Non-contact switch and electronic device

Abstract

The application relates to a non-contact switch and an electronic device. The non-contact switch is used for controlling multiple working modes, and comprises a fixed part, a sliding part and a processor; the fixed part comprises a sensor module; the sliding part is arranged in a spaced mode relative to the fixed part and can move along a preset direction relative to the fixed part; the sliding part comprises a magnetic head, and the magnetic head at least partially coincides with the sensor module so that the sensor module can judge the position of the sliding part relative to the fixed part; the processor is electrically connected with the sensor module, and the processor makes the non-contact switch be in a corresponding working mode according to the position of the sliding part relative to the fixed part. The electronic device comprises the non-contact switch. The non-contact switch provided by the application is beneficial to improving the sealing performance of the electronic device, and the sliding part does not need to be directly contacted with the fixed part.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, specifically to a non-contact switch and electronic equipment. Background Technology

[0002] Currently, buttons on electronic devices such as mobile phones typically use embedded push-button switches. Push-button switches have the advantages of simple structure and convenient operation. However, since push-button switches are directly connected to the inside of electronic devices, they place high demands on the sealing of electronic devices. Summary of the Invention

[0003] This application provides non-contact switches and electronic devices for improving the sealing performance of electronic devices.

[0004] This application provides a non-contact switch for controlling multiple operating modes, including:

[0005] Fixtures, including sensor modules;

[0006] A sliding member, spaced apart from the fixed member and movable relative to the fixed member along a preset direction; the sliding member includes a magnetic head, the magnetic head at least partially overlapping with the sensor module so that the sensor module can determine the position of the sliding member relative to the fixed member; and

[0007] The processor is electrically connected to the sensor module, and the processor puts the non-contact switch into a corresponding working mode according to the position of the slider relative to the fixed member.

[0008] This application also provides an electronic device, including:

[0009] Non-contact switches; and

[0010] The middle frame includes a middle plate and a frame extending from the edge of the middle plate, the frame and the middle plate forming an accommodating cavity;

[0011] The fixing member and the processor are housed in the accommodating cavity, and the sliding member is disposed on the frame.

[0012] The contactless switch provided in this application embodiment has a sliding member and a fixed member spaced apart and moving relative to the fixed member in a preset direction. A sensor module is mounted on the fixed member, and a magnetic head is mounted on the sliding member, enabling the sensor module to determine the position of the sliding member relative to the fixed member. The processor then puts the contactless switch into the corresponding operating mode based on the position of the sliding member relative to the fixed member. In the contactless switch provided in this application, the sliding member is slidably connected to the edge of the middle frame, and the fixed member is connected to the middle plate of the middle frame. The edge is sandwiched between the sliding member and the fixed member, eliminating the need for direct contact between the sliding member and the fixed member and the need for a through hole in the edge connecting the sliding member and the fixed member, thus improving the sealing performance of the electronic device. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a front view schematic diagram of the electronic device provided in the embodiments of this application;

[0015] Figure 2 yes Figure 1 A schematic cross-sectional view of the electronic device shown along the AA direction;

[0016] Figure 3 yes Figure 1 A partial structural diagram of the non-contact switch and its connection to the frame in the electronic device shown.

[0017] Figure 4 yes Figure 3 A schematic diagram of the three-dimensional structure of the middle frame shown;

[0018] Figure 5 yes Figure 4 The diagram shows the interface along the BB direction of the middle frame;

[0019] Figure 6 yes Figure 3 A perspective schematic diagram of an embodiment of a non-contact switch is shown.

[0020] Figure 7 yes Figure 6 The diagram shown illustrates the changes in magnetic field strength of the first Hall sensor in various directions when the slider is equivalent to the fixed part sliding along a preset direction.

[0021] Figure 8 yes Figure 6The diagram shown illustrates the changes in magnetic field strength of the second Hall sensor in various directions when the slider is equivalent to the fixed part sliding along a preset direction.

[0022] Figure 9 This is a schematic diagram showing the relationship between the magnetic field changes of the first and second Hall sensors and the sliding distance of the slider, which is equivalent to the sliding distance of the fixed part.

[0023] Figure 10 yes Figure 3 A perspective view of another embodiment of the non-contact switch shown;

[0024] Figure 11 yes Figure 10 The diagram shows the structure of the non-contact switch.

[0025] Figure 12 yes Figure 11 A schematic diagram of a specific embodiment of the contactless switch is shown.

[0026] Figure 13 yes Figure 11 A schematic cross-sectional view of the magnetoresistive sensor in the sensor module of the displacement measurement structure shown;

[0027] Figure 14 This is an axial schematic diagram showing how the resistance of a magnetoresistive sensor changes with an external magnetic field.

[0028] Figure 15 yes Figure 11 The circuit diagram of the processor in the contactless switch shown is shown.

[0029] Figure 16 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0030] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be particularly noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.

[0031] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0032] It should be noted that the terms "first," "second," and "third" in this application are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0033] Please refer to Figures 1 to 2 , Figure 1 This is a front view schematic diagram of the electronic device provided in the embodiments of this application; Figure 2 yes Figure 1 The diagram shows a cross-sectional view of the electronic device along the AA direction. Figure 1 This is a perspective view of an electronic device provided in an embodiment of this application. This application provides an electronic device 1000. Specifically, the electronic device 1000 can be any of various types of computer system devices that are mobile or portable and perform wireless communication. Figure 1 (Only one form is shown as an example). Specifically, the electronic device 1000 can be a mobile phone or smartphone (e.g., a phone based on iPhone™ or Android™), a portable gaming device (e.g., Nintendo DS™, PlayStation Portable™, Gameboy Advance™, iPhone™), a laptop computer, a PDA, a portable internet device, a music player, and a data storage device, other handheld devices, and such as headphones. The electronic device 1000 can also be other wearable devices that require charging (e.g., head-mounted devices (HMDs) such as electronic bracelets, electronic necklaces, electronic devices, or smartwatches).

[0034] Electronic device 1000 may also be any one of a plurality of electronic devices, including but not limited to cellular phones, smartphones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, other media recorders, radios, medical devices, vehicle transport instruments, calculators, programmable remote controls, pagers, laptop computers, desktop computers, printers, netbooks, personal digital assistants (PDAs), portable multimedia players (PMPs), Moving Image Experts Group (MPEG-1 or MPEG-2) audio layer 3 (MP3) players, portable medical devices, and digital cameras and combinations thereof.

[0035] In some cases, electronic device 1000 can perform multiple functions (e.g., playing music, displaying video, storing pictures, and receiving and sending telephone calls). If desired, electronic device 1000 can be such as a cellular phone, media player, other handheld device, wristwatch, pendant device, handset device, or other compact portable device.

[0036] Please refer to the above as well. Figure 3 , Figure 3 yes Figure 1 The diagram shows a partial structural illustration of a contactless switch cooperating with a mid-frame in an electronic device. The electronic device 1000 may include a mid-frame 400, a back cover 300, a display screen 200, and a contactless switch 100. The back cover 300 is connected to one side surface of the mid-frame 400 and is attached to the mid-frame 400. The display screen 200 is disposed on the surface of the mid-frame 400 opposite to the back cover. The mid-frame 400, the back cover 300, and the display screen 200 are connected and enclose a receiving space 4001. This receiving space 4001 can be used to house structural components such as a camera module, motherboard, and battery, enabling the electronic device 1000 to perform corresponding functions. The display screen 200, camera module, and other structural components can be electrically connected to the motherboard and battery via a flexible printed circuit (FPC), allowing them to receive power from the battery and execute corresponding instructions under the control of the motherboard. The non-contact switch 100 is disposed on the middle frame 400 and electrically connected to the motherboard. It is used to put the electronic device into a ringing, silent or do-not-disturb state, or to control the volume increase, volume decrease or volume hold state, etc., which will not be listed here.

[0037] The mid-frame 400 can be used to install various electronic components required by the electronic device 1000, and the mid-frame 400, together with the back cover 300 and the display screen 200, can form an accommodating space 4001. The accommodating space 4001 can be used to install electronic components such as optical sensors to achieve functions such as fingerprint unlocking, automatic screen off, and brightness self-adjustment. The accommodating space 4001 can also be used to install electronic components such as microphones, speakers, flashlights, circuit boards, and batteries to achieve functions such as voice communication, audio playback, and lighting.

[0038] Please refer to Figures 4 to 5 , Figure 4 yes Figure 3 The diagram shows the three-dimensional structure of the middle frame. Figure 5 yes Figure 4The diagram shows the interface of the mid-frame along the BB direction. Specifically, the mid-frame 400 may include a mid-plate 401 and a frame 402 extending from the edge of the mid-plate 401. The mid-plate 401 and the frame 402 surround to form a receiving cavity 4011, in which the camera module, motherboard, battery and other structures are housed.

[0039] The frame 402 may be provided with a sliding groove 403, and part of the non-contact switch 100 is slidably connected in the sliding groove 403, and part of the structure is housed in the receiving cavity 4011 and fixed on the middle plate 401.

[0040] In this embodiment, the frame 402 may have a first surface 4021 and a second surface 4022 disposed adjacent to each other, wherein the first surface 4021 is disposed away from the receiving cavity 4011, and the second surface 4022 is substantially parallel to the middle plate 401. The first surface 4021 is provided with a sliding groove 4031, and the second surface 4022 is provided with a slot 4032 communicating with the sliding groove 4031. The sliding groove 4031 and the slot 4032 form the sliding groove 403.

[0041] Understandably, the back cover 300 can abut against the second surface 4022 of the frame 402, so that the back cover 300 can seal the second sliding groove 4032, preventing external water, dust, etc. from entering the accommodating cavity 4011 through the sliding groove 4031 and the slot 4032 (i.e., the sliding groove 403). In addition, the back cover 300 also serves to protect the motherboard, battery, and other structures in the accommodating space 4001.

[0042] The display screen 200 can be used to provide image display function for the electronic device 1000. When the user uses the shooting function of the electronic device 1000, the display screen 200 can display the image of the camera module for the user to observe and operate.

[0043] Please refer to Figure 6 , Figure 6 yes Figure 3 The diagram shows a perspective view of an embodiment of a contactless switch. 100 may include a fixing member 10, a sliding member 20, and a processor 30, wherein the sliding member 20 is slidable relative to the fixing member 10. Specifically, the fixing member 10 may include a sensor module 11, and the sliding member 20 may include a magnetic head 23. The magnetic head 23 moves relative to the sensor module 11, enabling the sensor module 11 to sense the position of the magnetic head 23 relative to the sensor module 11 (i.e., the sliding member 20 relative to the fixing member 10). The processor 30 is electrically connected to the sensor module 11, and the processor 30 adjusts the contactless switch 100 to a corresponding operating mode based on the position of the sliding member 20 relative to the fixing member 10.

[0044] Understandably, the fixing member 10 can be spaced apart from the sliding member 20, meaning the fixing member 10 and the sliding member 20 can be configured without contact. Specifically, the fixing member 10 is housed in the receiving space 4001 and fixed to the middle plate 401. The sliding member 20 is held and housed in the sliding groove 403, allowing the sliding member 20 to slide in the sliding groove 403 along a preset direction, controlling the electronic device 1000 to enter the corresponding working mode without direct contact with the fixing member 10. That is, the non-contact switch 100 provided in this application does not need to consider the sealing problem of the electronic device 1000, making the structure of the electronic device 1000 simpler.

[0045] Specifically, the slider 20 may further include a sliding portion 21 and a retaining portion 22 connected to the sliding portion 21, with the magnetic head 23 disposed on the retaining portion 22. The sliding portion 21 is slidably connected to the slide groove 4031 and protrudes from the first surface 4021 to facilitate user sliding of the slider 20. The retaining portion 22 is retained in the slot 4032, serving two purposes: firstly, to prevent the sliding portion 21 from disengaging from the slide groove 4031, improving the reliability of the connection between the sliding portion 21 and the middle frame 400; and secondly, to fix the magnetic head 23, ensuring that the magnetic head 23 faces the accommodating space 4001 and is disposed adjacent to the fixing member 10.

[0046] In one embodiment, the sensor module 11 may include at least one Hall sensor 111, which may be arranged along a preset direction. When the slider 20 slides relative to the fixed member 10, the Hall sensor 111 may detect the magnetic field strength of the magnetic head 23 and determine the position of the slider 20 relative to the fixed member 10 based on the magnetic field strength of the magnetic head 23.

[0047] Specifically, the sensor module 11 may include two Hall sensors 111 (a first Hall sensor 111a and a second Hall sensor 111b), wherein the first Hall sensor 111a and the second Hall sensor 111b are spaced apart along a preset direction. When the magnetic head 23 is positioned corresponding to the first Hall sensor 111a, that is, when the slider 20 is located at the first position Z1 of the fixed member 10, the non-contact switch 100 can be in a first operating mode. When the magnetic head 23 is positioned between the first Hall sensor 111a and the second Hall sensor 111b, that is, when the slider 20 is located at the second position Z2 of the fixed member 10, the non-contact switch can be in a second operating mode. When the magnetic head 23 is positioned corresponding to the second Hall sensor 111b, that is, when the slider 20 is located at the third position Z3 of the fixed member 10, the non-contact switch 100 is in a third operating mode.

[0048] For example, when the contactless switch 100 is in the first operating mode, the electronic device 1000 can be in the ringing mode; when the contactless switch 100 is in the second operating mode, the electronic device 1000 can be in the do-not-disturb mode; and when the contactless switch 100 is in the third operating mode, the electronic device 1000 can be in the silent mode. As another example, when the contactless switch 100 is in the first operating mode, the electronic device 1000 can be in the volume up mode; when the contactless switch 100 is in the second operating mode, the electronic device 1000 can be in the volume hold mode; and when the contactless switch 100 is in the third operating mode, the electronic device 1000 can be in the volume down mode.

[0049] Please refer to Figures 7 to 9 , Figure 7 yes Figure 6 The diagram shown illustrates the changes in magnetic field strength of the first Hall sensor in various directions when the slider, which is equivalent to the fixed component, slides along a preset direction. Figure 8 yes Figure 6 The diagram shown illustrates the changes in magnetic field strength of the second Hall sensor in various directions when the slider corresponds to the fixed component sliding along a preset direction. Figure 9 This diagram illustrates the relationship between the magnetic field changes of the first and second Hall sensors and the sliding distance of the slider, which is equivalent to the sliding distance of the fixed component. As can be understood, as shown in the diagram, the single-axis Hall sensor is only sensitive to the magnetic field strength in the Z-axis direction; therefore, the Hall sensor only needs to detect the magnetic field strength in the Z-axis direction.

[0050] Please continue to refer to Figures 7 to 9 When the slider 20 is in the first position Z1 of the fixed member 10, the magnetic field strength measured by the first Hall sensor 111a is the maximum; Figure 8 As shown, when the slider 20 is in the third position Z3 of the fixed member 10, the magnetic field strength measured by the second Hall sensor 111b is the maximum. When the slider 20 is in the second position Z2 of the fixed member 10, the magnetic head 23 is located between the first Hall sensor 111a and the second Hall sensor 111b, as shown. Figure 9 As shown.

[0051] Please continue to refer to Figures 7 to 9 When the slider 20 is located in the first position Z1, the second position Z2, and the third position Z3 of the fixed member 10, the magnetic field strength difference between the Hall sensors 111 at adjacent positions is only 5mT. Considering the swaying factors at different positions, this scheme can only withstand external magnetic field interference of about 3mT. External magnetic field interference exceeding 3mT will cause the non-contact switch 100 to malfunction, affecting the normal function of the electronic device 1000.

[0052] Please refer to Figure 10 and Figure 11In another embodiment, the sensor module 11 includes a plurality of magnetoresistive sensors 112 arranged along a preset direction, and the plurality of magnetoresistive sensors 112 are connected in series. The slider 20 moves relative to the fixed member 10 along the preset direction, so that the magnetic head 23 passes through at least one magnetoresistive sensor 112 in sequence. The magnetic head 23 magnetizes the magnetoresistive sensor 112 it passes through and changes its resistance value, thereby changing the total resistance value of the sensor module 11. The processor 30 determines the position of the slider 20 relative to the fixed member 10 based on the total resistance value of the sensor module 11 and puts the non-contact switch 100 into the corresponding working mode. Here, the magnetoresistive sensors 112 passed by the magnetic head 23 only include the magnetoresistive sensors 112 that are passed during the movement, excluding the currently corresponding magnetoresistive sensor 112.

[0053] Please refer to Figure 12 , Figure 12 yes Figure 11 The diagram shows a specific embodiment of the contactless switch. When the slider 20 is at the first position Z1 of the fixed member 10, the total resistance of the sensor module 11 is a first total resistance value; when the slider 20 is at the second position Z2 of the fixed member 10, the total resistance of the sensor module 11 is a second total resistance value; and when the slider 20 is at the third position Z3 of the fixed member 10, the total resistance of the sensor module 11 is a third total resistance value. The first total resistance value < the second total resistance value < the third total resistance value. It can be understood that the distance of the slider 20 relative to the fixed member 10 is mapped one-to-one with the total resistance value of the sensor module 11. In other words, the distance of the slider 20 relative to the fixed member 10 is linearly related to the total resistance value of the sensor module 11. The processor 30 determines the moving distance of the slider 20 relative to the fixed member 10 based on the total resistance value of the sensor module 11, that is, it determines the position of the slider 20 relative to the fixed member 10, so that the contactless switch 100 is in the corresponding working mode.

[0054] Specifically, when the total resistance of the sensor module 11 is a first resistance value, that is, when the slider 20 is located at the first position Z1 of the fixed member 10, the non-contact switch 100 can be in the first operating mode. When the total resistance of the sensor module 11 is a second resistance value, that is, when the slider 20 is located at the second position Z2 of the fixed member 10, the non-contact switch can be in the second operating mode. When the total resistance of the sensor module 11 is a third resistance value, that is, when the slider 20 is located at the third position Z3 of the fixed member 10, the non-contact switch 100 is in the third operating mode.

[0055] For example, when the contactless switch 100 is in the first operating mode, the electronic device 1000 can be in the ringing mode; when the contactless switch 100 is in the second operating mode, the electronic device 1000 can be in the do-not-disturb mode; and when the contactless switch 100 is in the third operating mode, the electronic device 1000 can be in the silent mode. As another example, when the contactless switch 100 is in the first operating mode, the electronic device 1000 can be in the volume up mode; when the contactless switch 100 is in the second operating mode, the electronic device 1000 can be in the volume hold mode; and when the contactless switch 100 is in the third operating mode, the electronic device 1000 can be in the volume down mode.

[0056] Please refer to Figure 13 , Figure 13 yes Figure 11 The diagram shows a cross-sectional view of the magnetoresistive sensor in the sensor module of the displacement measurement structure. Specifically, the magnetoresistive sensor 112 is a tunneling magnetoresistive effect (TMR) memory magnetoresistive sensor 112. The magnetoresistive sensor 112 is a thin-film element fabricated using advanced film-forming technology. The magnetoresistive sensor 112 may include a barrier layer 1121 and a first magnetic layer 1122 (i.e., a fixed layer) and a second magnetic layer 1123 (i.e., a free layer) located on opposite surfaces of the barrier layer 1121. The magnetic field direction of the first magnetic layer 1122 is fixed, while the second magnetic layer 1123 can be affected by an external magnetic field (specifically, the magnetic head in this example). The magnetic field direction of the second magnetic layer 1123 changes according to the direction of the external magnetic field. Specifically, in this embodiment, the magnetic field direction of the second magnetic layer 1123 is determined by the direction of movement of the magnetic head 23 relative to the sensor module 11. Understandably, the first magnetic layer 1122 is located away from the magnetic head 23 to reduce the influence of the magnetic head 23 on the first magnetic layer 1122; the second magnetic layer 1123 is arranged adjacent to the magnetic head 23 so that the magnetic head 23 can magnetize the second magnetic layer 1123 more conveniently and quickly.

[0057] Specifically, when the magnetic field direction of the second magnetic layer 1123 is consistent with the magnetic field direction of the first magnetic layer 1122, the resistance of the magnetoresistive sensor 112 is at its minimum, and the current flowing through the barrier layer 1121 is at its maximum. At this time, the magnetoresistive sensor 112 has a first resistance value. When the magnetic field direction of the second magnetic layer 1123 is opposite to (i.e., antiparallel to) the magnetic field direction of the first magnetic layer 1122, the resistance of the magnetoresistive sensor 112 becomes extremely large, and almost no current flows through the barrier layer 1121. At this time, the magnetoresistive sensor 112 has a second resistance value. The magnetic field direction of the second magnetic layer 1123 can be consistent with or opposite to the movement direction of the magnetic head 23. Specifically, the magnetic field direction of the second magnetic layer 1123 can be consistent with the movement direction of the magnetic head 162, in which case the magnetoresistive sensor 112 has a first resistance value; or the second magnetic layer can be opposite to the movement direction of the magnetic head 162, in which case the magnetoresistive sensor 112 has a second resistance value. The first resistance value is less than the second resistance value.

[0058] Specifically, please refer to Figure 14 , Figure 14 This is an axial schematic diagram showing the change in resistance of the magnetoresistive sensor 112 with respect to an external magnetic field. (See diagram for example.) Figure 14 As shown, when the magnetic field direction of the second magnetic layer 1123 is aligned with the magnetic field direction of the first magnetic layer 1122 under the magnetization effect of the external magnetic field, and the magnetic field strength of the external magnetic field is greater than the preset magnetic field strength (i.e., in... Figure 14 When the -OP value is to the left, the magnetoresistive sensor 112 has a first resistance value R. L (That is, the minimum resistance value), and even if the magnetic field strength of the external magnetic field continues to increase, the resistance value of the magnetoresistive sensor 112 remains stable at the first resistance value R. L When the magnetic field direction of the second magnetic layer 1123 is opposite to that of the first magnetic layer 1122 under the magnetization effect of an external magnetic field, and the magnetic field strength of the external magnetic field is greater than the preset magnetic field strength (i.e., in... Figure 14 When the +OP value is to the right, the magnetoresistive sensor 112 has a second resistance value R. h (That is, the maximum resistance value), and even if the magnetic field strength of the external magnetic field continues to increase, the resistance value of the magnetoresistive sensor 112 remains stable at the second resistance value R. h In other words, when the magnetic field strength of the magnetic head 23 is greater than the preset magnetic field strength, the moving direction of the magnetic head 23 relative to the sensor module 11 changes, and the resistance value of the magnetoresistive sensor 112 passed by the magnetic head 23 can be measured at the first resistance value R. L Switching between a first resistance value and a second resistance value. In one embodiment, when the magnetic head moves in a preset direction and the magnetic field strength of the magnetic head is greater than a preset magnetic field strength, the magnetoresistive sensor has a first resistance value R. L When the magnetic head moves in the opposite direction of the preset direction and the magnetic field strength of the magnetic head is greater than the preset magnetic field strength, the magnetoresistive sensor has a second resistance value R. h .

[0059] When the external magnetic field strength is less than the preset magnetic field strength, that is, between -OP and +OP, the resistance value of the magnetoresistive sensor 112 changes approximately linearly. Understandably, the magnetic field strength of the magnetic head 23 is usually greater than the preset magnetic field strength, so the situation where the external magnetic field strength is between -OP and +OP can be ignored.

[0060] Understandably, when the magnetic field strength of the magnetic head 23 is greater than the preset magnetic field strength, that is, outside the range of -OP to +OP, the resistance value of the magnetoresistive sensor 112 can remain in a memory resistance state. In other words, even without power, the resistance value of the magnetoresistive sensor 112 does not change, and its resistance value has a physical memory function. Specifically, when the magnetic field direction of the second magnetic layer 1123 is aligned with the magnetic field direction of the first magnetic layer 1122 under the magnetization effect of an external magnetic field, and the magnetic field strength of the external magnetic field is greater than the preset magnetic field strength (that is, within the range of -OP to +OP), the resistance value of the magnetoresistive sensor 112 remains in a memory resistance state. Figure 14 When the -OP value is to the left, the magnetoresistive sensor 112 has a first resistance value R. L (That is, the minimum resistance value), when the magnetic field direction of the second magnetic layer 1123 is opposite to the magnetic field direction of the first magnetic layer 1122 under the magnetization effect of the external magnetic field, and the magnetic field strength of the external magnetic field is greater than the preset magnetic field strength (that is, in Figure 14 When the +OP value is to the right, the magnetoresistive sensor 112 has a second resistance value R. h (That is, the maximum resistance value). The magnetic field strength of the external magnetic field is usually much smaller than the magnetic field strength applied by the magnetic head 23. Specifically, the magnetic field strength applied by the magnetic head 23 is usually 10 or 100 times that of the external interference magnetic field. As long as the strength of the external interference magnetic field is less than the preset magnetic field strength, the external interference magnetic field has no impact on the accuracy of the displacement measurement structure. In other words, compared to the prior art, the displacement measurement structure provided in this application embodiment has a magnetic interference resistance capability that is more than 10 times improved.

[0061] Please continue to refer to Figure 12 In one specific embodiment, the first position Z1 and the third position Z3 are located at the two ends of the module sensor, and the second position Z2 is located in the middle of the first position Z1 and the third position Z3. If the distance between the first position Z1 and the second position Z2 is approximately 1.4mm, and the distance between the second position Z2 and the third position Z3 is 1.4mm, then the length of the sensor module 11 is greater than 2.8mm.

[0062] Taking a sensor module 11 with a length of 3.0 mm (actual effective monitoring length of 2.9 mm) as an example, the sensor module 11 may include 30 magnetoresistive sensors 112, with the center distance between two adjacent magnetoresistive sensors 112 being 0.1 mm. Specifically, the first magnetoresistive sensor arranged from left to right corresponds to the 0 mm position, the second magnetoresistive sensor corresponds to the 0.1 mm position, and so on, with the 30th magnetoresistive sensor corresponding to the 2.9 mm position. That is, the multiple magnetoresistive sensors 112 are equally spaced along a preset direction, so that the effective monitoring distance of the sensor module 11 is 0.1 mm * (30 - 1) = 2.9 mm, and its displacement resolution is 0.1 mm.

[0063] The first position Z1 is located at 0.1mm from the sensor module 11 (e.g., Figure 12 The second magnetoresistive sensor (as shown in the image) is located at position Z2, which is 1.5mm from sensor module 11. Figure 12 As shown, the 16th magnetoresistive sensor position from left to right is located at position Z3, which is 2.9mm from the sensor module 11 (e.g., ...). Figure 12 The location is shown as the 30th magnetoresistive sensor from left to right, or the 1st magnetoresistive sensor from the right.

[0064] Specifically, when the magnetic head 23 moves from the first end to the second end of the sensor module 11, that is, from the first position Z1 to the third position Z3, the resistance value of the magnetoresistive sensor 112 it passes through changes from the first resistance value R. L Switch to the second resistance value R h And retain the memory; when the magnetic head 23 moves from the second end to the first end of the sensor module 11, that is, from the third position Z3 to the first position Z1, the resistance value of the magnetoresistive sensor 112 it passes through changes from the second resistance value R. h Switch to the first resistance value R L And it retains this memory. That is, the relative displacement between the magnetic head 23 and the sensor module 11 is linearly related to the change in resistance of the sensor module 11. Specifically, the greater the change in resistance of the sensor module 11, the more magnetoresistive sensors 112 the magnetic head 23 passes through, and the greater the relative displacement between the magnetic head 23 and the sensor module 11. For example, when the magnetic head 23 moves from the first position Z1 to the second position Z2, that is... Figure 12 As shown, after passing through the 2nd to the 16th magnetoresistive sensor 112 from the left, the resistance values ​​of the 14 magnetoresistive sensors 112 on the left (1.4 / 0.1 = 14) are determined by the first resistance value R. L Switch to the second resistance value R h Meanwhile, the resistance value of the magnetoresistive sensor 112 at other locations remains the first resistance value R. L Then the overall resistance of sensor module 11 is R = 15R. h +15RL For example, when the magnetic head 23 moves from the second position Z2 to the first position Z1, that is... Figure 12 As shown, from the 15th magnetoresistive sensor 112 on the left to the 2nd magnetoresistive sensor on the left, the resistance values ​​of the 14 magnetoresistive sensors on the left (1.4 / 0.1 = 14) are determined by the second resistance value R. h Switch to the first resistance value R L Meanwhile, the resistance values ​​of the magnetoresistive sensors 112 (15 in total) at other locations remain the first resistance value R. L Only the magnetoresistive sensor 112 to the left of the first position Z1 (i.e., the first one from left to right) still retains the R value from the previous memory. h Then the overall resistance of sensor module 11 is R = 1 / R h +29R L .

[0065] Understandably, regardless of whether the magnetic head 23 moves left or right, the magnetoresistive sensor 112 at the current position of the magnetic head 23 does not change. Specifically, the magnetic field direction of the magnetic head 23 is perpendicular to the second magnetic layer 1123 of the magnetoresistive sensor 112, so that the magnetic field direction of the second magnetic layer 1123 of the sensor module 11 magnetized by the magnetic head 23 is perpendicular to the magnetic field direction of the first magnetic layer 1122. In other words, the magnetic field direction of the second magnetic layer 1123 is neither the same as nor opposite to the magnetic field direction of the first magnetic layer 1122, and the resistance value of the magnetoresistive sensor 112 does not change. However, when the magnetic head 23 moves left or right, the magnetic field direction on one side of the direction of movement of the magnetic head 23 is either consistent with or opposite to the second magnetic layer 1123 of the magnetoresistive sensor 112, so that the resistance of the magnetoresistive sensor 112 passing through the magnetic head 23 can change.

[0066] In other words, when the slider 20 is located at the first position Z1 of the fixed member 10 (that is, at the 0.1mm position of the sensor module 11), the overall resistance of the sensor module 11 is R = 1R. h +29R L When the sliding member 20 is located at the second position Z2 of the fixed member 10 (that is, 1.5mm position of the sensor module 11), the overall resistance of the sensor module 11 is R = 15R. h +15R L When the sliding member 20 is located at the third position Z3 of the fixed member 10 (i.e., 2.9mm of the sensor module 11), the overall resistance of the sensor module 11 is R = 29R. h +1R L .

[0067] Specifically, when the magnetic head 23 is in the first position Z1, at a position of 0.1mm, the overall resistance of the sensor module 11 is R = 1*600 + 29*300 = 9.3KΩ; when the magnetic head 23 is in the second position Z2, at a position of 1.5mm, the overall resistance of the sensor module 11 is R = 15*300 + 15*600 = 13.5KΩ; when the magnetic head 23 is in the third position Z3, at a position of 2.9mm, the overall resistance of the sensor module 11 is R = 29*600 + 1*300 = 17.7KΩ.

[0068] Understandably, considering the 0.2mm positional tolerance between adjacent positions, a resistance of 9.9KΩ to 9KΩ is identified as the first position Z1; a resistance of 14.1KΩ to 12.9KΩ is identified as the second position Z2; and a resistance of 18KΩ to 17.1KΩ is identified as the third position Z3. Since the resistance values ​​of the sensor module 11 vary considerably depending on the position of the slider 20, they are easily distinguishable.

[0069] Furthermore, the magnetic field strength applied by the magnetic head 23 is typically 10 or 100 times that of the external interference magnetic field. As long as the strength of the external interference magnetic field is less than the preset magnetic field strength, the external interference magnetic field will not affect the accuracy of the displacement measurement structure. That is, the displacement measurement structure provided in this application embodiment has excellent anti-magnetic interference capability.

[0070] Understandably, when the magnetoresistive sensors 112 are set at equal intervals, the resistance change of the magnetoresistive sensors 112 is linearly related to the relative displacement between the magnetic head 23 and the sensor module 11, for example, the first position Z1, the second position Z2 and the third position Z3 are set at equal intervals.

[0071] Of course, in some other embodiments, the spacing between adjacent magnetoresistive sensors 112 can be equal, unequal, or partially equal, and no specific limitation is imposed again. Correspondingly, the first position Z1, the second position Z2, and the third position Z3 can be set at equal intervals, or can be set according to requirements, and no specific limitation is imposed again.

[0072] Please refer to Figure 15 , Figure 15 yes Figure 11The circuit diagram of the processor in the contactless switch is shown. The processor 30 is used to measure the total resistance of the sensor module 11. Specifically, the processor 30 may include a fixed resistor 31 and an external power supply 32, wherein the fixed resistor 31 is connected in series with the sensor module 11, the positive terminal of the external power supply 32 is electrically connected to the external sensor, and the negative terminal is electrically connected to the fixed resistor 31. By measuring the voltage drop across the fixed resistor 31, the total resistance of the sensor can be determined, thereby determining the relative displacement of the magnetic head 23 relative to the sensor module 11.

[0073] The sensor module 11 may also include an operational amplifier 33 and an analog-to-digital converter 34. Because the resistance of the sensor module 11 is relatively large, the voltage drop across the fixed resistor 31 is relatively small. The operational amplifier 33 is used to fix the voltage across the resistor 31, making the resistance measurement of the sensor module 11 more accurate. The analog-to-digital converter 34 is used to convert the analog signal measured by the operational amplifier 33 into a digital signal.

[0074] The magnetic head 23 is either a permanent magnet or an electromagnet. In this embodiment, the magnetic head 23 is made of a permanent magnet to reduce electrical connections with other structures and simplify the structure of the electronic device 1000.

[0075] In this embodiment, the processor 30 can be a circuit board or a flexible circuit board. The processor 30 can be integrally formed with the sensor module and fixed on the middle frame 400 (such as the middle frame or the edge). Alternatively, the processor 30 can be part of the motherboard. No specific restrictions are made here.

[0076] The contactless switch 100 provided in this application embodiment has a sliding member 20 spaced apart from a fixed member 10 and moving relative to the fixed member 10 in a preset direction. A sensor module 11 is mounted on the fixed member 10, and a magnetic head 23 is mounted on the sliding member 20, enabling the sensor module 11 to determine the position of the sliding member 20 relative to the fixed member 10. The processor 30 adjusts the contactless switch 100 to a corresponding operating mode based on the position of the sliding member 20 relative to the fixed member 10. In this contactless switch 100, the sliding member 20 does not need to directly contact the fixed member 10, which helps improve the sealing performance of the electronic device 1000.

[0077] Please refer to Figure 16 , Figure 16This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Of course, this application can also provide an electronic device 800, which includes an RF circuit 810, a memory 820, an input unit 830, a display unit 8, a sensor 850, an audio circuit 860, a WiFi module 870, a processor 880, and a power supply 890, etc. The RF circuit 810, memory 820, input unit 830, display unit 8, sensor 850, audio circuit 860, and WiFi module 870 are respectively connected to the processor 880; the power supply 890 provides power to the entire electronic device 800.

[0078] Specifically, the RF circuit 810 is used to receive and transmit signals; the memory 820 is used to store data instruction information; the input unit 830 is used to input information, and may include a touch panel 831 and other input devices 832 such as operation buttons; the display unit 8 may include a display panel 841, etc.; the sensor 850 includes infrared sensors, laser sensors, etc., used to detect user proximity signals, distance signals, etc.; the speaker 861 and the microphone (or microphone) 862 are connected to the processor 880 through the audio circuit 860 for receiving and transmitting sound signals; the WiFi module 870 is used to receive and transmit WiFi signals; and the processor 880 is used to process the data information of the electronic device.

[0079] The above description is only a part of the embodiments of this application and does not limit the scope of protection of this application. Any equivalent device or equivalent process transformation made based on the content of this application specification and drawings, or directly or indirectly applied to other related technical fields, are similarly included in the patent protection scope of this application.

Claims

1. A non-contact switch, characterized in that, include: Fixtures, including sensor modules; A sliding member is spaced apart from the fixed member and can move relative to the fixed member in a preset direction; the sliding member includes a magnetic head, which at least partially overlaps with the sensor module so that the sensor module can determine the position of the sliding member relative to the fixed member; as well as The processor is electrically connected to the sensor module, and the processor controls the non-contact switch to a corresponding working mode according to the position of the slider relative to the fixed member. The sensor module includes multiple magnetoresistive sensors arranged at equal intervals along a preset direction, and the multiple magnetoresistive sensors are connected in series in sequence; the slider moves relative to the fixed member along the preset direction, so that the magnetic head passes through at least one of the magnetoresistive sensors in sequence, the magnetic head magnetizes the magnetoresistive sensors and changes their resistance values, thereby changing the total resistance value of the sensor module; the processor determines the position of the slider relative to the fixed member based on the total resistance value of the sensor module, and puts the non-contact switch into the corresponding working mode. The magnetoresistive sensor includes a barrier layer and a first magnetic layer and a second magnetic layer located on opposite sides of the barrier layer; the magnetic head is used to magnetize the second magnetic layer, and the magnetic field strength of the magnetic head is greater than a preset magnetic field strength, so that the resistance value of the magnetoresistive sensor can be maintained in a memory state. The distance between the sliding member and the fixed member is linearly related to the total resistance of the sensor module; The processor is used to measure the total resistance of the sensor module and determine the position of the slider relative to the fixed member based on the total resistance of the sensor module, so that the non-contact switch is in the corresponding working mode.

2. The non-contact switch according to claim 1, characterized in that, When the slider is located in the first position of the fixed member, the non-contact switch is in the first working mode; when the slider is located in the second position of the fixed member, the non-contact switch is in the second working mode; when the slider is located in the third position of the fixed member, the non-contact switch is in the third working mode; the first position, the second position and the third position are equally spaced along the preset direction.

3. The non-contact switch according to claim 1, characterized in that, When the magnetic field direction of the second magnetic layer is consistent with the magnetic field direction of the first magnetic layer, the magnetoresistive sensor has a first resistance value; when the magnetic field direction of the second magnetic layer is opposite to the magnetic field direction of the first magnetic layer, the magnetoresistive sensor has a second resistance value; wherein the magnetic field direction of the second magnetic layer is consistent with or opposite to the movement direction of the magnetic head, the first resistance value is less than the second resistance value.

4. The non-contact switch according to claim 3, characterized in that, The magnetic head is either a permanent magnet or an electromagnet.

5. The non-contact switch according to claim 1, characterized in that, The sensor module includes at least one Hall sensor arranged along the preset direction. The Hall sensor is used to detect the magnetic field strength of the magnetic head and thus determine the position of the slider relative to the fixed member.

6. An electronic device, characterized in that, include: The non-contact switch according to any one of claims 1-5; as well as The middle frame includes a middle plate and a frame extending from the edge of the middle plate, the frame and the middle plate forming an accommodating cavity; The fixing member and the processor are housed in the accommodating cavity, and the sliding member is disposed on the frame.

7. The electronic device according to claim 6, characterized in that, The surface of the frame facing away from the receiving cavity is recessed to form a sliding groove, and the slider is received and slid in the sliding groove, so that the slider slides relative to the fixing member along the preset direction.

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