A small-pitch wave crest material and a welding method thereof

Abstract

The application discloses a small-distance wave crest material and a welding method thereof. The small-distance wave crest material comprises a circuit board, a mounting material mounted on one side surface of the circuit board, and a wave crest material comprising a plurality of inserts welded on the side surface of the circuit board on which the mounting material is mounted. The distance between the mounting material and the wave crest material is not more than 1 mm. The above structure can prevent material welding short circuit and save the circuit board surface welding area.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of circuit boards, in particular to a small-interval wave peak material and a welding method thereof. BACKGROUND

[0002] A circuit board, also known as a PCB board, is the basis of electronic components and provides electrical connection for electronic components. The welding of components on the circuit board includes wave peak welding.

[0003] The interval of the material welding of the conventional wave peak welding needs to be greater than 1.25 mm or above, so that the solder of the wave peak material welding can be easily discharged and the welding short circuit does not occur. However, the distance between the pin of the conventional wave peak material and the distance of the mounting material requires to be greater than 2.5 mm or above, which greatly affects the overall layout of the product and is not conducive to the current compact structure requirement. The interval of the small-interval wave peak material is less than 1 mm, which can greatly save the welding area of the circuit board surface and increase the compactness of the material welding.

[0004] When the interval of the wave peak material welded on the circuit board is less than 1 mm, the solder after the wave peak welding of the wave peak material cannot be taken away due to the surface tension of the wave peak material and the capillary action of the pin of the wave peak material, thereby causing the welding short circuit of the wave peak material. SUMMARY

[0005] The application provides a small-interval wave peak material and a welding method thereof to prevent material welding short circuit and save the welding area of the circuit board surface.

[0006] To solve the above technical problems, the application provides a small-interval wave peak material, which comprises a circuit board, a mounting material mounted on one side surface of the circuit board, and a wave peak material comprising a plurality of inserts, wherein the inserts are welded to the side surface of the circuit board on which the mounting material is mounted, and the distance between the mounting material and the wave peak material is not more than 1 mm.

[0007] Preferably, the interval between two adjacent inserts is not more than 1 mm.

[0008] Preferably, the inserts penetrate through the circuit board and are welded to the side surface of the circuit board on which the mounting material is mounted.

[0009] Preferably, the wave peak material is welded to the circuit board by a wave peak welding process.

[0010] Preferably, the mounting material is welded to the circuit board by a flow welding or immersion welding process.

[0011] To solve the above technical problems, the application provides a welding method for small-interval wave crest materials, which comprises the following steps: providing a circuit board, wave crest materials and mounting materials; mounting the mounting materials on one side surface of the circuit board; and welding the wave crest materials on the one side surface of the circuit board on which the mounting materials are mounted; wherein the distance between the mounting materials and the wave crest materials is less than 1 mm.

[0012] Preferably, the step of welding the wave crest materials on the one side surface of the circuit board on which the mounting materials are mounted comprises the step of welding the wave crest materials on the one side surface of the circuit board on which the mounting materials are mounted by using a wave crest welding process.

[0013] Preferably, the wave crest materials comprise a plurality of inserts; and the step of welding the wave crest materials on the one side surface of the circuit board on which the mounting materials are mounted comprises the step of welding the inserts on the one side surface of the circuit board on which the mounting materials are mounted through the circuit board.

[0014] Preferably, the distance between two adjacent inserts is less than 1 mm.

[0015] Preferably, the step of mounting the mounting materials on the one side surface of the circuit board comprises the steps of: pasting the mounting materials on the one side surface of the circuit board by using glue; and welding the mounting materials by using a reflow soldering or dip soldering process.

[0016] The application has the following beneficial effects: the mounting materials are first mounted on the one side surface of the circuit board, and then the wave crest materials are welded on the one side surface of the circuit board on which the mounting materials are mounted, and the distance between the wave crest materials and the mounting materials is less than 1 mm, so that the wave crest materials can take away the excess solder of the wave crest materials by capillary action with the mounting materials in the process of wave crest welding, thereby preventing the wave crest materials from being short-circuited due to small interval. In addition, the welding devices on the surface of the circuit board are more compact by reducing the welding distance between the wave crest materials and the mounting materials, thereby saving the welding area on the surface of the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can also be obtained by those skilled in the art without any creative effort based on these drawings.

[0018] Figure 1 FIG. 1 is a structural schematic view of one embodiment of the application for small-interval wave crest materials;

[0019] Figure 2Flowchart of an embodiment of a method for welding a small-pitch wave crest material. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative effort are within the protection scope of the present application.

[0021] The terms used in the embodiments of the present application are merely for the purpose of describing particular embodiments, and are not intended to limit the present application. The singular forms "a", "an" and "the" used in the embodiments of the present application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. "Plural" generally includes at least two, but does not exclude the case of including at least one.

[0022] It should be understood that the term "and / or" used herein is merely an association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " herein generally represents an "or" relationship between the front and rear associated objects.

[0023] It should be understood that the terms "include", "contain" or any other variation used herein are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the elements defined by the statement "include" do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0024] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement condition, etc. between the components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications will also change accordingly.

[0025] Reference to an "embodiment" herein means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily mutually exclusive of one another. As will be apparent to those of ordinary skill in the art, embodiments described herein can be combined with other embodiments.

[0026] The application provides a small pitch wave crest material, please refer to Figure 1 , Figure 1 The application provides a small pitch wave crest material, please refer to Figure 1 The small pitch wave crest material includes a circuit board 11, and the circuit board 11 is surface-mounted with a mounting material 12 and a wave crest material 13.

[0027] In the embodiment, the wave crest material 13 includes a plug-in, which is a fixed seat for mounting a chip during testing, and uses a PIN contact mode to contact the solder ball or pin of the chip. Because the plug-in is large in size and is not suitable for forming an integrated component by mounting (SMT technology), the plug-in is currently integrated on a circuit board by manual plug-in and robot plug-in.

[0028] The mounting material 12 is a component integrated on a circuit board by SMT assembly technology. The SMT is a circuit assembly technology in which a surface-mounted device without a pin or with a short pin is mounted on a surface of a circuit board (PCB) or a surface of another substrate, and then is welded and assembled by flow soldering or dip soldering.

[0029] Specifically, the mounting material 12 is surface-mounted on one side surface of the circuit board 11, and the wave crest material 13 is welded on the side surface of the circuit board 11 on which the mounting material 12 is surface-mounted.

[0030] In the embodiment, the wave crest material 13 includes a plurality of plug-ins, and the plug-ins are pins of the wave crest material. The wave crest material 13 is welded to one side surface of the circuit board through the plug-ins. Specifically, the plug-ins of the wave crest material 13 penetrate the circuit board 11 and are welded to a back surface of the circuit board 11, wherein the back surface of the circuit board 11 is the side surface on which the mounting material 12 is surface-mounted, and the back surface of the circuit board 11 is away from the side surface of the wave crest material 13.

[0031] In the embodiment, the distance between the mounting material 12 and the wave crest material 13 is not more than 1 mm, so that the mounting material 12 takes away the solder of the wave crest material 13 in the wave soldering process by capillary action.

[0032] The wave crest material 13 is welded to the circuit board 11 by using the wave crest welding process. It should be noted that the wave crest welding is to make the welding surface of the plug-in board directly contact with the high-temperature liquid tin to achieve the welding purpose. The high-temperature liquid tin keeps a slope, and the liquid tin forms a wave-like phenomenon by a special device. The main material is a solder strip.

[0033] The mounting material 12 is pasted on one side surface of the circuit board 11 by using the glue, and then is welded to the circuit board 11 by using the flow welding or immersion welding.

[0034] In the process of welding the wave crest material 13 to the surface of the circuit board 11, the excess solder is generated. In the traditional way, the excess solder is removed by increasing the distance of the wave crest material 13. In the embodiment, the distance between the wave crest material 13 and the mounting material 12 is reduced, so that the excess solder on the wave crest material 13 is transferred to the mounting material 12 by the capillary action, and the solder on the surface of the wave crest material 13 is taken away by the mounting material 12, thereby preventing the short circuit of the wave crest material 13. It should be noted that in the embodiment, the capillary action refers to the process that the liquid solder is transferred from one end to the other end under the action of the surface tension.

[0035] The wave crest material is welded to the surface of the circuit board 11, and the distance between the wave crest material and the mounting material is not more than 1 mm, so that the excess solder of the wave crest material is taken away by the mounting material during the welding, thereby preventing the short circuit of the wave crest material due to the small distance. In addition, the welding distance between the wave crest material and the mounting material is less than 1 mm, so that the welding device on the surface of the circuit board is more compact, and the welding area on the surface of the circuit board is saved.

[0036] The application also provides a welding method of the wave crest material with small distance. Please refer to Figure 2 , Figure 2 which is a flowchart of an embodiment of the welding method of the wave crest material with small distance. As shown in Figure 2 , the welding method comprises the following steps:

[0037] Step S21: providing a circuit board, a wave crest material and a mounting material.

[0038] The one side surface of the circuit board has a welding point.

[0039] The wave crest material comprises a plug-in board, which is a fixed seat for mounting a chip during testing. The plug-in board uses the contact mode of a PIN pin to contact the solder ball or pin of the chip.

[0040] The mounting material is a device integrated on the circuit board by using the SMT assembly technology.

[0041] Step S22: mounting the mounting material on one side surface of the circuit board.

[0042] In this step, the mounting material is pasted on one side surface of the circuit board by adhesive, and then the mounting material is welded on the surface of the circuit board by reflow soldering or dip soldering process, so as to improve the bonding force between the mounting material and the circuit board.

[0043] Step S23: welding the wave crest material on the side surface of the circuit board where the mounting material is mounted.

[0044] Specifically, the wave crest material is welded on the circuit board at a position less than 1 mm away from the mounting material.

[0045] In this embodiment, the wave crest material is welded on the side surface of the circuit board where the mounting material is mounted by wave crest welding process. In the wave crest welding process, the soldering surface of the plug-in board is directly contacted with high-temperature liquid tin to achieve welding, and the high-temperature liquid tin maintains an inclined surface and forms a wave crest by special device.

[0046] In this embodiment, the wave crest material includes a plurality of plugs, and the welding of the wave crest material includes: penetrating the plugs into the circuit board on the side surface of the circuit board where the mounting material is mounted. The distance between the adjacent two plugs is not more than 1 mm, so as to form a small-pitch wave crest welding and save the soldering area of the circuit board surface.

[0047] In the process of welding the plug into the circuit board surface by wave crest welding, excess solder is generated. In the traditional way, the distance between each plug is increased to facilitate the removal of excess solder, while in this embodiment, the distance between the wave crest material and the mounting material is reduced, i.e. the distance between the plug and the mounting material is reduced, so that the excess solder on the plug is transferred to the mounting material by capillary action, thereby removing the solder at the end of the plug through the mounting material to prevent short circuit of the wave crest material.

[0048] The beneficial effects of this embodiment are: by mounting the mounting material on one side surface of the circuit board first, and then welding the wave crest material on the side surface of the circuit board surface where the mounting material is mounted, and the distance between the wave crest material and the mounting material is less than 1 mm, so that the wave crest material can take away the excess solder of the wave crest material by capillary action with the mounting material in the process of wave crest welding, and prevent the wave crest material from being short-circuited due to small distance. In addition, by reducing the welding distance between the wave crest material and the mounting material, the soldering devices on the circuit board surface are more compact, and the soldering area of the circuit board surface is saved.

[0049] The above merely describes the embodiments of the present application, and does not limit the patent protection scope of the present application. Any equivalent structure or equivalent process transformation, or direct or indirect application in other related technical fields, which is made by using the content of the present application specification and drawings, is also included in the patent protection scope of the present application.

Claims

1. A small-pitch wave crest material, characterized in that, The small-pitch wave crest material includes: Circuit board; The mounting material is mounted on one side surface of the circuit board; The wave soldering material includes multiple inserts, with the spacing between two adjacent inserts not exceeding 1 mm; the inserts are soldered to the side surface of the circuit board on which the soldering material is mounted using a wave soldering process; wherein, the wave soldering process involves directly contacting the soldering surface of the wave soldering material with high-temperature liquid tin to achieve soldering; The distance between the mounting material and the wave soldering material is no more than 1 mm, so that a capillary channel is formed between the pad surface of the mounting material and the pad of the wave soldering material. The capillary channel guides excess solder during the wave soldering process to flow towards the mounting material to prevent short circuits.

2. The small-pitch wave crest material according to claim 1, characterized in that, The plug-in extends through the circuit board and is soldered to the side surface of the circuit board where the mounting material is attached.

3. The small-pitch wave crest material according to claim 1, characterized in that, The mounting material is soldered onto the circuit board using a reflow soldering or dip soldering process.

4. A welding method for small-pitch wave crest materials, characterized in that, The welding method for the small-pitch wave crest material includes: We provide circuit boards, wave soldering materials, and mounting materials. The mounting material is mounted onto one side surface of the circuit board; The wave soldering process is used to solder the wave soldering material to one side surface of the circuit board where the surface material is mounted; the wave soldering material includes multiple inserts; the spacing between two adjacent inserts does not exceed 1 mm; the step of soldering the wave soldering material to one side surface of the circuit board where the surface material is mounted includes: passing the insert through the circuit board and soldering the insert to one side surface of the circuit board where the surface material is mounted. The distance between the mounting material and the wave soldering material is no more than 1 mm, so that a capillary channel is formed between the pad surface of the mounting material and the pad of the wave soldering material. The capillary channel guides excess solder during the wave soldering process to flow towards the mounting material to prevent short circuits.

5. The welding method for small-pitch wave crest materials according to claim 4, characterized in that, The step of mounting the mounting material onto one side surface of the circuit board includes: The mounting materials are adhered to one side of the circuit board using adhesive. The mounting material is soldered using reflow soldering or dip soldering processes.

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