A semiconductor device package processing apparatus

Abstract

The application discloses a kind of semiconductor device packaging processing equipment, comprising: rack;Conveying module;Feeding conveying line;Chip sticking module, for sticking tin paste, chip to the lead head in upper and lower graphite boat on workbench;Turnover and die module, for clamping upper graphite boat, and after upper graphite boat is overturned 180 degrees, it is combined with upper and lower graphite boat on workbench, and graphite boat group is formed;Pressure material module, for the lead on graphite boat group is compacted;Discharging module;Wherein, feeding conveying line, chip sticking module, turnover and die module, pressure material module, discharging module are arranged in parallel along the conveying direction of conveying module.The present application compared with prior art, solve the problem that the volume is large and easily not firm caused by low integration of equipment.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device technology, and in particular to a semiconductor device packaging and processing equipment. Background Technology

[0002] When semiconductor devices are packaged, for diodes that require high-temperature sintering, the physical constraints of upper and lower graphite boats are used to position the leads, solder paste and chip during the packaging process. This prevents the molten solder paste from moving due to surface tension or thermal flow. In addition, the excellent thermal conductivity of graphite ensures that heat is evenly transferred from the external heat source to the inside of the mold, so that the solder paste and chip are heated evenly.

[0003] To achieve physical constraints on the leads, solder paste, and chips by the graphite boat, a die-bonding and flipping mold-closing mechanism is needed to sequentially perform processes such as loading the lower graphite boat, bonding solder paste, bonding chips, flipping and closing the mold, pressing the material, and collecting the material. The existing die-bonding and flipping mold-closing mechanism has insufficient functional integration, occupies too much space, and has poor bonding quality of solder paste, chips, and leads, which can easily lead to poor soldering later. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor device packaging and processing equipment to solve the problems of large size and poor soldering caused by low equipment integration.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a semiconductor device packaging and processing equipment, comprising:

[0006] frame;

[0007] The conveying module includes a linkage clamping assembly and three worktables arranged in a straight line. The worktables are used to support the lower graphite boat, and the linkage clamping assembly is used to transfer the upper and lower graphite boats on the worktables to the next worktable. The conveying module is equipped with a loading clamping assembly and a unloading clamping assembly at both ends.

[0008] The feeding conveyor line is used to transport the graphite boats.

[0009] The chip-adhesive module is used to adhere solder paste and chips to the lead heads in the graphite boats on the upper and lower parts of the worktable.

[0010] The flipping and mold-closing module is used to clamp the upper graphite boat and flip it 180 degrees to close it with the upper and lower graphite boats on the worktable to form a graphite boat assembly.

[0011] The compaction module is used to compact the leads on the graphite boat assembly;

[0012] The unloading module is used for unloading and conveying graphite boats;

[0013] The feeding conveyor line, chip bonding module, flipping and mold closing module, pressing module, and unloading module are arranged in parallel along the conveying direction of the conveying module.

[0014] As a further description of the above technical solution:

[0015] The protective cover is fixedly installed on the frame, and the protective cover is equipped with a door panel that flips up and opens.

[0016] As a further description of the above technical solution:

[0017] The worktable includes two clamping frames arranged symmetrically facing each other. The clamping frames are provided with graphite boat support grooves. The first clamping cylinder is fixedly installed on the clamping frame. The piston rod of the first clamping cylinder is fixedly connected to the first baffle. The first baffle is used to contact the side wall of the lower graphite boat.

[0018] As a further description of the above technical solution:

[0019] The linkage clamping assembly includes a first slide rail, a material support base, a first drive unit, and a locking cylinder. Three worktables are arranged along the length of the first slide rail. Two material support bases are provided on the first slide rail and are fixedly connected by a linkage rod. A first lifting cylinder is fixedly installed on the material support base. The piston rod of the first lifting cylinder is connected to a support plate. Symmetrically arranged baffles are provided on both sides of the support plate. The first drive unit includes a first drive motor, a drive pulley, a driven pulley, and a first synchronous belt. The output end of the first drive motor is connected to the drive pulley. The drive pulley drives the driven pulley to rotate through the first synchronous belt. The first synchronous belt is fixedly connected to one side of the material support base. The piston rod end of the locking cylinder is connected to a locking block. The locking block is a circular block. The material support base has a notch with a shape matching the locking block.

[0020] As a further description of the above technical solution:

[0021] The feeding clamping assembly includes a feeding fixed seat, a second drive unit, a first transport frame, a second lifting cylinder, a first lifting frame, and a first clamping cylinder. The feeding fixed seat is fixedly installed on the frame, the first transport frame is slidably connected to the feeding fixed seat, the second drive unit is used to drive the first transport frame to slide on the feeding fixed seat, the second lifting cylinder is fixedly installed on the first transport frame, the piston rod of the second lifting cylinder is fixedly connected to the first lifting frame, and the first clamping cylinder is fixedly installed on the first lifting frame.

[0022] As a further description of the above technical solution:

[0023] The chip bonding module includes a die bonding assembly, a solder paste tray assembly, and a chip transfer machine. The worktable, solder paste tray assembly, and chip transfer machine are arranged sequentially along a straight line. The die bonding assembly includes a Y-axis linear module, a first lead screw driver, and a chip transfer robotic arm. The first lead screw driver is fixedly mounted on the slide of the Y-axis linear module, and the chip transfer robotic arm is fixedly mounted on the nut seat of the first lead screw driver. The chip transfer robotic arm is used to pick up the chip from the chip transfer machine. The solder paste tray assembly includes a solder paste mounting bracket, a solder paste carrier, a squeegee, a third drive unit, a first drive cylinder, and a scraper. The solder paste carrier is fixedly mounted on the solder paste mounting bracket and has a solder paste holding slot. The squeegee is slidably connected to the solder paste mounting bracket. The third drive unit is used to drive the squeegee to reciprocate along a straight line. The first drive cylinders are symmetrically arranged on both sides of the squeegee. The output end of the first drive cylinder is connected to the scraper, which is arranged at an angle. The chip transfer machine is used to hold the chip.

[0024] As a further description of the above technical solution:

[0025] The flipping and clamping module includes a flipping mounting frame, a fourth drive unit, a second lead screw driver, a flipping clamping frame, a rotating frame, a rotating cylinder, a second clamping cylinder, and a graphite boat conveyor line. The second lead screw driver is slidably connected to the flipping mounting frame. The fourth drive unit is used to drive the second lead screw driver to slide. The flipping clamping frame is fixedly installed on the nut seat of the second lead screw driver. The rotating frame is rotatably installed on the flipping clamping frame. The rotating shaft of the rotating frame is connected to the output end of the rotating cylinder. A baffle plate is provided on the rotating frame. The second clamping cylinder is fixedly installed on one side of the rotating frame. The graphite boat conveyor line is used to transport the graphite boat.

[0026] As a further description of the above technical solution:

[0027] The pressing module includes a pressing bracket, a third lead screw driver, and a pressing block. The third lead screw driver is fixedly installed on the pressing bracket, and the pressing block is fixedly installed on the nut seat of the third lead screw driver. The pressing block is provided with several pressing rods arranged in an array.

[0028] As a further description of the above technical solution:

[0029] The unloading module includes an unloading support frame, a pusher plate, and a pusher cylinder. The unloading support frame is used to place the graphite boat assembly. The pusher plate is slidably connected to the unloading support frame, and the piston rod of the pusher cylinder is connected to the pusher plate.

[0030] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0031] 1. In this invention, the conveying module in the packaging processing equipment is arranged along the length of the frame, while the loading conveyor line, chip bonding module, flipping and mold closing module, pressing module, and unloading module are arranged in parallel along the conveying direction of the conveying module. The equipment has a high degree of integration, effectively reduces the size of the equipment, improves the packaging efficiency of semiconductor devices, and the multiple functional modules arranged in a straight line facilitate loading, unloading and maintenance by the staff at the front of the frame, making the packaging equipment maintenance easier.

[0032] 2. In this invention, when the graphite boat is transported by the conveying module, the graphite boats on multiple worktables are synchronously transferred to the next worktable by the linkage clamping component, which effectively improves the graphite boat conveying efficiency.

[0033] 3. In this invention, after the upper and lower graphite boats are molded together to form a graphite boat assembly, the lead wires on the graphite boat assembly are pressed by the pressing module, so that the solder paste, chip and lead wires are more tightly attached, and the phenomenon of poor soldering occurs later. Attached Figure Description

[0034] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 A schematic diagram of the structure of a semiconductor device packaging and processing equipment. Figure 1 .

[0036] Figure 2 A schematic diagram of the structure of a semiconductor device packaging and processing equipment. Figure 2 .

[0037] Figure 3 A schematic diagram of the structure of a semiconductor device packaging and processing equipment. Figure 3 .

[0038] Figure 4 This is a schematic diagram of the structure of a transfer module in a semiconductor device packaging and processing equipment. Figure 1 .

[0039] Figure 5 This is a schematic diagram of the structure of a transfer module in a semiconductor device packaging and processing equipment. Figure 2 .

[0040] Figure 6 This is a schematic diagram of the structure of a feeding clamping component in a semiconductor device packaging and processing equipment.

[0041] Figure 7This is a schematic diagram of the chip bonding module in a semiconductor device packaging and processing equipment.

[0042] Figure 8 This is a schematic diagram of the structure of a tray assembly in a semiconductor device packaging and processing equipment.

[0043] Figure 9 This is a schematic diagram of the structure of a flip-and-close module in a semiconductor device packaging and processing equipment. Figure 1 .

[0044] Figure 10 This is a schematic diagram of the structure of a flip-and-close module in a semiconductor device packaging and processing equipment. Figure 2 .

[0045] Figure 11 This is a schematic diagram of the pressing module in a semiconductor device packaging and processing equipment.

[0046] Figure 12 This is a schematic diagram of the unloading module in a semiconductor device packaging and processing equipment.

[0047] Legend:

[0048] 1. Frame; 11. Protective cover; 111. Door panel; 18. Upper graphite boat; 19. Lower graphite boat;

[0049] 2. Conveying module; 21. Linkage clamping assembly; 211. First slide rail; 212. Material support seat; 2121. Linkage rod; 2122. First lifting cylinder; 2123. Support plate; 2124. Baffle; 213. First drive unit; 2131. First drive motor; 2132. First synchronous belt; 214. Locking cylinder; 22. Worktable; 221. Clamping frame; 2211. Graphite boat support groove; 222. First clamping cylinder; 23. Loading clamping assembly; 231. Loading fixed seat; 232. Second drive unit; 233. First transport frame; 234. Second lifting cylinder; 235. First lifting frame; 236. First clamping cylinder; 24. Unloading clamping assembly;

[0050] 3. Feeding conveyor line;

[0051] 4. Chip bonding module; 41. Die bonding assembly; 411. Y-axis linear module; 412. First lead screw driver; 413. Chip transfer robotic arm; 42. Glue tray assembly; 421. Glue tray mounting bracket; 422. Solder paste carrier; 4221. Solder paste container; 423. Scraper; 424. Third drive unit; 425. First drive cylinder; 426. Scraper; 43. Disc shaker;

[0052] 5. Tilting and mold closing module; 51. Tilting mounting frame; 52. Fourth drive unit; 53. Second lead screw driver; 54. Tilting clamping frame; 55. Rotating frame; 551. Baffle plate; 56. Rotary cylinder; 57. Second clamping cylinder; 58. Graphite boat conveyor line;

[0053] 6. Pressing module; 61. Pressing bracket; 62. Third lead screw driver; 63. Pressing block;

[0054] 7. Feeding module; 71. Feeding support frame; 72. Pusher plate; 73. Pusher cylinder. Detailed Implementation

[0055] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0056] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0057] Example 1

[0058] Please see Figure 1-12 The present invention provides a technical solution: a semiconductor device packaging and processing equipment, comprising:

[0059] Rack 1;

[0060] The conveying module 2 includes a linkage clamping component 21 and three worktables 22 arranged in a straight line. The worktables 22 are used to support the lower graphite boat 19. The linkage clamping component 21 is used to transfer the graphite boat 19 from the worktable 22 to the next worktable 22. The two ends of the conveying module 2 are respectively provided with a loading clamping component 23 and a unloading clamping component 24.

[0061] The feeding conveyor line 3 is used to transport the lower graphite boat 19. The feeding clamping component 23 is set between the feeding conveyor line 3 and the conveying module 2. The feeding conveyor line 3 is a belt conveyor. The lower graphite boat 19 is placed on the feeding conveyor line 3 manually. The conveyor line runs forward until the front-end sensor senses the lower graphite boat 19, at which point the conveyor line stops and waits for the feeding clamping component 23 to move the lower graphite boat 19 to the workbench 22. The conveyor line adopts a "flat belt + speed-regulating motor" design to continuously transport the lower graphite boat 19 to the designated position.

[0062] Chip-adhesive module 4 is used to adhere solder paste and chips to the lead heads in the graphite boats 19 on the worktable 22.

[0063] The flipping and mold-closing module 5 is used to clamp the upper graphite boat 18 and flip the upper graphite boat 180 degrees to close the mold with the upper and lower graphite boats 19 on the worktable 22 to form a graphite boat group.

[0064] The pressing module 6 is used to compact the leads on the graphite boat assembly;

[0065] The unloading module 7 is used for unloading and conveying the graphite boat assembly, and the unloading clamping component 24 is disposed between the unloading module 7 and the conveying module 2.

[0066] Among them, the feeding conveyor line 3, the chip bonding module 4, the flipping and mold closing module 5, the pressing module 6, and the unloading module 7 are arranged in parallel along the conveying direction of the conveying module 2.

[0067] The workbench 22 includes two symmetrically arranged clamping frames 221. Each clamping frame 221 has a graphite boat support groove 2211. A first clamping cylinder 222 is fixedly mounted on the clamping frame 221. The piston rod of the first clamping cylinder 222 is fixedly connected to a first baffle, which contacts the side wall of the lower graphite boat 19. When the lower graphite boat 19 is placed on the workbench 22, its sides are positioned within the graphite boat support grooves 2211 of the two clamping frames 221. Simultaneously, the piston rod of the first clamping cylinder 222 pushes the first baffle to press against the lower graphite boat 19, clamping it and ensuring precise alignment of the solder paste, chip, and lead.

[0068] The linkage clamping assembly 21 includes a first slide rail 211, a material support 212, a first drive unit 213, and a locking cylinder 214. Three worktables 22 are arranged along the length of the first slide rail 211. Two material support 212s are mounted on the first slide rail 211 and are fixedly connected by a connecting rod 2121. A first lifting cylinder 2122 is fixedly mounted on each material support 212. The piston rod of the first lifting cylinder 2122 is connected to a support plate 2123. The support plate 2123 has locking cylinders on both sides. The symmetrically arranged baffles 2124, the first drive unit 213 includes a first drive motor 2131, a drive pulley, a driven pulley and a first synchronous belt 2132. The output end of the first drive motor 2131 is connected to the drive pulley. The drive pulley drives the driven pulley to rotate through the first synchronous belt 2132. The first synchronous belt 2132 is fixedly connected to one side of the material support 212. The piston rod end of the locking cylinder 214 is connected to a locking block. The locking block is a circular block. The material support 212 is provided with a notch that matches the shape of the locking block.

[0069] The material support 212 is slidably connected to the first slide rail 211. One material support 212 is connected to the first synchronous belt 2132 of the first drive unit 213. Driven by the first synchronous belt 2132, it moves linearly along the first slide rail 211. The two material supports 212 move synchronously through the linkage rod 2121. After the first clamping cylinder 222 unlocks the lower graphite boat 19 on the worktable 22, the piston rod of the first lifting cylinder 2122 on the material support 212 lifts the support plate 2123, so that... The support plate 2123 contacts the lower graphite boat 19 and abuts against the end face of the lower graphite boat 19 through the baffle 2124, so that the lower graphite boat 19 can move together with the material carrier 212. In order to ensure that the lower graphite boat 19 is accurately placed on the worktable 22, after the material carrier 212 moves into place, the piston rod of the locking cylinder 214 pushes out the circular locking block. During the process of the locking block engaging with the notch on the material carrier 212, the position of the material carrier 212 is precisely guided, ensuring that the solder paste, chip and lead are accurately aligned.

[0070] The linkage clamping assembly 21 operates with the "synchronous belt pulley + motor" as the X-axis and the first lifting cylinder 2122 moving up and down as the Z-axis. Specifically, the lower graphite boat 19 placed on the first worktable 22, after applying solder paste and attaching chips, is moved to the second worktable 22 via the linkage clamping assembly 21. Simultaneously, the lower graphite boat 19 from the first worktable 22 is moved to the second worktable 22, and simultaneously, it is moved to the third worktable 22.

[0071] The loading clamping assembly 23 includes a loading fixed base 231, a second drive unit 232, a first transport frame 233, a second lifting cylinder 234, a first lifting frame 235, and a first clamping cylinder 236. The loading fixed base 231 is fixedly installed on the frame 1. The first transport frame 233 is slidably connected to the loading fixed base 231. The second drive unit 232 is used to drive the first transport frame 233 to slide on the loading fixed base 231. The second lifting cylinder 234 is fixedly installed on the first transport frame 233. The piston rod of the second lifting cylinder 234 is fixedly connected to the first lifting frame 235. The first clamping cylinder 236 is fixedly installed on the first lifting frame 235 and is used to clamp the lower graphite boat 19.

[0072] The second drive unit 232 and the first drive unit 213 have the same structure and working principle. The loading clamping assembly 23 and the unloading clamping assembly 24 have the same structure and working principle. Taking the loading clamping assembly 23 as an example, the loading and handling adopts "synchronous belt + motor" as the X-axis, the second lifting cylinder 234 moves the first lifting frame 235 up and down as the Z-axis, and the first clamping cylinder 236 is added as the P-axis to clamp and transport the unloaded graphite boat 19 from the loading transport line to the worktable 22.

[0073] The chip bonding module 4 includes a die bonding assembly 41, a solder paste tray assembly 42, and a churning machine 43. The worktable 22, the solder paste tray assembly 42, and the churning machine 43 are arranged sequentially along a straight line. The die bonding assembly 41 includes a Y-axis linear module 411, a first lead screw driver 412, and a chip transfer robotic arm 413. The first lead screw driver 412 is fixedly mounted on the slide of the Y-axis linear module 411, and the chip transfer robotic arm 413 is fixedly mounted on the nut seat of the first lead screw driver 412. The chip transfer robotic arm 413 is used to pick up the chip from the churning machine 43. The adsorption plate of the chip transfer robotic arm 413 is provided with several adsorption columns arranged in an array, and the bottom of the adsorption columns is provided with adsorption holes, thereby adsorbing solder paste and chips. The chip transfer robotic arm 413 is existing technology. The solder paste tray assembly 42 includes a solder paste mounting bracket 421, a solder paste carrier 422, a scraper 423, a third drive unit 424, a first drive cylinder 425, and a scraper 426. The solder paste carrier 422 is fixedly mounted on the solder paste tray assembly 421. On the tray mounting bracket 421, a solder paste holding tray 422 is provided with a solder paste holding groove 4221. A squeegee 423 is slidably connected to the tray mounting bracket 421. A third drive unit 424 is used to drive the squeegee 423 to reciprocate in a straight line. The third drive unit 424 and the first drive unit 213 have the same structure and working principle. Symmetrically arranged first drive cylinders 425 are provided on both sides of the squeegee 423. The output end of the first drive cylinders 425 is connected to a scraper 426. The 26 is arranged at an angle. After each application of solder paste, the first drive cylinder 425 can drive the scraper 426 to move downward to contact the surface of the solder paste carrier 422. Combined with the linear movement of the scraper frame 423, the scraper 426 flattens the surface of the solder paste in the solder paste holding tank 4221, so that the top of the solder paste holding tank 4221 is always in a flat state, in preparation for solder paste application, and ensuring the amount of solder paste applied in the next application. The swivel machine 43 is used to hold the chips. The chips are neatly arranged in the carrier of the swivel machine 43.

[0074] After the lower graphite boat 19 is placed in the workbench 22, the chip transfer robot arm 413 of the die bonding assembly 41 first picks up the solder paste in the solder paste carrier 422 of the adhesive tray assembly 42. Then, the chip transfer robot arm 413 moves above the lower graphite boat 19 and sticks the solder paste to the lead head in the lower graphite boat 19. After that, the chip transfer robot arm 413 picks up the chip from the chuck machine 43 and places it on the lead head through the same process.

[0075] The flipping and mold-closing module 5 includes a flipping mounting frame 51, a fourth drive unit 52, a second lead screw driver 53, a flipping clamping frame 54, a rotating frame 55, a rotating cylinder 56, a second clamping cylinder 57, and a graphite boat conveyor line 58. The second lead screw driver 53 is slidably connected to the flipping mounting frame 51. The fourth drive unit 52 is used to drive the second lead screw driver 53 to slide. The fourth drive unit 52 and the first drive unit 213 have the same structure and working principle. The flipping clamping frame 54 is fixedly installed on the nut seat of the second lead screw driver 53. The rotating frame 55 is rotatably installed on the flipping clamping frame 54. The rotating shaft of the rotating frame 55 is connected to the output end of the rotating cylinder 56. A baffle plate 551 is provided on the rotating frame 55. The second clamping cylinder 57 is fixedly installed on one side of the rotating frame 55. The graphite boat conveyor line 58 is used to transport the upper graphite boat 18. The graphite boat conveyor line 58 uses a "flat belt + speed-regulating motor" method to continuously transport the upper graphite boat 18 to the designated position.

[0076] The flipping and mold closing module 5 uses a "synchronous wheel + motor" as the Y-axis, a second lead screw driver 53 as the Z-axis, and a rotary cylinder 56 as the Q-axis, which together flip the upper graphite boat 18 and close the mold.

[0077] When the upper graphite boat 18 is conveyed to the area below the rotating frame 55 via the graphite boat conveyor line 58, the rotating frame 55 descends until the baffle plate 551 contacts the surface of the upper graphite boat 18. The piston rod of the second clamping cylinder 57 pushes the upper graphite boat 18 horizontally out, locking it. Then, the flipping clamping frame 54 drives the upper graphite boat 18 upward and rotates it 180 degrees. When the upper graphite boat 18 is placed on the surface of the lower graphite boat 19, the baffle plate 551 contacts the surface of the lower graphite boat 19. Then, the second clamping cylinder 57 is released from locking, the flipping clamping frame 54 moves along the Y-axis, and the baffle plate 551 moves out between the upper graphite boat 18 and the lower graphite boat 19, realizing the mold closing of the upper graphite boat 18 and the lower graphite boat 19.

[0078] The pressing module 6 includes a pressing bracket 61, a third lead screw driver 62, and a pressing block 63. The third lead screw driver 62 is fixedly installed on the pressing bracket 61, and the pressing block 63 is fixedly installed on the nut seat of the third lead screw driver 62. The pressing block 63 is provided with a plurality of pressing rods 631 arranged in an array.

[0079] The pressing module 6 is located at the third workbench 22. For the graphite boat assembly formed by the upper graphite boat 18 and the lower graphite boat 19, the pressing block 63 moves downward under the action of the third lead screw driver 62, so that the lead wire corresponding to the pressing rod 631 is squeezed, the solder paste, chip and lead wire are more tightly attached, and the lead wire is compacted to prevent the phenomenon of poor soldering in the later stage.

[0080] The unloading module 7 includes an unloading support frame 71, a pusher plate 72, and a pusher cylinder 73. The unloading support frame 71 is used to place the graphite boat assembly. The pusher plate 72 is slidably connected to the unloading support frame 71. The piston rod of the pusher cylinder 73 is connected to the pusher plate 72.

[0081] After the graphite boat assembly is clamped by the feeding clamping component 24 and placed on the feeding support frame 71, the piston rod of the pushing cylinder 73 retracts, and the pushing plate 72 slides in a straight line, smoothly pushing the graphite boat assembly away from the feeding clamping component 24 to facilitate the next feeding. At the same time, photoelectric sensors installed on the side wall of the feeding support frame 71 detect the feeding and fullness of the graphite boat assembly. An alarm is triggered when the assembly is full, and then it is manually removed.

[0082] Working principle: In the packaging processing equipment, the conveying module 2 is arranged along the length of the frame 1, while the loading conveyor line 3, chip bonding module 4, flipping and mold closing module 5, pressing module 6, and unloading module 7 are arranged in parallel along the conveying direction of the conveying module 2. The equipment has a high degree of integration, effectively reducing the size of the equipment and improving the packaging efficiency of semiconductor devices. Moreover, the multiple functional modules arranged in a straight line facilitate loading, unloading, and maintenance by the personnel at the front of the frame 1, making it convenient for the packaging equipment to be maintained.

[0083] When the graphite boats are transported via the conveying module 2, the linkage clamping assembly 21 synchronously transfers the lower graphite boats 19 from multiple worktables 22 to the next worktable 22, effectively improving the graphite boat transport efficiency. After the upper graphite boats 18 and lower graphite boats 19 are molded together to form a graphite boat assembly, the pressing module 6 compacts the leads on the graphite boat assembly, making the solder paste, chip, and leads adhere more tightly and preventing poor soldering later.

[0084] Example 2

[0085] Based on the above embodiments, this embodiment further improves upon the following technical solution: the protective cover 11 is fixedly installed on the frame 1, and the protective cover 11 is provided with a door panel 111 that can be flipped up and opened.

[0086] The door panel 111 on the protective cover 11 can be opened upwards, which facilitates the loading and unloading of the feeding conveyor line 3, the chip bonding module 4, the flipping mold closing module 5, and the unloading module 7, as well as their inspection and maintenance, thus facilitating the maintenance of the packaging equipment.

[0087] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A semiconductor device packaging and processing equipment, characterized in that, include: frame; The conveying module includes a linkage clamping assembly and three worktables arranged in a straight line. The worktables are used to support the lower graphite boat, and the linkage clamping assembly is used to transfer the lower graphite boat on the worktable to the next worktable. The two ends of the conveying module are respectively provided with a loading clamping assembly and a unloading clamping assembly. A feeding conveyor line is used to transport the lower graphite boat; A chip-adhesive module is used to adhere solder paste and chips to the lead heads in the lower graphite boat on the worktable. The flipping and mold-closing module is used to clamp the upper graphite boat and flip the upper graphite boat 180 degrees to close the mold with the lower graphite boat on the worktable to form a graphite boat assembly. The compaction module is used to compact the leads on the graphite boat assembly; The unloading module is used for unloading and conveying graphite boats; The feeding conveyor line, the chip bonding module, the flipping and mold closing module, the pressing module, and the unloading module are arranged in parallel along the conveying direction of the conveying module.

2. The semiconductor device packaging and processing equipment according to claim 1, characterized in that, The protective cover is fixedly installed on the frame, and the protective cover is provided with a door panel that flips up and opens.

3. The semiconductor device packaging and processing equipment according to claim 1, characterized in that, The workbench includes two clamping frames arranged symmetrically facing each other. The clamping frames are provided with graphite boat support grooves. A first clamping cylinder is fixedly installed on the clamping frame. The piston rod of the first clamping cylinder is fixedly connected to a first baffle. The first baffle is used to contact the side wall of the lower graphite boat.

4. The semiconductor device packaging and processing equipment according to claim 3, characterized in that, The linkage clamping assembly includes a first slide rail, a material support seat, a first drive unit, and a locking cylinder. Three worktables are arranged along the length of the first slide rail. Two material support seats are mounted on the first slide rail and are fixedly connected by a linkage rod. A first lifting cylinder is fixedly mounted on each material support seat. The piston rod of the first lifting cylinder is connected to a support plate. Symmetrically arranged baffles are provided on both sides of the support plate. The first drive unit includes a first drive motor, a drive pulley, a driven pulley, and a first synchronous belt. The output end of the first drive motor is connected to the drive pulley. The drive pulley drives the driven pulley to rotate via the first synchronous belt. The first synchronous belt is fixedly connected to one side of the material support seat. A locking block is connected to the piston rod end of the locking cylinder. The locking block is a circular block, and a notch matching the shape of the locking block is provided on the material support seat.

5. The semiconductor device packaging and processing equipment according to claim 1, characterized in that, The feeding clamping assembly includes a feeding fixed base, a second drive unit, a first transport frame, a second lifting cylinder, a first lifting frame, and a first clamping cylinder. The feeding fixed base is fixedly installed on the frame. The first transport frame is slidably connected to the feeding fixed base. The second drive unit is used to drive the first transport frame to slide on the feeding fixed base. The second lifting cylinder is fixedly installed on the first transport frame. The piston rod of the second lifting cylinder is fixedly connected to the first lifting frame. The first clamping cylinder is fixedly installed on the first lifting frame.

6. The semiconductor device packaging and processing equipment according to claim 1, characterized in that, The chip bonding module includes a die bonding assembly, a solder paste tray assembly, and a chip chuck. The worktable, the solder paste tray assembly, and the chip chuck are arranged sequentially along a straight line. The die bonding assembly includes a Y-axis linear module, a first lead screw driver, and a chip transfer robotic arm. The first lead screw driver is fixedly mounted on the slide of the Y-axis linear module, and the chip transfer robotic arm is fixedly mounted on the nut seat of the first lead screw driver. The chip transfer robotic arm is used to pick up the chip from the chip chuck. The solder paste tray assembly includes a solder paste mounting bracket, a solder paste carrier, a squeegee, a third drive unit, a first drive cylinder, and a scraper. The solder paste carrier is fixedly mounted on the solder paste mounting bracket and has a solder paste holding groove. The squeegee is slidably connected to the solder paste mounting bracket. The third drive unit is used to drive the squeegee to reciprocate along a straight line. The first drive cylinders are symmetrically arranged on both sides of the squeegee, and the output end of the first drive cylinder is connected to the scraper. The scraper is arranged at an angle. The chip chuck is used to hold the chip.

7. The semiconductor device packaging and processing equipment according to claim 1, characterized in that, The flipping and mold-closing module includes a flipping mounting frame, a fourth drive unit, a second lead screw driver, a flipping clamping frame, a rotating frame, a rotating cylinder, a second clamping cylinder, and a graphite boat conveyor line. The second lead screw driver is slidably connected to the flipping mounting frame. The fourth drive unit is used to drive the second lead screw driver to slide. The flipping clamping frame is fixedly installed on the nut seat of the second lead screw driver. The rotating frame is rotatably installed on the flipping clamping frame. The rotating shaft of the rotating frame is connected to the output end of the rotating cylinder. A baffle plate is provided on the rotating frame. The second clamping cylinder is fixedly installed on one side of the rotating frame. The graphite boat conveyor line is used to convey the upper graphite boat.

8. The semiconductor device packaging and processing equipment according to claim 1, characterized in that, The pressing module includes a pressing bracket, a third lead screw driver, and a pressing block. The third lead screw driver is fixedly installed on the pressing bracket, and the pressing block is fixedly installed on the nut seat of the third lead screw driver. The pressing block is provided with a plurality of pressing rods arranged in an array.

9. A semiconductor device packaging and processing equipment according to claim 1, characterized in that, The feeding module includes a feeding support frame, a pushing plate, and a pushing cylinder. The feeding support frame is used to place the graphite boat assembly. The pushing plate is slidably connected to the feeding support frame. The piston rod of the pushing cylinder is connected to the pushing plate.

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