Capacitive pressure module, manufacturing method thereof, and electronic device

Abstract

The application is suitable for the technical field of printed circuit board, and provides a manufacturing method of a pressure-capacitance module, comprising the following steps: providing a flexible circuit board and a sub-board for pressure sensing, wherein a first pad is arranged on a board surface of the flexible circuit board; arranging conductive glue on the sub-board or the first pad corresponding to the first pad; and aligning and pressing the sub-board and the flexible circuit board, wherein the conductive glue is used to bond the sub-board and the first pad, and a gap with a preset height is arranged between the sub-board and the board surface of the flexible circuit board. The application further provides a pressure-capacitance module and an electronic device. The pressure-capacitance module and the manufacturing method thereof can improve the consistency of the gap and the consistency of the capacitance value in the pressure-capacitance module, and improve the product yield.

Description

Technical Field

[0001] This application relates to the field of printed circuit board manufacturing technology, and in particular to a voltage-capacitor module and its manufacturing method, as well as an electronic device. Background Technology

[0002] The pressure-capacitive module used in True Wireless Stereo (TWS) earbuds works by applying external pressure, causing a slight change in the gap value (GAP value) between the modules. This change in GAP value alters the capacitance, and the signal is transmitted to a chip for processing and corresponding operations. This achieves pressure sensing and control interaction, thus enabling the operation of the earbuds. The pressure-capacitive module consists of a pressure sensor and a flexible printed circuit (FPC), with the gap value between them being the core control point for this type of module.

[0003] In existing technologies, the pressure sensing daughterboard is soldered onto a flexible circuit board using SMT (Surface Mount Technology). The gap between the two is controlled by the thickness of the solder paste at both ends. The main manufacturing challenges are: maintaining the gap value within a reasonable range after soldering; controlling the thickness difference of the solder joints at both ends to a minimum to prevent tilting, ensuring the capacitance value of the voltage-capacitor module meets design requirements, and achieving high capacitance consistency. However, in reality, the solder paste must melt during the SMT reflow soldering process. In this case, it is difficult to control the consistency of the solder joint height at both ends, thus making it difficult to ensure the consistency of the gap value and capacitance value in the voltage-capacitor module, affecting product performance.

[0004] In addition, the daughterboard and flexible circuit board are small in size, requiring separate monitoring of their warpage and deformation rate after SMT, and the flatness requirements are extremely high. Because the daughterboard and / or flexible circuit board may deform due to heat during the soldering process, common defects during the assembly process include cold solder joints, floating, and misalignment, resulting in a low product yield. Summary of the Invention

[0005] In view of this, this application provides a pressure-capacitance module and its manufacturing method and electronic device, which can ensure the consistency of gap and capacitance value in the pressure-capacitance module, reduce deformation rate and improve product yield.

[0006] An embodiment of the first aspect of this application provides a method for manufacturing a pressure-capacity module, including:

[0007] A flexible circuit board and a sub-board for pressure sensing are provided, wherein a first pad is provided on the surface of the flexible circuit board;

[0008] Conductive adhesive is applied to the sub-board at the location corresponding to the first pad or on the first pad.

[0009] The sub-board and the flexible circuit board are aligned and pressed together, wherein the conductive adhesive bonds the sub-board and the first pad, and there is a predetermined gap between the surfaces of the sub-board and the flexible circuit board.

[0010] In one embodiment, when conductive adhesive is applied to the subboard at the location corresponding to the first pad or on the first pad, the thickness of the conductive adhesive is greater than or equal to a preset height value of the gap.

[0011] In one embodiment, the alignment and pressing of the sub-board and the flexible circuit board includes:

[0012] The sub-board is bonded to the flexible circuit board using an automatic reinforcement machine;

[0013] A vacuum press is used to press the sub-board and the flexible circuit board together to assemble them into a press-capacitor module.

[0014] The pressure-capacitance module is baked in an oven to cure the conductive adhesive.

[0015] In one embodiment, before aligning and pressing the sub-board with the flexible circuit board, the manufacturing method further includes: providing an auxiliary film on the side of the flexible circuit board opposite to the sub-board, wherein the auxiliary film is provided between at least two adjacent first pads;

[0016] In one embodiment, after the sub-board and the flexible circuit board are aligned and pressed together, the manufacturing method further includes removing the auxiliary film.

[0017] In one embodiment, the thickness of the auxiliary membrane is equal to the preset height value of the gap.

[0018] In one embodiment, the flexible circuit board includes a circuit area and a board edge area surrounding the outside of the circuit area, and the circuit area includes a plurality of circuit board units, each of the circuit board units having a pair of first pads for pressing with a sub-board; the auxiliary film simultaneously covers the board edge area and the circuit area, and the auxiliary film has a window portion that exposes the first pads and pressing marks for pressing alignment.

[0019] In one embodiment, the two ends of the auxiliary film are respectively attached to the edge area of ​​the plate.

[0020] In one embodiment, the auxiliary film exposes a plurality of first pads at both ends along its width direction, and the window portion of the auxiliary film is located in the middle of the auxiliary film and exposes the remaining first pads.

[0021] The second aspect of this application provides a pressure-capacity module, which is manufactured using the pressure-capacity module manufacturing method described in the first aspect.

[0022] An embodiment of the third aspect of this application provides a pressure-capacitance module, comprising: a flexible circuit board and a sub-board for pressure sensing, wherein the flexible circuit board is provided with a first pad, and the sub-board is fixed to the first pad by conductive adhesive; a gap with a preset height is formed between the sub-board and the flexible circuit board.

[0023] An embodiment of the fourth aspect of this application provides an electronic device including a voltage-capacitor module as described in the second or third aspect.

[0024] The aforementioned method for manufacturing the voltage-capacitor module utilizes conductive adhesive to bond the first pads of the daughter board and the flexible circuit board, replacing the traditional SMT solder paste mounting process and solving the problem of uncontrollable solder paste thickness in the SMT solder paste mounting process. Therefore, this manufacturing method can precisely control the gap between the daughter board and the flexible circuit board, resulting in a voltage-capacitor module with good gap consistency and capacitance value consistency, thus improving product performance. Simultaneously, the manufacturing method provided in this application eliminates the need for a soldering process, effectively avoiding the problem of deformation of the daughter board or flexible circuit board due to heat, and solving the problem of low product yield caused by easy warping and deformation of the daughter board and flexible circuit board.

[0025] The capacitor-voltage module provided in this application uses conductive adhesive to bond the daughterboard and the flexible circuit board. Because the thickness of the conductive adhesive is easy to control, the capacitor-voltage module can use conductive adhesive to assemble the daughterboard and the flexible circuit board and precisely control the gap height, replacing the traditional SMT solder paste mounting process and solving the problem of uncontrollable solder paste thickness in the SMT solder paste mounting process. Therefore, the gap consistency of the capacitor-voltage module is good, and the capacitance value consistency of the capacitor-voltage module is also good. Furthermore, the capacitor-voltage module is not easily deformed during manufacturing, resulting in a good yield. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a flowchart of the manufacturing method of the pressure-capacity module provided in the embodiments of this application;

[0028] Figure 2 This is a schematic diagram of the structure of the pressure-capacity module provided in the embodiments of this application;

[0029] Figure 3 This is a flowchart of the pressing step in the manufacturing method of the pressing module provided in this application embodiment;

[0030] Figure 4 This is a schematic diagram of the flexible circuit board and auxiliary film provided in this application;

[0031] Figure 5 yes Figure 4 The cross-sectional view of the flexible circuit board and auxiliary film along line BB is shown.

[0032] Figure 6 This is a schematic diagram of the structure of a pressure-capacity module provided in another embodiment of this application.

[0033] The markings in the diagram mean:

[0034] 100. Capacitor module; 10. Flexible circuit board; 11. First pad; 101. Circuit area; 111. Circuit board unit; 102. Board edge area; 20. Sub-board; 30. Conductive adhesive; 40. Auxiliary film; 41. Window opening; 50. Reinforcing plate. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0036] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly or indirectly attached to that other component. When a component is referred to as being "connected to" another component, it can be directly or indirectly connected to that other component. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality of" means two or more, unless otherwise expressly and specifically defined.

[0037] It should also be noted that in the embodiments of this application, the same reference numerals are used to represent the same component or part. For the same part in the embodiments of this application, the reference numerals may only be used to mark one part or component as an example. It should be understood that the reference numerals are also applicable to other identical parts or components.

[0038] To illustrate the technical solution of this application, the following description is provided in conjunction with specific accompanying drawings and embodiments.

[0039] The first aspect of this application provides a method for manufacturing a pressure-capacity module. Please refer to... Figure 1 and Figure 2 The manufacturing method of the pressure-capacity module 100 includes:

[0040] Step S110: Provide a flexible circuit board 10 and a sub-board 20 for pressure sensing, wherein the flexible circuit board 10 is provided with a first pad 11.

[0041] Specifically, two first pads 11 are disposed opposite to each other and spaced apart on the surface of the flexible circuit board 10 for fixing and electrically connecting the sub-board 20. It can be understood that the number of first pads 11 may also be more than two.

[0042] The sub-board 20 can be a steel sheet or a printed circuit board (PCB). If the sub-board 20 is a steel sheet, a steel sheet of the designed size can be directly selected; if the sub-board 20 is a PCB, the PCB is prefabricated according to the preset circuit pattern. The PCB has a second pad (not shown) corresponding to the first pad 11. It can be understood that the PCB also has lines for conducting or transmitting signals, but is not limited to this.

[0043] Step S120: Apply conductive adhesive 30 to the first pad 11 on the subboard 20 or on the first pad 11.

[0044] The conductive adhesive 30 is a colloid that is conductive and has adhesive properties, such as a thermosetting conductive adhesive or an anisotropic conductive film. This application does not limit the material of the conductive adhesive 30.

[0045] When applying conductive adhesive 30 to the sub-board 20, if the sub-board 20 is a steel sheet, the conductive adhesive 30 is applied directly to the side of the steel sheet facing the flexible circuit board 10; if the sub-board 20 is a PCB, the conductive adhesive 30 is applied to the second pad. Alternatively, the conductive adhesive 30 can be applied directly to the first pad 11, for example, by coating or attaching the conductive adhesive 30 to the first pad 11.

[0046] Step S130: Align and press the sub-board 20 with the flexible circuit board 10, wherein the conductive adhesive 30 bonds the sub-board 20 and the first pad 11, and there is a gap of a preset height between the sub-board 20 and the surface of the flexible circuit board 10.

[0047] Specifically, the sub-board 20 is mounted on the flexible circuit board 10, and the sub-board 20 and the flexible circuit board 10 are aligned and pressed together. The conductive adhesive 30 located between the first pad 11 and the sub-board 20 can bond the sub-board 20 and the first pad 11 to complete the assembly of the pressure-capacitance module 100. The "gap" refers to the gap between the surface of the sub-board 20 facing the flexible circuit board 10 and the surface of the flexible circuit board 10 on which the first pad 11 is provided.

[0048] The pressure-capacitor module 100 manufactured by the above method includes a flexible circuit board 10 and a daughter board 20. A first pad 11 is provided on the flexible circuit board 10, and conductive adhesive 30 is disposed between the first pad 11 and the daughter board 20. Because the conductive adhesive 30 has a certain thickness, after assembly, there is a gap of a preset height (H) between the daughter board 20 and the surface of the flexible circuit board 10. Figure 2(as shown in part A) to enable the pressure-capacitance module 100 to obtain a certain capacitance value. During use, the sub-board 20 can deform towards the flexible circuit board 10 under force, causing the height of the gap between the sub-board 20 and the flexible circuit board 10 to change, thereby changing the capacitance value of the pressure-capacitance module 100. The flexible circuit board 10 determines the pressure detection result based on the change in capacitance value.

[0049] The aforementioned method for manufacturing the voltage-capacitor module 100 utilizes conductive adhesive 30 to bond the first pad 11 of the sub-board 20 and the flexible circuit board 10, replacing the traditional SMT solder paste mounting process and solving the problem of uncontrollable solder paste thickness in the SMT solder paste mounting process. Therefore, this manufacturing method can precisely control the gap between the sub-board 20 and the flexible circuit board 10, resulting in a voltage-capacitor module 100 with good gap consistency and capacitance value consistency, thus improving product performance. Simultaneously, the manufacturing method provided in this application eliminates the need for a soldering process, effectively preventing the sub-board 20 or the flexible circuit board 10 from deforming due to heat, and solving the problem of low product yield caused by the sub-board 20 and the flexible circuit board 10 easily warping and deforming.

[0050] Optionally, when conductive adhesive 30 is applied to the first pad 11 on the subboard 20, the thickness of the conductive adhesive 30 is greater than or equal to the preset height value of the gap.

[0051] Specifically, the thickness of the conductive adhesive 30 should be reasonably set according to its material, its fluidity during pressing, and the preset height value, so that the conductive adhesive 30, after pressing, covers and adheres to the first pad 11 without overflowing the edge of the flexible circuit board 10 or the sub-board 20. If the conductive adhesive 30 has high fluidity (deformation) during pressing, resulting in a large change in thickness before and after pressing, the thickness of the conductive adhesive 30 needs to be greater than the gap value to ensure that the thickness of the conductive adhesive 30 after pressing matches the preset gap value. If the conductive adhesive 30 has low fluidity during pressing, resulting in almost no change in thickness before and after pressing, the conductive adhesive 30 can be equal to or slightly greater than the gap value. In this embodiment, a conductive adhesive 30 with lower fluidity is selected, which allows for better control of the height of the gap after pressing.

[0052] In one embodiment, please refer to Figures 1 to 3 Step S130 involves aligning and pressing the daughter board 20 with the flexible circuit board 10, specifically including:

[0053] Step S131: Use an automatic reinforcing machine to attach the sub-board 20 onto the flexible circuit board 10.

[0054] Using an automatic reinforcing machine to mount the sub-board 20 enables high-efficiency and high-precision mounting. Specifically, the flexible circuit board is equipped with marking points, which are optical identification points. The automatic reinforcing machine aligns with these optical identification points and automatically picks up or grips the sub-board 20 to mount it to the designated position. Before mounting the sub-board 20, the flexible circuit board with the auxiliary film 40 already applied needs to undergo plasma treatment to clean the pads and prevent impurities from affecting the reliability of the conductive adhesive 30 after mounting to the pads.

[0055] Step S132: Use a vacuum press to press the composite board 20 and the flexible circuit board 10 to assemble them into a pressure-capacity module 100.

[0056] Since mounting only pre-fixes the sub-board 20 to the flexible circuit board, pressing is required to ensure the bonding reliability of the flexible circuit board and the sub-board 20. In this embodiment, a vacuum press is used for pressing. During pressing, the sub-board 20 is pressed with its side facing upwards, and release film and pressing cushioning material are also provided on the outside of the flexible circuit board and the sub-board 20.

[0057] Step S133: Bake the pressure molding module 100 in an oven to cure the conductive adhesive 30.

[0058] In this embodiment, the conductive adhesive 30 is a thermosetting conductive adhesive 30, which can be completely cured by baking the pressure-capacity module 100. It can be understood that if the conductive adhesive 30 is of other types, step S133 can be omitted.

[0059] Please refer to Figure 1 , Figure 2 , Figure 4 and Figure 5 In one embodiment, before aligning and pressing the sub-board 20 with the flexible circuit board 10 in step S130, the manufacturing method of the pressure-capacity module 100 further includes: setting an auxiliary film 40 on the side of the flexible circuit board 10 opposite to the sub-board 20; the auxiliary film 40 is at least set between two adjacent first pads 11; after aligning and pressing the sub-board 20 with the flexible circuit board 10 in step S130, the manufacturing method further includes: removing the auxiliary film 40.

[0060] Since the auxiliary film 40 is provided between at least two adjacent first pads 11, the auxiliary film 40 can fill the gap between the sub-board 20 and the flexible circuit board 10 between the two first pads 11, and play the role of supporting the sub-board 20 and dispersing pressure, so as to prevent the sub-board 20 from tilting.

[0061] In this embodiment, before the pressing step, an auxiliary film 40 is provided on the flexible circuit board 10. This allows the auxiliary film 40 to be located at the gap between the flexible circuit board 10 and the sub-board 20 during the pressing step. The auxiliary film 40 can ensure the stability of the gap and support the sub-board 20. During pressing, it can support and disperse the pressure, making the height values ​​at all points in the same gap equal and constant. Therefore, the setting of the auxiliary film 40 can further improve the stability and uniformity of the gap, resulting in a pressure-capacity module 100 with good gap consistency.

[0062] The thickness of the auxiliary film 40 is adapted to the gap after the pressure-capacity module 100 is assembled. Optionally, the thickness of the auxiliary film 40 is equal to the preset height value (H) of the gap, that is, the thickness of the auxiliary film 40 is set according to the height value of the gap required by the design. By setting the auxiliary film 40 of the preset thickness between the flexible circuit board 10 and the sub-board 20 before pressing, the gap position is not easily deformed. It can be understood that the thickness of the auxiliary film 40 can also be slightly smaller than the preset height of the gap, as long as it can support the sub-board 20 during pressing.

[0063] The auxiliary film 40 is a high-temperature resistant film. Thus, during the lamination step, the auxiliary film 40 can withstand high temperatures and is not easily deformed. Optionally, the auxiliary film 40 is a polyimide (PI) film. It is understood that other materials with superior properties to PI films can also be used as the auxiliary film 40 in this application.

[0064] like Figure 4 and Figure 5 As shown, the flexible circuit board 10 includes a circuit area 101 and a board edge area 102 surrounding the outside of the circuit area 101, and the circuit area 101 includes a plurality of circuit board units 111; the auxiliary film 40 covers both the board edge area 102 and the circuit area 101, and the auxiliary film 40 has a window portion 41, which exposes a first pad 11 and a pressing mark for pressing alignment, so as to avoid misalignment of the first pad 11 and the pressing mark.

[0065] In this embodiment, the flexible circuit board 10 has a panel structure, and one flexible circuit board 10 includes multiple circuit board units 111. Panelization is mainly to improve production efficiency; multiple circuit board units can be produced simultaneously from a single panel, and rapid mounting and lamination can be achieved to form multiple capacitor modules 100 products. It can be understood that each circuit board unit 111, after being mounted with its corresponding sub-board 20, forms a capacitor module 100. The shape and number of circuit board units 111 shown in the illustration are for illustrative purposes only.

[0066] In the circuit area 101, the connection area between circuit board units 111 is an auxiliary area. The auxiliary area is provided with pressing marks, i.e., optical identification points, for alignment during automatic reinforcement machine mounting. It is understood that in other embodiments, the pressing marks can also be directly set within the flexible circuit board unit 10.

[0067] It is understandable that the auxiliary film 40 may have openings 41 at positions such as the first pad 11 and the pressing mark.

[0068] In order to provide the window openings 41, the manufacturing method of the pressure-capacity module 100 further includes: cutting the auxiliary film 40 according to the size of the flexible circuit board 10 to form a plurality of window openings 41 on the auxiliary film 40.

[0069] In this way, the cut auxiliary film 40 can be applied to the flexible circuit board 10 as a whole, without the need to set an auxiliary film 40 separately for each circuit board unit 111, thus improving the production efficiency.

[0070] To facilitate pressing and subsequent removal of the auxiliary film 40, only a portion of the auxiliary film 40 may be bonded to the flexible circuit board 10, while other areas remain separated.

[0071] Optionally, the auxiliary film 40 is only adhered to the board edge area 102 for easy removal. In one embodiment, both ends of the auxiliary film 40 are respectively adhered to the board edge area 102. For example, both ends of the auxiliary film 40 along its length direction are respectively adhered to the board edge area 102, or both ends of the auxiliary film 40 along its width direction are respectively adhered to the board edge area 102. In this way, the auxiliary film 40 does not need to be adhered in the gap between the sub-board 20 and the flexible circuit board 10, which facilitates subsequent removal.

[0072] In one embodiment, the auxiliary film 40 is attached to the board edge area 102 at both ends along its length direction, and a plurality of first pads 11 are exposed at both ends along its width direction. The window portion 41 of the auxiliary film 40 is located in the middle of the auxiliary film 40 and exposes the remaining first pads 11.

[0073] Thus, the window portion 41 of the auxiliary film 40 is located in the middle of the auxiliary film 40 and simultaneously corresponds to the first pad 11 of multiple circuit board units 111. Since the entire auxiliary film 40 is attached to the flexible circuit board 10, the window portion 41 is provided in the middle of the auxiliary film 40, which facilitates the cutting of the auxiliary film 40 and the formation of the window portion 41, thereby improving manufacturing efficiency.

[0074] Optionally, the length of the auxiliary film 40 is greater than the length of the circuit area 101, and the width of the auxiliary film 40 is less than the length of the circuit area 101. The auxiliary film 40 is rectangular, with several first pads 11 exposed at both ends along its width direction. The window portion 41 of the auxiliary film 40 is rectangular and exposes the remaining first pads 11. In this way, the size of the window portion 41 is relatively large, the structure of the auxiliary film 40 is simple and easy to cut, and a portion of the auxiliary film 40 is provided between a pair of first pads 11 of each circuit board unit 111 to facilitate lamination.

[0075] It is understood that this application does not limit the shape of the auxiliary film 40. For example, a separate auxiliary film 40 may be provided in each circuit board unit 111, or a number of spaced auxiliary films 40 may be provided on the flexible circuit board 10, with each auxiliary film 40 extending between the two rows of first pads 11.

[0076] Please refer to Figures 1 to 5 The following specific embodiment illustrates the manufacturing method of the pressure-capacity module 100, including the following steps:

[0077] The system provides a flexible printed circuit board 10 and a sub-board 20. The flexible printed circuit board 10 has completed one or more process steps, including material preparation, drilling, black hole drilling, VCP plating, pattern transfer, AOI inspection, lamination / pressing of cover film, solder mask application, punching, surface treatment, character processing, testing, die cutting, and reinforcing lamination. The sub-board 20 is a steel sheet; it can be understood that the sub-board 20 is a PCB, in which case the PCB fabrication must be completed beforehand.

[0078] An auxiliary film 40 is provided: The auxiliary film 40 is cut according to the panel size of the flexible circuit board 10, and according to the panel arrangement of the circuit board units 111, the auxiliary film 40 retains the gap position, and makes room for the pressing mark and the first pad 11, thus forming the window portion 41. In this embodiment, the two first pads 11 are located at both ends of the gap position, so the auxiliary film 40 between the two first pads 11 is retained, and a window is made at the position of the pressing mark to avoid obstruction.

[0079] Applying the auxiliary film 40: The cut auxiliary film 40 is applied to the side of the flexible circuit board 10 opposite to the sub-board 20. To facilitate the removal of the auxiliary film 40 after the flexible circuit board 10 and the sub-board 20 are laminated, only a portion of the auxiliary film 40 is bonded to the flexible circuit board 10. Figure 4 For example, the two ends of the auxiliary film 40 in the length direction are bonded and fixed to the edge area 102 of the flexible circuit board 10, while the other positions remain separable.

[0080] Plasma treatment: The flexible circuit board 10 after the auxiliary film 40 is applied is subjected to plasma treatment to clean the flexible circuit board 10, especially the first pad 11 on the flexible circuit board 10.

[0081] Adhesive backing: Conductive adhesive 30 is applied to the first pad 11 of the flexible circuit board 10 on the sub-board 20. It should be noted that the size of the conductive adhesive 30 should be reasonably set according to the flowability of the conductive adhesive 30 during pressing, so that the conductive adhesive 30 covers and adheres to the pad after pressing, without overflowing the edge of the flexible circuit board 10 or the sub-board 20.

[0082] Mounting: Use an automatic reinforcing machine to mount the adhesive-backed sub-board 20 onto the corresponding position of the flexible circuit board 10.

[0083] Pressing: Since mounting only pre-fixes the sub-board 20 to the flexible circuit board 10, pressing is required to ensure the bonding reliability of the flexible circuit board 10 and the sub-board 20. This embodiment uses a vacuum high-speed press for pressing. During pressing, the sub-board 20 is pressed with its side facing upwards, and release films and pressing buffer materials are also placed on the outside of the flexible circuit board 10 and the sub-board 20. Specifically, release films are placed on the side of the sub-board 20 away from the flexible circuit board 10 and on the side of the flexible circuit board 10 backing the ion exchange plate 20, respectively. Pressing buffer materials, such as fiberglass cloth, are placed below the flexible circuit board 10 where the release films have been placed. The first piece after pressing needs to have its peel strength, misalignment, and gap value of the conductive adhesive 30 checked to adjust the process parameters of subsequent products in a timely manner.

[0084] Curing: The conductive adhesive 30 used in this embodiment is a thermosetting conductive adhesive 30. After pressing, it is baked in an oven to completely cure the conductive adhesive 30.

[0085] Remove auxiliary film 40: For the pressed and cured sub-board 20 and flexible circuit board 10, cut the adhesive portion of the auxiliary film 40 to the board edge area 102 so that it can be separated from the flexible circuit board 10. Pull out the auxiliary film 40 from one side until it is completely removed. After removal, perform product quality inspection and subsequent processes according to the standard procedure.

[0086] Because the flexible circuit board 10 adopts a panel structure during production, after removing the auxiliary film 40, the flexible circuit board 10 can be cut to form multiple individual pressure-capacitance modules 100; or it can be shipped directly to the customer in a panel structure, and the customer can further process it according to the subsequent assembly requirements.

[0087] The second aspect of this application provides a pressure-capacity module 100, which is manufactured using the manufacturing method of the pressure-capacity module 100 of any embodiment of the first aspect.

[0088] A third aspect of this application provides a pressure-capacity module 100, including a flexible circuit board 10 and a sub-board 20 for pressure sensing. The flexible circuit board 10 is provided with a first pad 11, and the sub-board 20 is fixed to the first pad 11 by conductive adhesive 30. A gap with a preset height is formed between the sub-board 20 and the flexible circuit board 10.

[0089] Specifically, the daughter board 20 is fixed to the first pad 11 by conductive adhesive 30 and electrically connected to the first pad 11 by conductive adhesive 30, and then electrically connected to the flexible circuit board 10.

[0090] When the daughterboard 20 is subjected to external pressure, the height of the gap changes, which in turn causes a change in the capacitance value of the pressure-capacitance module 100. The flexible circuit board 10 can determine the pressure detection result based on the change in capacitance value. The pressure-capacitance module 100 can be used in TWS earphones or other electronic devices that require pressure detection.

[0091] The capacitor-voltage module 100 provided in this application uses conductive adhesive 30 to bond the sub-board 20 and the flexible circuit board 10. Since the thickness of the conductive adhesive 30 is easy to control, the capacitor-voltage module 100 can use the conductive adhesive 30 to assemble the sub-board 20 and the flexible circuit board 10 and precisely control the gap height, replacing the traditional SMT solder paste mounting process and solving the problem of uncontrollable solder paste thickness in the SMT solder paste mounting process. Therefore, the capacitor-voltage module 100 has good gap consistency and good capacitance consistency; the capacitor-voltage module 100 is not easily deformed during manufacturing and has a good yield.

[0092] In one embodiment, the sub-board 20 is a steel sheet, and conductive adhesive 30 is disposed on the steel sheet at the location corresponding to the first pad 11. In another embodiment, the sub-board 20 is a PCB, and a second pad (not shown) is disposed on the PCB at the location corresponding to the first pad 11. The conductive adhesive 30 is disposed between the first pad 11 and the second pad so that the first pad 11 and the second pad are electrically connected through the conductive adhesive 30.

[0093] Optional, please refer to Figure 6 In another embodiment, the voltage-capacitance module 100 further includes a reinforcing plate 50, which is disposed on one side of the back-ion plate 20 of the flexible circuit board 10. The reinforcing plate 50 may be a steel plate, and it can reinforce the voltage-capacitance module 100.

[0094] A third aspect of this application provides an electronic device including the capacitor module 100 provided in the second or third aspect above. The electronic device also includes a housing, with the capacitor module 100 disposed inside the housing.

[0095] The electronic device can be a TWS earphone or other electronic device capable of detecting pressure.

[0096] The capacitor module 100 and its manufacturing method provided in this application can ensure the stability and consistency of the gap between the sub-board 20 and the flexible circuit board 10 in the capacitor module 100, thereby improving product yield and product quality.

[0097] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for manufacturing a pressure vessel module, characterized by The application relates to a pressure-sensitive module, comprising: a flexible circuit board and a sub-board for pressure sensing, the flexible circuit board comprising a circuit area and a board edge area outside the circuit area, and the circuit area comprising a plurality of circuit board units, and at least two first pads being arranged on the board surface of the flexible circuit board, wherein the two first pads are oppositely and spacedly arranged to fix and electrically connect the sub-board; conductive glue being arranged on the sub-board corresponding to the first pads or on the first pads; an auxiliary film being arranged on the side of the flexible circuit board opposite to the sub-board, the auxiliary film covering the circuit area and the auxiliary film having a windowing part, the windowing part exposing the first pads, and the auxiliary film being arranged between a pair of the first pads of each circuit board unit; aligning and pressing the sub-board and the flexible circuit board, wherein in the pressing step, the auxiliary film is arranged in the gap between the flexible circuit board and the sub-board, and the auxiliary film can support the sub-board; the conductive glue is solidified and the conductive glue adheres the sub-board and the first pads, the sub-board and the board surface of the flexible circuit board have a gap with a preset height, and the thickness of the auxiliary film is equal to the preset height of the gap; removing the auxiliary film, and cutting the flexible circuit board to form a plurality of separate pressure-sensitive modules, wherein each circuit board unit and the corresponding sub-board form a pressure-sensitive module. The thickness of the conductive glue is greater than or equal to the preset height of the gap when the conductive glue is arranged on the sub-board corresponding to the first pads or on the first pads. The aligning and pressing the sub-board and the flexible circuit board comprises: using an automatic reinforcing machine to adhere the sub-board on the flexible circuit board; using a vacuum pressing machine to press the sub-board and the flexible circuit board to assemble the pressure-sensitive module; and using an oven to bake the pressure-sensitive module to solidify the conductive glue. The auxiliary film covers the board edge area and the circuit area, and the windowing part also exposes a pressing mark point for aligning and pressing. The two ends of the auxiliary film along the length direction are respectively pasted on the board edge area, and the two ends of the auxiliary film along the width direction respectively expose a plurality of first pads, and the windowing part of the auxiliary film is arranged in the middle part of the auxiliary film and exposes the remaining first pads. The pressure-sensitive module is manufactured by using the manufacturing method of any one of claims 1-5.

2. The method of claim 1, wherein the pressure vessel is formed by a process comprising: The application also relates to a pressure-sensitive module, comprising the pressure-sensitive module of claim 6.

3. The method of claim 1, wherein the mold is a compression mold. ​ ​ ​ ​ 4. The method of claim 1, wherein the mold is a compression mold. ​ 5. The method for manufacturing the pressure-capacity module as described in claim 4, characterized in that, ​ 6. A pressure vessel module, characterized by ​ 7. An electronic device, comprising: ​

Images