Apparatus, method, electronic device, and storage medium for measuring height of spherical microbumps

Abstract

The present disclosure provides a device and method for measuring the height of spherical micro-bumps, which comprises a motion platform, an illumination module, an imaging module, a control and operation center. The substrate is fixed on the motion platform; the illumination module is turned on and a parallel light beam is projected onto the substrate surface; the control and operation center controls the motion platform to move according to a preset trajectory; the imaging module collects the parallel light beam reflected by the spherical micro-bumps and generates an image; and the control and operation center acquires the image and calculates the height of the spherical micro-bumps according to the image. The present disclosure analyzes the light illumination model of the spherical micro-bumps at different positions, summarizes the relatively invariant features in the process of measuring the spherical micro-bumps, establishes a visual measurement model of the height of the spherical micro-bumps, and can realize high-precision measurement of the height of the spherical micro-bumps. Moreover, the spherical micro-bump height measurement model proposed by the present disclosure is suitable for most micro-bump types in the chip packaging process, and meets the micro-bump detection requirements in the chip packaging process.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of optical measurement, in particular to a device, method, electronic device and storage medium for measuring the height of a spherical micro-bump. BACKGROUND

[0002] Currently, the methods for measuring the height of a micro-bump and coplanarity detection mainly include confocal method, interference method and visual measurement method. The confocal and interference methods have a measurement accuracy of nanometer level and are suitable for single-point micro-bump detection, but they have extremely low measurement efficiency and are generally used for sampling inspection. The visual measurement method generally measures the height of a micro-bump on a chip by calibrating the spatial coordinate position relationship between a structured light and a camera. This method is generally used for micro-bumps with a height of 100 microns or more. When the height of a micro-bump is less than 100 microns, it is difficult to compress the light bar to a width that can be ignored relative to the height of the micro-bump, so the extraction of the center position of the light bar in the conventional line structured light method cannot be used as a reference for calculating the height of the micro-bump.

[0003] DISCLOSURE

[0004] (I) Technical problems to be solved

[0005] In view of the above problems in the prior art, the main purpose of the present disclosure is to provide a device, method, electronic device and storage medium for measuring the height of a spherical micro-bump, so as to at least partially solve at least one of the above technical problems.

[0006] (II) Technical solutions

[0007] In order to achieve the above purpose, according to one aspect of the present disclosure, a device for measuring the height of a spherical micro-bump is provided, the spherical micro-bump is attached to a substrate, and at least one spherical micro-bump is attached to the substrate, the device comprising:

[0008] a motion platform for fixing the substrate and driving the substrate to move along a preset trajectory;

[0009] an illumination module for generating a parallel light beam, the parallel light beam irradiating onto the spherical micro-bump and forming a reflected light beam after being reflected by the spherical micro-bump;

[0010] an imaging module for collecting the reflected light beam and generating an image according to the reflected light beam;

[0011] a control and operation center for controlling the working parameters of the illumination module and the imaging module, acquiring the image, and calculating the height of the spherical micro-bump according to the image.

[0012] Preferably, the illumination module comprises:

[0013] a light projector for emitting a light beam;

[0014] a collimating lens for transforming the light beam emitted by the light projector into a parallel light beam.

[0015] Preferably, the working parameters of the illumination module and the imaging module include, in particular:

[0016] the power of the illumination module;

[0017] the distance between the illumination module and the substrate;

[0018] the acquisition mode and the acquisition frame rate of the imaging module.

[0019] In another aspect, the disclosure also provides a method for measuring the height of a spherical micro-bump on a substrate, the method using the device for measuring the height of a spherical micro-bump as described above, the method comprising:

[0020] fixing the substrate on the motion platform;

[0021] turning on the illumination module and projecting the parallel light beam emitted by the illumination module onto the surface of the substrate;

[0022] controlling the motion platform to move along a preset trajectory by using the control and operation center;

[0023] acquiring the reflected light beam formed by the parallel light beam reflected by the spherical micro-bump by using the imaging module, and generating an image according to the reflected light beam;

[0024] acquiring the image by using the control and operation center;

[0025] calculating the height of the spherical micro-bump according to the image by using the control and operation center.

[0026] Preferably, before the control and operation center controls the motion platform to move along a preset trajectory, the method further comprises:

[0027] adjusting the distance between the imaging module and the substrate until the image obtained by the imaging module is clear.

[0028] Preferably, the type of the spherical micro-bump includes:

[0029] the top of the spherical micro-bump is a hemisphere and the bottom is a cylinder, and the diameter of the hemisphere is the same as that of the cylinder; or,

[0030] the top of the spherical micro-bump is a sphere and the bottom is a cylinder, and the diameter of the sphere is greater than that of the cylinder; or,

[0031] the spherical micro-bump is a whole sphere; or,

[0032] The spherical micro-bump is a partial sphere.

[0033] Preferably, the control and operation center calculates the height of the spherical micro-bump according to the image, specifically comprising:

[0034] analyzing the image, extracting P' point and D' point from the image;

[0035] calculating the distance δ between the P' point and the D' point;

[0036] extracting the radius r of the spherical micro-bump and the incident angle θ of the light ray tangent to the spherical micro-bump from the image;

[0037] calculating the height h of the spherical micro-bump according to the δ and θ;

[0038]

[0039] Preferably, the P' point is the point corresponding to the image after the incident light ray is reflected by the vertex of the spherical micro-bump;

[0040] The D' point is the point corresponding to the image after the incident light ray tangent to the spherical micro-bump is reflected by the substrate.

[0041] In another aspect, the present disclosure also provides an electronic device, comprising:

[0042] a communicator for communicating with a server;

[0043] a processor;

[0044] a memory storing a computer executable program, which, when executed by the processor, causes the processor to execute the method for measuring the height of the spherical micro-bump as described above.

[0045] In another aspect, the present disclosure also provides a computer readable storage medium storing a computer program, which, when executed by a processor, implements the method for measuring the height of the spherical micro-bump as described above.

[0046] (III) Advantages

[0047] (1) In the present disclosure, by analyzing the light illumination model of the spherical micro-bump at different positions, the relative invariant characteristics of the spherical micro-bump measurement process are summarized, and a visual measurement model of the height of the spherical micro-bump is established, so that high-precision height detection of the spherical micro-bump can be realized.

[0048] (2) The spherical micro-bump height measurement model proposed in the present disclosure is applicable to most types of spherical micro-bumps in the chip packaging process, and meets the detection requirements of spherical micro-bumps in the chip packaging process. BRIEF DESCRIPTION OF DRAWINGS

[0049] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative labor.

[0050] Figure 1 A structural schematic diagram of a device for measuring the height of a spherical micro-bump according to an embodiment of the present disclosure is provided.

[0051] Figure 2 A structural schematic diagram of an illumination module and an imaging module of a device for measuring the height of a spherical micro-bump according to an embodiment of the present disclosure is provided.

[0052] Figure 3 A flowchart of a method for measuring the height of a spherical micro-bump according to an embodiment of the present disclosure is provided.

[0053] Figure 4 A flowchart of a method for calculating the height of a spherical micro-bump according to an image generated by an imaging module according to an embodiment of the present disclosure is provided.

[0054] Figures 5-8 An imaging model diagram when a spherical micro-bump is in different positions during the measurement process according to an embodiment of the present disclosure is provided.

[0055] Figure 9 A spherical micro-bump height calculation model diagram according to an embodiment of the present disclosure is provided.

[0056] Figure 10 A spherical micro-bump type diagram according to an embodiment of the present disclosure is provided.

[0057] Figure 11 A hardware structure diagram of an electronic device is schematically shown.

[0058] REFERENCE SIGNS

[0059] 1 Illumination module 2 Imaging module 3 Substrate

[0060] 4 Motion platform 5 Base 6 Control transmission line

[0061] 7 Control and operation center 8 Data transmission line 9 User operation center

[0062] 10 spherical microprotrusion 101 light projector 102 collimating lens

[0063] 103 projection sleeve lens 104 projection slit 105 projection objective

[0064] 201 camera 202 imaging sleeve lens 203 imaging slit

[0065] 204 imaging objective 205 aperture stop

[0066] a represents the first edge ray in the parallel beam width direction

[0067] a' represents the imaging of the first edge ray a in the camera imaging plane

[0068] b represents the second edge ray in the parallel beam width direction

[0069] b' represents the imaging of the second edge ray b in the camera imaging plane

[0070] A represents the position of the first edge ray a projected on the substrate surface

[0071] B represents the position of the second edge ray b projected on the substrate surface

[0072] A' represents the imaging of the first edge ray a in the camera imaging plane

[0073] B' represents the imaging of the second edge ray b in the camera imaging plane

[0074] c represents the light ray irradiated on the vertex of the spherical microprotrusion

[0075] d represents the light ray tangent to the spherical microprotrusion

[0076] D' represents the imaging of the light ray d tangent to the spherical microprotrusion in the camera imaging plane

[0077] P represents the vertex of the spherical microprotrusion

[0078] P' represents the imaging of the light ray reflected after the vertex P of the spherical microprotrusion in the camera imaging plane

[0079] F represents the tangent point of the light ray d tangent to the spherical microprotrusion and the spherical microprotrusion

[0080] Q represents the center of the circle of the spherical microprotrusion top sphere

[0081] M represents the position of the light ray c irradiated on the vertex of the spherical microprotrusion projected on the substrate surface

[0082] O represents the intersection of the extension line of PQ and the substrate

[0083] CCD represents the camera imaging plane

[0084] δ represents the length of P'D'

[0085] θ represents the incident angle of the light ray d tangent to the spherical micro-protrusion DETAILED DESCRIPTION

[0086] To make the objectives, features, technical solutions and advantages of the present disclosure clearer, the present disclosure is further described in detail below with reference to specific embodiments and drawings. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present disclosure.

[0087] Figure 1 A structural schematic diagram of a device for measuring the height of a spherical micro-protrusion is provided for an embodiment of the present disclosure, as shown in FIG. 1. Figure 1 The spherical micro-protrusion 10 is attached to a substrate, and the substrate is attached with at least one spherical micro-protrusion 10. The device comprises an illumination module 1, an imaging module 2, a motion platform 4 and a control and operation center 7.

[0088] In an embodiment of the present disclosure, the motion platform 4 is used to fix the above-mentioned substrate 3 and drive the above-mentioned substrate 3 to move along a preset trajectory; the illumination module 1 is used to generate a parallel light beam, the above-mentioned parallel light beam is irradiated onto the above-mentioned spherical micro-protrusion 10, and a reflected light beam is formed after being reflected by the above-mentioned spherical micro-protrusion 10; the imaging module 2 is used to collect the above-mentioned reflected light beam and generate an image according to the above-mentioned reflected light beam; and the control and operation center 7 is used to control the working parameters of the above-mentioned illumination module 1 and the above-mentioned imaging module 2, acquire the above-mentioned image, and calculate the height of the above-mentioned spherical micro-protrusion 10 according to the above-mentioned image.

[0089] As shown in FIG. 2, Figure 1 In an embodiment of the present disclosure, the device for measuring the height of a spherical micro-protrusion further comprises a base 5, a control transmission line 6, a data transmission line 8 and a user operation center 9.

[0090] In the embodiment, the motion platform 4 is located on the base 5, the substrate 3 is fixed on the motion platform 4, the illumination module 1 is connected with the control and operation center 7 through the control transmission line 6, the imaging module 2 is connected with the control and operation center 7 through the data transmission line 8, and the control and operation center 7 is connected with the user operation center 9.

[0091] In an embodiment of the present disclosure, the material of the base 5 comprises marble, the base 5 is connected with a mounting surface through a vibration isolation material, and a high-precision air floating guide rail is processed on the base 5. The motion platform 4 can move on the base 5 through the air floating guide rail, and the air floating guide rail can ensure the vibration isolation performance and high-precision positioning of the motion platform 4.

[0092] In one embodiment of this disclosure, the control and computing center 7 controls parameters such as the power and working distance of the light projector 101, and controls parameters such as the acquisition mode and acquisition frame rate of the camera 201. At the same time, it is responsible for acquiring the image obtained by the imaging module 2, processing the image, calculating the height of the spherical micro-bump 10, and transmitting the height of the spherical micro-bump 10 to the user operation center 9.

[0093] In this embodiment, the control and computing center 7 can control the relevant operating parameters of the light projector 101 in the illumination module 1, and the relevant operating parameters of the camera 201 in the imaging module 2. By controlling these operating parameters, the image obtained in the imaging module can be clear, making it easier to calculate the height of the spherical microbumps 10 on the substrate 3 based on the image.

[0094] In one embodiment of this disclosure, the user operation center 9 displays the height of the spherical micro-protrusion 10 transmitted by the control and calculation center 7 so that the user can know the measurement result.

[0095] In this embodiment, the user operation center 9 displays the height of the spherical microbumps 10 on the substrate 3 calculated by the control and calculation center 7, so that users can easily view and know the measurement results in a timely manner.

[0096] Figure 2 This is a schematic diagram of the illumination module and imaging module of a device for measuring the height of a spherical micro-bump, provided in an embodiment of this disclosure. Figure 2 As shown in (a), the above-mentioned lighting module 1 includes: a light projector 101, a collimating lens 102, a projection sleeve lens 103, a projection slit 104, and a projection objective lens 105.

[0097] In one embodiment of this disclosure, a light projector 101 is used to emit a light beam; a collimating lens 102 is used to transform the light beam emitted by the light projector 101 into a parallel light beam.

[0098] In this embodiment, during the measurement process, the light projector 101 emits a light beam, which becomes a parallel beam after passing through the collimating lens 102. This parallel beam then passes through the projection sleeve lens 103 and is projected onto the projection slit 104. After passing through the projection slit 104, the parallel beam becomes a narrow parallel beam, which is finally projected onto the surface of the substrate 3 through the projection objective lens 105. The projection slit 104 is located at the focal plane of the projection objective lens 105.

[0099] like Figure 2 As shown in (b), the imaging module 2 includes: a camera 201, an imaging sleeve lens 202, an imaging slit 203, an imaging objective lens 204, and an aperture stop 205.

[0100] In an embodiment of the present disclosure, during the measurement process, the parallel light beam generated by the illumination module 2 reaches the imaging objective 204 after being reflected by the surface of the substrate 3, is projected on the imaging slit 203 after passing through the imaging objective 204, and finally reaches the imaging sleeve lens 202 in the camera 201 after passing through the imaging slit 203. The imaging slit 203 is located at the focal plane position of the imaging objective 204 and the imaging sleeve lens 202.

[0101] In the embodiment, the aperture stop 205 is installed before the imaging objective 204, and the shape of the aperture stop 205 is the same as that of the structured light beam projected on the surface of the substrate. If the light beam is a linear light strip, the aperture stop 205 is a rectangular aperture stop. If the light beam is a circular light beam, the aperture stop 205 is a circular aperture stop. The aperture stop 205 is used to limit the light rays other than the reflected light of the light beam from entering the imaging system 2, while increasing the imaging depth of field.

[0102] In the embodiment, the aperture stop 205 is installed at the focal plane of the imaging objective 204 and the imaging sleeve lens 202, and the aperture stop 205 is used to improve the imaging quality.

[0103] In an embodiment of the present disclosure, the control and operation center 7 controls the working parameters of the above-mentioned illumination module 1 and the above-mentioned imaging module 2.

[0104] In the embodiment, the working parameters of the above-mentioned illumination module 1 and the imaging module 2 specifically include: the power of the above-mentioned illumination module 1; the distance between the above-mentioned illumination module 1 and the above-mentioned substrate 3; the acquisition mode and the acquisition frame rate of the above-mentioned imaging module 2.

[0105] Figure 3 A flowchart of a method for measuring the height of a spherical micro-bump according to an embodiment of the present disclosure is shown in FIG. 5. The method comprises the following steps. Figure 3

[0106] S301, fixing the substrate 3 on the motion platform 4;

[0107] In an embodiment of the present disclosure, the substrate 3 needs to be fixed on the motion platform, because the entire upper surface of the substrate 3 needs to be detected, and therefore the upper surface of the substrate 3 cannot be blocked during the fixing. In the embodiment, the substrate 3 can be fixed by using a vacuum adsorption method. Before the measurement starts, the motion trajectory of the motion platform needs to be preset. The preset motion trajectory can be preset according to the shape of the substrate 3. For example, if the substrate 3 is a circular substrate such as a wafer, the preset motion trajectory can be a snake-like back-and-forth motion, or can be a scanning motion according to the distribution of the dies or micro-bumps on the wafer, so as to cover the entire substrate.

[0108] S302, turning on the illumination module 1, and projecting the parallel light beam emitted by the illumination module 1 on the surface of the substrate 3; ​

[0109] In an embodiment of the present disclosure, before the control and operation center 7 controls the motion platform 4 to move according to the preset trajectory, the distance between the imaging module 2 and the substrate 3 needs to be adjusted until the image obtained by the imaging module 2 is clear.

[0110] S303, controlling the motion platform 4 to move according to the preset trajectory by using the control and operation center 7;

[0111] In an embodiment of the present disclosure, before starting the measurement, the user sets the motion trajectory according to the substrate 3 in advance, and stores the preset motion trajectory in the control and operation center 7. After starting the measurement, the control and operation center 7 can move according to the preset motion trajectory.

[0112] S304, collecting the reflected light beam formed by the parallel light beam reflected by the spherical micro-bump 10 by using the imaging module 2, and generating an image according to the reflected light beam;

[0113] In an embodiment of the present disclosure, after the parallel light beam generated by the illumination module 1 is irradiated on the surface of the substrate 3, the reflected light beam is formed by the reflection of the surface of the substrate 3. The reflected light beam enters the imaging module 2 to obtain an image. During the measurement process, a plurality of images can be obtained.

[0114] S305, obtaining the image by using the control and operation center 7;

[0115] S306, calculating the height of the spherical micro-bump 10 according to the image by using the control and operation center 7.

[0116] Figure 4 A flowchart of a method for calculating the height of the spherical micro-bump according to the image generated by the imaging module provided in an embodiment of the present disclosure is shown in FIG. 4, which includes the following steps. Figure 4

[0117] S401, analyzing the image, and extracting the P' point and the D' point from the image;

[0118] S402, calculating the distance δ between the P' point and the D' point;

[0119] S403, extracting the radius r of the spherical micro-bump 10 and the incident angle θ of the light ray tangent to the spherical micro-bump 10 from the image;

[0120] S404, calculating the height h of the spherical micro-bump 10 according to the δ and θ.

[0121] In an embodiment of the present disclosure, the control and operation center 7 analyzes the obtained image, and calculates the height of the spherical micro-bump 10 on the substrate 3 according to the analysis result.

[0122] Figures 5-8 ​The imaging model schematic diagram of the spherical micro-bump at different positions in the measuring process provided by an embodiment of the present disclosure is shown in FIG. 1, wherein Figure 5 ①, Figure 6 ①, Figure 7 ①and Figure 8 ①is an illustration of the light beam irradiated on the wafer surface near the micro-bump and reflected to the imaging plane of the camera 201 when the spherical micro-bump 10 is at different positions in the plane perpendicular to the light beam width. Figure 5 ②, Figure 6 ②, Figure 7 ②and Figure 8 ②is the corresponding imaging in the imaging plane of the camera 201 when the spherical micro-bump 10 is at different positions. Figures 5-8 In FIG. 1, a represents the first edge light in the parallel light beam width direction, a' represents the imaging of the first edge light a in the imaging plane of the camera, b represents the second edge light in the parallel light beam width direction, b' represents the imaging of the second edge light b in the imaging plane of the camera, A represents the position of the first edge light a projected on the substrate surface, B represents the position of the second edge light b projected on the substrate surface, A' represents the imaging of the first edge light a in the imaging plane of the camera, B' represents the imaging of the second edge light b in the imaging plane of the camera, c represents the light irradiated on the vertex of the spherical micro-bump, d represents the light tangent to the spherical micro-bump, D' represents the imaging of the light tangent to the spherical micro-bump d in the imaging plane of the camera, P represents the vertex of the spherical micro-bump, P' represents the imaging of the light reflected through the vertex P of the spherical micro-bump in the imaging plane of the camera, F represents the tangent point of the light tangent to the spherical micro-bump d and the spherical micro-bump, CCD represents the imaging plane of the camera, δ represents the length of P'D', θ represents the incident angle of the light tangent to the spherical micro-bump d, Q represents the center of the sphere at the top of the spherical micro-bump, M represents the position of the light c irradiated on the vertex of the spherical micro-bump projected on the substrate surface, and O represents the intersection of the extension line of PQ and the substrate.

[0123] In an embodiment of the present disclosure, it can be known through the analysis of the image that when the height of the spherical micro-bump 10 is less than 100 microns, the light beam width relative to the size of the spherical micro-bump 10 cannot be ignored.

[0124] Figure 5 The imaging model schematic diagram of the parallel light beam not irradiated on the spherical micro-bump provided by an embodiment of the present disclosure is shown in FIG. 2, wherein Figure 5 As shown in FIG. 2, in an embodiment of the present disclosure, the parallel light beam is not irradiated on the spherical micro-bump 10, at this time the parallel light beam is entirely projected on the surface of the substrate 3, at this time the imaging in the imaging plane of the camera is shown in FIG. 2B. Figure 5 ②, Figure 6 and Figure 7When parallel light beam is irradiated on the spherical micro-protrusion 10, part of the light beam is projected on the top of the spherical micro-protrusion 10, and part of the light beam is projected on the surface of the substrate 3. When the light beam is projected on the spherical micro-protrusion 10, only a small part of the reflected light near the vertex P of the spherical protrusion can enter the imaging module 2 and be imaged as P'. Meanwhile, the light beam irradiated on the surface of the substrate 3 can also enter the imaging module 2 and be imaged as a'b'.

[0125] Figure 6 and Figure 7 The imaging model schematic diagram when the parallel light beam is partially irradiated on the spherical micro-protrusion provided by an embodiment of the present disclosure is shown in FIG. 7. Figure 7 As shown in FIG. 7, at this time, the light ray b is tangent to the spherical micro-protrusion 10, and therefore, the light ray b is represented as b(d) in Figure 7 , and the imaging of the light ray b in the imaging plane of the camera is represented as B'(D'), the light ray tangent to the spherical top of the spherical micro-protrusion 10 is projected on the surface of the substrate 3, and after being reflected into the imaging module 2, it is in an arc shape in the imaging plane of the camera 201, as shown in Figure 6 ②and Figure 7 ②, d represents the light ray tangent to the spherical micro-protrusion 10, and the light ray d is projected on the surface of the substrate 3 and imaged as D' in the imaging plane of the camera 201.

[0126] Figure 8 The imaging model schematic diagram when the parallel light beam is fully irradiated on the spherical micro-protrusion provided by an embodiment of the present disclosure is shown in FIG. 8. Figure 8 As shown in FIG. 8, there is still light irradiated on the top of the spherical micro-protrusion 10, but there is no light ray tangent to the spherical top of the spherical micro-protrusion 10, and therefore, there is no D' point on the image a'b' in the imaging plane of the camera 201. Assuming that there is still a light ray d tangent to the spherical top of the spherical micro-protrusion 10 at this time, as shown by the dotted line in Figure 8 ①, at this time, the image point D' in the imaging plane of the camera 201 should be located at the vertex of the circle formed by the circular arc fitting, as shown in Figure 8 ②. Through analysis, it can be known that in the image, the distance of the imaging point P' of the top of the spherical micro-protrusion 10 to the center of the light bar a'b' changes with the position of the spherical micro-protrusion 10. However, since the position between the vertex P of the spherical micro-protrusion 10 and the point D where the light ray d tangent to the spherical is irradiated on the surface of the substrate 3 is relatively fixed, that is, the position between P' and D' in the image is relatively fixed, and therefore, P'D' in the image is the relative invariant feature of the measurement process of the spherical micro-protrusion 10, and the length thereof is a fixed value.

[0127] In the present embodiment, the relative invariant feature of the measurement process of the spherical micro-protrusion 10 is obtained by Figure 6 ①, Figure 6 ②and 7①, Figure 7② It can be seen that D′ is the vertex of the arc on the light stripe. Therefore, point D′ can be extracted by methods such as arc / circle fitting, and the radius r of the fitted circle can be obtained at the same time. Since only a small part near the vertex of the spherical micro-convex point 10 can be imaged, point P′ can be obtained by methods such as the centroid method.

[0128] Figure 9 This is a schematic diagram of a spherical micro-bump height calculation model provided in an embodiment of the present disclosure, as shown below. Figure 9 As shown, in one embodiment of this disclosure, M represents the intersection of the extension of ray c with the substrate surface, and δ represents the length of P′D′. The illumination model is simplified, retaining only the ray c that illuminates the top of the microbump and the ray d that is spherically tangent to the top of the microbump, which are imaged as D′ and P′ in the image, respectively.

[0129] In this embodiment, the angle θ between the incident ray and the normal to the horizontal plane is such that the reflected ray is perpendicular to the imaging plane of the camera 201. The length δ of P′D′ can be determined from the image, the radius PQ of the sphere on the substrate 3 is r, and PO is the height h of the micro-bump that needs to be calculated. Figure 9 According to the geometric relationship, the height h of the spherical micro-convex point 10 is:

[0130]

[0131] Figure 10 This is a schematic diagram of a spherical micro-bump type provided in an embodiment of the present disclosure, as shown below. Figure 10 As shown, in one embodiment of this disclosure, the types of spherical micro-bumps 10 include the following:

[0132] like Figure 10 As shown in (a), the top of the spherical micro-protrusion 10 is a hemisphere and the bottom is a cylinder, with the hemisphere and cylinder having the same diameter;

[0133] like Figure 10 As shown in (b) and (c), the top of the spherical micro-protrusion 10 is a sphere and the bottom is a cylinder, with the diameter of the sphere being larger than the diameter of the cylinder;

[0134] like Figure 10 As shown in (d), the spherical micro-protrusion 10 is the entire sphere;

[0135] like Figure 10 As shown in (e), the spherical micro-bumps 10 are part of a sphere.

[0136] like Figure 11 As shown, this disclosure also provides an electronic device 1100, which includes:

[0137] Communicator 1110 is used to communicate with the server;

[0138] Processor 1120;

[0139] The memory 1130 stores a computer-executable program, which contains the method for measuring the height of the spherical micro-bumps as described above.

[0140] Figure 11 The block diagram of the electronic device provided by an embodiment of the present disclosure is schematically shown as follows: Figure 11 As shown, the electronic device 1100 includes a communicator 1110, a processor 1120 and a memory 1130. The electronic device 1100 can perform the method of the above-mentioned embodiments of the present disclosure.

[0141] Specifically, the processor 1120 may, for example, include a general-purpose microprocessor, an instruction set processor and / or a related chipset and / or a special-purpose microprocessor (e.g., an application-specific integrated circuit (ASIC)), etc. The processor 1120 can also include an on-board memory for cache use. The processor 1120 can be a single processing unit or a plurality of processing units for performing different actions of the method flow according to the embodiments of the present disclosure.

[0142] The memory 1130 may, for example, be any medium capable of containing, storing, communicating, propagating or transferring instructions. For example, the readable storage medium may, for example, include but not limited to an electric, magnetic, optical, electromagnetic, infrared or semiconductor system, device, apparatus or propagation medium. Specific examples of the readable storage medium include a magnetic storage device such as a magnetic tape or a hard disk drive (HDD); an optical storage device such as a compact disc (CD-ROM); a memory such as a random access memory (RAM) or a flash memory; and / or a wired / wireless communication link. The memory 1130 stores a computer-executable program, which, when executed by the processor, causes the processor to perform the method for measuring the height of the spherical micro-bumps as described above.

[0143] The present disclosure also provides a computer-readable storage medium having a computer program stored thereon, which contains the method for measuring the height of the spherical micro-bumps as described above. The computer-readable storage medium may, for example, be contained in the apparatus / device described in the above-mentioned embodiments; or may exist separately without being assembled into the apparatus / device. The above-mentioned computer-readable storage medium carries one or more programs, which, when executed, implement the method of the above-mentioned embodiments of the present disclosure.

[0144] According to an embodiment of the present disclosure, the computer readable storage medium can be a computer readable signal medium or a computer readable storage medium or any combination of the two. The computer readable storage medium may, for example, be, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus or device, or any suitable combination of the above. More specific examples of the computer readable storage medium can include, but are not limited to, an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above.

[0145] In the present disclosure, the computer readable storage medium can be any tangible medium that contains or stores a program that can be used by or in connection with an instruction execution system, apparatus or device. In the present disclosure, the computer readable signal medium can include a data signal that is propagated in a baseband or as a part of a carrier wave, in which a computer readable program code is carried. Such a propagated data signal can take a variety of forms, including but not limited to an electromagnetic signal, an optical signal or any suitable combination of the above. The computer readable signal medium can also be any computer readable medium that can send, propagate or transfer a program for use by or in connection with an instruction execution system, apparatus or device. The program code contained on the computer readable medium can be transmitted using any suitable medium, including but not limited to wireless, wired, optical fiber cable, radio frequency (RF) signals, or any suitable combination of the above.

[0146] The above specific embodiments further illustrate the purpose, technical solutions and beneficial effects of the present disclosure. It should be understood that the above description is only for specific embodiments of the present disclosure and is not intended to limit the present disclosure. Those skilled in the art can understand that the features described in various embodiments and / or claims of the present disclosure can be combined or / and combined, even if such combination or combination is not explicitly described in the present disclosure. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. An apparatus for measuring the height of a spherical microbump (10) attached to a substrate (3) having at least one spherical microbump (10) attached thereto, characterized by, The method comprises: a motion platform (4) for fixing the substrate (3) and driving the substrate (3) to move along a preset trajectory; an illumination module (1) for generating a parallel light beam, the parallel light beam being irradiated onto the spherical micro-bump (10) and forming a reflected light beam after being reflected by the spherical micro-bump (10); an imaging module (2) for collecting the reflected light beam and generating an image according to the reflected light beam; a control and operation center (7) for controlling working parameters of the illumination module (1) and the imaging module (2), acquiring the image, and calculating a height of the spherical micro-bump (10) according to the image, the height being determined based on a corresponding point D' on a bottom of the spherical micro-bump (10) in the image, the corresponding point D' being obtained based on a circular arc / circle fitting method; wherein the height h of the spherical micro-bump (10) is determined by a spherical micro-bump height visual measurement model, the spherical micro-bump height visual measurement model being: wherein, represents the distance between two points P' D' in the image, P' represents the imaging of the light reflected by the vertex P of the spherical micro-protrusion in the imaging plane of the camera, represents the imaging of the light ray d tangent to the spherical micro-protrusion in the imaging plane of the camera, r represents the radius of the spherical micro-protrusion (10) in the image, represents the angle of the light ray tangent to the spherical micro-protrusion (10) with the incident light.

2. The apparatus for measuring the height of a spherical microbump according to claim 1, wherein, The illumination module (1) comprises: a light projector (101) for emitting a light beam; a collimating lens (102) for transforming the light beam emitted by the light projector (101) into a parallel light beam.

3. The apparatus of claim 1, wherein the ball micro-studs are measured by a ball height gauge. The working parameters of the illumination module (1) and the imaging module (2) specifically comprise: a power of the illumination module (1); a distance between the illumination module (1) and the substrate (3); an acquisition mode and an acquisition frame rate of the imaging module (2).

4. A method of measuring the height of a spherical microbump (10) on a substrate (3) having at least one spherical microbump (10) attached thereto, characterized by, The method employs the device for measuring the height of the spherical micro-bump (10) according to any one of claims 1 to 3, and the method comprises: fixing the substrate (3) on the motion platform (4); turning on the illumination module (1) and projecting a parallel light beam emitted by the illumination module (1) onto a surface of the substrate (3); controlling the motion platform (4) to move along a preset trajectory by using the control and operation center (7); collecting a reflected light beam formed after the parallel light beam is reflected by the spherical micro-bump (10) by using the imaging module (2) and generating an image according to the reflected light beam; acquiring the image by using the control and operation center (7); calculating the height of the spherical micro-bump (10) according to the image by using the control and operation center (7), comprising: analyzing the image, extracting from the image points, points, the points are points on the image corresponding to the reflection of the incident light rays after reflection by the apex of the spherical microprotrusions (10); the points are points on the image corresponding to the reflection of the incident light rays tangent to the spherical microprotrusions (10) after reflection by the substrate; calculating the point and distance between points ; extracting from the image the radius r of the spherical microbump (10) and the angle of incidence of the light ray tangent to the spherical microbump (10) ; According to the and calculating a height h of the spherical microbumps (10); ； The type of the spherical micro-bump (10) comprises: a top of the spherical micro-bump (10) is a hemisphere, and a bottom of the spherical micro-bump (10) is a cylinder, and a diameter of the hemisphere is the same as a diameter of the cylinder; or a top of the spherical micro-bump (10) is a sphere, and a bottom of the spherical micro-bump (10) is a cylinder, and a diameter of the sphere is greater than a diameter of the cylinder; or the spherical micro-bump (10) is a whole sphere; or the spherical micro-bump (10) is a partial sphere.

5. The method of measuring the height of a spherical microbump according to claim 4, wherein, Before the control and operation center (7) controls the motion platform (4) to move along a preset trajectory, the method further comprises: adjusting a distance between the imaging module (2) and the substrate (3) until an image obtained by the imaging module (2) is clear.

6. An electronic device, comprising: The electronic device comprises: a communicator for communicating with a server; a processor; a memory storing a computer executable program that, when executed by the processor, causes the processor to perform the method of measuring the height of a spherical microbump of any one of claims 4-5.

7. A computer readable storage medium having stored thereon a computer program, characterized in that, The computer program, when executed by the processor, implements the method of measuring the height of a spherical microbump of any one of claims 4-5.

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