A high-power remotely-excited fluorescent ceramic white LED with a heat dissipation component

Abstract

The present invention discloses a high-power remotely excited fluorescent ceramic type white LED with a heat dissipation component, which solves the technical problem of heat dissipation of fluorescent ceramics as a light conversion material for white LEDs. The present invention includes an upper fixing seat, in which a fluorescent ceramic and a heat dissipation component for cooling the fluorescent ceramic are provided. A gland for fixing the heat dissipation component is connected to the upper part of the upper fixing seat, and a lower fixing seat is connected to the lower part of the upper fixing seat. An LED chip is arranged in the lower fixing seat, and a temperature reduction component for cooling the LED chip is provided on the lower fixing seat. The present invention uses the LED chip to excite the fluorescent ceramic and separately dissipates heat from the LED chip and the fluorescent ceramic through the heat dissipation component arranged in the upper fixing seat and the temperature reduction component connected to the lower fixing seat. The structure is simple, the assembly is convenient, the heat dissipation rate is fast and controllable, which is beneficial to industrial production, and solves the problems of heat dissipation of fluorescent ceramics as a light conversion material for white LEDs and the restriction of temperature and efficiency in the light-emitting device.

Description

Technical Field

[0001] The present invention relates to the technical field of novel solid-state lighting, and particularly to a high-power remote-excited fluorescent ceramic type white LED with a heat dissipation component. Background Art

[0002] White LEDs have the advantages of energy conservation, environmental protection, high luminous efficiency, long lifespan, and flexible volume, and are considered as a new generation of lighting sources. The mainstream method of white LEDs is to coat a mixture of fluorescent powder and silicone resin on the chip, and the light emitted by the fluorescent powder is mixed with the light not absorbed by the LED chip to form white light. Currently, limited by the physical limit of the LED chip, the light conversion efficiency of the LED chip is about 30%. The remaining electrical energy is released in the form of heat, and the accumulation of a large amount of heat and thermal shock seriously affect the service life of white LEDs. More seriously, too high temperature will cause phenomena such as thermoluminescence decay, cracking, and carbonization of materials in the form of "fluorescent powder and silicone resin", leading to problems such as the decline of the luminous quality of white LEDs and dead lights. The above problems seriously restrict the application and development of white LEDs.

[0003] Based on this, fluorescent ceramics came into being, which have excellent thermal conductivity, luminous stability, mechanical processing performance, and physical and chemical properties. Taking rare-earth cerium-doped yttrium aluminum garnet fluorescent ceramic (Y 3 Al 5 O 12 :Ce 3+ , YAG:Ce) as an example, domestic and foreign researchers have carried out a large number of refined modification studies on YAG:Ce fluorescent ceramics and achieved remarkable results. However, currently, it has not been found that fluorescent ceramics are used as light conversion materials in white LED devices, and most studies only stay at the laboratory stage. Therefore, it is urgent to strengthen the application research on the heat dissipation and packaging of fluorescent ceramics.

[0004] In the literature (Ceramics International 47 (2021) 9156–9163), a series of LuAG:Ce,Mn,Si fluorescent ceramics were prepared. When testing the luminescence properties of the ceramics, (semi-)industrial encapsulation was not carried out. Instead, the fluorescent ceramics were simply covered on the upper surface of the blue LED chip. This encapsulation form not only fails to play a heat dissipation role, but also affects the luminescence properties of the ceramics. In the literature (Optics Express 29(8) 11938-11946(2022)), encapsulation was carried out on GdYAG:Ce fluorescent ceramics. Unfortunately, in this study, the GdYAG:Ce ceramics were also pasted above the blue LED chip. In the prior art, a Chinese patent such as CN204693214U discloses a remote phosphor-excited white LED downlight; this patent only physically separates the phosphor powder from the blue LED light source assembly to achieve remote excitation, which has an essential technical difference from the present invention. In the prior art, a Chinese patent such as CN204857779U discloses a remote-excited LED light emitter with good heat dissipation; this patent only describes the distance between the LED chip and the phosphor rubber sleeve macroscopically, without pointing out the mathematical relationship between this distance, the light-emitting surface of the chip, and the chip power. The present invention believes that the distance between the LED chip and the fluorescent ceramic directly affects the light-emitting efficiency of the device and the heat dissipation rate of the ceramic, and gives a specific quantitative relationship.

[0005] In summary, traditional LED device heat sinks only focus on the heat dissipation of the chip. There is no special heat dissipation device for fluorescent ceramics. There is quantum loss during the light conversion of fluorescent ceramics, generating a certain amount of waste heat, which seriously affects the light-emitting efficiency and quality. The literature (Journal of Materials Chemistry C, 2019, 7(37): 11449-11456) has quantified the waste heat generated by ceramics. In addition, most fluorescent ceramics have a sharp decline in their luminescence intensity, even a 50% reduction, under a service environment of about 150 o °C. Therefore, heat dissipation and encapsulation design for fluorescent ceramics are the technical bottlenecks that need to be broken through urgently for their application in white LEDs.

[0006] To solve the problem that the existing heat dissipation technology cannot take into account the heat dissipation of fluorescent ceramics, the present invention provides a remote-excited fluorescent ceramic type white LED device and its heat dissipation device, and designs a heat dissipation device for the fluorescent ceramics separately. Summary of the Invention

[0007] In view of the deficiencies in the above-mentioned background technology, the present invention proposes a high-power remotely excited fluorescent ceramic type white light LED with a heat dissipation component, which solves the problem that the existing technology cannot take into account the heat dissipation of fluorescent ceramics and LED chips. The present application designs heat dissipation devices for fluorescent ceramics and LED chips separately, which can not only increase the heat dissipation efficiency and thus prevent the problem of heat accumulation, but also effectively solve the problem of remotely excited packaging of fluorescent ceramics, greatly improving the application process of fluorescent ceramics.

[0008] The technical solution of the present invention is implemented as follows: a high-power remote-excitation fluorescent ceramic white light LED with a heat dissipation component includes an upper fixing seat, in which a fluorescent ceramic and a heat dissipation component for cooling the fluorescent ceramic are arranged, the upper part of the upper fixing seat is connected to a pressure cover for fixing the heat dissipation component, the lower part of the upper fixing seat is connected to a lower fixing seat, the LED chip is arranged in the lower fixing seat, and the lower fixing seat is provided with a cooling component for cooling the LED chip.

[0009] Furthermore, the cooling component includes a heat pipe system and a heat dissipation fin group, the upper part of the heat pipe system is connected to the lower fixing seat, and the lower part of the heat pipe system is connected to the heat dissipation fin group.

[0010] Furthermore, the heat pipe system is a gravity heat pipe, the number of gravity heat pipes is 4 to 10, the evaporation end of the gravity heat pipe is arranged in the lower fixed seat, and the condensation end of the gravity heat pipe is connected to the heat dissipation fin group.

[0011] Furthermore, a groove is provided on the upper portion of the lower fixing seat, and the LED chip is arranged in the groove. The bottom of the lower fixing seat is evenly distributed with heat dissipation fins, and a through hole cooperating with the gravity heat pipe is provided on the side wall of the lower fixing seat.

[0012] Furthermore, the heat dissipation assembly includes a support block and at least two turbo fans, the turbo fans are arranged in the mounting groove of the upper fixing seat and are located between the support block and the upper fixing seat, and the air outlet of the turbo fans is arranged in the air outlet hole on the support block.

[0013] Furthermore, the pressure cover is provided with a first light exit hole and a turbofan mounting hole cooperating with the turbofan.

[0014] Furthermore, a second light emitting hole and a receiving structure are provided in the upper fixing seat. The receiving structure is located at the lower part of the upper fixing seat and is an integrally formed structure with the upper fixing seat. The fluorescent ceramic is arranged in the receiving structure.

[0015] Furthermore, the emission peak wavelength of the LED chip is in the range of 200 nm to 500 nm, and the distance H between the LED chip and the fluorescent ceramic is numerically H=(1 / 20 to 1 / 10)S, where H is in mm, and S is the light-emitting area of ​​the LED chip, where S is in mm. 2 .

[0016] Further, the fluorescent ceramic is a ceramic containing at least one rare earth ion or transition metal ion, with an emission peak of 430 nm to 780 nm, and the thickness of the fluorescent ceramic is 0.8 mm to 2.0 mm.

[0017] The beneficial effects of the present invention are as follows: In this application, an LED chip is used to excite the fluorescent ceramic, and a heat dissipation component arranged in the upper fixing seat is used to dissipate heat from the fluorescent ceramic alone, while a temperature reduction component connected to the lower fixing seat is used to dissipate heat from the LED chip alone. This solves the technical problem of heat dissipation of the fluorescent ceramic as a light conversion material for white LEDs. The structure is simple, the assembly is convenient, the heat dissipation rate is fast and controllable, which is conducive to industrial production, and solves the problem of the restriction of temperature and efficiency in the light-emitting device.

[0018] 1. The present invention not only solves the heat dissipation problem of the LED chip, but also solves the heat dissipation problem of the fluorescent ceramic under the excitation of a high-power LED chip, enabling the fluorescent ceramic to stably emit light under the excitation of a high-power LED chip, manufacturing a high-power (with a power of 50 W - 300 W) white LED device, and realizing the application of the fluorescent ceramic.

[0019] 2. The present invention adopts the cooperation mode of the gland, the upper fixing seat and the lower fixing seat to solve the packaging problem of the fluorescent ceramic, and realizes the high-efficiency emission of white LEDs with different powers by setting different distances between the chip and the ceramic in different devices.

[0020] 3. The present invention solves the mathematical relationship between the light-emitting area of the LED chip and the spatial distance of the fluorescent ceramic, that is, numerically, the spatial distance between the fluorescent ceramic and the LED chip (unit: mm) is 1 / 20 to 1 / 10 times the light-emitting area of the LED chip (unit: mm 2 ), which is applicable to high-power remote excitation type white LEDs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention, and those of ordinary skill in the art can obtain other drawings without creative efforts based on these drawings.

[0022] Figure 1 It is a schematic structural diagram of the present invention;

[0023] Figure 2 It is a schematic structural diagram of the lower fixing seat;

[0024] Figure 3 It is a schematic structural diagram of the upper fixing seat;

[0025] Figure 4is a top view of the upper fixing seat;

[0026] Figure 5 is a schematic diagram of the structure of the support block;

[0027] Figure 6 It is a schematic diagram of the structure of the gland;

[0028] Figure 7 Schematic diagram of the fin structure of the heat dissipation fin.

[0029] In the figure: 1. pressure cover, 101. first threaded hole, 102. turbofan mounting hole, 103. first light output hole, 2. support block, 201. air outlet, 3. turbofan, 4. upper fixing seat, 401. second threaded hole, 402. mounting groove, 403. receiving structure, 404. second light output hole, 5. fluorescent ceramic, 6. LED chip, 7. lower fixing seat, 701. heat dissipating fin, 702. through hole, 703. groove, 704. third threaded hole, 705. mounting hole, 8. heat pipe system, 9. heat dissipating fin group, 901. perforation, 902. arc groove, 903. flange feature. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] like Figure 1As shown in the figure, in Embodiment 1, a high-power remotely-excited fluorescent ceramic white LED with a heat dissipation component includes an upper fixing seat 4. A fluorescent ceramic 5 and a heat dissipation component for cooling the fluorescent ceramic 5 are provided inside the upper fixing seat 4. A gland 1 for fixing the heat dissipation component is connected to the upper part of the upper fixing seat 4. A lower fixing seat 7 is connected to the lower part of the upper fixing seat 4. An LED chip 6 is arranged inside the lower fixing seat 7. A cooling component for cooling the LED chip 6 is provided on the lower fixing seat 7. The cavities of the upper fixing seat 4 and the lower fixing seat 7 are coated with a highly reflective material, which can avoid the loss of light absorbed by the cavity during the light conversion process. The light-emitting area of the LED chip 6 is the same as the area of the fluorescent ceramic 5. The LED chip 6 emits white light and excites the fluorescent ceramic 5, and the emitted light source is stable. The heat dissipation component cooperates with the upper fixing seat 4 to cool the fluorescent ceramic 5, and the cooling component cooperates with the lower fixing seat 7 to cool the LED chip 6. Under the action of the heat dissipation component and the cooling component, the heat generated by the lower fixing seat connected with the LED chip will not affect the upper fixing seat. It solves the technical problems of heat dissipation of the fluorescent ceramic 5 as a light conversion material for white LEDs and the temperature and efficiency constraints in the light-emitting device. The structure is simple, the assembly is convenient, the heat dissipation rate is fast and controllable, which is conducive to industrial production.

[0032] In this embodiment, the cooling component includes a heat pipe system 8 and two sets of heat dissipation fin groups 9. The heat pipe system 8 and the heat dissipation fin groups 9 are symmetrically arranged on both sides of the lower fixing seat. The two sets of heat dissipation fin groups 9 are composed of 20 - 60 fins, preferably 60 fins. The fins are in a plate-like structure. A plurality of plate-like structures are stacked to form the heat dissipation fin group. Flanging features 903 are vertically connected to both ends of the plate-like structure. The flanging features facilitate the heat dissipation space when the heat dissipation fin groups 9 are stacked. An arc-shaped groove 902 is provided in the middle of the flanging feature 903 close to the plate-like structure. The arc-shaped groove 902 facilitates the circumferential heat dissipation of the heat dissipation fin groups 9. The upper part of the heat pipe system 8 is connected inside the lower fixing seat 7, and the lower part of the heat pipe system 8 is connected to the heat dissipation fin groups 9. The number of the heat dissipation fin groups 9 is 20 - 60, preferably 40. The heat pipe system 8 is a gravity heat pipe. The number of the gravity heat pipes is 4 - 10, preferably 8. The evaporation end of the gravity heat pipe is arranged inside the lower fixing seat 7, and the condensation end of the gravity heat pipe is connected to the stacked heat dissipation fin groups 9. Perforations 901 matching the gravity heat pipes are provided on the heat dissipation fin groups 9. Using the gravity heat pipe to cool the LED chip 6 has a stable cooling effect and can continuously and effectively ensure the working temperature of the LED chip 6. The heat generated by the LED chip is dissipated through the gravity heat pipes and the heat dissipation fin groups connected to the lower fixing seat, and will not affect the upper fixing seat.

[0033] In this embodiment, a groove 703 is provided in the upper part of the lower fixing base 7. The groove 703 is a rectangular groove that mates with the LED chip 6. The LED chip 6 is disposed in the groove 703 and is fixed in the mounting hole 705 at the bottom of the groove by screws. LED chips 6 with different powers are installed in grooves 703 with different depths to ensure the luminous efficiency of the light source of the LED chip 6. Heat dissipation fins 701 are evenly distributed on the bottom of the lower fixing base 7. A number of heat dissipation fins 701 are evenly distributed on the bottom surface of the lower fixing base 7, increasing the contact area between the lower fixing base 7 and the air and facilitating the heat dissipation of the lower fixing base 7. A through hole 702 that mates with a gravity heat pipe is provided on the side wall of the lower fixing base 7. The evaporation end of the gravity heat pipe is disposed in the through hole 702, facilitating the transfer of the heat generated when the LED chip 6 operates from the lower fixing base to the gravity heat pipe for heat dissipation and preventing the operating temperature of the LED chip from being too high.

[0034] In this embodiment, the heat dissipation component includes a support block 2 and four turbo fans 3. The turbo fans 3 are disposed in the mounting groove 402 of the upper fixing base 4 and are located between the support block 2 and the upper fixing base 4. The mounting groove 402 is a "cross"-shaped groove. The turbo fans are evenly distributed on the four branches of the "cross"-shaped groove and do not touch each other. The support block is located in the middle of the "cross"-shaped groove and is snap-connected to the turbo fans. The support block 2 is a frame-shaped support block 2. Air outlet holes 201 are circumferentially distributed on the frame-shaped support block 2. The support block 2 is disposed in the middle of the mounting groove 402 to support the turbo fans. The air outlet of the turbo fan 3 is disposed in the air outlet hole 201 on the support block 2. The support block 2 is disposed in the upper fixing base 4 and is fixed in the upper fixing base 4 by a gland 1. The turbo fan 3 is disposed between the support block 2 and the upper fixing base 4, and the air outlet of the turbo fan 3 is disposed in the air outlet hole 201 on the support block 2. The gland 1 is provided with a first light-emitting hole 103 and a turbo fan mounting hole 102 that mates with the turbo fan 3. The turbo fan mounting hole 102 restricts the movement of the turbo fan, fixing the position of the turbo fan and preventing the turbo fan from tilting into the second light-emitting hole. The fluorescent ceramic 5 is disposed at the bottom of the mounting groove 402 and is connected to the receiving structure 403. The air outlet of the turbo fan 3 faces the inside of the support block 2, facilitating the removal of the heat of the fluorescent ceramic 5 to achieve the purpose of cooling. A second light-emitting hole 404 and a receiving structure 403 for receiving the LED chip 6 are provided in the upper fixing base 4. The receiving structure 403 is located in the lower part of the upper fixing base 4 and is an integrally formed structure with the upper fixing base 4. The support block is disposed in the upper part of the receiving structure. The receiving structure 403 is a rectangular ring structure, and the fluorescent ceramic 5 is connected to the rectangular ring structure, preventing the fluorescent ceramic 5 from falling downward into the lower fixing base 7 and ensuring the remote excitation effect of the LED chip on the fluorescent ceramic at the same time.

[0035] In this embodiment, the emission peak band range of the LED chip 6 is 200 nm to 500 nm. The distance H between the LED chip 6 and the phosphor ceramic 5 is numerically H = (1 / 20 - 1 / 10)S, where the unit of H is mm and the unit of S, which is the light-emitting area of the LED chip 6, is mm 2 . The light-emitting area of the LED chip 6 is a fixed value. The depth of the processing groove 703 is selected according to the light-emitting area of the LED chip 6. By varying the distance between different phosphor ceramics 5 and the LED chip 6, stable white light excitation is ensured, and at the same time, the individual heat dissipation effects of the LED chip 6 and the phosphor ceramic 5 are guaranteed. The LED chip 6 is any LED chip with an emission peak in the band range of 200 nm to 500 nm. The phosphor ceramic 5 is a luminescent ceramic with at least one of rare earth ions or transition metal ions as the luminescent center, and its emission peak is located at 430 nm to 780 nm. The LED chip 6 is a COB type LED chip, and the LED chip 6 within this range can emit stable white light. The phosphor ceramic 5 is a luminescent ceramic with at least one of rare earth ions or transition metal ions as the luminescent center. This ceramic has good luminous power and stable excited light source, and is suitable for industrial production.

[0036] Specifically, in the encapsulation process, the upper part of the gravity heat pipe is connected to the lower fixing seat 7, and the lower part of the gravity heat pipe is connected to a plurality of stacked heat dissipation fin groups 9. The LED chip 6 is placed in the groove 703 of the lower fixing seat 7 to form a temperature reduction structure for the LED chip 6. The phosphor ceramic 5 is cut so that its light-emitting area is the same size as that of the LED chip 6. Then, the cut phosphor ceramic 5 is installed on the receiving structure 403 of the upper fixing seat 4. Then, the heat dissipation fan and the support block 2 are installed, and the gland 1 is installed on the upper fixing seat 4. Long bolts are used to connect to the first threaded hole 101 on the gland 1, the second threaded hole 401 on the upper fixing seat 4, and the third threaded hole 704 on the lower fixing seat 7 in sequence to complete the encapsulation.

[0037] Embodiment 2

[0038] A remote-excited phosphor-ceramic type white LED with heat dissipation and a power of 300W, which includes the following parameters, encapsulation, and usage steps:

[0039] Parameters: The phosphor ceramic selected is LuAG:Ce,Cr, with a thickness of 2 mm and a side length of 35 mm; the LED chip selected is a COB type chip with an emission peak of 460 nm and a power of 300W.

[0040] The light-emitting area of the COB type LED chip with a power of 300W is 1225 mm 2Then, the spatial distance between the fluorescent ceramic and the LED chip is numerically 1 / 10 times the light-emitting area of the LED chip, and the calculated spatial distance between the fluorescent ceramic and the LED chip is 122.5 mm. There are 10 gravity heat pipes, and the total number of fins in the heat dissipation fin group is 60 pieces.

[0041] Step S1: Cut the LuAG:Ce,Cr fluorescent ceramic so that its light-emitting area is the same size as that of the LED chip. After applying thermal grease to the edge of the LuAG:Ce,Cr ceramic, it is installed in the upper fixing seat 4, and the turbine fan 3 and the support block 2 are successively installed in the upper fixing seat 4. The gland 1 is connected to the upper fixing seat 4 by bolts, and thermal grease is applied at the contact area between the two. The device obtained after step S1 is named A. A satisfies the separate heat dissipation of the fluorescent ceramic.

[0042] Step S2: Connect the evaporation ends of 10 gravity heat pipes to 5 through holes on both sides of the lower fixing seat 7 respectively. The condensation ends of the gravity heat pipes are connected to the heat dissipation fin group, and 30 fins are stacked and installed on one side. Apply thermal grease to the bottom of the LED chip, and connect the LED chip to the lower fixing seat 7 with the heat dissipation fin group and gravity heat pipes installed by screws. The device obtained after step S2 is named B. B completes the separate heat dissipation of the LED chip.

[0043] Step S3: Connect the device A obtained in step S1 and the device B obtained in step S2, and apply thermal grease in the middle. Applying thermal grease can connect the upper fixing seat and the lower fixing seat to complete the encapsulation of this device.

[0044] Step S4: After turning on the power, the device obtained in step S3 enters the normal working state. The LED chip emits white light and remotely excites the fluorescent ceramic. At the same time, the turbine fan and 10 gravity heat pipes start to work, cooling the fluorescent ceramic and the LED chip respectively. The highest temperature of the whole system is controlled within 110 o °C. It can enable the fluorescent ceramic to stably emit light under the excitation of a 300W LED chip, realizing the application of the fluorescent ceramic.

[0045] Example 3

[0046] A remotely excited fluorescent ceramic type white LED with a power of 50W and heat dissipation, which includes the following parameters, encapsulation and usage steps:

[0047] Parameters: The fluorescent ceramic is selected as LuAG:Ce,Cr, with a thickness of 0.8 mm and a side length of 20 mm; the LED chip is selected as a COB type chip, with an emission peak of 460 nm and a power of 50W.

[0048] The light-emitting area size of the COB type LED chip with a power of 50W is 400 mm 2Then, the spatial distance between the fluorescent ceramic and the LED chip is numerically 1 / 10 times the luminous area of the LED chip, and the calculated spatial distance between the fluorescent ceramic and the LED chip is 40 mm. There are 4 gravity heat pipes, and the total number of fins in the heat dissipation fin group is 20 pieces.

[0049] Step S1: Cut the LuAG:Ce,Cr fluorescent ceramic so that its luminous area is the same size as that of the LED chip. Apply thermal conductive silicone grease to the edge of the LuAG:Ce,Cr ceramic and install it into the upper fixing seat 4. Then, install the turbine fan 3 and the support block 2 into the upper fixing seat 4 in sequence. Connect the gland 1 to the upper fixing seat 4 with bolts, and apply thermal conductive silicone grease at the contact area between the two. The device obtained after step S1 is named C. C meets the requirement of separate heat dissipation for the fluorescent ceramic.

[0050] Step S2: Connect 4 gravity heat pipes to 2 through holes on both sides of the lower fixing seat 7 respectively. Connect the condensation ends of the gravity heat pipes on both sides of the lower fixing seat 7 to the fins, with 10 fins installed on each side. Apply thermal conductive silicone grease to the bottom of the LED chip, and connect the LED chip to the lower fixing seat 7 with fins and heat pipes installed through screws. The device obtained after step S2 is named D. D completes the separate heat dissipation for the LED chip.

[0051] Step S3: Connect the device C obtained in step 1 to the device D obtained in step S2, and apply thermal conductive silicone grease in the middle. Complete the encapsulation of this device.

[0052] Step S4: After turning on the power, the device obtained in step S3 enters the normal working state. The LED chip emits white light and remotely excites the fluorescent ceramic. At the same time, the turbine fan and 4 gravity heat pipes start to work, cooling the fluorescent ceramic and the LED chip respectively. The highest temperature of the whole system is controlled within 110 o °C. It can enable the fluorescent ceramic to stably emit light under the excitation of a 50W LED chip, realizing the application of the fluorescent ceramic.

[0053] Example 4

[0054] A remotely excited fluorescent ceramic type white LED with heat dissipation and a power of 200W, which includes the following parameters, encapsulation and usage steps:

[0055] Parameters: The fluorescent ceramic is selected as LuAG:Ce,Cr, with a thickness of 1 mm and a side length of 30 mm; the LED chip is selected as a COB type chip, with an emission peak of 460 nm and a power of 200W.

[0056] The luminous area size of the COB type LED chip with a power of 200W is 900mm 2Then, the spatial distance between the fluorescent ceramic and the LED chip is numerically 1 / 10 times the light-emitting area of the LED chip, and the calculated spatial distance between the fluorescent ceramic and the LED chip is 90 mm. There are 8 gravity heat pipes, and the total number of fins in the heat dissipation fin group is 50 pieces.

[0057] Step S1: Cut the LuAG:Ce,Cr fluorescent ceramic so that its light-emitting area is the same size as that of the LED chip. After applying thermal grease to the edge of the LuAG:Ce,Cr ceramic, it is installed into the upper fixing seat 4, and the turbine fan 3 and the support block 2 are successively installed into the upper fixing seat 4. The gland 1 is connected to the upper fixing seat 4 by bolts, and thermal grease is applied to the contact surface between the two. The device obtained through step S1 is named E. E satisfies the separate heat dissipation of the fluorescent ceramic.

[0058] Step S2: Connect 8 gravity heat pipes to 4 through holes on both sides of the lower fixing seat 7 respectively. The condensation ends of the gravity heat pipes on both sides of the lower fixing seat 7 are connected to the fins of the heat dissipation fin group, with 25 pieces installed on each side. Apply thermal grease to the bottom of the LED chip, and connect the LED chip to the lower fixing seat 7 with fins and heat pipes installed through screws. The device obtained through step S2 is named F. F completes the separate heat dissipation of the LED chip.

[0059] Step S3: Connect the device E obtained through step 1 to the device F obtained through step S2, and apply thermal grease in the middle. Complete the encapsulation of this device.

[0060] Step S4: After turning on the power, the device obtained in step S3 enters the normal working state. The LED chip emits white light and remotely excites the fluorescent ceramic. At the same time, the turbine fan and 8 gravity heat pipes start to work, cooling the fluorescent ceramic and the LED chip respectively. The highest temperature of the entire system is controlled within 110 o °C. It can enable the fluorescent ceramic to stably emit light under the excitation of a 200W LED chip, realizing the application of the fluorescent ceramic.

[0061] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A high-power remote-excitation fluorescent ceramic white light LED with a heat sink. Features: The device comprises an upper fixing seat (4), wherein a fluorescent ceramic (5) and a heat dissipation component for cooling the fluorescent ceramic (5) are arranged in the upper fixing seat (4), a pressure cover (1) for fixing the heat dissipation component is connected to the upper part of the upper fixing seat (4), a lower fixing seat (7) is connected to the lower part of the upper fixing seat (4), an LED chip (6) is arranged in the lower fixing seat (7), and a cooling component for cooling the LED chip (6) is arranged on the lower fixing seat (7); The cooling component comprises a heat pipe system (8) and at least two groups of heat dissipation fin groups (9), the upper part of the heat pipe system (8) is connected to the lower fixing seat (7), and the lower part of the heat pipe system (8) is connected to the heat dissipation fin group (9); The heat dissipation assembly comprises a support block (2) and at least two turbo fans (3); the turbo fans (3) are arranged in a mounting groove (402) of an upper fixing seat (4) and are located between the support block (2) and the upper fixing seat (4); and the air outlet of the turbo fans (3) is arranged in an air outlet hole (201) on the support block (2); The gland (1) is provided with a first light exit hole (103) and a turbofan mounting hole (102) that cooperates with the turbofan (3); The fluorescent ceramic (5) is a ceramic containing at least one rare earth ion or transition group ion, and its emission peak is 430nm-780nm. The thickness of the fluorescent ceramic (5) is 0.8mm-2.0mm.

2. The high-power remote-excitation fluorescent ceramic white light LED with a heat dissipation component according to claim 1, Features: The heat pipe system (8) is a gravity heat pipe, the number of gravity heat pipes is 4 to 10, the evaporation end of the gravity heat pipe is arranged in the lower fixed seat (7), and the condensation end of the gravity heat pipe is connected to the heat dissipation fin group (9).

3. The high-power remote-excitation fluorescent ceramic white light LED with a heat dissipation component according to claim 1 or 2, Features: The upper portion of the lower fixing seat (7) is provided with a groove (703), the LED chip (6) is arranged in the groove (703), the bottom of the lower fixing seat (7) is evenly distributed with heat dissipation fins (701), and the side wall of the lower fixing seat (7) is provided with a through hole (702) that cooperates with the gravity heat pipe.

4. The high-power remote-excitation fluorescent ceramic white light LED with a heat dissipation component according to claim 3, Features: The upper fixing seat (4) is provided with a second light exit hole (404) and a receiving structure (403); the receiving structure (403) is located at the lower part of the upper fixing seat (4) and is an integrally formed structure with the upper fixing seat (4); and the fluorescent ceramic (5) is connected to the receiving structure (403).

5. The high-power remote-excitation fluorescent ceramic white light LED with a heat dissipation assembly according to claim 1, 2 or 4, Features: The emission peak wavelength range of the LED chip (6) is 200 nm to 500 nm. The distance H between the LED chip (6) and the fluorescent ceramic (5) numerically satisfies H = (1 / 20 to 1 / 10)S, where the unit of H is mm and the unit of S, which is the light-emitting area of the LED chip (6), is mm 2 .

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