A modular signal sensor

Abstract

The present invention relates to a modular signal sensor, which is characterized in that it includes a resistor module, a connection module and a processing module. The resistor module includes a middle section housing, a receiving groove is arranged in the middle section housing, the receiving groove runs through the middle section housing, and a high-voltage resistor is inserted in the receiving groove; the connection module includes a front section housing, a connection row and a conductive front connection seat are installed on the front section housing, and the front connection seat is detachably connected to the front end electrode of the high-voltage resistor; the processing module includes a rear section housing, a processing circuit board is installed in the rear section housing, a conductive rear connection seat is installed on the rear section housing, the rear connection seat is detachably connected to the rear end electrode of the high-voltage resistor, the rear connection seat is connected to the input end of the processing circuit board, and an optical signal output interface is also installed on the rear section housing. The signal sensor adopts a three-section modular structure design, which can reduce auxiliary structural components, greatly reduce its volume, and is more convenient to install.

Description

Technical Field

[0001] The invention relates to the field of electrical technology, and in particular to a modular signal sensor. Background Art

[0002] At present, the voltage and current sampling in the power grid uses traditional voltage transformers and current transformers. The transformers are large in size and inconvenient to install. It is increasingly difficult to meet the needs of power grid monitoring and thyristor soft starting for fast and convenient layout of transformers.

[0003] Based on the above reasons, there is an urgent need to design a signal sampling device with smaller size and more convenient installation and layout. Summary of the invention

[0004] Based on the above description, the present invention provides a modular signal sensor to solve the technical problems of existing signal sampling devices being large in size and inconvenient to install.

[0005] The technical solution of the present invention to solve the above technical problems is as follows:

[0006] A modular signal sensor comprises a resistor module, a connection module and a processing module, wherein the resistor module comprises a middle section shell, wherein a receiving groove is arranged in the middle section shell, wherein the receiving groove runs through the middle section shell, wherein a high voltage resistor is inserted in the receiving groove, wherein electrodes at both ends of the high voltage resistor extend out of the receiving groove; wherein the connection module comprises a front section shell, wherein a connection row and a conductive front connection seat are arranged on the front section shell, wherein the connection row is connected to the front connection seat, wherein the connection row is used to be connected to a power grid, wherein the front connection seat is detachably connected to the front end electrode of the high voltage resistor; wherein the processing module comprises a rear section shell, wherein a processing circuit board is arranged in the rear section shell, wherein a conductive rear connection seat is arranged on the rear section shell, wherein the rear connection seat is detachably connected to the rear end electrode of the high voltage resistor, wherein the processing circuit board is used to process electrical signals and convert the processed electrical signals into optical signals, wherein the rear connection seat is connected to the input end of the processing circuit board, wherein an optical signal output interface is also arranged on the rear section shell, wherein the output end of the processing circuit board is connected to the optical signal output interface.

[0007] As a preferred solution: a signal processing unit and a photoelectric conversion unit are integrated on the processing circuit board, the input end of the signal processing unit is connected to the rear connecting socket, the output end of the signal processing unit is connected to the input end of the photoelectric conversion unit, the output end of the signal processing unit is connected to the optical signal output interface, and the optical signal output interface is connected to the external control board CPU.

[0008] As a preferred solution: the front connecting socket and the rear connecting socket both include a conductive ring, which is connected to the input end of the signal processing module through a wire, and an opening is provided on one side of the ring for the electrode of the high-voltage resistor to enter, and a pair of conductive contact blocks are symmetrically provided in the opening, the contact blocks are conductively connected to the ring, and the contact blocks are used to clamp the electrode of the high-voltage resistor, and an arc-shaped notch is provided on one side of the contact block that contacts the electrode.

[0009] As a preferred solution: a front bracket is fixed to the front part of the middle shell body, a pair of transverse front plug-in posts are arranged in parallel on the front bracket, and a front plug-in slot for inserting the front plug-in posts is correspondingly arranged on the front shell body; a rear bracket is fixed to the rear part of the middle shell body, a pair of transverse rear plug-in posts are arranged in parallel on the rear bracket, and a rear plug-in slot for inserting the rear plug-in posts is correspondingly arranged on the rear shell body.

[0010] As a preferred solution: a through hole is provided on the ring corresponding to the contact point, a conductive movable block is installed in the through hole, the movable block can slide back and forth along the radial direction of the ring, the two ends of the movable block are respectively located on the inner side and the outer side of the ring, the contact block is connected and fixed to the inner end of the movable block, a conductive elastic pad is provided between the movable block and the inner wall of the ring, and the elastic pad is fixed to the movable block and the ring by means of wire glue.

[0011] As a preferred solution: a conductive contact belt is further provided on the outside of the sleeve ring, the contact belt is elastic, and two ends of the contact belt are respectively connected to the outer ends of the two groups of movable blocks.

[0012] As a preferred solution: a conductive contact plate for contacting the end surface of the electrode is provided in the middle of the contact strip.

[0013] As a preferred solution: both ends of the accommodating groove are funnel-shaped.

[0014] As a preferred solution: the middle section shell is an aluminum shell.

[0015] As a preferred solution: heat dissipation fins are provided on the surface of the middle section shell.

[0016] Compared with the prior art, the technical solution of this application has the following beneficial technical effects:

[0017] The signal sensor adopts a three-section modular structure design, namely, it includes a connection module, a resistance module and a processing module in sequence. The connection module and the resistance module, as well as the processing module and the resistance module, are all detachable connection structures, which can easily disassemble and assemble the connection module and the resistance module, and the processing module and the resistance module. The high-voltage resistor in the resistance module is a detachable design. The user can select a suitable high-voltage resistor according to the actual required resistance value, and insert the selected high-voltage resistor into the resistance module, so that the signal sensor can be applied to different voltage levels, so that it can be used more flexibly. In addition, since the signal sensor adopts a modular structure, it can reduce auxiliary structural components, greatly reduce its volume, and make installation more convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic diagram of the internal structure of the signal collector in this embodiment;

[0019] Figure 2 Based Figure 1 A magnified view of part A in FIG.

[0020] Figure 3 is a schematic structural diagram of the connecting socket in this embodiment;

[0021] Figure 4 for Figure 3 A magnified view of part B in FIG.

[0022] Figure 5 Schematic diagram of the circuit in this embodiment.

[0023] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0024] 1. Resistor module; 101. Middle shell; 102. Accommodating groove; 103. High-voltage resistor; 104. Front bracket; 105. Front plug-in column; 106. Rear bracket; 107. Rear plug-in column; 108. Electrode; 109. Heat dissipation fin; 2. Connection module; 201. Front shell; 202. Connection row; 203. Front plug-in slot; 3. Processing module; 301. Rear shell; 302. Processing circuit board; 303. Optical signal output interface; 304. Rear plug-in slot; 4. Front connecting seat; 5. Rear connecting seat; 501. Ring; 502. Through hole; 503. Movable block; 504. Contact block; 505. Notch; 506. Elastic pad; 507. Contact belt; 508. Opening; 509. Contact plate. DETAILED DESCRIPTION

[0025] Reference Figure 1 , a modular signal sensor includes a resistance module 1, a connection module 2 and a processing module 3.

[0026] The resistor module 1 includes a middle shell 101, in which a receiving groove 102 is arranged. The receiving groove 102 passes through the middle shell 101, and a high-voltage resistor 103 is inserted in the receiving groove 102. Electrodes 108 at both ends of the high-voltage resistor 103 extend from the receiving groove 102, so that the high-voltage resistor 103 can be pulled out of the receiving groove 102.

[0027] The connection module 2 includes a front shell 201, on which a connection row 202 and a conductive front connection seat 4 are installed. The connection row 202 is connected to the front connection seat 4 through a wire. The connection row 202 is used to connect to the power grid, and the front connection seat 4 is used to connect to the front electrode 108 of the high-voltage resistor 103. The front connection seat 4 and the front electrode 108 of the high-voltage resistor 103 are detachably connected.

[0028] The processing module 3 includes a rear-end shell 301, in which a processing circuit board 302 is installed, and a conductive rear connecting seat 5 is installed on the rear-end shell 301, and the rear connecting seat 5 is used to connect to the rear-end electrode 108 of the high-voltage resistor 103, and the rear connecting seat 5 and the rear end electrode 108 of the high-voltage resistor 103 are detachably connected; the processing circuit board 302 is used to process electrical signals and convert the processed electrical signals into optical signals, and the rear connecting seat 5 is connected to the input end of the processing circuit board 302 through a wire, and an optical signal output interface 303 is also installed on the rear-end shell 301, and the output end of the processing circuit board 302 is connected to the optical signal output interface 303.

[0029] Reference Figure 5 The processing circuit board 302 integrates a signal processing unit and a photoelectric conversion unit. The input end of the signal processing unit is connected to the rear connection seat 5 to achieve connection with the rear end electrode 108 of the high-voltage resistor 103. The output end of the signal processing unit is connected to the input end of the photoelectric conversion unit. The output end of the signal processing unit is connected to the optical signal output interface 303, and the optical signal output interface 303 is connected to the external control board CPU.

[0030] When the signal sensor is working, the connecting bar 202 is connected to the power grid, and the voltage of the power grid acts on the high-voltage resistor 103 to generate current. The current flows through the connecting bar 202 and the high-voltage resistor 103 in sequence. The signal processing module 3 collects the analog current signal flowing out of the rear end electrode 108 of the high-voltage resistor 103. The photoelectric conversion module converts the analog current signal into an optical signal and transmits the optical signal to the control board CPU through the optical cable. The control board CPU restores the optical signal into an analog current signal, and then calculates the voltage value according to the current value and the resistance value of the high-voltage resistor 103, thereby realizing the collection and remote monitoring of the voltage and current signals of the power grid.

[0031] The signal sensor adopts a three-section modular structure design, namely, it includes a connection module 2, a resistor module 1 and a processing module 3 in sequence. The connection module 2 and the resistor module 1 and the processing module 3 and the resistor module 1 are all detachable connection structures, which can easily disassemble and assemble the connection module 2 and the resistor module 1 and the processing module 3 and the resistor module 1. The high-voltage resistor 103 in the resistor module 1 is a detachable design. The user can select a suitable high-voltage resistor 103 according to the actual required resistance value, and insert the selected high-voltage resistor 103 into the resistor module 1, so that the signal sensor can be applied to different voltage levels, so that it can be used more flexibly. In addition, since the signal sensor adopts a modular structure, it can reduce auxiliary structural components, greatly reduce its volume, and make installation more convenient.

[0032] In this embodiment, the front connection seat 4 and the rear connection seat 5 have the same structure. Figure 1 , Figure 2 and Figure 3 , take the connection socket 5 as an example:

[0033] The rear connecting socket 5 in this embodiment includes a conductive ring 501, which is connected to the input end of the signal processing module 3 through a wire. An opening 508 for the electrode 108 of the high-voltage resistor 103 to enter is provided on one side of the ring 501. A pair of conductive contact blocks 504 are symmetrically provided in the opening 508. The contact blocks 504 are conductively connected to the ring 501. The contact blocks 504 are used to clamp the electrode 108 of the high-voltage resistor 103. An arc-shaped notch 505 is provided on the side of the contact block 504 that contacts the electrode 108.

[0034] After the electrode 108 of the high-voltage resistor 103 is squeezed into the ring 501, the two groups of contact blocks 504 clamp the two sides of the electrode 108 respectively, so as to connect the ring 501 and the electrode 108 and prevent the electrode 108 from loosening. Such a structure can easily connect and disconnect the connection socket and the electrode 108 of the high-voltage resistor 103.

[0035] In order to improve the stability of the connection between the connection module 2, the processing module 3 and the resistance module 1. In this embodiment, a front bracket 104 is fixed to the front of the middle shell 101, a pair of horizontal front plug-in posts 105 are arranged in parallel on the front bracket 104, and a front plug-in slot 203 for inserting the front plug-in posts 105 is correspondingly arranged on the front shell 201. The connection module 2 and the resistance module 1 can be installed together by inserting the front plug-in posts 105 into the front plug-in slots 203.

[0036] In this embodiment, the front plug post 105 is located outside the opening 508 of the front connecting seat 4. When the front plug post 105 is inserted into the front plug slot 203, the front end electrode 108 of the high-voltage resistor 103 can be inserted into the ring 501 of the front connecting seat 4.

[0037] Similarly, a rear bracket 106 is fixed to the rear of the middle shell 101 , a pair of transverse rear plug-in posts 107 are arranged in parallel on the rear bracket 106 , and a rear plug-in slot 304 for inserting the rear plug-in posts 107 is correspondingly arranged on the rear shell 301 .

[0038] On this basis, a through hole 502 is opened on the ring 501 corresponding to the contact fast position, and a conductive movable block 503 is installed in the through hole 502. The movable block 503 can slide back and forth along the radial direction of the ring 501. The two ends of the movable block 503 are respectively located on the inner side and the outer side (i.e., the inner end and the outer end) of the ring 501. The contact block 504 is connected and fixed to the inner end of the movable block 503. A conductive elastic pad 506 is arranged between the movable block 503 and the inner wall of the ring 501. The elastic pad 506 is made of conductive silicone (or conductive rubber). The elastic pad 506 is fixed to the movable block 503 and the ring 501 by bonding with wire glue. In this way, it can ensure that the contact block 504 can move with the movable block 503 and the conductivity between the contact block 504 and the ring 501 can be ensured.

[0039] A conductive contact belt 507 is also provided outside the sleeve ring 501 . The contact belt 507 is made of a metal elastic sheet to make it elastic. The two ends of the contact belt 507 are connected to the outer ends of the two groups of movable blocks 503 respectively.

[0040] When the electrode 108 of the high-voltage resistor 103 is squeezed into the sleeve ring 501, the electrode 108 pushes the two groups of contact blocks 504, so that the contact blocks 504 and the movable blocks 503 move outward synchronously, the elastic pad 506 is compressed and deformed to store energy, and the two ends of the contact belt 507 move away from each other. At this time, the contact belt 507 is tightened, and the middle part of the contact belt 507 contacts and presses the end surface of the electrode 108, so as to achieve contact and conduction between the contact belt 507 and the electrode 108. After adding the contact belt 507, the reliability of the connection and conduction between the connection seat and the electrode 108 can be improved.

[0041] When the electrode 108 is pulled out from the connection socket, the elastic force of the elastic pad 506 drives the contact block 504 to return to its original position.

[0042] like Figure 3 As shown, in this embodiment, a conductive contact disc 509 for contacting the end surface of the electrode 108 is also provided in the middle of the contact belt 507. The contact disc 509 is a graphite disc, and the graphite material has excellent conductivity and wear resistance, which can not only improve the conductivity between the contact belt 507 and the electrode 108, but also delay wear and extend the service life.

[0043] like Figure 1 As shown, both ends of the receiving groove 102 in this embodiment are funnel-shaped, so that the high-voltage resistor 103 can be easily disassembled and assembled.

[0044] Considering that the high-voltage resistor 103 generates a lot of heat during the operation of the signal sensor, the middle shell 101 in this embodiment is an aluminum shell to facilitate the heat dissipation of the high-voltage resistor 103. The aluminum shell has good thermal conductivity and can quickly and efficiently dissipate heat from the high-voltage resistor 103.

[0045] On this basis, heat dissipation fins 109 are further provided on the surface of the middle shell 101 to improve the heat dissipation efficiency.

[0046] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A modular signal sensor, characterized in that: It comprises a resistance module, a connection module and a processing module, wherein the resistance module comprises a middle section shell, wherein a receiving groove is arranged in the middle section shell, wherein the receiving groove runs through the middle section shell, wherein a high-voltage resistor is inserted in the receiving groove, wherein electrodes at both ends of the high-voltage resistor extend out of the receiving groove; the connection module comprises a front section shell, wherein a connection row and a conductive front connection seat are arranged on the front section shell, wherein the connection row is connected with the front connection seat, wherein the connection row is used to be connected with a power grid, wherein the front connection seat is detachably connected with the front end electrode of the high-voltage resistor; the processing module comprises a rear section shell, wherein a processing circuit board is arranged in the rear section shell, wherein a conductive rear connection seat is arranged on the rear section shell, wherein the rear connection seat is detachably connected with the rear end electrode of the high-voltage resistor, wherein the processing circuit board is used to process electrical signals and convert the processed electrical signals into optical signals, wherein the rear connection seat is connected with the input end of the processing circuit board, wherein an optical signal output interface is also arranged on the rear section shell, wherein the output end of the processing circuit board is connected with the optical signal output interface; The front connection seat and the rear connection seat both include a conductive collar, the collar is connected to the input end of the signal processing module through a wire, one side of the collar is provided with an opening for the electrode of the high-voltage resistor to enter, a pair of conductive contact blocks are symmetrically provided in the opening, the contact blocks are in conduction with the collar, the contact blocks are used to clamp the electrode of the high-voltage resistor, and a side of the contact block in contact with the electrode is provided with an arc-shaped notch; A through hole is provided on the ring at a position corresponding to the contact block, and a conductive movable block is installed in the through hole. The movable block can slide back and forth along the radial direction of the ring, and the two ends of the movable block are respectively located on the inner side and the outer side of the ring. The contact block is connected and fixed to the inner end of the movable block, and a conductive elastic pad is provided between the movable block and the inner wall of the ring. The elastic pad is fixed to the movable block and the ring by means of wire glue.

2. The modular signal sensor according to claim 1, characterized in that: A signal processing unit and a photoelectric conversion unit are integrated on the processing circuit board. The input end of the signal processing unit is connected to the rear connection socket, the output end of the signal processing unit is connected to the input end of the photoelectric conversion unit, the output end of the signal processing unit is connected to the optical signal output interface, and the optical signal output interface is connected to the external control board CPU.

3. The modular signal sensor according to claim 1, characterized in that: A front bracket is fixed to the front of the middle shell, and a pair of horizontal front plug-in columns are arranged in parallel on the front bracket, and a front plug-in slot for inserting the front plug-in columns is correspondingly arranged on the front shell; a rear bracket is fixed to the rear of the middle shell, and a pair of horizontal rear plug-in columns are arranged in parallel on the rear bracket, and a rear plug-in slot for inserting the rear plug-in columns is correspondingly arranged on the rear shell.

4. The modular signal sensor according to claim 1, characterized in that: A conductive contact belt is also arranged outside the sleeve ring. The contact belt is elastic, and two ends of the contact belt are respectively connected to the outer ends of the two groups of movable blocks.

5. The modular signal sensor according to claim 4, characterized in that: A conductive contact pad for contacting the end surface of the electrode is arranged in the middle of the contact strip.

6. The modular signal sensor according to claim 1, characterized in that: Both ends of the accommodating groove are funnel-shaped.

7. The modular signal sensor according to claim 1, characterized in that: The middle section shell is an aluminum shell.

8. The modular signal sensor according to claim 7, characterized in that: The surface of the middle section shell is provided with heat dissipation fins.

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