A wide-surface end-sealed feeding and placing component

Abstract

The present invention relates to a wide-surface end-sealed feeding and placing component, which comprises an end-sealing plate, a sieve plate and a positioning structure. The sieve plate can be installed on the top of the end-sealing plate through the positioning structure. The sieve plate is provided with a through hole, and the hole wall of the through hole comprises two limiting surfaces arranged relatively along a first direction. The distance between the two limiting surfaces is adapted to the distance between the two end-sealing surfaces of a capacitor body, so that the capacitor body can enter the through hole through vibration and move to the end-sealing surface opposite to the limiting surface. Since the through hole is opposite to a placement groove and a groove wall on one side of the placement groove, and the groove wall is adjacent to the placement groove in the first direction, the capacitor body will be supported by the groove wall. Since the distance of the groove wall protruding from the limiting surface is less than half of the distance between the two limiting surfaces, the groove wall and the limiting surface cooperate to keep the capacitor body in a static state. At this time, when the sieve plate is removed, the capacitor body will be affected by gravity and flip into the placement groove, so as to achieve the effect of quickly and accurately placing the capacitor body and releasing labor.

Description

Technical Field

[0001] The invention relates to the field of chip capacitor production, in particular to a wide-surface sealed feeding and placing component. Background Art

[0002] During the production process of chip capacitors, a sealing machine is required to seal the capacitor body. The capacitor body has two sealing surfaces that are relatively set. The loading requirement of the sealing machine is to lay the capacitor body in the placement groove of the sealing plate, and when the capacitor is laid in the placement groove, the two sealing surfaces are layered. Since the capacitor body is not placed in the placement groove randomly, it is extremely costly to place the capacitor body in an automated way. The existing technology uses manual methods to place the capacitor body in the placement groove, and the labor intensity of the workers is relatively high. Summary of the invention

[0003] The technical problem to be solved by the embodiments of the present invention is to provide a wide-surface sealed feeding and placing assembly to solve the problem in the prior art of placing the capacitor body into the placement groove manually, which results in high labor intensity for workers.

[0004] The wide-surface sealed feeding assembly provided in an embodiment of the present invention comprises: a sealed plate, a placement groove is provided on the sealed plate, the placement groove is used to place the capacitor body, and when the capacitor body is placed in the placement groove, the two sealed end surfaces of the capacitor body are arranged in layers; a sieve plate, a through hole is provided on the sieve plate, the through hole is used for the capacitor body to pass through, the hole wall of the through hole comprises two limiting surfaces arranged opposite to each other along a first direction, the distance between the two limiting surfaces is adapted to the distance between the two sealing surfaces, so that when the capacitor body is accommodated between the two limiting surfaces, the two sealing end surfaces are respectively facing the two limiting surfaces; wherein, the sieve plate is detachably mounted on the top of the sealed plate through a positioning structure, and viewed from the extension direction of the through hole, the through hole is opposite to the placement groove and the groove wall on one side of the placement groove, and the groove wall is adjacent to the placement groove in the first direction, and the distance that the groove wall protrudes from the limiting surface is less than half of the distance between the two limiting surfaces.

[0005] Furthermore, the through hole has a first hole segment and a second hole segment, the second hole segment is located between the first hole segment and the placement groove, the segment wall of the second hole segment has two limiting protrusions arranged opposite to each other along the first direction, so that the outline of the first hole segment is larger than the outline of the second hole segment, and the two limiting surfaces are respectively located on the opposite sides of the two limiting protrusions.

[0006] Furthermore, the first hole segment is a circular hole segment, and when viewed from the extension direction of the through hole, the diameter of the first hole segment matches the length of the diagonal line of the capacitor body.

[0007] Furthermore, the two limiting protrusions each include a guiding inclined surface facing the first hole segment, the guiding inclined surface extends obliquely toward the placement groove, and viewed from the first direction, the two guiding inclined surfaces are cross-arranged.

[0008] Furthermore, the guiding inclined surface is a plane.

[0009] Furthermore, a first limiting frame is provided on the edge of the sieve plate and extends in a direction away from the end sealing plate.

[0010] Furthermore, handles are provided on two opposite sides of the first limiting frame.

[0011] Furthermore, the positioning structure is a positioning frame, and the positioning frame is provided with an end plate accommodating groove on one side in the thickness direction to limit the installation of the end plate, and the bottom of the end plate accommodating groove is provided with a sieve plate accommodating groove that passes through the positioning frame to limit the installation of the sieve plate.

[0012] Furthermore, the positioning frame is also provided with an end plate receiving groove on the other side in the thickness direction, and the sieve plate receiving groove is connected to the groove bottoms of the two end plate receiving grooves.

[0013] Furthermore, a notch is provided on the side wall of the end plate receiving groove, and the notch extends to the bottom of the end plate receiving groove. A groove is provided at the bottom of the end plate receiving groove near the notch, and the groove is connected to the notch.

[0014] Compared with the prior art, the wide-surface sealed feeding and placing assembly provided by the embodiment of the present invention has the following beneficial effects: the wide-surface sealed feeding and placing assembly of the present embodiment is provided with a sealed end plate, a sieve plate and a positioning structure; the sieve plate can be detachably mounted on the top of the sealed end plate through the positioning structure; a through hole is provided on the sieve plate for the capacitor body to pass through; in this way, as long as the capacitor body is placed on the top of the sieve plate, the wide-surface sealed feeding and placing assembly can be vibrated to allow the capacitor body to enter the through hole; since the hole wall of the through hole includes two limiting surfaces arranged opposite to each other along a first direction, and the distance between the two limiting surfaces matches the distance between the two sealed end surfaces of the capacitor body, the capacitor body can be displaced to the two sealed end surfaces of the capacitor body facing the two limiting surfaces respectively under the action of vibration; since the through hole is close to the placement groove and the placement groove when viewed from the extension direction of the through hole, The groove walls on one side of the placement groove are opposite, and the groove walls and the placement groove are arranged adjacent to each other in the first direction, so the capacitor body will be supported by the groove walls and will not fall directly into the placement groove. Because the distance between the groove wall and the limiting surface is less than half of the distance between the two limiting surfaces, less than half of the area of ​​the bottom of the capacitor body is supported on the groove wall. At this time, the groove wall and the limiting surface work together to keep the capacitor body in a balanced force state. Once the screen plate is removed to break the contact relationship between the limiting surface and the capacitor body, the balanced state will be broken. At this time, the capacitor body will be affected by gravity and flipped into the placement groove, and the two end sealing surfaces of the capacitor body after flipping into the placement groove are arranged in layers. Therefore, the wide-surface end sealing feeding and placing assembly provided by the embodiment of the present invention can quickly and accurately place the capacitor body, releasing labor. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The specific implementation of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments, in which:

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the capacitor body;

[0017] Figure 2 It is a schematic diagram of the three-dimensional structure of the wide-surface end-sealing feeding and placing assembly provided in an embodiment of the present invention in a combined state;

[0018] Figure 3 It is an exploded view of a wide-surface end-sealed feeding and placing assembly provided by an embodiment of the present invention;

[0019] Figure 4 yes Figure 2 A top view of the wide-side sealed feeding and placing assembly shown;

[0020] Figure 5 yes Figure 4 A partial enlarged schematic diagram of the position A in the middle;

[0021] Figure 6 It is a schematic diagram of a wide-surface end-sealing feeding and placing assembly provided by an embodiment of the present invention;

[0022] Figure 7 is a cross-sectional view of a through hole provided by an embodiment of the present invention;

[0023] Figure 8 yes Figure 2 A partial enlarged schematic diagram of position B in the middle;

[0024] Fig. 9 yes Figure 2 A schematic diagram of the three-dimensional structure of the wide-surface sealed feeding and placing assembly from another angle;

[0025] Fig.10 yes Fig. 9 A partial enlarged schematic diagram of the middle C position;

[0026] Fig.11 yes Figure 3 A schematic diagram of the three-dimensional structure of the wide-surface sealed feeding and placing assembly from another angle;

[0027] Fig.12 yes Figure 2 A side view of the wide-side sealed feed and placement assembly is shown.

[0028] The reference numerals in the figures are:

[0029] 1000, wide end sealing feeding and placing component;

[0030] 100, end plate; 110, placement slot; 111, slot wall; 120, surface adhesive;

[0031] 200, sieve plate; 210, through hole; 211, limiting surface; 212, first hole section; 213, second hole section; 2131, limiting protrusion; 21311, guiding inclined surface; 220, first limiting frame; 221, handle; 2211, grip;

[0032] 300, positioning structure; 310, positioning frame; 311, end plate receiving groove; 3111, notch; 3112, groove; 312, sieve plate receiving groove;

[0033] 2000, capacitor body; 2100, end sealing surface. DETAILED DESCRIPTION

[0034] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. Now, in conjunction with the accompanying drawings, the preferred embodiments of the present invention are described in detail.

[0035] refer to Figure 1-Figure 6In the production process of the chip capacitor, a sealing machine is required to perform a sealing operation on the capacitor body 2000. Specifically, the capacitor body 2000 is placed in the placement groove 110 of the sealing plate 100. Here, when the capacitor body 2000 is correctly placed in the placement groove 110, the two layers of the capacitor body 2000 are defined as sealing surfaces 2100. The sealing machine is mainly used to perform a silver gluing operation on the sealing surface 2100. Specifically, the sealing surface 2100 at the bottom is first fixed with the resurfacing glue 120, and then the other exposed sealing surface 2100 is first silver-glued, and then the resurfacing glue 120 is used to stick the silver-glued sealing surface 2100, and then the resurfacing glue 120 on the side of the sealing surface 2100 without silver is torn off to expose the sealing surface 2100 without silver, and then the silver gluing operation is performed on the sealing surface 2100 without silver. Since the capacitor body 2000 is not randomly placed in the placement groove 110, in order to ensure successful silver bonding, the two end sealing surfaces 2100 must be arranged in layers when the capacitor body 2000 is placed in the placement groove 110. This results in extremely high costs for placing the capacitor body 2000 in an automated manner. Not only is a shooting mechanism required to identify the position state of the capacitor body 2000, but a flipping mechanism is also required to flip the capacitor body 2000 to the point where the two end sealing surfaces 2100 are arranged in layers. A transport mechanism is also required to transport the capacitor body 2000 to the placement groove 110. The cost is so high that the prior art uses manual methods to place the capacitor body 2000 in the placement groove 110, but this method is very inefficient and the labor intensity of workers is also relatively high.

[0036] In order to solve the above problems, the embodiment of the present invention provides a wide-surface end-sealed feeding and placing assembly 1000, such as Figure 1-6 As shown, the wide-surface end-sealed feeding assembly 1000 includes an end-sealing plate 100, a sieve plate 200 and a positioning structure 300. The end-sealing plate 100 is provided with a placement groove 110, and the placement groove 110 is used to place the capacitor body 2000, and when the capacitor body 2000 is placed in the placement groove 110, the two end-sealing surfaces 2100 of the capacitor body 2000 are arranged in layers. The sieve plate 200 is provided with a through hole 210, and the through hole 210 is used for the capacitor body 2000 to pass through, and the hole wall of the through hole 210 includes a first direction ( Figure 5 The two limiting surfaces 211 are arranged opposite to each other (in the X direction in the middle), and the distance between the two limiting surfaces 211 matches the distance between the two end-sealing surfaces 2100, so that when the capacitor body 2000 is accommodated between the two limiting surfaces 211, the two end-sealing surfaces 2100 face the two limiting surfaces 211 respectively. The sieve plate 200 is detachably mounted on the top of the end-sealing plate 100 through the positioning structure 300, and the sieve plate 200 extends from the through hole 210 in the extending direction ( Figure 3The through hole 210 is opposite to the placement groove 110 and the groove wall 111 on one side of the placement groove 110, and the groove wall 111 and the placement groove 110 are adjacently arranged in the first direction, and the distance of the groove wall 111 protruding from the limiting surface 211 is less than half of the distance between the two limiting surfaces 211.

[0037] The operating principle of the wide-surface sealed feeding and placing component 1000 of the present embodiment is as follows: first, the sieve plate 200 is installed on the top of the sealing plate 100 using the positioning structure 300, and then some capacitor bodies 2000 are placed on the sieve plate 200, and then an external vibration generating device is used to vibrate the wide-surface sealed feeding and placing component 1000, and the capacitor bodies 2000 will enter the through holes 210 on the sieve plate 200 under the action of vibration. Since the hole wall of the through hole 210 includes two limiting surfaces 211 arranged opposite to each other along a first direction, and the distance between the two limiting surfaces 211 is adapted to the distance between the two sealing surfaces 2100 of the capacitor body 2000, the capacitor body 2000 can be displaced to the two sealing surfaces 2100 of the capacitor body 2000 under the action of vibration, respectively facing the two limiting surfaces 211. Since the through hole 210 is opposite to the placement groove 110 and the groove wall 111 on one side of the placement groove 110 when viewed from the extension direction of the through hole 210, and the groove wall 111 opposite to the through hole 210 and the placement groove 110 are arranged adjacent to each other in the first direction, the bottom of the capacitor body 2000 will be against the groove wall 111, that is, the capacitor body 2000 will be supported by the groove wall 111 and will not fall directly into the placement groove 110. Since the distance of the groove wall 111 protruding from the limiting surface 211 is less than half of the distance between the two limiting surfaces 211, less than half of the area of ​​the bottom of the capacitor body 2000 is supported by the groove wall 111, that is, the groove wall 111 and the limiting surface 211 can cooperate with each other to make the capacitor body 2000 balanced and keep in a static state. Figure 6 For schematic diagram, refer to Figure 6 Once the sieve plate 200 is removed, the limiting surface 211 and the capacitor body 2000 will lose contact, and the equilibrium state will be broken. At this time, the capacitor body 2000 will be affected by gravity and flip into the placement groove 110, and the two sealed end surfaces 2100 of the capacitor body 2000 after flipping into the placement groove 110 are arranged in layers.

[0038] It can be seen that the wide-face sealed feeding and placing assembly 1000 of the present embodiment can quickly and accurately place the capacitor body 2000 into the placing groove 110 of the sealing plate 100, thereby releasing labor. Preferably, a vibration generating device is used to vibrate the wide-face sealed feeding and placing assembly 1000, so that the capacitor body 2000 can be vibrated relatively quickly until the two sealing surfaces 2100 of the capacitor body 2000 are respectively facing the two limiting surfaces 211. Optionally, manually shaking the wide-face sealed feeding and placing assembly 1000 can also cause the capacitor body 2000 to move to the two sealing surfaces 2100 facing the two limiting surfaces 211, but compared with the vibration generating device, the efficiency is lower and a certain amount of labor is also consumed.

[0039] It should be noted that this embodiment is applicable to wide-side end-capping, which is different from ordinary end-capping. Figure 1 , Figure 1 What is shown is the wide end capping. If the two sides of the end capping surface 2100 are defined as the thickness direction and the width direction, then Figure 1 The thickness of the capacitor body shown is greater than the width and length, and the end-sealing surface has the largest area among the three surfaces of the capacitor body. For ordinary end-sealing, if the two sides of the end-sealing surface are defined as the thickness direction and the width direction, then the length of the capacitor body is greater than the width and thickness, and the end-sealing surface is the smallest among the three surfaces of the capacitor body. The wide-surface end-sealing feeding and placing assembly of this embodiment can quickly and accurately place the capacitor body. Figure 1 The capacitor body on the left.

[0040] refer to Figure 5 , Figure 7 In a specific embodiment, the through hole 210 has a first hole segment 212 and a second hole segment 213. The second hole segment 213 is located between the first hole segment 212 and the placement groove 110. The segment wall of the second hole segment 213 has two limiting protrusions 2131 arranged opposite to each other along the first direction, so that the contour of the first hole segment 212 is larger than the contour of the second hole segment 213. The two limiting surfaces 211 are respectively located on the opposite sides of the two limiting protrusions 2131.

[0041] In this embodiment, the through hole 210 is divided into a first hole section 212 arranged farther away from the placement groove 110, and a second hole section 213 arranged closer to the placement groove 110, and two limiting protrusions 2131 arranged opposite to each other along the first direction are provided on the section wall of the second hole section 213. The above-mentioned two limiting surfaces 211 respectively refer to the opposite sides of the two limiting protrusions 2131. By implementing this embodiment, since two limiting protrusions 2131 are provided on the wall of the second hole segment 213, the contour of the first hole segment 212 is larger than that of the second hole segment 213, so that the capacitor body 2000 can enter the through hole 210 more quickly under the action of vibration. Restricted by the wall of the first hole segment 212, the moving range of the capacitor body 2000 will be reduced after entering the first hole segment 212, so it is also easier to enter the second hole segment 213 from the first hole segment 212 through vibration, and finally move to the two end sealing surfaces 2100 of the capacitor body 2000 facing the two limiting surfaces 211 respectively, and the bottom of the capacitor body 2000 is against the groove wall.

[0042] refer to Figure 5 , Figure 7 In a specific embodiment, the first hole segment 212 is a circular hole segment. When viewed from the extension direction of the through hole 210 , the diameter of the first hole segment 212 matches the length of the diagonal line of the capacitor body 2000 .

[0043] It should be noted that when the sealing surface 2100 of the capacitor body 2000 is opposite to the hole wall of the through hole 210, the capacitor body 2000 is in an upright state. At this time, the diagonal line seen from the extension direction of the through hole 210 is the diagonal line referred to in this embodiment.

[0044] Specifically, since the capacitor body 2000 is in an upright state when it moves to the two end-sealing surfaces 2100 facing the two limiting surfaces 211 respectively, if the capacitor body 2000 can maintain an upright state when entering the first hole segment 212, it can be easily moved to the second hole segment 213 by vibration, so that the capacitor body 2000 can be moved between the two limiting surfaces 211 more quickly. In order to achieve this technical effect, in this embodiment, the first hole segment 212 is set as a circular hole segment, and the diameter of the first hole segment 212 is set to match the length of the diagonal line of the capacitor body 2000, so that the capacitor body 2000 enters the first hole segment 212 in an upright state.

[0045] refer to Figure 7-Figure 10 In a specific embodiment, the two limiting protrusions 2131 each include a guiding slope 21311 toward the first hole section 212, the guiding slope 21311 extends obliquely toward the placement groove 110, and viewed from the first direction, the two guiding slopes 21311 are cross-arranged.

[0046] By implementing this embodiment, after the capacitor body 2000 enters the first hole section 212 in an upright state, the bottom of the capacitor body 2000 will abut against the two guiding slopes 21311. Since the guiding slopes 21311 extend obliquely toward the placement groove 110, the capacitor body 2000 will rotate under the action of vibration and gradually go deeper into the second hole section 213 along the guiding slopes 21311 until the bottom of the capacitor body 2000 is separated from the guiding slopes 21311 and abuts against the groove wall. It can be seen that the guiding slopes 21311 can guide the capacitor body 2000 to go deeper into the second hole section 213, achieving the technical effect of moving the capacitor body 2000 between the two limiting surfaces 211 more quickly.

[0047] refer to Figure 7-Figure 10 In the specific embodiment, both guiding slopes 21311 are planes. Compared with the guiding slopes 21311 with curved surfaces, the guiding slopes 21311 of this embodiment can provide a more consistent guiding effect in the process of the capacitor body 2000 gradually penetrating into the second hole section 213. Of course, it is understandable that the guiding slopes 21311 can also be set as curved surfaces.

[0048] refer to Figure 7-Figure 10 In one embodiment, the guide slope 21311 extends to one end of the through hole 210 close to the groove wall, so that the guide slope 21311 is more inclined, so that the capacitor body 2000 can penetrate into the second hole segment 213 more quickly along the guide slope 21311 under the action of vibration, thereby achieving the technical effect of moving the capacitor body 2000 between the two limiting surfaces 211 more quickly.

[0049] refer to Figure 3 In one embodiment, a first limiting frame 220 extending away from the end sealing plate 100 is provided at the edge of the sieve plate 200 .

[0050] Specifically, since the capacitor body 2000 moves under the action of vibration, the capacitor body 2000 can easily detach from the edge of the sieve plate 200 under the action of vibration. In order to solve this technical problem, the first limiting frame 220 is provided at the edge of the sieve plate 200 in this embodiment, and the first limiting frame 220 extends in a direction away from the end plate 100. After the first limiting frame 220 is provided, when the capacitor body 2000 moves to the edge of the sieve plate 200 under the action of vibration, it will be blocked by the first limiting frame 220, so that the capacitor body 2000 cannot detach from the sieve plate 200.

[0051] refer to Figure 3 In a specific embodiment, the extension direction of the first limiting frame 220 is consistent with the opening direction of the through hole 210.

[0052] Specifically, the first limit frame 220 is enclosed on one side away from the end plate 100 to form a feeding port, and the capacitor body 2000 is placed on the screen plate 200 through this feeding port. The larger the feeding port, the simpler the feeding, and the first limit frame 220 blocks the field of vision less, and the real-time state of the capacitor body 2000 can be better observed. For example, the outline of the first limit frame 220 gradually increases from the side close to the end plate 100; the smaller the feeding port, the more difficult the feeding, and the first limit frame 220 blocks the field of vision more, and it is more difficult to observe the real-time state of the capacitor body 2000, for example, the outline of the first limit frame 220 gradually shrinks from the side close to the end plate 100. Through this embodiment, the extension direction of the first limit frame 220 is consistent with the opening direction of the through hole 210, so that the feeding port can be maximized without increasing the projection area.

[0053] refer to Figure 3 In a specific embodiment, handles 221 are provided on opposite sides of the first limit frame 220, so that it is convenient to carry the screen plate 200. There are many specific embodiments of the handle 221, and two embodiments are listed below for reference, and those skilled in the art can make adaptive settings for this.

[0054] refer to Figure 3 In the first embodiment, a handle 2211 is provided on the side of the first limit frame 220 away from the end plate 100, and the user can hold the two handles 2211 to carry the sieve plate 200. The handle 2211 can be a columnar protrusion or a Figure 3 The conical protrusion shown in the figure can also be a protrusion of other shapes, as long as the user can hold the handle 2211 to carry the screen plate 200. In order to prevent slipping, anti-skid stripes can also be processed on the periphery of the handle 2211, or a silicone pad can be set on the periphery of the handle 2211.

[0055] In the second embodiment, hand grip grooves are provided on two opposite outer sides of the first limit frame 220 , so that the user can use the hand grip grooves to carry the sieve plate 200 .

[0056] refer to Figure 3 In one embodiment, the positioning structure 300 is a component independent of the sieve plate 200. The positioning structure 300 is a positioning frame 310. The positioning frame 310 is provided in the thickness direction ( Figure 3 An end plate accommodating groove 311 is provided on one side (in the Y direction) to limit the installation of the end plate 100, and a sieve plate accommodating groove 312 penetrating the positioning frame 310 is provided at the bottom of the end plate accommodating groove 311 to limit the installation of the sieve plate 200.

[0057] By implementing this embodiment, the end sealing plate 100 is installed in the end sealing plate receiving groove 311, and the sieve plate 200 is installed in the sieve plate receiving groove 312, so that the relative positions of the end sealing plate 100 and the sieve plate 200 can be fixed. At this time, viewed from the extension direction of the through hole 210, the through hole 210 is opposite to the placement groove 110 and the groove wall 111 on one side of the placement groove 110, and the groove wall 111 and the placement groove 110 are adjacently arranged in the first direction, and the distance of the groove wall 111 protruding from the limiting surface 211 is less than half of the distance between the two limiting surfaces 211.

[0058] Optionally, the positioning structure 300 is formed on the sieve plate 200 , and the edge of the sieve plate 200 is provided with a second limiting frame extending in the extension direction of the through hole 210 , and the second limiting frame encloses a containing space to limit the installation of the end plate 100 .

[0059] refer to Fig.11 In a specific embodiment, a sealing plate receiving groove 311 is also provided on the other side of the positioning frame 310 in the thickness direction, and the sieve plate receiving groove 312 is connected to the bottom of the two sealing plate receiving grooves 311 .

[0060] Specifically, in this embodiment, end plate accommodating grooves 311 are provided on both sides of the positioning frame 310 in the thickness direction. The advantage of this arrangement is that workers do not need to distinguish between the front and back sides when using the positioning frame 310, which improves efficiency to a certain extent and releases labor to a certain extent.

[0061] refer to Fig.11 , Fig.12 In a specific embodiment, a notch 3111 is provided on the side wall of the end plate accommodating groove 311, and the notch 3111 extends to the bottom of the end plate accommodating groove 311. A groove 3112 is provided at the bottom of the end plate accommodating groove 311 near the notch 3111, and the groove 3112 is connected to the notch 3111.

[0062] Specifically, the end plate 100 is not easy to be separated from the end plate receiving groove 311. In this embodiment, a groove 3112 is provided at the bottom of the end plate receiving groove 311, so that an air-avoiding space is formed at the bottom of the end plate 100, and a notch 3111 is provided on the side wall of the end plate receiving groove 311, and the notch 3111 extends to the bottom of the end plate receiving groove 311 and communicates with the groove 3112, so the notch 3111 and the air-avoiding space can be used to apply force to the end plate 100, so that the end plate 100 can be more easily separated from the end plate receiving groove 311.

[0063] refer to Fig.11 , Fig.12In a specific embodiment, the notch 3111 and the groove 3112 are disposed on opposite sides of the positioning frame 310. In this way, the end plate 100 can be jointly exerted with force from both sides of the end plate 100, so that the end plate 100 can be more easily separated from the end plate receiving groove 311.

[0064] In one embodiment, a first chamfer is provided at the notch of the end plate receiving groove 311, and the first chamfer can play a guiding role when the end plate 100 enters the end plate receiving groove 311, so as to achieve the technical effect of installing the end plate 100 more simply and quickly.

[0065] In another embodiment, a second chamfer is provided at the notch of the sieve plate receiving groove 312, or a second chamfer is provided at the edge of the bottom of the sieve plate 200. The second chamfer can guide the sieve plate 200 when it enters the sieve plate receiving groove 312, so as to achieve the technical effect of installing the sieve plate 200 more simply and quickly.

[0066] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. For those skilled in the art, the technical solutions described in the above embodiments can be modified, or some of the technical features therein can be replaced by equivalents; and all these modifications and replacements should fall within the protection scope of the claims attached to the present invention.

Claims

1. A wide-surface end-sealed feeding and placing assembly, characterized in that: include: An end sealing plate, wherein a placement groove is provided on the end sealing plate, wherein the placement groove is used to place the capacitor body, and when the capacitor body is placed in the placement groove, two end sealing surfaces of the capacitor body are arranged in layers; A sieve plate, wherein a through hole is provided on the sieve plate, wherein the through hole is used for the capacitor body to pass through, wherein the hole wall of the through hole comprises two limiting surfaces arranged opposite to each other along a first direction, wherein the distance between the two limiting surfaces matches the distance between the two end-sealing surfaces, so that when the capacitor body is accommodated between the two limiting surfaces, the two end-sealing surfaces face the two limiting surfaces respectively; Among them, the sieve plate is detachably mounted on the top of the end sealing plate through a positioning structure. Viewed from the extension direction of the through hole, the through hole is opposite to the placement groove and the groove wall on one side of the placement groove, and the groove wall and the placement groove are adjacently arranged in the first direction, and the distance that the groove wall protrudes from the limit surface is less than half of the distance between the two limit surfaces.

2. The wide-surface end-sealed feeding and placing assembly according to claim 1, characterized in that: The through hole has a first hole segment and a second hole segment, the second hole segment is located between the first hole segment and the placement groove, the segment wall of the second hole segment has two limiting protrusions arranged opposite to each other along the first direction, so that the outline of the first hole segment is larger than the outline of the second hole segment, and the two limiting surfaces are respectively located on the opposite sides of the two limiting protrusions.

3. The wide-surface end-sealed feeding and placing assembly according to claim 2, characterized in that: The first hole segment is a circular hole segment. When viewed from the extension direction of the through hole, the diameter of the first hole segment matches the length of the diagonal line of the capacitor body.

4. The wide-surface end-sealed feeding and placing assembly according to claim 3, characterized in that: The two limiting protrusions each include a guiding inclined surface facing the first hole segment, the guiding inclined surface extends obliquely toward the placement groove, and viewed from the first direction, the two guiding inclined surfaces are cross-arranged.

5. The wide-surface end-sealed feeding and placing assembly according to claim 4, characterized in that: The guiding inclined surface is a plane.

6. The wide-surface end-sealed feeding and placing assembly according to claim 1, characterized in that: The edge of the sieve plate is provided with a first limiting frame extending in a direction away from the end sealing plate.

7. The wide-surface end-sealed feeding and placing assembly according to claim 6, characterized in that: Handles are provided on two opposite sides of the first limiting frame.

8. The wide-surface end-sealing feeding and placing assembly according to any one of claims 1 to 7, characterized in that: The positioning structure is a positioning frame, and the positioning frame is provided with an end plate accommodating groove on one side in the thickness direction to limit the installation of the end plate, and the bottom of the end plate accommodating groove is provided with a sieve plate accommodating groove that passes through the positioning frame to limit the installation of the sieve plate.

9. The wide-surface end-sealed feeding and placing assembly according to claim 8, characterized in that: The positioning frame is also provided with an end plate receiving groove on the other side in the thickness direction, and the sieve plate receiving groove is connected to the groove bottoms of the two end plate receiving grooves.

10. The wide-surface end-sealed feeding and placing assembly according to claim 8, characterized in that: A notch is provided on the side wall of the end plate receiving groove, and the notch extends to the bottom of the end plate receiving groove. A groove is provided at the bottom of the end plate receiving groove near the notch, and the groove is connected to the notch.

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