Device for transferring electronic components

Abstract

The present invention provides a device for transferring electronic components, which is used to transfer the electronic components on a flexible carrier to a target substrate. The transfer device includes a first frame, a second frame, an actuating mechanism and a light source. The first frame is used to carry the flexible carrier. The second frame is used to carry the target substrate, and the target substrate and the carrier are arranged relative to each other. The actuating mechanism is used to actuate a pin. The pin is made of a material that is light-transmissive and is arranged adjacent to the flexible carrier. The pin can be moved toward the flexible carrier by actuation of the actuating mechanism, and its abutting end can abut the flexible carrier, thereby abutting the electronic components on the flexible carrier to the target substrate. The light source can project a light beam. The light beam passes through at least a portion of the pin and is emitted from the abutting end of the pin to the flexible carrier.

Description

Technical Field

[0001] The present invention relates to a device, and more particularly to a device suitable for transferring electronic components. Background Art

[0002] In the manufacturing process of electronic products, there are often related electronic component transfer steps. For example, in the manufacturing process of light-emitting diode display panels (LED displays), the light-emitting diodes are often placed on a thin-film transistor array substrate (TFT array substrate) through a pick-and-place apparatus, and then the light-emitting diodes on the thin-film transistor array substrate are fixed and electrically connected to the thin-film transistor array substrate. However, in the above-mentioned method, if the environment or equipment vibrates slightly after the light-emitting diodes are placed on the thin-film transistor array substrate and before the light-emitting diodes are fixed to the thin-film transistor array substrate, the unfixed light-emitting diodes may be shifted. In addition, the throughput of the above-mentioned method may be low. Summary of the invention

[0003] The present invention is directed to a device that can be used to transfer electronic components.

[0004] According to an embodiment of the present invention, a device for transferring electronic components is used to transfer electronic components on a flexible carrier to a target substrate. The transfer device includes a first frame, a second frame, an actuating mechanism, and a light source. The first frame is used to carry the flexible carrier. The second frame is used to carry the target substrate, and the target substrate and the flexible carrier are arranged relative to each other. The actuating mechanism is used to actuate the ejector pin. The ejector pin is made of a material that is light-transmissive and is arranged adjacent to the flexible carrier. It can be moved toward the direction of the flexible carrier through the actuation of the actuating mechanism, and its abutting end can abut the flexible carrier, thereby abutting the electronic components on the flexible carrier to the target substrate. The light source can project a light beam. The light beam passes through at least a portion of the ejector pin and is emitted to the flexible carrier from the abutting end of the ejector pin.

[0005] Based on the above, the device for transferring electronic components can be suitable for transferring the electronic components on the flexible carrier to the target substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figures 1 to 7 It is a partial side view schematic diagram of a partial actuation method of a device for transferring electronic components according to an embodiment of the present invention.

[0007] Figure 8 It is a corresponding timing diagram of a partial actuation method of a device for transferring electronic components according to an embodiment of the present invention.

[0008] Fig. 9A It is a partial side view schematic diagram of a device for transferring electronic components according to an embodiment of the present invention when in operation.

[0009] Fig. 9B It is a partial top view schematic diagram of a device for transferring electronic components according to an embodiment of the present invention when in operation.

[0010] Fig.10 It is a partial side view schematic diagram of a device for transferring electronic components according to an embodiment of the present invention when in operation.

[0011] Description of Reference Numerals

[0012] 100: device;

[0013] 110: First frame;

[0014] 120: second frame;

[0015] 130: actuating mechanism;

[0016] 140: light source;

[0017] 150: control system;

[0018] 151: Input unit;

[0019] 152: output unit;

[0020] 153: Arithmetic unit;

[0021] 154: storage unit;

[0022] 159: signal line;

[0023] 160: Cloud system;

[0024] 200: thimble;

[0025] 220, 230: end;

[0026] 300: flexible carrier;

[0027] 300a, 300b: surface;

[0028] 310: carrier frame;

[0029] 400, 401, 402: electronic components;

[0030] 430: Grain;

[0031] 450: conductive connector;

[0032] 500: target substrate;

[0033] 540: pad;

[0034] 610: Elastomer;

[0035] 620: Carrier;

[0036] 620b: bearing surface;

[0037] 630: fasteners;

[0038] D1: top direction;

[0039] L1, L2: light beam;

[0040] t1, t2, t3, t4, t5: timing. DETAILED DESCRIPTION

[0041] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

[0042] The content of the following embodiments is for illustration rather than limitation. Moreover, the description of well-known devices, methods and materials may be omitted so as not to obscure the description of the various principles of the present invention. The directional terms used herein (e.g., up, down, top, bottom) are only used with reference to the idiomatic terms used or corresponding to the drawings shown, and are not intended to imply an absolute orientation. In addition, unless the content clearly indicates, the singular form "one", "an", "the" or the form not specifically indicating the quantity may include one or a plurality of forms, that is, including "at least one".

[0043] In some of the drawings, for the sake of clarity, some components or film layers may be enlarged, reduced or omitted. Similar components are represented by the same reference numerals and have similar functions, materials or formation methods, and the description is omitted. It will be obvious to those with ordinary knowledge in the technical field to which the present invention belongs that the present invention can be practiced in other embodiments that deviate from the specific details disclosed herein through the contents of the embodiments and the corresponding drawings.

[0044] Please refer to Figure 1, a device 100 suitable for transferring an electronic component 400 is provided. In the present embodiment, the device 100 can transfer the electronic component 400 from the flexible carrier 300 and solder it to the target substrate 500 (described in detail below). That is, the device 100 can be referred to as a transfer soldering device. The device 100 includes a first frame 110, a second frame 120, an actuating mechanism 130, and a light source 140. The first frame 110 is suitable for carrying the flexible carrier 300. The second frame 120 is suitable for carrying the target substrate 500. And, after the target substrate 500 is carried on the second frame 120, the target substrate 500 on the second frame 120 can be arranged relative to the flexible carrier 300. The actuating mechanism 130 is suitable for directly or indirectly actuating the ejector pin 200. The ejector pin 200 can be arranged adjacent to the flexible carrier 300. Furthermore, the ejector pin 200 can be directly or indirectly actuated via the actuating mechanism 130 to move relatively toward the flexible carrier 300. In addition, the abutting end 230 of the ejector pin 200 can abut the flexible carrier 300, and abut the electronic component 400 on the flexible carrier 300 onto the target substrate 500. The light source 140 can project one or more light beams. The aforementioned multiple light beams may refer to different light beams having different dominant wavelengths; or different light beams having the same dominant wavelength but different total energies or energy densities; or different light beams having different dominant wavelengths and different total energies or energy densities. The light beam projected by the light source 140 can be injected into the ejector pin 200 from the other end 220 relative to the abutting end 230, and emitted from the abutting end 230 of the ejector pin 200. In other words, the light beam can pass through at least a portion of the ejector pin 200, and be emitted from the abutting end 230 of the ejector pin 200 toward the flexible carrier 300.

[0045] In this embodiment, the device 100 may further include a control system 150. The control system 150 may be connected to corresponding components, assemblies or units (such as the first frame 110, the second frame 120, the actuator 130 and / or the light source 140, but not limited thereto) by means of wired signal transmission via corresponding signal lines 159, but the present invention is not limited thereto. In one embodiment, the control system 150 may be connected to corresponding components, assemblies or units by means of wireless signal transmission. In other words, the device 100 including the control system 150 and the first frame 110, the second frame 120, the actuator 130 and the light source 140 connected thereto by signals is the same device or machine. In addition, the signal connection mentioned in the present invention may generally refer to a connection method of wired signal transmission or wireless signal transmission. In addition, the present invention does not limit all signal connection methods to be the same or different.

[0046] In this embodiment, the control system 150 may include corresponding hardware or software.

[0047] In one embodiment, the control system 150 includes, for example, an input unit 151, an output unit 152, a computing unit 153 and / or a storage unit 154. The input unit 151 includes, for example, a keyboard, a mouse, a touch screen, a signal receiving end (such as a corresponding data port or antenna) and / or other similar units suitable for data input. The output unit 152 includes, for example, a screen, a printer, a signal output end (such as a corresponding data port or antenna) and / or other similar units suitable for data output. The computing unit 153 includes, for example, a central processing unit (CPU), a graphics processing unit (Graphics Processing Unit), a physical processing unit (PPU) or other similar units suitable for calculation, logical judgment and / or data processing. The storage unit 154 includes, for example, a memory, a hard disk, a disk array, a database and / or other similar units suitable for permanent or temporary data storage.

[0048] In one embodiment, the control system 150 may also be signal-connected to the cloud system 160. The cloud system 160 may perform input, output, calculation, storage, monitoring, data collection, statistics and / or other suitable operations through the control system 150 by remote control. The aforementioned cloud system 160 may include, for example, an Advanced Planning and Scheduling System (APS system), a Facility Monitoring Control System (FMCS system) or other suitable industrial control systems (ICS), but the present invention is not limited thereto.

[0049] In one embodiment, the control system 150 includes, for example, software suitable for performing logic judgment or a platform suitable for performing advanced process control (APC) and / or a programmable logic controller (PLC), but the present invention is not limited thereto.

[0050] In this embodiment, the material of the first frame 110 may include metal, glass or plastic, but the present invention is not limited thereto. In one embodiment, the first frame 110 may include corresponding fixing members (such as clamps and / or clamps, but not limited thereto), and may be suitable for directly and / or indirectly fixing the flexible carrier 300. For example, the first frame 110 may indirectly fix the flexible carrier 300 via the carrier frame 310. For another example, the contact between the first frame 110 and the flexible carrier 300 may directly fix the flexible carrier 300 via friction between them or other suitable methods.

[0051] In one embodiment, the first frame 110 may include a corresponding transmission member (such as a roller, but not limited thereto) to enable the flexible carrier 300 to be transported in an appropriate direction. It is worth noting that the aforementioned fixing member and the aforementioned transmission member may be the same member or different members. For example, the flexible carrier 300 may be sandwiched between two rollers, and when the rollers are not rotated, the flexible carrier 300 may be fixed accordingly; and when the rollers are rotated, the flexible carrier 300 may be transported accordingly.

[0052] In one embodiment, the first frame 110 can be fixed or mounted on the movable unit. In this way, the first frame 110 can move and / or rotate in the corresponding direction according to the design requirements. The movable unit may include a movable module commonly used in the design of movable mechanisms (such as: a horizontal moving module, a vertical moving module, a rotational moving module or a combination of the above), which may include corresponding hardware or software, or further combined with auxiliary parts. For example, the movable module may have a power supply device, a motor, a belt, a gear and other related components, which are not limited to the present invention. The aforementioned related components include, for example, communication components, power components, etc., which are not limited to the present invention. The aforementioned software includes, for example, spatial position calculation software, error recording software, communication software, etc., which are not limited to the present invention. The aforementioned auxiliary parts include, for example, moving tracks, moving shafts, shock absorbing components, positioning devices, etc., which are not limited to the present invention.

[0053] In this embodiment, the flexible carrier 300 may include UV tape or blue tape, but the present invention is not limited thereto. In one embodiment, the carrier frame 310 may be referred to as a blue tape frame, but the present invention is not limited thereto.

[0054] In one embodiment, the flexible carrier 300 may be a composite material. For example, the flexible carrier 300 may have a polymer film or ultra-thin glass covered with an adhesive layer.

[0055] In the present embodiment, the actuating mechanism 130 may include a movable module commonly used in the design of movable mechanisms (such as: a horizontal moving module, a vertical moving module, a rotational moving module or a combination of the above), which may include corresponding hardware or software, or may be further combined with auxiliary parts. For example, the movable module may have a power supply device, a motor, a belt, a gear and other related components, which are not limited in the present invention. The aforementioned related components include, for example, communication components, power components, etc., which are not limited in the present invention. The aforementioned software includes, for example, spatial position calculation software, error recording software, communication software, etc., which are not limited in the present invention. The aforementioned auxiliary parts include, for example, moving rails, moving shafts, shock absorbing components, positioning devices, etc., which are not limited in the present invention. In this way, the ejector pin 200 directly or indirectly fixed to the actuating mechanism 130 can move and / or rotate in the corresponding direction according to design requirements.

[0056] In one embodiment, Fig. 9A or Fig. 9B As shown, the ejector pin 200 may be indirectly fixed to the actuating mechanism 130, wherein Fig. 9B It can be corresponding to Fig. 9A And, for clarity, Fig. 9BThe following is omitted: Fig. 9A The fastener 630 in.

[0057] like Fig. 9A or Fig. 9B As shown, the carrier 620 may have a bearing surface 620b corresponding to the ejector pin 200, and the fastener 630 is disposed corresponding to the carrier 620, wherein the bearing surface 620b may be an inclined surface. In this way, the ejector pin 200 may be directly or indirectly accommodated in the carrier 620. For example, a corresponding elastic body 610 may be disposed between the fastener 630 and the ejector pin 200, and the fastener 630 may indirectly buckle the ejector pin 200 via the elastic body 610.

[0058] In one embodiment, the fastener 630 and the carrier 620, the fastener 630 and the actuating mechanism 130, and / or the actuating mechanism 130 and the carrier 620 can be fixed to each other via commonly used fixing members (not shown; such as: screws, retaining rings, adhesives and / or corresponding threads between the two components; but not limited to), but the present invention is not limited thereto. The elastic body 610 is, for example, a commonly used O-ring, but the present invention is not limited thereto.

[0059] In this embodiment, the material of the ejector pin 200 may be suitable for allowing the light beam projected by the light source 140 to penetrate therethrough. The penetration rate of the light beam projected by the light source 140 into the material of the ejector pin 200 may be, for example, greater than or equal to 50%; greater than or equal to 60%; greater than or equal to 70%; greater than or equal to 75%; greater than or equal to 80%; greater than or equal to 85%; greater than or equal to 90%; greater than or equal to 95%; or greater than or equal to 98%. In one embodiment, the material of the ejector pin 200 may be quartz, but the present invention is not limited thereto. In one embodiment, the material of the ejector pin 200 may include sapphire (e.g., artificial sapphire) or diamond (e.g., artificial diamond).

[0060] In this embodiment, the ejector pin 200 may be a homogeneous material, and the aforementioned homogeneous material cannot be separated into different single materials by mechanical methods (such as crushing, shearing, cutting, sawing, grinding, etc.). In other words, the ejector pin 200 may not have an interface formed by different materials, different processes (such as adhesion) and / or different objects (such as embedded objects).

[0061] In this embodiment, the light beam projected by the light source 140 can also penetrate the flexible carrier 300. For example, the flexible carrier 300 can have a first surface 300a and a second surface 300b. The second surface 300b is opposite to the first surface 300a. The electronic component 400 is located on the second surface 300b. The light beam projected by the light source 140 can penetrate the flexible carrier 300 from the first surface 300a to the second surface 300b.

[0062] In one embodiment, the light beam projected by the light source 140 may be a laser beam. In one embodiment, the light beam projected by the light source 140 may be an infrared light beam (e.g., a light beam with a wavelength of about 1064 nanometers (nm); but not limited thereto). For example, the light beam projected by the light source 140 may be an infrared laser beam.

[0063] In this embodiment, the second frame 120 may not be light-transmissive. The material of the second frame 120 may include metal, plastic or other materials suitable for supporting or fixing the target substrate 500 .

[0064] In one embodiment, the second frame 120 may be fixed or mounted on the movable unit, so that the second frame 120 may move and / or rotate in a corresponding direction according to design requirements.

[0065] In this embodiment, the target substrate 500 may include a corresponding circuit, wherein the circuit may include a corresponding pad 540 exposed to the outside. In one embodiment, the target substrate 500 may include a hard circuit board or a flexible circuit board, but the present invention is not limited thereto. In one embodiment, the target substrate 500 may be a circuit board further including active components (such as a thin film transistor array substrate (TFT array substrate), but not limited thereto).

[0066] In this embodiment, the electronic component 400 may include a die 430 and a conductive connection member 450 disposed on the die 430, but the present invention is not limited thereto. The die 430 may include a light-emitting die (such as, but not limited to, a light-emitting diode die) or an integrated circuit (IC), but the present invention is not limited thereto. At least one light beam projected by the light source 140 may be suitable for melting at least a portion of the conductive connection member 450. In one embodiment, the conductive connection member 450 includes, for example, solder, but the present invention is not limited thereto.

[0067] In an embodiment not shown, the electronic component 400 may include a die similar to the die 430 , and the target substrate 500 may have corresponding conductive connectors thereon similar to the conductive connector 450 .

[0068] The method of transferring the electronic component 400 from the flexible carrier 300 to the target substrate 500 via the apparatus 100 may be as described below. However, it should be noted that the present invention is not limited to the method described below.

[0069] Please refer to Figure 1 , providing an apparatus 100. Then, the following steps are performed in any order: a target substrate 500 is disposed on the second frame 120 of the apparatus 100, and a flexible carrier 300 having at least one electronic component 400 disposed thereon is disposed on the first frame 110. Furthermore, the electronic component 400 disposed on the flexible carrier 300 is disposed in a manner such that the electronic component 400 disposed on the flexible carrier 300 is opposite to the target substrate 500 and there is a corresponding distance between them. It is worth noting that Figure 1 In the embodiment, the number and / or configuration of the electronic components 400 disposed on the flexible carrier 300 are only shown as examples and are not limited to the present invention. Figure 1 In the embodiment, the method of disposing the target substrate 500 on the second frame 120 of the apparatus 100 and / or the method of disposing the flexible carrier 300 on the first frame 110 are only shown as examples and are not limited in the present invention.

[0070] In one embodiment, after the flexible carrier 300 having at least one electronic component 400 disposed thereon and the target substrate 500 are disposed at corresponding positions, a light beam L1 can be selectively projected to the electronic component 400 on the flexible carrier 300 via the light source 140 of the device 100. The light beam L1 can be a preheating beam, but the present invention is not limited thereto. In a possible embodiment, the light beam L1 can be a positioning beam or a scanning beam.

[0071] In addition, Figure 1 In the drawings or other similar drawings, the optical path of the light beam is only schematically shown. In an embodiment not shown, a suitable optical component (such as a light reflection component, a lens, a filter, an aperture, etc., but not limited thereto) may be provided on the optical path of the light beam.

[0072] Please refer to Figure 1 and Fig. 9A In one embodiment, the ejector pin 200 may contact the carrying surface 620 b of the carrier 620 .

[0073] Please refer to Figure 1 to Figure 2 (For example: corresponding to Figure 8 In the timing sequence t1 to t2 in the figure, the ejector pin 200 of the device 100 is brought close to the flexible carrier 300 in the abutting direction D1, so as to further cause the abutting end portion 230 of the ejector pin 200 to abut against a side of the flexible carrier 300 that does not carry the electronic component 400 (e.g., the first surface 300a).

[0074] Please refer to Figures 2 to 3 , the ejector pin 200 can be further pressed against the flexible carrier 300 to cause the flexible carrier 300 to produce a corresponding deformation (i.e., to bend the flexible carrier 300 toward the target substrate 500). Furthermore, the ejector pin 200 can be brought close to the target substrate 500 so that an electronic component 401 (one of the electronic components 400) corresponding to the ejector pin 200 is brought close to the target substrate 500. In this way, Figure 4 As shown, the electronic component 401 corresponding to the position where the ejector pin 200 abuts against the flexible carrier 300 contacts the target substrate 500 .

[0075] In this embodiment, in the direction parallel to the abutting direction D1, the ejector pin 200 may be a movable member, and the first frame 110 and the second frame 120 are not movable members, but the present invention is not limited thereto. In an embodiment not shown, in the direction parallel to the abutting direction D1, the first frame 110 and the second frame 120 may be movable members, and the ejector pin 200 is not a movable member. In an embodiment not shown, in the direction parallel to the abutting direction D1, the ejector pin 200, the first frame 110 and the second frame 120 may all be movable members.

[0076] Please refer to Figure 3 and Fig.10 In one embodiment, after the ejector pin 200 pushes against the flexible carrier 300 and causes it to deform accordingly, the ejector pin 200 can be separated from the bearing surface 620b of the carrier 620, and the elastic body 610 can be correspondingly compressed in a direction parallel to the pushing direction D1.

[0077] Please refer to Figure 4 (For example: corresponding to Figure 8 The heating light beam L2 may be projected to the electronic component 401 on the flexible carrier 300 via the light source 140 of the device 100 when and / or after the corresponding electronic component 401 contacts the target substrate 500. The heating light beam L2 may pass through at least a portion of the ejector pin 200 and be emitted from the abutting end portion 230 of the ejector pin 200, so that the conductive connecting member 450 of the electronic component 401 corresponding to the ejector pin 200 is at least partially melted, and the melted at least a portion of the conductive connecting member 450 may contact the corresponding pad 540 on the target substrate 500. Then, the projection of the heating light beam L2 may be stopped (e.g., corresponding to the heating light beam L2 being projected to the target substrate 500). Figure 8 The timing t4 in the figure can be reached, and the heat can be dissipated by a suitable method (such as: by a fan or other active heat dissipation method; or, a passive heat dissipation method of standing for a period of time), so that the electronic component 401 is soldered to the target substrate 500 and electrically connected to the corresponding circuit on the target substrate 500.

[0078] Please refer to Figures 4 to 5 and Figure 8 , so that the ejector pin 200 is away from the target substrate 500, so that the flexible carrier 300 with appropriate elasticity / flexibility can be Figure 6 (For example: corresponding to Figure 8 In addition, since the bonding force between the electronic component 401 and the target substrate 500 is greater than the bonding force between the electronic component 401 and the flexible carrier 300 after the electronic component 401 is soldered to the target substrate 500, the electronic component 401 soldered to the target substrate 500 can be separated from the carrier. In this way, the transfer action and the soldering action of the electronic component 401 can be completed through the aforementioned single step.

[0079] Through the above exemplary manner, the electronic component 401 can be transferred from the flexible carrier 300 to the target substrate 500 through the apparatus 100 .

[0080] Please refer to Figure 6 to Figure 7 In one embodiment, after completing the transfer of an electronic component 401, the first frame 110, the second frame 120, the actuator 130 and / or the light source 140 can be moved in an appropriate direction (e.g., a direction perpendicular to the top direction D1) to transfer another electronic component 402 (another one of the electronic components 400) in the same or similar manner as described above.

[0081] In summary, the device for transferring electronic components of the present invention can be suitable for transferring electronic components on a flexible carrier to a target substrate. In addition, the device can integrate the pressing or transferring action of the ejector pin with the irradiation or heating welding action of the light source through the combination of the ejector pin and the light source. In this way, the positioning accuracy or precision can be improved during the transfer of the electronic components, thereby improving the welding effect. On the other hand, through the use of the device, the electronic components can be directly transferred from the flexible carrier to the target substrate and welded. In this way, the process time, equipment cost and / or the use of consumables (such as temporary carriers and glue) can be reduced, and production efficiency can be improved.

[0082] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A device for transferring electronic components, It is characterized in that For transferring an electronic component on a flexible carrier to a target substrate, the device comprises: A first frame, which is used to carry the flexible carrier; A second frame, which is used to carry the target substrate and to arrange the target substrate and the flexible carrier relatively; an actuating mechanism for actuating a pin, wherein the pin is made of a material that is light-transmissive and is disposed adjacent to the flexible carrier. The pin can be moved toward the flexible carrier by the actuation of the actuating mechanism, and abuts the flexible carrier with its abutting end, thereby abutting the electronic component on the flexible carrier onto the target substrate, wherein the pin is made of a homogeneous material; and A light source can project a light beam, wherein the light beam enters the ejector pin from the other end relative to the abutting end, passes through at least a portion of the ejector pin, and is emitted from the abutting end of the ejector pin toward the flexible carrier.

2. The device according to claim 1, It is characterized in that The material of the ejector pin is quartz.

3. The device according to claim 1, It is characterized in that The light source may generate a laser beam.

4. The device according to claim 1, It is characterized in that The light source can generate an infrared light beam.

5. The device according to claim 1, It is characterized in that The light source is activated at least when the ejector pin pushes the electronic component on the flexible carrier onto the target substrate, so that the energy of the light beam welds the electronic component onto the target substrate.

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