A laser processing apparatus

Abstract

The application relates to a laser processing device, which comprises a laser light source for emitting laser light; an optical path switching assembly arranged adjacent to the laser light source and used for switching the laser light in a first optical path and a second optical path; a galvanometer assembly arranged in the first optical path and adjacent to the optical path switching assembly and used for controlling the laser light to form a scanning track on a target material surface located in the first optical path; wherein the scanning track comprises an acceleration section, a uniform speed section and a deceleration section; and a controller electrically connected with the galvanometer assembly and the optical path switching assembly and used for controlling the optical path switching assembly to switch the laser light in the first optical path and the second optical path according to the interval of the scanning track; wherein when the galvanometer assembly scans in the uniform speed section, the laser light is located in the first optical path; and when the galvanometer assembly scans in the acceleration section or the deceleration section, at least part of the laser light is located in the second optical path. In the above manner, the overburning of the edge of the scanning track can be reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser processing, in particular to a laser processing device. BACKGROUND

[0002] The laser cleaning technology is to act high energy density laser beam on the target material surface, thereby processing the target material surface.

[0003] The driving mode of controlling the laser scanning track is usually reciprocating, but at the beginning and the end of the laser track, the driving motor of the reciprocating driving scanning galvanometer is usually required to accelerate and decelerate, so that the laser spot is uneven at the beginning and the end, causing the edge of the scanning track or scanning pattern to be overburned. SUMMARY

[0004] In view of the above technical problems, the present application provides a laser processing device, which can reduce the phenomenon of overburning of the edge of the scanning track.

[0005] To solve the above technical problems, the technical scheme adopted by the present application is:

[0006] A laser processing device for processing the surface of a target material, comprising: a laser light source for emitting laser light; an optical path switching assembly adjacent to the laser light source for switching the laser light in a first optical path and a second optical path; a galvanometer assembly disposed in the first optical path and adjacent to the optical path switching assembly for controlling the laser light to form a scanning track on the surface of the target material located in the first optical path; wherein the scanning track comprises an acceleration section, a constant speed section and a deceleration section; and a controller electrically connected to the galvanometer assembly and the optical path switching assembly for controlling the optical path switching assembly to switch the laser light between the first optical path and the second optical path according to the interval to which the scanning track belongs; wherein when the galvanometer assembly scans in the constant speed section, the laser light is located in the first optical path; and when the galvanometer assembly scans in the acceleration section or the deceleration section, at least part of the laser light is located in the second optical path.

[0007] In an embodiment of the present application, the optical path switching assembly comprises: a rotating platform; a plurality of first mirrors spaced apart from the center of rotation of the rotating platform on the rotating platform; and a first driving member connected to the rotating platform for driving the rotating platform to rotate, thereby sequentially driving the plurality of first mirrors to pass through the optical path switching station; wherein when the first mirror is located in the optical path switching station, the first mirror reflects the laser light to the second optical path; and when the first mirror is not located in the optical path switching station, the laser light is transmitted to the galvanometer assembly through the first optical path; wherein the controller is electrically connected to the first driving member for controlling the first mirror to be located in the optical path switching station when the galvanometer assembly scans in the acceleration section or the deceleration section; and for controlling the first mirror not to be located in the optical path switching station when the galvanometer assembly scans in the constant speed section.

[0008] In an embodiment of the present application, the galvanometer assembly comprises a second mirror and a second driving member, the second driving member being connected with the second mirror and used to drive the second mirror to reciprocate so as to form a scanning track on the target surface; wherein, when the second driving member accelerates, the second driving member forms an acceleration section of the scanning track on the target surface; when the second driving member rotates at a constant speed, the second driving member forms a constant speed section of the scanning track on the target surface; when the second driving member decelerates, the second driving member forms a deceleration section of the scanning track on the target surface; wherein, the controller is electrically connected with the second driving member, and is used to control the first driving member to drive the first mirror to enter the light path switching station when the rotating speed of the second driving member becomes larger or smaller, and is used to control the first driving member to drive the first mirror to move out of the light path switching station when the rotating speed of the second driving member remains unchanged.

[0009] In an embodiment of the present application, the controller is used to control the first driving member and the second driving member to rotate synchronously; wherein, the time t0 required for the first driving member to drive the adjacent two first mirrors to enter and exit the light path switching station is the same as the time t1 required for the second driving member to drive the second mirror to complete a scanning track on the target surface.

[0010] In an embodiment of the present application, the first driving member is a servo motor, the number of the first mirrors is M, the number of pulses required for the servo motor to rotate one circumference is N all , the interval time of a single pulse trigger is T, and the number of pulses required for the adjacent two first mirrors to enter and exit the light path switching station is The second driving member is a galvanometer motor, the maximum scanning length of the galvanometer motor is L max , the maximum scanning speed is V max , the amplitude modulation parameter is K1, and the speed modulation parameter is K2. Wherein, Wherein, the value range of K1 and K2 is 1% to 100%.

[0011] In an embodiment of the present application, the light path switching assembly comprises: a third mirror, which is arranged adjacent to the laser light source; a third driving member, which is connected with the third mirror and used to drive the third mirror to deflect so as to alternately reflect the laser light into the first light path and the second light path; and a light path lengthening assembly, which is arranged adjacent to the deflection mirror and used to increase the offset of the first light path and the second light path so that the second light path does not pass through the galvanometer assembly; wherein, the controller is electrically connected with the third driving member, and is used to control the third driving member to adjust the deflection angle of the third mirror so that the reflected laser light is located in the second light path when the galvanometer assembly is in the acceleration section or the deceleration section, and is used to control the third driving member to adjust the deflection angle of the third mirror so that the reflected laser light is located in the first light path when the galvanometer assembly is in the constant speed section.

[0012] In an embodiment of the present application, the light path lengthening assembly comprises two sets of mutually parallel arranged mirror groups, the reflecting surfaces of the two sets of mirror groups are oppositely arranged, so that the laser can be reflected multiple times between the two sets of mirror groups.

[0013] In an embodiment of the present application, a scattering mirror is further included, the scattering mirror is located in the second light path and is used for receiving the laser reflected by the first mirror and scattering the laser.

[0014] In an embodiment of the present application, the light path switching assembly comprises an acousto-optic crystal and a fourth driving member, the fourth driving member is arranged on one side of the acousto-optic crystal and is used for generating mechanical disturbance to the acousto-optic crystal when working, so that the laser generates Bragg diffraction after passing through the acousto-optic crystal, thereby switching part of the laser from the first light path to the second light path; wherein the controller is electrically connected with the fourth driving member and is used for controlling the fourth driving member to work when the galvanometer assembly scans in the acceleration section or the deceleration section, and is used for controlling the fourth driving member not to work when the galvanometer assembly scans in the uniform speed section.

[0015] To solve the above technical problems, a solution provided by the present application is:

[0016] A laser processing device for processing a target surface, comprising: a laser light source for emitting laser; a galvanometer assembly arranged adjacent to a light path switching assembly, for controlling the laser to form a scanning track on the target surface; wherein the scanning track comprises an acceleration section, a uniform speed section and a deceleration section; a focusing field lens arranged adjacent to the galvanometer assembly, for converging the laser to the target surface; wherein the focal length of the focusing field lens is adjustable; and a controller electrically connected with the galvanometer assembly and the focusing field lens, for controlling the relative position between the focal plane of the focusing field lens and the target according to the interval to which the scanning track belongs; wherein when the galvanometer assembly scans in the uniform speed section, the focal plane of the focusing field lens coincides with the plane in which the target is located; and when the galvanometer assembly scans in the acceleration section or the deceleration section, the focal plane of the focusing field lens does not coincide with the plane in which the target is located.

[0017] To solve the above technical problems, a solution provided by the present application is:

[0018] A laser processing device for processing a target surface, comprising: a laser light source for emitting laser; a galvanometer assembly arranged in a first light path, adjacent to a light path switching assembly, for controlling the laser to form a scanning track on the target surface located in the first light path; wherein the scanning track comprises an acceleration section, a uniform speed section and a deceleration section; and a controller electrically connected with the galvanometer assembly and the laser light source, for controlling the opening and closing of the laser light source according to the interval to which the scanning track belongs; wherein when the galvanometer assembly scans in the uniform speed section, the laser light source is opened; and when the galvanometer assembly scans in the acceleration section or the deceleration section, the laser light source is closed.

[0019] Compared with the prior art, the present application has the following beneficial effects:

[0020] Different from the prior art, in the present application, the controller in the laser processing device can control the light path switching component to switch the laser according to the interval where the current scanning track is located, so that the original complete scanning track removes the acceleration section and the uniform speed section from the target material surface or reduces the laser energy located in the acceleration section and the uniform speed section, and finally realizes the uniform ablation of the target material surface, thereby avoiding the edge overburning situation. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0022] Among them:

[0023] Figure 1 is a schematic diagram of the laser scanning mode track in the field to which the present application belongs;

[0024] Figure 2 is a schematic diagram of the structure of the laser processing device in the present application;

[0025] Figure 3 is a schematic diagram of the structure of the laser processing device in another state in Figure 2 ;

[0026] Figure 4 is a schematic diagram of the structure of the light path switching component in Figure 2 ;

[0027] Figure 5 is a schematic diagram of the structure of another embodiment of the laser processing device in the present application;

[0028] Figure 6 is a schematic diagram of the module electrical connection of the controller and other components in the present application;

[0029] Figure 7 is a schematic diagram of the focusing field lens being a liquid lens in adjusting the focal length in the present application;

[0030] Figure 8 is a schematic diagram of the structure that the focusing field lens in the present application can move relative to the target material;

[0031] Figure 9 is a schematic diagram of the structure of another embodiment of the laser processing device in the present application;

[0032] Figure 10 is a schematic diagram of the structure of the laser processing device in another state in Figure 9 ;

[0033] Figure 11 is Figure 9 a schematic diagram of the principle of the acousto-optic crystal in the application. DETAILED DESCRIPTION

[0034] In order to make the above objectives, characteristics and advantages of the present application more apparent, more comprehensible, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. It can be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only the parts related to the present application are shown in the drawings, but not all the structures. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0035] The terms "comprising" and "having" and any variations thereof in the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but can optionally further comprise steps or units not listed, or can optionally further comprise other steps or units inherent to these processes, methods, products or devices.

[0036] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of the present application. The appearance of the phrase in various places in the specification does not necessarily all refer to the same embodiment, nor is it necessarily mutually exclusive of other embodiments. It is explicitly and implicitly understood by those skilled in the art that embodiments described herein can be combined with other embodiments.

[0037] Please refer to Figure 1 , Figure 1 is a schematic diagram of a laser scanning trajectory in the field to which the present application belongs. When filling the target material surface, a linear scanning in a back-and-forth manner is generally adopted. That is, the scanning galvanometer reflects the laser to the target material surface, and as the scanning galvanometer rotates, the laser completes a row trajectory on the target material surface to form an ablation area; after completing the scanning of a row, the scanning galvanometer controls the laser beam to jump to the next row to continue the scanning, so as to realize the surface filling on the target material surface in a back-and-forth linear scanning. However, near the edge of the scanning trajectory, the laser beam needs to perform a reversing action under the driving of the scanning galvanometer, so that the laser beam stays at the edge for a relatively long time. In the case that the laser energy remains unchanged, the edge of the scanning trajectory will be ablated more severely.

[0038] Taking a pulsed laser as an example, the pulsed laser acts on the target material surface in the unit time. When the scanning galvanometer drives the pulsed laser beam to and fro, a series of circular spots 10 (the effective coverage area of the circular spot needs to be considered) will be formed on the target material surface. When the scanning trajectory edge is reached, the scanning galvanometer decelerates, so that the number of pulses in the unit time is too much, thereby causing the edge to be burned.

[0039] Based on this, in the present application, in the period of one swing of the scanning galvanometer, the basic steps of V1 start acceleration, V2 uniform speed scanning and V3 deceleration reversing will be sequentially passed through. Corresponding to the scanning trajectory of the laser, three intervals of acceleration section D1, uniform speed section D2 and deceleration section D3 are sequentially formed. That is, the speed change of the scanning galvanometer is directly corresponding to the interval section of the scanning trajectory.

[0040] As a to-and-fro scanning, the positions of the acceleration section D1 and the deceleration section D3 in the multi-section scanning trajectory can be interchanged. That is, taking Figure 1 for example, in the starting stage, the scanning galvanometer first experiences acceleration, uniform speed and deceleration from left to right, forming the first scanning line section, and the corresponding scanning trajectory from left to right is acceleration section D1, uniform speed section D2 and deceleration section D3 in turn; after completing the first scanning line section, the scanning galvanometer controls the laser to jump to the next row, and experiences acceleration, uniform speed and deceleration from right to left, forming the second scanning line section, and the corresponding scanning trajectory from right to left is acceleration section D1, uniform speed section D2 and deceleration section D3 in turn.

[0041] Please refer to Figure 2 , Figure 3 and Figure 6 , wherein, Figure 2 is a structural schematic diagram of the laser processing device in the present application, Figure 3 is a structural schematic diagram of the laser processing device in Figure 2 in another state, Figure 6 is a module electrical connection schematic diagram of the controller and other components in the present application. In order to solve the technical problem of overburning of the acceleration section D1 and the deceleration section D3 in the scanning trajectory, the laser processing device 100 in the present application can include a laser light source 110, an optical path switching assembly 120, a galvanometer assembly 130 and a controller. Wherein, the laser light source 110 is used to emit laser 111; the optical path switching assembly 120 is arranged adjacent to the laser light source 110, and is used to switch the laser 111 in the first optical path 11 and the second optical path 12; the galvanometer assembly 130 is arranged in the first optical path 11 and adjacent to the optical path switching assembly 120, and is used to control the scanning action of the laser 111 on the target material surface, thereby forming a scanning trajectory on the target material surface. As described above, the scanning trajectory in the present application includes the acceleration section D1, the uniform speed section D2 and the deceleration section D3.

[0042] The controller is electrically connected with the galvanometer assembly 130 and the light path switching assembly 120, and is configured to control the light path switching assembly 120 to switch the laser between the first light path 11 and the second light path 12 according to the interval in which the laser currently scans. When the galvanometer assembly 130 controls the laser 111 to scan in the uniform speed section D2, the laser 111 is located in the first light path 11; when the galvanometer assembly 130 controls the laser 111 to scan in the acceleration section D1 or the deceleration section D3, the laser 111 is located in the second light path 12.

[0043] The first light path 11 is different from the second light path 12. The first light path 11 is a light path through which the laser 111 passes during normal processing, and the target material is located in the first light path 11; the second light path 12 is a light path that does not pass through the target material.

[0044] The laser source 110 referred to in the present application can be a gas laser, a solid-state laser, a semiconductor laser, etc. according to the gain medium; and the emitted laser can be continuous laser or pulsed laser. It can be understood that those skilled in the art can make adaptive adjustments according to actual conditions, select a suitable laser source 110, and adjust related parameters such as wavelength and repetition frequency of the laser source 110, which will not be described here.

[0045] In the present application, the controller in the laser processing device 100 can control the light path switching assembly 120 to switch the laser 111 according to the interval in which the current scanning trajectory is located, so that the acceleration section D1 and the deceleration section D3 are removed from the surface of the target material, and only the uniform speed section D2 is retained on the surface of the target material, finally achieving uniform ablation of the surface of the target material, thereby avoiding the situation of over-burning of the edge.

[0046] The light path switching assembly 120 can include a rotating platform 121, a plurality of first mirrors 123, and a first driving member 122. The plurality of first mirrors 123 are uniformly distributed on the edge of the rotating platform 121 with respect to the rotation axis of the rotating platform 121; the output shaft of the first driving member 122 is connected with the rotation axis of the rotating platform 121 to drive the rotating platform 121 to rotate, thereby driving the first mirrors 123 to enter and exit the light path switching station 13 in sequence. When the first mirror 123 is located in the light path switching station 13, the laser 111 emitted from the laser source 110 is reflected by the first mirror 123 into the second light path 12; when the first mirror 123 is not located in the light path switching station 13, the laser 111 emitted from the laser source 110 can be transmitted in the first light path 11 through the gap between the two first mirrors 123, and finally irradiated to the surface of the target material through the galvanometer assembly 130.

[0047] The plane where the rotating platform 121 is located and the incidence of the laser light source 110 are arranged at a non-90° angle to avoid the first mirror 123 reflecting the laser into the laser light source 110 at the light path switching station 13, which may damage the laser light source 110. Of course, the above-mentioned defect can also be avoided by arranging the first mirror 123 at an angle with the plane where the rotating platform 121 is located.

[0048] The galvanometer assembly 130 can include a second mirror 131 and a second driving member 132 connected with the second mirror 131 for driving the second mirror 131 to move back and forth to reflect the laser 111, so that the laser 111 forms an "arch" type scanning track on the target surface. In combination with Figure 1 , when the scanning track is located in the acceleration section D1, the corresponding second driving member 132 performs an acceleration rotating action; when the scanning track is located in the constant speed section D2, the corresponding second driving member 132 performs a constant speed rotating action; and when the scanning track is located in the deceleration section D3, the corresponding second driving member 132 performs a deceleration rotating action.

[0049] The controller can determine the interval to which the current scanning track belongs by detecting the acceleration of the driving shaft of the second driving member 132. An acceleration sensor can be arranged on the driving shaft of the second driving member 132. When the acceleration sensor detects that the acceleration of the driving shaft is positive, the corresponding second driving member 132 performs an acceleration rotating action; when the acceleration sensor detects that the acceleration of the driving shaft is 0, the corresponding second driving member 132 performs a constant speed rotating action; and when the acceleration sensor detects that the acceleration of the driving shaft is negative, the corresponding second driving member 132 performs a deceleration rotating action.

[0050] The controller obtains the rotating state of the second driving member 132 through the acceleration sensor, so as to know the interval to which the scanning track belongs in real time. When the acceleration of the second driving member 132 is positive or negative (i.e., the second driving member 132 performs an acceleration or deceleration action), it indicates that the corresponding scanning track has reached the edge area (the acceleration section D1 or the deceleration section D3), and the controller controls the first driving member 122 to drive the first mirror 123 into the light path switching station 13, so that the laser is reflected into the second light path 12; when the acceleration of the second driving member 132 is 0 (i.e., the second driving member 132 performs a motion rotating action), it indicates that the corresponding scanning track enters the constant speed section D2, and the controller controls the first driving member 122 to drive the first mirror 123 to move out of the light path switching station 13, so that the laser enters the first light path 11 again.

[0051] The rotating actions of the first driving member 122 and the second driving member 132 can be performed simultaneously. Please refer to Figures 2-3 and Figure 4 , Figure 4 is Figure 2Figure 2 is a structural schematic diagram of the optical path switching assembly 120 in Figure 1. In Figure 2, the number of the first mirrors 123 can be 8, which are evenly distributed along the rotation center of the rotating platform 121 and are driven by the rotating platform 121 to pass through the optical path switching station 13. In the process of synchronous rotation of the first driving member 122 and the second driving member 132, the time t0 required for the adjacent two first mirrors 123 to enter and exit the optical path switching station 13 is the same as the time t1 required for the second driving member 132 to drive the second mirror 131 to complete a scanning track.

[0052] That is, the gap region corresponding to the adjacent two first mirrors 123 is just corresponding to the uniform speed section D2 of the scanning track; and the reflection region formed by the width of each first scanning mirror 123 is just corresponding to the acceleration section D1 or the deceleration section D3 of the scanning track. The switching of the scanning track to the next row is switched by another mirror (Y-axis offset); the second mirror 131 is driven by the second driving member 132 to continuously reciprocate (X-axis offset) during the scanning process, so that the second driving member 132 has no time interval during the scanning process; and the plurality of first mirrors 123 are driven by the first driving member 122 to pass through the optical path switching station 13 in sequence, so that the first driving member 122 and the second driving member 132 have no time interval. Therefore, after the first driving member 122 and the second driving member 132 are set to rotate synchronously, the working efficiency of the laser processing device 100 in the present application can be greatly improved.

[0053] The implementation mode of the synchronous rotation of the first driving member 122 and the second driving member 132 is described below.

[0054] In the present application, the first driving member 122 is a servo motor. The servo motor is an incremental positioning motor, which is controlled to rotate to the required angle position by sending pulses. The second driving member 132 is a galvanometer motor, which is an absolute positioning motor, and is controlled to deflect to the specified position by sending instructions.

[0055] It is set that the number of the first mirrors 123 is M, the number of pulses required for the servo motor to rotate one circumference is N all , the interval time of a single pulse trigger is T, and the number of pulses of the adjacent two first mirrors 123 entering and exiting the optical path switching station 13 in sequence is Therefore,

[0056] It is set that the maximum scanning amplitude (i.e. one row of scanning track in the present application) of the galvanometer motor is L max , the maximum scanning speed is V max , the amplitude modulation parameter is K1, and the speed modulation parameter is K2. Therefore,

[0057] Let K1, K2 is in the range of 1% ~ 100%, L max , V max , N all , M is the servo motor and galvanometer motor itself hardware parameters.

[0058] Therefore, after K1, K2 is selected, the single pulse trigger time interval T of the servo motor can be determined.

[0059] For example, the device uses XX brand 500W pulse laser, the maximum scanning speed of the galvanometer motor is V max = 10m / s, the maximum scanning range is L max = 100mm. The servo motor selects XX brand XX series 100W servo motor, the servo motor needs to rotate a circle of pulse number N all = 50 pulses, the number of first mirror 123 units in the optical path switching assembly 120 M = 8.

[0060] Then the corresponding formula can be obtained,

[0061]

[0062] Therefore,

[0063] In order to obtain higher laser cleaning efficiency in actual application of laser cleaning, the scanning speed of the galvanometer motor is full speed as much as possible, that is, K2 = 1, then T = K1 * 1600us.

[0064] Therefore, the scanning amplitude of the galvanometer motor and the pulse control width T of the servo motor are linearly related. When K1 is 100%, the pulse width of the servo motor is 1600us, the servo motor rotates a circle and outputs 50 pulses, and the speed is 12.5r / s, which corresponds to 750r / min; When K1 is 50%, the speed needs to be increased to 1500r / min. Through the above method, the first driving member and the second driving member can be set to rotate synchronously, thereby improving the operation efficiency of the laser processing device 100.

[0065] The laser processing device 100 can also include a focusing field lens 140 for focusing the laser 111 deflected by the galvanometer assembly 130 to the target surface. The fourth mirror 160 can also be provided in the second light path 12, and the number and position of the fourth mirror 160 can be adjusted according to the actual situation, so that the laser 111 reflected by the first mirror 123 can enter the diffuser 150.

[0066] The laser processing device 100 in the present application is provided with the light path switching assembly 120, and according to the acceleration, uniform speed and deceleration actions of the galvanometer assembly 130, the light path switching assembly 120 is synchronously controlled to enter and exit the light path switching station 13, so that only the uniform speed section D2 is reserved in the final scanning track on the target material surface, not only the defect of edge overburning in the laser processing process is reduced, but also the laser processing device 100 in the present application can be adapted to the use of high-speed scanning.

[0067] The light path switching assembly 120 can also be another implementation mode in addition to the above-mentioned rotary disc type. Please refer to Figure 5 and Figure 6 , Figure 5 is a structural schematic diagram of another embodiment of the laser processing device 200 in the present application. The light path switching assembly 220 includes a third mirror 221, a third driving member 222 and an optical path lengthening assembly 223; the third driving member 222 is connected with the third mirror 221 and used for driving the third mirror 221 to deflect, so as to alternately reflect the laser 211 into the first light path 11 and the second light path 12; the optical path lengthening assembly 223 is arranged adjacent to the third mirror 221 and used for increasing the offset amount of the first light path 11 and the second light path 12, so that the second light path 12 does not pass through the galvanometer assembly 230.

[0068] Specifically, the incident angle of the laser light source 210 is constant, the third mirror 221 adjusts the reflection angle of the laser 211 through the third driving member 222, in order to meet the use of high-speed scanning, the deflection angle of the third mirror 221 cannot be too large, otherwise a long time needs to be consumed. Therefore, it is necessary to separate the first light path 11 and the second light path 12 under the premise of small deflection angle. The optical path lengthening assembly 223 is used for reflecting the laser 211 for multiple times, so as to amplify the initial offset amount of the first light path 11 and the second light path 12, so that the laser 211 finally emitted from the optical path lengthening assembly 223 passes through the galvanometer assembly 230 in the first light path 11 and does not pass through the galvanometer assembly 230 in the second light path 12.

[0069] The optical path lengthening assembly 223 can include two groups of reflection mirror groups arranged side by side, and the reflection surfaces of the two groups of reflection mirrors are oppositely arranged, so that the laser 211 can be reflected multiple times in the optical path lengthening assembly 223.

[0070] Correspondingly, the controller is electrically connected with the third driving member 222 and the second driving member 232 respectively, for controlling the deflection angle of the third mirror 221 driven by the third driving member 222 according to the rotation state of the second driving member 232. When the galvanometer assembly 230 is scanning in the uniform speed section D2, the controller is configured to control the third driving member 222 to drive the third mirror 221 to be located in the first light path 11; when the galvanometer assembly 230 is scanning in the acceleration section D1 or the deceleration section D3, the controller is configured to control the third driving member 222 to drive the third mirror 221 to be located in the second light path 12.

[0071] If the laser 211 is only deflected to the second light path 12, other components of the laser processing device 200 can be damaged. Therefore, a scattering mirror 250 can also be arranged in the second light path 12, for scattering the laser 211 located in the second light path 12, so as to reduce or lower the energy of the laser 211, thereby achieving the effect of protecting other components. The focusing field lens 240 can converge the laser 211 to the target surface in the first light path 11; the fourth mirror 260 is configured to adjust the reflection angle of the laser 211, so that it can irradiate towards the scattering mirror 250.

[0072] In order to solve the technical problem of overburning at the edge of the scanning track, in addition to deflecting the laser 211 located at the edge to another independent light path, based on the similar inventive concept, it can also be achieved by reducing the energy of the laser 211 at the edge of the scanning track. Please refer to Figure 6 and Figure 7 and Figure 8 One example scheme is that the focal length of the focusing field lens 240 is adjustable. The controller is electrically connected with the focusing field lens 240 and the galvanometer assembly 230 respectively, for controlling the distance between the focal plane of the focusing field lens 240 and the target according to the interval of the scanning track formed by the galvanometer assembly 230 on the target surface.

[0073] The focusing field lens 240 is a liquid lens, such as a liquid crystal lens. Under the application of different electric field strengths, the curvature of the liquid lens changes, thereby adjusting its focal length. Figure 7 The way of adjusting the focal length of the liquid lens is shown in the figure. In the normal state, the focal length of the focusing field lens is f1, the focal length after applying a positive electric field is f2, and the focal length after applying a negative electric field is f3. Therefore, f3>f1>f2. Therefore, when the focal length of the focusing field lens 240 changes, the originally concentrated laser energy will be divergent, thereby reducing the effect of high energy density superposition at the edge of the scanning track, and thus the overburning phenomenon at the edge of the scanning track can be reduced.

[0074] The distance between the focusing field lens 240 and the target is adjustable. Figure 8The focusing effect of the focusing field lens 240 at different distances from the target material is shown. In a normal state, the distance between the focusing field lens 240 and the target material is d1, and d1 is equal to the focal length of the focusing field lens 240, so that the focal plane of the focusing field lens 240 coincides with the surface of the target material; when the focusing field lens 240 is close to or away from the target material, the originally converging laser will be divergent. Therefore, d3>d1>d2. Therefore, when the distance between the focusing field lens 240 and the target material changes, the degree of laser spot convergence will be reduced, thereby reducing the overburning phenomenon of the edge of the scanning track.

[0075] Of course, as for the timing of applying the electric field and when to drive the focusing field lens 240 to approach or move away from the target material, reference can be made to the above-mentioned embodiments, and no further description is made herein; as for how to set the mechanism for driving the focusing field lens to approach or move away from the target material, those skilled in the art can design according to the actual situation, and no further description is made herein.

[0076] In order to solve the technical problem of overburning at the edge of the scanning track, in addition to deflecting the laser 211 located at the edge into another independent light path, based on similar inventive concepts, the energy of the laser located in the first light path 11 can also be reduced by transferring the laser part originally located in the first light path 11 to the second light path 12. Combined with Figure 6 And referring to Figures 9-10 , Figure 9 Another implementation of the laser device 300 of the present application is shown, Figure 10 is Figure 9 a schematic view of the laser processing device 300 in another state in

[0077] Referring to Figure 11 , Figure 11 is Figure 9 the principle diagram of the acousto-optic effect of the light path switching assembly 320 in

[0078] When the laser 311 is incident on the surface of the acousto-optic crystal at an angle α (Bragg angle), Bragg diffraction occurs, forming two laser beams with the same energy but different propagation directions. Combined with Figure 10The two beams of laser light respectively enter the first light path 11 and the second light path 12, but the energy that has entered the first light path 11 has been attenuated by 1 / 2 compared to the energy of the incident laser light 311. The laser light located in the second light path 12 is finally diverged by the diverging mirror 350 so as to avoid damaging other components of the laser device 300.

[0079] The fourth driving member 321 can include a piezoelectric ceramic. When alternating current is applied to the piezoelectric ceramic, periodic deformation occurs on the surface of the piezoelectric ceramic, thereby serving as an excitation source of high-frequency vibration.

[0080] The controller is electrically connected with the fourth driving member 321 and is configured to control the opening and closing of the fourth driving member 321 according to the interval to which the scanning track currently formed on the target material surface by the galvanometer assembly 330 belongs. When the scanning track is located at the acceleration end D1 or the deceleration end D3, the fourth driving member 321 is controlled to be opened, so that the acousto-optic crystal 322 generates an acousto-optic effect, thereby splitting the laser light 311 into two parallel beams of laser light and simultaneously transmitting the two beams of laser light in the first light path 11 and the second light path 12. Figure 10 When the scanning track is located at the constant-speed end D2, the fourth driving member 321 is controlled to be closed, so that the acousto-optic crystal 322 serves as a common transmission medium for laser transmission and does not adjust the transmission direction and energy of the laser light 311. The laser light 311 is finally transmitted to the target material surface through the first light path 11 and the galvanometer assembly 330 and the focusing field lens 340. Figure 9

[0081] As for the implementation manner of obtaining the interval to which the scanning track currently formed on the target material surface by the galvanometer assembly 330 belongs, the foregoing embodiment can be referred to for judgment by detecting the acceleration of the second driving member 332. Of course, in other embodiments, a high-speed camera (not shown) can be additionally provided, and the controller is electrically connected with the high-speed camera to continuously capture the shape of the scanning track on the target material surface, and a virtual boundary is set by calibration. When the high-speed camera records that the scanning track reaches or exceeds the virtual boundary, the first driving member (see Figure 2 or Figure 5 ) adjusts the distribution characteristics of the laser light in the first light path 11 and the second light path 12. Those skilled in the art can make adjustments according to actual conditions.

[0082] In order to solve the technical problem of overburning of the edge of the scanning track, in addition to deflecting the laser light 211 located at the edge to another independent light path, based on the similar inventive concept, the laser light of the laser light source 210 can also be directly turned off. In combination with Figure 5 and Figure 6 ​The controller can be electrically connected with the laser light source 210 and the galvanometer assembly 230 respectively, for controlling the opening and closing of the laser light source 210 according to the interval where the scanning trajectory of the galvanometer assembly 230 on the target surface is located. When the galvanometer assembly 230 is in a uniform rotation state (i.e., the corresponding scanning trajectory is in the uniform speed section D2), the controller controls the laser light source 210 to be in an open state; when the galvanometer assembly 230 is in an acceleration or deceleration state (i.e., the corresponding scanning trajectory is in the acceleration section D1 or the deceleration section D3), the controller controls the laser light source 210 to be in a closed state.

[0083] In this way, the laser 211 scanned to the edge of the scanning trajectory can be directly turned off, so that only the scanning trajectory of the uniform speed section D2 is reserved on the target surface, thereby avoiding the over-burning of the edge of the scanning trajectory.

[0084] Further, the controller in the present application can include a general purpose processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a single-chip computer, an ARM (Acorn RISC Machine), or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination of these components. In addition, the controller can also be any conventional processor, controller, microcontroller, or state machine. The controller can also be implemented as a combination of computing devices, such as a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors in conjunction with a DSP and / or any other such configuration.

[0085] The above description is only an embodiment of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process transformation using the content of the specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A laser processing apparatus for treating the surface of a target material, characterized in that, include: A laser source, used to emit laser light; An optical path switching component is disposed adjacent to the laser source and is used to switch the laser between a first optical path and a second optical path. A galvanometer assembly, disposed in the first optical path and adjacent to the optical path switching assembly, is used to control the laser to form a scanning trajectory on the target surface located in the first optical path; wherein the scanning trajectory includes an acceleration section, a constant speed section, and a deceleration section; and The controller, electrically connected to the galvanometer assembly and the optical path switching assembly, is used to control the optical path switching assembly to switch the laser between the first optical path and the second optical path according to the interval to which the scanning trajectory belongs; When the galvanometer assembly scans in the uniform speed section, the laser is located in the first optical path; when the galvanometer assembly scans in the acceleration section or the deceleration section, at least a portion of the laser is located in the second optical path, thereby reducing or removing the energy of the laser on the target surface.

2. The apparatus according to claim 1, characterized in that, The optical path switching component includes: Rotating platform; A plurality of first reflecting mirrors are disposed on the rotating platform at intervals around the center of rotation of the rotating platform; and The first driving component is connected to the rotating platform and is used to drive the rotating platform to rotate, thereby driving multiple first reflectors to pass through the optical path switching station in sequence. When the first reflector is located at the optical path switching station, the first reflector reflects the laser to the second optical path; when the first reflector is not located at the optical path switching station, the laser is transmitted to the galvanometer assembly through the first optical path. The controller is electrically connected to the first drive unit and is used to control the first reflector to be located at the optical path switching station when the galvanometer assembly is scanning in the acceleration or deceleration phase; and to control the first reflector not to be located at the optical path switching station when the galvanometer assembly is scanning in the uniform speed phase.

3. The apparatus according to claim 2, characterized in that, The galvanometer assembly includes a second reflector and a second driving member. The second driving member is connected to the second reflector and is used to drive the second reflector to reciprocate so as to form the scanning trajectory on the target surface. Wherein, when the second driving member rotates at an accelerated speed, it forms the acceleration segment of the scanning trajectory on the surface of the target material; when the second driving member rotates at a constant speed, it forms the constant speed segment of the scanning trajectory on the surface of the target material; when the second driving member rotates at a deceleration speed, it forms the deceleration segment of the scanning trajectory on the surface of the target material. The controller is electrically connected to the second driving component and is used to control the first driving component to drive the first reflector into the optical path switching station when the rotation speed of the second driving component increases or decreases; and to control the first driving component to drive the first reflector out of the optical path switching station when the rotation speed of the second driving component remains constant.

4. The apparatus according to claim 3, characterized in that, The controller is used to control the first driving component and the second driving component to rotate synchronously. The time required for the first driving component to drive two adjacent first reflectors to sequentially enter and exit the optical path switching station. The time required for the second reflector to complete one scanning trajectory on the target surface by the second driving element. same.

5. The apparatus according to claim 4, characterized in that, The first driving component is a servo motor, the number of the first reflectors is M, and the number of pulses required for the servo motor to rotate one circumference is... The single pulse trigger interval is T, and the number of pulses required for two adjacent first reflectors to sequentially enter and exit the optical path switching station is [number missing]. , ; The second driving component is a galvanometer motor, and the maximum single-scan amplitude of the galvanometer motor is [value missing]. Maximum scanning speed is The amplitude modulation parameters are The speed regulation parameters are respectively , ; in, , , The value range is 1% to 100%.

6. The apparatus according to claim 1, characterized in that, The optical path switching component includes: A third reflecting mirror is positioned adjacent to the laser source. A third driving element, connected to the third reflecting mirror, is used to drive the third reflecting mirror to deflect, thereby alternately reflecting the laser light into the first optical path and the second optical path; and An optical path extension component is disposed adjacent to the third reflector and is used to increase the offset between the first optical path and the second optical path, so that the second optical path does not pass through the galvanometer component; The controller is electrically connected to the third driving component and is used to control the third driving component to adjust the deflection angle of the third reflector so that the reflected laser is located in the second optical path when the galvanometer assembly is scanning in the acceleration or deceleration phase; and to control the third driving component to adjust the deflection angle of the third reflector so that the reflected laser is located in the first optical path when the galvanometer assembly is scanning in the uniform speed phase.

7. The apparatus according to claim 6, characterized in that, The optical path extension component includes two sets of mirrors arranged in parallel to each other, with the reflective surfaces of the two mirrors facing each other, so that the laser can be reflected multiple times between the two mirrors.

8. The apparatus according to claim 1, characterized in that, The optical path switching component includes an acousto-optic crystal and a fourth driving element. The fourth driving element is disposed on one side of the acousto-optic crystal and is used to generate mechanical disturbance to the acousto-optic crystal during operation, so that the laser will generate Bragg diffraction after passing through the acousto-optic crystal, thereby switching part of the laser from the first optical path to the second optical path. The controller is electrically connected to the fourth driving component and is used to control the fourth driving component to work when the galvanometer assembly is scanning in the acceleration or deceleration phase; and to control the fourth driving component to not work when the galvanometer assembly is scanning in the constant speed phase.

9. A laser processing apparatus for treating the surface of a target material, characterized in that, include: A laser source, used to emit laser light; A galvanometer assembly, disposed adjacent to the laser source, is used to control the laser to form a scanning trajectory on the target surface; wherein the scanning trajectory includes an acceleration section, a constant speed section, and a deceleration section; A focusing field lens, disposed adjacent to the galvanometer assembly, is used to focus the laser onto the target surface; wherein the focal length of the focusing field lens is adjustable; and A controller, electrically connected to the galvanometer assembly and the focusing field lens, is used to control the relative position of the focal plane of the focusing field lens and the surface of the target material according to the interval to which the scanning trajectory belongs; Specifically, when the galvanometer assembly scans in the uniform speed section, the focal plane of the focusing field lens coincides with the plane on the target surface; when the galvanometer assembly scans in the acceleration section or the deceleration section, the focal plane of the focusing field lens does not coincide with the plane on the target surface, thereby reducing the energy of the laser on the target surface.

10. A laser processing apparatus for treating the surface of a target material, characterized in that, include: A laser source, used to emit laser light; A galvanometer assembly, disposed adjacent to the laser source, is used to control the laser to form a scanning trajectory on the target surface; wherein the scanning trajectory includes an acceleration segment, a constant speed segment, and a deceleration segment; and The controller, electrically connected to the galvanometer assembly and the laser source, is used to control the turning on and off of the laser source according to the interval to which the scanning trajectory belongs; Specifically, when the galvanometer assembly scans in the uniform speed section, the laser source is turned on; when the galvanometer assembly scans in the acceleration section or the deceleration section, the laser source is turned off, thereby removing the energy of the laser on the target surface.

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