Automatic wafer gold tearing equipment

Abstract

The present invention relates to an automatic wafer gold tearing device, which comprises: a feeding device, a controller, a raw material rack, a film supply mechanism, a cutter mechanism, a flipping mechanism, a feeding device, a material taking device, a film pressing mechanism, and a film pulling mechanism. The feeding device comprises a feeding mechanism, and a limit station is arranged on the feeding mechanism. The material taking device is used to realize the alternation of the position of the wafer on the raw material rack and the limit station. The film pressing mechanism and the feeding mechanism cooperate to stick the white film on the surface of the wafer. The film pulling mechanism is used to pull the white film. The film pulling mechanism, the film pressing mechanism and the feeding mechanism cooperate to tear off the white film stuck on the surface of the wafer; the film pulling mechanism and the cutter mechanism cooperate to fix the white film; the film pulling mechanism, the cutter mechanism and the flipping mechanism cooperate to stick the white film flipped 180° on the white film fixed by the film pulling mechanism and the cutter mechanism. The present invention can realize full-automatic gold tearing of the wafer, the gold tearing process is simple and the gold tearing is thorough, and the structure layout of the equipment is compact and the volume is small, which is convenient for factory layout and transportation.

Description

Technical Field

[0001] The invention relates to the field of wafer processing equipment, and in particular to an automatic wafer gold-tearing device. Background Art

[0002] At present, the process of stripping metal from wafers is still mostly done manually, and manual gold stripping is slow, and it is easy to have problems such as incomplete gold stripping, wafer contamination, and even wafer damage. Although there are now automatic gold stripping equipment, it is pasted on the surface of the wafer by a film, and then the film is torn off to strip the metal on the wafer, and the gold is stripped completely. However, most of these equipment have complicated gold stripping processes, which leads to their bloated size, and the processing and manufacturing of wafers usually need to be carried out in a dust-free environment. The existing gold stripping equipment needs to occupy a large area in the dust-free factory, which is easy to interfere with other production equipment, which is not conducive to the layout of factory equipment and inconvenient to carry. In addition, the existing automatic gold stripping equipment for wafers fixes the wafer by adsorption of vacuum suction cups. When stripping gold, because the film will also be attached to the metal-free area on the wafer, the film has a large pulling force on the wafer, and the wafer is pulled on both sides. The risk of damage to the wafer is high, and the vacuum suction cup has a low service life due to frequent pulling and needs to be replaced frequently. Summary of the invention

[0003] The purpose of the present invention is to provide an automatic wafer gold stripping device, which can realize fully automatic wafer gold stripping, the gold stripping process is simple and the gold stripping is thorough, and the device has a compact structure and layout, a small size, and is convenient for factory layout and transportation.

[0004] In order to achieve the above object, the present invention discloses an automatic wafer gold peeling device, which comprises:

[0005] At least one raw material rack is used to stack wafers.

[0006] The film supply mechanism is used for supplying white film.

[0007] The feeding device is placed below the raw material rack and the film supply mechanism. The feeding device includes at least one group of feeding mechanisms. The feeding mechanisms are provided with a plurality of limiting positions for limiting the placement of wafers. The feeding mechanisms drive the limiting positions to move back and forth between the raw material rack and the film supply mechanism.

[0008] At least one material taking device is used to grab the wafer on the raw material rack and place it on the limiting position, or grab the wafer on the limiting position and stack it on the raw material rack.

[0009] The film pressing mechanism is placed above the feeding mechanism and close to the film supply mechanism. The film pressing mechanism and the feeding mechanism cooperate to closely fit the white film to the surface of the wafer placed on the feeding mechanism.

[0010] The cutter mechanism is arranged above the film pressing mechanism and is used for cutting off the white film.

[0011] The flipping mechanism is used to flip the cut white film 180 degrees.

[0012] A film-pulling mechanism, wherein the film-pulling mechanism pulls the white film through the film-pressing mechanism, the cutting mechanism and the flipping mechanism in sequence; the film-pulling mechanism, the film-pressing mechanism and the feeding mechanism cooperate to tear off the white film adhered to the surface of the wafer; the film-pulling mechanism and the cutting mechanism cooperate to fix the white film; the film-pulling mechanism, the cutting mechanism and the flipping mechanism cooperate to adhere the white film flipped 180° to the white film fixed by the film-pulling mechanism and the cutting mechanism.

[0013] The unloading device is used to grab the two laminated white films and place them at the designated location.

[0014] A controller is connected to the feeding device, the material taking device, the film supply mechanism, the film pressing mechanism, the cutter mechanism, the turning mechanism, the film pulling mechanism and the material unloading device.

[0015] Preferably, the number of the raw material racks is two groups, the feeding device also includes a first X-axis moving module, the number of the feeding mechanisms is two groups, the first X-axis moving module drives the two groups of feeding mechanisms to move synchronously, and when any one of the feeding mechanisms is placed directly below the raw material rack, the other feeding mechanism is facing the film supply mechanism.

[0016] Preferably, a plurality of carriers are positioned and placed on the raw material rack, and the carriers are arranged in an array on the raw material rack; the limiting stations are arranged in an array on the feeding mechanism, and the number of columns of the carriers is equal to the number of columns of the limiting stations and corresponds one to one.

[0017] Preferably, the feeding mechanism comprises a first Y-axis moving module and a carrier, and the first Y-axis moving module drives the carrier to move;

[0018] The carrier includes a substrate, a carrier plate, a plurality of first Z-axis moving modules and a plurality of lifting frames; the top surface of the carrier plate is partially recessed to form a limit station, and the lifting frame corresponds to the limit station one by one; the lifting frame includes a bottom plate, a plurality of guide rods and a plurality of support rods, the support rods are arranged circumferentially on the bottom plate, the guide rods are arranged circumferentially on the bottom plate, the guide rods are placed on the outside of the support rods, and the length of the guide rods is greater than the length of the support rods; the carrier plate is provided with guide holes that match the guide rods one by one and through holes that match the support rods one by one; the first Z-axis moving modules are arranged on the substrate, the number of the first Z-axis moving modules is equal to and corresponds to the number of rows of the limit stations, and the first Z-axis moving modules synchronously drive all the lifting frames belonging to the same row to move relative to the carrier plate.

[0019] Preferably, there are two groups of the material picking devices, including a second X-axis moving module, a second Y-axis moving module, a second Z-axis moving module and a first grabbing component, the second X-axis moving module drives the second Y-axis moving module to move, the second Y-axis moving module drives the second Z-axis moving module to move, the second Z-axis moving module drives the first grabbing component to move, and the first grabbing component includes at least one grabbing member; the first X-axis moving modules corresponding to the two groups of the material picking devices are independently arranged or integrated into one.

[0020] Preferably, the material picking device also includes a first camera for alignment, and the first camera is arranged on the second Y-axis moving module; the first camera is connected to the controller.

[0021] Preferably, the film supply mechanism includes a white film roll, a first clamping member, a second clamping member, a film supply frame, a sliding block, a clamping cylinder and a film supply motor, the first clamping member is rotatably connected to the film supply frame, and the film supply motor is transmission-connected to the first clamping member; the second clamping member is rotatably connected to the sliding block, the sliding block is slidably connected to the film supply frame, and the clamping cylinder drives the sliding block to move the second clamping member relative to the first clamping member; the first clamping member and the second clamping member cooperate to clamp and fix the white film roll.

[0022] Preferably, the film pressing mechanism includes a film pressing cylinder, a first mounting plate, a second mounting plate, at least one film pressing roller and at least two telescopic components, the base of the film pressing cylinder is fixed to the first mounting plate, the first mounting plate is provided with at least one guide sleeve, the second mounting plate is connected to the push rod of the film pressing cylinder, the second mounting plate is provided with a guide column corresponding to the guide sleeve one by one, and the guide column is slidably connected in the guide sleeve; the telescopic component includes a slide rod and a spring, the second mounting plate is provided with a slide hole matching the slide rod, and the slide rod is slidably connected in the slide hole; the upper end of the slide rod is provided with a limit piece matching the slide hole, and the lower end is provided with a baffle matching the spring; the spring sleeve is arranged on the slide rod, and the two ends of the spring respectively abut the baffle and the second mounting plate; the end of the film pressing roller is connected to the lower end of the slide rod; the bottoms of all the film pressing rollers are arranged flush.

[0023] Preferably, the cutter mechanism includes a cutter frame, a third X-axis moving module, a blade, two first film clamping cylinders, two first film clamping upper plates and two first film clamping lower plates, the third X-axis moving module is arranged on the cutter frame, and the third X-axis moving module drives the blade to move; the first film clamping cylinder, the first film clamping upper plate and the first film clamping lower plate correspond to each other one by one, the seats of the two first film clamping cylinders are respectively arranged on both sides of the cutter frame, the first film clamping lower plate is placed directly below the first film clamping cylinder, the push rod of the first film clamping cylinder is connected to the first film clamping upper plate and drives the first film clamping upper plate to move relative to the first film clamping lower plate, and the first film clamping upper plate and the second film clamping lower plate cooperate to clamp the white film.

[0024] Preferably, the film pulling mechanism includes a third Y-axis moving module, a slide seat, two second film clamping cylinders, two first film clamping upper plates and two second film clamping lower plates, the third Y-axis moving module drives the slide seat to move, the second film clamping cylinder, the second film clamping upper plate and the second film clamping lower plate correspond one to one, the seat body of the second film clamping lower plate and the second film clamping cylinder is fixed on the slide seat, the second film clamping upper plate is connected to the push rod of the second film clamping cylinder, and the second film clamping upper plate and the second film clamping lower plate can cooperate to clamp the white film.

[0025] Preferably, the top surface of the first clamping membrane lower plate is flush with the top surface of the second clamping membrane lower plate, and the first clamping membrane lower plate and the second clamping membrane lower plate are staggered, the limit position of the second clamping membrane lower plate when moving toward the cutting mechanism exceeds the blade, and the cutting mechanism is provided with an avoidance groove for avoiding the second clamping membrane upper plate and the second clamping membrane lower plate.

[0026] Preferably, the flipping mechanism includes a first flipping component and a second flipping component, the first flipping component and the second flipping component are arranged opposite to each other, and the white film can pass between the first flipping component and the second flipping component; the first flipping component and the second flipping component both include a first flipping cylinder, a second flipping cylinder, a rotating cylinder, a clamping cylinder, a third clamping upper plate and a third clamping lower plate, the first flipping cylinder drives the second flipping cylinder to move along the Z-axis direction, the second flipping cylinder drives the rotating cylinder to move along the X-axis direction, the rotating cylinder drives the clamping cylinder to rotate, the two claws of the clamping cylinder are respectively connected to the third clamping upper plate and the third clamping lower plate, and the third clamping upper plate and the third clamping lower plate can cooperate to clamp the white film.

[0027] Preferably, it also includes a support assembly arranged between the first flip assembly and the second flip assembly, the support assembly includes a support plate and a support cylinder, and the support cylinder drives the support plate to move along the Z-axis direction.

[0028] Preferably, it also includes a second camera for alignment, wherein the second camera is placed directly above the flipping mechanism; and the second camera is connected to the controller.

[0029] Preferably, the unloading device is mounted above the flipping assembly, and includes a fourth Y-axis moving module, a fourth X-axis moving module, a fourth Z-axis moving module and a second grabbing assembly, the fourth Y-axis moving module drives the fourth X-axis moving module to move, the fourth X-axis moving module drives the fourth Z-axis moving module to move, and the fourth Z-axis moving module drives the second grabbing assembly to move; the second grabbing assembly includes a plurality of suction cups arranged in an array, and the suction cups are connected to an external vacuum pumping device.

[0030] Preferably, it also includes a weighing device arranged on one side of the flipping mechanism and a coding mechanism arranged on one side of the weighing device; the weighing device and the coding mechanism are connected to the controller.

[0031] The coding mechanism includes a linear motion module, a first coding cylinder, a second coding cylinder and a coding device. The linear motion module drives the first coding cylinder to move in a direction parallel to the edge of the weighing device, the first coding cylinder drives the second coding cylinder to move relative to the weighing device; the second coding cylinder drives the coding device to move in the Z-axis direction.

[0032] The present invention has the following beneficial effects:

[0033] The present invention can tightly fit the white film on the wafer through the cooperation of the film pressing mechanism and the feeding mechanism, providing the necessary prerequisite for thorough gold tearing. The white film attached to the surface of the wafer is torn off through the cooperation of the film pulling mechanism, the film pressing mechanism and the feeding mechanism. The force on the surface of the wafer is relatively small, and the wafer can be simply limited by the limiting station. No vacuum adsorption is required, the process is simpler and more convenient, and the gold is torn off thoroughly, and the possibility of wafer damage is low. The white film adhering to the metal is cut off, turned over, and fit to each other through the cooperation of the film pulling mechanism, the cutting knife mechanism and the flipping mechanism, which can facilitate the unloading of the white film. The present invention realizes the fully automatic loading, gold tearing and unloading of the wafer, and the efficiency is high. In addition, the present invention arranges each device and mechanism in at least three layers of space, and each device and mechanism is reasonably and compactly arranged in space, which can make the overall volume of the equipment smaller, with high integration, and convenient for factory layout and transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a schematic diagram of the present invention.

[0035] Figure 2 It is a schematic diagram of another viewing angle of the present invention.

[0036] Figure 3 It is a front view of the present invention.

[0037] Figure 4 Schematic diagram of the raw material rack.

[0038] Figure 5 It is a schematic diagram of the feeding device (the first X-axis moving module is hidden).

[0039] Figure 6 A schematic diagram of the jacking frame.

[0040] Figure 7 This is a schematic diagram of the material taking device.

[0041] Figure 8 It is a schematic diagram of the film supply mechanism.

[0042] Fig. 9Schematic diagram of the film supply mechanism (white film roll is hidden).

[0043] Fig.10 It is a schematic diagram of the coordination of the feeding mechanism, the film pressing mechanism, the cutting mechanism, the flipping mechanism and the film pulling mechanism.

[0044] Fig.11 Schematic diagram of the film pressing mechanism.

[0045] Fig.12 Schematic diagram of the cutter mechanism.

[0046] Fig.13 Schematic diagram of the film pulling mechanism.

[0047] Fig.14 is a schematic diagram of a first flip assembly.

[0048] Fig.15 The figure is a schematic diagram of the installation of the support assembly.

[0049] Fig.16 Schematic diagram of the feeding device.

[0050] Fig.17 It is a schematic diagram of the coding mechanism.

[0051] Main component symbols:

[0052] Installation platform 10, first high-rise 11, second high-rise 12, third high-rise 13;

[0053] Raw material rack 20, carrier 21, photoelectric sensor 221, induction sheet 222;

[0054] Feeding device 30, first X-axis moving module 31, fixing plate 32, first Y-axis moving module 33, carrier 34, base plate 341, carrier plate 342, limit station 3421, guide hole 3422, through hole 3423, first Z-axis moving module 343, lifting frame 344, bottom plate 3441, guide rod 3442, support rod 3443;

[0055] A material taking device 40, a second X-axis moving module 41, a second Y-axis moving module 42, a second Z-axis moving module 43, a grabbing member 441, and a first camera 45;

[0056] Film supply mechanism 50, white film roll 51, white film 511, first clamping member 52, second clamping member 53, film supply frame 54, sliding block 55, clamping cylinder 56, film supply motor 57;

[0057] Film pressing mechanism 60, film pressing cylinder 61, first mounting plate 62, guide sleeve 621, second mounting plate 63, guide column 631, film pressing roller 64, slide bar 651, stopper 6511, baffle 6522;

[0058] Cutter mechanism 70, cutter frame 71, support plate 711, knife groove 712, avoidance groove 713, third X-axis moving module 72, blade 73, first clamping film cylinder 74, first clamping film upper plate 75, first clamping film lower plate 76;

[0059] Film pulling mechanism 80, third Y-axis moving module 81, slide seat 82, second film clamping cylinder 83, second film clamping upper plate 84, second film clamping lower plate 85;

[0060] A first flip assembly 91, a first flip cylinder 911, a second flip cylinder 912, a rotating cylinder 913, a clamping claw cylinder 914, a third clamping film upper plate 915, a third clamping film lower plate 916, a second flip assembly 92, a supporting assembly 93, a supporting plate 931, a supporting cylinder 932, and a second camera 94;

[0061] A material unloading device 100, a fourth Y-axis moving module 101, a fourth X-axis moving module 102, a fourth Z-axis moving module 103, a second grabbing assembly 104, and a suction cup 1041;

[0062] Weighing device 110;

[0063] A coding mechanism 120, a linear moving module 121, a first coding cylinder 122, a second coding cylinder 123, and a coding device 124;

[0064] Collection frame 130;

[0065] Wafer 140. DETAILED DESCRIPTION

[0066] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0067] like Figures 1 to 17 As shown, the present invention discloses an automatic wafer gold peeling device, which includes: a controller, a raw material rack 20, a film supply mechanism 50, a feeding device 30, a material taking device 40, a film pressing mechanism 60, a cutter mechanism 70, a flipping mechanism, a film pulling mechanism 80, a material unloading device 100, a weighing device 110 and a coding mechanism 120. The controller is a PLC, and the weighing device 110 is an electronic scale.

[0068] In order to facilitate the centralized placement and fixation of various devices and mechanisms, an installation platform 10 is provided, and the installation platform 10 includes a first shelf high level 11, a second shelf high level 12, and a third shelf high level 13 arranged in sequence along the Y-axis direction. Among them, the raw material rack 20 is arranged on the first shelf high level 11. The film supply mechanism 50 is arranged on the third shelf high level 13, or the film supply mechanism 50 is independently elevated and arranged on the installation platform 10, and the film supply mechanism 50 is located on the side of the third shelf high level 13 away from the first shelf high level 11. The arrangement of the raw material rack 20 and the film supply mechanism 50 facilitates the feeding of the wafer 140 and the white film roll 51.

[0069] There are two groups of raw material racks 20, which are arranged at intervals on the first rack high layer 11, and the two groups of raw material racks 20 are arranged side by side in the X-axis direction. There are two layers on the raw material rack 20, and three sets of carriers 21 are positioned and placed at equal intervals on each layer, that is, all the carriers 21 are arranged in an array on the raw material rack 20, so as to be easily grasped in an orderly manner by the material picking device 40. The carrier 21 is provided with a number of positioning grooves for placing wafers 140 at equal intervals in the vertical direction (Z-axis direction), and the wafers 140 are positioned and stacked on the carrier 21 at equal intervals. The carrier 21 can be replaced to facilitate loading and unloading. Each position on the raw material rack 20 where the carrier 21 is placed is provided with a detection element for detecting whether there are wafers 140 stacked on the carrier 21. A photoelectric sensor 221 and its matching induction sheet 222 can be selected, and the detection element is connected to the controller.

[0070] The feeding device 30 is installed on the mounting platform 10 and is placed below the raw material rack 20 and the film supply mechanism 50. It includes a first X-axis moving module 31 and two groups of feeding mechanisms. The first X-axis moving module 31 drives a fixed plate 32 to move along the X-axis direction. Both groups of feeding mechanisms are arranged on the fixed plate 32, that is, the two groups of feeding mechanisms can move synchronously in the X-axis direction. In particular, when any feeding mechanism is placed directly below the raw material rack 20, the other feeding mechanism is just opposite to the film supply mechanism 50. This arrangement can ensure that when one feeding mechanism cooperates with the gold-tearing operation, the other feeding mechanism can cooperate with the material-retrieving device 40 to put the gold-teared wafer 140 back to the carrier 21, and at the same time place the untorn gold wafer 140 into the feeding mechanism, thereby realizing a cyclic operation and improving efficiency.

[0071] The feeding mechanism includes a first Y-axis moving module 33 and a carrier 34. The first Y-axis moving module 33 drives the carrier 34 to move along the Y-axis direction. Through the cooperation of the first X-axis moving module 31, the carrier 34 moves back and forth between the raw material rack 20 and the film supply mechanism 50. The carrier 34 includes a substrate 341, a carrier plate 342, four sets of first Z-axis moving modules 343 and twelve sets of lifting frames 344. The top surface of the carrier plate 342 is partially recessed to form twelve limit stations 3421. These twelve limit stations 3421 are arranged in an array (four rows and three columns). It is best that the number of columns of the carrier 21 is equal to the number of columns of the limit stations 3421 and corresponds one to one. The limit station 3421 is a groove that matches the shape of the wafer 140. The wafer 140 falls into the groove and thus plays a role in limiting the wafer 140. The lifting frame 344 corresponds to the limiting station 3421 one by one, and includes a bottom plate 3441, four guide rods 3442 and four support rods 3443. The support rods 3443 are arranged circumferentially on the bottom plate 3441, and the guide rods 3442 are arranged circumferentially on the bottom plate 3441, and the guide rods 3442 are placed outside the support rods 3443, and the length of the guide rods 3442 is slightly greater than the length of the support rods 3443. The carrier plate 342 is provided with guide holes 3422 that match the guide rods 3442 one by one and through holes 3423 that match the support rods 3443 one by one. The first Z-axis moving module 343 is set on the base plate 341. The number of the first Z-axis moving modules 343 is equal to the number of rows of the limit stations 3421 and corresponds one to one. All the lifting frames 344 in the same row are driven by the first Z-axis moving module 343, so that the lifting frames 344 can move relative to the carrier plate 342, and the lifting frames 344 in the same row move synchronously.

[0072] When the lifting frame 344 moves relative to the carrier plate 342, the guide rod 3442 and the support rod 3443 can pass through the upper surface of the carrier plate 342, and the guide rod 3442 cooperates with the guide hole 3422 to ensure that the top surface of the support rod 3443 is flush, so that the support rod 3443 can reliably support the wafer 140. In addition, the guide rod 3442 can be tangent to the outer edge of the wafer 140, and because the length of the guide rod 3442 is greater than the length of the support rod 3443, a round head or a bevel can be set on the top of the guide rod 3442, which can guide and limit the wafer 140 when the wafer 140 is to be placed in the limit station 3421, so that after the lifting frame 3444 is lowered, the wafer 140 can accurately fall into the limit station 3421. The guide rod 3442 and the support rod 3443 can be completely submerged below the upper surface of the carrier plate 342.

[0073] The above-mentioned first X-axis moving module 31 and second X-axis moving module 41 are both linear moving modules 121 driven by motors, which are existing mature technologies, generally including a mounting seat, a motor, a guide rail, a slider and a screw, wherein the motor and the guide rail are fixed on the mounting seat, the screw is rotatably connected to the mounting seat, the slider is slidably connected to the guide rail, and the slider can only move along the length direction of the guide rail, and the slider can only be separated from the end of the guide rail. At the same time, the slider is also threadedly connected to the screw, and the motor is transmission-connected to the screw. The first X-axis moving module 31 drives the fixed plate 32 to move, that is, by fixing the fixed plate 32 on the slider corresponding to the first X-axis moving module 31. The motor is connected to a controller. The first Z-axis moving module 343 is a cylinder, and the first Z-axis moving module 343 drives the lifting frame 344 to move, that is, by fixing the push rod of the cylinder to the bottom plate 3441 of the lifting frame 344. The cylinder is connected to a controller.

[0074] There are two sets of material picking devices 40, which correspond to the raw material racks 20 one by one. The material picking devices 40 are arranged on the second rack layer 12, and include a second X-axis moving module 41, a second Y-axis moving module 42, a second Z-axis moving module 43, a first grabbing assembly and a first camera 45. The second X-axis moving module 41, the second Y-axis moving module 42 and the second Z-axis moving module 43 are the same as the first X-axis moving module 31, and will not be repeated. The second X-axis moving module 41 drives the second Y-axis moving module 42 to move along the X-axis direction. The two sets of second X-axis moving modules 41 can be set independently or integrated into one by sharing a mounting seat and a guide rail. The latter is preferred in the present invention to facilitate layout and assembly. The second Y-axis moving module 42 drives the second Z-axis moving module 43 to move along the Y-axis direction, and the second Z-axis moving module 43 drives the first grabbing assembly to move along the Z-axis direction.

[0075] The first grabbing assembly includes a grabbing member 441, which is a fork plate. The wafer 140 is taken out from the carrier 21 by forking. Because the support rod 3443 can extend out of the carrier plate 342, the wafer 140 can be conveniently placed on the support rod 3443 by moving the second Y-axis moving module 42 up and down. Similarly, when the wafer 140 on the support rod 3443 needs to be forked, the grabbing member 441 can extend from the gap between the support rods 3443 to fork the wafer 140. In order to ensure accurate alignment, a first camera 45 is provided. The first camera 45 is fixed on the mounting seat corresponding to the second Y-axis moving module 42 and connected to the controller. The first camera 45 is an industrial camera (CCD camera) with a fast image processing speed, which can facilitate the controller to quickly control the second X-axis moving module 41, the second Y-axis moving module 42 and the second Z-axis moving module 43 to fine-tune the position of the first grabbing assembly, so that the wafer 140 forked by the grabbing member 441 can accurately fall into the limit position 3421. As another preferred embodiment, the first grabbing assembly can be provided with three grabbing members 441, and the carrier 21, the grabbing member 441, and the limit position 3421 correspond one to one. When the material picking device 40 grabs the wafer 140, it only needs to move up and down, which can improve the grabbing efficiency of the wafer 140, and the wafer 140 is less likely to be displaced during the movement, which is convenient for positioning and placing in the limit position 3421 or sending back the carrier 21. In this case, the second X-axis moving module 41 and the first industrial camera can even be removed to further simplify the equipment.

[0076] The film supply mechanism 50 is used to supply the white film 511, and includes a white film roll 51, a first clamping member 52, a second clamping member 53, a film supply frame 54, a sliding block 55, a clamping cylinder 56 and a film supply motor 57. The white film roll 51 is a consumable material and needs to be replaced after it is used up, so the film supply mechanism 50 is designed as a structure that is convenient for disassembly and assembly of the white film roll 51. Specifically, the first clamping member 52 is rotatably connected to the film supply frame 54, and the first clamping member 52 cannot move relative to the film supply frame 54, and the film supply motor 57 is transmission-connected to the first clamping member 52. The second clamping member 53 is rotatably connected to the sliding block 55 and the second clamping member 53 cannot move relative to the sliding block 55. The sliding block 55 is slidably connected to the film supply frame 54, and the clamping cylinder 56 drives the sliding block 55 to move, so that the second clamping member 53 can move relative to the first clamping member 52. The clamping cylinder 56 is connected to the controller. The first clamping member 52 and the second clamping member 53 are adapted to the reel cavity of the white film roll 51. The first clamping member 52 and the second clamping member 53 can be inserted into the reel cavity and expanded, and the white film roll 51 is clamped and fixed by the cooperation of the first clamping member 52 and the second clamping member 53. The film supply motor 57 is connected to the controller. By controlling the operation of the film supply motor 57, the discharge speed of the white film 511 on the white film roll 51 can be controlled, so as to tighten the white film 511 and facilitate the subsequent operations such as laminating and tearing the white film 511.

[0077] The film pressing mechanism 60 is arranged at the bottom of the third frame layer 13 and is placed above the feeding mechanism. The film pressing mechanism 60 is arranged close to the film supply mechanism 50. The film pressing mechanism 60 includes a film pressing cylinder 61, a first mounting plate 62, a second mounting plate 63, two film pressing rollers 64 and four sets of telescopic components. The base of the film pressing cylinder 61 is fixed to the first mounting plate 62. At the same time, the first mounting plate 62 and / or the base of the film pressing cylinder 61 are fixed to the bottom of the third frame layer 13 to support the film pressing mechanism 60. Two guide sleeves 621 are arranged on the first mounting plate 62, and guide posts 631 corresponding to the guide sleeves 621 are arranged on the second mounting plate 63. The guide posts 631 are slidably connected in the guide sleeves 621. At the same time, the second mounting plate 63 is connected to the push rod of the film pressing cylinder 61. The film pressing cylinder 61 is connected to the controller.

[0078] The telescopic assembly includes a slide bar 651 and a spring. A sliding hole matching the slide bar 651 is provided on the second mounting plate 63, and the slide bar 651 is slidably connected in the sliding hole. A stopper 6511 (such as a screw) matching the sliding hole is provided at the upper end of the slide bar 651, and a baffle 6522 matching the spring is provided at the lower end of the slide bar 651. The spacing between the stopper 6511 and the baffle 6522 of each slide bar 651 is equal. The spring is sleeved on the slide bar 651, and the two ends of the spring abut against the baffle 6522 and the second mounting plate 63 respectively. The end of the film pressing roller 64 is connected to the lower end of the slide bar 651, and the bottoms of all the film pressing rollers 64 are arranged flush. The arrangement of the telescopic assembly enables the film pressing roller 64 to play a role in buffering and protecting the wafer 140 when pressing the white film 511 onto the surface of the wafer 140.

[0079] The cutter mechanism 70 is used to cut the white film 511, and is arranged on the third frame layer 13 and placed above the film pressing mechanism 60. The cutter mechanism 70 includes a cutter frame 71, a third X-axis moving module 72, a blade 73, two first film clamping cylinders 74, two first film clamping upper plates 75 and two first film clamping lower plates 76. The third X-axis moving module 72 is the same as the first X-axis moving module 31. The cutter frame 71 is provided with a passage for the white film 511 to pass through. The third X-axis moving module 72 is arranged on the cutter frame 71, and the third X-axis moving module 72 drives the blade 73 to move along the X-axis direction. Through the drive of the third X-axis moving module 72, the blade 73 can cut off the white film 511. A support plate 711 cooperating with the blade 73 can also be arranged on the cutter frame 71, and the support plate 711 is provided with a knife groove 712 adapted to the blade 73. The support plate 711 and the knife groove 712 are provided to facilitate the blade 73 to smoothly cut the white film 511, so that the incision can be relatively smooth.

[0080] The first film clamping cylinder 74, the first film clamping upper plate 75 and the first film clamping lower plate 76 correspond to each other, and the first film clamping cylinder 74 is connected to the controller. The bases of the two first film clamping cylinders 74 are respectively arranged on both sides of the cutter frame 71, and the first film clamping lower plate 76 is placed directly below the first film clamping cylinder 74. The push rod of the first film clamping cylinder 74 is connected to the first film clamping upper plate 75 and drives the first film clamping upper plate 75 to move relative to the first film clamping lower plate 76. Under normal conditions, the white film 511 passes through the gap between the first film clamping upper plate 75 and the first film clamping lower plate 76, and the first film clamping upper plate 75 and the second film clamping lower plate 85 cooperate to clamp and fix the white film 511. When the white film 511 needs to be cut off, the first film upper plate 75 and the second film lower plate 85 first clamp the white film 511 to prevent the new end of the white film 511 from falling off after cutting. Similarly, in order to facilitate the film pulling mechanism 80 to pick up the new end of the white film 511, a certain distance is left between the first film upper plate 75 (and the first film lower plate 76) and the blade 73, so as to expose the new end of the white film 511 for a distance.

[0081] The film pulling mechanism 80 is arranged on the third frame layer 13, and the film pulling mechanism 80 pulls the white film 511 through the film pressing mechanism 60, the cutting mechanism 70 and the turning mechanism in sequence. In order to prevent the movement track of the white film 511 from interfering with the various mechanisms, some guide rollers can be arranged to adjust the movement track of the white film 511. The film pulling mechanism 80 includes a third Y-axis moving module 81, a slide 82, two second film clamping cylinders 83, two first film clamping upper plates 75 and two second film clamping lower plates 85. The third Y-axis moving module 81 is connected to the first X-axis moving module 31, and the second film clamping cylinder 83 is connected to the controller. The third Y-axis moving module 81 drives the slide 82 to move, and the second film cylinder 83, the second film upper plate 84 and the second film lower plate 85 correspond to each other. The second film lower plate 85 and the seat of the second film cylinder 83 are fixed on the slide 82, and the second film upper plate 84 is connected to the push rod of the second film cylinder 83. The second film upper plate 84 and the second film lower plate 85 can clamp the white film 511. The second film upper plate 84 and the second film lower plate 85 extend forward relative to the slide 82 (toward the direction of the cutter mechanism 70) to facilitate clamping the white film 511. At the same time, the first film lower plate 76 and the second film lower plate 85 are staggered to avoid collision. The top surface of the first film lower plate 76 is flush with the top surface of the second film lower plate 85, so that when the film pulling mechanism 80 and the cutter structure clamp the white film 511 at the same time, the white film 511 is placed flat. When the second clamping film lower plate 85 moves toward the cutting mechanism 70, its limit position exceeds the blade 73 so as to firmly clamp the white film 511. In order to avoid interference, an avoidance groove 713 for avoiding the second clamping film upper plate 84 and the second clamping film lower plate 85 is provided on the cutting mechanism 70 (on the supporting plate 711).

[0082] The flip mechanism includes a first flip assembly 91 and a second flip assembly 92, which are arranged opposite to each other, and the white film 511 can pass between the first flip assembly 91 and the second flip assembly 92. The first flip assembly 91 and the second flip assembly 92 each include a first flip cylinder 911, a second flip cylinder 912, a rotating cylinder 913, a clamping claw cylinder 914, a third clamping film upper plate 915 and a third clamping film lower plate 916, wherein the first flip cylinder 911, the second flip cylinder 912, the rotating cylinder 913 and the clamping claw cylinder 914 are all connected to the controller. The first flip cylinder 911 drives the second flip cylinder 912 to move along the Z-axis direction, the second flip cylinder 912 drives the rotating cylinder 913 to move along the X-axis direction, the rotating cylinder 913 drives the clamping cylinder 914 to rotate, and the two claws of the clamping cylinder 914 are respectively connected to the third clamping film upper plate 915 and the third clamping film lower plate 916, and the third clamping film upper plate 915 and the third clamping film lower plate 916 cooperate to clamp the white film 511. Under normal conditions, the third clamping film upper plate 915 and the third clamping film lower plate 916 are placed horizontally, and the white film 511 passes through the gap between them.

[0083] A support assembly 93 is also provided between the first flip assembly 91 and the second flip assembly 92. The support assembly 93 includes a support plate 931 and a support cylinder 932. The support cylinder 932 drives the support plate 931 to move along the Z-axis direction. The support cylinder 932 is connected to the controller. Under normal conditions, the top surface of the support plate 931 does not exceed the top surface of the first clamping film lower plate 76. In addition, a second camera 94 is provided directly above the support plate 931. The second camera 94 is connected to the controller. The second camera 94 is used for alignment with the first camera 45.

[0084] When the material picking device 40 places the wafers 140 to be stripped at the limit station 3421 on the carrier 34, the first Y-axis moving module 33 corresponding to the carrier 34 drives it to come between the film pressing mechanism 60 and the film supply mechanism 50. When the carrier 34 moves toward the direction of the raw material rack 20 again and the carrier 34 begins to be placed directly under the film pressing roller 64, the film pressing mechanism 60 is pressed down. At the same time, the film pulling mechanism 80 begins to pull the white film 511. The pulling speed of the film pulling mechanism 80 is equal to the moving speed of the carrier 34. The film pressing roller 64 can press the white film 511 tightly onto the surface of the wafer 140. In this process, controlling the discharge speed of the film supply mechanism 50 can ensure that the white film 511 is taut, and it is not easy to have the problem of wrinkles on the white film 511 and the metal part on the wafer 140 is not bonded, which is conducive to ensuring that the gold stripping is thorough. As the carrier 34 continues to move, when the wafer 140 on it begins to escape from the area directly below the film pressing roller 64, the white film 511 also begins to move obliquely upward in a direction tangent to the outer periphery of the film pressing roller 64, thereby tearing the white film 511 from the surface of the wafer 140, and the metal on the surface of the wafer 140 adheres to the white film 511, thereby achieving metal tearing. During the metal tearing process, the wafer 140 is limited by the pressure of the film pressing roller 64 and the limitation of the limit station 3421, and the wafer 140 will not escape from the limit station 3421. When the entire wafer 140 escapes from the squeezing of the film pressing roller 64, only a little part of the white film 511 and the wafer 140 are left. The limit station 3421 can completely ensure that the wafer 140 is not taken away by the white film 511, and at this time, the guide rod 3442 can also extend a part of the carrier plate 342 (the support rod 3443 cannot be extended) to strengthen the limiting effect on the wafer 140.

[0085] The metal peeled off from the wafer 140 adheres to the white film 511 in an array. For the sake of convenience of explanation, this part of the white film 511 is defined as a metal film. As the film pulling mechanism 80 continues to pull, the metal film comes to the top of the support plate 931. The second camera 94 can stop the metal film at a relatively fixed position to facilitate the bonding of the adhesive surfaces of the two metal films. After the metal film positioning stops, the third clamping film upper plate 915 and the third clamping film lower plate 916 cooperate to clamp the metal film. At the same time, the first clamping film upper plate 75 and the first clamping film lower plate 76 cooperate to clamp the metal film, the blade 73 cuts off, the film pulling mechanism 80 is released, and the flipping mechanism flips the metal film 180°. Then the second clamping film upper plate 84 and the second clamping film lower plate 85 pass under the metal film flipped 180°, continue to clamp a metal film from the position of the cutting mechanism and pull it to the support plate 931, and align the upper and lower metal films through the second camera 94 so that the metals can be facing each other. The flipping mechanism drives the clamped metal film to move down, and the support plate 931 moves up at the same time, so that the two metal films are bonded together, and the blade 73 cuts off. At this point, a metal tearing and bonding cycle is completed.

[0086] The unloading device 100 is mounted on the third frame layer 13 and is located above the flipping mechanism and the weighing platform. It includes a fourth Y-axis moving module 101, a fourth X-axis moving module 102, a fourth Z-axis moving module 103 and a second grabbing assembly 104. The fourth Y-axis moving module 101 and the fourth X-axis moving module 102 are the same as the first X-axis moving module 31, and the fourth Z-axis moving module 103 is a cylinder. The fourth Y-axis moving module 101 drives the fourth X-axis moving module 102 to move along the Y-axis direction, the fourth X-axis moving module 102 drives the fourth Z-axis moving module 103 to move along the X-axis direction, and the fourth Z-axis moving module 103 drives the second grabbing assembly 104 to move along the Z-axis direction. The second grabbing assembly 104 includes a plurality of suction cups 1041 arranged in an array, and the suction cups 1041 are connected to an external vacuum pumping device. The metal film can be easily adsorbed by vacuum adsorption. The metal film is light in weight, and the suction cup 1041 is subjected to little force and is not easily damaged.

[0087] The weighing device 110 is arranged on one side of the flipping mechanism, and the coding mechanism 120 is arranged on one side of the weighing device 110, which includes a linear moving module 121, a first coding cylinder 122, a second coding cylinder 123 and a coding device 124. The linear moving module 121 is the same as the first X-axis moving module 31. The linear moving module 121 drives the first coding cylinder 122 to move in a direction parallel to the edge of the weighing device 110, the first coding cylinder 122 drives the second coding cylinder 123 to move relative to the weighing device 110, and the second coding cylinder 123 drives the coding device 124 to move in the Z-axis direction. The weighing device 110, the linear moving module 121, the first coding cylinder 122, the second coding cylinder 123 and the coding device 124 are all connected to the controller. The unloading device 100 grabs the two metal films bonded together and places them on a weighing platform for weighing, then sprays the weight and other information, and finally the unloading device 100 stacks the metal films after spraying the codes at a designated location. A collection frame 130 can be placed on the installation platform 10 for stacking.

[0088] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by any technician familiar with the technical field within the technical scope disclosed by the present invention should be covered within the protection scope of the present invention.

Claims

1. A wafer automatic gold tearing device, characterized in that: include: At least one raw material rack for stacking wafers; A film supply mechanism, used for supplying white film; A feeding device is placed below the raw material rack and the film supply mechanism, the feeding device includes at least one group of feeding mechanisms, the feeding mechanism is provided with a plurality of limiting positions for limiting the placement of wafers, the feeding mechanism drives the limiting positions to move back and forth between the raw material rack and the film supply mechanism; the feeding mechanism includes a first Y-axis moving module and a carrier, the first Y-axis moving module drives the carrier to move; the carrier includes a substrate, a carrier plate, a plurality of first Z-axis moving modules and a plurality of lifting frames; the top surface of the carrier plate is partially recessed to form a limiting position, and the lifting frame corresponds to the limiting position one by one; The lifting frame includes a bottom plate, a plurality of guide rods and a plurality of support rods, wherein the support rods are arranged circumferentially on the bottom plate, the guide rods are arranged circumferentially on the bottom plate, the guide rods are placed on the outside of the support rods, and the length of the guide rods is greater than the length of the support rods; the carrier plate is provided with guide holes that match the guide rods one by one and through holes that match the support rods one by one; the first Z-axis moving module is arranged on the base plate, the number of the first Z-axis moving modules is equal to and corresponds to the number of rows of the limit stations, and the first Z-axis moving module synchronously drives all the lifting frames belonging to the same row to move relative to the carrier plate; At least one material taking device, used to grab the wafers on the raw material rack and place them on the limiting position, or grab the wafers on the limiting position and stack them on the raw material rack; The film pressing mechanism is placed above the feeding mechanism and is arranged close to the film supply mechanism, and the film pressing mechanism and the feeding mechanism cooperate to closely fit the white film on the surface of the wafer placed on the feeding mechanism; the film pressing mechanism comprises a film pressing cylinder, a first mounting plate, a second mounting plate, at least one film pressing roller and at least two telescopic components, the seat body of the film pressing cylinder is fixed to the first mounting plate, the first mounting plate is provided with at least one guide sleeve, the second mounting plate is connected to the push rod of the film pressing cylinder, the second mounting plate is provided with a guide column corresponding to the guide sleeve one by one, and the guide column is slidably connected in the guide sleeve; the telescopic component comprises a slide bar and a spring, the second mounting plate is provided with a slide hole that cooperates with the slide bar, and the slide bar is slidably connected in the slide hole; the upper end of the slide bar is provided with a limit piece that cooperates with the slide hole, and the lower end is provided with a baffle that cooperates with the spring; the spring sleeve is arranged on the slide bar, and the two ends of the spring respectively abut the baffle and the second mounting plate; the end of the film pressing roller is connected to the lower end of the slide bar; The bottoms of all the laminating rollers are arranged flush with each other; A cutter mechanism, placed above the film pressing mechanism, for cutting off the white film; Flipping mechanism, used to flip the cut white film 180°; The film-pulling mechanism pulls the white film through the film-pressing mechanism, the cutter mechanism and the flipping mechanism in sequence; the film-pulling mechanism, the film-pressing mechanism and the feeding mechanism cooperate to tear off the white film adhered to the surface of the wafer; the film-pulling mechanism and the cutter mechanism cooperate to fix the white film; the film-pulling mechanism, the cutter mechanism and the flipping mechanism cooperate to adhere the white film flipped 180° to the white film fixed by the film-pulling mechanism and the cutter mechanism; the film-pulling mechanism comprises a third Y-axis moving module, a slide seat, two second film clamping cylinders, two second film clamping upper plates and two second film clamping lower plates, the third Y-axis moving module drives the slide seat to move, the second film clamping cylinder, the second film clamping upper plate and the second film clamping lower plate correspond one to one, the second film clamping lower plate and the seat body of the second film clamping cylinder are fixed on the slide seat, the second film clamping upper plate is connected to the push rod of the second film clamping cylinder, and the second film clamping upper plate and the second film clamping lower plate cooperate to clamp the white film; The unloading device is used to grab the two sheets of white film that are bonded together and place them at a designated location; A controller is connected to the feeding device, the material taking device, the film supply mechanism, the film pressing mechanism, the cutter mechanism, the turning mechanism, the film pulling mechanism and the material unloading device.

2. The automatic wafer gold stripping device according to claim 1, characterized in that: The number of the raw material racks is two groups, the feeding device also includes a first X-axis moving module, the number of the feeding mechanisms is two groups, the first X-axis moving module drives the two groups of feeding mechanisms to move synchronously, and when any one of the feeding mechanisms is placed directly below the raw material rack, the other feeding mechanism is facing the film supply mechanism.

3. The automatic wafer gold stripping device according to claim 1, characterized in that: A plurality of carriers are positioned and placed on the raw material rack, and the carriers are arranged in an array on the raw material rack; the limiting stations are arranged in an array on the feeding mechanism, and the number of columns of the carriers is equal to the number of columns of the limiting stations and corresponds one to one.

4. The automatic wafer gold stripping device according to claim 2, characterized in that: The number of the material picking devices is two groups, including a second X-axis moving module, a second Y-axis moving module, a second Z-axis moving module and a first grabbing component. The second X-axis moving module drives the second Y-axis moving module to move, the second Y-axis moving module drives the second Z-axis moving module to move, the second Z-axis moving module drives the first grabbing component to move, and the first grabbing component includes at least one grabbing member; the first X-axis moving modules corresponding to the two groups of the material picking devices are independently arranged or integrated into one.

5. The automatic wafer gold stripping device according to claim 4, characterized in that: The material picking device also includes a first camera for alignment, and the first camera is arranged on the second Y-axis moving module; the first camera is connected to the controller.

6. The automatic wafer gold stripping device according to claim 1, characterized in that: The film supply mechanism includes a white film roll, a first clamping member, a second clamping member, a film supply frame, a sliding block, a clamping cylinder and a film supply motor. The first clamping member is rotatably connected to the film supply frame, and the film supply motor is transmission-connected to the first clamping member; the second clamping member is rotatably connected to the sliding block, and the sliding block is slidably connected to the film supply frame, and the clamping cylinder drives the sliding block to move the second clamping member relative to the first clamping member; the first clamping member and the second clamping member cooperate to clamp and fix the white film roll.

7. The automatic wafer gold stripping device according to claim 1, characterized in that: The cutter mechanism includes a cutter frame, a third X-axis moving module, a blade, two first film clamping cylinders, two first film clamping upper plates and two first film clamping lower plates. The third X-axis moving module is arranged on the cutter frame, and the third X-axis moving module drives the blade to move; the first film clamping cylinder, the first film clamping upper plate and the first film clamping lower plate correspond to each other one by one, and the seats of the two first film clamping cylinders are respectively arranged on both sides of the cutter frame, and the first film clamping lower plate is placed directly below the first film clamping cylinder. The push rod of the first film clamping cylinder is connected to the first film clamping upper plate and drives the first film clamping upper plate to move relative to the first film clamping lower plate. The first film clamping upper plate and the second film clamping lower plate cooperate to clamp the white film.

8. The automatic wafer gold stripping device according to claim 7, characterized in that: The top surface of the first clamping membrane lower plate is flush with the top surface of the second clamping membrane lower plate, and the first clamping membrane lower plate and the second clamping membrane lower plate are staggered. The limit position of the second clamping membrane lower plate when moving toward the cutting mechanism exceeds the blade, and the cutting mechanism is provided with an avoidance groove for avoiding the second clamping membrane upper plate and the second clamping membrane lower plate.

9. The automatic wafer gold stripping device according to claim 1, characterized in that: The flipping mechanism includes a first flipping component and a second flipping component, the first flipping component and the second flipping component are arranged opposite to each other, and the white film can pass between the first flipping component and the second flipping component; the first flipping component and the second flipping component both include a first flipping cylinder, a second flipping cylinder, a rotating cylinder, a clamping cylinder, a third clamping film upper plate and a third clamping film lower plate, the first flipping cylinder drives the second flipping cylinder to move along the Z-axis direction, the second flipping cylinder drives the rotating cylinder to move along the X-axis direction, the rotating cylinder drives the clamping cylinder to rotate, the two claws of the clamping cylinder are respectively connected to the third clamping film upper plate and the third clamping film lower plate, the third clamping film upper plate and the third clamping film lower plate can cooperate to clamp the white film.

10. The automatic wafer gold stripping device according to claim 9, characterized in that: It also includes a support assembly arranged between the first flip assembly and the second flip assembly, the support assembly includes a support plate and a support cylinder, and the support cylinder drives the support plate to move along the Z-axis direction.

11. The automatic wafer gold stripping device according to claim 1, characterized in that: It also includes a second camera for alignment, wherein the second camera is placed just above the flipping mechanism; and the second camera is connected to the controller.

12. The automatic wafer gold stripping device according to claim 1, characterized in that: The unloading device is mounted above the flip assembly, and includes a fourth Y-axis moving module, a fourth X-axis moving module, a fourth Z-axis moving module and a second grabbing assembly. The fourth Y-axis moving module drives the fourth X-axis moving module to move, the fourth X-axis moving module drives the fourth Z-axis moving module to move, and the fourth Z-axis moving module drives the second grabbing assembly to move; the second grabbing assembly includes a plurality of suction cups arranged in an array, and the suction cups are connected to an external vacuum pumping device.

13. The automatic wafer gold stripping device according to claim 1, characterized in that: It also includes a weighing device arranged on one side of the flipping mechanism and a coding mechanism arranged on one side of the weighing device; the weighing device and the coding mechanism are connected to a controller; The coding mechanism includes a linear motion module, a first coding cylinder, a second coding cylinder and a coding device. The linear motion module drives the first coding cylinder to move in a direction parallel to the edge of the weighing device, the first coding cylinder drives the second coding cylinder to move relative to the weighing device; the second coding cylinder drives the coding device to move in the Z-axis direction.

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