Non-contact dimensional measurement device with micron-level resolution

Abstract

The invention relates to a non-contact dimension measuring device (1) with micrometer-level resolution, suitable for measuring the distance to an object (900) provided with at least one reflective surface (950). The non-contact dimension measuring device (1) extends along an axis (X-X) and comprises: i) a light source (2) generating an emitted light beam (Le) towards the object (900) so that the reflective surface (950) generates a reflected light beam (Lr); ii) a light blocking element (3) positioned on the opposite side of the light source (2), wherein the light blocking element (3) comprises at least one slit (30) to allow only the reflected light beam (Lr) to pass through the slit (30); iii) a detection group (5) comprising: an imaging sensor (50) detecting a projection (500) of the reflected light beam (Lr) passing through the slit (30) on the imaging sensor; and a processing and control component (51) operatively connected to the imaging sensor (50) and suitable for analyzing the projection (500) to determine the distance and characteristics of the reflective surface (950).

Description

Technical Field

[0001] The present invention relates to a non-contact dimensional measuring device with micrometer-level resolution. In addition, the present invention relates to a dimensional and / or product shape control system comprising at least one non-contact dimensional measuring device with micrometer-level resolution. Background Art

[0002] In particular, “non-contact dimensional measuring device with micrometer resolution” means that the device is suitable for measuring the distance between the position of the device and an object, in particular the distance between the position of the device and a reference plane or surface of the object, with micrometer resolution and accuracy and within a measuring range between 1 mm and 100 mm.

[0003] Preferably, a similar definition of “a non-contact dimension measuring device with micron-level resolution” is also “a non-contact displacement transducer device with micron-level resolution”.

[0004] To further illustrate the background of the present invention, it is worth noting that a non-contact dimensional measuring device with micron-level resolution relates to the technical field of dimensional control devices for performing precise measurements in industrial fields.

[0005] In this context, the size control devices are divided into contact devices and non-contact devices.

[0006] Both devices are suitable not only for dimensional measurement of mechanical components, but also for industries manufacturing glass components with flat and curved surfaces. This applies, for example, to the measurement of glass and other transparent materials, even large-scale ones, such as those used in the automotive, railway or aerospace sectors, where the metrological characteristics of these materials need to be accurately verified before they are released to the market and during their manufacturing process.

[0007] Contact devices have a movable part which, during measurement, comes into contact with the surface of the object relative to which the distance or dimension is to be measured.

[0008] A typical limitation of a contact device is an inherent property of the contact device, ie being in an operational mode.

[0009] In practice, it has been found that the contact of the movable part of the device with the surface may result in displacement and / or deformation of the object being measured, thereby not guaranteeing accurate measurements and / or causing potential damage to the object itself.

[0010] Known contactless devices can be divided into different types according to their operating principle.

[0011] The most important non-contact devices are of the optical type, i.e., those that use light as a measuring tool. Such devices measure the distance to an object, for example, by analyzing the intensity of a reflected light beam or by using laser triangulation techniques, or they are confocal (monochromatic or polychromatic), or they measure the distance to an object using the principle of interferometry.

[0012] Contactless devices solve the key problems typical of contact devices mentioned above; however, known contactless devices present a series of problems of their own due to the nature and characteristics of the measurement method and the surface of the object relative to which the measurement is performed.

[0013] In particular, non-contact optical dimensioning of objects with transparent or translucent surfaces presents significant difficulties. For example, if the surface is transparent, laser triangulation cannot be used. For example, detection sensors that analyze the intensity of the reflected light beam as a useful signal for measuring the distance are subject to errors caused by other physical quantities, such as the ambient temperature value and the reflectivity of the surface itself. For example, devices with confocal sensors or interferometers overcome some of the above-mentioned problems and limitations, but devices with confocal sensors or interferometers are extremely complex and expensive and therefore have limited use for large-scale measurements in industrial environments.

[0014] Against the backdrop of this background art, it is clear that there is a great need for a non-contact dimensional measurement device with micron-level resolution that performs non-contact measurements and overcomes the problems and limitations of known solutions. Summary of the Invention

[0015] An object of the present invention is to provide a non-contact dimensional measuring device with micron-level resolution that is easy to use, highly accurate and reliable, and cost-effective so as to be applicable to the fields of industrial measurement and advanced technology.

[0016] The above object is achieved by a non-contact dimensional measuring device with micron-level resolution according to the present invention. Similarly, this object is achieved by a size and / or product shape control system according to the present invention, which includes a non-contact dimensional measuring device with micron-level resolution.

[0017] Some embodiments of the invention show preferred variants which imply other advantageous aspects. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Other characteristics and advantages of the present invention will become apparent from the following description of a preferred embodiment of the invention given by way of non-limiting example with reference to the accompanying drawings, in which:

[0019] - Figure 1 A non-contact dimensional measuring device with micrometer-level resolution according to the present invention is schematically shown in an axially sectional perspective view;

[0020] - Figure 2 and Figure 2a The two are respectively a longitudinal schematic cross-sectional view and a transverse schematic cross-sectional view of a non-contact dimension measuring device with micron-level resolution according to a preferred embodiment;

[0021] - Figure 3 Schematically shows a first measurement performed on a target having a specular reflective portion by the non-contact dimension measuring device with micron-level resolution according to the present invention;

[0022] - Figure 3' and Figure 3 Shown with Figure 3 Two diagrams relating to the measurements schematically shown in FIG.

[0023] - Figure 4 Schematically shows a second measurement performed on a target having a specular reflective portion by a non-contact dimensional measuring device with micron-level resolution according to the present invention, wherein the object is positioned relative to Figure 3 At different distances as shown in the figure;

[0024] - Figure 4' and Figure 4 Shown with Figure 4 Two diagrams relating to the measurements schematically shown in FIG.

[0025] - Figure 5 schematically illustrates a third measurement performed on a translucent target by the non-contact dimension measuring device with micron-level resolution according to the present invention;

[0026] - Figure 5' and Figure 5 Shown with Figure 5 Two diagrams relating to the measurements schematically shown in FIG.

[0027] - Figure 6 Schematically shows a fourth measurement performed on a tilted target having a mirror reflective portion by the non-contact dimension measuring device with micrometer-level resolution according to the present invention;

[0028] - Figure 6' and Figure 6 Shown with Figure 6 Two diagrams relating to the measurements schematically shown in FIG.

[0029] - Figure 7 Shown according to Figure 4 The measurement uses a signal obtained by an imaging sensor included in the non-contact dimension measuring device with micron-level resolution according to the present invention;

[0030] - Figure 8 Shown according to Figure 5 The measurement uses a signal obtained by an imaging sensor included in the non-contact dimension measuring device with micron-level resolution according to the present invention;

[0031] - Figure 9 Shown according to Figure 6 The measurement uses a signal obtained by an imaging sensor included in the non-contact dimension measuring device with micron-level resolution according to the present invention;

[0032] - Figure 10 An enlarged view of a preferred embodiment of some components included in a non-contact dimensional measuring device with micrometer-level resolution, in particular a light source, a light blocking element and an optical group is shown. DETAILED DESCRIPTION

[0033] Referring to the drawings, a non-contact dimension measuring device with micron-level resolution according to the present invention is designated by reference numeral 1 .

[0034] The detection device 1 of the present invention is suitable for detecting the distance to an object 900 provided with a reflective surface 950. Preferably, in the following of this discussion, the terms "object" or "product" are essentially used as synonyms.

[0035] Preferably, the object 900 is a body including at least one surface having a fully or partially specularly reflective portion.

[0036] Preferably, the object 900 is made of glass or other transparent or translucent materials.

[0037] Preferably, object 900 is a glass pane or sheet. In embodiments where object 900 is a pane or sheet made of a transparent or translucent material, such as glass, object 900 includes a reflective surface 950 on a first side and a second reflective surface 955 on a second side. Preferably, these two reflective surfaces represent the outer surfaces of the glass pane. Preferably, the first side is located proximate to non-contact dimensional measurement device 1 with micron-level resolution, while the second side is located distal to non-contact dimensional measurement device 1 with micron-level resolution.

[0038] Another object of the present invention is to provide a size and / or product shape control system suitable for verifying the conformity and characteristics of an object 900, which size and / or product shape control system includes at least one non-contact size measuring device 1 with micron-level resolution according to the present invention.

[0039] According to a preferred embodiment, the size and / or product shape control system includes a support frame on which a plurality of dimensional measuring devices 1 with micron-level resolution are positioned. Preferably, the support frame is adapted to support each dimensional measuring device 1 with micron-level resolution in a corresponding preferred and predetermined position. Preferably, the dimensional measuring devices 1 with micron-level resolution simultaneously detect features of the object 900 at different points.

[0040] According to a preferred embodiment, the size and / or product shape control system comprises a mobile system equipped with one or more size measuring devices 1 with micron-level resolution for scanning the object 900 .

[0041] According to a preferred embodiment, the size and / or product shape control system is particularly used in the industry for manufacturing glass sheet products, for example in the industry for producing glass for the automotive, railway or aeronautical sectors.

[0042] Preferably, the size and / or product shape control system is suitable for checking the characteristics of the "glass" product as a whole. Preferably, the size and / or product shape control system produced is suitable for checking the integrity, thickness, and possible curvature and / or flatness of the glass.

[0043] According to the invention, the contactless dimensional measuring device 1 with micrometer resolution extends along an axis XX.

[0044] Preferably, the axis XX is also the axis along which the measurements are performed, as described in detail below.

[0045] In short, the non-contact dimensional measurement device 1 with micrometer resolution measures the position of an object 900 along the axis XX, wherein the object 900 is positioned at a distance between 1 mm and 100 mm. Preferably, the object 900 is positioned at a distance between 1 mm and 100 mm from the end of the non-contact dimensional measurement device 1 with micrometer resolution.

[0046] According to the present invention, a non-contact dimensional measuring device 1 with micrometer-level resolution includes a light source 2 that generates an emission light beam “Le” directed toward an object 900 .

[0047] In particular, the light source 2 generates an emission light beam "Le" along an emission direction, preferably substantially parallel to the axis XX. In other words, the light source 2 generates an incoherent and diverging light beam along the axis XX.

[0048] According to a preferred embodiment, the light source 2 is positioned at the axis XX.

[0049] According to a preferred embodiment, the light source 2 is an LED.

[0050] According to a preferred embodiment, the light source 2 is a blue LED.

[0051] According to a preferred embodiment, the light source 2 is a blue LED in the form of a bare chip.

[0052] According to the present invention, the light source 2 generates an emission light beam "Le" toward the reflective surface 950 so that the reflective surface 950 reflects a reflection light beam "Lr" in a reflection direction substantially opposite to the emission direction.

[0053] Furthermore, according to the present invention, the non-contact dimensional measuring device 1 with micron-level resolution includes a light blocking element 3 positioned on the opposite side of the light source 2 relative to the emission direction. In other words, the light blocking element 3 is adapted to prevent the reflected light beam "Lr" from passing through.

[0054] Preferably, the light blocking element 3 is substantially flat and orthogonal to the axis XX.

[0055] According to the present invention, the light blocking element 3 comprises at least one slit 30 capable of allowing the reflected light beam "Lr" to pass through. Preferably, the slit 30 extends in a through manner along a direction parallel to the axis XX.

[0056] In other words, the light blocking element 3 blocks light from passing except for the space of the at least one slit 30 , that is, the light blocking element 3 blocks the reflected light beam “Lr” from passing therethrough.

[0057] According to the present invention, the slit 30 is formed into a suitable shape.

[0058] According to a preferred embodiment, the slot 30 has a substantially circular shape. In other words, the slot 30 extends over substantially 360°. Preferably, the slot 30 is centered on the axis XX.

[0059] Preferably, the gap 30 includes and is defined by a first gap edge 31 and a second gap edge 32 , preferably the first gap edge 31 is an inner edge and preferably the second gap edge 32 is an outer edge.

[0060] According to a preferred embodiment, the slit 30 has a width comprised between 5 and 500 micrometers, comprised between the first and second slit edges 31 and 32. Preferably, the slit 30 has a width comprised between 10 and 100 micrometers, comprised between the first and second slit edges 31 and 32.

[0061] According to the present invention, the non-contact dimensional measuring device 1 with micron-level resolution comprises a detection group 5 , which is suitable for detecting and analyzing the light beam passing through the slit 30 .

[0062] The detection group 5 includes an imaging sensor (50) on which a projection 500 of the reflected light beam "Lr" passing through the slit 30 is detected.

[0063] According to a preferred embodiment, the projection 500 has a first projection edge 501 and a second projection edge 502 according to the shape of the gap 30 .

[0064] For example, in a preferred embodiment, where the slit 30 has a substantially circular shape, the projection 500 detected on the imaging sensor 50 also has a substantially circular shape.

[0065] According to a preferred embodiment, the slit 30 is substantially circular. However, the shape of the slit 30 is not limiting for the present invention.

[0066] According to a preferred embodiment, the imaging sensor 50 is a CMOS sensor.

[0067] According to a preferred embodiment, the CMOS sensor has an active area between 1*1 mm² and 30*30 mm². Preferably, the CMOS sensor has an active area between 1*1 mm² and 10*10 mm². Preferably, the CMOS sensor has an active area between 1*1 mm² and 4*4 mm². Preferably, the CMOS sensor has an active area of ​​approximately 1.5*1.5 mm².

[0068] According to a preferred embodiment, the imaging sensor 50 is positioned so that the centre of the active area corresponds to the axis XX.

[0069] Furthermore, the detection group 5 comprises a processing and control component 51 operatively connected to the imaging sensor 50 , which is suitable for analysing the shape and position of said projection 500 .

[0070] Preferably, the processing and control component 51 is adapted to identify the distance and characteristics of the reflective surface 950 of the object 900 by analyzing the shape and position of the projection 500 .

[0071] According to a preferred embodiment, the processing and control component 51 comprises a data conversion and transmission unit 51 ′ operatively connected to the detection sensor 50 , the data conversion and transmission unit 51 ′ being adapted to read and convert data generated by said detection sensor 50 .

[0072] Furthermore, the processing and control component 51 comprises a processing and control unit 51″ which is operatively connected to a data conversion and transmission unit 51′ and adapted to receive data read by the data conversion and transmission unit 51′, to analyse the data and thereby to verify the geometry and position of the projection 500.

[0073] According to a preferred embodiment, the non-contact dimensional measurement device 1 with micron-level resolution further includes an optical group 4 adapted to converge the reflected light beam “Lr” passing through the slit 30 toward the imaging sensor 50 .

[0074] A schematic and simulated preferred embodiment of the optical group 4 is shown in the attached diagram. Apart from the features described below, the optical group 4 is not limited to a specific embodiment.

[0075] According to a preferred embodiment, the optical group 4 comprises one or more lenses. Preferably, the lenses are spherical or aspherical.

[0076] According to a preferred embodiment, the number of lenses included in the optical group 4 is as limited as possible.

[0077] Preferably, the optical group 4 can be designed to achieve the right compromise between required performance, effectiveness, size and cost.

[0078] According to a preferred embodiment, the optical group 4 comprises two spherical convex lenses spaced axially apart.

[0079] According to a preferred embodiment, the optical group 4 comprises a base surface 41 facing the object 900. Preferably, said base surface 41 is close to the object 900 in the axial direction.

[0080] According to a preferred embodiment, said base surface 41 is flat. Preferably, said base surface 41 is orthogonal to the axis XX.

[0081] According to a preferred embodiment, the light blocking element 30 is positioned on the base surface 41 .

[0082] According to a preferred embodiment, the light source 2 and the light blocking element 3 are integrally connected.

[0083] Preferably, both the light source 2 and the light blocking element 3 are integrally connected to the optical group 4 .

[0084] According to a preferred embodiment, the light blocking element 3 is made of metal.

[0085] According to a preferred embodiment, the light-blocking element 3 is made of a current-conducting material. Preferably, the light-blocking element 3 is adapted to supply power to the light source 2 mounted on the light-blocking element 3. Preferably, the light-blocking element 3 is shaped so as to define a positive pole and a negative pole operatively connected to the light source 2. According to a preferred embodiment, the light-blocking element 3 is obtained by depositing at least one film-like material on the base surface 41, the film-like material being impermeable to light.

[0086] Preferably, the light blocking element 3 comprises at least one electrically conductive film-like material. Preferably, the light blocking element 3 comprises one or more conductive metal film-like materials. Preferably, the operation of depositing the at least one film-like material on the base surface 41 is performed by a metallization operation.

[0087] Figure 10 A non-limiting example of a preferred embodiment is shown of an optical group 4 (shown schematically), a light blocking element 3 integrally resting on a base surface 41 of the optical group 4, and an LED light source 2 mounted on and supplied with power by the light blocking element 3. According to this preferred embodiment, the gap 30 is specifically shaped to separate the positive from the negative polarization.

[0088] Furthermore, also according to the preferred embodiment, the light source 2 is operatively connected to the light blocking element 3 by wafer bonding technology and wire bonding technology.

[0089] According to a preferred embodiment, the non-contact dimensional measuring device 1 with micrometer resolution is suitable for also detecting the thickness of a transparent object 900. In fact, the transparent object 900 has a reflective surface 950 on a first side and a second reflective surface 955 on a second side (or the opposite side).

[0090] In particular, the detection group 5 detects and analyzes the projection 500 due to the reflective surface 950 and the auxiliary projection 510 due to the second reflective surface 955 on the imaging sensor 50 .

[0091] In practice, the auxiliary projection 510 preferably includes a first auxiliary projection edge 511 and a second auxiliary projection edge 512 .

[0092] In other words, when the light source 2 emits the emission light beam "Le" toward the transparent object 900, the non-contact dimension measuring device 1 with micron-level resolution receives two reflected light beams "Lr", "Lr'": one reflected light beam "Lr" caused by the first reflecting surface 950 and a second reflected light beam "Lr'" caused by the second reflecting surface 955.

[0093] Some measurement situations are shown in the diagram Figures 3 to 9 In particular, said figures refer to measurements relating to a non-contact dimensional measuring device 1 with micrometer-scale resolution comprising a slit 30 of substantially circular shape.

[0094] Specifically, Figure 3 、 Figure 3' and Figure 3 A first measurement is shown, wherein object 900, in particular reflecting surface 950 of object 900, is positioned at a distance "d".

[0095] Referring to the first measurement scenario, Figure 7 The outline of projection 500 on imaging sensor 50 is shown. Specifically, the value of the radius of projection 500, designated "R," which is associated with distance "d," is determined by data processing and control component 51 using specially configured image processing algorithms. Thus, the desired value of distance "d" is determined by measuring the radius of projection 500. In other words, the signal generated by imaging sensor 50 is transmitted via a conversion and transmission unit to a processing and control unit, which reconstructs the geometry of projection 500 using a suitable image processing algorithm, thereby determining the radius designated "R."

[0096] Figure 4 、 Figure 4' and Figure 4A second measurement situation is shown, wherein the object 900, in particular the reflective surface 950, is positioned at a distance "d'" (which is different from the distance "d" in the previous figures). Figure 4' and Figure 4 In, such as Figure 3' and Figure 3 The difference between the first and the second measurement situation shown in is indeed significant.

[0097] Figure 5 、 Figure 5' and Figure 5 A third measurement scenario is shown, in which object 900 is a transparent or translucent foil having a thickness "s" between a first reflective surface 950 and a second reflective surface 955. First reflective surface 950 is at a distance "d" from non-contact dimension measurement device 1 with micrometer-level resolution, while second reflective surface 955 is spaced apart from first reflective surface 950 by a thickness "s".

[0098] Referring to the third measurement scenario, Figure 8 The image of projection 500 and auxiliary projection 510 on imaging sensor 50 is shown. Specifically, the value of the distance denoted by "S" between the two projections, which is associated with the thickness "s" of transparent object 900, is determined by data processing and control component 51 using a specially configured image processing algorithm. Therefore, the desired value of thickness "s" is determined by measuring the distance between the two projections. In other words, the signal generated by imaging sensor 50 is sent via a conversion and transmission unit to a processing and control unit, which uses a specially configured image processing algorithm to reconstruct the geometry of projection 500 and auxiliary projection 510 in order to calculate distance "S."

[0099] also, Figure 6 、 Figure 6' and Figure 6 A fourth measurement situation is shown, wherein the object 900 is tilted relative to the axis XX or the object 900 has a reflecting surface 950 tilted relative to the axis XX. In particular, the tilt angle is denoted by the angle "α".

[0100] Referring to the fourth measurement scenario, Figure 9The image of projection 500 obtained on imaging sensor 50 is shown. Processing and control component 51 calculates an offset value "D" by utilizing a specially configured image processing algorithm. Offset value "D" is the difference between the center position of projection 500 obtained when object 900 is tilted at tilt angle "α" and the center position of projection 500 obtained at a null tilt angle (i.e., "α" equal to zero). The desired value of angle "α" is then found by measuring this offset value "D."

[0101] According to a preferred embodiment, the non-contact dimensional measuring device 1 with micrometer resolution comprises a device body 6 extending along an axis XX.

[0102] Preferably, the device body 6 determines the measuring end 60 through which the emission of the emission light beam “Le” occurs, and through which the reception of the reflected light beam “Lr” occurs.

[0103] According to a preferred embodiment, the device body 6 has a radial dimension between 6 mm and 60 mm. Preferably, the device body 6 has a radial dimension between 6 mm and 15 mm. Preferably, the device body 6 has a radial dimension of 8 mm.

[0104] According to a preferred embodiment, the device body 6 has an axially symmetrical shape.

[0105] Preferably, the device body 6 has a cylindrical shape.

[0106] Preferably, the device body 6 has a tapered shape in a region close to the measuring end 60 and widens in a region axially away from said measuring end.

[0107] According to a preferred embodiment, all of the above components are housed in the device body 6 .

[0108] According to a variant embodiment, all the above-mentioned components are housed in the device body 6, except for the processing and control unit 51" which is remotely located relative to the data conversion and transmission unit 51'. In this embodiment, all the above-mentioned components suitable for performing the detection are housed in the device body 6, while the necessary analysis is performed by the remote processing and control unit 51" with the help of specially configured image processing algorithms to achieve the required measurements.

[0109] According to a preferred embodiment, the device body 50 has an axial dimension between 6 mm and 200 mm. According to a preferred embodiment, the axial distance between the light blocking element 3 and the imaging sensor 50 is between 5 mm and 100 mm.

[0110] Innovatively, the non-contact dimensional measurement device and dimensional and / or product shape control system with micron-level resolution according to the present invention achieves the intended objectives to a large extent by resolving the problems encountered in typical prior art solutions.

[0111] Advantageously, the non-contact dimensional measurement device of the present invention with micrometer-level resolution is provided as a replacement for contact or non-contact detection devices within the context of prior art contact or non-contact detection devices.

[0112] Advantageously, a non-contact dimensional measuring device with micrometer-level resolution is suitable for detecting the distance between itself and an object in a simple and reliable manner.

[0113] Advantageously, the contactless dimensional measuring device with micrometer-level resolution is also suitable for detecting other features of an object, such as the inclination of the object and in particular the inclination of a reflective surface of the object, in a simple and reliable manner.

[0114] Advantageously, the non-contact dimension measuring device with micron-level resolution is suitable for detecting the thickness of transparent or semi-transparent objects.

[0115] Advantageously, a non-contact dimensional measuring device with micrometer-level resolution is suitable for wide dissemination and widespread use in the industrial field.

[0116] Advantageously, a large number of dimensional measuring devices with micrometer resolution, which are positioned relative to one another at predetermined locations or moved by a specific movement and scanning system, can be used to verify the size and shape of even low-cost objects, such as glass plates.

[0117] Advantageously, a non-contact dimensional measurement device with micrometer-level resolution has a limited number of components.

[0118] Advantageously, the non-contact dimensional measuring device with micron-level resolution has an extremely compact size. Advantageously, in a preferred embodiment, the light-blocking element and the light source are integrally connected. Advantageously, in a preferred embodiment, the light-blocking element and the optical group are integrally connected.

[0119] Advantageously, in a preferred embodiment, the light blocking element, in addition to performing the function of acting as a barrier for reflecting light, is also adapted to supply power to the light source.

[0120] Obviously, a person skilled in the art may make modifications to the object of the invention, all of which are included in the scope of protection as defined in the following claims to meet possible needs.

Claims

1. A non-contact dimension measuring device (1) with micrometer-level resolution, the non-contact dimension measuring device (1) with micrometer-level resolution being suitable for measuring the distance to an object (900) provided with at least one reflective surface (950), wherein: The non-contact dimensional measurement device (1) with micrometer resolution extends along an axis (XX), and the non-contact dimensional measurement device (1) with micrometer resolution comprises: i) a light source (2) generating an incoherent and diverging emission light beam (Le) towards the object (900) so that the reflecting surface (950) of the object generates a reflected light beam (Lr) in a reflection direction substantially opposite to the emission direction; ii) a light blocking element (3) positioned on the opposite side of the light source (2) with respect to the emission direction, wherein the light blocking element (3) comprises at least one slit (30) which is suitably shaped such that the light blocking element (3) allows only the reflected light beam (Lr) to pass through the slit (30); iii) a detection group (5), said detection group (5) comprising: - an imaging sensor (50) on which a projection (500) of the reflected light beam (Lr) passing through the slit (30) is detected; - a processing and control component (51) operatively connected to the imaging sensor (50) and adapted to analyze the shape and position of the projection (500) to determine the distance and characteristics of the reflecting surface (950) of the object (900).

2. The non-contact dimensional measuring device (1) with micron-level resolution according to claim 1, wherein: The non-contact dimension measuring device (1) with micron-level resolution further comprises an optical group (4) adapted to transmit the reflected light beam (Lr) passing through the slit (30) toward the imaging sensor (50).

3. The non-contact dimensional measuring device (1) with micron-level resolution according to claim 2, wherein: The optical group (4) includes at least one spherical or aspherical lens.

4. The non-contact dimensional measuring device (1) with micron-level resolution according to claim 2, wherein: The optical group (4) comprises a base surface (41) positioned in a position close to the object (900), wherein the light blocking element (3) is positioned on the base surface (41).

5. The non-contact dimensional measuring device (1) with micron-level resolution according to claim 4, wherein: The base surface (41) is flat.

6. The non-contact dimensional measuring device (1) with micrometer-level resolution according to any one of claims 1 to 5, wherein: The light source (2) is positioned on the light blocking element (3), wherein the light blocking element (3) is made of an electrically conductive material and is suitable for supplying electricity to the light source (2).

7. The non-contact dimensional measuring device (1) with micron-level resolution according to claim 6, wherein: The electrically conductive material is a metal.

8. The non-contact dimensional measuring device (1) with micron-level resolution according to claim 4 or 5, wherein: The light blocking element (3) comprises at least one metal film-like material, which is deposited on the base surface (41).

9. The non-contact dimensional measuring device (1) with micron-level resolution according to claim 8, wherein: The metal film-like material is deposited on the base surface (41) through a surface metallization process.

10. The non-contact dimensional measuring device (1) with micrometer-level resolution according to any one of claims 1 to 5, wherein: The slit (30) comprises a first slit edge (31) and a second slit edge (32), wherein the reflected projection (500) has a first projection edge (501) and a second projection edge (502).

11. The non-contact dimensional measuring device (1) with micrometer-level resolution according to any one of claims 1 to 5, wherein: The non-contact dimension measuring device (1) with micrometer-level resolution is suitable for detecting the thickness of a transparent or translucent object (900) having the reflective surface (950) on a first side and a second reflective surface (955) on a second side by detecting the projection (500) caused by the reflective surface (950) and the auxiliary projection (510) caused by the second reflective surface (955) on the imaging sensor (50).

12. The non-contact dimensional measuring device (1) with micron-level resolution according to claim 11, wherein: The reflected auxiliary projection (510) has a first auxiliary projection edge (511) and a second auxiliary projection edge (512).

13. The non-contact dimensional measuring device (1) with micrometer-level resolution according to any one of claims 1 to 5, wherein: The light source (2), the light blocking element (3) and the imaging sensor (50) are positioned centered about the axis (XX), wherein the gap (30) is symmetrically shaped relative to the axis (XX).

14. The non-contact dimensional measuring device (1) with micrometer-level resolution according to any one of claims 1 to 5, wherein: The non-contact dimension measuring device (1) with micrometer-level resolution is suitable for detecting an inclination angle (α) of an object (900) relative to an axis (XX) or an inclination angle (α) of a reflective surface (950) of the object (900) relative to the axis (XX) by detecting a displacement value (D), wherein the displacement value (D) is a difference between a center position of the projection (500) obtained when the object (900) is tilted at the inclination angle (α) and a center position of the projection (500) obtained when the object (900) is tilted at the inclination angle (α).

15. The non-contact dimensional measuring device (1) with micrometer-level resolution according to any one of claims 1 to 5, wherein: The imaging sensor (50) is a CMOS imaging sensor.

16. The non-contact dimensional measuring device (1) with micrometer-level resolution according to any one of claims 1 to 5, wherein: The non-contact dimension measuring device (1) with micron-level resolution comprises a device body (6) extending along the axis (XX) so as to determine a measuring end (60), the emission light beam (Le) being emitted by the measuring end (60), and the reflected light beam (Lr) being received by the measuring end (60).

17. The non-contact dimensional measuring device (1) with micron-level resolution according to claim 16, wherein: The device body (6) has a radial dimension between 6 mm and 60 mm.

18. A size and / or product shape control system adapted to verify the conformity and characteristics of an object (900) provided with a reflective surface (950), wherein: The size and / or product shape control system comprises at least one non-contact size measuring device (1) with micrometer resolution according to any one of claims 1 to 17.

19. The size and / or product shape control system according to claim 18, wherein: The object (900) is a plate-like member or sheet-like member or product made of glass or other transparent or translucent materials.

20. A size and / or product shape control system according to claim 18 or 19, wherein: The size and / or product shape control system comprises a support frame on which a plurality of non-contact size measuring devices (1) with micron-level resolution are positioned to detect a plurality of features of the object (900) at different points simultaneously.

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