Processing device, processing method, and computer program product

Abstract

The present invention discloses a processing device and method, a marking and shaping method, a recording medium, and a control device. Among them, the processing device includes a shaping device having an energy beam irradiation unit that irradiates an energy beam onto the surface of an object to form a molten pool and a material supply unit that supplies a shaping material into the molten pool, and a changing device that changes the positional relationship between the object and the molten pool. Moreover, the size of the shaped object in the second direction intersecting the first direction, which is shaped along the first direction by supplying the shaping material into the molten pool while changing the positional relationship between the object and the molten pool in the first direction, is changed based on the position of the shaped object in the first direction.

Description

[0001] This application is a divisional application of the patent application with the application date of December 03, 2018, application number 201880080382.X, and invention title "Processing Device and method, marking and shaping method, recording medium and control device". Technical Field

[0002] The present invention relates to the technical fields of a processing apparatus and method, a marking and shaping method, a recording medium, and a control apparatus, for example, for processing an object by irradiating an energy beam thereto. Background Art

[0003] In Patent Document 1, there is described a shaping apparatus that forms a shaped object by melting a powdery material with an energy beam and then solidifying the melted material. In such a shaping apparatus, it is a technical problem to form an appropriate shaped object.

[0004] [Prior Art Documents]

[0005] [Patent Documents]

[0006] [Patent Document 1]U.S. Patent Application Publication No. 2017 / 014909 Summary of the Invention

[0007] According to the first aspect, there is provided a processing apparatus including: a shaping apparatus having an energy beam irradiation unit that irradiates an energy beam onto a surface of an object to form a molten pool on the surface and a material supply unit that supplies a shaping material into the molten pool; and a changing apparatus that changes a positional relationship between the object and the molten pool; and the size of the shaped object in a second direction intersecting the first direction, which is shaped along the first direction by supplying the shaping material into the molten pool while changing the positional relationship between the object and the molten pool in the first direction, is changed based on the position of the shaped object in the first direction.

[0008] According to the second aspect, there is provided a processing apparatus including: a shaping apparatus having an energy beam irradiation unit that irradiates an energy beam onto a surface of an object to form a molten pool on the surface and a material supply unit that supplies a shaping material into the molten pool to melt the shaping material; a changing apparatus that changes the position of at least one of the object and the molten pool; and a control apparatus that controls the changing apparatus using coordinate data related to a mark such that a convex shaped object generated on the surface of the object by solidifying the melted shaping material becomes a mark.

[0009] According to the third aspect, there is provided a processing apparatus including: a shaping apparatus having an energy beam irradiation unit that irradiates an energy beam onto the surface of an object to form a molten pool on the surface, and a material supply unit that supplies a shaping material into the molten pool; a changing apparatus that changes the positional relationship between the object and the molten pool; a gas supply apparatus that supplies a gas around the molten pool; and a control apparatus that controls the gas supply apparatus so as to change the characteristics of the gas supplied to the periphery in order to change the hue of the shaped object shaped by the shaping apparatus.

[0010] According to the fourth aspect, there is provided a processing apparatus including: a shaping apparatus having an energy beam irradiation unit that irradiates an energy beam onto the surface of an object to form a first molten pool on the surface and a material supply unit that supplies a shaping material into the first molten pool, and a changing apparatus that changes the positional relationship between the object and the first molten pool; and an energy beam is irradiated from the energy beam irradiation unit onto a first shaped object shaped by supplying the shaping material into the molten pool while changing the positional relationship between the object and the first molten pool in a first direction, to form a second molten pool on the first shaped object, and the shaping material is supplied from the material supply unit to shape a second shaped object, and the size of the second shaped object in a second direction intersecting the first direction is different from the size of the first shaped object in the second direction.

[0011] According to the fifth aspect, there is provided a processing apparatus including: a shaping apparatus having an energy beam irradiation unit that irradiates an energy beam onto a first region on an object and a material supply unit that supplies a shaping material to at least partially overlap with the first region, to form a shaped object on the object; a position changing apparatus that changes the positions of the first and second regions on the object; and a supply amount changing apparatus that changes the supply amount per unit time of the shaping material from the material supply unit to the second region.

[0012] According to the sixth aspect, there is provided a processing apparatus including: a shaping apparatus having an energy beam irradiation unit that irradiates an energy beam onto an irradiation region on an object and a material supply unit that supplies a shaping material into the irradiation region, and a changing apparatus that changes the positional relationship between the object and the irradiation region; and the size of the shaped object shaped by supplying the shaping material into the irradiation region while changing the positional relationship between the object and the irradiation region in a direction along the surface of the object is different at a first position and a second position different from the first position in a direction along the surface of the shaped object.

[0013] According to the seventh aspect, there is provided a processing method including: irradiating an energy beam onto the surface of an object to form a molten pool on the surface; supplying a modeling material into the molten pool; and changing the positional relationship between the object and the molten pool; and changing the size in the second direction intersecting the first direction of the modeled object that is modeled along the first direction by changing the positional relationship in the first direction between the object and the molten pool while supplying the modeling material into the molten pool, based on the position of the modeled object in the first direction.

[0014] According to the eighth aspect, there is provided a processing method including: preparing coordinate data related to a mark to be formed on the surface of an object; irradiating an energy beam onto the surface of the object to form a molten pool on the surface; supplying a modeling material into the molten pool to melt the modeling material; and changing the position of at least one of the object and the molten pool; changing the position of at least one of them so that a convex modeled object generated on the surface of the object by solidifying the molten modeling material becomes the mark, and using the coordinate data to change the position of at least one of them.

[0015] According to the ninth aspect, there is provided a processing method including: irradiating an energy beam onto the surface of an object to form a molten pool on the surface; supplying a modeling material into the molten pool; changing the positional relationship between the object and the molten pool; supplying a specific gas around the molten pool; and changing the characteristics of the specific gas supplied to the periphery in order to change the color tone of the modeled object modeled by the modeling device.

[0016] According to the tenth aspect, there is provided a processing method including: irradiating an energy beam onto the surface of an object to form a first molten pool on the surface; supplying a modeling material into the first molten pool; changing the positional relationship between the object and the first molten pool; irradiating an energy beam from the energy beam irradiation unit onto a first modeled object that is modeled by changing the positional relationship in the first direction between the object and the first molten pool while supplying the modeling material into the molten pool to form a second molten pool on the first modeled object; and supplying a modeling material into the second molten pool to model a second modeled object; and the size in the second direction intersecting the first direction of the second modeled object is different from the size in the second direction of the first modeled object.

[0017] According to the eleventh aspect, there is provided a processing method including: irradiating an energy beam onto a first region on an object and supplying a modeling material to a second region that at least partially overlaps with the first region to form a modeled object on the object; changing the positions of the first and second regions on the object; and changing the supply amount per unit time of the modeling material to the second region.

[0018] According to the 12th aspect, a processing method is provided, which includes: irradiating an energy beam on an irradiation area on an object, supplying a modeling material to the irradiation area, and changing the positional relationship between the object and the irradiation area, and by changing the positional relationship between the object and the irradiation area in a direction along the surface of the object, the dimension of the modeling object in a direction intersecting the direction along the surface is different at a first position and a second position different from the first position in the direction along the surface of the modeling object.

[0019] According to the 13th aspect, a program executed by a computer is provided, which controls a processing device having the following devices: a modeling device having an energy beam irradiation unit that irradiates an energy beam on the surface of an object to form a molten pool on the surface and a material supply unit that supplies a modeling material to the molten pool, and a changing device that changes the positional relationship between the object and the molten pool; and causes the computer to execute the following processing: based on the position of the modeling object in the first direction, change the dimension of the modeling object in a second direction intersecting the first direction, by changing the positional relationship between the object and the molten pool in the first direction and supplying the modeling material to the molten pool along the first direction.

[0020] According to the 14th aspect, a program executed by a computer is provided, which controls a processing device having the following devices: a modeling device having an energy beam irradiation unit that irradiates an energy beam on the surface of an object to form a molten pool on the surface and a material supply unit that supplies a modeling material to the molten pool to melt the modeling material, and a changing device that changes the position of at least one of the object and the molten pool; and causes the computer to execute the following processing: control the changing device using coordinate data related to a mark so that a convex modeling object generated on the surface of the object by solidifying the molten modeling material becomes a mark.

[0021] According to the 15th aspect, a program executed by a computer is provided, which controls a processing device having the following devices: a modeling device having an energy beam irradiation unit that irradiates an energy beam on the surface of an object to form a molten pool on the surface and a material supply unit that supplies a modeling material to the molten pool, a changing device that changes the positional relationship between the object and the molten pool, and a gas supply device that supplies a gas around the molten pool; and causes the computer to execute the following processing: control the gas supply device in such a way as to change the characteristics of the gas supplied to the periphery in order to change the color tone of the modeling object modeled by the modeling device.

[0022] According to the 16th aspect, there is provided a program executed by a computer that controls a processing device having the following devices: a modeling device having an energy beam irradiation unit that irradiates an energy beam onto the surface of an object to form a first molten pool on the surface and a material supply unit that supplies a modeling material into the first molten pool, and a changing device that changes the positional relationship between the object and the first molten pool; and causes the computer to execute the following processing: irradiating an energy beam from the energy beam irradiation unit onto a first modeled object that is modeled by supplying the modeling material into the molten pool while changing the positional relationship between the object and the first molten pool in a first direction to form a second molten pool on the first modeled object, and supplying the modeling material from the material supply unit to model a second modeled object; and the size of the second modeled object in a second direction intersecting the first direction is different from the size of the first modeled object in the second direction.

[0023] According to the 17th aspect, there is provided a program executed by a computer that controls a processing device having the following devices: a modeling device having an energy beam irradiation unit that irradiates an energy beam onto a first region on an object and a material supply unit that supplies a modeling material to at least partially overlap the first region, to form a modeled object on the object; a position changing device that changes the positions of the first and second regions on the object; and a supply amount changing device that changes the supply amount per unit time of the modeling material from the material supply unit to the second region.

[0024] According to the 18th aspect, there is provided a program executed by a computer that controls a processing device having the following devices: a modeling device having an energy beam irradiation unit that irradiates an energy beam onto an irradiation region on an object and a material supply unit that supplies a modeling material into the irradiation region, and a changing device that changes the positional relationship between the object and the irradiation region; and causes the computer to execute the following processing: the size of a modeled object in a direction intersecting the direction along the surface of the object, which is modeled by supplying the modeling material into the irradiation region while changing the positional relationship between the object and the irradiation region in a direction along the surface of the object, is different at a first position and a second position different from the first position in the direction along the surface of the modeled object.

[0025] According to the 19th aspect, there is provided a processing apparatus including: a shaping apparatus having an energy beam irradiation unit that irradiates an energy beam onto the surface of an object to form a molten pool on the surface, and a material supply unit that supplies a shaping material into the molten pool; a changing apparatus that changes the positional relationship between the object and the molten pool; and a receiving apparatus that receives a control signal for controlling the shaping apparatus and the changing apparatus in such a manner that the dimension of the shaping object in the second direction intersecting the first direction, which is formed by supplying the shaping material into the molten pool while changing the positional relationship between the object and the molten pool in the first direction, is changed based on the position of the shaping object in the first direction.

[0026] According to the 20th aspect, there is provided a processing apparatus including: a shaping apparatus having an energy beam irradiation unit that irradiates an energy beam onto the surface of an object to form a molten pool on the surface, and a material supply unit that supplies a shaping material into the molten pool to melt the shaping material; a changing apparatus that changes the position of at least one of the object and the molten pool; and a receiving apparatus that receives a control signal for controlling the changing apparatus using coordinate data related to a mark such that a convex shaping object generated on the surface of the object by solidifying the melted shaping material becomes a mark.

[0027] According to the 21st aspect, there is provided a processing apparatus including: a shaping apparatus having an energy beam irradiation unit that irradiates an energy beam onto the surface of an object to form a molten pool on the surface, and a material supply unit that supplies a shaping material into the molten pool; a changing apparatus that changes the positional relationship between the object and the molten pool; a gas supply apparatus that supplies a gas around the molten pool; and a receiving apparatus that receives a control signal for controlling the gas supply apparatus in such a manner that the characteristics of the gas supplied to the periphery are changed in order to change the hue of the shaping object shaped by the shaping apparatus.

[0028] According to the 22nd aspect, there is provided a processing apparatus including: a shaping apparatus having an energy beam irradiation unit that irradiates an energy beam onto the surface of an object to form a first molten pool on the surface, and a material supply unit that supplies a shaping material into the first molten pool; a changing apparatus that changes the positional relationship between the object and the first molten pool; and a receiving apparatus that receives a control signal for controlling the shaping apparatus and the changing apparatus in such a manner that: for a first shaped object shaped by supplying the shaping material into the molten pool while changing the positional relationship between the object and the first molten pool in a first direction, an energy beam is irradiated from the energy beam irradiation unit onto the first shaped object to form a second molten pool on the first shaped object, and the shaping material is supplied from the material supply unit to shape a second shaped object; and the dimension of the second shaped object in a second direction intersecting the first direction is different from the dimension of the first shaped object in the second direction.

[0029] According to the 23rd aspect, there is provided a processing apparatus including: a shaping apparatus having an energy beam irradiation unit that irradiates an energy beam onto a first region on an object, and a material supply unit that supplies a shaping material to at least partially overlap with the first region, to form a shaped object on the object; a position changing apparatus that changes the positions of the first and second regions on the object; and a receiving apparatus that receives a control signal for controlling the material supply unit in such a manner that the supply amount per unit time of the shaping material from the material supply unit to the second region is changed.

[0030] According to the 24th aspect, there is provided a processing apparatus including: a shaping apparatus having an energy beam irradiation unit that irradiates an energy beam onto an irradiation region on an object, and a material supply unit that supplies a shaping material into the irradiation region; a changing apparatus that changes the positional relationship between the object and the irradiation region; and a receiving apparatus that receives a control signal for controlling the shaping apparatus and the changing apparatus in such a manner that: for a shaped object shaped by supplying the shaping material into the irradiation region while changing the positional relationship between the object and the irradiation region in a direction along the surface of the object, the dimension of the shaped object in a direction intersecting the direction along the surface is different at a first position and a second position different from the first position in the direction along the surface of the shaped object.

[0031] According to the 25th aspect, there is provided a control device that controls a processing device including: a modeling device having an energy beam irradiation unit that irradiates an energy beam onto the surface of an object to form a molten pool on the surface and a material supply unit that supplies a modeling material into the molten pool; and a changing device that changes the positional relationship between the object and the molten pool; and performs the following processing: based on the position of the modeled object in the first direction, the size of the modeled object in the second direction that intersects the first direction is changed by changing the positional relationship between the object and the molten pool in the first direction while supplying the modeling material into the molten pool and modeling along the first direction.

[0032] According to the 26th aspect, there is provided a control device that controls a processing device including: a modeling device having an energy beam irradiation unit that irradiates an energy beam onto the surface of an object to form a molten pool on the surface and a material supply unit that supplies a modeling material into the molten pool to melt the modeling material; and a changing device that changes the position of at least one of the object and the molten pool; and performs the following processing: the changing device is controlled using coordinate data related to a mark such that a convex modeled object generated on the surface of the object by solidifying the melted modeling material becomes a mark.

[0033] According to the 27th aspect, there is provided a control device that controls a processing device including: a modeling device having an energy beam irradiation unit that irradiates an energy beam onto the surface of an object to form a molten pool on the surface and a material supply unit that supplies a modeling material into the molten pool; a changing device that changes the positional relationship between the object and the molten pool; and a gas supply device that supplies a gas around the molten pool; and performs the following processing: the gas supply device is controlled in such a way as to change the characteristics of the gas supplied to the surroundings in order to change the color tone of the modeled object modeled by the modeling device.

[0034] According to the 28th aspect, there is provided a control device that controls a processing device including: a modeling device having an energy beam irradiation unit that irradiates an energy beam onto the surface of an object to form a first molten pool on the surface and a material supply unit that supplies a modeling material into the first molten pool; and a changing device that changes the positional relationship between the object and the first molten pool; and performs the following processing: an energy beam is irradiated from the energy beam irradiation unit onto a first modeled object that is modeled by changing the positional relationship between the object and the first molten pool in the first direction while supplying the modeling material into the molten pool to form a second molten pool on the first modeled object, and a second modeled object is modeled by supplying the modeling material from the material supply unit; and the size of the second modeled object in the second direction that intersects the first direction is different from the size of the first modeled object in the second direction.

[0035] According to the 29th aspect, there is provided a control device that controls a processing device including the following devices: a modeling device that has an energy beam irradiation unit that irradiates an energy beam onto a first region on an object and a material supply unit that supplies a modeling material to a second region that at least partially overlaps with the first region, and forms a modeled object on the object; a position changing device that changes the positions of the first and second regions on the object; and a supply amount changing device that changes the supply amount per unit time of the modeling material from the material supply unit to the second region.

[0036] According to the 30th aspect, there is provided a control device that controls a processing device including the following devices: a modeling device that has an energy beam irradiation unit that irradiates an energy beam onto an irradiation region on an object and a material supply unit that supplies a modeling material to the irradiation region, and a changing device that changes the positional relationship between the object and the irradiation region; and performs the following processing: while changing the positional relationship between the object and the irradiation region in a direction along the surface of the object, the size of the modeled object in a direction intersecting with the direction along the surface is different at a first position and a second position different from the first position in the direction along the surface of the modeled object while supplying the modeling material to the irradiation region.

[0037] The effects and other advantages of the present invention will be clarified by the embodiments described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 A cross-sectional view showing the structure of the modeling system of the present embodiment.

[0039] Figure 2 (a) to Figure 2 (c) are cross-sectional views respectively showing the states of irradiating light onto a certain region on the workpiece and supplying a modeling material.

[0040] Figure 3 (a) and Figure 3 (b) are top views respectively showing the movement trajectories of the irradiation regions on the modeling surface.

[0041] Figure 4 (a) to Figure 4 (c) are cross-sectional views respectively showing the processes of forming a three-dimensional structure.

[0042] Figure 5 (a) shows a top view of the movement path of the irradiation region on the modeling surface, Figure 5 (b) is a cross-sectional view showing the modeled object formed in the region intersecting with the movement path of the irradiation region and the modeled object formed in the region not intersecting with the movement path of the irradiation region.Figure 5 (c) is a top view showing the molded objects formed in the area where the movement paths in the irradiation area intersect and the molded objects formed in the area where the movement paths in the irradiation area do not intersect.

[0043] Figure 6 (a) to Figure 6 (c) are respectively graphs showing the supply rates of the molding material controlled to suppress the unevenness of the height of the molded object.

[0044] Figure 7 is a graph showing the relationship between the supply rate of the molding material and the supply amount of the molding material from the material nozzle.

[0045] Figure 8 (a) is a cross-sectional view showing the supply state of the molding material when the inert gas is ejected from the gas ejection device, Figure 8 (b) is a cross-sectional view showing the supply state of the molding material when the inert gas is not ejected from the gas ejection device.

[0046] Figure 9 (a) is a cross-sectional view showing the supply state of the molding material when the shielding member is in the non-shielding state, Figure 9 (b) shows the supply state of the molding material when the shielding member is in the shielding state.

[0047] Figure 10 (a) is a cross-sectional view showing the supply state of the molding material when the material nozzle is in the supply state, Figure 10 (b) shows the supply state of the molding material when the material nozzle is in the non-supply state.

[0048] Figure 11 (a) to Figure 11 (c) are respectively graphs showing the heat transfer rates controlled to suppress the unevenness of the height of the molded object.

[0049] Figure 12 is a graph showing the relationship between the heat transfer rate and the intensity of the light on the irradiation area.

[0050] Figure 13 (a) shows a cross-sectional view of the light irradiation state when the light shielding member is in the light shielding state, Figure 13 (b) shows a cross-sectional view of the light irradiation state when the light shielding member is in the non-light shielding state.

[0051] Figure 14 (a) shows a cross-sectional view of the light irradiation state when the focusing position is set on the molding surface, Figure 14(b) Cross-sectional view showing the irradiation pattern of light when the focusing position is set at a position separated from the molding surface.

[0052] Figure 15 (a) and Figure 15 (b) are graphs showing the moving speed of the irradiation area controlled to suppress the unevenness of the height of the molded object.

[0053] Figure 16 (a) Top view showing the moving path of the irradiation area on the molding surface, Figure 16 (b) Graph showing the relationship between the moving speed of the irradiation area and the height of the molded object.

[0054] Figure 17 Graph showing the supply rate of the molding material controlled based on the moving speed of the irradiation area to suppress the unevenness of the height of the molded object.

[0055] Figure 18 Graph showing the relationship between the moving speed of the irradiation area, the supply rate of the molding material, and the height of the molded object.

[0056] Figure 19 Graph showing the heat transfer rate controlled based on the moving speed of the irradiation area to suppress the unevenness of the height of the molded object.

[0057] Figure 20 Graph showing the relationship between the moving speed of the irradiation area, the heat transfer rate, and the height of the molded object.

[0058] Figure 21 (a) Perspective view showing an example of the positions of areas where heat is relatively difficult to diffuse and areas where heat is relatively easy to diffuse in an existing structure, Figure 21 (b) Cross-sectional view showing the molded objects formed in the areas where heat is relatively difficult to diffuse and the molded objects formed in the areas where heat is relatively easy to diffuse.

[0059] Figure 22 Graph showing the supply rate of the molding material controlled based on the degree of heat diffusion to suppress the unevenness of the height of the molded object.

[0060] Figure 23 Graph showing the heat transfer rate controlled based on the degree of heat diffusion to suppress the unevenness of the height of the molded object.

[0061] Figure 24 Graph showing the moving speed of the irradiation area controlled based on the degree of heat diffusion to suppress the unevenness of the height of the molded object.

[0062] Figure 25(a) A perspective view showing an example of the positions of regions irradiated with light EL at relatively high frequencies and regions irradiated with light EL at relatively low frequencies. Figure 25 (b) A cross-sectional view showing the molded objects formed in the regions irradiated with light EL at relatively high frequencies and the molded objects formed in the regions irradiated with light EL at relatively low frequencies.

[0063] Figure 26 A graph showing the supply rate of the molding material controlled based on the frequency of the irradiated light in order to suppress unevenness in the height of the molded object.

[0064] Figure 27 A graph showing the heat transfer rate controlled based on the frequency of the irradiated light in order to suppress unevenness in the height of the molded object.

[0065] Figure 28 A graph showing the moving speed of the irradiation region controlled based on the frequency of the irradiated light in order to suppress unevenness in the height of the molded object.

[0066] Figure 29 A top view and a cross-sectional view showing the marks formed on the molding surface.

[0067] Figure 30 (a) and Figure 30 (b) are respectively top views showing the moving trajectories of the irradiation regions on the molding surface when forming the Figure 29 shown marks.

[0068] Figure 31 (a) to Figure 31 (d) are respectively top views showing the marks whose dimensions are controlled by the dimension control operation.

[0069] Figure 32 A graph showing the relationship between the heat transfer rate and the dimensions of the marks.

[0070] Figure 33 A graph showing the relationship between the moving speed of the irradiation region and the dimensions of the marks.

[0071] Figure 34 A graph showing the relationship between the dimensions of the irradiation region and the dimensions of the marks.

[0072] Figure 35 (a) and Figure 35 (b) are respectively top views showing the relationship between the dimensions of the marks and the number of linear structures constituting the marks, Figure 35 (c) to Figure 35 (d) are respectively top views showing the relationship between the dimensions of the marks and the lengths of the linear structures constituting the marks.

[0073] Figure 36 (a) toFigure 36 (d) are top views of marks indicating height control by height control actions.

[0074] Figure 37 A graph showing the relationship between the supply rate and the height of the mark.

[0075] Figure 38 A graph showing the relationship between the heat transfer rate and the height of the mark.

[0076] Figure 39 A graph showing the relationship between the moving speed of the irradiation area and the height of the mark.

[0077] Figure 40 (a) and Figure 40 (b) are cross-sectional views showing the relationship between the height of the mark and the number of structural layers constituting the mark.

[0078] Figure 41 (a) to Figure 41 (c) are cross-sectional views of marks indicating shape control of the surface by shape control actions.

[0079] Figure 42 (a) to Figure 42 (c) are cross-sectional views of marks indicating shape control of the joint surface by shape control actions.

[0080] Figure 43 (a) shows a top view and a cross-sectional view of a mark pressed onto an object as a stamp, Figure 43 (b) shows a top view of an imprint transferred onto the object pressed by the mark.

[0081] Figure 44 (a) to Figure 44 (c) are cross-sectional views of marks indicating shape control of the joint surface in a complementary relationship with the object surface of the object.

[0082] Figure 45 (a) shows an example of a control pattern of the characteristics of a specific gas during the formation of multiple marks, Figure 45 (b) shows a top view of multiple marks formed when controlling the characteristics of a specific gas in the control pattern shown in Figure 45 (a), Figure 45 (c) shows an example of a control pattern of the characteristics of a specific gas during the formation of a single mark, Figure 45 (d) shows a top view of the mark formed when controlling the characteristics of a specific gas in the control pattern shown in Figure 45 (c).

[0083] Figure 46 (a) toFigure 46 (c) are cross-sectional views showing the state of the surface to be polished during the polishing operation.

[0084] Figure 47 (a) is a top view showing the movement path of the irradiation area during the shaping operation, Figure 47 (b) is a top view showing the movement path of the irradiation area during the polishing operation.

[0085] Figure 48 (a) is a top view showing the movement path of the irradiation area during the shaping operation, Figure 48 (b) is a top view showing the movement path of the irradiation area during the polishing operation.

[0086] Figure 49 A cross-sectional view showing the depth of focus of the irradiation optical system included in the shaping system of the first modified example.

[0087] Figure 50 (a) is a cross-sectional view of the structure layer formed by the shaping system of the first modified example when an irradiation area is set in a certain area portion on the shaping surface, Figure 50 (b) shows that when Figure 50 (a) When the irradiation area is set again in the same area portion as the area portion shown in, a cross-sectional view of the structure layer formed by the shaping system of the first modified example.

[0088] Figure 51 (a) and Figure 51 (b) are cross-sectional views showing the positional relationship between the shaping surface and the depth of focus range of the irradiation optical system, respectively.

[0089] Figure 52 A cross-sectional view showing the structure of the shaping system of the second modified example.

[0090] Figure 53 (a) is a cross-sectional view showing the structure of the irradiation optical system included in the shaping system of the third modified example, Figure 53 (b) is a perspective view showing the optical structure included in the irradiation optical system of the third modified example.

[0091] Figure 54 A cross-sectional view showing the structure of the shaping device included in the shaping system of the fourth modified example.

[0092] Figure 55 A cross-sectional view showing the structure of the shaping device included in the shaping system of the fifth modified example.

[0093] Figure 56 (a) to (c) are cross-sectional views showing the constitution of the shaped object shaped by the sixth modified example. Among them,Figure 56 (a) is an example where the shaping surface CS is a curved surface, Figure 56 (b) is an example where the shaping surface CS is concave-convex, Figure 56 (c) is an example where the shaping surface CS is the upper surface of the structural layer SL#1.

[0094] Figure 57 A cross-sectional view showing the structure of a shaped object shaped by the seventh modification example, which shows shaping a structural layer SL#2 with a height different from that of the already shaped structural layer SL#1 on top of the structural layer SL#1.

[0095] Figure 58 (a) and Figure 58 (b) are cross-sectional views showing the operations of the eighth modification example respectively. Among them, Figure 58 (a) is an example of setting the gas ejection device 461, Figure 58 (b) is an example of stopping the gas ejection operation of the gas ejection device 461 and starting the supply of the shaping material M from the material nozzle 412 to the supply area MA.

[0096] Figure 59 A cross-sectional view showing an example of the supply amount changing device used in the eighth modification example.

[0097] Figure 60 A cross-sectional view showing an example of the supply amount changing device used in the eighth modification example.

[0098] Figure 61 (a) shows a top view of the movement locus of the irradiation area on the shaping surface, Figure 61 (b) shows that ​ when the irradiation area moves along the movement locus shown in (a), a cross-sectional view of a part of the shaped object formed.

[0099] ​ (a) shows a top view of the movement locus of the irradiation area on the shaping surface, ​ (b) shows that ​ when the irradiation area moves along the movement locus shown in (a), a cross-sectional view of a part of the shaped object formed. Detailed implementation mode

[0100] Hereinafter, with reference to the drawings, embodiments of a processing apparatus and method, a marking and modeling method, a computer program, and a recording medium will be described. Hereinafter, a modeling system 1 capable of performing the following processing will be used to describe embodiments of the processing apparatus and method, the marking and modeling method, the computer program, and the recording medium. The processing is to form a three-dimensional structure ST by performing additional processing using a modeling material M by using a laser metal deposition (LMD) method. In addition, the laser metal deposition (LMD) method may also be referred to as: direct metal deposition, direct energy deposition, laser cladding, laser near-net shaping, direct light manufacturing, laser consolidation, shape deposition manufacturing, wire-fed laser deposition, blowpipe, laser powder fusion, laser metal forming, selective laser powder melting, laser direct casting, laser powder deposition, laser laminated manufacturing, laser rapid prototyping.

[0101] Further, in the following description, a XYZ orthogonal coordinate system defined by mutually orthogonal X-axis, Y-axis, and Z-axis will be used to describe the positional relationship of various components constituting the modeling system 1. In addition, in the following description, for ease of explanation, the X-axis direction and the Y-axis direction are respectively set as horizontal directions (i.e., predetermined directions in a horizontal plane), and the Z-axis direction is set as a vertical direction (i.e., a direction orthogonal to the horizontal plane, substantially an up-and-down direction). Further, the rotational directions (in other words, tilt directions) around the X-axis, Y-axis, and Z-axis are respectively referred to as the θX direction, the θY direction, and the θZ direction. Here, the Z-axis direction may also be set as the gravitational direction. Further, the XY plane may also be set as the horizontal direction.

[0102] (1) Structure of the modeling system 1

[0103] First, with reference to ​ , the overall structure of the modeling system 1 of the present embodiment will be described. ​ A cross-sectional view showing an example of the structure of the modeling system 1 of the present embodiment.

[0104] The shaping system 1 can form a three-dimensional structure ST (i.e., a three-dimensional object having a size in any direction of the three-dimensional direction, a three-dimensional object). The shaping system 1 can form the three-dimensional structure ST on a workpiece W that serves as the basis (i.e., the base material) for forming the three-dimensional structure ST. The shaping system 1 can form the three-dimensional structure ST by performing additional processing on the workpiece W. When the workpiece W is the platform 43 described later, the shaping system 1 can form the three-dimensional structure ST on the platform 43. When the workpiece W is an existing structure held by the platform 43, the shaping system 1 can form the three-dimensional structure ST on the existing structure. In this case, the shaping system 1 can also form a three-dimensional structure ST integrated with the existing structure. The action of forming a three-dimensional structure ST integrated with the existing structure is equivalent to the action of adding a new structure to the existing structure. Alternatively, the shaping system 1 can also form a three-dimensional structure ST separable from the existing structure. In addition, ​ An example in which the workpiece W is an existing structure held by the platform 43 is shown. Also, hereinafter, the example in which the workpiece W is an existing structure held by the platform 43 will be used to advance the description.

[0105] As described above, the shaping system 1 can form the three-dimensional structure ST using the laser thickening welding method. That is, the shaping system 1 can also be called a 3D (three dimensional) printer that uses additive manufacturing technology to form an object. In addition, additive manufacturing technology is also called: Rapid Prototyping, Rapid Manufacturing, or Additive Manufacturing.

[0106] To form the three-dimensional structure ST, the shaping system 1 is as ​ shown, and includes: a material supply device 3, a shaping device 4, a light source 5, a gas supply device 6, and a control device 7. The material supply device 3, the shaping device 4, the light source 5, the gas supply device 6, and the control device 7 are housed in a box C. ​ In the example shown, the shaping device 4 is housed in the upper space UC of the box C, and the material supply device 3, the light source 5, the gas supply device 6, and the control device 7 are housed in the lower space LC of the box C located below the upper space UC. However, the arrangement positions of the material supply device 3, the shaping device 4, the light source 5, the gas supply device 6, and the control device 7 in the box C are not limited to ​ the arrangement positions shown.

[0107] The material supply device 3 supplies the modeling material M to the modeling device 4. The material supply device 3 supplies the required amount of the modeling material M corresponding to the necessary amount, that is, the amount of the modeling material M necessary per unit time for the modeling device 4 to form the three-dimensional structure ST, to the modeling device 4.

[0108] The modeling material M is a material that can be melted by irradiation with light EL having a predetermined intensity or more. As such a modeling material M, for example, at least one of a metallic material and a resinous material can be used. However, as the modeling material M, other materials different from the metallic material and the resinous material can also be used. The modeling material M is a powdery or granular material. That is, the modeling material M is a powder or granule. However, the modeling material M may not be a powder or granule, and for example, a linear modeling material or a gaseous modeling material can also be used.

[0109] The modeling device 4 processes the modeling material M supplied by the material supply device 3 to form the three-dimensional structure ST. In order to process the modeling material M, the modeling device 4 includes: a modeling head 41, a drive system 42, and a platform 43. Further, the modeling head 41 includes: an irradiation optical system 411 and a material nozzle (that is, a supply system for supplying the modeling material M) 412. The modeling head 41, the drive system 42, and the platform 43 are housed in a chamber 44.

[0110] The irradiation optical system 411 is an optical system (for example, a condensing optical system) for emitting the light EL from the emission unit 413. Specifically, the irradiation optical system 411 is optically connected to the light source 5 that emits the light EL via a light transmission member (not shown) such as an optical fiber or an optical waveguide. The irradiation optical system 411 emits the light EL propagated from the light source 5 via the light transmission member. The irradiation optical system 411 irradiates the light EL downward (that is, the -Z side) from the irradiation optical system 411. The platform 43 is disposed below the irradiation optical system 411. When the workpiece W is placed on the platform 43, the irradiation optical system 411 irradiates the workpiece W with the light EL. Specifically, the irradiation optical system 411 can irradiate the irradiation area EA set on the workpiece W as the area irradiated (typically, condensed) with the light EL with the light EL. Further, the state of the irradiation optical system 411 can be switched between a state of irradiating the irradiation area EA with the light EL and a state of not irradiating the irradiation area EA with the light EL under the control of the control device 7. In addition, the direction of the light EL emitted from the irradiation optical system 411 is not limited to directly downward (that is, coinciding with the -Z axis direction), and for example, it can also be a direction inclined by a predetermined angle with respect to the Z axis.

[0111] The material nozzle 412 has a supply outlet 414 for supplying the molding material M. The material nozzle 412 supplies (specifically, sprays, ejects, blows) the molding material M from the supply outlet 414. The material nozzle 412 is physically connected via a conduit (not shown) or the like to the material supply device 3 which is the supply source of the molding material M. The material nozzle 412 supplies the molding material M supplied from the material supply device 3 via the conduit. The material nozzle 412 may also pressure-feed the molding material M supplied from the material supply device 3 via the conduit. That is, the molding material M from the material supply device 3 may be mixed with a conveying gas (e.g., an inert gas such as nitrogen or argon) and pressure-fed to the material nozzle 412 via the conduit. In addition, ​ in, the material nozzle 412 is depicted as tubular, but the shape of the material nozzle 412 is not limited to this shape. The material nozzle 412 supplies the molding material M downward (i.e., the -Z side) from the material nozzle 412. A platform 43 is disposed below the material nozzle 412. When the workpiece W is mounted on the platform 43, the material nozzle 412 supplies the molding material M toward the workpiece W. In addition, the traveling direction of the molding material M supplied from the material nozzle 412 may be a direction that is inclined by a predetermined angle (an example is an acute angle) with respect to the Z-axis direction, and may also be the -Z side (i.e., directly below).

[0112] In the present embodiment, the material nozzle 412 is aligned with the irradiation optical system 411 in order to supply the molding material M to the irradiation area EA where the light EL is irradiated. That is, in order to make the supply area MA set on the workpiece W, which is the area where the material nozzle 412 supplies the molding material M, coincide with (or at least partially overlap) the irradiation area EA, the material nozzle 412 is aligned with the irradiation optical system 411. In addition, the material nozzle 412 may be aligned with the molten pool MP formed by the light EL emitted from the irradiation optical system 411 in order to supply the molding material M.

[0113] The drive system 42 moves the shaping head 41. The drive system 42 moves the shaping head 41 along at least any one of the X-axis, Y-axis, and Z-axis. If the shaping head 41 moves along at least one of the X-axis and Y-axis, the irradiation area EA moves along at least one of the X-axis and Y-axis on the workpiece W. Furthermore, in addition to at least any one of the X-axis, Y-axis, and Z-axis, the drive system 42 can also move the shaping head 41 along at least one of the θX direction, θY direction, and θZ direction. The drive system 42 includes, for example, a motor or the like. In addition, the drive system 42 can also move the irradiation optical system 411 and the material nozzle 412 respectively. Specifically, for example, the drive system 42 can also adjust at least one of the position of the ejection part 413, the orientation of the ejection part 413, the position of the supply outlet 414, and the orientation of the supply outlet 414. In this case, the irradiation area EA where the irradiation optical system 411 irradiates the light EL and the supply area MA where the material nozzle 412 supplies the shaping material M can be controlled separately. In addition, the drive system 42 can also rotate the shaping head 41 along the rotation axis around the X-axis and the rotation axis around the Y-axis.

[0114] The platform 43 can hold the workpiece W. Furthermore, the platform 43 can release the held workpiece W. The above irradiation optical system 411 irradiates the light EL during at least a part of the period when the platform 43 holds the workpiece W. Furthermore, the above material nozzle 412 supplies the shaping material M during at least a part of the period when the platform 43 holds the workpiece W. In addition, a part of the shaping material M supplied by the material nozzle 412 may scatter or spill from the surface of the workpiece W to the outside of the workpiece W (for example, around the platform 43). Therefore, the shaping system 1 can also be provided with a recovery device around the platform 43 for recovering the scattered or spilled shaping material M. In addition, in order to hold the workpiece W, the platform 43 can be provided with a mechanical chuck or a vacuum adsorption chuck or the like.

[0115] The light source 5 emits at least one of, for example, infrared light, visible light, and ultraviolet light as the light EL. However, other types of light can also be used for the light EL. The light EL is laser light. In this case, the light source 5 can also include a laser light source (for example, a semiconductor laser such as a laser diode (LD)). The laser light source can also be a fiber laser, a CO2 laser, a YAG (yttrium aluminum garnet) laser, an excimer laser, or the like. However, the light EL can also not be laser light, and the light source 5 can also include any light source (for example, at least one of an LED (Light Emitting Diode) and a discharge lamp).

[0116] The gas supply device 6 is a supply source of the purge gas. The purge gas contains an inert gas. An example of the inert gas may be nitrogen or argon. The gas supply device 6 supplies the purge gas into the chamber 44 of the molding device 4. As a result, the internal space of the chamber 44 becomes a space purged by the purge gas. In addition, the gas supply device 6 may also be a high-pressure tank storing an inert gas such as nitrogen or argon, and when the inert gas is nitrogen, it may also be a nitrogen generation device that generates nitrogen using the atmosphere as a raw material.

[0117] The control device 7 controls the operation of the modeling system 1. The control device 7 may include, for example, a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), and a memory. The control device 7 executes a computer program by means of the CPU and functions as a device for controlling the operation of the modeling system 1. This computer program is a computer program for causing the control device 7 (e.g., the CPU) to perform (i.e., execute) the operations to be described later that the control device 7 should perform. That is, this computer program is a computer program for causing the control device 7 to function in order for the modeling system 1 to perform the operations to be described later. The computer program executed by the CPU may be recorded in the memory (i.e., recording medium) provided in the control device 7, or may be recorded in any storage medium (e.g., hard disk or semiconductor memory) built into the control device 7 or attachable to the control device 7. Alternatively, the CPU may also download the computer program to be executed from a device external to the control device 7 via a network interface. Also, the control device 7 may not be disposed inside the modeling system 1. For example, it may be disposed outside the modeling system 1 as a server or the like. In this case, the control device 7 and the modeling system 1 may also be connected by a wired or wireless communication line or network. In the case of a physical connection using a wire, for example, it may be a serial connection such as IEEE (Institute of Electrical and Electronics Engineers) 1394, RS-232x, RS-422, RS-423, RS-485, USB (Universal Serial Bus), or a parallel connection; or an electrical connection via a network such as 10BASE-T, 100BASE-TX, 1000BASE-T. Also, in the case of a wireless connection, radio waves such as IEEE802.1x, OFDM (Orthogonal Frequency Division Multiplexing) method, etc., wireless LAN (Local Area Network), or Bluetooth (registered trademark), infrared rays, optical communication, etc. may be used. In this case, the control device 7 and the modeling system 1 may also be configured to be able to transmit and receive various information via a communication line or network. Also, the control device 7 may send information such as commands or control parameters to the modeling system 1 via the above communication line or network. The modeling system 1 may also include a receiving device that receives information such as commands or control parameters from the control device 7 via the above communication line or network.In addition, the recording medium that records the computer program executed by the CPU may also include: CD-ROM (compact disk read only memory), CD-R (CD-recordable), CD-RW (CD-rewritable), or floppy disks, MO (magneto optical), DVD-ROM (digital versatile disc-read only memory), DVD-RAM (digital versatile disc-random access memory), DVD-R, DVD+R, DVD-RW (digital versatile disc-read / write), DVD+RW, Blu-ray (registered trademark), and other magnetic media such as magnetic disks or magnetic tapes; optical discs, magneto-optical discs, semiconductor memories such as USB memories; and other media that can store programs. Also, in the program, in addition to those distributed by being stored in the above recording media, there are also those distributed by downloading via network lines such as the Internet. Furthermore, the recording medium includes a machine that can record programs, such as a general-purpose or dedicated machine installed in a state where the above program can be executed in the form of software or firmware, etc. Furthermore, each process or function included in the program can be implemented using program software executable by a computer, or can also be implemented in a form where hardware such as a fixed gate array (FPGA (field programmable gate array), ASIC (application specific integrated circuit)) or a partial hardware module that mixes program software and a part of the elements that implement the hardware is used. Especially in this embodiment, the control device 7 controls the emission form of the light EL emitted by the irradiation optical system 411. The emission form includes at least one of, for example, the intensity of the light EL and the emission time of the light EL. When the light EL is pulsed light, the emission form may include at least one of, for example, the length of the emission time of the pulsed light and the ratio of the emission time to the extinction time of the pulsed light (so-called duty ratio). Furthermore, the control device 7 controls the movement form of the shaping head 41 caused by the drive system 42. The movement form includes at least one of, for example, the movement amount, movement speed, movement direction, and movement time. Furthermore, the control device 7 controls the supply form of the shaping material M caused by the material nozzle 412. The supply form includes at least one of, for example, the supply amount (especially the supply amount per unit time) and the supply time.In addition, the control device 7 may not be provided inside the modeling system 1. For example, it may also be provided outside the modeling system 1 as a server or the like.

[0118] (2) Modeling operation performed by the modeling system 1

[0119] Next, the modeling operation performed by the modeling system 1 (i.e., the operation for forming the three-dimensional structure ST) will be described. As described above, the modeling system 1 forms the three-dimensional structure ST using the laser cladding method. Therefore, the modeling system 1 can also form the three-dimensional structure ST by performing the existing modeling operation based on the laser cladding method. Hereinafter, an example of the modeling operation of the three-dimensional structure ST using the laser cladding method will be briefly described.

[0120] The shaping system 1 forms a three-dimensional structure ST on a workpiece W based on three-dimensional model data of the three-dimensional structure ST to be formed (for example, CAD (Computer Aided Design) data). As the three-dimensional model data, the following can be used: measurement data of a three-dimensional object measured by a measuring device provided in the shaping system 1; a three-dimensional shape measuring machine provided separately from the shaping system 1, such as a contact-type three-dimensional coordinate measuring machine that can move relative to the workpiece W and has a probe that can contact the workpiece W, or a non-contact three-dimensional measuring machine (as an example, a three-dimensional measuring machine using the pattern projection method, the light section method, the time-of-flight method, the moiré topography method, the holographic interference method, the CT (Computed Tomography) method, the MRI (Magnetic resonance imaging) method, etc.). In addition, as the three-dimensional model data, for example, the following can be used: STL (Stereo Lithography) format, VRML (Virtual Reality Modeling Language) format, AMF (Additive Manufacturing File Format), IGES (Initial Graphics Exchange Specification) format, VDA-FS (Association of German Automotive Manufactures - Surfaces Interface) format, HP / GL (Hewlett-Packard Graphics Language) format, bitmap format, etc. To form the three-dimensional structure ST, the shaping system 1 sequentially forms, for example, a plurality of layered partial structures (hereinafter referred to as "structural layers") SL arranged along the Z-axis direction. For example, the shaping system 1 sequentially forms, layer by layer, a plurality of structural layers SL obtained by circumferentially cutting the three-dimensional structure ST along the Z-axis direction. As a result, a laminated structure body in which a plurality of structural layers SL are laminated, that is, the three-dimensional structure ST, is formed. Hereinafter, the process of the operation of forming the three-dimensional structure ST by sequentially forming a plurality of structural layers SL layer by layer will be described.

[0121] First, the operations for forming each construction layer SL will be described. Under the control of the control device 7, the modeling system 1 sets an irradiation area EA in a required area on the surface of the workpiece W or on a modeling surface CS corresponding to the surface of the formed construction layer SL, and irradiates the irradiation area EA with light EL from the irradiation optical system 411. In addition, the area occupied by the light EL irradiated by the irradiation optical system 411 on the modeling surface CS may also be referred to as the irradiation area EA. In the present embodiment, the focusing position (i.e., the condensing position) of the light EL coincides with the modeling surface CS. As a result, as ​ (a) shows, a molten pool (i.e., a pool of metal melted by the light EL) MP is formed in a required area on the modeling surface CS by the light EL emitted from the irradiation optical system 411. Further, under the control of the control device 7, the modeling system 1 sets a supply area MA in a required area on the modeling surface CS, and supplies the modeling material M to the supply area MA from the material nozzle 412. Here, as described above, the irradiation area EA coincides with the supply area MA, so the supply area MA is set in the area where the molten pool MP is formed. Therefore, the modeling system 1, as ​ (b) shows, supplies the modeling material M to the molten pool MP from the material nozzle 412. As a result, the modeling material M supplied to the molten pool MP melts. If the light EL is no longer irradiated on the molten pool MP as the modeling head 41 moves, the modeling material M melted in the molten pool MP cools and solidifies again (i.e., solidifies). As a result, as ​ (c) shows, the re-solidified modeling material M accumulates on the modeling surface CS. That is, a model formed by the accumulation of the re-solidified modeling material M is formed.

[0122] A series of shaping processes including the formation of the melting pool MP by irradiating EL with light, the supply of the shaping material M into the melting pool MP, the melting of the supplied shaping material M, and the re-solidification of the melted shaping material M are repeatedly performed while moving the shaping head 41 relative to the shaping surface CS along the XY plane. That is, when the shaping head 41 moves relative to the shaping surface CS, the irradiation area EA also moves relative to the shaping surface CS. Therefore, a series of shaping processes are repeatedly performed while moving the irradiation area EA relative to the shaping surface CS along the XY plane (i.e., within a two-dimensional plane). At this time, the light EL selectively irradiates the irradiation area EA in the area on the shaping surface CS where the shaped object is to be formed, while selectively not irradiating the irradiation area EA in the area on the shaping surface CS where the shaped object is not to be formed (it can also be said that the irradiation area EA is not set in the area where the shaped object is not to be formed). That is, the shaping system 1 moves the irradiation area EA along a predetermined movement trajectory on the shaping surface CS, and irradiates the shaping surface CS with the light EL at a moment corresponding to the distribution pattern of the area where the shaped object is to be formed (i.e., the pattern of the structural layer SL). As a result, the melting pool MP also moves on the shaping surface CS along a movement trajectory corresponding to the movement trajectory of the irradiation area EA. Specifically, the melting pool MP is sequentially formed on the part irradiated with the light EL in the area along the movement trajectory of the irradiation area EA on the shaping surface CS. Furthermore, as described above, since the irradiation area EA coincides with the supply area MA, the supply area MA also moves on the shaping surface CS along a movement trajectory corresponding to the movement trajectory of the irradiation area EA. As a result, a structural layer SL equivalent to the aggregate of the shaped objects formed by the solidified shaping material M is formed on the shaping surface CS. That is, a structural layer SL equivalent to the aggregate of the shaped objects formed in a pattern corresponding to the movement trajectory of the melting pool MP on the shaping surface CS is formed (i.e., when viewed from above, the structural layer SL having a shape corresponding to the movement trajectory of the melting pool MP). In addition, when the irradiation area EA is set in the area where the shaped object is not to be formed, the irradiation area EA can be irradiated with the light EL, and the supply of the shaping material M can be stopped. Also, when the irradiation area EA is set in the area where the shaped object is not to be formed, the shaping material M can be supplied into the irradiation area EL, and the light EL with an intensity that cannot form the melting pool MP can be irradiated to the irradiation area EL.

[0123] During the layer formation period of forming a certain structural layer SL on the shaping surface CS, the irradiation area EA can also be as ​ (a) shows, move along the first movement trajectory that repeats the movement of the irradiation area EA along the Y-axis direction and the movement of the irradiation area EA along the X-axis direction. ​In the example shown in (a), the irradiation area EA moves along the movement locus in which the movement of the irradiation area EA toward the +Y side, the movement of the irradiation area EA toward the +X side, the movement of the irradiation area EA toward the -Y side, and the movement of the irradiation area EA toward the +X side are repeated. In this case, when the modeling system 1 sets the irradiation area EA in the area on the modeling surface CS where the object to be modeled is to be formed, the irradiation light EL is irradiated. Especially in ​ In the example shown in (a), the amount of movement of the irradiation area EA in the Y-axis direction (especially the amount of movement of one movement until the movement direction of the irradiation area EA is switched to the X-axis direction) is larger than the amount of movement of the irradiation area EA in the X-axis direction. In this case, the modeling system 1 irradiates the irradiation light EL during the period in which the irradiation area EA moves along the Y-axis (or along either one of the X-axis and the Y-axis where the amount of movement of one movement of the irradiation area EA is larger), and does not irradiate the irradiation light EL during the period in which the irradiation area EA moves along the X-axis (or along either one of the X-axis and the Y-axis where the amount of movement of one movement of the irradiation area EA is smaller). In addition, ​ The movement locus shown in (a) can be referred to as a movement locus corresponding to the scan by so-called raster scan. In this case, although the possibility that the movement locus of the irradiation area EA intersects on the modeling surface CS is not necessarily zero, the movement locus of the irradiation area EA basically does not intersect.

[0124] Or, during the layer formation period, the irradiation area EA may also be as ​ shown in (b), and move along the second movement locus along the pattern of the construction layer SL. In this case, the modeling system 1 also irradiates the irradiation light EL when setting the irradiation area EA in the area on the modeling surface CS where the object to be modeled is to be formed. However, since the irradiation area EA moves along the second movement locus along the pattern of the construction layer SL, the irradiation area EA can also be said to substantially overlap with the area on the modeling surface CS where the object to be modeled is to be formed. Therefore, the modeling system 1 can also continue to irradiate the irradiation light EL during the period in which the irradiation area EA moves. In this case, the molten pool MP also moves along the second movement locus along the pattern of the construction layer SL. As a result, a modeling process for growing the object to be modeled in the direction in which the irradiation area EA and the construction layer SL move relative to each other is performed. In addition, ​ The movement locus shown in (b) can be referred to as a movement locus corresponding to the scan by so-called vector scan. In this case, the control device 7 can also set the movement locus of the irradiation area EA in such a way that the movement locus of the irradiation area EA does not intersect on the modeling surface CS (especially the movement locus of the molten pool MP does not intersect on the modeling surface CS). However, depending on the distribution pattern of the area where the object to be modeled is to be formed on the modeling surface CS, there is a possibility that the movement locus of the irradiation area EA (especially the movement locus of the molten pool MP) intersects on the modeling surface CS.

[0125] In addition, in the above, by moving the shaping head 41 (i.e., the light EL) relative to the shaping surface CS, the irradiation area EA is moved relative to the shaping surface CS. However, the shaping surface CS may also be moved, or both the shaping head 41 (i.e., the light EL) and the shaping surface CS may be moved.

[0126] Under the control of the control device 7, the shaping system 1 repeatedly performs an operation for forming such a structural layer SL based on the three-dimensional model data. Specifically, first, the three-dimensional model data is sliced at a lamination pitch to produce slice data. In addition, data obtained by partially correcting the slice data according to the characteristics of the shaping system 1 may also be used. The shaping system 1 performs an operation for forming the first structural layer SL#1 on the shaping surface CS corresponding to the surface of the workpiece W based on the three-dimensional model data corresponding to the structural layer SL#1, that is, the slice data corresponding to the structural layer SL#1. As a result, on the shaping surface CS, a structural layer SL#1 is formed as shown in ​ (a). Then, after the shaping system 1 sets the surface (i.e., the upper surface) of the structural layer SL#1 on a new shaping surface CS, the second structural layer SL#2 is formed on the new shaping surface CS. To form the structural layer SL#2, the control device 7 first controls the drive system 42 in such a way that the shaping head 41 moves along the Z axis. Specifically, the control device 7 controls the drive system 42 to move the shaping head 41 toward the +Z side so that the irradiation area EA and the supply area MA are set on the surface of the structural layer SL#1 (i.e., the new shaping surface CS). Thereby, the focusing position of the light EL coincides with the new shaping surface CS. Then, under the control of the control device 7, the shaping system 1 performs an operation similar to the operation of forming the structural layer SL#1 based on the slice data corresponding to the structural layer SL#2, and forms the structural layer SL#2 on the structural layer SL#1. As a result, a structural layer SL#2 is formed as shown in ​ (b). Hereinafter, the same operation is repeatedly performed until all the structural layers SL that make up the three-dimensional structure ST to be formed on the workpiece W are formed. As a result, as shown in ​ (c), the three-dimensional structure ST is formed by a laminated structure in which a plurality of structural layers SL are laminated.

[0127] (3) Unevenness suppression operation

[0128] Next, an unevenness suppression control operation for suppressing unevenness in the characteristics of the shaped object (i.e., the shaped objects constituting each structural layer SL) formed by the shaping operation will be described. In the present embodiment, the shaping system 1 performs at least one of a first unevenness suppression operation, a second unevenness suppression operation, a third unevenness suppression operation, and a fourth unevenness suppression operation. Therefore, hereinafter, the first unevenness suppression operation to the fourth unevenness suppression operation will be described in order.

[0129] In addition, in the following description, as a characteristic of the molded object, the height of the molded object from the molded surface CS (i.e., the dimension in the Z-axis direction or the size in the Z-axis direction, which is substantially the thickness of the molded object) is used. That is, in the following description, an unevenness suppression operation for suppressing unevenness in the height of the molded object is described. However, as a characteristic of the molded object, any characteristic other than the height of the molded object may also be used. For example, as a characteristic of the molded object, in addition to or instead of the height of the molded object from the molded surface CS, the size of the molded object along the molded surface CS (i.e., the size in at least one of the X-axis direction and the Y-axis direction, such as the width) may be used.

[0130] (3-1) First unevenness suppression operation

[0131] First, the first unevenness suppression operation will be described. The first unevenness suppression operation is an operation for suppressing unevenness in the height of the molded object when the irradiation area EA is set two or more times on the same area on the molded surface CS during the layer formation period of forming any one structure layer SL on the molded surface CS. In addition, the first unevenness suppression operation may also be set as an operation for suppressing unevenness in the height (the size in the direction intersecting the surface on which the structure layer SL is located) including the position in the plane where the structure layer SL is located in any one structure layer SL.

[0132] Specifically, as shown in ​ (a), during the layer formation period of forming a certain structure layer SL on the molded surface CS, the irradiation area EA moves on the molded surface CS along a movement locus corresponding to the pattern of the structure layer SL on the molded surface CS. Here, depending on the pattern of the structure layer SL, there is a possibility that the movement locus of the irradiation area EA intersects on the molded surface CS. ​In the example shown in (a), in the region WA1 on the shaping surface CS, the movement trajectories of the irradiation regions EA cross. In the region WA1 on the shaping surface CS where the movement trajectories of the irradiation regions EA cross, the irradiation region EA is set two or more times. On the other hand, in the region WA2 on the shaping surface CS that overlaps with the movement trajectory of the irradiation region EA and where the movement trajectories of the irradiation regions EA do not cross, the irradiation region EA is set only once. That is, the shaping surface CS includes: the region WA1 where the irradiation region EA is set two or more times during the layer formation period, and the region WA2 where the irradiation region EA is set only once during the layer formation period. In addition, the region WA1 can be set as a region where the irradiation region EA is set M times (M is an integer of 2 or more) during the layer formation period, and the region WA2 can be set as a region where the irradiation region EA is set N times (N is an integer of 1 or more and satisfies the relationship N < M) during the layer formation period. In other words, the number of shaping processes for the region WA1 is different from the number of shaping processes for the region WA2. Specifically, the number of shaping processes for the region WA1 is more than the number of shaping processes for the region WA2. Further in other words, the number of shaping processes for the region WA2 is less than the number of shaping processes for the region WA1.

[0133] In the region WA1, there is a possibility that the above series of shaping processes including the formation of the molten pool MP by light irradiation EL, the supply of the shaping material M into the molten pool MP, the melting of the supplied shaping material M, and the re-solidification of the melted shaping material M are carried out two or more times at different times when at least a part of the region WA1 coincides with the irradiation region EA. That is, in the region WA1, there is a possibility that the movement trajectories of the molten pools MP on the shaping surface CS cross. On the other hand, in the region WA2, the series of shaping processes are not carried out two or more times. In the region WA2, at the moment when at least a part of the region WA2 coincides with the irradiation region EA, the series of shaping processes are carried out at most only once. That is, in the region WA2, the movement trajectories of the molten pools MP on the shaping surface CS do not cross. In addition, during the layer formation period for forming one structural layer SL, at least a part of the molten pool MP formed for carrying out the shaping process after the second time can also be formed on the shaped object formed on the region WA1 by the first shaping process. That is, at least a part of the molten pool MP formed for carrying out the shaping process after the second time can also be formed by the shaping material M.

[0134] If a series of shaping processes are performed more than twice in the region WA1 and only once in the region WA2, in other words, if the number of shaping processes in the region WA1 is different from the number of shaping processes in the region WA2, the following technical problems will occur. Specifically, in the region WA1, compared with the region WA2, there is a greater possibility of supplying, melting, and re-solidifying the shaping material M. Therefore, if a series of shaping processes are performed without distinguishing between the region WA1 and the region WA2 in a situation where shaped objects of the same height should be formed in the region WA1 and the region WA2, there is a possibility that the height of the shaped object formed in the region WA1 is inconsistent with the height of the shaped object formed in the region WA2. Typically, as shown in ​ (b), there is a possibility that the height h1 of the shaped object formed in the region WA1 is only higher than the height h2 of the shaped object formed in the region WA2 corresponding to the degree of the number of series of shaping processes being more. That is, when the irradiation area EA is set more than twice in a certain area on the shaping surface CS during layer formation, there is a possibility that the heights of the shaped objects are different. In addition, hereinafter, for the sake of simplification of explanation, the shaped object formed in the region WA1 will be referred to as "shaped object S1", and the shaped object formed in the region WA2 will be referred to as "shaped object S2".

[0135] Therefore, in the present embodiment, the control device 7 (in other words, the shaping system 1 under the control of the control device 7) suppresses the unevenness between the height h1 of the shaped object S1 and the height h2 of the shaped object S2 by performing the first unevenness suppression operation. In addition, in the present embodiment, the operation of "suppressing the unevenness between the height of one shaped object and the height of another shaped object" includes an operation of reducing the difference (that is, reducing the difference) between the height of one shaped object and the height of another shaped object compared with the case where the unevenness suppression operation is not performed. The operation of "suppressing the unevenness between the height of one shaped object and the height of another shaped object" includes an operation of making the height of one shaped object the same as the height of another shaped object (that is, making them the same).

[0136] In addition, as shown in ​As shown in (c), in the case where the shaped objects formed in the regions WA1 and WA2 should have the same size, there is also a possibility that the size of the shaped object formed in the region WA1 (here, the size in the X-axis direction, substantially the width) w1 is larger than the size w2 of the shaped object formed in the region WA2. That is, when the irradiation region EA is set two or more times in a certain region on the shaping surface CS during the layer formation, there is a possibility of unevenness in the size of the shaped object. Therefore, as described above, the size of the shaped object (especially the size along the XY plane) can be a characteristic of the shaped object for which the unevenness should be suppressed by the first unevenness suppression action. In this case, the first unevenness suppression action can also be an action for suppressing the unevenness in the size in the direction along the plane including the position in the plane where the structural layer SL is located in any one structural layer SL. Conversely, any characteristic that satisfies the following condition can also be used as a characteristic of the shaped object for which the unevenness should be suppressed by the first unevenness suppression action. The above condition is that if, in the case where shaped objects with the same characteristic should be formed in the regions WA1 and WA2, a series of shaping processes are performed without distinguishing between the regions WA1 and WA2, there is a possibility that the characteristic of the shaped object formed in the region WA1 is inconsistent with the characteristic of the shaped object formed in the region WA2. The same applies to the second to fourth unevenness suppression actions described below.

[0137] The control device 7 can also perform the following first unevenness suppression action: By controlling (for example, adjusting, changing, or setting, the same applies below) the supply amount of the shaping material M supplied to the supply region MA (that is, the irradiation region EA or the melting pool MP) per unit time, the unevenness in the height of the shaped object is suppressed. Hereinafter, for the sake of convenience of explanation, the supply amount of the shaping material M supplied to the supply region MA per unit time is referred to as the "supply rate". In addition, weight or volume can also be used as the unit of the supply amount of the shaping material M. In addition to or instead of controlling the supply rate, the control device 7 can also perform the following first unevenness suppression action: By controlling the heat transferred from the light EL to the shaping surface CS per unit time via the irradiation region EA (that is, the supply region MA), the unevenness in the height of the shaped object is suppressed. Hereinafter, for the sake of convenience of explanation, the heat transferred from the light EL to the shaping surface CS per unit time via the irradiation region EA is referred to as the "heat transfer rate". In addition to or instead of controlling at least one of the supply rate and the heat transfer rate, the control device 7 can also perform the following first unevenness suppression action: By controlling the relative movement speed of the irradiation region EA (that is, the supply region MA or the melting pool MP) with respect to the shaping surface CS, the unevenness in the height of the shaped object is suppressed. Hereinafter, the first unevenness suppression action of controlling the supply rate, the first unevenness suppression action of controlling the heat transfer rate, and the first unevenness suppression action of controlling the movement speed of the irradiation region EA will be described in sequence.

[0138] (3-1-1) First non-uniformity suppression operation for controlling the supply rate of the molding material M

[0139] First, with reference to ​ (a) to ​ (c), the first non-uniformity suppression operation for controlling the supply rate of the molding material M will be described. In addition, for the sake of simplicity of explanation, ​ (a) to ​ (c) respectively show the control method of the supply rate of the molding material M when the irradiation area EA is set twice in the area WA1 during the layer formation period.

[0140] ​ (a) to ​ (c) are graphs with the horizontal axis representing time and the vertical axis representing the supply rate of the molding material M. As time passes, the irradiation area EA moves on the molding surface CS, so ​ (a) to ​ (c)'s horizontal axis substantially corresponds to the position where the irradiation area EA is set on the molding surface. That is, ​ (a) to ​ (c) respectively represent the supply rate of the molding material M to a certain area portion on the molding surface CS during the period when the irradiation area EA is set in that area portion.

[0141] As ​ (a) shows, the control device 7 can also control the supply rate in the following manner: (i) the supply rate to the area WA1 during the first setting of the irradiation area EA in the area WA1 becomes the same as the supply rate to the area WA2, and (ii) the supply rate to the area WA1 during the second setting of the irradiation area EA in the area WA1 becomes zero. In other words, the control device 7 can also control the supply rate in the following manner: (i) the supply rate to the area WA1 where the irradiation area EA is first set becomes the same as the supply rate to the area WA2, and (ii) the supply rate to the area WA1 where the irradiation area EA is set again becomes zero. In addition, the control device 7 can also control the supply rate in such a way that the supply rate to the area WA1 where the irradiation area EA is set again is lower than the supply rate to the area WA1 where the irradiation area EA is first set.

[0142] Alternatively, the control device 7 can also control the supply rate in the following manner: (i) the supply rate to the region WA1 during the second setting of the irradiation region EA in the region WA1 becomes the same as the supply rate to the region WA2, and (ii) the supply rate to the region WA1 during the first setting of the irradiation region EA in the region WA1 becomes zero. That is, the control device 7 can also control the supply rate in the following manner: (i) the supply rate to the region WA1 where the irradiation region EA is set at a certain moment becomes the same as the supply rate to the region WA2, and (ii) the supply rate to the region WA1 where the irradiation region EA is set at other moments becomes zero. The same applies when the irradiation region EA is set two or more times in the region WA1 during the layer formation period. The control device 7 can control the supply rate in the following manner: (i) the supply rate to the region WA1 where the irradiation region EA is set at a certain moment becomes the same as the supply rate to the region WA2, and (ii) the supply rate to the region WA1 where the irradiation region EA is set at other moments becomes zero. In addition, the control device 7 can also control the supply rate in the following manner: the supply rate to the region WA1 where the irradiation region EA is set at a certain moment becomes the same as the supply rate to the region WA2, and the supply rate to the region WA1 where the irradiation region EA is set at other moments is lower than the supply rate to the region WA2.

[0143] As a result of controlling the supply rate in the above-described manner, the total amount of the modeling material M supplied to the area WA1 during the layer formation period and the total amount of the modeling material M supplied to the area WA2 during the layer formation period become the same. More specifically, the total amount of the modeling material M supplied to the area WA1 of a certain size during the layer formation period and the total amount of the modeling material M supplied to the area WA2 of the same size during the layer formation period become the same. That is, the value obtained by dividing the total amount of the modeling material M supplied to the area WA1 during the layer formation period by the area of the area WA1 (i.e., the supply amount of the modeling material M per unit area) and the value obtained by dividing the total amount of the modeling material M supplied to the area WA2 during the layer formation period by the area of the area WA2 become the same. Therefore, in the areas WA1 and WA2, the same amount of the modeling material M is supplied, melted, and re-solidified per unit area. As a result, the unevenness between the height h1 of the modeled object S1 formed in the area WA1 and the height h2 of the modeled object S2 formed in the area WA2 is suppressed. That is, the difference between the height h1 of the modeled object S1 and the height h2 of the modeled object S2 becomes smaller as compared with the case where the supply rate of the modeling material M is not controlled. Typically, the height h1 of the modeled object S1 and the height h2 of the modeled object S2 are the same. As a result, the formation accuracy of the three-dimensional structure ST formed as an aggregate of the modeled objects is improved. In addition, when the relationship between the supply rate and the total amount of the modeling material M supplied to each of the areas WA1 and WA2 during the layer formation period is non-linear, it is only necessary to control the supply rate in consideration of this non-linear relationship. Further, when the relationship between the supply rate and the heights h1 and h2 of the modeled objects is non-linear, it is only necessary to control the supply rate in consideration of this non-linear relationship.

[0144] Alternatively, as shown in ​ (b) and ​ (c), the control device 7 may also control the supply rate in such a manner that the modeling material M is supplied to the area WA1 each time the irradiation area EA is set in the area WA1 (i.e., in such a manner that the supply rate to the area WA1 does not become zero). In this case, the control device 7 controls the supply rate in the following manner: the supply rate to the area WA1 during the period when the irradiation area EA is first set in the area WA1 and the supply rate to the area WA1 during the period when the irradiation area EA is second set in the area WA1 are both less than the supply rate to the area WA2. In addition, as shown in ​ (b), the control device 7 may control the supply rate in such a manner that the supply rate to the area WA1 during the period when the irradiation area EA is first set in the area WA1 and the supply rate to the area WA1 during the period when the irradiation area EA is second set in the area WA1 are different. Alternatively, the control device 7 may also, as shown in ​As shown in (c), the supply rate is controlled such that the supply rate to the region WA1 during the first setting of the irradiation region EA in the region WA1 and the supply rate to the region WA1 during the second setting of the irradiation region EA in the region WA1 are the same. In the case where the supply rate is controlled as shown in ​ (b) or ​ (c), compared with the case where the supply rate to the region WA1 and the supply rate to the region WA2 are always the same, the difference between the total amount of the modeling material M supplied to the region WA1 during the layer formation period and the total amount of the modeling material M supplied to the region WA2 during the layer formation period is reduced. As a result, the unevenness between the height h1 of the modeled object S1 formed in the region WA1 and the height h2 of the modeled object S2 formed in the region WA2 is suppressed.

[0145] In the case where the supply rate is controlled by supplying the modeling material M to the region WA1 each time the irradiation region EA is set in the region WA1, the control device 7 can also control the supply rate to the region WA1 during the first setting of the irradiation region EA in the region WA1 and the supply rate to the region WA1 during the second setting of the irradiation region EA in the region WA1 such that the total amount of the modeling material M supplied to the region WA1 during the layer formation period and the total amount of the modeling material M supplied to the region WA2 during the layer formation period are the same. As a result, similar to the case where the supply rate is controlled as shown in ​ (a), the total amount of the modeling material M supplied to the region WA1 during the layer formation period and the total amount of the modeling material M supplied to the region WA2 during the layer formation period are the same. The unevenness between the height h1 of the modeled object S1 formed in the region WA1 and the height h2 of the modeled object S2 formed in the region WA2 is more appropriately suppressed. In addition, when the relationship between the supply rate and the total amount of the modeling material M supplied to each of the regions WA1 and WA2 during the layer formation period is non-linear, it is only necessary to control the supply rate in consideration of this non-linear relationship. Also, when the relationship between the supply rate and the heights h1 and h2 of the modeled objects is non-linear, it is only necessary to control the supply rate in consideration of this non-linear relationship.

[0146] In addition, the same applies when the irradiation area EA is set two or more times in the area WA1 during layer formation. The control device 7 can also control the supply rate in such a way that the supply rate to the area WA1 during each period in which the irradiation area EA is set in the area WA1 is less than the supply rate to the area WA2. Furthermore, the control device 7 can also control the supply rate to the area WA1 during each period in which the irradiation area EA is set in the area WA1 in such a way that the total amount of the modeling material M supplied to the area WA1 during the layer formation period and the total amount of the modeling material M supplied to the area WA2 during the layer formation period are the same. In addition, the supply rate can also be controlled in such a way that the total amount of the modeling material M supplied to the area WA1 during the layer formation period and the total amount of the modeling material M supplied to the area WA2 during the layer formation period are different.

[0147] Subsequently, with reference to ​ , a specific method for controlling the supply rate of the modeling material M will be described.

[0148] In order to control the supply rate, the control device 7 can also control the supply amount per unit time (i.e., the ejection amount) of the modeling material M from the material nozzle 412. Specifically, as ​ shows, the more the supply amount per unit time of the modeling material M from the material nozzle 412, the greater the supply rate. Therefore, the control device 7 can control the supply rate by controlling the supply amount per unit time of the modeling material M from the material nozzle 412. To control the supply amount per unit time of the modeling material M from the material nozzle 412, the control device 7 can also control the material supply device 3 to control the supply amount per unit time of the modeling material M from the material supply device 3 to the material nozzle 412. Alternatively, to control the supply amount per unit time of the modeling material M from the material nozzle 412, the control device 7 can also control the material nozzle 412. For example, when the material nozzle 412 is provided with a valve in the supply path of the modeling material M disposed in the material nozzle 412, the control device 7 can also control the valve to control the supply amount per unit time of the modeling material M from the material nozzle 412.

[0149] The control device 7 can also be as ​ (a) and ​As shown in (b), in order to control the supply rate, the gas ejection device 461 provided in the modeling device 4 is controlled. The gas ejection device 461 is used to blow away at least a part of the modeling material M supplied by the material nozzle 412 before it reaches the supply area MA (that is, the irradiation area EA or the molten pool MP). Specifically, the gas ejection device 461 ejects an inert gas to at least a part of the supply path of the modeling material M between the material nozzle 412 and the supply area MA. In addition, the gas ejection device 461 can also eject the inert gas along a direction intersecting with the direction of the supply path of the modeling material M between the material nozzle 412 and the supply area MA. The inert gas ejected by the gas ejection device 461 is supplied to the gas ejection device 461 from the gas supply device 6, for example. When the gas ejection device 461 ejects the inert gas, as ​ shown in (a), at least a part of the modeling material M supplied by the material nozzle 412 is blown away in a manner of leaving the supply area MA before reaching the supply area MA. That is, at least a part of the modeling material M supplied by the material nozzle 412 does not reach the supply area MA. On the other hand, when the gas ejection device 461 does not eject the inert gas, as ​ shown in (b), the modeling material M supplied by the material nozzle 412 is not blown away in a manner of leaving the supply area MA. That is, the modeling material M supplied by the material nozzle 412 reaches the supply area MA. As a result, when the gas ejection device 461 ejects the inert gas, compared with the case where the gas ejection device 461 does not eject the inert gas, the supply amount of the modeling material M per unit time to the supply area MA decreases. That is, when the gas ejection device 461 ejects the inert gas, compared with the case where the gas ejection device 461 does not eject the inert gas, the supply rate decreases. Therefore, the control device 7 can control the supply rate by controlling the gas ejection device 461.

[0150] The control device 7 can also be as ​ shown in (a) and ​ shown in (b), in order to control the supply rate, the shielding member 462 is controlled. The shielding member 462 is arranged in the modeling device 4 in a manner that can be inserted and removed on the supply path of the modeling material M between the material nozzle 412 and the supply area MA. Specifically, the shielding member 462 can be moved relative to the supply path of the modeling material M by a drive system (such as an actuator, etc.) not shown. In addition, the shielding member 462 can also be moved along a direction intersecting with the direction of the supply path of the modeling material M between the material nozzle 412 and the supply area MA. As the shielding member 462 moves, the state of the shielding member 462 can be in a non-shielding state where the shielding member 462 does not block the supply path of the modeling material M (refer to ​ (a)), and a shielding state where the shielding member 462 blocks the supply path of the modeling material M (refer to ​(b)). When the shielding member 462 is in the non-shielding state, as ​ (a) shows, the molding material M supplied by the material nozzle 412 is not blocked by the shielding member 462 and reaches the supply area MA. On the other hand, when the shielding member 462 is in the shielding state, as ​ (b) shows, at least a part of the molding material M supplied by the material nozzle 412 is blocked by the shielding member 462 before reaching the supply area MA. That is, at least a part of the molding material M supplied by the material nozzle 412 does not reach the supply area MA. As a result, when the shielding member 462 is in the shielding state, compared with the case where the shielding member 462 is in the non-shielding state, the supply amount of the molding material M per unit time to the supply area MA decreases. That is, when the shielding member 462 is in the shielding state, compared with the case where the shielding member 462 is in the non-shielding state, the supply rate decreases. Therefore, the control device 7 can control the supply rate of the molding material M by controlling the shielding member 462. In addition, the state of the shielding member 462 can also be a semi-shielding state in which the shielding member 462 blocks a part of the supply path of the molding material M. Also, the state of the shielding member 462 can be controlled in such a way that the molding material M is intermittently supplied to one supply area MA. In this case, the ratio (duty ratio) of the non-shielding state to the shielding state can also be controlled to control the supply amount of the molding material M per unit time to the one supply area MA. At this time, the respective times of the non-shielding state and the shielding state can also be shorter than the unit time.

[0151] In addition, both the gas ejection device 461 and the shielding member 462 can be referred to as supply amount changing devices for suppressing at least a part of the molding material M supplied by the material nozzle 412 from reaching the supply area MA. Therefore, when the molding device 4 is provided with any supply amount changing device different from the gas ejection device 461 and the shielding member 462, the control device 7 can also control any supply amount changing device in order to control the supply rate of the molding material M. In addition, any supply amount changing device can be provided on at least one of the material supply device 3 and the supply path from the material supply device 3 to the supply outlet 414 of the material nozzle 412. Such a supply amount changing device can also use, for example, a valve that can change the flow rate. Also, such a valve that can change the flow rate can be provided on at least one of the inside of the material supply device 3 and the supply path. Such a valve can use, for example, a butterfly valve, a gate valve, a globe valve, a ball valve, etc.

[0152] The control device 7 can also control the supply direction (i.e., the ejection direction) of the molding material M from the material nozzle 412 in order to control the supply rate. Specifically, as ​ (a) and ​As shown in Fig. (b), the control device 7 can also control the supply direction of the modeling material M from the material nozzle 412 by controlling the orientation of the material nozzle 412 with respect to the modeling surface CS. The orientation of the material nozzle 412 can be controlled by moving the material nozzle 412 using the drive system 42. However, in this case, the drive system 42 moves the irradiation optical system 411 and the material nozzle 412 separately. Along with the control of the orientation of the material nozzle 412, the state of the material nozzle 412 can be in a supply state (refer to ​ (a)) in which the modeling material M can be supplied to the supply area MA (i.e., the irradiation area EA or the molten pool MP), and a non-supply state (refer to ​ (b)) in which the modeling material M cannot be supplied to the supply area MA (i.e., the irradiation area EA or the molten pool MP). When the material nozzle 412 is in the supply state, as shown in ​ (a), the modeling material M supplied from the material nozzle 412 reaches the supply area MA. On the other hand, when the material nozzle 412 is in the non-supply state, as shown in ​ (b), the modeling material M supplied from the material nozzle 412 does not reach the supply area MA. Therefore, the longer the period during which the material nozzle 412 is in the non-supply state, the smaller the supply amount of the modeling material M to the supply area MA per unit time. That is, the longer the period during which the material nozzle 412 is in the non-supply state, the smaller the supply rate of the modeling material M. Therefore, the control device 7 can control the supply rate of the modeling material M by controlling the supply direction of the modeling material M. In addition, the state of the material nozzle 412 can also be a semi-supply state in which the modeling material M can be supplied to a part of the supply area MA (i.e., the irradiation area EA or the molten pool MP). In this case, the supply rate of the modeling material M can also be controlled by changing the area of the above-mentioned part from which the modeling material is supplied from the material nozzle 412.

[0153] (3-1-2) First non-uniformity suppression operation for controlling the heat transfer rate

[0154] Next, with reference to ​ (a) to ​ (c), the first non-uniformity suppression operation for controlling the heat transfer rate will be described. In addition, for the sake of simplicity of explanation, ​ (a) to ​ (c) respectively show the control method of the supply rate of the modeling material M when the irradiation area EA is set twice in the area WA1 during the layer formation period.

[0155] ​ (a) to ​ (c) are graphs with the horizontal axis representing time and the vertical axis representing the heat transfer rate. As time passes, the irradiation area EA moves on the modeling surface CS, so ​(a) to ​ The horizontal axis of (c) is the same as that of the above ​ (a) to ​ (c), and corresponds to the position where the irradiation area EA is set on the shaping surface CS.

[0156] As ​ As shown in (a), the control device 7 can also control the heat transfer rate in the following manner: (i) the heat transfer rate to the area WA1 during the first setting of the irradiation area EA in the area WA1 becomes the same as the heat transfer rate to the area WA2, and (ii) the heat transfer rate to the area WA1 during the second setting of the irradiation area EA in the area WA1 becomes zero. In other words, the control device 7 can also control the heat transfer rate in the following manner: (i) the heat transfer rate to the area WA1 where the irradiation area EA is initially set becomes the same as the heat transfer rate to the area WA2, and (ii) the heat transfer rate to the area WA1 where the irradiation area EA is set again becomes zero. In addition, the state where the heat transfer rate becomes zero is equivalent to the state where the light EL is not irradiated. Therefore, the control device 7 can also control the shaping device 4 in the following manner: (i) for the area WA1 where the irradiation area EA is initially set, irradiate the light EL in the same manner as the area WA2, and (ii) do not irradiate the light EL to the area WA1 where the irradiation area EA is set again. In addition, the control device 7 can also control the heat transfer rate in such a way that the heat transfer rate to the area WA1 where the irradiation area is set for the second time is lower than the heat transfer rate to the area WA1 where the irradiation area is set for the first time. Also, the control device 7 can also control in such a way that the intensity or energy per unit time of the light EL in the area WA1 where the irradiation area is set for the second time is lower than the intensity or energy per unit time of the light EL in the area WA1 where the irradiation area is set for the first time.

[0157] Alternatively, the control device 7 can also control the heat transfer rate in the following manner: (i) the heat transfer rate to the region WA1 during the period when the irradiation region EA is set for the second time in the region WA1 becomes the same as the heat transfer rate to the region WA2, and (ii) the heat transfer rate to the region WA1 during the period when the irradiation region EA is set for the first time in the region WA1 becomes zero. That is, the control device 7 can also control the heat transfer rate in the following manner: (i) the heat transfer rate to the region WA1 where the irradiation region EA is set at a certain moment becomes the same as the heat transfer rate to the region WA2, and (ii) the heat transfer rate to the region WA1 where the irradiation region EA is set at other moments becomes zero. The same applies when the irradiation region EA is set two or more times in the region WA1 during the layer formation period. The control device 7 can also control the heat transfer rate in the following manner: (i) the heat transfer rate to the region WA1 where the irradiation region EA is set at a certain moment becomes the same as the heat transfer rate to the region WA2, and (ii) the heat transfer rate to the region WA1 where the irradiation region EA is set at other moments becomes zero. In addition, the control device 7 can also control the heat transfer rate in such a way that the heat transfer rate to the region WA1 where the irradiation region is set for the first time is lower than the heat transfer rate to the region WA1 where the irradiation region is set for the second time. Also, the control device 7 can also control in such a way that the intensity or energy per unit time of the light EL in the region WA1 where the irradiation region is set for the first time is lower than the intensity or energy per unit time of the light EL in the region WA1 where the irradiation region is set for the second time. Also, the control device 7 can also control the heat transfer rate in the following manner: the heat transfer rate to the region WA1 where the irradiation region EA is set at a certain moment becomes the same as the heat transfer rate to the region WA2, and the heat transfer rate to the region WA1 where the irradiation region EA is set at other moments is lower than the heat transfer rate to the region WA2.

[0158] As a result of controlling the heat transfer rate in the above-described manner, the total amount of heat transferred from the optical EL to the region WA1 during the layer formation period and the total amount of heat transferred from the optical EL to the region WA2 during the layer formation period become the same. More specifically, the total amount of heat transferred from the optical EL to the region WA1 of a certain size during the layer formation period and the total amount of heat transferred from the optical EL to the region WA2 of the same size during the layer formation period become the same. That is, the value obtained by dividing the total amount of heat transferred from the optical EL to the region WA1 during the layer formation period by the area of the region WA1 (i.e., the amount of heat transferred from the optical EL per unit area) and the value obtained by dividing the total amount of heat transferred from the optical EL to the region WA2 during the layer formation period by the area of the region WA2 become the same. Therefore, in the regions WA1 and WA2, the same amount of the modeling material M is supplied, melted, and re-solidified per unit area. The reason is that the more heat is transferred from the optical EL, the more likely it is that a larger amount of the modeling material M will melt. Since the total amount of heat transferred from the optical EL to the region WA1 is the same as the total amount of heat transferred from the optical EL to the region WA2, the melting amount of the modeling material M in the region WA1 (specifically, the melting amount per unit area, the same applies hereinafter) and the melting amount of the modeling material M in the region WA2 are relatively likely to be the same. As a result, similar to the case of controlling the supply rate described above, the unevenness between the height h1 of the modeled object S1 formed in the region WA1 and the height h2 of the modeled object S2 formed in the region WA2 is suppressed. As a result, the formation accuracy of the three-dimensional structure ST, which is an aggregate of the modeled objects, is improved. In addition, when the relationship between the heat transfer rate and the heights h1 and h2 of the modeled objects is non-linear, it is only necessary to control the heat transfer rate while considering this non-linear relationship.

[0159] In the case of controlling the heat transfer rate, further, a molten pool MP having the same size as that in the region WA2 is formed in the region WA1. The reason is that the more heat is transferred from the light EL, the higher the possibility of forming a larger molten pool MP. The total amount of heat transferred from the light EL to the region WA1 is the same as the total amount of heat transferred from the light EL to the region WA2. Therefore, the possibility that the size of the molten pool MP formed in the region WA1 is the same as the size of the molten pool MP formed in the region WA2 is relatively high. As a result, similar to the case of controlling the supply rate described above, the unevenness in the height h1 of the shaped object S1 formed in the region WA1 and the height h2 of the shaped object S2 formed in the region WA2 is suppressed. The reason is that there is a possibility that the larger the molten pool MP, the larger the width (the dimension in the direction along the shaping surface CS) of the shaping material M that is melted and then solidified in the molten pool MP. Therefore, assuming that the same amount of the shaping material M is supplied to a relatively large molten pool MP and a relatively small molten pool MP, there is a possibility that in the portion where the relatively large molten pool MP is formed, a relatively low shaped object is formed due to the relatively larger width, while in the portion where the relatively small molten pool MP is formed, a relatively high shaped object is formed due to the relatively smaller width. However, in the present embodiment, since the size of the molten pool MP formed in the region WA1 is the same as the size of the molten pool MP formed in the region WA2, the unevenness in the height h1 of the shaped object S1 formed in the region WA1 and the height h2 of the shaped object S2 formed in the region WA2 is suppressed. As a result, the formation accuracy of the three-dimensional structure ST, which is an aggregate of the shaped objects, is improved.

[0160] Alternatively, as ​ (b) and ​ (c) show, the control device 7 may also control the heat transfer rate by irradiating the region WA1 with the light EL each time the irradiation region EA is set in the region WA1 (that is, in such a manner that the heat transfer rate to the region WA1 does not become zero). In this case, the control device 7 controls the supply rate of the shaping material M in such a manner that both the heat transfer rate to the region WA1 during the period when the irradiation region EA is first set in the region WA1 and the heat transfer rate to the region WA1 during the period when the irradiation region EA is second set in the region WA1 are less than the heat transfer rate to the region WA2. In addition, the control device 7 may also, as ​ (b) shows, control the heat transfer rate in such a manner that the heat transfer rate to the region WA1 during the period when the irradiation region EA is first set in the region WA1 is different from the heat transfer rate to the region WA1 during the period when the irradiation region EA is second set in the region WA1. Alternatively, the control device 7 may also, as ​As shown in (c), the heat transfer rate is controlled in such a way that the heat transfer rate to the region WA1 during the first setting of the irradiation region EA in the region WA1 and the heat transfer rate to the region WA1 during the second setting of the irradiation region EA in the region WA1 are the same. In the case where the heat transfer rate is controlled as shown in ​ (b) or ​ (c), compared with the case where the heat transfer rate to the region WA1 and the heat transfer rate to the region WA2 are always the same, the difference between the total amount of heat transferred to the region WA1 during the layer formation period and the total amount of heat transferred to the region WA2 during the layer formation period is reduced. As a result, the unevenness between the height h1 of the shaped object S1 formed in the region WA1 and the height h2 of the shaped object S2 formed in the region WA2 is suppressed. In addition, when the relationship between the heat transfer rate and the heights h1, h2 of the shaped objects is non-linear, it is only necessary to control the heat transfer rate in consideration of this non-linear relationship.

[0161] When the control device 7 controls the heat transfer rate by irradiating the region WA1 with the light EL each time the irradiation region EA is set in the region WA1, it is also possible to control the heat transfer rate to the region WA1 during the first setting of the irradiation region EA in the region WA1 and the heat transfer rate to the region WA1 during the second setting of the irradiation region EA in the region WA1 in such a way that the total amount of heat transferred to the region WA1 during the layer formation period and the total amount of heat transferred to the region WA2 during the layer formation period are the same. As a result, similar to the case where the heat transfer rate is controlled as shown in ​ (a), the total amount of heat transferred to the region WA1 during the layer formation period and the total amount of heat transferred to the region WA2 during the layer formation period are the same. As a result, the unevenness between the height h1 of the shaped object S1 formed in the region WA1 and the height h2 of the shaped object S2 formed in the region WA2 is more appropriately suppressed.

[0162] In addition, the same applies to the case where the irradiation region EA is set two or more times in the region WA1 during the layer formation period. The control device 7 can control the heat transfer rate in such a way that the heat transfer rate to the region WA1 during each period in which the irradiation region EA is set in the region WA1 is less than the heat transfer rate to the region WA2. Furthermore, the control device 7 can also control the heat transfer rate to the region WA1 during each period in which the irradiation region EA is set in the region WA1 in such a way that the total amount of heat transferred to the region WA1 during the layer formation period and the total amount of heat transferred to the region WA2 during the layer formation period are the same.

[0163] Subsequently, with reference to ​ , a specific method for controlling the heat transfer rate will be described.

[0164] In order to control the heat transfer rate, the control device 7 can also control the intensity or the amount of energy per unit area of the light EL on the irradiation area EA. Specifically, as ​ shown, the greater the intensity or the amount of energy per unit area of the light EL on the irradiation area EA, the greater the heat transfer rate. Therefore, the control device 7 can control the heat transfer rate by controlling the intensity or the amount of energy per unit area of the light EL on the irradiation area EA.

[0165] To control the intensity per unit area of the light EL on the irradiation area EA, the control device 7 can also control the light source 5. For example, the control device 7 can also control the intensity of the light EL emitted by the light source 5. When the light EL is pulsed light, the longer the emission time of the pulsed light (in other words, the shorter the extinction time of the pulsed light), the greater the intensity per unit area of the light EL on the irradiation area EA. Therefore, when the light EL is pulsed light, for example, the control device 7 can also control the duty ratio of the light EL emitted by the light source 5.

[0166] To control the intensity or the amount of energy per unit area of the light EL on the irradiation area EA, the control device 7 can also control the irradiation optical system 411. For example, the control device 7 can also control the intensity or the amount of energy of the light EL emitted by the irradiation optical system 411. In this case, the irradiation optical system 411 can also include optical components for adjusting the intensity or the amount of energy of the light EL within the irradiation optical system 411.

[0167] To control the intensity or the amount of energy per unit area of the light EL on the irradiation area EA, the control device 7 can also, as ​ (a) and ​ (b) show, control the light shielding member 471, which is arranged in the shaping device 4 in such a way that it can be inserted and removed on the optical path of the light EL between the irradiation optical system 411 and the irradiation area EA. Specifically, the light shielding member 471 can be moved relative to the optical path of the light EL by a drive system (such as an actuator, etc.) not shown. As the light shielding member 471 moves, the state of the light shielding member 471 can be switched between a light shielding state that blocks the optical path of the light EL (see ​ (a)) and a non-light shielding state that does not block the optical path of the light EL (see ​ (b)). When the light shielding member 471 is in the light shielding state, as ​As shown in (a), the light EL emitted from the irradiation optical system 411 is blocked by the light-shielding member 471. When the light-shielding member 471 is formed of a material through which the light EL cannot pass, the light EL does not reach the irradiation area EA. When the light-shielding member 471 is formed of a material through which a part of the light EL can pass, a part of the light EL does not reach the irradiation area EA. That is, the light EL whose intensity has been attenuated by the light-shielding member 471 is irradiated onto the irradiation area EA. On the other hand, when the light-shielding member 471 is in a non-light-shielding state, as ​ shown in (b), the light EL emitted from the irradiation optical system 411 is not blocked by the light-shielding member 471 and reaches the irradiation area EA. As a result, when the light-shielding member 471 is in a light-shielding state, compared with the case where the light-shielding member 471 is in a non-light-shielding state, the intensity per unit area of the light EL on the irradiation area EA decreases. In addition, the light-shielding member 471 can also be controlled by the control device 7 in such a way that it becomes a semi-light-shielding state that shields a part of the light EL emitted from the irradiation optical system 411. In addition, the control device 7 can also control the ratio of the period during which the light-shielding member 471 is in a light-shielding state to the period during which the light-shielding member 471 is in a non-light-shielding state. The longer the period during which the light-shielding member 471 is in a light-shielding state (in other words, the shorter the period during which the light-shielding member 471 is in a non-light-shielding state), the smaller the intensity per unit area of the light EL on the irradiation area EA. Also, the light-shielding member 471 can be provided inside the irradiation optical system 411 or on the optical path between the light source 5 and the irradiation optical system 411.

[0168] In order to control the heat transfer rate, the control device 7 can also control the focusing position of the light EL (in other words, the defocus amount). Specifically, the farther the focusing position is from the shaping surface CS (that is, the larger the defocus amount), the smaller the amount of the intensity or energy per unit area of the light EL on the irradiation area EA set on the shaping surface CS. Therefore, the farther the focusing position is from the shaping surface CS (that is, the larger the defocus amount), the smaller the heat transfer rate. Therefore, the control device 7 can control the heat transfer rate by controlling the focusing position. To control the focusing position, as ​ (a) and ​ (b) shown, the control device 7 can also control the condenser optical element 472 included in the irradiation optical system 411. In addition, ​ (a) shows a state in which the intensity or energy amount per unit area of the light EL on the irradiation area EA is relatively large because the focusing position is set on the shaping surface CS. On the other hand, ​(b) shows a state where, since the focusing position is set at a position separated from the shaping surface CS, the amount of intensity or energy per unit area of the light EL on the irradiation area EA is relatively small. Alternatively, in order to control the focusing position, the control device 7 can also control the drive system 42. Specifically, the control device 7 can also control the relative position between the shaping surface CS and the focusing position by moving the shaping head 41 (especially the irradiation optical system 411) along the Z-axis relative to the shaping surface CS. As described above, when the shaping device 4 includes a drive system for moving the platform 43, the control device 7 can also control the relative position between the shaping surface CS and the focusing position by moving the platform 43 (i.e., the shaping surface CS) along the Z-axis relative to the shaping head 41. In addition, the relative position between the shaping surface CS and the focusing position can also be controlled by moving a part of the optical members constituting the irradiation optical system 411.

[0169] In order to control the heat transfer rate, the control device 7 can also control the intensity distribution or the amount distribution of the energy of the light EL in the irradiation area EA. In addition, the control of the amount of intensity or energy per unit area of the light EL in the irradiation area EA and the control of the focusing position are a specific example of the control of the intensity distribution of the light EL in the irradiation area EA. In order to control the intensity distribution of the light EL in the irradiation area EA, the control device 7 can also control the optical members provided in the irradiation optical system 411 for adjusting the intensity distribution. As the optical members for adjusting the intensity distribution, at least one of the following can be used: a filter having a required concentration distribution in a plane intersecting the optical path of the light EL, an aspherical optical member (such as a refractive optical member or a reflective optical member) having a required surface shape in a plane intersecting the optical path of the light EL, a diffractive optical element, and a spatial light modulator.

[0170] In order to control the heat transfer rate, the control device 7 can also control at least one of the size, shape, and position of the irradiation area EA on the shaping surface CS. If at least one of the size, shape, and position of the irradiation area EA on the shaping surface CS changes, the intensity distribution or the amount distribution of the energy of the light EL on the shaping surface CS changes. Therefore, the control device 7 can control the heat transfer rate by controlling at least one of the size, shape, and position of the irradiation area EA on the shaping surface CS.

[0171] In order to control the heat transfer rate, the control device 7 can also control any characteristic of the light EL related to the intensity of the light EL. In order to control the heat transfer rate, the control device 7 can also control any characteristic of the light EL related to the heat transfer rate. As an example of any such characteristic of the light EL, at least one of the size, shape, and position of the irradiation area EA on the shaping surface CS can be cited. The reason is that if at least one of the size, shape, and position of the irradiation area EA on the shaping surface CS changes, the intensity distribution of the light EL on the shaping surface CS changes. Also, as an example of an arbitrary characteristic, it can also be the wavelength of the light EL directed towards the shaping surface CS. If the wavelength of the light EL is different, the absorption rate of light in the shaping material M is different, so the amount of heat transferred from the light EL to the shaping surface CS per unit time, that is, the heat transfer rate, changes. In addition, as described above, in the shaping process after the second time, it is also considered to form a molten pool on the shaped object of the shaping material M. In this case, there is a possibility that the absorption rates of the light EL of the shaping surface CS and the shaping material M are different from the light EL. For example, when the material forming the shaping surface CS is different from the shaping material M, there is a possibility that the absorption rates of the light EL of the shaping surface CS and the shaping material M are different from the light EL. In such a case, it is also possible to control the heat transfer rate by considering the absorption rate of the light EL of the part irradiated by the light EL, etc.

[0172] (3-1-3) First unevenness suppression operation for controlling the moving speed of the irradiation area EA

[0173] Next, with reference to ​ (a) and ​ (b), the first unevenness suppression operation for controlling the moving speed of the irradiation area EA will be described. In addition, for the sake of simplicity of explanation, ​ (a) and ​ (b) respectively show the control method of the moving speed of the irradiation area EA when the irradiation area EA is set twice in the area WA1 during the layer formation period.

[0174] ​ (a) and ​ (b) are graphs with the horizontal axis representing time and the vertical axis representing the moving speed of the irradiation area EA. As time passes, the irradiation area EA moves on the shaping surface CS, so ​ (a) and ​ (b)'s horizontal axis is the same as the horizontal axis of the above ​ (a) to ​ (c) and corresponds to the position on the shaping surface CS where the irradiation area EA is set.

[0175] As ​ (a) to ​(As shown in (b), the control device 7 controls the moving speed of the irradiation area EA in such a way that both the moving speed of the irradiation area EA during the first setting of the irradiation area EA in the area WA1 and the moving speed of the irradiation area EA during the second setting of the irradiation area EA in the area WA1 are faster than the moving speed of the irradiation area EA during the period when the irradiation area EA is set in the area WA2. In addition, the control device 7 can also be as ​ (a) shows, control the moving speed of the irradiation area EA in such a way that the moving speed of the irradiation area EA during the first setting of the irradiation area EA in the area WA1 is different from the moving speed of the irradiation area EA during the second setting of the irradiation area EA in the area WA1. Or, the control device 7 can also be as ​ (b) shows, control the moving speed of the irradiation area EA in such a way that the moving speed of the irradiation area EA during the first setting of the irradiation area EA in the area WA1 is the same as the moving speed of the irradiation area EA during the second setting of the irradiation area EA in the area WA1.

[0176] Here, the faster the moving speed of the irradiation area EA, the shorter the time for setting the irradiation area EA in a certain area part on the shaping surface CS. The shorter the time for setting the irradiation area EA in a certain area part on the shaping surface CS, the less heat transferred from the light EL to that area part. The less heat transferred from the light EL to a certain area part on the shaping surface CS, the less the melting amount of the shaping material M in that area part. Furthermore, the faster the moving speed of the irradiation area EA, the faster the moving speed of the supply area MA set at the same position as the irradiation area EA. The faster the moving speed of the supply area MA, the shorter the time for setting the supply area MA in a certain area part on the shaping surface CS. The shorter the time for setting the supply area MA in a certain area part on the shaping surface CS, the less the supply amount of the shaping material M to that area part. The less the supply amount of the shaping material M to a certain area part on the shaping surface CS, the less the melting amount of the shaping material M in that area part. Therefore, if as ​ (a) or ​(b), the moving speed of the irradiation area EA is controlled, and compared with the case where the moving speed of the irradiation area EA is constant all the time, the difference between the total amount of the molding material M melted in the area WA1 during the layer formation period and the total amount of the molding material M melted in the area WA2 during the layer formation period is reduced. More specifically, the difference between the total amount of the molding material M melted in an area WA1 of a certain size during the layer formation period and the total amount of the molding material M melted in an area WA2 of the same size during the layer formation period is reduced. That is, the difference between the value obtained by dividing the total amount of the molding material M melted in the area WA1 during the layer formation period by the area of the area WA1 (i.e., the melting amount of the molding material M per unit area) and the value obtained by dividing the total amount of the molding material M melted in the area WA2 during the layer formation period by the area of the area WA2 is reduced. As a result, the unevenness between the height h1 of the molded object S1 formed in the area WA1 and the height h2 of the molded object S2 formed in the area WA2 is suppressed.

[0177] The control device 7 can also control the moving speed of the irradiation area EA in such a way that the total amount of the molding material M melted in the area WA1 during the layer formation period and the total amount of the molding material M melted in the area WA2 during the layer formation period become the same. For example, in the case where a series of N molding processes (where N is an integer of 2 or more) are performed by setting the irradiation area EA N times in the area WA1, the control device 7 can also control the moving speed of the irradiation area EA in such a way that the moving speed of the irradiation area EA in each period when the irradiation area EA is set in the area WA1 becomes N times the moving speed of the irradiation area EA in the period when the irradiation area EA is set in the area WA2. Or, for example, in the case where a series of N molding processes are performed by setting the irradiation area EA N times in the area WA1, the control device 7 can also control the moving speed of the irradiation area EA in such a way that the average value of the moving speeds of the irradiation area EA in each period when the irradiation area EA is set in the area WA1 becomes the same as the moving speed of the irradiation area EA in the period when the irradiation area EA is set in the area WA2. As a result, the unevenness between the height h1 of the molded object S1 formed in the area WA1 and the height h2 of the molded object S2 formed in the area WA2 is more appropriately suppressed. In addition, when the relationship between the moving speed of the irradiation area EA and the heights h1, h2 of the molded objects is non-linear, it is only necessary to control the moving speed in consideration of this non-linear relationship.

[0178] In order to control the moving speed of the irradiation area EA, the control device 7 can also control the drive system 42. That is, the control device 7 can also control the relative moving speed of the irradiation area EA with respect to the shaping surface CS by controlling the moving speed of the shaping head 41 (especially the moving speed in the direction along the XY plane). As described later, when the shaping device 4 is equipped with a drive system for moving the platform 43, the control device 7 can also control the relative moving speed of the irradiation area EA with respect to the shaping surface CS by controlling the moving speed of the platform 43 (especially the moving speed in the direction along the XY plane). As described later, when the irradiation optical system 411 is equipped with an optical member (such as a current scanner, etc.) that can deflect the light EL, the control device 7 can also control the relative moving speed of the irradiation area EA with respect to the shaping surface CS by controlling the optical member that can deflect the light EL.

[0179] (3-2) Second unevenness suppression operation

[0180] Next, the second unevenness suppression operation will be described. When areas with different characteristics related to the heat transferred from the light EL (hereinafter referred to as "heat characteristics") exist on the shaping surface CS, the second unevenness suppression operation is equivalent to an operation for suppressing unevenness in the height of the shaped object, etc. In particular, when areas with different heat characteristics exist on the shaping surface CS due to differences in the relative moving speed of the irradiation area EA (that is, the supply area MA or the molten pool MP) with respect to the shaping surface CS, the second unevenness suppression operation is equivalent to an operation for suppressing unevenness in the height of the shaped object.

[0181] Specifically, as ​ (a) shows, during the layer formation period of forming a certain structural layer SL on the shaping surface CS, as described above, the irradiation area EA moves on the shaping surface CS along a moving trajectory corresponding to the pattern of the structural layer SL on the shaping surface CS. Here, the irradiation area EA does not necessarily move at a constant moving speed along the moving trajectory. That is, there is a possibility that the moving speed of the irradiation area EA changes during the layer formation period. For example, as ​ (a) shows, at a certain point P3 on the shaping surface CS, there is a possibility that the moving direction of the irradiation area EA changes. In this case, as ​ (b) shows, as the irradiation area EA approaches the point P3, the initially constant moving speed of the irradiation area EA gradually decreases. Then, the moving speed of the irradiation area EA becomes the minimum (for example, becomes zero) at the time point when the irradiation area EA reaches the point P3. Then, as the irradiation area EA moves away from the point P3, the moving speed of the irradiation area EA gradually increases. Then, after the moving speed of the irradiation area EA has increased to a certain extent, the irradiation area EA moves at a constant moving speed.

[0182] If the moving speed of the irradiation area EA changes as described above, the time for setting the irradiation area EA in a certain area portion on the shaping surface CS also changes. If the time for setting the irradiation area EA in a certain area portion on the shaping surface CS changes, the amount of heat transferred by the light EL to that area portion also changes. Therefore, when the moving speed of the irradiation area EA changes, areas with different thermal characteristics related to the amount of heat transferred by the light EL exist on the shaping surface CS. More specifically, the slower the moving speed of the irradiation area EA, the longer the time for setting the irradiation area EA in a certain area portion on the shaping surface CS. The longer the time for setting the irradiation area EA in a certain area portion on the shaping surface CS, the more heat is transferred from the light EL to that area portion.

[0183] If the amount of heat transferred from the light EL to a certain area portion on the shaping surface CS changes, there is a possibility that the melting amount of the shaping material M in that area portion changes. If the melting amount of the shaping material M in a certain area portion on the shaping surface CS changes, there is a possibility that the height (or any characteristic such as size) of the shaped object formed by the melted shaping material M in that area portion also changes. More specifically, the more heat is transferred from the light EL to a certain area portion on the shaping surface CS, the more likely it is that the melting amount of the shaping material M in that area portion is greater. In a certain area portion on the shaping surface CS, the greater the melting amount of the shaping material M, the more likely it is that the shaped object formed by the melted shaping material M in that area portion is higher. Therefore, if a series of shaping processes are performed without considering the change in the moving speed of the irradiation area EA in a situation where a shaped object of a certain height should be formed on the shaping surface CS, as ​ (b) shows at the bottom, there is a possibility of forming shaped objects with different heights corresponding to the moving speed of the irradiation area EA. More specifically, the slower the moving speed of the irradiation area EA moving in a certain area portion on the shaping surface CS, the more likely it is that the shaped object formed in that area portion is higher.

[0184] As an example, when the moving speed of the irradiation area EA changes, as ​ (a) and ​ (b) show, it can be said that on the shaping surface CS, there is an area WA3 where the irradiation area EA moves at the first moving speed, and an area WA4 where the irradiation area EA moves at a second moving speed slower than the first moving speed. In this case, if a series of shaping processes are performed without distinguishing between the area WA3 and the area WA4 in a situation where shaped objects of the same height should be formed on the area WA3 and the area WA4, as ​ (b) shows at the bottom, there is a possibility that the height of the shaped object formed in the area WA3 is inconsistent with the height of the shaped object formed in the area WA4. Typically, as​ (As shown in (b)), there is a possibility that the height of the shaped object formed in region WA3 is higher than the height of the shaped object formed in region WA4 corresponding to the degree of more heat transferred from light EL.

[0185] Therefore, in the present embodiment, the control device 7 (in other words, the shaping system 1 under the control of the control device 7) suppresses the unevenness in the height of the shaped objects formed in regions with different thermal characteristics due to the difference in the moving speed of the irradiation region EA by performing the second unevenness suppression operation. For example, the control device 7 suppresses the unevenness in the height of the shaped object formed in region WA3 and the height of the shaped object formed in region WA4 by performing the second unevenness suppression operation.

[0186] The control device 7 can also perform the second unevenness suppression operation for suppressing the unevenness in the height of the shaped object by controlling the supply rate of the shaping material M. Specifically, as ​ shown, the control device 7 can also control the supply rate in such a way that the slower the moving speed of the irradiation region EA, the smaller the supply rate. That is, the control device 7 can also control the supply rate in such a way that the slower the moving speed of the irradiation region EA moving in a certain region portion on the shaping surface CS, the smaller the supply rate to that region portion. As a result, in the case where the shaped object formed in the region portion where the irradiation region EA moves at a relatively slow moving speed becomes relatively high, the supply amount of the shaping material M to that region portion decreases. If the supply amount of the shaping material M decreases, the melting amount of the shaping material M also decreases. Therefore, it is suppressed that the shaped object formed in the region portion where the irradiation region EA moves at a relatively slow moving speed becomes relatively high. As a result, the unevenness in the height of the shaped objects formed in regions with different thermal characteristics due to the difference in the moving speed of the irradiation region EA is suppressed. In addition, when the relationship between the moving speed and the height of the shaped object is non-linear, it is only necessary to control the supply rate in consideration of this non-linear relationship.

[0187] As an example, in the case where the moving speed of the irradiation region EA changes as shown in the chart of the first paragraph in ​ (the same as the upper chart in ​ (b)), the control device 7 can also control the supply rate in such a way that the supply rate changes as shown in the chart of the second paragraph in ​ . That is, the control device 7 can also control the supply rate in such a way that the supply rate to region WA3 where the irradiation region EA moves at a relatively fast first moving speed is greater than the supply rate to region WA4 where the irradiation region EA moves at a relatively slow second moving speed. As a result, as ​As shown in the third paragraph of [], in a region where the thermal characteristics are different due to the difference in the moving speed of the irradiation region EA, a shaped object with a certain height can be formed. That is, the unevenness in the height of the shaped object formed in the region WA3 and the height of the shaped object formed in the region WA4 is suppressed. In addition, ​ In [], a comparison example is shown by a dotted line, where a certain supply rate is maintained regardless of the moving speed of the irradiation region EA and the shaped object formed in this case.

[0188] In addition to or instead of controlling the supply rate, the control device 7 can also perform a second unevenness suppression operation of suppressing the unevenness in the height of the shaped object by controlling the heat transfer rate. Specifically, as ​ shown, the control device 7 can also control the heat transfer rate in such a way that the slower the moving speed of the irradiation region EA, the smaller the heat transfer rate. That is, the control device 7 can also control the heat transfer rate in such a way that the slower the moving speed of the irradiation region EA moving in a certain region part on the shaping surface CS, the smaller the heat transfer rate to this region part. As a result, in a situation where the shaped object formed in the region part where the irradiation region EA moves at a relatively slow moving speed becomes relatively high, the amount of heat transferred from the light EL to this region part decreases. If the amount of heat transferred decreases, the melting amount of the shaping material M also decreases. Therefore, the shaped object formed in the region part where the irradiation region EA moves at a relatively slow moving speed is suppressed from becoming relatively high. As a result, the unevenness in the height of the shaped object formed in the region where the thermal characteristics are different due to the difference in the moving speed of the irradiation region EA is suppressed. In addition, when the relationship between the moving speed and the height of the shaped object is non-linear, it is only necessary to control the heat transfer rate considering this non-linear relationship.

[0189] As an example, in the chart shown in the first paragraph of [] (the same as the upper chart of [] (b)), when the moving speed of the irradiation region EA changes, the control device 7 can also control the heat transfer rate in such a way that the heat transfer rate changes as shown in the second paragraph of []. That is, the control device 7 can also control the heat transfer rate in such a way that the heat transfer rate to the region WA3 where the irradiation region EA moves at a relatively fast first moving speed is greater than the heat transfer rate to the region WA4 where the irradiation region EA moves at a relatively slow second moving speed. As a result, as ​ shown in the first paragraph of [], in a region where the thermal characteristics are different due to the difference in the moving speed of the irradiation region EA, a shaped object with a certain height can be formed. That is, the unevenness in the height of the shaped object formed in the region WA3 and the height of the shaped object formed in the region WA4 is suppressed. In addition, ​ (b) the upper chart of the same), when the moving speed of the irradiation region EA changes, the control device 7 can also control the heat transfer rate in such a way that the heat transfer rate changes as shown in the second paragraph of []. That is, the control device 7 can also control the heat transfer rate in such a way that the heat transfer rate to the region WA3 where the irradiation region EA moves at a relatively fast first moving speed is greater than the heat transfer rate to the region WA4 where the irradiation region EA moves at a relatively slow second moving speed. As a result, as ​ shown in the second paragraph of [], the control device 7 can control the heat transfer rate in such a way that the heat transfer rate changes. That is, the control device 7 can also control the heat transfer rate in such a way that the heat transfer rate to the region WA3 where the irradiation region EA moves at a relatively fast first moving speed is greater than the heat transfer rate to the region WA4 where the irradiation region EA moves at a relatively slow second moving speed. As a result, as ​ shown in the third paragraph of [], in a region where the thermal characteristics are different due to the difference in the moving speed of the irradiation region EA, a shaped object with a certain height can be formed. That is, the unevenness in the height of the shaped object formed in the region WA3 and the height of the shaped object formed in the region WA4 is suppressed. In addition, ​Among them, a comparative example in which a certain heat transfer rate is maintained regardless of the moving speed of the irradiation area EA and the formed object in this case is represented by a dotted line.

[0190] In addition, the specific methods for separately controlling the supply rate and the heat transfer rate in the second unevenness suppression operation may be the same as the specific methods for separately controlling the supply rate and the heat transfer rate in the first unevenness suppression operation described above. Therefore, the description regarding the specific methods for separately controlling the supply rate and the heat transfer rate is omitted.

[0191] Also, as described above, one of the reasons for the unevenness in the height of the object to be suppressed in the second unevenness suppression operation is the change in the relative moving speed of the irradiation area EA (i.e., the supply area MA) with respect to the shaping surface CS. In this way, when it is possible to form the required structural layer SL (and further, the three-dimensional structure ST) even if the moving speed of the irradiation area EA is controlled and changes from the original moving speed, the control device 7 can also perform the second unevenness suppression operation for suppressing the unevenness in the height of the object by controlling the moving speed of the irradiation area EA. In this case, by controlling the moving speed of the irradiation area EA, the cause of the unevenness in the height of the object (i.e., the technical problem of the unevenness in the height of the object) itself is eliminated. Therefore, the second unevenness suppression operation for controlling the moving speed of the irradiation area EA can also be called an operation for eliminating the cause of the unevenness in the height of the object. On the other hand, depending on the pattern of the moving trajectory of the irradiation area EA, there is a possibility that the moving speed of the irradiation area EA cannot be changed from the original moving speed. In this case, the control device 7 may not control the moving speed of the irradiation area EA in order to perform the second unevenness suppression operation for suppressing the unevenness in the height of the object. In addition, when the relationship between the moving speed and the height of the object is non-linear, it is only necessary to control the moving speed in consideration of this non-linear relationship.

[0192] (3-3) Third unevenness suppression operation

[0193] Next, the third unevenness suppression operation will be described. The third unevenness suppression operation is the same as the second unevenness suppression operation and is an operation for suppressing unevenness such as the height of the object when areas with different thermal characteristics exist on the shaping surface CS. However, when areas with different thermal characteristics due to differences in the degree of heat diffusion exist on the shaping surface CS in the existing structure (for example, at least one of the workpiece W and the already formed structural layer SL) where at least a part of the surface is set on the shaping surface CS, the third unevenness suppression operation is an operation for suppressing the unevenness in the height of the object.

[0194] Specifically, when forming the three-dimensional structure ST, as described above, the shaping surface CS is irradiated with the light EL. Heat is transferred from the light EL to the shaping surface CS. This heat is also transferred (substantially diffused) via the shaping surface CS to the interior of the existing structure. Here, depending on the characteristics of the existing structure (such as at least one of the structure, material, and shape), the degree of heat diffusion in the existing structure (i.e., an index indicating the ease or difficulty of diffusion) is not necessarily uniform. That is, there is a possibility that regions with different heat characteristics related to the degree of heat diffusion from the light EL exist on the shaping surface CS. For example, there is a possibility that on the shaping surface CS, there are regions where the heat transferred from the light EL is relatively difficult to diffuse, and regions where the heat transferred from the light EL is relatively easy to diffuse.

[0195] For example, as ​ (a) shows, in addition to the surface SF1 that sets the shaping surface CS, the existing structure also has a surface SF2 that does not set the shaping surface CS. In this case, depending on the proximity of a certain region portion on the shaping surface CS to the surface SF2, the degree of heat diffusion transferred to the certain region portion on the shaping surface CS can be estimated. Specifically, as ​ (a) shows, the region WA5 on the shaping surface CS is closer to the surface SF2 than the region WA6 on the shaping surface CS. Therefore, the heat diffusion path (i.e., the diffusion path inside the existing structure) of the heat transferred to the region WA5 is smaller or less than the heat diffusion path of the heat transferred to the region WA6. Therefore, the shorter the distance between a certain region portion on the shaping surface CS and the surface SF2 that does not set the shaping surface CS, the more difficult it is for the heat transferred to that region portion to diffuse. In addition, ​ (a) shows, in the example shown, it can also be said that there is a region WA5 on the shaping surface CS where the heat transferred from the light EL is relatively difficult to diffuse, and a region WA6 where the heat transferred from the light EL is relatively easy to diffuse.

[0196] In the region WA5 where heat is relatively difficult to diffuse, compared with the region WA6 where heat is relatively easy to diffuse, heat accumulates for a relatively longer time. As a result, there is a possibility that in the region WA5, only the shaping material M melts more than in the region WA6 corresponding to the degree of relatively longer heat accumulation time. Therefore, if in a situation where a shaped object of a certain height should be formed on the shaping surface CS, a series of shaping processes are performed without considering the difference in the degree of heat diffusion, there is a possibility of forming shaped objects with different heights according to the difference in the degree of heat diffusion. More specifically, there is a possibility that the more difficult it is for the heat transferred to a certain region portion on the shaping surface CS to diffuse, the higher the shaped object formed in that region portion. As an example, for instance, if in a situation where shaped objects of the same height should be formed in the region WA5 and the region WA6, and a series of shaping processes are performed without distinguishing between the region WA5 and the region WA6, then as ​(As shown in (b)), there is a possibility that the height h5 of the formed object S5 in the region WA5 is not consistent with the height h6 of the formed object S6 in the region WA6.

[0197] Therefore, in the present embodiment, the control device 7 (in other words, the forming system 1 under the control of the control device 7) suppresses the unevenness of the heights of the formed objects in the regions with different thermal characteristics due to the difference in the degree of heat diffusion by performing the third unevenness suppression operation. For example, the control device 7 suppresses the unevenness of the height of the formed object in the region WA5 and the height of the formed object in the region WA6 by performing the third unevenness suppression operation.

[0198] The control device 7 can also perform the third unevenness suppression operation of suppressing the unevenness of the height of the formed object by controlling the supply rate of the forming material M. Specifically, as ​ shown, the control device 7 can also control the supply rate in such a way that the smaller the supply rate is as the heat is more difficult to diffuse. That is, the control device 7 can also control the supply rate in such a way that the smaller the supply rate is for the area part on the forming surface CS where the heat is more difficult to diffuse. As a result, in the situation where the formed object in the area part where the heat is relatively difficult to diffuse becomes relatively higher, the supply amount of the forming material M to this area part decreases. If the supply amount of the forming material M decreases, the melting amount of the forming material M also decreases. Therefore, the situation where the formed object in the area part where the heat is relatively difficult to diffuse becomes relatively higher is suppressed. As a result, the unevenness of the heights of the formed objects in the regions with different thermal characteristics due to the difference in the degree of heat diffusion is suppressed. In addition, when the relationship between the degree of heat diffusion and the height of the formed object is non-linear, the supply rate can be controlled by considering this non-linear relationship.

[0199] In addition to or instead of controlling the supply rate, the control device 7 can also perform the third unevenness suppression operation of suppressing the unevenness of the height of the formed object by controlling the heat transfer rate. Specifically, as ​As shown, the control device 7 can also control the heat transfer rate in such a way that the more difficult it is for heat to spread, the smaller the heat transfer rate. That is, the control device 7 can also control the heat transfer rate in such a way that the more difficult it is for the heat transferred to a certain area portion on the shaping surface CS to spread, the smaller the heat transfer rate to that area portion. As a result, in the situation where the shaped object formed in the area portion where heat is relatively difficult to spread becomes relatively taller, the amount of heat transferred to that area portion decreases. If the amount of heat transferred decreases, the melting amount of the shaping material M also decreases. Therefore, the relative increase in the shaped object formed in the area portion where heat is relatively difficult to spread is suppressed. As a result, the unevenness in the height of the shaped objects formed in the areas with different heat characteristics due to the difference in the degree of heat diffusion is suppressed. In addition, when the relationship between the degree of heat diffusion and the height of the shaped object is non-linear, it is only necessary to control the heat transfer rate considering this non-linear relationship.

[0200] In addition to or instead of controlling at least one of the supply rate and the heat transfer rate, the control device 7 can also perform a third unevenness suppression operation of suppressing the unevenness in the height of the shaped object by controlling the relative movement speed of the irradiation area EA with respect to the shaping surface CS. Specifically, as ​ shown, the control device 7 can also control the movement speed of the irradiation area EA in such a way that the more difficult it is for heat to spread, the faster the movement speed of the irradiation area EA. That is, the control device 7 can also control the movement speed of the irradiation area EA in such a way that the more difficult it is for the heat transferred to a certain area portion on the shaping surface CS to spread, the faster the movement speed of the irradiation area EA when the irradiation area EA is set in that area portion. As described above, the faster the movement speed of the irradiation area EA when the irradiation area EA is set in a certain area portion on the shaping surface CS, the more the supply amount of the shaping material M to that area portion and the amount of heat transferred from the light EL to that area portion decrease. Therefore, if the movement speed of the irradiation area EA is controlled as ​ shown, in the situation where the shaped object formed in the area portion where heat is relatively difficult to spread becomes relatively taller, the supply amount of the shaping material M to that area portion and the amount of heat transferred to that area portion decrease. Therefore, the relative increase in the shaped object formed in the area portion where heat is relatively difficult to spread is suppressed. As a result, the unevenness in the height of the shaped objects formed in the areas with different heat characteristics due to the difference in the degree of heat diffusion is suppressed. In addition, when the relationship between the degree of heat diffusion and the height of the shaped object is non-linear, it is only necessary to control the movement speed considering this non-linear relationship.

[0201] In addition, the specific methods for separately controlling the supply rate, the heat transfer rate, and the moving speed of the irradiation area EA in the third unevenness suppression operation may be the same as the specific methods for separately controlling the supply rate, the heat transfer rate, and the moving speed of the irradiation area EA in the first unevenness suppression operation described above. Therefore, the description regarding the specific methods for separately controlling the supply rate, the heat transfer rate, and the moving speed of the irradiation area EA is omitted.

[0202] In addition, in the description of the third unevenness suppression operation, as the thermal property, the time-dependent property of heat has been exemplified for explanation, but it may also be other properties related to heat.

[0203] (3-4) Fourth unevenness suppression operation

[0204] Next, the fourth unevenness suppression operation will be described. The fourth unevenness suppression operation is the same as the second unevenness suppression operation, and when regions with different thermal properties exist on the shaping surface CS, it is an operation for suppressing unevenness such as the height of the shaped object. However, when regions with different thermal properties due to differences in the frequency of light EL irradiation exist on the shaping surface CS, the fourth unevenness suppression operation is an operation for suppressing unevenness in the height of the shaped object.

[0205] Specifically, when each structural layer SL constituting the three-dimensional structure ST is formed, as described above, light EL is irradiated at the moment when the irradiation area EA moves on the shaping surface CS and the irradiation area EA is set in the area on the shaping surface CS where the shaped object is to be formed. Here, depending on at least one of the pattern of the movement trajectory of the irradiation area EA and the pattern of the structural layer SL (i.e., the distribution pattern of the area on the shaping surface CS where the shaped object is to be formed), there is a possibility that regions with different frequencies of light EL irradiation exist on the shaping surface CS. For example, as ​ (a) shows, there is a possibility that there are regions WA7 where light EL is irradiated at a relatively high frequency and regions WA8 where light EL is irradiated at a relatively low frequency on the shaping surface CS.

[0206] In addition, the shorter the time from when light EL is irradiated on a certain area on the shaping surface CS until light EL is subsequently irradiated on another part of the certain area, the higher it is. The higher the frequency of irradiating light EL on a certain area on the shaping surface CS, that is, the more times light EL is irradiated on the certain area per unit time, the higher it is. The higher the frequency of irradiating light EL on a certain area on the shaping surface CS, that is, the more times light EL is irradiated on the certain area per unit area, the higher it is.

[0207] In the region WA7 irradiated with light EL at a relatively high frequency, compared with the region WA8 irradiated with light EL at a relatively low frequency, before the region WA7 heated by the heat transferred from the light EL is cooled, the possibility of further heating the region WA7 by the heat from the light re-irradiated to the region WA7 is increased. That is, in the region WA7 irradiated with light EL at a relatively high frequency, compared with the region WA8 irradiated with light EL at a relatively low frequency, the heat from the light EL is difficult to dissipate. In other words, in the region WA7 irradiated with light EL at a relatively high frequency, compared with the region WA8 irradiated with light EL at a relatively low frequency, the heat from the light EL accumulates for a relatively long time. As a result, in the region WA7, there is a possibility that more molding material M melts only corresponding to the degree of relatively long heat accumulation time than in the region WA8. Therefore, in the case where a molded object of a certain height should be formed on the molding surface CS, if a series of molding processes are performed without considering the difference in the frequency of light EL irradiation, there is a possibility of forming molded objects of different heights according to the difference in the frequency of light EL irradiation. More specifically, there is a possibility that the higher the frequency of light EL irradiation to a certain region on the molding surface CS, the higher the molded object formed in that region part. As an example, for instance, in the case where molded objects of the same height should be formed on the region WA7 and the region WA8, if a series of molding processes are performed without distinguishing between the region WA7 and the region WA8, as ​ shown in (b), there is a possibility that the height h7 of the molded object S7 formed in the region WA7 is inconsistent with the height h8 of the molded object S8 formed in the region WA8.

[0208] Therefore, in the present embodiment, the control device 7 (in other words, the molding system 1 under the control of the control device 7) suppresses the unevenness of the height of the molded object formed in the regions with different thermal characteristics due to the difference in the frequency of light EL irradiation by performing the fourth unevenness suppression action. For example, the control device 7 suppresses the unevenness of the height of the molded object formed in the region WA7 and the height of the molded object formed in the region WA8 by performing the fourth unevenness suppression action.

[0209] The control device 7 can also perform the fourth unevenness suppression action of suppressing the unevenness of the height of the molded object by controlling the supply rate of the molding material M. Specifically, as ​As shown, the control device 7 can also control the supply rate in such a way that the higher the frequency of the light EL irradiation, the smaller the supply rate. That is, the control device 7 can also control the supply rate in such a way that the higher the frequency of the light EL irradiation on a certain area portion of the shaping surface CS, the smaller the supply rate to that area portion. As a result, in the situation where the shaped object formed in the area portion with a high frequency of light EL irradiation becomes relatively higher, the supply amount of the shaping material M to that area portion decreases. If the supply amount of the shaping material M decreases, the melting amount of the shaping material M also decreases. Therefore, the shaped object formed in the area portion with a high frequency of light EL irradiation becoming relatively higher is suppressed. As a result, the unevenness in the height of the shaped object formed in the areas with different thermal characteristics due to the difference in the frequency of light EL irradiation is suppressed. In addition, when the relationship between the frequency of light EL irradiation and the height of the shaped object is non-linear, the non-linear relationship can also be considered to control the supply rate.

[0210] In addition to or instead of controlling the supply rate, the control device 7 can also perform a fourth unevenness suppression operation for suppressing the unevenness in the height of the shaped object by controlling the heat transfer rate. Specifically, as ​ shown, the control device 7 can also control the heat transfer rate in such a way that the higher the frequency of the light EL irradiation, the smaller the heat transfer rate. That is, the control device 7 can also control the heat transfer rate in such a way that the higher the frequency of the light EL irradiation on a certain area portion of the shaping surface CS, the smaller the heat transfer rate to that area portion. As a result, in the situation where the shaped object formed in the area portion with a high frequency of light EL irradiation becomes relatively higher, the amount of heat transferred to that area portion decreases. If the amount of heat transferred decreases, the melting amount of the shaping material M also decreases. Therefore, the shaped object formed in the area portion with a high frequency of light EL irradiation becoming relatively higher is suppressed. As a result, the unevenness in the height of the shaped object formed in the areas with different thermal characteristics due to the difference in the frequency of light EL irradiation is suppressed. In addition, when the relationship between the frequency of light EL irradiation and the height of the shaped object is non-linear, the non-linear relationship can also be considered to control the heat transfer rate.

[0211] In addition to or instead of controlling at least one of the supply rate and the heat transfer rate, the control device 7 can also perform a fourth unevenness suppression operation for suppressing the unevenness in the height of the shaped object by controlling the relative movement speed of the irradiation area EA with respect to the shaping surface CS. Specifically, as ​As shown, the control device 7 can also control the moving speed of the irradiation area EA in such a way that the higher the frequency of the light EL irradiation, the faster the moving speed of the irradiation area EA. That is, the control device 7 can also control the moving speed of the irradiation area EA in such a way that the higher the frequency of the light EL irradiation on a certain area portion on the shaping surface CS, the faster the moving speed of the irradiation area EA when the irradiation area EA is set in that area portion. As described above, the higher the moving speed of the irradiation area EA when the irradiation area EA is set in a certain area portion on the shaping surface CS, the less the supply amount of the shaping material M to that area portion and the less the heat transferred from the light EL to that area portion. Therefore, if ​ the moving speed of the irradiation area EA is controlled as shown, then in the situation where the shaped object formed in the area portion with a high frequency of the light EL irradiation is relatively tall, the supply amount of the shaping material M to that area portion and the heat transferred to that area portion are reduced. Therefore, the relative increase in height of the shaped object formed in the area portion with a high frequency of the light EL irradiation is suppressed. As a result, the unevenness in height of the shaped objects formed in the areas with different thermal characteristics due to the difference in the frequency of the light EL irradiation is suppressed. In addition, when the relationship between the frequency of the light EL irradiation and the height of the shaped object is non-linear, the non-linear relationship can also be considered to control the moving speed.

[0212] In addition, the specific methods for separately controlling the supply rate, the heat transfer rate, and the moving speed of the irradiation area EA in the fourth unevenness suppression operation can be the same as the specific methods for separately controlling the supply rate, the heat transfer rate, and the moving speed of the irradiation area EA in the first unevenness suppression operation described above. Therefore, the description related to the specific methods for separately controlling the supply rate, the heat transfer rate, and the moving speed of the irradiation area EA is omitted.

[0213] In addition, in the description of the fourth unevenness suppression operation, as the thermal characteristics, the time-dependent characteristics of heat have been exemplified for description, but it can also be other characteristics related to heat.

[0214] (3-5) Modification examples of the unevenness suppression operation

[0215] In the above description, the control device 7 controls at least one of the supply rate of the molding material M, the heat transfer rate, and the moving speed of the irradiation area EA relative to the molding surface CS in order to suppress the unevenness of the height (or any characteristics such as dimensions) of the molded objects formed in different areas on the molding surface CS. Conversely, however, the control device 7 can control the characteristics of the molded object (and thus the structure layer SL and the three-dimensional structure ST) formed on the molding surface CS by controlling at least one of the supply rate, the heat transfer rate, and the moving speed of the irradiation area EA relative to the molding surface CS. Therefore, the control device 7 can also control at least one of the supply rate, the heat transfer rate, and the moving speed of the irradiation area EA relative to the molding surface CS in such a way that the characteristics of the molded object (and thus the structure layer SL and the three-dimensional structure ST) formed on the molding surface CS become the desired characteristics. That is, the control device 7 can also control at least one of the supply rate, the heat transfer rate, and the moving speed of the irradiation area EA relative to the molding surface CS for a purpose different from the purpose of suppressing characteristic unevenness. For example, the control device 7 can also control at least one of the supply rate, the heat transfer rate, and the moving speed of the irradiation area EA relative to the molding surface CS in order to control the characteristics (such as at least one of the height and dimensions) of the mark formed by the marking operation described later.

[0216] In the above description, as an example of the reason why multiple areas with different thermal characteristics exist on the molding surface CS, the difference in the relative moving speed of the irradiation area EA relative to the molding surface CS, the difference in the degree of heat diffusion in the existing structure where at least a part of the surface is set on the molding surface CS, and the difference in the frequency irradiated by the light EL have been described. However, for other reasons, there is also a possibility that areas with different thermal characteristics exist on the molding surface CS. In this case, there is also a possibility that if a series of molding processes are performed without considering the difference in thermal characteristics in a situation where molded objects with the same characteristics are to be formed in areas with different thermal characteristics, there is a possibility of forming molded objects with uneven characteristics. Therefore, the control device 7 can also perform an unevenness suppression operation for suppressing the unevenness of the height of the molded object formed in an area with different thermal characteristics due to other reasons different from the above reasons. In addition, as a case where multiple areas with different thermal characteristics exist on the molding surface CS, a case where the type or density of the material is different at each position on the molding surface CS can be cited.

[0217] (4) Marking operation

[0218] Next, the marking operation for forming the mark SM on the molding surface CS using the above molding operation will be described.

[0219] (4-1) Outline of the marking operation

[0220] The marking action is an action of forming a marking SM composed of an aggregate of the shaped objects on the shaping surface CS by forming the shaped objects distributed in a predetermined distribution pattern on the shaping surface CS by using the above-described shaping action.

[0221] The marking SM may also include a mark related to a sign having a predetermined meaning on a plane along the shaping surface CS. The sign may include at least one of, for example, a sign meaning any character, a sign meaning any number, a sign meaning any figure, a sign meaning any logo, and a sign having any other meaning. For example, ​ shows an example in which on the shaping surface CS, a marking SM1 related to a sign meaning the letter N, a marking SM2 related to a sign meaning an exclamation mark, and a marking SM3 related to a sign meaning a circular figure are formed on the shaping surface CS.

[0222] The marking SM is, as ​ shown in the lower part of, a structure protruding convexly from the shaping surface CS. The marking SM may be a structure including a single structural layer SL. That is, the marking SM may be composed of a single structural layer SL. In this case, the height of the marking SM (that is, the length from the shaping surface CS to the upper surface of the marking SM (that is, the surface on the +Z side), the same hereinafter) is the same as the height of the structural layer SL. Alternatively, the marking SM may be a structure including a plurality of stacked structural layers SL. That is, the marking SM may also be composed of a plurality of stacked structural layers SL. In this case, the height of the marking SM becomes the same as the height of the plurality of stacked structural layers SL. Therefore, typically, the greater the number of structural layers SL constituting the marking SM, the higher the height of the marking SM.

[0223] However, the maximum value of the height of the marking SM does not exceed the minimum value of the size of the marking SM in the direction along the shaping surface CS. That is, the height of the highest part of the marking SM does not exceed the size of the thinnest part of the marking SM. For example, ​ in the example shown, the maximum value hm1 of the height of the marking SM1 does not exceed the minimum value wm1 of the size of the marking SM1 in the direction along the shaping surface CS. The maximum value hm2 of the height of the marking SM2 does not exceed the minimum value wm2 of the size of the marking SM2 in the direction along the shaping surface CS. However, a marking SM having a maximum value of the height exceeding the minimum value of the size of the marking SM in the direction along the shaping surface CS may also be formed.

[0224] To form such a mark SM, the control device 7 first acquires coordinate data related to the mark SM to be formed on the shaping surface CS. The coordinate data represents data on the shaping surface CS indicating the positions where the mark SM is distributed (i.e., the positions where the mark formation regions for forming the shaped objects constituting the mark SM are distributed). Since the shaping surface CS is a plane, the coordinate data corresponds to (or is associated with) the data of the positions on the two-dimensional coordinate system where the mark SM is distributed. As an example of such coordinate data, at least one of font data (such as dot matrix font data, etc.) and image data (such as dot matrix image data, etc.) can be cited. The control device 7 can also acquire the coordinate data from other devices that provide the coordinate data. Alternatively, the control device 7 can also generate the coordinate data by itself. In this case, the control device 7 first acquires mark information indicating the mark corresponding to the mark SM to be formed on the shaping surface CS. For example, the control device 7 acquires information related to the operation content of the user who designates the mark from an input device that can be operated by the user to input the mark to be formed on the shaping surface CS as the mark information. Then, the control device 7 converts the acquired mark information into coordinate data. For example, the control device 7 converts the mark indicated by the mark information into a mark pattern on the two-dimensional plane and determines the coordinates on the two-dimensional plane of the region where the mark pattern is distributed. As a result, the control device 7 can acquire the coordinate data representing the determined coordinates.

[0225] After acquiring the coordinate data, the control device 7 forms the mark SM by performing a shaping operation based on the coordinate data. Specifically, the control device 7 forms at least one construction layer SL based on the coordinate data, thereby forming the mark SM constituted by the construction layer SL. When forming each construction layer SL, the control device 7 can also, as shown in ​ (a), control the shaping device 4 in the following manner: while repeatedly moving the irradiation area EA along the Y-axis direction and the X-axis direction, moving the irradiation area EA relative to the shaping surface CS, and irradiating the light EL at the moment when the mark formation area represented by the coordinate data overlaps with the irradiation area EA. In other words, the irradiation area EA can also be moved in a raster scan manner on the shaping surface CS. Alternatively, the control device 7 can also, as shown in ​ (b), control the shaping device 4 by moving the irradiation area EA along the distribution pattern of the mark formation area represented by the coordinate data while irradiating the light EL. In other words, the irradiation area EA can also be moved in a vector scan manner on the shaping surface CS. Generally, a construction layer SL corresponding to the mark SM (i.e., a pattern corresponding to the movement trajectory of the molten pool MP) is formed on the shaping surface CS.

[0226] In addition, the control device 7 can also perform the above-mentioned non-uniformity suppression action during at least a part of the period of performing the marking action. That is, the control device 7 can also suppress the non-uniformity of the characteristics (such as at least one of the height and size) of the mark SM formed by the marking action by performing the above-mentioned non-uniformity suppression action during at least a part of the period of performing the marking action. For example, when the irradiation area EA is set two or more times in the same area on the shaping surface CS during at least a part of the period of forming the mark SM, the control device 7 can also perform the above-mentioned first non-uniformity suppression action. For example, when there are areas with different thermal characteristics on the shaping surface CS due to differences in the relative movement speed of the irradiation area EA with respect to the shaping surface CS during at least a part of the period of forming the mark SM, the control device 7 can also perform the above-mentioned second non-uniformity suppression action. For example, when there are areas with different thermal characteristics on the shaping surface CS in the existing structure where at least a part of the surface is set on the shaping surface CS due to differences in the degree of heat diffusion during at least a part of the period of forming the mark SM, the control device 7 can also perform the above-mentioned third non-uniformity suppression action. For example, when there are areas with different thermal characteristics on the shaping surface CS due to differences in the frequency of the light EL irradiated during at least a part of the period of forming the mark SM, the control device 7 can also perform the above-mentioned fourth non-uniformity suppression action.

[0227] (4-2) Characteristic control action for controlling the characteristics of the mark SM

[0228] Next, a characteristic control action for controlling the characteristics of the mark SM formed by the marking action will be described. In the present embodiment, as an example of the characteristic control action, the shaping system 1 performs: at least one of a size control action for controlling the size of the mark SM, a height control action for controlling the height of the mark SM, a shape control action for controlling the shape of the surface of the mark SM (especially the upper surface of the convex structure constituting the mark SM), and a tone control action for controlling the tone of the mark SM. Therefore, hereinafter, the size control action, the height control action, the shape control action, and the tone control action will be described in order. In addition, the shaping system 1 can also perform a characteristic control action for controlling other characteristics of the mark SM.

[0229] (4-2-1) Size control action

[0230] First, the dimension control operation will be described. The dimension control operation is a characteristic control operation for controlling the dimension of the mark SM (particularly the dimension in at least one of the X-axis direction and the Y-axis direction, such as the width). In addition, the dimension of the mark SM can also be the dimension in the in-plane direction of the modeling surface CS. The modeling system 1 can form the mark SM with the desired dimension by performing the dimension control operation under the control of the control device 7. Furthermore, the modeling system 1 can form a plurality of marks SM that represent the same symbol but have different dimensions by performing the dimension control operation under the control of the control device 7. Furthermore, the modeling system 1 can form the mark SM while changing the dimension of the mark SM during the formation of the mark SM by performing the dimension control operation under the control of the control device 7.

[0231] For example, ​ (a) to ​ (d) all show the mark SM11 related to the linear graph and the mark SM12 related to the circular graph formed on the modeling surface CS. ​ In the example shown in (a), the control device 7 performs the dimension control operation in such a way that the dimension of the mark SM11 (specifically, the dimension in the Y-axis direction, the width) becomes the required first dimension wm11, and the dimension of the mark SM12 becomes the required second dimension wm12. ​ In the example shown in (b), the control device 7 performs the dimension control operation in such a way that the dimension of the mark SM11 becomes the required third dimension wm13 that is smaller than the first dimension wm11, and the dimension of the mark SM12 becomes the required fourth dimension wm14 that is larger than the second dimension wm12. In addition, ​ (a) and ​ In the examples shown in (b), the control device 7 can also perform the dimension control operation in such a way that the dimension of one part of the mark SM11 and the dimension of another part of the mark SM11 that is different from the one part are the same (that is, in such a way that the dimension does not change during the formation of the mark SM11). ​ In the example shown in (c), the control device 7 performs the dimension control operation in such a way that along the long side direction of the mark SM11 (that is, the X-axis direction), the dimension of the mark SM11 continuously changes from the first dimension wm11 to the fifth dimension wm15 that is larger than the first dimension wm11 (here, it becomes larger). ​ In the example shown in (d), the control device 7 performs the dimension control operation in such a way that along the long side direction of the mark SM11, the dimension of the mark SM11 changes from the first dimension wm11 to the fifth dimension wm15 (here, it becomes larger) in a stepwise or discrete manner. In addition, ​ (c) and ​In the example shown in (d), the control device 7 can also perform the size control operation in such a way that the size of a part of the mark SM11 is different from the size of other parts of the mark SM11 that are different from the one part (i.e., in a way that changes the size during the formation of the mark SM11).

[0232] The control device 7 can also control the size of the mark SM by controlling the heat transfer rate. Specifically, the greater the heat transfer rate to a certain area portion of the shaping surface CS, the greater the amount of heat transferred from the light EL to that area portion. The more heat is transferred to a certain area portion of the shaping surface CS, the larger the size of the molten pool MP formed in that area portion. The larger the size of the molten pool MP in a certain area portion of the shaping surface CS, the larger the size of the shaped object formed in that area portion. The larger the size of the shaped object formed in a certain area portion of the shaping surface CS, the larger the size of the mark SM constituted by the shaped object. That is, as ​ shown, the greater the heat transfer rate, the larger the size of the mark SM. Therefore, the control device 7 can control the size of the mark SM by controlling the heat transfer rate. In addition, the specific method for controlling the heat transfer rate in the characteristic control operation including the size control operation can be the same as the specific method for controlling the heat transfer rate in the above unevenness suppression operation. Therefore, in the description of the characteristic control operation, the description related to the specific method for controlling the heat transfer rate is omitted. In addition, when the relationship between the heat transfer rate and the size of the mark SM is a non-linear relationship, the non-linear relationship can also be considered to control the heat transfer rate.

[0233] The control device 7 can also control the size of the mark SM by controlling the relative movement speed of the irradiation area EA with respect to the shaping surface CS. Specifically, the slower the movement speed of the irradiation area EA in a certain area portion of the shaping surface CS, the longer the time during which the irradiation area EA is set in a certain area portion on the shaping surface CS. The longer the time during which the irradiation area EA is set in a certain area portion on the shaping surface CS, the more heat is transferred from the light EL to that area portion. The more heat is transferred to a certain area portion on the shaping surface CS, the larger the size of the shaped object (and thus the size of the mark SM) formed in that area portion. That is, as ​As shown, the slower the moving speed of the irradiation area EA, the larger the size of the mark SM. Therefore, the control device 7 can control the size of the mark SM by controlling the moving speed of the irradiation area EA. In addition, in the characteristic control action including the size control action, the specific method for controlling the moving speed of the irradiation area EA can be the same as the specific method for controlling the moving speed of the irradiation area EA in the above uneven suppression action. Therefore, in the description of the characteristic control action, the description related to the specific method for controlling the moving speed of the irradiation area EA is omitted. In addition, when the relationship between the moving speed and the size of the mark SM is a non-linear relationship, the non-linear relationship can also be considered to control the moving speed.

[0234] The control device 7 can also control the size of the mark SM by controlling the size of the irradiation area EA. Specifically, the larger the size of the irradiation area EA set in a certain area portion on the shaping surface CS, the larger the size of the area actually irradiated by the light EL in this area portion. The larger the size of the area actually irradiated by the light EL in a certain area portion on the shaping surface CS, the larger the size of the molten pool MP formed in this area portion. The larger the size of the molten pool MP in a certain area portion of the shaping surface CS, the larger the size of the shaped object formed in this area portion (and thus the size of the mark SM). That is, as ​ shown, the larger the size of the irradiation area EA, the larger the size of the mark SM. Therefore, the control device 7 can control the size of the mark SM by controlling the size of the irradiation area EA. In addition, when the relationship between the size of the irradiation area EA and the size of the mark SM is a non-linear relationship, the non-linear relationship can also be considered to control the size of the irradiation area EA.

[0235] To control the size of the irradiation area EA, the control device 7 can also control the irradiation optical system 411. For example, the control device 7 can also control the size of the irradiation area EA by controlling the optical components included in the irradiation optical system 411. As an example of such an optical component, examples include: a condenser optical element; an aperture member that can change at least one of the shape and size of the opening through which the light EL can pass; and a light shaping member that can variably set the area through which the light EL can pass and the area that can block the light EL in a plane intersecting the optical axis of the irradiation optical system 411 (that is, a plane intersecting the propagation direction of the light EL), etc. Or, since the size of the irradiation area EA can also change if the relative position of the shaping surface CS with respect to the irradiation optical system 411 (especially the relative position in the Z-axis direction) changes, the control device 7 can also control the relative position of the shaping surface CS with respect to the irradiation optical system 411 by controlling the drive system 42, thereby controlling the size of the irradiation area EA.

[0236] As ​(a) to ​ As shown in (b), there is a case where a certain mark SM is composed of a plurality of linear structures LP. Such a mark SM composed of a plurality of linear structures LP can be formed when the following operations are repeated: For example, as ​ shown in (a) and ​ shown in (a), an operation of irradiating light EL while moving the irradiation area EA in the Y-axis direction, and an operation of moving the irradiation area EA in the X-axis direction without irradiating light EL. Specifically, if, while moving the irradiation area EA in the Y-axis direction and irradiating light EL, a plurality of linear structures LP formed so as to extend in the Y-axis direction are formed without gaps or with gaps in the X-axis direction, a mark SM equivalent to an aggregate of the plurality of linear structures LP can be formed.

[0237] In the case where the mark SM is composed of a plurality of linear structures LP as described above, the control device 7 can also control the size of the mark SM (particularly the size in the direction in which the plurality of linear structures LP are arranged) by controlling the number of the plurality of linear structures LP constituting the mark SM. Specifically, as ​ shown in (a) and ​ shown in (b), the smaller the number of the plurality of linear structures LP constituting the mark SM, the smaller the size of the mark SM. ​ Shown in (a) and ​ Shown in (b) is an example in which the size wm17 of the mark SM composed of N2 (where N2 < N1) linear structures LP is smaller than the size wm16 of the mark SM composed of N1 linear structures LP.

[0238] In the case where the mark SM is composed of a plurality of linear structures LP as described above, the control device 7 can also control the size of the mark SM (particularly the size in the long side direction or the extending direction of the plurality of linear structures LP) by controlling the length of the plurality of linear structures LP constituting the mark SM. Specifically, as ​ shown in (c) and ​ shown in (d), the shorter the length of the plurality of linear structures LP constituting the mark SM, the smaller the size of the mark SM. ​ Shown in (c) and ​ Shown in (d) is an example in which the size wm19 of the mark SM composed of relatively short (specifically, the length becomes wm19 (where wm19 < wm18)) linear structures LP is smaller than the size wm18 of the mark SM composed of relatively long (specifically, the length becomes wm18) linear structures LP.

[0239] In addition, the control device 7 can also control by combining at least two of the control of the supply rate of the molding material M, the control of the heat transfer rate, the control of the moving speed, and the control of the number of linear structures.

[0240] (4-2-2) Height control operation

[0241] Next, the height control operation will be described. The height control operation is a characteristic control operation for controlling the height of the mark SM. The molding system 1 can form the mark SM with the required height by performing the characteristic control operation under the control of the control device 7. Furthermore, the molding system 1 can form a plurality of marks SM that represent the same symbol but have different heights by performing the height control operation under the control of the control device 7. Furthermore, the molding system 1 can form the mark SM while changing the height of the mark SM being formed by performing the height control operation under the control of the control device 7.

[0242] For example, ​ (a) to ​ (d) all show the mark SM related to the linear pattern formed on the molding surface CS. ​ In the example shown in (a), the control device 7 performs the height control operation in such a way that the height of the mark SM becomes the required first height hm21. ​ In the example shown in (b), the control device 7 performs the height control operation in such a way that the height of the mark SM becomes the required second height hm22 higher than the first height hm21. In addition, ​ (a) and ​ In the examples shown in (b), the control device 7 can also perform the height control operation in such a way that the height of one part of the mark SM and the height of another part of the mark SM different from the one part are the same (that is, in such a way that the height does not change during the formation of the mark SM). ​ In the example shown in (c), the control device 7 performs the height control operation in such a way that along the long side direction of the mark SM (that is, the X-axis direction), the height of the mark SM continuously changes from the first height hm21 to the third height hm23 higher than the first height hm21 (here, it becomes higher). ​ In the example shown in (d), the control device 7 performs the height control operation in such a way that along the long side direction of the mark SM, the height of the mark SM changes from the first height hm21 to the third height hm23 stepwise or discretely (here, it becomes higher). Especially in ​ (c) and ​In the example shown in (d), the control device 7 performs a height control operation in such a manner that the height of each part constituting the following mark SM (i.e., the height along the Z-axis direction intersecting the Y-axis direction) varies according to the position of each part along the Y-axis direction. The above-mentioned mark SM is a mark extending in the Y-axis direction formed on the shaping surface CS by moving the irradiation region EA (i.e., the molten pool MP) along the Y-axis direction. In addition, ​ (c) and ​ In the example shown in (d), the control device 7 can also perform a height control operation in such a manner that the height of one part of the mark SM and the height of another part of the mark SM different from the one part are different (i.e., in such a manner that the height is changed during the formation of the mark SM). In addition, the control device 7 can also perform a height control operation in such a manner that the height of the mark SM continuously changes along the long side direction of the mark SM.

[0243] The control device 7 can also control the height of the mark SM by controlling the supply rate of the shaping material M. Specifically, the greater the supply rate to a certain region part of the shaping surface CS, the greater the supply amount of the shaping material M to that region part. The greater the supply amount of the shaping material M to a certain region part of the shaping surface CS, the greater the melting amount of the shaping material M in that region part. The greater the melting amount of the shaping material M in a certain region part of the shaping surface CS, the higher the shaped object formed in that region part. The higher the shaped object formed in a certain region part of the shaping surface CS, the higher the mark SM constituted by that shaped object. That is, as ​ shown, the greater the supply rate, the higher the mark SM. Therefore, the control device 7 can control the height of the mark SM by controlling the supply rate. In addition, the specific method for controlling the supply rate in the characteristic control operation including the height control operation can be the same as the specific method for controlling the supply rate in the above-mentioned uneven suppression operation. Therefore, in the description of the characteristic control operation, the description related to the specific method for controlling the supply rate is omitted. In addition, when the relationship between the supply rate and the height of the mark SM is a non-linear relationship, the non-linear relationship can also be considered to control the supply rate.

[0244] The control device 7 can also control the height of the mark SM by controlling the heat transfer rate. Specifically, the greater the heat transfer rate to a certain region part of the shaping surface CS, the greater the amount of heat transferred from the light EL to that region part. The greater the amount of heat transferred to a certain region part of the shaping surface CS, the greater the possibility that the melting amount of the shaping material M existing in that region part is greater. On a certain region part of the shaping surface CS, the greater the melting amount of the shaping material M, the higher the shaped object (and thus the mark SM) formed in that region part. That is, as ​As shown, the higher the heat transfer rate, the higher the marker SM. Therefore, the control device 7 can control the height of the marker SM by controlling the heat transfer rate. In addition, when the relationship between the heat transfer rate and the height of the marker SM is non-linear, the non-linear relationship can also be considered to control the heat transfer rate.

[0245] The control device 7 can also control the height of the marker SM by controlling the relative movement speed of the irradiation area EA with respect to the molding surface CS. Specifically, as described above, the slower the movement speed of the irradiation area EA in a certain area part of the molding surface CS, the more heat is transferred from the light EL to that area part. The more heat is transferred to a certain area part on the molding surface CS, the higher the molded object (and thus the marker SM) formed in that area part. That is, as ​ shown, the slower the movement speed of the irradiation area EA, the higher the marker SM. Therefore, the control device 7 can control the height of the marker SM by controlling the movement speed of the irradiation area EA. In addition, when the relationship between the movement speed and the height of the marker SM is non-linear, the non-linear relationship can also be considered to control the movement speed.

[0246] As described above, there is a case where the marker SM is a structure including a plurality of stacked structure layers SL. In this case, the control device 7 can also control the height of the marker SM by controlling the number of the plurality of structure layers SL constituting the marker SM (that is, the number of stacked structure layers SL). Specifically, as ​ (a) and ​ (b) show, the fewer the number of the plurality of structure layers SL constituting the marker SM, the lower the marker SM. ​ (a) and ​ (b) show an example in which the height wm25 of the marker SM constituted by L2 (where L2 > L1) structure layers SL is higher than the height hm24 of the marker SM constituted by L1 structure layers SL.

[0247] In addition, the control device 7 can also control by combining at least two of the control of the supply rate of the molding material M, the control of the heat transfer rate, the control of the movement speed, and the control of the number of stacked layers.

[0248] (4-2-3) Shape control operation

[0249] Next, the shape control operation will be described. The shape control operation is a characteristic control operation for controlling the shape of the surface of the marker SM (especially the upper surface of the convex structure constituting the marker SM). The molding system 1 can form a marker SM with a surface shape being a desired shape by performing the shape control operation under the control of the control device 7. For example, as ​As shown in (a), the control device 7 can also perform the shape control operation in such a way that the surface of the mark SM includes a flat surface (especially a flat surface parallel to the shaping surface CS). For example, as ​ As shown in (b), the control device 7 can also perform the shape control operation in such a way that the surface of the mark SM includes a curved surface. For example, as ​ As shown in (c), the control device 7 can also perform the shape control operation in such a way that the surface of the mark SM includes a flat surface inclined with respect to the shaping surface CS.

[0250] The control device 7 can also control the size of the shaped object constituting the mark SM by performing the same operation as the above-described size control operation, so as to control the shape of the surface of the mark SM. The control device 7 can also control the height of the shaped object constituting the mark SM by performing the same operation as the above-described height control operation, so as to control the shape of the surface of the mark SM. The control device 7 can also form a mark SM whose surface shape becomes a desired shape by performing the same operation as the normal shaping operation of the three-dimensional structure ST for forming a desired shape.

[0251] The shaping system 1 can also control at least one of the shape of the surface of the mark SM and the height of the mark SM under the control device 7, so as to control the shape of the virtual connection surface VS connecting the surfaces of the marks SM to be formed on the shaping surface CS (especially the shape of the cross section including the stacking direction of the structural layer SL, i.e., the Z-axis). The shaping system 1 can form a plurality of marks SM whose connection surface VS has a desired shape by performing at least one of the shape control operation and the height control operation under the control of the control device 7. For example, as ​ As shown in (a), the control device 7 can also perform the shape control operation in such a way that the connection surface VS includes a flat surface (especially a flat surface parallel to the shaping surface CS). For example, as ​ As shown in (b), the control device 7 can also perform at least one of the shape control operation and the height control operation in such a way that the connection surface VS includes a curved surface. For example, as ​ As shown in (c), the control device 7 can also perform at least one of the shape control operation and the height control operation in such a way that the connection surface VS includes a flat surface inclined with respect to the shaping surface CS.

[0252] As described above, the mark SM is a convex structure protruding from the shaping surface CS. In this case, the mark SM can be used as a stamp for transferring an imprint corresponding to the pattern of the mark SM onto the object TG by pressing the surface of the mark SM against the object TG. For example, ​(a) shows an example in which a mark SM having a pattern with the letters N and C reversed is formed on a modeling surface CS corresponding to the surface of a workpiece W. After coating the surface of such a mark SM with a coating material, if the surface of the mark SM is pressed against an object surface TGS of an object TG, then, as shown in ​ (b), an imprint including the letters N and C is transferred to the object surface TGS.

[0253] In the case where the mark SM is pressed against an object as described above, the control device 7 can also perform a shape control operation in such a manner that the shape of the connection surface VS is controlled based on the characteristics of the object TG. Specifically, the control device 7 can also perform a shape control operation in such a manner that the shape of the connection surface VS is controlled based on the shape of the object surface TGS of the object TG where the mark SM is pressed (specifically, the shape of a cross-section including an axis intersecting the object surface TGS). In this case, the control device 7 can also control the shape of the connection surface VS in such a manner that the shape of the connection surface VS and the shape of the object surface TGS are in a complementary relationship. For example, as shown in ​ (a), in the case where the object surface TGS is a flat surface, the control device 7 can also perform a shape control operation by forming the mark SM such that the connection surface VS is a flat surface having a complementary relationship with the object surface TGS. For example, as shown in ​ (b), in the case where the object surface TGS is a concave curved surface, the control device 7 can also perform a shape control operation by forming the mark SM such that the connection surface VS is a convex curved surface having a complementary relationship with the object surface TGS. For example, as shown in ​ (c), in the case where the object surface TGS is a convex flat surface, the control device 7 can also perform a shape control operation by forming the mark SM such that the connection surface VS is a concave flat surface having a complementary relationship with the object surface TGS. If the shape control operation is performed in the above manner, compared with the case where no shape control operation is performed, the surface of the mark SM can be appropriately pressed against the object surface TGS of the object TG. Specifically, when the surface of the mark SM is pressed against the object surface TGS, it is difficult to form a gap between the surface of the mark SM and the object surface TGS. As a result, regardless of the shape of the object surface TGS, an imprint corresponding to the pattern of the mark MS can be appropriately transferred to the object surface TGS.

[0254] When controlling the shape of the connection surface VS based on the characteristics of the object TG, the control device 7 can also acquire characteristic information related to the characteristics of the object TG and control the shape of the connection surface VS based on the acquired characteristic information. The control device 7 can also acquire the measurement results of a measuring device that measures the characteristics of the object TG as the characteristic information. In this case, the measuring device can be provided by the modeling system 1 or can be prepared separately from the modeling system 1. Alternatively, the control device 7 can also acquire the characteristic information from other devices that hold the characteristic information.

[0255] In addition, in the above description, the characteristic of the object TG is the shape of the object surface TGS, but the characteristic of the object TG can also be the hardness, elasticity, etc. of the object TG.

[0256] (4-2-4) Tone control operation

[0257] Next, the tone control operation will be described. The tone control operation is a characteristic control operation for controlling the tone of the mark SM (especially the tone of the surface of the mark SM). The modeling system 1 can form the mark SM with the required tone by performing the tone control operation under the control of the control device 7. Furthermore, the modeling system 1 can form a plurality of marks SM that represent the same symbol but have different tones by performing the tone control operation under the control of the control device 7. Furthermore, the modeling system 1 can form the mark SM while changing the tone of the mark SM during the formation of the mark SM by performing the tone control operation under the control of the control device 7.

[0258] The control device 7 can also control the tone of the mark SM by controlling the characteristics of a specific gas in the internal space of the chamber 44. In particular, the control device 7 can also control the tone of the mark SM by controlling the characteristics of a specific gas in the space around the molten pool MP located in the internal space of the chamber 44. In this case, the control device 7 can also control the characteristics of the specific gas in such a way that the characteristics of the specific gas can set the tone of the mark SM to the required tone. The specific gas includes a predetermined gas that affects the tone of the mark SM. As an example of such a specific gas, oxygen can be cited.

[0259] The characteristics of the specific gas may also include the concentration of the specific gas (i.e., the concentration of the specific gas in the internal space of the chamber 44, particularly in the space around the molten pool MP in the internal space). When the specific gas is included in the purge gas (i.e., the gas supply device 6 supplies the purge gas containing the specific gas), the control device 7 can also control the concentration of the specific gas in the internal space of the chamber 44 by controlling the concentration of the specific gas in the purge gas (i.e., the content of the specific gas in the purge gas). When the specific gas is not included in the purge gas (i.e., the gas supply device 6 supplies the specific gas via a supply path different from the purge gas or the specific gas is supplied by a device different from the gas supply device 6), the control device 7 can also control the concentration of the specific gas in the internal space of the chamber 44 by controlling the flow rate of at least one of the purge gas and the specific gas supplied to the internal space of the chamber 44. In addition, instead of controlling the concentration of the specific gas in the entire internal space of the chamber 44, the control of the concentration of the specific gas can be performed only in the space around the molten pool MP.

[0260] The control device 7 can also be as ​ (a) shows, in a manner such that the characteristics of the specific gas during the period when the first mark SM21 is formed are different from the characteristics of the specific gas during the period when the second mark SM22 different from the first mark SM21 is formed, to control the characteristics of the specific gas. In this case, as ​ (b) shows, the hue of the first mark SM21 becomes different from the hue of the second mark SM22. The control device 7 can also be as ​ (c) shows, in a manner such that the characteristics of the specific gas during the period when the first part SM21-1 in the first mark SM21 is formed are different from the characteristics of the specific gas during the period when the second part SM21-2 different from the first part SM21-1 in the first mark SM21 is formed, to control the characteristics of the specific gas. In this case, as ​ (d) shows, the hue of the first part SM21-1 of the first mark SM21 becomes different from the hue of the second part SM21-2 of the first mark SM21.

[0261] (4-2-5) Variation of the characteristic control operation

[0262] In the above description, the control device 7 performs a characteristic control operation to control the characteristics of the mark SM formed by the marking operation. However, not limited to the mark SM, the control device 7 may also perform the above characteristic control operation to control the characteristics of at least one of the shaped object, the structure layer SL, and the three-dimensional structure ST formed by the shaping operation. That is, the control device 7 may also perform the above size control operation to control the size of at least one of the shaped object, the structure layer SL, and the three-dimensional structure ST. The control device 7 may also perform the above height control operation to control the height of at least one of the shaped object, the structure layer SL, and the three-dimensional structure ST. The control device 7 may also perform the above shape control operation to control the shape of at least one of the shaped object, the structure layer SL, and the three-dimensional structure ST. The control device 7 may also perform the above color tone control operation to control the color tone of at least one of the shaped object, the structure layer SL, and the three-dimensional structure ST.

[0263] (5) Processing operation (grinding operation)

[0264] The shaping system 1 may also perform a processing operation for processing at least a part of the surface of at least one of the three-dimensional structure ST and the mark SM. In addition, the mark SM formed by the marking operation is a specific example of the three-dimensional structure ST formed by the shaping operation. Therefore, in the description of the processing operation, the three-dimensional structure ST means at least one of the three-dimensional structure ST and the mark SM.

[0265] In the present embodiment, as an example of the processing operation, the shaping system 1 may also perform a grinding operation for grinding at least a part of the surface of the three-dimensional structure ST (especially the upper surface of the structure layer SL constituting the uppermost layer of the three-dimensional structure ST). Hereinafter, the grinding operation will be described. In addition, hereinafter, for the sake of convenience of description, the surface ground by the grinding operation is referred to as the grinding target surface PS. In addition, the shaping system 1 may also perform a grinding operation for grinding at least a part of the side surface (the surface facing the direction crossing the direction in which the structure layers SL are stacked) of one or more structure layers SL of the three-dimensional structure.

[0266] In the present embodiment, the "grinding operation for grinding the surface PS to be ground" includes: "making the surface PS to be ground smoother and improving the flatness of the surface PS to be ground (i.e., making it flat) compared with before the grinding operation; and / or making the surface roughness of the surface PS to be ground finer (i.e., reducing it)". In addition, if the surface PS to be ground is ground, there is a possibility that the hue of the surface PS to be ground changes compared with before the surface PS to be ground is ground. Therefore, the "grinding operation for grinding the surface PS to be ground" may also include "changing the hue of the surface PS to be ground compared with before the grinding operation". If the surface PS to be ground is ground, there is a possibility that at least one of the reflectance (e.g., the reflectance of any light) and the diffusivity (e.g., the diffusivity of any light) of the surface PS to be ground changes compared with before the surface PS to be ground is ground. Therefore, the "grinding operation for grinding the surface PS to be ground" may also include: "changing at least one of the reflectance and the diffusivity of the surface PS to be ground compared with before the grinding operation".

[0267] Such a surface PS to be ground may be a relatively rough surface (i.e., a surface formed with irregularities) that can be made smooth (or flat or have its surface roughness reduced) by the grinding operation. For example, as described above, in the present embodiment, the three-dimensional structure ST is formed by melting and then re-solidifying the powdery or granular modeling material M. Therefore, there is a possibility that the un-melted modeling material M adheres to at least a part of the surface of the three-dimensional structure ST. In this case, the surface to which the un-melted modeling material M adheres may be a relatively rough surface that can be made smooth by the grinding operation. Further, there is a possibility that the modeling material M re-solidifies in an unexpected shape and adheres to at least a part of the surface of the three-dimensional structure ST. In this case, the surface to which the modeling material M re-solidifies in an unexpected shape adheres may be a relatively rough surface that can be made smooth by the grinding operation. For example, as described above, in the present embodiment, during the formation of each structure layer SL, the modeling head 41 moves along at least one of the X-axis and the Y-axis (i.e., along the XY plane). In this case, depending on the relative movement pattern of the modeling head 41 with respect to the modeling surface CS, there is a possibility that regular or irregular irregularities corresponding to the movement pattern (typically, the movement pitch) of the modeling head 41 appear on at least a part of the surface of the structure layer SL along the XY plane (and thus, the surface of the three-dimensional structure layer ST). In this case, the surface on which the regular or irregular irregularities appear may be a relatively rough surface that can be made smooth by the grinding operation.

[0268] To grind the grinding target surface PS, the modeling system 1 irradiates the grinding target surface PS with light EL under the control of the control device 7. That is, in the present embodiment, the grinding target surface PS is ground with the light EL. Specifically, as shown in ​ (a), the control device 7 sets an irradiation area EA in a certain area portion on the grinding target surface PS, and irradiates the irradiation area EA with the light EL from the irradiation optical system 411. In addition, ​ (a) shows the following example: the grinding target surface PS is a surface with regular or irregular unevenness that should be ground by the grinding operation. At this time, the control device 7 moves the modeling head 41 as needed, and sets the irradiation area EA in the required area portion on the grinding target surface PS. If the irradiation area EA is irradiated with the light EL, then as shown in ​ (b), the modeling material M in the area portion of the grinding target surface PS where the irradiation area EA is set is remelted by the light EL. If the modeling material M solidified in a manner of forming unevenness is melted, the surface (i.e., the interface) of the melted modeling material M approaches a flat surface or becomes a flat surface by at least one of the self-weight and surface tension of the melted modeling material M. That is, the smoothness of the surface (i.e., the interface) of the melted modeling material M is improved. Then, if the melted modeling material M is no longer irradiated with the light EL as the modeling head 41 moves, the melted modeling material M cools and solidifies again (i.e., solidifies). As a result, as shown in ​ (c), the modeling material M that is re-solidified in a manner of having a smoother (or, improved flatness and / or finer surface roughness) surface constitutes the surface of the three-dimensional structure ST. As described above, the grinding target surface PS is ground by the grinding operation.

[0269] The control device 7 repeatedly performs a series of grinding processes including the melting of the modeling material M by the irradiation of the light EL and the re-solidification of the melted modeling material M while relatively moving the modeling head 41 relative to the three-dimensional structure ST. That is, the control device 7 repeatedly performs a series of grinding processes while relatively moving the irradiation area EA relative to the grinding target surface PS. Specifically, for example, the control device 7 may also repeatedly perform a series of grinding processes while repeatedly performing the movement of the irradiation area EA along the Y-axis direction and the movement of the irradiation area EA along the X-axis direction. That is, the control device 7 may also move along with reference to ​(a) The movement locus corresponding to the scanning of the raster scan described is used to move the irradiation area EA, and a series of polishing processes are repeatedly performed while moving the irradiation area EA. In this case, while the irradiation area EA is moving along either one of the X-axis and the Y-axis with a larger movement amount per single movement, the irradiation light EL is used to polish the polishing target surface PS. On the other hand, while the irradiation area EA is moving along the other axis with a smaller movement amount per single movement of the X-axis and the Y-axis, the light EL is not irradiated. However, the control device 7 may also move along the movement locus corresponding to the scanning of the vector scan described with reference to ​ (b) to move the irradiation area EA and repeatedly perform a series of polishing processes while moving the irradiation area EA.

[0270] In both the modeling operation (or marking operation) and the polishing operation, when the irradiation area EA moves along the movement locus corresponding to the scanning of the raster scan, the control device 7 can also move the irradiation area EA in such a way that the moving direction of the irradiation area EA during the period when the light EL is irradiated in the modeling operation and the moving direction of the irradiation area EA during the period when the light EL is irradiated in the polishing operation intersect (i.e., are different). Specifically, as shown in ​ (a) and ​ (b), when the moving direction of the irradiation area EA during the period when the light EL is irradiated in the modeling operation is the Y-axis direction, the control device 7 can also set the moving direction of the irradiation area EA in the polishing operation in such a way that the moving direction of the irradiation area EA during the period when the light EL is irradiated in the polishing operation becomes the X-axis direction. Or, when the moving direction of the irradiation area EA during the period when the light EL is irradiated in the modeling operation is the X-axis direction, the moving direction of the irradiation area EA in the polishing operation can also be set in such a way that the moving direction of the irradiation area EA during the period when the light EL is irradiated in the polishing operation becomes the Y-axis direction. As a result, the modeling system 1 can appropriately polish the polishing target surface PS where the unevenness generated due to the movement pattern (typically the movement pitch) of the modeling head 41 during the modeling operation exists, so as to smooth the unevenness (especially remove the unevenness from the polishing target surface PS). In addition, the moving direction of the irradiation area EA during the period when the light EL is irradiated in the modeling operation and the moving direction of the irradiation area EA during the period when the light EL is irradiated in the polishing operation may not be orthogonal.

[0271] Alternatively, when the irradiation area EA moves along a movement locus corresponding to the scanning by raster scanning during both the shaping operation (or marking operation) and the polishing operation, the control device 7 can also move the irradiation area EA in such a manner that the moving direction of the irradiation area EA during the period when the light EL is irradiated during the shaping operation and the moving direction of the irradiation area EA during the period when the light EL is irradiated during the polishing operation are the same (i.e., identical). In this case, the polishing target surface PS can still be polished. However, in this case, the control device 7 can also move the irradiation area EA in such a manner that the one-time movement amount (i.e., the movement pitch) of the irradiation area EA during the period when the light EL is not irradiated during the shaping operation and the one-time movement amount of the irradiation area EA during the period when the light EL is not irradiated during the polishing operation are different. In particular, the control device 7 can move the irradiation area EA in such a manner that the movement amount of the irradiation area EA during the period when the light EL is not irradiated during the polishing operation is smaller than the movement amount of the irradiation area EA during the period when the light EL is not irradiated during the shaping operation. For example, specifically, as shown in ​ (a) and ​ (b), when the movement amount of the irradiation area EA during the period when the light EL is not irradiated during the shaping operation is the first movement amount P1, the control device 7 can also move the irradiation area EA in such a manner that the movement amount of the irradiation area EA during the period when the light EL is not irradiated during the polishing operation becomes the second movement amount P2 that is smaller than the first movement amount P1. As a result, the shaping system 1 can appropriately polish the polishing target surface PS where the unevenness generated by the movement pattern of the shaping head 41 exists during the shaping operation to make the unevenness smooth. In addition, the movement pitch of the irradiation area EA during the period when the light EL is not irradiated during the polishing operation can be larger or smaller than the movement pitch of the irradiation area EA during the period when the light EL is not irradiated during the shaping operation.

[0272] The control device 7 can also control the size of the irradiation area EA in such a way that the size of the irradiation area EA during the shaping operation when the light EL is irradiated is different from the size of the irradiation area EA during the polishing operation when the light EL is irradiated. For example, the control device 7 can also control the size of the irradiation area EA in such a way that the irradiation area EA during the shaping operation when the light EL is irradiated is larger than the irradiation area EA during the polishing operation when the light EL is irradiated. For example, the control device 7 can also control the size of the irradiation area EA in such a way that the irradiation area EA during the shaping operation when the light EL is irradiated is smaller than the irradiation area EA during the polishing operation when the light EL is irradiated. It can also be moved. In this case, the shaping system 1 can also appropriately polish the polishing object surface PS where the unevenness caused by the movement pattern of the shaping head 41 during the shaping operation exists, so that the unevenness becomes smooth. In addition, the specific method for controlling the size of the irradiation area EA can be the same as the specific method for controlling the size of the irradiation area EA in the above-mentioned size control operation. In addition, the control device 7 can also control the size of the irradiation area EA in such a way that the irradiation area EA during the shaping operation when the light EL is irradiated is smaller than the irradiation area EA during the polishing operation when the light EL is irradiated.

[0273] (6) Modified example

[0274] (6-1) First modified example

[0275] First, the first modified example of the shaping system 1 will be described. In the above description, in order to suppress the unevenness of the height h1 of the shaped object S1 in the region WA1 where the irradiation area EA is set two or more times during the layer formation period and the height h2 of the shaped object S2 in the region WA2 where the irradiation area EA is set once during the layer formation period, the control device 7 performs the first unevenness suppression operation. On the other hand, the shaping system 1a in the first modified example can suppress the unevenness of the height h1 of the shaped object S1 and the height h2 of the shaped object S2 even without performing the first unevenness suppression operation.

[0276] Specifically, the difference between the shaping system 1a and the shaping system 1 is that it is provided with a shaping device 4a instead of the shaping device 4. The difference between the shaping device 4a and the shaping device 4 is that it is provided with an irradiation optical system 411a as a condenser optical system instead of the irradiation optical system 411. The difference between the irradiation optical system 411a and the irradiation optical system 411 is that the optical characteristics are preset (in other words, designed or adjusted) to suppress the unevenness of the height h1 of the shaped object S1 and the height h2 of the shaped object S2. Other components of the shaping system 1a can be the same as those of the shaping system 1.

[0277] The optical characteristics of the irradiation optical system 411a are preset to suppress the unevenness between the height h1 of the modeled object S1 and the height h2 of the modeled object S2. In the present embodiment, the depth of focus is used as the optical characteristic of the irradiation optical system 411a. Therefore, the depth of focus of the irradiation optical system 411a is preset to suppress the unevenness between the height h1 of the modeled object S1 and the height h2 of the modeled object S2. The depth of focus is related to the numerical aperture (NA: Numerical Aperture), which is another example of the optical characteristics of the irradiation optical system 411a. Therefore, the numerical aperture of the irradiation optical system 411a may also be preset to suppress the unevenness between the height h1 of the modeled object S1 and the height h2 of the modeled object S2. In addition, the so-called depth of focus in this description may also refer to the range in the optical axis direction (the traveling direction of light) where the amount of intensity or energy per unit area of the light EL becomes greater than the intensity capable of melting the modeling material M.

[0278] The depth of focus of the irradiation optical system 411a is set based on the designed height (i.e., thickness) h0 of the construction layer SL formed by the modeling system 1a. Specifically, as shown in ​ the depth of focus of the irradiation optical system 411a is set to satisfy the following first condition: the size of the depth of focus (in other words, the width along the Z-axis) becomes less than twice the designed height h0 of the construction layer SL. That is, the depth of focus of the irradiation optical system 411a is set to satisfy the following first condition: two or more stacked construction layers SL cannot be simultaneously within the range of the depth of focus (i.e., a part of two or more stacked construction layers SL is out of the range of the depth of focus).

[0279] When such a condition is satisfied, consider the situation where the second irradiation area EA is set in the area WA1. In this case, if the first irradiation area EA is set in the area WA1, as shown in ​ (a), a modeled object SOa with a height ha equal to the height h0 is formed in the area WA1. Then, if the second irradiation area EA is set in the area WA1, there is a possibility of forming a new modeled object SOb on the modeled object SOa that has already been formed in the area WA1. However, since the size of the depth of focus is less than twice the height h0, as shown in ​As shown in (b), even if it is assumed that a new shaped object SOb is formed, its height hb is smaller than the height h0. The reason is that in the region outside the depth of focus range, since the intensity of the light EL is insufficient, the shaping material M does not melt. On the other hand, when the first condition is not satisfied, if the second irradiation region EA is set in the region WA1, there is a possibility of forming a shaped object SOb on the shaped object SOa with a height hb equal to the height h0. Therefore, when the first condition is satisfied, compared with the case where the first condition is not satisfied, the unevenness between the height h1 of the shaped object S1 formed in the region WA1 (= the sum of the height ha of the shaped object SOa and the height hb of the shaped object SOb) and the height h2 of the shaped object S2 formed in the region WA2 (= the height ha of the shaped object SOa) is suppressed. That is, even if the shaping system 1a does not control at least one of the supply rate of the shaping material M, the heat transfer rate related to the heat transferred from the light EL, and the moving speed of the irradiation region EA as described above, the unevenness between the height h1 of the shaped object S1 and the height h2 of the shaped object S2 can be appropriately suppressed.

[0280] The shaped object is formed on the shaping surface CS. Further, since the shaping material M melts within the depth of focus range of the irradiation optical system 411a, the shaped object is formed within the depth of focus range. Therefore, as shown in ​ (a) and Figure 51 (b), it is formed between the shaping surface CS and the boundary UB of the depth of focus range on the object surface side (the +Z side, the upper side in the examples shown in Figure 51 (a) and Figure 51 (b)) of the irradiation optical system 411a. In this way, in order to form a shaped object with the same design height h0 as the construction layer SL on the shaping surface CS, as shown in Figure 51 (a) and Figure 51 (b), the irradiation optical system 413 can be aligned with respect to the shaping surface CS such that the interval between the shaping surface CS and the boundary UB is h0 or more. Figure 51 (a) shows an example where the interval between the shaping surface CS and the boundary UB is equal to the height h0. In this case, a shaped object with a height of h0 is formed on the shaping surface CS. On the other hand, Figure 51 (b) shows an example where the interval between the shaping surface CS and the boundary UB is greater than the height h0. In this case, a shaped object with a height of at least h0 is formed on the shaping surface CS. In addition, as shown in Figure 51 (a), the state where the interval between the shaping surface CS and the boundary UB is equal to the height h0 is equivalent to the state where the focusing position of the light EL is set on the shaping surface CS. Similarly, as shown in Figure 51(As shown in (b), the state where the interval between the shaping surface CS and the boundary UB is greater than the height h0 is equivalent to the state where the focusing position of the light EL is set at a position shifted toward the object surface side of the irradiation optical system 411a with respect to the shaping surface CS.)

[0281] However, if the size of the depth of focus of the irradiation optical system 411a becomes less than the designed height h0 of the structure layer SL, the interval between the shaping surface CS and the boundary UB cannot be set to be h0 or more. As a result, a shaped object with a height of h0 cannot be formed on the shaping surface CS. Therefore, the depth of focus of the irradiation optical system 411a can also be set to satisfy the following second condition at the same time: the size of the depth of focus is equal to or greater than the designed height h0 of the structure layer SL.)

[0282] In addition, in the first modification example, the shaping system 1a can also perform the first unevenness suppression operation.)

[0283] (6-2) Second modification example

[0284] Next, with reference to Figure 52 , the second modification example of the shaping system 1 will be described. The difference between the shaping system 1b in the second modification example and the shaping system 1 lies in that the shaping device 4 is replaced by a shaping device 4b. The difference between the shaping device 4b and the shaping device 4 lies in that the drive system 45b is provided. Other components of the shaping system 1a can be the same as those of the shaping system 1.)

[0285] The drive system 45b moves the platform 43. The drive system 45b moves the platform 43 along at least any one of the X-axis, Y-axis, and Z-axis. In addition to at least any one of the X-axis, Y-axis, and Z-axis, the drive system 45b can also move the platform 43 along at least one direction among the θX direction, θY direction, and θZ direction. The drive system 45b includes, for example, a motor. If the platform 43 moves, the workpiece W held by the platform 43 (and further, the structure layer SL on the workpiece W) moves relative to the shaping head 41. That is, the shaping surface CS, which is at least a part of the surface of the workpiece W or the structure layer SL, moves relative to the irradiation area EA (that is, the supply area MA where the shaping material M is supplied by the shaping head 41) where the light EL is irradiated from the shaping head 41. Therefore, in the second modification example, the control device 7 can control the relative movement speed of the irradiation area EA with respect to the shaping surface CS by controlling the drive system 45b in addition to or instead of controlling the drive system 42.)

[0286] (6-3) Third modification example

[0287] Next, with reference to Figure 53 (a) and Figure 53(b) illustrates the third modification example of the shaping system 1. The shaping system 1c in the third modification example differs from the shaping system 1 in that: instead of the shaping device 4, it is provided with a shaping device 4c. The shaping device 4c differs from the shaping device 4 in that: instead of the irradiation optical system 411, it is provided with an irradiation optical system 411c. As shown in Figure 53 (a), the irradiation optical system 411c differs from the irradiation optical system 411 in that: it is provided with an optical system 491c that can deflect the light EL. Other components of the shaping system 1a can also be the same as those of the shaping system 1.

[0288] As shown in Figure 53 (b), the optical system 491c includes a focusing lens 4911c, a galvanometer mirror 4912c, and an fθ lens 4913c. The light EL is irradiated onto the shaping surface CS (and further, the surface PS to be polished as needed) through the focusing lens 4911c, the galvanometer mirror 4912c, and the fθ lens 4913c.

[0289] The focusing lens 4911c is composed of one or more lenses, and is an optical element that adjusts the focusing position of the light EL (i.e., the focal position of the optical system 491c) by adjusting the position of at least a part of the lenses along the optical axis direction. The galvanometer mirror 4912c deflects the light EL in such a way that the light EL scans the shaping surface CS (i.e., the irradiation area EA moves on the shaping surface CS). The galvanometer mirror 4912c includes an X scanning mirror 4912X and a Y scanning mirror 4912Y. The X scanning mirror 4912X reflects the light EL to the Y scanning mirror 4912Y. The X scanning mirror 4912X can swing or rotate in the θY direction (i.e., the rotation direction around the Y axis). By the swing or rotation of the X scanning mirror 4912X, the light EL scans the shaping surface CS along the X axis direction. By the swing or rotation of the X scanning mirror 4912X, the irradiation area EA moves on the shaping surface CS along the X axis direction. The Y scanning mirror 4912Y reflects the light EL to the fθ lens 4913c. The Y scanning mirror 4912Y can swing or rotate in the θX direction (i.e., the rotation direction around the X axis). By the swing or rotation of the Y scanning mirror 4912Y, the light EL scans the shaping surface CS along the Y axis direction. By the swing or rotation of the Y scanning mirror 4912Y, the irradiation area EA moves on the shaping surface CS along the Y axis direction. The fθ lens 4913c is an optical element that condenses the light EL from the galvanometer mirror 4912c onto the shaping surface CS.

[0290] Therefore, in the third modification example, the control device 7 can control the relative movement speed of the irradiation area EA with respect to the shaping surface CS by controlling the optical system 491c (especially the galvanometer mirror 4912c) in addition to or instead of controlling the drive system 42.

[0291] In addition, in the third modification example, the material nozzle 412 that supplies the molding material M can also move along at least one of the X-axis, Y-axis, and Z-axis in order to supply the molding material M to the molten pool MP formed on the molding surface CS of the irradiation area EA according to the position on the molding surface CS of the irradiation area EA.

[0292] (6-4) Fourth modification example

[0293] Next, a fourth modification example of the molding system 1 will be described. In the above description, the molding head 41 included in the molding system 1 emits both the light EL used in the molding operation and the light EL used in the polishing operation. That is, the optical path length in the light irradiation optical system 411 during the molding operation is the same as the optical path length in the light irradiation optical system 411 during the polishing operation. On the other hand, the molding system 1d of the fourth modification example includes a polishing head 41d that emits the light EL used in the polishing operation separately from the molding head 41 that emits the light EL used in the molding operation.

[0294] Specifically, the molding system 1d is different from the molding system 1 in that it includes a molding device 4d instead of the molding device 4. The molding device 4d is different from the molding device 4 in that it includes a polishing head 41d and a drive system 42d. Other components of the molding system 1d can be the same as those of the molding system 1. Therefore, hereinafter, with reference to Figure 54 , the molding device 4d of the fourth modification example will be further described. In addition, for components that are the same as those included in the molding system 1, the same reference numerals are used and their detailed descriptions are omitted.

[0295] As Figure 54 shown, in addition to the above-mentioned molding head 41, drive system 42, and platform 43, the molding device 4d further includes a polishing head 41d and a drive system 42d. The polishing head 41d includes a light irradiation optical system 411d.

[0296] The irradiation optical system 411d is an optical system (e.g., a condensing optical system) for emitting the light ELd from the emission unit 413d. Specifically, the irradiation optical system 411d is optically connected to the light source 5 that emits the light EL via a light transmission member (not shown) such as an optical fiber or a light pipe. The irradiation optical system 411d emits the light EL that has propagated from the light source 5 via the light transmission member as the light ELd. That is, the light EL emitted by the light source 5 is branched into two lights EL by a beam splitter disposed between the light source 5 and the modeling device 4d or within the modeling device 4d, one of the lights EL propagates to the modeling head 41, and the other light EL propagates to the grinding head 41d. The irradiation optical system 411d irradiates the light ELd downward (i.e., the Z side) from the irradiation optical system 411d. A platform 43 is disposed below the irradiation optical system 411d. When a three-dimensional structure ST is mounted on the platform 43, the irradiation optical system 411d irradiates the three-dimensional structure ST with the light ELd. Specifically, the irradiation optical system 411d irradiates the light ELd onto a circular (or any other shape) irradiation area EAd that is set on the grinding target surface PS as the area irradiated with the light ELd. Although the irradiation area EAd is set at a position different from the irradiation area EA irradiated with the light EL from the modeling head 41, it may also be set at the same position. Although the irradiation area EAd does not overlap with the irradiation area EA, it may at least partially overlap. Furthermore, the state of the irradiation optical system 411d can be switched between a state of irradiating the irradiation area EAd with the light ELd and a state of not irradiating the irradiation area EAd under the control of the control device 7.

[0297] The drive system 42d moves the grinding head 41d. Specifically, the drive system 42d moves the grinding head 41d along the X-axis, Y-axis, and Z-axis, respectively. In addition, the configuration of the drive system 42d may be the same as the configuration of the drive system 42. Therefore, a detailed description of the configuration of the drive system 42d is omitted.

[0298] Since the polishing head 41d is prepared separately from the shaping head 41, the polishing head 41d irradiates the light ELd from a direction different from that of the shaping head 41. That is, the light ELd propagates on an optical path different from the optical path of the light EL and is irradiated onto the polishing target surface PS. Therefore, the polishing head 41d can irradiate the light ELd during at least a part of the period when the shaping head 41 irradiates the light EL. That is, the shaping system 1d can perform the shaping action and the polishing action simultaneously. In other words, the shaping system 1d can set the time zone (or period) of performing the shaping action and the time zone (or period) of performing the polishing action to a state where at least a part of them overlaps, or at least a part of the moment of performing the shaping action and the moment of performing the polishing action overlaps. Specifically, during at least a part of the period when the three-dimensional structure ST is formed by irradiating the light EL onto an area on the shaping surface CS by the shaping head 41, the shaping system 1d can polish the polishing target surface PS by irradiating the light ELd onto at least a part of the surface of another part of the three-dimensional structure ST that has been formed on other areas on the shaping surface CS. As a result, the processing amount for forming the three-dimensional structure ST and performing polishing is increased. That is, the shaping system 1d of the fourth modification example not only enjoys the same effects as those that the above-described shaping system 1 can enjoy, but also can increase the processing amount for forming the polished three-dimensional structure ST.

[0299] However, even in the case where the shaping device 4d is separately provided with the polishing head 41d from the shaping head 41, the shaping system 1d can perform the polishing action after forming the three-dimensional structure ST by the shaping action. That is, even in this case, the shaping system 1d of the fourth modification example can enjoy the same effects as those that the above-described shaping system 1 can enjoy.

[0300] In addition, Figure 54 in, the light EL emitted from the common light source 5 propagates to the shaping head 41 and the polishing head 41d. However, the shaping system 1d can also be separated from the light source 5 that emits the light EL used in the shaping action, and additionally provided with a light source 5d that emits the light ELd used in the polishing action. The light source 5d can also emit the light ELd having the same characteristics (for example, intensity, wavelength, or polarization, etc.) as the light EL emitted by the light source 5d. The light source 5d can also emit the light ELd having different characteristics (for example, intensity, wavelength, or polarization, etc.) from the light EL emitted by the light source 5. The light source 5d can also emit an energy beam of a different type from the light EL emitted by the light source 5.

[0301] (6-5) Fifth Modification Example

[0302] Next, a fifth modification example of the modeling system 1 will be described. In the above description, the modeling system 1 includes a single modeling head 41. On the other hand, the modeling system 1e of the fifth modification example includes a plurality of modeling heads 41. Specifically, the modeling system 1e is different from the modeling system 1 in that: instead of the modeling device 4, it includes a modeling device 4e. The modeling device 4e is different from the modeling device 4 in that: it includes a plurality of modeling heads 41. Other components of the modeling system 1e may be the same as those of the modeling system 1. Therefore, hereinafter, with reference to Figure 55 , the modeling device 4e of the fifth modification example will be further described. In addition, for components that are the same as those included in the modeling system 1, the same reference numerals are used and their detailed descriptions are omitted.

[0303] As Figure 55 shown, the modeling device 4d includes a plurality of modeling heads 41. The plurality of modeling heads 41 are assembled in the support frame 48e in a linear arrangement along either the X-axis or the Y-axis (in the example shown in Figure 55 it is the Y-axis). The drive system 42 moves the support frame 48e along at least any one of the X-axis, Y-axis, and Z-axis. That is, the drive system 42 moves the plurality of modeling heads 41 together along at least any one of the X-axis, Y-axis, and Z-axis.

[0304] With such a modeling system 1e of the fifth modification example, a plurality of light ELs can be simultaneously irradiated onto the modeling surface CS to form the three-dimensional structure ST. Therefore, as a result, the processing amount for forming the three-dimensional structure ST is increased. That is, the modeling system 1e of the fifth modification example can not only enjoy the same effects as those that the above-mentioned modeling system 1 can enjoy, but also increase the processing amount for forming the three-dimensional structure ST.

[0305] In addition, the plurality of modeling heads 41 may not be assembled in the support frame 48e. In this case, the modeling device 4d may also include a plurality of drive systems 42 for moving the plurality of modeling heads 41 separately.

[0306] (6-6) Sixth modification example

[0307] In the above description, when the height of the modeled object from the modeling surface CS varies according to the position of the modeled object, the case where the modeling surface CS is a plane is taken as an example for description. However, the modeling surface CS itself is not limited to a plane, that is, the modeling surface CS itself may also have different heights (positions in the Z-axis direction) according to the position on the modeling surface CS. For example, as Figure 56As shown in (a), the shaping surface CS can also be a curved surface. In this case, with the upper surface of the structure layer SL#1 shaped on the upper part of the curved surface-shaped shaping surface CS along the XY plane, in other words, in such a way that regardless of the positions of the structure layer SL#1 in the X-axis direction and the Y-axis direction, the height in the Z-axis direction of the upper surface of the structure layer SL#1 is constant, the height corresponding to the position of the shaped object in the X-axis direction and the Y-axis direction can also be different. Also, as Figure 56 shown in (b), the shaping surface CS can also be concave-convex. In this case, with the upper surface of the structure layer SL#1 shaped on the upper part of the concave-convex shaped shaping surface CS along the XY plane, in other words, in such a way that regardless of the positions of the structure layer SL#1 in the X-axis direction and the Y-axis direction, the height in the Z-axis direction of the upper surface of the structure layer SL#1 is constant, the height corresponding to the position of the shaped object in the X-axis direction and the Y-axis direction can also be different. Also, as Figure 56 shown in (c), the shaping surface CS can also be the upper surface of the structure layer SL#1. In any case, regardless of the surface shape of the shaping surface CS, the upper surface of the shaped object SL#1 (and further, the structure layer SL#2) can be made flat. In this case, the upper surface of the structure layer SL#1 (and further, the structure layer SL#2) can also be set as a predetermined curved surface.

[0308] (6-7) The 7th modified example

[0309] In the above description, the height of the shaped object from the shaping surface CS varies according to the position of the shaped object. However, the height of the shaped object from the shaping surface CS may not vary according to the position of the shaped object (it can also be constant). For example, as Figure 57 shown, a structure layer SL#2 with a height different from that of the already shaped structure layer SL#1 (the dimension in the Z-axis direction (lamination direction)) can also be shaped on top of the structure layer SL#1. In this case, the accuracy of the height of the finally shaped three-dimensional structure ST in the lamination direction (Z-axis direction) can be made high-precision.

[0310] (6-8) The 8th modified example

[0311] The material nozzle 412 for supplying the shaping material M can also continuously supply the shaping material M during the period (hereinafter referred to as the first period) from the state where the supply area MA is located outside the workpiece W to the state where the supply area MA is located on the workpiece W and further at the shaping start position SP on the shaping surface CS. When it takes a long time from the time point when the material nozzle 412 starts supplying the shaping material M to the time point when the supply amount per unit time of the supplied material becomes stable, the supply amount per unit time at the shaping start position SP can be made stable.

[0312] At this time, there is a concern that the molding material MA impinges on the molding surface CS from the material nozzle 412 and damages the molding surface CS. In this case, as Figure 58 shown in (a), it is also possible to provide Figure 8 the gas ejection device 461 described in. Moreover, during the first period, it is also possible to eject gas from the gas ejection device 461 in a direction crossing the supply path of the molding material M, so that the molding material M that should be supplied from the material nozzle 412 to the supply area MA is directed toward the workpiece W and further to the outside of the molding surface CS. Then, as Figure 58 shown in (b), during the period (hereinafter referred to as the second period) when the supply area MA by the material nozzle 412 is located after the molding start position SP, it is also possible to stop the gas ejection operation of the gas ejection device 461 and start the supply of the molding material M from the material nozzle 412 to the supply area MA. Here, it is also possible to start irradiating the irradiation area EA with the light EL by the irradiation optical system 411 from the time point when the supply area MA by the material nozzle 412 is located at the molding start position SP.

[0313] In addition, the supply amount of the molding material M per unit time in the first period can be set to be less than the supply amount of the molding material M per unit time in the second period for forming the molded object. Also, in the above description, the gas ejection device 461 is used to direct the molding material M that should be supplied from the material nozzle 412 to the supply area MA toward the workpiece W and further to the outside of the molding surface CS, but it is also possible to use the shielding member 462 described by Figure 9 and it is also possible to change the supply direction (spray direction) of the supply nozzle 412 described by Figure 10 . Also, when the molding device 4 is provided with an arbitrary supply amount changing device different from the gas ejection device 461 and the shielding member 462, the control device 7 can also control the arbitrary supply amount changing device in order to control the supply rate of the molding material M. In addition, the arbitrary supply amount changing device can be the supply amount changing device 3a provided in the material supply device 3 as shown in Figure 59 , or it can be the supply amount adjusting device 481 provided on the supply path from the material supply device 3 to the supply outlet 414 of the material nozzle 412 as shown in Figure 60 . Such supply amount changing devices 3a and 481 can also use, for example, valves that can change the flow rate. In addition, Figure 59 and Figure 60 the supply amount changing devices 3a and 481 shown respectively can also be used as arbitrary supply amount changing devices different from the gas ejection device 461 and the shielding member 462 described by Figure 8 and Figure 9 .

[0314] (6-9) The ninth modification

[0315] When usingFigure 30 In the illustrated example, when focusing on the first movement of the irradiation area EA in the Y-axis direction (i.e., the movement until the movement direction changes, the movement along one scan line in raster scanning), when the irradiation area EA moves in the Y-axis direction, the irradiation light EL is irradiated at the moment when the marking formation area overlaps with the irradiation area EA. The height of the molded object molded by this first movement (furthermore, the multiple irradiations of the light EL performed during this first movement) becomes the same. However, when irradiating the light EL multiple times during the movement of the irradiation area EA in a predetermined direction (for example, a direction within the molding surface CS such as the Y-axis direction or the X-axis direction), and molding multiple molded objects arranged in the predetermined direction, the heights of these molded objects (the height from the molding surface CS in the Z-axis direction) can also be different from each other. For example, Figure 61 (a), at least one of the supply rate of the molding material M, the heat transfer rate, and the moving speed of the irradiation area EA is made different with respect to the area WA9 and the area WA10 arranged along the same scan line of raster scanning. By this operation, for example, Figure 61 as shown in (b), molded objects with different heights from the molding surface CS in the Z-axis direction can be molded.

[0316] Also, in the above example, the heights of multiple molded objects molded by the first movement of the irradiation area EA (i.e., the movement along one scan line in raster scanning) are changed with respect to each other. However, it is also possible to change the height (the height from the molding surface CS in the Z-axis direction) between multiple molded objects molded by the movement of the irradiation area EA along multiple scan lines in raster scanning (furthermore, the supply of the molding material M performed during the movement) along scan lines that are different from each other. For example, as Figure 62 (a) shows, at least one of the supply rate of the molding material M, the heat transfer rate, and the moving speed of the irradiation area EA is made different with respect to the area WA9 and the area WA11 arranged on different scan lines. By this operation, for example, Figure 62 as shown in (b), molded objects with different heights from the molding surface CS in the Z-axis direction can be molded.

[0317] In addition, in the ninth modification example, the marking action on the molding surface CS has been cited as an example. However, this ninth modification example can also be applied when the molding surface CS itself is the surface of a molded object formed by laminated molding.

[0318] (6 - 10) Other modification examples

[0319] In the above description, the shaping device 4 melts the shaping material M by irradiating the shaping material M with the light EL. However, the shaping device 4 may also irradiate an arbitrary energy beam onto the shaping material M to form a molten pool MP, and melt the shaping material M in the molten pool MP. In this case, in addition to or instead of including the irradiation optical system 411, the shaping device 4 may also include a beam irradiation device capable of irradiating an arbitrary energy beam. The arbitrary energy beam is not limited, and includes charged particle beams such as electron beams and ion beams, or electromagnetic waves.

[0320] In the above description, the shaping system 1 can form the three-dimensional structure ST by the laser thickening welding method. However, the shaping system 1 can also form the three-dimensional structure ST from the shaping material M by other methods that can form the three-dimensional structure ST by irradiating the shaping material M with the light EL (or, an arbitrary laser beam). Examples of other methods may include powder bed fusion methods such as selective laser sintering (SLS), binder jetting, or laser metal fusion (LMF).

[0321] At least a part of the constituent elements of the above-described embodiments can be appropriately combined with at least another part of the constituent elements of the above-described embodiments. A part of the constituent elements of the above-described embodiments may also not be used. Also, as long as the law permits, all the published gazettes and the disclosures of U.S. patents cited in the above-described embodiments are incorporated by reference as part of the description herein.

[0322] The present invention is not limited to the above-described embodiments, and can be appropriately modified within the scope not violating the gist or idea of the invention read from the scope of protection of the patent claims and the entire specification. The processing devices and methods, markings, shaping methods, computer programs, and recording media accompanying such modifications are also included in the scope of protection of the present invention.

[0323] Description of reference numerals:

[0324] 1: Shaping system

[0325] 3: Material supply device

[0326] 4: Shaping device

[0327] 41: Shaping head

[0328] 411: Irradiation optical system

[0329] 412: Material nozzle

[0330] 42: Drive system

[0331] 43: Platform

[0332] 5: Light source

[0333] W: Workpiece

[0334] M: Molding material

[0335] SL: Structure layer

[0336] CS: Molding surface

[0337] EA: Irradiation area

[0338] MA: Supply area

[0339] MP: Molten pool.

Claims

1. A processing device, characterized in that, Comprising: A shaping device having an energy beam irradiation unit that irradiates an energy beam onto the surface of an object to form an irradiation area on the surface, and a material supply unit that supplies a shaping material to the surface; A changing device that changes the positional relationship between the object and the irradiation area along a movement locus; And A control device that controls the shaping device and the changing device; The control device controls the changing device in such a manner that the movement locus when shaping an object on the object by the shaping device is different from the movement locus when grinding the shaped object by the energy beam from the energy beam irradiation unit.

2. The processing device according to claim 1, characterized in that: The control device controls the changing device in such a manner that the direction of the movement locus when shaping an object on the object by the shaping device intersects with the direction of the movement locus when grinding the shaped object by the energy beam from the energy beam irradiation unit.

3. The processing device according to claim 2, characterized in that: The control device controls the changing device in such a manner that the direction of the movement locus when shaping an object on the object by the shaping device is the same as the direction of the movement locus when grinding the shaped object by the energy beam from the energy beam irradiation unit.

4. The processing device according to any one of claims 1 to 3, characterized in that: The control device controls the changing device in such a manner as to change the pitch of the plurality of movement loci when shaping an object on the object by the shaping device and the pitch of the plurality of movement loci when grinding the shaped object by the energy beam from the energy beam irradiation unit.

5. The processing device according to claim 4, characterized in that: The control device controls the changing device in such a manner that the pitch of the plurality of movement loci when grinding the shaped object by the energy beam from the energy beam irradiation unit is smaller than the pitch of the plurality of movement loci when shaping an object on the object by the shaping device.

6. The processing device according to any one of claims 1 to 3, characterized in that: The control device controls the changing device in such a manner as to change the size of the irradiation area when shaping an object on the object by the shaping device and the size of the irradiation area when grinding the shaped object by the energy beam from the energy beam irradiation unit.

7. The processing device according to claim 6, characterized in that: The control device controls the changing device in such a manner that the size of the irradiation area when shaping an object on the object by the shaping device is larger than the size of the irradiation area when grinding the shaped object by the energy beam from the energy beam irradiation unit.

8. A processing device, characterized in that, Comprising: A first energy beam irradiation unit that irradiates a first energy beam onto the surface of an object to form a molten pool on the surface; A material supply unit that supplies a molding material to the surface; A second energy beam irradiation unit that irradiates the surface of the object with a second energy beam different from the first energy beam to grind the surface; A first changing device that changes the positional relationship between the object and the first energy beam irradiation unit; And A second changing device that changes the positional relationship between the object and the second energy beam irradiation unit.

9. The processing device according to claim 8, wherein: The first changing device changes the positional relationship between the object and the material supply unit.

10. The processing device according to claim 8, wherein: The irradiation direction of the first energy beam irradiated from the first energy beam irradiation unit to the surface is different from the irradiation direction of the second energy beam irradiated from the second energy beam irradiation unit to the surface.

11. The processing device according to any one of claims 8 to 10, wherein: At least a part of the irradiation period of the first energy beam irradiated from the first energy beam irradiation unit to the surface overlaps with at least a part of the irradiation period of the second energy beam irradiated from the second energy beam irradiation unit to the surface.

12. The processing device according to any one of claims 8 to 10, wherein: After the irradiation period of the first energy beam irradiated from the first energy beam irradiation unit to the surface, an irradiation period of the second energy beam irradiated from the second energy beam irradiation unit to the surface is set.

13. The processing device according to any one of claims 8 to 10, wherein: The first energy beam and the second energy beam are generated by light from a common light source.

14. The processing device according to any one of claims 8 to 10, wherein: The first energy beam is generated by light from a first light source; The second energy beam is generated by light from a second light source different from the first light source.

15. A processing device, characterized in that, Comprising: A first molding device having: a first energy beam irradiation unit that irradiates the surface of an object with a first energy beam to form a first irradiation area on the surface; and a first material supply unit that supplies a molding material to the first irradiation area; A second molding device having: a second energy beam irradiation unit that irradiates the surface of the object with a second energy beam to form a second irradiation area on the surface; And a second material supply unit that supplies a molding material to the second irradiation area; A first changing device that changes the positional relationship between the object and the first molding device; And A second changing device that changes the positional relationship between the object and the second molding device.

16. The processing device according to claim 15, wherein: The first energy beam and the second energy beam are simultaneously irradiated to the surface of the object.

17. A processing device, characterized in that, Comprising: A molding device having: an energy beam irradiation unit that irradiates the surface of an object with an energy beam to form a molten pool on the surface, and a material supply unit that supplies a molding material to the molten pool; A changing device that changes the positional relationship between the object and the molten pool; A gas supply device that supplies gas around the molten pool; and A control device that controls the gas supply device in such a way as to change the characteristics of the gas supplied to the periphery in order to change the color tone of the molded object molded by the molding device.

18. The processing device according to claim 17, wherein: The control device controls the characteristics of the gas during at least a part of the period of forming the molded object.

19. The processing device according to claim 17, wherein: The characteristics of the gas include the supply amount of the gas.

20. The processing device according to any one of claims 17 to 19, wherein: The gas contains oxygen.

21. The processing device according to any one of claims 17 to 19, wherein: The control device controls the color tone of at least a part of the molded object by controlling the concentration of the gas around the molten pool by controlling the characteristics of the gas.

22. A processing device, characterized in that, Comprising: A molding device having an energy beam irradiation unit that irradiates an energy beam on the surface of an object to form a molten pool on the surface, and a material supply unit that supplies a molding material into the molten pool; and A changing device that changes the positional relationship between the object and the molten pool; The changing device includes: A first changing device that changes the positional relationship between the object and the energy beam irradiation unit; and A second changing device that deflects the energy beam from the light source to move the irradiation area of the energy beam on the object; The second changing device changes the moving speed of the irradiation area on the object.

23. The processing device according to claim 22, wherein: The first changing device changes the positional relationship between the object and the material supply unit.

24. The processing device according to claim 22, wherein: The first changing device moves the material supply unit.

25. The processing device according to claim 23 or 24, wherein: The first changing device changes the supply position of the molding material performed by the material supply unit according to the position of the irradiation area on the surface.

26. The processing device according to claim 23 or 24, wherein: The second changing device includes a scanning member that deflects the energy beam from the light source to scan the energy beam; The energy beam irradiation unit includes a condensing optical system that condenses the energy beam from the scanning member.

27. The processing device according to claim 26, wherein: The energy beam irradiation unit further includes a focus changing optical system that changes the condensing position of the energy beam.

28. A processing method, characterized in that, Including: The action of irradiating an energy beam from an energy beam irradiation device on the surface of an object; The action of supplying a molding material to the surface; and A changing action of changing the positional relationship between the object and the molten pool; The changing action includes: An operation of changing the positional relationship between the object and the energy beam irradiation device; and a moving operation of deflecting the energy beam from the light source to move the irradiation area of the energy beam on the object; The moving operation includes: An operation of changing the moving speed of the irradiation area on the object.

29. A processing method, characterized in that, Includes: An operation of performing shaping by irradiating the surface of the object with an energy beam while supplying a shaping material; An operation of changing the positional relationship between the object and the irradiation area of the energy beam along a moving trajectory; And An operation of irradiating the surface of the shaped object obtained by performing the shaping with an energy beam to grind the shaped object; The moving trajectory when the object shapes the shaped object is different from the moving trajectory when grinding the shaped object.

30. A processing method, characterized in that, Includes: An operation of irradiating the surface of the object with a first energy beam from a first energy beam irradiation unit to form a molten pool on the surface; An operation of supplying a shaping material to the molten pool; An operation of irradiating the surface of the object with a second energy beam from a second energy beam irradiation unit, which is different from the first energy beam, to grind the surface; An operation of changing the positional relationship between the object and the first energy beam irradiation unit; And An operation of changing the positional relationship between the object and the second energy beam irradiation unit.

31. A processing method, characterized in that, Includes: An operation of irradiating the surface of the object with a first energy beam from a first energy beam irradiation unit to form a first irradiation area on the surface; An operation of supplying a shaping material from a first material supply unit to the first irradiation area; An operation of irradiating the surface of the object with a second energy beam from a second energy beam irradiation unit to form a second irradiation area on the surface; An operation of supplying a shaping material from a second material supply unit to the second irradiation area; An operation of changing the positional relationship between the object and the first material supply unit; And An operation of changing the positional relationship between the object and the second material supply unit.

32. A processing method, characterized in that, ​ ​ ​ ​ ​ ​ ​

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