Electronic modules and electronic equipment

Abstract

The present application provides an electronic module and an electronic device. The electronic module includes a circuit board, a first electronic device, a connecting member and a fastener. Among them: the first electronic device includes a device substrate and a device assembly provided on a part of the surface of the device substrate, the device assembly and the circuit board are electrically connected through the device substrate, and the device substrate is provided with an avoidance hole in addition to the area where the device assembly is provided; the connecting member includes a base, which is provided between the circuit board and the first electronic device and is fixedly connected to the circuit board; the fastener passes through the avoidance hole from the side of the first electronic device away from the circuit board and is fixedly connected to the connecting member; in the avoidance hole, there is a gap between the outer wall of the fastener and the inner wall of the avoidance hole. The electronic module can improve the reliability of the connection between the electronic device and the circuit board, and improve the stability of the electronic device structure, prevent the electronic device itself from breaking, and thus prevent problems such as open circuit in the electronic device.

Description

Technical Field

[0001] The present application relates to the field of assembly of electronic devices, and in particular to an electronic module and an electronic device. Background Art

[0002] In electronic devices, after electronic components are soldered to a circuit board for electrical connection, they are typically secured with fasteners such as bolts or screws to mechanically connect the components and the circuit board. In existing assembly structures, fasteners directly connect the electronic components and the circuit board to achieve a secure connection. During this mechanical connection, or when the electronic device is subjected to stress, the solder joints between the electronic component and the circuit board, or areas of the electronic component that are vulnerable to stress, can crack or loosen, leading to problems such as open circuits, poor contact, and malfunctions in the electronic product. Summary of the Invention

[0003] The present application provides an electronic module and an electronic device to improve the reliability of the connection between the electronic device and the circuit board, and improve the stability of the electronic device structure, prevent the electronic device itself from breaking, and further prevent the electronic device from having problems such as open circuits.

[0004] In a first aspect, the present application provides an electronic module comprising a circuit board, a first electronic device, a connecting member, and a fastener. The first electronic device comprises a device substrate and a device assembly disposed on a portion of the surface of the device substrate, the device assembly being electrically connected to the circuit board via the device substrate, and the device substrate having an escape hole disposed in an area other than where the device assembly is disposed. The connecting member comprises a base disposed between the circuit board and the first electronic device and fixedly connected to the circuit board. The fastener passes through the escape hole from a side of the first electronic device away from the circuit board and is fixedly connected to the connecting member. Within the escape hole, a gap is formed between the outer wall of the fastener and the inner wall of the escape hole.

[0005] In existing mechanical connection methods for first electronic devices, since fasteners such as bolts or screws directly contact the first electronic device, during the installation process, the fastening force generated by the fasteners will directly act on the first electronic device. When this part of the fastening force is transmitted to the solder joints or other stress-weakened areas of the first electronic device, it is easy to cause the solder joints to break or the first electronic device to crack. In the installation structure of the electronic module provided in the present application, a connecting member is provided for connecting the circuit board and the first electronic device. The base of the connecting member can be connected to the circuit board, and a relief hole is provided on the device substrate of the first electronic device. The fastener passing through the relief hole is fixedly connected to the base to achieve a mechanical connection between the first electronic device and the circuit board. In this electronic module, since the circumferential dimension of the relief hole is larger than the circumferential dimension of the fastener, during the fixing process, the force generated by the fastener can be transmitted to the circuit board through the connecting member, avoiding the application of force to the first electronic device in the plane where the first electronic device is located. Therefore, the solder joints of the first electronic device can be prevented from breaking or the first electronic device from cracking, thereby ensuring the structural stability of the first electronic device and the reliability of the connection with the circuit board.

[0006] In one possible implementation of the present application, the connecting member may further include a connecting post, which is perpendicular to the base and extends from the base along the clearance hole away from the base. The provision of the connecting post forms a guide mechanism for the fastener, allowing the fastener to directly contact the connecting post within the clearance hole, thereby preventing contact between the fastener and the device substrate and improving the connection strength between the fastener and the connecting member.

[0007] In a possible implementation of the present application, the height of the connecting column from the base to the first electronic component is greater than the height of the avoidance hole, thereby preventing the fastener from exerting an extrusion force on the first electronic component in the height direction of the avoidance hole.

[0008] In a possible implementation of the present application, the connecting column is provided with a connecting hole, and the fastener and the connecting column are fixedly connected through the connecting hole, thereby facilitating the connection between the fastener and the connecting column.

[0009] In a possible implementation of the present application, the connecting member further comprises a top plate, the top plate being fixedly connected to the connecting post and being disposed on a side of the first electronic device away from the base. By providing the top plate, the force of the fastener can be applied to the top plate.

[0010] In a possible implementation of the present application, the connecting column protrudes from the surface of the top plate, thereby facilitating the connection between the connecting column and other components.

[0011] In a possible implementation of the present application, the shape of the base includes one of a cube, a cuboid, a frustum, a cylinder, or a cone.

[0012] In a possible implementation of the present application, the base and the circuit board are connected by welding, bonding, riveting, pressing, snapping, plugging or threaded connection.

[0013] In a possible implementation of the present application, the circuit board is provided with a positioning hole for fixing the base, and the base is connected to the circuit board through the positioning hole. By providing the positioning hole, the base can be easily fixed.

[0014] In a possible implementation of the present application, an electrical connection point is provided between the first electronic component and the circuit board to achieve electrical connection between the first electronic component and the circuit board; and the base is spaced apart from the electrical connection point.

[0015] In one possible implementation of the present application, a solder layer is provided between the base and the circuit board; the melting point of the solder in the solder layer is lower than the melting point of the electrical connection point; wherein the electrical connection point is a solder point. The provision of the solder layer can adjust the flatness between the base and the circuit board. Simultaneously, the provision of the solder layer can also adjust the height difference between the circuit board and the first electronic device so that the surface of the device substrate facing the circuit board is in the same plane.

[0016] In one possible implementation of the present application, the melting point of the solder in the solder layer can be 10-100°C lower than that of the solder in the solder joint. Specifically, the melting point of the solder in the solder layer can be 10-100°C lower than that of the solder in the solder joint by using solders with different proportions or compositions. By limiting the difference in the melting points of the solder between the solder layer and the solder joint, the solder layer can be formed after the electrical connection point is formed and the internal stress of the device substrate is fully released, thereby achieving a fixed connection between the base and the circuit board and reducing the impact of the internal stress of the device substrate itself on weak points.

[0017] In one possible implementation of the present application, a second electronic device is provided on a side of the first electronic device that is away from the circuit board. Specifically, the second electronic device is provided on a side of the first electronic device that is away from the circuit board, and the second electronic device is fixedly connected to the connecting member via a fastener. Thus, the second electronic device can be provided above the first electronic device, achieving a combined connection between the first and second electronic devices.

[0018] The second electronic device may include a connector, which includes a cable, with one end of the cable near the connector secured to the device substrate. By providing the connector, signals from the first electronic device can be transmitted directly through the connector, rather than through the circuit board, thereby reducing signal loss, signal interference, and power loss.

[0019] In one possible implementation of the present application, a heat sink is provided on a side of the device assembly away from the circuit board, and the heat sink is fixedly connected to the circuit board, thereby preventing damage to the first electronic device during the heat sink assembly process.

[0020] In the second aspect, the present application also provides an electronic device, including the electronic module of each embodiment of the first aspect of the present application. Among them, the electronic device of the present application may be, for example, a mobile terminal, a display terminal, a vehicle intelligent control system, a data center system or an intelligent energy storage device. In addition to the above-mentioned electronic module, the electronic device of the present application may also include a packaging shell. In addition, taking a mobile phone as an example, it may also include components such as a display panel, an earpiece, an antenna, and a camera. Since the structures of various electronic devices are not the same, the composition of various electronic devices will not be repeated here.

[0021] Since the electronic device of the present application includes the electronic module of the first aspect of the present application, based on the structural stability and connection reliability of the electronic module of the first aspect of the present application, the electronic device provided by the present application also has the advantages of structural stability and reliable connection. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of the structure of an electronic module provided in one embodiment of the present application;

[0023] Figure 2 A schematic diagram of the structure of an electronic module provided in one embodiment of the present application;

[0024] Figure 3 A schematic diagram of the structure of an electronic module provided in one embodiment of the present application;

[0025] Figure 4 A schematic structural diagram of an electronic module provided in another embodiment of the present application;

[0026] Figure 5 A schematic structural diagram of an electronic module provided in another embodiment of the present application;

[0027] Figure 6 A schematic structural diagram of a connecting member provided in one embodiment of the present application;

[0028] Figure 7 A schematic structural diagram of an electronic module provided in another embodiment of the present application;

[0029] Figure 8 This is a schematic diagram of the connection structure between the connecting member and the device substrate in one embodiment of the present application;

[0030] Figure 9 This is a schematic diagram of the connection structure between the connecting member and the device substrate in one embodiment of the present application;

[0031] Figure 10 This is a schematic diagram of the connection structure between the device substrate, the connecting member and the circuit board in one embodiment of the present application;

[0032] Figure 11 A schematic structural diagram of an electronic module provided in one embodiment of the present application.

[0033] Reference numerals:

[0034] 1-electronic module; 10-circuit board; 101-positioning hole; 20-first electronic device; 201-device substrate; 202-device assembly;

[0035] 203-electrical connection point; 204-avoidance hole; 30-connecting member; 301-base; 302-connecting column; 303-connecting hole;

[0036] 304 - top plate; 305 - solder layer; 40 - fastener; 50 - second electronic device; 501 - cable. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0038] In electronic devices, after a portion of the electronic components in the electronic module are soldered to the circuit board to achieve electrical connection, they are then fixed with fasteners such as bolts or screws to achieve mechanical connection between the electronic components and the circuit board. In existing assembly structures, fasteners are directly connected between the electronic components and the circuit board to achieve a tight connection between the two. During the mechanical connection process, such as the process of assembling fasteners on the chip, or during the process of plugging, unplugging, or pulling the electronic device, the force generated will be transmitted to the stress-sensitive positions of the chip or electronic device, such as the chip pin solder joints, the unpackaged parts of the chip, the chip ceramic capacitors, etc., causing the chip pin solder joints to crack and the stress-sensitive parts of the electronic device to break. Several specific application scenarios are as follows: 1) In order to reduce power loss, chip direct-out cables and chip direct-out interfaces have become the mainstream of next-generation chips. When assembling chips and / or pulling the cables of devices on the chip surface, the chip's solder joints will be damaged; 2) As the power consumption of electronic devices becomes higher and higher, there are a large number of packaging forms of bare silicon wafers in chips. Since silicon wafers are brittle and sensitive to stress, during the assembly process, when mechanical force is transmitted to the chip, it is easy to cause damage and failure of the silicon wafer; 3) As the power consumption of chips or electronic modules becomes higher and higher, the supply materials of electronic modules will include heat sinks. Since the chip needs to be soldered first and then the heat sink is assembled during the assembly process, this process is also prone to processing defects on the chip. In summary, the existing chip mounting structure is prone to problems such as open circuits, poor contacts, and malfunctions in electronic devices.

[0039] To solve the above technical problems, an embodiment of the present application provides an electronic module. The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification and appended claims of this application, the singular expressions "a", "an", "above", "the", and "this" are intended to also include expressions such as "one or more", unless the context clearly indicates otherwise.

[0040] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0041] Figure 1 This is a structural diagram of an electronic module according to an embodiment of the present application. Figure 2 This is a structural diagram of an electronic module according to an embodiment of the present application. Figure 1 and Figure 2 In one embodiment of the present application, the electronic module 1 includes a circuit board 10 , a first electronic device 20 , a connecting member 30 and a fastener 40 .

[0042] The circuit board 10 may be a printed circuit board. The circuit board 10 is provided with a printed circuit. When the first electronic device 20 is mounted on the circuit board 10, the circuit board 10 can be used to transmit signals of the first electronic device 20.

[0043] The first electronic device 20 may be a chip. Figure 1 and Figure 2 As shown, in one embodiment of the present application, the first electronic device 20 may include a device substrate 201 and a device assembly 202. The device assembly 202 is disposed on a portion of the surface of the device substrate 201, for example, on a portion of the surface of the device substrate 201 away from the circuit board 10. The device substrate 201 may be used to provide support, and the device assembly 202 is the various circuit connection parts of the first electronic device 20, used to implement various signal processing functions.

[0044] When the first electronic device 20 is a chip, the device substrate 201 can be a chip substrate, and the device assembly 202 can be a chip functional component other than the chip substrate. In addition, the first electronic device 20 may also include a power module, a device module, or a system-in-a-package (SIP) module. The device assembly 202 can be electrically connected to the circuit board 10 via the device substrate 201 to achieve electrical signal transmission. An integrated electrical connection structure can be first formed between the device assembly 202 and the device substrate 201, and then the device substrate 201 is electrically connected to the circuit board 10.

[0045] like Figure 2 As shown, in one embodiment of the present application, when electrically connecting the device assembly 202 to the circuit board 10, the region of the device substrate 201 corresponding to the device assembly 202 can be connected to the circuit board 10 by welding to achieve electrical connection. After welding the device substrate 201 and the circuit board 10, an electrical connection point 203, such as a solder joint, can be formed between the two.

[0046] Figure 3 This is a schematic diagram of the structure of an electronic module according to another embodiment of the present application. Figure 3 As shown, in one embodiment of the present application, when the device assembly 202 is electrically connected to the circuit board 10, the area of ​​the device substrate 201 corresponding to the device assembly 202 and the circuit board 10 can be fixedly connected by crimping or plugging, and a metal pressing block or metal pin can be used to connect the device substrate 201 and the circuit board 10 during crimping or plugging.

[0047] In addition, the connection between the device substrate 201 and the circuit board 10 may also be a fixed connection method such as a clamping connection, a riveting connection or a threaded connection.

[0048] Continue to refer to Figure 1 In one embodiment of the present application, one or more avoidance holes 204 may be provided in the remaining area of ​​the device substrate 201, excluding the area where the device assembly 202 is provided. The number of avoidance holes 204 may be one, two, three, four, five, or more, and may be specifically set according to the size of the first electronic device 20. Furthermore, the avoidance hole 204 may be in the shape of a cylindrical hole or a square column. To facilitate processing, in one embodiment of the present application, the avoidance hole 204 may be in the shape of a cylindrical hole.

[0049] like Figures 1 to 3As shown, the avoidance hole 204 can be used to pass the fastener 40. Within the avoidance hole 204 and at any cross-section of the avoidance hole 204, the circumferential dimension of the fastener 40 is smaller than the circumferential dimension of the avoidance hole 204. In this way, a certain gap can exist between the outer wall of the fastener 40 and the inner wall of the avoidance hole 204. For example, the radial dimension of the fastener 40 is smaller than the radial dimension of the avoidance hole 204 to ensure that there is a gap between the fastener 40 and the avoidance hole 204. Therefore, when the fastener 40 passes through the avoidance hole 204, the fastener 40 will not apply a horizontal force (i.e., in the direction of the surface of the device substrate 201) to the first electronic device 20, thereby preventing the fastener 40 from damaging the electrical connection point between the first electronic device 20 and the circuit board 10. Among them, after the fastener 40 passes through the avoidance hole 204, it is fixedly connected to the circuit board 10 through the connecting member 30. The fastener 40 can be, for example, a screw, a bolt, or a pin.

[0050] Continue to refer to Figure 2 and Figure 3 In one embodiment of the present application, the connecting member 30 may include a base 301, which is disposed between the circuit board 10 and the first electronic device 20 and is fixedly connected to the circuit board 10. Because an electrical connection point 203 is formed when the circuit board 10 and the device assembly 202 of the first electronic device 20 are electrically connected, there is a certain height difference between the circuit board 10 and the first electronic device 20, and they are not tightly fitted. By providing the base 301, the first electronic device 20 can maintain a high degree of flatness after being tightened. It is understood that the size of the base 301 can be larger than the radial size of the avoidance hole 204 to achieve a leveling support function.

[0051] When fastening with the fastener 40, the fastener 40 passes through the avoidance hole 204 from the side of the first electronic device 20 away from the circuit board 10 and is fixedly connected to the connecting member 30, so that the fastening force is applied to the circuit board 10 through the connecting member 30, thereby achieving a transfer of the fastening force. The base 301 is spaced apart from the electrical connection point 203 to prevent the force applied by the base 301 from being transferred to the electrical connection point 203.

[0052] Continue to refer to Figure 2 and Figure 3 In one embodiment of the present application, the base 301 may be in the shape of a cube or a rectangular parallelepiped. When the base 301 is in the shape of a rectangular parallelepiped or a cube, the base 301 may be fixed to the circuit board 10 by welding or riveting.

[0053] Figure 4 This is a structural diagram of an electronic module according to another embodiment of the present application. Figure 4As shown, in one embodiment of the present application, the shape of the base 301 can also be a truncated cone. When the shape of the base 301 is a truncated cone, the radial dimension of the truncated cone gradually decreases from the direction of the device substrate 201 to the circuit board 10. At this time, a positioning hole 101 for inserting the base 301 can be provided on the circuit board 10, so that the base 301 can be fixed by plugging, riveting or clamping. Among them, the truncated cone-shaped base 301 can be provided with a flange on the side close to the first electronic device 20 for overlapping and fixing at the positioning hole 101; in addition, the edge of the positioning hole 101 can be provided with a groove that cooperates with the flange of the base, and the flange and the groove can form an interference fit connection to fix the base 301 in the positioning hole 101. Among them, the positioning hole 101 can be a plated hole.

[0054] It is understood that the shape of the base 301 is not limited to Figure 3 and Figure 4 In addition to the structural shape shown, it can also be a cylinder, prism, cone or pyramid. The connection method between the base 301 and the circuit board 10 includes but is not limited to welding, bonding, riveting, plugging or threading.

[0055] In addition, it should be noted that the connection method between the base 301 and the circuit board 10, and the connection method between the device substrate 201 and the circuit board 10 can be the same connection method, or different connection methods can be used. In one embodiment of the present application, Figure 4 As shown, the base 301 can be fixed on the circuit board 10 by plugging. At this time, the connection between the device substrate 201 and the circuit board 10 can be fixed by welding. In another embodiment of the present application, as shown in FIG. Figure 5 As shown, the connection between the device substrate 201 and the circuit board 10 can be fixed by means of crimping, riveting or clamping.

[0056] Continue to refer to Figure 1-Figure 5 In one embodiment of the present application, the connecting member 30 may further include a connecting column 302, which is perpendicular to the base 301 and extends from the surface of the base 301 along the avoidance hole 204 in a direction away from the base 301. A gap is left between the outer wall of the connecting column 302 and the inner wall of the avoidance hole 204 to prevent the connecting column 302 from exerting a force on the device substrate 201. When fastening with the fastener 40, the fastener 40 can be tightly connected to the connecting column 302, which can improve the connection strength and connection reliability of the fastener 40. In addition, the connecting column 40 can also play a guiding role to prevent the fastener 40 from damaging the device substrate 201 during the screwing process.

[0057] The height of the connecting post 302 in the direction from the base 301 to the first electronic device 20 can be less than the height of the avoidance hole 204, can be equal to the height of the avoidance hole 204, or can be greater than the height of the avoidance hole 204. When the height of the connecting post 302 is greater than the height of the avoidance hole 204, the fastener 40 can be prevented from exerting a force on the device substrate 201 in the height direction of the avoidance hole 204, further protecting the device substrate 201 from damage.

[0058] Figure 6 This is a structural diagram of a connecting member 30 of the present application, and reference is made to Figure 2 and Figure 6 In one embodiment of the present application, the connecting column 302 may be provided with a connecting hole 303 , and the fastener 40 may be fixedly connected to the connecting column 302 through the connecting hole 303 .

[0059] Figure 7 This is a structural diagram of an electronic module according to another embodiment of the present application. Figure 8 and Figure 9 They are schematic diagrams of the connection structure between the connecting member 30 and the device substrate 201 in one embodiment of the present application, Figure 10 Schematic diagram of the connection structure between the device substrate 201, the connecting member 30 and the circuit board 10 in one embodiment of the present application. Figure 7-10 As shown, in one embodiment of the present application, the connecting member 30 may further include a top plate 304, wherein the top plate 304 is fixedly connected to the connecting post 302 and is disposed on a side of the first electronic device 20 away from the base 301. During installation, after the connecting post 302 passes through the avoidance hole 204, the top plate 304 and the connecting post 302 are fixed. At this time, the device substrate 201 is disposed between the top plate 304 and the base 301. In this way, after being fixed with the fastener 40, the top plate 304 can be used to protect the device substrate 201, thereby preventing the fastener 40 from exerting force on the device substrate 201 in the height direction of the avoidance hole 204.

[0060] When the connecting posts 302 do not extend beyond the top plate 304, the connecting member 30 may be an I-shaped structure. When the connecting posts 302 protrude beyond the top plate 304, the connecting member 30 may be a U-shaped structure. It is understood that the connecting member 30 with the top plate 304 may be a welded or crimped type.

[0061] Figure 11 This is a schematic diagram of the structure of an electronic module in another embodiment of the present application. Figure 11 As shown, in one embodiment of the present application, when the electrical connection point 203 between the device substrate 201 and the circuit board 10 is a solder point, a fixed connection can be achieved between the base 301 and the circuit board 10 by providing a solder layer 305 .

[0062] Specifically, the method for forming the solder layer 305 between the base 301 and the circuit board 10 may include the following steps: placing solder, such as solder paste, between the base 301 of the connecting member 30 and the circuit board 10, wherein the solder paste has a lower melting point than the melting point of the solder between the device substrate 201 and the circuit board 10 corresponding to the device assembly portion; and then performing reflow soldering to simultaneously solder the device substrate 201 and the circuit board 10. During the reflow soldering process, the temperature zones and temperature settings of the reflow soldering curve are precisely controlled to ensure that the soldering of the connecting member 30 and the circuit board 10 is performed after the soldering between the device substrate 201 and the circuit board 10 is completed and after the cooling phase begins, thereby forming the solder layer 305 between the base 301 and the circuit board 10.

[0063] In one embodiment of the present application, the melting point of the solder of the solder layer 305 is 15-25°C lower than the melting point of the solder of the solder joint serving as the electrical connection point 203. By controlling the difference in the melting points of the solder between the solder layer 305 and the solder joint, after a stable solder joint is formed between the device substrate 201 and the circuit board 10, the stress generated by the thermal deformation of the circuit board 10 can be fully released, and then the solder layer 305 can be formed between the connecting member 30 and the circuit board 10. In this way, the internal stress of the circuit board 10 can be minimized, preventing damage to the solder joint caused by the internal stress. In addition, by first performing the soldering between the device substrate 201 and the circuit board 10 and then performing the soldering between the connecting member 30 and the circuit board 10, the solder between the connecting member 30 and the circuit board 10 can be fully flowed to automatically adjust the flatness of the device substrate 201.

[0064] Refer to Figure 1-Figure 7 as well as Figure 11 In one embodiment of the present application, a second electronic device 50 may be further provided on the side of the first electronic device 20 away from the circuit board 10, that is, the second electronic device 50 is provided on the side of the first electronic device 20 away from the circuit board 10, and the second electronic device 50 may also be fixedly connected to the connecting member 30 via a fastener 40.

[0065] As an example, in one embodiment of the present application, the second electronic device 50 may be a connector that can be electrically connected to the first electronic device 20. Furthermore, the connector may include a cable 501 or a plug interface that is used to connect to an external device, thereby routing some signals from the first electronic device 20 through the connector, shortening the transmission path. The cable 501 or the plug interface may have a top-out structure or a side-out structure, for example.

[0066] Continue to refer to Figure 1-Figure 7 as well as Figure 10In one embodiment of the present application, when the connector includes a cable 501, the end of the cable 501 close to the connector is fixed to the device substrate 201. For example, the cable 501 can be fixed with a fixing clip or fixing tape to reduce the force exerted by the cable 501 on the connector and the first electronic device 20, thereby protecting the weak points of the first electronic device 20 from damage.

[0067] In addition to the above structure, in one embodiment of the present application, a heat sink may be provided on the side of the device assembly away from the circuit board, and the heat sink may be fixedly connected to the circuit board. When fixing the heat sink to the circuit board, the same fixing method as the first electronic device may be used.

[0068] Therefore, the electronic module provided by the embodiment of the present application can effectively solve the problem of easy damage to the weak stress points in the electronic module. At the same time, it provides a feasible electrical connection protection solution for the future mainstream chip direct-out cable technology, which can effectively improve the reliability of solder joint connections in multiple application modules such as chip direct-out cables, SIP modules, and chip packages with bare silicon chips, thereby improving the reliability of electronic devices. Especially for the packaging of bare silicon chips, the technical solution provided by the embodiment of the present application will not cause damage to the silicon chip and does not take up additional installation space, which is in line with the trend of high-density miniaturization. In addition, the electronic module provided by the present application has no specific requirements for the installation order of fasteners and can be applied to different processing processes. In addition, the installation structure of the electronic module of the embodiment of the present application can also achieve support and positioning of the chip heat sink with bare silicon chips.

[0069] The above are only specific embodiments of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An electronic module, characterized in that: comprising a circuit board, a first electronic device, a connecting member and a fastener; The first electronic device includes a device substrate and a device assembly provided on a portion of the surface of the device substrate, the device assembly is electrically connected to the circuit board via the device substrate, and the device substrate is provided with an avoidance hole in an area other than where the device assembly is provided; The connecting member includes a base, which is provided between the circuit board and the first electronic component and is fixedly connected to the circuit board; The fastener passes through the avoidance hole from a side of the first electronic component away from the circuit board and is fixedly connected to the connecting member; in the avoidance hole, there is a gap between the outer wall of the fastener and the inner wall of the avoidance hole; An electrical connection point is provided between the first electronic device and the circuit board to achieve electrical connection between the first electronic device and the circuit board; the base is spaced apart from the electrical connection point; A solder layer is provided between the base and the circuit board, and the electrical connection points are solder points; The melting point of the solder of the solder layer is 10-100° C. lower than the melting point of the solder of the solder point.

2. The electronic module according to claim 1, wherein: The connecting member further includes a connecting column, which is perpendicular to the base and extends from the base along the avoidance hole in a direction away from the base.

3. The electronic module according to claim 2, characterized in that In a direction from the base to the first electronic component, the height of the connecting column is greater than the height of the avoidance hole.

4. The electronic module according to claim 2, characterized in that The connecting column is provided with a connecting hole, and the fastener is fixedly connected to the connecting column through the connecting hole.

5. The electronic module according to claim 2, characterized in that The connecting member further includes a top plate, the top plate is fixedly connected to the connecting column, and the top plate is arranged on a side of the first electronic component away from the base.

6. The electronic module according to claim 5, characterized in that The connecting column protrudes from the surface of the top plate.

7. The electronic module according to any one of claims 1 to 6, characterized in that: The shape of the base includes one of a cube, a cuboid, a frustum, a cylinder or a cone.

8. The electronic module according to any one of claims 1 to 6, characterized in that: The connection method between the base and the circuit board includes welding, bonding, riveting, pressing, clamping, plugging or threaded connection.

9. The electronic module according to any one of claims 1 to 6, characterized in that: A second electronic component is provided on a side of the first electronic component away from the circuit board, and the second electronic component is fixedly connected to the connecting member via the fastener.

10. The electronic module according to claim 9, characterized in that The second electronic device includes a connector. The connector includes a cable. One end of the cable close to the connector is fixed to the device substrate.

11. The electronic module according to any one of claims 1 to 6, characterized in that: A heat sink is provided on a side of the device assembly away from the circuit board, and the heat sink is fixedly connected to the circuit board.

12. An electronic device, characterized in that: The electronic module comprises the electronic module according to any one of claims 1 to 11.

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