Chip packaging device, method and packaged chip

Abstract

The present application discloses a chip packaging device, method and packaged chip, wherein the chip packaging device includes a plurality of conductive sheets, a concave platform transfer component and a heating component, wherein the lower surface of the concave platform of the concave platform transfer component is concavely formed with at least one groove adapted to the chip to adhere or clamp a plurality of conductive sheets, and one end of each conductive sheet is arranged on the opening edge of a groove and is located above a pad, and the other end of each conductive sheet is arranged on the opening of the corresponding groove and is located above a soldering foot, so that when the concave platform is pressed down, one end of the conductive sheet is pressed tightly onto a soldering pad, and the other end is pressed tightly onto a soldering foot corresponding to the soldering pad; the heating component is used to heat the soldering material on each soldering pad and the soldering material on each soldering foot, so that one end of the conductive sheet is soldered and fixed to the corresponding soldering pad, and the other end is soldered and fixed to the corresponding soldering foot. The technical solution of the present application can quickly realize the electrical interconnection between the chip and the substrate through a plurality of conductive sheets.

Description

Technical Field

[0001] The present application relates to the field of chip packaging technology, and in particular to a chip packaging device, method and packaged chip. Background Art

[0002] Since the advent of packaging technology, its application range has become increasingly wide due to its high reliability, convenience, and ease of operation. As the requirements for chip heat dissipation become higher and higher, the thinner the package, the better. Specifically, packaging substrates are gradually developing in the direction of ultra-thin and small-scale density. For substrate packaging technology, how to improve the packaging capability of ultra-thin substrates has become a very important issue.

[0003] In the semiconductor packaging industry, wire bonding is a process that uses thin metal wires and utilizes heat, pressure, and ultrasonic energy to tightly weld metal wires to substrate pads to achieve electrical interconnection between the chip and the substrate. Under ideal control conditions, electron sharing or atomic diffusion will occur between the wires and the substrate, thereby achieving atomic-level bonding between the two metals. At present, traditional chip packaging uses a positive method to bond to the pads in the packaging substrate through wire bonding. This wire bonding method requires wire bonding equipment to bond from the chip wires to the substrate pads one by one, so the efficiency is low, and warping and cracking are prone to occur during the bonding process. Summary of the invention

[0004] The embodiments of the present application provide a chip packaging device, method and packaged chip to improve the existing chip packaging that uses wire bonding to achieve electrical interconnection between the chip and the substrate, which has technical problems such as low efficiency and easy warping and cracking during the bonding process.

[0005] In a first aspect, the present application provides a chip packaging device for bonding welding materials on a plurality of pads on a substrate to welding materials on a plurality of solder pins on a chip in a one-to-one correspondence manner, wherein the chip packaging device comprises a plurality of conductive sheets, a concave stage transfer component and a heating component, wherein:

[0006] The concave platform transfer assembly comprises a concave platform, the lower surface of the concave platform is concavely formed with at least one groove adapted to the chip, the lower surface of the concave platform adheres or clamps the plurality of conductive sheets, and one end of each conductive sheet is arranged on the opening edge of one of the concave grooves and is located above one of the pads, and the other end of each conductive sheet is arranged on the opening of the corresponding concave groove and is located above one of the soldering feet, so that when the concave platform is pressed down, one end of the conductive sheet is pressed tightly onto one of the soldering pads, and the other end is pressed tightly onto the soldering foot corresponding to the soldering pad;

[0007] The heating component is used to heat the welding material on each of the welding pads and the welding material on each of the welding feet, so as to weld and fix one end of the conductive sheet to the corresponding welding pad and the other end to the corresponding welding foot.

[0008] Optionally, in some embodiments, the conductive sheet is a conductive foil with a sheet structure.

[0009] Optionally, in some embodiments, the plurality of conductive sheets are connected to the conductive surface material via a weakened connection structure, and the plurality of conductive sheets and the conductive surface material are in the same plane.

[0010] Optionally, in some embodiments, the recessed platform is an adhesive recessed platform, so that the plurality of conductive sheets can be adhered to the lower surface of the adhesive recessed platform, or the conductive surface material connected with the plurality of conductive sheets can be adhered to the lower surface of the adhesive recessed platform.

[0011] Optionally, in some embodiments, a fixed column support plate is fixedly provided on the upper surface of the adhesive recess, and a plurality of fixed columns are protruding from the lower surface of the fixed column support plate and are arranged to pass through the adhesive recess, and a plurality of through holes corresponding to the plurality of fixed columns are opened along the edge of the conductive surface material, so that each of the through holes can be clamped on the corresponding fixed column to further clamp and fix the conductive surface material adhered to the lower surface of the adhesive recess.

[0012] Optionally, in some embodiments, the recessed platform is a high temperature resistant recessed platform, and a plurality of fixing columns are protruding along the edge of the lower surface of the high temperature resistant recessed platform, and a plurality of through holes corresponding to the plurality of fixing columns are opened along the edge of the conductive surface material, so that the conductive surface material can be clamped on the lower surface of the high temperature resistant recessed platform by each of the through holes being clamped on the corresponding fixing column.

[0013] Optionally, in some embodiments, the bottom wall of the groove is a vacuum adsorption plane with adjustable height, or the bottom wall of the groove is an electromagnetic adsorption plane with adjustable height, or the bottom wall of the groove is provided with an elastic adhesive coating.

[0014] Optionally, in some embodiments, a side wall of the groove is provided with an inclined surface, and the inclined surface is open toward the chip.

[0015] In a second aspect, the present application provides a chip packaging method, which is applied to the above-mentioned chip packaging device, comprising:

[0016] A substrate and at least one chip are provided, wherein the chip is fixed on the substrate, and a plurality of pads arranged around the chip on the substrate are arranged in one-to-one correspondence with a plurality of solder pins on the chip, and soldering material is correspondingly arranged on each of the pads and each of the solder pins;

[0017] A plurality of conductive sheets are adhered or clamped on the lower surface of the concave platform of the concave platform transfer component, and one end of each conductive sheet is arranged on the opening edge of one of the concave grooves and is located above one of the pads, and the other end of each conductive sheet is arranged on the opening of the corresponding concave groove and is located above one of the soldering feet;

[0018] Pressing down the concave platform to press one end of the conductive sheet onto one of the pads and the other end onto the soldering foot corresponding to the pad;

[0019] The welding material on each of the welding pads and the welding material on each of the welding feet are heated by the heating component, so that one end of the conductive sheet is welded and fixed on the corresponding welding pad, and the other end is welded and fixed on the corresponding welding foot.

[0020] In a third aspect, the present application provides a packaged chip, comprising a substrate and a chip fixed on the substrate, the upper surface of the chip being provided with a plurality of solder pins, the upper surface of the substrate being provided with a plurality of solder pads corresponding to the plurality of solder pins around the chip, each of the solder pins being electrically connected to the corresponding solder pad via a conductive sheet, and each of the conductive sheets being welded and fixed between the corresponding solder pad and the solder pin by the above-mentioned chip packaging device using the above-mentioned chip packaging method.

[0021] In the present application, the concave platform transfer component of the chip packaging device includes a concave platform, and the lower surface of the concave platform is concavely formed with at least one groove adapted to the chip, so that when the concave platform is pressed down, the matching groove on the lower surface can correspond to the upper surface of the substrate and the chip on the substrate. At the same time, a plurality of conductive sheets are adhered or clamped on the lower surface of the concave platform, and one end of each conductive sheet is arranged on the opening edge of a groove and is located above a soldering pad, and the other end of each conductive sheet is arranged on the opening of the corresponding groove and is located above a soldering foot, so that when the concave platform is pressed down, the conductive sheet below The surface presses one end of each conductive sheet onto a pad (located on the upper surface of the substrate), and the groove presses the other end of each conductive sheet onto the soldering foot (located on the upper surface of the chip) corresponding to the pad. Finally, the welding material on each pad and each soldering foot is heated by the heating component, so that one end of the conductive sheet can be welded and fixed to the corresponding pad, and the other end can be welded and fixed to the corresponding soldering foot. The whole process only requires one pressing and one heating treatment, and the electrical interconnection between the chip and the substrate can be quickly achieved through multiple conductive sheets. At the same time, the method of welding the conductive sheet to the substrate pad and the chip soldering foot to achieve the electrical interconnection between the chip and the substrate through the concave stage transfer device has a higher packaging efficiency than the existing wire bonding method, and will not cause warping, cracking, etc. that are easy to occur during the hardware bonding process. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The technical solution and beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0023] Figure 1 This is a schematic diagram of the first structure of the chip packaging device provided in the embodiment of the present application.

[0024] Figure 2 This is a second structural schematic diagram of the chip packaging device provided in an embodiment of the present application.

[0025] Figure 3 yes Figure 1 A schematic structural diagram of a conductive surface material of a chip packaging device is shown.

[0026] Figure 4 This is a third structural schematic diagram of the chip packaging device provided in an embodiment of the present application.

[0027] Figure 5 This is a fourth structural schematic diagram of the chip packaging device provided in an embodiment of the present application.

[0028] Figure 6 This is a fifth structural schematic diagram of the chip packaging device provided in the embodiment of the present application.

[0029] Figure 7 This is a sixth structural schematic diagram of the chip packaging device provided in an embodiment of the present application.

[0030] Figure 8 It is a flow chart of the chip packaging method provided in the embodiment of the present application.

[0031] Fig. 9 It is a schematic diagram of the structure of the packaged chip provided in an embodiment of the present application. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application are clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In the absence of conflict, the following embodiments and their technical features can be combined with each other.

[0033] In the semiconductor packaging industry, wire bonding is a process that uses thin metal wires and utilizes heat, pressure, and ultrasonic energy to tightly weld metal leads to substrate pads to achieve electrical interconnection between the chip and the substrate. Under ideal control conditions, electron sharing or atomic diffusion will occur between the leads and the substrate, thereby achieving atomic-level bonding between the two metals. Currently, traditional chip packaging uses a positive wire bonding method to bond to the pads in the packaging substrate. This wire bonding method requires wire bonding equipment to bond from the chip leads to the substrate pads one by one, so the efficiency is low, and warping and cracking are prone to occur during the bonding process.

[0034] Based on this, it is necessary to provide a new chip packaging solution to improve the existing chip packaging that uses wire bonding to achieve electrical interconnection between the chip and the substrate, which has technical problems such as low efficiency and easy warping and cracking during the bonding process.

[0035] In one embodiment, Figure 1 As shown, the present embodiment provides a chip packaging device 100, which is used to bond the welding materials on the multiple pads 210 of the substrate 200 with the welding materials on the multiple soldering feet 310 of the chip 300 in a one-to-one correspondence. The chip packaging device 100 may specifically include multiple conductive sheets 110, a recessed stage transfer component 120, and a heating component 130, wherein the recessed stage transfer component 120 may specifically include a recessed stage 121, and the lower surface of the recessed stage 121 is concavely formed with at least one recessed portion adapted to the chip 300. The groove 122 and the lower surface of the concave platform 121 are adhered or clamped with a plurality of conductive sheets 110, and one end of each conductive sheet 110 is arranged at the edge of the opening of a groove 122 and is located above a pad 210, and the other end of each conductive sheet 110 is arranged at the opening of the corresponding groove 122 and is located above a soldering foot 310, so that when the concave platform 121 is pressed down, one end of the conductive sheet 121 is pressed tightly onto a soldering pad 210, and the other end is pressed tightly onto a soldering foot 310 corresponding to the soldering pad 210. The heating component 130 can be specifically used to heat the soldering material on each soldering pad 210 and the soldering material on each soldering foot 310, so that one end of each conductive sheet 110 is welded and fixed to the corresponding soldering pad 210, and the other end is welded and fixed to the corresponding soldering foot 310.

[0036] It should be noted that the soldering material on the pad 210 and the soldering material on the soldering foot 310 can be applied to the corresponding pad 210 or the corresponding soldering foot 310 in advance manually or by a separately provided tinning assembly (not shown). The soldering material is generally tin, which can be heated and melted, and after cooling, one end of each conductive sheet 110 is welded and fixed to the corresponding pad 210, and the other end is welded and fixed to the corresponding soldering foot 310. The length of the conductive sheet 110 should be greater than the sum of the lengths of the pad 210 and the corresponding soldering foot 310, which is generally the sum of the lengths of the pad 210 and the corresponding soldering foot 310 plus the length between the pad 210 and the corresponding soldering foot 310 along the upper surface of the substrate 200, the side surface of the chip 300, and the upper surface of the chip 300. The opening size of the groove 122 is specifically slightly larger than the plane size of the chip 300, so that a setting interval for the conductive sheet 110 is reserved between the side wall of the groove 122 and the side surface of the chip 300. The lower surface of the concave platform 121 can be adhered or clamped with multiple conductive sheets 110. In this regard, the concave platform 121 can be implemented in a variety of forms, which can be seen in the subsequent examples. The heating component 130 can be a heating platform, or Figure 1 As shown, it is arranged above the recessed stage transfer component 120 to heat the welding material on each welding pad 210 and the welding material on each welding foot 310 through heat conduction of the recessed stage transfer component 120, or it is arranged below the substrate 200 to heat the welding material on each welding pad 210 and the welding material on each welding foot 310 through heat conduction of the substrate 200.

[0037] Thus, in the embodiment of the present application, the recessed platform transfer component 120 of the chip packaging device 100 includes a recessed platform 121, and the lower surface of the recessed platform 121 is formed with at least one groove 122 adapted to the chip 300, so that when the recessed platform 121 is pressed down, its lower surface cooperates with the groove 122 to correspond to the upper surface of the substrate 200 and the chip 300 on the substrate 200. At the same time, the lower surface of the recessed platform 121 can adhere or clamp a plurality of conductive sheets 110, and one end of each conductive sheet 110 is arranged on the opening edge of a groove 122 and is located above a solder pad 210, and the other end of each conductive sheet 110 is arranged on the opening of the corresponding groove 122 and is located above a solder foot 310, so as to be bonded to the recessed platform. When 121 is pressed down, its lower surface presses one end of each conductive sheet 110 onto a pad 210 (located on the upper surface of the substrate 200), and its groove 122 presses the other end of each conductive sheet 110 onto a soldering foot 310 (located on the upper surface of the chip 300) corresponding to the pad 210. Finally, by heating the soldering material on each pad 210 and the soldering material on each soldering foot 310 through its heating component 130, one end of the conductive sheet 110 can be welded and fixed to the corresponding pad 210, and the other end can be welded and fixed to the corresponding soldering foot 310. The whole process only requires one pressing down and one heating treatment, and the electrical interconnection between the chip 300 and the substrate 200 can be quickly realized through multiple conductive sheets 110. At the same time, the conductive sheet 110 is welded to the substrate pad and the chip foot through the recessed stage transfer device 120 to realize the electrical interconnection between the chip 300 and the substrate 200. Compared with the existing wire bonding method, its packaging efficiency is higher and there will be no warping, cracking and other problems that are prone to occur during the hardware bonding process.

[0038] In some examples, such as Figure 1 As shown, the conductive sheet 110 may be a conductive foil of a cut sheet structure, or a conductive film of a cut sheet structure. At this time, the concave platform 121 needs to adhere or clamp a plurality of conductive sheets 110, and the plurality of conductive sheets 110 are specifically arranged one by one with the plurality of pads 210 on the substrate 200, so as to achieve the above-mentioned adhesion, attachment or clamping of a conductive sheet 110 above each pad 210 and the corresponding solder foot 310. The embodiment of the present application may include a variety of packaging methods for the packaging of the chip 300. For different packaging methods, the shape of the conductive sheet 110 may be different, that is, the shape of the conductive sheet 110 may not be limited to the rectangle shown in the figure.

[0039] Since conventional conductive sheets 110 are generally thin, the above-mentioned adsorption of a single cut conductive sheet 110 is prone to insufficient adhesion or difficulty in clamping, resulting in some conductive sheets 110 falling off or shifting. Figure 3As shown, the plurality of conductive sheets 110 can be connected to the conductive surface material 140 through the weakened connection structure 10, and the plurality of conductive sheets 110 and the conductive surface material 140 are in the same plane. In this way, the recessed platform 121 of the recessed platform moving component 120 can adhere or clamp the entire conductive surface material 140 as a whole to achieve the above-mentioned adhesion or clamping of a conductive sheet 110 above each pad 210 and the corresponding solder foot 310, thereby improving the adsorption stability. Figure 3 The conductive surface material 140 shown can be subjected to several weakening treatments on the entire conductive foil or conductive film, such as punching a circle of fine through holes around the corresponding conductive sheet 110 on the entire conductive foil or conductive film through laser, stamping, etching and other processes, so as to form a corresponding weakened connection structure 10 around each conductive sheet 110, thereby realizing that each conductive sheet 110 is connected to the conductive surface material 140 through the weakened connection structure 10, and multiple conductive sheets 110 and the conductive surface material 140 are in the same plane. The provision of the weakened connection structure 10 can make the spacing surface on the conductive surface material 140 and each conductive sheet 110 be weakened and peeled off quickly, avoiding the situation where the conductive sheet 110 is taken away during peeling, or the conductive sheet 110 is pulled and broken.

[0040] In some examples, such as Figure 1 As shown, the above-mentioned concave platform assembly 120 may further include a power mechanism for driving the concave platform 121 to translate and elevate, so as to realize the translation and elevating motion of the concave platform 121. Generally speaking, in order to adapt to the chip 300, all side walls of the above-mentioned groove 122 are generally vertical surfaces, that is, all side walls of the above-mentioned groove 122 are perpendicular to the bottom wall of the corresponding groove 122, and in order to better adapt to more chips of different sizes, such as Figure 2 As shown, all side walls of the above-mentioned groove 122 are provided with inclined surfaces, and the inclined surfaces in the side walls are in an open shape facing the chip 300. Specifically, the top surface of the inner wall of the groove 122 is adapted to the upper surface of the chip 300, and the side walls of the groove 122 are in an inclined shape. Therefore, the larger the distance of the inclined surface of the side wall of the groove 122 is, the farther it is from one end of the side surface of the chip 300. Such a structural setting can also make the opening of the groove 122 pressed down along the edge, so that more chip sizes can be adapted.

[0041] In some examples, such as Figure 1 and Figure 2As shown, the concave platform 121 can be a sticky concave platform, so that a plurality of conductive sheets 110 arranged one-to-one with a plurality of pads 210 on the substrate 200 can be adhered to the lower surface of the concave platform 121 at the same time, or a conductive surface material 140 connected with a plurality of conductive sheets 110 can be adhered. Further, the sticky concave platform can be a polydimethylsiloxane concave platform, which is made of polydimethylsiloxane (PDMS) material, and its surface has strong viscosity and elasticity, so that the conductive surface material 140 can be adhered to the lower surface of the concave platform 121 or a plurality of conductive sheets 110 arranged one-to-one with a plurality of pads 210 on the substrate 200 can be adhered at the same time, and when pressed down, it elastically contacts the upper surface of the substrate 200 and the upper surface of the chip 300, so as to form a certain downward pressure protection for the substrate 200 and the chip 300. When the recess 121 is pressed down, one end of the conductive sheet 110 adhered along the edge of the recess 122 is pressed onto a pad 210 (located on the upper surface of the substrate 200). At the same time, the side wall of the recess 122 fits the side surface of the chip 300, driving the conductive sheet 110 to change its shape and attach to the side surface of the chip 300 or bend the middle of the conductive sheet 110 and the side surface of the chip 300 in the same horizontal plane. After the shape of the conductive sheet 110 changes, the conductive sheet 110 at the other end is pressed onto the solder foot 310 (located on the upper surface of the chip 300) corresponding to the pad 210. After the downward pressure is completed, the heating device 130 heats the liquefied soldering material. The viscosity of the recess 121 will also weaken when heated. After the solder paste is solidified, the substrate pad and the chip solder foot are connected through the conductive sheet 110.

[0042] Based on the above examples, it can be known that the conductive sheet 110 can be a conductive foil or a conductive film. When the conductive sheet 110 is a conductive foil, since the conductive foil is flexible, it cannot return to its original shape after being subjected to force. Therefore, after the middle part of the conductive sheet 110 is attached to the corresponding side surface of the chip 300 in the groove 122, even if the corresponding groove 122 is withdrawn, the middle part of the conductive sheet 110 can still remain attached to the corresponding side surface of the chip 300 or remain bent at the same level as the side surface of the chip 300. However, when the conductive sheet 110 is a conductive film, since the material of the conductive film is mainly composed of polymers and is not flexible, it will return to its original shape after the force disappears. Based on this, in order to ensure that after the middle part of the conductive sheet 110 is attached to the corresponding side surface of the chip 300 in the groove 122 or the middle part of the conductive sheet 110 is bent at the same level as the side surface of the chip 300, the middle part of the conductive sheet 110 can still remain attached to the corresponding side surface of the chip 300 or remain bent at the same level as the side surface of the chip 300 after the corresponding groove 122 is withdrawn. like Figure 1As shown, the chip packaging device 100 may further include an adhesive layer 150 arranged on the side surface of the chip 300. The adhesive layer 150 is mainly arranged on the side surface between the pad 210 and the corresponding solder foot 310, so that when the side wall of the groove 122 presses down the corresponding conductive sheet 110, the middle part of the conductive sheet 110 is further bonded to the corresponding side surface of the chip 300, ensuring that when the conductive sheet 110 is a conductive film, the middle part thereof will not return to its original state due to the disappearance of the force, and when the conductive sheet 110 is a conductive foil, the fit between the middle part thereof and the side surface of the chip 300 is further improved.

[0043] In some examples, such as Figure 3 and Figure 4 As shown, the concave platform 121 can also be a high temperature resistant concave platform. The high temperature resistant concave platform can be made of high temperature resistant materials, such as silicon, glass, ceramics, metal, high temperature resistant polymers, etc. A plurality of fixing columns 123 are convexly arranged along the edge of the lower surface of the high temperature resistant concave platform, and a plurality of through holes 11 corresponding to the plurality of fixing columns 123 are opened along the edge of the conductive surface material 140, so that each through hole 11 is correspondingly clamped on the corresponding fixing column 123 to clamp the conductive surface material 140 on the lower surface of the high temperature resistant concave platform. Specifically, the fixing column 123 can be made of the same or different material as the high temperature resistant concave platform. The lower surface of the conductive surface material 140 and the concave platform 121 is generally a rectangular structure. In order to ensure that the conductive surface material 140 can be more stably clamped on the lower surface of the concave platform 121, at least one fixing column 123 can be respectively arranged at the four corners of the lower surface of the concave platform 121, and at least corresponding through holes 11 can be arranged at the four corners of the conductive surface material 140. Generally speaking, the diameter of the through hole 11 is slightly smaller than the diameter of the corresponding fixing column 123, so that when the through holes 11 of the conductive surface material 140 are respectively inserted into the corresponding fixing column 123, since the conductive surface material 140 is a conductive film or a conductive foil, both materials have a certain toughness, the through holes 11 of the conductive surface material 140 will not break when inserted into the corresponding fixing column 123, but the diameter of the corresponding through hole 11 is slightly changed by the fixing column 123, so as to better play the role of clamping and fixing the through hole 11 of the conductive surface material 140. The size of the concave platform 121 generally needs to be larger than the size of the substrate 200, so as to avoid the fixing columns 123 set at the four corners from touching the substrate 200 during the pressing process of the concave platform 121. The groove 122 set on the lower surface of the recess 121 is in a one-to-one correspondence with the chip 300 on the substrate 200. When the conductive surface material 140 is clamped on the lower surface of the recess 121, one end of each conductive sheet 110 set on the conductive surface material 140 is correspondingly located at the opening edge of a groove 122, and the other end is correspondingly located on the opening of the corresponding groove 122, so as to clamp a conductive sheet 110 above each solder pad 210 and the corresponding solder foot 310.

[0044] In the above example, when the recess 121 is pressed down to press one end of each conductive sheet 121 onto a pad 210, and the other end onto a soldering foot 310 corresponding to the pad 210, and the welding material on each pad 210 and the welding material on each soldering foot 310 are heated by the heating component 130, so that one end of each conductive sheet 110 is welded and fixed to the corresponding pad 210, and the other end is welded and fixed to the corresponding soldering foot 310. The remaining material of the conductive surface material 140 other than the conductive sheet 110 can be lifted up along with the recess 121, and can be clamped and lifted up together with the surrounding fixing columns 123. At the same time, each conductive sheet 110 can be peeled off from the conductive surface material 140 through the weakened connection structure 10. However, due to the phenomenon that part of the remaining material may break and remain on the upper surface of the chip 300 during the peeling process, in some examples, such as Figure 5 As shown, the bottom wall of the groove 122 can be further improved as follows, that is, the bottom wall of the groove 122 is specifically set as a vacuum adsorption plane with adjustable height or an electromagnetic adsorption plane with adjustable height, so that when the concave platform 121 is pressed down, the vacuum adsorption plane or the electromagnetic adsorption plane can directly contact the upper surface of the chip 300, so that the groove 122 can be adapted to chips 300 of different heights, and the vacuum adsorption plane or the electromagnetic adsorption plane can take away the residual material of the conductive surface material 140 broken on the upper surface of the chip 300 by adsorption when the concave platform 121 is raised. In order to form the above-mentioned vacuum adsorption plane or electromagnetic adsorption plane, a corresponding adsorption platform 124 that can be raised and lowered can be set in each groove 122. The adsorption platform 124 can specifically adopt a vacuum adsorption structure or an electric porcelain adsorption structure to form a corresponding vacuum adsorption plane or an electromagnetic adsorption plane on its lower surface as the new bottom wall of the groove 122.

[0045] In addition, when the recessed platform 121 is raised, the residual material of the conductive surface material 140 broken on the upper surface of the chip 300 can be taken away. Figure 6 As shown, the bottom wall of the groove 122 can be further improved as follows, that is, an elastic adhesive coating 125 is provided on the bottom wall of the groove 122, so that when the concave platform 121 is pressed down, the elastic adhesive coating 125 directly contacts the upper surface of the chip 300, so that the groove 122 provides a certain downward pressure protection for the chip 300, and the elastic adhesive coating 125 can carry away the residual material of the conductive surface material 140 broken on the upper surface of the chip 300 by adhesion when the concave platform 121 is raised. The elastic adhesive coating 125 can be specifically made of polydimethylsiloxane (PDMS) material, and its surface has strong viscosity and elasticity, which can provide better downward pressure protection for the chip 300, and when the concave platform 121 is raised, it can better adhere to and carry away the residual material of the conductive surface material 140 broken on the upper surface of the chip 300.

[0046] In some examples, the structure of the fixing column 123 can also be combined with the adhesive concave platform, such as Figure 7 As shown, a fixed column support plate 126 is fixed on the upper surface of the adhesive concave platform, and a plurality of fixed columns 123 are convexly formed on the lower surface of the fixed column support plate 126 and are arranged through the adhesive concave platform 121. A plurality of through holes 11 corresponding to the plurality of fixed columns 123 are opened along the edge of the conductive surface material 140, so that each through hole 11 is correspondingly clamped on the corresponding fixed column 123 to further clamp and fix the conductive surface material 140 adhered to the lower surface of the adhesive concave platform. Specifically, the fixed column 123 can be made of the same or different material as the fixed column support plate, and the material can be the same material as the above-mentioned high temperature resistant concave platform.

[0047] In one embodiment, Figure 8 As shown, the embodiment of the present application provides a chip packaging method, which is applied to the chip packaging device 100 in the above embodiment. The chip packaging method may specifically include the following steps:

[0048] Step S110: providing a substrate and at least one chip, wherein the chip is fixed on the substrate, and a plurality of pads arranged around the chip on the substrate are arranged correspondingly to a plurality of solder pins on the chip, and soldering material is arranged correspondingly on each pad and each solder pin.

[0049] Specifically, Figure 1 As shown, a substrate 200 and at least one chip 300 are provided. The substrate 200 can be any one of a silicon substrate, a ceramic substrate and a flexible substrate. The chip 300 can be any one of a storage chip, a control chip, a power chip and an optical chip. The chip 300 is fixed on the substrate 200, and a plurality of pads 210 arranged around the chip 300 on the substrate 200 are arranged one by one corresponding to a plurality of solder pins 310 on the chip 300. Each pad 210 and each solder pin 310 are provided with a soldering material (not shown). The soldering material on the pad 210 and the soldering material on the solder pin 310 can be applied to the corresponding pad 210 or the corresponding solder pin 310 in advance manually or by a tinning assembly (not shown). The soldering material is generally a common solder paste, which can be heated to melt and cooled to solidify to achieve corresponding soldering fixation.

[0050] Step S120: A plurality of conductive sheets are adhered or clamped on the lower surface of the recessed platform of the recessed platform transfer component, and one end of each conductive sheet is arranged on the opening edge of a recess and is located above a soldering pad, and the other end of each conductive sheet is arranged on the opening of the corresponding recess and is located above a soldering foot.

[0051] Specifically, Figure 1As shown, a plurality of conductive sheets 110 are adhered or clamped on the lower surface of the concave platform 121 of the concave platform transfer component 120, and one end of each conductive sheet 110 is arranged along the opening edge of a concave groove 122 and is located above a pad 210, and the other end of each conductive sheet 110 is arranged on the opening of the corresponding concave groove 122 and is located above a solder foot 310. Based on the above description, it can be seen that based on the different specific implementation structures of the concave platform transfer component 120, the implementation methods of adhering or clamping the plurality of conductive sheets 110 on the lower surface of the concave platform 121 are also slightly different. For details, please refer to the corresponding descriptions in the above embodiments, and no further description is given here.

[0052] Step S130: Press down the concave platform to press one end of the conductive sheet onto a pad and the other end onto a soldering foot corresponding to the pad.

[0053] Specifically, Figure 1 and Figure 2 As shown, the recessed platform 121 is pressed down to press one end of each conductive sheet 110 onto a pad 210, and the other end onto a soldering foot 310 corresponding to the pad 210. Similarly, based on the above description, it can be seen that based on the different specific implementation structures of the recessed platform transfer component 120, the implementation method of pressing down the recessed platform 121 to press one end of each conductive sheet 110 onto a pad 210, and the other end onto a soldering foot 310 corresponding to the pad 210 also has slight differences. For details, please refer to the corresponding description in the above embodiment, and no further description is given here.

[0054] Step S140: heating the soldering material on the soldering pad and the soldering material on each soldering foot by a heating component, so as to solder one end of each conductive sheet to the corresponding soldering pad and the other end to the corresponding soldering foot.

[0055] Specifically, after one end of each conductive sheet 110 is pressed onto a pad 210 and the other end is pressed onto a soldering foot 310 corresponding to the pad 210 through the above method steps, the soldering material on each pad 210 and the soldering material on each soldering foot 310 can be heated by the heating element 130 to weld and fix one end of each conductive sheet 110 onto the corresponding pad 210 and the other end onto the corresponding soldering foot 310. The heating element 130 can be specifically a heating platform, or a heating element such as a heating element 130. Figure 1 As shown, it is arranged above the vacuum adsorption transfer component 120 to heat the welding material on each welding pad 210 and the welding material on each welding foot 310 through heat conduction of the vacuum adsorption transfer component 120, or it is arranged below the substrate 200 to heat the welding material on each welding pad 210 and the welding material on each welding foot 310 through heat conduction of the substrate 200.

[0056] In this way, the chip packaging method of the embodiment of the present application only needs one pressing and one heating process in the entire packaging process, and the electrical interconnection between the chip 300 and the substrate 200 can be quickly achieved through multiple conductive sheets 110. At the same time, the conductive sheet 110 is welded to the substrate pad and the chip foot through the vacuum adsorption transfer component 120 to achieve the electrical interconnection between the chip 300 and the substrate 200. Compared with the existing wire bonding method, its packaging efficiency is higher, and there will be no warping, cracking, etc. that are easy to occur during the hardware bonding process.

[0057] like Fig. 9 As shown, in one embodiment, the embodiment of the present application provides a packaged chip 400, the packaged chip 400 includes a substrate 410 and a chip 420 fixed on the substrate 410, a plurality of solder pins 421 are arranged on the upper surface of the chip 420, a plurality of solder pads 411 corresponding to the plurality of solder pins 421 are arranged on the upper surface of the substrate 410 around the chip 420, each solder pin 421 is electrically connected to the corresponding solder pad 411 through a conductive sheet 430, and each conductive sheet 430 is welded and fixed between the corresponding solder pad 411 and the solder pin 421 through the above-mentioned chip packaging device 100 using the above-mentioned chip packaging method.

[0058] In this way, the packaged chip of the embodiment of the present application can quickly realize the electrical interconnection between the chip 420 and the substrate 410 through multiple conductive sheets 430. Compared with the existing wire bonding method, its packaging efficiency is higher and there will be no warping, cracking, etc. that are prone to occur during the hardware bonding process.

[0059] Although the present application has been shown and described with respect to one or more implementations, equivalent variations and modifications will occur to those skilled in the art based on reading and understanding of this specification and the accompanying drawings. The present application includes all such modifications and variations and is limited only by the scope of the appended claims. In particular, with respect to the various functions performed by the above-mentioned components, the terms used to describe such components are intended to correspond to any component (unless otherwise indicated) that performs the specified function of the component (e.g., it is functionally equivalent), even if it is not structurally equivalent to the disclosed structure that performs the functions in the exemplary implementation of this specification shown herein.

[0060] That is, the above description is only an embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the specification and drawings of the present application, such as the mutual combination of technical features between the embodiments, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

[0061] In addition, in the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, for structural elements with the same or similar characteristics, the present application may use the same or different reference numerals for identification. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0062] In this application, the word "exemplary" is used to mean "used as an example, illustration or description". Any embodiment described as "exemplary" in this application is not necessarily to be construed as being more preferred or more advantageous than other embodiments. In order to enable any technician in the field to implement and use the present application, the present application provides the above description. In the above description, various details are listed for the purpose of explanation. It should be understood that a person of ordinary skill in the art can recognize that the present application can be implemented without using these specific details. In other embodiments, well-known structures and processes will not be elaborated in detail to avoid unnecessary details that make the description of the present application obscure. Therefore, the present application is not intended to be limited to the embodiments shown, but is consistent with the widest range of principles and features disclosed in the present application.

Claims

1. A chip packaging device, used for bonding the welding materials on a plurality of pads on a substrate to the welding materials on a plurality of solder pins on a chip in a one-to-one correspondence, characterized in that: The chip packaging device includes a plurality of conductive sheets, a concave stage transfer component and a heating component, wherein: The concave platform transfer assembly comprises a concave platform, the lower surface of the concave platform is concavely formed with at least one groove adapted to the chip, the lower surface of the concave platform adheres or clamps the plurality of conductive sheets, and one end of each conductive sheet is arranged on the opening edge of one of the concave grooves and is located above one of the pads, and the other end of each conductive sheet is arranged on the opening of the corresponding concave groove and is located above one of the soldering feet, so that when the concave platform is pressed down, one end of the conductive sheet is pressed tightly onto one of the soldering pads, and the other end is pressed tightly onto the soldering foot corresponding to the soldering pad; The heating component is used to heat the welding material on each of the welding pads and the welding material on each of the welding feet, so as to weld and fix one end of the conductive sheet to the corresponding welding pad and the other end to the corresponding welding foot.

2. The chip packaging device according to claim 1, characterized in that: The conductive sheet is a conductive foil with a sheet structure.

3. The chip packaging device according to claim 1, characterized in that: The plurality of conductive sheets are connected to the conductive surface material via a weakened connection structure, and the plurality of conductive sheets and the conductive surface material are in the same plane.

4. The chip packaging device according to claim 3, characterized in that: The concave platform is an adhesive concave platform, so that the conductive surface material connected with the plurality of conductive sheets can be adhered to the lower surface of the adhesive concave platform.

5. The chip packaging device according to claim 4, characterized in that: A fixing column support plate is fixedly provided on the upper surface of the adhesive recess, and a plurality of fixing columns are protruding from the lower surface of the fixing column support plate and are arranged to penetrate the adhesive recess. A plurality of through holes corresponding to the plurality of fixing columns are opened along the edge of the conductive surface material, so that each of the through holes can be clamped on the corresponding fixing column to further clamp and fix the conductive surface material adhered to the lower surface of the adhesive recess.

6. The chip packaging device according to claim 3, characterized in that: The concave platform is a high temperature resistant concave platform, and a plurality of fixing columns are protruding along the edge of the lower surface of the high temperature resistant concave platform. A plurality of through holes corresponding to the plurality of fixing columns are opened along the edge of the conductive surface material, so that the conductive surface material can be clamped on the lower surface of the high temperature resistant concave platform by each of the through holes being clamped on the corresponding fixing column.

7. The chip packaging device according to claim 6, characterized in that: The bottom wall of the groove is a vacuum adsorption plane with adjustable height, or the bottom wall of the groove is an electromagnetic adsorption plane with adjustable height, or the bottom wall of the groove is provided with an elastic adhesive coating.

8. The chip packaging device according to any one of claims 1 to 7, characterized in that: The side wall of the groove is provided with an inclined surface, and the inclined surface is in an open shape facing the chip.

9. A chip packaging method, applied to the chip packaging device according to any one of claims 1 to 8, characterized in that: include: A substrate and at least one chip are provided, wherein the chip is fixed on the substrate, and a plurality of pads arranged around the chip on the substrate are arranged in one-to-one correspondence with a plurality of solder pins on the chip, and soldering material is correspondingly arranged on each of the pads and each of the solder pins; A plurality of conductive sheets are adhered or clamped on the lower surface of the concave platform of the concave platform transfer component, and one end of each conductive sheet is arranged on the opening edge of one of the concave grooves and is located above one of the pads, and the other end of each conductive sheet is arranged on the opening of the corresponding concave groove and is located above one of the soldering feet; Pressing down the concave platform to press one end of the conductive sheet onto one of the pads, and the other end onto the soldering foot corresponding to the pad; The welding material on each of the welding pads and the welding material on each of the welding feet are heated by the heating component, so that one end of the conductive sheet is welded and fixed on the corresponding welding pad, and the other end is welded and fixed on the corresponding welding foot.

10. A packaged chip, characterized in that: The packaged chip includes a substrate and a chip fixed on the substrate, a plurality of solder pins are arranged on the upper surface of the chip, a plurality of solder pads corresponding to the plurality of solder pins are arranged around the chip on the upper surface of the substrate, each of the solder pins is electrically connected to the corresponding solder pad via a conductive sheet, and each of the conductive sheets is fixed by welding between the corresponding solder pad and the solder pin using the chip packaging method as described in claim 9 through the chip packaging device as described in any one of claims 1 to 8.

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