A high-fidelity test interface device and a semiconductor test equipment

Abstract

The present application relates to a high-fidelity test interface device and a semiconductor test equipment, comprising: a test head for testing semiconductor devices through a test controller; a device-specific adapter including a plurality of slots for connecting semiconductor devices; a test motherboard provided with coaxial cables connecting the test head and the device-specific adapter to transmit test signals to the device-specific adapter; and a protocol processing board card pluggably connected between the test motherboard and the device-specific adapter to transmit test signals to the device-specific adapter. The high-fidelity test interface device of the present application introduces a protocol processing board card to adapt to the signal transmission requirements of high-speed chips; at the same time, due to the flexible replaceability of the protocol processing board card, different types of protocol processing board cards can be developed for different customers, so as to adapt to various customization requirements.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor test equipment, and particularly relates to a high-fidelity test interface device and a semiconductor test equipment. Background Art

[0002] Different semiconductor test equipment corresponds to different high-fidelity test interface solutions. For example, the test equipment for circuit probing test in the wafer stage corresponds to the wafer high-fidelity test interface solution, while the existing mainstream test equipment for semiconductor finished product test corresponds to the SBC-TYPE HiFIX solution, that is, the DSA-MB-TH connection solution.

[0003] In the related art, in the existing high-fidelity test interface solution of the SBC mode, data is transmitted between the test head and the device-specific adapter through the coaxial cable connector in the test motherboard. The transmission rate is restricted by the performance of the coaxial cable connector and cannot meet the increasing demand for high-speed signal transmission of the device under test. Summary of the Invention

[0004] Embodiments of this application provide a high-fidelity test interface device and a semiconductor test equipment to solve the problem in the existing HiFIX solution of the SBC mode in the related art that data is transmitted between the test head and the device-specific adapter through the coaxial cable connector in the test motherboard, and the transmission rate is restricted by the performance of the coaxial cable connector and cannot meet the increasing demand for high-speed signal transmission of the device under test.

[0005] In a first aspect of the embodiments of this application, a high-fidelity test interface device is provided, including:

[0006] A test head for testing semiconductor devices through a test controller;

[0007] A device-specific adapter including a plurality of slots for connecting semiconductor devices;

[0008] A test motherboard provided with a coaxial cable connecting the test head and the device-specific adapter to transmit test signals to the device-specific adapter;

[0009] A protocol processing board card connected between the test motherboard and the device-specific adapter to transmit test signals to the device-specific adapter.

[0010] In some embodiments: Coaxial cable connectors for connecting the test head and the device-specific adapter are respectively provided at both ends of the coaxial cable, and protocol processing board card connectors for connecting the device-specific adapter and the test motherboard are provided at both ends of the protocol processing board card.

[0011] In some embodiments, the device-specific adapter further includes a slot board that fixes a plurality of the slots. Slot guide plates are provided on both sides or around the slots and are fixed to the slot board. Both the test motherboard and the protocol processing board are pluggable and connectable to the slot board.

[0012] In some embodiments, the test motherboard includes a heat insulation layer. Accommodation spaces for respectively penetrating a coaxial cable and a protocol processing board are formed in the heat insulation layer. An inner air duct communicating with the accommodation spaces is further formed on the heat insulation layer.

[0013] In some embodiments, a metal reinforcement layer is provided at the bottom of the heat insulation layer. Through holes for respectively penetrating the coaxial cable and the protocol processing board are formed in the metal reinforcement layer. Two coaxial cables are provided and are respectively located on both sides of the protocol processing board.

[0014] In some embodiments, a plurality of wind baffle plates for separating the coaxial cable and the protocol processing board from each other are provided at the bottom of the metal reinforcement layer. The plurality of wind baffle plates are parallel to each other and are spaced apart to form a plurality of wind baffle air ducts.

[0015] In some embodiments, a fan for introducing a cooling air flow in the direction of the wind baffle plates is provided on one side of the plurality of wind baffle plates. The fan is configured to direct the cooling air flow into the plurality of wind baffle air ducts to cool the coaxial cable and the protocol processing board.

[0016] In some embodiments, the metal reinforcement layer is a stainless steel plate with a set thickness, and the heat insulation layer is an epoxy resin with a set thickness. The metal reinforcement layer and the heat insulation layer are fixedly connected to each other.

[0017] In some embodiments, the semiconductor device is a chip or a wafer, and the protocol processing board is a protocol processing board adapted to the UFS or PCIE protocol type.

[0018] In a second aspect of the embodiments of the present application, a semiconductor testing device is provided, including: the high-fidelity testing interface device according to any one of the above embodiments.

[0019] The beneficial effects brought by the technical solution provided by the present application include:

[0020] The embodiments of the present application provide a high-fidelity testing interface device and a semiconductor testing device. Since the high-fidelity testing interface device of the present application is provided with a test head for testing a semiconductor device through a test controller, a device-specific adapter including a plurality of slots for connecting the semiconductor device, a test motherboard provided with a coaxial cable for connecting the test head and the device-specific adapter to transmit a test signal to the device-specific adapter, and a protocol processing board connected between the test motherboard and the device-specific adapter to transmit a test signal to the device-specific adapter.

[0021] Therefore, the high-fidelity test interface device of the present application introduces a protocol processing board to adapt to the signal transmission requirements of high-speed chips. At the same time, due to the flexible replaceability of the protocol processing board, different types of protocol processing boards can be developed for different customers, so as to adapt to various customization requirements. While maintaining the original SBC mode, the present application changes the protocol types adapted by the protocol processing board, such as UFS, PCIE, etc., to meet the transmission requirements of various high-speed signals. The protocol processing board can be quickly disassembled and assembled, and is flexible to replace. Different versions of protocol processing boards can be developed according to the customization requirements of different users, realizing the standardization of the overall framework of the HiFIX solution.

[0022] The high-fidelity test interface device of the present application is respectively provided with coaxial cable connectors connecting test heads and device-specific adapters at both ends of the coaxial cable, and protocol processing board connectors connecting device-specific adapters and test motherboards at both ends of the protocol processing board. The coaxial cables on the test motherboard are respectively plugged and unplugged with the test heads and device-specific adapters through the coaxial cable connectors, and the protocol processing boards on the test motherboard are plugged and unplugged with the device-specific adapters through the protocol processing board connectors, which facilitates the quick installation and replacement of the test motherboard and improves the test efficiency.

[0023] The device-specific adapter of the high-fidelity test interface device of the present application further includes a slot board for fixing a number of slots, and slot guide plates fixed on the slot board are provided on both sides or around the slots. Both the test motherboard and the protocol processing board are plugged and unplugged with the slot board. The slot board of the device-specific adapter is used to install a number of slots, and each slot can install a semiconductor device under test. During the semiconductor performance test, multiple semiconductor devices under test can be tested at one time, realizing batch testing of semiconductor devices and improving the test efficiency of semiconductor devices. Slot guide plates fixed on the slot board are provided on both sides or around the slots, and the slot guide plates are used to provide positioning and guidance for placing and removing the semiconductor devices under test, facilitating the accurate installation of the semiconductor devices under test in the slots.

[0024] The test motherboard of the high-fidelity test interface device of the present application includes a heat insulation layer, accommodation spaces for respectively penetrating coaxial cables and protocol processing boards are opened in the heat insulation layer, and an inner air duct communicating with the accommodation spaces is further opened on the heat insulation layer. Since the protocol processing board itself has a high heat consumption, and when the device-specific adapter performs high-temperature tests on the semiconductor devices under test, heat will penetrate from the device-specific adapter into the test motherboard, resulting in a further increase in the ambient temperature. The present application further opens an inner air duct communicating with the accommodation spaces on the heat insulation layer, which facilitates the heat dissipation of the protocol processing board to the outside through the inner air duct, reduces the working temperature of the protocol processing board, and improves the stability of its test signals.

[0025] The high-fidelity test interface device of the present application is provided with a metal reinforcement layer at the bottom of the heat insulation layer. Through holes are opened in the metal reinforcement layer for respectively passing through coaxial cables and protocol processing boards. There are two coaxial cables, which are respectively located on both sides of the protocol processing board. At the bottom of the metal reinforcement layer, there are multiple windshields for separating the coaxial cables and the protocol processing boards from each other. The multiple windshields are parallel to each other and arranged at intervals to form multiple wind channels. Since the heat insulation layer is made of non-metallic material, it is necessary to use a metal reinforcement layer made of metal material to strengthen the overall structural strength of the test motherboard. The coaxial cables and the protocol processing boards are separated from each other by the windshields to prevent the protocol processing boards from rubbing against the coaxial cables during the plugging and unplugging process.

[0026] The high-fidelity test interface device of the present application is provided with a fan on one side of the multiple windshields for introducing cooling air flow towards the windshields. The fan is used to direct the cooling air flow into the multiple wind channels to cool the coaxial cables and the protocol processing boards. The present application is provided with a fan on one side of the multiple windshields for introducing cooling air flow towards the windshields. The function of the fan is to assist in dissipating heat from the coaxial cables and the protocol processing boards, while the function of the windshields is to separate the protocol processing boards and the coaxial cables. On the one hand, it maintains a relatively independent air duct between the coaxial cables and the protocol processing boards, and on the other hand, it can prevent the protocol processing boards from rubbing against the coaxial cables during the plugging and unplugging process. Description of the Drawings

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0028] Figure 1 It is a schematic structural diagram of an embodiment of the present application;

[0029] Figure 2 It is a schematic structural diagram of the test motherboard of an embodiment of the present application;

[0030] Figure 3 It is a top view of the structure of the test motherboard of an embodiment of the present application;

[0031] Figure 4 It is a top view of the structure of the test motherboard of an embodiment of the present application without the heat insulation layer.

[0032] Reference Signs:

[0033] 1. Test head; 2. Device-specific adapter; 3. Test motherboard; 4. Semiconductor device; 5. Windshield; 6. Fan; 21. Slot; 22. Slot board; 23. Slot guide plate; 31. Coaxial cable; 32. Protocol processing board; 33. Coaxial cable connector; 34. Protocol processing board connector; 35. Heat insulation layer; 36. Metal reinforcement layer; 37. Inner air duct. Detailed implementation manners

[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without making creative efforts shall fall within the scope of protection of the present application.

[0035] The embodiments of the present application provide a high-fidelity test interface device and a semiconductor test device, which can solve the problem in the existing HiFIX solution in the SBC mode in the related art that when transmitting data between the test head and the device-specific adapter through the coaxial cable connector in the test motherboard, the transmission rate is restricted by the performance of the coaxial cable connector and cannot meet the increasing demand for high-speed signal transmission of the device under test.

[0036] See Figure 1 As shown, the embodiments of the present application provide a high-fidelity test interface device, including:

[0037] A test head 1, which is used to test a semiconductor device 4 through a test controller, and the semiconductor device 4 is a chip or a wafer. A device-specific adapter 2, which includes a plurality of slots 21 connected to the semiconductor device 4. A test motherboard 3, on which a coaxial cable 31 connecting the test head 1 and the device-specific adapter 2 is provided to transmit test signals to the device-specific adapter 2. A protocol processing board 32, which is connected between the test motherboard 3 and the device-specific adapter 2 to transmit test signals to the device-specific adapter 2, and the protocol processing board 32 is preferably but not limited to a protocol processing board adapted to the UFS or PCIE protocol type.

[0038] The high-fidelity test interface device according to the embodiment of the present application introduces a protocol processing board 32 to adapt to the signal transmission requirements of high-speed chips; at the same time, due to the flexible replaceability of the protocol processing board 32, different types of protocol processing boards can be developed for different customers, so as to adapt to various customization requirements. While maintaining the original SBC mode, the present application changes the protocol types adapted by the protocol processing board 32, such as UFS, PCIE, etc., to meet the transmission requirements of various high-speed signals. The protocol processing board 32 can be quickly disassembled and assembled, and is flexible to replace. Different versions of protocol processing boards can be developed according to the customization requirements of different users, realizing the standardization of the overall framework of the HiFIX solution.

[0039] In some alternative embodiments: Refer to Figure 1 As shown in the figure, the embodiment of the present application provides a high-fidelity test interface device. Coaxial cable connectors 33 for connecting a test head 1 and a device-specific adapter 2 are respectively provided at both ends of the coaxial cable 31 of the high-fidelity test interface device. Protocol processing board connectors 34 for connecting the device-specific adapter 2 and a test motherboard 3 are provided at both ends of the protocol processing board 32.

[0040] The high-fidelity test interface device according to the embodiment of the present application is respectively provided with coaxial cable connectors 33 for connecting a test head 1 and a device-specific adapter 2 at both ends of the coaxial cable 31, and protocol processing board connectors 34 for connecting the device-specific adapter 2 and a test motherboard 3 at both ends of the protocol processing board 32. The coaxial cable 31 on the test motherboard 3 is respectively plugged and unplugged with the test head 1 and the device-specific adapter 2 through the coaxial cable connectors 33. The protocol processing board 32 on the test motherboard 3 is plugged and unplugged with the device-specific adapter 2 through the protocol processing board connectors 34, which facilitates the quick installation and replacement of the test motherboard 3 and improves the test efficiency.

[0041] In some alternative embodiments: Refer to Figure 1 As shown in the figure, the embodiment of the present application provides a high-fidelity test interface device. The device-specific adapter 2 of the high-fidelity test interface device further includes a slot board 22 for fixing a plurality of slots 21. Slot guide plates 23 fixed on the slot board 22 are provided on both sides or around the slots 21. Both the test motherboard 3 and the protocol processing board 32 are plugged and unplugged with the slot board 22.

[0042] The device-specific adapter 2 of the high-fidelity test interface device according to the embodiment of the present application further includes a slot board 22 for fixing a plurality of slots 21. Slot guide plates 23 fixed on the slot board are provided on both sides or around the slots 21. Both the test motherboard 3 and the protocol processing board 32 are plugged and unplugged with the slot board 22. The slot board 22 of the device-specific adapter 2 is used to install a plurality of slots 21, and each slot 21 can install a semiconductor device 4 to be tested.

[0043] During the semiconductor performance test, multiple semiconductor devices under test 4 can be tested at one time, achieving batch testing of the semiconductor devices 4 and improving the testing efficiency of the semiconductor devices 4. On both sides or around the slot 21, there is a slot guide plate 23 fixed on the slot board 22. The slot guide plate 23 is used to provide positioning and guidance for the placement and removal of the semiconductor devices under test 4, facilitating the accurate installation of the semiconductor devices under test 4 into the slot 21.

[0044] In some alternative embodiments: Refer to Figure 2 and Figure 3 As shown, the embodiment of the present application provides a high-fidelity test interface device. The test motherboard of the high-fidelity test interface device includes a heat insulation layer 35. Accommodation spaces for respectively penetrating a coaxial cable 31 and a protocol processing board 32 are provided in the heat insulation layer 35. An inner air duct 37 communicating with the accommodation space is also provided on the heat insulation layer 35.

[0045] The test motherboard 3 of the high-fidelity test interface device in the embodiment of the present application includes a heat insulation layer 35. Accommodation spaces for respectively penetrating a coaxial cable 31 and a protocol processing board 32 are provided in the heat insulation layer 35. An inner air duct 37 communicating with the accommodation space is also provided on the heat insulation layer 35. Since the protocol processing board 32 has a relatively high self-heat dissipation, when the device-specific adapter 2 performs a high-temperature test on the semiconductor device under test 4, heat will penetrate from the device-specific adapter 2 into the test motherboard 3, thereby causing a further increase in the ambient temperature. The present application also provides an inner air duct 37 communicating with the accommodation space on the heat insulation layer 35, facilitating the heat dissipation of the protocol processing board 32 through the inner air duct 37, reducing the operating temperature of the protocol processing board 32, and improving the stability of its test signal.

[0046] In some alternative embodiments: Refer to Figures 2 to 4 As shown, the embodiment of the present application provides a high-fidelity test interface device. A metal reinforcement layer 36 is provided at the bottom of the heat insulation layer 35 of the high-fidelity test interface device. Through holes for respectively penetrating the coaxial cable 31 and the protocol processing board 32 are provided on the metal reinforcement layer 36. There are two coaxial cables 31, which are respectively located on both sides of the protocol processing board 32. At the bottom of the metal reinforcement layer 36, there are multiple wind baffle plates 5 that separate the coaxial cable 31 and the protocol processing board 32 from each other. The multiple wind baffle plates 5 are parallel to each other and are spaced apart to form multiple wind baffle air ducts. The metal reinforcement layer 36 is a stainless steel plate with a set thickness, and the heat insulation layer 35 is an epoxy resin with a set thickness. The metal reinforcement layer 36 and the heat insulation layer 35 are fixedly connected to each other.

[0047] In the high-fidelity test interface device according to the embodiment of the present application, a metal reinforcement layer 36 is provided at the bottom of the heat insulation layer 35. Through holes are formed in the metal reinforcement layer 36 to respectively penetrate through the coaxial cable 31 and the protocol processing board 32. Two coaxial cables 31 are provided and are respectively located on both sides of the protocol processing board 32. At the bottom of the metal reinforcement layer 36, a plurality of windshields 5 for separating the coaxial cable 31 and the protocol processing board 32 from each other are provided. The plurality of windshields 5 are parallel to each other and are spaced apart to form a plurality of wind channels. Since the heat insulation layer 35 is made of a non-metallic material, it is necessary to use the metal reinforcement layer 36 made of metal to enhance the overall structural strength of the test motherboard 3. The coaxial cable 31 and the protocol processing board 32 are separated from each other by the windshields 5 to prevent the protocol processing board 32 from rubbing against the coaxial cable 31 during the plugging and unplugging process.

[0048] In some alternative embodiments: Refer to Figure 2 and Figure 4 As shown in, the embodiment of the present application provides a high-fidelity test interface device. A fan 6 for introducing a cooling air flow towards the windshields 5 is provided on one side of the plurality of windshields 5 of the high-fidelity test interface device. The fan 6 is configured to direct the cooling air flow into the plurality of wind channels to cool the coaxial cable 31 and the protocol processing board 32.

[0049] The high-fidelity test interface device of the present application is provided with a fan 6 for introducing a cooling air flow towards the windshields 5 on one side of the plurality of windshields 5. The fan 6 is configured to direct the cooling air flow into the plurality of wind channels to cool the coaxial cable 31 and the protocol processing board 32. The present application is provided with a fan 6 for introducing a cooling air flow towards the windshields 5 on one side of the plurality of windshields 5. The function of the fan 6 is to assist in dissipating heat from the coaxial cable 31 and the protocol processing board 32, while the function of the windshields 5 is to separate the protocol processing board 32 and the coaxial cable 31. On the one hand, it maintains a relatively independent air duct between the coaxial cable 31 and the protocol processing board 32, and on the other hand, it can prevent the protocol processing board 32 from rubbing against the coaxial cable 31 during the plugging and unplugging process.

[0050] In the second aspect of the embodiment of the present application, a semiconductor test device is provided, and the semiconductor test device uses the high-fidelity test interface device described in any of the above embodiments.

[0051] Working principle

[0052] The embodiment of the present application provides a high-fidelity test interface device and a semiconductor test device. The high-fidelity test interface device is provided with a test head 1, which is used to test a semiconductor device 4 through a test controller. The semiconductor device 4 is a chip or a wafer. A device-specific adapter 2, which includes a plurality of slots 21 for connecting the semiconductor device 4. A test motherboard 3, on which a coaxial cable 31 for connecting the test head 1 and the device-specific adapter 2 is provided to transmit test signals to the device-specific adapter 2. A protocol processing board 32, which is connected between the test motherboard 3 and the device-specific adapter 2 to transmit test signals to the device-specific adapter 2.

[0053] The high-fidelity test interface device and the semiconductor test device according to the embodiment of the present application introduce a protocol processing board 32 to adapt to the signal transmission requirements of high-speed chips; at the same time, due to the flexible replaceability of the protocol processing board 32, different types of protocol processing boards can be developed for different customers, so as to adapt to various customization requirements. While maintaining the original SBC mode, the present application changes the protocol types adapted by the protocol processing board 32, such as UFS, PCIE, etc., to meet the transmission requirements of various high-speed signals. The protocol processing board 32 can be quickly disassembled and assembled, and is flexible to replace. Different versions of protocol processing boards can be developed according to the customized requirements of different users, realizing the standardization of the overall framework of the HiFIX solution.

[0054] In the description of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "upper" and "lower" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0055] It should be noted that in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

[0056] The above are only specific embodiments of the present application, enabling those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but rather to the broadest scope consistent with the principles and novel features claimed herein.

Claims

1. A high-fidelity test interface device, characterized in that, Comprising: A test head (1) for testing a semiconductor device (4) through a test controller; A device-specific adapter (2) including a plurality of slots (21) for connecting the semiconductor device (4); A test motherboard (3) provided with a coaxial cable (31) connecting the test head (1) and the device-specific adapter (2) thereon to transmit low-speed test signals to the device-specific adapter (2); A protocol processing board (32) pluggably connected between the test motherboard (3) and the device-specific adapter (2) to transmit high-speed test signals to the device-specific adapter (2); Both ends of the coaxial cable (31) are respectively provided with coaxial cable connectors (33) connecting the test head (1) and the device-specific adapter (2), and the protocol processing board (32) on the test motherboard (3) is pluggably connected to the device-specific adapter (2) through a protocol processing board connector (34), and the test motherboard (3) has a receiving space for accommodating the protocol processing board (32).

2. A high-fidelity test interface device according to claim 1, characterized in that: The device-specific adapter (2) further includes a slot board (22) for fixing the plurality of slots (21), slot guide plates (23) fixed on the slot board (22) are provided on both sides or around the slots (21), and both the test motherboard (3) and the protocol processing board (32) are pluggably connected to the slot board (22).

3. A high-fidelity test interface device according to claim 1, characterized in that: The test motherboard (3) includes a heat insulation layer (35), a receiving space for respectively penetrating the coaxial cable (31) and the protocol processing board (32) is opened in the heat insulation layer (35), and an inner air duct (37) communicating with the receiving space is further opened on the heat insulation layer (35).

4. A high-fidelity test interface device according to claim 3, characterized in that: A metal reinforcement layer (36) is provided at the bottom of the heat insulation layer (35), through holes for respectively penetrating the coaxial cable (31) and the protocol processing board (32) are opened on the metal reinforcement layer (36), and two coaxial cables (31) are provided and are respectively located on both sides of the protocol processing board (32).

5. A high-fidelity test interface device according to claim 4, characterized in that: A plurality of windshields (5) for separating the coaxial cable (31) and the protocol processing board (32) from each other are provided at the bottom of the metal reinforcement layer (36), and the plurality of windshields (5) are parallel to each other and are spaced apart to form a plurality of windshield air ducts.

6. A high-fidelity test interface device according to claim 5, characterized in that: A fan (6) for introducing a cooling air flow in the direction of the windshields (5) is provided on one side of the plurality of windshields (5), and the fan (6) is used to direct the cooling air flow into the plurality of windshield air ducts to cool the coaxial cable (31) and the protocol processing board (32).

7. A high-fidelity test interface device according to claim 4, characterized in that: The metal reinforcement layer (36) is a stainless steel plate with a set thickness, the heat insulation layer (35) is an epoxy resin with a set thickness, and the metal reinforcement layer (36) is fixedly connected to the heat insulation layer (35).

8. The high-fidelity test interface device according to claim 1, characterized in that: The semiconductor device (4) is a chip or a wafer, and the protocol processing board (32) is a protocol processing board adapted to the UFS or PCIE protocol type.

9. A semiconductor testing device, characterized in that, Comprising: The high-fidelity test interface device according to any one of claims 1 to 8.

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