Clamping mechanism and electrochemical deposition equipment

Abstract

A clamping mechanism and an electrochemical deposition device relate to the technical field of wafer electrochemical deposition. The clamping mechanism includes a swing clamping assembly, a cover body assembly, a transmission assembly, and a driving assembly; the driving assembly is arranged on the cover body assembly, and the driving assembly drives and connects the swing clamping assembly through the transmission assembly so that the swing clamping assembly can switch between a clamping state and a releasing state; a cover body chamber is arranged inside the cover body assembly; the transmission assembly is located in the cover body chamber; a part of the swing clamping assembly is located in the cover body chamber, and the other part extends out of the cover body chamber; the swing clamping assembly includes a sealing diaphragm for sealing the cover body chamber. The electrochemical deposition device includes the clamping mechanism. The purpose of the present invention is to provide a clamping mechanism and an electrochemical deposition device to solve to a certain extent the technical problems existing in the prior art, such as fast wear and short life of the sealing ring, and the clamping structure is likely to cause damage to the wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer electrochemical deposition, and in particular, to a clamping mechanism and an electrochemical deposition device. Background Art

[0002] In the technical field of wafer electrochemical deposition (ECD), in processes such as Cu-TSV (copper electroplated through-silicon via) filling and deep hole filling with high aspect ratio, due to the presence of air in the microstructures, the plating solution cannot enter, resulting in defects such as internal holes in the electrochemical deposition; therefore, before wafer electrochemical deposition, the wafer is placed in a vacuum pre-wetting chamber, and through vacuum pumping, the bubbles in the micro-holes to be plated on the wafer are discharged to prevent the generation of process defects. The wafer clamping mechanism is used for clamping the wafer in a vacuum environment. During the wafer clamping process, it is necessary to ensure that the vacuum in the vacuum pre-wetting chamber does not leak, and at the same time, ensure flexible clamping to prevent damage to the wafer.

[0003] The existing technologies of the wafer clamping mechanism have the following deficiencies:

[0004] First, the sealing method uses an "O" - ring seal, which has fast wear and short service life. The particles worn from the seal are likely to cause contamination in the vacuum chamber.

[0005] Second, a cylinder is directly used to push the clamping rod to clamp the wafer, which is a "hard" clamping method. Changes and differences in the compressed air pressure and wafer size are likely to cause the wafer to be crushed or damaged. Summary of the Invention

[0006] The purpose of the present invention is to provide a clamping mechanism and an electrochemical deposition device to solve, to a certain extent, the technical problems in the prior art such as fast wear and short life of the seal ring, and the clamping structure is likely to cause damage to the wafer.

[0007] To achieve the above purpose, the present invention provides the following technical solutions:

[0008] A clamping mechanism includes a swing clamping assembly, a cover body assembly, a transmission assembly, and a driving assembly;

[0009] The driving assembly is arranged on the cover body assembly, and the driving assembly is drivingly connected to the swing clamping assembly through the transmission assembly, so that the swing clamping assembly switches between a clamping state and a releasing state;

[0010] A cover body chamber is arranged inside the cover body assembly; the transmission assembly is located in the cover body chamber;

[0011] A part of the swing clamping assembly is located in the cover body chamber, and another part extends out of the cover body chamber; the swing clamping assembly includes a sealing diaphragm for sealing the cover body chamber.

[0012] In any of the above technical solutions, optionally, the swing clamping assembly further includes a clamping rod, a support, and a swing rod;

[0013] The support is fixedly connected to the cover assembly, the swing rod is pivotally connected to the support, and the transmission assembly is connected to the swing rod;

[0014] The sealing diaphragm includes a sealing film portion and a sealing connection column portion fixedly provided at the center of the sealing film portion;

[0015] The sealing film portion is sealingly connected to the cover assembly to seal the cover chamber;

[0016] The top of the sealing connection column portion is fixedly connected to the swing rod, and the bottom of the sealing connection column portion is fixedly connected to the clamping rod; the sealing connection column portion is arranged at an angle with the transmission assembly.

[0017] In any of the above technical solutions, optionally, the swing clamping assembly further includes a gland configured to press the sealing film portion; the gland is fixedly connected to the support;

[0018] The material of the sealing film portion is polytetrafluoroethylene or silica gel;

[0019] The shape of the sealing film portion is double U-shaped;

[0020] Optionally, a rotating shaft for pivotally connecting the top of the swing rod is provided on the support; the bottom of the swing rod is inserted into the top of the sealing connection column portion; the side portion of the swing rod is hinged to the transmission assembly.

[0021] In any of the above technical solutions, optionally, the number of the swing clamping assemblies is multiple; the multiple swing clamping assemblies are arranged along the circumferential direction of the driving assembly;

[0022] The transmission assembly includes a connecting rod and a sliding sleeve; the number of the connecting rods corresponds to the number of the swing clamping assemblies; the multiple connecting rods are arranged on the circumference of the sliding sleeve;

[0023] One end of the connecting rod is hinged to the sliding sleeve, and the other end of the connecting rod is hinged to the swing clamping assembly;

[0024] The driving assembly is drivingly connected to the sliding sleeve.

[0025] In any of the above technical solutions, optionally, a guide shaft is fixedly provided on the cover assembly; the sliding sleeve is sleeved on the guide shaft, and the sliding sleeve can reciprocally move along the axial direction of the guide shaft.

[0026] In any of the above technical solutions, optionally, an elastic member is sleeved on the guiding shaft; the elastic member is located between the cover assembly and the sliding sleeve; the elastic member has a tendency to move the sliding sleeve away from the cover assembly;

[0027] Optionally, the elastic member is a spring.

[0028] In any of the above technical solutions, optionally, the cover assembly includes a sealing cover and a bracket; the bracket is fixed above the sealing cover, and the bracket and the sealing cover form the cover chamber;

[0029] The driving assembly is fixed on the bracket;

[0030] The sealing diaphragm is connected to the sealing cover to seal the cover chamber.

[0031] In any of the above technical solutions, optionally, an upper cover is fixedly connected above the bracket;

[0032] The driving assembly is arranged in the cavity formed by the upper cover and the bracket;

[0033] The material of the sealing cover is transparent organic glass.

[0034] In any of the above technical solutions, optionally, the cover assembly is fixedly connected with a plurality of positioning columns;

[0035] The positioning columns and a part of the swing clamping assembly extending out of the cover chamber are located on the same surface of the cover assembly;

[0036] The driving assembly includes a cylinder, a hydraulic cylinder or a motor.

[0037] An electrochemical deposition device includes a clamping mechanism.

[0038] The beneficial effects of the present invention mainly lie in:

[0039] For the clamping mechanism and the electrochemical deposition device provided by the present invention, the driving assembly drives the transmission assembly, and then the transmission assembly drives the swing clamping assembly, so that the swing clamping assembly switches between the clamping state and the releasing state. This driving method improves the flexibility of the movement of the clamping assembly through the transmission assembly, and reduces the damage problem of the clamped articles to a certain extent; when the cover assembly is used to connect with other structures and a vacuum chamber is formed below the cover assembly, the sealing diaphragm can effectively seal the cover chamber, so that the cover chamber is not communicated with the vacuum chamber; the sealing diaphragm is a diaphragm sealing structure without a sealing ring, which has good sealing effect, no wear, no pollution and long service life, and at the same time, the movement of the swing clamping assembly is realized through the deformation of the diaphragm to clamp or release the articles without vacuum leakage.

[0040] To make the above objects, features, and advantages of the present application more obvious and understandable, the following specifically gives preferred embodiments and, in conjunction with the accompanying drawings, makes a detailed description as follows. Description of the Drawings

[0041] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0042] Figure 1 Structural schematic diagram of the clamping mechanism provided by the embodiment of the present invention;

[0043] Figure 2 Top view of the clamping mechanism provided by the embodiment of the present invention;

[0044] Figure 3 Bottom view of the clamping mechanism provided by the embodiment of the present invention;

[0045] Figure 4 Structural schematic diagram of the swing clamping assembly and the cover body assembly provided by the embodiment of the present invention;

[0046] Figure 5 Structural schematic diagram of the swing clamping assembly provided by the embodiment of the present invention;

[0047] Figure 6 Structural schematic diagram of the sealing diaphragm provided by the embodiment of the present invention.

[0048] Reference numerals: 100 - swing clamping assembly; 110 - clamping rod; 120 - rotating shaft; 130 - gland; 140 - sealing diaphragm; 141 - sealing film part; 142 - sealing connection column part; 150 - support; 160 - swing rod;

[0049] 200 - cover body assembly; 210 - sealing cover; 220 - bracket; 240 - upper cover; 250 - guide shaft;

[0050] 300 - transmission assembly; 310 - connecting rod; 320 - sliding sleeve; 400 - elastic member; 500 - driving assembly; 600 - positioning post. Detailed Embodiments

[0051] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0052] Therefore, the detailed description of the embodiments of the present invention provided in the drawings below is not intended to limit the scope of the claimed invention, but is merely representative of selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0053] It should be noted that like reference numerals and letters denote like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

[0054] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the inventive product is customarily placed during use. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and should not be construed as indicating or implying relative importance.

[0055] In addition, the terms "horizontal", "vertical", "overhanging", etc. do not mean that the component is required to be absolutely horizontal or overhanging, but may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but may be slightly inclined.

[0056] In the description of the present invention, it should also be noted that unless otherwise clearly defined and limited, the terms "set", "installed", "connected", "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0057] The following will describe in detail some embodiments of the present invention in conjunction with the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0058] Embodiment

[0059] This embodiment provides a clamping mechanism and an electrochemical deposition device; please refer to Figures 1-6 , Figure 1 which is a half-sectional schematic view of the clamping mechanism provided in this embodiment; Figure 2 which is a top view of the clamping mechanism provided in this embodiment, and structures such as the bracket, the upper cover, and the driving assembly are not shown in the figure; Figure 3 which is a bottom view of the clamping mechanism provided in this embodiment; Figure 4 which is a schematic structural view of the swing clamping assembly and the cover body assembly provided in this embodiment, and only a part of the cover body assembly is shown in the figure; Figure 5 which is a schematic structural view of the swing clamping assembly provided in this embodiment, Figure 6 which is a half-sectional structural view of the sealing diaphragm.

[0060] The clamping mechanism provided in this embodiment is used for clamping sheet-like objects in a vacuum environment, such as clamping wafers in a vacuum environment. The clamping mechanism provided in this embodiment can be applied to electrochemical deposition equipment and can also be extended to wet cleaning equipment, and has a broad application market prospect.

[0061] Referring to Figures 1-6 as shown, the clamping mechanism includes a swing clamping assembly 100, a cover body assembly 200, a transmission assembly 300, and a driving assembly 500. Among them, the swing clamping assembly 100 is used for clamping objects.

[0062] The driving assembly 500 is arranged on the cover body assembly 200, and the driving assembly 500 is drivingly connected to the swing clamping assembly 100 through the transmission assembly 300, so that the swing clamping assembly 100 can be switched between a clamping state and a loosening state; for example, the fixed end of the driving assembly 500 is fixedly connected to the cover body assembly 200, and the driving end of the driving assembly 500 drives the swing clamping assembly 100 to clamp or loosen the object through the transmission assembly 300. The object in this embodiment can be a sheet-like object or its analog, such as a wafer.

[0063] A cover body chamber is arranged inside the cover body assembly 200; the transmission assembly 300 is located in the cover body chamber.

[0064] A part of the swing clamping assembly 100 is located in the cover body chamber, and the other part extends out of the cover body chamber; the swing clamping assembly 100 includes a sealing diaphragm 140 for sealing the cover body chamber.

[0065] In this embodiment, the clamping mechanism drives the transmission component 300 through the driving component 500, and then drives the swing clamping component 100 through the transmission component 300, so that the swing clamping component 100 switches between the clamping state and the releasing state. This driving method improves the flexibility of the movement of the swing clamping component 100 through the transmission component 300, and reduces the damage problem of the clamped items to a certain extent; when the cover body component 200 is used to connect with other structures and form a vacuum chamber below the cover body component 200, the sealing diaphragm 140 can effectively seal the cover body chamber, so that the cover body chamber is not communicated with the vacuum chamber; the sealing diaphragm 140 is a diaphragm sealing structure without a sealing ring, which has good sealing effect, no wear, no pollution and long service life. At the same time, the swing clamping component 100 moves to clamp or release the items through the deformation of the diaphragm without vacuum leakage.

[0066] See Figures 1-6 As shown, in an alternative embodiment of the present embodiment, the swing clamping component 100 further includes a clamping rod 110, a support 150 and a swing rod 160. The clamping rod 110 is used for clamping items.

[0067] The support 150 is fixedly connected to the cover body component 200. For example, the support 150 is fixed on the cover body component 200 by means of screwing, bonding, clamping, etc.

[0068] The swing rod 160 is pivotally connected to the support 150, that is, the swing rod 160 rotates around the support 150.

[0069] The transmission component 300 is connected to the swing rod 160; optionally, the transmission component 300 is hinged to the swing rod 160. By hinging the transmission component 300 to the swing rod 160, the flexibility of the transmission component 300 to drive the swing clamping component 100 to move is improved, and the damage problem of the clamped items is reduced to a certain extent.

[0070] Optionally, the sealing diaphragm 140 includes a sealing diaphragm portion 141 and a sealing connection column portion 142 fixedly arranged at the center of the sealing diaphragm portion 141.

[0071] Optionally, the sealing diaphragm portion 141 is sealingly connected to the cover body component 200 to seal the cover body chamber.

[0072] Optionally, the top of the sealing connection column portion 142 is fixedly connected to the swing rod 160, and the bottom of the sealing connection column portion 142 is fixedly connected to the clamping rod 110; the sealing connection column portion 142 is arranged at an angle with the transmission component 300. For example, the angle between the sealing connection column portion 142 and the transmission component 300 is 80 degrees - 130 degrees, such as 85 degrees, 90 degrees, 100 degrees, 110 degrees, etc.

[0073] In this embodiment, the driving component 500 drives and connects the swing rod 160 through the transmission component 300, so that the swing rod 160 swings around the support 150, thereby driving the sealing connection column part 142 to swing around the support 150, and further driving the clamping rod 110 to swing around the support 150 to clamp or release an object, realizing the clamping and releasing of the wafer.

[0074] In this embodiment, the support 150 and the swing rod 160 are located inside the cover body chamber; the sealing connection column part 142 is located outside the cover body chamber; the clamping rod 110 is located outside the cover body chamber, for example, inside a vacuum chamber outside the cover body chamber.

[0075] See Figures 4-6 As shown, in an alternative of this embodiment, the swing clamping assembly 100 further includes a gland 130 configured to press the sealing film part 141; the gland 130 is fixedly connected to the support 150; through the gland 130, the sealing film 140 is pressed to seal the cover body chamber, that is, the sealing film 140 seals the vacuum chamber, so that the upper and lower spaces of the sealing film 140 are not communicated with each other, achieving sealing.

[0076] Optionally, the material of the sealing film part 141 is polytetrafluoroethylene or silica gel, or other flexible materials. Among them, the English name of polytetrafluoroethylene is Poly tetra fluoroethylene, abbreviated as PTFE.

[0077] Optionally, the shape of the sealing film part 141 is double U-shaped; by adopting the double U-shaped flexible structure for the sealing film part 141, the sealing connection column part 142 can move axially and radially, and the double U-shaped flexible structure has a sealing boss, with better sealing effect.

[0078] Optionally, a rotating shaft 120 for pivotally connecting the top of the swing rod 160 is provided on the support 150, that is, the swing rod 160 is installed on the support 150 through the rotating shaft 120, and by rotating the swing rod 160 around the rotating shaft 120, the clamping rod 110 can be driven to swing.

[0079] Optionally, the bottom of the swing rod 160 is inserted into the top of the sealing connection column part 142; the side of the swing rod 160 is hinged to the transmission component 300.

[0080] See Figures 1-4 As shown, in an alternative of this embodiment, the number of the swing clamping assemblies 100 is multiple; the multiple swing clamping assemblies 100 are arranged circumferentially along the driving component 500. Optionally, the multiple swing clamping assemblies 100 are evenly arranged circumferentially along the driving component 500. Optionally, the number of the swing clamping assemblies 100 is 3, 4 or 6, or other numbers.

[0081] Optionally, the number of the swing clamping assemblies 100 is four, and the four swing clamping assemblies 100 are symmetrically mounted on the cover assembly 200 to better clamp the wafer.

[0082] Optionally, the driving assembly 500 is drivingly connected to the sliding sleeve 320. The transmission assembly 300 includes a connecting rod 310 and a sliding sleeve 320; the number of the connecting rods 310 corresponds to the number of the swing clamping assemblies 100, for example, when the number of the swing clamping assemblies 100 is 4, the number of the connecting rods 310 is 4.

[0083] A plurality of connecting rods 310 are arranged on the circumference of the sliding sleeve 320; optionally, the plurality of connecting rods 310 are evenly arranged on the circumference of the sliding sleeve 320. Through the sliding sleeve 320, the driving assembly 500 transmits the driving force to the plurality of connecting rods 310, so that the swing clamping assembly 100 can be better clamped or loosened.

[0084] Optionally, one end of the connecting rod 310 is hinged to the sliding sleeve 320, and the other end of the connecting rod 310 is hinged to the swing clamping assembly 100, forming a similar connecting rod mechanism, and the movement of the sliding sleeve 320 can drive the movement of the clamping rod 110 in the swing clamping assembly 100 through the connecting rod 310, so as to achieve the clamping and releasing of objects such as wafers. Optionally, under the drive of the driving assembly 500, the sliding sleeve 320 moves downward in the vertical direction.

[0085] See also Figure 1 As shown, in an optional solution of this embodiment, a guide shaft 250 is fixedly provided on the cover assembly 200; the sliding sleeve 320 is sleeved on the guide shaft 250, and the sliding sleeve 320 can reciprocate along the axial direction of the guide shaft 250. For example, the axial direction of the guide shaft 250 is the vertical direction. The guide shaft 250 is used to guide the movement direction of the sliding sleeve 320 to ensure the stability of the swing clamping assembly 100 in clamping the object.

[0086] See also Figure 1 As shown, in an optional scheme of this embodiment, an elastic member 400 is provided on the outer sleeve of the guide shaft 250; the elastic member 400 is located between the cover body assembly 200 and the sliding sleeve 320; the elastic member 400 has a tendency to make the sliding sleeve 320 move away from the cover body assembly 200; through the elastic member 400, when the driving assembly 500 withdraws the driving force, the sliding sleeve 320 can be reset under the action of the elastic potential energy of the elastic member 400 and drive the transmission assembly 300 to reset, such as clamping an object.

[0087] Optionally, the elastic member 400 is a spring, or other elastic members.

[0088] See also Figures 1-4As shown, in an alternative solution of this embodiment, the cover assembly 200 includes a sealing cover 210 and a bracket 220; the bracket 220 is fixed above the sealing cover 210, and the bracket 220 and the sealing cover 210 form a cover cavity; through the sealing cover 210 and the bracket 220, it is convenient for the production and processing of the cover assembly 200.

[0089] The driving assembly 500 is fixed on the bracket 220.

[0090] The sealing diaphragm 140 is connected to the sealing cover 210 to seal the cover cavity.

[0091] Optionally, the material of the sealing cover 210 is transparent organic glass. By using transparent organic glass as the material of the sealing cover 210, it is convenient for observation; for example, when the sealing cover 210 covers the vacuum chamber, by using transparent organic glass material, it is convenient to observe the wafers in the vacuum chamber.

[0092] See Figures 1-3 As shown, in an alternative solution of this embodiment, an upper cover 240 is fixedly connected above the bracket 220.

[0093] The driving assembly 500 is arranged in the cavity formed by the upper cover 240 and the bracket 220; through the upper cover 240, the driving assembly 500 is protected.

[0094] See Figures 1-3 As shown, in an alternative solution of this embodiment, several positioning posts 600 are fixedly connected to the cover assembly 200. Optionally, the number of the positioning posts 600 is 3, 4 or 6, or other numbers. The positioning posts 600 are used for positioning articles, such as for positioning wafers.

[0095] The part of the positioning post 600 that extends out of the cover cavity and the swing clamping assembly 100 are located on the same surface of the cover assembly 200; by positioning the article with the positioning post 600, it is prevented that the article tilts during clamping, resulting in clamping failure.

[0096] Optionally, the driving assembly 500 includes a cylinder, a hydraulic cylinder or a motor, or other methods are adopted.

[0097] In this embodiment, when the clamping mechanism clamps the wafer, by adopting a double-U-shaped flexible structure for the sealing diaphragm 140, the sealing between the inside and outside of the cover cavity and the vacuum cavity is realized during the wafer clamping process, ensuring the vacuum degree in the vacuum cavity. At the same time, by using the positioning post 600 for positioning and driven by the elastic member 400, the transmission assembly 300 is driven to realize the flexible clamping of the wafer, avoiding damage to the wafer.

[0098] In the clamping mechanism described in this embodiment, a diaphragm sealing structure without a sealing ring is adopted between the swing clamping assembly 100 and the sealing cover 210 - the sealing diaphragm 140. The movement of the clamping rod 110 is realized through the deformation of the sealing diaphragm 140 while ensuring the vacuum degree of the cavity. The swing clamping assembly 100 is connected to the sliding sleeve 320 through the connecting rod 310 to form a connecting rod mechanism. The sliding sleeve 320 can move up and down in the vertical direction along the guiding shaft 250. The loosening of the clamping rod 110 is completed by the driving assembly 500 pushing the sliding sleeve 320 downward and driving the swing clamping assembly 100 to move through the transmission assembly 300. The elastic member 400 is used to push the sliding sleeve 320 upward, and the swing clamping assembly 100 is driven through the transmission assembly 300 to achieve flexible clamping of the wafer, avoiding damage to the wafer.

[0099] The movement process of the clamping mechanism described in this embodiment is, for example: First, the driving end of the driving assembly 500 extends, pushing the sliding sleeve 320 to move downward in the vertical direction. The connecting rod 310 of the transmission assembly 300 drives the swing clamping assembly 100 to open all the clamping rods 110. The overall wafer clamping mechanism moves to the wafer clamping position, the electromagnetic valve changes direction, and the driving end of the driving assembly 500 retracts. At the same time, the elastic member 400 is used to make the sliding sleeve 320 move upward in the vertical direction. The connecting rod 310 drives the swing clamping assembly 100 to close all the clamping rods 110 to clamp the wafer to be processed. The sealing cover 210 is attached to the vacuum chamber, the inside of the chamber is evacuated, and the vacuum degree is maintained. After reaching the process treatment time, the pressure in the chamber is released, and the driving end of the driving assembly 500 drives the clamping rod 110 to open again to take out the wafer.

[0100] This embodiment also provides an electrochemical deposition device, including the clamping mechanism described in any of the above embodiments. In the electrochemical deposition device, the driving assembly 500 of the clamping mechanism drives the transmission assembly 300, and then the transmission assembly 300 drives the swing clamping assembly 100 to switch the swing clamping assembly 100 between the clamping state and the loosening state. This driving method improves the flexibility of the movement of the swing clamping assembly 100 through the transmission assembly 300, and reduces the problem of damage to the clamped object to a certain extent; when the cover body assembly 200 is used to connect to other structures and form a vacuum chamber below the cover body assembly 200, the sealing diaphragm 140 can effectively seal the cover body chamber, realizing that the cover body chamber is not connected to the vacuum chamber; the sealing diaphragm 140 is a diaphragm sealing structure without a sealing ring, which has good sealing effect, no wear, no pollution and long service life. At the same time, the movement of the swing clamping assembly 100 is realized through the deformation of the diaphragm to clamp or loosen the object without vacuum leakage.

[0101] The electrochemical deposition equipment provided in this embodiment includes the above-mentioned clamping mechanism. The technical features of the clamping mechanism disclosed above are also applicable to this electrochemical deposition equipment, and the technical features of the clamping mechanism already disclosed will not be described repeatedly. In this embodiment, the electrochemical deposition equipment has the advantages of the above-mentioned clamping mechanism, and the advantages of the clamping mechanism already disclosed will not be described repeatedly here.

[0102] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A clamping mechanism, characterized in that, It includes a swing clamping assembly (100), a cover assembly (200), a transmission assembly (300) and a drive assembly (500); The drive assembly (500) is arranged on the cover assembly (200), and the drive assembly (500) is drivingly connected to the swing clamping assembly (100) through the transmission assembly (300) so that the swing clamping assembly (100) switches between a clamping state and a releasing state; There is a cover chamber inside the cover assembly (200); the transmission assembly (300) is located in the cover chamber; A part of the swing clamping assembly (100) is located in the cover chamber, and another part extends out of the cover chamber; the swing clamping assembly (100) includes a sealing diaphragm (140) for sealing the cover chamber; The swing clamping assembly (100) further includes a clamping rod (110), a support (150) and a swing rod (160); The support (150) is fixedly connected to the cover assembly (200), the swing rod (160) is pivotally connected to the support (150), and the transmission assembly (300) is connected to the swing rod (160); The sealing diaphragm (140) includes a sealing film portion (141) and a sealing connection column portion (142) fixedly arranged at the center of the sealing film portion (141); The sealing film portion (141) is sealingly connected to the cover assembly (200) to seal the cover chamber; The top of the sealing connection column portion (142) is fixedly connected to the swing rod (160), and the bottom of the sealing connection column portion (142) is fixedly connected to the clamping rod (110); the sealing connection column portion (142) is arranged at an angle with the transmission assembly (300).

2. The clamping mechanism according to claim 1, wherein, The swing clamping assembly (100) further includes a gland (130) configured to press the sealing film portion (141); the gland (130) is fixedly connected to the support (150); The material of the sealing film portion (141) is polytetrafluoroethylene or silica gel; The shape of the sealing film portion (141) is double U-shaped.

3. The clamping mechanism according to claim 1, wherein There is a rotating shaft (120) on the support (150) for pivotally connecting the top of the swing rod (160); the bottom of the swing rod (160) is inserted into the top of the sealing connection column portion (142); the side of the swing rod (160) is hinged to the transmission assembly (300).

4. The clamping mechanism according to claim 1, characterized in that, The number of the swing clamping assemblies (100) is multiple; multiple swing clamping assemblies (100) are arranged along the circumference of the drive assembly (500); The transmission assembly (300) includes a connecting rod (310) and a sliding sleeve (320); the number of the connecting rods (310) corresponds to the number of the swing clamping assemblies (100); multiple connecting rods (310) are arranged on the circumference of the sliding sleeve (320); One end of the connecting rod (310) is hinged to the sliding sleeve (320), and the other end of the connecting rod (310) is hinged to the swing clamping assembly (100); The drive assembly (500) is drivingly connected to the sliding sleeve (320).

5. The clamping mechanism according to claim 4, characterized in that, A guide shaft (250) is fixedly arranged on the cover assembly (200); the sliding sleeve (320) is sleeved on the guide shaft (250), and the sliding sleeve (320) can reciprocate axially along the guide shaft (250).

6. The clamping mechanism according to claim 5, wherein An elastic member (400) is sleeved on the guide shaft (250); the elastic member (400) is located between the cover assembly (200) and the sliding sleeve (320); the elastic member (400) has a tendency to move the sliding sleeve (320) away from the cover assembly (200). The elastic member (400) is a spring.

7. The clamping mechanism according to claim 1, characterized in that, The cover assembly (200) includes a sealing cover (210) and a bracket (220); the bracket (220) is fixed above the sealing cover (210), and the bracket (220) and the sealing cover (210) form the cover chamber. The driving assembly (500) is fixed on the bracket (220). The sealing diaphragm (140) is connected to the sealing cover (210) to seal the cover chamber.

8. The clamping mechanism according to claim 7, characterized in that An upper cover (240) is fixedly connected above the bracket (220). The driving assembly (500) is arranged in the cavity formed by the upper cover (240) and the bracket (220). The material of the sealing cover (210) is transparent organic glass.

9. The clamping mechanism according to claim 1, wherein, The cover assembly (200) is fixedly connected with a plurality of positioning columns (600). The positioning columns (600) and a part of the swing clamping assembly (100) extending out of the cover chamber are located on the same surface of the cover assembly (200). The driving assembly (500) includes a cylinder, a hydraulic cylinder or a motor.

10. An electrochemical deposition device, characterized in that, It includes the clamping mechanism according to any one of claims 1-9.

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