A crystal bonding component, a crystal bonding machine and a crystal bonding method

Abstract

The present invention relates to the technical field of die bonding machines, and more particularly to a die bonding assembly, a die bonding machine, and a die bonding method. The die bonding assembly includes a suction device, a transfer carrier, and an image recognition device. The transfer carrier includes at least two adjustment components. The adjustment component includes a carrier for placing chips and a drive mechanism. The image recognition device captures the image of the chip on the carrier. The drive mechanism drives the carrier to adjust according to the chip image information. The suction device removes chips from at least two carriers at a time. By providing an adjustment component on the transfer carrier, the chips can be adjusted and positioned in advance. During mounting, only one reference point on the circuit board to be mounted is required to accurately mount the entire board of chips, greatly improving the overall mounting accuracy.

Description

Technical field

[0001] The present invention relates to the technical field of crystal bonding machines, and in particular to a crystal bonding component, a crystal bonding machine and a crystal bonding method. [Background Technology]

[0002] With the advancement of industrial technology, die bonders are rapidly developing towards a high degree of automation to improve production efficiency. Existing die bonders typically cycle through individual pickup, positioning, and placement soldering. However, as circuit boards become increasingly integrated, the number of chips required to be mounted on a single board increases, and single-chip placement equipment is increasingly unable to meet production efficiency requirements. Consequently, the industry has begun researching processes for simultaneously placing multiple chips. Because the placement of chips on the circuit board is precisely planned and laid out in advance, accurately positioning and placing multiple chips simultaneously remains a challenge for the industry. [Summary of the invention]

[0003] In order to solve the problem that existing equipment is difficult to accurately position and mount multiple chips at one time, the present invention provides a die bonding assembly, a die bonding machine and a die bonding method.

[0004] The solution to the technical problem of the present invention is to provide a solid crystal component for transferring chips, including a suction device, a transfer carrying device and an image recognition device; the transfer carrying device includes a limit plate and at least two adjustment components, the adjustment component includes a carrier for placing the chip and a driving mechanism; the limit plate is provided with a receiving hole, and the carrier is movably arranged in the receiving hole; the carrier is provided with an adsorption hole and at least one connecting hole, the inner wall of the receiving hole is provided with an annular air duct groove, the connecting hole connects the adsorption hole and the air duct groove, and the limit plate is provided with a negative pressure channel connecting the air duct groove and the external vacuum equipment; the carrier The part is connected to the driving mechanism through a connecting part, and the driving mechanism includes a rotating driving part and a lifting driving part. The rotating driving part drives the carrier to rotate through the connecting part, and the lifting driving part drives the carrier to move up and down through the connecting part; the image recognition device obtains the chip image on the carrier, and the rotating driving part drives the carrier to rotate according to the chip image information to fine-tune the skew of the chip on the carrier; the lifting driving part drives the carrier to move up and down according to the chip image information to level the upper surface of the chip on the carrier; the suction device absorbs all the chips on the transfer carrier at one time.

[0005] Preferably, the lifting drive member is fixed to one side of the connecting member, and the rotating drive member can drive the lifting drive member and the connecting member to rotate simultaneously when the rotating drive member is in motion.

[0006] Preferably, the limiting plate is arranged horizontally, and the horizontal upward surface of the limiting plate is defined as the upper surface. The accommodating hole forms an opening on the upper surface. The supporting member is cylindrical, and one end of the supporting member is exposed from the opening. The diameter of the supporting member matches the diameter of the opening; the adsorption hole is opened at the central axis of the supporting member.

[0007] Preferably, the image recognition device includes a first camera, which is horizontally arranged with its shooting direction facing the limiting plate.

[0008] Preferably, the central axis of the first camera is located in the plane where the upper surface is located or higher than the plane where the upper surface is located.

[0009] Preferably, the image recognition device further includes a second camera, which is vertically arranged and movable to the limiting plate, and the shooting direction of the second camera is toward the upper surface of the limiting plate.

[0010] Preferably, the suction device includes a main body and a suction nozzle, and the suction nozzle is detachably connected to one end of the main body; the suction nozzle is provided with at least two suction nozzle openings; when sucking the chip, the suction nozzle openings correspond to the carrier, and the main body drives the suction nozzle to suck the chip on the carrier once.

[0011] Preferably, the second camera is arranged on one side of the body and moves synchronously with the body.

[0012] In order to solve the above technical problems, the present invention further provides a die bonding machine, comprising the above die bonding assembly.

[0013] In order to solve the above technical problems, the present invention also provides a die bonding method, which is implemented through the above-mentioned die bonding component and includes the following steps: transferring the chip to a transfer carrier according to a preset position; obtaining an image of the chip on the transfer carrier; correcting the orientation of the chip based on the obtained chip image information; and sucking multiple chips on the transfer carrier at one time and transferring them to a welding position for welding.

[0014] Compared with the prior art, the die bonding assembly, die bonding machine and die bonding method provided by the present invention have the following advantages:

[0015] 1. The die bonding assembly of the present invention includes a suction device, a transfer carrier device, and an image recognition device. The transfer carrier device includes at least two adjustment components. The adjustment component includes a carrier for placing chips and a drive mechanism. The image recognition device obtains the image of the chip on the carrier, and the drive mechanism drives the carrier to adjust according to the chip image information. The suction device removes chips from at least two carriers at a time. It can be understood that each carrier is pre-arranged and arranged corresponding to the position of the chip to be mounted on the circuit board to be mounted. A chip can be placed on each carrier. Each time a chip is placed, the image recognition device can obtain the actual position and orientation of the chip in real time, compare it with the pre-designed position in the database, and control the drive mechanism to execute an action to adjust the carrier, thereby adjusting the position and orientation of the chip on the carrier. After the chips on the carrier are adjusted one by one, the chips on the entire transfer carrier device correspond one-to-one with the position of the chip to be mounted on the circuit board to be mounted. Then, the suction device sucks all the chips on the entire transfer carrier device at once and moves them to the mounting position for mounting at one time. By installing an adjustment component on the transfer carrier, the chip can be adjusted and positioned in advance. During placement, only one reference point on the circuit board to be placed is required to accurately place the entire board of chips, greatly improving the overall placement accuracy. In addition, the existing placement method is to move individual chips to the transfer table for positioning and identification, and then move them individually from the transfer table to the placement position for placement. The present invention extracts the entire board of chips from the transfer carrier at one time, reducing the multiple trips from the transfer table to the placement position to a single trip, greatly saving time and improving placement efficiency.

[0016] 2. The transfer carrier device of the present invention also includes a stopper plate with a receiving hole formed therein, into which the carrier is movably disposed. It is understood that the high concentration of chips on a circuit board and the small distances between chips will result in a correspondingly small distance between carriers, and the volume of a single carrier will also be reduced. By providing a stopper plate and confining the carrier within the receiving hole, the stability of the carrier can be enhanced, preventing carrier deflection that could affect positioning accuracy.

[0017] 3. The carrier of the present invention is connected to a drive mechanism via a connector. The drive mechanism includes a rotary drive assembly and a lift drive assembly. The rotary drive assembly drives the carrier to rotate via the connector, while the lift drive assembly drives the carrier to rise and fall via the connector. The rotary drive assembly allows for fine-tuning of chip skew to prevent crooked placement during placement. The lift drive assembly allows for leveling of the chip's top surface, ensuring that the suction device can simultaneously absorb multiple chips without missing any.

[0018] 4. The limit plate of the present invention is arranged horizontally, with the horizontal, upward surface of the limit plate defined as the upper surface, and one end of the carrier exposed from the upper surface. The image recognition device includes a first camera, which is arranged horizontally and faces the limit plate. By setting the first camera horizontally, the height of the chip can be quickly identified and the height difference between the chip and adjacent chips can be determined, thereby providing information to the adjustment component for fine-tuning the chip height. In addition, the chip side information obtained by the first camera can also be used to determine whether the chip is properly aligned, thereby providing information to the adjustment component for fine-tuning the chip orientation.

[0019] 5. The central axis of the first camera of the present invention is located in the plane where the upper surface is located or higher than the plane where the upper surface is located. This setting allows the first camera to fully capture the side of the chip without being blocked by the limit plate, resulting in a better recognition effect.

[0020] 6. The image recognition device of the present invention also includes a second camera, which is vertically positioned and movable to the position of the limit plate. The second camera's shooting direction is toward the upper surface of the limit plate. By arranging the second camera to shoot the top surface of the chip from top to bottom, the alignment of the chip can be determined from the top surface, providing clearer information about the chip's orientation and more precise adjustment.

[0021] 7. The nozzle of the present invention has at least two nozzle openings. When picking up chips, the nozzle openings correspond to the carrier, and the body drives the nozzle to pick up the chips on the carrier one at a time. By designing the nozzle with multiple nozzle openings, the connection method between the other end of the nozzle and the body can be maintained. That is, the universal binding head can be used with other nozzle models, increasing the applicability of the present invention and improving its practicality.

[0022] 8. The second camera of the present invention is arranged on one side of the main body and moves synchronously with the main body. Through this arrangement, the second camera can be prevented from affecting the movement of the suction device, and no separate component is needed to fix the second camera, which simplifies the structure and saves costs.

[0023] 9. The present invention also provides a die bonding machine and a die bonding method, which have the same beneficial effects as the above-mentioned die bonding assembly and are not described in detail here.

Brief Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 Schematic diagram of the structure of the die-bonding assembly provided in the first embodiment of the present invention.

[0026] Figure 2 It is a three-dimensional schematic diagram of the transfer carrying device of the die-bonding assembly provided by the first embodiment of the present invention.

[0027] Figure 3 It is a cross-sectional schematic diagram of the transfer carrying device of the die-bonding assembly provided in the first embodiment of the present invention.

[0028] Figure 4 yes Figure 3 A magnified view of the middle panel.

[0029] Figure 5 It is a structural schematic diagram of the material suction device of the die-bonding assembly provided by the first embodiment of the present invention.

[0030] Figure 6 FIG. 4 is a block diagram of a die bonding machine provided in accordance with a second embodiment of the present invention.

[0031] Figure 7 4 is a flowchart of the steps of the die bonding method provided in the third embodiment of the present invention.

[0032] Description of the accompanying drawings:

[0033] 100. Die bonding assembly; 200. Die bonding machine;

[0034] 1. Transfer carrying device;

[0035] 10. Adjustment assembly; 11. Carrying member; 12. Driving mechanism; 13. Connecting member; 20. Support frame; 30. Limiting plate; 40. Image recognition device; 50. Suction device; 51. Main body; 52. Suction nozzle;

[0036] 111, adsorption hole; 112, communication hole; 121, rotation drive member; 122, lifting drive member; 301, accommodation hole; 302, negative pressure channel; 401, first camera; 402, second camera; 521, suction nozzle;

[0037] 3011. Opening; 3012. Air duct groove. [Specific implementation method]

[0038] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0039] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly attached to the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only.

[0040] See also Figure 1 The first embodiment of the present invention provides a die-bonding assembly 100 for transferring chips. The die-bonding assembly 100 includes a suction device 50, a transfer carrier device 1, and an image recognition device 40. The image recognition device 40 can obtain the chip image on the transfer carrier device 1, and the suction device 50 can simultaneously absorb all chips on the transfer carrier device 1.

[0041] Please combine Figure 1-Figure 3 Furthermore, the transfer carrier device 1 includes at least two adjustment components 10, and the adjustment component 10 includes a carrier 11 for placing the chip and a driving mechanism 12; the image recognition device 40 obtains the chip image on the carrier 11, and the driving mechanism 12 drives the carrier 11 to adjust according to the chip image information, and the suction device 50 removes the chips on at least two carriers 11 at a time.

[0042] It can be understood that each carrier 11 is arranged in advance corresponding to the position of the chip to be attached to the circuit board to be mounted. A chip can be placed on each carrier 11. Every time a chip is placed, the image recognition device 40 can obtain the actual position and orientation of the chip in real time, and compare it with the pre-designed position in the database, and control the drive mechanism 12 to perform an action to adjust the carrier 11, thereby adjusting the position and orientation of the chip on the carrier 11. After the chips on the carrier 11 are adjusted one by one, the chips on the entire transfer carrier device 1 correspond one-to-one to the position of the chip to be attached on the circuit board to be mounted. Then, the suction device 50 sucks all the chips on the entire transfer carrier device 1 at one time and moves them to the mounting position for one-time mounting. By setting the adjustment component 10 on the transfer carrier device 1, the chips are adjusted and positioned in advance. When mounting, only one reference point corresponding to the circuit board to be mounted is required to accurately mount the entire board of chips, greatly improving the accuracy of the overall mounting. In addition, the mounting method of the prior art is to move the chips individually to the transfer table for positioning and identification, and then move them individually from the transfer table to the mounting position for mounting. The present invention absorbs the entire board of chips from the transfer carrier device 1 at one time, reducing the multiple journeys from the transfer table to the mounting position to one journey, greatly saving time and improving mounting efficiency.

[0043] Please combine Figure 2-Figure 4Furthermore, the transfer carrying device 1 also includes a support frame 20 and a limiting plate 30. One end of the support frame 20 is fixed to the external device, and the other end is connected to the limiting plate 30. The limiting plate 30 is provided with a receiving hole 301, and the carrier 11 is movably arranged in the receiving hole 301. It can be understood that the chips on the circuit board are highly concentrated and the distance between the chips is small. The distance between the corresponding carriers 11 will also be small, and the volume of a single carrier 11 will also be reduced, which will result in insufficient stability. By providing the limiting plate 30 and confining the carrier 11 in the receiving hole 301, the stability of the carrier 11 can be enhanced, and the deflection of the carrier 11 that affects the positioning accuracy can be prevented.

[0044] It is understandable that the location and arrangement of the accommodating holes 301 on the limiting plate 30 are determined according to the layout of the circuit board chips to be mounted, and are not limited here.

[0045] Furthermore, the carrier 11 is connected to the drive mechanism 12 via a connector 13. The drive mechanism 12 includes a rotary drive 121 and a lift drive 122. The rotary drive 121 drives the carrier 11 to rotate via the connector 13, while the lift drive 122 drives the carrier 11 up and down via the connector 13. The rotary drive 121 allows for fine-tuning of chip skew to prevent crooked placement during placement; the lift drive 122 allows for leveling of the chip's top surface, ensuring that the suction device can simultaneously absorb multiple chips without missing any.

[0046] Alternatively, the connecting member 13 may be an electric cylinder or a hydraulic cylinder, and correspondingly, the lifting drive member 122 may be an electric drive member or a hydraulic drive member; the rotating drive member 121 may utilize a gear transmission or a belt transmission to drive the connecting member 13 to rotate. Specifically, in this embodiment of the present invention, the connecting member 13 is an electric cylinder, the lifting drive member 122 is an electric drive member, and the rotating drive member 121 utilizes a gear transmission.

[0047] As an optional embodiment, the lifting driving member 122 is fixed to one side of the connecting member 13, and when the rotating driving member 121 is actuated, the lifting driving member 122 and the connecting member 13 can be driven to rotate simultaneously.

[0048] It can be understood that servo motors are provided in the rotating drive member 121 and the lifting drive member 122. The servo motors receive external signals through wired or wireless means and are turned on according to the signals, thereby providing power to the rotating drive member 121 and the lifting drive member 122, thereby driving the connecting member 13 and the carrier 11 to move, and then adjusting the chip on the carrier 11.

[0049] Furthermore, the limiting plate 30 is disposed horizontally, with the horizontal, upward-facing surface of the limiting plate 30 being defined as the upper surface. The accommodating hole 301 forms an opening 3011 on the upper surface. The carrier 11 is cylindrical, with one end of the carrier 11 protruding from the opening 3011. The diameter of the carrier 11 matches the diameter of the opening 3011, that is, the diameter of the carrier 11 is substantially the same as the diameter of the opening 3011. This diameter matching allows the carrier 11 to substantially block the opening 3011 of the accommodating hole 301 without affecting the movement of the carrier 11, preventing dust or foreign matter from entering the accommodating hole 301 and affecting its accuracy.

[0050] Furthermore, the carrier 11 is provided with suction holes 111 and at least one connecting hole 112. The inner wall of the accommodating hole 301 is provided with an air duct groove 3012, which connects the suction holes 111 and the air duct groove 3012. The limiting plate 30 is provided with a negative pressure channel 302 connecting the air duct groove 3012 and the external vacuum equipment. With this arrangement, the suction holes 111, connecting holes 112, air duct groove 3012, and negative pressure channel 302 are sequentially connected to form a suction channel. When a chip is placed on the carrier 11, the suction holes 111 immediately attract the chip, preventing it from slipping. At this point, the amount of adjustment of the carrier 11 is the same as the amount of adjustment of the chip, further improving adjustment accuracy.

[0051] As an optional embodiment, the air duct groove 3012 is arranged in a ring shape. This arrangement ensures that no matter how the supporting member 11 rotates, its connecting hole 112 can still be connected to the air duct groove 3012, which is more applicable.

[0052] As an optional embodiment, the adsorption hole 111 is opened at the central axis of the carrier 11. It can be understood that the chips are of different sizes, but they will all be placed corresponding to the center of the carrier 11. Opening the adsorption hole 111 at the central axis of the carrier 11 can ensure that large chips or small chips can be adsorbed, which is more applicable.

[0053] Please continue reading Figure 1 It can be understood that the image recognition device 40 is signal-connected to the transfer carrier 1. The image recognition device 40 is used to capture the image of the chip placed on the carrier 11, and compares the acquired chip image with the preset image corresponding to the circuit board mounting position, analyzes the data that needs to be adjusted to form a data signal, and then sends it to the transfer carrier 1 via a wired or wireless method, thereby controlling the corresponding adjustment component 10 in the transfer carrier 1 to perform the adjustment action.

[0054] It can be understood that a control analysis module can be built into the image recognition device 40 to perform image analysis and data signal transmission; or the acquired chip image can be transmitted to a cloud server for image analysis and data signal transmission, that is, it can be transferred and processed through the cloud server.

[0055] Furthermore, the image recognition device 40 includes a first camera 401, which is positioned horizontally and faces the transfer carrier 1. This horizontal position of the first camera 401 allows for rapid identification of the chip's height and determines any height differences with adjacent chips, providing information to the adjustment component for fine-tuning the chip's height. Furthermore, the chip's lateral information captured by the first camera 401 can be used to determine whether the chip is properly aligned, providing information to the adjustment component 10 for fine-tuning the chip's orientation.

[0056] Furthermore, the central axis of the first camera 401 is located on the plane of the upper surface of the limiting plate 30 or higher than the plane of the upper surface. This setting allows the first camera 401 to fully capture the side of the chip without being blocked by the limiting plate, resulting in a better recognition effect.

[0057] Furthermore, the image recognition device 40 also includes a second camera 402, which is vertically arranged and movable to the position of the limiting plate 30. The second camera 402 is oriented toward the upper surface of the limiting plate 30. By arranging the second camera 402 to photograph the upper surface of the chip from top to bottom, it is possible to determine whether the chip is aligned correctly from the upper surface of the chip, providing clearer information about the chip's orientation and more precise adjustment.

[0058] It can be understood that, as an optional implementation, the chip images captured by the first camera 401 and the second camera 402 can be fused and analyzed to avoid shooting errors in a single image, improve recognition accuracy, and further improve adjustment accuracy.

[0059] Please combine Figure 1 and Figure 5 Furthermore, the suction device 50 includes a body 51 and a suction nozzle 52. The suction nozzle 52 is detachably connected to one end of the body 51 and has at least two suction nozzle openings 521. When sucking chips, the suction nozzle openings 521 correspond to the carrier 11, and the body 51 drives the suction nozzle 52 to suck the chips on the carrier 11 one at a time. By designing the suction nozzle 52 with multiple suction nozzle openings 521, the connection method between the other end of the suction nozzle 52 and the body 51 can be maintained. That is, the universal binding head can be used with other types of suction nozzles, increasing the applicability of the present invention and improving its practicality.

[0060] As an optional embodiment, the second camera 402 is set on one side of the body 51 and moves synchronously with the body 51. Through this arrangement, the second camera 402 can be prevented from affecting the movement of the suction device 50, and no separate component is needed to fix the second camera 402, which simplifies the structure and saves costs.

[0061] See also Figure 6A second embodiment of the present invention provides a die bonding machine 200 including the die bonding assembly 100 provided in the first embodiment.

[0062] See also Figure 7 The third embodiment of the present invention provides a die bonding method, which is implemented by the die bonding assembly provided by the first embodiment. The die bonding method specifically includes the following steps:

[0063] Step S1, transferring the chip to a transfer carrier according to a preset position;

[0064] Step S2, obtaining an image of the chip on the transfer carrier;

[0065] Step S3, correcting the orientation of the chip based on the acquired chip image information;

[0066] In step S4, multiple chips on the transfer carrier are sucked at one time and transferred to the welding position for welding.

[0067] The chip transfer in step S1 and step S4 can use the same suction device body. The difference is that in step S1, the suction device body is connected to a suction nozzle with a single suction nozzle opening, while in step S4, the suction nozzle on the body needs to be replaced with a suction nozzle with multiple suction nozzle openings.

[0068] In step S2, the chip on the transfer carrier is photographed by an image recognition device to obtain an image of the chip on the transfer carrier.

[0069] In step S3, the image recognition device can include a built-in control and analysis module to perform image analysis and transmit data signals. Alternatively, the captured chip image can be transmitted to a cloud server for image analysis and data signal transmission, i.e., it can be processed by the cloud server. The processed data information can be transmitted to a transfer carrier via wired or wireless means, and the chip can be adjusted accordingly using the adjustment components on the transfer carrier.

[0070] Compared with the prior art, the die bonding assembly, die bonding machine and die bonding method provided by the present invention have the following advantages:

[0071] 1. The die bonding assembly of the present invention includes a suction device, a transfer carrier device, and an image recognition device. The transfer carrier device includes at least two adjustment components. The adjustment component includes a carrier for placing chips and a drive mechanism. The image recognition device obtains the image of the chip on the carrier, and the drive mechanism drives the carrier to adjust according to the chip image information. The suction device removes chips from at least two carriers at a time. It can be understood that each carrier is pre-arranged and arranged corresponding to the position of the chip to be mounted on the circuit board to be mounted. A chip can be placed on each carrier. Each time a chip is placed, the image recognition device can obtain the actual position and orientation of the chip in real time, compare it with the pre-designed position in the database, and control the drive mechanism to execute an action to adjust the carrier, thereby adjusting the position and orientation of the chip on the carrier. After the chips on the carrier are adjusted one by one, the chips on the entire transfer carrier device correspond one-to-one with the position of the chip to be mounted on the circuit board to be mounted. Then, the suction device sucks all the chips on the entire transfer carrier device at once and moves them to the mounting position for mounting at one time. By installing an adjustment component on the transfer carrier, the chip can be adjusted and positioned in advance. During placement, only one reference point on the circuit board to be placed is required to accurately place the entire board of chips, greatly improving the overall placement accuracy. In addition, the existing placement method is to move individual chips to the transfer table for positioning and identification, and then move them individually from the transfer table to the placement position for placement. The present invention extracts the entire board of chips from the transfer carrier at one time, reducing the multiple trips from the transfer table to the placement position to a single trip, greatly saving time and improving placement efficiency.

[0072] 2. The transfer carrier device of the present invention also includes a stopper plate with a receiving hole formed therein, into which the carrier is movably disposed. It is understood that the high concentration of chips on a circuit board and the small distances between chips will result in a correspondingly small distance between carriers, and the volume of a single carrier will also be reduced. By providing a stopper plate and confining the carrier within the receiving hole, the stability of the carrier can be enhanced, preventing carrier deflection that could affect positioning accuracy.

[0073] 3. The carrier of the present invention is connected to a drive mechanism via a connector. The drive mechanism includes a rotary drive assembly and a lift drive assembly. The rotary drive assembly drives the carrier to rotate via the connector, while the lift drive assembly drives the carrier to rise and fall via the connector. The rotary drive assembly allows for fine-tuning of chip skew to prevent crooked placement during placement. The lift drive assembly allows for leveling of the chip's top surface, ensuring that the suction device can simultaneously absorb multiple chips without missing any.

[0074] 4. The limit plate of the present invention is arranged horizontally, with the horizontal, upward surface of the limit plate defined as the upper surface, and one end of the carrier exposed from the upper surface. The image recognition device includes a first camera, which is arranged horizontally and faces the limit plate. By setting the first camera horizontally, the height of the chip can be quickly identified and the height difference between the chip and adjacent chips can be determined, thereby providing information to the adjustment component for fine-tuning the chip height. In addition, the chip side information obtained by the first camera can also be used to determine whether the chip is properly aligned, thereby providing information to the adjustment component for fine-tuning the chip orientation.

[0075] 5. The central axis of the first camera of the present invention is located in the plane where the upper surface is located or higher than the plane where the upper surface is located. This setting allows the first camera to fully capture the side of the chip without being blocked by the limit plate, resulting in a better recognition effect.

[0076] 6. The image recognition device of the present invention also includes a second camera, which is vertically positioned and movable to the position of the limit plate. The second camera's shooting direction is toward the upper surface of the limit plate. By arranging the second camera to shoot the top surface of the chip from top to bottom, the alignment of the chip can be determined from the top surface, providing clearer information about the chip's orientation and more precise adjustment.

[0077] 7. The nozzle of the present invention has at least two nozzle openings. When picking up chips, the nozzle openings correspond to the carrier, and the body drives the nozzle to pick up the chips on the carrier one at a time. By designing the nozzle with multiple nozzle openings, the connection method between the other end of the nozzle and the body can be maintained. That is, the universal binding head can be used with other nozzle models, increasing the applicability of the present invention and improving its practicality.

[0078] 8. The second camera of the present invention is arranged on one side of the main body and moves synchronously with the main body. Through this arrangement, the second camera can be prevented from affecting the movement of the suction device, and no separate component is needed to fix the second camera, which simplifies the structure and saves costs.

[0079] 9. The present invention also provides a die bonding machine and a die bonding method, which have the same beneficial effects as the above-mentioned die bonding assembly and are not described in detail here.

[0080] The above is a detailed introduction to a crystal bonding component, a crystal bonding machine and a crystal bonding method disclosed in the embodiments of the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for general technical personnel in this field, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention. Any modifications, equivalent replacements and improvements made within the principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A die-bonding assembly for transferring chips, characterized by: It includes a material suction device, a transfer carrying device and an image recognition device; the transfer carrying device includes a limit plate and at least two adjustment components, and the adjustment component includes a carrier for placing the chip and a driving mechanism; The limiting plate is provided with a receiving hole, and the supporting member is movably arranged in the receiving hole; the supporting member is provided with an adsorption hole and at least one communicating hole, an annular air duct groove is provided on the inner wall of the receiving hole, and the communicating hole connects the adsorption hole and the air duct groove; a negative pressure channel is provided in the limiting plate to connect the air duct groove and an external vacuum device; The bearing member is connected to the driving mechanism via a connecting member, and the driving mechanism includes a rotation driving member and a lifting driving member. The rotation driving member drives the bearing member to rotate via the connecting member, and the lifting driving member drives the bearing member to move up and down via the connecting member. The image recognition device obtains the chip image on the carrier, and the rotation drive drives the carrier to rotate according to the chip image information to fine-tune the skew of the chip on the carrier; The lifting drive drives the carrier to move up and down according to the chip image information so as to level the upper surface of the chip on the carrier; the suction device absorbs all the chips on the transfer carrier at one time.

2. The die-bonding assembly according to claim 1, wherein: The lifting driving member is fixed on one side of the connecting member, and when the rotating driving member is in motion, it can drive the lifting driving member and the connecting member to rotate simultaneously.

3. The die-bonding assembly according to claim 1, wherein: The limiting plate is arranged horizontally, and the horizontal upward surface of the limiting plate is defined as the upper surface. The accommodating hole forms an opening on the upper surface. The supporting member is cylindrical, and one end of the supporting member is exposed from the opening. The diameter of the supporting member matches the diameter of the opening; the adsorption hole is opened at the central axis of the supporting member.

4. The die-bonding assembly according to claim 3, wherein: The image recognition device includes a first camera, which is horizontally arranged with its shooting direction facing the limiting plate.

5. The die-bonding assembly according to claim 4, wherein: The central axis of the first camera is located in the plane where the upper surface is located or is higher than the plane where the upper surface is located.

6. The die-bonding assembly according to claim 4, wherein: The image recognition device also includes a second camera, which is vertically arranged and movable to the limiting plate, and the shooting direction of the second camera is toward the upper surface of the limiting plate.

7. The die-bonding assembly according to claim 6, wherein: The suction device includes a body and a suction nozzle, and the suction nozzle is detachably connected to one end of the body; the suction nozzle is provided with at least two suction nozzle openings; when sucking the chip, the suction nozzle openings correspond to the carrier, and the body drives the suction nozzle to suck the chip on the carrier once.

8. The die-bonding assembly according to claim 7, wherein: The second camera is arranged on one side of the body and moves synchronously with the body.

9. A die bonder, characterized in that: The die bonding machine includes the die bonding assembly according to any one of claims 1 to 8.

10. A die-bonding method, implemented by the die-bonding assembly according to any one of claims 1 to 8, characterized in that: The steps include: Transfer the chip to the transfer carrier according to the preset position; Acquire an image of the chip on the transfer carrier; Correct the orientation of the chip based on the acquired chip image information; Multiple chips on the transfer carrier are picked up at one time and transferred to the welding position for welding.

Images