Cooling module, cooling system and server system

Abstract

The present application discloses a heat dissipation module, a heat dissipation system and a server system. The heat dissipation module includes a liquid cooling component and an air cooling component. The liquid cooling component is provided with a liquid cooling cavity, a first liquid hole and a second liquid hole connected to the liquid cooling cavity. The liquid cooling component includes a plurality of first column fins arranged in the liquid cooling cavity; the air cooling component includes a plurality of heat dissipation columns correspondingly connected to the first column fins, and the heat dissipation columns extend to the outside of the liquid cooling cavity. Through the above arrangement, the liquid in the liquid cooling component flows and dissipates heat between the plurality of first column fins in the process of flowing from the first liquid hole to the second liquid hole in the liquid cooling cavity. The heat dissipation columns in the air cooling component absorb the heat in the first column fins and extend to the outside of the liquid cooling cavity for air cooling airflow heat dissipation. The liquid cooling component and the air cooling component work together to improve the heat dissipation efficiency of the heat dissipation module. At the same time, the arrangement of the plurality of first column fins in the liquid cooling cavity also effectively increases the number of flow channels in the heat dissipation module, increases the heat exchange area, reduces the flow impedance, and at the same time improves the heat exchange effect between the fluid and the heat dissipation module.

Description

Technical Field

[0001] The present application mainly relates to the field of liquid cooling technology, and in particular to the field of heat dissipation technology for high heat flux density liquid cooling plates. Background Art

[0002] The vigorous development of artificial intelligence, cloud computing and big data technologies has led to higher and higher performance requirements for the underlying IT infrastructure in actual business, which has directly led to a rapid growth trend in the power consumption of infrastructure such as servers. Traditional air cooling methods have been unable to meet the heat dissipation needs under the current high heat flux density.

[0003] Liquid cooling is gradually becoming a leader in high heat flux density cooling solutions with its outstanding advantages such as high heat dissipation, energy saving, low noise, green environmental protection, and no altitude influence, which will bring subversive changes to the development of servers and data centers. Liquid cooling plate, as a key component of liquid cooling system, its flow and heat transfer efficiency will directly determine the performance of liquid cooling system.

[0004] In the prior art, the liquid cooling plate in the liquid cooling system generally has the problems of a single number of flow channels, large flow impedance and limited heat exchange effect between the fluid and the liquid cooling plate. Summary of the invention

[0005] The present application mainly provides a heat dissipation module, a heat dissipation system and a server system to solve the problems of a single number of flow channels of a liquid cooling plate, large flow impedance and limited heat exchange effect between the fluid and the liquid cooling plate.

[0006] In order to solve the above technical problems, a technical solution adopted in the present application is: to provide a heat dissipation module, comprising: a liquid cooling component, provided with a liquid cooling cavity, a first liquid hole and a second liquid hole communicated with the liquid cooling cavity, the liquid cooling component comprising a plurality of first column fins arranged in the liquid cooling cavity;

[0007] The air cooling component includes a plurality of heat dissipation columns correspondingly connected to the first column fins, and the heat dissipation columns extend outside the liquid cooling cavity.

[0008] The plurality of first column fins are distributed in multiple rows in the liquid cooling chamber along the flow direction from the first liquid hole to the second liquid hole, and the first column fins in two adjacent rows are also distributed in a staggered manner.

[0009] Wherein, the first column fin comprises an inflow portion and a backflow portion connected to each other, the inflow portion faces the side where the first liquid hole is located, and the backflow portion faces the side where the second liquid hole is located;

[0010] Among them, the cross-sectional area of ​​the inflow portion gradually increases in the flow direction from the first liquid hole to the second liquid hole, the cross-sectional area of ​​the backflow portion gradually decreases in the flow direction, and the length dimension of the inflow portion along the flow direction is smaller than the length dimension of the backflow portion along the flow direction.

[0011] The outer wall surface of the inflow portion is an arc surface, the outer wall surface of the backflow portion is a conical surface, and the connection between the arc surface and the conical surface is a transition through an arc.

[0012] Wherein, the ratio of the length dimension of the backflow portion along the flow direction to the length dimension of the inflow portion along the flow direction is greater than or equal to 1.2 and less than or equal to 3.

[0013] Wherein, the outer wall of the incoming flow portion and / or the back flow portion is provided with some interference flow grooves.

[0014] The spoiler groove is extended along the circumferential direction of the first column fin, and a plurality of the spoiler grooves are stacked and arranged at intervals along a direction perpendicular to the circumferential direction.

[0015] The spoiler groove comprises a first spoiler groove and a second spoiler groove, and the first spoiler groove and the second spoiler groove are arranged at intervals on two sides of the first column fin opposite to each other along a direction perpendicular to the flow direction.

[0016] Wherein, the distance between the first spoiler groove and the second spoiler groove remains unchanged or gradually decreases along the flow direction.

[0017] The first spoiler groove and the second spoiler groove are symmetrically arranged about the central axis of the first column fin.

[0018] Wherein, the spoiler groove is arranged around the incoming flow portion and / or the back flow portion along the circumference of the first column fin.

[0019] The spoiler groove is arranged around the incoming flow portion along the circumference of the first column fin, and both ends of the spoiler groove also extend to the back flow portion.

[0020] The spoiler groove is an annular groove arranged around the incoming flow portion and the back flow portion along the circumference of the first column fin, and the spoiler groove at the back flow portion divides the back flow portion into a plurality of heat exchange plates arranged in an interval and stacked manner.

[0021] Wherein, the first column fin is provided with a receiving cavity connected to the heat dissipation column, and the side wall of the receiving cavity defined by the receiving cavity and the spoiler groove is a wall of equal thickness.

[0022] The liquid cooling assembly further includes second column fins spaced apart on opposite sides of the first column fin along a direction perpendicular to the flow direction, and the second column fins are smaller than the first column fins by a preset ratio.

[0023] Wherein, the second column fins are arranged on two opposite sides of the back flow portion along the vertical direction.

[0024] Wherein, the liquid cooling component further includes a flow dividing pool and a flow confluence pool, the flow dividing pool is connected between the first liquid hole and the liquid cooling cavity, and the flow confluence pool is connected between the liquid cooling cavity and the second liquid hole;

[0025] Among them, the diversion pool is provided with a third liquid hole connected to the liquid cooling cavity, and the hole area of ​​the third liquid hole is larger than the hole area of ​​the first liquid hole; the confluence pool is provided with a fourth liquid hole connected to the liquid cooling cavity, and the hole area of ​​the fourth liquid hole is larger than the hole area of ​​the second liquid hole.

[0026] The third liquid hole and the fourth liquid hole are long strip holes, and the length dimension in the direction perpendicular to the flow direction is greater than or equal to the length dimension of each row of the first column fins along the perpendicular direction.

[0027] Among them, the diversion pool is also provided with a first guide slope, which is used to guide the liquid entering from the first liquid hole to flow to the third liquid hole; the confluence pool is also provided with a second guide slope, which is used to guide the liquid entering from the fourth liquid hole to flow to the second liquid hole.

[0028] Among them, the liquid cooling component includes a base plate and a cover plate, the base plate and the cover plate are connected to form the liquid cooling chamber, the first liquid hole and the second liquid hole are respectively arranged at opposite ends of the base plate, the diversion pool and the confluence pool are arranged on the base plate, the first column fin connects the base plate and the cover plate, and the side of the base plate away from the cover plate is used to contact the heat source.

[0029] Wherein, the air cooling component also includes a heat dissipation fin arranged on one side of the liquid cooling component, and the heat dissipation fin is connected to the heat dissipation column.

[0030] Wherein, the heat dissipation fins include a plurality of first fins distributed along the extension direction of the heat dissipation column and arranged at intervals, and the plurality of first fins are connected to the heat dissipation column.

[0031] Wherein, the heat dissipation fins also include second fins connected to two opposite sides of the plurality of first fins, and the second fins are also connected to the liquid cooling assembly.

[0032] Wherein, the heat dissipation column passes through the plurality of first fins and extends to a side of the plurality of first fins away from the liquid cooling assembly.

[0033] Wherein, the first column fin is provided with a receiving cavity connected to the heat dissipation column, and the assembly gap between the heat dissipation column and the receiving cavity is also filled with heat conductive material.

[0034] Wherein, the heat dissipation column is a phase change heat transfer tube.

[0035] To solve the above technical problems, another technical solution adopted in the present application is: to provide a heat dissipation system, which includes a blowing member and any one of the heat dissipation modules as described above, and the blowing member is used to provide an air flow blowing through the air-cooled component.

[0036] To solve the above technical problems, another technical solution adopted in the present application is: to provide a server system, the server system includes a server host and any one of the heat dissipation modules as described above, and one side of the liquid cooling component contacts the heat source on the server host.

[0037] The beneficial effects of the present application are as follows: Different from the prior art, the present application discloses a heat dissipation module, a heat dissipation system and a server system. The heat dissipation module includes a liquid cooling component and an air cooling component. The liquid cooling component includes a liquid cooling chamber, a first liquid hole connected to the liquid cooling chamber, a second liquid hole and a plurality of first column fins arranged in the liquid cooling chamber; the air cooling component includes a heat dissipation column correspondingly connected to the first column fin, and the heat dissipation column extends to the outside of the liquid cooling chamber. Through the above arrangement, the liquid in the liquid cooling component flows and dissipates heat between the plurality of first column fins in the process of flowing from the first liquid hole to the second liquid hole in the liquid cooling chamber. The heat dissipation column in the air cooling component absorbs the heat in the first column fin and extends to the outside of the liquid cooling chamber for air cooling airflow heat dissipation. The liquid cooling component and the air cooling component work together to improve the heat dissipation efficiency of the heat dissipation module. At the same time, the arrangement of the plurality of first column fins in the liquid cooling chamber also effectively increases the number of flow channels in the heat dissipation module, increases the heat exchange area, reduces the flow impedance, and improves the heat exchange efficiency between the fluid and the heat dissipation module. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0039] Figure 1 It is a structural schematic diagram of the first embodiment of the heat dissipation module provided by the present application;

[0040] Figure 2 yes Figure 1 A schematic diagram of an AA cross section of an embodiment of a heat dissipation module;

[0041] Figure 3 yes Figure 2 BB cross-sectional diagram of the heat dissipation module;

[0042] Figure 4 yes Figure 3 Schematic diagram of the cross section of the heat dissipation module CC;

[0043] Figure 5 yes Figure 1 A schematic diagram of the structure of a cover plate in a heat dissipation module;

[0044] Figure 6 It is a schematic diagram of the flow separation phenomenon of fluid flowing around a cylinder;

[0045] Figure 7 yes Figure 2 A schematic diagram of the structure of the bottom plate, the first column fin and the heat dissipation column in the heat dissipation module;

[0046] Figure 8 yes Figure 7 Schematic diagram of the fluid flow around the first column fin in FIG.

[0047] Fig. 9 yes Figure 1 A schematic diagram of a BB cross section in another embodiment of a heat dissipation module;

[0048] Fig.10 This is a schematic diagram of the spoiler enhancement effect of the second column fin in 9;

[0049] Fig.11 is a structural schematic diagram of a first implementation mode of a first column fin in a second embodiment of a heat dissipation module;

[0050] Fig.12 yes Fig.11 A schematic cross-sectional view of an embodiment of a first column fin;

[0051] Fig.13 yes Fig.11 A schematic cross-sectional view of another embodiment of the first column fin;

[0052] Fig.14 is a cross-sectional schematic diagram of a second implementation manner of the first column fin in the second embodiment of the heat dissipation module;

[0053] Fig.15 yes Fig.13 Schematic diagram of the fluid flow around the first column fin;

[0054] Fig.16 is a schematic diagram of the structure and fluid flow of the liquid cooling chamber in the second embodiment of the heat dissipation module;

[0055] Fig.17 is a schematic structural diagram of the first column fin in the third embodiment of the heat dissipation module;

[0056] Fig.18 is a CC cross-sectional schematic diagram of the third embodiment of the heat dissipation module;

[0057] Fig.19 is a schematic diagram of the structure and fluid flow of the liquid cooling chamber in the third embodiment of the heat dissipation module;

[0058] Fig. 20 yes Fig.17 Schematic diagram of the fluid flow around the first column fin;

[0059] Fig.21 It is a structural schematic diagram of an embodiment of a heat dissipation system provided by the present application;

[0060] Fig. 22 It is a structural diagram of an embodiment of a server system provided by the present application. DETAILED DESCRIPTION

[0061] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0062] The terms "first", "second", "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0063] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0064] See also Figures 1 to 5 , Figure 1 is a structural schematic diagram of the first embodiment of the heat dissipation module provided by the present application, Figure 2 yes Figure 1 A schematic diagram of the AA cross section of an embodiment of the heat dissipation module, Figure 3 yes Figure 2 Schematic diagram of the cross section of the heat dissipation module BB, Figure 4 yes Figure 3 Schematic diagram of the cross section of the heat dissipation module CC, Figure 5 yes Figure 1 Schematic diagram of the structure of the cover plate in the heat dissipation module.

[0065] The present application provides a heat dissipation module 300, which includes a liquid cooling component 100 and an air cooling component 200. The liquid cooling component 100 includes a liquid cooling cavity 10, a first liquid hole 11 and a second liquid hole 12 connected to the liquid cooling cavity 10, and a plurality of first column fins 20 disposed in the liquid cooling cavity 10; the air cooling component 200 includes a plurality of heat dissipation columns 210 correspondingly connected to the first column fins 20, and the heat dissipation columns 210 extend outside the liquid cooling cavity 10.

[0066] Among them, at least one side of the liquid cooling component 100 is used to contact the heat source, for example, the heat source can be a processor or memory in a server; the first liquid hole 11 is used to connect the liquid, and the liquid enters from the first liquid hole 11, passes through the liquid cooling cavity 10 and the multiple first column fins 20 in the liquid cooling cavity 10, and flows out from the second liquid hole 12; then, after the liquid cooling component 100 contacts the heat source, the heat is transferred to the liquid cooling cavity 10 and the multiple first column fins 20. The multiple first column fins 20 can effectively increase the heat exchange area of ​​the liquid cooling component 100, so that the liquid cooling fluid can take away the heat more efficiently. The heat dissipation column 210 corresponding to the first column fin 20 can further guide the heat to the outside of the liquid cooling cavity 10 to dissipate the heat through air cooling.

[0067] The heat dissipation module 300 provided in the present application combines the heat dissipation by the liquid flow in the liquid cooling component 100 and the heat dissipation by the air-cooling airflow in the air cooling component 200, thereby effectively improving the heat dissipation efficiency of the heat dissipation module 300. At the same time, the multiple first column fins 20 arranged in the liquid cooling cavity 10 in the liquid cooling component 100 form multiple flow channels between the multiple first column fins 20 when the liquid in the liquid cooling cavity 10 flows from the first liquid hole 11 to the second liquid hole 12, effectively increasing the number of flow channels in the heat dissipation module 300 and increasing the heat exchange area, thereby improving the heat exchange effect of the heat dissipation module 300.

[0068] See also Figures 1 to 4 The heat dissipation module 300 includes a liquid cooling component 100 and an air cooling component 200 . The liquid cooling component 100 is mainly composed of a base plate 30 , a cover plate 40 and a first column fin 20 , and the air cooling component 200 is mainly composed of a heat dissipation column 210 and a heat dissipation fin 220 .

[0069] Specifically, the base plate 30 and the cover plate 40 in the liquid cooling assembly 100 are generally in the shape of a rectangular parallelepiped. The base plate 30 and the cover plate 40 are connected to form a liquid cooling chamber 10, and the liquid cooling chamber 10 is used to accommodate the flow of liquid cooling fluid therein. A plurality of first column fins 20 are distributed in the liquid cooling chamber 10, and the first column fins 20 are connected to the base plate 30, and the first column fins 20 and the base plate 30 are designed to be integrated. Preferably, the first column fins 20 are connected between the base plate 30 and the cover plate 40, that is, the end surface of the first column fin 20 close to one end of the cover plate 40 is in contact with the cover plate 40. In other embodiments, the first column fin 20 may also be spaced apart from the cover plate 40. The side of the base plate 30 away from the cover plate 40 is used to contact the heat source.

[0070] The bottom plate 30 and the cover plate 40 are sealed by welding to form a closed liquid cooling chamber 10. Optionally, the bottom plate 30 and the cover plate 40 can be welded by high-frequency diffusion welding.

[0071] Optionally, the liquid cooling component 100 can also be composed of other structural parts. For example, the whole is cast in one piece, etc. As long as the liquid cooling cavity 10, the first liquid hole 11, the second liquid hole 12 and the first column fin 20 can be formed, the present application does not limit the specific achievable structure of the liquid cooling component 100.

[0072] The first column fin 20 is provided with a receiving cavity 21, and the air cooling assembly 200 includes a plurality of heat dissipation columns 210. The receiving cavity 21 in the first column fin 20 is used to receive and connect the heat dissipation columns 210, and the plurality of heat dissipation columns 210 are respectively assembled and connected in the receiving cavities 21 of the plurality of first column fins 20. One end of the heat dissipation column 210 is assembled in the receiving cavity 21 of the first column fin 20, and the assembly gap between the heat dissipation column 210 and the receiving cavity 21 is filled with a thermal conductive material (not shown). It can be understood that filling the assembly gap with a thermal conductive material can effectively reduce the contact thermal resistance, which is beneficial to the heat transfer from the first column fin 20 to the heat dissipation column 210. The heat dissipation column 210 is a phase change heat transfer tube, for example, the heat dissipation column 210 can be a heat pipe. Preferably, the heat dissipation column 210 is a stainless steel heat pipe, so as to enhance the assembly strength.

[0073] In this embodiment, the heat dissipation column 210 is a cylindrical structure, and the accommodation cavity 21 of the first column fin 20 is also set to a circular hole corresponding to the shape of the heat dissipation column 210, so as to facilitate better assembly and connection between the heat dissipation column 210 and the first column fin 20. Optionally, the heat dissipation column 210 can also be set to other shapes, for example, the heat dissipation column 210 can be set to any shape such as a triangular prism, a quadrangular prism, an elliptical column, etc., and the accommodation cavity 21 of the first column fin 20 can also be set to any shape corresponding to the heat dissipation column 210.

[0074] See also Figure 1 , Figure 2 and Figure 4One end of the heat dissipation column 210 is assembled in the receiving cavity 21 of the first column fin 20 and connected to the bottom plate 30, and the other end passes through the cover plate 40 and extends to the side of the cover plate 40 away from the bottom plate 30. Specifically, a plurality of first receiving holes 41 are provided on the cover plate 40 at positions corresponding to the plurality of heat dissipation columns 210. The first receiving holes 41 are circular holes corresponding to the shapes of the heat dissipation columns 210 (such as Figure 5 As shown). The other end of the heat dissipation column 210 extends through the plurality of first receiving holes 41 to the side away from the bottom plate 30. The cover plate 40 and the heat dissipation column 210 are sealed by welding. One end of the heat dissipation column 210 is connected to the first column fin 20, and the other end extends to the outside of the liquid cooling assembly 100, that is, a part of the heat dissipation column 210 is located in the liquid cooling chamber 10, and the other part is exposed to the air, so that part of the heat from the heat source can be dissipated through the part of the heat dissipation column 210 exposed to the air.

[0075] The air cooling component 200 includes a heat sink fin 220 disposed on one side of the liquid cooling component 100, and the heat sink fin 220 is connected to the portion of the heat sink 210 exposed to the air. Specifically, the heat sink fin 220 includes a plurality of first fins 221 and two second fins 222, and the plurality of first fins 221 are distributed along the extension direction of the heat sink 210, that is, axially, and the plurality of first fins 221 are stacked and arranged at intervals, and multiple layers are distributed in the extension direction of the heat sink 210. The plurality of first fins 221 have the same shape and are all rectangular thin sheets. A plurality of second receiving holes 2211 are arranged on the first fin 221 at positions corresponding to the plurality of heat sinks 210, and the second receiving holes 2211 are all circular in shape corresponding to the plurality of heat sinks 210, and the heat sink 210 passes through the second receiving holes 2211 on the plurality of stacked and spaced first fins 221 and extends to the side of the plurality of first fins 221 away from the liquid cooling component 100. The edges of the heat dissipation column 210 contacting the second receiving hole 2211 are fixedly assembled by welding or other methods. The two second fins 222 are respectively distributed on two opposite sides of the plurality of first fins 221, and the end surfaces of the second fins 222 close to the first fins 221 are in contact with the plurality of first fins 221, and the end surfaces of the second fins 222 close to one end of the cover plate 40 are in contact with the cover plate 40.

[0076] It can be understood that the arrangement of the heat dissipation column 210 and the heat dissipation fins 220 in the air-cooling component 200 enables a portion of the heat from the heat source to be transferred to the heat dissipation column 210 through the first column fin 20, and then transferred to the first fin 221 and the second fin 222 exposed to the air by the heat conduction effect of the heat dissipation column 210, and dissipated through the convection effect of the air-cooling airflow, thereby realizing the air-cooling heat dissipation function of the heat dissipation module 300.

[0077] See also Figure 1 and Figure 4In the liquid cooling component 100, a first liquid hole 11 and a second liquid hole 12 are arranged on the bottom plate 30, and the first liquid hole 11 and the second liquid hole 12 are respectively arranged at opposite ends of the bottom plate 30, and the first liquid hole 11 and the second liquid hole 12 are both in fluid communication with the liquid cooling chamber 10. The external liquid pipe is connected to the first liquid hole 11 and the second liquid hole 12 respectively, and the liquid cooling fluid flows from the first liquid hole 11 into the liquid cooling chamber 10 along the liquid pipe connected to the first liquid hole 11, flows from the first liquid hole 11 to the second liquid hole 12 between the multiple first column fins 20 in the liquid cooling chamber 10, and flows out of the liquid cooling chamber 10 from the second liquid hole 12, so as to bring part of the heat of the heat source out of the heat dissipation module 300, and realize the liquid cooling heat dissipation function. Among them, the multiple first column fins 20 are distributed in multiple rows in the liquid cooling chamber 10 along the flow direction from the first liquid hole 11 to the second liquid hole 12, and the first column fins 20 in two adjacent rows are staggered. It can be understood that the first column fins 20 are distributed in the liquid cooling chamber 10 in a staggered manner along the flow direction, which can enhance the disturbance between the fluid in the liquid cooling chamber 10 and the wall surface of the first column fins 20, and further strengthen the flow and heat transfer.

[0078] In this embodiment, the first liquid hole 11 and the second liquid hole 12 are both circular holes. Optionally, the first liquid hole 11 and the second liquid hole 12 can also be set to other shapes, for example, the first liquid hole 11 and the second liquid hole 12 can be set to any shape such as an elliptical hole, a square hole, a diamond hole, etc.

[0079] See also Figure 4 The liquid cooling assembly 100 also includes a shunt pool 50 and a confluence pool 60, both of which are arranged on the bottom plate 30, wherein the shunt pool 50 is arranged on a side close to the first liquid hole 11, and is connected between the first liquid hole 11 and the liquid cooling chamber 10; the confluence pool 60 is arranged on a side close to the second liquid hole 12, and is connected between the second liquid hole 12 and the liquid cooling chamber 10. The shunt pool 50 is mainly used to collect and redistribute the liquid cooling fluid entering the first liquid hole 11 from the external liquid pipe, and the shunt pool 50 is used to achieve uniform configuration of the liquid flow of multiple different flow channels formed between multiple first column fins 20 in the liquid cooling chamber 10, to prevent the flow short circuit phenomenon, so as to produce a stronger flow and heat exchange level. Similarly, the confluence pool 60 is arranged at one end close to the second liquid hole 12, so as to collect the liquid cooling fluid to the confluence pool 60 and then flow out from the second liquid hole 12. The structural form of the confluence pool 60 is similar to that of the shunt pool 50.

[0080] Specifically, the diverter pool 50 is provided with a third liquid hole 51 connected to the liquid cooling chamber 10, and the confluence pool 60 is provided with a fourth liquid hole 61 connected to the liquid cooling chamber 10, that is, the third liquid hole 51 and the fourth liquid hole 61 are ports of the diverter pool 50 and the confluence pool 60 connected to one end of the liquid cooling chamber 10, respectively. Among them, the hole area of ​​the third liquid hole 51 is larger than the hole area of ​​the first liquid hole 11, and the hole area of ​​the fourth liquid hole 61 is larger than the hole area of ​​the second liquid hole 12. A first guide slope 52 is provided in the diverter pool 50, and the first guide slope 52 is used to guide the liquid entering the diverter pool 50 from the first liquid hole 11 to flow to the third liquid hole 51; the confluence pool 60 is provided with a second guide slope 62, and the second guide slope 62 is used to guide the liquid entering the confluence pool 60 from the fourth liquid hole 61 to flow to the second liquid hole 12. It can be understood that the side of the diversion pool 50 is connected to the first liquid hole 11 via a smaller opening, and the top surface is connected to the liquid cooling chamber 10 via a larger third liquid hole 51. An inclined first guide slope 52 is set in the flow path from the small port to the large port. The main function is to reduce the flow resistance / loss, and the liquid flowing out of the large port has a certain initial component velocity along the flow direction, which is beneficial to enhance the heat exchange intensity of the fluid.

[0081] In this embodiment, the third liquid hole 51 and the fourth liquid hole 61 are both long holes (such as Figure 3 As shown in FIG. 1 ), and the length dimension of the third liquid hole 51 and the fourth liquid hole 61 in the direction perpendicular to the liquid flow direction is greater than or equal to the length dimension of each row of first column fins 20 in the direction perpendicular to the flow direction. In this way, it is ensured that the liquid gathered in the flow diversion pool 50 can flow through all the first column fins 20 when flowing to the liquid cooling chamber 10, that is, it is ensured that the outer wall surfaces of the multiple first column fins 20 in the liquid cooling chamber 10 are all flowed by liquid, and the uniform configuration of the liquid flow is further achieved.

[0082] The liquid cooling fluid flows in the liquid cooling chamber 10 to exchange heat, wherein the plurality of first column fins 20 disposed in the liquid cooling chamber 10 strengthen the disturbance of the fluid, so that the fluid can take away more heat, thereby improving the heat exchange efficiency.

[0083] Optionally, the first liquid hole 11, the second liquid hole 12, the diversion pool 50 and the confluence pool 60 may also be arranged on the cover plate 40, which will not be described in detail.

[0084] See also Figures 6 to 8 , Figure 6 This is a schematic diagram of the flow separation phenomenon of fluid flowing around a cylinder. Figure 7 yes Figure 2 Schematic diagram of the assembly structure of the bottom plate, the first column fin and the heat dissipation column in the heat dissipation module, Figure 8 yes Figure 7 Schematic diagram of the fluid flow around the first column fin in .

[0085] like Figure 6The figure shows the flow separation phenomenon caused by the flow of fluid around a cylinder. The outer wall of the cylinder is circular, and the cross-sectional area of ​​the front half gradually decreases in the flow direction, while the cross-sectional area of ​​the back half gradually increases. When the fluid flows through the cross-section where the front half of the cylinder is located, the flow velocity increases and the pressure decreases due to the reduction of the flow cross-section. In the back half, the pressure rises again due to the increase of the flow cross-section. At this time, the fluid in the boundary layer relies on its own momentum to overcome the pressure increase and flows forward. The velocity distribution tends to be flat. The fluid layer near the wall has a small momentum, so it becomes increasingly difficult to overcome the rising pressure. Finally, there will be a local area where the velocity gradient at the wall becomes 0, and then a backflow in the opposite direction of the original flow direction will occur, causing vortices and vortex beams. From Figure 6 It can be seen that a small part of the vortex beam is distributed near the wall, where the vortex beam will have a strong heat exchange with the wall due to the disturbance process; in addition, most of the vortex beams are distributed on the far wall, but the disturbance of the vortex beams here is only between the fluid inside, lacking the participation of the cylindrical wall, and the effect of enhancing heat transfer is limited, but it will increase the flow resistance to a certain extent.

[0086] In view of this, in the present embodiment, the shape of the first column fin 20 is non-cylindrical. Specifically, the first column fin 20 includes an inflow portion 22 and a backflow portion 23, wherein the inflow portion 22 faces the side where the first liquid hole 11 is located, and the backflow portion 23 faces the side where the second liquid hole 12 is located, wherein the cross-sectional area of ​​the inflow portion 22 gradually increases in the direction of liquid flow, and the cross-sectional area of ​​the backflow portion 23 gradually decreases in the direction of liquid flow, the length dimension of the inflow portion 22 along the flow direction is a first dimension R1, and the length dimension of the backflow portion 23 along the flow direction is a second dimension R2, and the first dimension R1 is smaller than the second dimension R2, thereby relatively extending the dimension of the backflow portion 23 in the flow direction, so that the backflow portion 23 can be extended to such a length as Figure 6 The far wall surface of the vortex beam disturbance at the far wall surface is fully in contact with the outer wall surface of the back flow portion 23, thereby enhancing the heat exchange effect and reducing the flow resistance. It can effectively increase the heat exchange area in contact with the vortex beam and help reduce the flow resistance, which can further improve the heat exchange efficiency, thereby enhancing the heat exchange effect between the first column fin 20 and the fluid and reducing the flow resistance.

[0087] See also Figure 7 and Figure 8The first column fin 20 is roughly conical, the outer wall surface of the inflow portion 22 is an arc surface, the outer wall surface of the backflow portion 23 is a conical surface, and the connection between the inflow portion 22 and the backflow portion 23 is a circular arc transition. Among them, the ratio of the length dimension of the backflow portion 23 along the flow direction to the length dimension of the inflow portion 22 along the flow direction is greater than or equal to 1.2 and less than or equal to 3, that is, the ratio of the second dimension R2 to the first dimension R1 is greater than or equal to 1.2 and less than or equal to 3, for example, the ratio is 1.2, 1.5, 1.8, 2.0, 2.3, 2.5, 2.8 or 3.0, so that the backflow portion 23 can extend to the "vortex beam disturbance zone at the far wall" to fully participate in heat exchange.

[0088] Among them, the arc surface can play a role in a smooth transition of the fluid flow from front to back. The conical surface extends toward the back flow side, which can reduce the far wall vortex beams and make all the vortex beams close to the outer wall of the cone. While increasing the convection area, the number of "effective" near-wall vortex beams is increased, so that the heat exchange intensity and degree between the fluid and the outer wall of the first column fin 20 are higher, thereby enhancing the heat exchange. In addition, the reduction in the number of far wall vortex beams also reduces the internal friction between the fluids, reduces the flow loss, and further improves the flow efficiency.

[0089] Optionally, the outer wall surface of the inflow portion 22 may also be an elliptical arc surface or a conical surface, and the backflow portion 23 may also be an arc surface.

[0090] See also Fig. 9 and Fig.10 , Fig. 9 yes Figure 1 A schematic diagram of a cross section BB of another embodiment of the heat dissipation module, Fig.10 This is a schematic diagram of the spoiler enhancement effect of the second column fin in 9.

[0091] like Fig. 9 As shown, in another embodiment, the liquid cooling component 100 in the heat dissipation module 300 may further include a plurality of second column fins 70, and the second column fins 70 are arranged at intervals on both sides of the first column fin 20 in the direction perpendicular to the liquid flow direction. Preferably, the second column fins 70 are arranged on the opposite sides of the backflow portion 23 of the first column fin 20 in the direction perpendicular to the liquid flow direction, that is, a second column fin 70 is arranged on both sides of the backflow portion 23 of each first column fin 20. Among them, the second column fin 70 is reduced in size relative to the first column fin 20 according to a certain preset ratio, that is, the structure of the second column fin 70 is the same as that of the first column fin 20, but the size is smaller than that of the first column fin 20. It can be understood that the provision of the second column fin 70 can further increase the heat exchange area of ​​the fluid, and also improve the disturbance degree in the liquid cooling chamber 10, thereby further improving the heat exchange effect.

[0092] See also Fig.10The second column fin 70 is arranged on both sides of the backflow portion 23 of the first column fin 20. When the incoming liquid disturbs the second column fin 70 (such as Fig.10 (as shown by the middle dotted line), under the "blocking" of the second column fin 70, a part of it will bend toward the first column fin 20 on the proximal side, and will produce a certain "jet impact" effect on the outer wall surface of the first column fin 20, so that the heat exchange is stronger; the other part will bend toward the first column fin 20 on the far downstream side, so that the incoming liquid flow of the downstream first column fin 20 is more concentrated, that is, the flow rate is increased, the flow velocity is increased, thereby enhancing the heat exchange.

[0093] Furthermore, multiple third column fins and fourth column fins can also be arranged according to the same topological principle to further enhance the heat exchange effect. The third column fins are arranged on both sides of the second column fin 70, and the fourth column fins are arranged on both sides of the third column fin. The above-mentioned multiple column fins have certain fractal characteristics, which will not be repeated here.

[0094] See also Fig.11 , Fig.11 is a structural schematic diagram of a first implementation mode of a first column fin in a second embodiment of a heat dissipation module, Fig.12 yes Fig.11 A schematic cross-sectional view of an embodiment of the first column fin, Fig.13 yes Fig.11 A schematic cross-sectional view of another embodiment of the first column fin, Fig.14 is a cross-sectional schematic diagram of a second implementation of the first column fin in the second embodiment of the heat dissipation module, Fig.15 yes Fig.13 Schematic diagram of the fluid flow around the first column fin. Fig.16 Schematic diagram of the structure and fluid flow of the liquid cooling chamber in the second embodiment of the heat dissipation module.

[0095] The heat dissipation module 300 in this embodiment is different from the heat dissipation module 300 in the first embodiment only in that the structure of the first column fin 20 is different from that in the first embodiment, and the rest of the structures are the same as those in the first embodiment, which will not be described again.

[0096] In this embodiment, the shape of the first column fin 20 is the same as that in the first embodiment, except that a plurality of spoiler grooves 24 may be provided on the outer wall of the inflow portion 22 and / or the backflow portion 23 of the first column fin 20. Specifically, the spoiler grooves 24 are provided along the circumference of the first column fin 20, and the plurality of spoiler grooves 24 are provided in a stacked manner at intervals in a direction perpendicular to the circumference of the first column fin 20. The provision of a plurality of spoiler grooves 24 can increase the flow area of ​​the fluid on the one hand, and increase the heat exchange area between the fluid and the wall surface of the first column fin 20 on the other hand. At the same time, the spoiler grooves 24 are also conducive to enhancing the degree of disturbance of the fluid near the first column fin 20.

[0097] In one embodiment, if Fig.11As shown, the first column fin 20 is provided with a plurality of spoiler grooves 24, which are stacked at intervals in a direction perpendicular to the circumference of the first column fin 20, and the spoiler grooves 24 include a first spoiler groove 241 and a second spoiler groove 242, which are arranged at intervals on opposite sides of the first column fin 20 in a direction perpendicular to the flow direction of the liquid. The spacing between the first spoiler groove 241 and the second spoiler groove 242 can remain unchanged along the flow direction of the liquid (such as Fig.12 ), or it can gradually decrease along the flow direction of the liquid (as shown in Fig.13 Optionally, the first spoiler groove 241 and the second spoiler groove 242 may be symmetrically arranged, that is, the first spoiler groove 241 and the second spoiler groove 242 have the same shape and are symmetrical with respect to the accommodating cavity 21.

[0098] In another embodiment, Fig.14 As shown, a plurality of spoiler grooves 24 are provided on the first column fin 20, and the plurality of spoiler grooves 24 are arranged in an interval and stacked manner in a direction perpendicular to the circumference of the first column fin 20. The spoiler grooves 24 are arranged around the incoming flow portion 22 along the circumference of the first column fin 20, and both ends of the spoiler grooves 24 extend to the back flow portion 23, so that the cross section of the spoiler grooves 24 is arranged in an arc shape.

[0099] by Fig.13 For example, the first column fin 20 in FIG. Fig.15 As shown, when the fluid flows around the first column fin 20, a part of it will pass through the spoiler groove 24. When the fluid enters the spoiler groove 24, it will also generate vortex beams on the inner wall of the groove, thereby enhancing the heat exchange in the groove; when the fluid passes out of the spoiler groove 24, it will intersect or collide with the fluid or vortex beams at the outer edge, thereby generating greater disturbances near the wall of the first column fin 20, thereby also enhancing the heat exchange outside the groove.

[0100] like Fig.16 As shown, under the action of the spoiler groove 24, not only the flow area and the heat exchange area are increased, but also the fluid near the first column fin 20 has a more intense disturbance, thereby greatly enhancing the convective heat exchange intensity.

[0101] Furthermore, a plurality of second column fins 70 may be provided in the heat dissipation module 300. The second column fins 70 are smaller than the first column fins 20 by a preset ratio, that is, the structure of the second column fins 70 is the same as that of the first column fins 20, and spoiler grooves 24 are also provided. The second column fins 70 are provided in the same manner as in the first embodiment of the heat dissipation module 300. Similarly, third column fins, fourth column fins, etc. may also be provided, which will not be described in detail here.

[0102] See also Figures 17 to 20 , Fig.17 is a schematic diagram of the structure of the first column fin in the third embodiment of the heat dissipation module, Fig.18 This is a CC cross-sectional diagram of the third embodiment of the heat dissipation module. Fig.19 is a schematic diagram of the structure and fluid flow of the liquid cooling chamber in the third embodiment of the heat dissipation module, Fig. 20 yes Fig.17 Schematic diagram of the fluid flow around the first column fin.

[0103] The heat dissipation module 300 in this embodiment is different from the heat dissipation module 300 in the first embodiment only in that the structure of the first column fin 20 is different from that in the second embodiment, and the rest of the structures are the same as those in the first embodiment, which will not be described again.

[0104] See also Fig.17 and Fig.18 In this embodiment, the shape of the first column fin 20 is the same as that in the second embodiment. The first column fin 20 is provided with a plurality of spoiler grooves 24, which are arranged in a stacked manner in a direction perpendicular to the circumference of the first column fin 20. The difference is that the spoiler groove 24 in this embodiment is an annular groove arranged around the incoming flow portion 22 and the back flow portion 23 along the circumference of the first column fin 20, and the spoiler groove 24 in the back flow portion 23 divides the back flow portion 23 into a plurality of heat exchange plates 231 arranged in a stacked manner. It can be understood that the spoiler groove 24 is arranged in an annular shape along the accommodating cavity 21 to form an annular groove, the front half of the annular groove is in an arc shape, and the rear half is in a conical shape, so that the heat exchange area in the spoiler groove 24 is further increased, and the heat exchange intensity is further enhanced.

[0105] Furthermore, the annular spoiler groove 24 can be provided so that the side wall 211 of the accommodating cavity 21 defined by the accommodating cavity 21 and the spoiler groove 24 has a uniform thickness (eg Fig. 20 As shown in FIG. 2 , that is, the side wall 211 of the accommodating chamber 21 is an annular wall with equal wall thickness. It can be understood that when the side wall 211 of the accommodating chamber 21 is set to be an equal-thickness wall, the larger the area of ​​the spoiler groove 24 located at the backflow portion 23, that is, the larger the space between the heat exchange plates 231 located at the backflow portion 23, the more conducive it is for the fluid to achieve efficient transition in the backflow portion 23. Fig.19 As shown, in the downstream flow area of ​​the liquid cooling chamber 10, the fluid on both sides can achieve a lateral span through the spoiler grooves 24 and gradually converge to the second liquid hole 12, thereby enhancing heat exchange while shortening the flow path and further reducing flow impedance.

[0106] See also Fig. 20 When the fluid flows around the spoiler groove 24, a vortex beam will also be generated in the spoiler groove 24 located in the back flow portion 23, that is, a vortex beam will be generated between two adjacent heat exchange plates 231. Since these vortex beams are distributed in the grooves, they can directly disturb the wall surfaces at the top and bottom of each groove, that is, the plate surface of the heat exchange plate 231, thereby further enhancing the heat exchange intensity.

[0107] Furthermore, the heat dissipation module 300 may also be provided with a second column fin 70, a third column fin, a fourth column fin, etc., and the above-mentioned various column fins have certain fractal characteristics, and their structures are the same as the first column fin 20. The arrangement of the above-mentioned various column fins is the same as that in the first embodiment of the heat dissipation module 300, and will not be repeated here.

[0108] See also Fig.21 , Fig.21 It is a structural schematic diagram of an embodiment of a heat dissipation system provided in the present application.

[0109] See also Fig.21 The present application provides a heat dissipation system 400, which includes a blowing member 410 and a heat dissipation module 300. The heat dissipation module 300 can be any heat dissipation module 300 in the above-mentioned heat dissipation module 300 embodiments provided in the present application. The blowing member 410 is used to provide the heat dissipation module 300 with an air flow blowing through the air cooling component 200, so that the heat in the heat dissipation column 210 and the heat dissipation fin 220 is dissipated under the convection of the air cooling air flow provided by the blowing member 410, thereby improving the heat dissipation efficiency.

[0110] See also Fig. 22 , Fig. 22 It is a structural diagram of an embodiment of a server system provided by the present application.

[0111] See also Fig. 22 The present application provides a server system 500, which includes a server host 510 and a heat dissipation module 300. The heat dissipation module 300 can be any heat dissipation module 300 in the above-mentioned heat dissipation module 300 embodiments provided in the present application.

[0112] The side of the bottom plate 30 away from the air cooling assembly 200 contacts the heat source on the server host 510, and the heat dissipation module 300 is connected to the heat source on the server host 510 through the liquid cooling assembly 100.

[0113] The heat dissipation function of the air cooling component 200 dissipates the heat absorbed by the server host 510, thereby meeting the heat dissipation requirements of the server system 500.

[0114] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A heat dissipation module, characterized in that: include: A liquid cooling component is provided with a liquid cooling cavity, a first liquid hole and a second liquid hole communicated with the liquid cooling cavity, and the liquid cooling component includes a plurality of first column fins arranged in the liquid cooling cavity; An air cooling assembly, comprising a plurality of heat dissipation columns connected to the first column fins, and the heat dissipation columns extend outside the liquid cooling cavity; The plurality of first column fins are distributed in multiple rows in the liquid cooling chamber along the flow direction from the first liquid hole to the second liquid hole; the first column fin is provided with a receiving cavity connected to the heat dissipation column; The liquid cooling assembly further includes a shunt pool and a confluence pool, wherein the shunt pool is connected between the first liquid hole and the liquid cooling cavity, and the confluence pool is connected between the liquid cooling cavity and the second liquid hole; wherein the shunt pool is provided with a third liquid hole connected with the liquid cooling cavity, and the hole area of ​​the third liquid hole is larger than the hole area of ​​the first liquid hole; the confluence pool is provided with a fourth liquid hole connected with the liquid cooling cavity, and the hole area of ​​the fourth liquid hole is larger than the hole area of ​​the second liquid hole; The third liquid hole and the fourth liquid hole are long strip holes, and the length dimension in the direction perpendicular to the flow direction is greater than or equal to the length dimension of each row of the first column fins along the perpendicular direction.

2. The heat dissipation module according to claim 1, characterized in that: The first column fins in two adjacent rows are also distributed in a staggered manner.

3. The heat dissipation module according to claim 1 or 2, characterized in that: The first column fin comprises an inflow portion and a backflow portion connected to each other, the inflow portion faces the side where the first liquid hole is located, and the backflow portion faces the side where the second liquid hole is located; Among them, the cross-sectional area of ​​the inflow portion gradually increases in the flow direction from the first liquid hole to the second liquid hole, the cross-sectional area of ​​the backflow portion gradually decreases in the flow direction, and the length dimension of the inflow portion along the flow direction is smaller than the length dimension of the backflow portion along the flow direction.

4. The heat dissipation module according to claim 3, characterized in that: The outer wall surface of the incoming flow portion is an arc surface, the outer wall surface of the back flow portion is a conical surface, and the connection between the arc surface and the conical surface is a transition through an arc.

5. The heat dissipation module according to claim 4, characterized in that: A ratio of a length dimension of the backflow portion along the flow direction to a length dimension of the inflow portion along the flow direction is greater than or equal to 1.2 and less than or equal to 3.

6. The heat dissipation module according to claim 3, characterized in that: The outer wall of the incoming flow portion and / or the back flow portion is provided with some interference flow grooves.

7. The heat dissipation module according to claim 6, characterized in that: The spoiler groove is extended along the circumferential direction of the first column fin, and a plurality of the spoiler grooves are stacked and arranged at intervals along a direction perpendicular to the circumferential direction.

8. The heat dissipation module according to claim 7, characterized in that: The spoiler groove comprises a first spoiler groove and a second spoiler groove, and the first spoiler groove and the second spoiler groove are arranged at intervals on two sides of the first column fin opposite to each other along a direction perpendicular to the flow direction.

9. The heat dissipation module according to claim 8, characterized in that: The distance between the first spoiler groove and the second spoiler groove remains constant or gradually decreases along the flow direction.

10. The heat dissipation module according to claim 8 or 9, characterized in that: The first spoiler groove and the second spoiler groove are symmetrically arranged about a central axis of the first column fin.

11. The heat dissipation module according to claim 7, characterized in that: The spoiler groove is arranged around the incoming flow portion and / or the back flow portion along the circumference of the first column fin.

12. The heat dissipation module according to claim 11, characterized in that: The spoiler groove is arranged around the incoming flow portion along the circumference of the first column fin, and both ends of the spoiler groove also extend to the back flow portion.

13. The heat dissipation module according to claim 11, characterized in that: The spoiler groove is an annular groove arranged around the incoming flow portion and the back flow portion along the circumferential direction of the first column fin, and the spoiler groove at the back flow portion divides the back flow portion into a plurality of heat exchange plates arranged in an interval and stacked manner.

14. The heat dissipation module according to claim 13, characterized in that: The side wall of the accommodating cavity defined by the accommodating cavity and the spoiler groove is a wall of uniform thickness.

15. The heat dissipation module according to claim 3, characterized in that: The liquid cooling assembly further includes second column fins spaced apart on opposite sides of the first column fin along a direction perpendicular to the flow direction, and the second column fins are smaller than the first column fins by a preset ratio.

16. The heat dissipation module according to claim 15, characterized in that: The second column fins are arranged on opposite sides of the back flow portion along the vertical direction.

17. The heat dissipation module according to claim 1, characterized in that: The diversion pool is also provided with a first guide slope, which is used to guide the liquid entering from the first liquid hole to flow to the third liquid hole; the confluence pool is also provided with a second guide slope, which is used to guide the liquid entering from the fourth liquid hole to flow to the second liquid hole.

18. The heat dissipation module according to claim 17, characterized in that: The liquid cooling assembly includes a base plate and a cover plate, the base plate and the cover plate are connected to form the liquid cooling chamber, the first liquid hole and the second liquid hole are respectively arranged at opposite ends of the base plate, the diversion pool and the confluence pool are arranged on the base plate, the first column fin connects the base plate and the cover plate, and the side of the base plate away from the cover plate is used to contact the heat source.

19. The heat dissipation module according to claim 1, characterized in that: The air cooling component also includes a heat dissipation fin arranged on one side of the liquid cooling component, and the heat dissipation fin is connected to the heat dissipation column.

20. The heat dissipation module according to claim 19, characterized in that: The heat dissipation fins include a plurality of first fins distributed along the extension direction of the heat dissipation column and arranged at intervals, and the plurality of first fins are connected to the heat dissipation column.

21. The heat dissipation module according to claim 20, characterized in that: The heat dissipation fins also include second fins connected to two opposite sides of the plurality of first fins, and the second fins are also connected to the liquid cooling assembly.

22. The heat dissipation module according to claim 20, characterized in that: The heat dissipation column passes through the plurality of first fins and extends to a side of the plurality of first fins away from the liquid cooling assembly.

23. The heat dissipation module according to claim 1, characterized in that: The assembly gap between the heat dissipation column and the accommodating cavity is also filled with heat conductive material.

24. The heat dissipation module according to claim 1, characterized in that: The heat dissipation column is a phase change heat transfer tube.

25. A heat dissipation system, characterized in that: The heat dissipation system comprises a blowing member and a heat dissipation module as described in any one of claims 1 to 24, wherein the blowing member is used to provide an air flow blowing through the air-cooling component.

26. A server system, characterized in that: The server system comprises a server host and a heat dissipation module as described in any one of claims 1 to 24, and one side of the liquid cooling component contacts a heat source on the server host.

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