A high-efficiency semiconductor laser packaging auxiliary device and a packaging method

By using packaging auxiliary equipment such as coolers and integrated L-shaped electrodes, the problems of time-consuming component adjustment and poor electrical connection during the packaging process of semiconductor lasers have been solved, achieving efficient and reliable packaging results and reducing costs.

CN117394131BActive Publication Date: 2026-09-04Shandong Huaguang Optoelectronics Co. Ltd.
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Patent Information

Application Number
CN202311439593.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-11-01
Publication Date
2026-09-04
Estimated Expiration
2043-11-01

AI Technical Summary

Technical Problem

Existing semiconductor laser packaging processes suffer from problems such as time-consuming and labor-intensive component positioning, poor soldering, and abnormal electrical connections, resulting in low packaging efficiency, high cost, and poor reliability.

Method used

The packaging auxiliary equipment adopts a cooler, a secondary heat sink, an integrated L-shaped electrode, and an insulating sheet. The secondary heat sink is quickly positioned through the first groove, and the positioning and connection of the bar array are improved by setting a boss and a fourth groove. The integrated L-shaped electrode replaces the traditional scattered electrode sheet, increasing the conductive area and contact area.

Benefits of technology

It improves packaging efficiency, enhances packaging reliability and stability, reduces packaging costs, and ensures the heat dissipation performance and electrical connection stability of the laser.

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Abstract

The application relates to the technical field of semiconductor laser packaging, in particular to a high-efficiency semiconductor laser packaging auxiliary device and a packaging method. The packaging auxiliary device comprises a cooler, a secondary heat sink, an integrated L-shaped electrode, a first insulating sheet and a second insulating sheet. The upper surface of the cooler is provided with a first groove for accommodating the secondary heat sink; the upper surface of the secondary heat sink is provided with a second groove, the second groove is provided with a plurality of third grooves which are arranged at intervals and parallel to each other, the bottom surface of the second groove between the adjacent third grooves is provided with a boss, and the two ends of the secondary heat sink are provided with openings which are arranged parallel to the second groove. The integrated L-shaped electrode is arranged on the cooler. The technical scheme of the application can effectively reduce the packaging difficulty of the semiconductor laser, improve the packaging efficiency and reduce the packaging cost.
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