Auxiliary region setting device

Abstract

The present application provides an auxiliary region setting device capable of reducing power consumption used in manufacturing semiconductors. The auxiliary region setting device is provided with: a vacuum pump (6) for exhausting process gas from a processing chamber (2) of a semiconductor manufacturing device; a cooling unit (7) for cooling a first circulation liquid used in the processing chamber (2); a heating unit (8) for heating a second circulation liquid used in the processing chamber (2); a decontamination device (10) for decontaminating the process gas exhausted from the vacuum pump (6); and a cooling liquid line (12) for flowing a cooling liquid supplied from a cooling source (15). The cooling liquid line (12) has a first downstream side line (26) for supplying the cooling liquid after passing through the decontamination device (10), the vacuum pump (6) and the cooling unit (7) to the heating unit (8), a second downstream side line (27) and a third downstream side line (28).

Description

Technical Field

[0001] This invention relates to a subfab area arrangement device used in semiconductor manufacturing apparatuses such as etching apparatuses, and more particularly to a subfab area arrangement device for cooling and heating circulating fluids used in semiconductor manufacturing apparatuses. Background Technology

[0002] In the dry etching process, one of the semiconductor manufacturing steps, an etching apparatus is used, located in a cleanroom. The auxiliary area beneath the floor of the etching apparatus includes: a decontamination device for decontaminating the processing gases used in etching; a vacuum pump for exhausting the processing gases from the etching chamber; a cooling unit for cooling the circulating fluid flowing within the etching chamber; and a heating unit for heating the circulating fluid flowing within the etching chamber. The heating unit can be configured to heat the circulating fluid using hot gas from a compressor, using an electric heater, or using both hot gas and a heater. Furthermore, the decontamination device, vacuum pump, cooling unit, and heating unit are each cooled by cooling water (however, electric heater-type heating units do not require cooling water).

[0003] Patent Document 1 discloses a waste heat utilization system that uses 80°C warm cooling water from a vertical heat treatment apparatus (semiconductor wafer heat treatment apparatus) of a semiconductor manufacturing plant as a heating source for an etching apparatus.

[0004] Patent Document 2 discloses a waste heat recovery and reuse system for a resin tower and a reverse osmosis membrane device that uses a heat pump to absorb waste heat from a purifying device and use it as a heating source for purifying raw water in a water treatment device in a semiconductor manufacturing facility.

[0005] Patent document 3 discloses a method of integrating the pest control unit with the vacuum pump and sharing the cooling water.

[0006] Patent document 4 discloses a waste heat utilization system that connects multiple waste heat generating devices and waste heat utilization devices using a waste heat transport path.

[0007] Existing technical documents

[0008] Patent documents

[0009] Patent Document 1: International Publication No. 2002 / 067301

[0010] Patent Document 2: Japanese Patent Application Publication No. 2019-174050

[0011] Patent Document 3: Japanese Patent Application Publication No. 2014-231822

[0012] Patent Document 4: Japanese Patent Application Publication No. 2006-313048

[0013] As the number of etching units increases, so does the number of devices in these auxiliary areas. These devices operate independently without heat exchange between them, and are not optimized as a whole from the perspective of the auxiliary area's equipment. Therefore, the power consumption increases accordingly with the increase in the number of devices. Summary of the Invention

[0014] Therefore, the present invention provides an auxiliary area setting device that can effectively utilize the waste heat generated in a semiconductor manufacturing apparatus and reduce the electrical energy consumption used in manufacturing semiconductors.

[0015] In one embodiment, an auxiliary area setting device is provided, which is an auxiliary area setting device used in a semiconductor manufacturing apparatus, comprising: a vacuum pump for exhausting process gas from a processing chamber of the semiconductor manufacturing apparatus; a cooling unit for cooling a first circulating liquid after use in the processing chamber; a heating unit for heating a second circulating liquid after use in the processing chamber; a purging device for purifying the process gas discharged from the vacuum pump; and a coolant line for supplying coolant supplied from a cooling source, wherein the cooling unit includes a device for controlling the flow of coolant. The first heat pump for refrigerant circulation, the heating unit including a second heat pump for refrigerant circulation, the coolant pipeline having: a first upstream pipeline, a second upstream pipeline and a third upstream pipeline for supplying the coolant to the purging device, the vacuum pump and the cooling unit respectively; a first downstream pipeline, a second downstream pipeline and a third downstream pipeline for supplying the coolant after passing through the purging device, the vacuum pump and the cooling unit to the heating unit; and a coolant return pipeline for returning the coolant after passing through the heating unit to the cooling source.

[0016] According to the present invention, the coolant, which has been heated while passing through the sterilization device, vacuum pump, and cooling unit, can be used as a heat source at the heating unit. Therefore, electrical equipment such as electric heaters can be eliminated or its capacity reduced. Furthermore, since the coolant, after being cooled while passing through the heating unit, is returned to the cooling source, the power required for the cooling source (e.g., a chiller installed in a semiconductor manufacturing plant) to re-cool the coolant can be reduced. As a result, the electrical energy consumption used in semiconductor manufacturing can be reduced.

[0017] In one configuration, the first downstream pipeline, the second downstream pipeline, and the third downstream pipeline merge to form a confluence pipeline extending toward the heating unit. The coolant pipeline also includes a bypass pipeline branching from the confluence pipeline and connected to the coolant return pipeline.

[0018] In one embodiment, the auxiliary area installation device further comprises: a first flow control valve, a second flow control valve, and a third flow control valve, respectively disposed on the first upstream pipeline or the first downstream pipeline, the second upstream pipeline or the second downstream pipeline, and the third upstream pipeline or the third downstream pipeline; a first temperature measuring device, a second temperature measuring device, and a third temperature measuring device for measuring the temperature of the coolant flowing in the first downstream pipeline, the second downstream pipeline, and the third downstream pipeline; and a heating unit flow control valve disposed on the confluence pipeline and the... The system includes: a coolant return line or the aforementioned bypass line; a heating unit flow meter for measuring the flow rate of the coolant flowing within the heating unit, installed in the confluence line or the coolant return line; and a valve control unit that controls the operation of the first flow control valve, the second flow control valve, and the third flow control valve to keep the temperature of the coolant flowing in the first downstream line, the second downstream line, and the third downstream line constant, and controls the operation of the heating unit flow control valve to keep the flow rate of the coolant flowing in the heating unit constant.

[0019] According to the present invention, the temperature and flow rate of the coolant flowing in the heating unit remain constant, thus the heating unit is able to stably heat the second circulating liquid.

[0020] In one embodiment, the auxiliary area installation device further includes: a return temperature measuring device for measuring the temperature of the coolant flowing in the coolant return line; and a heat pump control unit for controlling the operation of the second heat pump of the heating unit to maintain the temperature of the coolant flowing in the coolant return line above a set value.

[0021] According to the present invention, it is possible to prevent the temperature of the coolant returning to the cooling source from dropping too low.

[0022] In one embodiment, the auxiliary area installation device further includes a buffer tank connected to the first downstream pipeline, the second downstream pipeline, and the third downstream pipeline.

[0023] According to the present invention, the coolant, after being heated while passing through the pest control device, vacuum pump, and cooling unit, is temporarily stored in a buffer tank before being supplied to the heating unit. The buffer tank can reduce temperature fluctuations of the heated coolant and stabilize the flow rate of coolant supplied to the heating unit.

[0024] In one configuration, the first downstream pipeline, the second downstream pipeline, and the third downstream pipeline merge to form a confluence pipeline extending toward the heating unit. The coolant pipeline also includes a reheating pipeline branching off from the confluence pipeline, which extends from the confluence pipeline to the first upstream pipeline.

[0025] According to the present invention, when the coolant in the buffer tank is not hot enough as a driving heat source for heating the second circulating liquid flowing in the heating unit, the coolant can be returned to the decontamination device for reheating.

[0026] In one embodiment, the coolant line further includes a bypass line branching from the combined line and connected to the coolant return line. The auxiliary area installation device further includes: an in-tank temperature measuring device for measuring the temperature of the coolant in the buffer tank; a reheating flow control valve installed on the reheating line; a heating unit flow control valve installed on the bypass line, the combined line, or the coolant return line; and a valve control unit that controls the operation of the reheating flow control valve and the heating unit flow control valve in such a way that the flow rate of the coolant flowing in the reheating line is a predetermined value when the temperature of the coolant in the buffer tank is below a set value.

[0027] According to the present invention, when the coolant in the buffer tank is not hot enough as a driving heat source for heating the second circulating liquid flowing in the heating unit, the coolant can be returned to the decontamination device for reheating.

[0028] In one embodiment, the coolant pipeline further includes a second reheating pipeline branching from the second downstream pipeline and a third reheating pipeline branching from the third downstream pipeline, wherein the second and third reheating pipelines are connected to the first upstream pipeline via a pressure pump.

[0029] According to the present invention, when the coolant after passing through the vacuum pump and cooling unit is not hot enough as a driving heat source for heating the second circulating liquid flowing in the heating unit, the coolant can be returned to the decontamination device for reheating.

[0030] In one embodiment, the auxiliary area installation device further comprises: a second downstream flow control valve, which is installed on the second downstream pipeline at a position downstream of the branch point of the second downstream pipeline and the second reheating pipeline; a third downstream flow control valve, which is installed on the third downstream pipeline at a position downstream of the branch point of the third downstream pipeline and the third reheating pipeline; a second temperature measuring device and a third temperature measuring device, which are used to measure the temperature of the coolant flowing in the second downstream pipeline and the third downstream pipeline; and a second reheating flow rate. A control valve and a third reheating flow control valve are respectively provided in the second reheating pipeline and the third reheating pipeline; and a valve control unit configured to decrease the opening of the second downstream flow control valve and increase the opening of the second reheating flow control valve when the temperature of the coolant flowing in the second downstream pipeline is lower than a threshold value, and decrease the opening of the third downstream flow control valve and increase the opening of the third reheating flow control valve when the temperature of the coolant flowing in the third downstream pipeline is lower than a threshold value.

[0031] According to the present invention, when the coolant after passing through the vacuum pump and cooling unit is not hot enough as a driving heat source for heating the second circulating liquid flowing in the heating unit, the coolant can be returned to the decontamination device for reheating.

[0032] In one embodiment, the auxiliary area installation device further includes: a first downstream flow control valve disposed on the first downstream pipeline; and a heating unit flow meter for measuring the flow rate of the coolant flowing in the heating unit. The valve control unit is further configured to control the operation of the first downstream flow control valve to keep the flow rate of the coolant flowing in the heating unit constant.

[0033] According to the present invention, the flow rate of the coolant flowing in the heating unit remains constant, so the heating unit can stably heat the second circulating liquid.

[0034] In one embodiment, the coolant pipeline further includes a second return pipeline branching from the second downstream pipeline and a third return pipeline branching from the third downstream pipeline, wherein the second return pipeline and the third return pipeline are connected to the coolant return pipeline.

[0035] According to the present invention, when the coolant after passing through the vacuum pump and cooling unit is not hot enough as a driving heat source for heating the second circulating liquid flowing in the heating unit, the coolant is not supplied to the heating unit, but is returned to the cooling source, thereby maintaining the heating function of the heating unit.

[0036] In one embodiment, the auxiliary area installation device further comprises: a first downstream flow control valve disposed on the first downstream pipeline; a second downstream flow control valve disposed on the second downstream pipeline at a position downstream of the branch point of the second downstream pipeline and the second return pipeline; a third downstream flow control valve disposed on the third downstream pipeline at a position downstream of the branch point of the third downstream pipeline and the third return pipeline; a second temperature measuring device and a third temperature measuring device for measuring the temperature of the coolant flowing in the second downstream pipeline and the third downstream pipeline; and a second return flow control valve and a third return flow control valve, respectively disposed on the second return pipeline. The system includes a pipeline and the aforementioned third return pipeline; a heating unit flow meter for measuring the flow rate of the coolant flowing in the heating unit; and a valve control unit configured to decrease the opening of the second downstream flow control valve and increase the opening of the second return flow control valve when the temperature of the coolant flowing in the second downstream pipeline is lower than a threshold value, and to decrease the opening of the third downstream flow control valve and increase the opening of the third return flow control valve when the temperature of the coolant flowing in the third downstream pipeline is lower than a threshold value, thereby controlling the operation of the first downstream flow control valve to keep the flow rate of the coolant flowing in the heating unit constant.

[0037] According to the present invention, when the coolant after passing through at least one of the vacuum pump and the cooling unit is not hot enough as a driving heat source for heating the second circulating liquid flowing in the heating unit, the coolant is not supplied to the heating unit, but is returned to the cooling source, thereby maintaining the heating function of the heating unit.

[0038] In one configuration, the first downstream pipeline, the second downstream pipeline, and the third downstream pipeline merge to form a confluence pipeline extending towards the heating unit. The coolant pipeline also includes a bypass pipeline branching from the confluence pipeline and connected to the coolant return pipeline. The auxiliary area installation device further comprises: a second downstream flow control valve disposed on the second downstream pipeline at a position downstream of the branch point of the second downstream pipeline and the second return pipeline; a third downstream flow control valve disposed on the third downstream pipeline at a position downstream of the branch point of the third downstream pipeline and the third return pipeline; a second temperature sensor and a third temperature sensor for measuring the temperature of the coolant flowing in the second downstream pipeline and the third downstream pipeline; and a second return flow control valve and a third return flow control valve. The system includes: a flow control valve, which is respectively installed in the second return pipeline and the third return pipeline; a heating unit flow meter, which is used to measure the flow rate of the coolant flowing in the heating unit; a heating unit flow control valve, which is installed in the confluence pipeline, the coolant return pipeline, or the bypass pipeline; and a valve control unit configured to reduce the opening of the second downstream flow control valve and increase the opening of the second return flow control valve when the temperature of the coolant flowing in the second downstream pipeline is lower than a threshold value, and to reduce the opening of the third downstream flow control valve and increase the opening of the third return flow control valve when the temperature of the coolant flowing in the third downstream pipeline is lower than a threshold value, thereby controlling the operation of the heating unit flow control valve to keep the flow rate of the coolant flowing in the heating unit constant.

[0039] According to the present invention, when the coolant after passing through at least one of the vacuum pump and the cooling unit is not hot enough as a driving heat source for heating the second circulating liquid flowing in the heating unit, the coolant is not supplied to the heating unit, but is returned to the cooling source, thereby maintaining the heating function of the heating unit.

[0040] In one embodiment, the coolant pipeline further includes a second return reheat pipeline branching from the second return pipeline and a third return reheat pipeline branching from the third return pipeline, wherein the second return reheat pipeline and the third return reheat pipeline are connected to the first upstream pipeline via a pressurization pump.

[0041] According to the present invention, when the coolant after passing through the vacuum pump and cooling unit is not hot enough as a driving heat source for heating the second circulating liquid flowing in the heating unit, the coolant can be returned to the cooling source or returned to the decontamination device for reheating.

[0042] In one embodiment, the auxiliary area installation device further comprises: a second return line temperature measuring device for measuring the temperature of the coolant flowing in the portion of the second return line upstream of the second return reheating line; a second return flow control valve and a third return flow control valve respectively disposed in the second return line and the third return line; a third return line temperature measuring device for measuring the temperature of the coolant flowing in the portion of the third return line upstream of the third return line; a second return reheating flow control valve and a third return reheating flow control valve respectively disposed in the second return reheating line and the third return reheating line; and a valve control unit for controlling the operation of the second return flow control valve, the third return flow control valve, the second return reheating flow control valve, and the third return reheating flow control valve.

[0043] According to the present invention, by adjusting the flow rate of the control valve according to the temperature of the coolant, the utilization efficiency of cooling sources such as chillers and heating units can be improved.

[0044] In one embodiment, the valve control unit is configured to increase the opening of the second return flow control valve and decrease the opening of the second return reheat flow control valve when the temperature of the coolant flowing in the second return line is lower than a set value, and increase the opening of the third return flow control valve and decrease the opening of the third return reheat flow control valve when the temperature of the coolant flowing in the third return line is lower than a set value.

[0045] In one embodiment, the valve control unit is configured to control the operation of the second return flow control valve, the third return flow control valve, the second return reheat flow control valve, and the third return reheat flow control valve according to the instruction signal from the semiconductor manufacturing apparatus.

[0046] In one configuration, the second return line and the third return line merge to form a combined return line, which is connected to the coolant return line. The coolant line also includes a combined reheating line branching off from the combined return line, which is connected to the first upstream line via a pressurization pump.

[0047] According to the present invention, when the coolant after passing through the vacuum pump and cooling unit is not hot enough as a driving heat source for heating the second circulating liquid flowing in the heating unit, the coolant can be returned to the cooling source or returned to the decontamination device for reheating.

[0048] In one embodiment, the auxiliary area installation device further comprises: a confluence return temperature measuring device for measuring the temperature of the coolant flowing in the confluence return pipeline; a confluence return flow control valve disposed on the confluence return pipeline at a position downstream of the branch point where the confluence reheat pipeline branches off from the confluence return pipeline; a confluence reheat flow control valve disposed on the confluence reheat pipeline; and a valve control unit for controlling the operation of the confluence return flow control valve and the confluence reheat flow control valve.

[0049] In one embodiment, the valve control unit is configured to increase the opening of the merging return flow control valve and decrease the opening of the merging reheat flow control valve when the temperature of the coolant flowing in the merging return pipeline is lower than a set value.

[0050] In one embodiment, the valve control unit is configured to control the operation of the combined return flow control valve and the combined reheat flow control valve according to the instruction signal from the semiconductor manufacturing apparatus.

[0051] Invention Effects

[0052] According to the present invention, it is possible to reduce the electrical energy consumption used in semiconductor manufacturing. In particular, it is possible to reduce the power consumption of heating units. Furthermore, it is possible to reduce the power consumption of cooling sources such as chillers that supply coolant. Attached Figure Description

[0053] Figure 1 This is a schematic diagram illustrating one embodiment of a semiconductor manufacturing apparatus and an auxiliary area arrangement apparatus.

[0054] Figure 2 This is a schematic diagram illustrating one embodiment of the auxiliary area setting device.

[0055] Figure 3 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device.

[0056] Figure 4 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device.

[0057] Figure 5 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device.

[0058] Figure 6 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device.

[0059] Figure 7 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device.

[0060] Figure 8 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device.

[0061] Figure 9 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device.

[0062] Figure 10 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device.

[0063] Figure 11 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device.

[0064] Figure 12 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device.

[0065] Figure 13 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device.

[0066] Figure 14 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device.

[0067] Figure 15 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device.

[0068] Figure 16 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device.

[0069] Figure 17 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device.

[0070] Figure 18 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device.

[0071] Explanation of reference numerals in the attached figures

[0072] 1: Semiconductor manufacturing equipment

[0073] 2: Processing chamber

[0074] 5: Auxiliary area setting device

[0075] 6: Vacuum pump

[0076] 7: Cooling Unit

[0077] 8: Heating Unit

[0078] 10: Pest Control Device

[0079] 12: Coolant lines

[0080] 15: Cooling source

[0081] 21: First upstream pipeline

[0082] 22: Second upstream pipeline

[0083] 23: Third upstream pipeline

[0084] 26: First downstream pipeline

[0085] 27: Second downstream pipeline

[0086] 28: Third downstream pipeline

[0087] 30: Coolant return line

[0088] 31: First heat pump

[0089] 31A: First Evaporator

[0090] 31B: First Compressor

[0091] 31C: First condenser

[0092] 31D: First Expansion Valve

[0093] 31E: No. 1 refrigerant piping

[0094] 32: Second heat pump

[0095] 32A: Second Evaporator

[0096] 32B: Second compressor

[0097] 32C: Second condenser

[0098] 32D: Second expansion valve

[0099] 32E: Second refrigerant piping

[0100] 35: Combination pipeline

[0101] 36: Bypass pipeline

[0102] 37: First flow control valve

[0103] 38: Second flow control valve

[0104] 39: Third flow control valve

[0105] 41: First temperature measuring device

[0106] 42: Second temperature measuring device

[0107] 43: Third temperature measuring device

[0108] 46: Flow control valve for heating unit

[0109] 47: Heating Unit Flow Meter

[0110] 50: Valve Control Section

[0111] 51: Return to temperature measuring device

[0112] 52: Heat Pump Control Unit

[0113] 55: Buffer tank

[0114] 56: Booster Pump

[0115] 59: Reheating line

[0116] 61: Internal temperature measuring device

[0117] 62: Flow control valve for reheating

[0118] 65: Second reheating line

[0119] 66: Third reheating line

[0120] 67: Booster Pump

[0121] 70: Second downstream flow control valve

[0122] 71: Third downstream flow control valve

[0123] 72: Flow control valve for second reheating

[0124] 73: Flow control valve for the third reheat

[0125] 75: First downstream flow control valve

[0126] 77: Second Return Pipeline

[0127] 78: Third Return Pipeline

[0128] 81: Second return flow control valve

[0129] 82: Third return flow control valve

[0130] 84: Second return reheat line

[0131] 85: Third return reheat line

[0132] 86: Booster Pump

[0133] 88: Second return pipeline temperature measuring device

[0134] 89: Third Return Pipeline Temperature Meter

[0135] 91: Second return reheat flow control valve

[0136] 92: Third return reheat flow control valve

[0137] 95: Confluence return line

[0138] 96: Combined reheating line

[0139] 97: Booster Pump

[0140] 100: Confluence Return Temperature Measuring Device

[0141] 101: Confluence Return Flow Control Valve

[0142] 102: Confluence Reheat Flow Control Valve Detailed Implementation

[0143] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0144] Figure 1 This is a schematic diagram illustrating one embodiment of a semiconductor manufacturing apparatus and an auxiliary area arrangement apparatus. Figure 1 The semiconductor manufacturing apparatus 1 shown in the embodiment is an etching apparatus having multiple processing chambers 2. An auxiliary area setting device 5 is connected to the multiple processing chambers 2, and a first circulating liquid and a second circulating liquid circulate between the multiple processing chambers 2 and the auxiliary area setting device 5.

[0145] The auxiliary area setup 5 includes: a vacuum pump 6 for exhausting process gas (e.g., etching gas) from the processing chamber 2; a cooling unit 7 for cooling the first circulating liquid after use in the processing chamber 2; a heating unit 8 for heating the second circulating liquid after use in the processing chamber 2; a purging device 10 for purifying the process gas discharged from the vacuum pump 6; and a coolant line 12 for supplying coolant from the cooling source 15. Figure 1 The coolant line 12 is schematically depicted in the diagram. Figure 1 In the illustrated embodiment, the pest control device 10 consists of only one unit, which is equipped with multiple vacuum pumps 6, multiple cooling units 7, and multiple heating units 8 connected to multiple processing chambers 2. Multiple pest control devices 10 may also be provided.

[0146] The number of processing chambers 2, vacuum pumps 6, cooling units 7, and heating units 8 are not limited to [specific numbers to be filled in]. Figure 1 The embodiment shown below. In the embodiment described below, for the sake of simplicity, the auxiliary area setting device 5 includes a vacuum pump 6, a cooling unit 7 and a heating unit 8 connected to a processing chamber 2, but the structure of the auxiliary area setting device 5, especially the number of vacuum pumps 6, the number of cooling units 7 and the number of heating units 8, are not limited to the embodiment described below.

[0147] Figure 2 This is a schematic diagram illustrating one embodiment of the auxiliary area setting device 5. For example... Figure 2As shown, the auxiliary area installation device 5 includes: a vacuum pump 6 for exhausting the processed gas from the processing chamber 2; a cooling unit 7 for cooling the first circulating liquid after use in the processing chamber 2; a heating unit 8 for heating the second circulating liquid after use in the processing chamber 2; a purging device 10 for purifying the processed gas discharged from the vacuum pump 6; and a coolant line 12 for supplying coolant from the cooling source 15. The vacuum pump 6, the cooling unit 7, and the heating unit 8 are connected to the processing chamber 2.

[0148] The air inlet of the vacuum pump 6 is connected to the processing chamber 2, and the exhaust port of the vacuum pump 6 is connected to the pest control device 10. The type of vacuum pump 6 is not particularly limited; examples of vacuum pump 6 used include positive displacement dry vacuum pumps. Examples of pest control devices 10 include wet pest control devices, catalyst-type pest control devices, combustion-type pest control devices, heater-type pest control devices, plasma-type pest control devices, etc.

[0149] Coolant is supplied from a cooling source 15, such as a chiller, in a factory where a semiconductor manufacturing apparatus 1 is installed, to a sterilization device 10, a vacuum pump 6, and a cooling unit 7 via a coolant line 12. The coolant line 12 includes: a first upstream line 21, a second upstream line 22, and a third upstream line 23 that supply coolant to the sterilization device 10, the vacuum pump 6, and the cooling unit 7, respectively; a first downstream line 26, a second downstream line 27, and a third downstream line 28 that supply coolant after passing through the sterilization device 10, the vacuum pump 6, and the cooling unit 7 to a heating unit 8; and a coolant return line 30 that returns coolant after passing through the heating unit 8 to the cooling source 15.

[0150] The first upstream pipeline 21 extends from the cooling source 15 to the pest control device 10, and the first downstream pipeline 26 extends from the pest control device 10 to the heating unit 8. Coolant is supplied from the cooling source 15 to the pest control device 10 via the first upstream pipeline 21, cooling the pest control device 10. The coolant after passing through the pest control device 10 flows to the heating unit 8 via the first downstream pipeline 26.

[0151] The second upstream pipeline 22 extends from the cooling source 15 to the vacuum pump 6, and the second downstream pipeline 27 extends from the vacuum pump 6 to the heating unit 8. Coolant is supplied from the cooling source 15 to the vacuum pump 6 via the second upstream pipeline 22 to cool the vacuum pump 6. The coolant after passing through the vacuum pump 6 flows to the heating unit 8 via the second downstream pipeline 27.

[0152] The third upstream pipeline 23 extends from the cooling source 15 to the cooling unit 7, and the third downstream pipeline 28 extends from the cooling unit 7 to the heating unit 8. Coolant is supplied from the cooling source 15 to the cooling unit 7 via the third upstream pipeline 23 to cool the cooling unit 7. After passing through the cooling unit 7, the coolant flows to the heating unit 8 via the third downstream pipeline 28.

[0153] The structure of the first upstream pipeline 21, the second upstream pipeline 22, and the third upstream pipeline 23 is not particularly limited as long as they can perform the functions described above. For example, the first upstream pipeline 21, the second upstream pipeline 22, and the third upstream pipeline 23 can also be constructed by branching from one pipeline into three pipelines, or they can be three independent pipelines. Similarly, the structure of the first downstream pipeline 26, the second downstream pipeline 27, and the third downstream pipeline 28 is not particularly limited as long as they can perform the functions described above. For example, the first downstream pipeline 26, the second downstream pipeline 27, and the third downstream pipeline 28 can also be constructed by merging three pipelines to form one pipeline, or they can be three independent pipelines.

[0154] The cooling unit 7 includes a first heat pump 31 for circulating refrigerant. The first heat pump 31 is a refrigeration machine (e.g., a vapor compression refrigeration machine). Specifically, the first heat pump 31 includes: a first evaporator 31A, which evaporates refrigerant liquid to generate refrigerant gas; a first compressor 31B, which compresses the refrigerant gas; a first condenser 31C, which condenses the compressed refrigerant gas to generate refrigerant liquid; and a first expansion valve 31D, which is disposed between the first evaporator 31A and the first condenser 31C. The refrigerant circulates in the first evaporator 31A, the first compressor 31B, the first condenser 31C, and the first expansion valve 31D via a first refrigerant pipe 31E. The processing chamber 2 is connected to the first evaporator 31A, and the first circulating liquid circulates between the processing chamber 2 and the first evaporator 31A.

[0155] The third upstream pipeline 23 and the third downstream pipeline 28 are connected to the first condenser 31C. Coolant supplied from the cooling source 15 is guided into the first condenser 31C via the third upstream pipeline 23, where it exchanges heat with refrigerant gas. As a result of this heat exchange, the coolant is heated, while the refrigerant gas is cooled to become liquid refrigerant. The liquid refrigerant is guided to the first evaporator 31A via the first expansion valve 31D. First circulating liquid is guided to the first evaporator 31A, where it exchanges heat with the liquid refrigerant. As a result of this heat exchange, the first circulating liquid is cooled, while the liquid refrigerant is heated to become gas. The gas refrigerant is drawn into the first compressor 31B and compressed by it. The compressed gas refrigerant is then guided to the first condenser 31C. Thus, the first circulating liquid is cooled by the coolant with the help of the refrigerant.

[0156] The heating unit 8 includes a second heat pump 32 for circulating refrigerant. The second heat pump 32 is a refrigeration machine (e.g., a vapor compression refrigeration machine). Specifically, the second heat pump 32 includes: a second evaporator 32A, which evaporates refrigerant liquid to generate refrigerant gas; a second compressor 32B, which compresses the refrigerant gas; a second condenser 32C, which condenses the compressed refrigerant gas to generate refrigerant liquid; and a second expansion valve 32D, which is disposed between the second evaporator 32A and the second condenser 32C. The refrigerant circulates in the second evaporator 32A, the second compressor 32B, the second condenser 32C, and the second expansion valve 32D via a second refrigerant pipe 32E. The processing chamber 2 is connected to the second condenser 32C, and the second circulating liquid circulates between the processing chamber 2 and the second condenser 32C.

[0157] The first downstream pipeline 26, the second downstream pipeline 27, the third downstream pipeline 28, and the coolant return pipeline 30 are connected to the second evaporator 32A. The coolant, whose temperature has risen due to passing through the purifying device 10, the vacuum pump 6, and the cooling unit 7, is guided into the second evaporator 32A via the first downstream pipeline 26, the second downstream pipeline 27, and the third downstream pipeline 28, where it exchanges heat with the refrigerant liquid. As a result of this heat exchange, the coolant is cooled, while the refrigerant liquid is heated to become refrigerant gas. The refrigerant gas is drawn into the second compressor 32B and compressed. The compressed refrigerant gas is directed to the second condenser 32C. The coolant after passing through the second evaporator 32A returns to the cooling source 15 via the coolant return pipeline 30. The second circulating liquid is directed to the second condenser 32C, where it exchanges heat with the refrigerant gas. As a result of this heat exchange, the second circulating liquid is heated, while the refrigerant gas is cooled to become liquid refrigerant. This liquid refrigerant is then directed to the second evaporator 32A via the second expansion valve 32D. Thus, the second circulating liquid is heated by the coolant using the refrigerant.

[0158] According to this embodiment, the coolant, which has been heated during its passage through the sterilization device 10, vacuum pump 6, and cooling unit 7, can be used as a heat source at the heating unit 8. Therefore, electrical equipment such as electric heaters can be eliminated, or the capacity of such equipment can be reduced. Furthermore, since the coolant, after being cooled during its passage through the heating unit 8, is returned to the cooling source 15, the power required by the cooling source 15 (e.g., a chiller installed in the semiconductor manufacturing plant 1) to re-cool the coolant can be reduced. As a result, the electrical energy consumption used in semiconductor manufacturing can be reduced.

[0159] Figure 3 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device 5. Unless otherwise specified, the structure and operation of this embodiment are similar to those described in the reference diagram. Figure 1 and Figure 2 The described implementation methods are the same, therefore repeated descriptions are omitted. Figure 3 As shown, the first downstream pipeline 26, the second downstream pipeline 27, and the third downstream pipeline 28 merge to form a confluence pipeline 35 extending towards the heating unit 8. More specifically, the downstream portion of the first downstream pipeline 26, the downstream portion of the second downstream pipeline 27, and the downstream portion of the third downstream pipeline 28 constitute a single confluence pipeline 35. The confluence pipeline 35 is connected to the second evaporator 32A of the heating unit 8. The coolant pipeline 12 also includes a bypass pipeline 36 that branches off from the confluence pipeline 35 and connects to the coolant return pipeline 30.

[0160] The auxiliary area setting device 5 of this embodiment further includes: a first flow control valve 37, a second flow control valve 38, and a third flow control valve 39 respectively installed on the first upstream pipeline 21, the second upstream pipeline 22, and the third upstream pipeline 23; a first temperature measuring device 41, a second temperature measuring device 42, and a third temperature measuring device 43 for measuring the temperature of the coolant flowing in the first downstream pipeline 26, the second downstream pipeline 27, and the third downstream pipeline 28; and a heating unit flow control valve installed on the confluence pipeline 35. 46; a heating unit flow meter 47 installed in the confluence line 35 for measuring the flow rate of the coolant flowing in the heating unit 8; and a valve control unit 50 that controls the operation of the first flow control valve 37, the second flow control valve 38 and the third flow control valve 39 to keep the temperature of the coolant flowing in the first downstream line 26, the second downstream line 27 and the third downstream line 28 constant, and controls the operation of the heating unit flow control valve 46 to keep the flow rate of the coolant flowing in the heating unit 8 constant.

[0161] The first flow control valve 37, the second flow control valve 38, the third flow control valve 39, the first temperature sensor 41, the second temperature sensor 42, the third temperature sensor 43, the heating unit flow control valve 46, and the heating unit flow sensor 47 are electrically connected to the valve control unit 50. The valve control unit 50 controls the operation of the first flow control valve 37, the second flow control valve 38, and the third flow control valve 39 based on the temperature of the coolant measured by the first temperature sensor 41, the second temperature sensor 42, and the third temperature sensor 43, to maintain a constant temperature of the coolant flowing in the first downstream pipeline 26, the second downstream pipeline 27, and the third downstream pipeline 28. Furthermore, the valve control unit 50 controls the operation of the heating unit flow control valve 46 based on the flow rate of the coolant measured by the heating unit flow sensor 47, to maintain a constant flow rate of the coolant flowing in the heating unit 8. The heating unit flow control valve 46 can also be located on the coolant return line 30 or bypass line 36 instead of the confluence line 35. Additionally, the heating unit flow meter 47 can also be located on the coolant return line 30 instead of the confluence line 35.

[0162] According to reference Figure 3 In the described embodiment, the temperature and flow rate of the coolant flowing in the heating unit 8 are kept constant, so the heating unit 8 can stably heat the second circulating liquid.

[0163] Figure 4 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device 5. Unless otherwise specified, the structure and operation of this embodiment are similar to those described in the reference diagram. Figure 3The described implementation is the same, therefore repeated descriptions are omitted. In this embodiment, the first flow control valve 37, the second flow control valve 38, and the third flow control valve 39 are respectively located on the first downstream pipeline 26, the second downstream pipeline 27, and the third downstream pipeline 28. The heating unit flow control valve 46 can also be located on the coolant return pipeline 30 or the bypass pipeline 36 instead of being located on the confluence pipeline 35. Furthermore, the heating unit flow meter 47 can also be located on the coolant return pipeline 30 instead of being located on the confluence pipeline 35. Figure 3 Similarly, the embodiments shown are based on reference. Figure 4 In the described embodiment, the temperature and flow rate of the coolant flowing in the heating unit 8 are kept constant, so the heating unit 8 can stably heat the second circulating liquid.

[0164] Figure 5 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device 5. Unless otherwise specified, the structure and operation of this embodiment are similar to those described in the reference diagram. Figure 1 and Figure 2 The described implementation methods are the same, therefore repeated descriptions are omitted. Figure 5 As shown, the auxiliary area setting device 5 also includes: a return temperature measuring device 51, which measures the temperature of the coolant flowing in the coolant return line 30; and a heat pump control unit 52, which controls the operation of the second heat pump 32 of the heating unit 8 to maintain the temperature of the coolant flowing in the coolant return line 30 above a set value.

[0165] The heat pump control unit 52 is electrically connected to the return temperature measuring device 51. The heat pump control unit 52 controls the operation of the second heat pump 32 of the heating unit 8, especially the operation of the second compressor 32B, to maintain the temperature of the coolant measured by the return temperature measuring device 51 above a set value. According to this embodiment, it is possible to prevent the temperature of the coolant returning to the cooling source 15 from dropping too much.

[0166] Figure 6 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device 5. Unless otherwise specified, the structure and operation of this embodiment are similar to those described in the reference diagram. Figure 1 and Figure 2 The described implementation methods are the same, therefore repeated descriptions are omitted. Figure 6 As shown, the auxiliary area installation device 5 also includes a buffer tank 55 connected to the first downstream pipeline 26, the second downstream pipeline 27 and the third downstream pipeline 28.

[0167] In this embodiment, the first downstream pipeline 26, the second downstream pipeline 27, and the third downstream pipeline 28 merge to form a confluence pipeline 35 extending towards the heating unit 8. A buffer tank 55 is installed on the confluence pipeline 35. In one embodiment, the first downstream pipeline 26, the second downstream pipeline 27, and the third downstream pipeline 28 may each be connected to the buffer tank 55, and the confluence pipeline 35 extends from the buffer tank 55 to the heating unit 8. When the pressure of the coolant flowing from the buffer tank 55 is low, such as... Figure 6 As shown, a pressure pump 56 can also be provided between the buffer tank 55 and the heating unit 8. Figure 6 In the embodiment shown, the pressurization pump 56 is located in the confluence line 35 extending from the buffer tank 55 to the heating unit 8.

[0168] According to this embodiment, the coolant, after being heated by the pest control device 10, vacuum pump 6, and cooling unit 7, is temporarily stored in a buffer tank 55 before being supplied to the heating unit 8. The buffer tank 55 can reduce temperature fluctuations of the heated coolant and stabilize the flow rate of the coolant supplied to the heating unit 8.

[0169] Figure 7 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device 5. Unless otherwise specified, the structure and operation of this embodiment are similar to those described in the reference diagram. Figure 6 The described implementation methods are the same, therefore repeated descriptions are omitted. Figure 7 As shown, the coolant line 12 also includes a reheating line 59 branching off from the confluence line 35, which extends from the confluence line 35 to the first upstream line 21. The branch point P1 of the reheating line 59, which branches off from the confluence line 35, is located between the buffer tank 55 and the heating unit 8.

[0170] According to this embodiment, if the coolant in the buffer tank 55 is not hot enough as a driving heat source for heating the second circulating liquid flowing in the heating unit 8, the coolant can be returned to the purifying device 10 for reheating.

[0171] Figure 8 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device 5. Unless otherwise specified, the structure and operation of this embodiment are similar to those described in the reference diagram. Figure 7 The described implementation methods are the same, therefore repeated descriptions are omitted. Figure 8 As shown, the coolant line 12 also includes a bypass line 36 that branches off from the confluence line 35 and connects to the coolant return line 30.

[0172] The auxiliary area setting device 5 of this embodiment further includes: a tank temperature measuring device 61, which measures the temperature of the coolant in the buffer tank 55; a reheating flow control valve 62, which is installed in the reheating pipeline 59; a heating unit flow control valve 46, which is provided in the confluence pipeline 35; and a valve control unit 50, which controls the operation of the reheating flow control valve 62 and the heating unit flow control valve 46 in such a way that the flow rate of the coolant flowing in the reheating pipeline 59 is a predetermined value when the temperature of the coolant in the buffer tank 55 is below a set value.

[0173] The tank temperature measuring device 61, the reheating flow control valve 62, and the heating unit flow control valve 46 are electrically connected to the valve control unit 50. When the temperature of the coolant in the buffer tank 55, as measured by the tank temperature measuring device 61, falls below a set value, the valve control unit 50 controls the operation of the reheating flow control valve 62 and the heating unit flow control valve 46 to ensure that the flow rate of the coolant flowing in the reheating line 59 is within a specified value. The heating unit flow control valve 46 can also be located in the bypass line 36 or the coolant return line 30 instead of being located in the confluence line 35.

[0174] According to this embodiment, if the coolant in the buffer tank 55 is not hot enough as a driving heat source for heating the second circulating liquid flowing in the heating unit 8, the coolant can be returned to the purifying device 10 for reheating.

[0175] Figure 9 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device 5. Unless otherwise specified, the structure and operation of this embodiment are similar to those described in the reference diagram. Figure 1 and Figure 2 The described implementation methods are the same, therefore repeated descriptions are omitted. Figure 9 As shown, the coolant line 12 also includes a second reheat line 65 branching from the second downstream line 27 and a third reheat line 66 branching from the third downstream line 28. The second reheat line 65 and the third reheat line 66 are connected to the first upstream line 21 via two booster pumps 67, 67.

[0176] The second reheating line 65 and the third reheating line 66 are not particularly limited in structure as long as they extend from the second downstream line 27 and the third downstream line 28 to the first upstream line 21. For example, the second reheating line 65 and the third reheating line 66 can be two independent lines, or they can be two lines merged to form one line. Figure 9In the example shown, the second reheating line 65 and the third reheating line 66 are two independent lines, and two pressurizing pumps 67 are connected to the second reheating line 65 and the third reheating line 66 respectively. In one embodiment, the second reheating line 65 and the third reheating line 66 may be combined to form a single combined reheating line, and a single pressurizing pump 67 may be connected to the combined reheating line.

[0177] According to reference Figure 9 In the described embodiment, if the coolant after passing through the vacuum pump 6 and cooling unit 7 is not hot enough as a driving heat source for heating the second circulating liquid flowing in the heating unit 8, the coolant can be returned to the purifying device 10 for reheating.

[0178] Figure 10 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device 5. Unless otherwise specified, the structure and operation of this embodiment are similar to those described in the reference diagram. Figure 9 The described implementation methods are the same, therefore repeated descriptions are omitted. Figure 10 As shown, the auxiliary area installation device 5 of this embodiment further includes: a second downstream flow control valve 70, which is provided on the second downstream pipeline 27 at a position downstream of the branch point P2 of the second downstream pipeline 27 and the second reheating pipeline 65; a third downstream flow control valve 71, which is provided on the third downstream pipeline 28 at a position downstream of the branch point P3 of the third downstream pipeline 28 and the third reheating pipeline 66; a second temperature measuring device 42 and a third temperature measuring device 43, which are used to measure the temperature of the coolant flowing in the second downstream pipeline 27 and the third downstream pipeline 28; a second reheating flow control valve 72 and a third reheating flow control valve 73, which are respectively provided on the second reheating pipeline 65 and the third reheating pipeline 66; and a valve control unit 50, which controls the operation of the second reheating flow control valve 72 and the third reheating flow control valve 73.

[0179] The valve control unit 50 is electrically connected to the second temperature sensor 42, the third temperature sensor 43, the second downstream flow control valve 70, the third downstream flow control valve 71, the second reheating flow control valve 72, and the third reheating flow control valve 73. The valve control unit 50 is configured to decrease the opening of the second downstream flow control valve 70 and increase the opening of the second reheating flow control valve 72 when the temperature of the coolant flowing in the second downstream pipeline 27, as measured by the second temperature sensor 42, is lower than a threshold value. Furthermore, the valve control unit 50 is configured to decrease the opening of the third downstream flow control valve 71 and increase the opening of the third reheating flow control valve 73 when the temperature of the coolant flowing in the third downstream pipeline 28, as measured by the third temperature sensor 43, is lower than a threshold value.

[0180] Reducing the opening of the second downstream flow control valve 70 includes completely closing the second downstream flow control valve 70 (setting the opening to 0%), and reducing the opening of the third downstream flow control valve 71 includes completely closing the third downstream flow control valve 71 (setting the opening to 0%). Similarly, increasing the opening of the second reheating flow control valve 72 includes fully opening the second reheating flow control valve 72 (setting the opening to 100%), and increasing the opening of the third reheating flow control valve 73 includes fully opening the third reheating flow control valve 73 (setting the opening to 100%). Within the range where the flow rate of coolant flowing into the purifying device 10 does not exceed the limit, the valve control unit 50 controls the operation of the second reheating flow control valve 72 and the third reheating flow control valve 73.

[0181] According to this embodiment, if the coolant after passing through the vacuum pump 6 and the cooling unit 7 is not hot enough as a driving heat source for heating the second circulating liquid flowing in the heating unit 8, the coolant can be returned to the purifying device 10 and reheated.

[0182] Figure 11 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device 5. Unless otherwise specified, the structure and operation of this embodiment are similar to those described in the reference diagram. Figure 10 The described embodiments are the same, so repeated descriptions are omitted. The auxiliary area setting device 5 of this embodiment also includes: a first downstream flow control valve 75, which is provided on the first downstream pipeline 26; and a heating unit flow meter 47, which is used to measure the flow rate of the coolant flowing in the heating unit 8.

[0183] The flow meter 47 for the heating unit can also be located upstream or downstream of the heating unit 8. Figure 11 In one embodiment, the first downstream pipeline 26, the second downstream pipeline 27, and the third downstream pipeline 28 merge to form a confluence pipeline 35 extending toward the heating unit 8, and the heating unit flow meter 47 is disposed on the confluence pipeline 35. In another embodiment, the heating unit flow meter 47 may be disposed on the coolant return pipeline 30 instead of on the confluence pipeline 35.

[0184] The valve control unit 50 is also electrically connected to the first downstream flow control valve 75 and the heating unit flow meter 47. The valve control unit 50 is configured to control the operation of the first downstream flow control valve 75 to keep the flow rate of the coolant flowing in the heating unit 8, as measured by the heating unit flow meter 47, constant. According to this embodiment, since the flow rate of the coolant flowing in the heating unit 8 remains constant, the heating unit 8 can stably heat the second circulating fluid.

[0185] Figure 12This is a schematic diagram illustrating another embodiment of the auxiliary area setting device 5. Unless otherwise specified, the structure and operation of this embodiment are similar to those described in the reference diagram. Figure 1 and Figure 2 The described implementation methods are the same, therefore repeated descriptions are omitted. Figure 12 As shown, the coolant line 12 also includes a second return line 77 branching from the second downstream line 27 and a third return line 78 branching from the third downstream line 28. The second return line 77 and the third return line 78 are connected to the coolant return line 30. The structure of the second return line 77 and the third return line 78 is not particularly limited as long as they extend from the second downstream line 27 and the third downstream line 28 to the coolant return line 30. For example, the second return line 77 and the third return line 78 can be two separate lines, or they can be two lines merging to form a single merged return line connected to the coolant return line 30.

[0186] According to this embodiment, when the coolant after passing through the vacuum pump 6 and the cooling unit 7 is not hot enough as a driving heat source for heating the second circulating liquid flowing in the heating unit 8, the coolant is not supplied to the heating unit 8, but is returned to the cooling source 15, thereby maintaining the heating function of the heating unit 8.

[0187] Figure 13 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device 5. Unless otherwise specified, the structure and operation of this embodiment are similar to those described in the reference diagram. Figure 12 The described implementation is the same, so repeated descriptions are omitted. The auxiliary area installation device 5 of this embodiment further includes: a first downstream flow control valve 75 provided on the first downstream pipeline 26; a second downstream flow control valve 70 provided on the second downstream pipeline 27 at a position downstream of the branch point P4 between the second downstream pipeline 27 and the second return pipeline 77; a third downstream flow control valve 71 provided on the third downstream pipeline 28 at a position downstream of the branch point P5 between the third downstream pipeline 28 and the third return pipeline 78; and a flow control valve 71 for measuring the flow in the second downstream pipeline 27 and the third downstream pipeline 28. The system includes a second temperature measuring device 42 and a third temperature measuring device 43 for measuring the temperature of the flowing coolant; a second return flow control valve 81 and a third return flow control valve 82 respectively installed on the second return line 77 and the third return line 78; a heating unit flow measuring device 47 for measuring the flow rate of the coolant flowing in the heating unit 8; and a valve control unit 50 for controlling the operation of the first downstream flow control valve 75, the second downstream flow control valve 70, the third downstream flow control valve 71, the second return flow control valve 81, and the third return flow control valve 82.

[0188] The flow meter 47 for the heating unit can also be located upstream or downstream of the heating unit 8. Figure 13 In one embodiment, the first downstream pipeline 26, the second downstream pipeline 27, and the third downstream pipeline 28 merge to form a confluence pipeline 35 extending toward the heating unit 8, and the heating unit flow meter 47 is disposed on the confluence pipeline 35. In another embodiment, the heating unit flow meter 47 may be disposed on the coolant return pipeline 30 instead of on the confluence pipeline 35.

[0189] The second temperature measuring device 42, the third temperature measuring device 43, the heating unit flow measuring device 47, the first downstream flow control valve 75, the second downstream flow control valve 70, the third downstream flow control valve 71, the second return flow control valve 81, and the third return flow control valve 82 are electrically connected to the valve control unit 50. The valve control unit 50 is configured to decrease the opening of the second downstream flow control valve 70 and increase the opening of the second return flow control valve 81 when the temperature of the coolant flowing in the second downstream pipeline 27, as measured by the second temperature measuring device 42, is lower than a threshold value. Furthermore, the valve control unit 50 is configured to decrease the opening of the third downstream flow control valve 71 and increase the opening of the third return flow control valve 82 when the temperature of the coolant flowing in the third downstream pipeline 28, as measured by the third temperature measuring device 43, is lower than a threshold value. Furthermore, the valve control unit 50 is configured to control the operation of the first downstream flow control valve 75 so that the flow rate of the coolant flowing in the heating unit 8, as measured by the heating unit flow meter 47, remains constant.

[0190] Reducing the opening of the second downstream flow control valve 70 includes completely closing the second downstream flow control valve 70 (setting the opening to 0%), and reducing the opening of the third downstream flow control valve 71 includes completely closing the third downstream flow control valve 71 (setting the opening to 0%). Similarly, increasing the opening of the second return flow control valve 81 includes making the second return flow control valve 81 fully open (setting the opening to 100%), and increasing the opening of the third return flow control valve 82 includes making the third return flow control valve 82 fully open (setting the opening to 100%).

[0191] According to this embodiment, when the coolant after passing through at least one of the vacuum pump 6 and the cooling unit 7 is not hot enough as a driving heat source for heating the second circulating liquid flowing in the heating unit 8, the coolant is not supplied to the heating unit 8, but is returned to the cooling source 15, thereby maintaining the heating function of the heating unit 8.

[0192] Figure 14 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device 5. Unless otherwise specified, the structure and operation of this embodiment are similar to those described in the reference diagram. Figure 12The described implementation is the same, so repeated descriptions are omitted. The first downstream pipeline 26, the second downstream pipeline 27, and the third downstream pipeline 28 merge to form a confluence pipeline 35 extending toward the heating unit 8. The coolant pipeline 12 also includes a bypass pipeline 36 that branches off from the confluence pipeline 35 and connects to the coolant return pipeline 30.

[0193] The auxiliary area installation device 5 further includes: a second downstream flow control valve 70, which is installed on the second downstream pipeline 27 at a position downstream of the branch point P4 between the second downstream pipeline 27 and the second return pipeline 77; a third downstream flow control valve 71, which is installed on the third downstream pipeline 28 at a position downstream of the branch point P5 between the third downstream pipeline 28 and the third return pipeline 78; a second temperature measuring device 42 and a third temperature measuring device 43, which are used to measure the temperature of the coolant flowing in the second downstream pipeline 27 and the third downstream pipeline 28. Temperature; a second return flow control valve 81 and a third return flow control valve 82, which are respectively located on the second return line 77 and the third return line 78; a heating unit flow meter 47, which is used to measure the flow rate of the coolant flowing in the heating unit 8; a heating unit flow control valve 46, which is located on the confluence line 35; and a valve control unit 50, which controls the operation of the second downstream flow control valve 70, the third downstream flow control valve 71, the second return flow control valve 81, the third return flow control valve 82 and the heating unit flow control valve 46.

[0194] The flow meter 47 for the heating unit can also be located upstream or downstream of the heating unit 8. Figure 14 In one embodiment, the heating unit flow meter 47 is located in the confluence line 35. However, in another embodiment, the heating unit flow meter 47 may also be located in the coolant return line 30 instead of in the confluence line 35. The heating unit flow control valve 46 may also be located in the coolant return line 30 or the bypass line 36 instead of in the confluence line 35.

[0195] The second temperature measuring device 42, the third temperature measuring device 43, the heating unit flow measuring device 47, the second downstream flow control valve 70, the third downstream flow control valve 71, the second return flow control valve 81, the third return flow control valve 82, and the heating unit flow control valve 46 are electrically connected to the valve control unit 50. The valve control unit 50 is configured to decrease the opening of the second downstream flow control valve 70 and increase the opening of the second return flow control valve 81 when the temperature of the coolant flowing in the second downstream pipeline 27, as measured by the second temperature measuring device 42, is lower than a threshold value. Furthermore, the valve control unit 50 is configured to decrease the opening of the third downstream flow control valve 71 and increase the opening of the third return flow control valve 82 when the temperature of the coolant flowing in the third downstream pipeline 28, as measured by the third temperature measuring device 43, is lower than a threshold value. Furthermore, the valve control unit 50 is configured to control the operation of the heating unit flow control valve 46 so that the flow rate of the coolant flowing in the heating unit 8, as measured by the heating unit flow meter 47, remains constant.

[0196] Reducing the opening of the second downstream flow control valve 70 includes completely closing the second downstream flow control valve 70 (setting the opening to 0%), and reducing the opening of the third downstream flow control valve 71 includes completely closing the third downstream flow control valve 71 (setting the opening to 0%). Similarly, increasing the opening of the second return flow control valve 81 includes making the second return flow control valve 81 fully open (setting the opening to 100%), and increasing the opening of the third return flow control valve 82 includes making the third return flow control valve 82 fully open (setting the opening to 100%).

[0197] According to this embodiment, when the coolant after passing through at least one of the vacuum pump 6 and the cooling unit 7 is not hot enough as a driving heat source for heating the second circulating liquid flowing in the heating unit 8, the coolant is not supplied to the heating unit 8, but is returned to the cooling source 15, thereby maintaining the heating function of the heating unit 8.

[0198] Figure 15 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device 5. Unless otherwise specified, the structure and operation of this embodiment are similar to those described in the reference diagram. Figure 12 The described implementation is the same, so repeated descriptions are omitted. Coolant line 12 also includes a second return reheat line 84 branching from the second return line 77 and a third return reheat line 85 branching from the third return line 78. The second return reheat line 84 and the third return reheat line 85 are connected to the first upstream line 21 via two booster pumps 86, 86.

[0199] The structure of the second return reheating line 84 and the third return reheating line 85 is not particularly limited, as long as they extend from the second return line 77 and the third return line 78 to the first upstream line 21. For example, the second return reheating line 84 and the third return reheating line 85 can be two independent lines, or they can be two lines merged to form one line. Figure 15 In the example shown, the second return reheat line 84 and the third return reheat line 85 are two independent lines, and two pressurization pumps 86 are respectively connected to the second return reheat line 84 and the third return reheat line 85. In one embodiment, the second return reheat line 84 and the third return reheat line 85 may be merged to form a single merged return reheat line, and a single pressurization pump 86 may be connected to the merged return reheat line.

[0200] According to this embodiment, if the coolant after passing through the vacuum pump 6 and the cooling unit 7 is not hot enough as a driving heat source for heating the second circulating liquid flowing in the heating unit 8, the coolant can be returned to the cooling source 15 or returned to the pest control device 10 for reheating.

[0201] Figure 16 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device 5. Unless otherwise specified, the structure and operation of this embodiment are similar to those described in the reference diagram. Figure 15 The described embodiments are the same, so repeated descriptions are omitted. The auxiliary area installation device 5 of this embodiment further includes: a second return line temperature measuring device 88, which measures the temperature of the coolant flowing in the portion of the second return line 77 upstream of the second return reheat line 84; a second return flow control valve 81 and a third return flow control valve 82, which are respectively provided in the second return line 77 and the third return line 78; a third return line temperature measuring device 89, which measures the temperature of the coolant flowing in the portion of the third return line 78 upstream of the third return reheat line 85; a second return reheat flow control valve 91 and a third return reheat flow control valve 92, which are respectively provided in the second return reheat line 84 and the third return reheat line 85; and a valve control unit 50, which controls the operation of the second return flow control valve 81, the third return flow control valve 82, the second return reheat flow control valve 91, and the third return reheat flow control valve 92.

[0202] The second return pipeline temperature measuring device 88, the third return pipeline temperature measuring device 89, the second return flow control valve 81, the third return flow control valve 82, the second return reheat flow control valve 91, and the third return reheat flow control valve 92 are electrically connected to the valve control unit 50. The valve control unit 50 is configured such that when the temperature of the coolant flowing in the second return pipeline 77, as measured by the second return pipeline temperature measuring device 88, is lower than a set value, the opening of the second return flow control valve 81 is increased, and the opening of the second return reheat flow control valve 91 is decreased; and when the temperature of the coolant flowing in the third return pipeline 78, as measured by the third return pipeline temperature measuring device 89, is lower than a set value, the opening of the third return flow control valve 82 is increased, and the opening of the third return reheat flow control valve 92 is decreased.

[0203] Decreasing the opening of the second return reheat flow control valve 91 includes completely closing the second return reheat flow control valve 91 (setting it to 0% opening), and decreasing the opening of the third return reheat flow control valve 92 includes completely closing the third return reheat flow control valve 92 (setting it to 0% opening). Similarly, increasing the opening of the second return flow control valve 81 includes making the second return flow control valve 81 fully open (setting it to 100% opening), and increasing the opening of the third return flow control valve 82 includes making the third return flow control valve 82 fully open (setting it to 100% opening).

[0204] According to this embodiment, by adjusting the flow rate of the control valve according to the temperature of the coolant, the utilization efficiency of the cooling source 15 such as the chiller and the heating unit 8 can be improved.

[0205] In one embodiment, the valve control unit 50 may be configured to control the operation of the second return flow control valve 81, the third return flow control valve 82, the second return reheat flow control valve 91, and the third return reheat flow control valve 92 according to the command signal from the semiconductor manufacturing apparatus 1. In this case, by adjusting the flow rate of the control valves according to the temperature of the coolant, the utilization efficiency of the cooling source 15 such as the chiller and the heating unit 8 can be improved.

[0206] Figure 17 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device 5. Unless otherwise specified, the structure and operation of this embodiment are similar to those described in the reference diagram. Figure 12 The described implementation is the same, so repeated descriptions are omitted. The second return line 77 and the third return line 78 merge to form a combined return line 95. The combined return line 95 is connected to the coolant return line 30. The coolant line 12 also includes a combined reheat line 96 branching from the combined return line 95, and the combined reheat line 96 is connected to the first upstream line 21 via a booster pump 97.

[0207] According to this embodiment, if the coolant after passing through the vacuum pump 6 and the cooling unit 7 is not hot enough as a driving heat source for heating the second circulating liquid flowing in the heating unit 8, the coolant can be returned to the cooling source 15 or returned to the pest control device 10 for reheating.

[0208] Figure 18 This is a schematic diagram illustrating another embodiment of the auxiliary area setting device 5. Unless otherwise specified, the structure and operation of this embodiment are similar to those described in the reference diagram. Figure 17 The described implementation is the same, so repeated descriptions are omitted. The auxiliary area installation device 5 also includes: a confluence return temperature measuring device 100, which measures the temperature of the coolant flowing in the confluence return line 95; a confluence return flow control valve 101, which is provided on the confluence return line 95 at a position downstream of the branch point P6 between the confluence return line 95 and the confluence reheat line 96; a confluence reheat flow control valve 102, which is provided on the confluence reheat line 96; and a valve control unit 50, which controls the operation of the confluence return flow control valve 101 and the confluence reheat flow control valve 102.

[0209] The merging return temperature measuring device 100, the merging return flow control valve 101, and the merging reheat flow control valve 102 are electrically connected to the valve control unit 50. The valve control unit 50 is configured to increase the opening of the merging return flow control valve 101 and decrease the opening of the merging reheat flow control valve 102 when the temperature of the coolant flowing in the merging return line 95, as measured by the merging return temperature measuring device 100, is lower than a set value. Increasing the opening of the merging return flow control valve 101 includes fully opening it (setting it to 100% opening). Similarly, decreasing the opening of the merging reheat flow control valve 102 includes completely closing it (setting it to 0% opening).

[0210] According to this embodiment, by adjusting the flow rate of the control valve based on the temperature of the coolant, the utilization efficiency of the cooling source 15 (such as the chiller) and the heating unit 8 can be improved. Furthermore, by merging the return lines, a single temperature sensor and flow control valve can be used.

[0211] In one embodiment, the valve control unit 50 may be configured to control the operation of the confluence return flow control valve 101 and the confluence reheat flow control valve 102 according to the command signal from the semiconductor manufacturing apparatus 1. In this case, by adjusting the flow rate of the control valve according to the temperature of the coolant, the utilization efficiency of the cooling source 15 such as the chiller and the heating unit 8 can be improved.

[0212] The embodiments described above are intended to enable those skilled in the art to carry out the invention. Various modifications of the above embodiments will naturally be apparent to those skilled in the art, and the inventive concept can be applied to other embodiments. Therefore, the invention is not limited to the described embodiments and should be interpreted as following the maximum scope of the inventive concept defined by the claims.

Claims

1. An auxiliary area setting device, which is an auxiliary area setting device used in a semiconductor manufacturing apparatus, characterized in that, have: A vacuum pump for venting process gases from the processing chamber of the semiconductor manufacturing apparatus; A cooling unit for cooling the first circulating liquid after use in the processing chamber; A heating unit for heating the second circulating liquid after it has been used in the processing chamber; A purging device for purifying the processed gas discharged from the vacuum pump; and Coolant lines, through which coolant supplied from a cooling source flows. The cooling unit includes a first heat pump that circulates the refrigerant. The heating unit includes a second heat pump that circulates the refrigerant. The coolant pipeline has: The first upstream pipeline, the second upstream pipeline, and the third upstream pipeline supply the coolant to the pest control device, the vacuum pump, and the cooling unit, respectively. The first downstream pipeline, the second downstream pipeline, and the third downstream pipeline supply the coolant after passing through the pest control device, the vacuum pump, and the cooling unit to the heating unit. as well as The coolant, after passing through the heating unit, is returned to the coolant source via a coolant return line.

2. The auxiliary area setting device according to claim 1, characterized in that, The first downstream pipeline, the second downstream pipeline, and the third downstream pipeline merge to form a confluence pipeline extending toward the heating unit. The coolant line also includes a bypass line that branches off from the confluence line and connects to the coolant return line.

3. The auxiliary area setting device according to claim 2, characterized in that, It also has: The first flow control valve, the second flow control valve, and the third flow control valve are respectively installed on the first upstream pipeline or the first downstream pipeline, the second upstream pipeline or the second downstream pipeline, and the third upstream pipeline or the third downstream pipeline; The first temperature measuring device, the second temperature measuring device, and the third temperature measuring device are used to measure the temperature of the coolant flowing in the first downstream pipeline, the second downstream pipeline, and the third downstream pipeline. A flow control valve for the heating unit is located in the confluence line, the coolant return line, or the bypass line; A heating unit flow meter, used to measure the flow rate of the coolant flowing within the heating unit, is installed in the confluence line or the coolant return line. as well as The valve control unit controls the operation of the first flow control valve, the second flow control valve, and the third flow control valve to keep the temperature of the coolant flowing in the first downstream pipeline, the second downstream pipeline, and the third downstream pipeline constant, and controls the operation of the heating unit flow control valve to keep the flow rate of the coolant flowing in the heating unit constant.

4. The auxiliary area setting device according to claim 1, characterized in that, It also has: A return temperature measuring device is used to measure the temperature of the coolant flowing in the coolant return line; and The heat pump control unit controls the operation of the second heat pump of the heating unit to maintain the temperature of the coolant flowing in the coolant return line above a set value.

5. The auxiliary area setting device according to claim 1, characterized in that, It also includes a buffer tank connected to the first downstream pipeline, the second downstream pipeline and the third downstream pipeline.

6. The auxiliary area setting device according to claim 5, characterized in that, The first downstream pipeline, the second downstream pipeline, and the third downstream pipeline merge to form a confluence pipeline extending toward the heating unit. The coolant line also includes a reheating line branching off from the confluence line, the reheating line extending from the confluence line to the first upstream line.

7. The auxiliary area setting device according to claim 6, characterized in that, The coolant line also includes a bypass line that branches off from the confluence line and connects to the coolant return line. The auxiliary area setting device also includes: A tank temperature measuring device is used to measure the temperature of the coolant inside the buffer tank. A flow control valve for reheating is installed on the reheating pipeline; A flow control valve for the heating unit is located in the bypass line, the confluence line, or the coolant return line; as well as The valve control unit controls the operation of the reheating flow control valve and the heating unit flow control valve in such a way that the flow rate of the coolant flowing in the reheating pipeline is a predetermined value when the temperature of the coolant in the buffer tank is below a set value.

8. The auxiliary area setting device according to claim 1, characterized in that, The coolant pipeline also includes a second reheating pipeline branching from the second downstream pipeline and a third reheating pipeline branching from the third downstream pipeline, the second reheating pipeline and the third reheating pipeline being connected to the first upstream pipeline via a pressure pump.

9. The auxiliary area setting device according to claim 8, characterized in that, It also has: The second downstream flow control valve is located on the second downstream pipeline at a position downstream of the branch point of the second downstream pipeline and the second reheat pipeline; The third downstream flow control valve is located on the third downstream pipeline at a position downstream of the branch point of the third downstream pipeline and the third reheat pipeline. The second and third temperature measuring devices are used to measure the temperature of the coolant flowing in the second downstream pipeline and the third downstream pipeline. A second reheating flow control valve and a third reheating flow control valve are respectively installed in the second reheating pipeline and the third reheating pipeline; and Valve control unit, The valve control unit is configured such that, When the temperature of the coolant flowing in the second downstream pipeline is lower than a threshold, the opening of the second downstream flow control valve is reduced, and the opening of the second reheat flow control valve is increased. When the temperature of the coolant flowing in the third downstream pipeline is lower than a threshold, the opening of the third downstream flow control valve is reduced, and the opening of the third reheat flow control valve is increased.

10. The auxiliary area setting device according to claim 9, characterized in that, It also has: A first downstream flow control valve, which is located on the first downstream pipeline; and A heating unit flow meter is used to measure the flow rate of the coolant flowing in the heating unit. The valve control unit is further configured to control the operation of the first downstream flow control valve to keep the flow rate of the coolant flowing in the heating unit constant.

11. The auxiliary area setting device according to claim 1, characterized in that, The coolant pipeline also includes a second return pipeline branching from the second downstream pipeline and a third return pipeline branching from the third downstream pipeline, the second return pipeline and the third return pipeline being connected to the coolant return pipeline.

12. The auxiliary area setting device according to claim 11, characterized in that, It also has: A first downstream flow control valve is provided on the first downstream pipeline; The second downstream flow control valve is located on the second downstream pipeline at a position downstream of the branch point of the second downstream pipeline and the second return pipeline; The third downstream flow control valve is located on the third downstream pipeline at a position downstream of the branch point of the third downstream pipeline and the third return pipeline; The second and third temperature measuring devices are used to measure the temperature of the coolant flowing in the second downstream pipeline and the third downstream pipeline. The second return flow control valve and the third return flow control valve are respectively located in the second return pipeline and the third return pipeline; A heating unit flow meter for measuring the flow rate of the coolant flowing in the heating unit; and Valve control unit, The valve control unit is configured such that, When the temperature of the coolant flowing in the second downstream pipeline is lower than a threshold, the opening of the second downstream flow control valve is reduced, and the opening of the second return flow control valve is increased. When the temperature of the coolant flowing in the third downstream pipeline is lower than a threshold, the opening of the third downstream flow control valve is reduced, and the opening of the third return flow control valve is increased. The operation of the first downstream flow control valve is controlled to keep the flow rate of the coolant flowing in the heating unit constant.

13. The auxiliary area setting device according to claim 11, characterized in that, The first downstream pipeline, the second downstream pipeline, and the third downstream pipeline merge to form a confluence pipeline extending toward the heating unit. The coolant line also includes a bypass line that branches off from the confluence line and connects to the coolant return line. The auxiliary area setting device also includes: The second downstream flow control valve is located on the second downstream pipeline at a position downstream of the branch point of the second downstream pipeline and the second return pipeline; The third downstream flow control valve is located on the third downstream pipeline at a position downstream of the branch point of the third downstream pipeline and the third return pipeline; The second and third temperature measuring devices are used to measure the temperature of the coolant flowing in the second downstream pipeline and the third downstream pipeline. The second return flow control valve and the third return flow control valve are respectively located in the second return pipeline and the third return pipeline; A heating unit flow meter is used to measure the flow rate of the coolant flowing in the heating unit. A flow control valve for the heating unit is located in the confluence line, the coolant return line, or the bypass line; as well as Valve control unit, The valve control unit is configured such that, When the temperature of the coolant flowing in the second downstream pipeline is lower than a threshold, the opening of the second downstream flow control valve is reduced, and the opening of the second return flow control valve is increased. When the temperature of the coolant flowing in the third downstream pipeline is lower than a threshold, the opening of the third downstream flow control valve is reduced, and the opening of the third return flow control valve is increased. The operation of the flow control valve of the heating unit is controlled to keep the flow rate of the coolant flowing in the heating unit constant.

14. The auxiliary area setting device according to claim 11, characterized in that, The coolant pipeline also includes a second return reheat pipeline branching from the second return pipeline and a third return reheat pipeline branching from the third return pipeline, the second return reheat pipeline and the third return reheat pipeline being connected to the first upstream pipeline via a pressurization pump.

15. The auxiliary area setting device according to claim 14, characterized in that, It also has: The second return line temperature measuring device measures the temperature of the coolant flowing in the portion of the second return line that is upstream of the second return reheat line. The second return flow control valve and the third return flow control valve are respectively located in the second return pipeline and the third return pipeline; The third return line temperature measuring device measures the temperature of the coolant flowing in the portion of the third return line that is upstream of the third return reheat line. The second return reheat flow control valve and the third return reheat flow control valve are respectively installed in the second return reheat line and the third return reheat line; and The valve control unit controls the operation of the second return flow control valve, the third return flow control valve, the second return reheat flow control valve, and the third return reheat flow control valve.

16. The auxiliary area setting device according to claim 15, characterized in that, The valve control unit is configured to increase the opening of the second return flow control valve and decrease the opening of the second return reheat flow control valve when the temperature of the coolant flowing in the second return line is lower than a set value, and to increase the opening of the third return flow control valve and decrease the opening of the third return reheat flow control valve when the temperature of the coolant flowing in the third return line is lower than a set value.

17. The auxiliary area setting device according to claim 15, characterized in that, The valve control unit is configured to control the operation of the second return flow control valve, the third return flow control valve, the second return reheat flow control valve, and the third return reheat flow control valve according to the instruction signal from the semiconductor manufacturing apparatus.

18. The auxiliary area setting device according to claim 11, characterized in that, The second return pipeline and the third return pipeline merge to form a confluence return pipeline. The confluence return line is connected to the coolant return line. The coolant line also includes a confluence reheat line branching off from the confluence return line. The combined reheating pipeline is connected to the first upstream pipeline via a pressurization pump.

19. The auxiliary area setting device according to claim 18, characterized in that, It also has: A confluence return temperature measuring device that measures the temperature of the coolant flowing in the confluence return line; A confluence return flow control valve is provided on the confluence return line at a location downstream of the branch point where the confluence reheat line branches off from the confluence return line; A combined reheat flow control valve, located on the combined reheat line; and The valve control unit controls the operation of the combined return flow control valve and the combined reheat flow control valve.

20. The auxiliary area setting device according to claim 19, characterized in that, The valve control unit is configured to increase the opening of the merging return flow control valve and decrease the opening of the merging reheat flow control valve when the temperature of the coolant flowing in the merging return pipeline is lower than a set value.

21. The auxiliary area setting device according to claim 19, characterized in that, The valve control unit is configured to control the operation of the confluence return flow control valve and the confluence reheat flow control valve according to the instruction signal from the semiconductor manufacturing apparatus.

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