Inspection jig, substrate inspection device, and inspection device

Abstract

Provided is an inspection jig, a substrate inspection device, and an inspection device. The present invention provides a structure that can suppress warping of a substrate used for an inspection jig. The inspection jig includes: a first substrate; a probe unit having a probe; a second substrate arranged side by side with the first substrate and electrically connected to the probe; an electrical connection portion electrically connecting the first substrate and the second substrate; and a substrate holding portion holding the second substrate in a state of being arranged side by side in a thickness direction with respect to the first substrate, and holding the probe unit. The substrate holding portion has: a probe-side holding plate portion located on the probe unit side of the second substrate; and a holding plate support portion positioning the probe-side holding plate portion at a position arranged side by side in the thickness direction with respect to the first substrate. The substrate holding portion sandwiches the electrical connection portion with the first substrate and the second substrate, thereby holding the second substrate in a state of electrically connecting the first substrate and the second substrate via the electrical connection portion.

Description

TECHNICAL FIELD

[0001] The present application relates to an inspection jig and a substrate inspection apparatus including the same. BACKGROUND

[0002] An inspection jig used for inspecting a semiconductor wafer is known. As the inspection jig, Patent Literature 1 discloses a structure including a probe unit having probes that contact inspection pads of an object to be inspected, a space transformer including a ceramic substrate, a pogo pin unit, and a printed circuit substrate.

[0003] The space transformer has a wiring pattern corresponding to a configuration pattern of the probes on one face. The probes are electrically connected to the space transformer by connecting the probe unit to the one face. The space transformer has a wiring pattern corresponding to the printed circuit substrate on the opposite face. The space transformer is connected to the printed circuit substrate via the pogo pin unit.

[0004] In addition, an inspection apparatus that inspects an electrical characteristic of a semiconductor element using a probe card is known. In the inspection apparatus, a tip of a probe needle of the probe card is brought into contact with a terminal on the semiconductor element, and inspection of the semiconductor element is performed. Therefore, the inspection apparatus has a structure for performing alignment of the probe card with a stage on which the semiconductor element is placed. Patent Literature 2 discloses a wafer inspection apparatus that has a probe card and a transport arm that transports a wafer that is an inspection target, and performs alignment of a position at which the transport arm faces the probe card by fitting a positioning pin of the transport arm into a notch portion of the probe card.

[0005] PRIOR ART DOCUMENTS

[0006] PATENT LITERATURE

[0007] Patent Literature 1: Japanese Patent Laid-Open No. 2019-178961

[0008] Patent Literature 2: Japanese Patent Laid-Open No. 2013-191737 SUMMARY

[0009] PROBLEMS TO BE SOLVED BY THE INVENTION

[0010] Further, in an inspection jig for inspecting a printed board, a resin-made board can be used as a member corresponding to a space transformer. Therefore, in the inspection jig for the printed board, when an electrical connection member such as a spring contact pin unit is brought into contact with the board to electrically connect the both, the board can be warped by a pressing force of the electrical connection member. If the board is warped, the electrical contact between the electrical connection member and the board can be deteriorated. Then, the inspection of the inspected board can not be stably performed.

[0011] An object of the present application is to provide a structure in which, in an inspection jig for a printed board used in an inspection apparatus for the printed board and an inspection apparatus for a board including the inspection jig, warping of a board used in the inspection jig can be suppressed.

[0012] Further, due to recent large-scale and miniaturization of semiconductor elements, the number of inspection points of an inspection object is increasing. Therefore, in an inspection apparatus, the number of probes of an inspection jig is also increasing. With the increase in the number of inspection points of the inspection object, a thickness direction force received by a board from a probe of the inspection jig is increasing when the inspection object is inspected using the inspection jig. Therefore, the board is sometimes displaced in the thickness direction with respect to the inspection object.

[0013] An object of the present application is to provide a structure in which, in an inspection jig for a printed board used in an inspection apparatus for the printed board and an inspection apparatus for a board including the inspection jig, warping of a board used in the inspection jig can be suppressed.

[0014] Technical means for solving the problem

[0015] An inspection jig of one embodiment of the present application is attached to an inspection processing portion of a substrate inspection device that inspects an electrical circuit included in a substrate to be inspected. The inspection jig includes a first substrate that detects a signal from the inspection processing portion; a probe unit that includes a probe that contacts the substrate to be inspected; a second substrate that is arranged side by side with the first substrate in a thickness direction of the first substrate with one surface facing the first substrate and is electrically connected to the probe; an electrical connection portion that electrically connects the first substrate and the second substrate and is located between the first substrate and the second substrate in the thickness direction; and a substrate holding portion that holds the second substrate in a state where the second substrate is arranged side by side with the first substrate in the thickness direction and holds the probe unit on a side opposite to the first substrate. The substrate holding portion includes a first holding plate portion that is plate-shaped and is located on the probe unit side of the second substrate, and a holding plate support portion that positions the first holding plate portion at a position where the first holding plate portion is arranged side by side with the first substrate in the thickness direction, and holds the second substrate in a state where the first substrate and the second substrate are electrically connected to each other via the electrical connection portion by sandwiching the electrical connection portion in the thickness direction between the first substrate and the second substrate.

[0016] A substrate inspection device of one embodiment of the present application includes the inspection jig.

[0017] In addition, an inspection jig of one embodiment of the present application is attached to an inspection device that inspects a substrate or a semiconductor as an inspection target. The inspection jig includes a probe that contacts the inspection target and detects an electrical signal; a second substrate that holds the probe and transmits the electrical signal detected by the probe; a first substrate that is arranged side by side with the second substrate in a thickness direction of the second substrate on a side opposite to the probe side of the second substrate and transmits the electrical signal transmitted by the second substrate to the inspection device; an electrical connection portion that electrically connects the first substrate and the second substrate; a first substrate holding portion that is plate-shaped and holds the first substrate with respect to the inspection device; and a second substrate holding portion that holds the second substrate with respect to the first substrate on the first substrate side. The second substrate holding portion includes a probe connection opening portion that penetrates in a thickness direction at a position overlapping with the probe when the second substrate holding portion is viewed in plan; an electrical connection housing portion that penetrates in the thickness direction and houses the electrical connection portion; and a first protrusion portion that protrudes toward the first substrate. When the second substrate holding portion is viewed in plan, a distance between the first protrusion portion and a center of the probe connection opening portion is shorter than a distance between the electrical connection housing portion and the center of the probe connection opening portion, and the first protrusion portion contacts the inspection device or the first substrate holding portion at least when the probe contacts the inspection target.

[0018] The inspection device of one embodiment of the present application includes the inspection jig, an inspection processing portion that detects a signal of the first substrate, and a plate-shaped inspection processing holding portion that holds the inspection processing portion. The inspection processing holding portion or the first substrate holding portion has a first contacted portion that is contacted by the first protruding portion.

[0019] Effects of the Invention

[0020] According to one embodiment of the present application, the following structure can be provided: in an inspection jig for an inspection device of a printed board and a board inspection device including the inspection jig, warping of a board for the inspection jig can be suppressed.

[0021] In addition, according to one embodiment of the present application, the following structure can be obtained: in an inspection jig for a plurality of boards and an inspection device including the inspection jig, displacement of the plurality of boards in a thickness direction with respect to a main body of the inspection device can be suppressed. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 FIG. 1 is a perspective view of an outline structure of an inspection device of one embodiment of the present application.

[0023] Figure 2 FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1. Figure 1

[0024] Figure 3 FIG. 3 is a cross-sectional view taken along line III-III of FIG. 1. Figure 1

[0025] Figure 4 FIG. 4 is an exploded perspective view of an inspection jig.

[0026] Figure 5 FIG. 5 is an exploded perspective view of an inspection jig.

[0027] Figure 6 FIG. 6 is a view of a state in which a second substrate is moved in a direction away from a flat plate portion.

[0028] Figure 7 FIG. 7 is a view of a state in which a holding plate support portion is moved in a horizontal direction with respect to the flat plate portion.

[0029] Figure 8 FIG. 8 is a view of a state in which the holding plate support portion is removed from a substrate holding portion.

[0030] Figure 9 FIG. 9 is a view of a state in which the second substrate is moved in a direction close to the flat plate portion.

[0031] Figure 10 FIG. 10 is a perspective view of an outline structure of an inspection device of one embodiment of the present application.

[0032] ​​Figure 11 for Figure 10 Sectional view along line II-II.

[0033] Figure 12 This is an exploded perspective view of the inspection fixture as seen from the side of the inspection and processing unit.

[0034] Figure 13 An exploded perspective view of the examination fixture as seen from the probe side.

[0035] Figure 14 This is a plan view of the second substrate holding section.

[0036] Figure 15 for Figure 14 A magnified view of a portion of the image.

[0037] Explanation of symbols

[0038] 1: Substrate inspection device, inspection equipment

[0039] 2: Flat section, inspection and handling maintenance section

[0040] 2a: Opening, inspection and processing storage area

[0041] 2b: Connecting hole

[0042] 3: Inspection and Processing Department

[0043] 4: Inspection fixture

[0044] 5: Inspect the substrate mounting stage

[0045] 6: Fixture holding part

[0046] 7: Control Department

[0047] 8: General-purpose unit, first substrate unit

[0048] 9: Transformation unit, second substrate unit

[0049] 10: First substrate

[0050] 10a: Connecting hole

[0051] 11: Terminal section on the body side

[0052] 12: Second substrate side terminal portion

[0053] 20: First substrate receiving section, first substrate holding section

[0054] 20a: concave part

[0055] 20b: Opening, First connecting receiving section

[0056] 20c: Connecting hole

[0057] 21: second contact portion

[0058] 30: inspection jig driving portion, holding body portion

[0059] 31: driving support portion, first contact portion

[0060] 32: first driving portion

[0061] 33: second driving portion

[0062] 40: second substrate

[0063] 40a: probe connection hole

[0064] 41: first substrate side terminal portion

[0065] 42: probe terminal portion, probe connection terminal portion

[0066] 50: substrate holding portion

[0067] 51: body side holding plate portion (second holding plate portion), body side holding plate portion (second substrate holding portion)

[0068] 51a: opening portion, second connection housing portion (electrical connection housing portion)

[0069] 51b: probe connection hole, probe connection opening portion

[0070] 51c: housing hole, link hole

[0071] 51d: shaft portion housing space

[0072] 51e: claw portion housing space

[0073] 52: probe side holding plate portion (first holding plate portion)

[0074] 52a: probe connection hole

[0075] 53: holding plate support portion

[0076] 54: shaft portion

[0077] 55: claw portion, connection lead wire

[0078] 60: connection lead wire

[0079] 61: first protrusion portion

[0080] 62: second protrusion portion

[0081] 70: probe unit

[0082] 71: probe

[0083] 72: probe support portion

[0084] 80: electrical connection portion

[0085] 81: first connection portion

[0086] 82: second connection portion

[0087] 90: coupling hole

[0088] 91: coupling member

[0089] 91a: jig fixing portion

[0090] W: substrate to be inspected, inspection object DETAILED DESCRIPTION

[0091] Embodiments of the present application will be described below in detail with reference to the accompanying drawings. In the drawings, like or equivalent components are designated with like reference numerals, and a description thereof will not be repeated. In addition, the constituent components in the drawings are not limited to the dimensions and the dimensional ratios of the constituent components described in the drawings.

[0092] In addition, in the following description, the expressions "fixing", "connecting", and "mounting" and the like (hereinafter, fixing and the like) refer not only to cases where components are directly fixed to each other, but also to cases where fixing and the like are performed via other components. That is, in the following description, the expressions "fixing" and the like include the meaning of direct fixing and indirect fixing of components to each other.

[0093] In addition, in the following description, the expression "equal" and the like refers not only to cases where they are exactly the same, but also to cases where they are within an error range.

[0094] (Overall Structure)

[0095] Figure 1 is a perspective view showing the overall structure of a substrate inspection apparatus 1 according to an embodiment. Figure 2 is a cross-sectional view of the substrate inspection apparatus 1. Figure 3 is a view showing the coupling structure of a flat plate portion 2 and an inspection jig 4. The substrate inspection apparatus 1 performs inspection on an electrical circuit possessed by a substrate to be inspected W. The substrate to be inspected W is a resin-made printed board.

[0096] As shown in Figure 1 , the substrate inspection apparatus 1 includes the flat plate portion 2, an inspection processing portion 3, the inspection jig 4, an inspection substrate stage 5, a control portion 7, and an inspection jig driving portion 30. In the present embodiment, as an example, a case where the number of inspection processing portions 3 is six is described. However, the number of inspection processing portions can be less than six or more than six.

[0097] The flat plate portion 2 is a member that supports the inspection processing portion 3 and the inspection jig 4. As shown in Figure 1 and Figure 2As shown, the flat plate portion 2 is plate-shaped. The flat plate portion 2 has rectangular opening portions 2a that extend through in the thickness direction. In the present embodiment, the number of the opening portions 2a is six, which is the same as the number of the inspection processing portions 3. The six opening portions 2a are arranged in two rows in units of three. The flat plate portion 2 supports the inspection processing portions 3 on one side in the thickness direction by housing a part of the inspection processing portions 3 in the opening portions 2a. The flat plate portion 2 supports the inspection jigs 4 on the other side in the thickness direction.

[0098] The flat plate portion 2 has four through-holes 2b that extend through in the thickness direction. As shown, the holding plate support portions 53 of the inspection jigs 4 pass through the through-holes 2b. The holding plate support portions 53 protrude toward one side of the flat plate portion 2. Figure 3

[0099] Hereinafter, the thickness direction of the flat plate portion 2 will be referred to as the "X direction", the row direction of the opening portions 2a will be referred to as the "Y direction", and the direction in which three opening portions 2a are arranged side by side will be referred to as the "Z direction".

[0100] The inspection processing portions 3 input a signal to the electrical circuit of the inspected substrate W according to an instruction signal from the control portion 7, and detect an output signal of the inspected substrate W and output it to the control portion 7. A part of each of the six inspection processing portions 3 is supported by the flat plate portion 2 in a state of being housed in each of the opening portions 2a. Thus, the inspection processing portions 3 are arranged in two rows in the Y direction in units of three in the Z direction on one side of the flat plate portion 2.

[0101] The inspection processing portion 3 has a terminal portion including a plurality of terminals on an end surface on the side housed in the opening portion 2a. The inspection processing portion 3 is electrically connected to the first substrate 10 of the inspection jig 4 via the terminal portion.

[0102] The inspection jig 4 is mounted on the side opposite to the side of the inspection processing portion 3 with respect to the flat plate portion 2. The inspection jig 4 is electrically connected to the inspection processing portion 3. In addition, the inspection jig 4 has a probe 71 on the side opposite to the side of the inspection processing portion 3. The front end of the probe 71 contacts a terminal of an electrical circuit possessed by the inspected substrate W. The electrical inspection of the inspected substrate W is performed in a state in which the front end of the probe 71 contacts the terminal of the electrical circuit. Details of the inspection jig 4 will be described later.

[0103] The inspection substrate placement table 5 places the inspected substrate W. The inspection substrate placement table 5 moves in a direction close to the inspection jig 4 and a direction away from the inspection jig 4 in a state in which the inspected substrate W is fixed on the inspection substrate placement table 5. Further, the inspection jig 4 can also move with respect to the inspection substrate placement table 5.

[0104] ​In this embodiment, the substrate mounting stage 5 is moved along the X, Y, and Z directions. Furthermore, the substrate mounting stage 5 is rotated 360 degrees around the X-axis. Therefore, the substrate mounting stage 5 can be positioned with high precision relative to the inspection fixture 4.

[0105] The control unit 7 controls the operation of the inspection processing unit 3. The control unit 7 outputs a command signal to the inspection processing unit 3 to inspect the substrate W to be inspected. In addition, based on the signals received by the inspection processing unit 3 from the substrate W to be inspected, the control unit 7 determines the electrical circuit defects, etc., of the substrate W to be inspected.

[0106] The inspection fixture drive unit 30 moves the changing unit 9 of the inspection fixture 4 along the X direction. Furthermore, the inspection fixture drive unit 30 holds the changing unit 9 of the inspection fixture 4 relative to the flat plate 2 in an upward-tilted position relative to the flat plate 2. Thus, the inspection processing unit 3 is electrically connected to the inspection fixture 4. Details regarding the inspection fixture drive unit 30 will be described later.

[0107] (Inspection fixture)

[0108] Then, use Figures 1 to 5 The inspection fixture 4 is described in detail. The inspection fixture 4 includes a general unit 8 having a first substrate 10, a conversion unit 9 having a second substrate 40, and an electrical connection portion 80 that electrically connects the first substrate 10 and the second substrate 40. The first substrate 10 and the second substrate 40 face each other and are arranged side by side along the thickness direction in the order of the first substrate 10 and the second substrate 40, starting from the side closest to the flat plate portion 2.

[0109] The inspection fixture 4 has a connecting hole 90 extending in the X direction for accommodating and retaining plate support portion 53. Figure 4 and Figure 5 A three-dimensional view showing the separation of the transformation unit 9 from the inspection fixture 4. Furthermore, Figure 4 and Figure 5 For illustrative purposes, the illustration of the retaining plate support 53 is omitted.

[0110] (General Unit)

[0111] like Figure 2 , Figure 4 and Figure 5 As shown, the general-purpose unit 8 has a first substrate 10 and a first substrate receiving portion 20. In this embodiment, the inspection fixture 4 has two general-purpose units 8. The two general-purpose units 8 are respectively installed at the positions of the three side-by-side openings 2a of the covering plate portion 2 (refer to...). Figure 2). That is, each of the common units 8 faces the end surface of the inspection processing section 3 housed in the opening section 2a. Each of the constituent members of the two common units 8 is symmetrically arranged in the Y direction with the center line of the Y direction of the flat plate section 2 as the center in a state where the common unit 8 is attached to the flat plate section 2. The two common units 8 are identical in structure, and thus the structure of one common unit 8 will be described below.

[0112] The first substrate 10 is a rectangular resin printed substrate extending in the Y direction and the Z direction. An electric circuit is formed in the first substrate 10. As shown in Figure 2 the first substrate 10 has a body-side terminal section 11 of a terminal on one side of the electric circuit on the surface on the flat plate section 2 side. In addition, the first substrate 10 has a second substrate-side terminal section 12 of a terminal on the other side of the electric circuit on the surface on the second substrate 40 side. The first substrate 10 has three body-side terminal sections 11 on the surface on the flat plate section 2 side and three second substrate-side terminal sections 12 on the surface on the second substrate 40 side.

[0113] The body-side terminal section 11 contacts the terminal section of each of the inspection processing sections 3. Thereby, a signal transmitted to the electric circuit of the first substrate 10 is transmitted to the inspection processing section 3. The three second substrate-side terminal sections 12 are electrically connected to the second substrate 40 via an electrical connection section 80 described later.

[0114] As shown in Figure 3 and Figure 4 the first substrate 10 has two coupling holes 10a extending in the thickness direction. The holding plate support section 53 passes through the coupling holes 10a. The coupling holes 10a are part of the coupling holes 90.

[0115] The first substrate housing section 20 is plate-shaped extending in the Y direction and the Z direction. The first substrate housing section 20 is made of a metal material having high rigidity. The metal material is, for example, a metal containing aluminum. As shown in Figure 2 and Figure 4 the first substrate housing section 20 has a recess 20a on the flat plate section 2 side. The first substrate 10 is housed in the recess 20a.

[0116] As shown in Figure 2 and Figure 5 the first substrate housing section 20 has three rectangular opening sections 20b extending in the thickness direction on the bottom surface of the recess 20a. The three opening sections 20b are located in the first substrate housing section 20 at positions corresponding to the three second substrate-side terminal sections 12. That is, the second substrate-side terminal sections 12 are exposed from the first substrate housing section 20 through the three opening sections 20b.

[0117] As shown in Figure 3 and Figure 5As shown, the first substrate receiving portion 20 has two connecting holes 20c extending through the thickness direction. The retaining plate support portion 53 extends through the connecting holes 20c. The connecting holes 20c are part of the connecting holes 90.

[0118] As described above, in this embodiment, the inspection fixture 4 has two general-purpose units 8. Therefore, the inspection fixture 4 has six body-side terminal portions 11, six second substrate-side terminal portions 12, six openings 20b, and four connecting holes 20c. That is, the openings 20b are arranged in two rows of three along the Z direction and along the Y direction.

[0119] Two first substrate receiving portions 20 are respectively mounted on the flat plate portion 2 in such a state that the first substrate 10 is received in the recess 20a.

[0120] (Transformation Unit)

[0121] like Figure 2 As shown, the conversion unit 9 includes a second substrate 40, a substrate holding portion 50, a connecting wire 60, and a probe unit 70. The conversion unit 9 is not fixed to the general unit 8, but is mounted at a position where the six openings 20b of the general unit 8 are covered by the holding structure described later.

[0122] The second substrate 40 is a rectangular resin printed circuit board extending along the Y and Z directions. The second substrate 40 has a probe connection hole 40a extending through the thickness direction in the center.

[0123] like Figure 2 and Figure 4 As shown, an electrical circuit is formed on the second substrate 40. The second substrate 40 has a first substrate-side terminal portion 41 on the surface side of the first substrate 10, which forms a terminal on one side of the electrical circuit. Additionally, the second substrate 40 has a probe terminal portion 42 on the surface side of the first substrate 10, which forms a terminal on the other side of the electrical circuit. The second substrate 40 has six first substrate-side terminal portions 41 and six probe terminal portions 42 on the surface side of the first substrate 10.

[0124] Viewed from the X direction, the six probe terminal portions 42 are arranged at equal intervals in the circumferential direction with the probe connection hole 40a as the center.

[0125] The six first substrate-side terminal portions 41 are located facing the six second substrate-side terminal portions 12 of the first substrate 10, respectively. That is, when viewed from the X direction, the six first substrate-side terminal portions 41 are located on the outer periphery of the second substrate 40.

[0126] like Figure 3As shown, the substrate holding portion 50 holds the second substrate 40 in a side-by-side configuration relative to the first substrate 10 in the X direction. Specifically, the substrate holding portion 50 includes: a body-side holding plate portion 51 that holds the second substrate 40 from the first substrate 10 side; a probe-side holding plate portion 52 that holds the second substrate 40 from the probe 71 side; and a holding plate support portion 53 that holds the second substrate 40 against the first substrate 10. The probe-side holding plate portion 52 is the first holding plate portion. The body-side holding plate portion 51 is the second holding plate portion.

[0127] The body-side retaining plate portion 51 is plate-shaped, extending along the Y and Z directions. The dimensions of the body-side retaining plate portion 51 in the Y and Z directions are the same as those of the second substrate 40 in the Y and Z directions. The body-side retaining plate portion 51 is made of a highly rigid metal material. The metal material is, for example, an aluminum-containing metal. The body-side retaining plate portion 51 is located on the first substrate side of the second substrate 40.

[0128] like Figure 2 and Figure 4 As shown, the body-side retaining plate portion 51 has six rectangular openings 51a extending through the thickness direction. The six openings 51a are located in the body-side retaining plate portion 51 at positions corresponding to the first substrate-side terminal portion 41. That is, the first substrate-side terminal portion 41 is exposed from the body-side retaining plate portion 51 through the six openings 51a.

[0129] like Figure 4 As shown, the body-side retaining plate portion 51 has a probe connection hole 51b that extends through the thickness direction and is hexagonal in shape when viewed from the X direction at its center. The probe connection hole 51b is located in the body-side retaining plate portion 51 at a position corresponding to the probe terminal portion 42 of the second substrate 40. That is, the probe terminal portion 42 is exposed from the body-side retaining plate portion 51 through the probe connection hole 51b.

[0130] like Figure 3 and Figure 4 As shown, the body-side retaining plate portion 51 has four receiving holes 51c extending through the thickness direction. The receiving holes 51c are part of the connecting holes 90. Viewed from the X direction, the receiving holes 51c are located between three side-by-side openings 51a. The receiving holes 51c have: a shaft receiving space 51d extending along the thickness direction of the body-side retaining plate portion 51; and a claw receiving space 51e extending along the Y direction towards the side opposite to the probe connecting hole 51b side on the second substrate 40 side of the body-side retaining plate portion 51. The shaft portion 54 of the retaining plate support portion 53 is received within the shaft receiving space 51d. The claw portion 55 of the retaining plate support portion 53 is received within the claw receiving space 51e.

[0131] The probe-side holding plate portion 52 is a plate shape extending in the Y direction and the Z direction. The Y direction and the Z direction of the probe-side holding plate portion 52 are the same size as the Y direction and the Z direction of the body-side holding plate portion 51. The thickness of the probe-side holding plate portion 52 is smaller than the thickness of the body-side holding plate portion 51. The probe-side holding plate portion 52 is composed of a metal material having high rigidity. The metal material is, for example, an aluminum-containing metal. The probe-side holding plate portion 52 is positioned on the probe 71 side of the second substrate 40.

[0132] As shown in FIG. 6, the probe-side holding plate portion 52 has a probe connection hole 52a that penetrates in the thickness direction in the center. The probe connection hole 52a of the probe-side holding plate portion 52 is positioned at the same position as the probe connection hole 40a of the second substrate 40 when viewed from the X direction. Figure 2

[0133] The body-side holding plate portion 51 and the probe-side holding plate portion 52 are joined to each other by a fixing member not shown in a state in which the second substrate 40 is sandwiched therebetween. In this way, by sandwiching the second substrate 40 from both sides in the thickness direction, it is possible to suppress deformation of the second substrate 40 in the thickness direction.

[0134] As shown in FIG. 6, the probe-side holding plate portion 52 has a probe connection hole 52a that penetrates in the thickness direction in the center. The probe connection hole 52a of the probe-side holding plate portion 52 is positioned at the same position as the probe connection hole 40a of the second substrate 40 when viewed from the X direction. Figure 3

[0135] As shown in FIG. 6, the connection lead 60 electrically connects the second substrate 40 and the probe 71 described later. One end portion of the connection lead 60 is connected to the probe terminal portion 42 of the second substrate 40. The other end portion of the connection lead 60 passes through the probe connection hole 40a of the second substrate 40 and the probe connection hole 52a of the probe-side holding plate portion 52 and is connected to the probe 71. Figure 2

[0136] The probe unit 70 is mounted on the side of the probe-side holding plate portion 52 opposite the second substrate 40 side at a position overlapping the probe connection hole 51b when viewed from the X direction. The probe unit 70 has the probe 71 and a probe support portion 72.

[0137] The probe 71 extends in the X direction. The probe 71 contacts a terminal of the board under test W with the front end to detect a signal of an electrical circuit possessed by the board under test W.

[0138] ​​​At the end of the probe 71 on the second substrate 40 side, one end of a connecting wire 60 is electrically connected. The other end of the connecting wire 60 is electrically connected to the second substrate 40. Thus, the signal of the electrical circuit of the substrate W under inspection detected by the probe 71 is transmitted to the second substrate 40 via the connecting wire 60.

[0139] The probe support portion 72 supports the probe 71 against the substrate holding portion 50. The probe support portion 72 is fixed to the probe-side holding plate portion 52 by a fixing member (not shown). The fixing member is, for example, a screw or threaded rod. Thus, the probe unit 70 is held in the substrate holding portion 50.

[0140] like Figure 2 As shown, the electrical connection portion 80 is located between the first substrate 10 and the second substrate 40. In this embodiment, the inspection fixture 4 has six electrical connection portions 80. The first substrate 10 side of each electrical connection portion 80 is received within the opening 20b of the first substrate receiving portion 20 and fixed to the first substrate receiving portion 20 by a fixing member (not shown). The second substrate 40 side of each electrical connection portion 80 is received within the opening 51a of the body-side retaining plate portion 51.

[0141] The electrical connection portion 80 has a first connection portion 81 on the first substrate 10 side. The first connection portion 81 includes a plurality of contact terminals that contact the second substrate side terminal portion 12 of the first substrate 10. The electrical connection portion 80 has a second connection portion 82 on the second substrate 40 side. The second connection portion 82 includes a plurality of contact terminals that contact the first substrate side terminal portion 41 of the second substrate 40. At least a portion of the first connection portion 81 and the second connection portion 82 are extendable and retractable in the X direction by the elastic force of an elastic member.

[0142] In this embodiment, the electrical connection portion 80 includes a spring pin. That is, the first connection portion 81 is pressed against the second substrate side terminal portion 12 of the first substrate 10, and the second connection portion 82 is pressed against the first substrate side terminal portion 41 of the second substrate 40. Thus, the first substrate 10 and the second substrate 40 are electrically connected via the electrical connection portion 80.

[0143] With the above structure, the inspection jig 4 can perform electrical inspection of the inspected substrate W via the probe 71, the connection wire 60, the probe terminal portion 42 of the second substrate 40 and the first substrate side terminal portion 41, the electrical connection portion 80, the second substrate side terminal portion 12 of the first substrate 10 and the body side terminal portion 11. Further, in the second substrate 40, the interval between the terminals of the first substrate side terminal portion 41 can be made wider than the interval between the terminals of the probe terminal portion 42. In the first substrate 10, the interval between the terminals of the body side terminal portion 11 can be made wider than the interval between the terminals of the second substrate side terminal portion 12. Thus, even when the interval between the terminals of the inspected substrate W is very narrow, the inspection jig 4 can set the interval between the terminals of the body side terminal portion 11 to an interval at which the inspection processing portion 3 can detect a signal.

[0144] (Holding structure)

[0145] Subsequently, the use of the inspection jig 4 will be described. Figure 3 The holding structure of the second substrate 40 will be described. As shown in FIG. 6, the inspection jig 4 is connected to the flat plate portion 2 by the holding plate support portion 53. Figure 3

[0146] The claw portion 55 of the holding plate support portion 53 is housed in the claw portion housing space 51e of the housing hole 51c extending in the Y direction. The shaft portion 54 of the holding plate support portion 53 is housed in the shaft portion housing space 51d of the housing hole 51c of the body side holding plate portion 51, the connection hole 20c of the first substrate housing portion 20, the connection hole 10a of the first substrate 10, and the connection hole 2b of the flat plate portion 2.

[0147] The claw portion 55 of the holding plate support portion 53 is housed in the claw portion housing space 51e of the housing hole 51c extending in the Y direction. The shaft portion 54 of the holding plate support portion 53 is housed in the shaft portion housing space 51d of the housing hole 51c of the body side holding plate portion 51, the connection hole 20c of the first substrate housing portion 20, the connection hole 10a of the first substrate 10, and the connection hole 2b of the flat plate portion 2.

[0148] ​In this embodiment, the thickness of the body-side holding plate portion 51 is greater than the thickness of the probe-side holding plate portion 52. With this configuration, in which the flat plate portion 2 holds the substrate holding portion 50 via the body-side holding plate portion 51, the rigidity of the substrate holding portion 50 can be ensured. In addition, with this configuration, the substrate holding portion 50 can be more reliably supported by the flat plate portion 2.

[0149] In addition, in the substrate inspection apparatus 1, the first substrate 10 and the second substrate 40 are electrically connected by bringing the second substrate 40 toward the first substrate 10 side via the holding plate support portion 53. As described above, the electrical connection portion 80 has a plurality of contact terminals that respectively make electrical contact with the terminals of the first substrate 10 and the terminals of the second substrate 40, and at least some of the plurality of contact terminals are stretchable in the X direction. In this configuration, the second substrate 40 is easily deformed in the X direction by the reaction force via at least some of the contact terminals of the electrical connection portion 80. In this configuration in which the second substrate 40 receives a reaction force, the deformation of the second substrate 40 can be more reliably suppressed by applying the holding structure. Thus, the second substrate 40 can be prevented from moving away from the electrical connection portion 80 due to warping in the X direction, and stable electrical connection can be performed.

[0150] In addition, in the substrate holding portion 50, the opening portion 51a is located on the outer periphery side of the body-side holding plate portion 51 when viewed in the X direction. That is, in a state in which the electrical connection portion 80 is accommodated in the opening portion 51a, the electrical connection portion 80 is located on the outer periphery side of the second substrate 40 when viewed in the X direction. When the electrical connection portion 80 is located on the outer periphery side of the second substrate 40, the second substrate 40 is more likely to deform. By applying the holding structure to this configuration, the deformation of the second substrate 40 can be more reliably suppressed.

[0151] Further, the holding plate support portion 53 is a rod-shaped member that extends through the body-side holding plate portion 51 and the inspection processing portion 3 in the X direction. The holding plate support portion 53 has a claw portion 55 that extends in a direction intersecting the extending direction of the holding plate support portion 53 at the front end portion of the holding plate support portion 53, and the body-side holding plate portion 51 has an accommodation hole 51c that accommodates the front end portion of the holding plate support portion 53 when viewed in the X direction. The accommodation hole 51c has a claw portion accommodation space 51e that accommodates the claw portion 55 of the holding plate support portion 53 extending in a direction opposite the probe unit 70 side when viewed in the X direction.

[0152] In this way, the claw portion accommodation space 51e that accommodates the claw portion 55 of the holding plate support portion 53 extends in a direction opposite the probe unit 70 side. Thus, compared to a configuration in which the claw portion accommodation space 51e extends toward the probe unit 70 side, the thickness direction deformation of the body-side holding plate portion 51 can be suppressed around the probe unit 7 of the body-side holding plate portion 51.

[0153] (Inspection jig driving section)

[0154] Next, the inspection jig driving section 30 will be described. As shown in Figure 1 and Figure 2 , the inspection jig driving section 30 has a driving support section 31, a first driving section 32, and a second driving section 33. The driving support section 31 is flat-plate shaped and is arranged side by side with the flat-plate section 2 in the thickness direction of the flat-plate section 2. The driving support section 31 is movably supported to the flat-plate section 2 in the Y direction. The holding plate support section 53 of the conversion unit 9 penetrates the driving support section 31 in the thickness direction.

[0155] The first driving section 32 moves the holding plate support section 53 relative to the driving support section 31 and the flat-plate section 2 in the X direction. Thereby, the body-side holding plate section 51 that houses the holding plate support section 53 can be moved relative to the flat-plate section 2 in the X direction.

[0156] In addition, the first driving section 32 can maintain the state of moving the holding plate support section 53. Thereby, the position of the body-side holding plate section 51 relative to the thickness direction of the flat-plate section 2 can be fixed. The first driving section 32 includes, for example, a cylinder.

[0157] The second driving section 33 moves the driving support section 31 relative to the flat-plate section 2 in the Y direction. That is, by the second driving section 33, the holding plate support section 53 that penetrates the driving support section 31 is moved relative to the flat-plate section 2 in the Y direction. Although the details will be described later, thereby the holding plate support section 53 can be removed from the body-side holding plate section 51. The second driving section 33 includes, for example, a cylinder.

[0158] (Method of replacing conversion unit)

[0159] Next, a method of replacing the conversion unit 9 will be described. Figures 6 to 9

[0160] When the conversion unit 9 is removed from the substrate inspection device 1, first, as shown in Figure 6 , the first driving section 32 moves the holding plate support section 53 to the inspection jig 4 side in the X direction. Thereby, the conversion unit 9 can be moved away from the flat-plate section 2. Next, as shown in Figure 7 , the second driving section 33 moves the holding plate support section 53 to the probe unit 70 side in the Y direction. Thereby, the claw section 55 of the holding plate support section 53 is extracted from the claw housing space 51e of the housing hole 51c. Then, as shown in Figure 8 , the holding plate support section 53 can be removed from the conversion unit 9.

[0161] ​When the other conversion unit 9 is attached to the substrate inspection device 1, first, the holding plate support section 53 is inserted into the housing hole 51c of the other conversion unit 9. Then, the second drive section 33 moves the holding plate support section 53 to the side opposite to the probe unit 70 side in the Y direction. Thus, the claw section 55 of the holding plate support section 53 is housed in the claw housing space 51e of the housing hole 51c. Then, the first drive section 32 moves the holding plate support section 53 to the flat plate section 2 side in the X direction. Thus, as shown in FIG. 9, the other conversion unit 9 can be attached to the substrate inspection device 1. Figure 9

[0162] By replacing the conversion unit 9 in the order described above, the second substrate 40 can be replaced. Thus, the electric circuit of the first substrate 10 possessed by the universal unit 8 that detects a signal by the inspection processing section 3 of the substrate inspection device 1 is configured as a universal circuit structure even when the electric circuit of the inspected substrate W is different, and on the other hand, the second substrate 40 can be replaced according to the electric circuit of the inspected substrate W. That is, an inspection jig 4 that can perform inspection of an inspected substrate W having a different electric circuit can be obtained. Therefore, by replacing only the second substrate 40 according to the electric circuit of the inspected substrate W, an inspection jig 4 that can be manufactured in a short period of time and at a low cost can be obtained.

[0163] As described above, the inspection jig 4 of the present embodiment is an inspection jig attached to the inspection processing section 3 of the substrate inspection device 1 that inspects the electric circuit possessed by the inspected substrate W. The inspection jig 4 has a first substrate 10 that detects a signal by the inspection processing section 3, a probe unit 70 that has a probe 71 that contacts the inspected substrate W, a second substrate 40 that has one face facing the first substrate 10 and is arranged side by side with the first substrate 10 in the thickness direction of the first substrate 10 and is electrically connected to the probe, an electrical connection section 80 that is located between the first substrate 10 and the second substrate 40 in the thickness direction and electrically connects the first substrate 10 and the second substrate 40, and a substrate holding section 50 that holds the second substrate 40 in a state of being arranged side by side with the first substrate 10 in the thickness direction and holds the probe unit 70 on the side opposite to the first substrate side. The substrate holding section 50 has a plate-shaped probe side holding plate section 52 located on the probe unit 70 side of the second substrate 40 and a holding plate support section 53 that positions the probe side holding plate section 52 at a position arranged side by side with the first substrate 10 in the thickness direction. The substrate holding section 50 holds the second substrate 40 in a state of electrically connecting the first substrate 10 and the second substrate 40 via the electrical connection section 80 by sandwiching the electrical connection section 80 in the thickness direction between the first substrate 10 and the second substrate 40.

[0164] ​In the structure, even if the second substrate 40 is stressed in the thickness direction by the electrical connection portion 80 clamped between the first substrate 10 and the second substrate 40 in the thickness direction, the deformation of the second substrate 40 in the thickness direction can be suppressed by the probe side holding plate portion 52. Further, with the structure, the second substrate 40 of the inspection jig 4 can be replaced only according to the electrical circuit of the substrate W to be inspected. That is, the electrical circuit of the first substrate 10 that detects a signal by the inspection processing portion 3 of the substrate inspection apparatus 1 is a general-purpose circuit structure even when the electrical circuit of the substrate W to be inspected is different, and on the other hand, the second substrate 40 is replaced according to the electrical circuit of the substrate W to be inspected, whereby the inspection jig 4 that can inspect substrates to be inspected having different electrical circuits can be obtained. Therefore, the substrate inspection apparatus 1 including the inspection jig 4 having the structure can easily perform inspection of the substrate W to be inspected having different electrical circuits.

[0165] In the embodiment, the substrate holding portion 50 further has a plate-shaped body side holding plate portion 51 located on the first substrate 10 side with respect to the second substrate 40. The probe side holding plate portion 52 and the body side holding plate portion 51 are fixed in a state of clamping the second substrate 40 in the thickness direction.

[0166] In this way, by clamping the second substrate 40 in the thickness direction by the probe side holding plate portion 52 and the body side holding plate portion 51 of the substrate holding portion 50, the deformation of the second substrate 40 in the thickness direction can be more reliably suppressed.

[0167] In addition, the substrate inspection apparatus 1 of the embodiment includes the inspection jig 4. Thereby, a substrate inspection apparatus that can suppress warping of a substrate for an inspection jig can be obtained.

[0168] (Other Embodiments)

[0169] The embodiments of the present application have been described above, but the embodiments are merely examples for implementing the present application. Therefore, the embodiments are not limited to the above-described embodiments, and the embodiments can be appropriately modified within the scope of the gist of the present application.

[0170] In the embodiments, the case where the substrate inspection apparatus 1 has six inspection processing portions 3 has been described. Therefore, the flat plate portion 2 has six opening portions 2a, the two first substrate housing portions 20 have six opening portions 20b in total, and the body side holding plate portion 51 has six opening portions 51a. However, the number of opening portions of each member can be any number as long as an electrical connection corresponding to the number of inspection processing portions can be made.

[0171] In the embodiment, the case where the substrate inspection device 1 has six inspection processing sections 3 is described. Therefore, the two first substrates 10 have six body-side terminal sections 11 and six second substrate-side terminal sections 12 in common, and the second substrate 40 has six first substrate-side terminal sections 41 and six probe terminal sections 42. In addition, the substrate inspection device 1 has six electrical connection sections 80. However, the number of terminal sections of each member can be any number as long as electrical connection can be made according to the number of inspection processing sections. In addition, the number of electrical connection sections can be any number.

[0172] In the embodiment, the substrate inspection device 1 has two common units 8. However, the number of common units can be other than two.

[0173] In the embodiment, the electrical connection section 80 is mounted to the common unit 8. However, the electrical connection section can also be a structure held by sandwiching the second substrate and the first substrate.

[0174] In the embodiment, the substrate holding section 50 that holds the second substrate 40 has a body-side holding plate section 51 and a probe-side holding plate section 52. However, the substrate holding section can also be a structure that does not have a body-side holding plate section.

[0175] In the embodiment, the holding plate support section 53 is connected to the body-side holding plate section 51. However, the holding plate support section can be connected to any component of the substrate holding section as long as the conversion unit can be moved with respect to the flat plate section.

[0176] In the embodiment, the holding plate support section 53 is detachably connected to the body-side holding plate section 51. However, the holding plate support section can also be a structure that is fixed to the body-side holding plate section 51 and is detachably connected to the flat plate section.

[0177] In the embodiment, the opening section 2a and the opening section 51a are rectangular in shape when viewed from the X direction. However, the opening section can be any shape as long as it does not interfere with electrical connection of the terminal sections of the members housed in the opening section and the terminal sections of the members exposed due to the opening section.

[0178] In the embodiment, the probe connection hole 51b is hexagonal in shape when viewed from the X direction. However, the probe connection hole can also be other shapes.

[0179] In the embodiment, the coupling hole 20c is located between the three opening sections 20b that are arranged side by side. However, the position of the coupling hole can be any position as long as the probe-side holding plate section can be positioned at a position that is side by side with respect to the first substrate in the X direction.

[0180] (Overall Structure)

[0181] The inspection apparatus 1 of this embodiment inspects the electrical circuitry of the object to be inspected, W. In this embodiment, the object to be inspected, W, is a circuit board. Alternatively, the object to be inspected, W, may also be an electronic component such as a semiconductor wafer, semiconductor chip, chip-size package (CSP), wafer-level package (WLP), fan-out wafer-level package (FOWLP), or semiconductor element.

[0182] like Figure 10 As shown, the inspection apparatus 1 includes an inspection processing holding unit 2, an inspection processing unit 3, an inspection fixture 4, an inspection substrate mounting stage 5, a fixture holding unit 6, and a control unit 7. In this embodiment, as an example, the case where the number of inspection processing units 3 is six will be described. However, the number of inspection processing units may be less than six or more than six.

[0183] The inspection and processing holding part 2 is a component that supports the inspection and processing part 3 and the inspection fixture 4. The inspection and processing holding part 2 has a holding body part 30 and a first contact part 31.

[0184] like Figures 10 to 12 As shown, the retaining body 30 is plate-shaped. The retaining body 30 has a rectangular inspection and processing receiving section 2a extending through the thickness direction. In this embodiment, the number of inspection and processing receiving sections 2a is six, the same as the number of inspection and processing sections 3. Three of the six inspection and processing receiving sections 2a are arranged in two rows. The retaining body 30 supports the inspection and processing section 3 on one side in the thickness direction by housing a portion of the inspection and processing section 3 within the inspection and processing receiving section 2a.

[0185] For the sake of explanation, the thickness direction of the main body 30 will be referred to as the "X direction", the column direction of the inspection and processing receiving section 2a will be referred to as the "width direction" or "Y direction", and the direction in which the three inspection and processing receiving sections 2a are arranged side by side will be referred to as the "Z direction".

[0186] The retaining body 30 has four connecting holes 2b extending through the thickness of the retaining body 30. A connecting member 91, described later, is accommodated in the connecting holes 2b. The connecting member 91 protrudes to one side of the retaining body 30 and is fixed to the retaining body 30 by a fixture fixing part 91a.

[0187] The first contact portion 31 is a cylindrical member extending in the thickness direction of the holding body portion 30 from the side of the holding body portion 30 opposite the side from which the connecting member 91 protrudes. The front end of the first contact portion 31 contacts the first protrusion portion 61. In the present embodiment, the inspection processing holding portion 2 has four first contact portions 31. The four first contact portions 31 are the same height. Details of the first protrusion portion 61 will be described later.

[0188] The inspection processing portion 3 inputs a signal to the electrical circuit of the inspection object W according to an instruction signal from the control portion 7, and detects an output signal from the inspection object W and outputs it to the control portion 7. The inspection processing portion 3 is a rectangular parallelepiped long in the X direction. A portion of the inspection processing portion 3 is housed in the inspection processing housing portion 2a of the inspection processing holding portion 2. In the present embodiment, as described above, the number of inspection processing portions 3 is six. A portion of each of the six inspection processing portions 3 is supported in the inspection processing holding portion 2 in a state of being housed in each inspection processing housing portion 2a. Thus, the inspection processing portions 3 are arranged in three units in the Z direction and two columns in the Y direction on one side of the inspection processing holding portion 2.

[0189] The inspection processing portion 3 has a terminal portion including a plurality of terminals on the end surface on the side housed in the inspection processing housing portion 2a. The inspection processing portion 3 is electrically connected to the first substrate 10 of the inspection jig 4 via the terminal portion.

[0190] The inspection jig 4 is mounted on the side of the inspection processing holding portion 2 opposite the side of the inspection processing portion 3. The inspection jig 4 is electrically connected to the inspection processing portion 3. In addition, the inspection jig 4 has a probe 71 on the side opposite the side of the inspection processing portion 3. The front end of the probe 71 contacts a terminal of an electrical circuit possessed by the inspection object W. In a state in which the front end of the probe 71 contacts the terminal of the electrical circuit, a signal is input from the inspection processing portion 3 to the electrical circuit of the inspection object W via the inspection jig 4, and an output signal from the electrical circuit is transmitted to the inspection processing portion 3 via the inspection jig 4. Details of the inspection jig 4 will be described later.

[0191] The inspection substrate placement table 5 places the inspection object W. The inspection substrate placement table 5 moves in a direction closer to the inspection jig 4 and a direction farther from the inspection jig 4 in a state in which the inspection object W is fixed on the inspection substrate placement table 5. Further, the inspection jig 4 can also move relative to the inspection substrate placement table 5.

[0192] In the present embodiment, the inspection substrate placement table 5 moves in the X direction, the Y direction, and the Z direction. Furthermore, the inspection substrate placement table 5 rotates 360 degrees around the X axis. Thus, the inspection object W placed on the inspection substrate placement table 5 is positioned at a position at which the front end of the probe 71 of the inspection jig 4 contacts.

[0193] The fixture holding part 6 fixes the inspection fixture 4 to the inspection and processing holding part 2. In detail, the fixture holding part 6 holds both sides of the body-side holding plate part 51 of the inspection fixture 4 in the Y direction, so that the inspection fixture 4 approaches and is fixed to the holding body part 30.

[0194] The connecting member 91 is a rod-shaped component that connects the inspection processing holding part 2 to the body-side holding plate part 51 of the inspection fixture 4. The connecting member 91 passes through the inspection processing holding part 2, the first substrate 10, the first substrate holding part 20, and the body-side holding plate part 51. The front end of the connecting member 91 is received within a connecting hole 51c in the body-side holding plate part 51. One side of the connecting member 91 is fixed to the body-side holding plate part 51. The other side of the connecting member 91 is fixed to the inspection processing holding part 2. Thus, the second substrate 40, held by the body-side holding plate part 51, is positioned side-by-side with respect to the first substrate 10 in the thickness direction.

[0195] The control unit 7 controls the operation of the inspection processing unit 3. The control unit 7 outputs a command signal for the inspection object W to the inspection processing unit 3. In addition, the control unit 7 determines the condition of the electrical circuit of the inspection object W, etc., based on the signals received by the inspection processing unit 3 from the inspection object W.

[0196] (Inspection fixture)

[0197] Then, use Figures 10 to 15 The inspection fixture 4 is described in detail below. The inspection fixture 4 has a first substrate unit 8 and a second substrate unit 9.

[0198] The inspection fixture 4 has a connecting hole 90 extending in the X direction to accommodate the connecting structure 91.

[0199] (First substrate unit)

[0200] like Figures 11 to 13 As shown, the first substrate unit 8 includes a first substrate 10 and a first substrate holding portion 20. In this embodiment, the inspection fixture 4 has two first substrate units 8. The two first substrate units 8 are respectively installed at the position of three side-by-side inspection processing receiving portions 2a covering the inspection processing holding portion 2. That is, each first substrate unit 8 faces the end face of the inspection processing portion 3 housed in the inspection processing receiving portion 2a. Each component of the two first substrate units 8 is symmetrically arranged in the Y direction with the center line in the Y direction of the inspection processing holding portion 2 as the center. Since the structures of the two first substrate units 8 are the same, the structure of one first substrate unit 8 will be described below.

[0201] The first substrate 10 is a rectangular resin circuit board extending along the Y and Z directions. For example... Figure 11As shown, the first substrate 10 has three body-side terminal portions 11 on the surface holding the body portion 30, and three second substrate-side terminal portions 12 on the surface holding the second substrate 40. Each body-side terminal portion 11 is electrically connected to each second substrate-side terminal portion 12.

[0202] The three body-side terminal portions 11 face the three inspection processing units 3 respectively. Each body-side terminal portion 11 contacts the terminal portion of each inspection processing unit 3. As a result, the signals transmitted to the electrical circuit of the first substrate 10 are transmitted to the inspection processing unit 3. The three second substrate-side terminal portions 12 are electrically connected to the second substrate 40 via the electrical connection portion 80 described later.

[0203] like Figure 12 As shown, the first substrate 10 has two connecting holes 10a extending through the thickness direction. The connecting holes 10a are part of the connecting holes 90.

[0204] The first substrate holding portion 20 is plate-shaped, extending along both the Y and Z directions. The first substrate holding portion 20 is made of a material with sufficient strength for holding the first substrate 10, such as an aluminum-containing metal. Figure 11 and Figure 12 As shown, the first substrate holding portion 20 has a recess 20a on the side of the holding body portion 30. The first substrate 10 is housed in the recess 20a.

[0205] like Figure 11 and Figure 13 As shown, the first substrate holding portion 20 has three rectangular first connection receiving portions 20b extending through the thickness direction on the bottom surface of the recess 20a. The three first connection receiving portions 20b are located in the first substrate holding portion 20 at positions corresponding to the three second substrate side terminal portions 12. That is, the second substrate side terminal portions 12 are exposed from the first substrate holding portion 20 through the three first connection receiving portions 20b.

[0206] like Figure 13 As shown, the first substrate holding portion 20 has two connecting holes 20c extending through the thickness direction. The connecting holes 20c are part of the connecting holes 90.

[0207] The first substrate holding portion 20 has a second contact portion 21 on the surface facing the second substrate 40. The second contact portion 21 is located in the first substrate holding portion 20 at a position corresponding to the second protrusion 62 of the body-side holding plate portion 51, which will be described later. The second protrusion 62 will be described later. Alternatively, the first substrate holding portion 20 may also have a first contact portion, which is located at a position corresponding to the first protrusion 61 of the body-side holding plate portion 51.

[0208] As described above, in this embodiment, the inspection fixture 4 has two first substrate units 8. Therefore, the inspection fixture 4 has six body-side terminal portions 11, six second substrate-side terminal portions 12, six first connection receiving portions 20b, and four connection holes 20c. That is, the first connection receiving portions 20b are arranged in two rows of three along the Z direction and along the Y direction.

[0209] Two first substrate holding portions 20 are respectively mounted on the inspection and processing holding portion 2 in a state in which the first substrate 10 is housed in the recess 20a.

[0210] (Second substrate unit)

[0211] like Figure 11 As shown, the second substrate unit 9 includes a second substrate 40, a body-side holding plate portion 51, a probe-side holding plate portion 52, a connecting wire 55, and a probe unit 70. The second substrate unit 9 is mounted at a position covering the six first connecting receiving portions 20b of the first substrate unit 8. The second substrate unit 9 is fixed to the inspection and processing holding portion 2 by the fixture holding portion 6 and the connecting member 91.

[0212] The second substrate 40 is a rectangular resin circuit substrate extending along the Y and Z directions. The second substrate 40 has a probe connection hole 40a extending through the thickness direction in the center.

[0213] like Figure 11 and Figure 12 As shown, the second substrate 40 has six first substrate-side terminal portions 41 and six probe connection terminal portions 42 on its surface on the side of the first substrate 10. Each first substrate-side terminal portion 41 is electrically connected to each probe connection terminal portion 42.

[0214] Viewed from the X direction, the six probe connection terminal portions 42 are arranged at equal intervals in the circumferential direction with the probe connection hole 40a as the center.

[0215] The six first substrate-side terminal portions 41 are located facing the six second substrate-side terminal portions 12 of the first substrate 10, respectively. That is, when viewed from the X direction, the six first substrate-side terminal portions 41 are located on the outer periphery of the second substrate 40.

[0216] like Figures 11 to 13 As shown, the body-side retaining plate portion 51 is plate-shaped, extending along both the Y and Z directions. The length of the body-side retaining plate portion 51 in the Y direction is longer than the length of the second substrate 40 in the Y direction. The length of the body-side retaining plate portion 51 in the Z direction is the same as the length of the second substrate 40 in the Z direction. The body-side retaining plate portion 51 is made of a material with sufficient strength for retaining the second substrate 40, such as an aluminum-containing metal. The body-side retaining plate portion 51 serves as a second substrate retaining portion.

[0217] The body-side holding plate portion 51 holds the second substrate 40 in a state of being arranged side by side in the thickness direction with respect to the first substrate 10. The body-side holding plate portion 51 holds the second substrate 40 from the first substrate 10 side.

[0218] The body-side holding plate portion 51 is held by the jig holding portion 6 on both sides in the Y direction, and the inspection process holding portion 2 is fixed.

[0219] As shown in Figure 12 and Figure 14 The body-side holding plate portion 51 has a hexagonal probe connection opening portion 51b that penetrates in the thickness direction and is located in the center of the body-side holding plate portion 51 when viewed in plan. The probe connection opening portion 51b is located in the body-side holding plate portion 51 at a position corresponding to the probe connection terminal portion 42 of the second substrate 40. That is, the probe connection terminal portion 42 is exposed from the body-side holding plate portion 51 through the probe connection opening portion 51b. The probe connection opening portion 51b is an opening portion.

[0220] As shown in Figure 14 The body-side holding plate portion 51 has six rectangular second connection housing portions 51a that penetrate in the thickness direction. The six second connection housing portions 51a are located in the body-side holding plate portion 51 at positions corresponding to the first substrate-side terminal portions 41. That is, when viewed in plan of the body-side holding plate portion 51, the six second connection housing portions 51a are arranged in a column of three units in the Z direction on one side and the other side in the Y direction of the body-side holding plate portion 51 than the probe connection opening portion 51b. The first substrate-side terminal portions 41 are exposed from the body-side holding plate portion 51 through the six second connection housing portions 51a. The second connection housing portions 51a are electrical connection housing portions.

[0221] The body-side holding plate portion 51 has four coupling holes 51c that penetrate in the thickness direction. The coupling holes 51c are located between the second connection housing portions 51a arranged side by side in three units when viewed in the X direction. The leading end portions of the coupling members 91 are housed in the coupling holes 51c. The coupling holes 51c are part of the coupling holes 90.

[0222] The body-side holding plate portion 51 has a cylindrical protrusion portion 61 and a protrusion portion 62 on the side of the first substrate 10. The body-side holding plate portion 51 is inhibited from being displaced toward the inspection process holding portion 2 by the protrusion portions 61 and 62. Details of the protrusion portions 61 and 62 will be described later.

[0223] As shown in Figures 11 to 13As shown, the probe-side retaining plate portion 52 is plate-shaped, extending along the Y and Z directions. The lengths of the probe-side retaining plate portion 52 in the Y and Z directions are the same as the lengths of the body-side retaining plate portion 51 in the Y and Z directions. The thickness of the probe-side retaining plate portion 52 is less than the thickness of the body-side retaining plate portion 51. The probe-side retaining plate portion 52 is made of a material that has sufficient strength to retain the second substrate 40, such as an aluminum-containing metal.

[0224] The probe-side holding plate portion 52 is located on the side opposite to the body-side holding plate portion 51, separated from the second substrate 40. That is, the body-side holding plate portion 51, the second substrate 40, and the probe-side holding plate portion 52 are arranged side by side along their thickness direction from the first substrate 10 side in the order of body-side holding plate portion 51, second substrate 40, and probe-side holding plate portion 52.

[0225] like Figure 11 As shown, the probe-side retaining plate portion 52 has a probe connection hole 52a extending through the thickness direction in the center. Viewed from the X direction, the probe connection hole 52a of the probe-side retaining plate portion 52 is located at the same position as the probe connection hole 40a of the second substrate 40.

[0226] The body-side retaining plate portion 51 and the probe-side retaining plate portion 52 are connected to each other by a fixing member (not shown) while the second substrate 40 is clamped between them. In this way, by clamping the second substrate 40 from both sides in the thickness direction, deformation of the second substrate 40 in the thickness direction can be suppressed.

[0227] like Figure 11 As shown, the connecting wire 55 electrically connects the second substrate 40 to the probe 71 described later. One end of the connecting wire 55 is connected to the probe connection terminal portion 42 of the second substrate 40. The other end of the connecting wire 55 passes through the probe connection hole 40a of the second substrate 40 and the probe connection hole 52a of the probe side holding plate portion 52 and is connected to the probe 71.

[0228] Viewed in plan view of the body-side retaining plate portion 51, the probe unit 70 is mounted on the probe-side retaining plate portion 52 at a position overlapping with the probe connection opening portion 51b. The probe unit 70 includes a probe 71 and a probe support portion 72.

[0229] The probe 71 is a needle-shaped member extending in the X direction. By contacting the terminals of the object being inspected, the probe 71 detects the signals of the electrical circuits present in the object being inspected.

[0230] like Figure 11 As shown, one end of a connecting wire 55 is electrically connected to the end of the probe 71 on the second substrate side. The other end of the connecting wire 55 is electrically connected to the second substrate 40. Thus, signals from the electrical circuitry of the object under inspection W are transmitted to the second substrate 40 via the probe 71.

[0231] The probe support 72 supports the probe 71 against the body-side retaining plate 51. The probe support 72 is fixed to the probe-side retaining plate 52 by a fixing member (not shown).

[0232] like Figure 11 As shown, the electrical connection portion 80 is located between the first substrate 10 and the second substrate 40. In this embodiment, the inspection fixture 4 has six electrical connection portions 80. The first substrate 10 side of each electrical connection portion 80 is received within the first connection receiving portion 20b of the first substrate holding portion 20 and fixed to the first substrate holding portion 20 by a fixing member (not shown). The second substrate 40 side of each electrical connection portion 80 is received within the second connection receiving portion 51a of the body-side holding plate portion 51.

[0233] The electrical connection portion 80 has a first connection portion 81 on the first substrate 10 side that contacts the second substrate side terminal portion 12 of the first substrate 10. The electrical connection portion 80 has a second connection portion 82 on the second substrate 40 side that contacts the first substrate side terminal portion 41 of the second substrate 40.

[0234] In this embodiment, the first connecting portion 81 and the second connecting portion 82 include spring pins. That is, the first connecting portion 81 is pressed against the second substrate side terminal portion 12 of the first substrate 10, and the second connecting portion 82 is pressed against the first substrate side terminal portion 41 of the second substrate 40. Thus, the first substrate 10 and the second substrate 40 are electrically connected via the electrical connecting portion 80.

[0235] At this time, the second substrate 40 is subjected to the reaction force of the electrical connection portion 80, and therefore is prone to deforming to the side opposite to the first substrate 10. However, the second substrate 40 is held by the probe-side holding plate portion 52, which holds it from the side opposite to the first substrate 10. As a result, when the electrical connection portion 80 is in electrical contact with the second substrate 40, deformation of the second substrate 40 in the thickness direction is suppressed.

[0236] With the above structure, the inspection fixture 4 transmits signals from the electrical circuits of the object under inspection W to the inspection processing unit 3 via the probe 71, the probe connection terminal portion 42 and the first substrate side terminal portion 41 of the second substrate 40, the electrical connection portion 80, the second substrate side terminal portion 12 and the body side terminal portion 11 of the first substrate 10. Furthermore, in the second substrate 40, the spacing between the terminals of the first substrate side terminal portion 41 can be wider than the spacing between the terminals of the probe connection terminal portion 42. In the first substrate 10, the spacing between the terminals of the body side terminal portion 11 can be wider than the spacing between the terminals of the second substrate side terminal portion 12. Therefore, even when the spacing between the terminals of the object under inspection W is very narrow, the inspection fixture 4 can set the spacing between the terminals of the body side terminal portion 11 to a level where signals can be detected by the inspection processing unit 3.

[0237] (protrusion)

[0238] Subsequently, the use Figures 11 to 15 The protrusion 61 and the protrusion 62 of the body-side holding plate portion 51 will be described in detail.

[0239] As Figure 12 shown, the protrusion 61 and the protrusion 62 are cylindrical. The protrusion 61 and the protrusion 62 protrude from the surface of the body-side holding plate portion 51 on the first substrate 10 side facing the first substrate 10. In the present embodiment, the protrusion 61 and the protrusion 62 are a part of the body-side holding plate portion 51. For example, the protrusion 61 and the protrusion 62 are manufactured by cutting the portion other than the protrusion 61 and the protrusion 62 of the body-side holding plate portion 51 in the thickness direction. As Figure 14 shown, the cross-sectional shape of the protrusion 61 and the protrusion 62 is circular. Therefore, it is not necessary to form an angle when cutting the body-side holding plate portion 51. Thus, the protrusion 61 and the protrusion 62 can be easily manufactured. Further, the protrusion 61 and the protrusion 62 can be manufactured separately from the body-side holding plate portion 51 and attached to the body-side holding plate portion 51. At this time, the cross-sectional shape of the protrusion 61 and the protrusion 62 is circular, and thus, when attaching the protrusion 61 and the protrusion 62, the angle with respect to the body-side holding plate portion 51 viewed from the axial direction can not be considered. In addition, the protrusion 61 and the protrusion 62 can be manufactured by press working the body-side holding plate portion 51.

[0240] As Figure 14 shown, in the present embodiment, the body-side holding plate portion 51 is viewed in plan, and the protrusion 61 and the protrusion 62 include four first protrusions 61 on the central side of the body-side holding plate portion 51 and four second protrusions 62 on the outer peripheral side of the body-side holding plate portion 51.

[0241] In the present embodiment, the four first protrusions 61 have the same height. In addition, the four second protrusions 62 have the same height.

[0242] The four first protrusions 61 are located around the probe connection opening portion 51b of the body-side holding plate portion 51. In detail, as Figure 15As shown in the drawing, the distance Ll from each first protruding portion 61 to the center O of the probe connection opening portion 51b is shorter than the distance L2 from the second connection housing portion 51a to the center O of the probe connection opening portion 51b, as viewed in plan of the body-side holding plate portion 51. Further, the distance Ll from each first protruding portion 61 to the center O of the probe connection opening portion 51b is shorter than the distance L3 from the linking hole 51c to which the linking member 91 is attached to the center O of the probe connection opening portion 51b, as viewed in plan of the body-side holding plate portion 51. Further, each first protruding portion 61 is located on the central side in the Y direction of the body-side holding plate portion 51 than the linking hole 51c housing the linking member 91. As viewed in plan of the body-side holding plate portion 51, the four first protruding portions 61 are arranged side by side in two units on both sides in the Z direction across the probe connection opening portion 51b. As shown in the drawing, Figure 11 As shown in the drawing, the four first protruding portions 61 protrude toward the inspection processing holding portion 2.

[0243] Further, here, the distance Ll refers to the shortest distance from each first protruding portion 61 to the center O of the probe connection opening portion 51b. Further, the distance L2 refers to the shortest distance from the outer edge of the second connection housing portion 51a to the center O of the probe connection opening portion 51b. Further, the distance L3 refers to the shortest distance from the outer edge of the linking hole 51c to the center O of the probe connection opening portion 51b.

[0244] As shown in the drawing, Figure 14 As shown in the drawing, the four second protruding portions 62 are located on the outer peripheral side of the body-side holding plate portion 51 than the probe connection opening portion 51b, as viewed in plan of the body-side holding plate portion 51. In detail, two of the four second protruding portions 62 are respectively located on the outer peripheral side than the second connection housing portions 51a arranged side by side in a column of three on one side in the Y direction of the body-side holding plate portion 51 and at substantially equal distances from adjacent second connection housing portions 51a of the second connection housing portions 51a arranged side by side in a column of three. The other two of the four second protruding portions 62 are respectively located on the outer peripheral side than the second connection housing portions 51a arranged side by side in a column of three on the other side in the Y direction of the body-side holding plate portion 51 and at substantially equal distances from adjacent second connection housing portions 51a of the second connection housing portions 51a arranged side by side in a column of three. As shown in the drawing, Figure 11 As shown in the drawing, the four second protruding portions 62 protrude toward the first substrate holding portion 20.

[0245] Further, the substantially equal distance from the adjacent second connection housing portion 51a here means a substantially equal distance from the positions of the mutually closest outer edges of the adjacent second connection housing portions 51a. Also, the outer periphery side of the body-side holding plate portion 51 than the probe connection opening portion 51b means the outer periphery portion of the body-side holding plate portion 51 than the outer edge of the probe connection opening portion 51b. The outer periphery side than the second connection housing portion 51a of the body-side holding plate portion 51 means the outer periphery portion of the body-side holding plate portion 51 than the outer edge of the second connection housing portion 51a.

[0246] As shown in Figure 11 , the front ends of the four first protruding portions 61 contact the first contacted portions 31 of the inspection process holding portion 2. Thus, the body-side holding plate portion 51 is inhibited from displacing to the inspection process holding portion 2 side by the four first protruding portions 61. Also, the front ends of the four second protruding portions 62 contact the second contacted portions 21 of the first substrate holding portion 20 (see Figure 13 ). Thus, the body-side holding plate portion 51 is inhibited from displacing to the inspection process holding portion 2 side by the four second protruding portions 62.

[0247] Further, in the present embodiment, the inspection process holding portion 2 has the first contacted portions 31 that contact the first protruding portions 61, and the first substrate holding portion 20 has the second contacted portions 21 that contact the second protruding portions 62. However, the inspection process holding portion can have second contacted portions that contact the second protruding portions, and the first substrate holding portion can have first contacted portions that contact the first protruding portions.

[0248] Next, the effects of the first protruding portions 61 and the second protruding portions 62 of the inspection apparatus 1 having the above structure will be described.

[0249] In the inspection apparatus 1, a signal of an electrical circuit that the inspection object W has is transmitted to the inspection process portion 3 via the probe 71, the second substrate 40, the first substrate 10. The probe 71, the second substrate 40, the first substrate 10, and the inspection process portion 3 are held by the probe unit 70, the body-side holding plate portion 51, the first substrate holding portion 20, and the inspection process holding portion 2, respectively. Also, the second substrate 40 is electrically connected to the first substrate 10 via the electrical connection portion 80 housed in the second connection housing portion 51a.

[0250] Therefore, in order to stably transmit the signal of the inspection object W detected by the probe 71 to the inspection processing section 3 at the time of inspection, it is necessary to maintain the position of the first substrate side terminal section 41 of the second substrate 40 with respect to the second connection section 82 of the electrical connection section 80 constant, and to maintain the state of electrical connection between the second connection section 82 of the electrical connection section 80 and the first substrate side terminal section 41 of the second substrate 40 held by the body side holding plate section 51 good. Therefore, with respect to the body side holding plate section 51, it is necessary to suppress displacement in the thickness direction with respect to the first substrate holding section 20 and the inspection processing holding section 2.

[0251] Viewing the body side holding plate section 51 in plan, the body side holding plate section 51 has a probe connection opening section 51b that penetrates in the thickness direction at a position overlapping the probe 71. Therefore, the rigidity of the body side holding plate section 51 is reduced around the probe connection opening section 51b. In addition, the body side holding plate section 51 has a second connection housing section 51a at a position of connection with the electrical connection section 80. Therefore, the rigidity of the body side holding plate section 51 is reduced around the second connection housing section 51a.

[0252] In addition, the body side holding plate section 51 receives a force to displace toward the probe 71 side from the contact pressure from the electrical connection section 80 around the second connection housing section 51a. In addition, the body side holding plate section 51 is fixed with respect to the inspection processing holding section 2 by the link member 91 at a position of the link hole 51c. In addition, the body side holding plate section 51 is pulled toward the inspection processing holding section 2 side on the outer peripheral side of the body side holding plate section 51 than the probe connection opening section 51b. Therefore, for example, the body side holding plate section 51 can be deformed in the thickness direction in part, or inclined with respect to the first substrate holding section 20 in part.

[0253] Further, the body side holding plate section 51 receives a contact pressure from the probe 71 at the time of inspection of the inspection object W, and receives a force to displace toward the inspection processing holding section 2 side around the probe connection opening section 51b. In this way, the force to displace toward the inspection processing holding section 2 side is received around the probe connection opening section 51b, and the body side holding plate section 51 around the probe connection opening section 51b, which is a central portion of the body side holding plate section 51, is displaced toward the inspection processing holding section 2 side. At this time, the outer peripheral side of the body side holding plate section 51 located further outward than the electrical connection section 80 is displaced toward the side opposite to the inspection processing holding section 2 side with the electrical connection section 80 as a fulcrum. As a result, a part of the first substrate side terminal section 41 of the second substrate 40 can be distanced from the second connection section 82 of the electrical connection section 80, and contact failure can occur between the electrical connection section 80 and the second substrate 40.

[0254] Further, in the inspection of the inspection object W, displacement of the periphery of the probe connection opening portion 51b of the body-side holding plate portion 51 to the inspection process holding portion 2 side can cause a situation in which the probe 71 is not pressed against the inspection object W by the force required for the inspection.

[0255] However, in the inspection device 1, the body-side holding plate portion 51 has the first protrusion portion 61 that contacts the inspection process holding portion 2 at the periphery of the probe connection opening portion 51b. Thus, the body-side holding plate portion 51 suppresses displacement of the periphery of the probe connection opening portion 51b to the inspection process holding portion 2 side. Therefore, the body-side holding plate portion 51 can hold the position of the first substrate-side terminal portion 41 of the second substrate 40 relative to the second connection portion 82 of the electrical connection portion 80 constant, and suppresses contact failure between the electrical connection portion 80 housed in the second connection housing portion 51a and the second substrate 40 held by the body-side holding plate portion 51. Further, displacement of the probe unit 70 located at the probe connection opening portion 51b to the inspection process holding portion 2 side is suppressed, and thus the probe 71 can be brought into contact with the inspection object W with the necessary force at the time of inspection.

[0256] Further, in the inspection device 1, the body-side holding plate portion 51 has the second protrusion portion 62 that contacts the first substrate holding portion 20 at the periphery of the second connection housing portion 51a. Thus, displacement of the body-side holding plate portion 51 to the first substrate holding portion 20 side at the periphery of the second connection housing portion 51a is suppressed.

[0257] Therefore, in the inspection device 1, displacement of the body-side holding plate portion 51 to the inspection process holding portion 2 side relative to the inspection process holding portion 2 is suppressed by the first protrusion portion 61. Further, displacement of the probe unit 70 to the inspection process holding portion 2 side relative to the body-side holding plate portion 51 and the inspection process holding portion 2 is suppressed by the first protrusion portion 61. Further, displacement of the body-side holding plate portion 51 of the position of the electrical connection portion 80 to the inspection process holding portion 2 side relative to the first substrate holding portion 20 is suppressed by the second protrusion portion 62. Thus, signals of the inspection object W can be stably transmitted between the probe 71 supported by the probe unit 70, the second substrate 40 held by the body-side holding plate portion 51, the first substrate 10 held by the first substrate holding portion 20, and the inspection process portion 3 supported by the inspection process holding portion 2.

[0258] In the embodiment, the body-side holding plate portion 51 has four first protrusion portions 61 and four second protrusion portions 62. However, the body-side holding plate portion can have at least one first protrusion portion 61. Further, in order to suppress displacement of the body-side holding plate portion 51 to the inspection process holding portion 2 side, the body-side holding plate portion 51 preferably has at least one second protrusion portion 62.

[0259] Further, in order to suppress displacement of the body-side holding plate portion 51 toward the inspection processing holding portion 2 side, the body-side holding plate portion 51 preferably has a plurality of first protruding portions 61. At this time, the plurality of first protruding portions 61 are preferably located at positions facing each other across the probe connection opening portion 51b, when the body-side holding plate portion 51 is viewed in plan. Thus, even when the body-side holding plate portion 51 receives contact pressure from the probes 71 at the time of inspection of the inspection object W, and receives a force to displace toward the inspection processing holding portion 2 side around the probe connection opening portion 51b, the body-side holding plate portion 51 can be suppressed from displacing toward the inspection processing holding portion 2 side at positions on both sides across the probe connection opening portion 51b. Therefore, compared with a structure in which the first protruding portion 61 is provided only on one side with respect to the probe connection opening portion 51b, it is easier to suppress displacement of the body-side holding plate portion 51 toward the inspection processing holding portion 2 side around the probe connection opening portion 51b.

[0260] Further, in the structure in which the body-side holding plate portion 51 has a plurality of first protruding portions 61 at positions facing each other across the probe connection opening portion 51b, at least two of the plurality of first protruding portions 61 are preferably located at one of two places across the probe connection opening portion 51b, when the body-side holding plate portion 51 is viewed in plan. Thus, the body-side holding plate portion 51 can be brought into contact with the inspection processing holding portion 2 at at least three places around the probe connection opening portion 51b. Therefore, displacement of the probe unit 70 toward the inspection processing holding portion 2 side can be suppressed at at least three places in the thickness direction of the body-side holding plate portion 51. Thus, it is easier to suppress displacement of the body-side holding plate portion 51 toward the inspection processing holding portion 2 side around the probe connection opening portion 51b.

[0261] As explained above, the inspection jig 4 is an inspection jig attached to an inspection device that inspects a substrate or a semiconductor as an inspection target. The inspection jig 4 includes: probes 71 that contact the inspection target to detect an electrical signal; a second substrate 40 that holds the probes 71 and transmits the electrical signal detected by the probes 71; a first substrate 10 that is arranged side by side with the second substrate 40 in a thickness direction of the second substrate 40 on a side opposite to the side of the probes 71 and transmits the electrical signal transmitted by the second substrate 40 to the inspection device; an electrical connection portion 80 that electrically connects the first substrate 10 and the second substrate 40; a first substrate holding portion 20 that holds the first substrate 10 with respect to the inspection device 1; and a body side holding plate portion 51 that holds the second substrate 40 with respect to the first substrate 10 on the side of the first substrate 10. The body side holding plate portion 51 has: a probe connection opening portion 51b that penetrates the body side holding plate portion 51 in the thickness direction at a position overlapping the probes 71 when viewed in plan; a second connection housing portion 51a that penetrates the body side holding plate portion 51 in the thickness direction to house the electrical connection portion 80; and a first protruding portion 61 that protrudes toward the first substrate 10. The distance between the first protruding portion 61 and the center of the probe connection opening portion 51b is shorter than the distance between the second connection housing portion 51a and the center of the probe connection opening portion 51b when viewed in plan of the body side holding plate portion 51. The first protruding portion 61 contacts the inspection device 1 or the first substrate holding portion 20 at least when the probes 71 contact the inspection target.

[0262] In the case where the body side holding plate portion 51 that holds the second substrate 40 has the probe connection opening portion 51b that penetrates the body side holding plate portion 51 in the thickness direction, the rigidity of the body side holding plate portion 51 is reduced around the probe connection opening portion 51b. Thus, it is possible that the second substrate 40 is displaced in the thickness direction with respect to the first substrate 10. In relation to this, in the structure, the body side holding plate portion 51 has the first protruding portion 61 that contacts the inspection process holding portion 2 or the first substrate holding portion 20 around the probe connection opening portion 51b of the body side holding plate portion 51. That is, by the first protruding portion 61, the body side holding plate portion 51 contacts the inspection process holding portion 2 or the first substrate holding portion 20 around the probe connection opening portion 51b of the body side holding plate portion 51 where the first protruding portion 61 is located. Thus, it is possible to suppress displacement of the second substrate 40 held by the body side holding plate portion 51 to the side of the inspection process holding portion 2 or the first substrate holding portion 20 around the probe connection opening portion 51b and around the second connection housing portion 51a. Thus, the body side holding plate portion 51 having a plurality of first protruding portions 61 can hold the position of the first substrate side terminal portion 41 of the second substrate 40 with respect to the second connection portion 82 of the electrical connection portion 80 constant, and stabilize electrical contact between the second substrate 40 and the electrical connection portion 80. In addition, it is possible to cause the probes 71 to contact the inspection target W with a necessary force at the time of inspection.

[0263] Further, the second connection housing portions 51a include a plurality of second connection housing portions 51a, and, when the body-side holding plate portion 51 is viewed in plan, are arranged in a row on at least one of the one side and the other side of the body-side holding plate portion 51 in the width direction thereof further from the probe connection opening portion 51b, and, when the body-side holding plate portion 51 is viewed in plan, the second protruding portions 62 are located at substantially equal distances from adjacent second connection housing portions 51a.

[0264] By the second protruding portions 62, the body-side holding plate portion 51 can be brought into contact with the inspection processing holding portion 2 or the first substrate holding portion 20 around the second connection housing portions 51a. Therefore, around the second connection housing portions 51a, displacement of the body-side holding plate portion 51 to the side of the inspection processing holding portion 2 or the first substrate holding portion 20 is suppressed. Also, as to the number of the second protruding portions 62, it is sufficient that there be at least one at a substantially equal distance from a plurality of second connection housing portions 51a. Therefore, displacement of the body-side holding plate portion 51 to the side of the inspection processing holding portion 2 or the first substrate holding portion 20 around the second connection housing portions 51a can be suppressed by the second protruding portions 62, which are fewer in number than the second connection housing portions 51a.

[0265] Further, in the present embodiment, when the body-side holding plate portion 51 is viewed in plan, the probe connection opening portion 51b is located in the center of the body-side holding plate portion 51. When the body-side holding plate portion 51 is viewed in plan, the plurality of second connection housing portions 51a are each arranged side by side in a row in three units in a direction orthogonal to the width direction further from the probe connection opening portion 51b on the one side and the other side of the body-side holding plate portion 51 in the width direction. The first protruding portions 61 include four first protruding portions 61, and, when the body-side holding plate portion 51 is viewed in plan, are located further from the center of the body-side holding plate portion 51 in the width direction than the four connection members 91, and two of the four first protruding portions 61 are located on the side opposite the other two first protruding portions 61 with the probe connection opening portion 51b interposed therebetween. When the body-side holding plate portion 51 is viewed in plan, the second protruding portions 62 are located at substantially equal distances from adjacent second connection housing portions 51a further from the center of the plurality of second connection housing portions 51a on the one side and the other side of the body-side holding plate portion 51 in the width direction.

[0266] The inspection jig 4 having six second connection housing portions 51a has first protruding portions 61 of the contact inspection processing holding portion 2 or the first substrate holding portion 20 at four places around the probe connection opening portion 51b. In addition, the inspection jig 4 has second protruding portions 62 at both sides in the Y direction of the body side holding plate portion 51 at both outer sides of the second connection housing portions 51a than the first protruding portions 61. Thus, by the four first protruding portions 61 of the central side of the body side holding plate portion 51 and the second protruding portions 62 disposed at least one each at one side and the other side in the Y direction of the body side holding plate portion 51, displacement of the body side holding plate portion 51 toward the contact inspection processing holding portion 2 side relative to the contact inspection processing holding portion 2 or the first substrate holding portion 20 is suppressed. Therefore, the body side holding plate portion 51 can hold the position of the first substrate side terminal portion 41 of the second substrate 40 relative to the second connection portion 82 of the electrical connection portion 80 constant, and contact failure between the electrical connection portion 80 housed in the second connection housing portion 51a and the second substrate 40 held by the body side holding plate portion 51 is suppressed.

[0267] In addition, the inspection device 1 includes the inspection jig 4 having the above structure, an inspection processing portion 3 that detects a signal of the first substrate 10, and a plate-shaped contact inspection processing holding portion 2 that holds the inspection processing portion 3. The contact inspection processing holding portion 2 or the first substrate holding portion 20 has a first contacted portion 31 that is contacted by the first protruding portion 61.

[0268] The inspection jig 4 of the inspection device 1 has the first protruding portion 61 that contacts the first contacted portion 31 around the probe connection opening portion 51b. Thus, displacement of the body side holding plate portion 51 of the inspection jig 4 toward the contact inspection processing holding portion 2 side around the probe connection opening portion 51b is suppressed. Therefore, displacement of the probe unit 70 held by the body side holding plate portion 51 toward the contact inspection processing holding portion 2 side relative to the inspection object W is suppressed. Therefore, for the outer peripheral side of the body side holding plate portion 51 located more outward than the electrical connection portion 80, displacement toward the side opposite to the contact inspection processing holding portion 2 side is suppressed. That is, the body side holding plate portion 51 is less likely to isolate a part of the first substrate side terminal portion 41 of the second substrate 40 from the second connection portion 82 of the electrical connection portion 80. That is, the body side holding plate portion 51 can hold the position of the first substrate side terminal portion 41 of the second substrate 40 relative to the second connection portion 82 of the electrical connection portion 80 constant, and contact failure between the electrical connection portion 80 housed in the second connection housing portion 51a and the second substrate 40 held by the body side holding plate portion 51 is suppressed. In addition, an inspection device that can cause the probe 71 to contact the inspection object W with necessary force at the time of inspection can be obtained.

[0269] Further, in the inspection device 1, the protruding portion includes a second protruding portion 62 that, when viewed in plan from the body-side holding plate portion 51, is located on the outer peripheral side of the body-side holding plate portion 51 than the second connection-receiving portion 51a and contacts the inspection device 1 or the body-side holding plate portion 51. The inspection process holding portion 2 or the first substrate holding portion 20 has a second contacted portion 21 that is contacted by the second protruding portion 62.

[0270] The inspection jig 4 of the inspection device 1 has the second protruding portion 62 that contacts the second contacted portion 21 on the outer peripheral side of the body-side holding plate portion 51. Thus, displacement of the body-side holding plate portion 51 of the inspection jig 4 in the thickness direction with respect to the inspection process portion 3 on the outer peripheral side of the body-side holding plate portion 51 is suppressed. Thus, displacement of the body-side holding plate portion 51 toward the inspection process holding portion 2 side is suppressed. Therefore, the body-side holding plate portion 51 can hold the position of the first substrate-side terminal portion 41 of the second substrate 40 with respect to the second connection portion 82 of the electrical connection portion 80 constant, and stabilize electrical contact of the inspection jig 4 with the inspection process portion 3. Further, the probe 71 can be brought into contact with the inspection object W with a necessary force at the time of inspection.

[0271] Further, the inspection device 1 further has a link member 91 that links the body-side holding plate portion 51 to the inspection device 1. When viewed in plan from the body-side holding plate portion 51, the first protruding portion 61 is located closer to the center O of the probe connection opening portion 51b than the link member 91 is to the center of the probe connection opening portion 51b.

[0272] When the inspection device 1 has the link member 91, the body-side holding plate portion 51 receives a force pressed toward the inspection process holding portion 2 side at the position of the link hole 51c in which the link member 91 is received, and displacement of the body-side holding plate portion 51 toward the inspection process holding portion 2 side is possible. However, the first protruding portion 61 is located closer to the vicinity of the probe connection opening portion 51b than the position at which the link member 91 is linked, and thus displacement of the body-side holding plate portion 51 toward the inspection process holding portion 2 side with respect to the inspection process holding portion 2 or the first substrate holding portion 20 around the probe connection opening portion 51b is suppressed. Therefore, electrical contact of the inspection jig 4 with the inspection process portion 3 can be stabilized. Further, the probe 71 can be brought into contact with the inspection object W with a necessary force at the time of inspection.

[0273] (Other Embodiments)

[0274] The embodiments of the present application described above are merely examples for carrying out the present application. Therefore, the embodiments are not limited to the above-described embodiments, but can be appropriately modified within the scope of the gist of the present application.

[0275] In the embodiment, the case where the inspection device 1 has six inspection processing sections 3 is described as an example. Therefore, the inspection processing holding section 2 has six inspection processing holding sections 2a, the two first substrate holding sections 20 have six first connection holding sections 20b in total, and the body side holding plate section 51 has six second connection holding sections 51a. However, the number of the opening sections of each member can be any number as long as electrical connection corresponding to the number of the inspection processing sections can be made.

[0276] In the embodiment, the case where the inspection device 1 has six inspection processing sections 3 is described as an example. Therefore, the two first substrates 10 have six body side terminal sections 11 and six second substrate side terminal sections 12 in total, and the second substrate 40 has six first substrate side terminal sections 41 and six probe connection terminal sections 42. Also, the inspection device 1 has six electrical connection sections 80. However, the number of the terminal sections of each member can be any number as long as electrical connection corresponding to the number of the inspection processing sections can be made. Also, the number of the electrical connection sections can be any number.

[0277] In the embodiment, the inspection device 1 has two first substrate units 8. However, the number of the first substrate units can be one or more than two.

[0278] In the embodiment, the electrical connection section 80 is mounted to the first substrate unit 8. However, the electrical connection section can also be a structure held by sandwiching the second substrate and the first substrate.

[0279] In the embodiment, one side of the link member 91 is fixed to the inspection processing holding section 2 and the other side is fixed to the body side holding plate section 51. However, the link member can be fixed to any component as long as the inspection processing holding section and the second substrate holding plate section are distanced from each other.

[0280] In the embodiment, the inspection processing holding section 2a is rectangular in shape when viewed from the X direction. However, the inspection processing holding section can be any shape as long as it does not interfere with electrical connection of the terminal sections of the component housed in the inspection processing holding section and the terminal sections of the component exposed due to the inspection processing holding section.

[0281] In the embodiment, the probe connection opening section 51b is hexagonal in shape when viewed from the X direction. However, the probe connection opening section can also be any other shape.

[0282] In the embodiment, the link hole 20c is located between the three second connection holding sections 51a in parallel. However, the position of the link hole can be any position as long as the probe side holding plate section is positioned in parallel with the first substrate in the X direction.

[0283] In the embodiment, the four first contact receiving portions 31 have the same height. In addition, the four first protruding portions have the same height. However, the four first contact receiving portions can have different heights from each other. In addition, the four first protruding portions can have different heights from each other. Furthermore, the height of each first contact receiving portion and the length of the height of the first protruding portion contacting the first contact receiving portion are preferably the same for the four combinations.

[0284] In the embodiment, the first contact receiving portion 31 is a cylindrical member extending from the face of the inspection jig 4 side of the holding body portion 30. However, the first contact receiving portion can not be cylindrical. The first contact receiving portion can be located on the face of the inspection jig 4 side of the holding body portion.

[0285] In the embodiment, the first protruding portion 61 is arranged in two units side by side on both sides in the Z direction across the probe connection opening portion 51b when the body side holding plate portion 51 is viewed in plan. However, the first protruding portion can be arranged in two units side by side on both sides in the Y direction across the probe connection opening portion when the body side holding plate portion is viewed in plan.

[0286] In the embodiment, the second protruding portion 62 is located further outward in the Y direction of the body side holding plate portion 51 than the three second connection receiving portions 51a arranged side by side on one side and the other side. However, the second protruding portion can be configured such that, when the body side holding plate portion is viewed in plan, it is located further outward in the Y direction of the body side holding plate portion than the probe connection opening portion. Thus, the body side holding plate portion can be inhibited from deforming in the thickness direction with respect to the first substrate holding portion or the inspection process holding portion on the outer periphery side of the body side holding plate portion. In addition, the second protruding portion can be configured such that, when the body side holding plate portion is viewed in plan, it is located further outward in the Y direction of the body side holding plate portion than the center of the second connection receiving portion. Thus, the body side holding plate portion can be inhibited from deforming in the thickness direction on the outer side in the Y direction of the body side holding plate portion than the center of the second connection receiving portion. Therefore, the body side holding plate portion can be inhibited from deforming in the thickness direction with respect to the first substrate holding portion or the inspection process holding portion around the second connection receiving portion.

[0287] In the embodiment, the second protruding portion 62 is located at substantially the same distance from the adjacent second connection receiving portions 51a of the three second connection receiving portions 51a arranged side by side. However, the second protruding portion can be located at different distances from the adjacent second connection receiving portions of the three second connection receiving portions arranged side by side. For example, it can be located at an arbitrary position further outward in the Y direction of the body side holding plate portion than the second connection receiving portion 51a.

[0288] Industrial Applicability

[0289] The present application can be applied to a substrate inspection apparatus that uses a probe to inspect various substrates.

[0290] In addition, the present application can be applied to an inspection apparatus that uses an inspection jig having a plurality of substrates to perform inspection of circuit substrates.

Claims

1. An inspection fixture, comprising: An inspection processing unit is mounted to a substrate inspection apparatus that inspects an electrical circuit included in a substrate under inspection, and includes: a first substrate that detects a signal from the inspection processing unit; a probe unit that includes a probe that contacts the substrate under inspection; a second substrate that is arranged side by side with the first substrate in a thickness direction of the first substrate and that is electrically connected to the probe; an electrical connection portion that is arranged between the first substrate and the second substrate in the thickness direction and that electrically connects the first substrate and the second substrate; and a substrate holding portion that holds the second substrate in a state in which the second substrate is arranged side by side with the first substrate in the thickness direction and that holds the probe unit on a side opposite to the first substrate, the substrate holding portion includes: a first holding plate portion that is plate-shaped and that is arranged on a side of the probe unit of the second substrate; and a holding plate support portion that positions the first holding plate portion at a position at which the first holding plate portion is arranged side by side with the first substrate in the thickness direction, the second substrate is held in a state in which the first substrate and the second substrate are electrically connected via the electrical connection portion by sandwiching the electrical connection portion in the thickness direction between the first substrate and the second substrate, the first holding plate portion is arranged between the probe unit and the second substrate.

2. The inspection jig of claim 1, wherein the substrate holding portion further includes a second holding plate portion that is plate-shaped and that is arranged on a side of the first substrate with respect to the second substrate, the first holding plate portion and the second holding plate portion are fixed in a state in which the second substrate is sandwiched in the thickness direction by the first holding plate portion and the second holding plate portion.

3. The inspection fixture of claim 2, wherein the holding plate support portion positions the first holding plate portion at a position at which the first holding plate portion is arranged side by side with the first substrate in the thickness direction by fixing the second holding plate portion to the inspection processing unit.

4. The inspection jig of claim 3, wherein the holding plate support portion is a rod-shaped member that extends through the second holding plate portion and the inspection processing unit in the thickness direction, at a front end portion of the holding plate support portion, a claw portion that extends in a direction that crosses an extending direction of the holding plate support portion is provided, when viewed in the thickness direction, the second holding plate portion has a receiving hole that receives the front end portion of the holding plate support portion, when viewed in the thickness direction, the receiving hole extends in a direction opposite to the side of the probe unit and has a claw portion receiving space that receives the claw portion of the holding plate support portion.

5. The inspection fixture of claim 2, wherein a thickness of the first holding plate portion is smaller than a thickness of the second holding plate portion.

6. The inspection fixture of claim 1, wherein the electrical connection portion includes a plurality of contact terminals that respectively electrically contact a terminal of the first substrate and a terminal of the second substrate, at least some of the plurality of contact terminals are capable of being extended and contracted in the thickness direction.

7. The inspection fixture of claim 1, wherein when viewed in the thickness direction, the electrical connection portion is arranged on an outer circumferential side of the second substrate.

8. A substrate inspection apparatus characterized by comprising: An inspection apparatus includes the inspection jig according to any one of claims 1 to 7.

9. An inspection fixture, characterized by, An inspection apparatus includes the inspection jig according to any one of claims 1 to 7. the inspection jig includes: a probe that contacts the inspection object and that detects an electrical signal; a second substrate holding the probe and transmitting an electrical signal detected by the probe; a first substrate arranged side by side with the second substrate in a thickness direction of the second substrate on a side opposite to the probe side of the second substrate and transmitting the electrical signal transmitted by the second substrate to the inspection device; an electrical connection portion electrically connecting the first substrate and the second substrate; a first substrate holding portion holding the first substrate with respect to the inspection device; and a second substrate holding portion holding the second substrate with respect to the first substrate on the first substrate side, the second substrate holding portion has a probe connection opening portion penetrating in a thickness direction at a position overlapping the probe when the second substrate holding portion is viewed in plan, an electrical connection housing portion penetrating in the thickness direction to house the electrical connection portion, and a first protrusion portion protruding toward the first substrate, a distance between the first protrusion portion and a center of the probe connection opening portion is shorter than a distance between the electrical connection housing portion and the center of the probe connection opening portion when the second substrate holding portion is viewed in plan, the first protrusion portion contacts the inspection device or the first substrate holding portion at least when the probe contacts the inspection target.

10. The inspection fixture of claim 9, wherein, the first protrusion portion includes a plurality of first protrusion portions, the plurality of first protrusion portions are located at positions facing each other across the probe connection opening portion when the second substrate holding portion is viewed in plan.

11. The inspection fixture of claim 10, wherein, at least two of the plurality of first protrusion portions are located at one of two places across the probe connection opening portion when the second substrate holding portion is viewed in plan.

12. The inspection fixture of claim 9, wherein, further including a second protrusion portion, the second protrusion portion is located closer to an outer peripheral side of the second substrate holding portion than the probe connection opening portion and contacts the inspection device or the first substrate holding portion when the second substrate holding portion is viewed in plan.

13. The inspection fixture of claim 12, wherein, the second protrusion portion is located closer to a width direction outer side of the second substrate holding portion than a center of the electrical connection housing portion when the second substrate holding portion is viewed in plan.

14. The inspection fixture of claim 12, wherein, the electrical connection housing portion includes a plurality of electrical connection housing portions arranged in a line on at least one of a width direction one side and a width direction other side of the second substrate holding portion closer to the second substrate holding portion than the probe connection opening portion when the second substrate holding portion is viewed in plan, the second protrusion portion is located at equal distances from adjacent electrical connection housing portions when the second substrate holding portion is viewed in plan.

15. The inspection fixture of claim 14, wherein, the probe connection opening portion is located at a center of the second substrate holding portion when the second substrate holding portion is viewed in plan, the plurality of electrical connection housing portions are arranged in a line in three units in a direction orthogonal to a width direction on the width direction one side and the width direction other side of the second substrate holding portion closer to the second substrate holding portion than the probe connection opening portion, respectively, when the second substrate holding portion is viewed in plan, The first protruding portions include four first protruding portions, which are located on a central side of the second substrate holding portion in a width direction than the plurality of electrical connection housing portions, and two of the four first protruding portions are located on a side opposite to the other two first protruding portions across the probe connection opening portion, The second protruding portion is located at an equal distance from adjacent electrical connection housing portions on one outer side of the second substrate holding portion in a width direction than the center of the plurality of electrical connection housing portions, and is located at an equal distance from adjacent electrical connection housing portions on the other outer side of the second substrate holding portion in a width direction than the center of the plurality of electrical connection housing portions.

16. The inspection fixture of claim 9, wherein, The first protruding portion is cylindrical.

17. An inspection apparatus characterized by comprising: Comprise: The inspection jig according to any one of claims 9 to 16; An inspection processing portion that detects a signal of the first substrate; And A plate-shaped inspection processing holding portion that holds the inspection processing portion, The inspection processing holding portion or the first substrate holding portion has a first contacted portion that is contacted by the first protruding portion.

18. The inspection apparatus of claim 17, wherein, Further comprising: A second protruding portion, which is located on a peripheral side of the second substrate holding portion than the probe connection opening portion, and contacts the inspection device or the first substrate holding portion, The inspection processing holding portion or the first substrate holding portion has a second contacted portion that is contacted by the second protruding portion.

19. The inspection device of claim 17, wherein, Further comprising: A connecting member that connects the second substrate holding portion to the inspection device, The first protruding portion is closer to the center of the probe connection opening portion than the connecting member.

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