Electronic device

Abstract

The present application provides an electronic device capable of withstanding repeated severe environmental changes such as sterilization treatment using a high-pressure steam sterilizer. A tablet terminal (electronic device) (106) has: a frame (10); a substrate (30) disposed in an internal space of the frame (10); an electronic circuit component (40) mounted on the substrate (30); a heat insulation layer (first heat insulation layer) (50) disposed along the frame (10); and a heat dissipation mechanism portion (first heat dissipation mechanism portion) (70) capable of discharging heat from an internal space of the heat insulation layer (50) to an outside of the frame (10).

Description

Technical Field

[0001] This invention relates to electronic devices, such as portable information terminal devices suitable for use in medical settings. Background Technology

[0002] Portable information terminal devices are an example of electronic devices used in medical settings, etc. A portable information terminal device is a type of computer, such as a tablet computer or smartphone, that can be easily carried. A portable information terminal device includes a display unit (monitor) for displaying images, electronic circuitry components, and a housing (see, for example, Patent Document 1).

[0003] [Existing Technical Documents]

[0004] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2018-136908 Summary of the Invention

[0006] Electronic devices are being widely used in various environments, including sometimes in medical settings such as hospitals. For example, there is a demand for advanced medical care using electronic devices such as portable information terminals in environments such as examination rooms, wards, examination rooms, operating rooms, rehabilitation rooms, nursing facilities, or dining rooms. As an example of use, scenarios include doctors operating medical equipment via portable information terminals for diagnosis and treatment, or displaying images (two-dimensional or three-dimensional) for diagnosis or surgery on the screen of a portable information terminal (or on another display device), while doctors or medical staff simultaneously operate the portable information terminal to provide diagnosis or medical services.

[0007] Medical instruments used in medical settings require necessary levels of disinfection and sterilization to prevent infection. One sterilization process is autoclaving. In autoclaving, objects are exposed to pre-determined high-temperature, high-pressure steam for a predetermined time or longer. Medical mice also require disinfection, preferably sterilization, to prevent infection; therefore, their performance must be considered in terms of heat resistance, water resistance, pressure resistance, waterproofing, and durability.

[0008] However, conventional electronic devices cannot withstand sterilization processes like high-pressure steam sterilization. Electronic devices include heat- and water-sensitive components such as electronic circuits. During high-pressure steam sterilization, the high heat reaches the electronic circuit components inside the casing, causing damage. Furthermore, when electronic devices have openings to accommodate image sensors or display panels, the heat from the high-pressure steam generated during sterilization is directly transferred to the electronic circuit components inside the casing, especially through these openings. Additionally, water vapor can easily seep in, further increasing the risk of damage.

[0009] The purpose of this invention is to provide an electronic device that can withstand repeated harsh environmental changes, such as sterilization processes performed using an autoclave.

[0010] Representative embodiments of the present invention have the following structure. One embodiment of the electronic device includes: a frame; a substrate disposed within the interior space of the frame; electronic circuit components mounted on the substrate; a first heat insulation layer disposed along the frame; and a first heat dissipation mechanism capable of dissipating heat from the space inside the first heat insulation layer to the outside of the frame.

[0011] According to representative embodiments of the present invention, electronic devices capable of withstanding repeated harsh environmental changes, such as sterilization processes performed using an autoclave, can be obtained. Attached Figure Description

[0012] Figure 1 This is a plan view showing the front appearance of a portable information terminal device, i.e., a tablet terminal, according to one embodiment.

[0013] Figure 2 It means Figure 1 A plan view of the back of the tablet terminal shown.

[0014] Figure 3 It is along Figure 2 A cross-sectional view of line AA.

[0015] Figure 4 It means Figure 2 The back of the frame shown and Figure 3 The diagram shows the state after the back side portion of the inner insulation layer has been removed.

[0016] Figure 5 It means along Figure 4 An enlarged cross-sectional view of the BB line, showing an example of a support structure fixed by screws.

[0017] Figure 6 yes Figure 3Enlarged cross-sectional view of part A.

[0018] Figure 7 It means targeting Figure 6 Enlarged cross-sectional view of the modified example.

[0019] Figure 8 yes Figure 5 Enlarged cross-sectional view of part B.

[0020] Figure 9 yes Figure 8 The example shown is a variation of the screw structure.

[0021] Figure 10 It is aimed at Figure 3 A cross-sectional view of a modified portable information terminal device.

[0022] Figure 11 It means Figure 3 An enlarged cross-sectional view of an example of the heat dissipation mechanism shown.

[0023] Figure 12 It means in Figure 11 The diagram shows a plan view of an example layout of multiple Peltier elements arranged in an array in a Peltier element layer.

[0024] Figure 13 It means targeting Figure 3 An enlarged cross-sectional view of an example of the peripheral structure of the frame in another variation of a portable information terminal device.

[0025] Figure 14 It is aimed at Figure 13 A variation of the above.

[0026] Figure 15 It means Figure 11 An explanatory diagram illustrating an example of the configuration of a transparent substrate having a display surface in the display section shown.

[0027] Figure 16 It means targeting Figure 1 A plan view of a variant example.

[0028] Figure 17 It is aimed at Figure 3 A cross-sectional view of another variation of a portable information terminal device.

[0029] Figure 18 It means targeting Figure 3 A cross-sectional view of another variation of a portable information terminal device.

[0030] Figure 19 It means Figure 8 An enlarged cross-sectional view of the deformed example around the connection between the front and back sides shown.

[0031] Figure 20 It means targeting Figure 19 Enlarged cross-sectional view of the modified example.

[0032] Figure 21 It means targeting Figure 7 Enlarged cross-sectional view of the modified example.

[0033] Figure 22 It means targeting Figure 4 A plan view of a variant example.

[0034] Figure 23 It is as a target Figure 1 The side view of the electronic device, namely the oral camera, shown as a modified example of the flat-panel terminal.

[0035] Figure 24 Viewed from the lower surface side Figure 23 The diagram shows a plan view of an oral camera.

[0036] Figure 25 It is along Figure 24 A cross-sectional view of the CC line.

[0037] Figure 26 Is as Figure 18 The side view of the electronic device, i.e., the spotlight, is a modified example of the tablet terminal shown.

[0038] Figure 27 Viewed from the lower surface side Figure 26 The diagram shows the plan view of the spotlight.

[0039] Figure 28 It is along Figure 27 A cross-sectional view of the DD line.

[0040] [Explanation of Labels in the Attached Image]

[0041] 10. Frame; 30. Substrate; 40. Electronic circuit components; 50. Heat insulation layer (first heat insulation layer); 70. Heat dissipation mechanism (first heat dissipation mechanism); 100. Tablet terminal (electronic device, portable information terminal device) Detailed Implementation

[0042] Hereinafter, embodiments of the present invention will be described in detail based on the accompanying drawings. Furthermore, in all the drawings used to describe the embodiments, the same reference numerals are used to label the same parts in principle, and repeated descriptions are omitted. Additionally, in the plan and sectional views, coordinate axes in the X, Y, and Z directions are shown to clearly indicate the orientation of the parts or devices. The X and Y directions are coordinate axes contained in the XY plane, which is parallel to the front side of the tablet terminal's frame (e.g., the surface where the display screen is disposed). The Z direction is a direction orthogonal to the XY plane; in other words, it is a coordinate axis in the thickness direction of the tablet terminal.

[0043] <Overview of Portable Information Terminal Devices>

[0044] First, refer to Figures 1 to 3 This section outlines a portable information terminal device as an example of an electronic device according to an embodiment of the present invention. An information terminal device is a terminal device capable of performing one or both of the following: input processing (receiving information (data) as signals from an external source) and output processing (receiving information (data) as signals to an external source). The information terminal device described below can be interpreted as an information input / output terminal device. Furthermore, a portable information terminal device is an information terminal device whose weight and size are portable, for example, an information terminal device that can be easily carried and used by hand. Figure 1 This is a plan view showing the front appearance of a tablet terminal, which is a portable information terminal device implemented in this embodiment. Figure 2 It means Figure 1 A plan view of the back of the tablet terminal shown. Figure 3 It is along Figure 2 A cross-sectional view of line AA.

[0045] As an example of an electronic device, a tablet terminal 100, represented by a terminal known as iPad (trade name: registered trademark), will be described. However, the electronic devices to which the technology described below applies are not limited to tablet terminal 100, but can be widely applied to various portable information terminal devices such as smartphones. Furthermore, it will be explained in detail later that the technology described below can be applied to various electronic devices other than portable information terminal devices. Tablet terminal 100 is, for example, a medical information terminal device used in medical applications. For example, when performing medical services such as diagnosis, examination, treatment, or surgery, it is sometimes desirable to use a medical system utilizing a medical information terminal device. The medical system may include an external computer or medical device connected via the medical information terminal device. The medical system allows doctors and other medical personnel to perform medical-related actions such as diagnosis, examination, and treatment by operating a computer or medical device using the medical information terminal device. Therefore, a medical system using a portable medical information terminal device can improve medical efficiency. Hereinafter, a portable medical information terminal device having the function of an operation panel as a medical device will be described. However, the technology described below is applicable not only to portable medical information terminal devices, but also to various electronic devices that can be sterilized using an autoclave. The following describes examples of electronic devices in which the techniques described below can be applied.

[0046] To improve the sanitary environment of medical settings such as hospitals, autoclaves are used to sterilize medical information terminal devices that come into contact with medical personnel. When medical information terminal devices possess the durability to withstand autoclaving, for example, sterilization before each use, the sterilized medical information terminal device can be used every time, thus ensuring infection prevention. Therefore, portable information terminal devices used in medical settings, unlike general tablet terminals, require high durability for sterilization treatment using autoclaves.

[0047] In autoclaving, the object to be sterilized is exposed to an atmosphere of high temperature and high pressure, such as steam. Therefore, portable information terminal devices capable of autoclaving require heat resistance, pressure resistance, and water resistance. In the case of portable information terminal devices, electronic circuit components built into the casing and the substrate on which they are mounted are particularly susceptible to damage from heat or moisture. Therefore, considering the electronic circuit components and substrate, heat resistance and water resistance are especially important for autoclaving. Of course, if the casing is damaged by high pressure, the internal components will also be destroyed, so pressure resistance is also necessary. Pressure resistance includes durability against pressures above atmospheric pressure and durability against pressures below atmospheric pressure. Furthermore, when the autoclaved steam contains chemicals other than water, the casing must also be chemically resistant.

[0048] Furthermore, portable information terminal devices include electronic circuit components, and the electronic circuit components of a portable information terminal device, which is also a portable computer, include semiconductor components, which include arithmetic processing circuits. For example, in Figure 3 In the example shown, data processing unit 41 is a semiconductor component that includes an arithmetic processing circuit. The "arithmetic processing circuit" referred to here is a circuit that controls a so-called computer system, having functions such as performing arithmetic processing based on multiple input signals and sending instruction signals to other circuits. Data processing unit 41 includes a system comprising the arithmetic processing circuit, a storage circuit, and a control circuit that controls communication between the circuits. Electronic circuit components that embed a system in such a package are called system packages. Power is required for the arithmetic processing circuit formed on the semiconductor component to operate; however, power consumption generates heat in the semiconductor component, sometimes causing the semiconductor component or components such as batteries to reach high temperatures. Once the semiconductor component reaches a high temperature, its performance degrades. Therefore, for portable information terminal devices capable of being sterilized using an autoclave, in addition to the aforementioned durability, heat dissipation performance is required to dissipate the heat generated by the semiconductor component to the outside during use. In other words, portable information terminal devices for medical use require thermal insulation to prevent external heat intrusion and heat dissipation to release internally generated heat to the outside. These two characteristics are mutually balancing.

[0049] like Figure 3 As shown, the tablet terminal 100 of this embodiment includes a frame 10 and a display section 20 partially exposed from the frame 10 (see reference). Figure 1The components include: a substrate 30 disposed inside the frame 10; electronic circuit components 40 mounted on the substrate 30; a heat insulation layer 50 disposed along the frame 10; and a heat insulation layer 60 separated from the heat insulation layer 50 and disposed to surround the substrate 30 and the electronic circuit components 40.

[0050] The heat insulation layer 50 prevents heat from entering the interior of the frame 10. Furthermore, the heat insulation layer 60 prevents heat from entering the interior of the heat insulation layer 60 (i.e., the area where the electronic circuit components 40 and the substrate 30 are located) from the space between the heat insulation layers 50 and 60. Figure 3 In the example shown, the insulation layer 50 is in contact with the frame 10. Furthermore, the insulation layer 60 is separate from the insulation layer 50. Between the insulation layer 50 and the insulation layer 60, a component such as a support member (not shown) may also be provided, or... Figure 3 The space shown is configured as described. Furthermore, the aforementioned support member can be a heat-insulating component, or it can have the characteristic of retaining and fixing the heat insulation layer 60.

[0051] Furthermore, the heat insulation layers 50 and 60 act as waterproof walls to prevent moisture from entering through the frame 10. Details will be described later. For example, sometimes openings are provided in the frame 10 for mounting components such as optical parts that require light transmission to the outside of the tablet terminal 100. In structures where the substrate 30 and electronic circuit components 40 are simply housed within the frame, moisture entering through the openings may contaminate the substrate 30 or the electronic circuit components. On the other hand, as in this embodiment, when the substrate 30 and electronic circuit components 40 are surrounded by the heat insulation layer 50, moisture entering through the openings is blocked by the heat insulation layer 50, making it difficult for it to reach the substrate 30 and electronic circuit components 40. Additionally, depending on the degree of moisture intrusion, the moisture may be absorbed by the moisture-absorbing properties of the heat insulation layers 50 and 60.

[0052] Furthermore, the tablet terminal 100 has a heat dissipation mechanism 70 that contacts the heat insulation layer 50 and a heat dissipation mechanism 80 that contacts the heat insulation layer 60. The heat dissipation mechanism 70 has the function of dissipating heat from the space between the heat insulation layer 50 and the heat insulation layer 60 to the outside of the frame 10. The heat dissipation mechanism 70 has a heat-absorbing surface 71 exposed inside the heat insulation layer 50 and a heat-dissipating surface 72 located on the opposite side of the heat-absorbing surface 71 and exposed to the outside of the frame 10. The heat movement direction of the heat dissipation mechanism 70 can be electrically controlled. For example, by energizing the heat dissipation mechanism 70, heat in the space between the heat insulation layer 50 and the heat insulation layer 60 is absorbed by the heat-absorbing surface 71 of the heat dissipation mechanism 70 and dissipated from the heat dissipating surface 72 of the heat dissipation mechanism 70. Similarly, the heat dissipation mechanism 80 has the function of dissipating heat from the space surrounded by the heat insulation layer 60 to the space between the heat insulation layer 50 and the heat insulation layer 60. The heat dissipation mechanism 80 has a heat-absorbing surface 81 exposed inside the heat insulation layer 60 and a heat-dissipating surface 82 located on the opposite side of the heat-absorbing surface 81 and exposed outside the heat insulation layer 60. The heat movement direction of the heat dissipation mechanism 80 can be electrically controlled. For example, by energizing the heat dissipation mechanism 80, heat in the space surrounded by the heat insulation layer 60 is absorbed by the heat-absorbing surface 81 of the heat dissipation mechanism 80 and dissipated from the heat dissipation surface 82 of the heat dissipation mechanism 80. The heat dissipation surface 72 of the heat dissipation mechanism 70 is exposed outside the frame 10. Therefore, even when the electronic circuit components 40 generate heat during the use of the tablet terminal 100, this heat is released to the outside of the frame 10 via the heat dissipation mechanism 80 and the heat dissipation mechanism 70. As a result, the temperature rise of the electronic circuit components 40 during the use of the tablet terminal 100 can be suppressed, and the performance degradation of the tablet terminal 100 caused by the temperature rise of the electronic circuit components 40 can be suppressed.

[0053] Furthermore, the heat dissipation mechanism 80 and heat dissipation mechanism 70 also have the function of suppressing temperature rise in the internal space of the frame 10 during autoclaving. For example, when the flat panel terminal 100 is sterilized by an autoclave, the heat dissipation mechanism 70 and heat dissipation mechanism 80 are energized. The heat dissipation mechanism 70 and heat dissipation mechanism 80 are components capable of controlling the direction of heat transfer. Even if the temperature around the flat panel terminal 100 is higher than the internal temperature of the flat panel terminal 100, heat is absorbed from the heat absorption surface 71 and heat absorption surface 81 and dissipated from the heat dissipation surfaces 72 and 82. Therefore, even if heat enters the frame 10 during autoclaving, the intruded heat is discharged to the outside via the heat dissipation mechanism 70 and heat dissipation mechanism 80. In other words, the heat dissipation mechanism 70 and 80 are not merely heat insulation components that simply obstruct heat transfer, but are used as temperature rise suppression components, suppressing temperature rise in the internal space of the frame 10 by actively transferring heat while controlling the direction of heat transfer.

[0054] Like heat dissipation mechanisms 70 and 80, thermoelectric elements that convert heat energy into electrical energy can be used as heat dissipation components that allow control over the direction of heat transfer. For example, the functions of heat dissipation mechanisms 70 and 80 can be easily achieved using a Peltier element, which is a component that utilizes the Peltier effect, a conversion between electrical and heat energy. The detailed structure of the heat dissipation mechanism using a Peltier element will be described later.

[0055] exist Figure 3 In the example shown, the heat-absorbing surface 71 of the heat dissipation mechanism 70 and the heat dissipation surface 82 of the heat dissipation mechanism 80 are arranged opposite each other. In this case, the heat released from the heat dissipation surface 82 of the heat dissipation mechanism 80 can be effectively absorbed by the heat-absorbing surface 71. Therefore, considering the heat dissipation efficiency of the peripheral area of ​​the electronic circuit component 40, such as Figure 3 As shown, the heat-absorbing surface 71 and the heat-dissipating surface 82 are preferably opposite each other. Although the illustration is omitted, it is intended to illustrate this. Figure 3 In some variations, the heat-absorbing surface 71 and the heat-dissipating surface 82 are not opposite each other. In this case, although... Figure 3 Compared to the example, the heat dissipation efficiency is reduced, but since the heat dissipation mechanism 80 can release the heat in the insulation layer 60 from the heat dissipation surface 82, and the heat in the frame 10 can be released to the outside of the frame 10 by driving the heat dissipation mechanism 70, the heat dissipation efficiency can be improved compared to the comparative tablet terminal (not shown) without heat dissipation mechanism 70 and 80.

[0056] <Layout of built-in components>

[0057] Next, we will illustrate the layout of the various components built into the tablet terminal. Figure 4 It means to Figure 2 The back of the frame shown and Figure 3 The diagram shows the state of the inner insulation layer after the back side portion has been removed. Figure 3 As shown, the heat dissipation mechanism 70 is mounted on the back side 12 of the frame 10, therefore, when the back side 12 is removed... Figure 4 In the middle, the heat dissipation mechanism 70 was also removed. Figure 4 In order to clarify the positional relationship between the heat dissipation mechanism 70 and the substrate 30, electronic circuit components 40 or secondary battery 90, the outline of the heat dissipation mechanism 70 is marked with a dashed line. Figures 1 to 3 The frame 10 shown includes a front portion 11 having a front face 10F and a back portion 12 having a back face 10B opposite to the front face 10F. Display unit 20 (see reference) Figure 1The front part 11 is mounted on the back part 12. The back part 12 is located on the opposite side of the front part 11 and is equipped with a heat dissipation mechanism 70. The front part 11 and the back part 12 are fixed by screws in a plurality of support parts 13, for example, so that the heat dissipation mechanism 70 can be installed by loosening the plurality of screws (see below). Figure 5 A structure that can be separated.

[0058] In this embodiment, the interior of the frame 10 houses an electrical component including a display unit (display panel module) 20, a flexible wiring board 21, a substrate 30, multiple electronic circuit components 40, a secondary battery 90, and a charging coil 91, as well as optical components such as a lens 92 and an optical fiber cable 93. Additionally, Figure 4 The types, quantities, and layout of components shown are just examples; therefore, various variations exist. For instance, they may include... Figure 4 Electrical or optical components other than those shown, or components that may not include a portion of the components shown. Additionally, Figure 4 The layout of the components shown can be varied depending on the heat resistance or durability of each component against environmental changes. For example, when the secondary battery 90 has high heat resistance, it can be disposed between the heat insulation layer 50 and the heat insulation layer 60. Similarly, in the various modifications described below, the types, quantities, and layouts of the various electronic components included in the electronic device are also varied, and are positioned appropriately according to the durability of the electronic components.

[0059] For example, the charging coil 91 is a coil used to charge the secondary battery 90 using electromagnetic induction. When the charging coil 91 is changed and a connector for connecting to an external power source is provided, the charging coil 91 may not be built-in. However, from the perspective of improving the waterproofing and heat insulation of the interior of the housing 10, it is preferable to have fewer openings in the housing 10. In use... Figure 4 In the case of the charging coil 91 shown, the secondary battery 90 can be charged without the need for a connector for connecting to an external power source. Therefore, this is preferable from the perspective of reducing the number of openings in the housing 10.

[0060] Multiple electronic circuit components 40 are mounted on the substrate 30. Figure 4 In the example shown, multiple electronic circuit components 40 include a data processing component 41, an image capture device (image sensor) 42, and an electromagnetic sensor 43.

[0061] The data processing unit 41 is a semiconductor component, which includes, for example, an arithmetic processing circuit for data processing and a control circuit for controlling the electrical and optical operations of the tablet terminal 100. Thus, electronic circuit components with arithmetic processing circuits for data processing are sometimes referred to as logic components. As a logic component, the data processing unit 41 is particularly prone to heat generation among the various electronic circuit components 40. Furthermore, the arithmetic processing circuit included in the data processing unit 41 is a component whose processing performance is reduced due to heat generated during the use of the tablet terminal 100. Therefore, as... Figure 3 As shown, in the thickness direction of the tablet terminal 100, the data processing component 41 preferably overlaps with the heat dissipation mechanism 80 and the heat dissipation mechanism 70. Therefore, the heat dissipation path from the data processing component 41 to the outside of the housing 10 can be shortened, thereby improving heat dissipation characteristics. Furthermore, in Figure 4 In the example shown, the data processing unit 41 is connected to the display unit 20 via the flexible wiring board 21. The display operation of the display unit 20 is controlled, for example, by the data processing unit 41.

[0062] The image capture unit 42 is an electronic circuit component (also an optical component) including a photoelectric conversion circuit that converts an optical image into an electrical signal, and is optically connected to the lens 92 via an optical fiber cable 93. In this embodiment, a direct optical image transmission method is used, in which the optical image is transmitted from the lens 92 to the image capture unit 42. Light (optical image) illuminating the lens 92 from the outside is transmitted to the image capture unit 42 via the optical fiber cable 93, where it is converted into an electrical signal. This electrical signal is transmitted to the data processing unit 41 via wiring formed on the substrate 30 and is processed by the data processing unit 41. Compared to electronic circuit components such as the image capture unit 42, optical components such as the lens 92 and the optical fiber cable 93 are less prone to damage even when exposed to heat or moisture. In addition, since the lens 92 needs to receive light from the outside of the frame 10, it needs to be positioned so that it can receive light from an opening or window of the frame 10. On the other hand, when the image capture unit 42 is placed near the lens, light attenuation can be suppressed, but the image capture unit 42 is susceptible to heat. Therefore, in Figure 4 In the example shown, a portion of the fiber optic cable 93 and the lens 92 are arranged outside the heat insulation layer 60, while the image capture device 42 is arranged inside the heat insulation layer 60. In this configuration, even when the flat panel terminal 100 is sterilized using an autoclave, the image capture device 42 can be prevented from being damaged by heat, and light can still be received through the image capture device 42. As an example of direct optical image transmission, the method of transmitting an optical image to the image capture device 42 via the lens 92 and fiber optic cable 93 has been described. However, variations of the direct optical image transmission method, such as using optical elements like rod lenses or lens barrels, are also effective.

[0063] Electromagnetic sensor 43 is a sensor for receiving external input. Instructions or information are input to electromagnetic sensor 43 from the outside using an electromagnetic communication method. The input information is converted into an electrical signal and, for example, transmitted to data processing unit 41. The input information may, for example, display identification information of a patient receiving treatment or examination. Using an input method like electromagnetic sensor 43, which allows for non-contact input of information to tablet computer 100, is preferred from the perspective of suppressing contamination of tablet computer 100. As an example, in Figure 4 The description includes a method for inputting data from above using electromagnetic communication, but besides electromagnetic methods, there are various variations of input methods, such as optical methods. Furthermore, even when using a so-called touch panel input method, there are cases where information can be input using an input tool such as a stylus without directly touching the tablet terminal 100.

[0064] exist Figure 4 In the example shown, a data processing unit 41, an image capture device 42, and an electromagnetic sensor 43 are exemplarily illustrated as multiple electronic circuit components 40; however, various variations exist in the type and number of electronic circuit components 40. For example, the functions of the data processing unit 41, the image capture device 42, and the electromagnetic sensor 43 can be integrated into a single electronic circuit component 40. Additionally, for example, in... Figure 4 The example shown integrates computational processing and control functions into a single data processing unit 41. However, corresponding to the high functionality of the tablet terminal 100, multiple data processing units 41 are sometimes installed. As the number of data processing units 41 increases, the processing speed improves, but the heat generation also increases. Therefore, improving… Figure 3 The heat dissipation efficiency of the heat dissipation mechanisms 70 and 80 shown becomes very important.

[0065] <Insulation and Sealing Structures>

[0066] Next, the sealing structure of the frame 10 of the tablet terminal 100 and the heat insulation structure of the heat insulation layer 50 in contact with the frame 10 will be described. Figure 5 It shows along Figure 4 An enlarged cross-sectional view of the structure of the support fixed by screws in the enlarged cross-section of the BB line. Figure 6 yes Figure 3 Enlarged cross-sectional view of part A. Figure 7 It means targeting Figure 6 Enlarged cross-sectional view of the modified example. Figure 8 yes Figure 5 Enlarged cross-sectional view of part B. Figure 9 yes Figure 8 The example shown is a variation of the screw's structure. Figures 6 to 8 In the middle, an arrow indicates when tightening...Figure 5 The direction of force applied when screw 14 is shown. Furthermore, the surface of frame 10 has partially roughened areas. Figures 6 to 9 In the diagram, the roughened areas are schematically represented by dashed lines.

[0067] like Figure 3 As shown, the frame 10 has a separable front portion 11 and a back portion 12. The front portion 11 is the part where the display unit 20 is mounted, and the display surface 22 of the display unit 20 (see reference) Figure 1 The frame 10 is exposed from the front face 11. The frame 10 is made of a rigid (hard) material. When sterilized by an autoclave, the frame 10 is exposed to a high-temperature steam atmosphere. Therefore, it is preferable to select the material constituting the frame 10 considering heat resistance, water resistance (including water vapor resistance), water resistance (i.e., sealing), pressure resistance, and durability (resistance to repeated use or temperature changes, etc.) to avoid damage to the frame 10 itself due to high temperatures. Furthermore, considering the risk of contaminants adhering to the frame 10, it is preferable to select the material of the frame 10 considering stain resistance, ease of cleaning, and resistance to cleaning solutions. As a preferred material considering the above-mentioned durability, thermoplastic resins known as so-called super engineering plastics can be cited as an example. Super engineering plastics are engineering plastics with strength, heat resistance, water resistance, etc. The frame 10 can be made of a material mixed with heat-insulating particles. The frame 10 can also be made of a material containing a reinforcing resin made of glass optical fibers or carbon fibers, etc. The frame 10 and each insulation layer are not limited to one layer, but can also be composed of multiple layers.

[0068] In addition, the frame 10 has such Figure 5 The front portion 11 and the back portion 12 shown are fixed by a support portion 13 via screws 14, and as shown in the figure Figure 7 The peripheral connecting portion 15 shown is where the front portion 11 and the back portion 12 are connected to each other in the periphery of the frame 10.

[0069] like Figure 6 As shown, the peripheral connection portion 15 includes a connection portion 15A between the front portion 11 and the back portion 12, with the heat insulation layer 50 sandwiched between them, and a connection portion 15B between the front portion 11 and the back portion 12, with the sealing material 16A sandwiched between them, also facing each other. The connection portion 15B is located further outward from the frame 10 compared to the connection portion 15A. Figure 5 In the support portion 13, the front portion 11 and the back portion 12 are fixed in the connecting portion 15A with the heat insulation layer 50 sandwiched between them by the tightening force of the screw 14. In the connecting portion 15B, the front portion 11 and the back portion 12 are fixed in the state of being sandwiched with the sealing material 16A.

[0070] When the front portion 11 and the back portion 12 are configured to be separable, a portion of the heat insulation layer 50 may be interrupted (in other words, a heat intrusion path) in the part where a portion of the front portion 11 and a portion of the back portion 12 are opposite to each other. In the case of this embodiment, Figure 6 The connecting part 15A shown (and described later) Figure 8 In the connecting portion 13A shown, the front portion 11 and the back portion 12 are fixed while the heat insulation layer 50 is sandwiched between them. Therefore, it is possible to prevent the heat insulation layer 50 from being interrupted in the portions where the front portion 11 and the back portion 12 are facing each other. As a result, even if the front portion 11 and the back portion 12 are separable, the reduction of the internal heat insulation properties of the frame 10 can be suppressed.

[0071] Additionally, although the illustration is omitted, it serves as... Figure 3 In some variations of the tablet terminal 100 shown, the frame 10 has a structure in which multiple components cannot be separated. Compared to this variation, as in this embodiment, when the frame 10 is composed of a separable front portion 11 and a back portion 12, the assembly and maintenance of the tablet terminal 100 become easier. However, when the frame 10 has a separable structure, the risk of heat and moisture intrusion from the portion connecting the front portion 11 and the back portion 12 increases. Therefore, when employing a separable structure, heat resistance, water resistance, chemical resistance, and pressure resistance measures are required at the connection points.

[0072] exist Figure 6 In the example shown, in the connection portion 15B located on the outer surface side of the frame 10, sealing material 16A is sandwiched between the front portion 11 and the back portion 12. Figure 6 In the example shown, the sealing material 16A has a structure that allows it to be separated into a first sealing material 16A on the front face 11 side and a second sealing material 16A on the back face 12 side. However, as a variation, a single sealing material 16A may be provided between the front face 11 and the front face 12. The sealing material 16A is made of a material that is elastic and has water and heat resistance, such as silicone rubber (or silicone resin). Furthermore, it is secured by screw 14 (see reference). Figure 5 The front portion 11 and the back portion 12 are fixed with the sealing material 16A sandwiched between them due to the fastening force. Therefore, moisture can be prevented from entering the connecting portion 15B located on the outside of the frame 10. In addition, since the front portion 11 and the back portion 12 are fixed with the sealing material 16A sandwiched between them, the pressure resistance of the frame 10 can be improved.

[0073] Figure 6An example is shown where an O-ring 16D is provided in the area between the connecting portion 15A and the connecting portion 15B, between the front portion 11 and the back portion 12. From the perspective of improving the airtightness of the contact interface between the front portion 11 and the back portion 12, it is preferable to provide the O-ring 16D. However, from the viewpoint of preventing moisture intrusion, the connecting portion 15B is sufficient; therefore, as a solution for… Figure 6 In some variations, O-rings are not arranged.

[0074] Furthermore, from the viewpoint of improving the adhesion of the sealing material 16A in the connecting portion 15B to the contact interfaces between the front portion 11 and the back portion 12, the following structure is preferred. That is, in the connecting portion 15B, the surface 11C1 of the front portion 11 that contacts the sealing material 16A and the surface 12C1 of the back portion 12 that contacts the sealing material 16A are respectively subjected to roughening treatment. Figure 6 (The portion shown schematically in dashed lines). As a roughening method, one example is a surface modification treatment performed by irradiating with a laser to form fine grooves. Furthermore, when the material constituting the frame 10 includes glass fiber or carbon fiber, laser irradiation exposes a portion of the glass fiber or carbon fiber, which serves as an anchor to suppress deviations of the sealing material 16A. The sealing material 16A is formed on either or both of the surface 11C1 of the front portion 11 and the surface 12C1 of the back portion 12, and the surface on which the sealing material 16A is formed is bonded to the sealing material 16A. Additionally, as a method for forming the sealing material 16A, there is a variation where, when the sealing material 16A is formed on either the surface 11C1 of the front portion 11 or the surface 12C1 of the back portion 12, a roughening treatment is performed on either surface 11C1 or surface 12C1 (the surface on which the sealing material 16A is formed). In other words, in the connecting portion 15B, if at least one of the surfaces 11C1 of the front portion 11 that contact the sealing material 16A and the surfaces 12C1 of the back portion 12 that contact the sealing material 16A is roughened, the sealing performance between the sealing material 16A and the frame 10 can be improved.

[0075] exist Figure 6In the example shown, a heat insulation layer 50 is sandwiched between the front portion 11 and the back portion 12 in the connecting portion 15A located on the inner surface side of the frame 10. The heat insulation layer 50 is, for example, a laminated film having a heat insulation fiber layer containing heat insulation fibers and an adhesive layer sandwiching the heat insulation fiber layer formed on both sides. Alternatively, it may not be a laminated film, but rather the heat insulation fibers are included in the adhesive layer. In addition to the heat insulation fiber layer, the laminated film may also contain a layer made of a metal film such as aluminum or various heat insulation fiber layers. The heat insulation fiber layer can be heat insulation paper or non-flammable fiber formed by adding a resin binder to a fiber material with high heat insulation properties and molding it into a sheet. Furthermore, to improve the heat insulation properties, inorganic fillers such as silica are sometimes mixed into the heat insulation layer or adhesive layer. In the case of this embodiment, the heat insulation layer is connected by screw 14 (see reference 14). Figure 5 The front part 11 and the back part 12 are fixed with the heat insulation layer 50 sandwiched between them by the fastening force of the heat insulation layer 50. As a result, even if heat enters from the connection part 15B through the connection interface between the front part 11 and the back part 12, the heat intrusion path in the connection part 15A can be cut off.

[0076] Figure 6 The structure of the peripheral connection portion 15 shown has various variations. For example, in Figure 7 In the modified example shown, the connecting portion 15B includes: a first direction parallel to the normal direction of the back surface 10B ( Figure 7 In the Z direction, the opposing portions (first opposing portions) 15B1 of the front portion 11 and the back portion 12 facing each other, and the second direction (e.g., inclined at an angle other than the direction orthogonal to the first direction) in the Z direction, and the second direction (e.g., in the Z direction) in the Z direction, which is inclined at an angle other than the direction orthogonal to the first direction. Figure 7 The second opposing portion 15B2 is located in the θ direction (front portion 11 and back portion 12 facing each other). As described above, the peripheral connecting portion 15 has multiple intersecting surfaces, thereby improving the pressure resistance characteristics of the frame 10. This is because when high pressure is applied to the frame 10, the applied pressure is applied in multiple directions, thus the pressure vectors generate opposing forces. Furthermore, from this viewpoint, it is preferable that the area of ​​the second opposing portion 15B2 is as large as possible.

[0077] Next, an explanation Figure 5 The structure of the support portion 13 is shown. As described above, from the perspective of the waterproofness and heat resistance of the peripheral connection portion 15 of the frame 10, as long as the front portion 11 and the back portion 12 are fixed in the connection portion 15A with the heat insulation layer 50 sandwiched by the tightening force of the screws 14 in the support portion 13, and in the connection portion 15B with the front portion 11 and the back portion 12 being fixed with the sealing material 16A sandwiched, the connection method is not particularly limited. However, since the front portion 11 and the back portion 12 are fixed by the screws 14, it is preferable to take measures to prevent moisture and heat from entering through the screw holes into which the screws 14 are inserted.

[0078] like Figure 8 As shown, the support portion 13 includes a connecting portion 13A where the front portion 11 and the back portion 12 sandwich the heat insulation layer 50 and face each other, a connecting portion 13B where the front portion 11 and the back portion 12 sandwich the sealing material 16B and face each other, and a stop portion 13C disposed between the connecting portions 13A and 13B. The connecting portion 13B is disposed further outward than the connecting portion 13A. Through the tightening force of the screw 14, in the connecting portion 13A, the front portion 11 and the back portion 12 are fixed while sandwiching the heat insulation layer 50, and in the connecting portion 13B, the front portion 11 and the back portion 12 are fixed while sandwiching the sealing material 16B. As described above, by employing a... Figure 6 and 7 The peripheral connection portion 15 has the same sealing and heat insulation structure, which prevents moisture and heat from entering from the insertion screw portion 14. The sealing material 16B can, for example, be the same as the reference material. Figure 6 The sealing material described is the same as that in 16A.

[0079] exist Figure 8 In the example shown, moisture may seep in through the tiny gap between screw 14 and frame 10. However, as... Figure 8 As shown, in the connection portion 13B where the front portion 11 and the back portion 12 are fastened by screw 14, since a sealing material 16B is provided between the front portion 11 and the back portion 12, moisture can be prevented from penetrating the connection portion 13A even if moisture intrudes. Furthermore, as described later... Figure 9 As shown, the method involves preventing moisture intrusion by placing a sealing material 16C at the interface between the screw 14 and the back portion 12. Alternatively, as described later. Figure 10 As shown, the method is as follows: by providing a covering film 17 covering the outer surfaces of the front part 11 and the back part 12, the boundary portion between the screw 14 and the back part 12 is covered by the covering film 17, thereby preventing moisture intrusion.

[0080] In addition to the connecting portions 13A and 13B, the support portion 13 also includes a stop portion 13C, which is controlled in a direction parallel to the back surface 10B. Figure 8 (in the Y direction) and the normal direction of the back 10B (in the Y direction) Figure 8 The positional deviation between the front portion 11 and the back portion 12 in the Z direction. The stop portion 13C has two or more intersecting surfaces. In the stop portion 13C, the front portion 11 and the back portion 12 are in direct contact on each of two or more surfaces 13CY and 13CZ. Figure 8In the example shown, the stop portion 13C has a surface 13CY extending in the Y direction and a surface 13CZ extending in the Z direction.

[0081] In the stop portion 13C, the front portion 11 and the back portion 12 are brought into contact with each other at the position of the surface 13CY extending in the Y direction, thereby controlling the tablet terminal 100 (see reference). Figure 5 Positional deviation in the thickness direction (Z direction). By controlling this positional deviation, it is possible to prevent the positional relationship between the front portion 11 and the back portion 12 from approaching or exceeding the design value. For example, in Figure 8 In the connecting portion 13A shown, when the distance between the front portion 11 and the back portion 12 in the Z direction is too close, the force clamping the heat insulation layer 50 is too large, causing the heat insulation layer 50 to deteriorate due to overload. In this embodiment, the front portion 11 contacts the back portion 12 on the surface 13CY of the stop portion 13C, so the distance between the front portion 11 and the back portion 12 in the connecting portion 13A can be maintained at a preset appropriate value. As a result, deterioration caused by overload of the heat insulation layer 50 can be suppressed. In addition, material deterioration caused by clamping the material with excessive force can also occur in the sealing material 16B. The sealing material 16B is, for example, an elastic material, and if the displacement is appropriate, stress can be relieved by elastic deformation. However, when the displacement is excessive, even an elastic material will deteriorate. In this embodiment, the front portion 11 and the back portion 12 contact each other on the surface 13CY of the stop portion 13C, so the distance between the front portion 11 and the back portion 12 in the connecting portion 13B can be maintained at a preset appropriate value. As a result, deterioration caused by overload of the sealing material 16B can be suppressed.

[0082] Furthermore, in the stop portion 13C, the front portion 11 and the back portion 12 are brought into contact with each other at a position of the surface 13CZ extending in the Z direction, thereby controlling the contact with the flat plate terminal 100 (see reference). Figure 5 The direction in which the thickness direction intersects () Figure 8 Positional deviation in the Y direction (example). In other words, the protruding part of the back portion 12 is inserted into the opening of the support portion 13 of the front portion 11 by the tightening force of the screw 14, but since the front portion 11 and the back portion 12 are in contact with each other in the surface 13CZ of the stop portion 13C, the surface 13CZ plays a guiding role. As a result, in relation to the tablet terminal 100 (refer to...) Figure 5 In the direction where the thickness direction of the front part 11 and the back part 12 intersect, the stop part 13C can prevent the positional relationship between the front part 11 and the back part 12 from shifting.

[0083] Furthermore, in the connecting portion 13B, the surface 11C2 of the front portion 11 that contacts the sealing material 16B and the surface 12C2 of the back portion 12 that contacts the sealing material 16B are respectively roughened. This roughening treatment and utilization Figure 6 The roughening treatment described herein is the same. By implementing the roughening treatment, the sealing strength between the sealing material 16B and the front portion 11 and the back portion 12 can be improved. When a rubber gasket is used as the sealing structure, deformation may sometimes occur due to the twisting of the rubber gasket. In the case of implementing the roughening treatment as in this embodiment, since such deformation can be prevented, performance can be improved from the perspective of sealing characteristics and durability. In addition, as a method of forming the sealing material 16B, if the sealing material 16B is formed on either the surface 11C2 of the front portion 11 or the surface 12C2 of the back portion 12, the surface 11C2 or the surface 12C2 (the surface on which the sealing material 16B is formed) can be roughened. That is, in the connecting portion 13B, if at least one of the surface 11C2 of the front portion 11 that contacts the sealing material 16B and the surface 12C2 of the back portion 12 that contacts the sealing material 16B is roughened, the sealing performance between the sealing material 16B and the frame 10 can be improved.

[0084] In addition, as a method to prevent moisture from entering through the part of the insertion screw 14, there are also Figure 9 The variation shown is an example of this. Figure 9 In the modified example shown, the support portion 13 has a screw-sealing portion 13D with the screw 14 and the back portion 12 sandwiching the sealing material 16C. In the screw-sealing portion 13D, the surface 12C3 of the back portion 12 that contacts the sealing material 16C is roughened. In the screw-sealing portion 13D, by placing the sealing material 16C between the back portion 12 and the screw 14, moisture intrusion into the gap between the screw 14 and the back portion 12 can be minimized. The sealing material 16C can be used with reference... Figure 6 The sealing material 16A described is the same material. Additionally, although not shown in the figure, there are variations where the surface of the screw 14 in close contact with the sealing material 16C is roughened. In this case, since the sealing performance between the screw 14 and the sealing material 16C can be improved, moisture can be reliably prevented from penetrating from the interface between the screw 14 and the sealing material 16C.

[0085] Furthermore, from the perspective of increasing the contact area between the screw 14 and the sealing material 16C, the surface of the screw 14 that contacts the sealing material 16C is preferably inclined relative to the back surface 10B. In addition, to prevent the intrusion of bacteria and viruses, the sealing material 16C is preferably formed as close as possible to the entrance in the threaded hole formed in the back surface portion 12. For example, the sealing material 16C contacts the screw head portion of the screw 14, which is closer to the back surface 10B than the threaded portion.

[0086] Figure 10 Is as Figure 3 A cross-sectional view of a modified portable information terminal device. Figure 10 The tablet terminal 101 shown has a cover film 17 on the frame 10, which is consistent with... Figure 3 The tablet terminal 100 shown is different. The frame 10 includes a cover film 17 covering the outer surfaces of the front portion 11 and the back portion 12. At least the sealing material 16A of the peripheral connection portion 15 and the screws 14 (more specifically, the screw heads of the screws 14) of the support portion 13 are covered by the cover film 17.

[0087] The covering membrane 17 is made of a material such as silicone rubber (or silicone resin) that has properties such as light transmittance, heat resistance, water resistance, and flexibility (elasticity). Furthermore, more preferably, the covering membrane 17 has properties such as durability, abrasion resistance, pressure resistance, or ease of cleaning. By covering the opening communicating with the internal space of the frame 10 with the covering membrane 17, moisture can be prevented from entering through the opening. Figure 10 In the example shown, the display surface 22 of the display unit 20 and the heat dissipation surface 72 of the heat dissipation mechanism unit 70 are exposed from the cover film 17. As a variation, there is also a structure in which the outermost periphery of the tablet terminal 101 is entirely covered by the cover film 17. For example, when the cover film 17 is made of a visible light transmitting material, light can be transmitted even though the display surface 22 is covered by the cover film 17. However, from the perspective of improving heat dissipation characteristics, it is preferable that at least a portion of the heat dissipation surface 72 is exposed from the cover film 17.

[0088] On the other hand, from the viewpoint of opening the frame 10 to facilitate repair and replacement of internal components, it is preferable that the covering film 17 does not cover the entire frame 10.

[0089] In this embodiment, as an example of a connection method (fixing method) between the front part 11 and the back part 12, a connection method using screws 14 is described. However, various variations of the connection method can be applied. For example, although the illustration is omitted, methods such as pressing with adhesive materials, welding, integral molding, and joining through chemical conversion treatment can be used.

[0090] This part utilizes Figures 5 to 10 The structure of the explanation and its subsequent use Figures 19 to 21The characteristic parts of the described structure, as Figure 3 The modified example of the tablet terminal 100 shown can be applied to electronic devices that do not have a heat dissipation mechanism 70, a heat dissipation mechanism 80, and a heat insulation layer 60.

[0091] <Structural Example of Heat Dissipation Mechanism>

[0092] Next, I will explain Figure 3 The structural examples of the heat dissipation mechanisms 70 and 80 are shown. If... Figure 3 The heat dissipation mechanisms 70 and 80 shown have the characteristic of releasing heat from the heat-absorbing surface to the heat-dissipating surface and suppressing the transfer of heat from the heat-dissipating surface to the heat-absorbing surface, thus allowing for the use of various mechanisms. Furthermore, it is particularly preferable if the degree and state of heat dissipation can be electrically controlled. In this embodiment, as an example of a heat dissipation mechanism having the aforementioned heat dissipation characteristics and capable of electrically controlling the degree and state of heat dissipation, a heat dissipation mechanism utilizing the Peltier effect will be described. Since heat dissipation mechanisms 70 and 80 can each have the same structure, heat dissipation mechanism 70 will be described as a representative example in this section. Heat dissipation mechanism 80, like heat dissipation mechanism 70, includes a Peltier sheet module 75, which includes a Peltier element layer 73 and ceramic plates 74A and 74B sandwiching the Peltier element layer. Figure 11 It is shown Figure 3 An enlarged cross-sectional view of an example structure of the heat dissipation mechanism shown. Figure 12 It is shown in Figure 11 The diagram shows a plan view of an example layout of multiple Peltier elements arranged in an array in a Peltier element layer.

[0093] Figure 11 The heat dissipation mechanism 70 shown includes a plurality of Peltier elements 73A arranged thereon (see reference). Figure 12 The Peltier element layer 73. Specifically, the heat dissipation mechanism 70 includes a Peltier sheet module 75 and a heat dissipation component 76. The Peltier sheet module 75 has a ceramic plate 74A including a heat-absorbing surface 71, a Peltier element layer 73, and a ceramic plate 74B disposed on the opposite side of the ceramic plate 74A via the Peltier element layer 73. The heat dissipation component 76 includes a heat dissipation plate 76A and a heat-conducting component 76B. The heat dissipation plate 76A has a heat dissipation surface 72 exposed from the frame 10, and the heat-conducting component 76B is disposed between the heat dissipation plate 76A and the Peltier sheet module 75 and is thermally connected to the ceramic plate 74B and the heat dissipation plate 76A, respectively.

[0094] like Figure 12As shown, multiple Peltier elements 73A are arranged, for example, in a matrix to form a Peltier element array. Each of the multiple Peltier elements 73A is electrically connected to the others. The multiple Peltier elements 73A are mounted on a ceramic plate 74B, with one side (heat-absorbing side) of each Peltier element 73A in contact with the ceramic plate 74A, and its opposite side (heat-dissipating side) in contact with the ceramic plate 74B. Between the ceramic plates 74A and 74B, the multiple Peltier elements 73A are sealed with a sealing material such as resin.

[0095] In addition, such as Figure 11 As shown, the Peltier element layer 73 is electrically connected to the secondary battery 90. The secondary battery 90 is electrically connected to the data processing unit 41, and the power supply to the Peltier element layer 73 is controlled by a command signal output from the data processing unit 41. During the power supply to the Peltier element layer 73, heat is absorbed from the heat-absorbing surface 71 and dissipated from the heat-dissipating surface 72. If the heat dissipation state of the heat dissipation mechanism 70 can be electrically controlled in this way, the power consumption of the entire device can be reduced. For example, when using the tablet terminal 100 (see reference...) Figure 1 When the temperature of the electronic circuit component 40 is detected, the on / off state of the heat dissipation mechanism 70 (and heat dissipation mechanism 80) is controlled based on its temperature. Furthermore, when used for sterilization in a high-pressure steam sterilizer, power is supplied to the heat dissipation mechanism 70 (and heat dissipation mechanism 80) to prevent heat from entering through the heat dissipation mechanism 70. In this embodiment, by using... Figure 4 The data processing unit 41, one of the multiple electronic circuit components 40 shown, controls the operating state of the heat dissipation mechanism 70. Therefore, when the tablet terminal 100 is not in use and is not being used for sterilization in an autoclave, the power supply to the heat dissipation mechanism 70 can be stopped, thereby reducing overall power consumption.

[0096] The material constituting the heat dissipation mechanism 70 is a material with a higher thermal conductivity than the materials constituting the frame 10 and the insulation layer 50. However, since the direction of heat transfer can be controlled by driving the heat dissipation mechanism 70, it is possible to prevent the electronic circuit components 40 located inside the frame 10 from being damaged by heat.

[0097] Although the function of the heat dissipation mechanism 70 can be achieved solely through the Peltier sheet module 75, from the viewpoint of preventing malfunctions of the Peltier sheet module 75 due to moisture, it is preferable to... Figure 11 The structure shown is as follows: The heat dissipation component 76 is mounted on the frame 10, and the Perger sheet module 75 is mounted inside the frame 10. The heat dissipation component 76 is embedded in the frame 10. Figure 11In the example, the heat dissipation component 76 includes a structure in which two plate-like components are connected via a plurality of pillars 76C arranged between them. The material constituting the frame 10 is embedded around the plurality of pillars 76C. Such a structure, for example, is formed after the structure of the heat dissipation component 76 is manufactured, by inserting the material of the frame 10 into the molding to seal the pillars 76C of the heat dissipation component 76, thereby obtaining a plurality of pillars 76C molded within the frame 10 as shown in the example. Figure 11 The structure shown. In this structure, since the Peltier sheet module 75 is disposed inside the frame 10, deformation of the Peltier element 73A (see reference) due to moisture or pressure can be prevented. Figure 12 Misoperation. In addition, since the heat dissipation component 76 is installed embedded in the frame 10, moisture can be prevented from entering the interior of the frame 10.

[0098] exist Figure 11 The example shown illustrates a scenario where the heat sink 76A and the heat-conducting component 76B are formed as separate parts. In this case, the heat sink 76A and the heat-conducting component 76B can be formed from different materials. For example, considering thermal conductivity, the heat-conducting component 76B may be made of aluminum or the like, and considering corrosion resistance, the portion of the heat sink 76A exposed to the outside of the frame may be made of stainless steel or the like. However, as a variation, the heat sink 76A and the heat-conducting component 76B may also be integrally formed from the same material.

[0099] <Near-infrared countermeasures>

[0100] Next, as one of the reasons for the rise in internal temperature of the frame 10, countermeasures to prevent the intrusion of near-infrared rays will be explained. The structures described in the "Heat Insulation Structure and Sealing Structure" section above can prevent heat from entering the interior of the frame 10. However, according to the inventors' research, when near-infrared rays penetrate the interior of the frame 10 from the outside, components located inside the frame 10 may be heated by the near-infrared rays, leading to a temperature increase. When sterilizing using an autoclave, for example, a heater is sometimes used to directly heat the interior of the autoclave. In this case, the wavelength range of the near-infrared rays emitted from the heater is approximately 0.7 to 2.5 μm. Hereinafter, as a variation of the aforementioned flat panel terminal 100, a preferred method for counteracting near-infrared rays will be described.

[0101] When focusing on the heating of components by near-infrared rays, even if... Figure 3 In the case of the heat insulation layer 50 or 60 shown, the internal components will be heated as long as near-infrared rays pass through. Therefore, in this modified example, a structural example with a functional layer for preventing the intrusion of near-infrared rays will be described. Figure 13 It means as Figure 3 An enlarged cross-sectional view of an example of the peripheral structure of the frame in another variation of a portable information terminal device.Figure 14 It is aimed at Figure 13 A variation of the above.

[0102] Figure 13 The modified example shown is a flat panel terminal 102 and Figure 3 The difference in the flat panel terminal 100 shown is that a near-infrared shielding layer 18 is provided between the frame 10 and the heat insulation layer 50 to block the intrusion of near-infrared rays. The near-infrared shielding layer 18 comprises, from the frame 10 side, a laminated film consisting of a near-infrared absorption layer 18A with a near-infrared absorption characteristic higher than that of the frame 10 and a near-infrared reflective layer 18B with a near-infrared reflectivity higher than that of the frame 10.

[0103] For example, such as Figure 13 The middle arrow schematically illustrates the case where near-infrared radiation is irradiated from the back side 10B. Near-infrared radiation is absorbed by the near-infrared absorption layer 18A through the frame 10. Most of the near-infrared radiation not absorbed by the near-infrared absorption layer 18A is reflected by the near-infrared reflective layer 18B. As a result, the amount of near-infrared radiation reaching the heat insulation layer 50 disposed inside the near-infrared shielding layer 18 is reduced. The energy absorbed by the near-infrared absorption layer 18A is converted into heat energy. That is, the near-infrared absorption layer 18A is heated. Since the temperature inside the autoclave does not rise above a predetermined temperature (e.g., 137°C for a Class B autoclave), the reflected heat dissipates to the outside from the back side 10B. On the other hand, since the heat generated in the near-infrared absorption layer 18A is insulated by the heat insulation layer 50, heat intrusion into the interior of the heat insulation layer 50 can be suppressed. Therefore, according to this modified example, the intrusion of near-infrared radiation from the outside can be suppressed. Furthermore, considering that the near-infrared absorption layer 18A is easily heated, the efficiency of sterilization of the surface of the flat plate terminal 102 can be improved by irradiating the flat plate terminal 102 with near-infrared rays during sterilization using an autoclave.

[0104] In addition, although Figure 13 An example of near-infrared countermeasures on the outer side of the insulation layer 50 is shown, but sometimes in Figure 3 The outer side of the heat insulation layer 60 shown is provided Figure 13 The near-infrared shielding layer 18 is shown. In this case, it is possible to prevent the components inside the heat insulation layer 60 from being heated by the near-infrared rays passing through the heat insulation layer 50.

[0105] In addition, such as Figure 14 As with the modified flat panel terminal 103 shown, sometimes the back surface 10B of the frame 10 is covered by a near-infrared absorbing layer 18C. Furthermore, although... Figure 14An enlarged view of the area surrounding the back surface 10B is shown, but with the entire frame 10 covered by the near-infrared absorbing layer 18C. The near-infrared absorbing layer 10C is made of the same material as the near-infrared absorbing layer 18A. In this case, the sterilization effect in the back surface 10B can be further improved.

[0106] Examples of materials constituting the near-infrared absorption layers 18A and 18C include films made of carbon black. Furthermore, films made of titanium oxide can be used as near-infrared reflective layers. When carbon black is incorporated into the near-infrared absorption layer 18C, from the perspective of suppressing damage from the carbon black, it is preferable to provide a surface protective film covering the near-infrared absorption layer 18C (e.g., see reference...). Figure 10 (Covering film 17).

[0107] In addition, Figure 13 and Figure 14 An example of a near-infrared countermeasure is shown, but various variations can be applied. For example, in Figure 14 The illustrated structure also includes examples where the near-infrared absorbing layer 18A is not provided. Alternatively, near-infrared absorbing materials such as carbon black can be mixed into the frame 10, making the frame 10 itself a near-infrared absorbing component. In this case, one or both of the near-infrared absorbing layers 18A and 18C can be omitted. Furthermore, there are cases where the near-infrared reflective layer 18B is provided between the near-infrared absorbing layer 18C and the frame 10. In this case, the near-infrared shielding layer 18 between the frame 10 and the heat insulation layer 50 can be omitted. However, in this case, the heat needs to be sufficiently absorbed by the near-infrared absorbing layer 18C before it can be transferred to the near-infrared reflective layer 18B.

[0108] This part utilizes Figure 13 and Figure 14 The various characteristic parts of the described structure, as Figure 3 The modified example of the tablet terminal 100 shown can be applied to electronic devices that do not have a heat dissipation mechanism 70, a heat dissipation mechanism 80, and a heat insulation layer 60.

[0109] <Display Section>

[0110] Next, regarding Figure 11 The heat insulation measures for the display unit 20 shown will be explained. For example... Figure 11 As shown, the display surface 22 of the display unit 20 protrudes from the frame 10. Furthermore, since the display surface 22 requires visible light transmittance, the choice of material is limited. The following describes a preferred structure of the display unit considering factors such as heat insulation, water resistance, heat resistance, pressure resistance, chemical resistance, and abrasion resistance. Figure 15 It means in Figure 11 An explanatory diagram illustrating an example structure of a transparent substrate having a display surface in a display section.

[0111] Figure 11 The display unit 20 shown includes a transparent substrate 23 having a display surface 22 and visible light transmittance (see reference). Figure 15 ).like Figure 15 As shown, the transparent substrate 23 includes multiple transparent resin layers 23A and a silica film layer 23B sandwiched between the multiple transparent resin layers 23A and containing multiple silica particles. The transparent resin layers 23A and the silica film layer 23B are alternately stacked. The transparent resin layers 23A have heat-resistant properties that do not deteriorate below the heat treatment temperature of an autoclave (e.g., 134°C). Furthermore, the silica film layer 23B has higher heat-insulating properties than the transparent resin layers 23A. In other words, the transparent substrate 23 has a stacked structure of a heat-insulating film and a heat-resistant film. This structure can suppress the intrusion of heat from the transparent substrate 23. Figure 15 As an example, the diagram shows a case where the transparent resin layer 23A has three layers and the silicon dioxide film layer 23B has two layers, but various variations can be applied. For example, as a minimal structure, there is a case where the transparent resin layer 23A has two layers and the silicon dioxide film layer 23B has one layer. Furthermore, the transparent resin layer 23A can have more than three layers, and the silicon dioxide film layer 23B can have more than two layers.

[0112] The silica film constituting the silica film layer 23B is a plate-shaped component capable of simultaneously achieving high transparency and high thermal insulation. The higher the proportion of silica in the silica film, the better the thermal insulation properties. However, on the other hand, the mechanical strength of the silica film is not high. In this embodiment, as... Figure 10 As shown, a recess 25 for accommodating the display unit 20 is formed in the frame 10 (more specifically, the front portion 11 of the frame 10). The display unit 20 is embedded in the recess 25 of the frame 10. In this configuration, the display unit 20 is supported by the frame 10. Therefore, even when pressure is applied to the display unit 20, deformation and functional degradation of the display unit 20 can be prevented.

[0113] Furthermore, in order to display images or videos on the display unit 20, the display unit 20 needs to be electrically driven. The electronic circuit component 40 for driving the display unit 20 (in this embodiment, it is...) Figure 4 The data processing component 41 shown is preferably disposed inside the heat insulation layer 60. Therefore, even if heat enters from the transparent substrate 23, the heat insulation layer 60 can block the heat.

[0114] In addition, Figure 1 In the example shown, unlike typical electronic devices such as tablets or smartphones, the size of the display surface 22 is the same as the front surface 10A of the frame 10 (see reference). Figure 3The area is less than half the total area. The reason for this is as follows: To reliably achieve a heat insulation structure against high temperatures during sterilization in a high-pressure steam sterilizer, the volume or thickness of the internal structure of the frame 10 where the display surface 22 is located is reduced. If the display surface 22 is enlarged, the thickness of that portion also increases, making it difficult to use. Therefore, by reducing the display surface 22, a robust heat insulation structure is established in the portion where the display surface 22 is not located, and electronic circuit components are housed within this portion to prevent heat buildup. However, with improvements in heat insulation technology and the heat resistance of electronic devices, it is expected that the tablet terminal 101 will become thinner and the display surface 22 larger, thus becoming easier to use. Therefore, the thickness of the tablet terminal 100, the size of the display surface 22, etc., are merely examples and are not limited to these examples.

[0115] in addition, Figure 16 The embodiment shown is another variation of the display unit 20. Figure 16 It is shown Figure 1 A plan view of a variant example. Figure 16 The tablet terminal 104 shown is Figure 1 The difference between the tablet terminal 100 shown is that it does not have Figure 1 The display unit 20 is shown. The tablet terminal 104 has a communication circuit 94 inside the housing 10 for wireless communication with external devices. When a command is input by touching the front surface 10A of the tablet terminal 100 with a finger or input tool, a signal corresponding to the command is output to the external display device 24 via the communication circuit 94. As a result, an image or video corresponding to the command is output to the display surface 22 of the display device 24. According to this variation, such as... Figure 16 As shown, since there is no display surface 22 exposed to the outside of the frame 10, the heat insulation structure of the frame can be enhanced.

[0116] This section utilizes Figure 10 , Figure 15 as well as Figure 16 The various characteristic parts of the described structure, as Figure 3 The modified example of the tablet terminal 100 shown can be applied to electronic devices that do not have a heat dissipation mechanism 70, a heat dissipation mechanism 80, and a heat insulation layer 60.

[0117] <Other variations>

[0118] Next, several representative modifications other than the above-described embodiments and various variations will be described. Figure 17 It is as a target Figure 3 A cross-sectional view of another variation of a portable information terminal device. Figure 17 The tablet terminal 105 shown is Figure 3The difference in the illustrated tablet terminal 100 is that the heat dissipation mechanism 70 and the heat dissipation mechanism 80 are thermally connected via a ceramic substrate (heat-conducting plate) 77. The ceramic substrate 77 contacts the heat-absorbing surface 71 of the heat dissipation mechanism 70 and the heat-dissipating surface 82 of the heat dissipation mechanism 80, respectively. Therefore, the thermal efficiency of releasing heat from the insulation layer 60 to the outside of the frame 10 is improved. Considering near-infrared heating countermeasures, the heat-conducting plate used for thermally connecting the heat dissipation mechanism 70 and the heat dissipation mechanism 80 is preferably made of a material other than metal. However, considering heat dissipation characteristics, a metal heat-conducting plate is sometimes used instead of the ceramic substrate 77.

[0119] Figure 18 It is shown as Figure 3 A cross-sectional view of another variation of a portable information terminal device. Figure 18 The tablet terminal 106 shown is Figure 3 The difference between the tablet terminal 100 shown is that it does not have Figure 3 The heat insulation layer 60 and the heat dissipation mechanism 70 are shown. When sufficient heat insulation can be achieved through the heat insulation layer 50 and the heat dissipation mechanism 70, sometimes these components may not be necessary. Figure 1 The heat insulation layer 60 is shown. In this case, the secondary battery 90 and the substrate 30 are preferably mounted on the heat absorption surface 71 of the heat dissipation mechanism 70.

[0120] Figure 19 It means Figure 8 An enlarged cross-sectional view of the periphery of the connection between the front and back portions shown. Figure 19 The connecting part 13B shown is Figure 8 The difference in the illustrated embodiment lies in the provision of a spacer 19 between the sealing material 16B and the screw 14. The spacer 19 is a cylindrical component integrally formed with either the front portion 11 or the back portion 12. Threads are formed on the inner wall of the spacer 19, allowing the screw 14 to be inserted along these threads. The spacer 19 is integrally formed with one of the front portion 11 and the back portion 12, and a portion of the spacer 19 contacts the other of the front portion 11 and the back portion 12. This spacer 19 serves as a spacer to prevent the sealing material 16B from being too thin. Furthermore, by providing the spacer 19, direct contact between the sealing material 16B and the screw 14 can be prevented. Additionally, in Figure 19 In the example shown, the spacer member 19 is integrally formed with the front portion 11 and contacts the back portion 12. Although the illustration is omitted, it serves as a reference... Figure 19 In some variations, the spacer 19 is integrally formed with the back portion 12 and contacts the front portion 11.

[0121] Figure 20 It means targeting Figure 19 An enlarged cross-sectional view of a modified example.Figure 20 In the modified example shown, the shape of the spacer 19A is similar to... Figure 19 The spacer member 19 shown is different. The spacer member 19A has a protrusion 19A1 at a position opposite to the back surface portion 12. Furthermore, the back surface portion 12 has a groove 12A at a position opposite to the spacer member 19A. When the spacer member 19A and the back surface portion 12 are in contact, the protrusion 19A1 is inserted into the groove 12A. In this modified example, with... Figure 19 Compared to the example shown, positioning accuracy in the Y direction can be improved. More specifically, according to this variation, it is possible to improve, including... Figure 1 The positioning accuracy in each direction within the XY plane, shown in the X and Y directions, is as follows. As a result, screw 14 can be easily inserted into the screw holes provided in the back part 12 and the front part 11.

[0122] Figure 21 It means targeting Figure 7 Enlarged cross-sectional view of the modified example. Figure 22 It means targeting Figure 4 A plan view of a variant example. Figure 22 Show settings Figure 7 The positions of the spacer 19B and the groove 12B are shown. (See reference...) Figure 19 and Figure 20 As explained, a spacer 19 is provided in the portion where the sealing material 16B is sandwiched between the front portion 11 and the back portion 12 (see reference). Figure 19 ) and spacer 19A (refer to Figure 20 This prevents the sealing material 16B from becoming too thick. Additionally, as... Figure 20 As shown, by providing a protrusion 19A1 at the front end of the spacer member 19A, which engages with the groove 12A of the back surface portion 12, the efficiency can be improved. Figure 1 The positioning accuracy shown includes the X and Y directions within the XY plane. The location of such spacer components 19 or 19A is not limited to the location of the insertion screw 14. Figure 21 In the example shown, a spacer 19B is provided in both connecting portion 15A and connecting portion 15B. The spacer 19B is integrally formed with one of the front portion 11 and the back portion 12, and a portion of the spacer 19B contacts the other of the front portion 11 and the back portion 12. Figure 21 In the example shown, a groove 12B is provided on the back surface 12 at a position opposite to the spacer member 19B. When the spacer member 19B and the back surface 12 are in contact, the front end portion of the spacer member 19B is inserted into the groove 12B.

[0123] exist Figure 21In the modified example shown, by providing the spacer 19B in the connecting portion 15B, the thickness of the sealing material 16B can be prevented from being too thin. Similarly, by providing the spacer 19B in the connecting portion 15A, the thickness of the heat insulation layer 50 can be prevented from being too thin. Furthermore, as... Figure 21 As shown, by engaging the spacer 19B with the groove 12B of the back surface portion 12, the efficiency can be improved. Figure 1 The positioning accuracy shown includes the X and Y directions in the XY plane.

[0124] Spacer component 19B and Figure 19 Unlike the spacer 19 shown, the spacer 19B does not have an inserted screw 14. Therefore, the shape of the spacer 19B is not particularly limited; for example, various shapes such as cylindrical or prismatic can be used. Furthermore, the shape of the groove 12B is defined by the shape of the spacer 19B. That is, since the front portion 11 and the back portion 12 need to be joined together by inserting the front end portion of the spacer 19B into the groove 12B, the shape of the groove 12B is such that the front end portion of the spacer 19B can be inserted and joined together. Furthermore, to provide the spacer 19B, the sealing material 16A and the heat insulation layer 50 preferably have through holes that allow the spacer 19B to be inserted.

[0125] like Figure 22 As shown in the plan view of the tablet terminal 100, multiple locations in the surrounding area are set... Figure 21 The spacer 19B and groove 12A shown enable high-precision alignment of the front portion 11 and the back portion 12 in the XY plane. For example... Figure 22 As shown in the plan view, when the tablet terminal 100 forms a quadrilateral, it is preferable to provide a spacer 19B and a groove 12A at the four corners where the sides of the tablet terminal 100 intersect. Furthermore, it is preferable to further provide the spacer 19B and groove 12A between the four corners. Additionally, when the four sides of the tablet terminal 100 have long and short sides, it is preferable to provide the spacer 19B and groove 12A at multiple locations along the long side. Although not shown in the figure, the spacer 19B and groove 12A are sometimes also provided... Figure 22 Locations other than those listed. For example, Figure 21 The spacer 19B and groove 12A shown are sometimes also provided Figure 8 In the connecting parts 13A and 13B shown.

[0126] The technologies described above will be used as representative examples, and the technical concepts used in the application of portable information terminal devices will be described as appendices.

[0127] [Postscript 1]

[0128] A portable information terminal device is available for use in medical settings where sterilization is performed using steam in a high-pressure steam sterilizer. The portable information terminal device includes:

[0129] A frame having a front side and a back side opposite to the front side;

[0130] The substrate is disposed within the internal space of the frame;

[0131] Electronic circuit components are mounted on the substrate;

[0132] A first thermal insulation layer is disposed along the frame; and

[0133] The first heat dissipation mechanism is capable of dissipating heat from the inner space of the first heat insulation layer to the outside of the frame.

[0134] [Appendix 2]

[0135] According to the portable information terminal device described in Appendix 1, the portable information terminal device further comprises:

[0136] A second heat insulation layer is configured to be separate from the first heat insulation layer and to surround the substrate and the electronic circuit components.

[0137] The second heat dissipation mechanism is capable of dissipating heat from the space surrounded by the second heat insulation layer to the space between the first heat insulation layer and the second heat insulation layer.

[0138] [Appendix 3]

[0139] According to the portable information terminal device described in Appendix 2, wherein...

[0140] The first heat dissipation mechanism has a first heat-absorbing surface exposed inside the first heat insulation layer, and a first heat-dissipating surface located on the opposite side of the first heat-absorbing surface and exposed outside the frame.

[0141] The second heat dissipation mechanism has a second heat-absorbing surface exposed inside the second heat insulation layer, and a second heat dissipation surface located on the opposite side of the second heat-absorbing surface and exposed outside the second heat dissipation layer.

[0142] [Appendix 4]

[0143] According to the portable information terminal device described in Appendix 3, wherein...

[0144] The first heat-absorbing surface and the second heat-dissipating surface are opposite to each other.

[0145] [Appendix 5]

[0146] The portable information terminal device according to any one of Appendices 1 to 4, wherein...

[0147] The frame includes: a front portion having the front side; a back portion located on the opposite side of the front portion; a support portion for fixing the front portion and the back portion by screws; and a peripheral connecting portion in the peripheral portion of the frame where the front portion and the back portion are connected to each other.

[0148] The first heat insulation layer is in contact with the inner surface of the frame.

[0149] The peripheral connection portion includes: a first connection portion, wherein the front portion and the back portion sandwich the first heat insulation layer and face each other; and a second connection portion, wherein the front portion and the back portion sandwich the first sealing material and face each other.

[0150] The second connecting portion is located further outward from the frame than the first connecting portion.

[0151] By the tightening force of the screws in the support portion, in the first connecting portion, the front portion and the back portion are fixed while the first heat insulation layer is sandwiched, and in the second connecting portion, the front portion and the back portion are fixed while the first sealing material is sandwiched.

[0152] [Appendix 6]

[0153] According to the portable information terminal device described in Appendix 5, wherein...

[0154] In the second connecting portion, at least one of the front surface in contact with the first sealing material and the back surface in contact with the first sealing material is roughened.

[0155] [Appendix 7]

[0156] According to the portable information terminal device described in Appendix 5, wherein...

[0157] The second connecting portion includes: a first opposing portion in a first direction parallel to the normal direction of the back surface, in which the front portion and the back surface face each other; and a second opposing portion in a second direction inclined at an angle other than orthogonal to the first direction, in which the front portion and the back surface face each other.

[0158] [Appendix 8]

[0159] According to the portable information terminal device described in Appendix 5, wherein...

[0160] The support portion includes: a third connecting portion, wherein the front portion and the back portion sandwich the first heat insulation layer and face each other; and a fourth connecting portion, wherein the front portion and the back portion sandwich the second sealing material and face each other.

[0161] The fourth connecting part is located further outward from the frame than the third connecting part.

[0162] In the third connecting part, the front part and the back part are fixed by the tightening force of the screws while the first heat insulation layer is sandwiched between them.

[0163] In the fourth connecting part, the front part and the back part are fixed by the tightening force of the screw while the second sealing material is sandwiched between them.

[0164] [Appendix 9]

[0165] According to the portable information terminal device described in Appendix 8, wherein...

[0166] The support portion further includes a stop portion disposed between the third connecting portion and the fourth connecting portion, which controls the positional deviation of the front portion and the back portion in a direction parallel to the back surface and in the normal direction of the back surface.

[0167] The stop portion has two or more surfaces that intersect each other.

[0168] With the front and back portions fixed, in the stop portion, the front and back portions are in direct contact on each of the two or more surfaces.

[0169] [Postscript 10]

[0170] According to the portable information terminal device described in Appendix 8, wherein...

[0171] In the fourth connecting portion, at least one of the front surface in contact with the second sealing material and the back surface in contact with the second sealing material is roughened.

[0172] [Postscript 11]

[0173] According to the portable information terminal device described in Appendix 8, wherein...

[0174] The support portion includes the screw and the screw sealing portion opposite to each other on the back side where a third sealing material is sandwiched.

[0175] In the screw seal, the surface on the back side that contacts the third sealing material is roughened.

[0176] [Postscript 12]

[0177] According to the portable information terminal device described in Appendix 5, wherein...

[0178] The frame has a covering film that covers the outer surfaces of the front and back portions.

[0179] At least the first sealing material of the peripheral connection portion and the screw are covered by the covering film.

[0180] [Postscript 13]

[0181] According to the portable information terminal device described in Appendix 8, wherein...

[0182] In the fourth connecting part, a spacer is provided between the second sealing material and the screw.

[0183] The spacer is integrally formed with either the front portion or the back portion and contacts the other.

[0184] [Appendix 14]

[0185] According to the portable information terminal device described in Appendix 1, wherein...

[0186] The first heat dissipation mechanism includes a Peltier element layer in which a plurality of Peltier elements are arranged.

[0187] [Postscript 15]

[0188] According to the portable information terminal device described in Appendix 14, wherein...

[0189] The power supply to the Perlite element layer is controlled by the electronic circuit components.

[0190] [Postscript 16]

[0191] According to the portable information terminal device described in Appendix 14, wherein...

[0192] The Perjet element layer is disposed inside the frame.

[0193] [Postscript 17]

[0194] According to the portable information terminal device described in Appendix 1, wherein...

[0195] It also has a near-infrared shielding layer disposed between the frame and the first heat insulation layer to prevent the intrusion of near-infrared rays.

[0196] The near-infrared shielding layer is a laminated film comprising a near-infrared absorption layer and a near-infrared reflection layer sequentially disposed from the frame side.

[0197] The near-infrared absorption layer has a higher near-infrared absorption characteristic than the frame, and the near-infrared reflective layer also has a higher near-infrared reflectivity than the frame.

[0198] [Postscript 18]

[0199] According to the portable information terminal device described in Appendix 1, wherein...

[0200] It also includes a display unit mounted on the front side of the frame, having a display surface exposed from the front side.

[0201] The display unit includes a transparent substrate having the display surface and being transmissive to visible light.

[0202] The transparent substrate includes multiple transparent resin layers and a silicon dioxide thin film layer sandwiched between the multiple transparent resin layers and containing multiple silicon dioxide particles.

[0203] The transparent resin layer has heat-resistant properties that do not deteriorate below the heating temperature of the high-pressure steam sterilization device.

[0204] The silica film layer has higher thermal insulation properties than the transparent resin layer.

[0205] [Postscript 19]

[0206] According to the portable information terminal device described in Appendix 18, wherein...

[0207] It also includes: a second heat insulation layer, configured to be separate from the first heat insulation layer and surround the substrate and the electronic circuit components; and a second heat dissipation mechanism capable of dissipating heat from the space surrounded by the second heat insulation layer to the space between the first heat insulation layer and the second heat insulation layer.

[0208] The electronic circuit components that drive the display are disposed within the second heat insulation layer.

[0209] [Postscript 20]

[0210] According to the portable information terminal device described in Appendix 18, wherein...

[0211] A recess for accommodating the display unit is formed in the frame.

[0212] The display portion is embedded in and held in the recess of the frame.

[0213] <Modifications applicable to electronic devices other than portable information terminal devices>

[0214] Furthermore, while the above description illustrates techniques particularly suitable for portable information terminal devices, these techniques are also applicable to various electronic devices other than portable information terminal devices. For example, utilizing... Figures 5 to 10 The technology involved in the thermal insulation and sealing structures described herein, or the utilization of Figure 2 , Figure 3 , Figure 11 , Figure 17 and Figure 18 The heat dissipation technology described herein is applicable to various electronic devices that undergo sterilization using an autoclave. In particular, the performance degradation due to heat and other factors is readily apparent in electronic devices containing semiconductor components with built-in processing circuitry. Therefore, applying the above technology to electronic devices with built-in semiconductor components with processing circuitry is effective. Examples of electronic devices to which the above technical concept applies can be illustrated below. That is, while autoclaving is currently impossible because some components contain electronic circuitry, the above technical concept is applicable to medical devices (in the healthcare field encompassing all living organisms, including humans, animals, and microorganisms) where it is desirable to achieve this.

[0215] The following will refer to Figures 23 to 25 This section describes a variation of the application to the oral camera 200, and refers to... Figures 26 to 28 This section describes a variation when applied to spotlight 300. Additionally, in... Figures 23 to 28 In this context, the labels attached to the components of an electronic device correspond to... Figure 3 The tablet terminal 100 shown or Figure 18 The reference numerals attached to the components of the tablet terminal 106 shown are as follows (the reference numerals for the components of the dental camera 200 are 200 series, and the reference numerals for the components of the spotlight 300 are 300 series). Therefore, detailed descriptions of components that are the same as those already described are omitted.

[0216] Figure 23 It is as a target Figure 1 The side view of the electronic device, namely the oral camera, shown as a modified example of the flat-panel terminal. Figure 24 Viewed from the lower surface side Figure 23 The diagram shows a plan view of an oral camera. Figure 25 It is along Figure 24 A cross-sectional view of the CC line. Figures 23 to 25 The oral camera 200 shown is a variation of an electronic device that can be used in a medical setting and is sterilized by water vapor in a high-pressure steam sterilizer.

[0217] Figures 23 to 25The shown oral camera 200 includes a frame 210, a substrate 230 disposed within the internal space of the frame 210, electronic circuit components 240 mounted on the substrate 230, a heat insulation layer 250 disposed along the frame 210, and a heat dissipation mechanism 270. Figure 25 In the example shown, the oral camera 200 also includes a heat insulation layer 260 and a heat dissipation mechanism 280. The heat insulation layer 260 is configured to be separate from the heat insulation layer 250 and surround the substrate 230 and electronic circuit components 240. The heat dissipation mechanism 280 is capable of dissipating heat from the space surrounded by the heat insulation layer 260 to the space between the heat insulation layer 250 and the heat insulation layer 260. The frame 210 includes a main body 210A and an extension 210B extending from the main body 210A. Figure 25 An example of an electronic circuit component 240 mounted on a substrate 230 is shown, comprising an IC chip 241 and an image capture device 242. The electronic circuit component 240 includes arithmetic processing circuitry. Various electronic components (electronic elements) are also housed within the internal space of the housing 210, in addition to the substrate 230 and the electronic circuit component. Examples of electronic components disposed within the internal space of the housing 210 are provided below. Figure 25 The diagram shows a charging coil 291, two secondary batteries 290, a light source element 202, a heat insulation layer 250, a heat insulation layer 260, a heat dissipation mechanism 270, and a heat dissipation mechanism 280. In the electronic components, the two secondary batteries 290 are disposed within the heat insulation layer 260. The charging coil 291 is disposed between the frame 210 and the heat insulation layer 250. However, the types, quantities, and layouts of the various electronic components are not limited to these specifications. Figure 25 The pattern shown can be modified in various ways to accommodate the heat resistance and environmental durability of each electronic component. For example, if the secondary battery 290 has high heat resistance, it can be disposed between the heat insulation layer 250 and the heat insulation layer 260.

[0218] An opening 201 is formed on the rear side of the front end of the extension 210B of the oral camera 200, and a camera lens 292 for taking pictures or capturing images, serving as an optical element or imaging element, is mounted in this opening 201. The camera lens 292 is optically connected to the image capture unit 242 through a transmission section 293 inserted into the interior of the extension 210B. The transmission section 293 can be formed of an optical fiber, such as glass fiber. In addition to the method of transmitting image or video information to the image capture unit via the camera lens 292 and optical fiber, the method of transmission using optical elements such as rod lenses or lens barrels is also effective.

[0219] In addition, Figure 25In the example shown, the oral camera 200 has a built-in light source element 202 within the housing 210. The light source element 202 is an optical element including a light source such as a light-emitting diode (LED) and serves as a source of light for illuminating the oral cavity. The light source element 202 is optically connected to the camera lens 292 via a light transmission section 203. The light transmission section 203 can be formed from an optical fiber, such as glass fiber, similar to the transmission section 293. Illumination light emitted from the light source element 202 reaches the camera lens 292 via the light transmission section 203 and illuminates the exterior of the oral camera 200 via the camera lens 292.

[0220] Although Figure 25 As a response Figure 3 The variations are illustrated, but they can be partially combined and utilized. Figures 1 to 22 Various embodiments are described as examples Figure 25 A modified example of the oral camera 200 shown. For example, using... Figures 5 to 11 or Figures 19 to 22 Any of the frames 10 described can be applied to the structure of the frame 210 of the oral camera 200. Additionally, for example, by... Figure 10 The cover film 17 of the tablet terminal 101 shown can be formed Figure 25 The structure covered by the frame 210 shown. Additionally, it can be... Figure 25 The oral camera 200 shown Figure 13 The structure of the tablet terminal 102 shown is as follows: Figure 14 The structure of the tablet terminal 103 shown is as follows: Figure 16 The structure of the tablet terminal 104 shown is as follows: Figure 17 The structure of the tablet terminal 105 shown, or Figure 18 The structure of the tablet terminal 106 shown is combined.

[0221] Figure 26 It is as a target Figure 18 The side view of the electronic device, i.e., the spotlight, is a modified example of the tablet terminal shown. Figure 27 Viewed from the lower surface side Figure 26 The diagram shows the plan view of the spotlight. Figure 28 It is along Figure 27 A cross-sectional view of the DD line. Figures 26 to 28 The spotlight 300 shown is a variation of an electronic device that can be used in a medical setting for sterilization by steam in a high-pressure steam sterilizer.

[0222] Figures 26 to 28The spotlight 300 shown includes a frame 310, a substrate 330 disposed in the internal space of the frame 310, electronic circuit components 340 mounted on the substrate 330, a heat insulation layer 350 disposed along the frame 310, and a heat dissipation mechanism 370. A switch 305 is mounted on the frame 310. Figure 28 An example of an IC chip 341 mounted on a substrate 330 as an electronic circuit component 340 is shown. In addition to the substrate 330 and the electronic circuit component 340, various electronic components (electronic elements) are also built into the interior space of the housing 310. Examples of electronic components disposed within the interior space of the housing 310 are shown below. Figure 28 The secondary battery 390, charging coil 391, light source element 302, heat insulation layer 350, and heat dissipation mechanism 370 are shown.

[0223] An opening 301 is formed on the back side of the front end of the frame 310 of the spotlight 300, and a light-illuminating lens 392 for illuminating light from the light source element 302 to the outside is fitted in the opening 301. The light-illuminating lens 392 is optically connected to the light source element 302 through a transmission section 303 inserted into the frame 310. The transmission section 303 may be formed of an optical fiber, such as glass fiber. The light-illuminating lens 392 and the charging coil 391 are disposed outside the heat insulation layer 350.

[0224] Furthermore, the IC chip 341 and the light source element 302 are respectively mounted on the substrate 330. The IC chip 341 and the light source element 302 are electrically connected via wiring (not shown) formed on the substrate 330. The switch 305 is electrically connected to the IC chip 341 on the substrate 330 via a transmission section 306. The transmission section 306 may be formed, for example, by a conductive cable such as an electric wire. The IC chip 341 includes a control circuit that controls the operation of the light source element 302 based on command signals from the switch 305.

[0225] As a response Figure 28 In a variation, the light source element 302 may be disposed near the light irradiation lens 392. In this case, the light source element 302 is not mounted on the substrate 330, but is electrically connected to the IC chip 341 via conductive cables such as wires (not shown).

[0226] The light source element 302 is an optical element equipped with a light source such as a light-emitting diode, and is used, for example, as a light source in dental treatment for curing resins that have the property of polymerizing upon irradiation with light. Furthermore, by adjusting the light output or frequency, the spotlight 300 can be used as a phototherapy device.

[0227] In addition, although Figure 28 As a response Figure 18 The variations are illustrated, but they can be partially combined and utilized. Figures 1 to 22Various embodiments described are applied to Figure 28 The example shown is a variation of the spotlight 300. For example, in the spotlight 300, it can be combined with... Figure 3 Similar to the tablet terminal 100 shown, a heat insulation layer is added around the substrate 330 to form a structure with a double heat insulation layer. Furthermore, for example, using... Figures 5 to 11 or Figures 19 to 22 Any of the frames 10 described can be applied to the structure of the frame 310 of the spotlight 300. Alternatively, for example, a structure made of... Figure 10 The tablet terminal 101 shown is covered by a cover film 17. Figure 28 The structure of the frame 310 shown. Additionally, it can be assembled. Figure 13 The structure of the tablet terminal 102 shown is as follows: Figure 14 The structure of the tablet terminal 103 shown, or Figure 17 The structure of the tablet terminal 105 shown is illustrated.

[0228] In addition to the above-described variations, the technology disclosed in this application can be applied to the following electronic devices.

[0229] When equipment is too large to be housed in an autoclave, the premise is that only frequently contaminated components can be disassembled and sterilized. For example, control panels are easily achievable. Alternatively, improvements to the equipment, such as miniaturizing other components to enable sterilization via autoclave, also fall into this category. This is because when such equipment is contaminated with highly pathogenic bacteria, in addition to sterilizable parts like those in an autoclave, it may be necessary to prevent the spread of infection using strong chemical solutions, gas sterilization, or incineration. Furthermore, medicine encompasses not only research on humans but also the health management and research of all living organisms, including animals and microorganisms, such as veterinary medicine, biology, gene therapy, genetic engineering, pharmacy, pharmaceutical manufacturing and drug formulation, as well as research on other infections.

[0230] 1. Control panels for large medical equipment (surgical robots, CT, MRI, PET, SPECT, scintillation scanning equipment, gamma cameras, angiography devices, mammography devices, X-ray imaging devices, ultrasound examination devices, 3D simulation medical equipment such as intestinal cell examination systems, gamma ray and other radiation irradiation devices, physical therapy equipment, physical therapy medical equipment, rehabilitation medical equipment, bathing medical equipment, beds, operating tables, pharmaceutical or drug dispensing and preparation equipment, etc.).

[0231] Large equipment is also listed in the various fields described later, and the same applies to this case.

[0232] 2. Medical examination equipment (all biological)

[0233] (2-A) Biological testing equipment

[0234] Medical devices used to examine the physiology, biochemistry, morphology, function, movement, load, tolerance, and response to stimuli or load of organisms (e.g., instruments for examining immunobiochemistry, urine, blood drugs, plasma proteins, coagulation, blood gases, etc.; bone density measuring devices; pulse oximeters; electroencephalogram (EEG) instruments; electrocardiogram (ECG) instruments; embedded ECG recorders; electromyography (EMG) instruments; cardiopulmonary function testing instruments; pulse wave testing instruments; respiratory metabolism measuring devices; respiratory function testing instruments; instruments for measuring various exhaled gases; thermometers; sphygmomanometers; endoscopes; capsule endoscopes; various cameras; miniature mirrors; bioinformatics monitoring instruments; health diagnostic equipment; muscle strength meters; fundus examination equipment; arteriosclerosis examination equipment; DPN examination equipment; sleep monitoring equipment; hearing examination equipment; visual acuity meters; dental scanners; and observation mirrors for various departments).

[0235] (2-B) Medical devices that examine samples or the environment, gases or toxins, or store such samples or information.

[0236] Not limited to humans or organisms, but also including equipment used for chemical, physical, physiological, pathological, clinical, and environmental examinations of all specimens related to health, disease, infection, and medical institutions or work and living environments (such as various chromatographic instruments, spectrometers, mass meters, volume meters, illuminometers, radiometers, non-destructive testing machines, routine equipment for all blood tests such as checking blood cell count / CRP / immunoluminescence / blood glucose levels, desymmetry analysis devices, clinical chemistry analysis devices, coagulation analysis devices, pathological tissue examination instruments, urine testing instruments, bacterial examination instruments, bacterial culture devices, centrifuges, thermometers and hygrometers, various gas detectors such as acetaldehyde gas, halitosis detectors, alcohol detectors, dental technician scanners, metal detectors, etc.).

[0237] 3. Diagnostic and recording related medical equipment

[0238] Medical devices that support medical and research judgments by integrating medical information from examinations or diagnoses.

[0239] 4. Equipment for the treatment, care, and disability assistance of living organisms (animals, microorganisms, etc.), including humans.

[0240] (4-A) Surgical equipment (e.g., navigation systems for various surgical procedures, various ablation therapy devices, intravascular ablation / stent implantation therapy devices / pacemakers / ICM / ICD / CRT-D / CRT-P / VAD / TRVR / TRVI and other catheter-related devices, high-frequency scalpels (high-frequency surgical devices), electric staplers, bipolar RFA systems, ultrasonic coagulation and cutting devices, Bessel sealing devices, microsurgical equipment, intraoperative 3D image monitoring systems, dental implant guidance systems, endoscopes, drills, anesthesia equipment, root canal treatment-related equipment, iontophoresis devices, photopolymerization lighting, etc.).

[0241] (4-B) Physiotherapy equipment (such as deep brain stimulation (DBS), spinal cord stimulation (SCS), ultrasound therapy, laser irradiation therapy, electromagnetic wave therapy, infrared therapy, acupuncture therapy, ultrasound fracture therapy, electrotherapy, etc.).

[0242] (4-C) Physical therapy equipment or exercise practice equipment (e.g., particle beam accelerator, inhaler, breathing trainer, massager, compression therapy device, rehabilitation therapy device, treadmill, force gauge, ultrasonic calibrator, etc.).

[0243] (4-D) Medical devices intended for quiet or fixed positions (such as biometric monitors, incubators, turning sensors, bed exit sensors, etc.).

[0244] (4-F) Medical devices that replace or assist the function or form of a living organism (e.g., artificial heart-lung machine, ventilator, oxygen concentrator, various infusion equipment, CPAP, ASV, oxygen concentrator, movement equipment that assists muscle contraction, cochlear implant, hearing aid, sleep aid, electric wheelchair, dental imaging-related equipment, dental CAD / CAM equipment, etc.).

[0245] (4-G) Medical devices used for sterilization, disinfection, cleaning, washing, storage or preservation, or for conducting experiments in biological enclosed spaces (e.g., low-temperature plasma sterilization systems, gas sterilization systems, ozone sterilizers, high-pressure steam sterilizers, suction devices, air purifiers, secondary water generators, liquid or detergent dischargers, medical refrigerators, insulated storage rooms, freezers, medical device cleaning machines, CPWS, electric toothbrushes, etc.).

[0246] (4-H) Medical devices that monitor ecological or environmental information, issue alarms, and transmit abnormal values ​​(e.g., clinical lie detectors, biological monitors, anemometers, ultrasonic blood flowmeters, activity meters, cell culture environment analyzers, etc.).

[0247] (4-I) Medical equipment that replaces or supports pharmaceutical manufacturing, dispensing or self-administering of medication, examinations, injections, meals, and various treatments (e.g., pharmaceutical manufacturing equipment, dispensing robots, automated tablet packaging machines, powder inspection systems, single-drug inspection support systems, injection drug payment systems, electronic balances, tablet pulverizers, salt meters, meal preparation systems, wiping carts, shampoo carts, waste disposal units, etc.).

[0248] 5. Medical equipment used to improve the level of protection against hygiene, nosocomial infection, and radiation exposure within medical institutions or affiliated institutions, including medical information management and storage, medical affairs and payments, appointments, communication, action sequence management, and environmental management (e.g., environmental radiation monitors, computers, keyboards, monitors, cash registers, automatic change machines, printers, fax machines, telephones, radio transceivers, mobile phones, uninterruptible power supplies, standby call ticketing systems, uniform sterilizers, various safety devices, barcode readers, individual identification devices, compressors, vacuum devices, air or water filters, water purifiers, electric toothbrushes, televisions, radios, etc.).

[0249] The examples of medical devices listed above are merely specific illustrations; devices with similar functions and forms are also included in this category.

[0250] 6. Equipment in research laboratories that requires sterilization overlaps with the above-mentioned equipment. For example, common laboratory equipment includes pure water systems, chromatographic analysis systems, mass analysis systems, structural and elemental analysis systems, organic synthesis systems, concentration systems, pumps, microbial testing systems, physical property measurement equipment, component analysis equipment, environmental analysis equipment, vibration stirring, pulverizing, and heating equipment, incubators, refrigeration and freezing equipment, cleaning, sterilization, and drying equipment, temperature and humidity control equipment, culture equipment, centrifuges, light absorption, emission, fluorescence, and correlation (RI) equipment, microscopes, imaging equipment, electrophoresis equipment, gene experimental equipment, protein experimental equipment, dispensing equipment, cell and tissue research equipment, electric pipettes, GBWS (Geometric Filter System), cleaning and ventilation fans, and gene experimental equipment, etc.

[0251] Related to gene research are gene experimental equipment such as single-cell analysis / nucleic acid extraction and purification devices / PCR / sequencing devices, electrophoresis devices / blotting / imaging related devices, structural analysis and elemental analysis devices, physical property / composition and other testing equipment, organic synthesis / concentration devices and pumps, etc.

[0252] In addition, a detailed description is provided of portable information terminal devices that can be sterilized by water vapor in a high-pressure steam sterilization device for use in medical settings. However, this applies to any electronic device that requires heat insulation, regardless of whether it is used in a medical setting.

Claims

1. An electronic device capable of use in a medical setting where sterilization is performed using steam within a high-pressure steam sterilization apparatus, the electronic device comprising: A frame having a front side and a back side opposite to the front side; The substrate is disposed within the internal space of the frame; Electronic circuit components are mounted on the substrate; A first heat insulation layer is provided along the frame; as well as The first heat dissipation mechanism is capable of dissipating heat from the inner space of the first heat insulation layer to the outside of the frame. A second heat insulation layer is configured to be separate from the first heat insulation layer and to surround the substrate and the electronic circuit components. The second heat dissipation mechanism is capable of dissipating heat from the space surrounded by the second heat insulation layer to the space between the first heat insulation layer and the second heat insulation layer. The first heat dissipation mechanism has a first heat-absorbing surface exposed inside the first heat insulation layer, and a first heat-dissipating surface located on the opposite side of the first heat-absorbing surface and exposed outside the frame. The second heat dissipation mechanism has a second heat-absorbing surface exposed inside the second heat insulation layer, and a second heat-dissipating surface located on the opposite side of the second heat-absorbing surface and exposed outside the second heat insulation layer.

2. The electronic device according to claim 1, wherein, The first heat-absorbing surface and the second heat-dissipating surface are opposite to each other.

3. The electronic device according to claim 1, wherein, The first heat dissipation mechanism includes a Peltier element layer in which a plurality of Peltier elements are arranged.

4. The electronic device according to claim 3, wherein, The power supply to the Perlite element layer is controlled by the electronic circuit components.

5. The electronic device according to claim 3, wherein, The Perjet element layer is disposed inside the frame.

6. The electronic device according to claim 1, wherein, The frame includes: a front portion having the front side; a back portion located on the opposite side of the front portion; a support portion for fixing the front portion and the back portion by screws; and a peripheral connecting portion in the peripheral portion of the frame where the front portion and the back portion are connected to each other. The first heat insulation layer is in contact with the inner surface of the frame. The peripheral connection portion includes: a first connection portion, wherein the front portion and the back portion sandwich the first heat insulation layer and face each other; and a second connection portion, wherein the front portion and the back portion sandwich the first sealing material and face each other. The second connecting portion is located further outward from the frame than the first connecting portion. By the tightening force of the screws in the support portion, in the first connecting portion, the front portion and the back portion are fixed while the first heat insulation layer is sandwiched, and in the second connecting portion, the front portion and the back portion are fixed while the first sealing material is sandwiched.

7. The electronic device according to claim 6, wherein, In the second connecting portion, at least one of the front surface in contact with the first sealing material and the back surface in contact with the first sealing material is roughened.

8. The electronic device according to claim 6, wherein, The second connecting portion includes: a first opposing portion in a first direction parallel to the normal direction of the back surface, in which the front portion and the back surface face each other; and a second opposing portion in a second direction inclined at an angle other than orthogonal to the first direction, in which the front portion and the back surface face each other.

9. The electronic device according to claim 6, wherein, The support portion includes: a third connecting portion, wherein the front portion and the back portion sandwich the first heat insulation layer and face each other; and a fourth connecting portion, wherein the front portion and the back portion sandwich a second sealing material and face each other. The fourth connecting part is located further outward from the frame than the third connecting part. In the third connecting part, the front part and the back part are fixed by the tightening force of the screws while the first heat insulation layer is sandwiched between them. In the fourth connecting part, the front part and the back part are fixed by the tightening force of the screw while the second sealing material is sandwiched between them.

10. The electronic device according to claim 9, wherein, The support portion further includes a stop portion disposed between the third connecting portion and the fourth connecting portion, which controls the positional deviation of the front portion and the back portion in a direction parallel to the back surface and in the normal direction of the back surface. The stop portion has two or more surfaces that intersect each other. With the front and back portions fixed, the front and back portions are in direct contact on each of the two or more surfaces in the stop portion.

11. The electronic device according to claim 9, wherein, In the fourth connecting portion, at least one of the front surface in contact with the second sealing material and the back surface in contact with the second sealing material is roughened.

12. The electronic device according to claim 9, wherein, The support portion includes the screw and the screw sealing portion opposite to each other on the back side where a third sealing material is sandwiched. In the screw seal, the surface on the back side that contacts the third sealing material is roughened.

13. The electronic device according to claim 6, wherein, The frame has a covering film that covers the outer surfaces of the front and back portions. At least the first sealing material of the peripheral connection portion and the screw are covered by the covering film.

14. The electronic device according to claim 9, wherein, In the fourth connecting part, a spacer is provided between the second sealing material and the screw. The spacer is integrally formed with either the front portion or the back portion and is in contact with the other.

15. The electronic device according to claim 1, wherein, The electronic device also includes: A near-infrared shielding layer is disposed between the frame and the first heat insulation layer to prevent the intrusion of near-infrared rays. The near-infrared shielding layer is a laminated film comprising a near-infrared absorption layer and a near-infrared reflection layer sequentially disposed from the frame side. The near-infrared absorption layer has higher near-infrared absorption characteristics than the frame, and the near-infrared reflective layer has higher near-infrared reflectivity than the frame.

16. The electronic device according to claim 1, further comprising: The display unit is mounted on the front side of the frame and has a display surface exposed from the front side. The display unit includes a transparent substrate having the display surface and being transmissive to visible light. The transparent substrate includes multiple transparent resin layers and a silicon dioxide thin film layer sandwiched between the multiple transparent resin layers and containing multiple silicon dioxide particles. The transparent resin layer has heat-resistant properties that do not deteriorate below the heating temperature of the high-pressure steam sterilization device. The thermal insulation properties of the silica film layer are higher than those of the transparent resin layer.

17. The electronic device according to claim 16, wherein, The electronic device further includes: a second heat insulation layer, configured to be separate from the first heat insulation layer and surround the substrate and the electronic circuit components; and a second heat dissipation mechanism capable of dissipating heat from the space surrounded by the second heat insulation layer to the space between the first heat insulation layer and the second heat insulation layer. The electronic circuit components that drive the display are disposed within the second heat insulation layer.

18. The electronic device according to claim 16, wherein, A recess for accommodating the display unit is formed in the frame. The display portion is embedded in and held in the recess of the frame.

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