Decoupling device and decoupling method

Abstract

The application discloses a kind of decoupling device and decoupling method, first decoupling unit is arranged above the intermediate position of two E face coupled antenna units, and second decoupling unit is arranged above the antenna unit, E face scattering wave with E face coupling wave amplitude equal, opposite phase is generated by first decoupling unit and second decoupling unit, E face scattering wave and E face coupling wave are mutually offset, realize E face decoupling, simultaneously, second decoupling unit also generates H face scattering wave and realizes H face partial decoupling, in addition, third decoupling unit is also arranged above the intermediate position of two H face coupled antenna units, H face scattering wave with H face coupling wave amplitude equal, opposite phase is generated by second decoupling unit and third decoupling unit, H face scattering wave and H face coupling wave are mutually offset, realize E face decoupling;Through the common effect of first decoupling unit, second decoupling unit and third decoupling unit, E face and H face of antenna array are decoupled.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wireless communication, and in particular to a decoupling device and a decoupling method. BACKGROUND

[0002] MIMO (Multiple input multiple output) antenna technology is adopted in the fifth generation mobile communication, which has the ability to improve the reliability of the communication system and increase the channel capacity, and is therefore considered as one of the core technologies of 5G. Antenna mutual coupling, as a widely existing physical phenomenon, can significantly deteriorate the performance of MIMO antenna system, causing problems such as increased independent channel correlation, deteriorated active standing wave, decreased gain, and deteriorated signal-to-noise ratio. At the same time, in order to reduce the cost of tower leasing, the antenna array is required to be miniaturized, which further enhances the mutual coupling. Therefore, reducing antenna mutual coupling has become a research focus of Massive-MIMO antenna.

[0003] In an antenna array, the coupling mode can be divided into an E-plane coupling mode, an H-plane coupling mode, and a diagonal coupling mode between the E-plane coupling mode and the H-plane coupling mode according to the relative position relationship between the antenna elements. The existing decoupling technology can only realize decoupling in a single coupling mode. SUMMARY

[0004] The present application aims to at least solve one of the technical problems existing in the prior art, and provides a decoupling device and a decoupling method, which can realize common decoupling of the E-plane and the H-plane of an antenna array.

[0005] In a first aspect, an embodiment of the present application provides a decoupling device applied to an antenna array, wherein the antenna array comprises a plurality of antenna elements, and the decoupling device comprises:

[0006] a dielectric substrate, which is located above the plurality of antenna elements;

[0007] a first decoupling unit, which is arranged on the dielectric substrate, and the first decoupling unit is arranged above the middle position of each two E-plane coupled antenna elements;

[0008] a second decoupling unit, which is arranged on the dielectric substrate, and the second decoupling unit is arranged above each antenna element;

[0009] a third decoupling unit, which is arranged on the dielectric substrate, and the third decoupling unit is arranged above the middle position of each two H-plane coupled antenna elements.

[0010] In a second aspect, the embodiments of the present application provide a decoupling method applied to an antenna array, the antenna array comprising a plurality of antenna units, the decoupling method comprising:

[0011] a first decoupling unit is arranged above the middle position of each two E-coupled antenna units;

[0012] a second decoupling unit is arranged above each antenna unit;

[0013] a third decoupling unit is arranged above the middle position of each two H-coupled antenna units.

[0014] The embodiments of the present application comprise a decoupling device and a decoupling method, a first decoupling unit is arranged above the middle position of two E-coupled antenna units, and a second decoupling unit is arranged above the antenna units, an E-scattering wave with the same amplitude and opposite phase as the E-coupled wave is generated by the first decoupling unit and the second decoupling unit, the E-scattering wave and the E-coupled wave cancel each other out to achieve E-decoupling, at the same time, the second decoupling unit also generates an H-scattering wave to achieve partial H-decoupling, in addition, a third decoupling unit is arranged above the middle position of two H-coupled antenna units, an H-scattering wave with the same amplitude and opposite phase as the H-coupled wave is generated by the second decoupling unit and the third decoupling unit, the H-scattering wave and the H-coupled wave cancel each other out to achieve E-decoupling; through the joint action of the first decoupling unit, the second decoupling unit and the third decoupling unit, the E-plane and the H-plane of the antenna array are decoupled together.

[0015] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent to those skilled in the art from the description, or can be learned by practice of the application. The objects and other advantages of the application will be realized and attained by the structure particularly pointed out in the written description and claims thereof as well as the appended drawings. BRIEF DESCRIPTION OF DRAWINGS

[0016] The accompanying drawings, which are included to provide a further understanding of the application and constitute a part of this specification, illustrate embodiments of the application and together with the description help to explain the application.

[0017] The application will be further described by reference to the drawings and embodiments.

[0018] Figure 1 is a perspective view of a decoupling device provided by the embodiments of the present application;

[0019] Figure 2 is a side view of a decoupling device provided by the embodiments of the present application;

[0020] Figure 3is a structural diagram of an antenna array provided by an embodiment of the present application;

[0021] Figure 4 is a structural diagram of a decoupling device provided by an embodiment of the present application;

[0022] Figure 5 is a structural diagram of a first decoupling unit of a decoupling device provided by an embodiment of the present application;

[0023] Figure 6 is a structural diagram of a second decoupling unit of a decoupling device provided by an embodiment of the present application;

[0024] Figure 7 is a mutual coupling curve diagram before and after using a decoupling device in an embodiment provided by the present application;

[0025] Figure 8 is a return loss curve diagram before and after using a decoupling device in an embodiment provided by the present application;

[0026] Figure 9 is a directional diagram before and after using a decoupling device in an embodiment provided by the present application;

[0027] Figure 10 is an active standing wave diagram before and after using a decoupling device in an embodiment (2-element subarray) provided by the present application;

[0028] Figure 11 is an E-plane and H-plane mutual coupling curve diagram when only using a first decoupling unit and a second decoupling unit in an embodiment (2-element subarray) provided by the present application;

[0029] Figure 12 is an H-plane mutual coupling curve diagram when the size of a third decoupling unit changes in an embodiment provided by the present application;

[0030] Figure 13 is a flowchart of a decoupling method provided by an embodiment of the present application. DETAILED DESCRIPTION

[0031] This part will describe specific embodiments of the present application in detail, and preferred embodiments of the present application are shown in the accompanying drawings, which serve to supplement the description in the text part of the description and enable people to intuitively and visually understand each technical feature and the overall technical scheme of the present application, but cannot be understood as a limitation on the protection scope of the present application.

[0032] In the description of the present application, the meaning of one or more is one or more, the meaning of multiple is more than two, greater than, less than, more than, etc. is understood as not including the number, above, below, etc. is understood as including the number. If it is described that the first, second is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the sequence of indicated technical features.

[0033] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing, connecting, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical scheme.

[0034] The embodiment of the present application provides a decoupling device and a decoupling method, which can realize the E-plane and H-plane common decoupling of an antenna array.

[0035] The embodiment of the present application is further described below in combination with the drawings.

[0036] The first aspect embodiment of the present application provides a decoupling device applied to an antenna array, the antenna array comprising a plurality of antenna units, the antenna array in the embodiment is taken as an example of a 2*2 planar antenna array 200, the planar antenna array 200 is placed on a reflecting floor 300 as shown in Figure 2 and Figure 3 The planar antenna array 200 comprises a first antenna unit 210, a second antenna unit 220, a third antenna unit 230 and a fourth antenna unit 240, wherein the first antenna unit 210 and the second antenna unit 220 are two antenna units coupled in the H-plane, the second antenna unit 220 and the third antenna unit 230 are two antenna units coupled in the E-plane; similarly, the third antenna unit 230 and the fourth antenna unit 240 are also two antenna units coupled in the H-plane, and the first antenna unit 210 and the fourth antenna unit 240 are also two antenna units coupled in the E-plane.

[0037] The decoupling device 100 covers the top of the planar antenna array 200, the decoupling device 100 comprises a dielectric substrate 110, a first decoupling unit 120, a second decoupling unit 130 and a third decoupling unit 140, wherein:

[0038] As shown in Figure 1 and Figure 2 The dielectric substrate 110 is located above the plurality of antenna units, i.e. above the planar antenna array 200, the dielectric substrate 110 only plays a physical supporting role for the first decoupling unit 120, the second decoupling unit 130 and the third decoupling unit 140, and the dielectric substrate 110 can be a single layer or a multi-layer structure, and in some possible embodiments, the dielectric substrate 110 can also be a radome;

[0039] The first decoupling unit 120 is arranged above the medium substrate 110, and is arranged above the middle position of each two E-coupled antenna units, that is, the first decoupling unit 120 is arranged above the middle position of the second antenna unit 220 and the third antenna unit 230, and the first decoupling unit 120 is also arranged above the middle position of the first antenna unit 210 and the fourth antenna unit 240.

[0040] The second decoupling unit 130 is arranged above the medium substrate 110, and is arranged above each antenna unit, that is, the second decoupling unit 130 is arranged above the first antenna unit 210, the second antenna unit 220, the third antenna unit 230 and the fourth antenna unit 240.

[0041] The third decoupling unit 140 is arranged above the medium substrate 110, and is arranged above the middle position of each two H-coupled antenna units, that is, the third decoupling unit 140 is arranged above the middle position of the first antenna unit 210 and the second antenna unit 220, and the third decoupling unit 140 is also arranged above the middle position of the third antenna unit 230 and the fourth antenna unit 240.

[0042] In the embodiment, the first decoupling unit 120 is arranged above the middle position of each two E-coupled antenna units, and the second decoupling unit 130 is arranged above each antenna unit, and the E-plane scattering wave with the same amplitude and opposite phase as the E-plane coupling wave is generated by the first decoupling unit 120 and the second decoupling unit 130, the E-plane scattering wave and the E-plane coupling wave are mutually offset, the E-plane decoupling is realized, meanwhile, the H-plane scattering wave is also generated by the second decoupling unit 130 to realize the H-plane partial decoupling, in addition, the third decoupling unit 140 is arranged above the middle position of each two H-coupled antenna units, and the H-plane scattering wave with the same amplitude and opposite phase as the H-plane coupling wave is generated by the second decoupling unit 130 and the third decoupling unit 140, the H-plane scattering wave and the H-plane coupling wave are mutually offset, the E-plane decoupling is realized, and the E-plane and H-plane decoupling of the antenna array is realized by the cooperation of the first decoupling unit 120, the second decoupling unit 130 and the third decoupling unit 140.

[0043] In an embodiment, the first decoupling unit 120 includes a first metal patch 121 or includes a plurality of first metal patches 121 arranged along the H-plane direction, and the geometric center of the first decoupling unit 120 is located directly above the middle position of the two E-coupled antenna units.

[0044] It should be noted that, as Figure 3As shown, the first antenna unit 210 and the second antenna unit 220 are two antenna units coupled in the H-plane, and the third antenna unit 230 and the fourth antenna unit 240 are also two antenna units coupled in the H-plane, Figure 4 The H-plane direction in the above figure is the horizontal direction. As shown in the above figure, Figure 4 In the embodiment, each first decoupling unit 120 specifically includes two first metal patches 121 arranged in the H-plane direction, i.e., two first metal patches 121 arranged in the horizontal direction are arranged above the middle position of the second antenna unit 220 and the third antenna unit 230, and two first metal patches 121 arranged in the horizontal direction are also arranged above the middle position of the first antenna unit 210 and the fourth antenna unit 240. The first decoupling unit 120 can also include only one first metal patch 121, and can also include three or more first metal patches 121, which are not limited in the present application, as long as the geometric center of the first decoupling unit 120 is located directly above the middle position of the two antenna units coupled in the E-plane.

[0045] The shape of the first metal patch 121 can be rectangular, triangular, circular, cross-shaped, H-shaped, C-shaped or other similar shapes.

[0046] In addition, the length of the first metal patch 121 in the H-plane direction ranges from 0.01λc to 0.25λc, where λc is the wavelength of the electromagnetic wave corresponding to the center frequency of the antenna array. The first metal patch 121 with the size range is an electrically small metal patch. The electromagnetic scattering wave of the electrically small metal patch structure is isotropic, i.e., the scattering wave amplitudes and phases in different directions are equal at the same distance.

[0047] Referring to Figure 4 In an embodiment, the first metal patch 121 is externally sleeved with a first metal ring 122.

[0048] It can be understood that the structure of the first metal patch 121 can be a single metal patch structure or an internally nested structure, i.e., the structure formed by sleeving the first metal ring 122 externally on the first metal patch 121. The nested metal patch structure is beneficial to enhancing the scattering wave amplitude and improving the decoupling effect.

[0049] In an embodiment, each first metal patch 121 includes a plurality of metal patches arranged in a direction perpendicular to the H-plane direction.

[0050] It can be understood that, on the basis that the first decoupling unit 120 includes a plurality of first metal patches 121 arranged in the H-plane direction, each first metal patch 121 includes a plurality of metal patches arranged in a direction perpendicular to the H-plane direction, i.e., the first decoupling unit 120 is arranged in a two-dimensional array by a plurality of metal patches. Specifically, as shown in the above figure,Figure 5 As shown, the first decoupling unit 120 includes two first metal patches 121 arranged along the H-plane direction. Each first metal patch 121 includes two metal patches arranged perpendicular to the H-plane direction. That is, the first decoupling unit 120 is composed of four metal patches arranged in a two-dimensional array.

[0051] In another embodiment, each first metal patch 121 includes a plurality of stacked metal patches.

[0052] It is understandable that the first metal patch 121 is a three-dimensional spatial structure formed by multiple stacked metal patches, which can achieve different decoupling effects.

[0053] In one embodiment, the second decoupling unit 130 includes a second metal patch 131 or a plurality of second metal patches 131 arranged along the E-plane direction, and the geometric center of the second decoupling unit 130 is located directly above the antenna element.

[0054] It should be noted that, as Figure 3 As shown, the second antenna element 220 and the third antenna element 230 are two antenna elements coupled to the E-plane, and the first antenna element 210 and the fourth antenna element 240 are also two antenna elements coupled to the E-plane. Figure 4 The direction of plane E in the diagram is vertical. For example... Figure 4 As shown, in this embodiment, each second decoupling unit 130 includes two second metal patches 131 arranged along the E-plane direction. That is, two second metal patches 131 arranged vertically are disposed above the first antenna unit 210, the second antenna unit 220, the third antenna unit 230, and the fourth antenna unit 240. The second decoupling unit 220 may also include only one second metal patch 131, or it may include three or more second metal patches 131. The present invention does not limit this, as long as the geometric center of the second decoupling unit 130 is located directly above each antenna unit.

[0055] The shape of the second metal patch 131 can be rectangular, triangular, circular, cross-shaped, I-shaped, C-shaped, or other similar shapes.

[0056] Furthermore, the length of the second metal patch 131 along the E-plane ranges from 0.01λc to 0.25λc, where λc is the electromagnetic wave wavelength corresponding to the center frequency of the antenna array. This size range of the second metal patch 131 results in an electrically small metal patch. The electromagnetic scattered waves from an electrically small metal patch structure are isotropic, meaning that at the same distance, the amplitude and phase of the scattered waves in different directions are equal.

[0057] Reference Figure 4In an embodiment, the second metal patch 131 is externally sleeved with a second metal ring 132.

[0058] It can be understood that the structure of the second metal patch 131 can be a single metal patch structure or an internally nested structure, i.e., the structure formed by externally sleeving the second metal patch 131 with the second metal ring 132. The nested metal patch structure is beneficial to enhancing the scattering amplitude and improving the decoupling effect.

[0059] In an embodiment, each second metal patch 131 includes a plurality of metal patches arranged along a direction perpendicular to the E-plane.

[0060] It can be understood that, based on the second decoupling unit 130 including a plurality of second metal patches 131 arranged along the E-plane, each second metal patch 131 includes a plurality of metal patches arranged along a direction perpendicular to the E-plane, i.e., the second decoupling unit 130 is formed by a plurality of metal patches arranged in a two-dimensional array. Specifically, as shown in FIG. 2, the second decoupling unit 130 includes two second metal patches 131 arranged along the E-plane, and each second metal patch 131 includes two metal patches arranged along a direction perpendicular to the E-plane, i.e., the second decoupling unit 130 is formed by four metal patches arranged in a two-dimensional array. Figure 6

[0061] In addition, in an embodiment, each second metal patch 131 includes a plurality of metal patches arranged in layers.

[0062] It can be understood that the second metal patch 131 forms a three-dimensional space structure by a plurality of metal patches arranged in layers, which can achieve different decoupling effects.

[0063] In an embodiment, the third decoupling unit 140 includes one third metal patch 141 or a plurality of third metal patches 141 arranged in layers, and the geometric center of the third decoupling unit 140 is located directly above the middle position between the two H-plane coupled antenna units.

[0064] The third decoupling unit 140 can be formed by only one third metal patch 141 or a plurality of third metal patches 141 arranged in layers to achieve different decoupling effects. The third metal patch 141 can have a shape of a rectangle, a triangle, a circle, a cross, an I shape, a C shape, or other similar shapes.

[0065] In addition, the length of the third metal patch 141 along the H-plane direction ranges from 0.40λc to 0.80λc, where λc is the wavelength of an electromagnetic wave corresponding to the center frequency of the antenna array. The third metal patch 141 with the size range is an electrically large metal patch, which refers to both the physical length and the effective current length, i.e., the electric length.​

[0066] Referring to Figure 4 In an embodiment, the third metal patch 141 is externally sleeved with a third metal ring 142.

[0067] It can be understood that the structure of the third metal patch 141 can be a single metal patch structure or an internally nested structure, i.e., the structure formed by externally sleeving the third metal ring 142 on the third metal patch 141. The nested metal patch structure is advantageous in reducing the physical size of the large-size metal patch and enhancing the scattering amplitude to improve the decoupling effect.

[0068] It should be noted that the first decoupling unit 120, the second decoupling unit 130, and the third decoupling unit 140 can be at the same height or at different heights. The height of the first decoupling unit 120, the second decoupling unit 130, and the third decoupling unit 140 from the antenna unit is between 0.05λc and 1.0λc.

[0069] The size of the first decoupling unit 120 increases as the distance between every two E-coupled antenna units decreases, but the upper limit does not exceed the distance between two H-coupled antenna units. The size of the second decoupling unit 130 increases as the distance between every two E-coupled antenna units decreases or as the distance between every two H-coupled antenna units decreases, but the upper limit does not exceed the distance between two E-coupled antenna units. The size of the third decoupling unit 140 is determined by the operating frequency of the antenna and is irrelevant to the distance between the antenna units.

[0070] The first decoupling unit 120, the second decoupling unit 130, and the third decoupling unit 140 can be respectively expanded along the x-axis and the y-axis according to the array size of the planar antenna, and thus are suitable for antenna arrays with any number of antenna units.

[0071] In the following, the decoupling device provided by the present application is further described in conjunction with specific embodiments.

[0072] A decoupling device 100 applied to a planar antenna array to achieve dual-mode decoupling, as shown in Figures 1 to 4 The decoupling device 100 covers the top of a 2x2 planar antenna array 200 and includes a dielectric substrate 110, a first decoupling unit 120, a second decoupling unit 130, and a third decoupling unit 140.

[0073] The planar antenna array 200 is placed on a reflecting floor 300, the inter-element distance of the antenna units in the x-axis direction is 47mm (0.55λ 3.5GHz , and the inter-element distance of the antenna units in the y-axis direction is 43mm (0.5λ 3.5GHz ); the antenna units are printed electric dipoles.

[0074] The first decoupling unit 120, the second decoupling unit 130 and the third decoupling unit 140 are etched on the upper surface of the dielectric substrate 110;

[0075] The first decoupling unit 120 is composed of two electrically small first metal patches 121; the first metal patches 121 are arranged along the H-plane direction of the antenna; the geometric center of the first decoupling unit 120 is located directly above the middle position of each two E-coupled antenna units;

[0076] The second decoupling unit 130 is composed of two electrically small second metal patches 131; in order to avoid excessive influence on the decoupling effect of the first decoupling unit 120, the second metal patches 131 are arranged from both ends of the antenna unit along the E-plane direction of the antenna; the geometric center of the second decoupling unit 130 is located directly above each antenna unit;

[0077] The third decoupling unit 140 is composed of one electrically large third metal patch 141; the geometric center of the third decoupling unit 140 is located above the middle position of each two H-coupled antenna units;

[0078] The length L1 of the first metal patch 121 is 16mm (0.19λ 3.5GHz ), and the width W1 is 8mm (0.09λ 3.5GHz );

[0079] The length L2 of the second metal patch 131 is 19mm (0.22λ 3.5GHz ), and the width W2 is 8mm (0.09λ 3.5GH z);

[0080] The length L3+L4 of the third metal patch 141 is 46mm (0.54λ 3.5GHz ), and the width W3 is 6mm (0.07λ 3.5GHz );

[0081] The first decoupling unit 120, the second decoupling unit 130 and the third decoupling unit 140 are located at the same height, and the distance H from the antenna array 200 is 14mm (0.16λ 3.5GHz );

[0082] The first metal patch 121 is a rectangular metal patch, and a first metal ring 122 is further sleeved outside to enhance the scattering wave radiation;

[0083] The second metal patch 131 is a rectangular metal patch, and a second metal ring 132 is further sleeved outside to enhance the scattering wave radiation;

[0084] The third metal patch 141 is a cross-shaped metal patch, and a cross-shaped third metal ring 142 is further sleeved outside, so as to reduce the physical size of the large-size metal patch and enhance the scattering wave amplitude;

[0085] It should be noted that the shapes of the first metal patch 121 and the second metal patch 131 are not limited to rectangles, and the structures are not limited to ring-shaped nesting; the shape of the third metal patch 141 is not limited to a cross shape, and the structure is not limited to ring-shaped nesting.

[0086] The decoupling device 100 can be fixed above the planar antenna array by a plastic support, or can be made inside the antenna cover.

[0087] The decoupling device 100 provided by the present example and applied to the planar antenna array to realize dual-mode decoupling can further improve the antenna impedance characteristics and radiation characteristics on the basis of significantly reducing the E-plane and H-plane mutual coupling of the MIMO antenna, which is specifically embodied in that: Figure 7 For the mutual coupling curves before and after using the decoupling device, the E-plane and H-plane mutual coupling can be reduced by more than 10 dB within a relative bandwidth of 6% (3.4-3.6 GHz); the E-plane and H-plane mutual coupling can be reduced by 5 dB within a relative bandwidth of 12% (3.3-3.7 GHz); Figure 8 For the return loss curves before and after using the decoupling device, the antenna impedance bandwidth can be increased from 5.7% (3.4-3.6 GHz) to 14.5% (3.2-3.7 GHz); Figure 9 For the directional diagrams before and after using the decoupling device, the antenna gain can be increased from 8.0 dBi to 8.3 dBi; Figure 10 For the active standing wave diagrams before and after using the decoupling device, the maximum active standing wave of the MIMO antenna when the 0° beam is directed can be reduced from 1.9 to 1.55, and the maximum active standing wave when the 15° beam is directed can be reduced from 3.3 to 1.6; the decoupling device 100 can be periodically expanded along the x-axis and the y-axis, and is used for planar MIMO antennas with any number of antenna elements; the decoupling device 100 can be covered above the MIMO antenna or integrated inside the antenna cover, and has the characteristics of simple structure, convenient implementation and low cost.

[0088] The E-plane scattering wave generated by the first decoupling unit 120 and the second decoupling unit 130 has the same amplitude and opposite phase as the E-plane coupling wave, and the scattering wave and the E-plane coupling wave cancel each other out to realize E-plane decoupling. At the same time, the H-plane scattering wave generated by the second decoupling unit 130 realizes partial H-plane decoupling. As shown in Figure 11 The E-plane and H-plane mutual coupling curves when the first decoupling unit and the second decoupling unit are used. After using the first decoupling unit and the second decoupling unit, the E-plane mutual coupling is reduced by 10 dB, and the H-plane mutual coupling is reduced by only 4 dB within the frequency band of 3.4-3.6 GHz.

[0089] The third decoupling unit changes the phase of the H-plane scattering wave generated by the second decoupling unit by using the resonant characteristic of the electrically large-size metal patch, so that the H-plane scattering wave generated by the second decoupling unit and the third decoupling unit is equal in amplitude and opposite in phase to the H-plane coupling wave, thereby realizing H-plane decoupling. Meanwhile, the third decoupling unit is far away from the E-plane coupling antenna, and thus has no influence on E-plane decoupling. As shown in Figure 7 After the first decoupling unit, the second decoupling unit and the third decoupling unit are used, the H-plane mutual coupling is less than 25 dB, which is reduced by 10 dB compared with no decoupling device.

[0090] The size of the electrically large-size metal patch included in the third decoupling unit directly determines the phase of the H-plane scattering wave. Figure 12 As shown in the H-plane mutual coupling curve when the size of the electrically large-size metal patch changes in the 2-element subarray, as the size of the electrically large-size metal patch increases, the H-plane optimal decoupling frequency band moves to a low frequency.

[0091] Through the joint action of the first decoupling unit, the second decoupling unit and the third decoupling unit, E / H-plane common decoupling of the antenna is realized.

[0092] In addition, with reference to Figure 13 The second aspect embodiment of the present application provides a decoupling method, which is applied to an antenna array including a plurality of antenna units, and includes the following steps:

[0093] Step S1310: A first decoupling unit is arranged above the middle position of each two E-plane coupled antenna units;

[0094] Step S1320: A second decoupling unit is arranged above each antenna unit;

[0095] Step S1330: A third decoupling unit is arranged above the middle position of each two H-plane coupled antenna units.

[0096] In this embodiment, the first decoupling unit is arranged above the middle position of the two E-plane coupled antenna units, and the second decoupling unit is arranged above the antenna units, so that the E-plane scattering wave generated by the first decoupling unit and the second decoupling unit is equal in amplitude and opposite in phase to the E-plane coupling wave, the E-plane scattering wave and the E-plane coupling wave are mutually offset, E-plane decoupling is realized, meanwhile, the second decoupling unit also generates H-plane scattering wave to realize H-plane partial decoupling, in addition, the third decoupling unit is arranged above the middle position of the two H-plane coupled antenna units, the H-plane scattering wave generated by the second decoupling unit and the third decoupling unit is equal in amplitude and opposite in phase to the H-plane coupling wave, the H-plane scattering wave and the H-plane coupling wave are mutually offset, E-plane decoupling is realized; through the joint action of the first decoupling unit, the second decoupling unit and the third decoupling unit, E / H-plane common decoupling of the antenna array is realized.

[0097] In an embodiment, the first decoupling unit comprises one first metal patch or a plurality of first metal patches arranged along the H-plane direction, and a geometric center of the first decoupling unit is located directly above a middle position of the two E-plane coupled antenna units.

[0098] The shape of the first metal patch can be rectangular, triangular, circular, cross-shaped, H-shaped, C-shaped or other similar shapes, and the size of the first metal patch ranges from 0.01λc to 0.25λc, where λc is the wavelength of electromagnetic waves corresponding to the center frequency of the antenna array. The first metal patch with the size range is an electrically small metal patch. The electromagnetic scattering wave of the electrically small metal patch structure is isotropic, i.e., the scattering wave amplitudes and phases in different directions are equal at the same distance. In addition, the first metal patch can be further sleeved with a first metal ring, or each first metal patch comprises a plurality of metal patches arranged along a direction perpendicular to the H-plane direction, or each first metal patch comprises a plurality of metal patches arranged in layers. Different structures of the first metal patch can achieve different decoupling effects.

[0099] In an embodiment, the decoupling method further comprises the following steps:

[0100] The shape, number, height or size of the first metal patch is adjusted so that the E-plane scattering wave generated by the first decoupling unit is equal in amplitude and opposite in phase to the E-plane coupling wave.

[0101] The E-plane scattering wave generated by the first decoupling unit is equal in amplitude and opposite in phase to the E-plane coupling wave, and the E-plane scattering wave and the E-plane coupling wave cancel each other out, achieving E-plane decoupling.

[0102] In an embodiment, the second decoupling unit comprises one second metal patch or a plurality of second metal patches arranged along the E-plane direction, and a geometric center of the second decoupling unit is located directly above the antenna unit.

[0103] The shape of the second metal patch can be rectangular, triangular, circular, cross-shaped, H-shaped, C-shaped or other similar shapes, and the size of the second metal patch ranges from 0.01λc to 0.25λc, where λc is the wavelength of electromagnetic waves corresponding to the center frequency of the antenna array. The second metal patch with the size range is an electrically small metal patch. The electromagnetic scattering wave of the electrically small metal patch structure is isotropic, i.e., the scattering wave amplitudes and phases in different directions are equal at the same distance. In addition, the second metal patch can be further sleeved with a second metal ring, or each second metal patch comprises a plurality of metal patches arranged along a direction perpendicular to the E-plane direction, or each second metal patch comprises a plurality of metal patches arranged in layers. Different structures of the second metal patch can achieve different decoupling effects.

[0104] In an embodiment, the decoupling method further comprises the following steps:

[0105] The shape, number, height or size of the second metal patch is adjusted so that the H-plane scattering wave generated by the second decoupling unit is equal in amplitude to the H-plane coupling wave.

[0106] The H-plane scattering wave generated by the second decoupling unit can achieve H-plane partial decoupling.

[0107] In an embodiment, the third decoupling unit comprises one third metal patch or a plurality of third metal patches arranged in layers, and the geometric center of the third decoupling unit is located directly above the middle position of the two H-plane coupled antenna units.

[0108] The third decoupling unit can be composed of only one third metal patch or a plurality of third metal patches arranged in layers to achieve different decoupling effects. The shape of the third metal patch can be rectangular, triangular, circular, cross-shaped, I-shaped, C-shaped or other similar shapes. The size of the third metal patch ranges from 0.40λc to 0.80λc, where λc is the wavelength of the electromagnetic wave corresponding to the center frequency of the antenna array. The third metal patch with this size range is an electrically large metal patch, which refers to both the physical length and the effective current length, i.e. the electrical length. In addition, the third metal patch can also be provided with a third metal ring outside, adopting a nested metal patch structure, which is beneficial to reducing the physical size of the electrically large metal patch and enhancing the scattering wave amplitude to improve the decoupling effect.

[0109] In an embodiment, the decoupling method further comprises the following steps:

[0110] The shape, number, height or size of the third metal patch is adjusted so that the H-plane scattering wave generated by the second decoupling unit and the third decoupling unit together is equal in amplitude and opposite in phase to the H-plane coupling wave.

[0111] By the second decoupling unit and the third decoupling unit generating the H-plane scattering wave equal in amplitude and opposite in phase to the H-plane coupling wave, the H-plane scattering wave and the H-plane coupling wave cancel each other out to achieve E-plane decoupling.

[0112] In the following, the decoupling method provided by the present application is further described in conjunction with specific embodiments.

[0113] The method for achieving dual-mode decoupling applied to a planar antenna array provided in the present example comprises the following steps:

[0114] The first step is to set the first decoupling unit 120, which is composed of one electrically small first metal patch 121 or multiple electrically small first metal patches 121. If the first decoupling unit 120 is composed of multiple electrically small first metal patches 121, the multiple first metal patches 121 are arranged along the H-plane direction of the antenna. The geometric center of the first decoupling unit 120 is located directly above the middle position of each two E-coupled antenna units. By adjusting the size, height, number, shape and number of layers of the first metal patch 121, the E-plane scattering wave generated by the first decoupling unit 120 is equal in amplitude and opposite in phase to the E-plane coupling wave, so as to realize E-plane antenna decoupling.

[0115] The second step is to set the second decoupling unit 130, which is composed of one electrically small second metal patch 131 or multiple electrically small second metal patches 131. If the second decoupling unit 130 is composed of multiple electrically small second metal patches 131, the multiple second metal patches 131 are arranged along the E-plane of the antenna. In order to avoid the second decoupling unit 130 having a greater impact on the first decoupling unit 120, the second metal patch 131 is arranged from the outside to the inside starting from both ends of the antenna. The geometric center of the second decoupling unit 130 is located directly above each antenna unit. By adjusting the size, number, shape and number of layers of the second metal patch 131, the H-plane scattering wave generated by the second decoupling unit 130 is equal in amplitude to the H-plane coupling wave.

[0116] The third step is to optimize the first decoupling unit 120 by adjusting the size of the first metal patch 121 to correct the impact of the second decoupling unit 130 on the E-plane scattering wave and ensure E-plane decoupling.

[0117] The fourth step is to set the third decoupling unit 140, which is composed of one electrically large third metal patch 141 or multiple electrically large third metal patches 141 stacked together. The geometric center of the third decoupling unit 140 is located directly above the middle position of each two H-coupled antenna units. By adjusting the size of the third metal patch 141 and utilizing the resonance characteristics of the third decoupling unit 140, the H-plane scattering wave generated by the second decoupling unit 130 is opposite in phase to the H-plane coupling wave, so as to realize H-plane antenna decoupling.

[0118] The fifth step is to optimize the second decoupling unit 130 by adjusting the size of the second metal patch 131 to correct the impact of the third decoupling unit 140 and ensure H-plane decoupling.

[0119] The sixth step is to expand the first decoupling unit 120, the second decoupling unit 130 and the third decoupling unit 140 along the x-axis and the y-axis according to the scale of the planar MIMO antenna to obtain a decoupling device that realizes E-plane and H-plane common decoupling of the antenna.

[0120] Due to the symmetry of the decoupling unit, the method is applicable not only to a single-polarized antenna array but also to a dual-polarized antenna array.

[0121] The decoupling device and the decoupling method provided by the embodiments of the present application can achieve more coupling wave suppression in a dual-polarized MIMO antenna array and obtain better coupling effect; and can also achieve two-dimensional spatial arbitrary direction coupling decoupling, so that the base station antenna decoupling has greater flexibility.

[0122] The embodiments of the present application are described in detail above in combination with the drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge range of ordinary skilled in the art without departing from the purpose of the present application.

Claims

1. A decoupling device applied to an antenna array, the antenna array comprising a plurality of antenna elements, characterized in that, The decoupling device comprises: a medium substrate located above the plurality of antenna units; a first decoupling unit arranged on the medium substrate, the first decoupling unit being arranged above the middle position of every two E-coupled antenna units; a second decoupling unit arranged on the medium substrate, the second decoupling unit being arranged above every antenna unit; a third decoupling unit arranged on the medium substrate, the third decoupling unit being arranged above the middle position of every two H-coupled antenna units; wherein the third decoupling unit has a size of an electrically large size, and the third decoupling unit has a resonant characteristic.

2. The decoupling device of claim 1, wherein, The first decoupling unit comprises one first metal patch or a plurality of first metal patches arranged along the H direction, and the geometric center of the first decoupling unit is located directly above the middle position of the two E-coupled antenna units.

3. The decoupling device of claim 2, wherein, Each first metal patch comprises a plurality of metal patches arranged perpendicularly to the H direction.

4. The decoupling device of claim 2, wherein, Each first metal patch comprises a plurality of metal patches arranged in layers.

5. The decoupling device of claim 2, wherein, The first metal patch is externally sleeved with a first metal ring.

6. The decoupling device of claim 2, wherein, The length of the first metal patch along the H direction ranges from 0.01λc to 0.25λc, where λc is the wavelength of an electromagnetic wave corresponding to the center frequency of the antenna array.

7. The decoupling device of claim 1, wherein, The second decoupling unit comprises one second metal patch or a plurality of second metal patches arranged along the E direction, and the geometric center of the second decoupling unit is located directly above the antenna unit.

8. The decoupling device of claim 7, wherein, Each second metal patch comprises a plurality of metal patches arranged perpendicularly to the E direction.

9. The decoupling device of claim 7, wherein, Each second metal patch comprises a plurality of metal patches arranged in layers.

10. The decoupling device of claim 7, wherein, The second metal patch is externally sleeved with a second metal ring.

11. The decoupling device of claim 7, wherein, The length of the second metal patch along the E direction ranges from 0.01λc to 0.25λc, where λc is the wavelength of an electromagnetic wave corresponding to the center frequency of the antenna array.

12. The decoupling device of claim 1, wherein, The third decoupling unit comprises one third metal patch or a plurality of third metal patches arranged in layers, and the geometric center of the third decoupling unit is located directly above the middle position of the two H-coupled antenna units.

13. The decoupling device of claim 12, wherein, The length of the third metal patch along the H direction ranges from 0.40λc to 0.80λc, where λc is the wavelength of an electromagnetic wave corresponding to the center frequency of the antenna array.

14. The decoupling device of claim 12, wherein, The third metal patch is externally sleeved with a third metal ring.

15. A decoupling method applied to an antenna array, the antenna array comprising a plurality of antenna elements, characterized in that, The decoupling method comprises: arranging a first decoupling unit above the middle position of every two E-coupled antenna units; arranging a second decoupling unit above every antenna unit; arranging a third decoupling unit above the middle position of every two H-coupled antenna units; wherein the third decoupling unit has a size of an electrically large size, and the third decoupling unit has a resonant characteristic.

16. The decoupling method of claim 15, wherein, The first decoupling unit includes one first metal patch or a plurality of first metal patches arranged along the H-plane direction, and a geometric center of the first decoupling unit is located directly above a middle position of the two E-plane coupled antenna units.

17. The decoupling method of claim 16, wherein, Further comprising: The shape, number, height or size of the first metal patch is adjusted so that the E-plane scattering wave generated by the first decoupling unit is equal in amplitude and opposite in phase to the E-plane coupling wave.

18. The decoupling method of claim 15, wherein, The second decoupling unit includes one second metal patch or a plurality of second metal patches arranged along the E-plane direction, and a geometric center of the second decoupling unit is located directly above the antenna unit.

19. The decoupling method of claim 18, wherein, Further comprising: The shape, number, height or size of the second metal patch is adjusted so that the H-plane scattering wave generated by the second decoupling unit is equal in amplitude to the H-plane coupling wave.

20. The decoupling method of claim 15, wherein, The third decoupling unit includes one third metal patch or a plurality of third metal patches arranged in layers, and a geometric center of the third decoupling unit is located directly above a middle position of the two H-plane coupled antenna units.

21. The decoupling method of claim 20, wherein, Further comprising: The shape, number of layers, height or size of the third metal patch is adjusted so that the H-plane scattering wave generated by the second decoupling unit and the third decoupling unit together is equal in amplitude and opposite in phase to the H-plane coupling wave.

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