A chip testing apparatus

Abstract

The application discloses a chip testing device and belongs to the technical field of semiconductor device testing. The device comprises a base (5), a lifter (6) arranged on the base, a testing table (7) fixedly connected to the lifting end of the lifter, a support (4) fixedly connected to the base, a microscope (1) connected to the support, a lens of the microscope facing the testing table, a set of positioning grid lines (12) arranged on the upper surface of the testing table, a fixed probe seat (8) arranged on a ring table (2) outside the testing table, the testing table and the probe seat not contacting each other, a movable probe (19) arranged on the probe seat, and the testing table and the probe electrically connected to a tester (24) respectively. The positioning grid lines arranged on the testing table and the magnifying effect of the microscope can facilitate chip alignment and positioning, the probe can easily contact a PAD area, and the chip is not easily damaged, so that the device has the advantages of simple and quick operation and low manufacturing cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor chip testing, in particular to a chip testing device. BACKGROUND

[0002] With the rapid development of the chip industry, it has been widely applied to various fields. A chip is divided from a wafer, and a wafer is made into a MOSFET or a BJT component through photolithography, doping, CMP and other technologies, and a wire is made by using a thin film and a CMP technology, so that the chip is completed. For a chip used in a high-quality and high-reliability circuit, it is often required to test 100% of the chip before it is used in a product. Because the chip is very small, it is difficult to test. The chip testing technology of the chip manufacturer can only rely on very expensive automatic testing equipment. If a probe is used for testing, it is difficult to position a single chip, the probe is not easy to find the PAD area, and the chip is easy to scratch.

[0003] In the prior art, a positioning structure is usually used to position a single chip, but because the size of the chip is too small, the accuracy of the size of the positioning structure is required to be high, and in order to ensure the positioning accuracy, a separate clamping structure is often needed to fix, which causes the overall positioning structure to be complex and the manufacturing cost to be too high, and the chip is also easy to be damaged under the action of clamping.

[0004] In addition, the quality of the surface of the chip is a key inspection process for normal use of the chip. The main detection contents include chip surface defects such as maximum allowable size of chip shape, scratches and edge collapse on the surface. Because the size of the chip is too small, it cannot be measured by the naked eye, and the existing technology often uses special intelligent equipment for detection, which causes a large one-time investment in detection.

[0005] The present application is to overcome the shortcomings of the prior art, and provides a testing device for a single chip.

[0006] In view of the shortcomings of the prior art, the present application provides a chip testing device.

[0007] The present application adopts the following technical scheme:

[0008] A chip testing device, comprising a base and a lifting machine arranged on the base, a lifting end of the lifting machine being fixedly connected to a testing table, a support being fixedly connected to the base, a microscope being connected to the support, a lens of the microscope facing the testing table, characterized in that: a group of positioning grid lines are arranged on the upper surface of the testing table; a fixed probe seat is arranged on the annular table outside the testing table, the testing table and the probe seat being in contact with each other; a movable and adjustable probe is arranged on the probe seat, the testing table and the probe being electrically connected to a tester, respectively.

[0009] Furthermore, the positioning grid is a nine-square grid, with each square being rectangular and having a scale. The size of each square does not exceed the standard external dimensions of the chip under test, and the middle square faces the lens of the microscope.

[0010] Furthermore, the probe holder is provided with a sliding groove, and a mounting bracket for fixing the probe is slidably connected and fixed in the sliding groove. The probe holder and the mounting bracket are adjusted by an adjustment mechanism to make the mounting bracket reciprocate within the sliding groove.

[0011] Furthermore, the mounting bracket includes an L-shaped bracket, one end of which is rotatably connected to a slider, and the other end is fixedly connected to a fixing sleeve that is inserted into the probe. The fixing sleeve is provided with adjusting screws for locking the probe on its periphery.

[0012] Furthermore, the adjustment mechanism is a nut screw mechanism, which includes an internal thread on the slider and a screw that engages with the internal thread. A section of optical axis is provided at the front of the screw body, and the diameter of the optical axis is smaller than the diameter of the screw thread. The probe seat is provided with a through hole that rotatably engages with the optical axis. By rotating the screw, the slider is driven to move linearly within the groove.

[0013] Furthermore, the adjustment mechanism is a double-screw structure, which includes screws threaded to opposite sides of the probe seat, with each screw end extending into the groove and pressing against the slider.

[0014] Furthermore, a laser rangefinder for measuring the lifting height of the test platform is provided on the fixed end of the elevator.

[0015] Furthermore, a layer of silver wire mesh is fixedly provided on the upper surface of the test platform, and a set of positioning grid lines are provided on the surface of the silver wire mesh. The silver wire mesh is electrically connected to the tester.

[0016] Furthermore, the annular platform is fixed to the base by a support rod, and a set of LED lights is provided on the annular platform.

[0017] Furthermore, the annular platform is provided with first and second grooves for placing the chip box and tweezers, respectively.

[0018] Compared with existing technologies, the present invention has the following advantages:

[0019] 1. This solution sets positioning grid lines on the surface of the test stage, and with the magnification of the microscope, the chip can be aligned and positioned by visual observation, ensuring that the probe can be easily aligned with the contact PAD area. Compared with the positioning structure used in the existing technology, it has the advantages of simple and quick operation and low manufacturing cost, while avoiding the possibility of damage to the chip when clamped.

[0020] 2, by setting the size of the positioning grid line in the palace, with the chip shape to be detected, the tester can easily determine whether the chip size is out of standard by visual inspection under the microscope; in addition, the defects on the surface of the chip are more easily observed through the microscope, and the position and size of the defects are roughly measured through the scale of the palace, which is convenient for subsequent chip qualification determination. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a structural schematic diagram of an embodiment of a chip testing device of the present application;

[0022] Figure 2 is a structural schematic diagram of the test bench and probe connection of an embodiment of a chip testing device of the present application;

[0023] Figure 3 is a structural schematic diagram of an embodiment of the adjusting mechanism of the present application;

[0024] Figure 4 is a structural schematic diagram of another embodiment of the adjusting mechanism of the present application.

[0025] BRIEF DESCRIPTION OF DRAWINGS: 1, microscope; 2, ring table; 3, laser range finder; 4, support; 5, base; 6, elevator; 7, test bench; 8, probe base; 9, mounting bracket; 10, support rod; 11, LED lamp; 12, positioning grid line; 13, silver wire mesh; 14, screw; 15, sliding groove; 16, sliding block; 17, L-shaped bracket; 18, fixed sleeve; 19, probe; 20, adjusting screw; 21, jackscrew; 22, first groove; 23, second groove; 24, tester. DETAILED DESCRIPTION

[0026] In order to make the present application clearer, a chip testing device of the present application is further described below in conjunction with the drawings. The specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0027] As Figure 1 , Figure 2As shown, a chip testing device includes a base 5, a hand-operated elevator 6 fixedly connected to the base 5, the elevator 6 vertically ascending and descending, a testing table 7 fixedly connected to the ascending and descending end of the elevator 6, the testing table 7 can be circular as shown in the figure or other shapes, which is convenient to arrange. A laser range finder 3 is arranged on the fixed end of the elevator 6, the laser range finder 3 is directed to the testing table 7, and is used to measure the ascending and descending height of the testing table 7. A gate-shaped support 4 is fixedly connected to one side of the base 5, the upper part of the support 4 is fixedly connected to a microscope 1, the position of the microscope 1 is higher than the maximum ascending and descending limit position of the elevator 6, and the lens of the microscope 1 is directed to the center of the upper surface of the testing table 7. In addition, the elevator 6 in the embodiment can also be an electrically driven telescopic elevator with a range finding function of the laser range finder 3.

[0028] A layer of silver wire mesh 13 with excellent electrical conductivity is covered and fixed on the upper surface of the testing table 7, a set of positioning grid lines 12 is arranged on the silver wire mesh 13, and the silver wire mesh 13 is electrically connected to a tester 24 through a wire. Among them, the silver wire mesh 13 has fine and dense mesh holes, which can ensure that the chip to be tested can form effective and stable electrical connection with the silver wire mesh 13 when the chip to be tested is placed on the silver wire mesh 13.

[0029] In the embodiment, the set of positioning grid lines 12 preferably adopts a nine-square grid, each square is rectangular or square, and each square has a scale for measurement, and the middle square is directly opposite the lens of the microscope 1. When the chip to be tested is placed on the nine-square grid, the chip to be tested is placed according to the grid lines of the nine-square grid as the positioning reference, and at the same time, the defects on the surface of the chip, such as scratches and edge collapse, are observed through the microscope 1, and the scale on the nine-square grid is used to preliminarily measure the position and size of the defects. At the same time, for the measurement of the maximum allowable size of the chip shape, each square can be made according to the maximum allowable size of the chip shape, and the operator can easily determine whether the size of the chip shape exceeds the standard through visual observation under the microscope 1.

[0030] An annular table 2 is arranged outside the testing table 7, and the annular table 2 is fixed to the base 5 through a support rod 10. A set of LED lamps 11 is arranged on one side of the annular table 2, and the set of LED lamps is used to improve the intensity of the ambient light, so that the operator can more easily observe the details on the chip to be tested through the microscope 1. A probe seat 8 is fixedly connected to each of the opposite sides of the annular table 2, and the probe seat 8 and the annular table 2 are not in contact with the testing table 7, so as to prevent interference phenomenon caused by the upward and downward movement of the testing table 7. Each probe seat 8 is provided with a movable and adjustable probe 19, and each probe 19 is electrically connected to the tester 24.

[0031] As shown in the figure, Figure 3 , Figure 4As shown, the probe seat 8 is provided with a rectangular strip-shaped sliding groove 15, the length direction of the sliding groove 15 points to the center of the test table 7. The mounting bracket 9 for fixing the probe 19 is slidingly connected in the sliding groove 15. The specific structure of the mounting bracket 9 includes an L-shaped bracket 17, the vertical end of the L-shaped bracket 17 is rotationally connected on the sliding block 16 through the shaft hole structure, and a certain rotational resistance is formed by the size tolerance of the shaft hole structure, and only under the action of a certain external force, the rotation can occur. The horizontal end of the L-shaped bracket 17 is fixedly connected with the fixing sleeve 18 which is inserted with the probe 19. The circumferential side of the fixing sleeve 18 is provided with an adjusting screw 20 for locking the probe 19, and the probe 19 can be fastened through the adjusting screw 20, and the subsequent use and replacement of the probe 19 are also facilitated. The probe seat 8 and the mounting bracket 9 are connected through the adjusting mechanism to make the mounting bracket 9 reciprocate in the sliding groove 15, drive the probe 19 to move left and right for adjustment, and the mounting bracket 9 is rotated under the external force to change the in-plane angle of the probe 19, and the two aspects work together to facilitate the probe 19 to align the PAD area of the chip to be tested. The non-free end of the fixing sleeve 18 is provided with a circular baffle (not shown in the figure) to limit the insertion depth of the probe 19.

[0032] In the embodiment, one structure form of the adjusting mechanism is as shown in Figure 3 The adjusting mechanism is a nut screw mechanism, which includes an inner thread provided on the sliding block 16 and a screw rod 14 matched with the inner thread. The front part of the rod body of the screw rod 14 is provided with a light shaft, the diameter of the light shaft is smaller than the diameter of the thread of the screw rod 14, and the probe seat 8 is provided with a through hole rotationally matched with the light shaft. By rotating the screw rod 14, the sliding block 16 is driven to linearly move in the sliding groove 15 through the anti-rotation limiting of the sliding groove 15, and the moving direction of the sliding block 16 is changed according to the rotating direction. Considering the installation of the screw rod 14, the through hole is composed of two separable semicircular holes, that is, the probe seat 8 has a separable structure, and each separated part has a semicircular hole. Of course, there are also conventional installation and arrangement forms of the nut screw mechanism, which are not listed here.

[0033] Another structure form of the adjusting mechanism is as shown in Figure 4 The adjusting mechanism is a double jackscrew structure, which includes jackscrews 21 threadedly connected on the opposite sides of the probe seat 8. The axis of each jackscrew 21 is consistent with the length direction of the sliding groove 15, and the end of the jackscrew 21 extends into the sliding groove 15 and presses against the corresponding surface of the sliding block 16. By rotating the jackscrew on one side to move left and rotating the jackscrew on the other side to move right, the movement of the sliding block 16 is realized. When the sliding block 16 is used in reverse, the rotating direction of each jackscrew is adjusted.

[0034] Considering that the test device needs to be used with tweezers and placed in a chip box in the actual use process, a protruding structure is further provided on the annular table 2, and a first groove 22 and a second groove 23 are respectively provided on the structure. The first groove is used for placing the chip box, and the second groove is used for placing the tweezers.

[0035] The use process of the device

[0036] First, open the LED lamp 11, take out the chip of the chip box with tweezers and place it on the silver screen 13 of the test table 7, and move the chip to the center position of the positioning grid line 12;

[0037] Then, slowly move the test table 7 to the probe 19 through the elevator 6, and observe through the microscope 1 during this period, and adjust the left and right positions of the probe 19 in time through the adjusting mechanism, and at the same time, adjust the plane angle of the probe 19 by fine-tuning the L-shaped support 17 as needed, until the probe 19 accurately contacts the test area on the chip.

[0038] Finally, visually inspect the maximum size of the chip and the surface defect condition through the microscope 1 to see whether it meets the requirements; the continuity of the chip PAD area is detected by the tester 24.

[0039] When the above steps are completed, the value of the laser range finder 3 is recorded, so that the next chip to be tested can quickly find the position of the probe and the chip contact. Subsequent chips only need to be placed in the positioning test position of the first chip on the positioning grid line 12, and the elevator is raised to the value of the laser range finder, so that the test can be quickly realized.

[0040] The above embodiments of the present application are only examples for clearly illustrating the present application, and are not a limitation on the embodiments of the present application. Based on the above description, other different forms of changes or variations can be made by those skilled in the art. It is not necessary or possible to exhaust all embodiments. The changes or variations that belong to the substantial spirit of the present application are still within the protection scope of the present application.

Claims

1. A chip testing device, comprising a base (5) and a lift (6) mounted on the base (5), wherein the lifting end of the lift (6) is fixedly connected to a test stage (7), a bracket (4) is fixedly connected to the base (5), and a microscope (1) is connected to the bracket (4), the lens of the microscope (1) facing the test stage (7), characterized in that: The upper surface of the test bench (7) is provided with a set of positioning grid lines (12); A fixed probe seat (8) is provided on the annular platform (2) outside the test platform (7). The test platform (7) and the probe seat (8) do not contact each other. A movable and adjustable probe (19) is provided on the probe seat (8). The test platform (7) and the probe (19) are electrically connected to the tester (24). The positioning grid line (12) is a nine-square grid, each square is a rectangle and has scales, the size of the square does not exceed the standard external dimensions of the chip to be tested, and the middle square is directly opposite the lens of the microscope (1); The probe holder (8) is provided with a sliding groove (15), and the mounting bracket (9) of the fixed probe (19) is slidably connected and fixed in the sliding groove (15). The probe holder (8) and the mounting bracket (9) are adjusted by an adjustment mechanism to make the mounting bracket (9) move back and forth in the sliding groove (15). The mounting bracket (9) includes an L-shaped bracket (17), one end of which is rotatably connected to a slider (16), and the other end is fixedly connected to a fixing sleeve (18) that is inserted into the probe (19). The fixing sleeve (18) is provided with an adjusting screw (20) for locking the probe (19) on its periphery. The elevator (6) is equipped with a laser rangefinder (3) on the fixed end of the elevator (7) to measure the lifting height. A layer of silver wire mesh (13) is fixedly provided on the upper surface of the test platform (7), and a set of positioning grid lines (12) are provided on the surface of the silver wire mesh (13). The silver wire mesh (13) is electrically connected to the tester (24).

2. The chip testing apparatus according to claim 1, wherein: The adjustment mechanism is a screw mechanism, which includes an internal thread on the slider (16) and a screw (14) that engages with the internal thread. The front part of the screw (14) is provided with a section of optical axis, the diameter of which is smaller than the diameter of the screw (14) thread. The probe seat (8) is provided with a through hole that engages with the optical axis. By rotating the screw (14), the slider (16) is driven to move linearly in the groove (15).

3. A chip testing apparatus according to claim 1 or 2, characterized by: The adjustment mechanism is a double-top screw structure, which includes top screws (21) threaded to opposite sides of the probe seat (8), with the end of each top screw (21) extending into the slide groove (15) and pressing against the slider (16).

4. The chip testing apparatus according to claim 1, wherein: The annular platform (2) is fixed to the base (5) by a support rod (10), and a set of LED lights (11) are provided on the annular platform (2).

5. The chip testing apparatus according to claim 4, wherein: The annular platform (2) is provided with a first and a second groove for placing the chip box and tweezers, respectively.

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