Non-return-to-zero sensing lens

Abstract

The application discloses a non-reflow sensing lens, comprising a circuit board, an electronic chip mounted on the circuit board, a sensing chip, a bonding tape pre-configured on the sensing chip and adhered to the electronic chip, a plurality of wires electrically connecting the electronic chip and the sensing chip to the circuit board, a supporting glue layer, a light-transmitting sheet, and an optical module fixed on the circuit board and surrounding the components. The sensing chip is attached to the electronic chip through the bonding tape, and the sensing area of the sensing chip is perpendicular to the central axis of the optical module. The supporting glue layer is annular and arranged on the top surface of the sensing chip, and the light-transmitting sheet is arranged on the supporting glue layer and faces the sensing chip. Accordingly, the non-reflow sensing lens realizes the effect of not needing reflow, reduces the requirement for high temperature resistance, and further reduces the material cost and improves the yield of products.

Description

TECHNICAL FIELD

[0001] The present application relates to a sensing lens, in particular to a non-reflow sensing lens. BACKGROUND

[0002] The existing sensing lens is fixed on a circuit carrier board by reflowing a sensor package structure, and then an optical module is installed on the circuit carrier board. However, the architecture of the existing sensor head is limited by the sensor package structure, and it is difficult to be further improved. For example, since the sensor package structure in the existing sensing lens needs to be fixed on the circuit carrier board by reflowing, the component connection in the sensor package structure also needs to meet the requirement of high temperature resistance.

[0003] Therefore, the applicant believes that the above defects can be improved, and after careful research and application of scientific principles, a non-reflow sensing lens is finally proposed, which is reasonable in design and effectively improves the above defects. SUMMARY

[0004] The embodiment of the present application provides a non-reflow sensing lens which can effectively improve the defects that may be caused by the existing sensing lens.

[0005] The embodiment of the present application discloses a non-reflow sensing lens, which comprises: a circuit carrier board, comprising a first board surface and a second board surface opposite to the first board surface; wherein the circuit carrier board comprises a die bonding area, a plurality of first solder pads outside the die bonding area, and a plurality of second solder pads outside the plurality of first solder pads on the first board surface; an optical module, comprising: a frame fixed on the first board surface of the circuit carrier board; at least one lens installed in the frame, and the center axis of the at least one lens is along the die bonding area; and a filter installed in the frame and located at the center axis; wherein the frame, the filter and the first board surface collectively form a configuration space, and the die bonding area, the plurality of first solder pads and the plurality of second solder pads are located in the configuration space; an electronic chip arranged on the die bonding area, and the electronic chip comprises a plurality of first connection pads on the top side thereof; a plurality of first conductive lines electrically coupled to the plurality of first connection pads and the plurality of first solder pads; a sensing chip and an adhesive tape, the sensing chip comprises a sensing area on the top surface thereof and a plurality of second connection pads outside the sensing area, and the adhesive tape is attached to the bottom surface of the sensing chip; wherein the sensing chip is attached to the top side of the electronic chip through the adhesive tape, and the sensing area is perpendicular to the center axis; a plurality of second conductive lines electrically coupled to the plurality of second connection pads and the plurality of second solder pads; a support adhesive layer arranged outside the sensing area in a ring shape; and a light transmission sheet arranged on the support adhesive layer and facing the light transmission sheet, so that the light transmission sheet, the support adhesive layer and the top surface of the sensing chip collectively form a closed space.

[0006] Optionally, the non-reflow sensing lens further comprises a sealing glue formed on the first plate surface, and the sealing glue surrounds the outside of the electronic chip, the sensing chip, the supporting glue layer, and the light-transmitting sheet, and at least a part of each of the first wires, at least a part of each of the second wires, the plurality of first solder pads, and the plurality of second solder pads are embedded in the sealing glue.

[0007] Optionally, the plurality of first connection pads are located outside the bonding tape, and each of the plurality of first wires and the plurality of first connection pads are embedded in the sealing glue.

[0008] Optionally, at least one first connection pad and the partial first wire connected thereto are embedded in the bonding tape.

[0009] Optionally, the circuit carrier board is recessed to form a die placement groove at the die bonding area, the electronic chip is disposed in the die placement groove, and the top side of the electronic chip forms a difference of not greater than 10 microns compared to the first plate surface.

[0010] Optionally, the first plate surface is parallel to the second plate surface, and the circuit carrier board does not form any groove on the first plate surface.

[0011] Optionally, the plurality of first solder pads and the plurality of second solder pads are arranged in a staggered manner.

[0012] Optionally, at least one second connection pad is located outside the supporting glue layer and embedded in the sealing glue.

[0013] Optionally, at least one second connection pad and the partial second wire connected thereto are embedded in the supporting glue layer.

[0014] Optionally, when a light passes through at least one lens, the filter is used to allow a wavelength band corresponding to the light of the sensing area to pass through; the non-reflow sensing lens comprises at least one passive electronic component located in the arrangement space; wherein the at least one passive electronic component is mounted on the first plate surface of the circuit carrier board.

[0015] In summary, the non-reflow sensing lens disclosed in the embodiments of the present application, through the cooperation between the above-mentioned components, realizes the effect of not needing reflow, thereby reducing the high-temperature resistance requirement of the components (such as the electronic chip, the sensing chip, the bonding tape, the plurality of first wires, the plurality of second wires, the supporting glue layer, and the light-transmitting sheet) located in the arrangement space, thereby reducing the material cost of the non-reflow sensing lens and improving the yield of the product.

[0016] Furthermore, the non-reflow sensing lens disclosed in this application does not require a reflow process, and therefore does not require a corresponding testing process, thereby effectively simplifying the entire production process and improving the production efficiency of the non-reflow sensing lens.

[0017] Furthermore, the non-reflow sensing lens disclosed in this application embodiment has the bonding tape pre-configured on the bottom surface of the sensing chip, so that the sensing chip can be smoothly attached to the electronic chip through the bonding tape, thereby realizing the miniaturized architecture of multi-chip stack.

[0018] To further understand the features and technical content of this application, please refer to the following detailed description and drawings of this application. However, these descriptions and drawings are only used to illustrate this application and are not intended to limit the scope of protection of this application in any way. Attached Figure Description

[0019] Figure 1 This is a three-dimensional schematic diagram of a non-reflow sensing lens according to Embodiment 1 of this application.

[0020] Figure 2 for Figure 1 A schematic diagram of its breakdown.

[0021] Figure 3 for Figure 2 A partial overhead view (optical modules omitted).

[0022] Figure 4 for Figure 1 A schematic cross-sectional view along section line IV-IV.

[0023] Figure 5 for Figure 4 A cross-sectional view of another variation.

[0024] Figure 6 This is a cross-sectional schematic diagram of the non-reflow sensing lens of Embodiment 2 of this application.

[0025] Figure 7 for Figure 6 A cross-sectional view of another variation.

[0026] Figure 8 This is a cross-sectional schematic diagram of the non-reflow sensing lens of Embodiment 3 of this application.

[0027] Figure 9 for Figure 8 An enlarged diagram of region IX in the image.

[0028] Figure 10 for Figure 9 A schematic diagram of another variation. Detailed Implementation

[0029] The following detailed description is presented in terms of a particular embodiment so as to provide a thorough understanding of the present application disclosed herein for "non-reflow sensing lens". Those skilled in the art will realize that the present application can be practiced with by other

[0030] It should be understood that, although the terms "first", "second", "third", etc. can be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein can include any one or more combinations of the associated listed items.

[0031] [Embodiment One]

[0032] Please refer to Figures 1 to 5 , which is embodiment one of the present application. As shown in Figure 1 and Figure 2 , the present embodiment discloses a non-reflow sensing lens 100, which does not contain any packaging structure; that is, any sensing lens with packaging structure or any sensing lens that needs to be made by reflow is different from the non-reflow sensing lens 100 of the present embodiment.

[0033] As shown in Figure 3 and Figure 4 , the non-reflow sensing lens 100 comprises a circuit carrier 1, an optical module 2 fixed to the circuit carrier 1, at least one passive electronic component 3 mounted on the circuit carrier 1, an electronic chip 4 mounted on the circuit carrier 1, a plurality of first wires W1 electrically coupled between the electronic chip 4 and the circuit carrier 1, a sensing chip 5, a die attach film (DAF) 6 preconfigured on the sensing chip 5 and attached to the electronic chip 4, a plurality of second wires W2 electrically coupled between the sensing chip 5 and the circuit carrier 1, a support adhesive layer 7 disposed on the sensing chip 5, a light-transmitting sheet 8 disposed on the support adhesive layer 7, and a sealing adhesive 9.

[0034] Wherein, the non-reflow sensing lens 100 in this embodiment is described as containing the above components, but the non-reflow sensing lens 100 can also be adjusted and changed according to design requirements. For example, in other embodiments not shown in this application, the non-reflow sensing lens 100 can also omit at least one of the passive electronic components 3 and / or the sealing glue 9.

[0035] The circuit carrier board 1 in this embodiment can be a printed circuit board (PCB) or a flexible printed circuit (FPC), but the application is not limited thereto. Wherein, the circuit carrier board 1 has a first board surface 11 and a second board surface 12 opposite to the first board surface 11, the first board surface 11 is parallel to the second board surface 12, and the circuit carrier board 1 does not form any groove on the first board surface 11.

[0036] Furthermore, the circuit carrier board 1 contains a die bonding area 113, a plurality of first solder pads 111 outside the die bonding area 113, and a plurality of second solder pads 112 outside the plurality of first solder pads 111 on the first board surface 11. Wherein, the plurality of first solder pads 111 and the plurality of second solder pads 112 are preferably arranged in a staggered manner, thereby reducing the difficulty of implementing wire bonding in the plurality of first solder pads 111 and the plurality of second solder pads 112.

[0037] In addition, the circuit carrier board 1 can further be provided with an electrical connector 14, and the circuit carrier board 1 can be detachably connected to an electronic device (not shown) through the plurality of electrical connectors 14, so that the non-reflow sensing lens 100 can be mounted and electrically connected to the electronic device. That is, the circuit carrier board 1 not only can carry the electronic chip 4 and the sensing chip 5, but also can provide other electronic components for mounting and electrical coupling, so the circuit carrier board 1 described in this embodiment is different from the substrate in any packaging structure.

[0038] The optical module 2 includes a frame 21, at least one lens 22 mounted in the frame 21, and a filter 23 mounted in the frame 21. The frame 21 is fixed to the first surface 11 of the circuit board 1, the central axis L of at least one lens 22 is along the die bonding area 113, and the filter 23 is located on the central axis L. At least one passive electronic component 3 is mounted on the first surface 11 of the circuit board 1 adjacent to the frame 21. In addition, the number of at least one passive electronic component 3 can be adjusted according to design requirements, and the outer edge of the circuit board 1 can be partially (e.g., three edges) trimmed to the frame 21 in this embodiment, but the application is not limited thereto.

[0039] In more detail, the number of at least one lens 22 is multiple in this embodiment, and the central axes L of multiple lenses 22 substantially overlap each other, and the position of the filter 23 is located between multiple lenses 22 and the die bonding area 113. The frame 21, the filter 23, and the first surface 11 of the circuit board 1 collectively form a configuration space 24, and the die bonding area 113, multiple first solder pads 111, multiple second solder pads 112, at least one passive electronic component 3, the electronic chip 4, the adhesive tape 6, the sensing chip 5, multiple first wires W1, multiple second wires W2, the support adhesive layer 7, the light-transmitting sheet 8, and the sealing adhesive 9 are all located in the configuration space 24.

[0040] The electronic chip 4 is illustrated by an image signal processor (ISP) in this embodiment, but the application is not limited thereto. The electronic chip 4 is disposed on the die bonding area 113, and the electronic chip 4 includes multiple first connection pads 41 on the top side thereof.

[0041] It should be additionally noted that the non-reflow sensing lens 100 includes a glue material M (e.g., thermal conductive glue) disposed on the die bonding area 113 in this embodiment, and the electronic chip 4 is fixed to the die bonding area 113 through the glue material M (e.g., the bottom side of the electronic chip 4 and the die bonding area 113 are adhered and fixed to each other through the glue material M), but the application is not limited thereto. For example, in other embodiments not shown in the application, the glue material M can be omitted or replaced by other components.

[0042] In the embodiment, the first solder pads 111 are arranged in a ring shape, and the first connection pads 41 are also arranged in a ring shape and preferably correspond to the positions of the first solder pads 111, but the application is not limited thereto. For example, in other embodiments not shown in the application, the first solder pads 111 can be arranged in two columns and distributed on opposite sides of the die bonding area 113, and the first connection pads 41 are also arranged in two columns and correspond to the positions of the first solder pads 111, respectively.

[0043] The first wires W1 are electrically connected to the first connection pads 41 and the first solder pads 111, respectively; that is, each first wire W1 is formed in a wire bonding manner, so that its two ends are connected to a first solder pad 111 and a corresponding first connection pad 41, respectively. The wire bonding manner of any first wire W1 can be selected as a normal bond manner or a reverse bond manner according to design requirements, which is not limited in the application.

[0044] The sensing chip 5 is an image sensing chip in the embodiment, and the size of the sensing chip 5 is smaller than the size of the electronic chip 4, but the application is not limited thereto. The bottom surface 52 of the sensing chip 5 is attached to the top side of the electronic chip 4 by the adhesive tape 6, that is, the bottom surface 52 of the sensing chip 5 is provided with the adhesive tape 6 to ensure its flatness, and the top surface 51 (such as a sensing area 511) of the sensing chip 5 is perpendicular to the center axis L. In the embodiment, the adhesive tape 6 is attached to the top side of the electronic chip 4 inside the first connection pads 41; that is, the first connection pads 41 are located outside the adhesive tape 6, but the application is not limited thereto.

[0045] Accordingly, the non-reflow sensing lens 100 in the embodiment is provided with the adhesive tape 6 on the bottom surface 52 of the sensing chip 5, so that the sensing chip 5 can be smoothly attached to the electronic chip 4 by the adhesive tape 6, thereby realizing the miniaturization architecture of the multi-chip stack.

[0046] Furthermore, the sensing chip 5 comprises a sensing region 511 on the top surface 51 and a plurality of second connection pads 512 outside the sensing region 511. The filter sheet 23 is selected to correspond to the sensing region 511 of the sensing chip 5. For example, when a light ray passes through at least one of the lenses 22, the filter sheet 23 is configured to allow a wavelength of the light ray corresponding to the sensing region 511 to pass through.

[0047] In the embodiment, the second solder pads 112 are arranged in a ring shape, and the second connection pads 512 are also arranged in a ring shape on the top surface 51 and surround the sensing region 511. The positions of the second connection pads 512 preferably correspond to the positions of the second solder pads 112, but the present application is not limited thereto. For example, in another embodiment not shown in the present application, the second connection pads 512 are arranged in two rows and distributed on opposite sides of the sensing region 511, and the second solder pads 112 can also be arranged in two rows and their positions correspond to the positions of the second connection pads 512.

[0048] The second wires W2 are electrically connected to the second connection pads 512 and the second solder pads 112, respectively; that is, each of the second wires W2 is formed by wire bonding, so that its two ends are connected to one of the second solder pads 112 and the corresponding second connection pad 512, respectively. The wire bonding direction of any of the second wires W2 can be selected as forward bonding or reverse bonding according to design requirements, which is not limited in the present application.

[0049] The support adhesive layer 7 is arranged on the top surface 51 of the sensing chip 5 in a ring shape and surrounds (or is located outside) the sensing region 511. Each of the first connection pads 41 and the first wires W1 connected thereto can also be located outside the support adhesive layer 7, but the present application is not limited thereto.

[0050] The light-transmitting sheet 8 has an inner surface 81 and an outer surface 82. The inner surface 81 of the light-transmitting sheet 8 is arranged on the support adhesive layer 7 and faces the sensing region 511 (that is, the support adhesive layer 7 is clamped between the top surface 51 of the sensing chip 5 and the inner surface 81 of the light-transmitting sheet 8), so that the light-transmitting sheet 8, the support adhesive layer 7, and the top surface 51 of the sensing chip 5 together form a closed space S. The sensing region 511 is located in the closed space S and faces the light-transmitting sheet 8.

[0051] As shown in FIG. 1, the sensing chip 5 is arranged on the top surface 21 of the filter sheet 23, and the sensing region 511 of the sensing chip 5 faces the filter sheet 23. The filter sheet 23 is arranged on the top surface 51 of the sensing chip 5 and covers the sensing region 511 of the sensing chip 5. Figure 4As shown, the encapsulation 9 is formed on the first surface 11 of the circuit board 1, and the encapsulation 9 surrounds the outside of the electronic chip 4, the adhesive tape 6, the sensing chip 5, the support adhesive layer 7, and the light-transmissive sheet 8; and the first solder pads 111, the first connection pads 41, the first wires W1, the second solder pads 112, and the second wires W2 are all embedded in the encapsulation 9, but the present application is not limited thereto. For example, as shown in FIG. 1C, the second connection pads 512 are all located outside the support adhesive layer 7, so that the encapsulation 9 can further embed the second connection pads 512 and the second wires W2 therein. Figure 5 As shown, the second connection pads 512 are all located outside the support adhesive layer 7, so that the encapsulation 9 can further embed the second connection pads 512 and the second wires W2 therein.

[0052] As described above, the non-reflow sensing lens 100 in the present embodiment is configured by the above components to achieve the effect of not needing reflow, thereby reducing the high-temperature resistance requirement of the components located in the configuration space 24, and further reducing the material cost of the non-reflow sensing lens 100 and improving the yield of the product. Further, the non-reflow sensing lens 100 does not need to go through the corresponding test process because it does not need to go through the reflow process, thereby effectively simplifying the entire production process to improve the production efficiency of the non-reflow sensing lens 100.

[0053] [Embodiment Two]

[0054] Please refer to Figure 6 and Figure 7 which is embodiment two of the present application. Since the present embodiment is similar to the above-mentioned embodiment one, the same parts of the two embodiments will not be described again, and the differences between the present embodiment and the above-mentioned embodiment one are described as follows:

[0055] In the present embodiment, the size of the sensing chip 5 is substantially equal to the size of the electronic chip 4, and the adhesive tape 6 pre-configured on the sensing chip 5 substantially covers (or adheres to) the entire top side of the electronic chip 4. Each first connection pad 41 and the partial first wire W1 connected thereto are embedded in the adhesive tape 6, and the other part of each first wire W1 is embedded in the encapsulation 9, but the present application is not limited thereto. For example, in other embodiments not shown in the present application, the non-reflow sensing lens 100 can be configured such that at least one first connection pad 41 and the partial first wire W1 connected thereto are embedded in the adhesive tape 6.

[0056] [Embodiment Three]

[0057] Please refer to Figures 8 to 10As shown, it is the third embodiment of the present application. Since this embodiment is similar to the above-mentioned embodiment two, the same parts of the two embodiments will not be repeated, and the differences of this embodiment compared with the above-mentioned embodiment two are generally described as follows:

[0058] In this embodiment, the circuit carrier plate 1 is recessed to form a die placement groove 13 at the die bonding area 113; that is, a plurality of the first solder pads 111 are located outside the die placement groove 13, and each of the first solder pads 111 is spaced apart from the die placement groove 13, and preferably separated by a spacing distance D of no more than 100 microns (μm), but the present application is not limited thereto.

[0059] The electronic chip 4 is arranged in the die placement groove 13 (for example, the bottom side of the electronic chip 4 faces the groove bottom of the die placement groove 13), and the top side of the electronic chip 4 forms a step difference G of no more than 10 microns (μm) compared with the first plate surface 11. Among them, the step difference G can be no more than 5 microns, and the step difference G is preferably 0 (for example: Figure 10 As shown, the top side of the electronic chip 4 is coplanar with the first plate surface 11 of the circuit carrier plate 1). Further, a plurality of the first wires W1 are respectively electrically coupled to a plurality of the first connection pads 41 to a plurality of the first solder pads 111, and each of the first connection pads 41 and the local first wires W1 connected thereto are embedded in the adhesive tape 6.

[0060] Accordingly, the non-reflow sensing lens 100 disclosed in the embodiments of the present application, by arranging the sensing chip 5 in the die placement groove 13 under certain conditions (for example, the step difference G is no more than 10 microns), so that the formation of each of the first wires W1 is no longer limited by the height of the electronic chip 4, thus being able to help shorten the distance between any one of the first solder pads 111 and the corresponding first connection pad 41.

[0061] It should be additionally noted that the non-reflow sensing lens 100 in this embodiment is fixed in the die placement groove 13 by the adhesive M (for example, thermal conductive adhesive), and the electronic chip 4 is fixed in the die placement groove 13 (for example, the bottom side of the electronic chip 4 and the groove bottom of the die placement groove 13 are adhered and fixed to each other by the adhesive M), but the present application is not limited thereto. For example, in other embodiments not shown in the present application, the adhesive M can also be omitted or replaced by other components.

[0062] [Technical effects of the embodiments of the present application]

[0063] In summary, the non-reflow sensing lens disclosed in the embodiments of the present application is configured by the above components, so that the overall structure of the non-reflow sensing lens can achieve the effect of not needing to be reflowed, thereby reducing the high-temperature resistance requirement of the components (such as the electronic chip, the sensing chip, the adhesive tape, the plurality of first wires, the plurality of second wires, the supporting adhesive layer, and the light-transmitting sheet) connected in the configuration space, and further reducing the material cost of the non-reflow sensing lens and improving the yield of the product.

[0064] Further, the non-reflow sensing lens disclosed in the embodiments of the present application does not need to go through the corresponding test process because it does not need to go through the reflow process, thereby effectively simplifying the entire production process to improve the production efficiency of the non-reflow sensing lens.

[0065] In addition, the non-reflow sensing lens disclosed in the embodiments of the present application is pre-configured with the adhesive tape on the bottom surface of the sensing chip, so that the sensing chip can be smoothly attached to the electronic chip through the adhesive tape, thereby realizing the miniaturized architecture of the multi-chip stack.

[0066] The above disclosure is only the preferred and feasible embodiments of the present application, and does not limit the patent scope of the present application, so any equivalent technical changes made by applying the content of the specification and drawings of the present application are included in the patent scope of the present application.

Claims

1. A non-reflow sensing lens, characterized in that, The non-reflow sensing lens includes: A circuit carrier board includes a first board surface and a second board surface located on the opposite side of the first board surface; wherein the circuit carrier board includes a die bonding region, a plurality of first bonding pads located outside the die bonding region, and a plurality of second bonding pads located outside the plurality of first bonding pads on the first board surface. An optical module, comprising: A frame is fixed to the first surface of the circuit carrier board; At least one lens is mounted within the frame, and the central axis of at least one of the lenses passes through the die-bonding region; and A filter is mounted within the frame and located on the central axis; wherein the frame, the filter, and the first plate surface together surround and form a configuration space, and the die bonding area, a plurality of first bonding pads, and a plurality of second bonding pads are located within the configuration space; An electronic chip is disposed on the die-bonding region, and the electronic chip includes a plurality of first connection pads located on its top side; Multiple first conductors are electrically coupled to multiple first connecting pads to multiple first solder pads, respectively; A sensing chip and an adhesive tape are provided. The sensing chip includes a sensing area on its top surface and a plurality of second connecting pads on the outside of the sensing area. The adhesive tape is attached to the bottom surface of the sensing chip. The sensing chip is attached to the top side of the electronic chip by the adhesive tape, so that the sensing area is perpendicular to the central axis. Multiple second conductors are electrically coupled to multiple second connecting pads to multiple second solder pads, respectively; A supporting adhesive layer, in a ring shape, is disposed on the top surface of the sensing chip, and the supporting adhesive layer surrounds the outer side of the sensing area; and A light-transmitting sheet is disposed on the supporting adhesive layer and faces the light-transmitting sheet, so that the light-transmitting sheet, the supporting adhesive layer, and the top surface of the sensing chip together form a closed space.

2. The non-reflow sensing lens according to claim 1, characterized in that, The non-reflow sensing lens further includes a sealing colloid formed on the first plate surface, and the sealing colloid surrounds the outer side of the electronic chip, the sensing chip, the supporting adhesive layer, and the light-transmitting film, with at least a portion of each of the first wires, at least a portion of each of the second wires, a plurality of the first solder pads, and a plurality of the second solder pads embedded within the sealing colloid.

3. The non-reflow sensing lens according to claim 2, characterized in that, Multiple first connecting pads are located on the outside of the adhesive tape, and multiple first wires and multiple first connecting pads are embedded within the sealant.

4. The non-reflow sensing lens according to claim 2, characterized in that, At least one of the first connecting pads and the portion of the first wire connected to it are embedded in the adhesive tape.

5. The non-reflow sensing lens according to claim 4, characterized in that, The circuit substrate has a die-bonding groove recessed in the die-bonding area, the electronic chip is disposed in the die-bonding groove, and the top side of the electronic chip has a difference of no more than 10 micrometers from the first board surface.

6. The non-reflow sensing lens according to claim 2, characterized in that, The first board surface is parallel to the second board surface, and the circuit carrier board does not have any grooves formed on the first board surface.

7. The non-reflow sensing lens according to claim 1, characterized in that, The plurality of first welding pads and the plurality of second welding pads are staggered relative to each other.

8. The non-reflow sensing lens according to claim 2, characterized in that, At least one of the second connecting pads is located outside the supporting adhesive layer and embedded within the sealing adhesive.

9. The non-reflow sensing lens according to claim 2, characterized in that, At least one of the second connecting pads and the portion of the second wire connected to it are embedded within the supporting adhesive layer.

10. The non-reflow sensing lens according to claim 1, characterized in that, When a light ray passes through at least one of the lenses, the filter allows the wavelength of the light ray corresponding to the sensing area to pass through; the non-reflow sensing lens includes at least one passive electronic component located within the configuration space; wherein at least one of the passive electronic components is mounted on the first surface of the circuit board.

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