SiC shell packaging device

Abstract

The present invention relates to a SiC cladding packaging device. When the SiC cladding packaging device is used to package the SiC cladding, the upper pressure head and the lower pressure head are respectively connected to the two poles of a power supply. Since the heating ring is located between the upper pressure head and the lower pressure head, the upper end of the heating ring is connected to the upper pressure head, and the lower end of the heating ring is connected to the lower pressure head. At this time, the upper pressure head, the heating ring, the lower pressure head and the power supply form a loop, thereby energizing the heating ring, and then the heating ring can heat the connection between the SiC cladding and the end plug. Since the heating ring is located between the upper pressure head and the lower pressure head, the upper end of the heating ring is connected to the upper pressure head, and the lower end of the heating ring is connected to the lower pressure head, thereby limiting the heating area of ​​the heating ring, allowing the heating ring to locally heat the SiC cladding. The heating range is small, thereby avoiding chemical and mechanochemical reactions between the fuel pellets inside the SiC cladding and the SiC cladding, and ensuring the service performance of the fuel pellets and the SiC cladding.

Description

Technical Field

[0001] The present invention relates to the technical field of fuel cladding packaging, and in particular to a SiC cladding packaging device. Background Art

[0002] Silicon carbide (SiC) ceramics, as a nuclear ceramic material, have great potential for use in nuclear reactor cladding, thereby addressing the shortcomings of current commercial zirconium alloys. However, due to SiC's high melting point and low self-diffusion coefficient, current commercial Zr cladding welding technology cannot be directly applied to SiC cladding. Furthermore, the cladding's thin walls, small diameter, and large aspect ratio complicate its connection and packaging, thus restricting its application.

[0003] Currently, SiC cladding is primarily heated by radiation. However, this heat has a wide impact range and can intensify chemical and mechanochemical reactions between the fuel pellets and the SiC cladding, severely impacting the service performance of both the fuel pellets and the cladding. Summary of the Invention

[0004] Based on this, it is necessary to provide a SiC cladding packaging device to address the technical problem that the heat influence range of the SiC cladding radiation heating packaging method is large, which will intensify the chemical and mechanochemical reactions between the internal fuel pellets and the SiC cladding, thereby seriously affecting the service performance of the fuel pellets and the cladding.

[0005] An embodiment of the present application provides a SiC shell packaging device, comprising:

[0006] An upper pressure head, wherein the material used for the upper pressure head is a conductive material;

[0007] A pressing head, wherein the material used for the pressing head is a conductive material and the pressing head is provided with a through hole; and

[0008] A heating ring, the material used for the heating ring is a conductive material, the heating ring is located between the upper pressure head and the lower pressure head, the upper end of the heating ring is connected to the upper pressure head, and the lower end of the heating ring is connected to the lower pressure head, and the inner diameter of the heating ring is greater than or equal to the inner diameter of the through hole.

[0009] In one embodiment, the SiC shell packaging device further includes:

[0010] a heating furnace, wherein the upper pressure head, the heating ring, and the lower pressure head are all located in the heating furnace; and

[0011] A clamping piece is located in the heating furnace, fixed to the inner wall of the heating furnace, located below the lower pressure head, and used to clamp the SiC cladding.

[0012] In one embodiment, the SiC shell packaging device further includes a pressurizing portion, which is used to apply downward pressure to the upper pressure head.

[0013] In one embodiment, the clamping member comprises:

[0014] a fixing portion, the fixing portion being fixed to an inner wall of the heating furnace, the fixing portion having a first clamping space, the first clamping space gradually becoming smaller from top to bottom; and

[0015] A movable portion is located in the first clamping space, the cross-sectional profile of the movable portion gradually decreases from top to bottom, and the movable portion has a second clamping space for clamping the SiC shell; the movable portion is an elastic structure, and the movable portion can slide downward relative to the fixed portion in the first clamping space, so that the elastic force generated by the movable portion clamps the SiC shell.

[0016] In one embodiment, the moving part is made of nylon.

[0017] In one embodiment, the heating furnace is provided with a liquid through port.

[0018] In one embodiment, the SiC shell packaging device further includes a thermal insulation ring, which is sleeved outside the heating ring, with the upper end of the thermal insulation ring abutting against the upper pressure head, and the lower part of the thermal insulation ring abutting against the lower pressure head.

[0019] In one embodiment, the SiC shell packaging device includes a temperature detector, and the side wall of the insulation ring is provided with a temperature measuring hole. The temperature detector is used to measure the temperature of the heating ring through the temperature measuring hole. The temperature detector is connected to a temperature control module, and the temperature control module is used to control the heating temperature of the heating ring according to the temperature measured by the temperature detector.

[0020] In one embodiment, the upper pressure head is provided with a stepped hole, which includes a first hole and a second hole that are connected, and the inner diameter of the first hole is smaller than the inner diameter of the second hole, so that the connection between the hole wall of the first hole and the hole wall of the second hole forms a step surface facing downward.

[0021] In one embodiment, the heating furnace comprises:

[0022] furnace body; and

[0023] A furnace cover, which is detachably connected to the furnace body and is used to seal the furnace body;

[0024] The SiC shell packaging device further includes:

[0025] An air charging valve, which is arranged on the furnace body and is externally connected to an air charging system;

[0026] A vacuum valve is provided on the furnace body and is externally connected to a vacuum pump and a vacuum gauge.

[0027] In one embodiment, the SiC shell packaging device includes a positioning member, which is vertically arranged on the bottom wall of the heating furnace. The upper pressure head is provided with a positioning hole, and the upper end of the positioning member is positioned and matched with the positioning hole.

[0028] When the SiC cladding packaging device is used to package the SiC cladding, the upper and lower pressure heads are connected to the two poles of a power supply, respectively. Since the heating ring is located between the upper and lower pressure heads, the upper end of the heating ring is connected to the upper pressure head, and the lower end of the heating ring is connected to the lower pressure head. At this time, the upper pressure head, the heating ring, the lower pressure head, and the power supply form a circuit, thereby energizing the heating ring and allowing the heating ring to heat the connection between the SiC cladding and the end plug. Since the heating ring is located between the upper and lower pressure heads, the upper end of the heating ring is connected to the upper pressure head, and the lower end of the heating ring is connected to the lower pressure head, thereby limiting the heating area of ​​the heating ring, allowing the heating ring to locally heat the SiC cladding. The heating range is small, thereby avoiding chemical and mechanochemical reactions between the fuel pellets inside the SiC cladding and the SiC cladding, and ensuring the service performance of the fuel pellets and SiC cladding. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a two-dimensional cross-sectional view of the SiC shell packaging device;

[0030] Figure 2 This is the structural design diagram of the upper pressure head in the SiC shell packaging device.

[0031] Figure Number:

[0032] 100-SiC shell packaging device;

[0033] 110 - upper pressure head; 111 - first hole; 112 - second hole; 113 - positioning hole;

[0034] 120-down pressure head; 121-through hole;

[0035] 130-heating ring;

[0036] 140 - clamping member; 141 - fixed portion; 142 - movable portion; 143 - first clamping space; 144 - second clamping space;

[0037] 150-heating furnace; 151-furnace body; 152-liquid port; 153-positioning member;

[0038] 160-insulation ring; 161-temperature measuring hole;

[0039] 170-Thermometer;

[0040] 181-inflating valve; 182-vacuum valve;

[0041] 210-SiC cladding; 220-end plug. DETAILED DESCRIPTION

[0042] To make the above-mentioned objects, features, and advantages of the present invention more readily apparent, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following description sets forth numerous specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0043] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0044] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0045] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0046] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0047] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0048] See Figure 1 An embodiment of the present application provides a SiC shell packaging device 100 . The SiC shell packaging device 100 includes an upper pressing head 110 , a lower pressing head 120 , and a heating ring 130 .

[0049] The upper pressing head 110 is made of a conductive material. The lower pressing head 120 is also made of a conductive material and is provided with a through hole 121. The heating ring 130 is made of a conductive material and is located between the upper pressing head 110 and the lower pressing head 120. The upper end of the heating ring 130 is connected to the upper pressing head 110, and the lower end of the heating ring 130 is connected to the lower pressing head 120. The inner diameter of the heating ring 130 is greater than or equal to the inner diameter of the through hole 121.

[0050] When packaging the SiC cladding 210 , the end plug 220 needs to be inserted into the upper end of the SiC cladding 210 and reliably connected to the SiC cladding 210 to seal the SiC cladding 210 .

[0051] When the SiC shell packaging device 100 is used to package a SiC shell 210, the SiC shell 210 is inserted into the heating ring 130 and the through-hole 121 of the lower press head 120, so that the wall of the through-hole 121 of the lower press head 120 clamps the SiC shell 210. Because the inner diameter of the heating ring 130 is greater than or equal to the inner diameter of the through-hole 121, the lower end of the heating ring 130 can abut against the lower press head 120. The upper press head 110 is located on the side of the SiC shell 210 where the end plug 220 is provided. Therefore, the upper press head 110 can press the heating ring 130 tightly between the upper press head 110 and the lower press head 120.

[0052] When the above-mentioned SiC cladding packaging device 100 is used to encapsulate the SiC cladding 210, the upper pressing head 110 and the lower pressing head 120 are respectively connected to the two poles of the power supply. Since the heating ring 130 is located between the upper pressing head 110 and the lower pressing head 120, the upper end of the heating ring 130 is connected to the upper pressing head 110, and the lower end of the heating ring 130 is connected to the lower pressing head 120. At this time, the upper pressing head 110, the heating ring 130 and the lower pressing head 120, which are all made of conductive materials, are connected to form a loop with the power supply, so that the heating ring 130 is energized, and then the heating ring 130 can heat the connection between the SiC cladding 210 and the end plug 220. Since the heating ring 130 is located between the upper pressure head 110 and the lower pressure head 120, the upper end of the heating ring 130 is connected to the upper pressure head 110, and the lower end of the heating ring 130 is connected to the lower pressure head 120, thereby limiting the heating area of ​​the heating ring 130, so that the heating ring 130 locally heats the SiC cladding 210, and the heating range is small, thereby avoiding chemical and mechanochemical reactions between the fuel pellets inside the SiC cladding 210 and the SiC cladding 210, thereby ensuring the service performance of the fuel pellets and the SiC cladding 210.

[0053] In one embodiment, the inner diameter of the heating ring 130 is larger than the inner diameter of the through hole, so that the heating ring 130 does not directly contact the SiC cladding 210 , thereby avoiding affecting the structure and quality of the SiC cladding 210 during the heating process.

[0054] In one embodiment, the SiC cladding packaging device 100 further includes a clamping member 140 and a heating furnace 150. The upper press head 110, the heating ring 130, and the lower press head 120 are all located within the heating furnace 150. The clamping member 140 is located within the heating furnace 150 and is fixed to the inner wall of the heating furnace 150. The clamping member 140 is located below the lower press head 120. The clamping member 140 is used to clamp the SiC cladding 210, thereby fixing the position of the SiC cladding 210. The upper press head 110 and the clamping member 140 can respectively provide downward and upward clamping forces on the SiC cladding 210, facilitating the application of pressure to the upper press head 110 and, in turn, facilitating the pressing of the end plug 220 against the SiC cladding 210.

[0055] In one embodiment, there is one through hole 121 in the pressing head 120 .

[0056] In another embodiment, there are multiple through holes 121 in the lower pressing head 120 , and the clamping members 140 correspond to the through holes 121 one by one, so that batch packaging of multiple SiC cladding 210 tubes can be achieved.

[0057] In one embodiment, the heating furnace 150 may further have a side door (not shown) so that the SiC cladding 210 tube can enter the heating furnace 150 through the side door, thereby facilitating the placement of the SiC cladding 210 .

[0058] In one embodiment, the SiC cladding packaging device 100 further includes a pressurizing portion (not shown), which is used to apply downward pressure to the upper pressure head 110 so that the end plug 220 presses the SiC cladding 210. At the same time, the heating ring 130 can be tightly connected to the upper pressure head 110 and the lower pressure head 120, thereby improving the heating efficiency.

[0059] Specifically, the pressurizing unit may be provided by the heating furnace 150 itself, or may be provided inside the heating furnace 150 .

[0060] Alternatively, the pressurizing part may be a hydraulic cylinder or a servo motor.

[0061] In one embodiment, the clamping member 140 includes a fixed portion 141 and a movable portion 142. The fixed portion 141 is fixed to the inner wall of the heating furnace 150 and defines a first clamping space 143 that gradually decreases in size from top to bottom. The movable portion 142 defines a second clamping space 144 for clamping the SiC cladding 210. The cross-sectional profile of the movable portion 142 gradually decreases in size from top to bottom.

[0062] The movable portion 142 is an elastic structure. The movable portion 142 can slide downward relative to the fixed portion 141 in the first clamping space 143 , so that the elastic force generated by the movable portion 142 can clamp the SiC cladding 210 .

[0063] When the SiC cladding 210 is clamped by the clamping member 140 , the SiC cladding 210 can be inserted into the second clamping space and moved downward, so that the moving portion 142 moves downward relative to the fixing portion 141 along with the SiC cladding 210 .

[0064] Since the cross-sectional profile of the movable portion 142 gradually decreases from top to bottom, and the first clamping space gradually decreases from top to bottom, the movable portion 142 has an elastic structure. Therefore, when the movable portion 142 moves downward relative to the fixed portion 141 along with the SiC cladding 210, the movable portion 142 is squeezed by the fixed portion 141, thereby generating an elastic force on the movable portion 142 to radially clamp the SiC cladding 210.

[0065] In one embodiment, the moving portion 142 is made of nylon.

[0066] In one embodiment, the heating furnace 150 is provided with at least one liquid opening 152 . Cooling liquid can enter the heating furnace 150 through the liquid opening 152 to cool the SiC cladding 210 tube, and the cooling liquid can flow out of the heating furnace 150 through the liquid opening 152 .

[0067] In one embodiment, it is necessary to control the coolant level to maintain a certain distance from the lower end of the pressure head 120 to ensure the normal heating process and prevent leakage.

[0068] In one embodiment, there are multiple liquid inlets 152. The multiple liquid inlets 152 include at least one liquid inlet and at least one liquid outlet. When the SiC cladding packaging device 100 encapsulates the SiC cladding 210, liquid inlet and outlet occur simultaneously, enabling coolant circulation and improving cooling efficiency.

[0069] In one embodiment, the SiC cladding packaging device 100 further includes an insulating ring 160, which is sleeved on the outside of the heating ring 130. The upper end of the insulating ring 160 abuts against the upper pressure head 110, and the lower part of the insulating ring 160 abuts against the lower pressure head 120. The side wall of the insulating ring 160 is provided with a temperature measuring hole 161, thereby enclosing the heating ring 130 in a space formed by the upper pressure head 110, the SiC cladding 210, the lower pressure head 120 and the insulating ring 160, so that the heat is fully maintained in the space, ensuring heating efficiency, while preventing heat from diffusing to the non-heating area of ​​the SiC cladding 210, ensuring local heating of the SiC cladding.

[0070] In one embodiment, the SiC shell packaging device 100 includes a temperature detector 170. The temperature detector 170 is used to measure the temperature of the heating ring 130 through the temperature measuring hole 161. The temperature detector 170 is connected to the temperature control module to control the heating temperature of the heating ring 130 based on the temperature measured by the temperature detector 170. The temperature detector 170 can be one or more of an infrared thermometer and a thermocouple thermometer.

[0071] In one embodiment, the upper ram 110 is provided with a stepped hole, which includes a first hole 111 and a second hole 112 that are interconnected. The inner diameter of the first hole 111 is smaller than the inner diameter of the second hole 112, so that the connection between the wall of the first hole 111 and the wall of the second hole 112 forms a step surface facing downward. The stepped holes correspond one-to-one with the through holes 121. The heating ring 130 is mounted on the outside of the SiC cladding 210 tube, and the thermal insulation ring 160 is mounted on the outside of the heating ring 130. The heating ring 130 and the thermal insulation ring 160 cooperate with the second hole 121, and the end plug 220 cooperates with the first hole 111, facilitating the positioning of the SiC cladding 210 tube.

[0072] In one embodiment, the number of the stepped hole and the through hole 121 can be one or more.

[0073] When there are multiple stepped holes and multiple through holes 121 , batch packaging of multiple SiC packages 210 can be achieved.

[0074] In one embodiment, the heating furnace 150 further includes a furnace body 151 and a furnace cover (not shown). The furnace cover is detachably connected to the furnace body 151 and serves to seal the furnace body 151. The SiC cladding packaging device further includes an inflation valve 181 and a vacuum valve 182. The inflation valve 181 and the furnace cover are externally connected to an inflation system, the gas source of which includes nitrogen, helium, hydrogen, or argon. The vacuum valve 182 is externally connected to a vacuum pump and a vacuum gauge, the vacuum gauge comprising at least one of resistive silicon and ionized silicon. The vacuum pump comprises at least one of a rotary vane pump, a diffusion pump, and a molecular pump.

[0075] In one embodiment, the interior of the heating furnace 150 is evacuated by a vacuum pump, and the vacuum degree is controlled to be 10 -6 -10Pa.

[0076] When packaging the SiC cladding 210, the heating furnace 150 needs to be sealed with a furnace cover, the vacuum pump is started to evacuate the heating furnace 150, and the vacuum degree of the heating furnace 150 is detected by a vacuum gauge. After the vacuum degree reaches the test requirement, the inflation step is performed through the inflation system, so that the SiC cladding 210 is heated and packaged in a gas atmosphere, preventing air from affecting the heating process and introducing by-products. At the same time, it can ensure that the SiC cladding 210 contains gas, thereby resisting the external pressure in the use environment.

[0077] Preferably, the gas source of the inflation system is helium. When the inflation system is filled with helium, the interior of the SiC cladding 210 can be filled with helium, thereby improving the thermal conductivity of the fuel and the air cavity of the SiC cladding 210, which is beneficial to heat dissipation.

[0078] In one embodiment, the SiC shell packaging device 100 includes a positioning member 153 . The positioning member 153 is vertically disposed on the bottom wall of the heating furnace 150 . The upper pressing head 110 is provided with a positioning hole 113 . The upper end of the positioning member 153 is positioned and matched with the positioning hole 113 .

[0079] When the SiC cladding packaging device 100 is packaging the SiC cladding 210, the upper ram 110 is mounted on the positioning member 153 through the positioning hole 113, thereby achieving positioning. When the pressurizing unit is not applying pressure to the upper ram 110, the upper ram 110 does not move relative to the positioning member 153. When the pressurizing unit applies pressure to the upper ram 110, since the upper ram 110 is mounted on the positioning member 153 through the positioning hole 113 and the positioning member 153 is vertically disposed on the bottom wall of the heating furnace 150, the upper ram 110 moves vertically downward along the positioning member 153, pressing the end plug 220 against the SiC cladding 210.

[0080] Preferably, the positioning member 153 is located at the center of the bottom wall of the heating furnace 150 .

[0081] In one embodiment, one side of the clamping member 140 is fixed to the inner wall of the heating furnace 150 , and the other side of the clamping member 140 can be fixed to the side of the positioning member 153 .

[0082] In one embodiment, the positioning hole 113 on the upper pressing head 110 can be a through hole or a blind hole.

[0083] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0084] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A SiC shell packaging device (100), characterized in that: The SiC shell packaging device (100) comprises: An upper pressing head (110), wherein the material used for the upper pressing head (110) is a conductive material; A pressing head (120), wherein the pressing head (120) is made of a conductive material and is provided with a through hole (121); and a heating ring (130), wherein the material of the heating ring (130) is a conductive material, the heating ring (130) is located between the upper pressure head (110) and the lower pressure head (120), the upper end of the heating ring (130) is connected to the upper pressure head (110), and the lower end of the heating ring (130) is connected to the lower pressure head (120), and the inner diameter of the heating ring (130) is greater than or equal to the inner diameter of the through hole; A heat-insulating ring (160), wherein the heat-insulating ring (160) is sleeved on the outside of the heating ring (130), the upper end of the heat-insulating ring (160) abuts against the upper pressure head (110), and the lower part of the heat-insulating ring (160) abuts against the lower pressure head (120); A heating furnace (150), wherein the upper pressure head (110), the heating ring (130), the heat-insulating ring (160) and the lower pressure head (120) are all located in the heating furnace (150), and the heating furnace (150) is provided with a side door; A temperature measuring hole (161) is provided on the side wall of the heat-insulating ring (160). The temperature measuring hole (161) is used to measure the temperature of the heating ring (130) through the temperature measuring hole (161). The temperature measuring hole (161) is used to connect the temperature measuring hole (170) to a temperature control module. The temperature control module is used to control the heating temperature of the heating ring (130) according to the temperature measured by the temperature measuring hole (161).

2. The SiC shell packaging device (100) according to claim 1, characterized in that The SiC shell packaging device (100) further comprises: A clamping member (140) is located in the heating furnace (150), the clamping member (140) is fixed to the inner wall of the heating furnace (150), the clamping member (140) is located below the lower pressure head (120), and the clamping member (140) is used to clamp the SiC shell (210).

3. The SiC shell packaging device (100) according to claim 2, characterized in that The SiC shell packaging device (100) further comprises a pressurizing portion, which is used to apply downward pressure to the upper pressure head (110).

4. The SiC shell packaging device (100) according to claim 2, characterized in that The clamping member (140) comprises: a fixing portion (141), the fixing portion (141) being fixed to an inner wall of the heating furnace (150), the fixing portion (141) having a first clamping space (143), the first clamping space (143) gradually becoming smaller from top to bottom; and A movable portion (142) is located in the first clamping space (143), the cross-sectional profile of the movable portion (142) gradually decreases from top to bottom, and the movable portion (142) has a second clamping space (144) for clamping the SiC shell (210); the movable portion (142) is an elastic structure, and the movable portion (142) can slide downward relative to the fixed portion (141) in the first clamping space (143), so that the elastic force generated by the movable portion (142) clamps the SiC shell (210).

5. The SiC shell packaging device (100) according to claim 4, characterized in that The moving part (142) is made of nylon.

6. The SiC shell packaging device (100) according to claim 1, characterized in that The heating furnace (150) is provided with a liquid passage (152).

7. The SiC shell packaging device (100) according to claim 1, characterized in that: The upper pressure head (110) is provided with a stepped hole, which includes a first hole (111) and a second hole (112) that are connected to each other. The inner diameter of the first hole (111) is smaller than the inner diameter of the second hole (112), so that the connection between the hole wall of the first hole (111) and the hole wall of the second hole (112) forms a step surface facing downward.

8. The SiC shell packaging device (100) according to claim 1, characterized in that The heating furnace (150) comprises: a furnace body (151) and a furnace cover, wherein the furnace cover is detachably connected to the furnace body (151) and is used to seal the furnace body (151); The SiC shell packaging device (100) further comprises: an air filling valve (181), the air filling valve (181) being arranged on the furnace body (151) and being connected to an external air filling system; A vacuum valve (182) is provided on the furnace body (151) and is externally connected to a vacuum pump and a vacuum gauge.

9. The SiC shell packaging device (100) according to claim 1, characterized in that: The SiC shell packaging device (100) comprises a positioning member (153), the positioning member (153) is vertically arranged on the bottom wall of the heating furnace (150), a positioning hole (113) is provided on the upper pressure head (110), and the upper end of the positioning member (153) is positioned and matched with the positioning hole (113).

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