Backlight module and display device

Abstract

The embodiments of the present disclosure provide a backlight module and a display device, which relate to the field of display technology and are used to reduce the risk of increased light decay of the backlight module. The backlight module includes a back panel, a light guide plate and a flexible circuit board. The back panel includes a support portion and a groove portion located on one side of the support portion, the groove portion includes a first sub-plate, a second sub-plate and a third sub-plate connected in sequence, the first sub-plate is connected to the support portion on a side away from the second sub-plate, and the third sub-plate is arranged opposite to the first sub-plate. The light guide plate is arranged on the support portion, and is partially located between the first sub-plate and the third sub-plate. The flexible circuit board is at least partially located between the light guide plate and the third sub-plate, and is fixedly connected to the light guide plate. The above-mentioned backlight module is used to provide a light source for an LCD panel.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a backlight module and a display device. Background Art

[0002] Liquid crystal display devices are popular among users due to their advantages of small size, high brightness, power saving and low radiation. Liquid crystal display devices include a backlight module for providing backlight and a display panel for displaying images. The backlight module includes a backlight source, a light guide plate, a back plate and a plurality of optical films.

[0003] In the related art, the backlight source includes a flexible circuit board and a plurality of light emitting diode (LED) lamp beads. According to the installation position classification of the flexible circuit board, light guide plate and back plate, the backlight module can be divided into a positive group backlight module and a reverse group backlight module. In the reverse group backlight module, the flexible circuit board is located on the side of the light guide plate close to the plurality of optical films, the flexible circuit board and the back plate are fixedly connected, and the LED lamp beads are located on the side of the light guide plate close to the second sub-plate.

[0004] Among them, the light guide plate contracts after expanding due to heat, the gap between the lamp beads and the light guide plate increases, and the light decay of the backlight module becomes larger. Summary of the invention

[0005] An object of the embodiments of the present disclosure is to provide a backlight module and a display device, which are used to reduce the risk of increased light decay of the backlight module.

[0006] To achieve the above objectives, the embodiments of the present disclosure provide the following technical solutions:

[0007] In one aspect, a backlight module is provided. The backlight module includes a back plate, a light guide plate, and a flexible circuit board. The back plate includes a support portion and a groove portion located on one side of the support portion, the groove portion includes a first sub-plate, a second sub-plate, and a third sub-plate connected in sequence, the first sub-plate is connected to the support portion at one end away from the second sub-plate, and the third sub-plate is arranged opposite to the first sub-plate. The light guide plate is arranged on the support portion, and is partially located between the first sub-plate and the third sub-plate. The flexible circuit board is at least partially located between the light guide plate and the third sub-plate, and is fixedly connected to the light guide plate.

[0008] In the above-mentioned display backlight module, the back plate includes a support portion and a groove portion located on one side of the support portion. The support portion is used to support the light guide plate, and the groove portion is used to shield light. The first sub-plate, the second sub-plate and the third sub-plate are connected in sequence, and the side of the first sub-plate away from the second sub-plate is connected to the support portion, and the third sub-plate is arranged opposite to the first sub-plate, so that the first sub-plate, the second sub-plate and the third sub-plate form a groove portion. The light guide plate is arranged on the support portion, and is partially located between the first sub-plate and the third sub-plate. The light guide plate can convert a line light source into a surface light source. The flexible circuit board is at least partially located between the light guide plate and the third sub-plate, and is fixedly connected to the light guide plate. When the light guide plate expands due to heat or contracts due to cold, the light guide plate and the flexible circuit board move synchronously, so that the risk of increased light decay of the backlight module can be reduced.

[0009] In some embodiments, the light guide plate includes a first sub-section and a second sub-section. The first sub-section is at least partially located between the first sub-section and the third sub-section. The second sub-section is disposed on the support portion and connected to the first sub-section. The first sub-section is away from the surface of the first sub-section and is closer to the plane where the first sub-section and the support portion are located than the surface of the second sub-section away from the support portion. The flexible circuit board is located on the side of the first sub-section away from the first sub-section and is fixedly connected to the surface of the first sub-section away from the first sub-section.

[0010] In some embodiments, a surface of the flexible circuit board away from the first sub-portion is flush with a surface of the second sub-portion away from the support portion.

[0011] In some embodiments, the flexible circuit board includes a wiring portion and a shading portion. The wiring portion is located between the first sub-board and the third sub-board, and is fixedly connected to the light guide plate. The shading portion is located on a side of the wiring portion away from the second sub-board, is connected to the wiring portion, and one end of the shading portion away from the wiring portion extends out of the groove portion. Among them, the backlight module also includes a plurality of stacked optical films, the plurality of optical films are located on a side of the light guide plate away from the support portion, and on a side of the third sub-board away from the second sub-board; the edge portion of the plurality of optical films close to the third sub-board overlaps with the edge portion of the shading portion away from the wiring portion.

[0012] In some embodiments, the routing portion includes a first insulating layer, a first conductive layer, a substrate layer, a second conductive layer, and a cover film which are stacked in sequence, wherein the first insulating layer is closer to the light guide plate than the cover film. The light shielding portion includes an extension layer and a reflective layer, wherein the extension layer is integrally arranged with the cover film or the substrate layer, and the reflective layer is arranged on a side of the extension layer close to the light guide plate.

[0013] In some embodiments, edge portions of the plurality of optical films close to the third sub-panel overlap with the reflective layer.

[0014] In some embodiments, when the light guide plate includes a first sub-portion and a second sub-portion, an end of the light shielding portion away from the wiring portion is flush with an end of the second sub-portion close to the first sub-portion.

[0015] In some embodiments, the flexible circuit board includes a grounding conductive portion, which is located on a side of the flexible circuit board close to the third sub-board. The backlight module also includes a grounding structure, which is electrically connected to the grounding conductive portion and the third sub-board.

[0016] In some embodiments, the grounding structure includes an elastic conductive block located between the flexible circuit board and the third sub-board, one end of the elastic conductive block is electrically connected to the grounding conductive portion, and the other end of the elastic conductive block is electrically connected to the third sub-board.

[0017] In some embodiments, the third sub-board is provided with a first opening. The grounding structure includes a conductive adhesive layer and a conductive block. The conductive adhesive layer is bonded to a surface of the third sub-board away from the first sub-board and covers the first opening. The conductive block is partially located in the first opening, and one end is electrically connected to the grounding conductive portion, and the other end is electrically connected to the conductive adhesive layer.

[0018] In some embodiments, a portion of the boundary of the third sub-board away from the second sub-board is recessed inward to form a first opening. The backlight module further includes a plurality of optical films stacked in layers, at least one of the optical films includes a main body and a raised portion, the main body is located on a side of the third sub-board away from the second sub-board, one end of the raised portion is connected to the main body and is at least partially located in the second opening, and the raised portion is arranged side by side with the conductive block.

[0019] In some embodiments, along the first direction, the protrusion and the conductive block are in contact with each other at the ends thereof that are close to each other. The first direction is parallel to the length extension direction of the third sub-board.

[0020] In some embodiments, the conductive adhesive layer is provided with an avoidance hole, and part of the protrusion is located in the avoidance hole.

[0021] In some embodiments, the backlight module further includes a supporting layer and an adhesive layer which are stacked, and the adhesive layer is bonded to the conductive adhesive layer.

[0022] In another aspect, a display device is provided, which includes a backlight module and a display panel as described in any one of the above embodiments.

[0023] The above-mentioned display device has the same structure and beneficial technical effects as the backlight module provided in some of the above-mentioned embodiments, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0025] Figure 1 is a structural diagram of a display panel according to some embodiments of the present disclosure;

[0026] Figure 2 for Figure 1 Another cross-sectional view along the section line AA;

[0027] Figure 3 for Figure 1 Another cross-sectional view along the section line AA;

[0028] Figure 4 for Figure 1 Another cross-sectional view along the section line AA;

[0029] Figure 5 for Figure 1 Another cross-sectional view along the section line AA;

[0030] Figure 6 A structural diagram of a backlight source in some embodiments of the present disclosure;

[0031] Figure 7 is another structural diagram of a backlight source of some embodiments of the present disclosure;

[0032] Figure 8 is another structural diagram of a backlight source of some embodiments of the present disclosure;

[0033] Fig. 9 for Figure 8 A cross-sectional view along the cutting line BB;

[0034] Fig.10 is a structural diagram of a backplane in some embodiments of the present disclosure;

[0035] Fig.11 for Figure 1 Another cross-sectional view along the section line AA;

[0036] Fig.12 for Figure 1 Another cross-sectional view along the section line AA;

[0037] Fig.13 for Figure 1Another cross-sectional view along the section line AA;

[0038] Fig.14 for Figure 1 Another cross-sectional view along the section line AA;

[0039] Fig.15 for Figure 1 Another cross-sectional view along the section line AA;

[0040] Fig.16 for Figure 1 Another cross-sectional view along the section line AA;

[0041] Fig.17 for Figure 1 Another cross-sectional view along the section line AA;

[0042] Fig.18 for Figure 1 Another cross-sectional view along the section line AA;

[0043] Fig.19A for Fig.18 A cross-sectional view along the cutting line CC;

[0044] Fig.19B for Fig.18 Another cross-sectional view along the cutting line CC;

[0045] Fig. 20 for Figure 1 Another cross-sectional view along the section line AA;

[0046] Fig.21 for Figure 1 Another cross-sectional view along the section line AA;

[0047] Fig. 22 for Figure 1 Another cross-sectional view along the section line AA;

[0048] Fig.23 for Figure 1 Another cross-sectional view along the section line AA;

[0049] Fig.24 for Figure 1 Another cross-sectional view along the section line AA;

[0050] Fig.25 for Figure 1 Another cross-sectional view along the cutting line AA. DETAILED DESCRIPTION

[0051] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0052] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics described may be included in any one or more embodiments or examples in any appropriate manner.

[0053] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0054] When describing some embodiments, the expression "connected" and its derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components have direct physical or electrical contact with each other.

[0055] “At least one of A, B, and C” has the same meaning as “at least one of A, B, or C” and both include the following combinations of A, B, and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0056] The use of "adapted to" or "configured to" herein is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0057] As used herein, "approximately" includes the stated values ​​and averages that are within an acceptable range of deviation from the particular value, where the acceptable range of deviation is determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0058] As used herein, "parallel" and "perpendicular" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement being discussed and the errors associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°.

[0059] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0060] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0061] The embodiment of the present disclosure provides a display device 1000, such as Figure 1 As shown, the display device is a device or equipment for visually displaying electronic information. Exemplarily, the display device 1000 can be a tablet computer, a notebook computer, a monitor or a television.

[0062] In some embodiments, the display device 1000 includes a backlight module 100 , a display panel 200 , and a fixing tape 300 .

[0063] like Figure 2 As shown, the backlight module 100 includes a back plate 10, a light guide plate 20, a backlight source 30 and a plurality of optical films 40 stacked together.

[0064] The back plate 10 includes a support portion 11 and a groove portion 12 located on one side of the support portion 11. The support portion 11 is used to support the light guide plate 20, and the groove portion 12 is used to shield the light emitted by the backlight source 30. The groove portion 12 includes a first sub-plate 121, a second sub-plate 122, and a third sub-plate 123 connected in sequence. The end of the first sub-plate 121 away from the second sub-plate 122 is connected to the support portion 11, and the third sub-plate 123 is arranged opposite to the first sub-plate 121.

[0065] The light guide plate 20 is disposed on the support portion 11 and is partially located on the first sub-plate 121 . The light guide plate 20 is partially located between the first sub-plate 121 and the third sub-plate 123 . The light guide plate 20 is used to convert a line light source into a surface light source.

[0066] The backlight source 30 includes a flexible circuit board 31 and an LED lamp bead 32 located on one side. The LED lamp bead 32 is attached to the flexible circuit board 31 using surface mount technology (SMT).

[0067] The plurality of optical films 40 are located on a side of the light guide plate 20 away from the support portion 11 and on a side of the third sub-plate 123 away from the second sub-plate 122 . There is a gap between the plurality of optical films 40 and the third sub-plate 123 .

[0068] Exemplarily, the plurality of optical films 40 include a first diffuser, a prism sheet, and a second diffuser stacked in sequence. The first diffuser is closer to the light guide plate 20 than the second diffuser. The plurality of optical films 40 can make the brightness of the light emitted from the light guide plate 20 to the display panel more uniform.

[0069] The backlight module 100 further includes a light shielding tape 50. The light shielding tape 50 is partially located between the flexible circuit board 31 and the third sub-board 123, and is located on a side of the second sub-board 122 close to the plurality of optical films 40. One end of the light shielding tape 50 away from the second sub-board 122 extends out of the groove 12. The edge portions of the plurality of optical films 40 close to the third sub-board 123 overlap with the edge portions of the light shielding tape 50 away from the second sub-board 122.

[0070] The backlight module 100 further includes a display panel bearing layer 5 . The display panel bearing layer 5 is located on a side of the third sub-board 123 away from the first sub-board 121 and is fixedly connected to the third sub-board 123 .

[0071] The display panel 200 further includes a first glass substrate 210 , a second glass substrate 220 , a first polarizer 230 , and a second polarizer 240 .

[0072] The first glass substrate 210 is partially located on a side of the display panel carrying layer 5 away from the third sub-plate 123 , and is fixedly connected to the display panel carrying layer 5 .

[0073] The second glass substrate 220 is located on a side of the first glass substrate 210 away from the display panel bearing layer 5 , and is fixedly connected to the first glass substrate 210 .

[0074] The first polarizer 230 is located on a side of the first glass substrate 210 away from the second glass substrate 220 , and is fixedly connected to the first glass substrate 210 .

[0075] The second polarizer 240 is located on a side of the second glass substrate 220 away from the first glass substrate 210 , and is fixedly connected to the second glass substrate 220 .

[0076] The fixing tape 300 is disposed along the edge of the second polarizer 240 and around the back plate 10 , the display panel bearing layer 5 , the first glass substrate 210 and the second glass substrate 220 .

[0077] In some embodiments, according to the installation positions of the back plate 10 , the light guide plate 20 , and the flexible circuit board 31 in the backlight module 100 , the backlight module 100 can be divided into a positive group backlight module 100 and a negative group backlight module 100 .

[0078] Specifically, in the front backlight module, the flexible circuit board is partially located between the light guide plate and the first sub-plate, and the flexible circuit board is fixedly connected to the light guide plate, and the LED lamp beads are located on the side of the light guide plate close to the second sub-plate. The backlight module also includes a first adhesive layer (not shown in the figure), which is used to bond the flexible circuit board and the light guide plate.

[0079] Specifically, in the reverse assembly backlight module, the flexible circuit board is at least partially located between the light guide plate and the third sub-plate, and is fixedly connected to the third sub-plate. The LED lamp beads are located on a side of the light guide plate close to the second sub-plate.

[0080] In the reverse assembly backlight module, the light shielding tape is also used to bond the light guide plate and the flexible circuit board. The material of the light shielding tape includes a conductive material. In this way, the flexible circuit board is electrically connected to the third sub-board 123 through the light shielding tape, that is, the flexible circuit board is grounded.

[0081] Among them, in the reverse-assembled backlight module 100, the light guide plate 20 expands due to heat, and the light guide plate 20 will drive the flexible circuit board that fixes the LED lamp beads 32 to move toward the second sub-board 122. When the light guide plate 20 returns to its original position, the distance between the light guide plate 20 and the LED lamp beads 32 increases, resulting in an increase in the light attenuation of the backlight module 100.

[0082] In order to solve the above problems, Figure 2As shown, the flexible circuit board 31 in the embodiment of the present disclosure is at least partially located between the light guide plate 20 and the third sub-plate 123, and the flexible circuit board 31 is fixedly connected to the light guide plate 20. In this way, when the light guide plate 20 expands due to heat or contracts due to cold, the light guide plate 20 and the LED lamp beads 32 move synchronously, which can reduce the risk of increasing the distance between the LED lamp beads 32 and the light guide plate 20, and further reduce the risk of increasing the light decay of the backlight module 100.

[0083] At the same time, when the flexible circuit board 31 needs to be removed from the groove 12 (for example, the flexible circuit board 31 is damaged and the electrical analysis of the flexible circuit board 31 is required. Or, the flexible circuit board 31 needs to be replaced), the light guide plate 20 is moved, and the light guide plate 20 can drive the flexible circuit board 31 to be removed from the groove 12, so that it is easier and more convenient to remove the flexible circuit board 31. The flexible circuit board 31 can be removed from the groove 12 without touching the flexible circuit board 31, so that the risk of damage to the flexible circuit board 31 can be reduced.

[0084] Exemplarily, the first adhesive layer is used to bond the light guide plate 20 and the flexible circuit board 31 .

[0085] In some embodiments, Figure 3 As shown (in order to facilitate the display of the positional relationship of each film layer of the backlight module 100, Figure 3 The display panel 200 and the fixing tape 300 are not shown), and the light guide plate 20 includes a first sub-portion 21 and a second sub-portion 22.

[0086] The first sub-portion 21 is at least partially located between the first sub-board 121 and the third sub-board 123 .

[0087] The second sub-section 22 is disposed on the support portion 11 and is connected to the first sub-section 21. The surface of the first sub-section 21 away from the first sub-board 121 is closer to the plane where the first sub-board 121 and the support portion 11 are located than the surface of the second sub-section 22 away from the support portion 11. The flexible circuit board 31 is located on the side of the first sub-section 21 away from the first sub-board 121 and is fixedly connected to the surface of the first sub-section 21 away from the first sub-board 121. In this way, the distance between the flexible circuit board 31 and the third sub-board 123 is increased, which facilitates the movement of the light guide plate 20 and the flexible circuit board 31 into the groove portion 12, can reduce the difficulty of assembling the backlight module 100, and can reduce the thickness of the backlight module 100.

[0088] In the case where the light guide plate 20 includes the first sub-portion 21 and the second sub-portion 22 , the first adhesive layer is used to bond the flexible circuit board 31 and the first sub-portion 21 .

[0089] For example, Figure 4 As shown (in order to facilitate the display of the positional relationship of each film layer of the backlight module 100, Figure 4The display panel 200 and the fixing tape 300 are not shown), the surface of the flexible circuit board 31 away from the first sub-section 21 is flush with the surface of the second sub-section 22 away from the support portion 11. Or, as Figure 6 As shown, the surface of the flexible circuit board 31 away from the first sub-portion 21 is farther away from the plane where the third sub-board 123 and the support portion 11 are located than the surface of the second sub-portion 22 away from the support portion 11 .

[0090] Flush includes absolutely flush and approximately flush, with "approximately" including the stated value and an average value that is within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0091] The light shielding tape 50 in the related art can absorb the light emitted from the light guide plate 20 through the gap between the third sub-plate 123 and the plurality of optical films 40 , resulting in insufficient light output from the light guide plate 20 .

[0092] In some embodiments, in order to solve the above problems, Figure 5 As shown (in order to facilitate the display of the positional relationship of each film layer of the backlight module 100, Figure 5 The display panel 200 and the fixing tape 300 are not shown), and the flexible circuit board 31 includes a wiring portion 311 and a light shielding portion 312.

[0093] The wiring portion 311 is located between the first sub-board 121 and the third sub-board 123 and is fixedly connected to the light guide plate 20. The LED lamp bead 32 is fixedly connected to the wiring portion 311.

[0094] The light shielding portion 312 is located on the side of the wiring portion 311 away from the second sub-board 122, the light shielding portion 312 is connected to the wiring portion 311, and one end of the light shielding portion 312 away from the wiring portion 311 extends out of the groove portion 12. The edge portion of the plurality of optical films 40 close to the third sub-board 123 overlaps with the edge portion of the light shielding portion 312 away from the wiring portion 311. The light shielding portion 312 can reflect the light emitted from the light guide plate 20 from the gap between the third sub-board 123 and the plurality of optical films 40, thereby increasing the light output of the light guide plate 20. The light shielding portion 312 can reduce the risk of light loss caused by part of the light in the light guide plate 20 being emitted from the gap between the third sub-board 123 and the plurality of optical films 40. In this way, the light shielding tape 50 in the related art can be eliminated, and then the process related to the light shielding tape 50 in the backlight module 100 can be eliminated, and the production speed of the backlight module 100 can be improved. The thickness of the backlight module 100 can also be reduced.

[0095] For example, the length of the region where the plurality of optical films 40 and the light shielding portion 312 overlap each other along the second direction X may be 0.8 mm. The second direction X is parallel to the direction in which the support portion 11 and the first sub-plate 121 are arranged.

[0096] For example, Figure 5 As shown, in the case where the light guide plate 20 includes the first sub-section 21 and the second sub-section 22, the edge of the first sub-section 21 close to the second sub-section 22 overlaps with the edge of the plurality of optical films 40 close to the third sub-plate 123. For example, the length of the region where the plurality of optical films 40 overlap with the first sub-section 21 along the second direction X can be 0.8 mm. The end of the shading portion 312 away from the wiring portion 311 is flush with the end of the second sub-section 22 close to the first sub-section 21. The surface of the shading portion 312 away from the first sub-section 21 is flush with the surface of the second sub-section 22 away from the support portion 11, so that the risk of the plurality of optical films 40 being lifted by the shading portion 312 can be reduced.

[0097] Parallel, absolute parallelism and approximately parallelism, "approximately" includes the conditions described and conditions similar to the conditions described, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, the acceptable deviation range for approximately parallelism may be, for example, a deviation within 5°;

[0098] In some embodiments, Figure 6 and Figure 7 As shown, the routing portion 311 includes a first insulating layer 3111 , a first conductive layer 3112 , a substrate layer 3113 , a second conductive layer 3114 and a covering film 3115 which are stacked in sequence, wherein the first insulating layer 3111 is closer to the light guide plate 20 than the covering film 3115 .

[0099] The material of the first insulating layer 3111 may include silicon nitride (SiNx), aluminum oxide (Al2O3) or silicon dioxide (SiO2), which will not be listed one by one in the embodiments of the present disclosure.

[0100] The material of the first conductive layer 3112 may include aluminum (AL), silver (Ag) or copper (Cu), which are not listed one by one in the embodiments of the present disclosure. For example, the material of the first conductive layer 3112 includes copper.

[0101] The material of the substrate layer 3113 may include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyphenylene sulfone resins (PPSU), or polymethyl methacrylate (PMMA), which are not listed one by one in the embodiments of the present disclosure.

[0102] The material of the second conductive layer 3114 can be the same as that of the first conductive layer 3112 , which can improve the material identity of the flexible circuit board 31 and reduce the cost of the flexible circuit board 31 .

[0103] The material of the cover film 3115 may be the same as that of the first insulating layer 3111 .

[0104] The light shielding portion 312 includes an extension layer 3121 and a light reflecting layer 3122. Figure 6 As shown, the extension layer 3121 is integrally provided with the covering film 3115; or, as Figure 7 As shown, the extension layer 3121 and the substrate layer 3113 are integrally arranged.

[0105] The reflective layer 3122 is disposed on a side of the extension layer 3121 close to the light guide plate 20. The material of the reflective layer 3122 may include at least one of white oil and white paint. The material of the white oil may include epoxy resin, polytetrafluoroethylene resin, titanium dioxide or dipropylene glycol methyl ether, which are not listed one by one in the embodiments of the present disclosure. The reflective layer 3122 may also include a reflective sheet.

[0106] In some embodiments, the edge of the plurality of optical films 40 near the third sub-plate 123 overlaps the reflective layer 3122. Thus, the reflective layer 3122 can reduce the risk of light loss caused by part of the light in the light guide plate 20 being emitted from the gap between the third sub-plate 123 and the plurality of optical films 40.

[0107] The light guide plate 20 and the flexible circuit board 31 are fixedly connected together, so that the flexible circuit board 31 does not contact the third sub-board 123, and thus the flexible circuit board 31 cannot be grounded.

[0108] In some embodiments, in order to solve the above problems, the flexible circuit board 31 includes a grounding conductive portion 33, and the grounding conductive portion 33 is located on a side of the flexible circuit board 31 close to the third sub-board 123. The backlight module 100 also includes a grounding structure 60, and the grounding structure 60 is electrically connected to the grounding conductive portion 33 and the third sub-board 123. In this way, the flexible circuit board 31 is grounded, which can reduce the risk of damage to the LED lamp beads 32 caused by static electricity or large current.

[0109] like Figure 8 and Fig. 9 As shown, the grounding conductive portion 33 refers to: the cover film 3115 is provided with at least one second opening 2 , and the second opening 2 exposes a region of the second conductive layer 3114 .

[0110] In some embodiments, Fig.10 As shown, the third sub-plate 123 is provided with a first opening 1231 , and the first opening 1231 matches with the second opening 2 .

[0111] In some embodiments, Fig.11 As shown (in order to facilitate the display of the positional relationship of each film layer of the backlight module 100, Fig.11 The display panel 200 and the fixing tape 300 are not shown), the grounding structure 60 includes an elastic conductive block 61, the elastic conductive block 61 is located between the flexible circuit board 31 and the third sub-board 123, one end of the elastic conductive block 61 is electrically connected to the grounding conductive portion 33, and the other end is electrically connected to the third sub-board 123. The flexible circuit board 31 is electrically connected to the third sub-board 123 through the elastic conductive block 61, that is, the flexible circuit board 31 is grounded.

[0112] Exemplarily, the elastic conductive block 61 may include conductive foam. When installing the conductive foam, first place one end of the conductive foam at the second opening 2, and the conductive foam is fixedly connected to the second conductive layer 3114, for example, glue is applied to one end of the conductive foam, and then the end of the conductive foam coated with glue is bonded to the second conductive layer 3114. Then, the other end of the conductive foam is pressed to be compressed, and then the conductive foam and the flexible circuit board 31 are moved into the groove 12, and the other end of the conductive foam contacts the third sub-board 123, that is, the grounding of the flexible circuit board 31 is completed.

[0113] In some embodiments, Fig.12 As shown, when the third sub-board 123 is provided with a first opening 1231 , one end of the conductive foam is placed at the second opening 2 and adhered to the second conductive layer 3114 , and the other end contacts the edge of the first opening 1231 , so that the flexible circuit board 31 is grounded.

[0114] In some embodiments, Fig.13As shown, the elastic conductive block 61 includes a first conductive portion 611 and a second conductive portion 612. The first conductive portion 611 is located between the third sub-board 123 and the flexible circuit board 31, and the first conductive portion 611 is located at the second opening 2, and the second conductive portion 612 is located on the side of the first conductive portion 611 close to the third sub-board 123. The orthographic projection of the first conductive portion 611 on the third sub-board 123 is located within the range of the orthographic projection of the second conductive portion 612 on the third sub-board 123, and is spaced from the boundary of the orthographic projection of the second conductive portion 612 on the third sub-board 123. In this way, the contact area between the elastic conductive block 61 and the third sub-board 123 can be increased, the pressure on the third sub-board 123 can be reduced, and the service life of the third sub-board 123 can be increased.

[0115] In some embodiments, Fig.14 As shown, when the third sub-board 123 is provided with the first opening 1231, the second opening 2 is orthogonally projected on the third sub-board 123, and is located within the orthogonal projection range of the second conductive portion 612 on the third sub-board 123, and is spaced from the orthogonal projection boundary of the second conductive portion 612 on the third sub-board 123, that is, the first opening 1231 is orthogonally projected on the third sub-board 123, and is located within the orthogonal projection range of the second conductive portion 612 on the third sub-board 123, and is spaced from the orthogonal projection boundary of the second conductive portion 612 on the third sub-board 123. The second opening 2 is orthogonally projected on the third sub-board 123, and is located within the orthogonal projection range of the display panel bearing layer 5 on the third sub-board 123, and is spaced from the orthogonal projection boundary of the display panel bearing layer 5 on the third sub-board 123.

[0116] In some embodiments, Fig.15 As shown, a fourth opening 613 is provided at one end of the elastic conductive block 61 away from the second sub-board 122. At least one optical film 40 includes a main body 41 and a protrusion 42. The main body 41 is located on the side of the third sub-board 123 away from the second sub-board 122. One end of the protrusion 42 is connected to the main body and at least partially located in the fourth opening 613. The fourth opening 613 is configured to limit the movement of the protrusion 42 along the first direction Y. In this way, the risk of at least one optical film 40 moving along the first direction Y and colliding with the back plate 10 and causing damage can be reduced. The first direction Y is perpendicular to the second direction X. In order to facilitate the display of the positional relationship between the film layers of the backlight module 100, Fig.12 and Fig.13 The middle display panel 200 and the fixing tape 300 are not shown.

[0117] In the case where the elastic conductive block 61 includes a first conductive portion 611 and a second conductive portion 612, as shown in FIG. Fig.16 As shown, a fourth opening 613 is provided at one end of the first conductive portion 611 away from the second sub-board 122 . The protrusion 42 is at least partially located in the fourth opening 613 .

[0118] In some embodiments, Fig.17 As shown (in order to facilitate the display of the positional relationship of each film layer of the backlight module 100, Fig.17 The display panel 200 and the fixing tape 300 are not shown), and in the case where the third sub-board 123 is provided with a first opening 1231. The grounding structure 60 includes a conductive adhesive layer 62 and a conductive block 63.

[0119] The conductive adhesive layer 62 is bonded to a surface of the third sub-board 123 away from the first sub-board 121 , and covers the first opening 1231 .

[0120] The conductive block 63 is partially located in the first opening 1231, and one end is electrically connected to the grounded conductive portion 33, and the other end is electrically connected to the conductive adhesive layer 62. The flexible circuit board 31 is electrically connected to the third sub-board 123 through the conductive block 63 and the conductive adhesive layer 62, that is, the flexible circuit board 31 is grounded. In the reliability thermal shock test, the conductive adhesive layer 62 can provide support for the flexible circuit board 31 at the first opening 1231, which can reduce the risk of warping of the flexible circuit board 31 (thickness ≤ 0.1 mm), and further reduce the risk of light leakage of the backlight module 100.

[0121] Exemplarily, the material of the conductive block 63 may include conductive glue, so that one end of the conductive block 63 is bonded to the ground conductive portion 33 , and the other end passes through the first opening 1231 and is bonded to the conductive glue layer 62 .

[0122] Exemplarily, the material of the conductive block and the material of the second conductive layer 3114 may be the same, so that one end of the conductive block contacts the ground conductive portion 33 , and the other end passes through the first opening 1231 and contacts the conductive adhesive layer 62 .

[0123] The backlight module 100 further includes a support layer 70 and an adhesive layer 80, wherein the support layer 70 is located on a side of the conductive adhesive layer 62 away from the third sub-board 123, and the adhesive layer 80 is located between the support layer 70 and the conductive adhesive layer 62. The adhesive layer 80 is used to adhere the support layer 70 and the conductive adhesive layer 62. The support layer 70, the adhesive layer 80 and the conductive adhesive layer 62 form a display panel bearing layer 5, and the display panel bearing layer 5 is configured to support the first glass substrate 210.

[0124] The material of the support layer 70 may include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyphenylene sulfone resin (PPSU), or polymethyl methacrylate (PMMA). The embodiments of the present disclosure will not be listed one by one. Exemplarily, the material of the support layer 70 includes PET.

[0125] In some embodiments, Fig.10 As shown, a portion of the boundary of the third sub-board 123 away from the second sub-board 122 is recessed inward to form a first opening 1231 , that is, a boundary of the first opening 1231 coincides with a boundary of the third sub-board 123 away from the second sub-board 122 .

[0126] like Fig.18 As shown, at least one optical film 40 includes a main body 41 and a raised portion 42. The main body 41 is located on the side of the third sub-plate 123 away from the second sub-plate 122. One end of the raised portion 42 is connected to the main body and is at least partially located in the first opening 1231. The raised portion 42 is arranged side by side with the conductive block 63. The conductive block 63 is configured to limit the movement of the raised portion 42 along the first direction Y. In this way, the risk of at least one optical film 40 moving along the first direction Y and colliding with the back plate 10 and causing damage can be reduced. The first direction Y is perpendicular to the second direction X. In order to facilitate the display of the positional relationship between the film layers of the backlight module 100, Fig.17 The middle display panel 200 and the fixing tape 300 are not shown.

[0127] For example, Fig.19A As shown (in order to facilitate the display of the positional relationship between the display panel bearing layer 5, the wiring portion 311 and the conductive block 63, Fig.19A The middle back plate 10 and the display panel 200 are fixed with the adhesive tape 300 (not shown). Along the first direction Y, the protrusion 42 and the conductive block 63 are arranged side by side, and the protrusion 42 is located on the left side of the conductive block 63 .

[0128] For example, Fig.19B As shown (in order to facilitate the display of the positional relationship between the display panel bearing layer 5, the wiring portion 311 and the conductive block 63, Fig.19B The adhesive tape 300 for fixing the middle back plate 10 and the display panel 200 is not shown. ), along the first direction Y, the protrusion 42 and the conductive block 63 are arranged side by side, and the protrusion 42 is located on the right side of the conductive block 63 .

[0129] like Fig.19A and Fig.19B As shown, along the first direction Y, the protrusion 42 and the conductive block 63 are in contact with each other at the ends thereof that are close to each other, so that the conductive block 63 can limit the protrusion 42 from moving along the first direction Y. Wherein.

[0130] In some embodiments, Fig.19A and Fig.19B As shown, the conductive adhesive layer 62 is provided with an avoidance hole 621 , and part of the protrusion 42 is located in the avoidance hole 621 .

[0131] It should be noted that: when the surface of the protrusion 42 away from the light guide plate 20 is closer to the light guide plate 20 than the surface of the third sub-plate 123 away from the light guide plate 20, the conductive adhesive layer 62 may not be provided with the avoidance hole 621. Alternatively, when the surface of the protrusion 42 away from the light guide plate 20 is flush with the surface of the third sub-plate 123 away from the light guide plate 20, the conductive adhesive layer 62 may not be provided with the avoidance hole 621.

[0132] In some embodiments, Fig.18 As shown, the backlight module 100 further includes a reflective layer 90 , and the reflective layer 90 is located between the support portion 11 and the light guide plate 20 .

[0133] It can be understood that the embodiments of the present disclosure are not limited thereto, and in some possible cases, the above-mentioned multiple embodiments can be arbitrarily combined.

[0134] For example, Fig. 20 As shown, the flexible circuit board 31 is partially located between the light guide plate 20 and the first sub-plate 121 , and is bonded to the light guide plate 20 .

[0135] The light shielding tape 50 is partially located between the third sub-board 123 and the flexible circuit board 31, and is located on the side of the second sub-board 122 close to the plurality of optical films 40. One end of the light shielding tape 50 away from the second sub-board 122 extends out of the groove 12. The edge of the plurality of optical films 40 close to the first sub-board 121 overlaps with the edge of the light shielding tape 50 away from the second sub-board 122.

[0136] The conductive foam is located between the flexible circuit board 31 and the third sub-board 123 , and between the second sub-board 122 and the light shielding tape 50 . One end of the conductive foam is connected to the grounding conductive portion 33 , and the other end is connected to the third sub-board 123 .

[0137] For example, Fig.21As shown, the first sub-portion 21 is at least partially located between the first sub-board 121 and the third sub-board 123, and the second sub-portion 22 is disposed on the support portion 11 and connected to the first sub-portion 21. The first sub-portion 21 is away from the surface of the first sub-board 121, and is closer to the plane where the first sub-board 121 and the support portion 11 are located than the surface of the second sub-portion 22 away from the support portion 11.

[0138] The flexible circuit board 31 is partially located between the first sub-section 21 and the first sub-board 121 , and the flexible circuit board 31 is bonded to the surface of the first sub-section 21 .

[0139] The light shielding tape 50 is partially located between the third sub-board 123 and the flexible circuit board 31, and is located on the side of the second sub-board 122 close to the plurality of optical films 40. One end of the light shielding tape 50 away from the second sub-board 122 extends out of the groove 12, and the edge of the plurality of optical films 40 close to the first sub-board 121 overlaps with the edge of the light shielding tape 50 away from the second sub-board 122.

[0140] The conductive foam is located between the flexible circuit board 31 and the third sub-board 123 , and between the second sub-board 122 and the light shielding tape 50 . One end of the conductive foam is connected to the grounding conductive portion 33 , and the other end is connected to the third sub-board 123 .

[0141] For example, Fig.11 As shown, the first sub-section 21 is at least partially located between the first sub-board 121 and the third sub-board 123, and the second sub-section 22 is disposed on the support portion 11 and connected to the first sub-section 21. The first sub-section 21 is away from the surface of the first sub-board 121, and is closer to the plane where the first sub-board 121 and the support portion 11 are located than the surface of the second sub-section 22 is away from the support portion 11. The edge of the first sub-section 21 close to the second sub-section 22 overlaps with the edge of the plurality of optical films 40 close to the third sub-board 123.

[0142] The wiring portion 311 is partially located between the light guide plate 20 and the third sub-plate 123, and is fixedly connected to the first sub-plate 21. The LED lamp bead 32 is fixedly connected to the wiring portion 311. The light shielding portion 312 is located on the side of the wiring portion 311 away from the second sub-plate 122, and is connected to the wiring portion 311. One end of the light shielding portion 312 away from the wiring portion 311 extends out of the groove portion 12 and is flush with one end of the first sub-plate 21 close to the second sub-plate 22. The light shielding portion 312 is away from the surface of the first sub-plate 21 and is flush with the surface of the second sub-plate 22 away from the support portion 11.

[0143] The conductive foam is located between the flexible circuit board 31 and the third sub-board 123 . One end of the conductive foam is connected to the ground conductive portion 33 , and the other end of the conductive foam is connected to the third sub-board 123 .

[0144] For example, Fig. 22As shown (in order to facilitate the display of the positional relationship of each film layer of the backlight module 100, Fig.21 The display panel 200 and the fixing tape 300 are not shown), the wiring portion 311 is partially located between the light guide plate 20 and the third sub-plate 123, and is fixedly connected to the light guide plate 20. The LED lamp bead 32 is fixedly connected to the wiring portion 311. The shading portion 312 is located on the side of the wiring portion 311 away from the second sub-plate 122, and is connected to the wiring portion 311, and one end of the shading portion 312 away from the wiring portion 311 extends out of the groove portion 12. The edge portions of the plurality of optical films 40 close to the first sub-plate 121 overlap with the edge portions of the shading portion 312 away from the second sub-plate 122.

[0145] The conductive foam is located between the flexible circuit board 31 and the third sub-board 123 . One end of the conductive foam is connected to the ground conductive portion 33 , and the other end of the conductive foam is connected to the third sub-board 123 .

[0146] For example, Fig.17 As shown, the first sub-section 21 is at least partially located between the first sub-board 121 and the third sub-board 123, and the second sub-section 22 is disposed on the support portion 11 and connected to the first sub-section 21. The first sub-section 21 is away from the surface of the first sub-board 121, and is closer to the plane where the first sub-board 121 and the support portion 11 are located than the surface of the second sub-section 22 is away from the support portion 11. The edge of the first sub-section 21 close to the second sub-section 22 overlaps with the edge of the plurality of optical films 40 close to the third sub-board 123.

[0147] The wiring portion 311 is partially located between the first sub-portion 21 and the third sub-board 123, and is fixedly connected to the first sub-portion 21. The LED lamp bead 32 is fixedly connected to the wiring portion 311. The light shielding portion 312 is located on the side of the wiring portion 311 away from the second sub-board 122, and is connected to the wiring portion 311. One end of the light shielding portion 312 away from the wiring portion 311 extends out of the groove portion 12 and is flush with one end of the first sub-portion 21 away from the second sub-portion 22. The light shielding portion 312 is away from the surface of the first sub-portion 21 and is flush with the surface of the second sub-portion 22 away from the support portion 11.

[0148] The third sub-board 123 is provided with a first opening 1231. The conductive adhesive layer 62 is bonded to the surface of the third sub-board 123 away from the first sub-board 121 and covers the first opening 1231. The conductive block 63 is partially located in the first opening 1231, and one end of the conductive block 63 is electrically connected to the ground conductive portion 33, and the other end is electrically connected to the conductive adhesive layer 62.

[0149] The support layer 70 is located on a side of the conductive adhesive layer 62 away from the third sub-board 123, and the adhesive layer 80 is located between the support layer 70 and the conductive adhesive layer 62. The adhesive layer 80 is used to adhere the support layer 70 and the conductive adhesive layer 62. The support layer 70, the adhesive layer 80 and the conductive adhesive layer 62 form a display panel bearing layer 5, and the display panel bearing layer 5 is configured to support the first glass substrate 210.

[0150] For example, Fig.23 As shown (in order to facilitate the display of the positional relationship of each film layer of the backlight module 100, Fig.23 The display panel 200 and the fixing tape 300 are not shown), the flexible circuit board 31 is at least partially located between the light guide plate 20 and the first sub-plate 121, and is bonded to the light guide plate 20.

[0151] The light shielding tape 50 is partially located between the third sub-board 123 and the flexible circuit board 31, and is located on the side of the second sub-board 122 close to the plurality of optical films 40. One end of the light shielding tape 50 away from the second sub-board 122 extends out of the groove 12. The edge of the plurality of optical films 40 close to the first sub-board 121 overlaps with the edge of the light shielding tape 50 away from the second sub-board 122.

[0152] The third sub-board 123 is provided with a first opening 1231. The conductive adhesive layer 62 is bonded to the surface of the third sub-board 123 away from the first sub-board 121 and covers the first opening 1231. The conductive block 63 is partially located in the first opening 1231 and partially located between the second sub-board 122 and the light shielding tape 50. One end of the conductive block 63 is electrically connected to the ground conductive portion 33, and the other end is electrically connected to the conductive adhesive layer 62.

[0153] The support layer 70 is located on a side of the conductive adhesive layer 62 away from the third sub-board 123, and the adhesive layer 80 is located between the support layer 70 and the conductive adhesive layer 62. The adhesive layer 80 is used to adhere the support layer 70 and the conductive adhesive layer 62. The support layer 70, the adhesive layer 80 and the conductive adhesive layer 62 form a display panel bearing layer 5, and the display panel bearing layer 5 is configured to support the first glass substrate 210.

[0154] For example, Fig.24 As shown (in order to facilitate the display of the positional relationship of each film layer of the backlight module 100, Fig.24 The first sub-section 21 is at least partially located between the first sub-board 121 and the third sub-board 123, and the second sub-section 22 is disposed on the support portion 11 and connected to the first sub-section 21. The first sub-section 21 is away from the surface of the first sub-board 121, and is closer to the plane where the first sub-board 121 and the support portion 11 are located than the surface of the second sub-section 22 away from the support portion 11.

[0155] The flexible circuit board 31 is at least partially located between the first sub-portion 21 and the first sub-board 121 , and is bonded to the first sub-portion 21 .

[0156] The light shielding tape 50 is partially located between the third sub-board 123 and the flexible circuit board 31, and is located on one side of the second sub-board 122. One end of the light shielding tape 50 away from the second sub-board 122 extends out of the groove 12, and the orthographic projections of the plurality of optical films 40 on the reference surface partially overlap with the orthographic projections of the light shielding tape 50 on the reference surface.

[0157] The third sub-board 123 is provided with a first opening 1231. The conductive adhesive layer 62 is connected to the surface of the third sub-board 123 away from the first sub-board 121. The conductive block 63 is located partially in the first opening 1231 and partially between the second sub-board 122 and the light shielding tape 50. One end of the conductive block 63 is electrically connected to the ground conductive portion 33, and the other end is electrically connected to the conductive adhesive layer 62.

[0158] The support layer 70 is located on a side of the conductive adhesive layer 62 away from the third sub-board 123, and the adhesive layer 80 is located between the support layer 70 and the conductive adhesive layer 62. The adhesive layer 80 is used to adhere the support layer 70 and the conductive adhesive layer 62. The support layer 70, the adhesive layer 80 and the conductive adhesive layer 62 form a display panel bearing layer 5, and the display panel bearing layer 5 is configured to support the first glass substrate 210.

[0159] For example, Fig.25 As shown (in order to facilitate the display of the positional relationship of each film layer of the backlight module 100, Fig.23 The display panel 200 and the fixing tape 300 are not shown), the wiring portion 311 is partially located between the light guide plate 20 and the third sub-plate 123, and is fixedly connected to the first sub-plate 21. The LED lamp bead 32 is fixedly connected to the wiring portion 311. The shading portion 312 is located on the side of the wiring portion 311 away from the second sub-plate 122, and is connected to the wiring portion 311. The end of the shading portion 312 away from the wiring portion 311 extends out of the groove portion 12 and is flush with the end of the first sub-plate 21 close to the second sub-plate 22. The shading portion 312 is away from the surface of the first sub-plate 21 and is flush with the surface of the second sub-plate 22 away from the support portion 11.

[0160] The third sub-board 123 is provided with a first opening 1231. The conductive adhesive layer 62 is bonded to the surface of the third sub-board 123 away from the first sub-board 121 and covers the first opening 1231. The conductive block 63 is partially located in the first opening 1231, and one end of the conductive block 63 is electrically connected to the ground conductive portion 33, and the other end is electrically connected to the conductive adhesive layer 62.

[0161] The support layer 70 is located on a side of the conductive adhesive layer 62 away from the third sub-board 123, and the adhesive layer 80 is located between the support layer 70 and the conductive adhesive layer 62. The adhesive layer 80 is used to adhere the support layer 70 and the conductive adhesive layer 62. The support layer 70, the adhesive layer 80 and the conductive adhesive layer 62 form a display panel bearing layer 5, and the display panel bearing layer 5 is configured to support the first glass substrate 210.

[0162] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A backlight module, characterized in that: include: A back plate, comprising a support portion and a groove portion located at one side of the support portion, wherein the groove portion comprises a first sub-plate, a second sub-plate and a third sub-plate connected in sequence, wherein an end of the first sub-plate away from the second sub-plate is connected to the support portion, and the third sub-plate is arranged opposite to the first sub-plate; and the third sub-plate is provided with a first opening; a light guide plate, disposed on the support portion and partially located between the first sub-plate and the third sub-plate; A flexible circuit board, at least partially located between the light guide plate and the third sub-plate, and fixedly connected to the light guide plate; the flexible circuit board includes a routing portion, the routing portion is located between the first sub-plate and the third sub-plate, and fixedly connected to the light guide plate, and the routing portion does not contact the third sub-plate; the routing portion includes a first insulating layer, a first conductive layer, a substrate layer, a second conductive layer and a cover film which are stacked in sequence, wherein the first insulating layer is closer to the light guide plate than the cover film, and the cover film is provided with at least one second opening; the flexible circuit board also includes a grounding conductive portion, the grounding conductive portion is located on a side of the flexible circuit board close to the third sub-plate; the grounding conductive portion refers to a region where the second opening exposes the second conductive layer; A grounding structure, electrically connected to the grounding conductive portion and the third sub-board; the grounding structure comprises: A conductive adhesive layer, bonded to a surface of the third sub-board away from the first sub-board and covering the first opening; A conductive block is partially located in the first opening, one end of the conductive block is electrically connected to the ground conductive portion, and the other end of the conductive block is electrically connected to the conductive adhesive layer.

2. The backlight module according to claim 1, characterized in that: The light guide plate comprises: a first sub-section, at least partially located between the first sub-board and the third sub-board; a second sub-section, disposed on the support portion and connected to the first sub-section; Among them, the first sub-part is far away from the surface of the first sub-board, and is closer to the plane where the first sub-board and the supporting part are located than the surface of the second sub-part is far away from the supporting part. The flexible circuit board is located on the side of the first sub-part far away from the first sub-board, and is fixedly connected to the surface of the first sub-part far away from the first sub-board.

3. The backlight module according to claim 2, characterized in that: A surface of the flexible circuit board away from the first sub-portion is flush with a surface of the second sub-portion away from the supporting portion.

4. The backlight module according to any one of claims 1 to 3, characterized in that: The flexible circuit board also includes: A light shielding portion, located at a side of the wiring portion away from the second sub-board, connected to the wiring portion, and one end of the light shielding portion away from the wiring portion extends out of the groove; Among them, the backlight module also includes a plurality of stacked optical films, which are located on a side of the light guide plate away from the supporting portion, and on a side of the third sub-board away from the second sub-board; the edge portion of the plurality of optical films is close to the third sub-board and overlaps with the edge portion of the shading portion away from the routing portion.

5. The backlight module according to claim 4, characterized in that: The light shielding portion includes an extension layer and a light reflecting layer. The extension layer is integrally provided with the cover film or the substrate layer. The light reflecting layer is provided on a side of the extension layer close to the light guide plate.

6. The backlight module according to claim 5, characterized in that: The edge portions of the plurality of optical films close to the third sub-plate overlap with the reflective layer.

7. The backlight module according to claim 4, characterized in that: In the case that the light guide plate includes a first sub-portion and a second sub-portion, an end of the light shielding portion away from the wiring portion is flush with an end of the second sub-portion close to the first sub-portion.

8. The backlight module according to claim 1, characterized in that: The third sub-plate is recessed inwardly away from a portion of the boundary of the second sub-plate to form the first opening; The backlight module also includes a plurality of stacked optical films, at least one of which includes a main body and a raised portion, the main body being located on a side of the third sub-board away from the second sub-board, one end of the raised portion being connected to the main body and at least partially located in the first opening, and the raised portion being arranged side by side with the conductive block.

9. The backlight module according to claim 8, characterized in that: Along a first direction, the protrusion and the ends of the conductive block that are close to each other are in contact with each other; wherein the first direction is parallel to a length extension direction of the third sub-board.

10. The backlight module according to claim 9, characterized in that: The conductive adhesive layer is provided with an avoidance hole, and part of the protrusion is located in the avoidance hole.

11. The backlight module according to claim 1, characterized in that: The backlight module further comprises a supporting layer and an adhesive layer which are stacked, and the adhesive layer is bonded to the conductive adhesive layer.

12. A display device, characterized in that: It comprises a backlight module and a display panel as described in any one of claims 1 to 11.

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