A display device and a manufacturing method thereof

Abstract

Embodiments of the present invention disclose a display device and a method for manufacturing the same. A specific example of the display device includes a display and a ceramic substrate, wherein the ceramic substrate is an integrally formed ceramic substrate having a groove; the display is embedded in the groove and encapsulated by an encapsulation layer. The technical solution provided by the present invention embeds the display in the groove of the integrally formed ceramic substrate and then encapsulates it, thereby improving the heat dissipation capacity of the display device and the structural strength of the display device. Furthermore, because the integrally formed ceramic substrate has a groove on one side and a flat surface with no exposed components on the other side, surface mounting and planarization processes are eliminated, thereby improving production efficiency.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and more particularly to a display device and a method for manufacturing the same. Background Art

[0002] Organic Light-Emitting Diodes (OLEDs) are widely used in the display field due to their light weight, high contrast, and wide operating temperature range. In recent years, with the emergence of high-tech products such as AR / VR, demand for silicon-based OLED microdisplays has continued to increase. Silicon-based OLED microdisplays integrate millions or more light-emitting pixels on a silicon substrate less than 2 inches in size. To ensure the reliability of the display device, a PCB board is used as the carrier board for the silicon-based OLED microdisplay, and the display is encapsulated in a housing. This structure has difficulty dissipating heat and the manufacturing process is complex. Especially with the increasing demand for brightness, there is an urgent need to improve the heat dissipation capacity of the display device. Summary of the Invention

[0003] An object of the present invention is to provide a display device and a method for manufacturing the same, so as to solve at least one of the problems existing in the prior art.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions:

[0005] A first aspect of the present invention provides a display device comprising a display and a ceramic substrate, wherein:

[0006] The ceramic substrate is an integrally formed ceramic substrate having a groove;

[0007] The display is embedded in the groove and encapsulated by an encapsulation layer.

[0008] By embedding the display in the groove of the integrally formed ceramic substrate and then packaging it, the heat dissipation capacity of the display device is improved while the structural strength of the display device is improved.

[0009] Optionally, a peripheral circuit device is further provided in the ceramic substrate, and the display is electrically connected to the peripheral circuit device via a bonding area.

[0010] The peripheral circuit components are arranged in an integrally formed ceramic substrate, thereby reducing the size of the display device.

[0011] Optionally, the encapsulation layer encapsulates the display and the bonding area.

[0012] Furthermore, the encapsulation layer is a transparent encapsulation layer, which protects the display and the bonding area from external contamination while ensuring the display effect of the display.

[0013] Optionally, the ceramic substrate is provided with at least one alignment mark for aligning the embedded display. By providing at least one alignment mark on the ceramic substrate, the combination accuracy of the display and the ceramic substrate is improved, further improving production efficiency.

[0014] Optionally, the alignment mark is arranged at an edge position of the ceramic substrate.

[0015] Optionally, the display is a silicon-based OLED display, and further, a silicon-based OLED microdisplay, wherein the main structure of the silicon-based OLED microdisplay includes: a silicon-based substrate, a driving circuit layer, a light-emitting structure layer, an encapsulation layer, a color filter layer, and a cover plate. The silicon-based substrate is also called an IC chip; the driving circuit layer includes a pixel driving circuit, pixel electrodes, an array gate driving circuit, and a corresponding IC driving circuit, etc., which are directly prepared on the silicon-based substrate; the light-emitting structure layer is arranged on the driving circuit layer, including a first electrode, a light-emitting layer that emits white light, and a second electrode; the encapsulation layer covers the light-emitting structure layer; the color filter layer is arranged on the encapsulation layer, including a black matrix, a red filter, a green filter, and a blue filter; and the cover plate covers the above structure. The silicon-based OLED microdisplay uses a white light + color filter method to achieve high resolution and can be applied to helmet displays, stereo display mirrors, eye-type displays, etc.

[0016] The second aspect of the present invention provides a method for preparing the display device provided by the first aspect of the present invention, comprising:

[0017] Providing an integrally formed ceramic substrate having a groove;

[0018] Embedding the display in the groove;

[0019] The display is encapsulated with an encapsulation layer.

[0020] The preparation method has a simple process, and the prepared display device has excellent heat dissipation capability and structural strength.

[0021] Optionally, the provision of an integrally formed ceramic substrate having a groove includes:

[0022] An integrally formed ceramic substrate with grooves and peripheral circuit components is formed by sintering through a stacking method.

[0023] Optionally, after embedding the display in the groove and before encapsulating the display with an encapsulation layer, the method further includes:

[0024] The display is electrically connected to the peripheral circuit device through the bonding area through a bonding process.

[0025] Optionally, before embedding the display in the groove, the method further comprises providing at least one alignment mark on the ceramic substrate;

[0026] The embedding of the display in the groove includes aligning the embedded display using the alignment mark. By providing at least one alignment mark on the ceramic substrate, the combination accuracy of the display and the ceramic substrate is improved, further improving production efficiency.

[0027] The beneficial effects of the present invention are as follows:

[0028] The technical solution provided by the present invention embeds the display in the groove of the integrally formed ceramic substrate and then packages it, thereby improving the heat dissipation capacity of the display device and increasing the structural strength of the display device. In addition, since the integrally formed ceramic substrate has a groove on one side and a flat surface with no exposed components on the other side, the surface mounting and planarization processes are eliminated, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0030] Figure 1 A schematic diagram of a manufacturing process of a display device provided by an embodiment of the present invention is shown.

[0031] Figure 2 A schematic structural diagram of a display device provided by an embodiment of the present invention is shown.

[0032] Figure 3 A cross-sectional view of a display device provided by an embodiment of the present invention is shown.

[0033] Figure 4 A schematic structural diagram of a display device provided by another embodiment of the present invention is shown.

[0034] Figure 5 A schematic structural diagram of a display device provided by another embodiment of the present invention is shown.

[0035] Figure 6 A flow chart showing a method for manufacturing a display device provided by another embodiment of the present invention is shown. DETAILED DESCRIPTION

[0036] In order to more clearly illustrate the present invention, the present invention will be further described below in conjunction with the embodiments and drawings. Similar components in the drawings are represented by the same reference numerals. It should be understood by those skilled in the art that the following specific description is illustrative rather than restrictive and should not be used to limit the scope of protection of the present invention.

[0037] like Figure 1 As shown, in order to ensure that the display has high reliability and guarantee its assembly performance, a printed circuit board is currently mainly used as the carrier board of the display. The display is set on the printed circuit board, and then the display and the carrier board are connected by a wire bonding process. The module is then packaged with a shell to form a display device. Due to the material problem of the printed circuit board and the closed structure of the display device, it is difficult to dissipate heat. Especially when displaying high brightness, the heat released by the display is relatively high. If the temperature cannot be reduced, it will affect the light decay of the display and reduce the life of the display. In addition, its production process is relatively complicated, which reduces production efficiency.

[0038] To solve the above problems, the present invention provides a display device and a method for manufacturing the same, so as to improve the heat dissipation performance of the display device and simplify the manufacturing process of the display device.

[0039] One embodiment of the present invention provides a display device, such as Figure 2 As shown, the display device includes a display 101 and a ceramic substrate 102, wherein:

[0040] The ceramic substrate 102 is an integrally formed ceramic substrate having a groove;

[0041] The display 101 is embedded in the groove and encapsulated by the encapsulation layer 103 .

[0042] The display device provided in this embodiment embeds the display 101 in a groove of an integrally formed ceramic substrate and then packages it, thereby improving the heat dissipation capability of the display device while also increasing the structural strength of the display device. Furthermore, since the integrally formed ceramic substrate has a groove on one side and a flat surface with no exposed components on the other side, the surface mounting and planarization processes are eliminated, thereby improving production efficiency.

[0043] In a specific embodiment, the display is a silicon-based organic light-emitting diode (OLED) display.

[0044] Furthermore, the display is a microdisplay. A silicon-based OLED microdisplay is a display device that integrates millions or even more light-emitting pixels on a silicon-based substrate with a size of less than 2 inches. The main structure of the silicon-based OLED microdisplay includes: a silicon-based substrate, a driving circuit layer, a light-emitting structure layer, an encapsulation layer, a color filter layer, and a cover plate. The silicon-based substrate is also called an IC wafer; the driving circuit layer includes a pixel driving circuit, pixel electrodes, a gate driver array (GOA), and a corresponding IC driving circuit, etc., and is directly prepared on the silicon-based substrate; the light-emitting structure layer is provided on the driving circuit layer and includes a first electrode, a light-emitting layer that emits white light, and a second electrode; the encapsulation layer covers the light-emitting structure layer; the color filter layer is provided on the encapsulation layer and includes a black matrix, a red (R) color filter (CF), a green (G) color filter, and a blue (B) color filter; and the cover plate covers the above structures. Silicon-based OLED microdisplays use white light + color film to achieve high resolution (Pixels Per Inch, PPI), and can be applied to helmet displays, stereoscopic displays, and eyeglass displays.

[0045] In a specific embodiment, Figure 3 As shown, the ceramic substrate 102 is further provided with a peripheral circuit device 1022. Figure 3 The cross-sectional view of the ceramic substrate 102 is shown. The peripheral circuit device 1022 is sintered and set in the ceramic substrate. The display 101 is electrically connected to the peripheral circuit device 1022 through the bonding area.

[0046] It should be noted that the peripheral circuit device 1022 is integrally formed and sintered in the ceramic substrate 102 when the ceramic substrate 102 is prepared. Specifically, the ceramic substrate 102 is prepared by a stacking method.

[0047] Ceramic substrates, also known as ceramic circuit boards, consist of a ceramic substrate and metal circuit layers. For electronic packaging, the packaging substrate plays a critical role, connecting the internal and external heat dissipation channels, while also providing electrical interconnection and mechanical support. Ceramics offer advantages such as high thermal conductivity, excellent heat resistance, high mechanical strength, and a low coefficient of thermal expansion. Furthermore, their chemical stability allows for easy coating during post-processing. As a non-toxic and harmless green material, their excellent surface roughness and cleanliness, along with the absence of warping and cracking, make them easy to clean and maintain during later maintenance.

[0048] Based on the packaging structure and application requirements, ceramic substrates can be divided into two categories: planar ceramic substrates and three-dimensional ceramic substrates. This solution uses a stacking method to prepare an integrally formed ceramic substrate with grooves. The metal circuit layer of the ceramic substrate is used as a peripheral circuit to provide a reference power supply to the display. This reduces the module size and reduces the shell packaging process on the production line. The thermal conductivity of ceramic is much higher than that of conventional printed circuit boards (PCBs) and package shells, which can better dissipate heat from silicon-based OLED displays. At the same time, ceramic has a low coefficient of expansion and high hardness, which can ensure that the module has better module structural reliability.

[0049] It should be noted that when a printed circuit board is used as a base plate to protect the display, when setting peripheral circuit components, the printed circuit board needs to be surface mounted (SMT) to mount the components on the printed circuit board, resulting in an uneven backplane. This operation is not only cumbersome and complicated but also further affects the heat dissipation of the display and increases the volume of the product.

[0050] Compared with using a printed circuit board as the base plate to protect the display, this implementation method uses an integrally formed special-shaped ceramic substrate to bond with the display. Its high thermal conductivity improves the heat dissipation of the display, and the ceramic substrate has sufficient mechanical strength. In addition to carrying the display, it can also be used as a supporting structural component. It has good surface roughness and cleanliness, strong insulation, and a low dielectric constant. It can maintain stable performance under high temperature and high humidity conditions and has high reliability.

[0051] In a possible implementation, the peripheral circuit device 1022 includes at least one resistor and / or at least one capacitor, which is electrically connected to the display 101 through a bonding region and is configured to output a regulated voltage signal to provide a reference power supply.

[0052] In a possible implementation, the display 101 is connected to the external circuit device 1022 using a pressure welding process.

[0053] In a specific embodiment, the display 101 is connected to the external circuit device 1022 using a pressure welding process. The specific process is to use metal wires such as gold wires or aluminum wires, and utilize heat pressing or ultrasonic energy to complete the connection between the connecting wires of the solid-state circuit in the display 101 and the connecting wires of the external circuit device.

[0054] In a specific embodiment, Figure 3 As shown, the encapsulation layer 103 encapsulates the display 101 and the bonding area. The encapsulation layer 103 is a transparent encapsulation layer, which protects the display and the bonding area from external contamination while ensuring the display effect of the display.

[0055] In one possible implementation, the encapsulation layer 103 includes a thin film encapsulation layer and an organic coating layer, wherein the thin film encapsulation layer includes an organic encapsulation layer and an inorganic encapsulation layer wrapped around the outside of the organic encapsulation layer; wherein the thin film encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked in a direction away from the display, the first inorganic encapsulation layer and the second inorganic encapsulation layer are arranged on both sides of the organic encapsulation layer, and the organic encapsulation layer is sealed and coated to give full play to the water barrier properties of the inorganic encapsulation layer. In the actual preparation process, the first inorganic encapsulation layer, the organic encapsulation layer, and the second inorganic encapsulation layer can be formed by atomic layer deposition, plasma enhanced chemical vapor deposition, sputtering, etc. The first inorganic encapsulation layer and the second inorganic encapsulation layer can be selected from one or more of metal oxides, metal sulfides, metal nitrides, etc., such as zinc oxide, aluminum oxide, zirconium oxide, cerium oxide, iron oxide, copper sulfide, zinc sulfide, tin disulfide, iron sulfide, silicon nitride, and aluminum nitride.

[0056] It should be noted that the organic coating layer is made of, for example, resin, such as BT resin (bismaleimide triazine resin) or PPE resin (polyphenylene ether resin).

[0057] In a specific embodiment, the encapsulation layer 103 encapsulates the display 101 embedded in the ceramic substrate 102 to form a caulking and bonding area ( Figure 3 (not shown), due to the strong insulation of the ceramic substrate, a packaging layer is provided on the bonding area and the caulking area for packaging, and the overall packaging can be achieved without providing a cover plate, and compared with Figure 1 The structure of the central display device is not easy to harbor dirt and is more convenient to clean.

[0058] In a specific embodiment, at least one alignment mark 1023 is provided on the ceramic substrate 102 for aligning the embedded display 101 .

[0059] With this implementation, alignment is performed through the alignment marks when setting the display 101, thereby improving the alignment accuracy between the display and the ceramic substrate and further improving production efficiency.

[0060] In a specific embodiment, the alignment mark 1023 is disposed at an edge of the ceramic substrate 102 .

[0061] In one possible implementation, Figure 4 As shown, four alignment marks 1023 for aligning the embedded display 101 are provided on the ceramic substrate 102 . The four alignment marks 1023 are respectively provided on the four corners of the ceramic substrate 102 .

[0062] In one possible implementation, Figure 5 The ceramic substrate 102 is provided with two alignment marks 1023 for aligning the display 101 . The two alignment marks are in a cross shape and are respectively provided on both side edges of the ceramic substrate.

[0063] It should be noted that the alignment mark may be removed or not after the display is embedded, depending on the production requirements.

[0064] Another embodiment of the present invention provides a method for manufacturing a display device, such as Figure 6 Shown, including

[0065] Providing an integrally formed ceramic substrate having a groove;

[0066] Embedding the display in the groove;

[0067] The display is encapsulated with an encapsulation layer.

[0068] The preparation method provided in this embodiment has a simple process, improves production efficiency, and the prepared display device has excellent heat dissipation capability and structural strength.

[0069] In a specific embodiment, providing an integrally formed ceramic substrate having a groove includes:

[0070] An integrally formed ceramic substrate with grooves and peripheral circuit components is formed by sintering through a stacking method.

[0071] This solution prepares an integrally formed ceramic substrate with grooves by a stacking method, and sinters the peripheral circuit for providing a reference power supply to the display into the ceramic substrate, thereby reducing the module size and the surface mounting process.

[0072] In a specific embodiment, the display is a silicon-based organic light-emitting diode (OLED) display. Furthermore, it is a microdisplay. The silicon-based OLED microdisplay is a display device that integrates millions or even more light-emitting pixels on a silicon-based substrate with a size of less than 2 inches. The main structure of the silicon-based OLED microdisplay includes: a silicon-based substrate, a driving circuit layer, a light-emitting structure layer, an encapsulation layer, a color filter layer, and a cover plate. Among them, the silicon-based substrate is also called an IC wafer; the driving circuit layer includes a pixel driving circuit, pixel electrodes, an array gate driver circuit (Gate Driver on Array, GOA) and a corresponding IC driving circuit, etc., which are directly prepared on the silicon-based substrate; the light-emitting structure layer is arranged on the driving circuit layer, including a first electrode, a light-emitting layer that emits white light, and a second electrode; the encapsulation layer covers the light-emitting structure layer; the color filter layer is arranged on the encapsulation layer, including a black matrix, a red (R) color filter (CF), a green (G) color filter, and a blue (B) color filter; and the cover plate covers the above structure. Silicon-based OLED microdisplays use white light + color film to achieve high resolution (Pixels Per Inch, PPI), and can be applied to helmet displays, stereoscopic displays, and eyeglass displays.

[0073] In a specific embodiment, after embedding the display in the groove and before encapsulating the display with an encapsulation layer, the method further includes:

[0074] The display is electrically connected to the peripheral circuit device through the bonding area through a bonding process.

[0075] In a possible implementation, the bonding process is a pressure welding process.

[0076] In a specific embodiment, before embedding the display in the groove, the method further includes providing at least one alignment mark on the ceramic substrate;

[0077] Embedding the display in the groove includes: aligning the embedded display using the alignment mark.

[0078] In this embodiment, by providing at least one alignment mark on the ceramic substrate, the bonding accuracy between the display and the ceramic substrate is improved, thereby further improving production efficiency.

[0079] In one specific embodiment, after the ceramic substrate is aligned and embedded, the alignment mark is removed, and the display and bonding area are encapsulated with an encapsulation layer. Specifically, the encapsulation layer includes a first encapsulation film, a transition layer, and a second encapsulation film stacked in sequence. The transition layer includes a fully carbonized polymer film and a hydrophobically treated lanthanide oxide film with a fluorite crystal structure. Forming the transition layer includes: fully carbonizing the polymer film; loading the fully carbonized polymer film with a lanthanide oxide with a fluorite crystal structure; and hydrophobically treating the lanthanide oxide with a fluorite crystal structure. The fully carbonized polymer film has a multi-porous structure and is an excellent heat dissipation medium, which can improve the poor heat dissipation of the display device. The lanthanide oxide with a fluorite crystal structure can perform an oxygen removal function. Since the lanthanide oxide with a fluorite crystal structure is inherently resistant to water vapor corrosion and has a very stable chemical composition, it can ensure the stability of the oxygen removal function. After being hydrophobically modified, the lanthanide oxide with a fluorite crystal structure can effectively prevent oxygen and water vapor from further corroding the light-emitting element.

[0080] It should be noted that the alignment mark may be removed or not after the display is embedded, depending on production requirements.

[0081] It should be noted that relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus comprising the element.

[0082] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in this field, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the scope of protection of the present invention.

Claims

1. A display device, characterized in that: Comprising a display and a ceramic substrate, wherein The ceramic substrate is an integrally formed ceramic substrate having a groove; The display is embedded in the groove and encapsulated by an encapsulation layer. The display is a silicon-based OLED display, The encapsulation layer is located on a side of the display away from the ceramic substrate. The encapsulation layer includes a thin film encapsulation layer and an organic coating layer. The thin film encapsulation layer includes an organic encapsulation layer and an inorganic encapsulation layer coating the outer side of the organic encapsulation layer.

2. The display device according to claim 1, wherein The ceramic substrate is also provided with peripheral circuit components, and the display is electrically connected to the peripheral circuit components via the bonding area.

3. The display device according to claim 2, wherein: The encapsulation layer encapsulates the display and the bonding area.

4. The display device according to claim 1, wherein At least one alignment mark for aligning the embedded display is provided on the ceramic substrate.

5. The display device according to claim 4, wherein: The alignment mark is arranged at an edge position of the ceramic substrate.

6. A method for preparing a display device, characterized in that: include Providing an integrally formed ceramic substrate having a groove; Embedding the display in the groove; The display is encapsulated by an encapsulation layer, wherein the display is a silicon-based OLED display. The encapsulation layer is located on a side of the display away from the ceramic substrate. The encapsulation layer includes a thin film encapsulation layer and an organic coating layer. The thin film encapsulation layer includes an organic encapsulation layer and an inorganic encapsulation layer coating the outer side of the organic encapsulation layer.

7. The preparation method according to claim 6, characterized in that The method of providing an integrally formed ceramic substrate having a groove includes: An integrally formed ceramic substrate with grooves and peripheral circuit components is formed by sintering through a stacking method.

8. The preparation method according to claim 7, characterized in that After embedding the display in the groove and before encapsulating the display with an encapsulation layer, the method further includes: The display is electrically connected to the peripheral circuit device through the bonding area through a bonding process.

9. The preparation method according to claim 6, characterized in that Before embedding the display in the groove, the method further includes providing at least one alignment mark on the ceramic substrate; Embedding the display in the groove includes aligning the embedded display using the alignment mark.

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