Automatic ball planting device and automatic ball planting method

Abstract

The present invention discloses an automatic ball planting device and an automatic ball planting method, comprising a frame, a station rotating mechanism, the station rotating mechanism comprising a turntable rotatably arranged on the frame, a carrier arranged on the turntable and used to load chips, and a ball holding portion arranged on the turntable and used to place solder balls; a chip scraping mechanism, the chip scraping mechanism being arranged on the frame and located on one side of the turntable, the chip scraping mechanism comprising a scraping assembly located above the turntable, the scraping assembly reciprocating along the radial direction of the turntable to apply solder paste to the chip; and a ball planting mechanism, the ball planting mechanism being arranged on the frame and located on one side of the turntable, the ball planting mechanism comprising a suction cup for sucking and releasing solder balls; wherein the solder balls in the ball holding portion and the chips coated with paste by the scraping assembly are replaced under the suction cup by the rotation of the turntable. The present invention solves the problem that manual operation leads to low chip production efficiency, wastes manpower, and difficulty in ensuring chip quality consistency.

Description

Technical Field

[0001] The present invention relates to the field of chip recycling production, and in particular to an automatic ball planting device and an automatic ball planting method. Background Art

[0002] Chip recycling not only allows chips to be reused, achieving resource recycling, but also saves production resources and reduces the consumption of materials such as copper and wafers. The existing chip recycling production process requires first scraping solder paste from the chip contacts, and then re-balling the chip after the solder paste is scraped.

[0003] Existing processes are all done manually. After the manual scraping is completed, the chip is removed and placed in the ball placement station to complete the ball placement process. This manual process results in slow chip production efficiency, wastes manpower, and makes it difficult to ensure chip quality consistency.

[0004] Therefore, the existing technology still needs to be improved and developed. Summary of the Invention

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide an automatic ball planting device and an automatic ball planting method, which solve the problems in the prior art that the manual operation process leads to slow chip production efficiency, waste of manpower, and difficulty in ensuring chip quality consistency.

[0006] The technical solutions of the present invention are as follows:

[0007] An automatic ball planting device includes a frame, wherein the automatic ball planting device further includes:

[0008] A station rotation mechanism, the station rotation mechanism includes a turntable rotatably disposed on the frame, a carrier disposed on the turntable and used to load chips, and a ball receiving portion disposed on the turntable and used to place solder balls;

[0009] a chip scraping mechanism, the chip scraping mechanism being disposed on the frame and located on one side of the turntable, the chip scraping mechanism comprising a scraping assembly located above the turntable, the scraping assembly reciprocating along the radial direction of the turntable to apply solder paste to the chip;

[0010] A ball planting mechanism, the ball planting mechanism is arranged on the frame and located on one side of the turntable, the ball planting mechanism includes a suction cup, and the suction cup is used to suck and release solder balls;

[0011] The solder balls in the ball holding portion and the chips coated with paste by the scraper assembly are alternately positioned below the suction cup through the rotation of the turntable.

[0012] Furthermore, the chip scraping mechanism further includes:

[0013] A scraper lifting assembly, the scraper lifting assembly being fixedly arranged on the frame in a vertical direction;

[0014] a scraper moving assembly, the scraper moving assembly being connected to the scraper lifting assembly and being driven by the scraper lifting assembly to move up and down;

[0015] A scraper mesh plate, the scraper mesh plate is connected to the scraper lifting assembly and is driven by the scraper lifting assembly to move up and down;

[0016] The invention comprises a left scraper assembly and a right scraper assembly, wherein the left scraper assembly and the right scraper assembly are arranged side by side on the scraper moving assembly along the left and right directions;

[0017] The chip is located below the scraper web, the solder paste is located on the scraper web, the left scraper assembly and the right scraper assembly are located on the upper surface of the scraper web and are moved in left and right directions by the drive of the scraper moving assembly.

[0018] Furthermore, the scraper moving assembly includes a movable plate, a scraper assembly support plate is fixedly arranged on the movable plate, and the scraper assembly support plate is extended in the left and right directions;

[0019] The left scraper assembly includes:

[0020] A left scraper cylinder, the left scraper cylinder being fixedly arranged on the scraper assembly support plate in a vertical direction;

[0021] A left scraper mounting block, the left scraper mounting block being fixedly arranged on the piston shaft of the left scraper cylinder, the left scraper mounting block extending in the front-to-back direction;

[0022] A left scraper is provided on the left scraper mounting block along a front-to-rear direction, and a blade of the left scraper faces the upper surface of the scraper mesh plate.

[0023] The right scraper assembly includes:

[0024] A right scraper cylinder, the right scraper cylinder being fixedly arranged on the scraper assembly support plate in a vertical direction, and the right scraper cylinder and the left scraper cylinder being arranged side by side;

[0025] a right scraper mounting block, the right scraper mounting block being fixedly mounted on the piston shaft of the right scraper cylinder and extending in a front-to-rear direction;

[0026] a right scraper, the right scraper being arranged on the right scraper mounting block along a front-to-rear direction, with a blade edge of the right scraper facing the upper surface of the scraper mesh;

[0027] The left scraper and the right scraper are arranged side by side along the left-right direction.

[0028] Furthermore, the ball planting mechanism includes: a ball planting lifting assembly, the ball planting lifting assembly being fixedly arranged on the frame in a vertical direction;

[0029] a suction cup mounting assembly, the suction cup mounting assembly being connected to the ball planting lifting assembly and being driven by the ball planting lifting assembly to move up and down, the suction cup being arranged on the suction cup mounting assembly; and

[0030] A knocking component is connected to the ball planting lifting component and is used to knock the suction cup.

[0031] Furthermore, the ball planting mechanism further includes a ball planting base, and the ball planting base is fixedly arranged on the frame;

[0032] The ball planting lifting assembly includes:

[0033] A ball planting lifting cylinder, the ball planting lifting cylinder being vertically connected to the ball planting base;

[0034] A ball planting template, the ball planting template is arranged on the piston rod of the ball planting lifting cylinder in a horizontal direction;

[0035] The ball planting upper and lower guide parts are arranged on the ball planting base along the vertical direction, and the ball planting template is slidably connected to the ball planting upper and lower guide parts.

[0036] Furthermore, the suction cup mounting assembly includes:

[0037] A left mounting portion and a right mounting portion, wherein the left mounting portion and the right mounting portion are mirror-imaged and arranged on the left and right sides of the ball planting template;

[0038] A clamping portion, two sides of which are respectively connected to the left mounting portion and the right mounting portion;

[0039] The clamping portion is provided with a clamping slot, and the suction cup is clamped in the clamping slot.

[0040] Furthermore, the left mounting portion includes: a left guide rail mounting plate, the left guide rail mounting plate extending in the front-to-rear direction;

[0041] a left pull plate, the left pull plate being arranged on the left guide rail mounting plate and extending toward the right mounting portion;

[0042] A left guide rail, the left guide rail being fixedly arranged on the left guide rail mounting plate in an up-down direction, and a left slide being slidably connected to the left guide rail;

[0043] A left card slot connecting plate, wherein the left card slot connecting plate is fixedly connected to the left slide, and the clamping portion is connected to the left card slot connecting plate;

[0044] A limit screw, wherein the screw head of the limit screw is located above the left pull plate, and the screw rod of the limit screw passes through the left pull plate and is fixedly connected to the left slot connecting plate.

[0045] Furthermore, the ball planting template is connected with a ball planting connecting plate in the up and down directions;

[0046] The knocking assembly includes: a knocking rod located above the suction cup, the knocking rod moving up and down knocking the suction cup;

[0047] A knocking cylinder is arranged on the ball planting connecting plate in an up-down direction;

[0048] a knocking plate connected to the piston rod of the knocking cylinder, the knocking plate extending along a side facing the suction cup, the knocking rod being fixedly arranged on the knocking plate in an up-down direction, with the lower end of the knocking rod facing the suction cup;

[0049] The knocking sub-plate is arranged parallel to the bottom of the knocking plate and is fixedly connected to the cylinder body of the knocking cylinder. The knocking rod passes through and is slidably arranged on the knocking sub-plate.

[0050] Furthermore, the turntable is provided with a plurality of the ball holding parts and a plurality of the carriers, and the plurality of the ball holding parts and the plurality of the carriers are alternately arranged at intervals;

[0051] The ball holding portion is provided with a placement cavity for placing solder balls;

[0052] The station rotation mechanism further includes: an air blowing portion, which is arranged on the frame. When the ball holding portion rotates to below the suction cup, the air blowing portion is connected to the placement cavity.

[0053] Based on the same concept, the present invention also includes an automatic ball planting method, wherein the automatic ball planting device described above is used, and the automatic ball planting method includes:

[0054] Step A: The station rotation mechanism is started, the turntable rotates, the carrier loaded with chips rotates to the bottom of the squeegee assembly, and the ball receiving portion loaded with solder balls rotates to the bottom of the suction cup;

[0055] Step B: activating the chip scraping mechanism, which applies solder paste to the chip on the carrier, and activating the ball planting mechanism, which causes the suction cup to absorb the solder balls in the ball holding portion;

[0056] Step C: The turntable rotates so that the chip coated with solder paste is located below the suction cup, and the other ball receiving part is located below the squeegee assembly;

[0057] Step D: The ball placement mechanism is activated, and the suction cup places the solder ball onto the chip coated with solder paste below, while the chip scraping mechanism is not activated;

[0058] Step E: The turntable rotates, causing another carrier loaded with chips to rotate to the bottom of the squeegee assembly, and at the same time, another ball receiving portion loaded with solder balls rotates to the bottom of the suction cup. At this time, the chip with completed ball implantation is removed from the ball implantation mechanism;

[0059] Step F: Remove the chip with the ball implanted on the carrier, replace it with a new chip without the ball implanted, and execute step B at the same time.

[0060] Compared to the prior art, the present invention proposes an automatic ball placement device and method. In this solution, the turntable on the workstation rotation mechanism rotates, driving the ball holding unit and carrier to different positions. This allows for a cyclical replacement of solder balls and chips, enabling a continuous cycle of scraping, sucking, placing, scraping, sucking, and placing. The specific process is as follows: First, the carrier carrying the chips rotates beneath the scraping assembly, while the ball holding unit carrying the solder balls rotates beneath the suction cup. The chip scraping mechanism is then activated, coating the chips on the carrier with solder paste. Simultaneously, the ball placement mechanism is activated, causing the suction cup to absorb the solder balls from the ball holding unit. The turntable is then driven to rotate, positioning the coated chip beneath the suction cup, while another ball holding unit is positioned beneath the scraping assembly. The ball placement mechanism is then activated, causing the suction cup to place the solder balls onto the coated chip below, while the chip scraping mechanism is deactivated. The turntable is then driven to rotate, causing another carrier loaded with chips to rotate under the scraping assembly. At the same time, the ball holding portion loaded with solder balls rotates under the suction cup. At this time, the chip with completed ball implantation is removed from the implantation mechanism. Finally, the chip with completed ball implantation on the carrier is removed and replaced with a new chip that has not been implanted. At the same time, the chip scraping mechanism is activated to scrape glue on another chip, and the subsequent steps are continued. In this way, the scraping and ball implantation can be performed continuously and uninterruptedly, realizing an automatic ball implantation process, saving labor costs and improving production efficiency. This solves the problem of slow ball implantation efficiency and waste of manpower caused by the manual ball implantation process in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] Figure 1 A schematic structural diagram of an embodiment of an automatic ball planting device according to the present invention;

[0062] Figure 2 A schematic diagram of a portion of the structure of a station rotation mechanism of an embodiment of an automatic ball planting device of the present invention;

[0063] Figure 3 A schematic structural diagram of a carrier of an embodiment of an automatic ball planting device of the present invention;

[0064] Figure 4A left side view of a station rotation mechanism of an embodiment of an automatic ball planting device of the present invention;

[0065] Figure 5 This is a left side view of a chip scraping mechanism of an embodiment of an automatic ball placement device of the present invention;

[0066] Figure 6 A schematic structural diagram of a chip scraping mechanism of an embodiment of an automatic ball placement device of the present invention;

[0067] Figure 7 A schematic structural diagram of a chip scraping mechanism from another perspective of an embodiment of an automatic ball placement device of the present invention;

[0068] Figure 8 A partial structural diagram of an embodiment of an automatic ball planting device of the present invention;

[0069] Figure 9 A schematic diagram of the partial structure of a station rotation mechanism of an embodiment of an automatic ball planting device of the present invention;

[0070] Figure 10 This is a schematic structural diagram of a ball holding portion and an air blowing portion of an embodiment of an automatic ball planting device of the present invention;

[0071] Figure 11 for Figure 10 A magnified view of part A;

[0072] Figure 12 A cross-sectional view of a ball holding portion and an air blowing portion of an embodiment of an automatic ball planting device of the present invention;

[0073] Figure 13 A schematic structural diagram of a ball planting mechanism of an embodiment of an automatic ball planting device of the present invention;

[0074] Figure 14 A schematic structural diagram of a ball planting mechanism from another perspective of an embodiment of an automatic ball planting device of the present invention;

[0075] Figure 15 This is a structural diagram of a ball planting lifting assembly and a suction cup mounting assembly in an embodiment of an automatic ball planting device of the present invention;

[0076] Figure 16 A left side view of a ball planting lifting assembly and a suction cup mounting assembly of an embodiment of an automatic ball planting device of the present invention;

[0077] Figure 17 This is a cross-sectional view of a suction cup of an embodiment of an automatic ball planting device of the present invention.

[0078] 1400, spindle; 1410, substrate; 1411, chip placement slot; 1420, fixing member; 1421, spring; 1430, spring movable slot; 1440, removal slot; 1450, avoidance hole; 1500, encoder; 1510, encoder disk; 1520, sensor; 2120, avoidance hole; 2200, ball holding portion; 2210, placement cavity; 2220, box mounting plate; 2230, box body; 2240, ball blowing hole; 230 0. Blowing unit; 2310. Blowing plate; 2311. Upper cover; 2312. Middle plate; 2313. Lower support plate; 2314. Buffer chamber; 2315. Air guide hole; 2316. Air outlet; 2320. Driving unit; 2321. Ball box driving cylinder; 2322. Mounting plate; 3000. Chip scraping mechanism; 3100. Scraping base; 3110. Bottom plate; 3120. Cylinder mounting plate; 3200. Scraping lifting assembly; 3210. Scraping lifting cylinder; 3220. Scraping template; 3230. Scraping upper and lower guides; 3231. Vertical linear bearing seat; 3232. Vertical guide shaft; 3300. Scraping moving assembly; 3310. Scraping moving cylinder; 3320. Fixed plate; 3321. Left and right fixed plates; 3322, front and rear fixed plates; 3330, movable plate; 3340, left and right guide parts of scraper glue; 3341, left and right linear bearing seats; 3342, left and right guide shafts; 3350, scraper glue assembly support plate; 3400, left scraper glue assembly; 3410, left scraper glue cylinder; 3420, left scraper blade mounting block; 3430, left scraper; 3500, right scraper glue assembly; 3510, right scraper glue cylinder; 3520, right scraper blade mounting block; 3530, right scraper; 3600, scraper glue screen; 3610, scraper glue connecting plate; 3620, screen plate mounting plate; 3621, accommodating chamber; 3700, fine-tuning assembly; 3710, differential head seat; 3720, differential head; 3730, differential head adjustment block; 4000, plant Ball mechanism; 4100, ball planting base; 4110, ball planting bottom plate; 4120, ball planting cylinder mounting plate; 4200, ball planting lifting assembly; 4210, ball planting lifting cylinder; 4220, ball planting template; 4230, ball planting upper and lower guide parts; 4231, second vertical linear bearing seat; 4232, second vertical guide shaft; 4300, suction cup mounting assembly; 4310, left mounting part; 4311, left guide rail mounting plate; 4312, left pull plate; 4313, left guide rail; 4314, left slide; 4315, left card slot connecting plate; 4316, limit screw; 4320, right mounting part; 4330, clamping part; 4331, upper clamping plate; 4332, lower clamping plate; 4333, card slot; 4334, mounting cavity;4340, ball planting connecting plate; 4400, suction cup; 4410, suction plate; 4420, limiting boss; 4430, air pipe; 4440, ball suction hole; 4450, chamfer; 4500, knocking assembly; 4510, knocking cylinder; 4520, knocking plate; 4530, knocking rod; 4540, knocking sub-plate; 4600, ball planting fine-tuning assembly; 4610, ball planting micrometer head seat; 4620, ball planting micrometer head; 4630, ball planting micrometer head adjustment block. DETAILED DESCRIPTION

[0079] The present invention provides an automatic ball placement device and method. To clarify the objectives, technical solutions, and effects of the present invention, the present invention is further described below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0080] like Figure 1 As shown, the present invention provides an automatic ball placement device, which is mounted on a frame 1000. The structure of the frame 1000 is described using the frame 1000 as an example, with the frame 1000 placed vertically on the ground. The automatic ball placement device is vertically mounted on the frame 1000, with the up, down, left, and right directions shown in FIG1 as a reference. The automatic ball placement device also includes: a station rotation mechanism 1100, a chip scraping mechanism 3000, and a ball placement mechanism 4000. The station rotation mechanism 1100 includes a turntable 1110 that is rotatably mounted on the frame 1000, a carrier 1400 that is mounted on the turntable 1110 and is used to load chips, and a ball receiving portion 2200 that is mounted on the turntable 1110 and is used to place solder balls. The chip scraping mechanism 3000 is mounted on the frame 1000 and located on one side of the turntable 1110. It includes a scraping assembly positioned above the turntable 1110, which reciprocates radially along the turntable 1110 to apply solder paste to the chip. The ball placement mechanism 4000 is mounted on the frame 1000 and located on one side of the turntable 1110. It includes a suction cup 4400 for sucking and placing solder balls. The solder balls in the ball holding portion 2200 and the chips coated with paste by the scraping assembly are alternately positioned below the suction cup 4400 as the turntable 1110 rotates.

[0081] In this solution, the turntable 1110 on the workstation rotation mechanism 1100 rotates, driving the ball receiving unit 2200 and carrier 1400 to different positions. This allows for a continuous rotation of solder balls and chips, enabling a continuous cycle of squeegeeing, ball suction, ball placement, squeegeeing, ball suction, and ball placement. The specific process is as follows: First, the carrier 1400 loaded with chips rotates beneath the squeegee assembly, while the ball receiving unit 2200 loaded with solder balls rotates beneath the suction cup 4400. The chip squeegee mechanism 3000 is then activated, coating the chips on the carrier 1400 with solder paste. Simultaneously, the ball placement mechanism 4000 is activated, causing the suction cup 4400 to absorb the solder balls from the ball receiving unit 2200. The turntable 1110 is then driven to rotate, positioning the solder-coated chips beneath the suction cup 4400, while the other ball receiving unit 2200 is positioned beneath the squeegee assembly. Restart the ball planting mechanism 4000, and the suction cup 4400 places the solder ball on the chip coated with solder paste below, while the chip scraping mechanism 3000 is not started. Then drive the turntable 1110 to rotate, so that another carrier 1400 loaded with chips rotates to the bottom of the scraping assembly, and at the same time, the ball holding part 2200 loaded with solder balls rotates to the bottom of the suction cup 4400. At this time, the chip with completed ball planting is moved out of the ball planting mechanism 4000. Finally, take out the chip with completed ball planting on the carrier 1400, replace it with a new chip that has not been ball-planted, and start the chip scraping mechanism 3000 at the same time, scrape glue on another chip, and continue with the subsequent steps. In this way, the scraping and ball planting can be carried out continuously and uninterruptedly, realizing the process of automatic ball planting, saving labor costs, improving production efficiency, automating production, and ensuring chip consistency. It solves the problem in the existing technology that the manual operation process leads to slow chip production efficiency, waste of manpower, and difficulty in ensuring chip quality consistency.

[0082] like Figure 1 、 Figure 2 As shown in the specific structure, the station conversion mechanism 1100 further includes: a turntable 1100, a station drive assembly 1300, a carrier 1400 and the ball receiving portion 2200 are arranged on the turntable 1100. The station drive assembly 1300 is connected to the turntable 1100, and the turntable 1100 is rotated by the drive of the station drive assembly 1300. Figure 3 As shown, the frame includes a working platform 1111. Figure 1 、 Figure 4As shown, the station drive assembly 1300 is disposed vertically below and through the work platform 1111. One end of the station drive assembly 1300 protrudes from the upper surface of the work platform 1111 and connects to the turntable 1100. The station drive assembly 1300 can be activated upon powering on. Once activated, the station drive assembly 1300 drives the turntable 1100 to rotate at various angles. The carrier 1400 and the ball holding portion 2200 are fixedly disposed on the non-rotating axis of the turntable 1100. This allows the carrier 1400 to deviate from its original position after rotating a predetermined angle, thereby achieving movement of the carrier 1400. The carrier 1400 includes a base plate 1410, which defines a chip placement slot 1411 within which the chip is positioned, and a fixing member 1420. The base plate 1410 defines a chip placement slot 1411, within which the chip is positioned. The fixing member 1420 is disposed on the base plate 1410 and is used to secure the chip. By placing the chip in the placement groove, the chip is limited and not easily escaped from the carrier 1400. The fixing member 1420 presses the chip tightly, which can fix the chip on the carrier 1400 and facilitate the transportation of the chip.

[0083] In the above scheme, a turntable 1100 is provided with multiple carriers 1400 and multiple ball holding parts 2200, the chip is fixed in the carrier 1400, and the solder ball is placed in the ball holding part, so that the turntable 1100 is driven by the work station driving component 1300 to rotate, so that the carrier 1400 is rotated, such as rotating 45°, 90° or 180°, so that the chip in the carrier 1400 and the solder ball in the ball holding part 2200 reach different positions after rotation, realizing automatic transportation of the chip. Therefore, the work station conversion mechanism enables the chip to be transferred between different work stations, replacing the existing manual transmission, thereby having the advantages of high transmission efficiency, saving manpower, and ensuring the positioning consistency of the chip.

[0084] like Figure 2 、 Figure 3As shown, in the specific structure of this embodiment, the fixing member 1420 includes a spring piece 1421, one end of which is fixedly disposed on the side wall of the chip placement groove 1411, and the other end of which extends into the chip placement groove 1411. Specifically, the spring piece 1421 has a certain degree of elasticity, one end of which is embedded in a slot provided on the side wall of the chip placement groove 1411, and the other end of which extends into the chip placement groove 1411 and is free to move. When a chip is to be placed in chip placement slot 1411, pressure is applied to the free end of spring clip 1421, causing it to deform and move backward in a direction away from chip placement slot 1411. Once the chip is placed in chip placement slot 1411, the free end of spring clip 1421 is released, allowing it to rest against the side of the chip. This elastic force of the elastic deformation applies pressure to the chip, forcing it to rest against the inner wall of chip placement slot 1411, thereby securing it within chip placement slot 1411. When the chip is to be removed, pressure is applied to the free end of spring clip 1421, causing it to release the side wall of the chip, allowing for quick removal. In this embodiment, spring clip 1421 is a square plate. In this embodiment, the square plate is a straight plate, with the straight spring clip 1421 being arranged at an angle relative to the inner wall of chip placement slot 1411. In another embodiment, the square plate is connected to one end of the inner wall of the chip placement groove 1411 and is bent to form a bent portion, which is inserted into the inner wall of the chip placement groove 1411 through the bent portion, so that the spring 1421 is not easily loosened.

[0085] The chip is positioned by the inner wall of the chip placement groove 1411, limiting the chip's freedom in the front-to-back and left-to-right directions. To allow sufficient deformation space for the spring clip 1421, a spring clip movable groove 1430 is provided on the substrate 1410. The spring clip 1421 is movably disposed within the spring clip movable groove 1430 toward one end of the chip, and the spring clip movable groove 1430 is connected to the chip placement groove 1411. The spring clip 1421 extends toward one end of the chip into the chip placement groove 1411, thereby pressing the chip in the chip placement groove 1411 against the spring clip 1421.

[0086] like Figure 3As shown, the bottom of the spring movable groove 1430 in this embodiment is recessed below the bottom of the chip placement groove 1411, and the spring movable groove 1430 extends into the chip placement groove 1411. Thus, a first step is formed between the bottom surface of the spring movable groove 1430 and the bottom surface of the chip placement groove 1411. The first step is located within the chip placement groove 1411. Thus, when the chip is placed within the chip placement groove 1411, there is a clear space below the position of the chip facing the spring movable groove 1430. The clear space formed by the first step facilitates finger access, making it easier to remove the chip from the chip placement groove 1411.

[0087] In this embodiment, the chip placement slot 1411 has an inner wall formed with a removal slot 1440. The bottom of the removal slot 1440 is recessed below the bottom of the chip placement slot 1411. This allows the removal slot to be deeper than the chip placement slot 1411. When a finger enters the removal slot 1440, it can grasp the entire side of the chip, making it easier to remove and place the chip. Two removal slots 1440 are symmetrically located on opposing inner walls of the chip placement slot 1411. In this embodiment, the two side walls of the removal slot 1440 are adjacent to the inner wall where the spring-loaded slot 1430 is located. Thus, the removal slot 1440 and the spring-loaded slot 1430 are located on different inner walls of the chip placement slot 1411. This facilitates chip removal and placement and optimizes the spatial layout of the substrate 1410. The removal slot 1440 can be square, circular, or oval, intersecting the chip placement slot 1411. The removal slot 1440 in this embodiment is configured as a semi-elliptical shape that intersects with the chip placement slot 1411 , so as to match the shape of a finger and facilitate the finger to take and place the chip.

[0088] like Figure 3 As shown, the chip placement groove 1411 is square, and the four corners of the chip placement groove 1411 are provided with air avoidance holes 1450. When the chip is placed in the chip placement groove 1411, the air avoidance holes 1450 avoid the four corners of the chip, so that the four side walls of the chip can match the four inner walls of the chip placement groove 1411. Stable positioning of the chip is achieved. Two chip placement grooves 1411 are provided on the substrate 1410, so that two chips can be processed at a time, thereby improving the processing efficiency of the chip. The two chip placement grooves 1411 are arranged side by side along a direction parallel to the tangent of the disc; specifically, the line connecting the intersection of the diagonals of the two chip placement grooves 1411 is used as the center line of the two chip placement grooves 1411, and the line connecting the midpoint of the center line and the rotation center of the turntable 1100 is perpendicular to the center line. In this way, when the turntable 1100 rotates 90° or 180°, the position of the chip placement slot 1411 is aligned, which facilitates the positioning operation of each process equipment and facilitates automation.

[0089] like Figure 2 、 Figure 4 As shown, the workstation drive assembly 1300 in this embodiment includes: a motor 1310, and a reducer 1320. The motor 1310 is fixedly arranged on the frame, the reducer 1320 is connected to the motor 1310, and the turntable 1100 is fixedly arranged on the reducer 1320 through a coupling 1330. In the specific structure, the motor 1310 is fixed to the frame by screws and is located below the working platform 1111. The reducer 1320 is connected to the output shaft of the motor 1310, and the output shaft of the reducer 1320 is connected to a main shaft 1340 through a coupling 1330. The other end of the main shaft 1340 is fixedly connected to the turntable 1100, and the main shaft is coaxially connected to the turntable 1100. In this way, the motor 1310 rotates after being energized, and the rotating motor 1310 is decelerated by the reducer 1320. The reducer 1320 drives the main shaft to rotate, and then drives the turntable 1100 to rotate to different positions. The output speed of the motor 1310 can be changed into a reasonable speed through the reducer 1320, so that the turntable 1100 can rotate stably, and the chip can be stably rotated to different workstations in the carrier 1400.

[0090] like Figure 4 As shown, the workstation conversion mechanism in this embodiment also includes an encoder 1500, which is used to detect the position of the turntable 1100 rotated, and control the motor 1310 to pause when the preset rotation angle is reached. For example, if the turntable 1100 is set to pause for a period of time after rotating 90°, the encoder 1500 is used to detect whether the turntable 1100 rotates 90°. The encoder 1500 specifically includes: an encoding disk 1510, and a sensor 1520 matched with the encoding disk 1510. The encoding disk 1510 is coaxially arranged on the turntable 1100, and the sensor 1520 is arranged on the frame. The encoding disk 1510 is coaxially arranged with the main shaft and can rotate synchronously with the main shaft. The sensor 1520 is fixed on the frame and is used to sense the rotating encoding disk 1510.

[0091] like Figure 1 、 Figure 8The turntable 1110 is provided with a plurality of ball receiving portions 2200 and a plurality of carriers 1400, which are alternately arranged at intervals. Specifically, there are two ball receiving portions 2200 and two carriers 1400, respectively, which are alternately arranged at intervals at the four quadrants of the turntable 1110. The line connecting the chip scraping mechanism 3000 and the center of the turntable 1110 is perpendicular to the line connecting the ball implanting mechanism 4000 and the center of the turntable 1110.

[0092] like Figure 1 、 Figure 5 As shown in the specific structure. The chip scraper mechanism 3000 also includes: a scraper lifting assembly 3200, a scraper moving assembly 3300, and a scraper mesh plate 3600. The scraper assembly includes a left scraper assembly 3400 and a right scraper assembly 3500. The scraper lifting assembly 3200 is fixedly arranged on the frame in the vertical direction. The scraper moving assembly 3300 is connected to the scraper lifting assembly 3200 and moves up and down by the drive of the scraper lifting assembly 3200. The left scraper assembly 3400 and the right scraper assembly 3500 are arranged side by side on the scraper moving assembly 3300 in the left and right directions, and the scraper mesh plate 3600 is connected to the scraper lifting assembly 3200 and moves up and down by the drive of the scraper lifting assembly 3200. The chip is located below the scraper web 3600 , the solder paste is located on the scraper web 3600 , the left scraper assembly 3400 and the right scraper assembly 3500 are located on the upper surface of the scraper web 3600 and are moved in the left and right directions by the drive of the scraper moving assembly 3300 .

[0093] In the above embodiment, the squeegee lifting assembly 3200 drives the squeegee stencil 3600 and the squeegee moving assembly 3300 to descend synchronously, allowing the squeegee stencil 3600 to contact the chip below and aligning the mesh holes on the squeegee stencil 3600 with the chip contacts. The squeegee moving assembly 3300 then drives the left and right squeegee assemblies 3400 and 3500 to move left and right. As the left and right squeegee assemblies 3400 and 3500 move through the mesh areas, the solder paste passes through the mesh holes and is applied to the chip contacts. This enables automated solder paste application on chips, replacing manual labor. This improves production efficiency, saves human resources, and standardized production ensures product consistency. The left scraper assembly 3400 and the right scraper assembly 3500 arranged on the left and right sides can move back and forth in the left and right directions. When moving to the right under the drive of the scraper moving assembly 3300, the left scraper assembly 3400 can push the solder paste; when moving to the left under the drive of the scraper moving assembly 3300, the right scraper assembly 3500 can push the solder paste. In this way, the back and forth movement in the left and right directions has the function of coating the solder paste, which further improves the efficiency of coating the solder paste.

[0094] The specific structure of this embodiment is as follows: Figure 5 、 Figure 6 As shown, the chip scraper mechanism 3000 also includes a scraper base 3100, which is fixedly arranged on the frame. The scraper base 3100 specifically includes a horizontally arranged base plate 3110 and a cylinder mounting plate 3120 vertically arranged on the base plate 3110. The base plate 3110 is fixedly installed on the upper surface of the frame by screws, and the cylinder mounting plate 3120 is fixedly installed on the base plate 3110 by screws.

[0095] like Figure 5 、 Figure 6As shown, the scraper lifting assembly 3200 in this embodiment specifically includes: a scraper lifting cylinder 3210, a scraper template 3220, and scraper upper and lower guides 3230. The scraper lifting cylinder 3210 is vertically connected to the scraper base 3100. Specifically, the scraper lifting cylinder 3210 is fixedly connected to the surface of the cylinder mounting plate 3120 facing away from the chip via screws. The scraper template 3220 is horizontally mounted on the piston shaft of the scraper lifting cylinder 3210. Specifically, the scraper lifting cylinder 3210 adopts a dual-axis cylinder. Existing dual-axis cylinders are standardly equipped with a mounting block between the dual axes. The scraper template 3220 is fixedly connected to the mounting block on the piston shaft of the scraper lifting cylinder 3210 via screws. The scraper upper and lower guides 3230 are vertically mounted on the scraper base 3100, and the scraper template 3220 is slidably connected to the scraper upper and lower guides 3230. Specifically, the lower ends of the scraper upper and lower guides 3230 are fixedly engaged with the base plate 3110, and the scraper template 3220 is driven by the scraper lifting cylinder 3210 to slide directionally on the scraper upper and lower guides 3230. This ensures stable up and down sliding of the scraper template 3220.

[0096] like Figure 6 、 Figure 7 As shown, the upper and lower guide parts 3230 for scraping glue in this embodiment include: a vertical linear bearing seat 3231, and a vertical guide shaft 3232. The vertical linear bearing seat 3231 is set on the scraping glue template 3220 and penetrates the scraping glue template 3220 in the up and down direction. The vertical guide shaft 3232 is fixedly set on the scraping glue base 3100 in the vertical direction. The vertical guide shaft 3232 is set in the vertical linear bearing seat 3231 and penetrates the vertical linear bearing seat 3231. Specifically, the vertical linear bearing seat 3231 is fixedly connected to the upper surface of the scraping glue template 3220 by screws. The vertical linear bearing seat 3231 penetrates the scraping glue template 3220. A linear bearing is embedded in the existing vertical linear bearing seat 3231. The vertical guide shaft 3232 adopts an optical axis, which is matched with the linear bearing, so that the scraping glue template 3220 can slide up and down stably along the vertical guide shaft 3232. There are four upper and lower scraper guide parts 3230, and the four upper and lower scraper guide parts 3230 are symmetrically arranged around the scraper lifting cylinder 3210, so that the scraper template 3220 is limited on the horizontal plane, making the directional sliding of the scraper template 3220 more stable.

[0097] like Figure 6 、 Figure 7As shown, the squeegee moving assembly 3300 includes: a squeegee moving cylinder 3310, a fixed plate 3320, a movable plate 3330, and left and right squeegee guides 3340. The fixed plate 3320 is connected to the surface of the squeegee template 3220 and extends beyond the edge of the squeegee template 3220; the squeegee moving cylinder 3310 is fixedly mounted on the fixed plate 3320 in the left and right directions; the movable plate 3330 is fixedly mounted on the piston shaft of the squeegee moving cylinder 3310; the left and right squeegee guides 3340 are fixedly mounted on the fixed plate 3320, and the movable plate 3330 is slidably mounted on the left and right squeegee guides 3340. Specifically, the fixed plate 3320 includes left and right fixed plates 3321 and front and rear fixed plates 3322. The left and right fixed plates 3321 are fixedly connected to the squeegee template 3220 in the left-right direction via screws, while the front and rear fixed plates 3322 are fixedly connected to the front and rear fixed plates 3322 in the front-rear direction via screws. The squeegee moving cylinder 3310 is also fixedly connected to the left and right fixed plates 3321 via screws, with the end of the squeegee moving cylinder 3310 facing away from the chip resting on the surfaces of the front and rear fixed plates 3322. The squeegee moving cylinder 3310 is a dual-axis cylinder, and the movable plate 3330 is connected to the squeegee moving cylinder 3310 via the standard mounting block provided with the dual-axis cylinder. When the squeegee moving cylinder 3310 is activated, it pushes the movable plate 3330 to move in the left-right direction. The movable plate 3330 is limited and guided by the left and right guides 3340, allowing it to slide back and forth in a directional manner in the left-right direction.

[0098] like Figure 6 、 Figure 7 As shown, the scraper left and right guide parts 3340 in this embodiment specifically include: left and right linear bearing seats 3341, and left and right guide shafts 3342. The left and right linear bearing seats 3341 are arranged on the movable plate 3330 and penetrate the scraper template 3220 in the left and right directions. The left and right guide shafts 3342 are fixedly arranged on the fixed plate 3320 in the left and right directions. The left and right guide shafts 3342 are arranged in the left and right linear bearing seats 3341 and penetrate the left and right linear bearing seats 3341. Specifically, the left and right guide shafts 3342 adopt optical axes, one end of the left and right guide shafts 3342 is fixed to the front and rear fixed plates 3322 by screws, and the other end extends toward the chip direction and is penetrated by the left and right linear bearing seats 3341. There are two scraper left and right guide parts 3340, and the two scraper left and right guide parts 3340 are symmetrically arranged on the front and rear sides of the scraper moving cylinder 3310.

[0099] A scraper assembly support plate 3350 is fixedly provided on the movable plate 3330. The scraper assembly support plate 3350 extends in the left and right directions. The scraper assembly support plate 3350 is fixedly connected to the movable plate 3330 by screws. The scraper assembly support plate 3350 is used to support the left scraper assembly 3400 and the right scraper assembly 3500.

[0100] like Figure 5 、 Figure 6 As shown, the left squeegee assembly 3400 in this embodiment specifically includes: a left squeegee cylinder 3410, a left squeegee blade mounting block 3420, and a left squeegee blade 3430. The left squeegee cylinder 3410 is vertically fixedly mounted on the squeegee assembly support plate 3350. The left squeegee blade mounting block 3420 is fixedly mounted on the piston shaft of the left squeegee cylinder 3410. The left squeegee blade mounting block 3420 extends in the front-to-back direction. The left squeegee blade 3430 is mounted in the front-to-back direction on the left squeegee blade mounting block 3420. The blade edge of the left squeegee blade 3430 faces the upper surface of the squeegee web 3600. The right squeegee assembly 3500 includes: a right squeegee cylinder 3510, a right squeegee blade mounting block 3520, and a right squeegee blade 3530. The right scraper cylinder 3510 is fixedly arranged on the scraper assembly support plate 3350 in the vertical direction, and the right scraper cylinder 3510 is arranged side by side with the left scraper cylinder 3410; the right scraper mounting block 3520 is fixedly arranged on the piston shaft of the right scraper cylinder 3510, and the right scraper mounting block 3520 extends in the front-to-back direction; the right scraper 3530 is arranged on the right scraper mounting block 3520 in the front-to-back direction, and the blade of the right scraper 3530 faces the upper surface of the scraper mesh plate 3600.

[0101] When the left scraper assembly 3400 and the right scraper assembly 3500 are working, the left scraper cylinder 3410 and the right scraper cylinder 3510 push the left scraper 3430 and the right scraper 3530 downward respectively, so that the left scraper 3430 and the right scraper 3530 synchronously drop to the upper surface of the scraper stencil 3600, and then the scraper moving cylinder 3310 is started to move the left scraper 3430 and the right scraper 3530 left and right on the scraper stencil 3600, so that the solder paste on the scraper stencil 3600 is pushed through the scraper stencil 3600 by the left scraper 3430 and the right scraper 3530 and coated on the chip below.

[0102] In this embodiment, the squeegee template 3220 is fixedly connected to a squeegee connecting plate 3610, which is arranged in a vertical direction. A stencil mounting plate 3620 is fixedly connected to the squeegee connecting plate 3610, which is arranged in a horizontal direction. The stencil mounting plate 3620 has a mounting opening, and the squeegee stencil 3600 is fixedly mounted within the mounting opening, forming a receiving cavity 3621 for placing solder paste. The solder paste is disposed in the receiving cavity 3621, and the inner wall of the mounting opening forms a rib of the receiving cavity 3621 to prevent the solder paste from flowing out.

[0103] like Figure 5 、 Figure 6 As shown, the chip scraping mechanism in this embodiment further includes a fine-tuning assembly 3700, which includes: a differential head seat 3710, a differential head 3720, and a differential head adjustment block 3730. The differential head seat 3710 is fixedly disposed on the side of the cylinder mounting plate 3120 facing away from the scraping lifting cylinder 3210, the differential head 3720 is vertically connected to the differential head seat 3710, and the differential head adjustment block 3730 is fixedly disposed on the side of the scraping template 3220 facing the scraping lifting cylinder 3210, with one end of the differential head 3720 abutting against the differential head adjustment block 3730. The fine-tuning assembly 3700 can be used to adjust the height at which the squeegee template 3220 stops after descending. Furthermore, the squeegee lifting cylinder 3210 is equipped with a limit nut. Once the fine-tuning assembly 3700 has precisely adjusted the squeegee template 3220 into position, the limit nut on the squeegee lifting cylinder 3210 secures the position. Each time the squeegee lifting cylinder 3210 lowers the squeegee template 3220 to a predetermined height, it is stopped by the limit nut. This allows the squeegee template 3220 to precisely limit its descending position when the squeegee moving assembly 3300, the left squeegee assembly 3400, and the right squeegee assembly 3500 are raised and lowered by the squeegee template 3220, thereby precisely controlling the extent of solder paste coverage.

[0104] like Figure 1 、 Figure 8 、 Figure 9As shown, the ball planting mechanism 4000 in this embodiment further includes: a ball planting lifting assembly 4200 and a suction cup mounting assembly 4300. The ball planting lifting assembly 4200 is fixedly mounted on the frame 1000 in the vertical direction, and the suction cup mounting assembly 4300 is connected to the ball planting lifting assembly 4200 and moves up and down by the drive of the ball planting lifting assembly 4200. The suction cup 4400 is mounted on the suction cup mounting assembly 4300, and the work station rotation mechanism 1100 is mounted on the frame 1000. The rotation of the turntable on the work station rotation mechanism 1100 alternately delivers the solder balls and chips to the bottom of the suction cup 4400.

[0105] In the above-described embodiment, this solution uses the workstation rotation mechanism 1100 to first deliver the solder balls to the bottom of the suction cup 4400. The ball planting lift assembly 4200 is then activated. When ball planting lift assembly 4200 is activated, it drives the suction cup mounting assembly 4300 to move up and down. When the suction cup mounting assembly 4300 moves downward, it drives the suction cup 4400 downward, activating the suction cup 4400 and generating negative pressure to absorb the solder balls. Once the solder balls are absorbed, the ball planting lift assembly 4200 drives the suction cup 4400 upward, while the turntable of the workstation rotation mechanism 1100 rotates, removing the remaining solder balls and replacing the chip that has just been coated with solder paste by the chip squeegee mechanism under the suction cup 4400. The ball placement lift assembly 4200 is activated again, driving the suction cup 4400 downward toward the chip to be placed. The negative pressure on the suction cup 4400 is released, allowing the solder ball to adhere to the solder paste on the chip. The suction cup 4400 then rises, completing the placement process. The station rotation mechanism 1100 rotates the solder ball and chip in a continuous cycle of scraping glue, sucking the ball, placing the ball, scraping glue, sucking the ball, and placing the ball.

[0106] like Figure 8 As shown, the specific structure of this embodiment is that the station rotation mechanism 1100 further includes a blowing part 2300. Figure 9 、 Figure 10As shown, the ball holding unit 2200 is provided with a placement cavity 2210 for placing solder balls. When ball planting is required, the turntable 1110 can transport the ball holding unit 2200 to the suction cup position, allowing the suction cup to absorb the small solder balls in the placement cavity 2210 through negative pressure. The blowing unit 2300 is connected to the placement cavity 2210. The blowing unit 2300 can be located on the turntable 1110 or elsewhere. In this embodiment, the transport blowing unit 2300 is located on the frame. When the turntable 1110 transports the ball holding unit 2200 to the suction cup position, the ball holding unit 2200 reaches the position of the blowing unit 2300, and the blowing unit 2300 is activated to blow air into the placement cavity 2210. After the suction cup picks up the solder ball, the turntable 1110 drives the ball receiving unit 2200 away from the suction cup 4400, and the air blowing unit 2300 closes, stopping the air blowing into the placement chamber 2210. Furthermore, the carrier 1400 on the turntable 1110 is used to load the chip. The rotation of the turntable 1110 allows the solder balls in the ball receiving unit 2200 and the chips on the carrier 1400 to be continuously alternately delivered to the bottom of the suction cup 4400.

[0107] In the above scheme, the turntable 1110 is used to transport the ball receiving unit 2200 to the suction cup station. The ball receiving unit 2200 has a placement chamber 2210 for placing the balls to be sucked. The ball placement lifting assembly 4200 drives the suction cup to the placement chamber 2210 and activates negative pressure to suck the balls from the upper opening of the placement chamber 2210. During the suction process of the suction cup 4400, the air blowing unit 2300 blows air into the placement chamber 2210, blowing the solder balls inside the placement chamber 2210 and moving the accumulated solder balls, thereby dispersing the solder balls and achieving a more even distribution within the placement chamber 2210. When the suction cup applies negative pressure to the blown solder balls, the solder balls evenly distributed within the suction cup's suction area are more easily attracted to the suction holes of the suction cup, thus ensuring that all the suction holes on the suction cup can attract solder balls. After the ball suction process is completed, the turntable is rotated to switch the position of the chip and the suction cup, so that the chip is positioned under the suction cup in preparation for the next ball placement process.

[0108] like Figure 9 、 Figure 12 As shown, in the specific structure of this embodiment, the turntable 1110 is rotatably mounted on the frame 1000 in a horizontal plane. The ball holding unit 2200 and the carrier 1400 are both fixed to the turntable 1110 by screws and located at the non-rotational center of the turntable 1110. To enable the rotation of the turntable 1110 to drive the ball holding unit 2200 to achieve a large displacement, the ball holding unit 2200 and the carrier 1400 are both located at the periphery of the turntable 1110. The rotation of the turntable 1110 causes the ball holding unit 2200 to move closer to or further away from the suction cup. The air blowing unit 2300 is located below the turntable 1110 and is connected to the frame 1000.

[0109] like Figure 10 、 Figure 11 As shown, the ball receiving portion 2200 specifically comprises a cartridge mounting plate 2220 and a cartridge body 2230. The cartridge body 2230 is mounted on the cartridge mounting plate 2220. The periphery of the cartridge mounting plate 2220 protrudes from the outer wall of the cartridge body 2230. Through holes or threaded holes may be provided in the protruding portion of the cartridge mounting plate 2220, and the cartridge mounting plate 2220 is then fixed to the turntable 1110 using screws. The placement chamber 2210 is defined in the cartridge body 2230. The cartridge mounting plate 2220 is provided with a plurality of ball-blowing holes 2240. The diameter of each of the ball-blowing holes 2240 is smaller than that of the solder ball, preventing the solder ball from leaking out of the placement chamber 2210. The ball-blowing holes 2240 extend vertically through the cartridge mounting plate 2220 and communicate with the placement chamber 2210. In this embodiment, the plurality of blowing holes 2240 are arranged in a rectangular shape, corresponding to the shape of the chip. The number of blowing holes 2240 corresponds to the number of contacts on the chip. This facilitates blowing air through the blowing holes 2240 to displace an equal number of solder balls, allowing the corresponding number of solder balls corresponding to the chip contacts to be sucked up by the suction cup. To allow air to flow into the blowing holes 2240, the turntable 1110 is provided with a clearance hole 2120 that provides space for the blowing holes 2240. In this embodiment, the clearance hole 2120 is square, and its opening is larger than the rectangular area of ​​the arrangement of the plurality of blowing holes 2240.

[0110] like Figure 10 、 Figure 12 As shown, the specific structure of the air blowing unit 2300 includes an air blowing plate 2310 and a driving unit 2320. The air blowing plate 2310 is located below the ball holding unit 2200, specifically, below the turntable 1110. The driving unit 2320 is connected to the air blowing plate 2310 and drives the air blowing plate 2310 to move back and forth. In this embodiment, the driving unit 2320 drives the air blowing plate 2310 to move back and forth in the left and right directions. The reciprocating movement of the air blowing plate 2310 causes the air blowing plate 2310 to switch between a state of supplying air aligned with the ball blowing holes 2240 and a state of interrupting air supply offset from the ball blowing holes 2240. This causes the air in the placement chamber 2210 to intermittently flow, causing the solder balls inside to be blown up or down, thereby disrupting the solder balls and preventing them from piling up. This also ensures a more even distribution of the solder balls within the placement chamber 2210.

[0111] like Figure 9 、 Figure 10As shown, the driving unit 2320 includes: a ball box driving cylinder 2321 and a mounting plate 2322. The ball box driving cylinder 2321 is fixedly connected to the upper surface of the frame by screws, and the mounting plate 2322 is fixedly arranged on the piston rod of the driving cylinder. The blowing unit 2300 is fixedly connected to the mounting plate 2322 by screws. The piston rod is arranged in the left and right directions. Driven by the ball box driving cylinder 2321, the blowing unit 2300 can move quickly left and right. The ball box driving cylinder 2321 in this embodiment is a double-axis cylinder. The double-axis cylinder makes the force more uniform, so that the blowing unit 2300 can be stably advanced. It is easy to imagine that the driving unit 2320 can also be an electric push rod, a ball screw linear motion mechanism, etc.

[0112] like Figure 9 、 Figure 12 As shown, the blowing plate 2310 in this embodiment specifically includes: an intermediate plate 2312, an upper cover plate 2311, and a lower support plate 2313. The intermediate plate 2312 is provided with a buffer cavity 2314, and the buffer cavity 2314 passes through the intermediate plate 2312. The side of the intermediate plate 2312 is provided with an air guide hole 2315 connected to the buffer cavity 2314, and the air guide hole 2315 is used to connect to an external air pipe. The upper cover plate 2311 is fixedly arranged on the upper surface of the intermediate plate 2312 and seals the upper opening of the buffer cavity 2314. The upper cover plate 2311 is provided with an air outlet hole 2315. 16. The air outlet 2316 communicates with the buffer chamber 2314. The lower support plate 2313 is fixedly mounted on the lower surface of the intermediate plate 2312 and seals the lower opening of the buffer chamber 2314. Thus, the upper cover plate 2311 and the lower support plate 2313 block the buffer chamber 2314. Dividing the air blowing plate 2310 into the intermediate plate 2312, the upper cover plate 2311, and the lower support plate 2313 facilitates processing by machining the three plate-like structures separately and then splicing them together. Air is supplied through an external air pipe, allowing air to enter the buffer chamber 2314. The buffer chamber 2314 redirects air from entering from the side to blowing upward, thus preventing direct air flow and buffering the air's impact. To seal the buffer chamber 2314, sealing grooves can be provided on the upper and lower surfaces of the intermediate plate 2312, respectively, and sealing rings can be placed within the sealing grooves. This prevents gas leakage and conserves air resources.

[0113] In another embodiment, to prevent excessive gas leakage between the turntable 1110 and the air blowing plate 2310, a flexible retaining ring (not shown) is provided on the upper surface of the air blowing plate 2310. The flexible retaining ring is arranged around the air outlet 2316, and the upper end of the flexible retaining ring abuts against the lower surface of the turntable 1110. The flexible retaining ring can block the gas to a certain extent, allowing the gas to enter the placement cavity 2210 through the ball blowing hole 2240, thereby preventing a large amount of gas from overflowing out of the placement cavity 2210 and causing a large amount of gas waste. Since the flexible retaining ring has a certain degree of compressibility, it will not affect the rotation of the turntable 1110.

[0114] In this embodiment, the diameter of the air outlet hole 2316 is larger than the diameter of the ball blowing hole 2240. Increasing the diameter of the air outlet hole 2316 can reduce the impact force of the airflow rushing out of the air outlet hole 2316. In this way, when the airflow enters the ball blowing hole 2240, the impact force is not very strong, and only the force required to blow the solder ball is sufficient.

[0115] like Figure 10 To improve ball placement efficiency, two placement cavities 2210 are provided side by side in this embodiment, along with two corresponding buffer cavities 2314. The two placement cavities 2210 are arranged side by side in the left-right direction, and the two corresponding buffer cavities 2314 are arranged side by side in the left-right direction. This allows the suction cup to simultaneously pick up solder balls from two chip positions, allowing for ball placement on both chips, thus improving production efficiency.

[0116] like Figure 8 、 Figure 13 As shown, the automatic ball planting equipment specifically includes: a ball planting base 4100, the ball planting base 4100 is fixedly set on the frame, the ball planting base 4100 specifically includes a horizontally set ball planting base plate 4110, and a ball planting cylinder mounting plate 4120 vertically set on the ball planting base plate 4110, the ball planting base plate 4110 is fixedly installed on the upper surface of the frame by screws, and the ball planting cylinder mounting plate 4120 is fixedly installed on the ball planting base plate 4110 by screws.

[0117] like Figure 13 、 Figure 14As shown, the ball planting lift assembly 4200 in this embodiment specifically includes: a ball planting lift cylinder 4210, a ball planting template 4220, and upper and lower ball planting guides 4230. The ball planting lift cylinder 4210 is vertically connected to the ball planting base 4100. Specifically, the ball planting lift cylinder 4210 is fixedly connected to the surface of the ball planting cylinder mounting plate 4120 facing away from the chip via screws. The ball planting template 4220 is horizontally mounted on the piston rod of the ball planting lift cylinder 4210. Specifically, the ball planting lift cylinder 4210 is a dual-axis cylinder. Existing dual-axis cylinders are standardly equipped with a mounting block between the two axes. The ball planting template 4220 is fixedly connected to the mounting block on the piston rod of the ball planting lift cylinder 4210 via screws. The ball planting guides 4230 are vertically mounted on the ball planting base 4100, and the ball planting template 4220 is slidably connected to the guides 4230. Specifically, the lower ends of the guides 4230 are fixed to the base plate, and the ball planting template 4220 is driven by the ball planting lift cylinder 4210 to slide directionally on the guides 4230. This ensures stable up and down sliding of the ball planting template 4220.

[0118] like Figure 13 、 Figure 14 As shown, the ball planting upper and lower guide parts 4230 in this embodiment include: a second vertical linear bearing seat 4231, and a second vertical guide shaft 4232. The second vertical linear bearing seat 4231 is set on the ball planting template 4220 and passes through the ball planting template 4220 in the up-down direction. The second vertical guide shaft 4232 is fixedly set on the ball planting base 4100 in the vertical direction. The second vertical guide shaft 4232 is set in the second vertical linear bearing seat 4231 and passes through the second vertical linear bearing seat 4231. Specifically, the second vertical linear bearing seat 4231 is fixedly connected to the upper surface of the ball planting template 4220 by screws. The second vertical linear bearing seat 4231 passes through the ball planting template 4220. A linear bearing is embedded in the existing second vertical linear bearing seat 4231. The second vertical guide shaft 4232 adopts an optical axis, which is matched with the linear bearing to achieve stable up and down sliding of the ball planting template 4220 along the vertical guide axis. There are four upper and lower ball planting guide parts 4230, and the four upper and lower ball planting guide parts 4230 are symmetrically arranged around the ball planting lifting cylinder 4210, so that the ball planting template 4220 is limited on the horizontal plane, making the directional sliding of the ball planting template 4220 more stable.

[0119] like Figure 13 、 Figure 15As shown, the suction cup mounting assembly 4300 includes a left mounting portion 4310, a right mounting portion 4320, and a clamping portion 4330. The left mounting portion 4310 and the right mounting portion 4320 are mirror images arranged on the left and right sides of the ball planting template 4220. The two sides of the clamping portion 4330 are respectively connected to the left mounting portion 4310 and the right mounting portion 4320. The clamping portion 4330 is provided with a slot 4333, into which the suction cup 4400 is inserted. Specifically, a ball planting connecting plate 4340 is connected to the ball planting template 4220 in the vertical direction. The ball planting connecting plate 4340 is fixedly connected to the front surface of the ball planting template 4220 by screws. The left mounting portion 4310 and the right mounting portion 4320 are respectively fixedly connected to the left and right sides of the ball planting connecting plate 4340 by screws. In this way, after the left mounting portion 4310 and the right mounting portion 4320 are connected to the clamping portion 4330 , the suction cup 4400 can be fixed from the left and right sides through the clamping portion 4330 , thereby stably connecting the suction cup 4400 .

[0120] like Figure 13 、 Figure 15As shown, the left and right mounting portions 4310 and 4320 in this embodiment have the same structure. Taking the left mounting portion 4310 as an example, the left mounting portion 4310 includes a left guide rail mounting plate 4311, a left pull plate 4312, a left guide rail 4313, a left slot connecting plate 4315, and a stop screw 4316. The left guide rail mounting plate 4311 extends in the front-to-back direction. The left pull plate 4312 is disposed on the left guide rail mounting plate 4311 and extends toward the right mounting portion 4320. The left guide rail 4313 is fixedly mounted on the left guide rail mounting plate 4311 in the top-to-bottom direction. A left slide 4314 is slidably connected to the left guide rail 4313. The left slot connecting plate 4315 is fixedly connected to the left slide 4314, and the engaging portion 4330 is connected to the left slot connecting plate 4315. In the specific structure, one end of the left guide rail mounting plate 4311 is fixedly connected to the left side of the ball planting connecting plate 4340 via screws. The other end of the left guide rail mounting plate 4311 extends forward. The left guide rail 4313 is fixedly connected to the right side of the left guide rail mounting plate 4311 in the vertical direction via screws. The left slide 4314 is matched with the left guide rail 4313 and slides on the left guide rail 4313 in the vertical direction. The left slide 4314 is fixedly connected to the left slot connecting plate 4315 via screws. The left slot connecting plate 4315 extends in the front-to-back direction. One end of the left pull plate 4312 is screwed to the upper surface of the left guide rail mounting plate 4311. The other end of the left pull plate 4312 extends rightward to the top of the left slot connecting plate 4315. The screw head of the stop screw 4316 is located above the left pull plate 4312. The left pull plate 4312 has a through hole, through which the screw rod of the stop screw 4316 passes and is fixed to the left slot connecting plate 4315. The left end of the clamping portion 4330 is connected to the left slot connecting plate 4315. The right mounting portion 4320 on the other side is arranged as a mirror image of the left mounting portion 4310, and the right end of the clamping portion 4330 is connected to the right mounting portion 4320. Thus, when the suction cup 4400 is mounted on the clamping portion 4330, the left and right mounting portions 4310 and 4320 secure the suction cup 4400 via the clamping slot 4333.During the ball sucking process, the ball planting lifting assembly 4200 moves downward, driving the ball planting template 4220 to move downward, and then driving the ball planting connecting plate 4340 to move downward through the ball planting template 4220. The downward moving ball planting connecting plate 4340 drives the left guide rail mounting plate 4311 on it to move downward, and then drives the suction cup 4400 to move down to the top of the ball holding part through the clamping part 4330. When the suction cup 4400 abuts against the opening of the ball holding part, the ball planting lifting assembly 4200 can continue to descend, and the left card slot connecting plate 4315 slides upward relative to the left guide rail 4313. The screw of the limit screw 4316 is equivalent to a guide rod to limit the sliding of the left card slot connecting plate 4315, so that the suction cup 4400 located on the opening of the ball holding part can press the opening of the ball holding part, and then absorb the solder balls in the ball holding part through negative pressure. When the ball planting lifting assembly 4200 rises, the left slot connecting plate 4315 moves downward under the action of the gravity of the suction cup 4400, and the screw head of the limit screw 4316 can abut against the upper surface of the left pull plate 4312, so that the suction cup 4400 moves down to the predetermined position and does not move.

[0121] like Figure 15 As shown, the clamping portion 4330 in this embodiment includes an upper clamping plate 4331 and a lower clamping plate 4332 arranged parallel to the upper clamping plate 4331. The upper clamping plate 4331 and the lower clamping plate 4332 are spaced apart to form the clamping slot 4333. A mounting cavity 4334 is formed through the upper surfaces of the upper clamping plate 4331 and the lower clamping plate 4332. Both sides of the suction cup 4400 are embedded in the clamping slot 4333, and the suction cup 4400 is placed in the mounting cavity 4334. In the specific structure, one side of the mounting cavity 4334 extends beyond one side of the upper clamping plate 4331, so that the outer contour of the mounting cavity 4334 is a square with one side open. The clamping slot 4333 is located on the side of the clamping portion 4330. In this way, the clamping slot 4333 is located on the left and right side walls of the mounting cavity 4334. The two sides of the suction cup 4400 are embedded by means of the locking grooves 4333 on the two side walls of the installation cavity 4334.

[0122] like Figure 13 、 Figure 17As shown, the suction cup 4400 in this embodiment includes a suction plate 4410 and a limiting boss 4420 connected to the suction plate 4410. An air cavity is formed between the suction plate 4410 and the limiting boss 4420, which is connected to an air tube 4430. A suction ball hole 4440 is defined on the lower surface of the suction plate 4410 and communicates with the air cavity. Both sides of the suction plate 4410 are embedded in the retaining groove 4333, and the limiting boss 4420 is located in the mounting cavity 4334. In the specific structure, a step is formed between the suction plate 4410 and the limiting boss 4420. When the left and right sides of the suction plate 4410 are inserted into the slot 4333, the step abuts against the inner wall of the mounting cavity 4334. The cooperation between the mounting cavity 4334 and the limiting boss 4420 allows the suction cup 4400 to be positioned, making it easier to install the suction cup 4400 on the clamping portion 4330. Air is sucked in through the air pipe 4430, creating negative pressure at the location of the ball suction hole 4440, thereby sucking up the solder ball. The position of the suction hole is set to correspond to the contact position of the chip to be implanted. In this way, the solder ball sucked by the suction hole can be placed on the corresponding contact position of the chip. The ball suction hole 4440 in this embodiment is provided with a chamfer 4450 at the edge of the hole facing downward. Through the setting of the chamfer 4450, the solder ball can be better sucked into the suction cup 4400 by the negative pressure. The chamfer 4450 can provide an adsorption position for the solder ball adsorbed on the suction cup 4400, so that the solder ball can be adsorbed on the suction cup 4400 more stably.

[0123] like Figure 13 、 Figure 15 As shown, the ball planting mechanism also includes a knocking assembly 4500 connected to the ball planting lifting assembly. In this embodiment, the knocking assembly 4500 includes: a knocking rod 4530, a knocking cylinder 4510, a knocking plate 4520, and a knocking sub-plate 4540. The knocking cylinder 4510 is fixed to the ball planting connecting plate 4340 by screws in the vertical direction. The knocking plate 4520 is connected to the piston rod of the knocking cylinder 4510 via a mounting block on the piston rod of the knocking cylinder 4510. The knocking plate 4520 extends along the side facing the suction cup 4400, that is, the knocking plate 4520 extends toward the front. The knocking rod 4530 is fixed to the knocking plate 4520 by screws in the vertical direction, and the lower end of the knocking rod 4530 faces the suction cup 4400. When the suction cup 4400 is sucking up the solder ball, the knocking cylinder 4510 is started, and the piston rod of the knocking cylinder 4510 drives the knocking plate 4520 to move downward, thereby driving the knocking rod 4530 to move downward through the knocking plate 4520. The downward moving knocking rod 4530 knocks the suction cup 4400, thereby knocking off the solder ball adsorbed by static electricity on the suction cup 4400. Since the knocking force is controlled, the solder ball adsorbed by the negative pressure due to the large adsorption force can be prevented from being knocked off.

[0124] In this embodiment, the knocking sub-plate 4540 is arranged parallel to the bottom of the knocking plate 4520 and is fixed to the cylinder body of the knocking cylinder 4510 by screws. The knocking rod 4530 passes through the knocking sub-plate 4540 and is slidably arranged on the knocking sub-plate 4540. In this way, the knocking sub-plate 4540 has a guiding effect on the knocking rod 4530, allowing the knocking rod 4530 to slide in a directional and stable manner in the up and down direction.

[0125] like Figure 14 、 Figure 16 As shown, the ball planting mechanism in this embodiment further includes a ball planting fine-tuning assembly 4600, which includes: a ball planting micrometer head seat 4610, a ball planting micrometer head 4620, and a ball planting micrometer head adjustment block 4630. The ball planting micrometer head seat 4610 is fixedly mounted on the side of the ball planting cylinder mounting plate 4120 away from the ball planting lifting cylinder 4210 by screws. The ball planting micrometer head 4620 is vertically connected to the ball planting micrometer head seat 4610. The ball planting micrometer head adjustment block 4630 is fixedly mounted on the side of the ball planting template 4220 facing the ball planting lifting cylinder 4210, with one end of the ball planting micrometer head 4620 abutting against the ball planting micrometer head adjustment block 4630. The ball planting template 4220's resting height after descending can be adjusted using the ball planting fine-tuning assembly 4600. Furthermore, the ball planting lift cylinder 4210 is equipped with a limit nut. Once the ball planting template 4220 has been precisely adjusted into position by the ball planting fine-tuning assembly 4600, the position is fixed using the limit nut on the ball planting lift cylinder 4210. This allows the limit nut to stop the ball planting template 4220 each time it descends to a predetermined height. This allows the suction cup mounting assembly 4300 and suction cup 4400 to be precisely controlled while the ball planting template 4220 is moving upwards and downwards, precisely limiting the downward position of the suction cup 4400 and allowing precise control of the suction cup's elevation.

[0126] In addition, this solution also proposes an automatic ball planting method for the automatic ball planting device described above, the automatic ball planting method comprising:

[0127] Step A: The station rotation mechanism is started, the turntable rotates, the carrier loaded with chips rotates to the bottom of the squeegee assembly, and the ball receiving portion loaded with solder balls rotates to the bottom of the suction cup;

[0128] Step B: activating the chip scraping mechanism, which applies solder paste to the chip on the carrier, and activating the ball planting mechanism, which causes the suction cup to absorb the solder balls in the ball holding portion;

[0129] Step C: The turntable rotates so that the chip coated with solder paste is located below the suction cup, and the other ball receiving part is located below the squeegee assembly;

[0130] Step D: The ball placement mechanism is activated, and the suction cup places the solder ball onto the chip coated with solder paste below, while the chip scraping mechanism is not activated;

[0131] Step E: The turntable rotates, causing another carrier loaded with chips to rotate to the bottom of the squeegee assembly, and at the same time, another ball receiving portion loaded with solder balls rotates to the bottom of the suction cup. At this time, the chip with completed ball implantation is removed from the ball implantation mechanism;

[0132] Step F: Remove the chip with the ball implanted on the carrier, replace it with a new chip without the ball implanted, and execute step B at the same time.

[0133] After completing step B, the subsequent steps are executed sequentially. This forms a continuous loop until the "Auto Stop" button is pressed to stop the entire process. It is also easy to imagine that the chip scraping mechanism can also operate independently, and the ball placement mechanism can also operate independently.

[0134] In summary, in this solution, the turntable on the workstation rotation mechanism rotates, thereby driving the ball holding part and the carrier to rotate to the chip scraping mechanism or ball planting mechanism, so that the solder balls and chips are cyclically replaced, and the cycle of scraping glue - sucking balls - planting balls - scraping glue - sucking balls - planting balls can be continuously realized. Continuous and uninterrupted scraping and ball planting realize the process of automatic ball planting, saving labor costs and improving production efficiency. This solves the problem of manual operation in the existing technology that leads to slow chip production efficiency, waste of manpower, and difficulty in ensuring chip quality consistency.

[0135] It should be understood that the application of the present invention is not limited to the above examples. For those skilled in the art, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. An automatic ball placement device, comprising a frame, characterized in that: The automatic ball planting device also includes: A station rotation mechanism, the station rotation mechanism includes a turntable rotatably disposed on the frame, a carrier disposed on the turntable and used to load chips, and a ball receiving portion disposed on the turntable and used to place solder balls; a chip scraping mechanism, the chip scraping mechanism being disposed on the frame and located on one side of the turntable, the chip scraping mechanism comprising a scraping assembly located above the turntable, the scraping assembly reciprocating along the radial direction of the turntable to apply solder paste to the chip; A ball planting mechanism, the ball planting mechanism is arranged on the frame and located on one side of the turntable, the ball planting mechanism includes a suction cup, and the suction cup is used to suck and release solder balls; The solder balls in the ball holding portion and the chips coated with paste by the squeegee assembly are alternately positioned below the suction cup by the rotation of the turntable; The turntable is provided with a plurality of ball holding parts and a plurality of carriers, and the plurality of ball holding parts and the plurality of carriers are alternately arranged at intervals; The ball holding portion is provided with a placement cavity for placing solder balls; The station rotation mechanism further includes: a blowing part, which is arranged on the frame and communicates with the placement cavity when the ball holding part rotates to below the suction cup; The carrier includes a substrate and a fixing member, and the substrate is provided with a chip placement groove; The fixing member includes an elastic piece, one end of which is fixedly arranged on the side wall of the chip placement groove, and the other end of which extends into the chip placement groove.

2. The automatic ball planting device according to claim 1, characterized in that: The chip scraping mechanism also includes: A scraper lifting assembly, the scraper lifting assembly being fixedly arranged on the frame in a vertical direction; a scraper moving assembly, the scraper moving assembly being connected to the scraper lifting assembly and being driven by the scraper lifting assembly to move up and down; A scraper mesh plate, the scraper mesh plate is connected to the scraper lifting assembly and is driven by the scraper lifting assembly to move up and down; The scraper assembly includes a left scraper assembly and a right scraper assembly, and the left scraper assembly and the right scraper assembly are arranged side by side on the scraper moving assembly along the left and right directions; The chip is located below the scraper web, the solder paste is located on the scraper web, the left scraper assembly and the right scraper assembly are located on the upper surface of the scraper web and are moved in left and right directions by the drive of the scraper moving assembly.

3. The automatic ball planting device according to claim 2, characterized in that: The scraper moving assembly includes a movable plate, a scraper assembly support plate is fixedly arranged on the movable plate, and the scraper assembly support plate is extended in the left and right directions; The left scraper assembly includes: A left scraper cylinder, the left scraper cylinder being fixedly arranged on the scraper assembly support plate in a vertical direction; A left scraper mounting block, the left scraper mounting block being fixedly arranged on the piston shaft of the left scraper cylinder, the left scraper mounting block extending in the front-to-back direction; A left scraper, the left scraper being arranged on the left scraper mounting block along a front-to-rear direction, with a blade edge of the left scraper facing the upper surface of the scraper mesh; The right scraper assembly includes: A right scraper cylinder, the right scraper cylinder being fixedly arranged on the scraper assembly support plate in a vertical direction, and the right scraper cylinder and the left scraper cylinder being arranged side by side; a right scraper mounting block, the right scraper mounting block being fixedly mounted on the piston shaft of the right scraper cylinder and extending in a front-to-rear direction; a right scraper, the right scraper being arranged on the right scraper mounting block along a front-to-rear direction, with a blade edge of the right scraper facing the upper surface of the scraper mesh; The left scraper and the right scraper are arranged side by side along the left-right direction.

4. The automatic ball planting device according to claim 1, characterized in that: The ball planting mechanism includes: a ball planting lifting assembly, which is fixedly arranged on the frame in a vertical direction; a suction cup mounting assembly, the suction cup mounting assembly being connected to the ball planting lifting assembly and being driven by the ball planting lifting assembly to move up and down, the suction cup being arranged on the suction cup mounting assembly; and A knocking component is connected to the ball planting lifting component and is used to knock the suction cup.

5. The automatic ball planting device according to claim 4, characterized in that: The ball planting mechanism further includes a ball planting base, which is fixedly arranged on the frame; The ball planting lifting assembly includes: A ball planting lifting cylinder, the ball planting lifting cylinder being vertically connected to the ball planting base; A ball planting template, the ball planting template is arranged on the piston rod of the ball planting lifting cylinder in a horizontal direction; The ball planting upper and lower guide parts are arranged on the ball planting base along the vertical direction, and the ball planting template is slidably connected to the ball planting upper and lower guide parts.

6. The automatic ball planting device according to claim 5, characterized in that: The suction cup mounting assembly includes: A left mounting portion and a right mounting portion, wherein the left mounting portion and the right mounting portion are mirror-imaged and arranged on the left and right sides of the ball planting template; A clamping portion, two sides of which are respectively connected to the left mounting portion and the right mounting portion; The clamping portion is provided with a clamping slot, and the suction cup is clamped in the clamping slot.

7. The automatic ball planting device according to claim 6, characterized in that: The left mounting portion includes: a left guide rail mounting plate, the left guide rail mounting plate extending in the front-to-back direction; a left pull plate, the left pull plate being arranged on the left guide rail mounting plate and extending toward the right mounting portion; A left guide rail, the left guide rail being fixedly arranged on the left guide rail mounting plate in an up-down direction, and a left slide being slidably connected to the left guide rail; A left card slot connecting plate, wherein the left card slot connecting plate is fixedly connected to the left slide, and the clamping portion is connected to the left card slot connecting plate; A limit screw, wherein the screw head of the limit screw is located above the left pull plate, and the screw rod of the limit screw passes through the left pull plate and is fixedly connected to the left slot connecting plate.

8. The automatic ball planting device according to claim 5, characterized in that: The ball planting template is connected with a ball planting connecting plate in the up and down directions; The knocking assembly includes: a knocking rod located above the suction cup, the knocking rod moving up and down knocking the suction cup; A knocking cylinder is arranged on the ball planting connecting plate in an up-down direction; a knocking plate connected to the piston rod of the knocking cylinder, the knocking plate extending along a side facing the suction cup, the knocking rod being fixedly arranged on the knocking plate in an up-down direction, with the lower end of the knocking rod facing the suction cup; The knocking sub-plate is arranged parallel to the bottom of the knocking plate and is fixedly connected to the cylinder body of the knocking cylinder. The knocking rod passes through and is slidably arranged on the knocking sub-plate.

9. An automatic ball planting method, characterized in that: For the automatic ball planting device according to any one of claims 1 to 8, the automatic ball planting method comprises: Step A: The station rotation mechanism is started, the turntable rotates, the carrier loaded with chips rotates to the bottom of the squeegee assembly, and the ball receiving portion loaded with solder balls rotates to the bottom of the suction cup; Step B: activating the chip scraping mechanism, which applies solder paste to the chip on the carrier, and activating the ball planting mechanism, which causes the suction cup to absorb the solder balls in the ball holding portion; Step C: The turntable rotates so that the chip coated with solder paste is located below the suction cup, and the other ball receiving part is located below the squeegee assembly; Step D: The ball placement mechanism is activated, and the suction cup places the solder ball onto the chip coated with solder paste below, while the chip scraping mechanism is not activated; Step E: The turntable rotates, causing another carrier loaded with chips to rotate to the bottom of the squeegee assembly, and at the same time, another ball receiving portion loaded with solder balls rotates to the bottom of the suction cup. At this time, the chip with completed ball implantation is removed from the ball implantation mechanism; Step F: Remove the chip with the ball implanted on the carrier, replace it with a new chip without the ball implanted, and execute step B at the same time.

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