Multilayer assembly for electronic devices and method of building the assembly

Abstract

A multi-layer assembly for an electronic device includes a substrate film configured to house an electronic device on at least a first side thereof, the film having a first side and a second side; an area light source on the first side of the substrate film and configured to emit light of a predetermined frequency or frequency band; a molded light guide layer disposed on the first side of the substrate film and at least partially embedding the light source, having an optically at least semi-transparent material configured to transmit light emitted by the embedded light source so that the transmitted light propagates within the light guide layer and is out-coupled therefrom via an outer surface thereof substantially opposite the embedded light source; and a mask layer disposed on the outer surface of the light guide layer, containing a substantially opaque material to block external viewing of at least some internal components of the multi-layer structure, wherein the mask layer defines a window for light emitted by the embedded light source and propagating within the plastic light guide layer to pass through the mask layer toward the environment. A method of manufacturing the multi-layer assembly is presented.

Description

[0001] This application is a divisional application of the Chinese patent application for "Multilayer structure with embedded area light source of illumination" with the application number 2017800262716 (PCT / FI2017 / 050261), the filing date of 11 April 2017. TECHNICAL FIELD

[0002] Generally, the present invention relates to multilayer structures in connection with electronic devices, related equipment and manufacturing methods. In particular, but not exclusively, the present invention relates to providing an integral illumination solution within a multilayer structure. BACKGROUND

[0003] Generally, there are various different stacked components and structures in the context of, for example, electronic devices and electronic products, such as various electronic equipment.

[0004] The motivation behind stacking electronic devices and other elements in a general structure can be as diverse as the related use contexts. Comparatively commonly, when the resulting optimized solution ends up exhibiting multilayer properties, what is sought in terms of, for example, manufacturing processes or logistics, is a size saving, weight saving, cost saving, availability benefit or simply an efficient integration of components. In turn, the associated use scenarios can involve product or food packaging, visual design of equipment casings, wearable electronics, personal electronic equipment, displays, detectors or sensors, vehicle interiors, antennas, labels, vehicles and, in particular, automotive electronics, etc.

[0005] Electronic devices such as electronic components, ICs (integrated circuits) and conductors can generally be provided onto a substrate element by a number of different technologies. For example, off-the-shelf electronic devices such as various surface mount devices (SMDs) can be mounted on the substrate surface of an inner or outer interface layer (intermediate layer) that eventually forms a multilayer structure. In addition, technologies belonging to the term "printed electronics" can be applied to actually fabricate electronic devices directly and additionally to the associated substrate. In this context, the term "printed" refers to various printing technologies capable of producing electronic devices / electrical elements from printed substances by essentially additive printing processes, including but not limited to screen printing, flexographic printing and inkjet printing. The substrate used can be flexible and an organic printed material, however, this is not always the case.

[0006] Substrates such as plastic substrate films can be subjected to processes such as (thermal) shaping or molding. Indeed, using for example injection molding, a plastic layer can be provided on a film, which can then possibly be embedded with a plurality of elements, such as electronic components present on the film. The plastic layer can have different mechanical, optical, electrical, etc. properties. The resulting multi-layer or stacked structure can be configured for various purposes, depending on the features included, such as electronic devices, and the intended use scenario and related use environment. For example, it can include connection features, such as anchor pawl type protrusions, for coupling with compatible grooves of a host element, or vice versa.

[0007] Occasionally, lighting capabilities should be provided for different elements, surfaces or devices, which can assume for example decorative / aesthetic or functional purposes, such as guiding or indicative purposes. For example, the environment of a device or element should be flood-lit to increase the visibility in the shade or darkness during night time, which in turn can enable the trouble-free performance of various human activities, such as walking or reading, which normally require a relatively high level of light comfort to be performed. Alternatively, lighting can be applied to warn or inform different parties about for example the status of a host element or a connected remote device, through different warning or indicative lights. However, lighting can enable a host element to have its certain features visually emphasized and the desired appearance by providing for example brighter areas with the desired color on it. Thus, lighting can also be applied to guide the user of a device about the location of different functional features on the surface of the device, such as keys, switches, touch-sensitive areas, etc., or about the actual functionality underneath the features of the lighting.

[0008] Therefore, there are a large number of use cases for lighting in connection with different structures and devices. However, since lighting can not usually be the highest priority or the most important key or unique feature in the associated product, and it can actually be considered only as a supplementary optional feature, the design and implementation of the illumination features providing the desired lighting effects should be properly implemented. The overall complexity of the weight and size requirements, increased power consumption, additional design considerations, new processing steps, and generally increased manufacturing stages, as well as the resulting product are examples of many drawbacks that are easily turned into reality as a side effect of the adoption of illumination features in the target solution. However, the presentation of the lighting effects and the perceptibility of for example the illumination elements are another problem. In certain applications, the light sources should remain hidden or weakly exposed, or the lighting effects should be rather soft without hot spots. SUMMARY

[0009] It is an object of the present invention to at least mitigate one or more of the above-mentioned drawbacks associated with the prior solutions in the context of other host elements or various electronic devices to which illumination features are to be provided.

[0010] This object is achieved by embodiments of a multi-layer assembly and related manufacturing method according to the present invention.

[0011] According to one embodiment of the present application, a multi-layer assembly for an electronic device comprises:

[0012] A preferably flexible substrate film configured to accommodate electronic components, such as conductive traces and electronic parts, e.g. SMDs (Surface Mount Devices), on at least a first side thereof, the film having a first side and a second side,

[0013] At least one area light source, such as an OLED light source, of an optional planar type, disposed on the first side of the substrate film and configured to emit light of a predetermined frequency or frequency band (frequency band), preferably comprising or substantially limited to visible light,

[0014] A molded plastic light guide layer disposed on the first side of the substrate film and at least partially embedding the light source, the plastic light guide layer having an optically at least semi-transparent, optionally transparent material with respect to the predetermined frequency or band, wherein the plastic light guide layer is configured to transmit light emitted by the embedded light source so that the transmitted light propagates within the light guide layer and is out-coupled from the plastic light guide layer via its outer surface substantially opposite the embedded light source, and

[0015] A mask layer disposed on the outer surface of the plastic light guide layer, containing a substantially opaque material to block at least some internal components of the multi-layer structure from external view, wherein the mask layer defines a window for light emitted by the embedded light source and propagating within the plastic light guide layer to pass through the mask layer towards the environment.

[0016] In some embodiments, the substrate film can comprise a plurality of further light sources, which together with the mask layer and associated windows are mutually configured so that, at least within a selected viewing angle, preferably including zero angle from the surface normal of the mask layer, there is no direct (straight) line of sight (LOS) path from outside the assembly through the windows to the further light sources and optionally selected further electronic components.

[0017] In some embodiments, the area light source (area light) has been positioned on the substrate so that it is substantially opposite the window of the mask layer. There can thus be a direct LOS between the light source and the window so that at least some of the light emitted by the source and entering the light guide material can directly propagate through the light guide layer and exit via the window, directly or via optional further layer(s), into the environment.

[0018] In some embodiments, the area light source has been printed or otherwise configured so as to assume a desired shape according to the physical appearance and / or light emission pattern with respect to the window. For example, the shape and / or size of the light source and the window can substantially match.

[0019] According to another embodiment, a method of establishing a multi-layer assembly for an electronic device, comprises:

[0020] A preferably flexible substrate film is obtained, which is configured to accommodate electronic devices on at least a first side thereof, said film having a first side and a second side,

[0021] At least one area-type light source is provided on the first side of the substrate film, said light source being configured to emit light of a predetermined frequency or frequency band,

[0022] A plastic light guide layer is molded onto the first side of the substrate film and thus at least partially embeds the light source, the plastic light guide layer having an optically at least semi-transparent, optionally transparent material with respect to the predetermined frequency or band of light, wherein the plastic light guide layer is configured to transmit light emitted by the embedded light source such that the transmitted light propagates within the light guide layer and is out-coupled from the light guide layer via its outer surface substantially opposite to the embedded light source, and

[0023] A mask layer is provided on the outer surface of the light guide layer, which contains a substantially opaque material to block at least some internal components of the multilayer structure from external observation, wherein the mask layer defines a window for light emitted by the embedded light source and propagating within the light guide layer to pass through the mask layer towards the environment.

[0024] In some embodiments, area light sources and / or further light sources, such as LED sources, are provided on the first side of the substrate film, the mask layer and the associated window being mutually configured such that, at least within a selected viewing angle, there is no direct line-of-sight path from the outside of the assembly through the window to the light sources and optionally further electronic devices.

[0025] An apparatus, such as an electronic apparatus comprising embodiments of the assembly, can be provided. The apparatus can be a portable, handheld, wearable, desktop or other type of apparatus. For example, it can be of the standalone type or the apparatus can constitute part of a larger whole, with reference to the dashboard of a vehicle.

[0026] As will be appreciated by the skilled person, different considerations presented herein with respect to embodiments of the assembly can be flexibly applied to embodiments of the method mutatis mutandis, and vice versa.

[0027] According to embodiments, the utility of the invention stems from a number of problems.

[0028] Illumination features, such as light sources and associated optics, directing layers, lenses, diffusers, collimators, prisms, diffractive elements, reflectors, non-transparent / masking elements, etc. can be cleverly integrated into a common assembly, which in turn can establish at least a portion of the host device or host element. Suitable light sources include different printed light sources, such as OLEDs, and more conventional mountable components, such as LEDs, both of which are similar. The resulting illumination effects can have, for example, aesthetic / decorative functions, indicative functions, instructional and / or warning functions. By appropriate configuration of the light sources, intermediate elements, and windows, including, for example, the positioning of masking layers relative to embedded light sources and light directing layers, the out-coupled light can appear very uniform, while the masking layers hide unsightly (unwanted to see) electronics, such as light sources, from external observers.

[0029] However, in preferred configurations, at least multiple area light sources, such as OLEDs or other applicable area light sources, are utilized, which are producible by, for example, printed electronics technology. The area light sources can be positioned, for example, directly opposite the windows of the masking layers (or of course elsewhere when desired). Thus, the light emitted by the light sources can have a relatively short path to the windows and reach the windows with substantially no reflections, which increases optical efficiency and also facilitates its controllability. Still, the light reaching the environment does not particularly present as point-like or uneven, as the area light sources can provide diffuse / wide viewing angle and uniform illumination.

[0030] The area light sources, such as OLED(s), can be made directly on the substrate, for example, layer-by-layer or as a component or module mounted thereon. For example, the component / module can be provided in conjunction or coupling with an optionally thin glass sheet or other feasible plate, e.g., sufficiently transparent plate or other element, the remaining elements of the light source stack or other possibly layered structure located therebetween. The component / module can include a plurality of attachment features, such as ready-made (e.g., pre-unrolled / pre-laminated) adhesive surfaces, for attaching the component / module to the adjacent layer(s), such as the molded plastic light directing layer and / or substrate of the assembly.

[0031] Furthermore, such area light sources can remain distinguishable to the environment or practically hidden or nearly invisible, as it can be made on the substrate as a flat and / or compact (unobtrusive) material stack, as compared to, for example, many SMDs with more prominent appearance and, for example, more point-like light output, considering, for example, ordinary LEDs. However, in some embodiments, the area light sources can be made visible from outside the assembly via the windows, if so desired for aesthetics.

[0032] However, through configuration of surface graphics, embedded graphics (e.g. still visible through a window), surface materials with different surface profiles, general shape, etc., the assembly can present a selected appearance or e.g. haptic feel to an observer (such as an operator).

[0033] The resulting structures can generally remain relatively light, thin and energy efficient (power saving). The optical coupling between the embedded optoelectronic devices (such as light sources or sensors) and the light guide can be strong, with low losses and without substantial artifacts. However, through construction, the assembly can be somewhat simple and compact, which also generally translates into durability and other useful aspects. The relative simplicity of the associated manufacturing process itself yields benefits, with reference e.g. to the associated fairly tolerable equipment and material costs, space, processing time, logistics and storage requirements.

[0034] With respect to the molding process, the thermoplastic material used can be optimized for various purposes, including securing the electronic devices. Also, the molding material, optionally together with other materials used, can be configured to protect the embedded elements (such as electronic devices) from e.g. environmental conditions, such as moisture, heat, cold, dirt, impacts, etc.

[0035] The expression "a number of" can herein refer to any positive integer starting from one (1).

[0036] Correspondingly, the expression "a plurality of" can refer to any positive integer starting from two (2).

[0037] The ordinal numbers such as "first" and "second" are used herein to distinguish one element from another, without particularly prioritizing or ordering them, if not otherwise explicitly stated.

[0038] The terms "film" and "foil" are generally used interchangeably herein, unless otherwise explicitly stated. BRIEF DESCRIPTION OF DRAWINGS

[0039] The application will be described in more detail in the following with reference to the enclosed drawings, in which:

[0040] Figure 1 An embodiment of a multilayer assembly according to the application is shown.

[0041] Figure 2 is a cross-sectional side view of an embodiment of a multilayer structure according to the application.

[0042] Figure 3 An embodiment of a manufacturing process for obtaining a multilayer assembly of the application and related elements of the assembly is shown conceptually.

[0043] Figure 4 is a flow chart disclosing an embodiment of the method according to the present application. DETAILED DESCRIPTION

[0044] In various embodiments, the mask layer can be combined with a coating, such as a film, on the molded plastic light guide layer. The mask layer itself can be made, for example, using suitable deposition or other methods on a carrier, such as the plastic light guide layer, or some other carrier, for example a cover layer, which is then provided on the light guide layer, and preferably secured thereto using, for example, suitable lamination methods. Alternatively, the mask layer defined by the film, sheet / panel and / or other element(s) can be pre-formed separately using, for example, extrusion or molding, and then provided for mounting in the assembly.

[0045] In various embodiments, the assembly can in fact contain at least one further cover or "top" layer, which is on and generally in contact with the mask layer. The cover layer can dominate or otherwise be connected to the mask layer, protecting the underlying structure and / or presenting a desired appearance, such as a color scheme, graphics, etc.

[0046] The cover layer can be provided by at least one cover element on the mask layer, such as a film, sheet / panel or other coating / cover element. The cover layer can also include a window for enabling light emitted by the light source to pass through to the environment. The window can be aligned with and at least partially overlap a window of the underlying mask layer. It can have the same or different dimensions.

[0047] The material(s) of the cover layer(s) can include, for example, plastic, glass, leather, fabric, organic or generally fibrous material. Similar considerations apply to the mask layer. The material(s) of the optional cover layer(s) can be different from the material of the mask layer. In some embodiments, the material can be substantially translucent or transparent with respect to, for example, the wavelengths emitted by the light source of the assembly. In some other embodiments, it can be substantially opaque. The cover (cap) and / or mask layer can be, for example, rubber or have a rubberized surface. The surface material and topology (surface form) can be optimized to provide desired sensory and / or aesthetic properties, in addition to or instead of, for example, insulating (e.g. from moisture and / or heat) or damping properties. The cover and / or mask layer can be flexible (bendable), elastic or stiff / rigid.

[0048] In various embodiments, the other layers / elements between the light guide layer and the mask layer and / or the mask layer can be at least partially reflective with respect to the light emitted by the light source, to enhance, for example, light propagation within the light guide rather than leakage due to absorption or transmission. It can contain reflective material, optionally enabling, for example, specular or diffuse reflection from it.

[0049] At least one bottom layer defined by, for example, a film or sheet / panel can be provided on the second or "bottom" side of the substrate film using, for example, selected lamination or deposition techniques, in addition to or instead of at least one cover layer.

[0050] The bottom layer can protect the assembly and / or facilitate its attachment to the host device, for example, if the assembly is not secured to the host via the substrate. The bottom layer, or in some cases directly the substrate, can thus contain attachment features such as adhesive material and / or mechanical fixation structure(s), for example, in the form of bosses / stands, clamps, hooks, grooves, etc., for this purpose.

[0051] With reference to the above paragraphs, the bottom layer can be configured to at least partly reflect light or otherwise control light propagation, which preferably at least mainly takes place within the light guide layer and possibly the substrate film. To this end, it can contain, for example, a reflective (surface) material, optionally diffusely or specularly reflecting (surface) material. The bottom layer can be flexible or rigid / hard.

[0052] The overall assembly can thus be flexible or rigid / hard, depending on the layer materials used, their thickness, and, for example, embedded elements. In some embodiments, its bottom can at least be flexible, so as to better conform to the surface form of the support or possible host device. Alternatively or additionally, the top can be flexible, able to be shaped, for example, dynamically.

[0053] In various embodiments, the substrate film can contain plastic, metal, glass, leather, fabric, organic and / or fibrous material (e.g. paper or cardboard). The substrate film can be optically translucent or transparent with respect to the selected wavelength(s). Preferably, the substrate film is or at least contains electrically insulating (dielectric) material. Light emitted by the light source and subsequently incident on the substrate can be at least partly absorbed by the substrate film or penetrate (transmit) the substrate film, depending on the material used, the respective refractive indices and the general configuration, for example, its arrangement and the geometry and surface topology of the elements. However, the substrate film can at least partly reflect and contain a reflective (surface) material, for example, in the form of a coating or more thorough.

[0054] In various embodiments, the substrate is formed into a desired substantially three-dimensional (non-planar), for example, curved, angled or undulating shape, with respect to its own thickness, preferably by thermoforming (such as pressure forming, vacuum forming or hydroforming), prior to or at the time of providing the plastic light guide layer on, for example, the substrate. The resulting 3d shape can be several times thicker than the initial film. Electronic devices such as printed electronics and / or mounting components can have been prepared to be provided on the substrate prior to forming. Additionally or alternatively, electronic devices can be provided to the substrate after forming.

[0055] In various embodiments, the window can be defined by an optional further layer on the mask layer and an opening in the mask layer, such as a via, a tab or a cut-out. In some embodiments, the mask layer and the optional further layer thereon can comprise a plurality of spatially discrete windows, each window passing light of the required wavelength(s) (such as the wavelength of the embedded light source) through.

[0056] The window(s) in the further layer(s) and / or the mask layer establishing part of the relevant light path can optionally contain a translucent, optionally transparent material, optionally glass or plastic, such as glazing, with respect to the aforementioned wavelength or band. It can optionally define an optical functional element, such as a lens, a prism or other refractive and / or diffractive element, for example.

[0057] In some embodiments, the window material can establish a substantially planar tab. The relevant surface can also be planar.

[0058] However, in some embodiments, the top surface (facing the environment, away from the light guide layer) and / or the opposite bottom surface facing the light guide can have a substantially three-dimensional shape, for example, a non-planar shape. It can define dome(s), recesses and / or protrusions, for example.

[0059] The micro-scale surface of the window filler can generally be smooth or rough.

[0060] The tab of material filling the window opening can also extend at least partially through the upper layer(s) towards the environment.

[0061] The window can present a required indication and / or decorative shape, such as at least part of the shape of text, numbers, symbols, graphical patterns and / or pictures. However, when applicable, the window material can have a selected color. In some embodiments, the window can contain a plurality of different adjacent materials (in the direction of the surface normal of the multi-layer structure, i.e. the thickness direction) that overlap and / or have different properties (e.g. color, transmittance and / or refractive index).

[0062] In various embodiments, the material of the light guide layer can establish at least part of the window filler. The material can define a protrusion from the light guide layer, for example, which is accommodated in the window defined by the mask layer and optional possible further layer. In some embodiments, the light guide material can also establish at least part of the outer (top) surface of the assembly.

[0063] The multi-layer assembly can generally be substantially planar or flat. Thus, the order of magnitude of the width and length of the assembly can differ from the height (direction of the stack of layers), i.e. the "thickness", which can be rather small. For example, the thickness can be only a few millimeters or less, while the width and length can be several centimeters or more, even rather large, depending on the implementation. The thickness can be constant, or it can vary, considering for example that in some implementations the shape of the assembly generally conforms to the shape of a general disc (flying disc).

[0064] In various implementations, by the configuration of the associated elements, such as the light source, the material layers and optional further optical functional elements, the assembly can be adapted to produce uniform light via the window from the perspective of an external observer.

[0065] As hinted at above, in various implementations the assembly or at least its elements can be configured to diffuse the light emitted by the light source. Diffusion can soften the light and reduce the contrast between bright and dark areas. It can contribute to obtaining a more uniform illumination effect via the window. For this purpose, the assembly can contain a specific diffuser, such as a diffusive reflector and / or a semi-transparent diffuser, optionally for example in the form of a plastic film. The diffuser(s) can be of a dedicated kind or integral with any of the aforementioned layers. In addition, the above-mentioned non-LOS positioning of the light source relative to the mask layer and its window(s) can increase the uniform illumination, so that no light rays can pass through the window(s) directly from the light source without prior interaction within the assembly, such as reflection. A direct light path is prone to cause hot spots visible to the environment.

[0066] In some implementations, the assembly or at least its elements can be configured to collimate the light, and thus comprise a collimator. For example, some other elements functionally positioned before the window structure or elements defining the window(s) (filler) material, such as reflectors, can be arranged to collimate the incoming light initially emitted by the light source, and arranged to out-couple via the window. Of course, the light source used, such as an area light source or other, can itself be configured to emit highly collimated or diffused light depending on for example its specifications, type and internal optics.

[0067] In some implementations, instead of or in addition to the light source, a plurality of light receivers or detectors, such as photodiodes, phototransistors, other suitable optoelectronic elements or for example photovoltaic elements (e.g. solar cells) arranged on a substrate film, are at least partially embedded by molding inside the established plastic layer. These elements are configured to capture or generally sense (sense) light received through the window, and / or light emitted by the light source and propagating within the plastic light guide layer. For example, the sensing data can be utilized to adjust the light source.

[0068] In various embodiments, the light source or other electronic devices can have been embedded in the material of the plastic light guide layer, just by molding the light guide material on top of it. In some other embodiments, an off-the-shelf light guide layer or at least a relevant portion thereof (e.g. the lowest portion thereof in case the layer actually contains several at least initially separate sub-layers, which is possible) can have been provided with features, such as e.g. surface forms in the shape of grooves or holes, configured to accommodate at least a portion of the protrusion caused by the electronic devices on the substrate. The light guide layer comprising optically transmissive material is configured to transmit light in-coupled from the embedded light source located on the substrate film. The light is preferably out-coupled from the light guide layer through its outer surface, which is the surface on the side of the light guide opposite to the other side on which the light source is embedded in the light guide material.

[0069] In various embodiments, the electronic devices included in the assembly, as provided on the substrate film and / or on the further layer(s) or element(s) such as mask layer(s), can generally comprise at least one feature selected from the group consisting of: conductive traces, printed conductive traces, contact pads, components, integrated circuits (chips), processing units, memories, communication units, transceivers, transmitters, receivers, signal processors, microcontrollers, batteries, light emitting devices, light sensing devices, photodiodes, connectors, electrical connectors, optical connectors, diodes, LEDs, OLEDs (organic LEDs), printed electronic components, sensors, force sensors, antennas, accelerometers, gyroscopes, capacitive switches or sensors, electrodes, sensor electrodes, printed electrodes, printed sensor electrodes, and photovoltaic cells. The electronic devices can be printed and / or mounted by printed electronics technology, e.g. screen printing or inkjet, or other additive methods. The electronic devices can be at least partially embedded, e.g. in the molded light guide layer or between different layers. For example, some features such as connectors, which can be arranged to supply power to the assembly, can be at least partially exposed to the environment of the assembly.

[0070] If there are several layers provided with electronic devices, e.g. substrate and mask layer, in a multi-layer stack, the layers can be connected together, functionally (e.g. electrically) in addition to structurally, by the molding layer, to enable e.g. signal transmission and / or current provision between them.

[0071] The connection between the layers can be achieved by using conductive elements such as metal pins, flexible circuits, etc. In some embodiments, wireless connections (e.g. radio frequency (rf) or optical) can also be applied.

[0072] The (wired) connections can be established after or before molding, e.g. using suitable molding features to protect the connection elements during molding. Alternatively or additionally, an introduction can be established for the connection elements during molding, e.g. by suitable molding features (such as posts) that prevent material flow into the space occupied by them.

[0073] As another alternative or supplemental option, the layers can be electrically connected together at the edges, e.g. via electrical wiring, flex circuits or other conductors, which can enable omission of molding material for connections from more central areas of the established multi-layer stack, for example, later, or arrangement of specific molding features (such as posts) to create the necessary introduction.

[0074] As a further option, the molding material can be machined, such as drilled or otherwise treated, to arrange an introduction therein for the connection and the relevant conductive element(s).

[0075] With respect to power supply and / or communication connections for external electronics or any layer of the host device electronics, for example, can be arranged in similar fashion, e.g. via side contacts provided at the edges.

[0076] As mentioned herein above, the cover layer, mask layer, associated window filler material(s), substrate film, bottom layer and / or other elements of the assembly can have been provided with visually distinguishable, decorative / aesthetic and / or informative features, such as graphic patterns and / or colors on or in them. These features can have been embedded in the assembly below its outer surface and / or provided on its outer surface. Accordingly, IML (in-mold labeling) / IMD (in-mold decoration) technology is suitable for manufacturing these features.

[0077] In various embodiments, the mold used can incorporate surface shapes that establish their corresponding mirror features in the molded plastic light guide layer. The shapes / features can include, for example, protrusions, gratings, bosses, boss pedestals, grooves, recesses, ridges, holes or cutouts.

[0078] With reference to the appended drawings, Figure 1 One embodiment of a multi-layer assembly according to the present application, in particular its exterior, is shown at 100.

[0079] The depicted only exemplary assembly 100 generally has a slightly flat or planar disc shape with low side walls, if any. The outer surface of the assembly 100 is at least partially defined by a mask layer 106 or optional cover layer(s) 108 thereon. A substantially transparent or at least translucent window, in this example a circular window 116A, can be free of material or contain a circular substantially planar transparent or translucent material plate, e.g. plastic or glass. In this figure, for illustration purposes, the window 116A has also been depicted separately, as indicated by the leading dashed line to the mounting location.

[0080] It is a fact understood by the skilled person that the optimal shape can be determined on a case-by-case basis based on optical, dimensional (size) and aesthetic purposes. Therefore, one still only exemplary more complex option 116B for the window shape is shown on the right side.

[0081] In other feasible implementations, the assembly 100 and related elements can have more three-dimensional shapes and thus also a considerable thickness or "height".

[0082] The shown assembly 100 has strong (circular) symmetry around its thickness / height axis, but in some other implementations at least one or more of the assembly or its components have a different symmetry or are substantially completely asymmetric (non-symmetrical).

[0083] Figure 2 An implementation 200 of a multilayer assembly according to the present application is shown via a cross-sectional side view. This mainly conceptual representation can cover, for example Figure 1 implementations and various other implementations. It is considered that Figure 1 a view can be taken, for example, along the line A-A. Figure 3 A substantially identical or similar implementation is shown at 300, in particular from the manufacturing process and layered construction point of view. In Figure 3 the shown layer thicknesses are only exemplary, but can also reflect realistic scenarios as far as relative thicknesses are concerned. For example, the substrate 202 can have a film type (wherein the thickness is, for example, about 0.1 millimeter), whereas, for example, the light guide layer 204 can be substantially thicker, for example, one or several millimeters or more.

[0084] The substrate 202 has been provided with elements, such as electrically conductive traces (conductors) 210, electronic components 212, 214 such as light sources 214 (optional), area light sources 215 (preferred), light receivers / sensors, integrated circuits, etc., as described above, at least on its first side (top / upper side in the figure). Optionally, but not necessarily, one or more area light sources 215 are printed on the substrate 202 (surface) by means of printed electronics technology.

[0085] Alternatively, at least one area light source 215 such as an OLED can be provided on the surface of the substrate as a (surface) mountable component or module. Thus, the component / module can be off-the-shelf. It can comprise different functional features, e.g. optical features, for enhancing or enabling proper optical functionality of the source, cf. e.g. barrier film(s) or conventional barrier elements, reflectors, lenses, etc. The area light source 215 can be configured to assume an angular or circular, possibly flat (planar) shape. According to embodiments, instead of a flat shape, the area light source can assume a three-dimensional shape such as a curved shape to better fit the installation location and host structure and / or to output a required light distribution.

[0086] The shape and / or size of the source 215 can substantially follow that of the window(s) 116, 116C or differ therefrom. In addition, a plurality of elements 314A such as electronic components can be provided on both sides thereof and / or embedded therein, optionally at least partly after molding of the light guide layer 204 of preferably thermoplastic material.

[0087] In some applications, instead of molding the light guide layer 204, it can be provided in other ways, cf. e.g. an off-the-shelf element preferably containing the necessary surface form such as a recess for receiving and accommodating at least a portion of the electronic devices 212, 214 protruding from the first upper surface of the substrate 204.

[0088] The mask layer 106 can be laminated to or directly made on top of the light guide layer 204. The mask layer 106 comprises at least one window 116, or in some embodiments, a number of windows as described above, for enabling transmission of light emitted by the light source 214, 215 towards the environment.

[0089] The window(s) 116, the light guide layer 204 and the light source 214, 215 (and / or other related elements such as light detectors / sensors) can already be configured according to e.g. mutual position, material, specification and shape, such that light emitted by the source 214, 215 propagating within the light guide layer 204 and impinging on the window(s) 116 passes through the window(s) 116 at least with respect to selected angles of incidence.

[0090] However, the configuration can be such that one or more light sources (e.g. other light sources providing more punctual light beams than area type sources 214 emitting more diffuse and uniform light over a larger area, or SMD type discrete components 214 such as LEDs) and / or other internal elements (such as additional electronics) remain hidden from the observer substantially completely or at least within a selected inspection angle with respect to a reference such as the surface normal of the assembly (i.e. the surface normal of the window filler / mask layer 106 or possibly of the top layer 108, or even of the light guide 204 in the absence of a window filler material). The order of magnitude of the associated critical angle can be for example about 10, 15, 20, 30, 40, 45, 50, 60 or more degrees. In some other embodiments, the reference with respect to which and possibly around which the above-mentioned viewing angle is defined can be different from the above-mentioned surface normal, and thus can be a line at an angle (such as a 45 degree angle) thereto.

[0091] At least one cover / top layer 108 can optionally be provided with and arranged with windows 116C aligned with respect to the windows of the mask layer 106 so that light exits the overall assembly, not only the light guide 204 and the mask layer 106, to the desired extent. For example, the windows 116, 116C can be substantially superimposed along the thickness / height direction of the assembly.

[0092] The windows 116, 116C can generally have the same or different shapes and optionally specifications. In the illustrated case, the overlapping windows 116C are larger than the windows 116, but they can have the same size, e.g. in the lateral direction or conventionally, as represented by the virtual vertical line 217. The windows can be planar, but also quite 3d shapes (i.e. with a comprehensive thickness specification), even if the thickness varies. For example, different surface topologies can be applied to achieve the desired optical or other functions, e.g. insulating functions, and / or associated functional elements, e.g. lenses, prisms, diffractive elements, etc.

[0093] Preferably, embodiments of the arrangement 200 actually include at least one area light source 215, such as the aforementioned OLED type source. The light source 215 can be planar. For example, the light source 215 can cover a relatively large area, such as an area corresponding to at least about 50%, 75%, 90% or 100% of the area of the windows 116, 116C.

[0094] Thus, the perceived light can exhibit uniformity with an even distribution of luminance, thus lacking substantial hot spots from the perspective of an external viewer.

[0095] At least one bottom layer 218 can optionally be provided under the substrate 202, on the side opposite the light guide layer 204. The bottom layer 218 can have aesthetic functions (by e.g. graphics, surface form, color, etc.), tactile functions (e.g. by surface form, material selection), protective functions (material properties, thickness, flexibility / stiffness, hardness, insulating properties, etc.), connection / fixation functions (e.g. adhesive, adhesive, mechanical such as protrusions, grooves, hooks, Velcro (nylon hook and loop)), conductive functions (electrically conductive material, traces, leads / wires or other conductors), and / or other functions.

[0096] In some embodiments, the bottom layer(s) 218 are omitted, and the assembly 200 is attached to a host device or other host element 218 via the substrate 202. As a further alternative, the assembly 200 can be of a standalone element or device type, or attached to a host or other element via other surfaces (e.g. via the side wall(s) / edge or top surface).

[0097] In some embodiments, the assembly 200 forms at least a portion of a housing or cover of a host device / element. For example, the assembly can be shaped accordingly to assume a generally convex, empty receptacle and / or container shape.

[0098] The assembly 200 can be configured for internal reflection, preferably within the light guide layer 204 based on the propagation of light that is totally internally reflected. The type of propagation of light by reflection can be enhanced by using suitable materials instead of undesired absorption / leakage. The light guide layer 204 can have, for example, a higher refractive index than the adjacent mask layer 106, substrate 202, bottom layer / host element surface / protective layer 218, and / or associated reflector. However, the position and geometry of the light guide layer 204 relative to the light source 214 (such as a top or side emitting LED) can be configured so that light generally reaches the material interface at an angle larger than the relevant critical angle to ensure internal reflection as understood by the skilled person.

[0099] In some embodiments, e.g. the substrate 202 and the light guide layer 204 have substantially similar optical properties, e.g. in terms of refractive index. The interface between the two can then be considered transparent or substantially non-existent, with respect to the incident light, and e.g. within the then functional combination of the light guide layer 204 and the substrate 202, its propagation based on total internal reflection.

[0100] With respect to the lighting features of assembly 200, one general purpose can be to provide uniform illumination or uniform "brightness" distribution towards the environment via window 116, without hot spots as described above. The directionality of the light (e.g. whether it is collimated or diffuse) can also be determined on a case-by-case basis. For example, diffuse / collimating lenses or other features can be implemented by appropriately shaped window fillers 116, 116C and / or other elements of the assembly. Embedded reflective / mirroring features (such as plate, film or layer surfaces) can be used for similar purposes.

[0101] In addition to the light projected / emitted by assembly 200 (produced by light source 214), the perceived illumination uniformity of the surface also depends on the uniformity of the reflected external light.

[0102] With respect to the reflective properties of window 116, 116C with respect to external light reaching from the environment of assembly 200, the associated filler (or other element of the assembly receiving external light, such as light guide layer 204, if there is no window filler, in the case of e.g. a through-hole type window) can incorporate an external surface facing the environment. This surface is preferably ideally or maximally slow- shooting to reflect such incoming light equally in every direction. For example, such slow-shooting properties can be achieved by increasing the surface roughness.

[0103] In order to obtain the required lighting performance, such as uniformity, in some embodiments, assembly 200 can be configured according to the illuminance of window 116, 116C or other element defining at least part of the external surface, which out-couples internally transmitted light to the environment, and possibly reflects external light. Thus, a constant illuminance of window 116, 116C from the underlying light guide layer 204 can be considered one possible design purpose.

[0104] Additionally or alternatively, the brightness and / or luminous intensity of window 116, 116C or other element can be configured to be at least sufficient (an appropriate level of sufficiency should be naturally determined by the skilled person under the particular embodiment) constant.

[0105] Generally, the lighting properties of assembly 200 and in particular e.g. its window 116, 116C can be determined in practice by the combination of the elements used, the associated materials, their mutual positioning, and the specifications and shapes. The shapes can cover both the surface topology and the overall geometry.

[0106] Figure 4 Flowchart 400 including embodiments of methods according to the present application are disclosed.

[0107] At the start of the method for manufacturing a multi-layer structure, a start-up phase 402 can be carried out. During the start-up 402, necessary tasks can be carried out, such as material, component and tool selection, acquisition, calibration and other configuration activities. It must be noted in particular that the individual elements and material selections work together and are free from the selected manufacturing and placement processes, which are naturally preferably checked in advance, according to the manufacturing process specifications and component data sheets, or for example by investigating and testing a production prototype. The equipment used, such as molding / IMD (in-mold decoration), lamination, adhesion, thermoforming, cutting, drilling and / or printing equipment, among others, can thus be ramped up to operational state in this section. The mold(s) can be prepared with the necessary surface forms, etc.

[0108] At 404, a preferably flexible substrate film or possibly other preferably planar substrate element is obtained for accommodating the electronic devices. A ready-made substrate material element, for example a roll of plastic film, can be obtained. In some embodiments, the substrate film itself can first be produced internally from the required source material(s) by molding, extrusion or other methods. Optionally, the substrate film is treated. For example, it can be coated, cut and / or provided with openings, notches, grooves, cut-outs, etc. as considered above. The initial and / or resulting film can have for example a rectangular, square or circular shape. The substrate can be opaque, semi-transparent or substantially transparent with respect to the wavelength of the light or generally electromagnetic radiation selected, such as the operating wavelength of the light sources or detectors provided thereon.

[0109] At 406, a plurality of conductive traces defining for example a conductor line, a contact pad (or other contact area), etc. of a required circuit pattern or circuit design for electrically coupling the electronic components are provided on the substrate film, preferably by reference to one or more printed electronics techniques of the relevant additive technology. For example, screen, inkjet, flexographic, gravure or offset lithographic printing can be utilized. Still further actions of cultivating the film, including for example printing graphics, visual indicators, etc. can be carried out here.

[0110] At 408, a plurality of light sources such as LEDs are provided on the substrate, the substrate optionally having one or more other electronic components. In practice, for example ready-made components such as various SMDs can be attached to the selected contact areas by solder and / or adhesive. Alternatively or additionally, printed electronics techniques can be applied to actually manufacture at least a part of the components directly on the film(s), such as OLEDs.

[0111] In a preferred embodiment, instead of or in addition to other light sources such as LEDs, at least one area light source such as an OLED is provided on the substrate, either by building it directly on top thereof, e.g. by printing the necessary functional layers, or by mounting it as at least a partly ready-made component or module, which can optionally be completed on the substrate by printing the remaining layers or using some other manufacturing method, as described above.

[0112] The area light source(s) can be positioned such that they substantially match the position of the window(s) of the mask layer to be provided on top of the molded light guide layer. Thus, the emitted light can reach the window(s) without reflection, or at least a substantial amount thereof, and via a straight and short path. The area light source(s) can be dimensioned such that the shape and / or size of the window(s) matches the selected range.

[0113] In some embodiments, the substrate film can be formed to assume a desired 3d shape (substantially non-planar shape), preferably by thermoforming 418, such as vacuum or pressure forming. The substrate containing a thermoformable material can be shaped to better fit the host device or use scenario. Additionally or alternatively, thermoforming can even be performed after the forming 410, provided that the already established multi-layer stack is designed to withstand such treatment. In view of the forming technique, for example, pressure forming can be applied to provide the substrate with very precise, sharp details. When the substrate lacks (through) holes, which can enable undesired flow and cause pressure drop via them, pressure forming can generally be preferred.

[0114] In some embodiments, a plurality of subassemblies of the electronic device / sub- substrate can be likewise provided to the host substrate at 409 and secured, e.g. by an adhesive.

[0115] At 410, at least one thermoplastic layer is molded at and on at least a portion of the electronic device on the first side of the substrate film, such as traces and a plurality of electronic components, which establishes a light guide for the light emitted by the light sources. Preferably, the light sources are at least partially embedded within the molded material. Thus, the optical contact between them and the molded light guide layer will be excellent, with low optical coupling losses. In practice, the substrate film can be used as an insert in an injection molding process. In some embodiments, the first side of the substrate element and the associated surface can be left with one or more areas, such as borders, without molded plastic. In some embodiments, both sides of the substrate film can be provided with molded layer(s). The thermoplastic material used is preferably at least translucent. It can still assume at least one color.

[0116] In case of using two films, one designated as substrate and the other as e.g. a mask layer or a layer underlying it in the assembly stack, both can be inserted into their own half-mold in order to inject a plastic layer between them. The other film can have optionally already been provided with electronic devices (e.g. printed electronics such as traces or components, sensor electrodes and / or mounting components), which are formed prior to molding, e.g. during performance of items 406, 408 and / or prior to molding. Electronic devices and / or other elements can be provided, e.g. on the side of the other film facing the substrate film and on the molded plastic.

[0117] The plastic can be injected via one or more locations, e.g. from the side(s) of the film(s). Thus e.g. edge injection and / or hole injection (injection of plastic between the films through one or more holes in the film(s)) can be applied. Alternatively, the other film for establishing e.g. a mask layer can be attached to the assembly of plastic light guide layer and substrate film after molding by suitable lamination techniques.

[0118] The other film can be provided with at least one hole for the aforementioned window(s). The hole can be produced by a cutting, drilling, engraving, stamping or etching operation, for example. During molding, the thermoplastic molding material can then enter the hole from either or both sides, optionally also traveling to the other side of the film, and establish at least a portion of the window filling for the relevant film.

[0119] In some embodiments, no through hole is prepared in the other film prior to molding. The film can optionally still have a point that is thinned or otherwise weakened (formed using one of the above-mentioned operations, for example) at the target position of the window in order to facilitate the formation of the window during molding due to the pressure of the molding material. In some embodiments, the mold surface in contact with the other film can have surface features such as grooves, perforated areas, flaps or small holes thereon that correspond to the target position of the window in the other film, which can facilitate the formation and / or filling of the window during molding. Thus, features in the other film that match and face the desired area of the window can further enable the molding material to flow via the window to the other side of its other film (i.e. the mold / external side).

[0120] With regard to a few examples of suitable material selection, the substrate film and / or possible additional film(s) or material layer(s) can essentially consist of or include at least one material selected from the group consisting of: a polymer, a thermoplastic material, PMMA (polymethyl methacrylate), polycarbonate (PC), polyimide, a copolymer of methyl methacrylate and styrene (MS resin), glass, an organic material, a fiber material, polyethylene terephthalate (PET) and a metal.

[0121] Possible molding methods include, for example, injection molding. In the case of several plastic materials, they can be molded using a dual-shot or generally multi-shot molding method. A molding machine with multiple molding units can be utilized. Alternatively, several machines or a single reconfigurable machine can be used to sequentially provide several materials.

[0122] With respect to the associated surface area, the first side of the substrate and thus the associated first surface has thus been at least partially overmolded (overmolding, two-color molding) by a plastic, preferably and generally a thermoplastic material. Optionally, several materials suitable for overmolding can be utilized to establish one or more molding layers, for example adjacent layers, which are placed side by side on the first side of the substrate and / or form a stack of multiple superposed layers thereon.

[0123] The (thermo)plastic material used to establish the molding layer(s) comprises a material which is optically substantially opaque, transparent or translucent with respect to a selected wavelength, for example light emitted by an embedded light source, such as visible light, to enable passage therethrough with negligible loss. For example, depending on the implementation, the sufficient transmissivity of the material at the selected wavelength can be about 60%, 70%, 75%, 85%, 90% or 95% or higher. Possible further molding (thermo)plastic materials, such as the material establishing the mask layer, can be substantially opaque or translucent.

[0124] The plastic layer(s) set by the overmolding procedure can generally incorporate, for example, an elastomeric resin. In more detail, the layer(s) can comprise one or more thermoplastic materials comprising at least one material selected from the group consisting of: PC, PMMA, ABS (acrylonitrile butadiene styrene), PET, Nylon (PA, polyamide), polypropylene (PP), polystyrene (GPPS) and MS resin.

[0125] At 412, the assembly can finally be provided with further layer(s) such as a mask layer, if not already present with reference to the previous paragraph. The provision can include direct fabrication, by, for example, molding, deposition / other coating methods and attachment. The window-defined cutout or aperture in the mask and possible further layers can be provided by drilling, engraving, sawing, etching, cutting (for example, using a laser or a mechanical blade), or using any other feasible processing method understood by the person skilled in the art. Alternatively, for example, the layer(s) can be produced with ready-made window features by molding.

[0126] Suitable lamination techniques for fixing the various layer(s) onto the assembly utilize, for example: adhesives, elevated temperature and / or pressure-based bonding.

[0127] The resulting overall thickness of the stack structure obtained depends to a large extent on the materials used and the associated minimum material thicknesses, taking into account the provision of the necessary strength in terms of manufacture and subsequent use. These aspects must be considered on a case-by-case basis. For example, the overall thickness of the structure can be approximately 1 mm, but considerably thicker or thinner embodiments are also feasible.

[0128] Item 414 relates to possible post-processing tasks and attachment to a host device or element.

[0129] At 416, the method execution ends.

[0130] The scope of the invention is defined by the appended claims, together with equivalents thereof. It will be understood by those within the art that the disclosed implementations are merely exemplary in nature, and that other arrangements of the described embodiments can readily be prepared by those skilled in the art without departing from the spirit and scope of the invention. For example, instead of a substantially opaque mask layer, in some applications a translucent (e.g., diffusive) material can be used therein. The translucent material would still hinder or prevent direct light propagation through the mask layer.

Claims

1. A multi-layered assembly (100, 200, 300) for an electronic device, said assembly comprising: A flexible substrate film (202) is configured to accommodate electronic devices (210, 212) on at least a first side of the substrate film, the substrate film having a first side and a second side. A regional light source (215) is disposed on the first side of the substrate film (202) and configured to emit light of a predetermined frequency or frequency band, the predetermined frequency or frequency band including or limited to visible light. A molded plastic light guide layer (204) is disposed on the first side of the substrate film (202) and at least partially embedded in the regional light source (215). The plastic light guide layer (204) has a material that is optically at least semi-transparent with respect to the predetermined frequency or frequency band. The plastic light guide layer (204) is configured to transmit light emitted by the embedded regional light source (215), such that the transmitted light propagates within the plastic light guide layer (204) and couples outward from the plastic light guide layer (204) through its outer surface. The outer surface of the plastic light guide layer (204) is opposite to another surface of the plastic light guide layer (204), which faces the first side of the substrate film (202) and the regional light source (215) on the substrate film (202). Therefore, the regional light source (215) is at least partially embedded in the plastic light guide layer (204) via the other surface. A mask layer (106) is disposed on the outer surface of the plastic light guide layer (204), the mask layer (106) containing an opaque material to block external observation of at least some internal components of the multilayer assembly, wherein the mask layer (106) defines a window for allowing light emitted by the embedded area light source (215) and propagating within the plastic light guide layer to pass through the mask layer (106) toward the environment, wherein the area light source (215) is positioned opposite the window. The area light source (215) is flat, and the light emitted by the flat area light source (215) is diffuse and uniform. The assembly further includes a plurality of additional light sources (214) on the substrate film (202), the additional light sources being surface-mount elements, wherein the additional light sources (214), the mask layer (106), and the associated windows are configured to each other such that, at least within a selected viewing angle (220), there is no direct line-of-sight path from the outside of the assembly through the window to the additional light sources (214). The component further includes a plurality of light receivers or detectors disposed on the substrate film and configured to sense light received through the window and / or light emitted by the regional light source and propagating within the plastic light guide layer.

2. The component according to claim 1, wherein, The additional light sources are LEDs.

3. The component according to claim 1, wherein, The additional light source (214), the mask layer (106), and the associated window are configured such that, at least within a selected viewing angle (220), there is no direct line-of-sight path from the outside of the component through the window to the additional light source (214) and the additional electronic devices (210, 212).

4. The component according to claim 1, wherein, The additional light source (214), the mask layer (106), and the associated window are configured such that, at least within a selected viewing angle (220), including a zero angle from the surface normal of the mask layer, there is no direct line-of-sight path from the outside of the component through the window to the additional light source (214).

5. The component according to claim 1, wherein, The additional light source (214), the mask layer (106), and the associated window are configured such that, at least within a selected viewing angle (220), including a zero angle from the surface normal of the mask layer, there is no direct line-of-sight path from the outside of the component through the window to the additional light source (214) and the additional electronic devices (210, 212).

6. The component according to claim 1, wherein, The component also includes a protective overlay (108) on the mask layer (106).

7. The component of claim 6, wherein the overlay has an optically transparent material with respect to the predetermined frequency or frequency band of the regional light source (215), or defines a window without material, or has an optically translucent or transparent material with respect to the predetermined frequency or frequency band of the regional light source.

8. The component according to claim 7, wherein, The window without material is a through hole.

9. The component according to any one of claims 1 to 8, wherein the regional light source (215) comprises a light source printed or mounted on the substrate film.

10. The component of claim 9, wherein, The regional light source (215) is an organic light-emitting diode.

11. The component according to any one of claims 1 to 8, wherein the area light source (215) defines a flat circular shape or at least a shape having a circular edge.

12. The component according to any one of claims 1 to 8, wherein the area light source (215) conforms to the size and / or shape of the window.

13. The component according to any one of claims 1 to 8, wherein the component further comprises a bottom layer (218) on the second side of the substrate film.

14. The component of claim 13, wherein the bottom layer includes or is established by an attachment feature for securing the component to a body device.

15. The component of claim 14, wherein, The attachment features include adhesive or mechanical fastening structures.

16. The component according to any one of claims 1 to 8, wherein at least the substrate film is formed in a three-dimensional non-planar shape.

17. The component according to any one of claims 1 to 8, wherein the window is a through hole.

18. The component according to any one of claims 1-8, wherein the window comprises an optically translucent or transparent material with respect to the predetermined frequency or frequency band.

19. The component according to any one of claims 1-8, wherein the window defines an optical diffuser.

20. The component according to any one of claims 1 to 8, wherein the window defines at least one lighting element selected from the group consisting of: graphic patterns, text, symbols, numbers, and pictures.

21. The component according to any one of claims 1 to 8, wherein the illuminance, brightness, or luminous intensity associated with the window is constant in order to provide uniform illumination to the environment.

22. The component according to any one of claims 1 to 8, wherein the substrate film contains an optically translucent or transparent material with respect to the predetermined frequency or frequency band.

23. The component according to any one of claims 1 to 8, wherein the component is configured for internal reflection based on the propagation of light within the component.

24. The component of claim 23, wherein the component is configured for total internal reflection based on the propagation of light within the component.

25. The component according to any one of claims 1 to 8, wherein the substrate film comprises at least one material selected from the group consisting of: glass, organic materials, and metals.

26. The component according to any one of claims 1 to 8, wherein the substrate film comprises a polymer.

27. The component according to any one of claims 1 to 8, wherein the substrate film comprises at least one material selected from the group consisting of thermoplastic materials and fibrous materials.

28. The component according to any one of claims 1 to 8, wherein the substrate film comprises at least one material selected from the group consisting of: polymethyl methacrylate, polycarbonate, polyimide, copolymer of methyl methacrylate and styrene, and polyethylene terephthalate.

29. The component according to any one of claims 1 to 8, wherein the plastic light guide layer comprises at least one material selected from the group consisting of: polycarbonate, polymethyl methacrylate, acrylonitrile butadiene styrene, polyethylene terephthalate, nylon, polypropylene, polystyrene, and copolymers of methyl methacrylate and styrene.

30. The component according to any one of claims 1 to 8, wherein the electronic device located on the substrate film comprises at least one element selected from the group consisting of: conductive traces, contact pads, components, integrated circuits, batteries, light emitting devices, light sensing devices, connectors, diodes, sensors, antennas, and electrodes.

31. The component according to any one of claims 1 to 8, wherein the electronic device located on the substrate film comprises at least one element selected from the group consisting of: printed conductive traces, processing units, memory, communication units, microcontrollers, photodiodes, electrical connectors, optical connectors, light-emitting diodes, printed electronic components, force sensors, accelerometers, gyroscopes, capacitive switches or sensors, sensor electrodes, and photovoltaic cells.

32. The component according to any one of claims 1 to 8, wherein the electronic device located on the substrate film comprises at least one element selected from the group consisting of: transceiver, transmitter, receiver, signal processor, organic light-emitting diode, printed sensor electrode.

33. A method (400) for constructing a multi-layered assembly (100, 200, 300) for an electronic device, the method comprising: A flexible substrate film (404) is obtained, the substrate film being configured to accommodate electronic devices on at least a first side of the substrate film, the substrate film having a first side and a second side. At least one regional light source (215) is disposed (408) on the first side of the substrate film. The regional light source is configured to emit light of a predetermined frequency or frequency band, wherein the regional light source (215) is flat, and the light emitted by the flat regional light source (215) is diffuse and uniform. A plastic light guide layer is molded (410) on the first side of the substrate film, thus at least partially embedding the regional light source. The plastic light guide layer has a material that is optically at least semi-transparent with respect to the predetermined frequency or frequency band of light. The plastic light guide layer is configured to transmit light emitted by the embedded regional light source, such that the transmitted light propagates within the plastic light guide layer and couples outwardly through the outer surface of the plastic light guide layer, wherein the outer surface of the plastic light guide layer faces another surface of the plastic light guide layer, the other surface facing the first side of the substrate film and the regional light source located on the substrate film, so that the regional light source is at least partially embedded in the plastic light guide layer via the other surface. A mask layer (412) is disposed on the outer surface of the plastic light guide layer, the mask layer containing an opaque material to block external observation of at least some internal components of the multilayer assembly, wherein the mask layer defines a window for allowing light emitted by the embedded regional light source and propagating within the plastic light guide layer to pass through the mask layer toward the environment, wherein the regional light source (215) is positioned opposite the window, and A plurality of additional light sources (214) are disposed on the substrate film (202), the additional light sources being surface-mount elements, wherein the additional light sources (214), the mask layer (106), and the associated windows are configured to each other such that: at least within a selected viewing angle (220), there is no direct line-of-sight path from the outside of the assembly through the window to the additional light sources (214). The method further includes disposing a plurality of light receivers or detectors on the substrate film, the light receivers or detectors being configured to sense light received through the window and / or light emitted by the regional light source and propagating within the plastic light guide layer.

34. The method according to claim 33, wherein, The other light source is an LED.

35. The method according to claim 33, wherein, The additional light source (214), the mask layer (106), and the associated window are configured such that, at least within a selected viewing angle (220), there is no direct line-of-sight path from the outside of the component through the window to the additional light source (214) and the additional electronic devices (210, 212).

36. The method according to claim 33, wherein, The additional light source (214), the mask layer (106), and the associated window are configured such that, at least within a selected viewing angle (220), including a zero angle from the surface normal of the mask layer, there is no direct line-of-sight path from the outside of the component through the window to the additional light source (214).

37. The method according to claim 33, wherein, The additional light source (214), the mask layer (106), and the associated window are configured such that, at least within a selected viewing angle (220), including a zero angle from the surface normal of the mask layer, there is no direct line-of-sight path from the outside of the component through the window to the additional light source (214) and the additional electronic devices (210, 212).

38. The method according to any one of claims 33 to 37, wherein additional films for forming the mask layer or a layer between the mask layer and the plastic photoconductive layer, and the substrate film are disposed within a mold, each abutting against an opposing half-mold, and a thermoplastic material for forming the plastic photoconductive layer is molded between the two films.

39. The method of claim 38, wherein the additional membrane contains or is treated to contain a through-hole for the window.

40. The method of claim 38, wherein the additional membrane contains or is processed to contain surface features located at the target position of the window, enabling window formation during the molding process due to the introduction of associated pressure on the surface features.

41. The method according to claim 40, wherein, The surface features are thinned portions, perforated portions, or sheet-like structures.

42. The method of claim 38, wherein the mold has a groove or hole aligned to match the position of the window.

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