Integrated monitoring device and system for ground stress and microseismic

Abstract

The application provides a ground stress and microseismic integrated monitoring device and system, wherein the device comprises: a pipe body, a grouting channel is formed in the pipe body; a stress monitoring assembly is sleeved on the pipe body, and a cavity is formed between the stress monitoring assembly and the pipe body; a microseismic monitoring assembly is sleeved on the pipe body; a cable connecting assembly is sleeved on the pipe body, and the stress monitoring assembly and the microseismic monitoring assembly are connected to the cable connecting assembly; wherein the stress monitoring assembly is located between the microseismic monitoring assembly and the cable connecting assembly. In actual use, the device can perform stress monitoring and microseismic monitoring on the rock mass based on the same borehole, reduces the number of openings during monitoring, reduces the monitoring cost, improves the consistency of the monitoring positions of the stress monitoring assembly and the microseismic monitoring assembly, improves the coupling between the stress information and the microseismic information, weakens the influence of the monitoring position difference between the microseismic monitoring assembly and the stress monitoring assembly on the analysis accuracy, and enhances the monitoring and early warning capability of the engineering site.

Description

Technical Field

[0001] This invention relates to the field of rock mass engineering testing equipment technology, and in particular to an integrated monitoring device and system for geostress and microseismic activity. Background Technology

[0002] In the construction of deep engineering projects such as deep-buried tunnels and underground cavern groups, stress is an important determinant of the mechanical behavior of rock mass. At the same time, it is also necessary to monitor the microseismic parameters of the rock mass during engineering construction in order to capture the time, location and magnitude of rock microfractures.

[0003] In related technologies, monitoring devices for rock mass stress and rock mass microseismic activity are relatively isolated. Therefore, in order to set up monitoring devices for the aforementioned parameters, it is usually necessary to drill stress monitoring boreholes and microseismic monitoring boreholes on the rock mass to be monitored, and to arrange stress monitoring devices and microseismic vibration reduction devices in the corresponding boreholes. This results in high monitoring costs and low monitoring accuracy, which increases engineering investment and also limits the improvement of on-site monitoring and early warning capabilities. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0005] Therefore, a first aspect of the present invention provides an integrated monitoring device for ground stress and microseismic events.

[0006] A second aspect of the present invention provides an integrated monitoring system for ground stress and microseismic events.

[0007] In view of this, a first aspect of the embodiments of this application provides an integrated monitoring device for ground stress and microseismic events, comprising:

[0008] The pipe body contains grouting channels;

[0009] A stress monitoring component is fitted onto the pipe body, and a cavity is formed between the stress monitoring component and the pipe body.

[0010] Microseismic monitoring components are fitted onto the pipe body;

[0011] The cable connection assembly is sleeved on the pipe body, and both the stress monitoring assembly and the micro-vibration monitoring assembly are connected to the cable connection assembly;

[0012] The stress monitoring component is located between the microseismic monitoring component and the cable connection component.

[0013] In one feasible implementation, the stress monitoring component includes:

[0014] A sleeve is fitted onto a pipe body, forming a cavity between the sleeve and the pipe body. Both ends of the sleeve are sealed and connected to the pipe body.

[0015] The strain monitoring module is installed on the casing and is used to monitor the strain information of the casing.

[0016] The strain monitoring module is connected to the cable connection assembly.

[0017] In one feasible implementation, the strain monitoring module includes:

[0018] The strain gauges are at least three in number, and the three strain gauges are evenly arranged on the sleeve along the circumference of the tube body, and the three strain gauges are in the same position along the axial direction of the tube body.

[0019] In one feasible implementation, the strain rosette is a triaxial 45° strain rosette, with one strain sensing direction of each triaxial 45° strain rosette parallel to the axial direction of the tube body.

[0020] In one feasible implementation, the number of strain monitoring modules is at least two, and the at least two strain monitoring modules are arranged at intervals along the axial direction of the tube.

[0021] In one feasible implementation, the strain gauge includes a fiber Bragg grating strain sensor connected to a cable connection assembly.

[0022] In one feasible implementation, the microseismic monitoring component includes:

[0023] The base is fitted onto the tube body. The base has a ring structure and one end of the base has an installation wall.

[0024] The first protective shell is fitted onto the tube body. One end of the first protective shell is connected to the mounting wall, and the first protective shell, the base, and the tube body form a first mounting cavity, with the mounting wall facing the first mounting cavity.

[0025] The first micro-vibration sensor is installed on the mounting wall, and the micro-vibration sensing direction of the first micro-vibration sensor is arranged along the radial direction of the tube body.

[0026] The second micro-vibration sensor is disposed on the mounting wall. The micro-vibration sensing direction of the second micro-vibration sensor is arranged along the radial direction of the tube body, and the micro-vibration sensing direction of the first micro-vibration sensor is perpendicular to the micro-vibration sensing direction of the second micro-vibration sensor.

[0027] The third micro-vibration sensor is installed on the mounting wall, and the micro-vibration sensing direction of the third micro-vibration sensor is parallel to the axial direction of the pipe body.

[0028] Among them, the first microseismic sensor, the second microseismic sensor, and the third microseismic sensor are all fiber optic grating microseismic sensors.

[0029] In one feasible implementation, the cable connection assembly includes:

[0030] The second protective shell is fitted onto the pipe body, and the second protective shell and the pipe body form a second mounting cavity;

[0031] An optical cable connector is disposed in the second protective housing, with at least a portion of the optical cable connector located outside the second mounting cavity;

[0032] The first optical cable has one end connected to an optical cable connector and the other end connected to a stress monitoring component;

[0033] The second optical cable has one end connected to the optical cable connector and the other end connected to the microseismic monitoring component.

[0034] In one feasible implementation, the integrated geostress and microseismic monitoring device further includes:

[0035] Adapters are installed on the pipe body. There are two adapters, one at each end of the pipe body.

[0036] Temperature sensing element is installed in the stress monitoring component.

[0037] According to a second aspect of the embodiments of this application, an integrated monitoring system for ground stress and microseismic events is proposed, comprising:

[0038] Multiple integrated geostress and microseismic monitoring devices as proposed in any of the first aspects above;

[0039] Multiple connecting pipes are used to connect the pipe bodies of two adjacent integrated ground stress and microseismic monitoring devices.

[0040] Compared with the prior art, the present invention has at least the following beneficial effects: The integrated geostress and microseismic monitoring device provided in this application includes a pipe body, a stress monitoring component, a microseismic monitoring component, and a cable connection component. A grouting channel is formed within the pipe body, thereby providing a channel for grout flow during grouting operations and guiding the grout flow to facilitate grout filling into the rock mass to be grouted. Simultaneously, the pipe body also provides a supporting structure for the stress monitoring component and the microseismic monitoring component, improving the ease of deployment and installation reliability of the stress monitoring component and the microseismic monitoring component; the stress monitoring component, microseismic monitoring component... Both the monitoring component and the cable connection component are mounted on the pipe body. The stress monitoring component is used to acquire stress information of the rock mass to be monitored, and the microseismic monitoring component is used to acquire microseismic information of the rock mass to be monitored. The stress monitoring component is located between the microseismic monitoring component and the cable connection component. This arrangement, combined with the aforementioned configuration, allows for stress and microseismic monitoring of the rock mass from the same borehole in practical use, reducing the number of boreholes required for monitoring, thereby lowering monitoring costs and improving operational efficiency. Furthermore, it improves the consistency of the monitoring positions of the stress monitoring component and the microseismic monitoring component, thus enhancing the correlation between the aforementioned stress and microseismic information. The coupling between the information components weakens the impact of the difference in monitoring positions between the microseismic monitoring component and the stress monitoring component on the accuracy of the analysis. This allows for the use of the aforementioned stress and microseismic information to provide more reliable reference data for rock mass behavior prediction, improving the accuracy of rock mass behavior prediction and enhancing the monitoring and early warning capabilities at the engineering site. Simultaneously, both the stress and microseismic monitoring components are connected to a cable connection component, which is used to connect to external lines to establish a connection between the integrated stress and microseismic monitoring device and external signal receiving equipment. Thus, the stress and microseismic information acquired during use can be transmitted to the outside world through the cable connection component, facilitating rock mass behavior prediction by operators based on the stress and microseismic information. Furthermore, a cavity is formed between the stress monitoring component and the pipe body. After grouting is performed inside the pipe body, the cavity and pipe body can separate the stress monitoring component from the grout. This prevents the grout from eroding the stress monitoring component, extending its service life. Additionally, the cavity can be in a stress-free, free state, reducing interference from the grouting process and improving the accuracy of stress monitoring, which is beneficial for further enhancing the accuracy of rock mass mechanical behavior prediction. Attached Figure Description

[0041] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of exemplary embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0042] Figure 1A schematic structural diagram from the first perspective of an embodiment of the integrated geostress and microseismic monitoring device provided in this application;

[0043] Figure 2 A schematic structural diagram from a second perspective of an embodiment of the integrated geostress and microseismic monitoring device provided in this application;

[0044] Figure 3 A schematic structural diagram from a third perspective of an embodiment of the integrated geostress and microseismic monitoring device provided in this application;

[0045] Figure 4 for Figure 2 The schematic cross-sectional view of the integrated geostress and microseismic monitoring device along the AA direction is shown in the figure.

[0046] Figure 5 for Figure 2 The schematic cross-sectional view of the integrated geostress and microseismic monitoring device along the BB direction is shown in the figure.

[0047] Figure 6 A schematic exploded view of an embodiment of the integrated geostress and microseismic monitoring device provided in this application;

[0048] Figure 7 A schematic structural diagram of an integrated geostress and microseismic monitoring system according to an embodiment of this application.

[0049] in, Figures 1 to 7 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0050] 10 Integrated monitoring device for ground stress and microseismic activity; 20 connecting pipes;

[0051] 100 Pipe body; 200 Stress monitoring assembly; 300 Micro-vibration monitoring assembly; 400 Cable connection assembly; 500 Adapter; 600 Temperature sensor;

[0052] 210 Sleeve; 220 Strain monitoring module; 310 Base; 320 First protective shell; 330 First micro-vibration sensor; 340 Second micro-vibration sensor; 350 Third micro-vibration sensor; 410 Second protective shell; 420 Optical cable connector;

[0053] 221 strain flower;

[0054] 101 Grouting channel; 102 Cavity. Detailed Implementation

[0055] Exemplary embodiments of the present application will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this application will be thorough and complete, and will fully convey the scope of the present application to those skilled in the art.

[0056] like Figures 1 to 6 As shown, according to a first aspect of the embodiments of this application, an integrated ground stress and microseismic monitoring device 10 is provided, comprising: a pipe body 100, with a grouting channel 101 formed inside the pipe body 100; a stress monitoring component 200, sleeved on the pipe body 100, with a cavity 102 formed between the stress monitoring component 200 and the pipe body 100; a microseismic monitoring component 300, sleeved on the pipe body 100; and a cable connection component 400, sleeved on the pipe body 100, wherein the stress monitoring component 200 and the microseismic monitoring component 300 are both connected to the cable connection component 400; wherein the stress monitoring component 200 is located between the microseismic monitoring component 300 and the cable connection component 400.

[0057] The integrated ground stress and microseismic monitoring device 10 provided in this application embodiment includes a pipe body 100, a stress monitoring component 200, a microseismic monitoring component 300, and a cable connection component 400. The pipe body 100 has a grouting channel 101 formed inside. The pipe body 100 can provide a channel for grout flow and guide the flow of grout, making it easier for the grout to fill the rock mass to be grouted. On the other hand, the pipe body 100 can also provide a support structure for the stress monitoring component 200 and the microseismic monitoring component 300, improving the convenience of deployment and the reliability of installation of the stress monitoring component 200 and the microseismic monitoring component 300.

[0058] The stress monitoring component 200, the microseismic monitoring component 300, and the cable connection component 400 are all mounted on the pipe body 100. The stress monitoring component 200 is used to acquire stress information of the rock mass to be monitored, and the microseismic monitoring component 300 is used to acquire microseismic information of the rock mass to be monitored. The stress monitoring component 200 is located between the microseismic monitoring component 300 and the cable connection component 400. In combination with the aforementioned setup, on the one hand, stress monitoring and microseismic monitoring of the rock mass can be carried out based on the same borehole in actual use, reducing the number of boreholes to be opened in the rock mass during monitoring, thereby reducing monitoring costs and improving work efficiency. On the other hand, it can improve the consistency of the monitoring positions of the stress monitoring component 200 and the microseismic monitoring component 300, thereby improving the coupling between the aforementioned stress information and microseismic information, weakening the impact of the difference in monitoring positions between the microseismic monitoring component 300 and the stress monitoring component 200 on the accuracy of analysis, and thus using the aforementioned stress information and microseismic information to provide more reliable reference data for rock mass behavior prediction, improving the accuracy of rock mass behavior prediction, and enhancing the monitoring and early warning capabilities at the engineering site.

[0059] Meanwhile, the stress monitoring component 200 and the microseismic monitoring component 300 are both connected to the cable connection component 400, and the cable connection component 400 is used to connect to external lines to establish a connection between the integrated ground stress and microseismic monitoring device 10 and external signal receiving equipment. Thus, the stress information and microseismic information obtained during use can be transmitted to the outside world through the cable connection component 400, so that operators can predict rock mass behavior based on the stress information and microseismic information.

[0060] Furthermore, a cavity 102 is formed between the stress monitoring component 200 and the pipe body 100. After grouting is performed inside the pipe body 100, the stress monitoring component 200 and the grout can be separated by the cavity 102 and the pipe body 100. This can prevent the grout from eroding the stress monitoring component 200 and extend its service life. On the other hand, the cavity 102 can be in a stress-free state, reducing the interference of the grouting process on the stress monitoring component 200, improving the accuracy of stress monitoring, and further enhancing the accuracy of rock mass mechanical behavior prediction.

[0061] In some feasible examples, the tube body 100 can be a metal tube.

[0062] like Figure 1 , Figure 2 , Figure 4 and Figure 6As shown, in some examples, the stress monitoring component 200 includes: a sleeve 210 sleeved on the tube body 100, with a cavity 102 formed between the sleeve 210 and the tube body 100, and both ends of the sleeve 210 being sealed and connected to the tube body 100 respectively; a strain monitoring module 220 disposed on the sleeve 210 for monitoring the strain information of the sleeve 210; wherein, the strain monitoring module 220 is connected to the cable connection component 400.

[0063] In this technical solution, the stress monitoring component 200 may include a sleeve 210 and a strain monitoring module 220. The sleeve 210 is fitted onto the pipe body 100, forming the aforementioned cavity 102 between the sleeve 210 and the pipe body 100. Both ends of the sleeve 210 are sealed and connected to the pipe body 100, thereby further reducing the possibility of grout entering the cavity 102 and contacting the stress monitoring component 200 during the grouting process, providing further assurance for improving the accuracy of stress monitoring of the rock mass. The strain monitoring module 220 is installed on the sleeve 210 and is used to monitor the strain information of the sleeve 210. It can be understood that the sleeve 210 will generate strain under the action of rock mass stress, that is, ground stress. Therefore, the stress condition of the rock mass can be reflected based on the strain information of the sleeve 210, realizing stress monitoring of the rock mass. The strain monitoring module 220 is connected to the cable connection component 400, so that the monitored strain information can be transmitted to an external information receiving device for information processing and prediction analysis of rock mass behavior.

[0064] In some feasible examples, the sleeve 210 can be made of epoxy resin material, which can improve the corrosion resistance and insulation performance of the sleeve 210, which is conducive to further extending the service life of the stress monitoring component 200 and reducing the damage rate of the strain monitoring module 220.

[0065] In some feasible examples, the aforementioned cavity 102 can be an annular cavity, and the thickness of the aforementioned cavity 102 is greater than or equal to 2 mm, thereby ensuring that a relatively large stress-free space is formed between the sleeve 210 and the pipe body 100, providing further assurance for the improved monitoring accuracy of the stress monitoring component 200. The aforementioned cavity 102 can be 2 mm thick, thereby ensuring the monitoring accuracy of the stress monitoring component 200 while making the structure of the integrated ground stress and microseismic monitoring device 10 more compact, improving the miniaturization level of the integrated ground stress and microseismic monitoring device 10, and thus broadening the application range of the integrated ground stress and microseismic monitoring device 10.

[0066] like Figure 2 and Figure 6As shown, in some examples, the strain monitoring module 220 includes: strain gauges 221, the number of strain gauges 221 is at least three, the at least three strain gauges 221 are evenly arranged in the sleeve 210 along the circumference of the tube body 100, and the three strain gauges 221 are in the same position along the axial direction of the tube body 100.

[0067] In this technical solution, the strain monitoring module 220 may include at least three strain gauges 221. The strain gauges 221 are disposed on the casing 210. The aforementioned at least three strain gauges 221 are uniformly arranged along the axial direction of the casing 100, and the positions of the aforementioned at least three strain gauges 221 along the axial direction of the casing 100 are the same. Based on the aforementioned arrangement, on the one hand, during the monitoring process, multiple strain gauges 221 can be used to monitor the strain information generated by the casing 210 under the action of rock mass stress, and multiple positions in the circumferential direction can be monitored. Thus, based on the strain information, the stress information of the rock mass to be monitored near the borehole at multiple positions in the circumferential direction of the borehole can be obtained, thereby improving the coverage of stress monitoring and reducing the blind spots of stress monitoring. On the other hand, by limiting the aforementioned at least three strain gauges 221 By positioning multiple strain gauges 221 at the same axial direction along the pipe body 100, the strain gauges 221 can be located on the same monitoring section perpendicular to the axial direction of the pipe body 100. This improves the positional consistency of the strain information monitored by the multiple strain gauges 221, avoiding calculation deviations caused by differences in the axial positions of the multiple strain gauges 221 during subsequent analysis based on strain information, and improving the prediction accuracy of the mechanical behavior of the monitored rock mass. On the other hand, multiple strain sensors with different strain sensing directions in the strain gauges 221 can be used to monitor the strain of the casing 210 in multiple different directions, thereby realizing multi-directional stress monitoring of the monitored rock mass. This facilitates the acquisition of stress tensor information of the rock mass and provides a more refined reference for the prediction of the mechanical behavior of the rock mass.

[0068] It is understood that the strain gauge 221 includes multiple strain sensors with different strain sensing directions. When the strain gauge 221 is installed on the sleeve 210, each strain sensor is used to monitor the strain information of the sleeve 210 in different directions. Based on the strain information in these different directions, the stress information of the rock mass in the corresponding direction, i.e., the stress tensor information of the rock mass, can be obtained. The strain sensors included in the strain gauge 221 can be glued and fixed to the sleeve 210 with adhesive to prevent movement of the strain sensors relative to the sleeve 210 during use, ensuring the accuracy and reliability of stress monitoring.

[0069] In some feasible examples, the stress monitoring assembly 200 may also include a protective layer covering the sleeve 210 and the strain gauge 221. This protective layer provides structural protection for the strain gauge 221, reducing the likelihood of physical damage and extending the service life of the stress monitoring assembly 200. This also reduces maintenance costs and ultimately lowers monitoring costs. The protective layer may be made of epoxy resin, thereby improving the bond strength between the protective layer and the sleeve 210 and providing more reliable protection for both the strain gauge 221 and the sleeve 210.

[0070] In some feasible examples, the number of strain gauges 221 is three, with adjacent strain gauges 221 forming a circumferential angle of 120° along the tube body 100. The three strain gauges 221 can be connected in series and connected to the cable connection assembly 400.

[0071] like Figure 2 and Figure 6 As shown, in some examples, strain rosette 221 is a triaxial 45° strain rosette, with one strain sensing direction of each triaxial 45° strain rosette parallel to the axial direction of the tube body 100.

[0072] In this technical solution, the strain gauge 221 can be a triaxial 45° strain gauge, with each strain gauge 221 including three strain sensors. The strain sensing directions of the three strain sensors are different from each other, thus each triaxial 45° strain gauge has three different strain sensing directions. By setting one strain sensing direction of each triaxial 45° strain gauge parallel to the axial direction of the tube body 100, each triaxial 45° strain gauge can monitor the strain information of the casing 210 along the axial direction of the tube body 100, thereby obtaining the stress information of the rock mass to be monitored along the axial direction of the tube body 100. At the same time, based on the strain monitoring characteristics of the triaxial 45° strain gauge, the other two strain sensors of each triaxial 45° strain gauge can respectively monitor the strain information of the casing 210 along the direction perpendicular to the axial direction of the tube body 100 and the strain information along the direction at a 45° angle to the axial direction of the tube body 100. Thus, based on the strain information monitored by multiple triaxial 45° strain gauges in various directions, the stress tensor information of the rock mass in the corresponding direction can be obtained, providing more detailed and reliable reference data for predicting the mechanical behavior of the rock mass.

[0073] It should be noted that, Figure 2 The strain rosette 221 shown is a triaxial 45° strain rosette. It can be understood that a triaxial 45° strain rosette includes three strain sensors, two of which have strain sensing directions perpendicular to each other, and the strain sensing direction of the third strain sensor lies on the bisector of the angle between the strain sensing directions of the first two, and forms a 45° angle with each of the first two strain sensing directions. Figure 2At position 221 of the strain rosette, three quadrilaterals with different length directions are used to schematically represent strain sensors. The length direction of the quadrilateral is also the strain sensing direction of the corresponding strain sensor. It can be seen that one of the three strain sensors included in the triaxial 45° strain rosette has a strain sensing direction parallel to the axis of the tube 100, that is, the angle with the axis of the tube 100 is 0°. Another strain sensing direction is perpendicular to the axis of the tube 100, that is, the angle with the axis of the tube 100 is 90°. The third strain sensing direction is located on the bisector of the angle between the strain sensing directions of the first two, and the angle with the axis of the tube 100 is 45°.

[0074] In some examples, the number of strain monitoring modules is at least two, and the at least two strain monitoring modules are arranged at axial intervals along the tube body 100.

[0075] In this technical solution, the number of strain monitoring modules can be at least two, and the at least two strain monitoring modules are arranged at intervals along the axial direction of the pipe body 100. Thus, each integrated geostress and microseismic monitoring device 10 can use at least two strain monitoring modules to monitor the stress information of the rock mass to be monitored at different positions along the axial direction of the pipe body 100, thereby further increasing the stress monitoring range of the integrated geostress and microseismic monitoring device 10, improving the stress monitoring precision of the integrated geostress and microseismic monitoring device 10, and providing more refined reference data for predicting the mechanical behavior of the rock mass.

[0076] In some examples, strain gauge 221 includes a fiber Bragg grating strain sensor connected to cable connection assembly 400.

[0077] In this technical solution, the stress sensor of the strain gauge 221 can be a fiber optic strain sensor, which is connected to the cable connection assembly 400. The strain information monitored by the strain gauge 221 can be transmitted to an external information receiving device via the cable connection assembly 400. This allows for the analysis and prediction of the mechanical behavior of the rock mass based on the aforementioned strain information. Furthermore, the fiber optic strain sensor has good electromagnetic interference resistance, excellent corrosion resistance, low transmission loss, and is easy to array, making it more suitable for deployment within boreholes for monitoring rock stress information. This reduces the possibility of insulation failure of the strain gauge 221 under environmental erosion during underground operations, extends the service life of the stress monitoring assembly 200, reduces monitoring costs, and improves the stability of information transmission, providing a reliable guarantee for the stable execution of rock mass mechanical behavior prediction.

[0078] like Figures 4 to 6As shown, in some examples, the microseismic monitoring component 300 includes: a base 310, sleeved on the tube body 100, the base 310 having an annular structure and a mounting wall formed at one end; a first protective shell 320, sleeved on the tube body 100, one end of the first protective shell 320 connected to the mounting wall, and the first protective shell 320, the base 310, and the tube body 100 forming a first mounting cavity, with the mounting wall facing the first mounting cavity; and a first microseismic sensor 330, disposed on the mounting wall, the microseismic sensing direction of the first microseismic sensor 330 along the diameter of the tube body 100. The tube body 100 is arranged in a radial direction; a second micro-vibration sensor 340 is disposed on the mounting wall, and the micro-vibration sensing direction of the second micro-vibration sensor 340 is arranged along the radial direction of the tube body 100, and the micro-vibration sensing direction of the first micro-vibration sensor 330 is perpendicular to the micro-vibration sensing direction of the second micro-vibration sensor 340; a third micro-vibration sensor 350 is disposed on the mounting wall, and the micro-vibration sensing direction of the third micro-vibration sensor 350 is parallel to the axial direction of the tube body 100; wherein, the first micro-vibration sensor 330, the second micro-vibration sensor 340 and the third micro-vibration sensor 350 are all fiber Bragg grating micro-vibration sensors.

[0079] In this technical solution, the microseismic monitoring component 300 may include a base 310, a first protective shell 320, a first microseismic sensor 330, a second microseismic sensor 340, and a third microseismic sensor 350. The base 310 is an annular structure and is fitted onto the tube body 100. One end of the base 310 has a mounting wall, which provides mounting positions for each microseismic sensor. The first protective shell 320 is fitted onto the tube body 100, and one end is connected to the aforementioned mounting wall. The first protective shell 320, the base 310, and the tube 100 form a first mounting cavity. The aforementioned mounting wall is arranged facing the mounting cavity. The first micro-vibration sensor 330, the second micro-vibration sensor 340, and the third micro-vibration sensor 350 are all disposed on the mounting wall and located inside the first mounting cavity. Thus, the first protective shell 320, together with the base 310 and the tube 100, can provide structural protection for each micro-vibration sensor, reducing the possibility of physical damage to the aforementioned micro-vibration sensors.

[0080] At the same time, such as Figure 5As shown, the micro-vibration sensing direction of the first micro-vibration sensor 330 is arranged radially along the pipe body 100, the micro-vibration sensing direction of the second micro-vibration sensor 340 is also arranged radially along the pipe body 100, and the micro-vibration sensing direction of the first micro-vibration sensor 330 is perpendicular to the micro-vibration sensing direction of the second micro-vibration sensor 340. The micro-vibration sensing direction of the third micro-vibration sensor 350 is parallel to the axial direction of the pipe body 100. Therefore, based on the aforementioned arrangement, the third micro-vibration sensor 350 can be used to monitor the micro-vibration information of the rock mass along the axial direction of the pipe body 100, and the first and second micro-vibration sensors 330 and 340 can be used to monitor the micro-vibration information of the rock mass along the axial direction of the pipe body 100. The microseismic information in the radial direction is obtained. Since the microseismic sensing directions of the first microseismic sensor 330 and the second microseismic sensor 340 are perpendicular, it is convenient to establish a spatial rectangular coordinate system with the axis of the tube body 100 as one coordinate axis during the analysis process. Based on the microseismic information monitored by the aforementioned microseismic sensors, a microseismic location distribution chart of the rock mass to be monitored can be established, which provides convenient conditions for analyzing the microseismic location distribution of the rock mass to be monitored. At the same time, the location of the microseismic source of the rock mass to be monitored can be located based on the time difference of the microseismic information monitored by the aforementioned microseismic sensors, further improving the accuracy and convenience of rock mass behavior prediction.

[0081] It should be noted that, Figure 5 The double arrows close to the first micro-vibration sensor 330 schematically indicate the micro-vibration sensing direction of the first micro-vibration sensor 330; Figure 5 The double arrows near the second microseismic sensor 340 schematically indicate the microseismic sensing direction of the second microseismic sensor 340.

[0082] Furthermore, the first microseismic sensor 330, the second microseismic sensor 340, and the third microseismic sensor 350 can all be fiber Bragg grating microseismic sensors. Fiber Bragg grating microseismic sensors have good anti-electromagnetic interference performance, good corrosion resistance, low transmission loss, and are easy to array, making them more suitable for deployment in boreholes and for monitoring the microseismic information of rock masses. During underground operations, they can reduce the possibility of insulation failure of the aforementioned microseismic sensors under environmental erosion, extend the service life of the microseismic monitoring component 300, reduce monitoring costs, and improve the stability of information transmission, providing a reliable guarantee for the stable execution of rock mass behavior prediction.

[0083] In some feasible examples, the sensitive elements of the first microseismic sensor 330, the second microseismic sensor 340, and the third microseismic sensor 350 can all be FP (Fabry-Perot) interferometers, Michelson interferometers, or Mach-Zehnder interferometers. This facilitates further reduction in the volume of the aforementioned microseismic sensors, improves the miniaturization level of the microseismic monitoring component 300, enhances the structural compactness of the integrated ground stress and microseismic monitoring device 10, and helps to further broaden the application range of the integrated ground stress and microseismic monitoring device 10. The sensitive elements of the first microseismic sensor 330, the second microseismic sensor 340, and the third microseismic sensor 350 can all be microseismic acceleration sensors, microseismic velocity sensors, or microseismic displacement sensors.

[0084] In some feasible examples, the first microseismic sensor 330, the second microseismic sensor 340, and the third microseismic sensor 350 are all threaded to the base 310 or bonded to the mounting wall. Each of the aforementioned microseismic sensors may be a double-ended connector and connected in series with each other, and each of the aforementioned microseismic sensors is connected to the cable connection assembly 400.

[0085] like Figures 2 to 4 and Figure 6 As shown, in some examples, the cable connection assembly 400 includes: a second protective shell 410, sleeved on the tube body 100, the second protective shell 410 and the tube body 100 forming a second mounting cavity; an optical cable connector 420, disposed on the second protective shell 410, at least a portion of the optical cable connector 420 being located outside the second mounting cavity; a first optical cable, one end of which is connected to the optical cable connector 420 and the other end of which is connected to the stress monitoring assembly 200; and a second optical cable, one end of which is connected to the optical cable connector 420 and the other end of which is connected to the micro-vibration monitoring assembly 300.

[0086] In this technical solution, the cable assembly may include a second protective shell 410, an optical cable connector 420, a first optical cable, and a second optical cable. The second protective shell 410 is fitted onto the tube body 100 and forms a second mounting cavity with the tube body 100. The optical cable connector 420 is disposed on the second protective shell 410, with at least a portion of the connector 420 located outside the second mounting cavity, facilitating connection of the connector 420 to external signal receiving equipment or external optical cables. The two ends of the first optical cable are respectively connected to the optical cable connector 420 and the stress monitoring component 200. Thus, during monitoring, the stress information monitored by the stress monitoring component 200 can be transmitted through the first optical cable connector 410 to the second optical cable. The optical cable and optical cable connector 420 transmit to the outside world. The two ends of the second optical cable are respectively connected to the optical cable connector 420 and the microseismic monitoring component 300. Thus, during the monitoring process, the microseismic information monitored by the microseismic monitoring component 300 can be transmitted to the outside world through the first optical cable and optical cable connector 420. This is beneficial to realize the optical fiber transmission of the integrated ground stress and microseismic monitoring device 10, reduce the possibility of electromagnetic interference during information transmission, and avoid the emission of electromagnetic waves during information transmission. This also reduces the impact of the integrated ground stress and microseismic monitoring device 10 on other nearby external electronic devices, and provides further assurance for the reliable transmission of the aforementioned information.

[0087] Understandably, when the stress monitoring component 200 monitors the rock mass by monitoring the strain information of the sleeve 210 through the strain monitoring module 220, the first optical cable is used to transmit the strain information monitored by the strain monitoring module 220. When the strain monitoring module 220 includes the aforementioned fiber Bragg grating strain sensor, one end of the first optical cable is connected to the aforementioned fiber Bragg grating strain sensor. When the microseismic monitoring component 300 includes the aforementioned first microseismic sensor 330, second microseismic sensor 340, and third microseismic sensor 350, all three are connected to the second optical cable. The first and second optical cables can pass through the second protective shell and the cavity 102, and are respectively connected to the stress monitoring component 200 and the microseismic monitoring component 300.

[0088] like Figure 6 As shown, in some examples, the integrated geostress and microseismic monitoring device 10 further includes: an adapter 500 disposed on the tube body 100, with two adapters 500 disposed at each end of the tube body 100; and a temperature sensor 600 disposed on the stress monitoring component 200.

[0089] In this technical solution, the integrated ground stress and microseismic monitoring device 10 may further include an adapter 500 and a temperature sensor 600. The adapter 500 is disposed on the pipe body 100, and there are two adapters 500. One adapter 500 is disposed at each end of the pipe body 100, which facilitates the connection of the pipe body 100 to the external grouting pipe through the adapter 500, improves the installation convenience of the integrated ground stress and microseismic monitoring device 10, and facilitates the fixation of the integrated ground stress and microseismic monitoring device 10 in the borehole through the external grouting pipe, thereby improving the monitoring efficiency.

[0090] The temperature sensor 600 is installed on the stress monitoring component 200, so that the temperature information of the stress monitoring component 200 can be monitored by the temperature sensor 600. This facilitates temperature compensation of the stress information monitored by the stress monitoring component 200 during the analysis process, making up for the monitoring error of the stress monitoring component 200 at different temperatures, and providing further assurance for the accurate prediction of rock mass mechanical behavior.

[0091] It is understandable that the temperature information monitored by the temperature sensor can also be used to characterize the low temperature in the area near the stress monitoring component 200, thereby further realizing the low temperature monitoring function of the integrated ground stress and microseismic monitoring device 10.

[0092] In some feasible examples, the temperature sensing element 600 can be a fiber Bragg grating temperature sensor, and the cable connection assembly 400 can also include a third optical cable, one end of which is connected to the aforementioned optical cable connector 420, and the other end is connected to the fiber Bragg grating temperature sensor. Thus, when the stress monitoring assembly 200 includes the aforementioned fiber Bragg grating strain sensor, and the first microseismic sensing element 330, the second microseismic sensing element 340, and the third microseismic sensing element 350 are all fiber Bragg grating microseismic sensors, the all-fiber monitoring and transmission of the integrated ground stress and microseismic monitoring device 10 can be realized, providing further assurance for improving the monitoring stability and reliability of the integrated ground stress and microseismic monitoring device 10.

[0093] In some feasible examples, the two ends of the tube body 100 are formed with threaded structures, and the adapter 500 is threadedly connected to the tube body 100.

[0094] like Figure 7 As shown, according to a second aspect of the embodiments of this application, an integrated monitoring system for ground stress and microseismic activity is proposed, comprising: a plurality of integrated monitoring devices 10 for ground stress and microseismic activity as proposed in any of the first aspects above; and a plurality of connecting pipes 20 connected between the pipe bodies 100 of two adjacent integrated monitoring devices 10 for ground stress and microseismic activity.

[0095] The integrated geostress and microseismic monitoring system provided in this application embodiment may include multiple connecting pipes 20 and multiple integrated geostress and microseismic monitoring devices 10 as described in any of the first aspects above. The multiple connecting pipes 20 are connected between the pipe bodies 100 of two adjacent integrated geostress and microseismic monitoring devices 10. Thus, during monitoring, the integrated geostress and microseismic monitoring system can be arranged inside the borehole. Based on the arrangement of the connecting pipes 20, the position of the integrated geostress and microseismic monitoring devices 10 within the borehole can be adjusted, and based on the connection between the connecting pipes 20 and the integrated geostress and microseismic monitoring devices 10... Adjusting the connection between the 0s and the distance between two adjacent integrated geostress and microseismic monitoring devices 10 can improve the flexibility of the arrangement of the integrated geostress and microseismic monitoring devices 10. By using multiple integrated geostress and microseismic monitoring devices 10, stress and microseismic monitoring can be carried out on the rock mass at different positions along the borehole axis, thereby increasing the monitoring range of the integrated geostress and microseismic monitoring system. At the same time, it can be understood that the connecting pipe 20 is connected to the pipe body 100, so the grout flow channel during grouting can also be extended by using the connecting pipe 20, which is beneficial for grouting operations on the rock mass during construction.

[0096] In some feasible examples, the connecting pipe 20 can be a metal pipe, a PVC pipe, or a PPR pipe; the specifications of the connecting pipe 20 can be commonly used standard specifications, such as DN15, DN20, DN25, DN32, DN40, etc. The specific specifications of the pipe body 100 can be selected according to the actual drilling conditions, and are not limited here. When the integrated ground stress and microseismic monitoring device 10 includes an adapter 500, the pipe body 100 is connected to the connecting pipe 20 through the adapter 500.

[0097] In practical applications, when the stress monitoring component 200 includes the aforementioned triaxial 45° strain rosette, the triaxial 45° strain rosette of each integrated stress and microseismic monitoring device 10 can maintain a consistent circumferential angular position along the borehole, thereby improving the circumferential position consistency of the stress information monitored by each integrated stress and microseismic monitoring device 10; when the microseismic monitoring component 300 includes the aforementioned microseismic sensors, the corresponding microseismic sensors of each integrated stress and microseismic monitoring device 10 can maintain a consistent circumferential angular position along the borehole, thereby improving the circumferential position consistency of the microseismic information monitored by each integrated stress and microseismic monitoring device 10; when the cable connection component 400 includes the aforementioned optical cable connector 420, the optical cable connector 420 of each integrated stress and microseismic monitoring device 10 can maintain a consistent circumferential angular position along the borehole, so that the cable connection component 400 of each integrated stress and microseismic monitoring device 10 can be connected to an external information receiving device, such as a demodulation device, to achieve real-time information transmission and ensure the real-time monitoring of rock stress and microseismic conditions.

[0098] Understandably, in practical applications, multiple boreholes can be drilled in different areas of the rock mass to deploy multiple integrated geostress and microseismic monitoring systems, based on monitoring needs. This not only enables stress and microseismic monitoring at multiple locations within the rock mass, but also avoids the need to drill separate stress monitoring boreholes and microseismic monitoring boreholes for the same rock mass area, reducing the number of boreholes required for monitoring and thus lowering monitoring costs.

[0099] Furthermore, since the integrated geostress and microseismic monitoring system provided in this application includes the integrated geostress and microseismic monitoring device 10 as proposed in any of the first aspects above, it possesses all the beneficial effects of the integrated geostress and microseismic monitoring device 10 as proposed in any of the first aspects above, which will not be repeated here.

[0100] In this invention, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise explicitly defined. The terms "install," "connect," "link," and "fix" should be interpreted broadly. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "link" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0101] In the description of this invention, it should be understood that the terms "upper," "lower," "left," "right," "front," "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or unit referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0102] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0103] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An integrated monitoring device for ground stress and microseismic activity, characterized in that, include: The pipe body has a grouting channel formed inside it; A stress monitoring component is sleeved on the tube body, and a cavity is formed between the stress monitoring component and the tube body; A microseismic monitoring component is fitted onto the tube body; A cable connection assembly is sleeved on the tube body, and both the stress monitoring assembly and the micro-vibration monitoring assembly are connected to the cable connection assembly; The stress monitoring component is located between the microseismic monitoring component and the cable connection component; The stress monitoring component includes: A sleeve is fitted onto the tube body, and a cavity is formed between the sleeve and the tube body. Both ends of the sleeve are respectively sealed and connected to the tube body. A strain monitoring module is installed in the sleeve to monitor the strain information of the sleeve; The microseismic monitoring component is used to locate microseismic signals in three-dimensional space, and the microseismic monitoring component includes: The system comprises a base, a first protective shell, a first micro-vibration sensor, a second micro-vibration sensor, and a third micro-vibration sensor. The base is fitted onto the tube body and has an annular structure, with a mounting wall formed at one end. The first protective shell is fitted onto the tube body, with one end connected to the mounting wall. The first protective shell, the base, and the tube body form a first mounting cavity, with the mounting wall facing the first mounting cavity. The mounting wall provides mounting positions for each micro-vibration sensor. The cable connection assembly includes: A second protective shell is fitted onto the tube body, and the second protective shell and the tube body form a second mounting cavity; An optical fiber connector is disposed in the second protective housing, with at least a portion of the optical fiber connector located outside the second mounting cavity; A first optical cable, one end of which is connected to the optical cable connector and the other end of which is connected to the stress monitoring component; The second optical cable has one end connected to the optical cable connector and the other end connected to the micro-vibration monitoring component; The first optical cable and the second optical cable pass through the cavity.

2. The integrated monitoring device for ground stress and microseismic activity according to claim 1, characterized in that, The strain monitoring module includes: The strain gauges are provided in a manner that is at least three in number, and are evenly distributed around the circumference of the tube body on the sleeve, with the three strain gauges being positioned in the same axial direction along the tube body.

3. The integrated monitoring device for ground stress and microseismic activity according to claim 2, characterized in that, The strain rosette is a triaxial 45° strain rosette, and one strain sensing direction of each of the triaxial 45° strain rosettes is parallel to the axial direction of the tube body.

4. The integrated monitoring device for ground stress and microseismic activity according to claim 3, characterized in that, The number of strain monitoring modules is at least two, and the at least two strain monitoring modules are arranged at intervals along the axial direction of the tube.

5. The integrated monitoring device for ground stress and microseismic activity according to claim 3, characterized in that, The strain gauge includes a fiber Bragg grating strain sensor, which is connected to the cable connection assembly.

6. The integrated monitoring device for ground stress and microseismic activity according to claim 1, characterized in that, The first micro-vibration sensor is disposed on the mounting wall, and the micro-vibration sensing direction of the first micro-vibration sensor is arranged along the radial direction of the tube body; The second micro-vibration sensor is disposed on the mounting wall, and the micro-vibration sensing direction of the second micro-vibration sensor is arranged along the radial direction of the tube body, and the micro-vibration sensing direction of the first micro-vibration sensor is perpendicular to the micro-vibration sensing direction of the second micro-vibration sensor. The third micro-vibration sensor is disposed on the mounting wall, and the micro-vibration sensing direction of the third micro-vibration sensor is parallel to the axial direction of the pipe body; Among them, the first microseismic sensor, the second microseismic sensor and the third microseismic sensor are all fiber optic grating microseismic sensors.

7. The integrated monitoring device for ground stress and microseismic activity according to any one of claims 1 to 5, characterized in that, Also includes: An adapter is provided on the pipe body, and there are two adapters, one at each end of the pipe body; A temperature sensor is disposed on the stress monitoring assembly.

8. An integrated monitoring system for ground stress and microseismic activity, characterized in that, include: Multiple integrated geostress and microseismic monitoring devices as described in any one of claims 1 to 7; Multiple connecting pipes are connected between the pipe bodies of two adjacent integrated geostress and microseismic monitoring devices.

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