Mass transfer device and mass transfer method

Abstract

A mass transfer device and a mass transfer method, the mass transfer device includes: a carrying platform, a first adjustment component and a second adjustment component, the carrying platform is used to place a growth substrate and a transient substrate that are arranged opposite to each other, and the growth substrate and the transient substrate are both perpendicular to the carrying platform. The first adjustment component is located on the side of the growth substrate facing away from the transient substrate, and pushes the growth substrate to move toward the transient substrate, and the second adjustment component is located on the side of the transient substrate facing away from the growth substrate, and pushes the transient substrate to move toward the growth substrate. By arranging the first adjustment component and the second adjustment component in the mass transfer device to push the growth substrate and the transient substrate to move relative to each other, since the first adjustment component and the second adjustment component can maintain the stability of the moving path during the movement, so that the growth substrate and the transient substrate always maintain a facing state, the purpose of precise alignment during bonding is achieved, and the operation is simple and quick, which is conducive to improving product yield and mass transfer efficiency.

Description

Technical Field

[0001] The present invention relates to the field of mass transfer technology, and in particular to a mass transfer device and a mass transfer method. Background Art

[0002] Micro LED display technology is a technology that integrates traditional LEDs into micron-level spacing LED arrays to achieve ultra-high resolution display effects. Micro-LED has the characteristics of self-luminescence. Compared with OLED and LCD displays, Micro-LED colors are easier to accurately adjust, have longer luminous life, higher brightness and contrast, and are thinner and more energy-saving. Due to its high density, small size, and ultra-high pixel characteristics, Micro-LED will become the most promising new generation of revolutionary display technology in the future.

[0003] Currently, the biggest process bottleneck in Micro-LED is the mass transfer link. In the mass transfer process, WB (Wafer Bonding) is a key process, which refers to the process of bonding the Micro LED growth substrate to the temporary board through adhesive, and then transferring the Micro LED chip from the growth substrate to the temporary board through the laser stripping process. In this process, manual bonding is currently usually used. In the process of manually bringing the two substrates closer together, it is difficult to keep both hands stable, so there will be a slight angle deviation. However, due to the characteristics of Micro LED chips such as dense arrangement and small size, this angle deviation will cause the laser scanning trajectory in the subsequent laser stripping process to be inconsistent with the chip arrangement, causing subsequent process difficulties and yield loss. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the prior art, the purpose of the present application is to provide a mass transfer device and a mass transfer method, which can achieve precise alignment between substrates, improve product yield, and are simple and quick to operate.

[0005] The present application provides a mass transfer device, comprising:

[0006] A carrying platform, the carrying platform is used to place a growth substrate and a temporary substrate; wherein the first surface of the growth substrate provided with a chip placed on the carrying platform and the second surface of the temporary substrate provided with a bonding layer are directly opposite, and the growth substrate and the temporary substrate are both perpendicular to the carrying platform; and

[0007] a first adjusting component and a second adjusting component, wherein the first adjusting component and the second adjusting component are both arranged on the carrying platform, the first adjusting component is located on a side of the growth substrate facing away from the temporary substrate, and the second adjusting component is located on a side of the temporary substrate facing away from the growth substrate;

[0008] The first adjustment component is used to connect with the growth substrate and push the growth substrate to move toward the temporary substrate so that the chip and the bonding layer are connected;

[0009] and / or,

[0010] The second adjusting component is used to be connected to the temporary substrate and push the temporary substrate to move toward the growth substrate so as to connect the chip and the bonding adhesive layer.

[0011] By setting the first adjustment component and the second adjustment component in the mass transfer device, and the first adjustment component and the second adjustment component drive the growth substrate and the transient substrate to move relative to each other so that the chip and the bonding layer are connected, the first adjustment component and the second adjustment component can maintain the stability of the moving path during the movement, so that the first surface and the second surface always remain in a facing state, so as to achieve the purpose of precise alignment during bonding, and the operation is simple and quick, which is conducive to improving product yield and mass transfer efficiency.

[0012] In one embodiment, the first adjustment component includes a first bracket and a first push rod, the first bracket is fixed on the bearing platform, the first push rod is slidably connected to the first bracket, the first bracket is located on the side of the growth substrate facing away from the transient substrate, and the first push rod is used to connect with the growth substrate and push the growth substrate to move toward the transient substrate. By setting the first push rod in the first adjustment component, the position of the growth substrate can be adjusted by pushing the first push rod; at the same time, by setting the first bracket, the support and guiding effect of the first push rod can be achieved, so that the first push rod moves along a fixed path, avoiding angular deviation of the growth substrate during movement.

[0013] In one embodiment, the second adjustment component includes a second bracket and a second push rod, the second bracket is fixed to the bearing platform, the second push rod is slidably connected to the second bracket, the second bracket is located on the side of the temporary substrate facing away from the growth substrate, and the second push rod is used to connect with the temporary substrate and push the temporary substrate to move toward the growth substrate. By setting the second push rod in the second adjustment component, the position of the temporary substrate can be adjusted by pushing the second push rod; at the same time, by setting the second bracket, the support and guiding effect of the second push rod can be achieved, so that the push rod moves along a preset path, avoiding angular deviation of the temporary substrate during movement.

[0014] In one embodiment, a suction cup is provided at one end of the first push rod close to the growth substrate, and the suction cup is used to adsorb the growth substrate. By providing the suction cup at the end of the first push rod, the adsorption and fixing of the growth substrate can be achieved by vacuuming the suction cup, which is simple and quick to operate and helps to improve the efficiency of mass transfer.

[0015] In one embodiment, the mass transfer device further includes a first drive assembly, the first drive assembly is one, the first drive assembly is connected to the first push rod or the second push rod, and the first drive assembly drives the first push rod or the second push rod to move;

[0016] Alternatively, there are two first drive assemblies, one of which is connected to the first push rod and drives the first push rod to move, and the other of which is connected to the second push rod and drives the second push rod to move. By arranging the first drive assembly to drive the first push rod and the second push rod to move, compared with the manual push transfer method, the degree of automation is higher, which is conducive to improving the efficiency of mass transfer.

[0017] In one embodiment, the growth substrate includes a first side surface, the first side surface is vertically connected to the first surface, the transient substrate includes a second side surface, the second side surface is vertically connected to the second surface, the first side surface and the second side surface are both planes, and the first side surface and the second side surface are both placed on the carrying platform. By making the first side surface and the second side surface fit the carrying platform, since the first side surface and the second side surface are both planes, it is beneficial to keep the growth substrate and the transient substrate in a vertical state with the carrying platform without tilting, which is beneficial to achieve precise alignment of the growth substrate and the transient substrate.

[0018] In one embodiment, the mass transfer device further includes a first positioning fixture and a second positioning fixture, the first positioning fixture and the second positioning fixture are arranged in parallel and spaced apart on the carrier platform, the first positioning fixture is used to adjust the position of the growth substrate on the carrier platform, and the second positioning fixture is used to adjust the position of the transient substrate on the carrier platform so that the first surface is directly opposite to the second surface. By providing the first positioning fixture and the second positioning fixture in the mass transfer device, the purpose of adjusting the position of the growth substrate and the transient substrate can be achieved by simply adjusting the positions of the first positioning fixture and the second positioning fixture. Compared with the manual adjustment method, this adjustment method makes the alignment between the growth substrate and the transient substrate more precise, which is conducive to improving the product yield.

[0019] In one embodiment, the bearing platform includes a supporting surface, the growth substrate and the transient substrate are arranged on the supporting surface, the supporting surface is provided with a first slide groove and a second slide groove arranged in parallel and spaced apart, the first positioning fixture is arranged in the first slide groove and moves along the first slide groove, and the second positioning fixture is arranged in the second slide groove and moves along the second slide groove. By arranging the first slide groove and the second slide groove structure on the bearing platform, the limiting effect of the first positioning fixture and the second positioning fixture is achieved, and the position displacement of the first positioning fixture and the second positioning fixture during the movement is avoided.

[0020] In one embodiment, the first positioning fixture is provided with a first clamping portion, the second positioning fixture is provided with a second clamping portion, the growth substrate is fixed to the first positioning fixture via the first clamping portion, and the transient substrate is fixed to the second positioning fixture via the second clamping portion. By providing the first clamping portion on the first positioning fixture and the second clamping portion on the second positioning fixture, the growth substrate and the first positioning fixture, as well as the transient substrate and the second positioning fixture, are connected and fixed by clamping, which makes assembly and disassembly more convenient.

[0021] In one embodiment, the mass transfer device further includes a second drive assembly, which is connected to the first positioning fixture and the second positioning fixture and drives the first positioning fixture and the second positioning fixture to move. By setting the second drive assembly to drive the first positioning fixture and the second positioning fixture to move, the first positioning fixture and the second positioning fixture can be quickly adjusted to a preset position, which is conducive to improving the transfer efficiency.

[0022] In one embodiment, the mass transfer device further includes a controller, the controller is electrically connected to the first drive assembly, and the controller controls the first drive assembly to drive the first push rod and / or the second push rod to move. By setting the controller in the mass transfer device, the relative position of the growth substrate and the transient substrate can be accurately controlled by setting the parameters of the controller. Compared with manual operation, the degree of automation and accuracy are higher, which is conducive to improving mass transfer efficiency and product yield.

[0023] Based on the same inventive concept, the present application also provides a mass transfer method, which uses a mass transfer device to transfer chips on a growth substrate to a transient substrate, wherein the mass transfer device includes a carrying platform, a first adjustment component and a second adjustment component, and the mass transfer method includes:

[0024] Placing the growth substrate and the temporary substrate on the carrying platform, and making the first surface of the growth substrate provided with the chip and the second surface of the temporary substrate provided with the bonding adhesive face each other, and making the growth substrate and the temporary substrate both be arranged vertically to the carrying platform;

[0025] Connecting the first adjusting component to the growth substrate, and pushing the growth substrate toward the temporary substrate until the chip is connected to the bonding adhesive;

[0026] and / or,

[0027] The second regulating component is connected to the temporary substrate, and the temporary substrate is pushed to move toward the growth substrate until the chip is connected to the bonding adhesive layer.

[0028] By adopting the mass transfer method provided in the present application, the first adjustment component and the second adjustment component drive the growth substrate and the temporary substrate to move relative to each other so that the chip and the bonding layer are connected. The first adjustment component and the second adjustment component can maintain the stability of the movement path during the movement, so that the growth substrate and the temporary substrate always remain in a facing state, so as to achieve the purpose of precise alignment during bonding. The operation is simple and quick, which is conducive to improving product yield and mass transfer efficiency.

[0029] In one embodiment, the growth substrate includes a first side surface, the first side surface is vertically connected to the first surface, the transient substrate includes a second side surface, the second side surface is vertically connected to the second surface, the first side surface and the second side surface are both planes, and the mass transfer method further includes: placing the first side surface and the second side surface on the supporting platform.

[0030] In one embodiment, the first adjustment component includes a first push rod, and the mass transfer method further includes: connecting the first push rod to the growth substrate and pushing the growth substrate to move toward the temporary substrate.

[0031] In one embodiment, the second adjustment component includes a second push rod, and the mass transfer method further includes: connecting the second push rod to the temporary substrate and pushing the temporary substrate to move toward the growth substrate.

[0032] In one embodiment, the mass transfer device further includes a controller and a first drive assembly, and the mass transfer method further includes:

[0033] Setting parameters of the controller;

[0034] The first driving assembly is started, and the controller controls the first driving assembly to drive the first push rod and / or the second push rod to move according to set parameters.

[0035] In one embodiment, the mass transfer device further includes a second driving assembly, a first positioning fixture, and a second positioning fixture, and the mass transfer method further includes:

[0036] The first positioning fixture and the second positioning fixture are arranged on the carrying platform;

[0037] Starting the second driving assembly, the second driving assembly pushes the first positioning fixture and the second positioning fixture to move to a preset position;

[0038] The growth substrate is clamped to the first positioning fixture, and the temporary substrate is clamped to the second positioning fixture.

[0039] In one embodiment, the mass transfer method further includes:

[0040] The second driving component is started to drive the first positioning fixture and the second positioning fixture to move, so that the first positioning fixture is separated from the growth substrate, and the second positioning fixture is separated from the temporary substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 A front view of a mass transfer device according to an embodiment;

[0042] Figure 2 A top view of a mass transfer device according to an embodiment;

[0043] Figure 3 for Figure 2 A cross-sectional view of the mass transfer device along the AA direction;

[0044] Figure 4 A flowchart of a mass transfer method according to an embodiment;

[0045] Figure 5 A front view of a mass transfer device according to another embodiment;

[0046] Figure 6 A front view of a mass transfer device according to another embodiment;

[0047] Figure 7 A front view of a mass transfer device according to another embodiment;

[0048] Figure 8 The figure is a schematic diagram of the installation structure of a growth substrate according to an embodiment.

[0049] Description of reference numerals:

[0050] 10-carrying platform; 11-first slide groove; 111-first surface; 112-second surface; 12-second slide groove; 13-support surface;

[0051] 20-growth substrate; 21-first side; 30-temporary substrate;

[0052] 41-first adjustment assembly; 411-first bracket; 412-first push rod; 413-first sliding portion; 414-first connecting portion; 415-suction cup;

[0053] 42-second adjustment assembly; 421-second bracket; 422-second push rod; 423-second sliding portion; 424-second connecting portion;

[0054] 51-first driving assembly; 52-second driving assembly; 521-driving member; 522-connecting member;

[0055] 61-first positioning fixture; 610-first clamping portion; 611-first clamping member; 612-second clamping member;

[0056] 62-second positioning fixture; 620-second clamping portion;

[0057] 70-Controller. DETAILED DESCRIPTION

[0058] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0059] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0060] Micro LED display technology is a technology that integrates traditional LEDs into micron-level spacing LED arrays to achieve ultra-high resolution display effects. Micro-LED has the characteristics of self-luminescence. Compared with OLED and LCD displays, Micro-LED colors are easier to accurately adjust, have longer luminous life, higher brightness and contrast, and are thinner and more energy-saving. Due to its high density, small size, and ultra-high pixel characteristics, Micro-LED will become the most promising new generation of revolutionary display technology in the future.

[0061] Currently, the biggest process bottleneck in Micro-LED is the mass transfer link. In the mass transfer process, WB (Wafer Bonding) is a key process, which refers to the process of bonding the Micro LED growth substrate to the temporary board through adhesive, and then transferring the Micro LED chip from the growth substrate to the temporary board through the laser stripping process. In this process, the two substrates are currently bonded manually, which will result in a slight angle deviation. However, due to the characteristics of MicroLED chips such as dense arrangement and small size, this angle deviation will cause the laser scanning trajectory in the subsequent laser stripping process to be inconsistent with the chip arrangement, causing subsequent process difficulties and yield loss.

[0062] Based on this, the present application hopes to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in the subsequent embodiments.

[0063] See also Figure 1 The present application provides a mass transfer device, which includes: a carrier platform 10, the carrier platform 10 is made of materials such as marble, and the surface is polished to make it have a smooth surface, and the polishing process can form a protective layer on the surface of the carrier platform 10, thereby extending its service life. The carrier platform 10 is used to place a growth substrate 20 and a temporary substrate 30, wherein the growth substrate 20 placed on the carrier platform 10 is provided with a first surface of a chip and the temporary substrate 30 is provided with a second surface of a bonding layer, and the growth substrate 20 and the temporary substrate 30 are both perpendicular to the carrier platform 10. Specifically, a plurality of bonding structures corresponding to the chip are provided on the temporary substrate 30, and the bonding structure can be a through hole, a groove, etc. The bonding layer covers the plurality of bonding structures, and the bonding layer is sticky and is used to receive the LED chip on the surface of the growth substrate 20, and make the LED chip correspond to the bonding structure on the temporary substrate 30 one by one. The material of the bonding layer is one or more of polyalkyl acrylate, polyphenylene vinyl, polyester or polydimethylsiloxane (PDMS). After being irradiated by laser, the above materials will lose their stickiness, so that the LED chip attached to the bonding layer will fall off, thereby achieving the effect of loading and unloading the Micro LED chip. The carrying platform 10 includes a supporting surface 13. During the mass transfer process, the first surface and the second surface are arranged opposite to each other and are both perpendicular to the supporting surface 13, and the LED chip and the bonding structure are matched one by one.

[0064] The carrying platform 10 is further provided with a first adjustment component 41 and a second adjustment component 42, which are arranged at intervals, and the growth substrate 20 and the temporary substrate 30 are arranged between the first adjustment component 41 and the second adjustment component 42, wherein the first adjustment component 41 is located on the side of the growth substrate 20 facing away from the temporary substrate 30, and the second adjustment component 42 is located on the side of the temporary substrate 30 facing away from the growth substrate 20. The first adjustment component 41 is used to connect with the growth substrate 20 and push the growth substrate 20 to move toward the temporary substrate 30. When the LED chip on the growth substrate 20 contacts the bonding adhesive layer on the temporary substrate 30, the LED chip on the growth substrate 20 can be transferred to the temporary substrate 30. Similarly, the second adjustment component 42 is used to connect with the temporary substrate 30 and push the temporary substrate 30 to move toward the growth substrate 20 until the LED chip on the growth substrate 20 contacts the bonding adhesive layer on the temporary substrate 30, and the LED chip on the growth substrate 20 can be transferred to the temporary substrate 30. Specifically, in this embodiment, the first adjustment component 41 can push the growth substrate 20 to move toward the temporary substrate 30, and the second adjustment component 42 can also push the temporary substrate 30 to move toward the growth substrate 20. During the mass transfer process, the purpose of connecting the LED chip to the bonding layer can be achieved by simultaneously adjusting the first adjustment component 41 and the second adjustment component 42.

[0065] In other embodiments, the second adjustment component 42 may be a fixed structure, the temporary substrate 30 is connected to the second adjustment component 42 and remains fixed, and the first adjustment component 41 pushes the growth substrate 20 to move toward the temporary substrate 30, so as to achieve the purpose of transferring the LED chip on the growth substrate 20 to the temporary substrate 30. Alternatively, the first adjustment component 41 may be a fixed structure, the growth substrate 20 is connected to the first adjustment component 41 and remains fixed, and the second adjustment component 42 pushes the temporary substrate 30 to move toward the growth substrate 20, so as to achieve the purpose of transferring the LED chip on the growth substrate 20 to the temporary substrate 30.

[0066] By setting the first adjustment component 41 and the second adjustment component 42 in the mass transfer device, and the first adjustment component 41 and the second adjustment component 42 push the growth substrate 20 and the temporary substrate 30 to move relative to each other, so that the LED chip and the bonding adhesive layer are connected, the first adjustment component 41 and the second adjustment component 42 can maintain the stability of the movement path during the movement, so that the growth substrate 20 and the temporary substrate 30 always remain in a facing state, so as to achieve the purpose of precise alignment during bonding, and the operation is simple and quick, which is conducive to improving product yield and mass transfer efficiency.

[0067] In one implementation, see Figure 1 and Figure 8The growth substrate 20 includes a first side surface 21, and the first side surface 21 is vertically connected to the first surface. The temporary substrate 30 includes a second side surface (not shown in the figure), and the second side surface is vertically connected to the second surface. The temporary substrate 30 has the same shape as the growth substrate 20, that is, the second side surface has the same shape as the first side surface 21, which can be used as a reference. The first side surface 21 and the second side surface are both planes, and the first side surface 21 and the second side surface are both placed on the supporting platform 10. Figure 8 The figure shows a schematic diagram of the structure of the growth substrate 20, in which the first side surface 21 is a plane (i.e., a flat edge), and the first side surface 21 and the second side surface are both attached to the carrier platform 10, so that the Micro LED chip on the growth substrate 20 and the bonding structure on the temporary substrate 30 are quickly aligned, and then the substrate of the growth substrate 20 is removed by laser stripping or grinding process, so as to transfer the Micro LED chip to the surface of the temporary substrate 30. By attaching the first side surface 21 and the second side surface to the carrier platform 10, since the first side surface 21 and the second side surface are both planes, it is beneficial to keep the growth substrate 20 and the temporary substrate 30 in a vertical state with the carrier platform 10 without tilting, which is beneficial to achieve accurate alignment of the growth substrate 20 and the temporary substrate 30.

[0068] In one implementation, see Figure 1 and Figure 2 The first adjustment assembly 41 includes a first bracket 411 and a first push rod 412. The first bracket 411 is fixed on the carrying platform 10, and the first push rod 412 is slidably connected to the first bracket 411. Specifically, the first push rod 412 includes a first sliding portion 413 and a first connecting portion 414 connected to each other. The first bracket 411 is provided with a through hole, and the opening of the through hole is directly opposite to the growth substrate 20. The first bracket 411 is located on the side of the growth substrate 20 that is away from the temporary substrate 30. The first sliding portion 413 is penetrated through the through hole and slides in the through hole in a direction perpendicular to the first surface of the growth substrate 20. The first connecting portion 414 is provided at one end of the first sliding portion 413 close to the growth substrate 20. When the first sliding portion 413 slides in a direction close to the growth substrate 20, the first connecting portion 414 is connected to the growth substrate 20 and pushes the growth substrate 20 to move toward the temporary substrate 30. It is understandable that in other embodiments, a plurality of through holes may be provided on the bracket 411, and the purpose of adjusting the position of the first push rod 412 can be achieved by setting the first push rod 412 in different through holes. Alternatively, the first bracket 411 may also be other structures that support and adjust the position of the first push rod 411, which is not specifically limited in the present application. By providing the first push rod 412 in the first adjustment component 41, the position of the growth substrate 20 can be adjusted by pushing the first push rod 412; at the same time, by providing the first bracket 411, the support and guiding function of the first push rod 412 can be achieved, so that the first push rod 412 moves along a fixed path, avoiding the angular displacement of the growth substrate 20 during the movement.

[0069] In one implementation, see Figure 1 and Figure 2 The second adjustment assembly 42 includes a second bracket 421 and a second push rod 422. The second bracket 421 is fixed on the carrying platform 10. The second push rod 422 is slidably connected to the second bracket 421. The second bracket 421 is located on the side of the temporary substrate 30 facing away from the growth substrate 20. The second push rod 422 is used to connect with the temporary substrate 30 and push the temporary substrate 30 to move toward the growth substrate 20. It can be understood that the second adjustment assembly 42 has the same structure as the first adjustment assembly 41, that is, the second push rod 422 includes a second sliding portion 423 and a second connecting portion 424 connected to each other, a through hole is provided on the second bracket 421, the opening of the through hole is directly opposite to the temporary substrate 30, the second sliding portion 423 is inserted into the through hole and slides in the through hole in a direction perpendicular to the second surface of the temporary substrate 30, and the second connecting portion 424 is provided at one end of the second sliding portion 423 close to the temporary substrate 30. When the second sliding portion 423 slides in a direction close to the temporary substrate 30, the second connecting portion 424 is connected to the temporary substrate 30 and pushes the temporary substrate 30 to move toward the growth substrate 20. By providing the second push rod 422 in the second adjustment assembly 42, the position of the temporary substrate 30 can be adjusted by pushing the second push rod 422; at the same time, by providing the second bracket 421, the support and guiding function of the second push rod 422 can be realized, so that the second push rod 422 moves along a preset path, and the angle deviation of the temporary substrate 30 is avoided during the movement.

[0070] In one implementation, see Figure 1 and Figure 2 , a suction cup 415 is provided at one end of the first push rod 412 close to the growth substrate 20, and the suction cup 415 is used to adsorb the growth substrate 20. Specifically, the suction cup 415 can be a vacuum suction cup. When the suction cup 415 is connected to the growth substrate 20, the growth substrate 20 can be adsorbed on the first push rod 412 by evacuating the suction cup 415, so as to fix the growth substrate 20. When the suction cup 415 is filled with gas, the growth substrate 20 can be separated from the first push rod 412. It can be understood that the suction cup 415 can also be a suction cup of other structures, such as an electrostatic suction cup, a magnetic suction cup, etc., which is not limited in this application. By arranging the suction cup 415 at the end of the first push rod 412, the adsorption and fixing effect of the growth substrate 20 can be achieved by evacuating the suction cup 415. The operation is simple and quick, which helps to improve the efficiency of mass transfer.

[0071] In one implementation, see Figure 1The mass transfer device also includes a first drive component 51. When the number of the first drive components 51 is 1, one first drive component 51 is connected to the first push rod 412 or the second push rod 422, and the first drive component 51 drives the first push rod 412 or the second push rod 422 to move. Specifically, when the second adjustment component 42 is a fixed structure and the first adjustment component 41 can push the growth substrate 20 to move, the first drive component 51 is connected to the first push rod 412. The first drive component 51 can be a transmission structure composed of a servo motor and a screw rod. The output shaft of the servo motor is connected to the screw rod, and the screw rod is connected to the first push rod 412. When the servo motor rotates, it drives the screw rod to rotate. When the screw rod rotates, it can drive the first push rod 412 to move. The first push rod 412 further pushes the growth substrate 20 to move toward the temporary substrate 30 until the chip on the growth substrate 20 is connected to the bonding adhesive layer of the temporary substrate 30, and the first drive component 51 stops driving. When the first adjustment component 41 is a fixed structure and the second adjustment component 42 can push the temporary substrate 30 to move, the first drive component 51 is connected to the second push rod 422. That is, the screw rod is connected to the second push rod 422, and when the servo motor rotates, it drives the screw rod to rotate, and the screw rod rotation further drives the second push rod 422 to move, and the second push rod 422 further pushes the temporary substrate 30 to move toward the growth substrate 20 until the bonding layer on the temporary substrate 30 is connected to the chip on the growth substrate 20, and the first drive component 51 stops driving. It can be understood that in other embodiments, the first drive component 51 can also be other transmission structures, such as a combination of a motor and a gear meshing transmission, etc., which is not limited in this application.

[0072] Alternatively, there are two first drive components 51, one of which is connected to the first push rod 412 and drives the first push rod 412 to move, and the other first drive component 51 is connected to the second push rod 422 and drives the second push rod 422 to move. Specifically, when the first adjustment component 41 can push the growth substrate 20, and the second adjustment component 42 can also push the temporary substrate 30, the first drive component 51 is connected to both the first push rod 412 and the second push rod 422, and the first drive component 51 connected to the first push rod 412 drives the first push rod 412 to move, and the first push rod 412 further pushes the growth substrate 20 to move. The first drive component 51 connected to the second push rod 422 drives the second push rod 422 to move, and the second push rod 422 further pushes the temporary substrate 30 to move. When the chip on the growth substrate 20 is connected to the bonding adhesive layer on the temporary substrate 30, both first drive components 51 stop driving. The first driving assembly 51 is provided to drive the first push rod 412 and the second push rod 422 to move. Compared with the manual pushing bonding method, the degree of automation is higher, which is conducive to improving the efficiency of mass transfer.

[0073] In one implementation, see Figures 1 to 3The mass transfer device also includes a first positioning fixture 61 and a second positioning fixture 62, which are arranged in parallel and spaced apart on the carrier platform 10. The first positioning fixture 61 is used to adjust the position of the growth substrate 20 on the carrier platform 10, and the second positioning fixture 62 is used to adjust the position of the temporary substrate 30 on the carrier platform 10, so that the temporary substrate 30 is directly opposite to the growth substrate 20. Specifically, the support surface 13 is provided with a first slide groove 11 and a second slide groove 12 arranged in parallel and spaced apart, and the first slide groove 11 and the second slide groove 12 extend in a direction perpendicular to the first push rod 412, wherein the width of the first slide groove 11 is equal to the width of the first positioning fixture 61, so that the first positioning fixture 61 can be arranged in the first slide groove 11 and move along the first slide groove 11, and remain stable. When the width of the first slide groove 11 is too wide, the first positioning fixture 61 is prone to tilt, resulting in misalignment. Similarly, the width of the second slide groove 12 is the same as that of the second positioning fixture 62, so that the second positioning fixture 62 can be arranged in the second slide groove 12 and move along the second slide groove 12, and remain stable. Taking the first positioning fixture 61 as an example, when the first positioning fixture 61 is pushed along the X direction, the first positioning fixture 61 slides in the first slide groove 11, and stops sliding when the first positioning fixture 61 abuts against the first surface 111 of the first slide groove 11, thereby achieving a locking effect on the first positioning fixture 61. When the first positioning fixture 61 is moved in the direction opposite to the X direction, the first positioning fixture 61 moves in the reverse direction until it stops when it abuts against the second surface 112 of the first slide groove 11. By setting the first positioning fixture 61 and the second positioning fixture 62 in the mass transfer device, the purpose of adjusting the position of the growth substrate 20 and the temporary substrate 30 can be achieved by simply adjusting the position of the first positioning fixture 61 and the second positioning fixture 62. Compared with the manual adjustment method, this adjustment method makes the alignment between the growth substrate 20 and the temporary substrate 30 more accurate and fast, which is conducive to improving the product yield and mass transfer efficiency. In addition, by setting the structure of the first slide groove 11 and the second slide groove 12 on the carrier platform 10, the limiting effect of the first positioning fixture 61 and the second positioning fixture 62 is achieved, avoiding the first positioning fixture 61 and the second positioning fixture 62 from being offset during the movement process.

[0074] In one implementation, see Figure 1 and Figure 2, the first positioning fixture 61 is provided with a first clamping portion 610, the second positioning fixture 62 is provided with a second clamping portion 620, the growth substrate 20 is fixed to the first positioning fixture 61 through the first clamping portion 610, and the transient substrate 30 is fixed to the second positioning fixture 62 through the second clamping portion 620. Specifically, the first positioning fixture 61 includes a first clamping member 611 and a second clamping member 612, and the first clamping member 611 and the second clamping member 612 are symmetrically arranged. Grooves of equal width are provided on opposite sides of the first clamping member 611 and the second clamping member 612, and the two grooves are symmetrically arranged to form the first clamping portion 610, and the width of the groove is equal to the thickness of the growth substrate 20, so that the growth substrate 20 can be stably mounted on the first positioning fixture 61, and the bottom of the groove is flush with the support surface 13, so that the growth substrate can move on the support surface 13. When the first clamping member 611 and the second clamping member 612 move toward each other, the length of the first clamping portion 610 is shortened until it stops moving when it is able to stably clamp the growth substrate 20. When it is necessary to separate the first positioning fixture 61 from the growth substrate 20, it is sufficient to move the first clamping member 611 and the second clamping member 612 away from each other. It is understandable that the structure of the second positioning fixture 62 is the same as that of the first positioning fixture 61, and can be used as a reference. By providing the first clamping portion 610 on the first positioning fixture 61 and the second clamping portion 620 on the second positioning fixture 62, the growth substrate 20 and the first positioning fixture 61, as well as the transient substrate 30 and the second positioning fixture 62 are connected and fixed by clamping, which makes disassembly and assembly more convenient.

[0075] In one implementation, see Figure 2 and Figure 3 , the mass transfer device also includes a second drive assembly 52, which is connected to the first positioning fixture 61 and the second positioning fixture 62, and drives the first positioning fixture 61 and the second positioning fixture 62 to move. Specifically, the second drive assembly 52 includes a driving member 521 and a connecting member 522 that are connected to each other, and the connecting member 522 is connected to the first positioning fixture 61 and the second positioning fixture 62. When the driving member 521 drives the connecting member 522 to move, the connecting member 522 drives the first positioning fixture 61 and the second positioning fixture 62 to move. Among them, the second drive assembly 52 can be driven by air control, electric control, etc. By setting the second drive assembly 52 to drive the first positioning fixture 61 and the second positioning fixture 62 to move, the first positioning fixture 61 and the second positioning fixture 62 can be quickly adjusted to the preset position, which is conducive to improving the transfer efficiency.

[0076] In one implementation, see Figure 1The mass transfer device further includes a controller 70, which is electrically connected to the first drive assembly 51. The controller 70 drives the first push rod 412 and the second push rod 422 to move by controlling the first drive assembly 51. Specifically, the controller 70 includes a setting terminal and a control program. The control terminal is used to input the position parameters of the growth substrate 20 and the transient substrate 30. The control program is used to analyze the input parameters. The controller 70 controls the first drive assembly 51 to start, and the first drive assembly 51 drives the first push rod 412 and the second push rod 412 to move. When the first push rod 412 pushes the growth substrate 20 to a preset position, the first drive assembly 51 stops driving the first push rod 412. When the second push rod 422 pushes the transient substrate 30 to move to a preset position, the first drive assembly 51 stops driving the second push rod 422. It can be understood that the first drive assembly 51 can drive the first push rod 412 and the second push rod 422 to move at the same time, or can drive the first push rod 412 or the second push rod 422 to move separately.

[0077] Alternatively, the controller 70 is also connected to the second drive component 52, and the relevant parameters are input into the control terminal, and the relevant parameters are set according to the preset fixed positions of the growth substrate 20 and the transient substrate 30. The control program controls the second drive component 52 to start according to the relevant parameters, and the second drive component 52 further drives the first positioning fixture 61 and the second positioning fixture 62 to move to the preset position and then stop. By setting the controller 70 in the mass transfer device, the relative position of the growth substrate 20 and the transient substrate 30 can be accurately controlled by setting the parameters of the controller 70. Compared with manual operation, the degree of automation is higher and the accuracy is higher, which is conducive to improving the efficiency of mass transfer and product yield.

[0078] Based on the same inventive concept, the present application also provides a mass transfer method, which uses a mass transfer device as in any of the above embodiments, and its flow chart is as follows: Figure 4 As shown, specifically including:

[0079] Step S1, see Figure 1 , placing the growth substrate 20 and the temporary substrate 30 on the carrying platform 10, and making the first surface of the growth substrate 20 with the chip and the second surface of the temporary substrate 30 with the bonding layer face each other, and making the growth substrate 20 and the temporary substrate 30 both perpendicular to the carrying platform 10;

[0080] Step S2, see Figure 6 and Figure 7 , connecting the first adjustment component 41 to the growth substrate 20, and pushing the growth substrate 20 to move toward the temporary substrate 30 until the chip is connected to the bonding adhesive layer;

[0081] Alternatively, the second adjustment component 42 is connected to the temporary substrate 30 and pushes the temporary substrate 30 toward the growth substrate 20 until the chip is connected to the bonding adhesive layer.

[0082] Alternatively, the first adjusting component 41 is connected to the growth substrate 20 and pushes the growth substrate 20 toward the temporary substrate 30; at the same time, the second adjusting component 42 is connected to the temporary substrate 30 and pushes the temporary substrate 30 toward the growth substrate 20. When the chip is connected to the bonding adhesive layer, both the first adjusting component 41 and the second adjusting component 42 stop pushing.

[0083] By adopting the mass transfer method provided in the present application, the first adjustment component 41 and the second adjustment component 42 push the growth substrate 20 and the temporary substrate 30 to move relative to each other so that the chip and the bonding layer are connected. The first adjustment component 41 and the second adjustment component 42 can maintain the stability of the movement path during the movement, so that the growth substrate 20 and the temporary substrate 30 always remain in a facing state, so as to achieve the purpose of precise alignment during bonding. The operation is simple and quick, which is conducive to improving product yield and mass transfer efficiency.

[0084] In one implementation, see Figure 1 , Figure 4 and Figure 8 The growth substrate 20 includes a first side surface 21, which is vertically connected to the first surface. The temporary substrate 30 includes a second side surface, which is vertically connected to the second surface. The first side surface 21 and the second side surface are both planes. The mass transfer method also includes S11: placing the first side surface 21 and the second side surface on a supporting platform.

[0085] In one implementation, see Figure 1 and Figure 4 The first adjustment component 41 includes a first push rod 412 , and step S2 further includes step S21 : connecting the first push rod 412 to the growth substrate 20 , and pushing the growth substrate 20 to move toward the temporary substrate 30 .

[0086] In one implementation, see Figure 1 and Figure 4 The second adjustment assembly 42 includes a second push rod 422 , and step S2 further includes step S22 : connecting the second push rod 422 to the temporary substrate 30 and pushing the temporary substrate 30 to move toward the growth substrate 20 .

[0087] In one implementation, see Figure 1 and Figure 4 The mass transfer device further includes a controller 70 and a first drive assembly 51, and the mass transfer method further includes:

[0088] Step S211, setting parameters of the controller 70;

[0089] Step S212, see Figure 6 and Figure 7 , start the first driving component 51. When only the growth substrate 20 needs to be moved, the controller 70 controls the first driving component 51 to drive the first push rod 411 to move according to the set parameters. The first push rod 412 is connected to the growth substrate 20 and continues to push the growth substrate 20 toward the temporary substrate 30. The driving is stopped when the chip is connected to the bonding layer.

[0090] When only the temporary substrate 30 needs to be moved, the controller 70 controls the first driving assembly 51 to drive the second push rod 422 to move according to the set parameters. The second push rod 422 is connected to the temporary substrate 30 and continues to push the temporary substrate toward the growth substrate 20. The drive stops when the chip is connected to the bonding layer.

[0091] When both the growth substrate 20 and the temporary substrate 30 need to be moved, the controller 70 controls the first driving assembly 51 to drive the first push rod 412 to move according to the set parameters, and the first push rod 412 further pushes the growth substrate 20 to move toward the temporary substrate 30. At the same time, the controller 70 also controls the first driving assembly 51 to drive and the second push rod 422 to move according to the set parameters, and the second push rod 422 further pushes the temporary substrate 30 to move toward the growth substrate 20. When the growth substrate 20 and the temporary substrate 30 are in close contact, the controller 70 controls the first driving assembly 51 to stop driving.

[0092] In one implementation, see Figure 1 , Figure 2 and Figure 4 The mass transfer device further includes a second driving assembly 52, a first positioning fixture 61 and a second positioning fixture 62, and step S1 further includes:

[0093] Step S12, see Figure 5 , a first positioning fixture 61 and a second positioning fixture 62 are arranged on the carrying platform 10;

[0094] Step S13, starting the second driving assembly 52, the second driving assembly 52 pushes the first positioning fixture 61 and the second positioning fixture 62 to move to a preset position and then stops driving;

[0095] In step S14 , the growth substrate 20 is clamped to the first positioning fixture 61 , and the temporary substrate 30 is clamped to the second positioning fixture 62 .

[0096] In one implementation, please refer to Figure 4 , step S1 further includes:

[0097] Step S15, see Figure 2 and Figure 6, start the second driving assembly 52 , and the second driving assembly 52 drives the first positioning fixture 61 and the second positioning fixture 62 to move, so that the first positioning fixture 61 is separated from the growth substrate 20 , and the second positioning fixture 62 is separated from the temporary substrate 30 .

[0098] It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A mass transfer device, characterized in that: include: A carrying platform, the carrying platform is used to place a growth substrate and a temporary substrate; wherein the first surface of the growth substrate provided with a chip placed on the carrying platform and the second surface of the temporary substrate provided with a bonding layer are directly opposite, and the growth substrate and the temporary substrate are both perpendicular to the carrying platform; and A first adjusting component and a second adjusting component, wherein the first adjusting component and the second adjusting component are both arranged on the carrying platform, the first adjusting component is located on a side of the growing substrate facing away from the temporary substrate, and the second adjusting component is located on a side of the temporary substrate facing away from the growing substrate; wherein the first adjusting component comprises a first bracket and a first push rod, the first bracket is fixed on the carrying platform and is provided with a through hole, the first push rod comprises a first sliding portion and a first connecting portion, the first sliding portion passes through the through hole and is connected to the growing substrate through the first connecting portion provided at the end, and pushes the growing substrate to move toward the temporary substrate, so that the chip is connected to the bonding adhesive layer; and / or, The second adjustment component includes a second bracket and a second push rod, the second bracket is fixed on the supporting platform and is provided with another through hole, the second push rod includes a second sliding portion and a second connecting portion, the second sliding portion passes through the through hole and is connected to the temporary substrate through the second connecting portion provided at the end, and pushes the temporary substrate toward the growth substrate to connect the chip and the bonding layer.

2. The mass transfer device according to claim 1, characterized in that: Suction cups are provided at one end of the first connection part and the second connection part close to the growth substrate, and the suction cups are used to absorb the growth substrate or the temporary substrate.

3. The mass transfer device according to claim 1, wherein: The mass transfer device further includes a first drive assembly, There is one first driving assembly, one first driving assembly is connected to the first push rod or the second push rod, and the first driving assembly drives the first push rod or the second push rod to move; Alternatively, there are two first drive components, one of which is connected to the first push rod and drives the first push rod to move, and the other of which is connected to the second push rod and drives the second push rod to move.

4. The mass transfer device according to claim 1, wherein: The growth substrate includes a first side surface, which is vertically connected to the first surface. The transient substrate includes a second side surface, which is vertically connected to the second surface. The first side surface and the second side surface are both planes, and the first side surface and the second side surface are both placed on the supporting platform.

5. The mass transfer device according to claim 3, characterized in that: The mass transfer device also includes a first positioning fixture and a second positioning fixture, the first positioning fixture and the second positioning fixture are arranged in parallel and spaced apart on the carrying platform, the first positioning fixture is used to adjust the position of the growth substrate on the carrying platform, and the second positioning fixture is used to adjust the position of the transient substrate on the carrying platform so that the first surface is opposite to the second surface.

6. The mass transfer device according to claim 5, characterized in that: The supporting platform includes a supporting surface, the growth substrate and the temporary substrate are arranged on the supporting surface, the supporting surface is provided with a first slide groove and a second slide groove arranged in parallel and spaced apart, the first positioning fixture is arranged in the first slide groove and moves along the first slide groove, and the second positioning fixture is arranged in the second slide groove and moves along the second slide groove.

7. The mass transfer device according to claim 5, characterized in that: The first positioning fixture is provided with a first clamping portion, the second positioning fixture is provided with a second clamping portion, the growth substrate is fixed to the first positioning fixture via the first clamping portion, and the transient substrate is fixed to the second positioning fixture via the second clamping portion.

8. The mass transfer device according to claim 5, characterized in that: The mass transfer device further includes a second driving component, which is connected to the first positioning fixture and the second positioning fixture and drives the first positioning fixture and the second positioning fixture to move.

9. The mass transfer device according to claim 3, wherein: The mass transfer device further includes a controller, which is electrically connected to the first drive assembly. The controller controls the first drive assembly to drive the first push rod and / or the second push rod to move.

10. A method for mass transfer, characterized in that: The chips on the growth substrate are transferred to the temporary substrate using a mass transfer device, the mass transfer device comprising a carrying platform, a first adjustment component and a second adjustment component, and the mass transfer method comprises: Placing the growth substrate and the temporary substrate on the carrying platform, and making the first surface of the growth substrate provided with the chip and the second surface of the temporary substrate provided with the bonding adhesive layer face each other, and making the growth substrate and the temporary substrate both be arranged vertically to the carrying platform; Connecting the first adjustment component to the growth substrate, wherein the first adjustment component includes a first bracket and a first push rod, the first bracket is fixed to the carrying platform and is provided with a through hole, the first push rod includes a first sliding portion and a first connecting portion, the first sliding portion passes through the through hole and is connected to the growth substrate through the first connecting portion provided at the end, and pushes the growth substrate to move toward the temporary substrate until the chip stops when it is connected to the bonding adhesive layer; and / or, The second adjustment component is connected to the temporary substrate, the second adjustment component includes a second bracket and a second push rod, the second bracket is fixed to the supporting platform and is provided with another through hole, the second push rod includes a second sliding portion and a second connecting portion, the second sliding portion passes through the through hole and is connected to the temporary substrate through the second connecting portion provided at the end, and pushes the temporary substrate toward the growth substrate until the chip stops when it is connected to the bonding layer.

11. The method for mass transfer according to claim 10, wherein: The growth substrate includes a first side surface, which is vertically connected to the first surface; the transient substrate includes a second side surface, which is vertically connected to the second surface; the first side surface and the second side surface are both planes; and the mass transfer method further includes: placing the first side surface and the second side surface on the supporting platform.

12. The method for mass transfer according to claim 10, wherein: The mass transfer device further includes a controller and a first driving component, and the mass transfer method further includes: Setting parameters of the controller; The first driving assembly is started, and the controller controls the first driving assembly to drive the first push rod and / or the second push rod to move according to set parameters.

13. The method for mass transfer according to claim 10, wherein: The mass transfer device further includes a second driving assembly, a first positioning fixture and a second positioning fixture, and the mass transfer method further includes: The first positioning fixture and the second positioning fixture are arranged on the carrying platform; Starting the second driving assembly, the second driving assembly pushes the first positioning fixture and the second positioning fixture to move to a preset position; The growth substrate is clamped to the first positioning fixture, and the temporary substrate is clamped to the second positioning fixture.

14. The method for mass transfer according to claim 13, wherein: The mass transfer method further includes: The second driving component is started to drive the first positioning fixture and the second positioning fixture to move, so that the first positioning fixture is separated from the growth substrate, and the second positioning fixture is separated from the temporary substrate.

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