A kind of anti-shake motor based on elastic piece type photosensitive chip

Abstract

The application provides a kind of based on the anti-shake motor of shell fragment type photosensitive chip, including shell, focusing upper spring group, carrier, module photosensitive chip, focusing coil, anti-shake spring group, magnet support, magnet group, focusing lower spring group, photosensitive chip connection circuit, anti-shake coil group, base and PCB board, the shell is used to fix bearing lens, the photosensitive chip is fixedly arranged in the carrier, photosensitive chip connection circuit is arranged in the carrier or the surface of carrier outer and is used to guide the partial connection port of the lower surface of the module photosensitive chip to the upper surface of the carrier;The one end of focusing lower spring group is connected with the partial connection port of the lower surface of the module photosensitive chip.This application has the beneficial effects of simple and fast process, compact and ingenious structure design and low overall cost.

Description

Technical Field

[0001] This invention relates to the field of image stabilization motor technology, and more specifically, to an image stabilization motor based on a spring-loaded photosensitive chip. Background Technology

[0002] Traditional optical image stabilization solutions achieve this by using a VCM motor to drive the lens for angle correction. However, this approach has long suffered from drawbacks such as high power consumption, limited stabilization effect, large product size, and high unit price. As mobile phone photography scenarios become increasingly diverse, the demand for image stabilization is also growing. Improving the shooting performance of mobile phones in action photography is inevitable, and translation sensor image stabilization technology can precisely solve this problem.

[0003] Currently, more and more mobile phone cameras are adopting shift sensor image stabilization technology to replace the optical image stabilization technology of the past. In shift sensor image stabilization technology, the moving image sensor chip is used to move the image sensor and other information acquisition components, so that the optical components and information acquisition components move relative to each other, which cancels out the image shake caused by vibration. Since it does not require moving a heavy lens, it has a great advantage in terms of high-frequency image stabilization effect and power consumption. This technology improves the camera's ability to capture dynamic scenes.

[0004] However, the image stabilization motor that uses translation sensor image stabilization technology still has the following problems:

[0005] 1. The translation sensor image stabilization technology can only achieve image stabilization in the X / Y direction. The Z direction requires a separate drive motor for focusing, which results in the overall image stabilization motor being very tall in the vertical direction, taking up a lot of space in the phone.

[0006] 2. The structure is complex. In particular, when the separate drive motor and the separate anti-vibration motor are integrated into one motor, there are many parts and the connection and assembly between the parts are also complicated. It is impossible to form an integrated structure process, and there are many performance debugging procedures, resulting in high overall production costs.

[0007] In view of this, the inventors of this application have invented a spring-loaded photosensitive chip-based image stabilization motor with a simple and quick manufacturing process, a compact and ingenious structural design, and low overall cost. Summary of the Invention

[0008] The purpose of this invention is to provide a spring-type photosensitive chip anti-shake motor with a novel planar spring structure that is simple and quick to manufacture, has a stable structure, and low overall cost.

[0009] To achieve the above objectives, the present invention adopts the following technical solution:

[0010] A spring-loaded image stabilization motor based on a photosensitive sensor includes a housing, an upper focusing spring assembly, a carrier, a photosensitive sensor, a focusing coil, an image stabilization spring assembly, a magnet bracket, a magnet assembly, a lower focusing spring assembly, a chip connection circuit, an image stabilization coil assembly, a base, and a PCB board. The housing is used to fix and support the lens. The photosensitive sensor is fixedly disposed in the carrier. A chip connection circuit is provided inside or on the outer surface of the carrier to guide a portion of the connection port on the lower surface of the photosensitive sensor to the upper surface of the carrier. One end of the upper focusing spring assembly is connected to the connection port of the photosensitive sensor guided to the upper surface of the carrier, and the other end is connected to the image stabilization spring assembly, and the circuit is connected to the PCB board through the image stabilization spring assembly. One end of the lower focusing spring assembly is connected to a portion of the connection port on the lower surface of the photosensitive sensor, and the other end is connected to the image stabilization spring assembly, and the circuit is connected to the PCB board through the image stabilization spring assembly.

[0011] As a further improvement, the chip connection circuit is a flexible circuit board arranged on the outer surface of the carrier.

[0012] As a further improvement, the flexible circuit board includes a first plane disposed on the lower surface of the carrier, several second planes extending vertically upward along the outer wall of the carrier to the top of the carrier, and several third planes extending horizontally inward to the upper surface of the carrier, which are connected in sequence.

[0013] As a further improvement, a focusing closed-loop control chip is provided on one of the second planes. The focusing closed-loop control chip is electrically connected to the focusing spring assembly through a flexible circuit board. The sensing magnet is provided on the magnet bracket and is positioned directly opposite the focusing closed-loop control chip.

[0014] As a further improvement, the chip connection circuit is a connection circuit that is installed inside the carrier by in-mold injection molding. The connection port of the chip connection circuit on the lower surface of the carrier is connected to a portion of the connection port on the lower surface of the photosensitive chip through a spring contact. The lower surface of the carrier is flush with the lower surface of the photosensitive chip.

[0015] As a further improvement, the image stabilization spring assembly includes four combined image stabilization springs distributed in a centrally symmetrical manner. The combined image stabilization springs include several image stabilization spring units stacked on a vertical plane. One end of each image stabilization spring unit is connected to the upper focus spring assembly or the lower focus spring assembly, and the other end is connected to the PCB board.

[0016] As a further improvement, each of the image stabilization spring units includes a first planar portion and a second planar portion spliced ​​together, with the splice point of the first planar portion and the second planar portion located at the four corners of the base; one end of several of the first planar portions is connected to a spring unit in the upper focusing spring assembly, and one end of the remaining first planar portions is connected to a spring unit in the lower focusing spring assembly.

[0017] As a further improvement, each of the anti-shake spring units includes an integrally formed first planar portion and a second planar portion, the connection between the first planar portion and the second planar portion is located at the four corners of the base and the connection is in the form of multiple broken lines.

[0018] As a further improvement, a non-conductive component is provided between each pair of adjacent anti-shake spring units to separate the two adjacent anti-shake spring units. The non-conductive component is an isolation block or an isolation strip formed by adhesive curing.

[0019] As a further improvement, the non-conductive component includes four corner blocks respectively disposed at the four corners of the base. Each anti-shake spring unit includes a first planar portion and a second planar portion connected together. The connection between the first planar portion and the second planar portion is located at the four corners of the base. The corner block is triangular prism-shaped and has several parallel limiting grooves on its side for limiting and fixing the connection between the first planar portion and the second planar portion.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] 1. This invention discloses a spring-loaded image sensor-based image stabilization motor. By fixing the lens in place and allowing the carrier to support the image sensor and move it along the X, Y, and Z axes, the image stabilization motor directly drives the image sensor to achieve image stabilization and focusing functions. This eliminates the need for a separate traditional motor for focusing, significantly reducing the product's height and size, and significantly improving low-light image quality and image stabilization performance. Simultaneously, a chip connection circuit is located inside or on the outer surface of the carrier. Combined with the connection structure of the focusing spring assembly and the image stabilization spring assembly, this cleverly guides the conductive structure connected to the lower surface of the image sensor to the upper part of the carrier for conduction. By fully utilizing the space above and below the carrier, this overcomes the technical problem of excessive motor size caused by the concentration of conductive structures at the lower part of the carrier in existing structures. The structure is ingeniously designed and easy to implement. Furthermore, the integrated structure simplifies the manufacturing process, facilitates performance debugging, eliminates the need for separate production batches and locations, and facilitates material management and control.

[0022] 2. This invention provides a spring-loaded image stabilization motor based on a photosensitive chip. It utilizes the space between a flexible circuit board and a magnet bracket to fix the focusing closed-loop control chip to a movable carrier relative to the magnet bracket, and to fix the sensing magnet to a fixed magnet bracket relative to the carrier. This avoids interference between the moving sensing magnet and the magnet group located above the base, ensuring stable carrier movement and overall image stabilization motor functionality. It significantly improves overall space utilization while retaining the functions of the focusing closed-loop control chip to further enhance the shooting accuracy of the camera module.

[0023] 3. The chip connection circuit of the photosensitive chip anti-shake motor based on the spring-loaded type of the present invention is set inside the carrier by in-mold injection molding. It can directly cooperate with the connection circuit inside the carrier to guide the conductive structure connected to part of the conductive end on the lower surface of the photosensitive chip to the upper part of the carrier for conduction. By making full use of the space above and below the carrier, it overcomes the technical problem of the motor volume being too large due to the conductive structure being concentrated at the lower part of the carrier in the existing structure. Moreover, the overall manufacturing process is more mature.

[0024] 4. This invention provides a spring-loaded image stabilization motor for a photosensitive chip. Each stabilization spring unit is connected to a single spring unit in the upper focusing spring group or a single spring unit in the lower focusing spring group. This effectively enables conduction to each conductive terminal of the photosensitive chip and achieves image stabilization on the X and Y axes in conjunction with the upper and lower focusing spring groups. Furthermore, the spring structure, formed by simply splicing the first and second planar portions, is simpler and faster to manufacture than a one-piece bent spring structure, offering excellent mass production capabilities. The spliced ​​structure has minimal differences from the design structure, resulting in stable product performance, good reliability testing, and an intact spring surface that is less prone to oxidation and rust. This also leads to high overall material utilization, similar to conventional focusing planar springs, thus saving material. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 This is an exploded structural diagram of a photosensitive chip anti-shake motor based on a spring-loaded contactor according to the present invention.

[0027] Figure 2 This is a schematic diagram of the structure of a spring-loaded photosensitive chip anti-shake motor according to the present invention;

[0028] Figure 3 This is a schematic diagram of the structure of a photosensitive chip anti-shake motor based on a spring-loaded housing, after the housing is hidden.

[0029] Figure 4 This is a schematic diagram of the bottom chip connection circuit connection structure of a photosensitive chip anti-shake motor based on a spring-loaded type, which is hidden behind the outer shell, base plate and PCB board of the invention.

[0030] Figure 5 This is a schematic diagram of the flexible circuit board and magnet support in Example 1;

[0031] Figure 6 This is a schematic diagram illustrating the structure of a focus closed-loop control chip in a spring-loaded photosensitive chip image stabilization motor according to the present invention.

[0032] Figure 7 This is a schematic diagram of the anti-shake spring assembly in a spring-type photosensitive chip anti-shake motor according to the present invention;

[0033] Figure 8 This is a schematic diagram of another structure of the anti-shake spring assembly in a spring-type photosensitive chip anti-shake motor according to the present invention;

[0034] Figure 9 This is a schematic diagram of the structure of the anti-shake spring assembly in the photosensitive chip anti-shake motor based on the spring-loaded type of the present invention when the assembly is a spliced ​​structure;

[0035] Figure 10 This is a schematic diagram showing the structure of the upper surface of the chip connection circuit during in-mold injection molding in Embodiment 2;

[0036] Figure 11 This is a schematic diagram showing the structure of the lower surface of the chip connection circuit in Example 2 during in-mold injection molding.

[0037] 10. Housing; 20. Upper focusing spring assembly; 30. Carrier; 40. Image sensor; 50. Focusing coil; 60. Image stabilization spring assembly; 61. Combined image stabilization spring; 62. Image stabilization spring unit; 621. First flat part; 622. Second flat part; 70. Magnet bracket; 80. Magnet assembly; 90. Lower focusing spring assembly; 100. Chip connection circuit; 110. Image stabilization coil assembly; 120. Base; 130. PCB board; 140. Focusing closed-loop control chip; 150. Sensing magnet; 160. Corner block; 170. Connector. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Example 1

[0039] Please refer to Figures 1 to 4A spring-loaded image stabilization motor based on a photosensitive chip includes a housing 10, an upper focusing spring assembly 20, a carrier 30, a photosensitive chip 40, a focusing coil 50, an image stabilization spring assembly 60, a magnet bracket 70, a magnet assembly 80, a lower focusing spring assembly 90, a chip connection circuit 100, an image stabilization coil assembly 110, a base 120, and a PCB board 130. The housing 10 is used to fix and support the lens, ensuring that the lens is fixed in the housing 10 and does not move. The photosensitive chip 40 is fixedly disposed in the carrier 30. The conventional carrier 30 is used to support the lens, but in the sensor-shift image stabilization technology, the moving photosensitive chip 40 is used to move the image sensor and other information acquisition components, so that the relative movement between the optical components and the information acquisition components cancels out the image shake caused by vibration. Since it does not require moving a heavy lens, it has significant advantages in terms of high-frequency image stabilization effect and power consumption. Since the image sensor 40 is much larger than the lens and has a large number of connection ports on its lower surface (32 conductive terminals in this embodiment), in the prior art, a large number of conductive lines need to be arranged on the lower surface of the image sensor 40 to achieve communication with the outside. It is precisely for this reason that the image stabilization motor that currently uses translation sensor image stabilization technology is very large.

[0040] Based on the above problems, a chip connection circuit 100 is provided inside or on the outer surface of the carrier 30 to guide a portion of the connection port on the lower surface of the photosensitive chip 40 to the upper surface of the carrier 30. One end of the focusing upper spring assembly 20 is connected to the connection port of the photosensitive chip 40 guided to the upper surface of the carrier 30, and the other end is connected to the image stabilization spring assembly 60, and the circuit is connected to the PCB board 130 through the image stabilization spring assembly 60. The focusing coil 50 is connected to the image stabilization spring assembly 60 through the focusing lower spring assembly, and finally connected to the PCB board 130 to achieve conductivity. The image stabilization coil assembly 110 is directly connected through the PCB board 130. One end of the focusing lower spring assembly 90 is connected to a portion of the connection port on the lower surface of the photosensitive chip 40, and the other end is connected to the image stabilization spring assembly 60, and the circuit is connected to the PCB board 130 through the image stabilization spring assembly 60.

[0041] The overall design achieves image stabilization and focusing by fixing the lens in place and allowing the image sensor 40 to move along the X, Y, and Z axes via the carrier 30. This eliminates the need for a separate traditional motor for focusing, significantly reducing the product's height and size while substantially improving low-light image quality and stabilization performance. Simultaneously, a chip connection circuit 100 is located inside or on the outer surface of the carrier 30. This, combined with the connection structure between the focusing spring assembly 20 and the image stabilization spring assembly 60, cleverly guides the conductive structure connected to a portion of the conductive terminals on the lower surface of the image sensor 40 to the upper part of the carrier 30. By fully utilizing the space above and below the carrier 30, the existing structure overcomes the technical problem of excessive motor size caused by the concentration of conductive structures below the carrier 30. The structure is ingeniously designed and easy to implement. Furthermore, the traditional translation sensor image stabilization motor only stabilizes the image sensor chip 40 in the horizontal direction, while the focusing action is still completed by the transmission motor. Therefore, after the motor manufacturer provides the image stabilization motor to the module, the module needs to select and assemble the focusing motor itself. However, the integrated structure of this solution has a simpler manufacturing process, more convenient performance debugging, and no need for separate production batches or production locations. The materials are also easier to manage and control.

[0042] Please refer to Figure 5 The chip connection circuit 100 is a flexible circuit board disposed on the outer surface of the carrier 30, and the flexible circuit board is fixed to the outer surface of the carrier 30 by adhesive dispensing. By using a flexible circuit board, the conductive structure of the photosensitive chip 40 can be flexibly guided, and various types of photosensitive chips 40 can be adapted to make corresponding structural adjustments, thus having a wide range of applications.

[0043] The flexible circuit board includes a first plane disposed on the lower surface of the carrier 30, several second planes extending vertically upward along the outer wall of the carrier 30 to the top of the carrier 30, and several third planes extending horizontally inward to the upper surface of the carrier 30. Specifically, there is one square first plane to guide some of the connection ports on the four sides of the lower surface of the photosensitive chip 40 to the first plane. There are four elongated second planes to provide vertical connection. Finally, the conductive ends are guided to the upper surface of the carrier 30 and connected to the multiple focusing springs in the focusing spring assembly 20 through the four third planes connected to the second planes. This integrated design of the flexible circuit board facilitates early manufacturing and quick fixed connection with the carrier 30. Furthermore, its flexibility meets the requirement of a small size for mobile phone camera modules, further extending and improving the overall lifespan of the camera module beyond its functional requirements.

[0044] Please refer to Figure 6Furthermore, a focus closed-loop control chip 140 is disposed on one of the second planes. The focus closed-loop control chip 140 is electrically connected to the focus upper spring assembly 20 via a flexible circuit board. The sensing magnet 150 is disposed on the magnet bracket 70 and is positioned directly opposite the focus closed-loop control chip 140. The VCM of the mobile phone camera requires the focus closed-loop control chip 140, i.e., the driver IC, to complete focusing and image stabilization. The VCM controls the magnitude of the VCM power supply current through the focus closed-loop control chip 140 to determine the distance the lens mounted on the VCM moves, thereby adjusting it to an appropriate position to capture a clear image.

[0045] Because the image stabilization motor is a closed-loop control motor, its focusing closed-loop control chip 140 can accurately adjust the lens position through the position feedback of the sensing magnet 150, thereby achieving an uninterrupted effect and improving image quality. However, since the sensing magnet 150 itself is a permanent magnetic field, there will be a magnetic field distribution around it. At the same time, each magnet in the magnet group 80 is also a permanent field, and there will also be a magnetic field distribution around it. Therefore, when the sensing magnet 150 moves, it is more easily interfered with by the magnet group 80, ultimately affecting the effect of closed-loop control.

[0046] The conventional approach in the industry is to fix the focus closed-loop control chip 140 to the magnet bracket 70 and the sensing magnet 150 to the carrier 30. The focus closed-loop control chip 140 detects the position of the sensing magnet 150 when the carrier 30 moves it. That is, by sensing the magnetic flux around the sensing magnet 150, the focus closed-loop control chip 140 calculates the actual position of the lens to achieve overall closed-loop control. However, this method has a major technical problem: the sensing magnet 150 is easily interfered with by the magnet group 80 during movement, which eventually causes the carrier 30 to tilt, affecting the overall performance of the image stabilization motor. Furthermore, because the image sensor chip 40 is fixed in the carrier 30 in this embodiment and the number of conductive terminals of the image sensor chip 40 is large, the space of the overall image stabilization motor is very limited, making it impossible to meet the conventional approach of setting the focus closed-loop control chip 140 (driver IC) on the magnet bracket 70.

[0047] In view of this, this application makes full use of the space between the flexible circuit board and the magnet bracket 70 to fix the focusing closed-loop control chip 140 to the carrier 30 which is movable relative to the magnet bracket 70, and to fix the sensing magnet 150 to the magnet bracket 70 which is immovable relative to the carrier 30. This avoids interference between the moving sensing magnet 150 and the magnet group 80 set above the base 120 caused by the movement of the magnet group 80 relative to the magnet group 80, ensures the stable movement of the carrier 30, ensures the overall use of the image stabilization motor, greatly improves the overall space utilization, and at the same time retains the functions implemented by the focusing closed-loop control chip 140 to further improve the shooting accuracy of the camera module.

[0048] Furthermore, the focus closed-loop control chip 140 (driver IC) first leads the signals from the four ports of SAD / SCL / VDD / VSS to the focus upper spring assembly 20 through a flexible circuit board, and then leads the signals to the PCB board 130 through the image stabilization spring to realize signal transmission with the outside, including VDD and VSS contacts for power supply, and two SAD and SCL contacts for data transmission as a bus.

[0049] Please refer to Figure 7 The image stabilization spring assembly 60 includes four centrally symmetrically distributed combined image stabilization springs 61. Each combined image stabilization spring 61 includes several image stabilization spring units 62 stacked on a vertical plane. One end of each of the multiple image stabilization spring units 62 is connected to the upper focus spring assembly 20 or the lower focus spring assembly 90, and the other end is connected to the PCB board 130. Its symmetrically distributed image stabilization spring structure ensures a miniaturized overall size and ease of manufacturing. Simultaneously, the stacked spring structure on the vertical plane further reduces the overall space occupied, resulting in a reasonable and compact overall structural design.

[0050] Furthermore, each of the image stabilization spring units 62 includes a first flat portion 621 and a second flat portion 622 spliced ​​together, with the splice points of the first flat portion 621 and the second flat portion 622 located at the four corners of the base 120; one end of several of the first flat portions 621 is connected to a spring unit in the upper focusing spring assembly 20, and one end of the remaining first flat portions 621 is connected to a spring unit in the lower focusing spring assembly 90. The first flat portion 621 and the second flat portion 622 can be fixedly connected by welding, adhesive application, or laser welding.

[0051] Each image stabilization spring unit 62 is connected to a single spring unit in the upper focusing spring group 20 or a single spring unit in the lower focusing spring group 90. On the one hand, it can effectively achieve conduction to each conductive terminal of the image sensor 40. On the other hand, it can also work with the upper focusing spring group 20 and the lower focusing spring group 90 to achieve image stabilization on the X and Y axes. At the same time, the spring structure formed by simply splicing the first flat part 621 and the second flat part 622 is simpler and faster to manufacture than the integrated bent spring structure, and has good mass production capability. The spliced ​​structure has little difference from the design structure, the product performance is stable, the reliability test performance is good, and the spring surface is intact and not easy to oxidize and rust. It also makes the overall material utilization rate high, not much different from the current conventional focusing flat spring, saving materials.

[0052] Please refer to Figure 8The image stabilization spring unit also has another structure: each image stabilization spring unit 62 includes an integrally formed first flat portion 621 and a second flat portion 622. The connection between the first flat portion 621 and the second flat portion 622 is located at the four corners of the base 120, and the connection is in the form of multiple broken lines. The integrally formed structure of the image stabilization spring unit 62, combined with the multiple broken lines at the four corners, increases the overall connection strength.

[0053] Please refer to Figure 3 , Figure 8 and Figure 9 The system further includes four corner blocks 160 respectively disposed at the four corners of the base 120. Each of the anti-shake spring units 62 includes a first flat portion 621 and a second flat portion 622 connected to each other. The connection between the first flat portion 621 and the second flat portion 622 is located at the four corners of the base 120. The corner block 160 is triangular prism in shape and has several parallel limiting grooves on its side for limiting and fixing the connection between the first flat portion 621 and the second flat portion 622. The line connecting the outer edges of the four corner blocks 160 forms a square to achieve stable limiting and fixing of multiple anti-shake spring units 62. At the same time, the limiting grooves prevent collisions or damage between multiple anti-shake spring units 62.

[0054] Please refer to Figure 1 and Figure 2 The PCB board 130 is located below the base 120. The PCB board further includes a connector 170 for connecting and fixing the circuit of the PCB board to the circuit board of the mobile phone. The base 120 has several limiting oblique holes to avoid the image stabilization coil assembly 110. No circuit structure is set inside the base 120. The image stabilization coil assembly 110 is fixed on the PCB board 130. The base 120 only serves to support the various components above it. Example 2

[0055] Please refer to Figure 10 and Figure 11 Unlike Embodiment 1, the chip connection circuit 100 is a connection circuit installed inside the carrier 30 via in-mold injection molding. The connection port of the chip connection circuit 100 on the lower surface of the carrier 30 is connected to a portion of the connection port on the lower surface of the photosensitive chip 40 via a spring contact. The lower surface of the carrier 30 is flush with the lower surface of the photosensitive chip 40 to achieve stability when the spring contact is connected. In this way, the conductive structure connected to a portion of the conductive end on the lower surface of the photosensitive chip 40 can be guided to the upper part of the carrier 30 for conduction by directly cooperating with the connection circuit inside the carrier 30. By making full use of the space above and below the carrier 30, the technical problem of the motor being too large due to the concentration of conductive structures below the carrier 30 in the existing structure is overcome, and the overall manufacturing process is more mature.

[0056] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the invention by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the invention should be included within the scope of protection of the invention.

Claims

1. A spring-loaded image sensor image stabilization motor, comprising a housing (10), an upper focusing spring assembly (20), a carrier (30), an image sensor (40), a focusing coil (50), an image stabilization spring assembly (60), a magnet bracket (70), a magnet assembly (80), a lower focusing spring assembly (90), an image sensor connection circuit (100), an image stabilization coil assembly (110), a base (120), and a PCB board (130), characterized in that: The outer shell (10) is used to fix the lens. The photosensitive chip (40) is fixedly disposed in the carrier (30). A chip connection circuit (100) is provided inside the carrier (30) or on the outer surface of the carrier (30) to guide part of the connection port on the lower surface of the photosensitive chip (40) to the upper surface of the carrier (30). One end of the focusing upper spring assembly (20) is connected to the connection port of the photosensitive chip (40) guided to the upper surface of the carrier (30), and the other end is connected to the image stabilization spring assembly (60). The circuit is connected to the PCB board (130) through the image stabilization spring assembly (60). One end of the focusing lower spring assembly (90) is connected to part of the connection port on the lower surface of the photosensitive chip (40), and the other end is connected to the image stabilization spring assembly (60). The circuit is connected to the PCB board (130) through the image stabilization spring assembly (60). The chip connection circuit (100) is a flexible circuit board arranged on the outer surface of the carrier (30); The flexible circuit board includes a first plane disposed on the lower surface of the carrier (30), several second planes extending vertically upward along the outer wall of the carrier (30) to the top of the carrier (30), and several third planes extending horizontally inward to the upper surface of the carrier (30). The image stabilization spring assembly (60) includes four combined image stabilization springs (61) arranged in a centrally symmetrical manner. Each combined image stabilization spring (61) includes several image stabilization spring units (62) stacked on a vertical plane. One end of each image stabilization spring unit (62) is connected to the upper focus spring assembly (20) or the lower focus spring assembly (90), and the other end is connected to the PCB board (130). The PCB board (130) is located below the base (120).

2. The image stabilization motor based on a spring-loaded photosensitive chip according to claim 1, characterized in that: A focus closed-loop control chip (140) is provided on the second plane. The focus closed-loop control chip (140) is electrically connected to the focus upper spring assembly (20) through a flexible circuit board. The sensing magnet (150) is provided on the magnet bracket (70) and is positioned opposite to the focus closed-loop control chip (140).

3. The image stabilization motor based on a spring-loaded photosensitive chip according to claim 1, characterized in that: Each of the image stabilization spring units (62) includes a first flat portion (621) and a second flat portion (622) spliced ​​together, the splicing point of the first flat portion (621) and the second flat portion (622) is located at the four corners of the base (120); one end of a plurality of the first flat portions (621) is connected to a spring unit in the upper focusing spring assembly (20), and one end of the remaining first flat portions (621) is connected to a flat portion unit in the lower focusing spring assembly (90).

4. The image stabilization motor based on a spring-loaded photosensitive chip according to claim 1, characterized in that: Each of the anti-shake spring units (62) includes an integrally formed first flat portion (621) and a second flat portion (622), the connection between the first flat portion (621) and the second flat portion (622) is located at the four corners of the base (120) and the connection is in the form of multiple broken lines.

5. The image stabilization motor based on a spring-loaded photosensitive chip according to claim 1, characterized in that: A non-conductive component is provided between each pair of adjacent anti-shake spring units (62) to separate the two adjacent anti-shake spring units (62). The non-conductive component is an isolation block or an isolation strip formed by adhesive curing.

6. The image stabilization motor based on a spring-loaded photosensitive chip according to claim 5, characterized in that: The non-conductive component includes four corner blocks (160) respectively disposed at the four corners of the base (120). Each anti-shake spring unit (62) includes a first flat part (621) and a second flat part (622) connected to each other. The connection between the first flat part (621) and the second flat part (622) is located at the four corners of the base (120). The corner block (160) is triangular prism and has several parallel limiting grooves on its side for limiting and fixing the connection between the first flat part (621) and the second flat part (622).

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