Wafer inspection report file distribution method and system, electronic device, storage medium

Abstract

The present application relates to a kind of wafer detection report file distribution methods, it includes the following steps: configuration file collection directory and target distribution directory;And the same wafer detection report file corresponding file collection directory in the collection path is bound in the multiple target paths in the target distribution directory;Periodically according to the collection path download corresponding wafer detection report file;According to the number and file size of all downloaded wafer detection report file, corresponding file distribution application is distributed;The file distribution application is called according to the target path, and wafer detection report file is copied and distributed to corresponding multiple target report analysis system.Accordingly, the present application also provides a kind of wafer detection report file distribution system, electronic equipment, storage medium and computer program product.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor device manufacturing, and in particular to a wafer detection report file distribution method and system, an electronic device, a storage medium, and a computer program product. BACKGROUND

[0002] With the continuous reduction of the size of semiconductor manufacturing technology, the manufacturing process is also becoming more and more complex, and the manufacturing and packaging of wafers is a long and complex process involving hundreds of steps. These steps are not perfect every time, and contamination and material changes will combine into the process to cause wafer defects. Maintaining and improving the yield of the process and the product is crucial to the semiconductor industry. In the wafer manufacturing process, the factory needs to monitor each node. For example, before the wafer is shipped, the wafer is detected and measured, including whether there are defects on the wafer, and wafer acceptable test (WAT), wherein the defect detection determines whether the wafer is qualified, and the wafer acceptable test directly affects the wafer factory shipment efficiency. And these detection data or test data are usually written in the files generated by the machine, and the characteristics of these files are that the data file formats generated by different machines are different, the contents are different, the data volume is large, and there are hundreds of parameters to be tested each time. Each Die on the wafer is tested for hundreds of parameters, and the generated data file is extremely complex. If only the data is read and parsed to show the engineers, they will also feel helpless in the face of hundreds of parameters. Therefore, wafer foundries usually use a large number of report analysis systems to analyze the files generated by the machine.

[0003] At present, when the machine generates a wafer detection report file, the report file generated by the machine is usually transferred to other storage locations for storage, and when a report analysis system needs to be used, the report file is transferred to a specified location. On the one hand, since the data transfer is mostly processed in series according to the report analysis system, the original file needs to be read multiple times each time, which is very wasteful of IO, and for report analysis systems with high time efficiency requirements, it is difficult to meet the demand. On the other hand, when multiple report analysis systems need to share the same report file at the same time, the multiple report analysis systems all need to download the corresponding report file from the machine, which will greatly increase the load of the machine corresponding to the report file, thereby affecting the normal operation of the machine (for example, causing lag, etc.), and further affecting the normal production and manufacturing of the wafer, and even causing wafer defects and leading to a decrease in wafer yield. SUMMARY

[0004] The purpose of the present application is to provide a wafer detection report file distribution method and system, which partially solves or alleviates the above-mentioned deficiencies in the prior art, reduces the load of the machine to a certain extent, and ensures the normal operation of wafer manufacturing.

[0005] Beneficial effects: The present application binds multiple target paths corresponding to the same wafer detection report file with the acquisition path, then downloads the corresponding wafer detection report file according to the acquisition path, and distributes the wafer detection report file according to the corresponding target path, so that when multiple report analysis systems need the same wafer detection report file, it only needs to be read and downloaded once, and then copied and distributed to each report analysis system in parallel. Compared with the prior art, the load of the machine is greatly reduced, the normal operation of the machine is ensured, the production efficiency and yield of wafer manufacturing are improved, and the normal production of wafers and the defect detection process are avoided. The normal operation of the machine is affected due to the excessive load of the machine, and the process of defect detection is affected. Since the report file does not need to be stored multiple times, and the report file does not need to be read multiple times, each report analysis system can quickly obtain the wafer detection report file, which improves the distribution efficiency of the report file, and periodically obtains the report file for distribution, so that the requirement of each report analysis system for timeliness can be met to a certain extent. At the same time, the concurrent processing mode is adopted, which saves IO resources compared with the serial sending mode of the report file. BRIEF DESCRIPTION OF DRAWINGS

[0006] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual proportion. Obviously, the drawings described below are some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creating any inventive labor.

[0007] Figure 1 A flowchart of a wafer detection report file distribution method for an exemplary embodiment of the present application;

[0008] Figure 2 A functional module diagram of a wafer detection report file distribution system for an exemplary embodiment of the present application;

[0009] Figure 3 A wafer detection report file distribution example diagram for an exemplary embodiment of the present application;

[0010] Figure 4 Fig. 2 is a schematic diagram of a file collection directory for an exemplary embodiment of the present application;

[0011] Figure 5 Fig. 3 is a schematic diagram of a target distribution directory for an exemplary embodiment of the present application;

[0012] Fig. 6 is a schematic diagram of a target distribution directory for another exemplary embodiment of the present application. DETAILED DESCRIPTION

[0013] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0014] In this document, the suffixes such as "module", "part" or "unit" used for an element are merely intended for facilitating description of the present application, and are by no means specific. Therefore, "module", "part" or "unit" can be mixedly used.

[0015] In this document, the terms "upper", "lower", "inner", "outer", "front", "back", "one end", "the other end" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are merely for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0016] In this document, unless otherwise explicitly specified and limited, the terms "mount", "provided with", "connected" and the like should be understood broadly, for example, "connected" can be fixed connection, can also be detachable connection, or integral connection; can be mechanical connection, can be direct connection, can also be indirect connection through an intermediate medium, can be the communication inside two elements. For a person of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0017] The wafer detection report file refers to a report file including wafer-related analysis data generated by a corresponding machine during detection of a wafer in each process step in the wafer production process. For example, a report file including wafer defect data obtained by a wafer detection machine during defect detection of a wafer. Correspondingly, one wafer corresponds to one report file. Generally, the formats of report files generated by different machines are different.

[0018] The wafer detection report file refers to data obtained by corresponding machines during corresponding detection of a wafer in each process step in the entire wafer production process, and the data is stored in the form of a report. Of course, multiple detection report files (or a batch of wafer detection report files) generated by the same machine are stored in the same path, and the wafer detection report files in the same path are updated in real time.

[0019] The acquisition path refers to the source address of the wafer detection report file, for example, storage in the machine.

[0020] The target path refers to the address of the target of the wafer detection report file to be distributed, for example, storage of a target report analysis system or other designated storage.

[0021] Embodiment 1: see Figure 1 The flowchart of a wafer detection report file distribution method according to an exemplary embodiment of the present application, specifically, the method comprises the steps of:

[0022] S101, configure a file acquisition directory and a target distribution directory, and bind and store the file acquisition directory and the target distribution directory.

[0023] In some embodiments, the file acquisition directory includes: an acquisition path of each wafer detection report file; correspondingly, the target distribution directory includes: a plurality of target paths corresponding to each wafer detection report file. Wherein, at least one wafer report file of the same type is stored in each acquisition path; and each target path corresponds to a report analysis system.

[0024] In some embodiments, binding the file acquisition directory and the target distribution directory refers to binding the acquisition path of each wafer detection report file and the corresponding target distribution path, or in other words, constructing a mapping relationship between the acquisition path of each wafer detection report file and the corresponding at least one target distribution path.

[0025] For example, see Figure 4According to each link involved in the wafer production manufacturing process, the file collection directory is configured in advance. When n detection links are involved in the whole process, n collection paths: URL11, URL12, URL13, URL14, ···, URL1n are configured in the file collection directory correspondingly, wherein a plurality of wafer detection report files of the same type generated by the corresponding detection link are stored under each collection path URL1i (i = 1, 2, ···, n).

[0026] For example, referring to FIG. 5, the file collection directory is configured according to the wafer detection report files generated by each detection link involved in the wafer production manufacturing process. When n detection links are involved in the whole process, n collection paths: URL11, URL12, URL13, URL14, ···, URL1n are configured in the file collection directory correspondingly, wherein a plurality of wafer detection report files of the same type generated by the corresponding detection link are stored under each collection path URL1i (i = 1, 2, ···, n). Figure 5

[0027] In some cases, since multiple report analysis systems need the same wafer detection report file (or the same type of wafer detection report file), the above collection path and the corresponding target path need to be bound according to the wafer detection report file required by each report analysis system (or the type of wafer detection report file required), that is, the mapping relationship between the collection path and the corresponding target path is constructed.

[0028] For ease of understanding, referring to FIG. 6, the presentation form after the collection path and the corresponding target path are bound is shown: for example, since only one report analysis system needs the wafer detection report file under the collection path URL11, the collection path URL11 is bound with the target path URL21 corresponding to the report analysis system; since two report analysis systems need the wafer detection report file under the collection path URL12, the collection path URL12 is bound with the corresponding target paths URL21, URL22, URL24; similarly, the collection path URL13 is bound with the target path URL23, the collection path URL14 is bound with the target path URL24, and so on. Of course, the specific presentation form of the bound collection path and target path can be adjusted or changed according to actual needs.

[0029] S102, periodically downloading a plurality of wafer detection report files corresponding to the collection paths.

[0030] In some embodiments, the system downloads the wafer detection report files corresponding to the collection paths through the file microservice.

[0031] ​In some embodiments, the "periodically" means periodically downloading according to a preset time interval, and the specific time interval can be adjusted according to actual needs. Of course, if the time interval is very short, it can also be considered as real-time downloading. Of course, a corresponding download record will be generated each time the download is performed, or recorded in the corresponding system log.

[0032] In some embodiments, since the wafer detection report files in the machine are generated in real time during the wafer production and manufacturing process, the plurality of wafer detection report files under the collection path are also updated continuously.

[0033] In some embodiments, when updating, it is automatically determined whether the plurality of wafer detection report files under the collection path have been downloaded. If the plurality of wafer detection report files have been downloaded, the new wafer detection report files will overwrite the old wafer detection report files. If the plurality of wafer detection report files have not been downloaded, the new wafer detection report files will be appended to the collection path, and the old wafer detection report files that have not been downloaded will be retained, thereby saving storage space and resources.

[0034] S103, assigning corresponding file distribution applications according to the number and file size of the downloaded wafer detection report files.

[0035] In some embodiments, the step S103 specifically includes the steps of: sorting the downloaded wafer detection report files in descending order according to the file size; and sequentially assigning the wafer detection report files from the first order to the plurality of pre-configured file distribution applications.

[0036] Since the wafer detection report files generated by different machines are of different types and different sizes, in order to ensure a certain degree of balance between the sizes of the wafer detection report files allocated to each file distribution application, the files are allocated to the file distribution applications in order from large to small according to file size. For example, there are 10 wafer detection report files and 3 file distribution applications are pre-configured, so the 10 wafer detection report files are first sorted in order from large to small according to file size, and then the first order is allocated to the corresponding file distribution application, and so on until all wafer detection files are allocated to the corresponding file distribution application. For example, the first to third wafer detection files are allocated to the three file distribution applications app1, app2, and app3 in order, then the fourth to sixth wafer detection files are allocated to the three file distribution applications app1, app2, and app3 in order, and then the seventh to ninth wafer detection files are allocated to the three file distribution applications app1, app2, and app3 in order; finally, the last wafer detection report file is allocated to the first file distribution application app1, or the app3 that always allocates the smallest file among the three file distribution applications. That is, according to the pre-configured number of file distribution applications, each wafer detection report file is allocated to a file distribution application in order from the first order, and when each file distribution application has allocated a wafer detection report file, each wafer detection report file is allocated to a corresponding file distribution application in order from the first order of the remaining unallocated wafer detection report, and so on until the last wafer detection report file is allocated.

[0037] In some embodiments, since each file distribution application is configured with a corresponding configuration limit, during the file allocation process, for example, before each wafer detection report file is allocated to a corresponding file distribution application, it is necessary to determine whether the current file distribution application has exceeded the load according to the configuration parameters and the allocated amount of the current file distribution application. Specifically, it is determined whether the allocated amount of the current file distribution application exceeds the first configuration limit or the second configuration limit; if it exceeds, no new wafer detection report file is allocated to the current file distribution application, and if it does not exceed, a new wafer detection report file is allocated to the current file distribution application.

[0038] In some embodiments, since each file distribution application is configured with a corresponding configuration limit, during the file allocation process, for example, before each wafer detection report file is allocated to a corresponding file distribution application, it is necessary to determine whether the current file distribution application has exceeded the load according to the configuration parameters and the allocated amount of the current file distribution application. Specifically, it is determined whether the allocated amount of the current file distribution application exceeds the first configuration limit or the second configuration limit; if it exceeds, no new wafer detection report file is allocated to the current file distribution application, and if it does not exceed, a new wafer detection report file is allocated to the current file distribution application.

[0039] In some embodiments, the assigned quota refers to the number of wafer inspection report files that the file distribution application has assigned (or has received) or the total file size of all wafer inspection report files that the file distribution application has assigned (or has received).

[0040] In other embodiments, as previously described, since the configuration parameters of each file distribution application are configured, it is necessary to determine whether all current file distribution applications can carry the current copy distribution service of all wafer inspection report files according to the number and file size of the wafer inspection report files and the configuration parameters of the file distribution applications, that is, to determine whether the current file distribution applications can carry the current report distribution service (see step S105 in the method). Figure 1 If not, the temporary service application is started to perform the file copy distribution service; if yes, step S104 is performed. Specifically, it is determined whether the assigned quotas of all file distribution applications have exceeded the first configuration limit or the second configuration limit (for example, the number of wafer inspection report files received by each file distribution application exceeds the preset first configuration limit, or the total file size of all wafer inspection report files received by each file distribution application exceeds the preset second configuration limit); if yes, the temporary service application is started to perform the file copy distribution service, and the corresponding temporary service application is assigned according to the number and file size of the wafer inspection report files that have not been assigned, and the assignment principle is the same as that of assigning each wafer inspection report file to each file distribution application, which will not be described here.

[0041] For example, according to the file size, the unassigned wafer inspection report files are sorted from large to small, and then the corresponding temporary service application is sequentially assigned from the first order.

[0042] For another example, it is determined whether any temporary service application is overloaded according to the first configuration limit and the second configuration limit: it is determined whether the assigned quota of any temporary service application exceeds the preset first configuration limit or the second configuration limit; if yes, no new wafer inspection report file is assigned to the temporary service application.

[0043] For another example, it is determined whether all currently started temporary service applications can carry all unassigned wafer inspection report file copy distribution services according to the first configuration limit and the second configuration limit; if not, the wafer inspection report files that cannot be carried are marked for the next assignment.

[0044] S104, the corresponding file distribution application is called to copy and distribute the wafer inspection report file to the corresponding multiple target report analysis systems according to the target path corresponding to each wafer inspection report file.

[0045] In some embodiments, when a wafer detection report file is assigned to a corresponding file distribution application, the corresponding wafer detection report file is copied and distributed to the corresponding target report analysis system by the file distribution application. Since the distribution is by copying, the corresponding number of copies is directly distributed according to the number of all target report analysis systems sent, so there is no need to store the original detection report file multiple times; on the other hand, if the target report analysis system requires the wafer detection report file to be redistributed due to loss of data files or other reasons (for example, feedback to the corresponding file distribution application with a resend request), the file distribution application directly sends the corresponding target report analysis system again according to the downloaded wafer report file, which greatly improves the processing efficiency of redistribution and saves system resources. In the traditional way, the entire collection and distribution task needs to be executed again, that is, the wafer detection report file needs to be collected again and then distributed to each report analysis system, which leads to the inability to quickly realize redistribution, thereby reducing the processing efficiency of redistribution and wasting certain system resources.

[0046] In other embodiments, when a wafer detection report file is assigned to a temporary service application, the corresponding wafer detection report file is copied and distributed to the corresponding target report analysis system by the temporary service application.

[0047] The distribution of the wafer detection report file in the method of the present exemplary embodiment will be described in detail below with reference to specific examples.

[0048] Referring to Figure 3 , the pre-configured file distribution applications in the system have a total of 3: app1, app2, app3, and each file distribution application has corresponding configuration parameters: a maximum of 3 files can be processed (i.e. the first configuration limit), and the total size of the files that can be processed is 4G (i.e. the second configuration limit); the pre-configured temporary service applications have a total of 2: temp1, temp2, and each temporary service application has the same configuration parameters as the file distribution application, i.e. a maximum of 3 files can be processed, and the total size of the files that can be processed is 4G; and there are currently a total of 15 wafer detection report files, which are sorted in descending order of file size: file1 (3G), file2 (2G), file3 (2G), file4 (2G), file5 (1G)-file15 (1G).

[0049] The specific allocation process of the 15 wafer detection report files is as follows:

[0050] Since the maximum value (ceiling (the number of files to be allocated / app configuration file number), ceiling (total size of files to be allocated / app configuration processing size)) = max (ceil (15 / 3), ceil (20 / 4)) = 5 > the number of pre-configured file distribution applications 3, all file distribution applications app are started, and all wafer detection report files to be allocated are sequentially allocated to the three file distribution applications from the first wafer detection report file in the order:

[0051] File 1 (3G), file 2 (2G), file 3 (2G) are sequentially allocated to app1, app2, app3;

[0052] File 4 (2G), file 5 (1G), file 6 (1G) are sequentially allocated to app1, app2, app3; wherein, since the total size of files allocated by app1 is 5G, which exceeds the preset second configuration limit 4G, no new file is allocated to app1;

[0053] File 7 (1G), file 8 (1G) are sequentially allocated to app2, app3; wherein, the total number of files allocated by app2 and app3 is 3, which reaches the preset first configuration limit 3, so no new file is allocated to app2 and app3.

[0054] But at this time there are still 7 files totaling 7G that have not been allocated, and a temporary service application temp will be started to process the files. Since the maximum value (ceiling (the number of remaining unallocated files / app configuration file number), ceiling (total size of remaining unallocated files / app configuration processing size)) = max (ceil (7 / 3), ceil (7 / 4)) = 3 > the number of pre-configured temporary service applications temp 2, two temporary service applications temp are started:

[0055] File 9 (1G), file 10 (1G) are sequentially allocated to temp1, temp2;

[0056] File 11 (1G), file 12 (1G) are sequentially allocated to temp1, temp2;

[0057] File 13 (1G), file 14 (1G) are sequentially allocated to temp1, temp2; wherein, the total number of files allocated by temp1 and tmp2 is 3, which reaches the preset first configuration limit, so no new wafer detection report file will be allocated to temp1 and temp2.

[0058] Therefore, all applications (including app and temp app) no longer receive new wafer detection report files, and the remaining unassigned wafer detection report files 15 (1G) will be skipped this time and wait for the next time to be downloaded again to new wafer detection report files for distribution together. The distribution principle is the same and will not be repeated here.

[0059] After distribution according to the above distribution principle, since the size difference of each file is not large, and the data processing of each application is the same, it can be known that app1 will finally process a 5G file, app2 will process a 4G file, app3 will process a 4G file, and temp1 and temp2 will each process a 3G file. Therefore, the file size corresponding to all applications reaches a certain degree of balance, avoiding the situation that one or part of the application needs to process a larger file, while another or another part of the application processes a smaller file, or the file processing capacity of some applications is not reasonably arranged, thereby reducing the efficiency of file distribution. For example, if file 1 and 2 are assigned to app1 for processing, file 3 and 4 are assigned to app2, and file 5, 6, and 7 are assigned to app3, app1 will process 5G, and app3 will process 3G. Among them, app1 needs to process 5G, while app3 only needs to process 3G, which is less than the second configuration limit of 4G. That is to say, under the premise that app1 is overloaded and the data processing capacity of app2 is fully utilized, the data processing capacity of app3 is not fully utilized. Of course, this is only an example, and in actual engineering applications, there are many types of report files, and the file size also varies more. Therefore, it is very important to make the best use of the data processing capacity of each file distribution application in this case, because it will directly affect the efficiency of report analysis by each report analysis system, thereby affecting the detection efficiency of each link in the wafer production and manufacturing process, and further affecting the generation efficiency and yield of wafers.

[0060] Generally, the total number of files to be distributed is in the thousands, which is much larger than the number of file distribution applications configured by the system. Therefore, when distributing, the wafer detection report files are usually first distributed to each file distribution application, and then the number of temporary service applications to be started is determined according to the number and size of the remaining wafer detection report files. Of course, if the total number of files to be distributed is less than the number of file distribution applications, the corresponding number of file distribution applications will be started, and each wafer detection file will be assigned to a file distribution application.

[0061] The exemplary method of the present application binds a file collection directory and a distribution target directory in advance, so that only the wafer detection report file to be analyzed needs to be downloaded to the corresponding collection path (for example, storage in the machine), and then the downloaded wafer detection report file is copied and distributed in parallel to the target report analysis system matched with the corresponding multiple target paths. In the whole process, only one reading from the collection path is needed, multiple data transfer is not needed, and multiple target report analysis systems do not need to read from the machine, which greatly reduces the load of the machine. When the file is downloaded, it is copied and distributed in parallel according to the number of target report analysis systems, which greatly improves the efficiency of the target report analysis system to obtain the file compared with the multiple transfer and serial sending mode. That is, the exemplary embodiment is more suitable for scenarios with certain time efficiency requirements. On the other hand, since the file distribution application app is used for downloading and distributing the file, there is no need to make large-scale changes to the existing production environment and hardware device layout.

[0062] Embodiment 2: see Figure 2 The present application provides a wafer detection report file distribution system, specifically, the system comprises:

[0063] a database for storing data;

[0064] a first configuration module for configuring a file collection directory and a target distribution directory, and binding the collection path of each wafer detection report file in the file collection target and the corresponding at least one target path in the target distribution directory, and storing them in the database;

[0065] a second configuration module for configuring the configuration parameters of the file distribution application and the temporary service application; the configuration parameters include: a first configuration limit representing the maximum number of files that the file distribution application or the temporary service application can handle each time; and a second configuration limit representing the maximum file size that the file distribution application or the temporary service application can handle each time;

[0066] a file acquisition module for periodically downloading wafer detection report files according to the collection path in the file collection directory;

[0067] a file distribution master module for assigning a corresponding file distribution application module according to the number and size of the wafer detection report files downloaded by the file acquisition module, and calling the file distribution application module to distribute the wafer detection report files to the corresponding target report analysis system according to the corresponding target path;

[0068] a file distribution application module for distributing the wafer detection report file to the corresponding target report analysis system according to the target path.

[0069] In some embodiments, the file distribution master module comprises:

[0070] a file sorting unit configured to sort all the wafer inspection report files downloaded in descending order according to file size of each wafer inspection report file;

[0071] a file copy distribution unit configured to distribute all the wafer inspection report files to each of the file distribution applications in sequence from the wafer inspection report file in the first order until all the wafer inspection files are distributed.

[0072] In some embodiments, the wafer inspection report file distribution system further comprises a first service master module configured to determine whether any file distribution application is overloaded according to the first configuration limit or the second configuration limit, and control the file distribution master service module to stop distributing new wafer inspection report files to the any file distribution application when it is determined that the any file distribution application is overloaded. Specifically, the first service master module is configured to determine whether the distribution amount of any file distribution application exceeds the first configuration limit or the second configuration limit, and control the file distribution master service module to stop distributing new wafer inspection report files to the any file distribution application when it is determined that the distribution amount of the any file distribution application exceeds the first configuration limit or the second configuration limit.

[0073] In some embodiments, the wafer inspection report file distribution system further comprises a second service master module configured to determine whether all the file distribution applications preconfigured can carry the copy distribution service of all the wafer inspection report files downloaded currently, and start the temporary service application preconfigured to carry the copy distribution service when it is determined that all the file distribution applications preconfigured cannot carry the copy distribution service. Specifically, the second service master module is configured to determine whether the distribution amount of all the file distribution applications exceeds the first configuration limit or the second configuration limit, and start the temporary service application to carry the file copy distribution service and control the file distribution master service module to distribute the corresponding temporary service application according to the number and file size of the wafer inspection report files not distributed when it is determined that the distribution amount of all the file distribution applications exceeds the first configuration limit or the second configuration limit.

[0074] In some embodiments, the wafer inspection report file distribution system further comprises a third service master module configured to determine whether the distribution amount of any temporary service application exceeds the first configuration limit or the second configuration limit pre-set, and control the file distribution master service module to stop distributing new wafer inspection report files to the any temporary service application when it is determined that the distribution amount of the any temporary service application exceeds the first configuration limit or the second configuration limit pre-set.

[0075] In some embodiments, the wafer detection report file distribution system further comprises a fourth service master module for judging whether all temporary service applications can carry all unassigned wafer detection report file copy distribution services; if not, marking the wafer detection report files that cannot be carried for distribution in the next round.

[0076] Also used for judging whether the file distribution application module can carry the distribution services of all wafer detection report files currently acquired, and if not, starting the temporary service module to carry out the distribution services.

[0077] In a fourth aspect, the present application provides an electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the method described above when executing the program. For ease of illustration, only the parts related to the embodiments of the present application are shown, and the specific technical details not disclosed are described with reference to the method part of the embodiments of the present application. The electronic device can be any electronic device, including a PC computer, a network cloud server, even a mobile phone, a tablet computer, a PDA (Personal Digital Assistant), a POS (Point of Sales), a vehicle-mounted computer, a desktop computer, etc.

[0078] Specifically, the bus can include any number of interconnecting buses and bridges, which link various circuits including one or more processors represented by the processor and memory represented by the memory. The bus can also link various other circuits such as peripheral devices, voltage stabilizers, and power management circuits, which are well known in the art, and thus, are not further described herein. The communication interface provides an interface between the bus and a receiver and / or transmitter, which can be separate independent receivers or transmitters or the same element such as a transceiver, providing a unit for communicating with various other devices over a transmission medium. The processor is responsible for managing the bus and general processing, while the memory can be used for storing data used by the processor in performing operations.

[0079] From the above description of the embodiments, those skilled in the art can easily understand that the example embodiments described herein can be implemented by software, or by software in combination with necessary hardware. Therefore, the technical solutions according to the embodiments of the present application can be embodied in the form of a software product, which can be stored in a computer readable storage medium (which can be a CD-ROM, a U disk, a mobile hard disk, etc.) or a network, and includes a number of instructions to make a computing device (which can be a personal computer, a server, or a network device, etc.) execute the above-mentioned method according to the embodiments of the present application.

[0080] The computer readable medium can include a data signal transported over a carrier wave and can be baseband or propagated along with carriers. The program code embodied on the computer readable medium can be transmitted using any appropriate medium, including but not limited to wireless, wired, optical fiber cable, RF, and the like, or any suitable combination of the foregoing.

[0081] The program code can be written in any combination of one or more programming languages, including an object oriented programming language such as Java, C++, or the like, and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code can execute entirely on the user's computing device, partly on the user's computing device, as a stand-alone software package, partly on the user's computing device and partly on a remote computing device or entirely on the remote computing device or server. In the latter scenario, the remote computing device can be connected to the user's computing device through any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection can be made to an external computing device, such as through the Internet using an Internet Service Provider.

[0082] The computer readable medium described above carries one or more programs, when the one or more programs are executed by the device, the computer readable medium realizes the following functions: configuration file collection directory and target distribution directory; wherein the file collection directory includes an acquisition path corresponding to each wafer detection report file; the target distribution directory includes a plurality of target paths corresponding to each wafer detection report file; binding the acquisition path corresponding to the same wafer detection report file and the corresponding plurality of target paths; periodically downloading a plurality of wafer detection report files according to the acquisition path; allocating a corresponding file distribution application according to the number and file size of all wafer detection report files; calling the file distribution application to copy and distribute the wafer detection report file to a corresponding plurality of report analysis systems according to the target path.

[0083] Those skilled in the art can understand that the above-mentioned modules can be distributed in the device according to the description of the embodiment, and can also be changed in one or more devices different from the embodiment. The modules of the above-mentioned embodiment can be combined into one module, or can be further split into a plurality of sub-modules.

[0084] Through the description of the above embodiments, those skilled in the art can clearly understand that the above-mentioned example methods can be realized by means of software and a necessary general hardware platform, and of course, can also be realized by hardware, but in many cases, the former is a better embodiment. Based on such understanding, the technical solutions of the present application can be embodied in the form of a software product in essence or in the form of a part of the prior art that contributes to the present application. The computer software product is stored in a storage medium (such as a ROM / RAM, a magnetic disk, or an optical disk) and includes a plurality of instructions for causing a computer terminal (which can be a mobile phone, a computer, a server, or a network device, etc.) to execute the methods described in the various embodiments of the present application.

[0085] It should be noted that in this document, the terms "comprising", "including", or any other variant thereof are intended to cover non-exclusive inclusions, so that a process, method, article, or device that includes a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent to such a process, method, article, or device. Without more limitations, the element defined by the statement "including a" does not exclude the presence of other identical elements in the process, method, article, or device that includes the element.

[0086] The embodiments of the present application are described above in combination with the drawings, but the present application is not limited to the above specific embodiments, and the above specific embodiments are only illustrative and not restrictive. Those skilled in the art can make many forms under the inspiration of the present application without departing from the scope of the present application and the scope of protection of the claims, and these are all within the protection of the present application.

Claims

1. A method for distributing wafer inspection report files, characterized in that, Including the following steps: The configuration file includes a data acquisition directory and a target distribution directory. The data acquisition directory includes the acquisition path corresponding to each wafer inspection report file. The target distribution directory includes multiple target paths corresponding to each wafer inspection report file. The wafer inspection report file refers to the data obtained from various stages of the wafer manufacturing process, where corresponding equipment is used to perform inspections on the wafer, and this data is stored in report form. The acquisition path refers to the source address of the wafer inspection report file. The target path refers to the address of the destination where the wafer inspection report file will be distributed. Bind the acquisition path corresponding to the same wafer inspection report file to the corresponding multiple target paths; Multiple wafer inspection report files are periodically downloaded according to the acquisition path; The corresponding file distribution application is assigned based on the number and file size of all the aforementioned wafer inspection report files; The file distribution application is invoked to copy and distribute the wafer inspection report file to multiple corresponding report analysis systems according to the target path; The step of allocating files for application distribution based on the number and size of the downloaded wafer inspection report files specifically includes the following steps: Sort all the wafer inspection report files from largest to smallest according to the size of each wafer inspection report file; Starting with the first wafer inspection report file, all wafer inspection report files are sequentially assigned to the pre-configured file distribution applications until all wafer inspection report files have been assigned.

2. The wafer inspection report file distribution method according to claim 1, characterized in that, The step of sequentially allocating all wafer inspection report files to the file distribution application, starting with the first-ranked wafer inspection report file, specifically includes the following steps: It is determined whether the current file distribution application is overloaded based on the allocated quota of the current file distribution application and the first configuration limit or the second configuration limit corresponding to the current file distribution application; the allocated quota includes the number of wafer inspection report files that have been allocated, or the total size of all allocated files; If the application is overloaded, no new wafer inspection report files will be allocated to the current file distribution application.

3. The wafer inspection report file distribution method according to claim 2, characterized in that, It also includes the following steps: Determine whether all the file distribution applications can handle the copying and distribution of all wafer inspection report files; if not, start a temporary service application to perform the file copying and distribution.

4. The wafer inspection report file distribution method according to claim 3, characterized in that, The steps for determining whether the file distribution application can handle the copying and distribution of all wafer inspection report files specifically include the following steps: Determine whether the allocation amount already allocated to all the file distribution applications exceeds the preset first configuration limit or the second configuration limit; If so, start a temporary service application to perform file copying and distribution, and allocate the corresponding temporary service application according to the number and size of the unallocated wafer inspection report files.

5. The wafer inspection report file distribution method according to claim 4, characterized in that, It also includes the following steps: Determine whether the allocated amount for any temporary service application exceeds a preset first configuration limit or a second configuration limit; if so, do not allocate any new wafer inspection report file to any temporary service application; and / or, Determine whether all temporary service applications can handle the copying and distribution of all unallocated wafer inspection report files; if they cannot, mark the wafer inspection report files that cannot be handled so that they can be included in the next allocation.

6. A wafer inspection report file distribution system, characterized in that, include: A database is used to store data; The first configuration module is used to configure the file acquisition directory and the target distribution directory, and binds the acquisition path of each wafer inspection report file in the file acquisition directory with the corresponding target path in the target distribution directory and stores it in the database. The wafer inspection report file refers to the data obtained from the corresponding inspections of the wafer at each stage of the wafer manufacturing process using corresponding equipment, and this data is stored in the form of reports; the acquisition path refers to the source address of the wafer inspection report file; the target path refers to the address of the destination where the wafer inspection report file will be distributed. The second configuration module is used to configure the configuration parameters of the file distribution application and the temporary service application; the configuration parameters include: a first configuration limit representing the maximum number of files that the file distribution application or the temporary service application can process each time; and a second configuration limit representing the maximum file size that the file distribution application or the temporary service application can process each time. The file acquisition module is used to periodically download multiple wafer inspection report files according to the acquisition path; The file distribution master control module is used to allocate the corresponding file distribution application module according to the number and size of the downloaded wafer inspection report files, and call the file distribution application module to distribute the wafer inspection report files to the corresponding target report analysis system according to the target path; The file distribution application module is used to distribute the wafer inspection report file to the corresponding target report analysis system according to the target path.

7. A wafer inspection report file distribution system according to claim 6, characterized in that, Also includes: The first business control module is used to determine whether any file distribution application is overloaded based on the first configuration limit or the second configuration limit. Furthermore, when an overload is detected, the file distribution master module will stop allocating new wafer inspection report files to any of the file distribution applications. The second business control module is used to determine whether all the pre-configured file distribution applications can carry out the copying and distribution of all currently downloaded wafer inspection report files; and when it is determined that they cannot carry out the copying and distribution, the pre-configured temporary service application is started to carry out the copying and distribution. The third business control module is used to determine whether the allocation amount already received by any temporary service application exceeds the preset first configuration limit or second configuration limit; and when it is determined that it exceeds the limit, it controls the file distribution control module to stop allocating new wafer inspection report files to any temporary service application. The fourth business control module is used to determine whether all temporary service applications can carry the copying and distribution of all unallocated wafer inspection report files; if they cannot carry it, the wafer inspection report files that cannot be carried will be marked for inclusion in the next allocation.

8. An electronic device for distributing wafer inspection report files, characterized in that, The device includes at least one processor and a memory; the memory stores computer-executable instructions; the at least one processor executes the computer-executable instructions stored in the memory, causing the electronic device to perform the method according to any one of claims 1-5.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, implement the method described in any one of claims 1-5.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the method described in any one of claims 1-5.

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