Substrate connector

Abstract

The present invention relates to a substrate connector including: a plurality of RF contact pieces for transmitting an RF (Radio Frequency) signal; an insulating portion supporting the plurality of RF contact pieces; a plurality of transmission contact pieces coupled to the insulating portion between a plurality of first RF contact pieces among the plurality of RF contact pieces and a plurality of second RF contact pieces among the plurality of RF contact pieces, such that the plurality of first RF contact pieces and the plurality of second RF contact pieces are spaced apart from each other in a first axial direction; a ground housing coupled with the insulating portion; a first ground contact piece coupled to the insulating portion to shield between the plurality of first RF contact pieces and the plurality of transmission contact pieces with reference to the first axial direction; and a second ground contact piece coupled to the insulating portion to shield between the plurality of second RF contact pieces and the plurality of transmission contact pieces with reference to the first axial direction, the first ground contact piece shielding between the plurality of first RF contact pieces and the plurality of transmission contact pieces with reference to the first axial direction, and shielding between the plurality of first RF contact pieces with reference to a second axial direction perpendicular to the first axial direction.

Description

Technical Field

[0001] The present invention relates to a substrate connector provided in an electronic device for electrical connection between a plurality of substrates. Background Technology

[0002] A connector is a device used for electrical connection in various electronic devices. For example, connectors are used in electronic devices such as mobile phones, computers, and tablets to allow various components within these devices to be electrically connected to each other.

[0003] Typically, electronic devices, such as smartphones and tablet PCs, contain RF connectors and board-to-board connectors (hereinafter referred to as "board connectors"). RF connectors are used to transmit RF (Radio Frequency) signals. Board connectors are used to process digital signals from cameras, etc.

[0004] Such RF connectors and substrate connectors are mounted on a PCB (Printed Circuit Board). Because existing technologies involve mounting several substrate connectors and RF connectors along with multiple components within a limited PCB space, the PCB mounting area becomes larger. Therefore, with the trend towards miniaturization in smartphones, there is a need for a technology that optimizes the PCB mounting area by integrating the RF connector and substrate connector.

[0005] Figure 1 This is a schematic perspective view of a substrate connector in the prior art.

[0006] Reference Figure 1 The existing substrate connector 100 includes a first connector 110 and a second connector 120.

[0007] The first connector 110 is used to attach to a first substrate (not shown). The first connector 110 can be electrically connected to the second connector 120 via a plurality of first contacts 111.

[0008] The second connector 120 is used for bonding to a second substrate (not shown). The second connector 120 can be electrically connected to the first connector 110 via a plurality of second contacts 121.

[0009] With a plurality of first contacts 111 and a plurality of second contacts 121 connected to each other, the prior art substrate connector 100 can electrically connect the first substrate and the second substrate to each other. Furthermore, when a portion of the plurality of first contacts 111 and the plurality of second contacts 121 are used as a plurality of RF contacts for transmitting RF signals, the prior art substrate connector 100 can be implemented to transmit RF signals between the first substrate and the second substrate via the RF contacts.

[0010] The existing substrate connector 100 has the following problems.

[0011] First, in the existing substrate connector 100, when a plurality of contacts 111 and 121 that are close to each other are used as RF contacts, there is a problem that the signal cannot be transmitted smoothly due to the RF signal interference between the plurality of RF contacts 111′, 111″, 121′, and 121″.

[0012] Secondly, in the existing substrate connector 100, although an RF signal shielding part 112 is provided at the outermost part of the connector to shield RF signals from being radiated to the outside, there is a problem that shielding between RF signals cannot be achieved.

[0013] Third, in the prior art substrate connector 100, a plurality of RF contacts 111′, 111″, 121′, and 121″ each include a plurality of mounting portions 111a′, 111a″, 121a′, and 121a″ mounted on the substrate, and the plurality of mounting portions 111a′, 111a″, 121a′, and 121a″ are configured to be exposed to the outside. Therefore, the prior art substrate connector 100 has the problem of not being able to shield the plurality of mounting portions 111a′, 111a″, 121a′, and 121a″. Summary of the Invention

[0014] The problem that the invention aims to solve

[0015] The present invention addresses the aforementioned problems by providing a substrate connector capable of reducing the possibility of RF signal interference between multiple RF contacts.

[0016] Technical solutions to the problem

[0017] To address the issues described above, the present invention may include the following configuration.

[0018] The substrate connector of the present invention may include: a plurality of RF contacts for transmitting RF (Radio Frequency) signals; an insulating portion supporting the plurality of RF contacts; a plurality of transmission contacts coupled to the insulating portion between a plurality of first RF contacts and a plurality of second RF contacts among the plurality of RF contacts, such that the plurality of first RF contacts and the plurality of second RF contacts are spaced apart from each other along a first axis; a grounding housing coupled to the insulating portion; a first grounding contact coupled to the insulating portion, shielding between the plurality of first RF contacts and the plurality of transmission contacts with reference to the first axis; and a second grounding contact coupled to the insulating portion, shielding between the plurality of second RF contacts and the plurality of transmission contacts with reference to the first axis. The first grounding contact can shield between a plurality of the first RF contacts and a plurality of the transmission contacts with reference to the first axial direction, and shield between a plurality of the first RF contacts with reference to a second axial direction perpendicular to the first axial direction.

[0019] The substrate connector of the present invention may include: a plurality of RF contacts for transmitting RF (Radio Frequency) signals; an insulating portion supporting the plurality of RF contacts; a plurality of transmission contacts coupled to the insulating portion between a plurality of first RF contacts and a plurality of second RF contacts among the plurality of RF contacts, such that the plurality of first RF contacts and the plurality of second RF contacts are spaced apart from each other along a first axis; a grounding housing coupled to the insulating portion; a first grounding contact coupled to the insulating portion, shielding between the plurality of first RF contacts and the plurality of transmission contacts with reference to the first axis; and a second grounding contact coupled to the insulating portion, shielding between the plurality of second RF contacts and the plurality of transmission contacts with reference to the first axis.

[0020] Invention Effects

[0021] According to the present invention, the following effects can be achieved.

[0022] This invention utilizes a grounding housing and grounding contacts to shield signals and electromagnetic waves from a plurality of RF contacts. Therefore, this invention prevents electromagnetic waves generated from the plurality of RF contacts from being interfered with by signals from a plurality of circuit components located around the electronic device, and also prevents electromagnetic waves generated from a plurality of circuit components located around the electronic device from being interfered with by RF signals transmitted through the plurality of RF contacts. Thus, this invention utilizes a grounding housing and grounding contacts to improve EMI (Electromagnetic Interference) shielding performance and EMC (Electromagnetic Compatibility) performance.

[0023] This invention can be implemented such that all of a plurality of RF contacts, including those mounted on a substrate, are located inside a grounding housing. Therefore, this invention utilizes the grounding housing to enhance the shielding function of the plurality of RF contacts, thereby achieving complete shielding. Attached Figure Description

[0024] Figure 1 This is a schematic perspective view of a substrate connector in the prior art.

[0025] Figure 2 This is a schematic perspective view of the socket connector and plug connector in the substrate connector of the present invention.

[0026] Figure 3 This is a schematic perspective view of the substrate connector of the first embodiment.

[0027] Figure 4 This is a schematic exploded perspective view of the substrate connector of the first embodiment.

[0028] Figure 5 This is a schematic top view used to illustrate the grounding loop in the substrate connector of the first embodiment.

[0029] Figure 6 This is a schematic perspective view of the first grounding contact and the second grounding contact in the substrate connector of the first embodiment.

[0030] Figure 7 This is a schematic top view of the substrate connector of the first embodiment.

[0031] Figure 8 Therefore Figure 7 The schematic side sectional view, with line II as reference, shows the combination of the substrate connector of the first embodiment and the substrate connector of the second embodiment.

[0032] Figure 9 Therefore Figure 7The schematic side sectional view shows the combination of the substrate connector of the first embodiment and the substrate connector of the second embodiment with reference to line II-II.

[0033] Figure 10 This is a schematic perspective view of the grounding housing in the substrate connector of the first embodiment.

[0034] Figures 11 to 14 By magnification Figure 8 Part A is a schematic side sectional view showing the combination of the substrate connector of the first embodiment and the substrate connector of the second embodiment.

[0035] Figure 15 This is a schematic perspective view showing a modified embodiment of the grounding housing in the substrate connector of the first embodiment.

[0036] Figure 16 This is a schematic top view of the insulating portion in the substrate connector of the first embodiment.

[0037] Figure 17 This is a schematic perspective view of the substrate connector of the second embodiment.

[0038] Figure 18 This is a schematic exploded perspective view of the substrate connector of the second embodiment.

[0039] Figure 19 This is a schematic top view of the substrate connector of the second embodiment.

[0040] Figure 20 Therefore Figure 19 The schematic side sectional view shows the combination of the substrate connector of the second embodiment and the substrate connector of the first embodiment, with the Ⅲ-Ⅲ line as the reference.

[0041] Figure 21 This is a schematic top view illustrating the grounding loop in the substrate connector of the second embodiment.

[0042] Figure 22 This is a schematic perspective view of the grounding housing in the substrate connector of the second embodiment.

[0043] Figure 23 By magnification Figure 8 Part A is a schematic side sectional view showing the combination of the substrate connector of the second embodiment and the substrate connector of the first embodiment.

[0044] Figures 24 to 27 This is a conceptual bottom view of an embodiment showing a mounting pattern of a substrate with a substrate connector of the first embodiment.

[0045] Figures 28 to 31This is a conceptual bottom view of an embodiment showing a mounting pattern of a substrate with a substrate connector of the second embodiment. Detailed Implementation

[0046] Hereinafter, embodiments of the substrate connector of the present invention will be described in detail with reference to the accompanying drawings. Figure 8 and Figure 9 The connector of the first embodiment is shown in Figure 2 and Figure 3 The case shown is where the connector of the second embodiment is reversed in the direction shown.

[0047] Reference Figure 2 The substrate connector 1 of the present invention can be disposed in electronic devices such as mobile phones, computers, and tablet computers (not shown). The substrate connector 1 of the present invention can be used to electrically connect a plurality of substrates (not shown). The substrate can be a printed circuit board (PCB). For example, when the first substrate and the second substrate are electrically connected, a receptacle connector mounted on the first substrate and a plug connector mounted on the second substrate can be connected to each other. Thus, the first substrate and the second substrate can be electrically connected to each other via the receptacle connector and the plug connector. The plug connector mounted on the first substrate and the receptacle connector mounted on the second substrate can also be connected to each other.

[0048] The substrate connector 1 of the present invention can be implemented by the socket connector. The substrate connector 1 of the present invention can also be implemented by the plug connector. The substrate connector 1 of the present invention can also be implemented by simultaneously including both the socket connector and the plug connector. Hereinafter, an embodiment in which the substrate connector 1 of the present invention is implemented by the plug connector is defined as the substrate connector 200 of the first embodiment, and an embodiment in which the substrate connector 1 of the present invention is implemented by the socket connector is defined as the substrate connector 300 of the second embodiment, and will be described in detail with reference to the accompanying drawings. Furthermore, the description will be based on an embodiment in which the substrate connector 200 of the first embodiment is mounted on the first substrate, and the substrate connector 300 of the second embodiment is mounted on the second substrate. Therefore, those skilled in the art can readily deduce embodiments of the substrate connector 1 of the present invention that simultaneously include both the socket connector and the plug connector.

[0049] <Baseboard connector 200 of the first embodiment>

[0050] Reference Figures 2 to 4The substrate connector 200 of the first embodiment may include: a plurality of RF contacts 210, a plurality of transmission contacts 220, a ground housing 230, and an insulating portion 240.

[0051] The plurality of RF contacts 210 are used to transmit RF (Radio Frequency) signals. The plurality of RF contacts 210 can transmit ultra-high frequency RF signals. The plurality of RF contacts 210 can be supported on the insulating portion 240. The plurality of RF contacts 210 can be assembled to the insulating portion 240. The plurality of RF contacts 210 can also be integrally formed with the insulating portion 240 by injection molding.

[0052] The plurality of RF contacts 210 may be spaced apart from each other. The plurality of RF contacts 210 are mounted on the first substrate, thereby enabling electrical connection to the first substrate. The plurality of RF contacts 210 are connected to the plurality of RF contacts of the opposing connector, thereby enabling electrical connection to the second substrate on which the opposing connector is mounted. Thus, the first substrate and the second substrate can be electrically connected. In the case where the substrate connector 200 of the first embodiment is a plug connector, the opposing connector may be a receptacle connector. In the case where the substrate connector 200 of the first embodiment is a receptacle connector, the opposing connector may be a plug connector.

[0053] The first RF contact 211 and the second RF contact 212 of the plurality of RF contacts 210 may be spaced apart from each other along a first axial direction (X-axis direction). The first RF contact 211 and the second RF contact 212 may be supported on the insulating portion 240 at positions spaced apart from each other along the first axial direction (X-axis direction).

[0054] The first RF contact 211 may include a first RF mounting member 2111. The first RF mounting member 2111 may be mounted on the first substrate. Thus, the first RF contact 211 can be electrically connected to the first substrate via the first RF mounting member 2111. The first RF contact 211 may be formed of an electrically conductive material. For example, the first RF contact 211 may be formed of metal. The first RF contact 211 may be connected to any one of the plurality of RF contacts of the opposing connector.

[0055] The second RF contact 212 may include a second RF mounting member 2121. The second RF mounting member 2121 may be mounted on the first substrate. Thus, the second RF contact 212 can be electrically connected to the first substrate via the second RF mounting member 2121. The second RF contact 212 may be formed of an electrically conductive material. For example, the second RF contact 212 may be formed of metal. The second RF contact 212 may connect to any one of the plurality of RF contacts of the opposing connector.

[0056] Reference Figures 2 to 4 A plurality of the transmission contacts 220 are coupled to the insulating portion 240. The plurality of transmission contacts 220 can function as transmitters of signals, data, etc. The plurality of transmission contacts 220 can be coupled to the insulating portion 240 through an assembly process. Alternatively, the plurality of transmission contacts 220 can be integrally formed with the insulating portion 240 through injection molding.

[0057] A plurality of the transmission contacts 220 can be arranged between the first RF contact 211 and the second RF contact 212 with reference to the first axial direction (X-axis direction). Therefore, in order to reduce RF signal interference between the first RF contact 211 and the second RF contact 212, the plurality of transmission contacts 220 can be arranged in a space that separates the first RF contact 211 and the second RF contact 212 from each other. Thus, the substrate connector 200 of the first embodiment not only reduces RF signal interference by increasing the distance between the first RF contact 211 and the second RF contact 212, but also improves the space utilization of the insulating portion 240 by arranging a plurality of the transmission contacts 220 in the space between them.

[0058] The plurality of transmission contacts 220 may be spaced apart from each other. The plurality of transmission contacts 220 are mounted on the first substrate, thereby enabling electrical connection with the first substrate. In this case, the transmission mounting member 2201 of each of the plurality of transmission contacts 220 may be mounted on the first substrate. The plurality of transmission contacts 220 may be formed of an electrically conductive material. For example, the plurality of transmission contacts 220 may be formed of metal. The plurality of transmission contacts 220 connect with the plurality of transmission contacts of the opposing connector, thereby enabling electrical connection with the second substrate on which the opposing connector is mounted. Thus, the first substrate and the second substrate can be electrically connected.

[0059] on the other hand, Figure 4 The substrate connector 200 shown in the first embodiment includes four transmission contacts 220, but is not limited thereto; the substrate connector 200 of the first embodiment may also include five or more transmission contacts 220. The plurality of transmission contacts 220 may be spaced apart from each other along a first axial direction (X-axis direction) and a second axial direction (Y-axis direction). The first axial direction (X-axis direction) and the second axial direction (Y-axis direction) are axial directions perpendicular to each other.

[0060] Reference Figures 2 to 4 The insulating portion 240 is attached to the grounding housing 230. The grounding housing 230 can be grounded by being mounted on the first substrate. Thus, the grounding housing 230 can shield signals, electromagnetic waves, etc., from the plurality of RF contacts 210. In this case, the grounding housing 230 can prevent electromagnetic waves generated from the plurality of RF contacts 210 from being interfered with by signals from a plurality of circuit components located around the electronic device, and can also prevent electromagnetic waves generated from the plurality of circuit components located around the electronic device from being interfered with by RF signals transmitted by the plurality of RF contacts 210. Therefore, the substrate connector 200 of the first embodiment can utilize the grounding housing 230 to improve EMI (Electromagnetic Interference) shielding performance and EMC (Electromagnetic Compatibility) performance. The grounding housing 230 can be formed of an electrically conductive material. For example, the grounding housing 230 can be formed of metal.

[0061] The grounding housing 230 can be configured to surround the side of the inner space 230a. A portion of the insulation portion 240 can be located in the inner space 230a. The first RF contact 211, the second RF contact 212, and the transmission contact 22 can all be located in the inner space 230a. In this case, the first RF mounting member 2111, the second RF mounting member 2121, and the transmission mounting member 2201 can also all be located in the inner space 230a. Therefore, by implementing a shielding wall for all the first RF contacts 211 and the second RF contacts 212, the grounding housing 230 can enhance the shielding function of the first RF contacts 211 and the second RF contacts 212, thereby achieving complete shielding. The opposing connector can be inserted into the inner space 230a.

[0062] The grounding housing 230 can be configured to surround all sides based on the inner space 230a. The inner space 230a can be disposed inside the grounding housing 230. When the grounding housing 230 is generally formed in the shape of a quadrilateral ring, the inner space 230a can be formed in the shape of a cuboid. In this case, the grounding housing 230 can be configured to surround four sides based on the inner space 230a.

[0063] The grounding housing 230 can be integrally formed without seams. The grounding housing 230 can be integrally formed without seams using metal injection molding processes such as die casting or MIM (Metal Injection Molding). The grounding housing 230 can also be integrally formed without seams using CNC (Computer Numerical Control) machining or MCT (Machining Center Tool) machining.

[0064] Reference Figures 2 to 4 The insulating portion 240 supports a plurality of the RF contacts 210. The plurality of RF contacts 210 and the plurality of transmission contacts 220 may be coupled to the insulating portion 240. The insulating portion 240 may be formed of an insulating material. The insulating portion 240 may be coupled to the grounding housing 230 such that the plurality of RF contacts 210 are located in the inner space 230a.

[0065] Reference Figures 2 to 4 The substrate connector 200 in the first embodiment may include a first grounding contact 250.

[0066] The first grounding contact 250 is coupled to the insulating portion 240. The first grounding contact 250 can be grounded by being mounted on the first substrate. The first grounding contact 250 can be coupled to the insulating portion 240 by an assembly process. The first grounding contact 250 can be integrally formed with the insulating portion 240 by injection molding.

[0067] The first grounding contact 250, together with the grounding housing 230, can provide shielding for the first RF contact 211. In this case, the first grounding contact 250 can be configured between the first RF contact 211 and a plurality of the transmission contacts 220, with the first axial direction (X-axis direction) as a reference. The first grounding contact 250 can be formed of an electrically conductive material. For example, the first grounding contact 250 can be formed of metal. If the opposing connector is inserted into the inner space 230a, the first grounding contact 250 can connect with the grounding contacts of the opposing connector.

[0068] Reference Figures 2 to 4 The substrate connector 200 in the first embodiment may include a second grounding contact 260.

[0069] The second grounding contact 260 is coupled to the insulating portion 240. The second grounding contact 260 can be grounded by being mounted on the first substrate. The second grounding contact 260 can be coupled to the insulating portion 240 by an assembly process. The second grounding contact 260 can be integrally formed with the insulating portion 240 by injection molding.

[0070] The second grounding contact 260, together with the grounding housing 230, can provide shielding for the second RF contact 212. The second grounding contact 260 can be configured with respect to the first axial direction (X-axis direction) between a plurality of transmission contacts 220 and the second RF contact 212. The second grounding contact 260 can be formed of an electrically conductive material. For example, the second grounding contact 260 can be formed of metal. If the opposing connector is inserted into the inner space 230a, the second grounding contact 260 can connect with the grounding contacts of the opposing connector.

[0071] Here, the substrate connector 200 of the first embodiment can be implemented as including a plurality of the first RF contacts 211 and a plurality of the second RF contacts 212.

[0072] Reference Figures 2 to 9A plurality of the first RF contacts 211 and a plurality of the second RF contacts 212 may be spaced apart from each other along the first axial direction (X-axis direction). A plurality of transmission contacts 220 may be arranged between the plurality of the first RF contacts 211 and the plurality of the second RF contacts 212, with the first axial direction (X-axis direction) as a reference. In this case, the first ground contact 250 may shield between the plurality of the first RF contacts 211 and the plurality of the transmission contacts 220, with the first axial direction (X-axis direction) as a reference. The second ground contact 260 may shield between the plurality of the second RF contacts 212 and the plurality of the transmission contacts 220, with the first axial direction (X-axis direction) as a reference.

[0073] When a plurality of the first RF contacts 211 are provided, the first ground contact 250 can shield the plurality of the first RF contacts 211 and the plurality of transmission contacts 220 with reference to the first axial direction (X-axis direction), and simultaneously shield the plurality of the first RF contacts 211 with reference to the second axial direction (Y-axis direction). Therefore, the substrate connector 200 of the first embodiment can utilize the first ground contact 250 to achieve shielding between the plurality of the first RF contacts 211 and the plurality of transmission contacts 220, while also achieving shielding between the plurality of the first RF contacts 211. Thus, the substrate connector 200 of the first embodiment can be implemented to transmit a wider variety of RF signals using the plurality of the first RF contacts 211, thereby improving its versatility for application in a wider variety of electronic products.

[0074] The first-1 RF contact 211a and the first-2 RF contact 211b of the plurality of the first RF contacts 211 can be coupled to the insulating portion 240 in a manner that is spaced apart from each other along the second axial direction (Y-axis direction). Figure 5 The substrate connector 200 shown in the first embodiment includes two first RF contacts 211 implemented by the first-1 RF contact 211a and the first-2 RF contact 211b, but it is not limited thereto; the substrate connector 200 of the first embodiment may also include three or more first RF contacts 211. On the other hand, this specification is described based on the first embodiment substrate connector 200 including the first-1 RF contact 211a and the first-2 RF contact 211b.

[0075] When the first-1 RF contact 211a and the first-2 RF contact 211b are provided, the first ground contact 250 may include the first-1 ground contact 251 and the first-2 ground contact 252.

[0076] The first-1 grounding contact 251 can be located between the first-1 RF contact 211a and the plurality of transmission contacts 220, with the first axial direction (X-axis direction) as a reference. Thus, the first-1 grounding contact 251 can shield the area between the first-1 RF contact 211a and the plurality of transmission contacts 220.

[0077] The first-1 grounding contact 251 may include the first-1 shielding member 2511.

[0078] The first-1 shielding member 2511 can be located between the first-1 RF contact 211a and the first-2 RF contact 211b, with the second axial direction (Y-axis direction) as a reference. Therefore, the first-1 grounding contact 251 can use the first-1 shielding member 2511 to shield between the first-1 RF contact 211a and the first-2 RF contact 211b. Thus, even if the first-1 RF contact 211a and the first-2 RF contact 211b transmit different RF signals, the substrate connector 200 of the first embodiment can use the first-1 shielding member 2511 to prevent interference between the first-1 RF contact 211a and the first-2 RF contact 211b. Therefore, the substrate connector 200 of the first embodiment is implemented such that it can stably transmit a wider variety of RF signals using the first-1 RF contact 211a and the first-2 RF contact 211b. The first-1 shielding member 2511 may be formed as a plate arranged in the vertical direction between the first-1 RF contact 211a and the first-2 RF contact 211b.

[0079] The first-1 shielding member 2511 can be spaced equidistant from the first-1 RF contact 211a and the first-2 RF contact 211b, with the second axial direction (Y-axis direction) as a reference. Therefore, the substrate connector 200 of the first embodiment can reduce the deviation between the shielding performance of the first-1 RF contact 211a and the shielding performance of the first-2 RF contact 211b. Thus, the substrate connector 200 of the first embodiment can utilize the first-1 shielding member 2511 to achieve a stable shielding function for each of the first-1 RF contact 211a and the first-2 RF contact 211b.

[0080] The first-1 grounding contact 251 may include the first-1 shielding protrusion 2512.

[0081] The first-1 shielding protrusion 2512 protrudes from the first-1 shielding member 2511. The first-1 shielding protrusion 2512 can be connected to the grounding housing 230. Thus, the first grounding contact 250 can be electrically connected to the grounding housing 230 via the first-1 shielding protrusion 2512, thereby enhancing the shielding performance between the first-1 RF contact 211a and the first-2 RF contact 211b to achieve complete shielding. The first-1 shielding protrusion 2512 can be formed as a plate shape arranged along the vertical direction.

[0082] The first-1 grounding contact 251 may include a first-1 grounding connection member 2513 and a first-1 grounding mounting member 2514.

[0083] The first-1 grounding connection member 2513 is combined with the first-1 shielding member 2511 and the first-1 grounding mounting member 2514, respectively. The first-1 shielding member 2511 and the first-1 grounding mounting member 2514 can be connected to each other through the first-1 grounding connection member 2513. The first-1 grounding connection member 2513 can be connected to the grounding contact of the opposing connector. Thus, the first grounding contact 250 is connected to the grounding contact of the opposing connector through the first-1 grounding connection member 2513, thereby enabling electrical connection with the grounding contact of the opposing connector. Therefore, as the first grounding contact 250 is connected to the grounding contact of the opposing connector through the first-1 grounding connection member 2513, the gap created by the first-1 grounding contact 251 and the first-2 grounding contact 252 being spaced apart from each other along the second axial direction (Y-axis direction) can be shielded. The first-1 grounding connection member 2513 may be combined with the first-1 shielding member 2511. The first-1 shielding member 2511 may protrude from the first-1 grounding connection member 2513 along the first axial direction (X-axis direction). In this case, the first-1 shielding protrusion 2512 may protrude from the first-1 shielding member 2511 along the first axial direction (X-axis direction).

[0084] The first-1 grounding mounting member 2514 is mounted on the first substrate. The first-1 grounding mounting member 2514 can be grounded by being mounted on the first substrate. Thus, the first-1 grounding contact 251 can be grounded on the first substrate via the first-1 grounding mounting member 2514. The first-1 grounding mounting member 2514 can protrude from the first-1 grounding connection member 2513 along the second axial direction (Y-axis direction). In this case, the first-1 grounding mounting member 2514 can be configured with reference to the first axial direction (X-axis direction) between the first-1 RF contact 211a and the plurality of transmission contacts 220. The first-1 grounding mounting member 2514 can protrude from the first-1 grounding connection member 2513 with a length sufficient to connect to the grounding housing 230, with reference to the second axial direction (Y-axis direction). In this configuration, the first-1 grounding mounting member 2514 and the first-1 shielding member 2511 protrude from the first-1 grounding connection member 2513 in different directions and can be connected to the different sidewalls of the grounding housing 230. Therefore, since the first-1 grounding contact 251 and the grounding housing 230 surround all sides of the first-1 RF contact 211a and are electrically connected to each other, the substrate connector 200 of the first embodiment further enhances the shielding performance of the first-1 RF contact 211a, thereby achieving complete shielding. The first-1 grounding mounting member 2514 can be formed as a plate arranged in a horizontal direction.

[0085] The first-1 grounding contact 251 may include a first-1 grounding protrusion 2515.

[0086] The first-1 grounding protrusion 2515 protrudes from the first-1 shielding member 2511. The first-1 grounding protrusion 2515 can be mounted on the first substrate. Therefore, the substrate connector 200 of the first embodiment can increase the mounting area of ​​the first-1 grounding contact 251 on the first substrate, thereby further enhancing the shielding performance of the first-1 grounding contact 251. The first-1 grounding protrusion 2515 penetrates and protrudes from the insulating portion 240, thus allowing it to be mounted on the first substrate. The first-1 grounding protrusion 2515 can protrude from the first-1 shielding member 2511 along the vertical direction. The first-1 grounding protrusion 2515 can be formed in a plate shape arranged along the vertical direction.

[0087] The first-1 grounding contact 251 may include a first-1 connecting protrusion 2516.

[0088] The first-1 connecting protrusion 2516 protrudes from the first-1 shielding member 2511. The first-1 connecting protrusion 2516 can connect to the ground housing of the opposing connector. Therefore, since the first-1 grounding contact 251 can expand the connection area for connection with the ground housing of the opposing connector, the substrate connector 200 of the first embodiment can further enhance the shielding performance of the first-1 grounding contact 251. The first-1 connecting protrusion 2516 penetrates and protrudes from the insulating portion 240, thereby connecting to the ground housing of the opposing connector. The first-1 connecting protrusion 2516 is inserted into the insulating portion of the opposing connector, thereby also connecting to the ground housing of the opposing connector. In this case, a through hole for the insertion of the first-1 connecting protrusion 2516 can be formed in the insulating portion of the opposing connector. The first-1 connecting protrusion 2516 can protrude from the first-1 shielding member 2511 along the vertical direction. With the vertical direction as a reference, the first-1 connecting protrusion 2516 and the first-1 grounding protrusion 2515 may protrude from the first-1 shielding member 2511 in opposite directions. The first-1 connecting protrusion 2516 may be formed as a plate shape arranged along the vertical direction.

[0089] The first-2 grounding contact 252 can be located between the first-2 RF contact 211b and the plurality of transmission contacts 220, with the first axial direction (X-axis direction) as a reference. Thus, the first-2 grounding contact 252 can shield the area between the first-2 RF contact 211b and the plurality of transmission contacts 220. The first-2 grounding contact 252 can be configured separately from the first-1 grounding contact 251, with the second axial direction (Y-axis direction) as a reference. The first-2 grounding contact 252 and the first-1 grounding contact 251 can be formed in different forms. For example, the first-2 grounding contact 252 can be formed without the first-1 shielding member 2511, the first-1 shielding protrusion 2512, the first-1 grounding protrusion 2515, and the first-1 connecting protrusion 2516 present in the first-1 grounding contact 251. Therefore, compared to the embodiment where the first-2 grounding contact 252 is formed in the same shape as the first-1 grounding contact 251, the substrate connector 200 of the first embodiment not only improves the ease of manufacturing the first-2 grounding contact 252, but also reduces the material cost for manufacturing the first-2 grounding contact 252. In this case, the shielding between the first-1 RF contact 211a and the first-2 RF contact 211b can be achieved through the first-1 grounding contact 251.

[0090] The first-second grounding contact 252 may include a first-second grounding connection member 2521 and a first-second grounding mounting member 2522.

[0091] The first-second grounding connection member 2521 is used to connect with the grounding contact of the opposing connector. Thus, the first grounding contact 250 is connected to the grounding contact of the opposing connector via the first-second grounding connection member 2521, thereby enabling electrical connection with the grounding contact of the opposing connector. Therefore, as the first grounding contact 250 is connected to the grounding contact of the opposing connector via the first-second grounding connection member 2521, the gap created by the first-second grounding contact 252 and the first-first grounding contact 251 being spaced apart from each other along the second axial direction (Y-axis direction) can be concealed. In this case, both the first-second grounding connection member 2521 and the first-first grounding connection member 2513 can be connected to the grounding contact of the opposing connector.

[0092] The first-second grounding mounting member 2522 is mounted on the first substrate. The first-second grounding mounting member 2522 can be grounded by being mounted on the first substrate. Thus, the first-second grounding contact 252 can be grounded on the first substrate via the first-second grounding mounting member 2522. The first-second grounding mounting member 2522 can protrude from the first-second grounding connection member 2521 along the second axial direction (Y-axis direction). In this case, the first-second grounding mounting member 2522 can be positioned between the first-second RF contact 211b and the plurality of transmission contacts 220, with the first axial direction (X-axis direction) as a reference. The first-second grounding mounting member 2522 can protrude from the first-second grounding connection member 2521 by a length sufficient to connect with the grounding housing 230, with the second axial direction (Y-axis direction) as a reference. In this configuration, the first-second grounding mounting member 2522 and the first-first grounding mounting member 2514 protrude in opposite directions, allowing them to connect to each of the opposing sidewalls of the grounding housing 230. Therefore, the substrate connector 200 of the first embodiment can further enhance the shielding performance between the plurality of the first RF contacts 211 and the transmission contacts 220. The first-second grounding mounting member 2522 can be formed as a plate arranged in a horizontal direction.

[0093] As described above, the substrate connector 200 of the first embodiment can utilize the first-1 ground contact 251, the first-2 ground contact 252, and the ground housing 230 to realize a first ground loop 250a for the first-1 RF contact 211a and the first-2 RF contact 211b. Figure 5 (as shown in the diagram). Therefore, the substrate connector 200 of the first embodiment utilizes the first ground loop 250a to further enhance the shielding performance of the first-1RF contact 211a and the first-2RF contact 211b, thereby achieving complete shielding of the first-1RF contact 211a and the first-2RF contact 211b.

[0094] Reference Figures 2 to 9 When a plurality of the second RF contacts 212 are provided, the second ground contact 260 can shield the plurality of the second RF contacts 212 and the plurality of transmission contacts 220 with reference to the first axial direction (X-axis direction), and can also shield the plurality of the second RF contacts 212 with reference to the second axial direction (Y-axis direction). Thus, the substrate connector 200 of the first embodiment, while utilizing the second ground contact 260 to achieve shielding between the plurality of the second RF contacts 212 and the plurality of transmission contacts 220, can additionally achieve shielding between the plurality of the second RF contacts 212. Therefore, the substrate connector 200 of the first embodiment is implemented to transmit a wider variety of RF signals using a plurality of the second RF contacts 212, thereby improving its versatility for application in a wider variety of electronic products.

[0095] The second-1 RF contact 212a and the second-2 RF contact 212b of the plurality of second RF contacts 212 can be coupled to the insulating portion 240 in a manner that is spaced apart from each other along the second axial direction (Y-axis direction). Figure 5 The substrate connector 200 shown in the first embodiment includes two second RF contacts 212 implemented by the second-1 RF contact 212a and the second-2 RF contact 212b. However, it is not limited to this, and the substrate connector 200 of the first embodiment may also include three or more second RF contacts 212. On the other hand, this specification is described based on the first embodiment substrate connector 200 including the second-1 RF contact 212a and the second-2 RF contact 212b.

[0096] When the second-1 RF contact 212a and the second-2 RF contact 212b are provided, the second ground contact 260 may include the second-1 ground contact 261 and the second-2 ground contact 262.

[0097] The second-first grounding contact 261 can be located between the second-first RF contact 212a and the plurality of transmission contacts 220, with the first axial direction (X-axis direction) as a reference. Thus, the second-first grounding contact 261 can shield the area between the second-first RF contact 212a and the plurality of transmission contacts 220.

[0098] The second-first grounding contact 261 may include the second-first shielding member 2611.

[0099] The second-first shielding member 2611 can be located between the second-first RF contact 212a and the second-second RF contact 212b, with the second axial direction (Y-axis direction) as a reference. Therefore, the second-first grounding contact 261 can use the second-first shielding member 2611 to shield between the second-first RF contact 212a and the second-second RF contact 212b. Thus, even if the second-first RF contact 212a and the second-second RF contact 212b transmit different RF signals, the substrate connector 200 of the first embodiment can use the second-first shielding member 2611 to prevent interference between the second-first RF contact 212a and the second-second RF contact 212b. Therefore, the substrate connector 200 of the first embodiment can be implemented to stably transmit a wider variety of RF signals using the second-first RF contact 212a and the second-second RF contact 212b. The second-first shielding member 2611 may be formed in a plate shape between the second-first RF contact 212a and the second-second RF contact 212b, arranged along the vertical direction.

[0100] The second-first shielding member 2611 can be spaced equidistant from each of the second-first RF contacts 212a and 212b, with the second axial direction (Y-axis direction) as a reference. Therefore, the substrate connector 200 of the first embodiment can reduce the deviation between the shielding performance of the second-first RF contact 212a and the shielding performance of the second-second RF contact 212b. Thus, the substrate connector 200 of the first embodiment can utilize the second-first shielding member 2611 to achieve stable shielding for each of the second-first RF contacts 212a and 212b.

[0101] The second-first grounding contact 261 may include a second-first shielding protrusion 2612.

[0102] The second-first shielding protrusion 2612 protrudes from the second-first shielding member 2611. The second-first shielding protrusion 2612 can be connected to the grounding housing 230. Thus, the second grounding contact 260 can be electrically connected to the grounding housing 230 via the second-first shielding protrusion 2612, thereby enhancing the shielding performance between the second-first RF contact 212a and the second-second RF contact 212b to achieve complete shielding. The second-first shielding protrusion 2612 can be formed as a plate shape arranged along the vertical direction.

[0103] The second-first grounding contact 261 may include a second-first grounding connection member 2613 and a second-first grounding mounting member 2614.

[0104] The second-first grounding connection member 2613 is combined with the second-first shielding member 2611 and the second-first grounding mounting member 2614, respectively. The second-first shielding member 2611 and the second-first grounding mounting member 2614 can be connected to each other through the second-first grounding connection member 2613. The second-first grounding connection member 2613 can be connected to the grounding contact of the opposing connector. Thus, the second grounding contact 260 is connected to the grounding contact of the opposing connector through the second-first grounding connection member 2613, thereby enabling electrical connection with the grounding contact of the opposing connector. Therefore, as the second grounding contact 260 is connected to the grounding contact of the opposing connector through the second-first grounding connection member 2613, the gap created by the second-first grounding contact 261 and the second-second grounding contact 262 being spaced apart from each other along the second axial direction (Y-axis direction) can be shielded. The second-first grounding connection member 2613 may be combined with the second-first shielding member 2611. The second-first shielding member 2611 may protrude from the second-first grounding connection member 2613 along the first axial direction (X-axis direction). In this case, the second-first shielding protrusion 2612 may protrude from the second-first shielding member 2611 along the first axial direction (X-axis direction).

[0105] The second-first grounding mounting member 2614 is mounted on the first substrate. The second-first grounding mounting member 2614 can be grounded by being mounted on the first substrate. Thus, the second-first grounding contact 261 can be grounded on the first substrate via the second-first grounding mounting member 2614. The second-first grounding mounting member 2614 can protrude from the second-first grounding connection member 2613 along the second axial direction (Y-axis direction). In this case, the second-first grounding mounting member 2614 can be positioned between the second-first RF contact 212a and the plurality of transmission contacts 220, with the first axial direction (X-axis direction) as a reference. The second-first grounding mounting member 2614 can protrude from the second-first grounding connection member 2613 with a length sufficient to connect to the grounding housing 230, with the second axial direction (Y-axis direction) as a reference. In this case, the second-first grounding mounting member 2614 and the second-first shielding member 2611 protrude from the second-first grounding connection member 2613 in different directions, thereby allowing them to connect with the different sidewalls of the grounding housing 230. Therefore, since the second-first grounding contact 261 and the grounding housing 230 surround all sides of the second-first RF contact 212a and are electrically connected to each other, the substrate connector 200 of the first embodiment further enhances the shielding performance of the second-first RF contact 212a, thereby achieving complete shielding. The second-first grounding mounting member 2614 can be formed as a plate shape arranged in a horizontal direction.

[0106] The second-first grounding contact 261 may include a second-first grounding protrusion 2615.

[0107] The second-first grounding protrusion 2615 protrudes from the second-first shielding member 2611. The second-first grounding protrusion 2615 can be mounted on the first substrate. Therefore, the substrate connector 200 of the first embodiment can increase the mounting area of ​​the second-first grounding contact 261 on the first substrate, thereby further enhancing the shielding performance of the second-first grounding contact 261. The second-first grounding protrusion 2615 penetrates and protrudes from the insulating portion 240, thus allowing it to be mounted on the first substrate. The second-first grounding protrusion 2615 can protrude from the second-first shielding member 2611 along the vertical direction. The second-first grounding protrusion 2615 can be formed in a plate shape arranged along the vertical direction.

[0108] The second-first grounding contact 261 may include a second-first connecting protrusion 2616.

[0109] The second-1 connecting protrusion 2616 protrudes from the second-1 shielding member 2611. The second-1 connecting protrusion 2616 can connect to the ground housing of the opposing connector. Therefore, the substrate connector 200 of the first embodiment can increase the connection area between the second-1 grounding contact 261 and the ground housing of the opposing connector, thereby further enhancing the shielding performance of the second-1 grounding contact 261. The second-1 connecting protrusion 2616 penetrates and protrudes from the insulating portion 240, thereby connecting to the ground housing of the opposing connector. The second-1 connecting protrusion 2616 is inserted into the insulating portion of the opposing connector, thereby also connecting to the ground housing of the opposing connector. In this case, a through hole for the insertion of the second-1 connecting protrusion 2616 can be formed in the insulating portion of the opposing connector. The second-1 connecting protrusion 2616 can protrude from the second-1 shielding member 2611 along the vertical direction. With the vertical direction as a reference, the second-first connecting protrusion 2616 and the second-first grounding protrusion 2615 can protrude from the second-first shielding member 2611 in opposite directions. The second-first connecting protrusion 2616 can be formed as a plate shape arranged along the vertical direction.

[0110] The second-2 grounding contact 262 can be located between the second-2 RF contact 212b and the plurality of transmission contacts 220, with the first axial direction (X-axis direction) as a reference. Thus, the second-2 grounding contact 262 can shield the area between the second-2 RF contact 212b and the plurality of transmission contacts 220. The second-2 grounding contact 262 can be configured separately from the second-1 grounding contact 261, with the second axial direction (Y-axis direction) as a reference. The second-2 grounding contact 262 and the second-1 grounding contact 261 can be formed in different forms. For example, the second-2 grounding contact 262 can be formed without the second-1 shielding member 2611, the second-1 shielding protrusion 2612, the second-1 grounding protrusion 2615, and the second-1 connecting protrusion 2616 present in the second-1 grounding contact 261. Therefore, compared to the embodiment where the second-2nd ground contact 262 is formed in the same shape as the second-1st ground contact 261, the substrate connector 200 of the first embodiment not only improves the ease of manufacturing the second-2nd ground contact 262, but also reduces the material cost for manufacturing the second-2nd ground contact 262. In this case, shielding between the second-1st RF contact 212a and the second-2nd RF contact 212b can be achieved through the second-1st ground contact 261.

[0111] The second-second grounding contact 262 may include a second-second grounding connection member 2621 and a second-second grounding mounting member 2622.

[0112] The second-2 grounding connection member 2621 is used to connect with the grounding contact of the opposing connector. Thus, the second grounding contact 260 connects to the grounding contact of the opposing connector via the second-2 grounding connection member 2621, thereby enabling electrical connection with the grounding contact of the opposing connector. Therefore, as the second grounding contact 260 connects to the grounding contact of the opposing connector via the second-2 grounding connection member 2621, the gap created by the second-2 grounding contact 262 and the second-1 grounding contact 261 being spaced apart from each other along the second axial direction (Y-axis direction) can be concealed. In this case, both the second-2 grounding connection member 2621 and the second-1 grounding connection member 2613 can connect to the grounding contact of the opposing connector.

[0113] The second-2 grounding mounting member 2622 is mounted on the first substrate. The second-2 grounding mounting member 2622 can be grounded by being mounted on the first substrate. Thus, the second-2 grounding contact 262 can be grounded on the first substrate via the second-2 grounding mounting member 2622. The second-2 grounding mounting member 2622 can protrude from the second-2 grounding connection member 2621 along the second axial direction (Y-axis direction). In this case, the second-2 grounding mounting member 2622 can be positioned between the second-2 RF contact 212b and the plurality of transmission contacts 220, with the first axial direction (X-axis direction) as a reference. The second-2 grounding mounting member 2622 can protrude from the second-2 grounding connection member 2621 with a length sufficient to connect to the grounding housing 230, with the second axial direction (Y-axis direction) as a reference. In this configuration, the second-2nd grounding mounting member 2622 and the second-1st grounding mounting member 2614 protrude in opposite directions, thereby connecting to the sidewalls of the grounding housing 230 facing each other. Therefore, the substrate connector 200 of the first embodiment can further enhance the shielding performance between the plurality of the second RF contacts 212 and the transmission contacts 220. The second-2nd grounding mounting member 2622 can be formed as a plate arranged in a horizontal direction.

[0114] As described above, the substrate connector 200 of the first embodiment can utilize the second-1st ground contact 261, the second-2nd ground contact 262, and the ground housing 230 to realize a second ground loop 260a for the second-1st RF contact 212a and the second-2nd RF contact 212b. Figure 5 (As shown in the figure). Therefore, the substrate connector 200 of the first embodiment utilizes the second ground loop 260a to further enhance the shielding performance of the second-1 RF contact 212a and the second-2 RF contact 212b, thereby achieving complete shielding of the second-1 RF contact 212a and the second-2 RF contact 212b.

[0115] Here, the second-first grounding contact 261 and the first-first grounding contact 251 can be formed with the same shape as each other. The second-second grounding contact 262 and the first-second grounding contact 252 can also be formed with the same shape as each other. Thus, the substrate connector 200 of the first embodiment can improve the ease of manufacturing the second-first grounding contact 261, the first-first grounding contact 251, the second-second grounding contact 262, and the first-second grounding contact 252 respectively.

[0116] In this case, such as Figure 5 As shown, the second-first grounding contact 261 and the first-first grounding contact 251 can be configured as point-symmetric with respect to a symmetry point SP. The symmetry point SP is a position that is equidistant from the side walls 230b and 230c of the grounding housing 230, which are spaced apart from each other with respect to the first axial direction (X-axis direction), and equidistant from the side walls 230d and 230e of the grounding housing 230, which are spaced apart from each other with respect to the second axial direction (Y-axis direction). Therefore, since the second-first grounding contact 261 and the first-first grounding contact 251 are formed with the same shape and differ only in their configuration direction, the substrate connector 200 of the first embodiment can further improve the ease of manufacturing the second-first grounding contact 261 and the first-first grounding contact 251. Figure 5As shown, the second-2nd grounding contact 262 and the first-2nd grounding contact 252 can be configured as point-symmetric with respect to the symmetry point SP. Therefore, since the second-2nd grounding contact 262 and the first-2nd grounding contact 252 are formed with the same shape and differ only in their configuration direction, the substrate connector 200 of the first embodiment can further improve the ease of manufacturing the second-2nd grounding contact 262 and the first-2nd grounding contact 252. In this case, the second-1st RF contact 212a and the first-1st RF contact 211a can be configured as point-symmetric with respect to the symmetry point SP. The second-2nd RF contact 212b and the first-2nd RF contact 211b can be configured as point-symmetric with respect to the symmetry point SP.

[0117] Reference Figures 2 to 10 In the substrate connector 200 of the first embodiment, the ground housing 230 can be implemented in the following manner.

[0118] The grounding housing 230 may include: an inner grounding wall 231, an outer grounding wall 232, and a grounding connection wall 233.

[0119] The grounding inner wall 231 faces the insulating portion 240. The grounding inner wall 231 can be configured to face the inner space 230a. The first-first grounding contact 251 and the second-first grounding contact 261 can be connected to the grounding inner wall 231 respectively. The grounding inner wall 231 may include: a first sub-grounding inner wall 2311, a second sub-grounding inner wall 2312, a third sub-grounding inner wall 2313, and a fourth sub-grounding inner wall 2314.

[0120] The first sub-grounding inner wall 2311 and the second sub-grounding inner wall 2312 can be arranged opposite each other with reference to the first axial direction (X-axis direction). The third sub-grounding inner wall 2313 and the third sub-grounding inner wall 2314 can be arranged opposite each other with reference to the second axial direction (Y-axis direction). The first sub-grounding inner wall 2311, the second sub-grounding inner wall 2312, the third sub-grounding inner wall 2313, and the third sub-grounding inner wall 2314 can be coupled to the grounding connection wall 233 at positions spaced apart from each other. The first sub-grounding inner wall 2311, the second sub-grounding inner wall 2312, the third sub-grounding inner wall 2313, and the third sub-grounding inner wall 2314 can each elastically move with reference to the portion coupled to the grounding connection wall 233, thereby applying pressure to the insulating portion 240. Thus, the substrate connector 200 of the first embodiment can strengthen the bonding force between the grounding housing 230 and the insulating portion 240. Furthermore, when the relative connector is inserted into the inner space 230a, the first sub-grounding inner wall 2311, the second sub-grounding inner wall 2312, the third sub-grounding inner wall 2313, and the third sub-grounding inner wall 2314 are pushed by the relative connector, thereby exerting stronger pressure on the insulating portion 240, which can further increase the bonding force between the grounding housing 230 and the insulating portion 240.

[0121] The grounding outer wall 232 is spaced apart from the grounding inner wall 231. The grounding outer wall 232 may be disposed outside the grounding inner wall 231. The grounding outer wall 232 may be configured to surround all sides relative to the grounding inner wall 231. The grounding outer wall 232 and the grounding inner wall 231 may be implemented by shielding walls surrounding the sides of the inner space 230a. The first RF contact 211 and the second RF contact 212 may be located in the inner space 230a surrounded by the shielding walls. Thus, the grounding housing 230 can utilize the shielding walls to achieve shielding for a plurality of the RF contacts 210. Therefore, the substrate connector 200 of the first embodiment can utilize the shielding walls to further improve EMI shielding performance and EMC performance.

[0122] The grounding outer wall 232 can be grounded by being mounted on the first substrate. In this case, the grounding housing 230 can be grounded through the grounding outer wall 232. With one end of the grounding outer wall 232 connected to the grounding connection wall 233, the other end of the grounding outer wall 232 can be mounted on the first substrate. In this case, the grounding outer wall 232 can be formed to have a higher height than the grounding inner wall 231.

[0123] The grounding outer wall 232 can be connected to the grounding housing of the opposing connector inserted into the inner space 230a. For example, as Figure 8 and Figure 9 As shown, the grounding outer wall 232 can be connected to the grounding housing 330 of the opposite connector. As described above, the substrate connector 200 of the first embodiment can further enhance its shielding function through the connection between the grounding housing 230 and the grounding housing of the opposite connector. Furthermore, the connection between the grounding housing 230 and the grounding housing of the opposite connector of the first embodiment can reduce adverse electrical effects such as crosstalk caused by mutual capacitance or mutual inductance between adjacent terminals. In this case, the substrate connector 200 of the first embodiment can ensure a path for electromagnetic waves to flow into the ground of at least one of the first and second substrates, thereby further enhancing EMI shielding performance.

[0124] The grounding connection wall 233 is connected to both the grounding inner wall 231 and the grounding outer wall 232. The grounding connection wall 233 can be disposed between the grounding inner wall 231 and the grounding outer wall 232. Through the grounding connection wall 233, the grounding inner wall 231 and the grounding outer wall 232 can be electrically connected to each other. Therefore, if the grounding outer wall 232 is mounted on the first substrate and grounded, the grounding connection wall 233 and the grounding inner wall 231 are also grounded, thereby achieving a shielding function.

[0125] The grounding connection wall 233 can be connected to one end of the grounding outer wall 232 and one end of the grounding inner wall 231, respectively. Figure 10 When used as a reference, one end of the grounding outer wall 232 can correspond to the upper end of the grounding outer wall 232, and one end of the grounding inner wall 231 can correspond to the upper end of the grounding inner wall 231. The grounding connection wall 233 can be formed as a plate arranged in the horizontal direction, and the grounding outer wall 232 and the grounding inner wall 231 can each be formed as a plate arranged in the vertical direction. The grounding connection wall 233, the grounding outer wall 232, and the grounding inner wall 231 can also be formed as a single unit.

[0126] The grounding connection wall 233 can be connected to the grounding housing of the opposite connector inserted into the inner space 230a. Therefore, since the grounding outer wall 232 and the grounding connection wall 233 are connected to the grounding housing of the opposite connector, the substrate connector 200 of the first embodiment increases the contact area between the grounding housing 230 and the grounding housing of the opposite connector, thereby further enhancing the shielding function.

[0127] Here, the grounding housing 230, together with the first grounding contact 250, can provide shielding for the plurality of the first RF contacts 211. The grounding housing 230, together with the second grounding contact 260, can provide shielding for the plurality of the second RF contacts 212.

[0128] In this case, such as Figure 5 As shown, the grounding housing 230 may include a first shielding wall 230b, a second shielding wall 230c, a third shielding wall 230d, and a fourth shielding wall 230e. The first shielding wall 230b, the second shielding wall 230c, the third shielding wall 230d, and the fourth shielding wall 230e can be implemented by the grounding inner wall 231, the grounding outer wall 232, and the grounding connection wall 233, respectively. The first shielding wall 230b and the second shielding wall 230c are arranged opposite each other with respect to the first axial direction (X-axis direction). With respect to the first axial direction (X-axis direction), a plurality of the first RF contacts 211 and a plurality of the second RF contacts 212 can be located between the first shielding wall 230b and the second shielding wall 230c. With reference to the first axial direction (X-axis direction), a plurality of the first RF contacts 211 can be located at a distance shorter than the distance between them and the first shielding wall 230b. With reference to the first axial direction (X-axis direction), a plurality of the second RF contacts 212 can be located at a distance shorter than the distance between them and the second shielding wall 230c. The third shielding wall 230d and the fourth shielding wall 230e are arranged opposite each other with reference to the second axial direction (Y-axis direction). With reference to the second axial direction (Y-axis direction), a plurality of the first RF contacts 211 and a plurality of the second RF contacts 212 can be located between the third shielding wall 230d and the fourth shielding wall 230e.

[0129] The first grounding contact 250 can be configured with reference to the first axial direction (X-axis direction) between a plurality of the first RF contacts 211 and a plurality of the transmission contacts 320. Thus, the plurality of the first RF contacts 211 can be located with reference to the first axial direction (X-axis direction) between the first shielding wall 230b or the first grounding contact 250, and with reference to the second axial direction (Y-axis direction) between the third shielding wall 230d and the fourth shielding wall 230e. Therefore, the substrate connector 200 of the first embodiment can utilize the first grounding contact 250, the first shielding wall 230b, the third shielding wall 230d, and the fourth shielding wall 230e to enhance the shielding function of the plurality of the first RF contacts 211. The first grounding contact 250, the first shielding wall 230b, the third shielding wall 230d, and the fourth shielding wall 230e are arranged on four sides based on a plurality of the first RF contacts 211, thereby achieving shielding against RF signals. In this case, the first grounding contact 250, the first shielding wall 230b, the third shielding wall 230d, and the fourth shielding wall 230e can form the first grounding loop 250a for the plurality of the first RF contacts 211. Figure 5 (As shown in the diagram). Therefore, the substrate connector 200 of the first embodiment utilizes the first ground loop 250a to further enhance the shielding function of the plurality of the first RF contacts 211, thereby achieving complete shielding of the plurality of the first RF contacts 211. In this case, the plurality of the first RF contacts 211 can be located between the first sub-grounding inner wall 2311 and the first grounding contact 250 with reference to the first axial direction (X-axis direction), while they can be located between the third sub-grounding inner wall 2313 and the fourth sub-grounding inner wall 2314 with reference to the second axial direction (Y-axis direction).

[0130] The second grounding contact 260 can be configured between a plurality of the second RF contacts 212 and a plurality of the transmission contacts 320, with the first axial direction (X-axis direction) as a reference. Thus, the plurality of the second RF contacts 212 can be located between the second shielding wall 230c and the second grounding contact 260, with the first axial direction (X-axis direction) as a reference, and can be located between the third shielding wall 230d and the fourth shielding wall 230e, with the second axial direction (Y-axis direction) as a reference. Therefore, the substrate connector 200 of the first embodiment can utilize the second grounding contact 260, the second shielding wall 230c, the third shielding wall 230d, and the fourth shielding wall 230e to enhance the shielding function of the plurality of the second RF contacts 212. The second grounding contact 260, the second shielding wall 230c, the third shielding wall 230d, and the fourth shielding wall 230e are arranged on four sides based on a plurality of the second RF contacts 212, thereby achieving shielding against RF signals. In this case, the second grounding contact 260, the second shielding wall 230c, the third shielding wall 230d, and the fourth shielding wall 230e can form a second grounding loop 260a for the plurality of the second RF contacts 212. Figure 5 (As shown in the diagram). Therefore, the substrate connector 200 of the first embodiment utilizes the second ground loop 260a to further enhance the shielding function of the plurality of the second RF contacts 212, thereby achieving complete shielding of the plurality of the second RF contacts 212. In this case, the plurality of the second RF contacts 212 can be located between the second sub-grounding inner wall 2312 and the second grounding contact 260 with reference to the first axial direction (X-axis direction), and can also be located between the third sub-grounding inner wall 2313 and the fourth sub-grounding inner wall 2314 with reference to the second axial direction (Y-axis direction).

[0131] The grounding housing 230 may include a wedge component 234. Figure 10 (as shown in the image).

[0132] The wedge member 234 protrudes from the grounding inner wall 231. When the grounding housing 230 and the insulating portion 240 are engaged, the wedge member 234 is embedded in the insulating portion 240, thereby securing the grounding housing 230 and the insulating portion 240. Therefore, the substrate connector 200 of the first embodiment can utilize the wedge member 234 to more securely engage the grounding housing 230 and the insulating portion 240. The wedge member 234 and the grounding inner wall 231 can also be integrally formed.

[0133] The wedge component 234 may include a first wedge component 234a ( Figure 8 (shown in) and the second wedge component 234b ( Figure 8 (as shown in the image).

[0134] The first wedge member 234a protrudes from the inner wall 2311 of the first sub-ground. When the ground housing 230 and the insulating portion 240 are engaged, the first wedge member 234a is inserted into the insulating portion 240 as it is inserted, thereby securing the ground housing 230 and the insulating portion 240. The first-1 grounding contact 251 can be connected to the first wedge member 234a. In this case, the first-1 shielding protrusion 2512 is connected to the first wedge member 234a, thereby enabling electrical connection with the ground housing 230. Thus, the first wedge member 234a can enhance the bonding force between the ground housing 230 and the insulating portion 240 while also enhancing the shielding performance between the first-1 RF contact 211a and the first-2 RF contact 211b.

[0135] The second wedge member 234b protrudes from the inner wall 2312 of the second sub-ground. When the ground housing 230 and the insulating portion 240 are engaged, the second wedge member 234b is inserted into the insulating portion 240 as it is inserted, thereby securing the ground housing 230 and the insulating portion 240. The second wedge member 234b and the first wedge member 234a can be configured to face each other with reference to the first axial direction (X-axis direction). The second-first ground contact 261 can be connected to the second wedge member 234b. In this case, the second-first shielding protrusion 2612 is connected to the second wedge member 234b, thereby enabling electrical connection with the ground housing 230. Thus, the second wedge member 234b can enhance the shielding performance between the second-first RF contact 212a and the second-second RF contact 212b while strengthening the bonding force between the ground housing 230 and the insulating portion 240.

[0136] Reference Figures 2 to 14 The grounding housing 230 improves the contact between the grounding inner wall 231 and the grounding housing of the opposite connector, thereby further enhancing the shielding function, and may include the following configuration.

[0137] First, such as Figure 11As shown, the grounding housing 230 may include a connecting groove 235. The connecting groove 235 may be formed on the outer surface of the grounding outer wall 232. The outer surface of the grounding outer wall 232 is the side facing the opposite side of the inner space 230a. The connecting groove 235 may be implemented as a groove formed from the outer surface of the grounding outer wall 232 at a predetermined depth. The grounding housing 330 of the opposing connector can be inserted into the connecting groove 235. In this case, the connecting protrusion 336 of the grounding housing 330 of the opposing connector can be inserted into the connecting groove 235. Thus, the substrate connector 200 of the first embodiment utilizes the connecting groove 235 to improve the contact between the grounding housing 230 and the grounding housing 330 of the opposing connector, thereby further enhancing the shielding function of the first RF contact 211 and the second RF contact 212. Although Figure 11 As shown in the diagram, the connecting groove 235 is formed to have a longer length than the connecting protrusion 336 based on the vertical direction, but it is not limited to this; the connecting groove 235 and the connecting protrusion 336 can also be formed to have approximately the same length. On the other hand, the grounding outer wall 232 supports the connecting protrusion 336 inserted into the connecting groove 235, thereby preventing the connecting protrusion 336 from escaping from the connecting groove 235. The grounding housing 230 may also include a plurality of the connecting grooves 235. In this case, the plurality of connecting grooves 235 can be arranged spaced apart from each other along the outer surface of the grounding outer wall 232.

[0138] Next, as Figure 12 As shown, the grounding housing 230 may further include a connecting protrusion 236. The connecting protrusion 236 may be formed on the outer surface of the grounding outer wall 232. The connecting protrusion 236 may protrude from the outer surface of the grounding outer wall 232. The connecting protrusion 236 may be inserted into the grounding housing 330 of the opposing connector. In this case, the connecting protrusion 236 may be inserted into the connecting groove 337 of the grounding housing 330 of the opposing connector. Thus, the substrate connector 200 of the first embodiment utilizes the connecting protrusion 236 to improve the contact between the grounding housing 230 and the grounding housing 330 of the opposing connector, thereby further enhancing the shielding function of the first RF contact 211 and the second RF contact 212. Although Figure 12As shown in the diagram, the connecting protrusion 236 is formed to have a shorter length than the connecting groove 337 based on the vertical direction, but it is not limited to this; the connecting protrusion 236 and the connecting groove 337 can also be formed to have approximately the same length. On the other hand, the connecting protrusion 236 is supported on the grounding housing 330 by being inserted into the connecting groove 337, thereby preventing it from escaping from the connecting groove 337. The grounding housing 230 may also include a plurality of the connecting protrusions 236. In this case, the plurality of connecting protrusions 236 can be arranged spaced apart from each other along the outer surface of the grounding outer wall 232.

[0139] Next, as Figure 13 As shown, when the ground housing 230 includes the connecting protrusion 236, the connecting protrusion 236 can also be supported by the connecting protrusion 336 of the ground housing 330 of the opposing connector. Thus, the substrate connector 200 of the first embodiment utilizes the connecting protrusion 236 to improve the contact between the ground housing 230 and the ground housing 330 of the opposing connector, thereby further enhancing the shielding function of the first RF contact 211 and the second RF contact 212. On the other hand, the connecting protrusion 236, by being positioned below the connecting protrusion 336 and supported by it, can also prevent escape.

[0140] Next, as Figure 8 As shown, the grounding housing 230 can also contact the grounding housing 330 of the opposite connector through a surface contact between the outer surface of the grounding outer wall 232 and the grounding housing 330 of the opposite connector. In this case, a gap may be generated between the outer surface of the grounding outer wall 232 and the grounding housing 330 of the opposite connector. To compensate for this gap, as... Figure 14 As shown, the grounding housing 230 may include a conductive member 237. The conductive member 237 may be attached to the outer surface of the grounding outer wall 232. The conductive member 237 may be formed along a corner portion 232a ( ) of the outer surface including the grounding outer wall 232. Figure 10The outer surface of the grounding outer wall 232 (shown in the diagram) extends to form a closed loop. Thus, the substrate connector 200 of the first embodiment utilizes the conductive member 237 to improve the contact between the grounding housing 230 and the grounding housing 330 of the opposing connector, thereby further enhancing the shielding function of the first RF contact 211 and the second RF contact 212. Furthermore, in the embodiment utilizing the connecting protrusion 236 and the connecting groove 235, operations performed on the corner portion 232a of the outer surface of the grounding outer wall 232 are difficult; however, in the embodiment utilizing the conductive member 237, the ease of operations performed on the corner portion 232a of the outer surface of the grounding outer wall 232 is improved. The conductive member 237 can be formed of an electrically conductive material to enable electrical connection between the grounding outer wall 232 and the grounding housing 330 of the opposing connector. For example, the conductive member 237 can be formed of metal. After being manufactured separately, the conductive component 237 can be attached to the grounding outer wall 232 by installation, attachment, fastening, or other means on the outer surface of the grounding outer wall 232. Alternatively, the conductive component 237 can be attached to the grounding outer wall 232 by coating the outer surface of the grounding outer wall 232 with a conductive shielding material.

[0141] Reference Figure 15 The grounding housing 230 can also be implemented as a double shielding wall. In this case, the inner grounding wall 231 can be configured to surround all sides relative to the inner space 230a. Thus, the grounding housing 230 can be implemented as a double shielding wall configured to surround all sides relative to the inner space 230a by the inner grounding wall 231 and the outer grounding wall 232. Thus, the grounding housing 230 can utilize the double shielding wall to enhance the shielding function of the plurality of RF contacts 210. Therefore, the substrate connector 200 of the first embodiment can utilize the double shielding wall to help further improve EMI shielding performance and EMC performance.

[0142] Reference Figures 2 to 16 In the substrate connector 200 of the first embodiment, the insulating portion 240 can be implemented in the following manner.

[0143] The insulating part 240 may include: an insulating member 241, an insertion member 242, and a connecting member 243.

[0144] The insulating member 241 supports a plurality of the RF contacts 210 and a plurality of the transmission contacts 220. The insulating member 241 may be located in the inner space 230a. The insulating member 241 may be located inside the grounding inner wall 231. The insulating member 241 may be inserted into the inner space of the opposing connector.

[0145] The insertion member 242 is inserted between the inner grounding wall 231 and the outer grounding wall 232. As the insertion member 242 is inserted between the inner grounding wall 231 and the outer grounding wall 232, the insulating portion 240 can engage with the grounding housing 230. The insertion member 242 can be inserted between the inner grounding wall 231 and the outer grounding wall 232 in an interference fit manner. The insertion member 242 can be disposed outside the insulating member 241. The insertion member 242 can be configured to surround the outer side of the insulating member 241.

[0146] The connecting member 243 is coupled to both the insertion member 242 and the insulating member 241. The insertion member 242 and the insulating member 241 can be connected to each other via the connecting member 243. With respect to the vertical direction, the connecting member 243 can be formed to be thinner than the insertion member 242 and the insulating member 241. This allows for a space to be provided between the insertion member 242 and the insulating member 241, and the opposing connector can be inserted into the corresponding space. The connecting member 243, the insertion member 242, and the connecting member 243 can also be integrally formed.

[0147] The insulating part 240 may include a welding inspection window 244. Figure 7 (as shown in the image).

[0148] The solder inspection window 244 can be formed through the insulating portion 240. The solder inspection window 244 can be used to inspect the state of the first RF mounting member 2111 mounted on the first substrate. In this case, a plurality of the first RF contacts 211 can be combined with the insulating portion 240 so that the first RF mounting members 2111 are located in the solder inspection window 244. Thus, the plurality of first RF mounting members 2111 are not obstructed by the insulating portion 240. Therefore, when the substrate connector 200 of the first embodiment is mounted on the first substrate, the operator can inspect the state of the plurality of first RF mounting members 2111 mounted on the first substrate through the solder inspection window 244. Thus, even if all the plurality of first RF contacts 211, including the plurality of first RF mounting members 2111, are located inside the grounding housing 230, the substrate connector 200 of the first embodiment can improve the accuracy of the installation operation of mounting the plurality of first RF contacts 2111 onto the first substrate. The solder inspection window 244 can be formed through the insulating portion 241.

[0149] The insulating portion 240 may further include a plurality of solder inspection windows 244. In this case, the plurality of first RF mounting members 2111 may be located in different solder inspection windows 244. The plurality of second RF mounting members 2121 and the plurality of transmission mounting members 2201 may also be located in the plurality of solder inspection windows 244. Therefore, when the substrate connector 200 of the first embodiment is mounted on the first substrate, the operator can inspect the mounting of the plurality of first RF mounting members 2111, the plurality of second RF mounting members 2121, and the plurality of transmission mounting members 2201 on the first substrate through the plurality of solder inspection windows 244. Thus, the substrate connector 200 of the first embodiment can improve the accuracy of the operation of mounting the plurality of first RF contacts 211, the plurality of second RF contacts 212, and the plurality of transmission contacts 220 on the first substrate. The plurality of solder inspection windows 244 may be formed through the insulating portion 240 at spaced-apart locations.

[0150] The insulating portion 240 may include a first assembly groove 245. Figure 16 (as shown in the image).

[0151] The first assembly slot 245 provides the first wedge component 234a ( Figure 8(As shown in the diagram) Insertion. The first wedge member 234a is inserted into the first assembly groove 245 and embedded in the insulating portion 240, thereby securing the grounding housing 230 and the insulating portion 240. The first assembly groove 245 can be implemented as forming a groove of a predetermined depth in the insulating member 241. The first-1 shielding protrusion 2512 can be inserted into the first assembly groove 245. The first-1 shielding protrusion 2512 is inserted into the first assembly groove 245 and can be connected to the first wedge member 234a. Thus, the first-1 grounding contact 251 can be electrically connected to the grounding housing 230.

[0152] The insulating portion 240 may include a second assembly groove 246. Figure 16 (as shown in the image).

[0153] The second assembly slot 246 provides the second wedge component 234b ( Figure 8 (As shown in the diagram) Insertion. The second wedge member 234b, as it is inserted into the second assembly groove 246, embeds itself into the insulating portion 240, thereby securing the grounding housing 230 and the insulating portion 240. The second assembly groove 246 can be implemented as forming a groove of a predetermined depth in the insulating member 241. The second-first shielding protrusion 2612 can be inserted into the second assembly groove 246. The second-first shielding protrusion 2612, inserted into the second assembly groove 246, can be connected to the second wedge member 234b. Thus, the second-first grounding contact 261 can be electrically connected to the grounding housing 230.

[0154] <Substrate connector 300 of the second embodiment>

[0155] Reference Figure 2 , Figure 17 as well as Figure 18 The substrate connector 300 of the second embodiment may include: a plurality of RF contacts 310, a plurality of transmission contacts 320, a ground housing 330, and an insulating portion 340.

[0156] The plurality of RF contacts 310 are used for RF signal transmission. The plurality of RF contacts 310 can transmit ultra-high frequency RF signals. The plurality of RF contacts 310 can be supported on the insulating portion 340. The plurality of RF contacts 310 can be assembled to the insulating portion 340. The plurality of RF contacts 310 can be integrally formed with the insulating portion 340 by injection molding.

[0157] The plurality of RF contacts 310 may be spaced apart from each other. The plurality of RF contacts 310 are mounted on the second substrate, thereby enabling electrical connection to the second substrate. The plurality of RF contacts 310 are connected to the plurality of RF contacts of the opposing connector, thereby enabling electrical connection to the first substrate on which the opposing connector is mounted. Thus, the second substrate and the first substrate can be electrically connected. In this case, the opposing connector may also be implemented by the substrate connector 200 of the first embodiment. On the other hand, the opposing connector in the substrate connector 200 of the first embodiment may also be implemented by the substrate connector 300 of the second embodiment.

[0158] The first RF contact 311 and the second RF contact 312 of the plurality of RF contacts 310 may be spaced apart from each other along the first axial direction (X-axis direction). The first RF contact 311 and the second RF contact 312 may be supported on the insulating portion 340 at positions spaced apart from each other along the first axial direction (X-axis direction).

[0159] The first RF contact 311 may include a first RF mounting member 3111. The first RF mounting member 3111 may be mounted on the second substrate. Thus, the first RF contact 311 can be electrically connected to the second substrate via the first RF mounting member 3111. The first RF contact 311 may be formed of an electrically conductive material. For example, the first RF contact 311 may be formed of metal. The first RF contact 311 may be connected to any one of the plurality of RF contacts of the opposing connector.

[0160] The second RF contact 312 may include a second RF mounting member 3121. The second RF mounting member 3121 may be mounted on the second substrate. Thus, the second RF contact 312 can be electrically connected to the second substrate via the second RF mounting member 3121. The second RF contact 312 may be formed of an electrically conductive material. For example, the second RF contact 312 may be formed of metal. The second RF contact 312 may connect to any one of the plurality of RF contacts of the opposing connector.

[0161] Reference Figure 2 , Figure 16 as well as Figure 17A plurality of the transmission contacts 320 are coupled to the insulating portion 340. The plurality of transmission contacts 320 can function as transmitters of signals, data, etc. The plurality of transmission contacts 320 can be coupled to the insulating portion 340 through an assembly process. Alternatively, the plurality of transmission contacts 320 can be integrally formed with the insulating portion 340 through injection molding.

[0162] With the first axial direction (X-axis direction) as a reference, a plurality of the transmission contacts 320 can be disposed between the first RF contact 311 and the second RF contact 312. Therefore, in order to reduce RF signal interference between the first RF contact 311 and the second RF contact 312, the plurality of transmission contacts 320 can be disposed in a space that separates the first RF contact 311 and the second RF contact 312 from each other. Thus, the substrate connector 300 of the second embodiment not only reduces RF signal interference by increasing the distance between the first RF contact 311 and the second RF contact 312, but also improves the space utilization of the insulating portion 340 by distributing a plurality of the transmission contacts 320 in the space used for them.

[0163] The plurality of transmission contacts 320 may be spaced apart from each other. The plurality of transmission contacts 320 may be electrically connected to the second substrate by being mounted on it. In this case, the transmission mounting member 3201 of each of the plurality of transmission contacts 320 may be mounted on the second substrate. The plurality of transmission contacts 320 may be formed of an electrically conductive material. For example, the plurality of transmission contacts 320 may be formed of metal. The plurality of transmission contacts 320 connect with the transmission contacts of the opposing connector, thereby enabling electrical connection with the second substrate on which the opposing connector is mounted. Thus, the second substrate and the first substrate can be electrically connected.

[0164] On the other hand, although Figure 18 The substrate connector 300 shown in the second embodiment includes four transmission contacts 320, but is not limited thereto; the substrate connector 300 of the second embodiment may also include five or more transmission contacts 320. The plurality of transmission contacts 320 may be spaced apart from each other along the first axial direction (X-axis direction) and the second axial direction (Y-axis direction).

[0165] Reference Figures 17 to 19The grounding housing 330 is combined with the insulating portion 340. The grounding housing 330 can be grounded by being mounted on the second substrate. Thus, the grounding housing 330 can shield signals, electromagnetic waves, etc., from the plurality of RF contacts 310. In this case, the grounding housing 330 can prevent electromagnetic waves generated from the plurality of RF contacts 310 from being interfered with by signals from a plurality of circuit components located around the electronic device, and can also prevent electromagnetic waves generated from the plurality of circuit components located around the electronic device from being interfered with by RF signals transmitted by the plurality of RF contacts 310. Therefore, the substrate connector 300 of the second embodiment can utilize the grounding housing 330 to improve EMI (Electro Magnetic Interference) shielding performance and EMC (Electro Magnetic Compatibility) performance. The grounding housing 330 can be formed of an electrically conductive material. For example, the grounding housing 330 can be formed of metal.

[0166] The grounding housing 330 can be configured to surround the side of the inner space 330a. The insulating portion 340 can be provided in the inner space 330a. The first RF contact 311, the second RF contact 312, and a plurality of transmission contacts 22 can all be located in the inner space 330a. In this case, the first RF mounting member 3111, the second RF mounting member 3121, and a plurality of transmission mounting members 3201 can also be located in the inner space 330a. Therefore, by acting as a shielding wall for the first RF contact 311 and the second RF contact 312, the grounding housing 330 can enhance the shielding function of the first RF contact 311 and the second RF contact 312, thereby achieving complete shielding. The opposing connector can be inserted into the inner space 330a. In this case, a portion of the opposing connector is inserted into the inner space 330a, and a portion of the substrate connector 300 of the second embodiment can be inserted into the inner space of the opposing connector.

[0167] The grounding housing 330 can be configured to surround all sides based on the inner space 330a. The inner space 330a can be located inside the grounding housing 330. When the grounding housing 330 is generally formed as a quadrilateral ring, the inner space 330a can be formed as a cuboid. In this case, the grounding housing 330 can be configured to surround the four sides based on the inner space 330a.

[0168] The grounding housing 330 can be integrally formed without seams. The grounding housing 330 can be integrally formed without seams through metal injection molding processes such as die casting or MIM (Metal Injection Molding). The grounding housing 330 can also be integrally formed without seams through CNC (Computer Numerical Control) machining or MCT (Machining Center Tool) machining.

[0169] Reference Figures 17 to 19 The insulating portion 340 supports a plurality of the RF contacts 310. The insulating portion 340 may be combined with a plurality of the RF contacts 310 and a plurality of the transmission contacts 320. The insulating portion 340 may be formed of an insulating material. The insulating portion 340 may be combined with the grounding housing 330 such that the plurality of the RF contacts 310 are located in the inner space 330a.

[0170] Reference Figure 9 , Figures 17 to 20 The substrate connector 300 in the second embodiment may include a first grounding contact 350.

[0171] The first grounding contact 350 is coupled to the insulating portion 340. The first grounding contact 350 can be grounded by being mounted on the second substrate. The first grounding contact 350 can be coupled to the insulating portion 340 by an assembly process. The first grounding contact 350 can also be integrally formed with the insulating portion 340 by injection molding.

[0172] The first grounding contact 350, together with the grounding housing 330, can provide shielding for the first RF contact 311. In this case, the first grounding contact 350 can be positioned between the first RF contact 311 and a plurality of the transmission contacts 320, with the first axial direction (X-axis direction) as a reference. The first grounding contact 350 can be formed of an electrically conductive material. For example, the first grounding contact 350 can be formed of metal. If the opposing connector is inserted into the inner space 330a, the first grounding contact 350 can connect with the grounding contacts of the opposing connector.

[0173] Although not illustrated, the substrate connector 300 of the second embodiment may further include a plurality of the first ground contacts 350. The plurality of first ground contacts 350 may be spaced apart from each other along the second axial direction (Y-axis direction). As the first ground contacts 350 are connected to the ground contacts of the opposing connector, the gaps formed by the plurality of first ground contacts 350 being spaced apart from each other can be concealed.

[0174] Reference Figure 9 , Figures 17 to 20 The substrate connector 300 in the second embodiment may include a second grounding contact 360.

[0175] The second grounding contact 360 is coupled to the insulating portion 340. The second grounding contact 360 can be grounded by being mounted on the second substrate. The second grounding contact 360 can be coupled to the insulating portion 340 by an assembly process. The second grounding contact 360 can also be integrally formed with the insulating portion 340 by injection molding.

[0176] The second grounding contact 360, together with the grounding housing 330, can provide shielding for the second RF contact 312. The second grounding contact 360 can be disposed between a plurality of the transmission contacts 320 and the second RF contacts 212, with the first axial direction (X-axis direction) as a reference. The second grounding contact 360 can be formed of an electrically conductive material. For example, the second grounding contact 360 can be formed of metal. If the opposing connector is inserted into the inner space 330a, the second grounding contact 360 can connect with the grounding contacts of the opposing connector.

[0177] Although not illustrated, the substrate connector 300 of the second embodiment may further include a plurality of the aforementioned second ground contacts 360. The plurality of the second ground contacts 360 may be spaced apart from each other along the second axial direction (Y-axis direction). As the second ground contacts 360 are connected to the ground contacts of the opposing connector, the gaps formed by the plurality of second ground contacts 360 being spaced apart from each other can be concealed.

[0178] Here, the substrate connector 300 of the second embodiment can be implemented as including a plurality of the first RF contacts 311 and a plurality of the second RF contacts 312.

[0179] Reference Figure 9 , Figures 17 to 21A plurality of the first RF contacts 311 and a plurality of the second RF contacts 312 may be spaced apart from each other along the first axial direction (X-axis direction). A plurality of transmission contacts 320 may be arranged between the plurality of the first RF contacts 311 and the plurality of the second RF contacts 312, with the first axial direction (X-axis direction) as a reference. In this case, the first ground contact 350 may shield between the plurality of the first RF contacts 311 and the plurality of transmission contacts 320, with the first axial direction (X-axis direction) as a reference. The second ground contact 260 may shield between the plurality of the second RF contacts 312 and the plurality of transmission contacts 320, with the first axial direction (X-axis direction) as a reference.

[0180] When a plurality of the first RF contacts 311 are provided, the first ground contact 350 can shield the plurality of the first RF contacts 311 and the plurality of transmission contacts 320 with reference to the first axial direction (X-axis direction). The first ground contact 350 is connected to the ground contact of the opposing connector, thereby shielding the plurality of the first RF contacts 311 with reference to the second axial direction (Y-axis direction). Thus, the substrate connector 300 of the second embodiment utilizes the first ground contact 350 to achieve shielding between the plurality of the first RF contacts 311 and the plurality of transmission contacts 320, and can further achieve shielding between the plurality of the first RF contacts 311 by utilizing the connection between the first ground contact 350 and the ground contact of the opposing connector. In this case, the substrate connector 300 of the second embodiment can also utilize the ground housing 330 to shield between the plurality of the first RF contacts 311. Therefore, the substrate connector 300 of the second embodiment is implemented to be able to transmit a wider variety of RF signals using a plurality of the first RF contacts 311, thereby improving its versatility for use in a wider variety of electronic products.

[0181] The first-1 RF contact 311a and the first-2 RF contact 311b of the plurality of the first RF contacts 311 can be coupled to the insulating portion 240 to be spaced apart from each other along the second axial direction (Y-axis direction). Although Figure 21As illustrated in the figure, the substrate connector 300 of the second embodiment includes two first RF contacts 311 implemented by the first-1RF contact 311a and the first-2RF contact 311b. However, it is not limited to this, and the substrate connector 300 of the second embodiment may also include three or more first RF contacts 311. On the other hand, in this specification, the description is based on the second embodiment substrate connector 300 including the first-1RF contact 311a and the first-2RF contact 311b.

[0182] When the first-1RF contact 311a and the first-2RF contact 311b are provided, the first grounding contact 350 may include a first grounding mounting member 351. Figure 9 (shown in the image) and the first grounding connection member 352 ( Figure 9 (as shown in the image).

[0183] The first grounding mounting member 351 is mounted on the first substrate. The first grounding mounting member 351 can be grounded by mounting on the first substrate. Thus, the first grounding contact 350 can be grounded on the first substrate via the first grounding mounting member 351. The first grounding mounting member 351 can be configured along the second axial direction (Y-axis direction). In this case, the first grounding mounting member 351 can be configured between the first-1RF contact 311a and the plurality of transmission contacts 320, with the first axial direction (X-axis direction) as a reference. The first grounding mounting member 351 can also be configured between the first-2RF contact 311b and the plurality of transmission contacts 320, with the first axial direction (X-axis direction) as a reference. The first grounding mounting member 351 can be formed as a plate shape configured along the vertical direction. The first grounding mounting member 351 can also be connected to the grounding contact of the opposing connector. For example, as... Figure 8 The first grounding mounting member 351 can be connected to the first-1 grounding connection member 2513 of the opposite connector.

[0184] The first grounding connection member 352 is coupled to the first grounding mounting member 351. The first grounding connection member 352 may protrude from the first grounding mounting member 351 in the vertical direction. The first grounding connection member 352 may be connected to the grounding contact of the opposing connector. Thus, the first grounding contact 350 is connected to the grounding contact of the opposing connector via the first grounding connection member 352, thereby enabling electrical connection with the grounding contact of the opposing connector. Therefore, the first grounding contact 350 can achieve shielding force against the first-1RF contact 311a and the first-2RF contact 311b through the connection between the first grounding connection member 352 and the grounding contact of the opposing connector. In this configuration, the first grounding contact 350 can, with reference to the first axial direction (X-axis direction), shield the transmission contact 320 from the shielding force between each of the first-1RF contact 311a and the first-2RF contact 311b. The first grounding contact 350 can, with reference to the second axial direction (Y-axis direction), shield the transmission contact 320 from the shielding force between the first-1RF contact 311a and the first-2RF contact 311b. The first grounding connection member 352 can be formed as a plate arranged along the vertical direction.

[0185] The first grounding contact 350 may include a plurality of the first grounding connection members 352. The first grounding connection members 352, 352' ( Figure 9 (As shown in the diagram) They can be spaced apart from each other along the second axial direction (Y-axis direction). A plurality of the first grounding connection members 352 can each be connected to different grounding contacts of the opposing connectors. For example, as... Figure 9 As shown, the first grounding connection members 352 and 352' can be connected to the first-1 grounding contact 251 and the first-2 grounding contact 252 of the opposing connector, respectively. In this case, the first grounding connection member 352 can be connected to the first-1 grounding connection member 2513 of the first-1 grounding contact 251. The first grounding connection member 352' can be connected to the first-2 grounding connection member 2521 of the first-2 grounding contact 252. If the opposing connector is inserted into the inner space 330a, with the second axial direction (Y-axis direction) as a reference, the first-1 shielding member 2511 of the first-1 grounding contact 251 of the opposing connector can be located between the first-1 RF contact 311a and the first-2 RF contact 311b.

[0186] As described above, the substrate connector 300 of the second embodiment can utilize the connection between the first ground contact 350 and the ground contact of the opposing connector to realize the first ground loop 350a of the first-1RF contact 311a and the first-2RF contact 311b. Figure 21 (As shown in the figure). Therefore, the substrate connector 300 of the second embodiment utilizes the first ground loop 350a to enhance the shielding performance of the first-1RF contact 311a and the first-2RF contact 311b, thereby achieving complete shielding of the first-1RF contact 311a and the first-2RF contact 311b.

[0187] When a plurality of the second RF contacts 312 are provided, the second ground contact 360 can shield the plurality of the second RF contacts 312 and the plurality of transmission contacts 320 with reference to the first axial direction (X-axis direction). The second ground contact 360 is connected to the ground contact of the opposing connector, thereby shielding the plurality of the second RF contacts 312 with reference to the second axial direction (Y-axis direction). Thus, the substrate connector 300 of the second embodiment utilizes the second ground contact 360 to achieve shielding between the plurality of the second RF contacts 312 and the plurality of transmission contacts 320, and can additionally achieve shielding between the plurality of the second RF contacts 312 by utilizing the connection between the second ground contact 360 and the ground contact of the opposing connector. In this case, the substrate connector 300 of the second embodiment can also utilize the ground housing 330 to shield between the plurality of the second RF contacts 312. Therefore, the substrate connector 300 of the second embodiment can transmit a wider variety of RF signals by using a plurality of the second RF contacts 312, thereby improving its versatility for use in a wider variety of electronic products.

[0188] The second-1 RF contact 312a and the second-2 RF contact 312b of the plurality of second RF contacts 312 can be coupled to the insulating portion 240 in a manner spaced apart from each other along the second axial direction (Y-axis direction). Although Figure 21As illustrated in the figure, the substrate connector 300 of the second embodiment includes two second RF contacts 312 implemented by the second-1 RF contact 312a and the second-2 RF contact 312b. However, it is not limited to this; the substrate connector 300 of the second embodiment may also include three or more second RF contacts 312. On the other hand, in this specification, the description is based on the second embodiment substrate connector 300 including the second-1 RF contact 312a and the second-2 RF contact 312b.

[0189] With the second-1 RF contact 312a and the second-2 RF contact 312b provided, the second grounding contact 360 may include a second grounding mounting member 361. Figure 20 (shown in the image) and the second grounding connection member 362 ( Figure 20 (as shown in the image).

[0190] The second grounding mounting member 361 is mounted on the first substrate. The second grounding mounting member 361 can be grounded by mounting on the first substrate. Thus, the second grounding contact 360 can be grounded on the first substrate via the second grounding mounting member 361. The second grounding mounting member 361 can be configured along the second axial direction (Y-axis direction). In this case, the second grounding mounting member 361 can be configured between the second-1RF contact 312a and the plurality of transmission contacts 320, with the first axial direction (X-axis direction) as a reference. The second grounding mounting member 361 can be configured between the second-2RF contact 312b and the plurality of transmission contacts 320, with the first axial direction (X-axis direction) as a reference. The second grounding mounting member 361 can be formed as a plate shape configured along the vertical direction. The second grounding mounting member 361 can be connected to the grounding contact of the opposing connector. For example, as... Figure 8 As shown, the second grounding mounting member 361 can be connected to the second-first grounding connection member 2613 of the opposite connector.

[0191] The second grounding connection member 362 is coupled to the second grounding mounting member 361. The second grounding connection member 362 may protrude from the second grounding mounting member 361 in the vertical direction. The second grounding connection member 362 may be connected to the grounding contact of the opposing connector. Thus, the second grounding contact 360 is connected to the grounding contact of the opposing connector via the second grounding connection member 362, thereby enabling electrical connection with the grounding contact of the opposing connector. Therefore, the second grounding contact 360 can achieve shielding force against the second-1RF contact 312a and the second-2RF contact 312b through the connection between the second grounding connection member 362 and the grounding contact of the opposing connector. In this configuration, the second grounding contact 360 can, with the first axial direction (X-axis direction) as a reference, shield the transmission contact 320 from the shielding force between each of the second-1RF contacts 312a and the second-2RF contacts 312b. The second grounding contact 360 can, with the second axial direction (Y-axis direction) as a reference, shield the transmission contact 320 from the shielding force between the second-1RF contacts 312a and the second-2RF contacts 312b. The second grounding connection member 362 can be formed as a plate arranged along the vertical direction.

[0192] The second grounding contact 360 may include a plurality of the second grounding connection members 362. The plurality of the second grounding connection members 362, 362' ( Figure 20 (As shown in the diagram) They can be spaced apart from each other along the second axial direction (Y-axis direction). A plurality of the second grounding connection members 362 can each be connected to different grounding contacts of the opposing connectors. For example, as... Figure 20 As shown, a plurality of the second grounding connection members 362, 362' can be connected to the second-1 grounding contact 261 and the second-2 grounding contact 262 of the opposing connector, respectively. In this case, the second grounding connection member 362 can be connected to the second-1 grounding connection member 2613 of the second-1 grounding contact 261. The second grounding connection member 362' can be connected to the second-2 grounding connection member 2621 of the second-2 grounding contact 262. If the opposing connector is inserted into the inner space 330a, the second-1 shielding member 2611 of the second-1 grounding contact 261 of the opposing connector can be located between the second-1 RF contact 312a and the second-2 RF contact 312b, with reference to the second axial direction (Y-axis direction).

[0193] As described above, the substrate connector 300 of the second embodiment can utilize the connection between the second ground contact 360 and the ground contact of the opposing connector to realize the second ground loop 360a of the second-1RF contact 312a and the second-2RF contact 312b. Figure 21 (As shown in the figure). Therefore, the substrate connector 300 of the second embodiment utilizes the second ground loop 360a to further enhance the shielding performance of the second-1RF contact 312a and the second-2RF contact 312b, thereby achieving complete shielding of the second-1RF contact 312a and the second-2RF contact 312b.

[0194] Reference Figure 8 , Figure 9 , Figures 11 to 23 In the substrate connector 300 of the second embodiment, the ground housing 330 can be implemented in the following manner.

[0195] The grounding housing 330 may include a grounding sidewall 331 and a grounding bottom 332.

[0196] The grounding sidewall 331 is configured to surround the sides of the inner space 330a. The grounding sidewall 331 can be configured to surround all sides relative to the inner space 330a. If the opposing connector is inserted into the inner space 330a, the grounding sidewall 331 can be connected to the grounding housing of the opposing connector. For example, the grounding sidewall 331 can be connected to the grounding outer wall 232 of the grounding housing 230 of the opposing connector. The grounding sidewall 331 can be formed as a plate arranged in a vertical direction.

[0197] The grounding bottom 332 protrudes from the lower end of the grounding sidewall 331 toward the inner space 330a. That is, the grounding bottom 332 can protrude toward the inner side of the grounding sidewall 331. The grounding bottom 332 can be formed into a closed ring shape extending along the lower end of the grounding sidewall 331. The grounding bottom 332 can be grounded by being mounted on the second substrate. Thus, the grounding sidewall 331 can be grounded through the grounding bottom 332. In this case, the grounding housing 330 can be grounded through the grounding bottom 332. If the opposing connector is inserted into the inner space 330a, the grounding bottom 332 can be connected to the grounding housing of the opposing connector. For example, the grounding bottom 332 can be connected to the grounding connection wall 233 of the grounding housing 230 of the opposing connector. The grounding bottom 332 can be formed into a plate shape arranged in the horizontal direction.

[0198] The grounding bottom 332 and the grounding sidewall 331 can be configured to surround the inner space 330a. In this case, the first RF contact 311 and the second RF contact 312 can be located in the inner space 330a surrounded by the grounding bottom 332 and the grounding sidewall 331. Therefore, the grounding bottom 332 and the grounding sidewall 331 provide complete shielding for the first RF contact 311 and the second RF contact 312, thereby enhancing the shielding function of the first RF contact 311 and the second RF contact 312 to achieve complete shielding.

[0199] The grounding bottom 332 and the grounding sidewall 331 can also be integrally formed. In this case, the grounding housing 330 can be integrally formed without seams. The grounding housing 330 can be integrally formed without seams through metal injection molding processes such as die casting or MIM (Metal Injection Molding). The grounding housing 330 can also be integrally formed without seams through CNC (Computer Numerical Control) machining or MCT (Machining Center Tool) machining.

[0200] The grounding housing 330 may include a first shielding bottom 333.

[0201] The first shielding bottom 333 protrudes from the grounding bottom 332. The first shielding bottom 333 protrudes from the grounding bottom 332 toward the first grounding contact 350, thereby being positioned between the first-1RF contact 311a and the first-2RF contact 311b with reference to the second axial direction (Y-axis direction). Thus, the first shielding bottom 333 can shield between the first-1RF contact 311a and the first-2RF contact 311b with reference to the second axial direction (Y-axis direction). The first shielding bottom 333 can be formed as a plate shape arranged along the vertical direction.

[0202] The first shield bottom 333 can also be connected to the grounding contact of the opposing connector. For example, as Figure 8As shown, the first shielding bottom 333 can be connected to the first ground contact 251 of the opposing connector. In this case, the first shielding bottom 333 can be connected to the first connecting protrusion 2516 of the first ground contact 250. Thus, the substrate connector 300 of the second embodiment can utilize the connection between the first shielding bottom 333 and the ground contact of the opposing connector to realize a first ground loop 350a for the first RF contact 311a and the first RF contact 311b. The first shielding bottom 333 and the grounding bottom 332 can also be integrally formed.

[0203] The grounding housing 330 may include a second shielding bottom 334.

[0204] The second shielding bottom 334 protrudes from the grounding bottom 332. The second shielding bottom 334 protrudes from the grounding bottom 332 toward the second grounding contact 360, thereby positioning it between the second-1RF contact 312a and the second-2RF contact 312b with reference to the second axial direction (Y-axis direction). Thus, the second shielding bottom 334 can shield between the second-1RF contact 312a and the second-2RF contact 312b with reference to the second axial direction (Y-axis direction). The second shielding bottom 334 can be formed as a plate shape arranged along the vertical direction.

[0205] The second shield bottom 334 can also be connected to the grounding contact of the opposing connector. For example, as... Figure 8 As shown, the second shielding bottom 334 can be connected to the second-1 grounding contact 261 of the opposing connector. In this case, the second shielding bottom 334 can be connected to the second-1 connecting protrusion 2616 of the second-1 grounding contact 261. Thus, the substrate connector 300 of the second embodiment can utilize the connection between the second shielding bottom 334 and the grounding contact of the opposing connector to realize a second grounding loop 360a for the second-1 RF contact 312a and the second-2 RF contact 312b. The second shielding bottom 334 and the grounding bottom 332 can also be integrally formed.

[0206] The grounding housing 330 may include a grounding upper wall 335.

[0207] The upper grounding wall 335 protrudes from the upper end of the grounding sidewall 331 toward the opposite side of the inner space 330a. In this case, the upper grounding wall 335 may protrude outward from the grounding sidewall 331. The upper grounding wall 335 may be formed as a closed loop extending along the upper end of the grounding sidewall 331. The upper grounding wall 335 may be formed as a plate arranged in the horizontal direction.

[0208] The grounding upper wall 335, the grounding bottom 332, and the grounding side wall 331 can also be integrally formed. In this case, the grounding housing 330 can be integrally formed without seams. The grounding housing 330 can be integrally formed without seams through metal injection molding processes such as metal die casting or MIM. The grounding housing 330 can also be integrally formed without seams through CNC machining, MCT machining, etc.

[0209] like Figure 8 and Figure 9 As shown, the connection portion between the grounding upper wall 335 and the grounding side wall 331 can be formed into an arc shape. Therefore, when the opposing connector is inserted into the inner space 330a, the connection portion between the grounding upper wall 335 and the grounding side wall 331 can guide the opposing connector. In this case, the portion of the connection portion between the grounding upper wall 335 and the grounding side wall 331 facing the inner space 330a can form a curved surface and be formed into an arc shape.

[0210] The grounding upper wall 335, the grounding side wall 331, and the grounding bottom wall 332 can form a shielding wall. In this case, such as Figure 19 and Figure 21As shown, the grounding housing 330 may include a first shielding wall 330b, a second shielding wall 330c, a third shielding wall 330d, and a fourth shielding wall 330e. The first shielding wall 330b, the second shielding wall 330c, the third shielding wall 330d, and the fourth shielding wall 330e may be implemented by the grounding side wall 331, the grounding bottom wall 332, and the grounding top wall 335, respectively. The first shielding wall 330b and the second shielding wall 330c are arranged opposite each other with respect to the first axial direction (X-axis direction). With respect to the first axial direction (X-axis direction), a plurality of the first RF contacts 311 and a plurality of the second RF contacts 312 may be located between the first shielding wall 330b and the second shielding wall 330c. With reference to the first axial direction (X-axis direction), a plurality of the first RF contacts 311 may be located at a distance shorter than the distance between them and the first shielding wall 330b. With reference to the first axial direction (X-axis direction), a plurality of the second RF contacts 312 may be located at a distance shorter than the distance between them and the second shielding wall 330c. The third shielding wall 330d and the fourth shielding wall 330e are arranged opposite each other with reference to the second axial direction (Y-axis direction). With reference to the second axial direction (Y-axis direction), a plurality of the first RF contacts 311 and a plurality of the second RF contacts 312 may be located between the third shielding wall 330d and the fourth shielding wall 330e.

[0211] In this case, the first grounding contact 350, the first shielding wall 330b, the third shielding wall 330d, the fourth shielding wall 330e, and the first shielding bottom 333 can form the first grounding loop 350a of the first-1RF contact 311a and the first-2RF contact 311b. Figure 21 (As shown in the figure). Therefore, the substrate connector 300 of the second embodiment utilizes the first ground loop 350a to further enhance the shielding function of the first-1RF contact 311a and the first-2RF contact 311b, thereby achieving complete shielding of the first-1RF contact 311a and the first-2RF contact 311b.

[0212] In this case, the second grounding contact 360, the second shielding wall 330c, the third shielding wall 330d, the fourth shielding wall 330e, and the second shielding bottom 334 can form a second grounding loop 360a between the second-1 RF contact 312a and the second-2 RF contact 312b. Figure 21(As shown in the figure). Therefore, the substrate connector 300 of the second embodiment utilizes the second ground loop 360a to further enhance the shielding function of the second-1RF contact 312a and the second-2RF contact 312b, thereby achieving complete shielding of the second-1RF contact 312a and the second-2RF contact 312b.

[0213] Reference Figures 8 to 13 , Figure 23 In order to further enhance the shielding function by improving the contact between the grounding sidewall 331 and the grounding housing of the opposite connector, the grounding housing 330 may include the following configuration.

[0214] First, such as Figure 11 As shown, the grounding housing 330 may include a connecting protrusion 336. The connecting protrusion 336 may be formed on the inner surface of the grounding sidewall 331. The connecting protrusion 336 may protrude from the inner surface of the grounding sidewall 331. The connecting protrusion 336 may be inserted into the grounding housing 230 of the opposing connector. In this case, the connecting protrusion 336 may be inserted into the connecting groove 235 of the grounding housing 230 of the opposing connector. Thus, the substrate connector 300 of the second embodiment utilizes the connecting protrusion 336 to improve the contact between the grounding housing 330 and the grounding housing 230 of the opposing connector, thereby further enhancing the shielding function of the first RF contact 311 and the second RF contact 312. Although in Figure 11 The diagram shows that the connecting protrusion 336 is formed with a shorter length than the connecting groove 235 based on the vertical direction, but it is not limited to this; the connecting protrusion 336 and the connecting groove 235 can also be formed with approximately the same length. The grounding housing 330 may also include a plurality of the connecting protrusions 336. In this case, the plurality of connecting protrusions 336 can be arranged spaced apart from each other along the inner surface of the grounding sidewall 331.

[0215] Next, as Figure 12As shown, the grounding housing 330 may include a connecting groove 337. The connecting groove 337 may be formed on the inner surface of the grounding sidewall 331. The connecting groove 337 may be implemented by a groove formed to a predetermined depth on the inner surface of the grounding sidewall 331. The grounding housing 230 of the opposing connector can be inserted into the connecting groove 337. In this case, the connecting protrusion 236 of the grounding housing 230 of the opposing connector can be inserted into the connecting groove 337. Thus, the substrate connector 300 of the second embodiment utilizes the connecting groove 337 to improve the contact between the grounding housing 330 and the grounding housing 230 of the opposing connector, thereby further enhancing the shielding function of the first RF contact 311 and the second RF contact 312. Although Figure 10 The diagram shows that the connecting groove 337 is formed with a length longer than the connecting protrusion 236 in the vertical direction, but it is not limited to this; the connecting groove 337 and the connecting protrusion 236 can also be formed with approximately the same length. On the other hand, the grounding sidewall 331 supports the connecting protrusion 236 inserted into the connecting groove 337, thereby preventing the connecting protrusion 236 from escaping from the connecting groove 337. The grounding housing 330 may also include a plurality of the connecting grooves 337. In this case, the plurality of connecting grooves 337 can be spaced apart from each other along the inner surface of the grounding sidewall 331.

[0216] Next, as Figure 13 As shown, when the ground housing 330 includes the connecting protrusion 336, the connecting protrusion 336 can also support the connecting protrusion 236 of the ground housing 230 of the opposing connector. Therefore, the substrate connector 300 of the second embodiment utilizes the connecting protrusion 336 to improve the contact between the ground housing 330 and the ground housing 230 of the opposing connector, thereby further enhancing the shielding function of the first RF contact 311 and the second RF contact 312. On the other hand, the connecting protrusion 336 is disposed on the upper side of the connecting protrusion 236, thereby supporting the connecting protrusion 236.

[0217] Next, as Figure 8 As shown, the grounding housing 330 can also be connected to the grounding housing 230 of the opposite connector via a surface contact between the inner surface of the grounding sidewall 331 and the grounding housing 230 of the opposite connector. In this case, a gap may be generated between the inner surface of the grounding sidewall 331 and the grounding housing 230 of the opposite connector. To compensate for this gap, as... Figure 23As shown, the grounding housing 330 may include a conductive member 338. The conductive member 338 may be coupled to the inner surface of the grounding sidewall 331. The conductive member 338 may be formed such that along the corner portion 3301 (including the inner surface of the grounding sidewall 331) Figure 22 The inner surface of the grounding sidewall 331 (shown in the diagram) extends to form a closed loop. Thus, the substrate connector 300 of the second embodiment utilizes the conductive member 338 to improve the contact between the grounding housing 330 and the grounding housing 230 of the opposing connector, thereby further enhancing the shielding function of the first RF contact 311 and the second RF contact 312. Furthermore, in the embodiment utilizing the connecting protrusion 336 and the connecting groove 337, it is difficult to perform operations on the corner portion 3301 of the inner surface of the grounding sidewall 331; however, in the embodiment utilizing the conductive member 338, the ease of performing operations on the corner portion 3301 of the inner surface of the grounding sidewall 331 is improved. The conductive member 338 can be formed of an electrically conductive material, enabling electrical connection between the grounding sidewall 331 and the grounding housing 230 of the opposing connector. For example, the conductive member 338 can be formed of metal. After being manufactured separately, the conductive component 338 can be attached to the grounding sidewall 331 by mounting, attaching, or fastening it to the inner surface of the grounding sidewall 331. Alternatively, the conductive component 338 can be attached to the grounding sidewall 331 by coating the inner surface of the grounding sidewall 331 with a conductive shielding material.

[0218] Reference Figures 17 to 23 The grounding housing 330 may include a connecting member 339.

[0219] The connecting member 339 protrudes upward from the grounding bottom 332. When the grounding housing 330 and the insulating portion 340 are engaged, the connecting member 339 can be inserted into the insulating portion 340. Thus, the connecting member 339 can securely connect the grounding housing 330 and the insulating portion 340. The connecting member 339 can also be coupled to the insulating portion 340 in an interference fit manner. The connecting member 339 and the grounding bottom 332 can also be integrally formed. A connecting groove (not shown) for the insertion of the connecting member 339 can be formed in the insulating portion 340. The connecting groove can be formed on the lower surface of the insulating portion 340.

[0220] The grounding housing 330 may also include a plurality of the aforementioned connecting members 339. In this case, the plurality of connecting members 339 may be spaced apart from each other along the grounding bottom 332. Although Figure 22 The grounding housing 330 is shown to include four connecting members 339, but is not limited thereto; the grounding housing 330 may also include two, three, or five or more connecting members 339. The insulating portion 340 may have a number of connecting grooves equal to the number of the plurality of connecting members 339.

[0221] The grounding housing 330 may include a wedge member 3391 protruding from the connecting member 339. As the connecting member 339 is inserted into the insulating portion 340, the wedge member 3391 embeds into the insulating portion 340, thereby securing the grounding housing 330 and the insulating portion 340. Therefore, the substrate connector 300 of the second embodiment can utilize the wedge member 3391 to more securely connect the grounding housing 330 and the insulating portion 340. When the connecting member 339 is spaced apart from the grounding sidewall 331 along the second axial direction (Y-axis direction), the wedge member 3391 may protrude from the side of the connecting member 339 along the first axial direction (X-axis direction). The wedge member 3391 and the connecting member 339 may be integrally formed.

[0222] Reference Figures 17 to 23 In the substrate connector 300 of the second embodiment, the insulating portion 340 may include a solder inspection window 341. Figure 19 (as shown in the image).

[0223] The solder inspection window 341 can be formed through the insulating portion 340. The solder inspection window 341 can be used to inspect the state of a plurality of the first RF mounting members 3111 mounted on the second substrate. In this case, the plurality of the first RF contacts 311 can be combined with the insulating portion 340 so that the plurality of the first RF mounting members 3111 are located in the solder inspection window 341. Therefore, the plurality of the first RF mounting members 3111 are not obstructed by the insulating portion 340. Therefore, when the substrate connector 300 of the second embodiment is mounted on the second substrate, the operator can inspect the state of the plurality of the first RF mounting members 3111 mounted on the second substrate through the solder inspection window 341. Thus, even if the plurality of the first RF contacts 311, including the plurality of the first RF mounting members 3111, are all located inside the grounding housing 330, the substrate connector 300 of the second embodiment can improve the accuracy of the mounting operation of the plurality of the first RF contacts 3111 on the second substrate. The welding inspection window 341 can be formed by penetrating the insulating member 241.

[0224] The insulating portion 340 may also include a plurality of solder inspection windows 341. In this case, the plurality of first RF mounting members 2111 may be located in different solder inspection windows 341. The plurality of second RF mounting members 3121 and the plurality of transmission mounting members 3201 may also be located in the plurality of solder inspection windows 341. Therefore, when the substrate connector 300 of the second embodiment is mounted on the second substrate, the operator can inspect the mounting status of the plurality of first RF mounting members 3111, the plurality of second RF mounting members 3121, and the plurality of transmission mounting members 3201 on the second substrate through the plurality of solder inspection windows 341. Thus, the substrate connector 300 of the second embodiment can improve the accuracy of the operation of mounting the plurality of first RF contacts 311, the plurality of second RF contacts 312, and the plurality of transmission contacts 320 to the second substrate. The plurality of solder inspection windows 341 may be formed through the insulating portion 340 at spaced-apart locations.

[0225] Hereinafter, embodiments of the mounting pattern (pattern) of the substrate with the substrate connector of the present invention will be described in detail with reference to the accompanying drawings.

[0226] Figures 24 to 27 This is a conceptual bottom view illustrating an embodiment of a substrate with a substrate connector of the first embodiment mounted on it. Figures 28 to 31 This is a conceptual bottom view of an embodiment showing a mounting pattern of a substrate with a substrate connector of the second embodiment. Figures 24 to 27 by Figure 5 The bottom surface of the substrate connector in the first embodiment shown is used as a reference to indicate the position of the mounting pattern. Figures 28 to 31 by Figure 21 The bottom surface of the substrate connector in the second embodiment shown is used as a reference to indicate the position of the mounting pattern. Figures 24 to 31 The shaded area in the image indicates where the pattern will be installed.

[0227] Reference Figures 24 to 27 The substrate connector 200 of the first embodiment can be mounted on a mounting pattern 201 formed on a substrate (not shown). The substrate connector 200 of the first embodiment and the mounting pattern 201 are electrically connected, thereby enhancing the shielding force on the plurality of RF contacts 210. The substrate connector 200 of the first embodiment can be mounted on mounting patterns 201 implemented by various embodiments, and embodiments of such mounting patterns 201 will be described sequentially with reference to the accompanying drawings.

[0228] First, such as Figure 24As shown, the mounting pattern 201 can be formed on the substrate in a shape that surrounds the inner space 230a. For example, the mounting pattern 201 can be formed as a quadrilateral ring along the outer side of the inner space 230a. The grounding housing 230 can be mounted on the mounting pattern 201. If the grounding housing 230 is mounted on the mounting pattern 201, the shielding force on the plurality of RF contacts 210 can be strengthened through the electrical connection between the grounding housing 230 and the mounting pattern 201. In this case, the shielding force of the mounting pattern 201 can be realized to surround all contacts located in the inner space 230a.

[0229] Next, as Figure 25 As shown, a first mounting pattern 201a, a second mounting pattern 201b, a third mounting pattern 201c, and a fourth mounting pattern 201d can be formed on the substrate. The first mounting pattern 201a, the second mounting pattern 201b, the third mounting pattern 201c, and the fourth mounting pattern 201d can be spaced apart from each other. The grounding housing 230 can be mounted on each of the first mounting pattern 201a, the second mounting pattern 201b, the third mounting pattern 201c, and the fourth mounting pattern 201d. In this case, the different shielding walls 230b, 230c, 230d, and 230e of the grounding housing 230 can be respectively mounted on the first mounting pattern 201a, the second mounting pattern 201b, the third mounting pattern 201c, and the fourth mounting pattern 201d. Therefore, the shielding force of the plurality of RF contacts 210 can be enhanced by the electrical connection between the ground housing 230 and the mounting patterns 201a, 201b, 201c, and 201d.

[0230] Next, as Figure 26 As shown, a first mounting pattern 201a and a second mounting pattern 201b can be formed on the substrate. The first mounting pattern 201a and the second mounting pattern 201b can be spaced apart from each other along the first axial direction (X-axis direction).

[0231] The first grounding contact 250 can be installed in the first mounting pattern 201a. Thus, the shielding force on the first RF contact 211 can be strengthened through the electrical connection between the first mounting pattern 201a and the first grounding contact 250. In this case, a portion of the first-1 grounding contact 251 and all of the first-2 grounding contact 252 can be installed in the first mounting pattern 201a. The first grounding contact 250 and the grounding housing 230 can also be installed in the first mounting pattern 201a. In this case, the third shielding wall 230d and the fourth shielding wall 230e can be installed in the first mounting pattern 201a. Therefore, the shielding force on the first RF contact 211 can be further strengthened. The first mounting pattern 201a can be formed by extending parallel to the second axial direction (Y-axis direction).

[0232] The second grounding contact 260 can be installed in the second mounting pattern 201b. Thus, the shielding force on the second RF contact 212 can be strengthened through the electrical connection between the second mounting pattern 201b and the second grounding contact 260. In this case, a portion of the second-1 grounding contact 261 and all of the second-2 grounding contact 262 can be installed in the second mounting pattern 201b. The second grounding contact 260 and the grounding housing 230 can also be installed in the second mounting pattern 201b. In this case, the third shielding wall 230d and the fourth shielding wall 230e can be installed in the second mounting pattern 201b. Therefore, the shielding force on the second RF contact 212 can be further strengthened. The second mounting pattern 201b can be formed by extending parallel to the second axial direction (Y-axis direction).

[0233] Next, as Figure 27 As shown, a first mounting pattern 201a and a second mounting pattern 201b can be formed on the substrate. The first mounting pattern 201a and the second mounting pattern 201b can be spaced apart from each other along the first axial direction (X-axis direction).

[0234] The first grounding contact 250 can be installed in the first mounting pattern 201a. All of the first-1 grounding contact 251 and all of the first-2 grounding contact 252 can be installed in the first mounting pattern 201a. Thus, the electrical connection between the first mounting pattern 201a and the first grounding contact 250 strengthens not only the shielding force between the first RF contact 211 and the second RF contact 212, but also the shielding force between the first-1 RF contact 211a and the first-2 RF contact 211b. The first grounding contact 250 and the grounding housing 230 can also be installed in the first mounting pattern 201a. In this case, the first shielding wall 230b, the third shielding wall 230d, and the fourth shielding wall 230e can be installed in the first mounting pattern 201a. Therefore, the shielding force between the first RF contact 211 and the second RF contact 212, and the shielding force between the first-1 RF contact 211a and the first-2 RF contact 211b, can be further strengthened. The first mounting pattern 201a can be formed as a combination of a portion extending parallel to the second axial direction (Y-axis direction) and a portion extending parallel to the first axial direction (X-axis direction). For example, the first mounting pattern 201a can be formed in a T-shape overall.

[0235] The second grounding contact 260 can be installed in the second mounting pattern 201b. All of the second-1 grounding contact 261 and all of the second-2 grounding contact 262 can be installed in the second mounting pattern 201b. Thus, the electrical connection between the second mounting pattern 201b and the second grounding contact 260 strengthens not only the shielding force between the second RF contact 212 and the first RF contact 211, but also the shielding force between the second-1 RF contact 212a and the second-2 RF contact 212b. The second grounding contact 260 and the grounding housing 230 can also be installed in the second mounting pattern 201b. In this case, the second shielding wall 230c, the third shielding wall 230d, and the fourth shielding wall 230e can be installed in the second mounting pattern 201b. Therefore, the shielding force between the second RF contact 212 and the first RF contact 211, and the shielding force between the second-1 RF contact 212a and the second-2 RF contact 212b, can be further strengthened. The second mounting pattern 201b can be formed as a combination of portions extending parallel to the second axial direction (Y-axis direction) and portions extending parallel to the first axial direction (X-axis direction). For example, the second mounting pattern 201b can be generally formed in a T-shape. The second mounting pattern 201b and the first mounting pattern 201a can be formed in a symmetrical manner.

[0236] Reference Figures 28 to 31 The substrate connector 300 of the second embodiment can be mounted on a mounting pattern 301 formed on a substrate (not shown). The substrate connector 300 of the second embodiment is electrically connected to the mounting pattern 301, thereby enhancing the shielding force on the plurality of RF contacts 210. The substrate connector 300 of the second embodiment can be mounted on mounting patterns 301 implemented by various embodiments, and embodiments of such mounting patterns 301 will be described sequentially with reference to the accompanying drawings.

[0237] First, such as Figure 28 As shown, the mounting pattern 301 can be formed on the substrate in a shape that surrounds the inner space 330a. For example, the mounting pattern 301 can be formed as a quadrilateral ring along the outer side of the inner space 330a. The ground housing 330 can be mounted on the mounting pattern 301. If the ground housing 330 is mounted on the mounting pattern 301, the shielding force on the plurality of RF contacts 310 can be strengthened through the electrical connection between the ground housing 330 and the mounting pattern 301. In this case, the shielding force of the mounting pattern 301 can be realized to surround all contacts located in the inner space 330a.

[0238] Next, as Figure 29 As shown, a first mounting pattern 301a, a second mounting pattern 301b, a third mounting pattern 301c, and a fourth mounting pattern 301d can be formed on the substrate. The first mounting pattern 301a, the second mounting pattern 301b, the third mounting pattern 301c, and the fourth mounting pattern 301d can be spaced apart from each other. The grounding housing 330 can be mounted on each of the first mounting pattern 301a, the second mounting pattern 301b, the third mounting pattern 301c, and the fourth mounting pattern 301d. In this case, the different shielding walls 330b, 330c, 330d, and 330e of the grounding housing 330 can be respectively mounted on the first mounting pattern 301a, the second mounting pattern 301b, the third mounting pattern 301c, and the fourth mounting pattern 301d. Therefore, the shielding force of the plurality of RF contacts 310 can be enhanced by the electrical connection between the ground housing 330 and the mounting patterns 301a, 301b, 301c, and 301d.

[0239] Next, as Figure 30 As shown, a first mounting pattern 301a and a second mounting pattern 301b can be formed on the substrate. The first mounting pattern 301a and the second mounting pattern 301b can be spaced apart from each other along the first axial direction (X-axis direction).

[0240] The first grounding contact 350 can be mounted on the first mounting pattern 301a. Thus, the electrical connection between the first mounting pattern 301a and the first grounding contact 350 strengthens the shielding force on the first RF contact 311. In this case, the entire first grounding contact 350 and a portion of the first shielding bottom 333 can also be mounted on the first mounting pattern 301a. The first grounding contact 350 and the grounding housing 330 can also be mounted on the first mounting pattern 301a. In this case, the third shielding wall 330d and the fourth shielding wall 330e can be mounted on the first mounting pattern 301a. Therefore, the shielding force on the first RF contact 311 can be further strengthened. The first mounting pattern 301a can be formed extending parallel to the second axial direction (Y-axis direction).

[0241] The second grounding contact 360 can be mounted in the second mounting pattern 301b. Thus, the electrical connection between the second mounting pattern 301b and the second grounding contact 360 strengthens the shielding of the second RF contact 312. In this case, the entire second grounding contact 360 and a portion of the second shielding bottom 334 can also be mounted in the second mounting pattern 301b. The second grounding contact 360 and the grounding housing 330 can also be mounted in the second mounting pattern 301b. In this case, the third shielding wall 330d and the fourth shielding wall 330e can be mounted in the second mounting pattern 301b. Therefore, the shielding of the second RF contact 312 can be further strengthened. The second mounting pattern 301b can be formed by extending parallel to the second axial direction (Y-axis direction).

[0242] Next, as Figure 31 As shown, a first mounting pattern 301a and a second mounting pattern 301b can be formed on the substrate. The first mounting pattern 301a and the second mounting pattern 301b can be spaced apart from each other along the first axial direction (X-axis direction).

[0243] The first grounding contact 350 can be installed in the first mounting pattern 301a. The entirety of the first grounding contact 350 and the entirety of the first shielding bottom 333 can be installed in the first mounting pattern 301a. Thus, not only is the shielding force between the first RF contact 311 and the second RF contact 312 strengthened by the connection between the first mounting pattern 301a and the first grounding contact 350, but the shielding force between the first-1RF contact 311a and the first-2RF contact 311b is also strengthened by the electrical connection between the first mounting pattern 301a and the first shielding bottom 333. The first grounding contact 350 and the grounding housing 330 can also be installed in the first mounting pattern 301a. In this case, the third shielding wall 330d and the fourth shielding wall 330e can be installed in the first mounting pattern 301a. Therefore, the shielding force between the first RF contact 311 and the second RF contact 312, and the shielding force between the first-1 RF contact 311a and the first-2 RF contact 311b, can be further strengthened. Although not shown, the first shielding wall 330b, the third shielding wall 330d, and the fourth shielding wall 330e can also be mounted on the first mounting pattern 301a. The first mounting pattern 301a can be formed in a configuration where a portion extending parallel to the second axis direction (Y-axis direction) and a portion extending parallel to the first axis direction (X-axis direction) are combined with each other. For example, the first mounting pattern 301a can be formed in a T-shape overall.

[0244] The second grounding contact 360 can be installed in the second mounting pattern 301b. The entirety of the second grounding contact 360 and the entirety of the second shielding bottom 334 can be installed in the second mounting pattern 301b. Thus, not only is the shielding force between the second RF contact 312 and the first RF contact 311 strengthened by the electrical connection between the second mounting pattern 301b and the second grounding contact 360, but the shielding force between the second-1 RF contact 312a and the second-2 RF contact 312b is also strengthened by the electrical connection between the second mounting pattern 301b and the second shielding bottom 334. The second grounding contact 360 and the grounding housing 330 can also be installed in the second mounting pattern 301b. In this case, the third shielding wall 330d and the fourth shielding wall 330e can be installed in the second mounting pattern 301b. Therefore, the shielding force between the second RF contact 312 and the first RF contact 311, and between the second-1 RF contact 312a and the second-2 RF contact 312b, can be further strengthened. Although not shown, the second shielding wall 330c, the third shielding wall 330d, and the fourth shielding wall 330e can also be mounted on the second mounting pattern 301b. The second mounting pattern 301b can be formed with a portion extending parallel to the second axis direction (Y-axis direction) and a portion extending parallel to the first axis direction (X-axis direction) combined with each other. For example, the second mounting pattern 301b can be formed in a T-shape overall. The second mounting pattern 301b and the first mounting pattern 301a can be formed symmetrically to each other.

[0245] The present invention described above is not limited to the foregoing embodiments and drawings. Those skilled in the art will clearly understand that various substitutions, modifications and alterations can be made without departing from the technical concept of the present invention.

Claims

1. A substrate connector characterized by comprising: first and second RF contact pieces arranged apart in a first axial direction for transmitting an RF signal; an insulating portion supporting the first and second RF contact pieces; a plurality of transmission contact pieces coupled to the insulating portion between the first and second RF contact pieces in the first axial direction for transmitting a signal different from the RF signal; a ground housing surrounding the insulating portion in the first axial direction and a second axial direction perpendicular to the first axial direction and coupled to the insulating portion; a first ground contact piece arranged apart from the ground housing, coupled to the insulating portion, and shielding between the first RF contact piece and the plurality of transmission contact pieces with reference to the first axial direction; and a second ground contact piece arranged apart from the ground housing, coupled to the insulating portion, and shielding between the second RF contact piece and the plurality of transmission contact pieces with reference to the first axial direction; the first RF contact piece includes first-1 and first-2 RF contact pieces arranged apart in a second axial direction; the first ground contact piece includes a portion between the first RF contact piece and the transmission contact pieces in the first axial direction, and another portion continuous with the portion and between the first-1 and first-2 RF contact pieces in the second axial direction; the portion shields between the plurality of first RF contact pieces and the plurality of transmission contact pieces with reference to the first axial direction, and the another portion shields between the plurality of first RF contact pieces with reference to the second axial direction.

2. The substrate connector according to claim 1, characterized by the first ground contact piece includes: a first-1 ground contact piece between the first-1 RF contact piece and the plurality of transmission contact pieces with reference to the first axial direction; and a first-2 ground contact piece between the first-2 RF contact piece and the plurality of transmission contact pieces with reference to the first axial direction, the first-1 ground contact piece includes: a first-1 shield member between the first-1 and first-2 RF contact pieces with reference to the second axial direction.

3. The substrate connector according to claim 2, characterized by the first-1 ground contact piece includes a first-1 shield protrusion protruding from the first-1 shield member, the first-1 shield protrusion is connected to the ground housing.

4. The substrate connector according to claim 3, characterized by the ground housing includes: a first sub ground inner wall facing the insulating portion; and a first wedge member protruding from the first sub ground inner wall, the first-1 shield protrusion is connected to the first wedge member so as to be electrically connected to the ground housing.

5. The substrate connector according to claim 2, characterized by the first-1 ground contact piece includes: a first-1 ground mounting member mounted to a substrate; and ​ a first-1 ground connecting member combined with the first-1 ground mounting member and the first-1 shield member, the first-1 shield member protrudes from the first-1 ground connecting member in the first axial direction, the first-1 ground mounting member protrudes from the first-1 ground connecting member in the second axial direction.

6. The substrate connector according to claim 2, wherein the first-1 ground contact includes a first-1 ground protrusion protruding from the first-1 shield member, the first-1 ground protrusion is mounted to a substrate.

7. The substrate connector according to claim 2, wherein the first-1 ground contact includes a first-1 connecting protrusion protruding from the first-1 shield member, the first-1 connecting protrusion protrudes from the insulating portion to be connected to a ground housing of an opposing connector.

8. The substrate connector according to claim 2, wherein the second ground contact includes: a second-1 ground contact positioned between a second-1 RF contact of the plurality of second-1 RF contacts and the plurality of transmission contacts with reference to the first axial direction; and a second-2 ground contact positioned between a second-2 RF contact of the plurality of second-2 RF contacts and the plurality of transmission contacts with reference to the first axial direction, the second-1 ground contact includes: a second-1 shield member positioned between the second-1 RF contact and the second-2 RF contact with reference to the second axial direction.

9. The substrate connector according to claim 2, wherein the second ground contact includes: a second-1 ground contact formed in the same shape as the first-1 ground contact; and a second-2 ground contact formed in the same shape as the first-2 ground contact.

10. The substrate connector according to claim 8, wherein the first-1 ground contact and the second-1 ground contact are configured to be point-symmetric with reference to a point of symmetry, the point of symmetry is separated by the same distance from both side walls of the ground housing that are positioned apart from each other with reference to the first axial direction and is separated by the same distance from both side walls of the ground housing that are positioned apart from each other with reference to the second axial direction, the first-2 ground contact and the second-2 ground contact are configured to be point-symmetric with reference to the point of symmetry.

11. The substrate connector according to claim 1, wherein the ground housing includes: a ground inner wall facing the insulating portion; a ground outer wall separated from the ground inner wall; and a ground connecting wall combined with the ground inner wall and the ground outer wall, the ground inner wall includes: a first sub-ground inner wall and a second sub-ground inner wall configured to be opposite to each other with reference to the first axial direction; and a third sub-ground inner wall and a fourth sub-ground inner wall configured to be opposite to each other with reference to the second axial direction, a plurality of the first RF contacts are positioned between the first sub-internal ground wall and the first ground contact with reference to the first axis direction, and between the third sub-internal ground wall and the fourth sub-internal ground wall with reference to the second axis direction, a plurality of the second RF contacts are positioned between the second sub-internal ground wall and the second ground contact with reference to the first axis direction, and between the third sub-internal ground wall and the fourth sub-internal ground wall with reference to the second axis direction.

12. The substrate connector according to claim 1, wherein the ground housing includes: an internal ground wall facing the insulating portion; an external ground wall spaced apart from the internal ground wall; and a ground connecting wall combined with the internal ground wall and the external ground wall, respectively, a conductive member combined with an outer surface of the external ground wall, the conductive member is formed in a closed loop shape to extend along the external ground wall including a corner portion of the external ground wall.

13. The substrate connector according to claim 1, wherein a plurality of the first RF contacts each include a first RF mounting member for mounting on a substrate, and the first RF mounting members are combined with the insulating portion such that the first RF mounting members are positioned at solder inspection windows formed through the insulating portion, respectively.

14. The substrate connector according to claim 1, wherein the ground housing includes: an internal ground wall facing the insulating portion; an external ground wall mounted on a substrate and spaced apart from the internal ground wall; and a ground connecting wall combined with the internal ground wall and the external ground wall, respectively, the ground housing is grounded by the external ground wall mounted on the substrate.

15. A substrate connector, comprising: a first RF contact and a second RF contact disposed apart along a first axis direction for transmitting an RF signal; an insulating portion supporting the first RF contact and the second RF contact; a plurality of transmission contacts combined with the insulating portion between the first RF contact and the second RF contact along the first axis direction for transmitting a signal different from the RF signal; a ground housing formed to define an inner space, to surround the insulating portion along the first axis direction and a second axis direction perpendicular to the first axis direction, and to combine with the insulating portion; a first ground contact disposed apart from the ground housing, combined with the insulating portion, and shielding between the first RF contact and the plurality of transmission contacts with reference to the first axis direction; and a second ground contact disposed apart from the ground housing, combined with the insulating portion, and shielding between the second RF contact and the plurality of transmission contacts with reference to the first axis direction; a plurality of the first RF contacts each include a first RF mounting member for mounting on a substrate; a plurality of the second RF contacts each include a second RF mounting member for mounting on a substrate. ​ All of the first RF contacts and all of the second RF contacts are disposed in the inner space, and the first and second RF mounting members do not protrude outside the ground housing in the first axis direction and a second axis direction perpendicular to the first axis direction.

16. The substrate connector according to claim 15, wherein a first-1 RF contact of the first RF contacts and a first-2 RF contact of the first RF contacts are spaced apart from each other in a second axis direction perpendicular to the first axis direction, the first ground contact is connected to a ground contact of an opposing connector so as to achieve a shielding force that shields between the first-1 RF contact and the first-2 RF contact with reference to the second axis direction, the ground housing includes: a ground side wall that surrounds a side of the inner space; a ground bottom that protrudes from a lower end of the ground side wall toward a side of the inner space; and a first shielding bottom that protrudes from the ground bottom toward a side of the first ground contact so that the first shielding bottom is positioned between the first-1 RF contact and the first-2 RF contact with reference to the second axis direction.

17. The substrate connector according to claim 15, wherein a second-1 RF contact of the second RF contacts and a second-2 RF contact of the second RF contacts are spaced apart from each other in a second axis direction perpendicular to the first axis direction, the second ground contact is connected to a ground contact of an opposing connector so as to achieve a shielding force that shields between the second-1 RF contact and the second-2 RF contact with reference to the second axis direction, the ground housing includes: a ground side wall that surrounds a side of the inner space; a ground bottom that protrudes from a lower end of the ground side wall toward a side of the inner space; and a second shielding bottom that protrudes from the ground bottom toward a side of the second ground contact so that the second shielding bottom is positioned between the second-1 RF contact and the second-2 RF contact with reference to the second axis direction.

18. The substrate connector according to claim 15, wherein the ground housing includes: a ground side wall that surrounds a side of the inner space; and a conductive member that is bonded to an inner surface of the ground side wall, the conductive member is formed in a closed loop shape so as to extend along the inner surface of the ground side wall including a corner portion of the inner surface of the ground side wall.

19. The substrate connector according to claim 15, wherein the first RF mounting members are bonded to the insulating portion so that the first RF mounting members are respectively positioned at solder inspection windows formed through the insulating portion.

20. The substrate connector according to claim 15, wherein the ground housing includes: a ground side wall that surrounds a side of the inner space; and a ground bottom that protrudes from a lower end of the ground side wall toward a side of the inner space and is mounted to a substrate, The ground housing is grounded by a ground bottom mounted on the substrate. The ground housing is grounded by a ground bottom mounted on the substrate.

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