Display device and manufacturing method thereof

Abstract

The present invention provides a display device and a manufacturing method thereof, wherein the display device includes: a display panel, a flexible circuit board and a composite heat dissipation structure; wherein: the flexible circuit board includes a bendable portion and a flat portion connected to each other, the composite heat dissipation structure and at least one driver chip are provided on the side of the flat portion facing the display panel, and the bendable portion is connected to the display panel; the composite heat dissipation structure includes a first heat dissipation portion provided on the back of the display panel, and a second heat dissipation portion provided between the flat portion and the first heat dissipation portion, wherein the second heat dissipation portion includes a heat conducting pipe and grease accommodated in the heat conducting pipe, and the heat conducting pipe is provided with a receiving groove for accommodating each of the driver chips on the side facing the flat portion, and the orthographic projection of the second heat dissipation portion on the display panel completely falls within the area of ​​the orthographic projection of the first heat dissipation portion on the display panel.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display device and a manufacturing method thereof. Background Art

[0002] In recent years, organic electroluminescent display (OLED) panels have been increasingly used in automotive applications due to their excellent image quality and flexible, bendable design. However, OLED displays are driven by a single pixel, and the organic light-emitting materials in these pixels are extremely sensitive to temperature. Excessive temperatures can cause their lifespan to decline rapidly. Furthermore, the temperature sensitivity of the organic light-emitting materials in different color pixels varies, which can easily cause color coordinates to shift. Preventing the effects of temperature on display quality has become a pressing technical challenge. Summary of the Invention

[0003] The present invention provides a display device and a manufacturing method thereof, which are used to improve heat dissipation efficiency and ensure display effect.

[0004] In a first aspect, an embodiment of the present invention provides a display device, including:

[0005] Display panel, flexible circuit board and composite heat dissipation structure; wherein:

[0006] The flexible circuit board includes a bendable portion and a flat portion connected to each other, the composite heat dissipation structure and at least one driver chip are provided on a side of the flat portion facing the display panel, and the bendable portion is connected to the display panel;

[0007] The composite heat dissipation structure includes a first heat dissipation portion arranged on the back of the display panel, and a second heat dissipation portion arranged between the flat portion and the first heat dissipation portion, wherein the second heat dissipation portion includes a heat conduction pipe and grease accommodated in the heat conduction pipe, and a side of the heat conduction pipe facing the flat portion is provided with a receiving groove for accommodating each of the driving chips, and the orthographic projection of the second heat dissipation portion on the display panel completely falls within the area of ​​the orthographic projection of the first heat dissipation portion on the display panel.

[0008] In a possible implementation, the heat-conducting pipe is separated into a plurality of heat-conducting units by each of the accommodating grooves, and two adjacent heat-conducting units are connected via a flow channel.

[0009] In a possible implementation, the heat-conducting pipe is separated into a plurality of independent heat-conducting units by the respective accommodating grooves.

[0010] In a possible implementation, there is a certain gap between each of the driving chips and the sidewalls and bottom of the corresponding accommodating groove.

[0011] In a possible implementation, the heat-conducting pipe is bonded to the first heat dissipating portion through a first adhesive layer, and is bonded to the flat portion through a second adhesive layer.

[0012] In a possible implementation, an end portion of the heat conducting pipe extends to an edge of the display panel and is connected to an auxiliary heat dissipation structure.

[0013] In a possible implementation, the display device further includes a printed circuit board connected to the flat portion, and the heat conducting pipe extends from a position corresponding to the flat portion to a position corresponding to the printed circuit board.

[0014] In a possible implementation, foam glue is further provided between the printed circuit board and the first heat dissipation portion, and an orthographic projection of the foam glue on the display panel and an orthographic projection of the heat conducting pipe on the base substrate do not overlap with each other.

[0015] In a second aspect, an embodiment of the present invention further provides a method for manufacturing a display device as described in any one of the above items, comprising:

[0016] Laminating the composite heat dissipation structure on the back side of the display panel;

[0017] connecting the display panel and the bendable portion of the flexible circuit board;

[0018] Bending the bendable portion so that each of the at least one driver chip disposed on the flexible circuit board is accommodated in the corresponding accommodation groove;

[0019] A display device including the display panel, the flexible circuit board and the composite heat dissipation structure is formed.

[0020] In a possible implementation, before attaching the composite heat dissipation structure to the back surface of the display panel, the method further includes:

[0021] While filling the grease into the cylindrical pipe, the cylindrical pipe is punched in two opposite directions using a punch to obtain a quadrangular prism-shaped pipe;

[0022] The receiving groove is formed by punching one side surface of the quadrangular prism-shaped pipe;

[0023] Sealing the end of the quadrangular prism-shaped pipe to form the second heat dissipation portion;

[0024] The other side surface of the second heat dissipation portion that is opposite to the one side surface is attached to the first heat dissipation portion to obtain the composite heat dissipation structure including the first heat dissipation portion and the second heat dissipation portion.

[0025] The beneficial effects of the present invention are as follows:

[0026] An embodiment of the present invention provides a display device and a manufacturing method thereof. The display device includes a display panel, a flexible circuit board, and a composite heat dissipation structure. The flexible circuit board includes a bendable portion and a flat portion connected to each other. The composite heat dissipation structure and at least one driver chip are disposed on the side of the flat portion facing the display panel, and the bendable portion is connected to the display panel. The composite heat dissipation structure includes a first heat dissipation portion disposed on the back of the display panel, and a second heat dissipation portion disposed between the flat portion and the first heat dissipation portion. The second heat dissipation portion includes a heat conduction pipe and grease contained within the heat conduction pipe. The side of the heat conduction pipe facing the flat portion includes a receiving groove for each driver chip. The orthographic projection of the second heat dissipation portion on the display panel completely falls within the orthographic projection of the first heat dissipation portion on the display panel. In this way, when at least one driver chip is operating, the grease in the heat conduction pipe can absorb heat generated by the at least one driver chip. Due to the heat differences at different locations within the heat conduction pipe, the grease circulates, forming eddy currents, which quickly conduct the heat away. Because the eddy currents are highly efficient in heat conduction, the heat dissipation efficiency of the display device is improved, uneven display caused by excessive temperature of the display device is avoided, and the display quality is guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A schematic diagram of a structure of an OLED display device in related art;

[0028] Figure 2 A schematic diagram of a top view of a display device provided by an embodiment of the present invention;

[0029] Figure 3 For the Figure 2 A schematic diagram of one of the cross-sectional structures in the direction indicated by MM;

[0030] Figure 4 For the Figure 2 A schematic diagram of one of the cross-sectional structures in the direction indicated by NN;

[0031] Figure 5 for Figure 3 A magnified view of one of the structures in the middle region C;

[0032] Figure 6 A schematic diagram of one structure of a heat conduction pipe in a display device provided by an embodiment of the present invention;

[0033] Figure 7 A schematic diagram of a structure of a display device provided by an embodiment of the present invention;

[0034] Figure 8 A schematic diagram of a structure of a display device provided by an embodiment of the present invention;

[0035] Figure 9 A schematic diagram of a structure of a display device provided by an embodiment of the present invention;

[0036] Figure 10 A schematic diagram of a structure of a display device provided by an embodiment of the present invention;

[0037] Figure 11 A schematic diagram of a structure of a display device provided by an embodiment of the present invention;

[0038] Figure 12 A schematic diagram of a structure of a display device provided by an embodiment of the present invention;

[0039] Figure 13 A schematic diagram of a structure of a display device provided by an embodiment of the present invention;

[0040] Figure 14 A flow chart of one method of manufacturing a display device provided by an embodiment of the present invention;

[0041] Figure 15 For Figure 14 One of the method flow charts before step S101;

[0042] Figure 16 for Figure 14 A process flow chart for preparing a second heat dissipation portion;

[0043] Figure 17 A schematic top view of a second heat dissipation portion in a display device according to an embodiment of the present invention;

[0044] Figure 18 This is a schematic side view of a second heat dissipation portion in a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. And in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. Based on the described embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] Unless otherwise defined, technical or scientific terms used in this invention shall have the same general meaning as those generally understood by persons skilled in the art in the art to which this invention pertains. Words such as "include" or "comprise" used in this invention mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0047] It should be noted that the sizes and shapes of the figures in the accompanying drawings do not reflect the actual scale and are only for the purpose of illustrating the present invention. The same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions.

[0048] In related technologies, the Figure 1 An OLED display device is fabricated using the film structure shown in the figure, where 01 represents the panel, 02 represents the chip on film (COF), 03 represents the display driver chip, 04 represents the foam, and 05 represents the support bracket. Foam 04 supports COF 02 and conducts heat generated by the display driver chip 03 through the air and away from the support bracket 05. However, air has a low thermal conductivity, which can easily cause excessive heating in certain areas of the display device, resulting in excessive brightness attenuation and shifted color coordinates on the screen.

[0049] In view of this, an embodiment of the present invention provides a display device and a manufacturing method thereof, which are used to improve heat dissipation efficiency and ensure display effects.

[0050] Combine Figures 2 to 4 As shown, an embodiment of the present invention provides a display device, wherein: Figure 2 is a schematic diagram of a top view of the display device. Figure 3 For the Figure 2 One of the cross-sectional structural diagrams in the direction shown in MM, Figure 4 For the Figure 2 In one embodiment of the present invention, the display device includes:

[0051] Display panel 10, flexible circuit board 20 and composite heat dissipation structure 30; wherein:

[0052] The flexible circuit board 20 includes a bendable portion 21 and a flat portion 22 connected to each other. The composite heat dissipation structure 30 and at least one driver chip 23 are provided on the side of the flat portion 22 facing the display panel 10. The bendable portion 21 is connected to the display panel 10.

[0053] The composite heat dissipation structure 30 includes a first heat dissipation portion 31 arranged on the back of the display panel 10, and a second heat dissipation portion 32 arranged between the flat portion 22 and the first heat dissipation portion 31, wherein the second heat dissipation portion 32 includes a heat conduction pipe 320 and grease 321 accommodated in the heat conduction pipe 320. The heat conduction pipe 320 is provided with a receiving groove 322 for accommodating each of the driving chips 23 on the side facing the flat portion 22. The orthographic projection of the second heat dissipation portion 32 on the display panel 10 completely falls within the area of ​​the orthographic projection of the first heat dissipation portion 31 on the display panel 10.

[0054] Still combined Figure 2 As shown, the display device includes a display panel 10, a flexible circuit board 20, and a composite heat dissipation structure 30. In a specific implementation, the flexible circuit board 20 can be a single-layer board structure with single-sided wiring. Accordingly, at least one driver chip 23 is disposed on the side of the flat portion 22 of the flexible circuit board 20 facing the display panel 10. Figure 2 The figure illustrates a case where there are four at least one driver chips 23, but this is not limiting. The specific number of at least one driver chip 23 can be set based on the resolution and driving requirements of the display device and is not limited here. Furthermore, the flexible circuit board 20 also includes a bendable portion 21 interconnected with the flat portion 22 and the display panel 10, respectively. The bendable portion 21 allows the flat portion 22 of the flexible circuit board 20 to be bent toward the back of the display panel 10, thereby maintaining a narrow bezel design for the display device.

[0055] A composite heat dissipation structure 30 is also provided on the side of the flat portion 22 facing the display panel 10. This composite heat dissipation structure 30 includes a first heat dissipation portion 31 disposed on the back of the display panel 10, and a second heat dissipation portion 32 disposed between the flat portion 22 and the first heat dissipation portion 31. The second heat dissipation portion 32 includes a heat pipe 320 and grease 321 contained within the heat pipe 320. The heat pipe 320 is provided with a receiving groove 322 for accommodating each driver chip 23 on the side facing the flat portion 22. The orthographic projection of the second heat dissipation portion 32 on the display panel 10 completely falls within the area of ​​the orthographic projection of the first heat dissipation portion 31 on the display panel 10. In this way, on the one hand, the second heat sink 32 effectively supports the flexible circuit board 20, preventing damage to the driver chip 23. On the other hand, during the operation of the driver chip 23, the grease 321 within the heat pipe 320 of the second heat sink 32 can absorb the heat generated by it. Due to the heat differences at different locations within the heat pipe 320, the grease 321 circulates, forming eddy currents, thereby quickly conducting heat away and preventing the problem of localized overheating of the display device. In addition, the heat conducted by the second heat sink 32 can also be conducted away through the first heat sink 31. Due to the relatively large area of ​​the first heat sink 31, the heat conduction efficiency is guaranteed to a certain extent. Moreover, the high efficiency of eddy currents in heat conduction improves the heat dissipation efficiency of the display device, ensuring the display effect of the display device.

[0056] In a specific implementation, the heat conducting pipe 320 can be made of a metal material such as copper, or an insulating material such as thermally conductive silicone. Of course, other materials with good thermal conductivity can also be selected to make the heat conducting pipe 320 according to actual application needs, and this is not limited here. The first heat dissipation portion 31 can be entirely attached to the back surface of the display panel 10, increasing the heat dissipation area of ​​the display panel 10 and improving heat dissipation efficiency. Furthermore, the first heat dissipation portion 31 can be made of a metal material such as aluminum, ensuring good thermal conductivity while ensuring a lightweight and thin design of the display panel 10.

[0057] In the embodiment of the present invention, the heat conducting pipe 320 can be set in the following two ways, but is not limited to the following two ways. It can be set according to actual application needs and is not limited here.

[0058] In the first configuration, the heat-conducting pipe 320 is separated into a plurality of heat-conducting units 3200 by the respective accommodating grooves 322 , and two adjacent heat-conducting units 3200 are connected via a flow channel.

[0059] In the first setting method, if Figure 5 Shown Figure 3An enlarged view of one of the structures of the middle area C. In this arrangement, the heat-conducting pipe 320 is separated into a plurality of heat-conducting units 3200 by each accommodating groove 322, and two adjacent heat-conducting units 3200 are connected through a circulation channel. The specific number of heat-conducting units 3200 can be set according to the specific number of at least one driver chip 23. In this way, after each heat-conducting unit 3200 absorbs heat, the eddy current formed can circulate with each other through the circulation channel, and the heat dissipation area is larger, thereby improving the heat dissipation efficiency. In one exemplary embodiment, along Figure 3 The display device is placed 90 degrees clockwise in the direction indicated by the arrow S. The hot grease 321 flows upward, driving the cold grease to flow downward, thereby forming a vortex. The direction of the vortex can be Figure 5 The counterclockwise direction is shown by the arrow. Figure 4 The eddy current direction in the figure can be counterclockwise as indicated by the arrow in the figure. It should be noted that in order to prevent the heat conduction channel 320 from damaging the driver chip 23 while ensuring the flow performance of the flow channel, during the stamping process of the accommodating groove 322, the distance between the bottom of the accommodating groove 322 and the bonding surface between the second heat dissipation portion 32 and the first heat dissipation portion 31 can be set to be greater than 0 mm and not greater than 0.5 mm. In specific preparation, the corresponding distance can be set according to actual application needs and is not limited here.

[0060] In the second configuration, the heat-conducting pipe 320 is separated into a plurality of independent heat-conducting units 3200 by the respective accommodating grooves 322 .

[0061] In the second setting, if Figure 6 The figure shows one structural schematic diagram of the heat-conducting pipe 320. In this arrangement, the heat-conducting pipe 320 is isolated by each accommodating groove 322 into a plurality of independent heat-conducting units 3200, and each heat-conducting unit 3200 does not circulate with each other. The specific number of the heat-conducting units 3200 can be set according to the specific number of at least one driver chip 23. In this way, after each heat-conducting unit 3200 absorbs heat, it can each conduct the absorbed heat to the first heat dissipation part 31, and conduct heat through the first heat dissipation part 31. In this arrangement, the support thickness of the heat-conducting pipe 320 can be made small enough, thereby saving the layout space of the heat-conducting pipe 320, thereby ensuring the light and thin design of the display device.

[0062] In the embodiment of the present invention, still combined with Figures 3 to 6As shown, there is a certain gap between each of the driver chips 23 and the side walls and bottom of the corresponding accommodating groove 322. In the specific implementation process, there is a certain gap between each of the driver chips 23 and the side walls and bottom of the corresponding accommodating groove 322. In this way, the loss of the driver chip 23 in the accommodating groove 322 due to process errors can be avoided, the driving ability of the driver chip 23 is guaranteed, and the performance of the display device is guaranteed. In one exemplary embodiment, the relevant parameters of the corresponding accommodating groove 322 can be set according to the specific parameter values ​​of the length, width and height of each driver chip 23. For example, the horizontal width of the driver chip 23 is 39.5mm. When stamping the accommodating groove 322, the accommodating groove 322 can avoid 0.5mm on one side. In this way, the horizontal extension width of the bottom of the accommodating groove 322 can be 40.5mm. For another example, if the vertical width of the driver chip 23 is 1.9 mm, when stamping the accommodating groove 322, the accommodating groove 322 can avoid 1 mm on one side. In this case, the vertical extension width of the accommodating groove 322 can be 3.9 mm. For another example, if the height of the driver chip 23 is 0.2 mm, when stamping the accommodating groove 322, the accommodating groove 322 can avoid 0.3 mm of the height of the driver chip 23. In this case, the depth of the accommodating groove 322 can be 0.5 mm. Of course, the relevant parameters of the accommodating groove 322 can also be set based on the thermal conductivity and support performance of the second heat dissipation portion 32 and other parameters of the driver chip 23, and are not limited here.

[0063] In a specific implementation, the wall thickness of the heat conduction channel 320 may range from 0.2 mm to 0.5 mm. The wall thickness of the heat conduction channel 320 may be set according to actual applications and is not limited here, thereby ensuring the flexible design of the display device.

[0064] In the embodiment of the present invention, the heat conducting pipe 320 is bonded to the first heat dissipation portion 31 through a first adhesive layer, and is bonded to the flat portion 22 through a second adhesive layer.

[0065] During the specific implementation process, the heat-conducting pipe 320 can be bonded to the first heat dissipation part 31 through the first adhesive layer, thereby ensuring the structural stability between the heat-conducting pipe 320 and the first heat dissipation part 31. Among them, the first adhesive layer can be a pressure-sensitive adhesive (PSA), an optical adhesive (OCA), or a double-sided adhesive, which is not limited here. In addition, the heat-conducting pipe 320 can also be bonded to the flat part 22 through the second adhesive layer, thereby ensuring the structural stability between the heat-conducting pipe 320 and the flat part 22. Among them, the second adhesive layer can be PSA, OCA, or double-sided adhesive, which is not limited here. It should be noted that the first adhesive layer and the second adhesive layer are not illustrated in the figure.

[0066] In the embodiment of the present invention, the end of the heat conducting pipe 320 extends to the edge of the display panel 10 and is connected to the auxiliary heat dissipation structure 40 .

[0067] In one exemplary embodiment, Figure 7 As shown, one end of the heat pipe 320 extends to the edge of the display panel 10 and is connected to the auxiliary heat dissipation structure 40 through a related heat dissipation interface. The auxiliary heat dissipation structure 40 can be a metal grid line or an electric fan. The auxiliary heat dissipation structure 40 further improves the heat dissipation efficiency.

[0068] In an embodiment of the present invention, the display device further includes a printed circuit board 50 connected to the flat portion 22 , and the heat conducting pipe 320 extends from a corresponding position of the flat portion 22 to a corresponding position of the printed circuit board 50 .

[0069] In one exemplary embodiment, Figure 8 As shown, the display device also includes a printed circuit board 50 connected to the flat portion 22. The printed circuit board 50 can be a single-layer board structure with single-sided wiring. The driving and display capabilities of the display device are guaranteed through the mutual cooperation of the printed circuit board 50, the flexible circuit board 20 and the at least one driving chip 23.

[0070] In one exemplary embodiment, the Figure 9 and Figure 10 As shown, the heat pipe 320 extends from the corresponding position of the flat portion 22 to the corresponding position of the printed circuit board 50. On the one hand, this increases the heat dissipation area of ​​the heat pipe 320 and improves the heat dissipation efficiency. On the other hand, the heat pipe 320 can also absorb heat from the printed circuit board 50, preventing the display device from overheating and ensuring the display effect.

[0071] In one exemplary embodiment, Figure 11 As shown, one end of the heat pipe 320 can extend to the edge of the display panel 10 and connect to the auxiliary heat dissipation structure 40 via the relevant heat dissipation interface. The other end can also extend from the corresponding position of the flat portion 22 to the corresponding position of the printed circuit board 50, thereby ensuring heat dissipation efficiency. Of course, in actual applications, in addition to the several methods of arranging the heat pipe described above, other methods can also be used to improve the heat dissipation efficiency of the heat pipe 320, which will not be detailed here.

[0072] In the embodiment of the present invention, a foam adhesive 60 is further provided between the printed circuit board 50 and the first heat dissipation portion 31 , and the orthographic projection of the foam adhesive 60 on the display panel 10 does not overlap with the orthographic projection of the heat conducting pipe 320 on the base substrate.

[0073] In one exemplary embodiment, Figure 12 As shown, a foam adhesive 60 is further disposed between the printed circuit board 50 and the first heat sink 31. The orthographic projection of the foam adhesive 60 on the display panel 10 does not overlap with the orthographic projection of the heat pipe 320 on the base substrate. This ensures structural stability between the printed circuit board 50 and the first heat sink 31 while ensuring heat conduction through the heat pipe 320.

[0074] It should be noted that, in addition to the above-mentioned film layers, the embodiments of the present invention also include Figure 13 As shown, the display device may further include a third adhesive layer 70 located between the first heat dissipation portion 31 and the display panel 10, wherein the third adhesive layer 70 may be PSA or double-sided tape, which is not limited here. Moreover, a polarizer 80 may be provided on the side of the display panel 10 facing away from the flat portion 22. The polarizer 80 reduces the reflection of the display panel 10 to the external ambient light, thereby improving the user experience; on the other hand, it avoids the influence of the external ambient light on the organic light-emitting material, ensures the life of the organic light-emitting material, and improves the performance of the display device. In addition, a fourth adhesive layer 90 and a cover plate 100 may be provided in sequence on the side of the polarizer 80 facing away from the display panel 10. The fourth adhesive layer 90 may be OCA. The cover plate 100 can not only protect the display device from damage, but also improve the performance of the display device by providing a coating with specific functions on the cover plate 100. The coating may be one or more of an anti-glare (AG) protective film layer, an anti-fingerprint (AF), and an anti-ultraviolet (UV) protective film layer, which are not limited here. Of course, other film layers may be provided according to actual application requirements, which may be achieved by referring to relevant technologies and will not be described in detail here.

[0075] In specific implementations, the display device provided by the embodiments of the present invention can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigation system, or the like. Other essential components of the display device are well understood by those skilled in the art and are not described in detail here, nor should they be construed as limitations of the present invention.

[0076] In one exemplary embodiment, the display device in the embodiment of the present invention may be a vehicle-mounted display device. In one application scenario, the vehicle-mounted display device is C-shaped or S-shaped, and the vehicle-mounted display device can be vertically mounted on a vehicle, which may be a motor vehicle or a non-motor vehicle. For example, when the vehicle-mounted display device is applied to a motor vehicle, the vehicle-mounted display device may be set at the position of a navigator and used as a navigator. The vehicle-mounted display device may also be set at the position of a front-view mirror, or may be set within the line of sight of the co-pilot. Of course, the specific position and function of the vehicle-mounted display device may also be set according to actual application needs, which is not limited here.

[0077] Based on the same inventive concept, Figure 14 As shown, an embodiment of the present invention further provides a method for manufacturing the display device described above, comprising:

[0078] S101: Laminating the composite heat dissipation structure on the back side of the display panel;

[0079] S102: Connecting the display panel to the bendable portion of the flexible circuit board;

[0080] S103: bending the bendable portion so that each of the at least one driver chip disposed on the flexible circuit board is accommodated in the corresponding accommodation groove;

[0081] S104: forming a display device including the display panel, the flexible circuit board and the composite heat dissipation structure.

[0082] In a specific implementation, steps S101 and S102 may be performed first and then S102, or first and then S101, without limitation. In one exemplary embodiment, after preparing the relevant film structures of the display panel 10, the composite heat dissipation structure 30 is attached to the back surface of the display panel 10, connecting the display panel 10 to the bendable portion 21 of the flexible circuit board 20, wherein at least one driver chip 23 is pre-attached to the flat portion 22 of the flexible circuit board 20. Then, the bendable portion 21 is bent, bending the flat portion of the flexible circuit board 20 toward the back surface of the display panel 10. After the bending, each of the at least one driver chip 23 disposed on the flexible circuit board 20 is accommodated in a corresponding accommodating groove 322. In this manner, a display device including the display panel 10, the flexible circuit board 20, and the composite heat dissipation structure 30 is formed.

[0083] In the embodiment of the present invention, Figure 15As shown, in step S101: before attaching the composite heat dissipation structure to the back surface of the display panel, the method further includes:

[0084] S201: while filling the grease into the cylindrical pipe, using a punch to punch the cylindrical pipe in two opposite directions to obtain a quadrangular prism-shaped pipe;

[0085] S202: stamping the receiving groove on one side surface of the quadrangular prism-shaped pipe;

[0086] S203: sealing the end of the quadrangular prism-shaped pipe to form the second heat dissipation portion;

[0087] S204: Bonding the other side surface of the second heat dissipation portion that is opposite to the one side surface to the first heat dissipation portion to obtain the composite heat dissipation structure including the first heat dissipation portion and the second heat dissipation portion.

[0088] In a specific implementation process, before the composite heat dissipation structure 30 is attached to the back surface of the display panel 10, the composite heat dissipation structure 30 may be prepared in advance. Accordingly, the specific implementation process of steps S201 to S204 may be:

[0089] First, while filling grease 321 into the cylindrical pipe, the cylindrical pipe is punched in two opposite directions by using a pressure head to obtain a quadrangular prism pipe. Among them, the cylindrical pipe can be punched in two opposite directions by using two pressure heads at the same time, which improves the production efficiency while ensuring the production yield of the heat-conducting pipe 320. In practical applications, the grease 321 can be filled while being punched to ensure the production efficiency of the second heat dissipation part 32. Then, a receiving groove 322 is punched on one of the side surfaces of the quadrangular prism pipe. Then, the end of the quadrangular prism pipe is sealed with a pressure head to form a second heat dissipation part 32 including the heat-conducting pipe 320 and the receiving groove 322. Then, the other side surface of the second heat dissipation part 32, which is opposite to one of the side surfaces, is bonded together with the first heat dissipation part 31 to obtain a composite heat dissipation structure 30 including the first heat dissipation part 31 and the second heat dissipation part 32. In steps S201 to S204, the process flow chart for preparing the second heat dissipation part 32 is as shown in FIG. Figure 16 shown.

[0090] It should be noted that, in one exemplary embodiment, it may be according to Figure 16The process flow diagram shows the pre-preparation of the second heat dissipation portion 32. After the relevant film structures of the display panel 10 are prepared, the first heat dissipation portion 31 can be first attached to the back of the display panel 10, and then the second heat dissipation portion 32 can be attached to the side of the first heat dissipation portion 31 facing away from the display panel 10. Of course, other methods can also be used to produce the composite heat dissipation structure 30 and attach the first and second heat dissipation portions 31, 32 to the display panel 10 according to actual application needs, which will not be described in detail here.

[0091] In addition, in the process of manufacturing the second heat dissipation part 32 of the display device, it is necessary to combine the relevant structural parameters of the driver chip 23 and the process deviation to set the relevant structural parameters of the heat conduction pipe 320 and the accommodating groove 322 in the second heat dissipation part 32. In one exemplary embodiment, it can be referred to Figure 17 and Figure 18 As shown. Among them, Figure 17 FIG. 1 is a schematic diagram showing a top view of the second heat dissipation portion 32 in the display device. Figure 18 This is a side view of a structure diagram in which the second heat dissipation portion 32 includes a receiving groove 322. Figure 17 and Figure 18 As shown, x represents the horizontal width of the driver chip 23, y represents the vertical width of the driver chip 23, and h represents the height of the driver chip 23. In the specific manufacturing process, the horizontal width X of the accommodating groove can be set according to x. For example, the accommodating groove 322 horizontally avoids the outer shape of the driver chip 23 by 0.5mm on one side. When x is 39.5mm, X can be set to 40.5mm. The vertical width Y of the accommodating groove can be set according to y. For example, the accommodating groove 322 vertically avoids the outer shape of the driver chip 23 by 1mm on one side. When y is 1.9mm, Y can be set to 3.9mm. The depth Z of the accommodating groove can be set according to h. For example, the accommodating groove 322 avoids the height of the driver chip 23 by 0.3mm. When h is 0.2mm, Z can be set to 0.5mm. The shape parameter A of the heat conducting pipe 320 is designed based on the shape of the display panel 10, and the shape parameter B of the heat conducting pipe 320 is set based on the width of the flexible circuit board 20. The wall thickness of the heat conducting pipe 320 ranges from 0.2 mm to 0.5 mm, and the spacing W reserved for the heat conducting pipe 320 after pressing is in the range of 0 to 0.5 mm. In this way, the thickness H of the second heat dissipation portion 32 after forming is: H = 2*t + Z + h + W. In this way, when the wall thickness t and h are constant, the desired second heat dissipation portion 32 can be designed by adjusting the relevant values ​​of Z and W. Of course, other methods can also be used to set the relevant structural parameters of the second heat dissipation portion 32 according to actual application needs, which will not be detailed here.

[0092] An embodiment of the present invention provides a display device and a manufacturing method thereof, wherein the display device includes a display panel 10, a flexible circuit board 20, and a composite heat dissipation structure 30. The flexible circuit board 20 includes a bendable portion 21 and a flat portion 22 connected to each other. The composite heat dissipation structure 30 and at least one driver chip 23 are provided on the side of the flat portion 22 facing the display panel 10. The bendable portion 21 is connected to the display panel 10. The composite heat dissipation structure 30 includes a first heat dissipation portion 31 provided on the back of the display panel 10, and a second heat dissipation portion 32 provided between the flat portion 22 and the first heat dissipation portion 31. The second heat dissipation portion 32 includes a heat conduction pipe 320 and grease 321 contained in the heat conduction pipe 320. The heat conduction pipe 320 is provided with a receiving groove 322 for receiving each driver chip 23 on the side facing the flat portion 22. The orthographic projection of the second heat dissipation portion 32 on the display panel 10 completely falls within the area of ​​the orthographic projection of the first heat dissipation portion 31 on the display panel 10. In this way, when at least one driver chip 23 is operating, the grease 321 within the heat pipe 320 can absorb the heat generated by the at least one driver chip 23. Due to the heat differences at different locations within the heat pipe 320, the grease 321 circulates, forming eddy currents, which quickly conduct the heat away. Because eddy currents conduct heat more efficiently, the heat dissipation efficiency of the display device is improved, preventing uneven display caused by overheating, thereby ensuring a good display quality.

[0093] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0094] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.

Claims

1. A display device, characterized in that: include: Display panel, flexible circuit board and composite heat dissipation structure; wherein: The flexible circuit board includes a bendable portion and a flat portion connected to each other, the composite heat dissipation structure and at least one driver chip are provided on a side of the flat portion facing the display panel, and the bendable portion is connected to the display panel; The composite heat dissipation structure includes a first heat dissipation portion arranged on the back of the display panel, and a second heat dissipation portion arranged between the flat portion and the first heat dissipation portion, wherein the second heat dissipation portion includes a heat conduction pipe and grease accommodated in the heat conduction pipe, and a groove for accommodating each of the driver chips is provided on the side of the heat conduction pipe facing the flat portion, and the orthographic projection of the second heat dissipation portion on the display panel completely falls within the area of ​​the orthographic projection of the first heat dissipation portion on the display panel; the heat conduction pipe is a continuous closed cavity, the grease is completely filled in the closed cavity, and when there is a heat difference at different positions in the heat conduction pipe, the grease flows and circulates to form a vortex.

2. The display device according to claim 1, wherein The heat-conducting pipe is separated into a plurality of heat-conducting units by the respective accommodating grooves, and two adjacent heat-conducting units are connected via a flow channel.

3. The display device according to claim 1, wherein The heat-conducting pipe is separated into a plurality of independent heat-conducting units by the respective accommodating grooves.

4. The display device according to any one of claims 1 to 3, wherein: There is a certain gap between each of the driving chips and the sidewall and bottom of the corresponding accommodating groove.

5. The display device according to claim 4, wherein The heat-conducting pipe is bonded to the first heat-dissipating portion through a first adhesive layer, and is bonded to the flat portion through a second adhesive layer.

6. The display device according to any one of claims 1 to 3, wherein: The end of the heat-conducting pipe extends to the edge of the display panel and is connected to the auxiliary heat dissipation structure.

7. The display device according to claim 6, wherein The display device further includes a printed circuit board connected to the flat portion, and the heat conducting pipe extends from a position corresponding to the flat portion to a position corresponding to the printed circuit board.

8. The display device according to claim 7, wherein: Foam glue is further provided between the printed circuit board and the first heat dissipation portion, and the orthographic projection of the foam glue on the display panel does not overlap with the orthographic projection of the heat-conducting pipe on the display panel.

9. A method for manufacturing a display device according to any one of claims 1 to 8, characterized in that: include: Laminating the composite heat dissipation structure on the back side of the display panel; connecting the display panel and the bendable portion of the flexible circuit board; Bending the bendable portion so that each of the at least one driver chip disposed on the flexible circuit board is accommodated in the corresponding accommodation groove; A display device including the display panel, the flexible circuit board and the composite heat dissipation structure is formed.

10. The production method according to claim 9, characterized in that: Before attaching the composite heat dissipation structure to the back surface of the display panel, the method further includes: While filling the grease into the cylindrical pipe, the cylindrical pipe is punched in two opposite directions using a punch to obtain a quadrangular prism-shaped pipe; The receiving groove is formed by punching one side surface of the quadrangular prism-shaped pipe; Sealing the end of the quadrangular prism-shaped pipe to form the second heat dissipation portion; The other side surface of the second heat dissipation portion that is opposite to the one side surface is attached to the first heat dissipation portion to obtain the composite heat dissipation structure including the first heat dissipation portion and the second heat dissipation portion.

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