Radiator structure of audio equipment

Abstract

Provided is a heat sink structure for an audio device that suppresses resonance of a heat sink fin by a structure that is easy to manufacture. The heat sink structure for an audio device comprises: a base portion; and a plurality of heat sink fins, wherein the heat sink fins are plate-shaped heat sink fins that stand upright on a given surface of the base portion in a first direction orthogonal to the given surface, and the plurality of heat sink fins are arranged side by side in a second direction orthogonal to the first direction, and in a cross section of the heat sink fin parallel to the first direction and the second direction, the inclination of the side surface relative to the base portion is different between the heat sink fins adjacent to each other in the second direction.

Description

Technical Field

[0001] The invention relates to a radiator structure of an audio device. Background Art

[0002] When audio equipment is in use, heat is generated from electronic components such as power ICs and regulators, so sometimes a heat sink is directly set on these components, or on a housing that accommodates these components. The heat sink, for example, has multiple heat sink fins arranged in parallel to have a wider surface area, and releases heat from these heat sink fins to the outside air. In this way, when a heat sink with heat sink fins arranged in parallel is set on an audio device, these heat sink fins sometimes resonate and vibrate at an inherent frequency like a tuning fork. If the vibration is transmitted to the circuit that processes the sound signal, the electronic components, wiring materials and other elements that constitute the circuit vibrate. As a result, changes in contact resistance, induced voltage, etc. in these elements sometimes add noise to the sound signal, distort the sound signal, and become the main reason for the reduction in sound quality.

[0003] Patent Document 1 describes that ribs are formed at different positions on a plurality of fins to cancel out fins having the same natural frequency, thereby suppressing resonance.

[0004] Prior Art Literature

[0005] Patent Literature

[0006] [Patent Document 1]: Japanese Patent Application Publication No. 2000-68427

[0007] [Patent Document 2]: Japanese Utility Model Application Laid-Open No. 3-63990

[0008] [Patent Document 3]: Japanese Patent Application Publication No. 2018-098350

[0009] As described in Patent Document 1, if a rib is formed on each of a plurality of fins so that the width of the fins is partially different, i.e., the rib portion protrudes in the width direction, the shape of each fin will be complicated, and it will be difficult to manufacture the heat sink by casting, resulting in a problem of manufacturing constraints. Summary of the invention

[0010] An object of the present invention is to provide a heat sink structure that suppresses resonance of heat sink fins with a structure that is easy to manufacture.

[0011] In order to solve the above-mentioned problems, the heat sink structure of an audio device according to the present invention is a heat sink structure for an audio device, comprising:

[0012] a base portion; and

[0013] A plurality of heat dissipation fins, wherein the heat dissipation fins are plate-shaped heat dissipation fins erected toward a given surface of the base portion in a first direction orthogonal to the given surface, and the plurality of heat dissipation fins are arranged in parallel in a second direction orthogonal to the first direction,

[0014] In a cross section of the heat dissipation fin parallel to the first direction and the second direction, an inclination of a side surface with respect to the base portion is different between the heat dissipation fins adjacent to each other in the second direction.

[0015] According to the present invention, it is possible to provide a heat sink structure that suppresses resonance of heat dissipation fins with a structure that is easy to manufacture. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is an external perspective view of a housing to which the heat sink structure according to the embodiment is applied.

[0017] Figure 2 yes Figure 1 Cross-sectional view at line AA.

[0018] Figure 3 It is a plan view showing the heat sink structure according to the embodiment.

[0019] Figure 4 This is an illustration of the heat sink structure being removed from the mold.

[0020] Figure 5 It is a diagram showing the structure of an audio amplifier according to an embodiment.

[0021] -Description of Reference Numerals-

[0022] 1: Radiator structure;

[0023] 10: base portion;

[0024] 20, 20A~20C, 20M, 20N: cooling fins;

[0025] 21: base end;

[0026] 22: front end;

[0027] 23: first side;

[0028] 24: Second side;

[0029] 25: pressure part;

[0030] 30: Circuit;

[0031] 41: Upper mold;

[0032] 42: extrusion pin;

[0033] 51: bottom plate;

[0034] 52, 53: circuit substrate;

[0035] 60: upper covering body;

[0036] 100: audio amplifier (audio equipment);

[0037] 110: Shell. DETAILED DESCRIPTION

[0038] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Figure 1 is a perspective view of the appearance of a housing to which the heat sink structure according to the present embodiment is applied. Figure 2 yes Figure 1 The cross-sectional view at line AA of Figure 3 FIG. 2 is a top view showing the heat sink structure according to the present embodiment. Figure 1 to Figure 3 In the figure, the X axis represents the width direction, the Y axis represents the height direction, and the Z axis represents the front-rear direction. These directions are shown for convenience of explanation, and the plate structure of this embodiment is not limited to being arranged in the directions shown in the figure.

[0039] The heat sink structure 1 according to the present embodiment is applied to an audio amplifier 100. Specifically, Figure 1 As shown, the heat sink structure 1 is provided in a housing 110 of an audio amplifier 100. The heat sink structure 1 includes a base portion 10 and a plurality of heat sink fins 20 erected on the base portion 10.

[0040] The base portion 10 constitutes a part of the shell 110 and is a roughly plate-shaped component extending in the XZ direction. It has a lower surface 11 located on the inner side of the shell 110 and an upper surface 12 parallel to the lower surface 11. The upper surface (given surface) 12 is provided with heat dissipation fins 20.

[0041] The heat dissipation fins 20 are plate-shaped members erected on the upper surface 12 of the base portion 10 in a first direction (Y direction) perpendicular to the upper surface 12 , and a plurality of the heat dissipation fins 20 are arranged in parallel in a second direction (X direction) perpendicular to the first direction.

[0042] The heat sink structure 1 of this embodiment is a casting (die-cast product) made of aluminum or aluminum alloy, and is obtained by integrally casting the base portion 10 and the heat sink fins 20 using a casting mold. For example, the heat sink structure 1 is manufactured by arranging the upper mold and the lower mold that have been closed in the vertical direction, and injecting the molten aluminum alloy into the space formed between the upper mold and the lower mold. In this case, the cast heat sink structure 1 is pulled out from the mold in the Y direction, so a draft angle is set according to this direction. Figure 2In the example of , in each heat dissipation fin 20 of the heat sink structure 1, the width W2 on the front end portion 22 side is formed to be narrower than the width W1 of the base end portion 21 on the base portion 10 side. In other words, in the XY cross section of each heat dissipation fin 20, when one of the side surfaces of each heat dissipation fin facing each other in the X direction is set as the first side surface 23 and the other side is set as the second side surface 24, these first side surfaces 23 and second side surfaces 24 are inclined relative to the upper surface 12 of the base portion so that the interval (width of the heat dissipation fin) becomes narrower as it moves from the base end portion 21 toward the front end portion 22. In this way, each heat dissipation fin 20 is formed to be separated from the upper mold by becoming a shape with a tapered front end.

[0043] In addition, if Figure 2 As shown, in the heat sink structure 1 , the draft angles of the heat sink fins 20 adjacent to each other in the Y direction are different from each other.

[0044] exist Figure 2 In the figure, one of the heat dissipation fins 20 is represented as a heat dissipation fin 20A, and one of the heat dissipation fins 20 adjacent to the heat dissipation fin 20A is represented as a heat dissipation fin 20B.

[0045] exist Figure 2 In the example, the inclination gradient θL of the first side surface 23 of the heat sink 20A relative to the upper surface 12 of the base portion is 88°, that is, the inclination of the first side surface 23 relative to the Y axis is 2 degrees. In addition, the inclination θR of the second side surface 24 of the heat sink 20A relative to the upper surface 12 of the base portion is 86°, that is, the inclination of the second side surface 24 relative to the Y axis is 4 degrees.

[0046] On the other hand, the inclination θL of the first side surface 23 of the heat dissipation fin 20B relative to the upper surface 12 of the base portion is 86°, that is, the inclination of the first side surface 23 relative to the Y axis is 4 degrees. In addition, the inclination θR of the second side surface 24 of the heat dissipation fin 20B relative to the upper surface 12 of the base portion is 88°, that is, the inclination of the second side surface 24 relative to the Y axis is 2 degrees.

[0047] Thus, the inclination θL of the first side surface 23 and the inclination θR of the second side surface 24 of the heat dissipation fin 20A are reversed from the inclination θL of the first side surface 23 and the inclination θR of the second side surface 24 of the heat dissipation fin 20B. That is, the cross-sectional shape of the heat dissipation fin 20A and the cross-sectional shape of the heat dissipation fin 20B are formed symmetrically (left-right symmetrically) with respect to the Y axis.

[0048] In addition, the first side surface 23 of the heat sink fin 20C adjacent to the heat sink fin 20B has an inclination θL of 88° with respect to the upper surface 12 of the base portion, and the second side surface 24 has an inclination θR of 86° with respect to the upper surface 12 of the base portion. Therefore, the inclination θL of the first side surface 23 and the inclination θR of the second side surface 24 of the heat sink fin 20B are opposite to the inclination θL of the first side surface 23 and the inclination θR of the second side surface 24 of the heat sink fin 20C. Figure 2 , three heat sink fins 20A to 20C arranged at the same height are shown, but four or more heat sink fins 20A to 20C may be arranged in parallel, and the inclination θL of the first side surface 23 and the inclination θR of the second side surface 24 are reversed between adjacent heat sink fins 20, and the cross-sectional shape identical to the heat sink fin 20A and the cross-sectional shape identical to the heat sink fin 20B are set to be different from each other. In this way, the heat sink structure 1 of this embodiment suppresses resonance between adjacent heat sink fins 20 by changing the draft angle of adjacent heat sink fins 20 and making the cross-sectional shapes different from each other.

[0049] In addition, the curvature radius RL of the connection portion between the first side surface 23 of the heat dissipation fin 20A and the upper surface 12 of the base portion 10 is 1 mm, and the curvature radius RR of the connection portion between the second side surface 24 and the upper surface 12 of the base portion 10 is 2 mm. On the other hand, the curvature radius RL of the connection portion between the first side surface 23 of the heat dissipation fin 20B and the upper surface 12 of the base portion 10 is 2 mm, and the curvature radius RR of the connection portion between the second side surface 24 and the upper surface 12 of the base portion 10 is 1 mm.

[0050] In this way, the curvature radii RL and RR of the connection portion of the base end portion of the heat dissipation fin 20A are reversed from the curvature radii RL and RR of the connection portion of the base end portion of the heat dissipation fin 20B.

[0051] In addition, the curvature radius RL of the connection portion between the first side surface 23 of the heat dissipation fin 20C adjacent to the heat dissipation fin 20B and the upper surface 12 of the base portion 10 is 1 mm, and the curvature radius RR of the connection portion between the second side surface 24 and the upper surface 12 of the base portion 10 is 2 mm. Therefore, the curvature radii RL and RR of the connection portion of the heat dissipation fin 20B are opposite to the curvature radii RL and RR of the connection portion of the base end portion of the heat dissipation fin 20C. Figure 2 In the figure, three heat sink fins 20A to 20C are arranged at the same height, but four or more heat sink fins may be arranged in parallel, and the curvature radii RL and RR of the connection portion of the first side surface 23 are reversed in adjacent heat sink fins 20, and the cross-sectional shape identical to the heat sink fin 20A and the cross-sectional shape identical to the heat sink fin 20B are set to be different from each other. In addition, the above-mentioned curvature radius and curvature are examples and are not limited thereto.

[0052] In this way, the heat sink structure 1 of the present embodiment suppresses resonance between adjacent heat sink fins 20 by changing the radius of curvature of the connection portion of adjacent heat sink fins 20 , that is, changing the curvature of the connection portion to make the cross-sectional shapes different from each other.

[0053] The heat sink structure 1 of the present embodiment further includes heat sink fins 20M and 20N having a height different from that of the heat sink fins 20A to 20C. The heat sink fins 20M and 20N have the same height, and the heat sink fins 20M and 20N adjacent to each other at the same height have different draft angles and curvatures of connecting portions, similarly to the heat sink fins 20A to 20C described above. In addition, since the heat sink fins 20C and the heat sink fins 20M have different heights and different cross-sectional shapes regardless of the draft angle, the inclinations and curvatures of connecting portions may be the same or different.

[0054] In addition, if Figure 3 As shown, the heat sink structure 1 of this embodiment has a pressure receiving portion 25 formed at the front end portion 22 of the heat dissipation fin 20, the pressure receiving portion 25 being wider than other portions of the front end portion 22. Figure 4 As shown, after the heat sink structure 1 is cast, the pressure receiving portion 25 is pressed by the pressing pin 42, thereby being pulled out from the upper mold 41. Here, if the pressure receiving portion 25 is formed in the same manner in the adjacent heat sink fins 20, it is considered that resonance will occur, so the positions where the pressure receiving portion 25 are formed in the adjacent heat sink fins 20 are made different in the depth direction (Z direction). As a result, the cross-sectional shapes of the adjacent heat sink fins 20 are made different from each other, thereby suppressing the resonance between the adjacent heat sink fins 20.

[0055] Figure 5 1 is a diagram showing the structure of an audio amplifier 100 according to the present embodiment. The audio amplifier 100 is provided with circuit boards 52 and 53 on a base plate 51. The circuit board 52 includes electronic components 521 that serve as heat sources, such as a power IC and a regulator. In addition, the circuit board 53 is provided with a circuit 532 that performs signal processing such as transmission, conversion, amplification, and output of sound signals input from other devices.

[0056] Furthermore, the circuit 30, which is a heat source, such as a power transformer, an electrolytic capacitor, and a switching element, is provided on the bottom plate 51. In addition, the circuit 30 and the electronic component 521 are also vibration sources that generate minute vibrations during use.

[0057] The upper cover 60 is mounted on the bottom plate 51 by fastening members such as screws. The upper cover 60 includes a side plate portion 61 that divides the side surface of the housing 110, and a top plate portion 62 that is connected to the upper ends of the left and right side plates 61 and divides the upper surface of the housing 110. In addition, the heat sink structure 1 of the present embodiment is formed integrally with the upper cover 60, and the base portion 10 constitutes a part of the top plate portion 62.

[0058] In addition, the housing 110 is in a box shape having a front panel (not shown) dividing the front surface and a rear panel (not shown) dividing the rear surface. In this way, the audio amplifier 100 of this embodiment accommodates the circuit 532 for signal processing, the circuit 30 that serves as a heat source and a vibration source, the electronic component 521, etc. in the space inside the housing 110. The electronic component 521 is arranged in contact with the inner wall surface of the top plate portion 62, that is, the lower surface 11 of the heat sink structure 1, and releases heat to the outside through the heat sink structure 1.

[0059] <Effects>

[0060] As described above, in the heat sink structure 1 of the present embodiment, in the XY cross section of the plurality of radiating fins 20 arranged in parallel, the inclinations of the side surfaces 23 and 24 with respect to the base 10 are different between radiating fins adjacent to each other in the second direction (X direction).

[0061] Thus, the heat sink structure 1 of the present embodiment makes the cross-sectional shapes of adjacent heat dissipation fins different from each other, changes the resonance point, and suppresses the resonance of adjacent heat dissipation fins.

[0062] In addition, the heat sink structure 1 of the present embodiment makes the curvature of the connection portion between the side surfaces 23 and 24 of the heat sink fin 20 and the base portion 10 different between adjacent heat sink fins in the second direction in the XY cross section of the heat sink fin 20. Thus, the heat sink structure 1 of the present embodiment makes the cross-sectional shapes of adjacent heat sink fins different, changes the resonance point, and suppresses the resonance between adjacent heat sink fins.

[0063] In addition, in the heat sink structure 1 of the present embodiment, one of the side surfaces of each heat sink fin 20 that are opposite in the second direction is set as the first side surface 23, and the other side is set as the second side surface 24 in the XY cross section of the heat sink fin 20, and the inclination of the first side surface 23 and the inclination of the second side surface 24 are reversed in the heat sink fins that are adjacent in the second direction. Thus, the heat sink structure 1 of the present embodiment makes the cross-sectional shapes of adjacent heat sink fins different from each other, changes the resonance point, and suppresses the resonance of adjacent heat sink fins.

[0064] Furthermore, in the heat sink structure 1 of the present embodiment, the base portion 10 constitutes a part of the housing 110 in the audio amplifier (audio equipment) 100. Thus, the resonance of the heat sink structure 1 caused by the micro vibration generated by the vibration source of the audio amplifier 100 is suppressed, and the influence on the signal circuit caused by the resonance of the heat sink structure 1 is suppressed, so that the sound quality of the audio amplifier 100 can be suppressed from being deteriorated.

[0065] <Others>

[0066] The audio device is not limited to the audio amplifier 100 , and may be any device including a circuit for processing an audio signal, such as an audio tuner, a video recording device (recorder), and a video playback device (player).

Claims

1. A radiator structure for an audio device, used for the audio device, the radiator structure comprising: a base portion; and A plurality of heat dissipation fins, wherein the heat dissipation fins are plate-shaped heat dissipation fins erected toward a given surface of the base portion in a first direction orthogonal to the given surface, and the plurality of heat dissipation fins are arranged in parallel in a second direction orthogonal to the first direction, In a cross section of the heat dissipation fin parallel to the first direction and the second direction, one of the side surfaces of each heat dissipation fin that are opposite to each other in the second direction is set as a first side surface, and the other side is set as a second side surface, so that the inclination of the first side surface and the inclination of the second side surface relative to the given surface of the heat dissipation fins adjacent to each other in the second direction are different from each other, Adjacent heat dissipation fins are not bonded to each other.

2. The heat sink structure of the audio equipment according to claim 1, wherein: In a cross section of the heat dissipation fin parallel to the first direction and the second direction, a curvature of a connection portion between the first side surface and the base portion of the heat dissipation fins adjacent in the second direction is different from a curvature of a connection portion between the second side surface and the base portion.

3. A radiator structure for an audio device, used for the audio device, the radiator structure comprising: a base portion; and A plurality of heat dissipation fins, wherein the heat dissipation fins are plate-shaped heat dissipation fins erected toward a given surface of the base portion in a first direction orthogonal to the given surface, and the plurality of heat dissipation fins are arranged in parallel in a second direction orthogonal to the first direction, In a cross section of the heat dissipation fin parallel to the first direction and the second direction, one of the side surfaces of each heat dissipation fin that are opposite to each other in the second direction is set as a first side surface, and the other side is set as a second side surface, so that the inclination of the first side surface and the inclination of the second side surface relative to the given surface of the heat dissipation fins adjacent to each other in the second direction are different from each other, In a cross section of the heat dissipation fin parallel to the first direction and the second direction, a curvature of a connection portion between the first side surface and the base portion of the heat dissipation fins adjacent in the second direction is different from a curvature of a connection portion between the second side surface and the base portion.

4. The radiator structure of the audio equipment according to any one of claims 1 to 3, wherein: In a cross section of the heat dissipation fin parallel to the first direction and the second direction, the inclination of the first side surface and the inclination of the second side surface of the heat dissipation fins adjacent to each other in the second direction are reversed.

5. The radiator structure of the audio equipment according to any one of claims 1 to 3, wherein: The base portion constitutes a part of a housing of the audio device.

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