Electronic device and processing method thereof

Abstract

The present application discloses an electronic device and a processing method thereof, the method comprising: providing a printed circuit board, a first surface of which is provided with a plurality of first grooves, and a first soldering portion of the printed circuit board is exposed from the first grooves; laying solder at the bottom of the first grooves; transferring a plurality of soldering parts into the first grooves and performing a soldering process; wherein, one first groove accommodates one soldering part, and a second soldering part is provided on the side of the soldering part facing the first soldering part, the length of the second soldering part being greater than or equal to 20% and less than or equal to 80% of the length of the first groove; and / or, the width of the second soldering part being greater than or equal to 20% and less than or equal to 80% of the width of the first groove; and / or, the height of the second soldering part being greater than or equal to 20% and less than or equal to 80% of the height of the first groove. In the above manner, the present application can improve the accuracy of the soldering parts falling into the soldering position and the efficiency of the transfer process.

Description

Technical Field

[0001] The present application relates to the technical field of electronic device manufacturing, and in particular to an electronic device and a processing method thereof. Background Art

[0002] With the continuous advancement of technology, the functional requirements of electronic products are becoming increasingly higher. During the manufacturing process of circuit boards, it is often necessary to transfer a large number of soldered parts such as chips, wafers, components, and devices onto the circuit boards.

[0003] In the prior art, transfer technology is usually used to place multiple groups of solder parts of the same specifications at the designated soldering positions on the circuit board. For example, electrostatic adsorption, vacuum adsorption, phase change transfer, etc. During the transfer process of the solder parts, due to the frequent occurrence of window position offsets, soldering position errors, excessive solder mask thickness, inconsistent solder mask thickness, etc. during the circuit board manufacturing process, the above situations will cause the solder parts to not fall accurately into the designated grooves, and it is impossible to achieve an accurate and stable transfer process. The existing solution is to individually control the size of the solder parts according to the size differences of the soldering positions, and place and heat the solder parts one by one, which seriously affects the efficiency of the transfer process. Summary of the Invention

[0004] The main technical problem solved by the present application is to provide an electronic device and a processing method thereof, which can effectively improve the accuracy of the welding parts falling into the welding position, and is conducive to improving the efficiency of the welding parts transfer process.

[0005] In order to solve the above technical problems, a technical solution adopted in the present application is: to provide a processing method for an electronic device, comprising: providing a printed circuit board, wherein a first surface of the printed circuit board is provided with a plurality of first grooves, and a plurality of first welding parts of the printed circuit board are respectively exposed from the plurality of first grooves; laying solder at the bottom of the plurality of first grooves; transferring a plurality of welding parts into the plurality of first grooves, and performing welding processing so that the first welding parts are welded and fixed to the second welding parts through the solder; wherein, one of the first grooves accommodates one of the welding parts, and a second welding part is provided on the side of the welding part facing the first welding part, and the length of the second welding part is greater than or equal to 20% of the length of the first groove and less than or equal to 80% of the length of the first groove; and / or, the width of the second welding part is greater than or equal to 20% of the width of the first groove and less than or equal to 80% of the width of the first groove; and / or, the height of the second welding part is greater than or equal to 20% of the height of the first groove and less than or equal to 80% of the height of the first groove.

[0006] Among them, the step of transferring multiple welding parts into the multiple first grooves includes: spreading the multiple welding parts all over the first surface, with the second welding parts of the multiple welding parts facing the first surface; applying a horizontal vibration force to the printed circuit board so that the welding parts fall into the first grooves under the action of the vibration force, and each first groove only accommodates one welding part; removing the excess welding parts that have not fallen into the first groove; detecting whether there is any abnormality in the laying of each first groove; wherein the abnormal laying conditions include no welding part in the first groove, multiple welding parts in the first groove, and the second welding part of the welding part facing away from the first welding part; in response to the existence of a laying abnormality in at least one of the first grooves, the printed circuit board is stored separately; in response to the situation that there is no laying abnormality in all the first grooves, entering the step of performing welding processing so that the first welding part is welded and fixed to the second welding part by the solder.

[0007] The step of removing the excess welding parts that have not fallen into the first groove includes: passing the printed circuit board through the middle of two conveying plates with a certain relative height so that the excess welding parts are pushed away from the first surface by the conveying plates; wherein the relative height of the conveying plates is equal to the sum of the height of the printed circuit board and the height of the welding parts above the first surface.

[0008] Among them, the step of applying a horizontal vibration force to the printed circuit board so that the welding part falls into the first groove under the action of the vibration force includes: applying at least two horizontal vibration forces to the printed circuit board and vibrating them a predetermined number of times respectively so that the welding part falls into the first groove under the action of the vibration force.

[0009] Wherein, after entering the step of performing the soldering process so that the first soldering portion is soldered and fixed to the second soldering portion through the solder, the method further includes: cleaning the first surface of the printed circuit board and the surfaces of all the soldering parts.

[0010] Among them, the step of providing a printed circuit board, wherein the first surface of the printed circuit board is provided with multiple first grooves, and the multiple first welding parts of the printed circuit board are respectively exposed from the multiple first grooves, includes: forming a patterned metal circuit layer on at least one side surface of a substrate; forming an insulating dielectric layer on the surface of the metal circuit layer, and the insulating dielectric layer located on the first surface of the substrate is flush with at least part of the metal circuit layer; lowering the height of the metal circuit layer flush with the insulating dielectric layer so that the insulating dielectric layer and the metal circuit layer located on the first surface form the multiple first grooves; wherein the metal circuit layer exposed from the first groove forms the multiple first welding parts.

[0011] Among them, the step of forming a patterned metal circuit layer on at least one side of the substrate includes: providing a substrate, the substrate including a first surface and a second surface arranged opposite to each other, and the first surface and the second surface are respectively pre-covered with a metal layer; drilling from one side of the first surface to form a plurality of holes, the holes at least passing through the metal layer located on the first surface and the substrate; forming a photosensitive resist film on one side of the first surface and the second surface, and the photosensitive resist film located on the one side of the first surface is provided with a first opening at the position corresponding to the hole, the hole and the part of the metal layer adjacent to the hole are exposed from the first opening; electroplating to form metal pillars in the first opening and the hole; removing all the photosensitive resist films; forming a photosensitive resist film on one side of the first surface and the second surface, and the position corresponding to the metal pillar on each side is covered by the photosensitive resist film, and the remaining at least part of the position is not covered by the photosensitive resist film; removing the metal layer not covered by the photosensitive resist film to form a patterned metal circuit layer; removing the photosensitive resist film.

[0012] Among them, the step of forming an insulating dielectric layer on the surface of the metal circuit layer, and the insulating dielectric layer located on the first surface of the substrate is flush with at least a portion of the metal circuit layer, includes: forming an insulating dielectric layer on the surface of the metal circuit layer, and the insulating dielectric layer covers the metal circuit layer; grinding the insulating dielectric layer until the metal column is exposed from the insulating dielectric layer and the metal column is flush with the insulating dielectric layer.

[0013] Among them, the step of lowering the height of the metal circuit layer flush with the insulating medium layer includes: lowering the height of the metal column by any one of micro-etching, UV laser drilling and ablation, laser milling, and CO2 laser drilling and ablation, and the metal column forms the first welding part.

[0014] The insulating dielectric layer includes any one of epoxy resin, phenolic resin, polyimide, BT, ABF and ceramic-based.

[0015] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide an electronic device, including: a printed circuit board, the printed circuit board includes a substrate and a first surface provided with multiple first grooves, and the multiple first welding parts of the printed circuit board are respectively exposed from the multiple first grooves; multiple welding parts, one first groove accommodates one welding part; wherein, the welding part is provided with a second welding part on the side facing the first welding part, the second welding part is fixedly connected to the first welding part by solder, and the length of the second welding part is greater than or equal to 20% of the length of the first groove and less than or equal to 80% of the length of the first groove; and / or, the width of the second welding part is greater than or equal to 20% of the width of the first groove and less than or equal to 80% of the width of the first groove; and / or, the height of the second welding part is greater than or equal to 20% of the height of the first groove and less than or equal to 80% of the length of the first groove.

[0016] The electronic device further includes: a plurality of holes penetrating the first surface and a second surface opposite to the first surface; and metal pillars located in the plurality of holes and covering a portion of the surface of the substrate.

[0017] Among them, it also includes: an insulating dielectric layer, which is located on the first surface and forms a plurality of first grooves with the side of the metal column close to the first surface, wherein the insulating dielectric layer includes any one of epoxy resin, phenolic resin, polyimide, BT, ABF, and ceramic-based.

[0018] It also includes: a metal circuit layer located on the side of the metal column close to the first surface, with a height smaller than that of the insulating medium layer, and exposed from the plurality of first grooves to form a plurality of first welding portions. Different from the prior art, the beneficial effects of the present application are as follows: the present application provides a method for processing an electronic device, providing a printed circuit board, wherein a first surface of the printed circuit board is provided with a plurality of first grooves, and a plurality of first welding parts of the printed circuit board are respectively exposed from the plurality of first grooves; solder is laid at the bottom of the plurality of first grooves; a plurality of welding parts are transferred into the plurality of first grooves, and welding treatment is performed so that the first welding parts are welded and fixed to the second welding parts through the solder; wherein, one of the first grooves accommodates one of the welding parts, and a second welding part is provided on the side of the welding part facing the first welding part, and the length of the second welding part is greater than or equal to 20% of the length of the first groove and less than or equal to 80% of the length of the first groove; and / or, the width of the second welding part is greater than or equal to 20% of the width of the first groove and less than or equal to 80% of the width of the first groove; and / or, the height of the second welding part is greater than or equal to 20% of the height of the first groove and less than or equal to 80% of the length of the first groove. Through the above method, the size of the welding end is designed according to the length, width and height of the first groove, so that the welding end and the non-welding end of the welded part are differentiated in size. The size differentiation feature can be used to enable the welded part to fall accurately into the first groove during the transfer process; before the welded part is transferred, the size of the welding end is designed in advance according to the size matching of the welding position, which greatly improves the efficiency of the welded part transfer process. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without inventive efforts. Among them:

[0020] Figure 1 This is a flow chart of an embodiment of a method for processing an electronic device according to the present application;

[0021] Figure 2 is a flowchart of an implementation method of step S103;

[0022] Figure 3 is a flowchart of an implementation method of step S101;

[0023] Figure 4 yes Figure 3 A structural diagram of an implementation method of steps S301 to S303;

[0024] Figure 5 This is a flow chart of an implementation method of step S301;

[0025] Figure 6 yes Figure 5 A structural diagram of an implementation method of steps S401 to S408;

[0026] Figure 7 is a flowchart of an implementation method of step S302;

[0027] Figure 8 This is a schematic structural diagram of an electronic device of the present application. DETAILED DESCRIPTION

[0028] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0029] See Figure 1 , Figure 1 1 is a flow chart of an embodiment of a method for processing an electronic device of the present application, the method comprising:

[0030] S101: providing a printed circuit board, wherein a first surface of the printed circuit board is provided with a plurality of first grooves, and a plurality of first welding portions of the printed circuit board are respectively exposed from the plurality of first grooves.

[0031] Specifically, a printed circuit board, also known as a printed circuit board, is one of the supporting bodies of electronic devices and is a carrier for electrical connections of electronic devices. In the processing of electronic devices, it is often involved to transfer chips, wafers, components, devices and other welding parts to the designated welding position of the circuit board. Therefore, it is necessary to open a welding position in the printed circuit board in advance for the welding parts to be transferred and fall into it. The first groove in the above step S101 refers to the welding position in the printed circuit board; the first welding part refers to the metal layer at the bottom of the first groove, and the welding part is welded and fixed to the metal layer by solder; the first surface refers to the welding surface of the printed circuit board, and the opening of the first groove faces this surface. In addition, the specific processing process of the printed circuit board will be described in detail in the subsequent embodiments and will not be described here.

[0032] S102: Laying solder on the bottoms of the plurality of first grooves.

[0033] Specifically, the solder only needs to cover the entire bottom of the first groove, and the height of the solder does not exceed the height of the first groove, effectively ensuring the subsequent welding assembly steps.

[0034] S103: Transferring a plurality of welding parts into a plurality of first grooves, and performing welding processing so that the first welding part is welded and fixed to the second welding part by solder; wherein, one first groove accommodates one welding part, and the second welding part is provided on the side of the welding part facing the first welding part, and the length of the second welding part is greater than or equal to 20% of the length of the first groove and less than or equal to 80% of the length of the first groove; and / or, the width of the second welding part is greater than or equal to 20% of the width of the first groove and less than or equal to 80% of the width of the first groove; and / or, the height of the second welding part is greater than or equal to 20% of the height of the first groove and less than or equal to 80% of the height of the first groove.

[0035] Specifically, each welded part includes a functional main body portion and a welding portion, and the second welding portion in the above step refers to the welding portion of the welded part. When designing the size of the welded part according to the size matching of the first groove, it is only necessary to design and determine the size of the welding portion, and then process the corresponding welded part according to the specified size of the design. The processing method of the welded part can be to form the functional main body portion and the welding portion as one piece through die casting, or to process the functional main body portion and the welding portion separately and then connect them, which is not specifically limited here. In addition, the specific transfer process of the welded part will be described in detail in subsequent embodiments and will not be repeated here.

[0036] Through the above-mentioned embodiment, the size of the welding end is designed according to the length, width and height dimensions of the first groove, so that the welding end and the non-welding end of the welded part are differentiated in size. The size differentiation feature can be used to enable the welded part to fall accurately into the first groove during the transfer process; before the welded part is transferred, the size of the welding end is pre-designed according to the welding position size matching, which greatly improves the efficiency of the welded part transfer process and can realize efficient batch transfer of welded parts.

[0037] See also Figure 2 , Figure 2 This is a flow chart of an embodiment of step S103, specifically introducing the transfer process of the welded parts. The above step S103 includes:

[0038] S201: spreading a plurality of welding pieces over the first surface, with the second welding portions of the plurality of welding pieces facing the first surface.

[0039] Since the number of welds to be transferred is relatively large, it is necessary to adopt mass transfer technology to realize the transfer process of welds. The so-called mass transfer refers to picking up multiple groups of welds of the same specifications from the original storage position with very high spatial accuracy and direction, moving these welds to the predetermined position, while maintaining the relative spatial position and direction of the welds, and then distributing the welds to each welding position at the predetermined position, repeating the above actions many times to realize the transfer of welds of large magnitude. In this embodiment, specifically, the welds are uniformly sprinkled from the weld laying tray at a specified height above the printed circuit board to the welding surface of the printed circuit board. Preferably, the specified height here is 10-2000 microns. Maintain the relative spatial position and direction of the welding end of the weld so that the welding end faces the welding surface.

[0040] In another embodiment, before step S201 , the first surface of the printed circuit board may be cleaned to ensure that the welded parts are not affected by waste slag, residual materials and other substances during the transfer and welding process.

[0041] S202: applying a horizontal vibration force to the printed circuit board so that the soldering parts fall into the first grooves under the action of the vibration force, and each first groove only accommodates one soldering part.

[0042] Specifically, in this embodiment, when the soldering parts in step S201 above cover the entire soldering surface of the printed circuit board, the printed circuit board stops being transported, and a manipulator or clamp is used to clamp both sides of the printed circuit board and apply a vibration force so that each soldering part falls into a corresponding groove. In this embodiment, at least two horizontal vibration forces are applied to the printed circuit board, for example, to achieve vibration in the front-to-back and left-to-right directions of the printed circuit board, and the vibration is applied a predetermined number of times, for example, 2-100 times, so that the soldering parts fall into the first groove under the action of the vibration force. Through the above embodiment, the large-scale transfer process of soldering parts can be efficiently completed using a simple process, effectively improving the efficiency of the transfer process.

[0043] S203: removing excess welding parts that do not fall into the first groove.

[0044] Specifically, in this embodiment, the printed circuit board is passed through the middle of two conveyor plates of a certain relative height so that excess welded parts are pushed away from the first surface by the conveyor plates; wherein the relative height of the conveyor plates is equal to the sum of the height of the printed circuit board and the height of the welded parts above the first surface. In other words, the two conveyor plates act as height limiters, and the height between the conveyor plates only allows the circuit board and one welded part that falls into the first groove to pass through. In addition, a welded part carrier tray is provided below the transmission plate, and excess welded parts that are pushed away from the first surface fall into the carrier tray through the gap between the conveyor plates. Through the above embodiment, the height restriction can effectively remove excess welded parts, ensuring that there is only one welded part in the first groove, while also providing technical support for subsequent inspection and welding processes.

[0045] S204: Detecting whether there is any abnormality in the laying of each first groove; wherein the abnormality in the laying includes no welding part in the first groove, multiple welding parts in the first groove, and the second welding part of the welding part is away from the first welding part.

[0046] Specifically, according to the originally designed circuit board diagram, all first grooves on the printed circuit board are scanned by an optical scanning device to check whether there is any abnormality in the placement of the welding parts at each welding position.

[0047] S205: In response to at least one first groove having a laying abnormality, the printed circuit board is stored separately; in response to all first grooves having no laying abnormality, a step of performing a welding process to fix the first welding portion to the second welding portion by soldering.

[0048] Specifically, in this embodiment, the selected solder type is heated in combination with its melting point, and the solder melts to connect the welding end of the welding piece and the first welding portion at the bottom of the first groove.

[0049] In another embodiment, the above-mentioned step S205 also includes cleaning the first surface of the printed circuit board and the surfaces of all welding parts, which can ensure the cleanliness of the prepared printed circuit board and provide protection for the subsequent processing of the electronic device, so that the subsequent process will not be affected by substances such as solder waste and residue.

[0050] Through the above implementation, a large number of welding parts transfer processes are realized by utilizing the matching design of welding parts and welding positions and the mass transfer technology, which effectively improves the transfer efficiency and saves time costs.

[0051] See also Figure 3 and Figure 4 , Figure 3 is a flow chart of an implementation method of step S101. Figure 4 yes Figure 3The structural diagram of an embodiment of step S301 to step S303 in FIG1 mainly introduces the processing process of the printed circuit board in detail. The above step S101 includes:

[0052] S301 : forming a patterned metal circuit layer 202 on at least one surface of the substrate 10 .

[0053] Specifically, see Figure 4 (a) A substrate 10 coated with copper on both sides is provided. A patterned metal circuit layer 202 is formed through an etching process. The pattern here refers to the originally designed circuit pattern. The specific formation process of metal circuit layer 202 will be described in detail in subsequent embodiments and is not detailed here.

[0054] S302 : forming an insulating dielectric layer 30 on the surface of the metal circuit layer 202 , wherein the insulating dielectric layer 30 located on the first surface 101 of the substrate 10 is flush with at least a portion of the metal circuit layer 202 .

[0055] See also Figure 4 (b) Here, the use of insulating dielectric layer 30 material instead of the solder resist ink used in the prior art can effectively avoid the problem of ink window offset causing the soldering area to decrease. The specific process corresponding to this step will be described in detail in the subsequent embodiments.

[0056] S303: Lowering the height of the metal circuit layer 202 flush with the insulating dielectric layer 30 so that the insulating dielectric layer 30 and the metal circuit layer 202 located on the first surface 101 form a plurality of first grooves 103; wherein the metal circuit layer 202 exposed from the first grooves 103 forms a plurality of first welding portions 201.

[0057] Specifically, see Figure 4 (c) In this embodiment, the height of the metal circuit layer 202 can be lowered by micro-etching, UV laser drilling and ablation, laser milling, or CO2 laser drilling and ablation, thereby forming a plurality of first welding portions 201 in the metal circuit layer 202. This embodiment allows for directionally controlling the height difference between the surface of the insulating dielectric layer 30 and the first welding portions 201 at the welding locations, effectively controlling the depth of the first grooves 103.

[0058] Through the above implementation method, a printed circuit board suitable for mass transfer scenarios can be processed, providing technical support for the transfer process of welded parts.

[0059] In this implementation, see Figure 5 and Figure 6 , Figure 5 is a flow chart of an implementation method of step S301. Figure 6 yes Figure 5The structural diagram of an embodiment of step S401 to step S408 in the figure specifically introduces the processing process of the metal circuit layer. The above step S301 includes:

[0060] S401 : providing a substrate 10 , wherein the substrate 10 comprises a first surface 102 and a second surface 104 disposed opposite to each other, and the first surface 102 and the second surface 104 are respectively pre-covered with a metal layer 20 .

[0061] Specifically, see Figure 6 (a) The metal layer 20 here may be a copper layer, and the substrate 10 refers to a dielectric layer. Pre-processing a substrate 10 with copper layers on both sides can provide a basis for subsequent processing.

[0062] S402 : performing a drilling process from one side of the first surface 102 to form a plurality of holes 40 . The holes 40 at least penetrate the metal layer 20 and the substrate 10 located on the first surface 102 .

[0063] Specifically, see Figure 6 (b) Laser drilling is used to create a hole 40 penetrating one side of the metal layer 20 and the substrate 10. The hole 40 here refers to a micro blind via or a through-hole. After drilling, desmear treatment is performed to remove excess material and waste. The hole is then treated with a conductive material, either by copper plating or black hole treatment, to provide technical support for subsequent electroplating steps.

[0064] S403: A photosensitive resist film 50 is formed on one side of the first surface 102 and the second surface 104, and a first opening 501 is provided at a position of the photosensitive resist film 50 corresponding to the hole 40 on the first surface 102 side, and the hole 40 and a portion of the metal layer 20 adjacent to the hole 40 are exposed from the first opening 501.

[0065] Specifically, see Figure 6 (c) The photoresist film 50 is a polymer compound that, when exposed to a specific light source, undergoes a polymerization reaction to form a stable substance that adheres to the board surface, thereby preventing electroplating. Based on the circuit design, the photoresist film 50 is attached to the metal layer 20. First openings 501 are defined in the photoresist film 50 at locations corresponding to the holes 40. The length of each first opening 501 is greater than that of the hole 40. This step provides technical support for subsequently increasing the height of the metal layer 20.

[0066] S404 : forming a metal pillar 401 by electroplating in the first opening 501 and the hole 40 .

[0067] Specifically, see Figure 6(d) The surface of the metal pillar 401 is flush with the surface of the photoresist film 50 . This step can effectively increase the height of the metal layer 20 .

[0068] S405: removing all the photoresist films 50.

[0069] For details, please refer to Figure 6 (e).

[0070] S406 : forming a photoresist film 50 on one side of the first surface 102 and the second surface 104 , and the positions corresponding to the metal pillars on each side are covered by the photoresist film 50 , while at least part of the remaining positions are not covered by the photoresist film 50 .

[0071] Specifically, see Figure 6 (f) The photoresist film 50 is selectively provided according to the welding position. The photoresist film 50 can be formed only on the first surface 102 or the second surface 104. The provision of the photoresist film 50 is also based on the pre-designed circuit diagram.

[0072] S407 : removing the metal layer 20 not covered by the photoresist film 50 to form a patterned metal circuit layer 202 .

[0073] Specifically, see Figure 6 (g) The metal layer 20 is corroded by an etching process. The portion of the metal layer 20 protected by the photoresist film 50 is not corroded, so the pattern of the metal circuit layer 202 finally formed is completely consistent with the circuit diagram.

[0074] S408: removing the photoresist film 50.

[0075] For details, please refer to Figure 6 (h).

[0076] Through the above implementation, a printed circuit board that meets circuit requirements can be processed, and the thickness of the metal circuit layer corresponding to the welding position can be effectively increased, providing a guarantee for the subsequent directional control of the height of the welding position.

[0077] See also Figure 7 , Figure 7 1 is a flow chart of an embodiment of step S302. The above step S302 specifically includes:

[0078] S501: forming an insulating dielectric layer on a surface of the metal circuit layer, wherein the insulating dielectric layer covers the metal circuit layer.

[0079] Specifically, in this embodiment, a lamination process is used to coat the metal circuit layer with an insulating dielectric layer. The insulating dielectric layer mentioned herein can include any of epoxy resins, phenolic resins, polyimide resins, BT resins, ABF resins, and ceramic-based resins. Replacing the solder mask ink used in prior art with an insulating dielectric material effectively avoids the problem of ink window offset, which reduces the soldering area.

[0080] S502: Grinding the insulating dielectric layer until the metal pillar is exposed from the insulating dielectric layer and the metal pillar is flush with the insulating dielectric layer.

[0081] Specifically, the surface of the insulating dielectric layer may be ground by scraping, brushing, laser ablation, ion cutting, ion polishing, water jet, or the like.

[0082] Through the above-mentioned implementation, the use of insulating dielectric layer material to replace the solder mask ink used in the prior art can effectively avoid the problem of ink window offset causing the welding area to become smaller, and at the same time can directionally control the height of the metal column, providing technical support for the batch transfer welding process.

[0083] The electronic device formed by the above steps in this application will be further described from the structural aspect below.

[0084] See also Figure 8 , Figure 81 is a schematic diagram of the structure of an electronic device of the present application. The electronic device 100 includes: a printed circuit board 105 and a plurality of welding parts 107. The printed circuit board 105 includes a substrate 10 and a first surface 102 provided with a plurality of first grooves 103, and a plurality of first welding portions 201 of the printed circuit board 105 are exposed from the plurality of first grooves 103. In addition, each first groove 103 accommodates a welding member 107. The welding member 107 is provided with a second welding portion 1071 on the side facing the first welding portion 201. The second welding portion 1071 is fixedly connected to the first welding portion 201 by solder, and the length of the second welding portion 1071 is greater than or equal to 20% and less than or equal to 80% of the length L of the first groove 103; and / or the width B of the second welding portion 1071 is greater than or equal to 20% and less than or equal to 80% of the width B of the first groove 103; and / or the height of the second welding portion 1071 is greater than or equal to 20% and less than or equal to 80% of the height H of the first groove 103. Through the above embodiment, the size of the weldment 107 is designed according to the corresponding dimensions of the length L, width B, and height H of the first groove 103, so that the second welding portion 1071 and the rest of the weldment 107 are differentiated in size. The size differentiation feature enables the weldment 107 to accurately fall into the first groove 103 during the transfer process, thereby improving the accuracy and precision of the transfer process; before the weldment 107 is transferred, the size of the weldment 107 is pre-designed according to the welding position size matching, thereby greatly improving the efficiency of the transfer process of the weldment 107 and enabling efficient batch and large-scale transfer.

[0085] Please continue reading Figure 8 The electronic device 100 further includes a plurality of holes 40 extending through the first surface 102 and the second surface 104 opposite the first surface 102. The holes 40 are micro blind vias or through-holes, which can be formed by laser drilling. Correspondingly, a plurality of metal pillars 401 are disposed within the holes 40. These metal pillars 401 are in the shape of an "I" (Chinese character) and are formed by electroplating, covering a portion of the surface of the substrate 10. The above-described embodiment effectively increases the height of the soldering position, providing technical support for the subsequent placement of the metal circuit layer 202.

[0086] In this implementation, please continue to refer to Figure 8The electronic device 100 further includes an insulating dielectric layer 30 located on the first surface 102, and a plurality of first grooves 103 are formed on the side of the metal pillar 401 close to the first surface 102, wherein the insulating dielectric layer 30 includes any one of epoxy resin, phenolic resin, polyimide, BT, ABF, and ceramic matrix. Using insulating dielectric materials to replace the solder mask ink used in the prior art can effectively avoid the problem of ink window offset causing the soldering area to decrease. In another embodiment, please continue to refer to Figure 8 The electronic device 100 further includes a metal circuit layer 202, which is located on the side of the metal pillar 401 close to the first surface 102. The metal circuit layer 202 has a height (not shown) less than the height of the insulating dielectric layer 30 (not shown), and the height difference formed by the two is the height H of the first groove 103. The metal circuit layer 202 is exposed from the multiple first grooves 103 to form multiple first welding portions 201. Through the above embodiment, a printed circuit board suitable for mass transfer scenarios can be processed, providing technical support for the subsequent transfer process of the welded parts. In addition, the pattern formed by the metal circuit layer 202 is consistent with the pre-designed circuit pattern, which can ensure that the processed printed circuit board meets the requirements of the circuit design.

[0087] The above description is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A method for processing an electronic device, characterized in that: include: A printed circuit board is provided, wherein a first surface of the printed circuit board is provided with a plurality of first grooves, and a plurality of first welding portions of the printed circuit board are respectively exposed from the plurality of first grooves; Laying solder on the bottoms of the plurality of first grooves; Transferring a plurality of welding parts into the plurality of first grooves and performing welding processing so that the first welding parts are welded and fixed to the second welding parts by the solder; wherein, one of the first grooves accommodates one of the welding parts, and the welding part is provided with a second welding part on a side facing the first welding part, and the length of the second welding part is greater than or equal to 20% and less than or equal to 80% of the length of the first groove; and / or, the width of the second welding part is greater than or equal to 20% and less than or equal to 80% of the width of the first groove; and / or, the height of the second welding part is greater than or equal to 20% and less than or equal to 80% of the height of the first groove; The step of providing a printed circuit board, wherein a first surface of the printed circuit board is provided with a plurality of first grooves, and a plurality of first welding portions of the printed circuit board are exposed from the plurality of first grooves respectively, comprises: forming a patterned metal circuit layer on at least one surface of the substrate; forming an insulating dielectric layer on the surface of the metal circuit layer, wherein the insulating dielectric layer located on the first surface of the substrate is flush with at least a portion of the metal circuit layer; The height of the metal circuit layer flush with the insulating dielectric layer is lowered so that the insulating dielectric layer and the metal circuit layer located on the first surface form the multiple first grooves; wherein the metal circuit layer exposed from the first grooves forms the multiple first welding parts.

2. The processing method according to claim 1, characterized in that: The step of transferring the plurality of welding parts into the plurality of first grooves comprises: Spreading the plurality of welding pieces all over the first surface, with the second welding portions of the plurality of welding pieces facing the first surface; Applying a horizontal vibration force to the printed circuit board so that the welding parts fall into the first grooves under the action of the vibration force, and each first groove only accommodates one welding part; removing excess welding parts that do not fall into the first groove; Detecting whether each of the first grooves has any abnormal laying conditions; wherein the abnormal laying conditions include the absence of the welding component in the first groove, the presence of multiple welding components in the first groove, and the second welding portion of the welding component facing away from the first welding portion; In response to the presence of laying abnormality in at least one of the first grooves, the printed circuit board is stored separately; in response to the presence of no laying abnormality in all of the first grooves, the step of performing welding processing to fix the first welding portion to the second welding portion through the solder is entered.

3. The processing method according to claim 2, characterized in that: The step of removing the excess welded parts that do not fall into the first groove comprises: The printed circuit board is passed through the middle of two conveying plates with a certain relative height so that the excess soldering parts are pushed away from the first surface by the conveying plates; wherein the relative height of the conveying plates is equal to the sum of the height of the printed circuit board and the height of the soldering parts above the first surface.

4. The processing method according to claim 2, characterized in that: The step of applying a horizontal vibration force to the printed circuit board so that the welding part falls into the first groove under the action of the vibration force includes: At least two vibration forces in horizontal directions are applied to the printed circuit board, and the vibrations are respectively applied for a predetermined number of times, so that the welding part falls into the first groove under the action of the vibration forces.

5. The processing method according to claim 2, characterized in that: After the step of performing the welding process so that the first welding portion is welded and fixed to the second welding portion by the solder, the method includes: The first surface of the printed circuit board and the surfaces of all the welding parts are cleaned.

6. The processing method according to claim 1, characterized in that: The step of forming a patterned metal circuit layer on at least one surface of the substrate comprises: Providing the substrate, wherein the substrate comprises the first surface and the second surface disposed opposite to each other, and the first surface and the second surface are respectively pre-covered with a metal layer; Performing drilling processing from one side of the first surface to form a plurality of holes, wherein the holes at least penetrate the metal layer located on the first surface and the substrate; forming a photosensitive resist film on one side of the first surface and the second surface, and providing a first opening on the photosensitive resist film on the first surface at a position corresponding to the hole, wherein the hole and a portion of the metal layer adjacent to the hole are exposed through the first opening; Electroplating to form metal pillars in the first opening and the hole; removing all of the photoresist films; forming a photosensitive resist film on one side of the first surface and the second surface, wherein the position corresponding to the metal pillar on each side is covered by the photosensitive resist film, and at least part of the remaining position is not covered by the photosensitive resist film; removing the metal layer not covered by the photoresist film to form the patterned metal circuit layer; The photoresist film is removed.

7. The processing method according to claim 6, characterized in that: The step of forming the insulating dielectric layer on the surface of the metal circuit layer, wherein the insulating dielectric layer located on the first surface of the substrate is flush with at least a portion of the metal circuit layer, comprises: forming the insulating dielectric layer on the surface of the metal circuit layer, wherein the insulating dielectric layer covers the metal circuit layer; The insulating dielectric layer is ground until the metal pillar is exposed from the insulating dielectric layer and the metal pillar is flush with the insulating dielectric layer.

8. The processing method according to claim 6, characterized in that: The step of lowering the height of the metal circuit layer flush with the insulating dielectric layer comprises: The height of the metal column is reduced by any one of micro-etching, UV laser drilling and ablation, laser milling, and CO2 laser drilling and ablation, and the metal column forms the first welding portion.

9. The processing method according to claim 7, characterized in that: The insulating dielectric layer includes any one of epoxy resin, phenolic resin, polyimide, BT, ABF, and ceramic-based.

10. An electronic device, characterized in that: include: A printed circuit board, the printed circuit board comprising a substrate and a first surface provided with a plurality of first grooves, wherein a plurality of first welding portions of the printed circuit board are respectively exposed from the plurality of first grooves; Multiple welding parts, each first groove accommodates one welding part; wherein the welding part is provided with a second welding part on the side facing the first welding part, the second welding part is fixedly connected to the first welding part by solder, and the length of the second welding part is greater than or equal to 20% of the length of the first groove and less than or equal to 80% of the length of the first groove; and / or, the width of the second welding part is greater than or equal to 20% of the width of the first groove and less than or equal to 80% of the width of the first groove; and / or, the height of the second welding part is greater than or equal to 20% of the height of the first groove and less than or equal to 80% of the length of the first groove; a plurality of holes extending through the first surface and a second surface opposite to the first surface; The metal pillars are located in the plurality of holes and cover a portion of the surface of the substrate; an insulating dielectric layer, located on the first surface, and forming a plurality of first grooves with the metal pillar on a side close to the first surface; The metal circuit layer is located on a side of the metal column close to the first surface, has a height smaller than that of the insulating medium layer, and is exposed from the first grooves to form the first welding portions.

11. The electronic device according to claim 10, wherein: The insulating dielectric layer includes any one of epoxy resin, phenolic resin, polyimide, BT, ABF, and ceramic-based.

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