Shielded differential via, method of fabrication, and differential signal high speed channel

Abstract

The application discloses a shielded differential via, a manufacturing method of the shielded differential via and a differential signal high-speed channel. The metal hole wall of the long hole is divided into a differential transmission line and a shielded hole wall. The shielded hole wall can be used as a reference ground of the differential transmission line, and the impedance is stable and is not affected by the hole length, the hole size, the dielectric constant of the printed circuit board, the size of the reverse pad and the like. The shielded hole wall can well isolate the interference signal, and especially can block the coupling between the adjacent parallel long vias. In addition, the width and the line spacing of the differential transmission line can be controlled by adjusting the position and the hole size of the divided hole, so that the impedance of the differential transmission line is controlled to be the design value, the impedance of the differential transmission line and the impedance of the connected signal line are matched, and the return loss is reduced. The embodiment of the application overcomes the problems of uncontrolled differential signal via impedance, large return loss, no shielding or poor shielding effect, and the like, and the manufacturing process is simple and not complex, and is easy to implement.

Description

Technical Field

[0001] This invention relates to the field of high-speed design technology, and in particular to a shielded differential via, a method for manufacturing a shielded differential via, and a high-speed differential signal channel. Background Technology

[0002] As signal transmission rates continue to increase, signal channels become increasingly sensitive to impedance continuity / return loss and crosstalk, especially at speeds above 56Gbps. Via diameter, anti-pads, length, and the dielectric constant of high-speed board materials all affect via impedance, leading to impedance instability and failure to meet design requirements. This is particularly true for crimp holes in high-speed connectors, where the thicker pins typically result in lower impedance and greater deviation from the transmission line. Furthermore, parallel vias, especially long parallel vias, also have a significant impact on crosstalk. Currently, there are no effective measures for vias in high-speed design. Existing related technologies are difficult to apply to high-speed channel design. Shielding of single vias involves multiple via plugging and copper plating, which is complex and unsuitable for differential vias. Summary of the Invention

[0003] The purpose of this invention is to at least solve one of the technical problems existing in the prior art, and to provide a shielded differential via, a method for manufacturing a shielded differential via, and a high-speed differential signal channel. The shielded differential via has stable impedance, can isolate interference signals, and has a simple manufacturing process.

[0004] In a first aspect, embodiments of the present invention provide a shielded differential via, including an elongated hole and at least three dividing holes disposed on a printed circuit board. The inner wall of the elongated hole is provided with a metal hole wall, and the at least three dividing holes pass through the metal hole wall, so that the metal hole wall is divided into a first differential transmission line, a second differential transmission line, and a first shielding hole wall.

[0005] Secondly, embodiments of the present invention provide a method for fabricating a shielded differential via, comprising:

[0006] Mill elongated holes into a printed circuit board;

[0007] The inner wall of the elongated hole is plated with copper to form a metal hole wall;

[0008] At least three dividing holes are drilled on the printed circuit board, the at least three dividing holes passing through the metal hole wall, so that the metal hole wall is divided into a first differential transmission line, a second differential transmission line and a first shielding hole wall.

[0009] Thirdly, embodiments of the present invention provide a shielded differential via, including a first crimping via, a second crimping via, an elongated blind via, and three segmented blind vias disposed on a printed circuit board. The elongated blind vias partially overlap with the first crimping via and the second crimping via, respectively. The inner walls of the first crimping via, the second crimping via, and the elongated blind via are provided with metal hole walls. The three segmented blind vias pass through the metal hole walls of the inner walls of the elongated blind vias, so that the metal hole walls of the inner walls of the elongated blind vias are divided into a third differential transmission line, a fourth differential transmission line, and a second shielding hole wall.

[0010] Wherein: the third differential transmission line is electrically connected to the metal hole wall of the inner wall of the first crimping through hole, and the fourth differential transmission line is electrically connected to the metal hole wall of the inner wall of the second crimping through hole.

[0011] Fourthly, embodiments of the present invention provide a method for fabricating a shielded differential via, comprising:

[0012] Drill the first crimping via and the second crimping via on the printed circuit board;

[0013] Elongated blind holes are milled on the printed circuit board, and the elongated blind holes partially overlap with the first crimping through hole and the second crimping through hole, respectively;

[0014] Copper plating is performed on the inner walls of the first crimping through hole, the second crimping through hole, and the elongated blind hole to form a metal hole wall;

[0015] Three segmented blind holes are drilled on the printed circuit board. The three segmented blind holes pass through the metal hole wall of the inner wall of the elongated blind hole, so that the metal hole wall of the inner wall of the elongated blind hole is divided into a third differential transmission line, a fourth differential transmission line, and a second shielding hole wall; wherein: the third differential transmission line is electrically connected to the metal hole wall of the inner wall of the first crimping through hole, and the fourth differential transmission line is electrically connected to the metal hole wall of the inner wall of the second crimping through hole.

[0016] Fifthly, embodiments of the present invention provide a high-speed differential signal channel:

[0017] The differential signal high-speed channel includes an elongated hole and at least three dividing holes disposed on a printed circuit board. The inner wall of the elongated hole is provided with a metal hole wall. The at least three dividing holes pass through the metal hole wall of the inner wall of the elongated hole, so that the metal hole wall of the inner wall of the elongated hole is divided into a first differential transmission line, a second differential transmission line and a first shielding hole wall.

[0018] The differential signal high-speed channel further includes a first crimping via, a second crimping via, an elongated blind via, and three segmented blind vias disposed on a printed circuit board. The elongated blind vias partially overlap with the first crimping via and the second crimping via. The inner walls of the first crimping via, the second crimping via, and the elongated blind via are provided with metal hole walls. The three segmented blind vias pass through the metal hole walls of the inner walls of the elongated blind vias, so that the metal hole walls of the inner walls of the elongated blind vias are divided into a third differential transmission line, a fourth differential transmission line, and a second shielding hole wall. The third differential transmission line is electrically connected to the metal hole wall of the inner wall of the first crimping via, and the fourth differential transmission line is electrically connected to the metal hole wall of the inner wall of the second crimping via.

[0019] The differential signal high-speed channel further includes a first transmission line and a second transmission line disposed on a printed circuit board. The first differential transmission line is connected to the third differential transmission line through the first transmission line; the second differential transmission line is connected to the fourth differential transmission line through the second transmission line.

[0020] This invention includes: shielded differential vias, a method for fabricating shielded differential vias, and a high-speed differential signal channel. According to the solution provided by this invention, by dividing the metal wall of the elongated via into differential transmission lines and shielded via walls, the shielded via walls can serve as a reference ground for the differential transmission lines, ensuring stable impedance unaffected by via length, diameter, dielectric constant of the printed circuit board material, or anti-pad size. This effectively isolates interference signals, especially blocking coupling between adjacent parallel elongated vias. Furthermore, by adjusting the position and diameter of the dividing vias, the width and spacing of the differential transmission lines can be controlled, thereby controlling the impedance of the differential transmission lines to the design value, ensuring impedance matching between the differential transmission lines and the connected signal lines, and reducing return loss. This invention overcomes the problems of uncontrolled differential signal via impedance, high return loss, lack of shielding, or poor shielding effect, and the fabrication process is simple and easy to implement.

[0021] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the description, claims, and drawings. Attached Figure Description

[0022] The accompanying drawings are provided to further understand the technical solutions of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the technical solutions of the present invention, and do not constitute a limitation on the technical solutions of the present invention.

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0024] Figure 1 This is a schematic diagram of a shielded differential via provided in one embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of a shielded differential via provided in another embodiment of the present invention;

[0026] Figure 3 This is a schematic diagram of the structure of a shielded differential via without a dividing hole, according to an embodiment of the present invention.

[0027] Figure 4 This is a flowchart of a method for fabricating a shielded differential via provided in an embodiment of the present invention;

[0028] Figure 5 This is a schematic diagram of the structure of the first crimped via and the second crimped via portion of a shielded differential via according to another embodiment of the present invention;

[0029] Figure 6 This is a schematic diagram of the structure of a long blind hole portion of a shielded differential via provided in another embodiment of the present invention;

[0030] Figure 7 This is a flowchart of a method for fabricating a shielded differential via according to another embodiment of the present invention;

[0031] Figure 8 This is a schematic diagram of a differential signal high-speed channel provided in another embodiment of the present invention. Detailed Implementation

[0032] This section will describe in detail specific embodiments of the present invention. Preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and overall technical solution of the present invention, but they should not be construed as limiting the scope of protection of the present invention.

[0033] In the description of this invention, the use of "first" and "second" is for the purpose of distinguishing technical features only, and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of the technical features indicated.

[0034] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0035] This invention provides a shielded differential via, a method for manufacturing a shielded differential via, and a high-speed differential signal channel. The shielded differential via has stable impedance, can isolate interference signals, and has a simple manufacturing process.

[0036] The embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0037] A first aspect of the present invention provides a shielded differential via, including an elongated via 100 and at least three segmented vias 300 disposed on a printed circuit board. The inner wall of the elongated via 100 is provided with a metal via wall. (Refer to...) Figure 3 As shown, the metal hole wall of the inner wall of the elongated hole 100 includes a first straight wall 240, a second straight wall 250 and two arc-shaped hole walls. The first straight wall 240 and the second straight wall 250 are parallel to each other, and the two arc-shaped hole walls are respectively connected to the first straight wall 240 and the second straight wall 250.

[0038] Additionally, refer to Figure 1 and Figure 2 At least three dividing holes 300 pass through the metal hole wall to divide the metal hole wall into a first differential transmission line 210, a second differential transmission line 220 and a first shielding hole wall 230.

[0039] By dividing the inner metal wall of the elongated via 100 into a differential transmission line and a shielded via wall, the shielded via wall can serve as a reference ground for the differential transmission line, ensuring stable impedance unaffected by via length, diameter, dielectric constant of the printed circuit board material, or anti-pad size. It effectively isolates interference signals, especially blocking coupling between adjacent parallel long vias. Furthermore, by adjusting the position and diameter of the dividing via 300, the width and spacing of the differential transmission line can be controlled, thereby controlling the impedance of the differential transmission line to the design value. This ensures impedance matching between the differential transmission line and the connected signal lines, reducing return loss. This invention overcomes problems such as uncontrolled differential signal via impedance, high return loss, lack of shielding, or poor shielding effectiveness. Moreover, the manufacturing process is simple and easy to implement.

[0040] Reference Figure 1 In the shielded differential via provided in this embodiment, three dividing holes 300 are provided, and the three dividing holes 300 pass through the first straight wall 240 or the second straight wall 250. It can be understood that the three dividing holes 300 are all provided on a long straight wall of the metal hole wall, so that the first straight wall 240 or the second straight wall 250 is divided into a first differential transmission line 210 and a second differential transmission line 220 by the three dividing holes 300.

[0041] By dividing the metal hole wall of the inner wall of the elongated hole 100 into a first differential transmission line 210 and a second differential transmission line 220 as edge-coupled differential signals, the other long straight wall of the metal hole wall and the two arc-shaped hole walls are used as the reference ground and shield for the differential signals. This method is suitable for cases where the differential pins are arranged perpendicular to the chip edge.

[0042] Reference Figure 2 Distinguished from Figure 1 In the differential transmission line structure shown in this embodiment, four dividing holes 300 are provided in the shielded differential vias provided in this embodiment. Two dividing holes 300 pass through the first straight wall 240 to divide the first differential transmission line 210, and the other two dividing holes 300 pass through the second straight wall 250 to divide the second differential transmission line 220.

[0043] By dividing one long straight wall of the metal hole wall inside the elongated hole 100 into a first differential transmission line 210 and dividing the other long straight wall into a second differential transmission line 220, the two sides of the elongated hole 100 are used as wide-side coupled differential signals, and the other parts are used as reference ground and shielding. This is suitable for situations where the differential pins are arranged parallel to the edge of the chip.

[0044] Reference Figure 4 As shown, a second aspect of the present invention provides a method for manufacturing a shielded differential via, the method comprising the following steps:

[0045] Step S410: Mill an elongated hole 100 on the printed circuit board;

[0046] Step S420: Perform copper plating on the inner wall of the elongated hole 100 to form a metal hole wall;

[0047] Step S430: Drill at least three dividing holes 300 on the printed circuit board. The at least three dividing holes 300 pass through the metal hole wall so that the metal hole wall is divided into a first differential transmission line 210, a second differential transmission line 220 and a first shielding hole wall 230.

[0048] It should be noted that after step S440 is completed to form a metal hole wall on the inner wall of the elongated hole 100, resin can be used to plug the hole to facilitate the subsequent drilling of the dividing hole 300.

[0049] It is understandable that printed circuit boards are generally multilayer boards that are laminated according to conventional processing technology. The processing technology of printed circuit boards includes, but is not limited to: making inner layer boards according to pre-designed inner layer patterns; and laminating the inner layer boards to obtain multilayer boards.

[0050] The structure of the elongated hole 100 portion of the printed circuit board after step S420 is as follows: Figure 3As shown, the metal hole wall of the elongated hole 100 includes a first straight wall 240, a second straight wall 250, and two arc-shaped hole walls. The first straight wall 240 and the second straight wall 250 are parallel to each other, and the two arc-shaped hole walls are respectively connected to the first straight wall 240 and the second straight wall 250. The structure of the elongated hole 100 portion of the printed circuit board after step S430 is as follows: Figure 1 Or such as Figure 2 As shown.

[0051] In addition, after completing step S430, back drilling can be used to reduce residual piles in the hole, or zero-stub technology can be used to achieve zero-residual pile through the hole.

[0052] In the fabrication method of the shielded differential via in this embodiment, the metal hole wall of the inner wall of the elongated hole 100 is divided into a differential transmission line and a shielded hole wall. The shielded hole wall can serve as a reference ground for the differential transmission line, with stable impedance, unaffected by hole length, hole diameter, dielectric constant of the printed circuit board material, anti-pad size, etc. It can effectively isolate interference signals, especially blocking coupling between adjacent parallel elongated vias. In addition, the width and spacing of the differential transmission line can be controlled by adjusting the position and diameter of the dividing hole 300, thereby controlling the impedance of the differential transmission line to the design value, so that the impedance of the differential transmission line matches the impedance of the connected signal line, thereby reducing return loss. This embodiment of the invention overcomes the problems of uncontrolled differential signal via impedance, large return loss, lack of shielding or poor shielding effect, and the fabrication process is simple and easy to implement.

[0053] Reference Figure 1 As shown, in the above method for manufacturing shielded differential vias, the metal via wall includes a first straight wall 240 and a second straight wall 250 that are parallel to each other. Three dividing holes 300 are drilled on the multilayer board. The three dividing holes 300 pass through the first straight wall 240 or the second straight wall 250.

[0054] By dividing the metal hole wall of the inner wall of the elongated hole 100 into a first differential transmission line 210 and a second differential transmission line 220 as edge-coupled differential signals, the other long straight wall of the metal hole wall and the two arc-shaped hole walls are used as the reference ground and shield for the differential signals. This method is suitable for cases where the differential pins are arranged perpendicular to the chip edge.

[0055] Reference Figure 2 As shown, in the above method for manufacturing shielded differential vias, the metal via wall includes a first straight wall 240 and a second straight wall 250 that are parallel to each other. Four dividing holes 300 are drilled on the multilayer board. Two dividing holes 300 pass through the first straight wall 240 to divide the first differential transmission line 210, and two dividing holes 300 pass through the second straight wall 250 to divide the second differential transmission line 220.

[0056] By dividing one long straight wall of the metal hole wall inside the elongated hole 100 into a first differential transmission line 210 and dividing the other long straight wall into a second differential transmission line 220, the two sides of the elongated hole 100 are used as wide-side coupled differential signals, and the other parts are used as reference ground and shielding. This is suitable for situations where the differential pins are arranged parallel to the edge of the chip.

[0057] In the above method for manufacturing shielded differential vias, before milling the elongated hole 100 on the printed circuit board, a hole plate is also provided on the printed circuit board.

[0058] Before performing step S410, a via design is required for the vias of the differential signals to locate their positions. This involves first setting up a via on the printed circuit board, and then step S410 mills elongated holes 100 into the via. It is understood that the shape of the via is consistent with the shape of the elongated holes 100.

[0059] The embodiments of the present invention can not only achieve controllable impedance of differential vias to reduce return loss, but also shield differential pairs to reduce crosstalk; with the aid of zero residual stake technology, it can achieve performance optimization of high-speed channels with next-generation speeds of 112G and above; and by utilizing mature PCB manufacturing processes, it can greatly reduce production costs and has strong feasibility.

[0060] Furthermore, a third aspect of the present invention provides a shielded differential via, including a first crimp via 400, a second crimp via 500, an elongated blind via 600, and three segmented blind vias 700 disposed on a printed circuit board. The elongated blind vias 600 partially overlap with the first crimp via 400 and the second crimp via 500, respectively. The inner walls of the first crimp via 400, the second crimp via 500, and the elongated blind via 600 are provided with metal hole walls. A schematic diagram of the structure of the first crimp via 400 and the second crimp via 500 is shown below. Figure 5 As shown; a structural schematic diagram of the 600-section elongated blind hole is shown below. Figure 6 As shown; three segmented blind holes 700 pass through the metal hole wall of the inner wall of the elongated blind hole 600, so that the metal hole wall of the inner wall of the elongated blind hole 600 is divided into a third differential transmission line 810, a fourth differential transmission line 820 and a second shielding hole wall 830.

[0061] Specifically: the third differential transmission line 810 is electrically connected to the metal hole wall inside the first crimping via 400, and the fourth differential transmission line 820 is electrically connected to the metal hole wall inside the second crimping via 500.

[0062] Understandable Figure 5 and Figure 6This is a schematic diagram of the same location on a printed circuit board at different heights. The printed circuit board is considered to have two layers. The upper layer only shows the first crimp via 400 and the second crimp via 500. The lower layer shows both the first crimp via 400 and the second crimp via 500, as well as the elongated blind via 600. The upper layer, i.e.... Figure 5 The first crimping via 400 and the second crimping via 500 shown are generally used for differential output lines of crimped pins in high-speed connectors. The fisheye position of the connector crimping pin extends upwards to the top surface of the printed circuit board to meet crimping requirements, thus retaining the original crimping via design. The fisheye position of the connector crimping pin extends downwards to the trace layer, which is then adjusted accordingly. Figure 6 The design shown features an elongated blind via 600, and a segmented blind via 700 divides the inner metal wall of the elongated blind via 600 into a third differential transmission line 810, a fourth differential transmission line 820, and a second shielding via wall 830. The second shielding via wall 830 can serve as a reference ground for the differential transmission line, ensuring stable impedance unaffected by via length, diameter, dielectric constant of the printed circuit board material, or anti-pad size. It effectively isolates interference signals, especially blocking coupling between adjacent parallel long vias. Furthermore, by adjusting the position and diameter of the segmented blind via 700, the width and spacing of the differential transmission lines can be controlled, thereby controlling the impedance of the differential transmission lines to the design value. This ensures impedance matching between the differential transmission lines and the connected signal lines, reducing return loss. This embodiment of the invention overcomes problems such as uncontrolled differential signal via impedance, high return loss, lack of shielding, or poor shielding effect. Moreover, the manufacturing process is simple and easy to implement.

[0063] Reference Figure 7 As shown, a fourth aspect embodiment of the present invention provides a method for manufacturing a shielded differential via, the method comprising the following steps:

[0064] Step S710: Drill the first crimping via 400 and the second crimping via 500 on the printed circuit board;

[0065] Step S720: Mill an elongated blind hole 600 on the printed circuit board. The elongated blind hole 600 partially overlaps with the first crimping through hole 400 and the second crimping through hole 500, respectively.

[0066] Step S730: Perform copper plating on the inner walls of the first crimping via 400, the second crimping via 500, and the elongated blind via 600 to form metal hole walls;

[0067] Step S740: Drill three segmented blind holes 700 on the printed circuit board. The three segmented blind holes 700 pass through the metal hole wall of the inner wall of the elongated blind hole 600, so that the metal hole wall of the inner wall of the elongated blind hole 600 is divided into a third differential transmission line 810, a fourth differential transmission line 820, and a second shielding hole wall 830; wherein: the third differential transmission line 810 is electrically connected to the metal hole wall of the inner wall of the first crimping via 400, and the fourth differential transmission line 820 is electrically connected to the metal hole wall of the inner wall of the second crimping via 500.

[0068] The method for fabricating shielded differential vias provided in this embodiment is used to fabricate the shielded differential vias provided in the third aspect embodiment. By dividing the metal hole wall of the elongated blind via 600 into a third differential transmission line 810, a fourth differential transmission line 820, and a second shielded hole wall 830 through the segmented blind via 700, the second shielded hole wall 830 can serve as a reference ground for the differential transmission line, with stable impedance unaffected by hole length, hole diameter, dielectric constant of the printed circuit board material, anti-pad size, etc. It can effectively isolate interference signals, especially blocking coupling between adjacent parallel long vias. In addition, the width and spacing of the differential transmission line can be controlled by adjusting the position and diameter of the segmented blind via 700, thereby controlling the impedance of the differential transmission line to the design value, so that the impedance of the differential transmission line matches the impedance of the connected signal line, thereby reducing return loss. This embodiment of the invention overcomes the problems of uncontrolled differential signal via impedance, large return loss, lack of shielding, or poor shielding effect, and the fabrication process is simple and easy to implement.

[0069] Additionally, refer to Figure 8 As shown, a fifth aspect embodiment of the present invention provides a high-speed differential signal channel:

[0070] The differential signal high-speed channel includes an elongated hole 100 and at least three dividing holes 300 disposed on a printed circuit board. The inner wall of the elongated hole 100 is provided with a metal hole wall. The at least three dividing holes 300 pass through the metal hole wall of the inner wall of the elongated hole 100, so that the metal hole wall of the inner wall of the elongated hole 100 is divided into a first differential transmission line 210, a second differential transmission line 220 and a first shielding hole wall 230.

[0071] The high-speed differential signal channel also includes a first crimping via 400, a second crimping via 500, an elongated blind via 600, and three segmented blind vias 700 disposed on the printed circuit board. The elongated blind via 600 partially overlaps with the first crimping via 400 and the second crimping via 500. The inner walls of the first crimping via 400, the second crimping via 500, and the elongated blind via 600 are provided with metal hole walls. The three segmented blind vias 700 pass through the metal hole walls of the inner walls of the elongated blind via 600, so that the metal hole walls of the inner walls of the elongated blind via 600 are divided into a third differential transmission line 810, a fourth differential transmission line 820, and a second shielding hole wall 830. Among them, the third differential transmission line 810 is electrically connected to the metal hole wall of the inner wall of the first crimping via 400, and the fourth differential transmission line 820 is electrically connected to the metal hole wall of the inner wall of the second crimping via 500.

[0072] The differential signal high-speed channel also includes a first transmission line 910 and a second transmission line 920 disposed on the printed circuit board. The first differential transmission line 210 is connected to the third differential transmission line 810 through the first transmission line 910; the second differential transmission line 220 is connected to the fourth differential transmission line 820 through the second transmission line 920.

[0073] The high-speed differential signal channel provided in this embodiment of the invention includes both the elongated via 100 shown in the first aspect embodiment and the first crimping via 400, the second crimping via 500, and the elongated blind via 600 shown in the third aspect embodiment. The first differential transmission line 210 is connected to the third differential transmission line 810 through the first transmission line 910, and the second differential transmission line 220 is connected to the fourth differential transmission line 820 through the second transmission line 920, thus forming a high-speed performance channel, which greatly improves the performance of applications with high speeds of 56G and above.

[0074] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A shielded differential via, characterized in that, It includes an elongated hole and at least three dividing holes disposed on a printed circuit board. The inner wall of the elongated hole is provided with a metal hole wall, and the at least three dividing holes pass through the metal hole wall so that the metal hole wall is divided into a first differential transmission line, a second differential transmission line, and a first shielding hole wall.

2. The shielded differential via according to claim 1, characterized in that, The metal hole wall includes a first straight wall and a second straight wall that are parallel to each other, and three dividing holes are provided, which pass through the first straight wall or the second straight wall.

3. The shielded differential via according to claim 1, characterized in that, The metal hole wall includes a first straight wall and a second straight wall that are parallel to each other. Four dividing holes are provided. Two dividing holes pass through the first straight wall to divide the first differential transmission line, and two dividing holes pass through the second straight wall to divide the second differential transmission line.

4. A method for fabricating a shielded differential via, characterized in that, include: Mill elongated holes into a printed circuit board; The inner wall of the elongated hole is plated with copper to form a metal hole wall; At least three dividing holes are drilled on the printed circuit board, the at least three dividing holes passing through the metal hole wall, so that the metal hole wall is divided into a first differential transmission line, a second differential transmission line and a first shielding hole wall.

5. The manufacturing method according to claim 4, characterized in that, The metal hole wall includes a first straight wall and a second straight wall that are parallel to each other. The printed circuit board has three dividing holes drilled through the first straight wall or the second straight wall.

6. The manufacturing method according to claim 4, characterized in that, The metal hole wall includes a first straight wall and a second straight wall that are parallel to each other. The printed circuit board has four dividing holes drilled in it. Two of the dividing holes pass through the first straight wall to divide the first differential transmission line, and two of the dividing holes pass through the second straight wall to divide the second differential transmission line.

7. The manufacturing method according to claim 4, characterized in that, Before milling elongated holes on the printed circuit board, the following steps are also included: Hole pads are set on the printed circuit board.

8. A shielded differential via, characterized in that, The circuit includes a first crimping via, a second crimping via, an elongated blind via, and three segmented blind vias disposed on a printed circuit board. The elongated blind vias partially overlap with the first crimping via and the second crimping via, respectively. The inner walls of the first crimping via, the second crimping via, and the elongated blind via are provided with metal hole walls. The three segmented blind vias pass through the metal hole walls of the inner walls of the elongated blind vias, thereby dividing the metal hole walls of the inner walls of the elongated blind vias into a third differential transmission line, a fourth differential transmission line, and a second shielding hole wall. Wherein: the third differential transmission line is electrically connected to the metal hole wall of the inner wall of the first crimping through hole, and the fourth differential transmission line is electrically connected to the metal hole wall of the inner wall of the second crimping through hole.

9. A method for fabricating a shielded differential via, characterized in that, include: Drill the first crimping via and the second crimping via on the printed circuit board; Elongated blind holes are milled on the printed circuit board, and the elongated blind holes partially overlap with the first crimping through hole and the second crimping through hole respectively; Copper plating is performed on the inner walls of the first crimping through hole, the second crimping through hole, and the elongated blind hole to form a metal hole wall; Three segmented blind holes are drilled on the printed circuit board. The three segmented blind holes pass through the metal hole wall of the inner wall of the elongated blind hole, so that the metal hole wall of the inner wall of the elongated blind hole is divided into a third differential transmission line, a fourth differential transmission line, and a second shielding hole wall; wherein: the third differential transmission line is electrically connected to the metal hole wall of the inner wall of the first crimping through hole, and the fourth differential transmission line is electrically connected to the metal hole wall of the inner wall of the second crimping through hole.

10. A high-speed differential signal channel, characterized in that: The differential signal high-speed channel includes an elongated hole and at least three dividing holes disposed on a printed circuit board. The inner wall of the elongated hole is provided with a metal hole wall. The at least three dividing holes pass through the metal hole wall of the inner wall of the elongated hole, so that the metal hole wall of the inner wall of the elongated hole is divided into a first differential transmission line, a second differential transmission line and a first shielding hole wall. The differential signal high-speed channel further includes a first crimping via, a second crimping via, an elongated blind via, and three segmented blind vias disposed on a printed circuit board. The elongated blind vias partially overlap with the first crimping via and the second crimping via. The inner walls of the first crimping via, the second crimping via, and the elongated blind via are provided with metal hole walls. The three segmented blind vias pass through the metal hole walls of the inner walls of the elongated blind vias, so that the metal hole walls of the inner walls of the elongated blind vias are divided into a third differential transmission line, a fourth differential transmission line, and a second shielding hole wall. The third differential transmission line is electrically connected to the metal hole wall of the inner wall of the first crimping via, and the fourth differential transmission line is electrically connected to the metal hole wall of the inner wall of the second crimping via. The differential signal high-speed channel further includes a first transmission line and a second transmission line disposed on a printed circuit board. The first differential transmission line is connected to the third differential transmission line through the first transmission line; the second differential transmission line is connected to the fourth differential transmission line through the second transmission line.

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