A TO-254 package device welding height control tool and method

Abstract

The present invention introduces a TO‑254 package device welding height control tooling and method, including a device body, a V-shaped spring piece, a support block, a printed circuit board, a positioning groove and a screw; the support block and the device body are placed on the printed circuit board, the V-shaped spring piece is placed between the support block and the printed circuit board, the positioning groove is buckled on the device body, the screw is inserted into the positioning installation hole from the lower side of the printed circuit board, and the screw is screwed into the screw hole of the positioning groove through the V-shaped spring piece and the hole in the center of the support block in sequence upward; the fixing glue is applied between the device body, the support block and the printed circuit board, and when the glue is solidified, the screw is unscrewed and the positioning groove is removed. The present invention can accurately control the welding height of the device on the printed circuit board, ensure the product installation quality, and improve production efficiency; the adjustment function of the V-shaped spring piece can ensure that the heat dissipation surface of the device is flatly fitted with the radiator during installation, compensate for the height error of the device body shell and the flange, the device has good heat dissipation, prevents the printed circuit board from deformation, and improves the reliability of the circuit board.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit board device welding, and in particular to a welding height control tool and method for a TO-254 package device. Background Art

[0002] TO-254 packaged devices are metal shell devices welded on printed circuit boards. When the device is working normally, the heat generated by the device needs to be released through the heat dissipation surface. When the printed circuit board is installed on the radiator, the heat dissipation surface of the device on the printed circuit board needs to be smoothly fitted with the radiator to reduce thermal resistance. At present, when TO-254 packaged devices are welded on printed circuit boards, support blocks are generally placed between the device and the printed circuit board to control the welding height of the device. However, there will be errors in the manufacturing of the thickness of the body and flange of the TO-254 packaged device. The error will cause the distance between the heat dissipation surface of the device and the printed circuit board to be inconsistent with the height of the radiator support. The printed circuit board will be deformed after being installed on the radiator, the heat dissipation surface of the device will have poor contact with the radiator, and stress damage will be caused to the surface mount devices welded on the printed circuit board, making the circuit board unable to work normally. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a TO-254 package device welding height control tool and method, which is easy to use, improves device welding efficiency, and ensures installation accuracy.

[0004] The technical solution adopted by the present invention is:

[0005] A TO-254 package device welding height control tool, comprising a device body, a V-shaped spring, a support block, a printed circuit board, a positioning groove and a screw;

[0006] The flange on the heat dissipation surface of the device body is provided with mounting holes, and a hole corresponding to the mounting hole on the device body flange is provided in the middle of the V-shaped spring piece; the support block is a rectangular block, and a hole corresponding to the mounting hole on the device body flange is also provided in the middle of the support block, and a positioning mounting hole is provided on the printed circuit board. The device body is arranged on the printed circuit board, and the mounting hole on the device body flange corresponds to the positioning mounting hole on the printed circuit board. The support block is arranged on the lower side of the device body flange, and the V-shaped spring piece is arranged between the lower side of the support block and the printed circuit board. The positioning groove is an inverted U-shaped structure, and the positioning groove is buckled on both sides of the device body. The height of the inner side of the U-shaped two side plates of the positioning groove is the positioning height of the device body welding, and the positioning height is consistent with the height of the radiator support. A screw hole corresponding to the mounting hole on the device body flange is provided in the middle of the positioning groove; the screw passes through the V-shaped spring piece, the support block, the device body flange and the positioning groove in sequence from the positioning mounting hole on the lower side of the printed circuit board to fix the device body on the printed circuit board.

[0007] Specifically, the inner surface and both side ends of the positioning groove are coated with a debonding layer.

[0008] Specifically, an annular boss is arranged around the hole in the center of the upper surface of the support block, the outer diameter of the annular boss matches the inner diameter of the mounting hole on the flange of the device body, and the height of the annular boss is not higher than the upper surface of the flange of the device body, so as to facilitate the positioning of the support block and the device body.

[0009] A method for controlling the welding height of a TO-254 package device, the specific steps are:

[0010] Step 1: Open corresponding positioning and mounting holes at the device installation position on the printed circuit board, open corresponding pin through holes according to the position of the pins on the device body after bending on the printed circuit board, and open connection holes for connecting to the radiator at the four corners of the printed circuit board to complete the welding preparation work;

[0011] Step 2: Place the annular boss on the support block into the mounting hole on the flange of the device body, place the support block and the device body on the printed circuit board, pass the pins through the pin holes, place a V-shaped spring between the support block and the printed circuit board, buckle the positioning groove on the device body, and adjust the positions of the V-shaped spring, support block, device body and positioning groove to make the positions of each hole correspond;

[0012] Step 3: Insert the screw from the bottom of the printed circuit board into the positioning hole, and then pass through the V-shaped spring and the hole in the center of the support block and screw it into the screw hole of the positioning slot;

[0013] Step 4: Tighten the screws gradually. The V-shaped springs always ensure that the heat dissipation surface of the device body is in contact with the inner surface of the positioning groove under the action of elastic force. Stop when the screws are tightened until the lower end surfaces of both sides of the positioning groove fit the printed circuit board.

[0014] Step 5: Apply the fixing glue between the device body, the support block and the printed circuit board; fix the device body, the support block and the V-shaped spring piece on the printed circuit board, and solidify the glue;

[0015] Step 6: When the glue solidifies, unscrew the screws and remove the positioning slot to complete the welding and fixation of the device body on the printed circuit board; use the screws to pass through the connection holes at the four corners of the printed circuit board and screw the screws into the pillars of the radiator to fit the heat dissipation surface of the device body to the radiator.

[0016] Due to the adoption of the above-mentioned technical solution, the present invention has the following advantages:

[0017] The TO-254 package device welding height control tool and method of the present invention can accurately control the welding height of the device on the printed circuit board, ensure the product installation quality, and improve the production efficiency; the adjustment function of the V-shaped spring piece can ensure that the heat dissipation surface of the device and the heat sink are flatly fitted during installation, and the height error between the device body shell and the flange is compensated, the device has good heat dissipation, the printed circuit board is prevented from being deformed, and the reliability of the circuit board is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic diagram of the device body of the present invention.

[0019] Figure 2 It is a schematic diagram of the overall installation position of the present invention.

[0020] Figure 3 yes Figure 2 Schematic side view of .

[0021] Figure 4 It is a schematic diagram after the screws are unscrewed in step six of the present invention.

[0022] Figure 5 It is a schematic diagram of the overall explosion of the present invention when it is connected with a radiator.

[0023] Figure 6 Schematic diagram of the V-shaped spring piece of the present invention.

[0024] Figure 7 It is a schematic diagram of the positioning groove of the present invention.

[0025] Figure 8 Schematic diagram of the support block of the present invention.

[0026] In the figure: 1-device body, 11-flange, 12-mounting hole, 13-heat dissipation surface, 14-pin, 2-V-shaped spring, 3-support block, 31-annular boss, 4-printed circuit board, 5-positioning groove, 51-screw hole, 6-screw, 7-fixing glue, 8-heat sink, 9-column. DETAILED DESCRIPTION

[0027] The present invention will be further explained below in conjunction with the accompanying drawings and embodiments, which should not be used to limit the protection scope of the present invention. The purpose of disclosing the present invention is to protect all technical improvements within the scope of the present invention.

[0028] Combined with Figure 1-8 A TO-254 package device welding height control tool shown in the figure includes a device body 1, a V-shaped spring 2, a support block 3, a printed circuit board 4, a positioning groove 5 and a screw 6;

[0029] There is a mounting hole 12 on the flange 11 on the heat dissipation surface 13 of the device body 1, and a hole corresponding to the mounting hole 12 on the flange 11 of the device body 1 is arranged in the middle of the V-shaped spring piece 2; the support block 3 is a rectangular block, and a hole corresponding to the mounting hole 12 on the flange 11 of the device body 1 is also arranged in the middle of the support block 3, and an annular boss 31 is arranged around the hole in the center of the upper surface of the support block 3, and the outer diameter of the annular boss 31 matches the inner diameter of the mounting hole 12 on the flange 11 of the device body 1, and the height of the annular boss 31 is not higher than the upper surface of the flange 11 of the device body 1, so as to facilitate the positioning of the support block 3 and the device body 1.

[0030] A positioning and mounting hole is provided on the printed circuit board 4, the device body 1 is provided on the printed circuit board 4, the mounting hole 12 on the flange 11 of the device body 1 corresponds to the positioning and mounting hole on the printed circuit board 4, the support block 3 is provided on the lower side of the flange 11 of the device body 1, the V-shaped spring piece 2 is provided between the lower side of the support block 3 and the printed circuit board 4, the positioning groove 5 is an inverted U-shaped structure, the inner surface and both side ends of the positioning groove 5 are coated with a debonding layer, the positioning groove 5 is buckled on both sides of the device body 1, the height of the inner side of the U-shaped two side plates of the positioning groove 5 is the positioning height of the device body 1 welding, the positioning height is consistent with the height of the column 9 of the radiator 8, and a screw hole 51 corresponding to the mounting hole 12 on the flange 11 of the device body 1 is provided in the middle of the positioning groove 5; the screw 6 passes through the V-shaped spring piece 2, the support block 3, the flange 11 of the device body 1 and the positioning groove 5 in sequence from the positioning and mounting hole 12 on the lower side of the printed circuit board 4 to fix the device body 1 on the printed circuit board 4.

[0031] A method for controlling the welding height of a TO-254 package device, the specific steps are:

[0032] Step 1: Open corresponding positioning and mounting holes 12 at the device mounting position on the printed board 4, open corresponding pin through holes according to the positions of the pins 14 on the device body 1 corresponding to the positions on the printed board 4 after bending, and open connection holes for connecting with the heat sink 8 at the four corners of the printed board 4 to complete the welding preparation work;

[0033] Step 2: Place the annular boss 31 on the support block 3 into the mounting hole 12 on the flange 11 of the device body 1, place the support block 3 and the device body 1 on the printed circuit board 4, pass the pin 14 through the pin through-hole, place the V-shaped spring piece 2 between the support block 3 and the printed circuit board 4, buckle the positioning groove 5 on the device body 1, and adjust the positions of the V-shaped spring piece 2, the support block 3, the device body 1 and the positioning groove 5 so that the positions of the holes correspond;

[0034] Step 3: Insert the screw 6 from the lower side of the printed circuit board 4 into the positioning and mounting hole, and then pass through the V-shaped spring piece 2 and the hole in the center of the support block 3 and screw it into the screw hole 51 of the positioning groove 5;

[0035] Step 4: Tighten the screws 6 gradually. The V-shaped spring piece 2 always ensures that the heat dissipation surface 13 of the device body 1 is in contact with the inner surface of the positioning groove 5 under the action of elastic force. Stop when the screws 6 are tightened until the lower end surfaces of both sides of the positioning groove 5 are in contact with the printed circuit board 4.

[0036] Step 5: Apply the fixing glue 7 between the device body 1, the support block 3 and the printed circuit board 4; fix the device body 1 together with the support block 3 and the V-shaped spring piece 2 on the printed circuit board 4, and solidify the glue;

[0037] Step 6: When the glue is solidified, unscrew the screws 6 and remove the positioning grooves 5 to complete the welding and fixation of the device body 1 on the printed circuit board 4; use the screws 6 to pass through the connection holes at the four corners of the printed circuit board 4 and screw the screws into the columns 9 of the radiator 8 to fit the heat dissipation surface 13 of the device body 1 to the radiator 8.

[0038] The parts not described in detail in this invention are prior art.

[0039] The embodiments selected herein for the purpose of disclosing the invention are currently considered to be suitable, but it should be understood that the invention is intended to include all changes and modifications of the embodiments that fall within the scope of the concept and invention.

Claims

1. A TO-254 package device welding height control tool, characterized in that: It includes a device body, a V-shaped spring, a support block, a printed circuit board, a positioning groove and a screw; The flange on the heat dissipation surface of the device body is provided with mounting holes, and a hole corresponding to the mounting hole on the device body flange is provided in the middle of the V-shaped spring piece; the support block is a rectangular block, and a hole corresponding to the mounting hole on the device body flange is also provided in the middle of the support block, and a positioning mounting hole is provided on the printed circuit board. The device body is arranged on the printed circuit board, and the mounting hole on the device body flange corresponds to the positioning mounting hole on the printed circuit board. The support block is arranged on the lower side of the device body flange, and the V-shaped spring piece is arranged between the lower side of the support block and the printed circuit board. The positioning groove is an inverted U-shaped structure, and the positioning groove is buckled on both sides of the device body. The height of the inner side of the U-shaped two side plates of the positioning groove is the positioning height of the device body welding, and the positioning height is consistent with the height of the radiator support. A screw hole corresponding to the mounting hole on the device body flange is provided in the middle of the positioning groove; the screw passes through the V-shaped spring piece, the support block, the device body flange and the positioning groove in sequence from the positioning mounting hole on the lower side of the printed circuit board to fix the device body on the printed circuit board.

2. The TO-254 package device welding height control tool according to claim 1, characterized in that: The inner surface and both side ends of the positioning groove are coated with a debonding layer.

3. The TO-254 package device welding height control tool according to claim 1, characterized in that: An annular boss is arranged around the hole at the center of the upper surface of the support block, the outer diameter of the annular boss matches the inner diameter of the mounting hole on the flange of the device body, and the height of the annular boss is not higher than the upper surface of the flange of the device body.

4. A method for using the TO-254 package device welding height control tooling according to any one of claims 1 to 3, characterized in that: The specific steps are: Step 1: Open corresponding positioning and mounting holes at the device installation position on the printed circuit board, open corresponding pin through holes according to the position of the device pins on the printed circuit board after bending, and open connection holes for connecting to the radiator at the four corners of the printed circuit board to complete the welding preparation work; Step 2: Place the annular boss on the support block into the mounting hole on the flange of the device body, place the support block and the device body on the printed circuit board, pass the pins through the pin holes, place a V-shaped spring between the support block and the printed circuit board, buckle the positioning groove on the device body, and adjust the positions of the V-shaped spring, support block, device body and positioning groove to make the positions of each hole correspond; Step 3: Insert the screw from the bottom of the printed circuit board into the positioning hole, and then pass through the V-shaped spring and the hole in the center of the support block and screw it into the screw hole of the positioning slot; Step 4: Tighten the screws gradually. The V-shaped springs always ensure that the heat dissipation surface of the device body is in contact with the inner surface of the positioning groove under the action of elastic force. Stop when the screws are tightened until the lower end surfaces of both sides of the positioning groove fit the printed circuit board. Step 5: Apply the fixing glue between the device body, the support block and the printed circuit board; fix the device body, the support block and the V-shaped spring piece on the printed circuit board, and solidify the glue; Step 6: When the glue solidifies, unscrew the screws and remove the positioning slot to complete the welding and fixation of the device body on the printed circuit board; use the screws to pass through the connection holes at the four corners of the printed circuit board and screw the screws into the pillars of the radiator to fit the heat dissipation surface of the device body to the radiator.

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