A die bonding assembly, a die bonder and a die bonding method

Abstract

The present application relates to the technical field of die bonder, in particular to a die bonder assembly, die bonder and die bonding method, the die bonder assembly comprises a suction device and a transfer carrying device, the suction device comprises a body and a suction nozzle, the suction nozzle comprises a connecting part and a suction part, the connecting part is detachably connected to the body, at least two suction nozzle openings are formed at the end of the suction part away from the connecting part, the transfer carrying device comprises at least two rotatable and / or liftable carrying parts for placing chips;When working, the body drives the suction nozzle to move to the transfer carrying device, the suction nozzle openings correspond to the carrying parts one by one, so as to suck and remove at least two chips on the carrying parts at one time. By adjusting and positioning the chips in advance on the carrying parts of the transfer carrying device, only one reference point of the circuit board to be mounted needs to be corresponded when mounting, so that the whole plate chips can be accurately mounted, and the accuracy of the whole mounting is greatly improved.

Description

[Technical Field]

[0001] This invention relates to the field of die bonder technology, and particularly to a die bonder assembly, die bonder, and die bonder method. [Background Technology]

[0002] With the development of industrial technology, die bonders are rapidly evolving towards high automation to improve production efficiency. Current die bonders typically employ a single pick-up, single positioning, and single placement / soldering process, repeated sequentially. However, in the manufacturing of electronic products such as coolers, a large number of cooling chips need to be mounted, and single-chip placement equipment is increasingly unable to meet production efficiency demands. Therefore, the industry has begun researching processes that mount multiple chips simultaneously. Due to the high integration of cooling chip mounting positions, current technologies struggle to achieve precise positioning and mounting of multiple chips in a single operation. [Summary of the Invention]

[0003] To address the problem that existing equipment struggles to accurately position and mount multiple chips at once, this invention provides a die bonding assembly, a die bonding machine, and a die bonding method.

[0004] The present invention provides a die bonding assembly for transferring chips, comprising a pick-up device and a transfer carrier device. The pick-up device includes a body and a nozzle, the nozzle comprising a connecting portion and a pick-up portion, the connecting portion being detachably connected to the body, and the pick-up portion having at least two nozzle openings at one end away from the connecting portion. The transfer carrier device includes at least two rotatable and / or liftable carriers for placing chips. During operation, the body moves the nozzle to the transfer carrier device, with each nozzle opening corresponding to one of the carriers, to pick up and remove chips from at least two carriers at a time.

[0005] Preferably, the end of the connecting part away from the suction part is a convex spherical surface or a convex parabolic surface, and the body has a connecting cavity that matches the connecting part; when the connecting part is connected to the connecting cavity, the end of the connecting part away from the suction part enters the connecting cavity.

[0006] Preferably, a limiting block is provided on one side of the connecting part, and a limiting notch is provided at the end of the body near the nozzle; when the connecting part is connected to the body, the limiting block enters the limiting notch.

[0007] Preferably, the transfer bearing device further includes a limiting plate, the limiting plate having a receiving hole, and the bearing member being movably disposed in the receiving hole.

[0008] Preferably, the transfer bearing device further includes a drive mechanism correspondingly connected to the bearing member; the bearing member is connected to the drive mechanism via a connector, the drive mechanism includes a rotation drive member and a lifting drive member, the rotation drive member drives the bearing member to rotate via the connector, and the lifting drive member drives the bearing member to rise and fall via the connector.

[0009] Preferably, the die bonding assembly further includes an image recognition device signal-connected to the driving mechanism, the image recognition device including a first camera; the limiting plate is horizontally arranged, defining the horizontally upward surface of the limiting plate as the upper surface, and one end of the carrier protrudes from the upper surface; the first camera is horizontally arranged and the imaging direction is towards the limiting plate.

[0010] Preferably, the image recognition device further includes a second camera, which is vertically positioned and movable to the limiting plate, with the shooting direction of the second camera facing the upper surface of the limiting plate.

[0011] Preferably, the second camera is positioned on one side of the main body and moves synchronously with the main body.

[0012] To solve the above-mentioned technical problems, the present invention also provides a die bonder, including the above-mentioned die bonder components.

[0013] To solve the above-mentioned technical problems, the present invention also provides a die bonding method, which is implemented by the above-mentioned die bonding component and includes the following steps: transferring the chip to the corresponding carrier of the transfer carrier device according to the preset position; rotating and / or raising and lowering the corresponding carrier to correct the orientation of the chip; replacing the chip with a nozzle having at least two suction ports to pick up multiple chips from the transfer carrier device at one time and transfer them to the welding position for welding.

[0014] Compared with the prior art, the die bonding assembly, die bonding machine and die bonding method provided by the present invention have the following advantages:

[0015] 1. The die bonding assembly of the present invention includes a suction device and a transfer carrier device. The suction device includes a body and a suction nozzle. The suction nozzle includes a connecting part and a suction part. The connecting part is detachably connected to the body. The suction part has at least two suction nozzle openings at one end away from the connecting part. The transfer carrier device includes at least two carriers for placing chips that are rotatable and / or liftable. During operation, the body drives the suction nozzle to move to the transfer carrier device. The suction nozzle openings correspond one-to-one with the carriers to pick up and remove chips from at least two carriers at a time. It is understandable that each carrier component pre-layouts the positions of the chips to be mounted on the circuit board. Each carrier component can hold a chip. After placing each chip, the orientation and / or height of the chip is adjusted by rotating and / or raising / lowering the carrier component. Once all the chips on the carrier components are adjusted, the chips on the entire transfer carrier device correspond one-to-one with the chip positions on the circuit board to be mounted, and the nozzles correspond one-to-one with the carrier components, i.e., one-to-one with the chips on the carrier components. This allows for the simultaneous pickup of chips from the carrier components and their movement to the mounting position for placement. By pre-adjusting and positioning the chips on the carrier components of the transfer carrier device, during mounting, only one reference point on the circuit board needs to be aligned to accurately mount the entire board of chips, greatly improving the overall mounting accuracy. Furthermore, existing placement methods involve moving each chip individually to a transfer station for positioning and identification, and then moving each chip individually from the transfer station to the placement position for placement. This invention, by picking up the entire board of chips from the transfer carrier in one go, reduces the multiple journeys from the transfer station to the placement position to a single journey, significantly saving time and improving placement efficiency. Additionally, by designing the nozzle with multiple nozzle openings, the connection method between the other end of the nozzle and the main body can be maintained, allowing the use of a universal binding head with other nozzle models, increasing the applicability and practicality of this invention.

[0016] 2. By setting the end of the connecting part away from the suction part as an outwardly convex spherical surface or an outwardly convex parabolic surface, when the connecting part is installed into the connecting cavity on the body, the outwardly convex spherical surface or the outwardly convex parabolic surface can guide the suction nozzle to slightly shift to the side, so that the connecting part can smoothly enter the connecting cavity. This prevents the side wall of the connecting cavity from making hard contact with the upper end of the suction nozzle and causing damage when the connecting cavity is not completely aligned with the suction nozzle or when the suction nozzle is skewed on the suction frame.

[0017] 3. A limiting block is provided on one side of the connecting part of the present invention, and a limiting notch is provided at the end of the main body near the nozzle. When the connecting part is connected to the main body, the limiting block enters the limiting notch. By aligning the limiting block with the limiting notch, it can be ensured that the nozzle does not rotate relative to the main body after installation. When the main body drives the nozzle to adjust the chip on the corresponding carrier, the control is more precise, thereby ensuring more accurate adsorption and mounting.

[0018] 4. The transfer carrier device of the present invention further includes a limiting plate with a receiving hole, in which the carrier component is movably disposed. It is understood that the high concentration of chips on the circuit board and the small distance between chips result in a small distance between the corresponding carrier components, and the volume of a single carrier component is also reduced. By setting the limiting plate and confining the carrier component within the receiving hole, the stability of the carrier component can be enhanced, preventing the carrier component from tilting and affecting positioning accuracy.

[0019] 5. The transfer carrier device of the present invention includes a drive mechanism correspondingly connected to the carrier component. The carrier component is connected to the drive mechanism via a connector. The drive mechanism includes a rotary drive assembly and a lifting drive assembly. The rotary drive assembly drives the carrier component to rotate via the connector, and the lifting drive assembly drives the carrier component to rise and fall via the connector. By setting the rotary drive assembly, the chip skew can be finely adjusted to prevent misalignment during mounting; by setting the lifting drive assembly, the upper surface of the chip can be leveled to ensure that the pick-up device can pick up multiple chips simultaneously without missing any.

[0020] 6. The die-bonding assembly of the present invention further includes an image recognition device connected to the driving mechanism via signals. The image recognition device includes a first camera, a horizontally positioned limiting plate, and a horizontally upward-facing surface of the limiting plate defined as the upper surface. One end of the carrier protrudes from the upper surface. The first camera is horizontally positioned with its imaging direction facing the limiting plate. By setting the first camera horizontally, the height of the chip can be quickly identified, and it can be determined whether there is a height difference with adjacent chips, so as to provide information to the driving mechanism for fine-tuning the chip height. In addition, the chip side information acquired by the first camera can also be used to determine whether the chip is aligned, so as to provide information to the driving mechanism for fine-tuning the chip orientation.

[0021] 7. The image recognition device of the present invention further includes a second camera, which is vertically arranged and movable to the limiting plate, with the shooting direction of the second camera facing the upper surface of the limiting plate. By setting the second camera to shoot the upper surface of the chip from top to bottom, it is possible to determine whether the chip is aligned correctly from the upper surface of the chip, making the orientation information of the chip clearer and the adjustment more precise.

[0022] 8. The second camera of the present invention is disposed on one side of the main body and moves synchronously with the main body. This arrangement avoids the second camera from affecting the movement of the suction device, and eliminates the need for a separate component to fix the second camera, thus simplifying the structure and saving costs.

[0023] 9. The present invention also provides a die bonder and a die bonder method, which have the same beneficial effects as the die bonder components described above, and will not be described in detail here. [Attached Image Description]

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the die-bonding assembly provided in the first embodiment of the present invention.

[0026] Figure 2 This is a three-dimensional schematic diagram of the nozzle of the die bonding assembly provided in the first embodiment of the present invention.

[0027] Figure 3 This is a side view of the nozzle of the die bonding assembly provided in the first embodiment of the present invention.

[0028] Figure 4 This is a side view of another nozzle of the die bonding assembly provided in the first embodiment of the present invention.

[0029] Figure 5 yes Figure 4 A magnified view of A in the middle.

[0030] Figure 6 This is an exploded view of the material feeding device of the die bonding assembly provided in the first embodiment of the present invention.

[0031] Figure 7 This is a three-dimensional schematic diagram of the transfer bearing device in the die-bonding assembly provided in the first embodiment of the present invention.

[0032] Figure 8 This is a cross-sectional schematic diagram of the transfer bearing device in the die-bonding assembly provided in the first embodiment of the present invention.

[0033] Figure 9 yes Figure 8 A magnified view of B in the middle.

[0034] Figure 10 This is a block diagram of the die bonder provided in the second embodiment of the present invention.

[0035] Figure 11 This is a flowchart of the die bonding method provided in the third embodiment of the present invention.

[0036] Explanation of reference numerals in the attached diagram:

[0037] 100. Die bonder assembly; 200. Die bonder;

[0038] 1. Transfer bearing device;

[0039] 10. Adjustment component; 11. Support component; 12. Drive mechanism; 13. Connector; 20. Support frame; 30. Limiting plate; 40. Image recognition device; 50. Suction device; 51. Body; 52. Suction nozzle;

[0040] 111. Adsorption hole; 112. Connecting hole; 121. Rotary drive component; 122. Lifting drive component; 301. Accommodation hole; 302. Negative pressure channel; 401. First camera; 402. Second camera; 510. Connecting cavity; 511. Limiting notch; 520. Suction plane; 521. Suction nozzle; 522. Connecting part; 523. Suction part; 524. Converging cavity; 525. External connecting hole; 526. Annular protrusion; 527. Suction hole; 528. Limiting block;

[0041] 3011, Opening; 3012, Air duct slot.

Detailed Implementation Methods

[0042] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0043] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0044] Please see Figure 1 The first embodiment of the present invention provides a die bonding component 100 for transferring chips. The die bonding component 100 includes a suction device 50 and a transfer carrier device 1. Multiple chips can be placed on the transfer carrier device 1, and the suction device 50 can simultaneously pick up all the chips on the transfer carrier device 1.

[0045] Please combine Figures 1-3 Furthermore, the suction device 50 includes a body 51 and a suction nozzle 52. The suction nozzle 52 includes a connecting part 522 and a suction part 523. The connecting part 522 is detachably connected to the body 51. The suction part 523 has at least two suction nozzle openings 521 at one end away from the connecting part 522. The transfer carrier device 1 includes at least two carrier members 11 that are rotatable and / or liftable for placing chips. During operation, the body 51 drives the suction nozzle 52 to move to the transfer carrier device 1. The suction nozzle openings 521 correspond one-to-one with the carrier members 11 to pick up and remove chips from at least two carrier members 11 at once.

[0046] Understandably, each carrier 11 is pre-positioned to correspond to the chip positions on the circuit board to be mounted. Each carrier 11 can hold a chip. After each chip is placed, the orientation and / or height of the chip is adjusted by rotating and / or raising / lowering the carrier 11. Once the chips on each carrier 11 are adjusted, the chips on the entire transfer carrier device 1 correspond one-to-one with the chip positions on the circuit board to be mounted, and the nozzle 521 corresponds one-to-one with each carrier 11, i.e., one-to-one with the chips on the carrier 11. This allows for the simultaneous pickup of chips from the carrier 11 and their movement to the mounting position for one-time mounting. By pre-adjusting and positioning the chips on the carrier 11 of the transfer carrier device 1, during mounting, only one reference point on the circuit board needs to be aligned to accurately mount the entire board of chips, greatly improving the overall mounting accuracy. Furthermore, existing placement methods involve moving each chip individually to a transfer station for positioning and identification, and then moving each chip individually from the transfer station to the placement position for placement. This invention, by picking up the entire board of chips from the transfer carrier 1 in one go, reduces the multiple journeys from the transfer station to the placement position to a single journey, significantly saving time and improving placement efficiency. Additionally, by designing the nozzle 52 with multiple nozzle openings 521, the connection method between the other end of the nozzle 52 and the body 51 can be maintained, allowing the use of a common binding head with other nozzle models, increasing the applicability and practicality of this invention.

[0047] Furthermore, the end of the suction section 523 away from the connecting section 522 is a plane, defined as the suction plane 520. The suction nozzle 521 is formed on the suction plane 520. A converging cavity 524 is formed inside the suction section 523, and an external connecting hole 525 is formed in the connecting section 522. The suction nozzle 521, the converging cavity 524, and the external connecting hole 525 are connected sequentially. With this configuration, the present invention can simultaneously adsorb multiple chips through multiple suction nozzles 521 to complete the simultaneous transfer and mounting of multiple chips, greatly improving mounting efficiency and solving the problem of low efficiency in existing mounting methods.

[0048] Optionally, the suction plane 520 can be circular, polygonal, or other irregular shapes, and is not limited thereto, as long as it can be equipped with suction nozzles 521 that correspond one-to-one with the mounting positions on the circuit board to be mounted. For example, in this embodiment, the suction plane 520 is shown as rectangular.

[0049] Furthermore, at least two suction nozzles 521 have the same diameter. This setting ensures that the airflow of each suction nozzle 521 is the same, that is, the negative pressure suction is the same, which ensures that multiple chips can be sucked up at the same time, avoiding missed suction or individual chips falling off due to unstable adsorption.

[0050] Furthermore, the sum of the diameters of at least two suction nozzles 521 is less than the diameter of the external connecting hole 525. This arrangement allows the airflow through the external connecting hole 525 to be greater than the sum of the airflow through all the suction nozzles 521, resulting in better negative pressure, stronger suction, and more secure chip adsorption.

[0051] Optionally, the connecting part 522 and the suction part 523 can be connected as a single unit by welding, bonding, snap-fitting, or bolting, or the connecting part 522 and the suction part 523 can be integrally formed. Specifically, in this embodiment of the invention, the connecting part 522 and the suction part 523 are integrally formed. The integral forming design simplifies the subsequent installation steps and avoids accuracy errors caused by improper operation during installation, resulting in higher overall accuracy.

[0052] Please combine Figure 4 and Figure 5 As an optional implementation, annular protrusions 526 are provided on the suction plane 520, corresponding one-to-one with and surrounding the suction nozzle opening 521. By providing the annular protrusions 526, the suction nozzle 52 can be applied to circuit boards with uneven surfaces, avoiding the impact of unevenness on the suction nozzle opening's ability to press the chip down, thus improving practicality. Furthermore, a suction hole 527 is formed on the axis of the annular protrusion 526 corresponding to the suction nozzle opening 521, and the diameter of the suction hole 527 is less than or equal to the diameter of the suction nozzle opening 521. This arrangement allows the airflow rate through the suction hole 527 to be less than or equal to the airflow rate through the suction nozzle opening 521, resulting in better negative pressure, stronger suction, and more secure chip adsorption. In addition, the smaller suction hole 527 can accommodate smaller chips, broadening the applicability range.

[0053] Please see Figure 6 Furthermore, the end of the connecting part 522 away from the suction part 523 is a convex spherical surface or a convex paraboloid surface, and the main body 51 has a connecting cavity 510 that matches the connecting part 522. When the connecting part 522 is connected to the connecting cavity 510, the end of the connecting part 522 away from the suction part 523 enters the connecting cavity 510. With this setting, when the connecting part 522 is installed into the connecting cavity 510 on the main body 51, the convex spherical surface or the convex paraboloid surface can guide the suction nozzle 52 to slightly shift laterally, so that the connecting part 522 can smoothly enter the connecting cavity 510, preventing damage caused by hard contact between the side wall of the connecting cavity 510 and the upper end of the suction nozzle 52 when the connecting cavity 510 is not completely aligned with the suction nozzle 52 or when the suction nozzle 52 is tilted on the suction frame.

[0054] Furthermore, a limiting block 528 is provided on one side of the connecting part 522, and a limiting notch 511 is provided at the end of the main body 51 near the nozzle 52; when the connecting part 522 is connected to the main body 51, the limiting block 528 enters the limiting notch 511. Through the alignment of the limiting block 528 and the limiting notch 511, it can be ensured that the nozzle 52 does not rotate relative to the main body 51 after installation. When the main body 51 drives the nozzle 52 to adjust the chip on the corresponding carrier, the control is more precise, thereby ensuring more accurate adsorption and mounting.

[0055] Please combine Figure 1 , Figure 7 and Figure 8 Furthermore, the transfer carrier device 1 also includes a drive mechanism 12, and the carrier 11 and the drive mechanism 12 are connected to form an adjustment assembly 10; the drive mechanism 12 drives the carrier 11 to make adjustments, and then the suction device 50 removes at least two adjusted chips from the carrier 11 at a time.

[0056] Please combine Figures 7-9 Furthermore, the transfer carrier device 1 also includes a support frame 20 and a limiting plate 30. One end of the support frame 20 is fixed to an external device, and the other end is connected to the limiting plate 30. The limiting plate 30 has a receiving hole 301, and the carrier 11 is movably disposed in the receiving hole 301. It can be understood that the high concentration of chips on the circuit board and the small distance between the chips will result in a small distance between the corresponding carriers 11, and the volume of a single carrier 11 will also be reduced, which will cause insufficient stability. By setting the limiting plate 30 and limiting the carrier 11 in the receiving hole 301, the stability of the carrier 11 can be enhanced, and the deviation of the carrier 11 can be prevented from affecting the positioning accuracy.

[0057] Understandably, the location and arrangement of the receiving hole 301 on the limiting plate 30 depend on the layout of the circuit board chip to be mounted, and are not limited here.

[0058] Furthermore, the carrier 11 is connected to the drive mechanism 12 via a connector 13. The drive mechanism 12 includes a rotary drive 121 and a lifting drive 122. The rotary drive 121 drives the carrier 11 to rotate via the connector 13, and the lifting drive 122 drives the carrier 11 to rise and fall via the connector 13. By setting the rotary drive 121, the chip skew can be finely adjusted to prevent misalignment during placement; by setting the lifting drive 122, the upper surface of the chip can be leveled to ensure that the pick-up device can pick up multiple chips simultaneously without missing any.

[0059] Optionally, the connecting member 13 can be an electric cylinder or a hydraulic cylinder, and correspondingly, the lifting drive member 122 can be an electric drive member or a hydraulic drive member; the rotation drive member 121 can drive the connecting member 13 to rotate using a gear transmission method or a belt transmission method. Specifically, in this embodiment of the invention, the connecting member 13 is an electric cylinder, the lifting drive member 122 is an electric drive member, and the rotation drive member 121 uses a gear transmission method.

[0060] As an optional implementation, the lifting drive 122 is fixed to one side of the connector 13, and when the rotation drive 121 is activated, it can drive the lifting drive 122 and the connector 13 to rotate simultaneously.

[0061] Understandably, both the rotary drive component 121 and the lifting drive component 122 are equipped with servo motors. The servo motors receive external signals via wired or wireless means and are activated according to the signals, thereby providing power to the rotary drive component 121 and the lifting drive component 122, which in turn drive the connecting component 13 and the carrier component 11 to move, thereby adjusting the chip on the carrier component 11.

[0062] Furthermore, the limiting plate 30 is horizontally positioned, and its horizontally upward-facing surface is defined as the upper surface. The receiving hole 301 forms an opening 3011 on the upper surface. The carrier member 11 is cylindrical, with one end protruding from the opening 3011. The diameter of the carrier member 11 matches the diameter of the opening 3011, meaning that the diameter of the carrier member 11 is approximately the same as the diameter of the opening 3011. Through diameter matching, without affecting the movement of the carrier member 11, the carrier member 11 can essentially block the opening 3011 of the receiving hole 301, preventing dust or foreign objects from entering the receiving hole 301 and affecting accuracy.

[0063] Furthermore, the carrier 11 has an adsorption hole 111 and at least one connecting hole 112. The inner wall of the receiving hole 301 has an air duct groove 3012. The connecting hole 112 connects the adsorption hole 111 and the air duct groove 3012. The limiting plate 30 has a connecting air duct groove 3012 and a negative pressure channel 302 for an external vacuum device. With this arrangement, the adsorption hole 111, the connecting hole 112, the air duct groove 3012, and the negative pressure channel 302 are sequentially connected to form an adsorption channel. When the chip is placed on the carrier 11, the adsorption hole 111 holds the chip, preventing the chip from slipping on its own. At this time, the amount of adjustment of the carrier 11 is the amount of chip adjustment, further improving the adjustment accuracy.

[0064] As an alternative implementation, the air duct groove 3012 is arranged in a ring shape. This arrangement ensures that no matter how the support member 11 rotates, its connecting hole 112 can still connect to the air duct groove 3012, making it more versatile.

[0065] As an optional implementation, the adsorption hole 111 is opened at the central axis of the carrier 11. It can be understood that the size of the chips is different, but they will all be placed at the center of the carrier 11. By opening the adsorption hole 111 at the central axis of the carrier 11, it can be ensured that both large and small chips can be adsorbed, making it more applicable.

[0066] Please continue reading. Figure 1 Furthermore, the die bonding assembly 100 also includes an image recognition device 40 connected to the drive mechanism 12 via a signal. Understandably, the image recognition device 40 is used to acquire images of the chip placed on the carrier 11. By comparing the acquired chip image with a preset image corresponding to the circuit board mounting position, it analyzes the data that needs adjustment, forms a data signal, and then sends it to the drive mechanism 12 via wired or wireless means, thereby controlling the drive mechanism 12 to drive the carrier 11 to perform adjustment actions.

[0067] Understandably, the image analysis and data signal transmission can be performed by a built-in control and analysis module in the image recognition device 40; or the acquired chip image can be transmitted to a cloud server for image analysis and data signal transmission, i.e., it can be processed through a cloud server.

[0068] Furthermore, the image recognition device 40 includes a first camera 401, which is horizontally positioned with its camera facing the limiting plate 30. By setting the first camera 401 horizontally, the height of the chip can be quickly identified, and it can be determined whether there is a height difference with adjacent chips, so as to provide information to the adjustment component to fine-tune the chip height. In addition, the side information of the chip acquired by the first camera 401 can also be used to determine whether the chip is aligned, so as to provide information to the drive mechanism 12 to fine-tune the chip orientation.

[0069] Furthermore, the central axis of the first camera 401 is located on or above the plane of the upper surface of the limiting plate 30. This setting allows the first camera 401 to capture the side of the chip completely without being blocked by the limiting plate, resulting in better recognition.

[0070] Furthermore, the image recognition device 40 also includes a second camera 402, which is vertically positioned and movable to the limiting plate 30. The second camera 402's shooting direction is towards the upper surface of the limiting plate 30. By setting the second camera 402 to shoot the upper surface of the chip from top to bottom, it is possible to determine whether the chip is aligned correctly from its upper surface, providing clearer directional information and enabling more precise adjustment.

[0071] Understandably, as an optional implementation, the chip images captured by the first camera 401 and the second camera 402 can be fused and analyzed to avoid shooting errors in a single image, improve recognition accuracy, and further improve adjustment precision.

[0072] As an optional implementation, the second camera 402 is disposed on one side of the main body 51 and moves synchronously with the main body 51. This arrangement avoids the second camera 402 from affecting the movement of the suction device 50, and eliminates the need for a separate component to fix the second camera 402, simplifying the structure and saving costs.

[0073] Please see Figure 10 The second embodiment of the present invention provides a die bonder 200, which includes the die bonder assembly 100 provided in the first embodiment.

[0074] Please see Figure 11 The third embodiment of the present invention provides a die bonding method, which is implemented by the die bonding component provided in the first embodiment. The die bonding method specifically includes the following steps:

[0075] Step S1: Transfer the chip to the transfer carrier device according to the preset position;

[0076] Step S2: Rotate and / or raise / lower the corresponding carrier to correct the orientation of the chip;

[0077] Step S3: Replace with a nozzle with at least two suction ports to pick up multiple chips from the transfer carrier at once and transfer them to the soldering position for soldering.

[0078] In step S1 and step S3, the chip transfer can be performed using the same suction device body. The difference is that in step S1, the suction device body is connected to a single suction nozzle, while in step S3, the suction nozzle on the body needs to be replaced with a suction nozzle with multiple suction nozzles.

[0079] Specifically, step S2 further includes: capturing an image of the chip on the transfer carrier using an image recognition device to obtain an image of the chip on the transfer carrier. The image recognition device can have a built-in control and analysis module for image analysis and data signal transmission; alternatively, the acquired chip image can be transmitted to a cloud server for image analysis and data signal transmission, i.e., it can be processed via a cloud server. The processed data information can be transmitted to the drive mechanism of the transfer carrier via wired or wireless means, and the drive mechanism rotates and / or raises the connected carrier to correct the orientation of the chip.

[0080] To better understand this method, the mounting process of a semiconductor cooler is used as an example. It can be understood that a semiconductor cooler consists of an upper ceramic plate, a cooling chip, and a lower ceramic plate, with the cooling chip positioned between the upper and lower ceramic plates. First, the lower ceramic chip is fixed on the die bonding stage. Then, the cooling chips in the cassette are placed one by one onto the carrier of the transfer carrier device using a standard single-nozzle suction nozzle. Each time a chip is placed, the image recognition device captures and analyzes the image, controlling the drive mechanism to adjust the corresponding carrier. After each chip is placed and adjusted, the positions of several cooling chips on the transfer carrier device correspond one-to-one with the preset mounting positions on the lower ceramic chip. Next, the suction device moves autonomously to the nozzle holder, replacing the standard single-nozzle suction nozzle with a multi-nozzle suction nozzle that matches the lower ceramic chip to be mounted. It then moves back to the transfer carrier device to pick up all the cooling chips at once and moves the entire device to the die bonding stage, mounting all the cooling chips onto the lower ceramic chip in one go. Finally, the suction device can move back to the nozzle holder, replacing the multi-nozzle suction nozzle with a single-nozzle suction nozzle that can pick up the upper ceramic chip, picking it up from the cassette, positioning it, and then moving it to the die bonding stage to complete the mounting process.

[0081] Compared with the prior art, the die bonding assembly, die bonding machine and die bonding method provided by the present invention have the following advantages:

[0082] 1. The die bonding assembly of the present invention includes a suction device and a transfer carrier device. The suction device includes a body and a suction nozzle. The suction nozzle includes a connecting part and a suction part. The connecting part is detachably connected to the body. The suction part has at least two suction nozzle openings at one end away from the connecting part. The transfer carrier device includes at least two carriers for placing chips that are rotatable and / or liftable. During operation, the body drives the suction nozzle to move to the transfer carrier device. The suction nozzle openings correspond one-to-one with the carriers to pick up and remove chips from at least two carriers at a time. It is understandable that each carrier component pre-layouts the positions of the chips to be mounted on the circuit board. Each carrier component can hold a chip. After placing each chip, the orientation and / or height of the chip is adjusted by rotating and / or raising / lowering the carrier component. Once all the chips on the carrier components are adjusted, the chips on the entire transfer carrier device correspond one-to-one with the chip positions on the circuit board to be mounted, and the nozzles correspond one-to-one with the carrier components, i.e., one-to-one with the chips on the carrier components. This allows for the simultaneous pickup of chips from the carrier components and their movement to the mounting position for placement. By pre-adjusting and positioning the chips on the carrier components of the transfer carrier device, during mounting, only one reference point on the circuit board needs to be aligned to accurately mount the entire board of chips, greatly improving the overall mounting accuracy. Furthermore, existing placement methods involve moving each chip individually to a transfer station for positioning and identification, and then moving each chip individually from the transfer station to the placement position for placement. This invention, by picking up the entire board of chips from the transfer carrier in one go, reduces the multiple journeys from the transfer station to the placement position to a single journey, significantly saving time and improving placement efficiency. Additionally, by designing the nozzle with multiple nozzle openings, the connection method between the other end of the nozzle and the main body can be maintained, allowing the use of a universal binding head with other nozzle models, increasing the applicability and practicality of this invention.

[0083] 2. By setting the end of the connecting part away from the suction part as an outwardly convex spherical surface or an outwardly convex parabolic surface, when the connecting part is installed into the connecting cavity on the body, the outwardly convex spherical surface or the outwardly convex parabolic surface can guide the suction nozzle to slightly shift to the side, so that the connecting part can smoothly enter the connecting cavity. This prevents the side wall of the connecting cavity from making hard contact with the upper end of the suction nozzle and causing damage when the connecting cavity is not completely aligned with the suction nozzle or when the suction nozzle is skewed on the suction frame.

[0084] 3. A limiting block is provided on one side of the connecting part of the present invention, and a limiting notch is provided at the end of the main body near the nozzle. When the connecting part is connected to the main body, the limiting block enters the limiting notch. By aligning the limiting block with the limiting notch, it can be ensured that the nozzle does not rotate relative to the main body after installation. When the main body drives the nozzle to adjust the chip on the corresponding carrier, the control is more precise, thereby ensuring more accurate adsorption and mounting.

[0085] 4. The transfer carrier device of the present invention further includes a limiting plate with a receiving hole, in which the carrier component is movably disposed. It is understood that the high concentration of chips on the circuit board and the small distance between chips result in a small distance between the corresponding carrier components, and the volume of a single carrier component is also reduced. By setting the limiting plate and confining the carrier component within the receiving hole, the stability of the carrier component can be enhanced, preventing the carrier component from tilting and affecting positioning accuracy.

[0086] 5. The transfer carrier device of the present invention includes a drive mechanism correspondingly connected to the carrier component. The carrier component is connected to the drive mechanism via a connector. The drive mechanism includes a rotary drive assembly and a lifting drive assembly. The rotary drive assembly drives the carrier component to rotate via the connector, and the lifting drive assembly drives the carrier component to rise and fall via the connector. By setting the rotary drive assembly, the chip skew can be finely adjusted to prevent misalignment during mounting; by setting the lifting drive assembly, the upper surface of the chip can be leveled to ensure that the pick-up device can pick up multiple chips simultaneously without missing any.

[0087] 6. The die-bonding assembly of the present invention further includes an image recognition device connected to the driving mechanism via signals. The image recognition device includes a first camera, a horizontally positioned limiting plate, and a horizontally upward-facing surface of the limiting plate defined as the upper surface. One end of the carrier protrudes from the upper surface. The first camera is horizontally positioned with its imaging direction facing the limiting plate. By setting the first camera horizontally, the height of the chip can be quickly identified, and it can be determined whether there is a height difference with adjacent chips, so as to provide information to the driving mechanism for fine-tuning the chip height. In addition, the chip side information acquired by the first camera can also be used to determine whether the chip is aligned, so as to provide information to the driving mechanism for fine-tuning the chip orientation.

[0088] 7. The image recognition device of the present invention further includes a second camera, which is vertically arranged and movable to the limiting plate, with the shooting direction of the second camera facing the upper surface of the limiting plate. By setting the second camera to shoot the upper surface of the chip from top to bottom, it is possible to determine whether the chip is aligned correctly from the upper surface of the chip, making the orientation information of the chip clearer and the adjustment more precise.

[0089] 8. The second camera of the present invention is disposed on one side of the main body and moves synchronously with the main body. This arrangement avoids the second camera from affecting the movement of the suction device, and eliminates the need for a separate component to fix the second camera, thus simplifying the structure and saving costs.

[0090] 9. The present invention also provides a die bonder and a die bonder method, which have the same beneficial effects as the die bonder components described above, and will not be described in detail here.

[0091] The foregoing has provided a detailed description of a die bonding component, die bonding machine, and die bonding method disclosed in the embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent substitutions, and improvements made within the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A die-bonding assembly for transferring chips, characterized in that: The device includes a material suction device and a transfer carrier device. The material suction device includes a body and a suction nozzle. The suction nozzle includes a connecting part and a material suction part. The connecting part is detachably connected to the body. The material suction part has at least two suction nozzle openings at one end away from the connecting part. The transfer carrier device includes a limiting plate, at least two carriers for placing chips, and a drive mechanism corresponding to and connected to the carriers. The limiting plate has a receiving hole, and the carrier is movably disposed in the receiving hole; the carrier has an adsorption hole and at least one connecting hole, the inner wall of the receiving hole has an annular air duct groove, the connecting hole connects the adsorption hole and the air duct groove, and the limiting plate has a negative pressure channel connecting the air duct groove and an external vacuum device. The carrier is connected to the driving mechanism via a connector. The driving mechanism includes a rotation drive and a lifting drive. The rotation drive drives the carrier to rotate via the connector to fine-tune the tilt of the chip on the carrier. The lifting drive drives the carrier to rise and fall via the connector to level the upper surface of the chip. During operation, the main body moves the suction nozzle to the transfer carrier device, and the suction nozzle opening corresponds one-to-one with the carrier to pick up and remove chips from at least two of the carriers at a time.

2. The die-bonding assembly as described in claim 1, characterized in that: The end of the connecting part away from the suction part is a convex spherical surface or a convex parabolic surface, and the main body has a connecting cavity that matches the connecting part; when the connecting part is connected to the connecting cavity, the end of the connecting part away from the suction part enters the connecting cavity.

3. The die-bonding assembly as described in claim 1, characterized in that: A limiting block is provided on one side of the connecting part, and a limiting notch is provided at the end of the body near the nozzle; when the connecting part is connected to the body, the limiting block enters the limiting notch.

4. The die-bonding assembly as described in claim 1, characterized in that: The die bonding assembly further includes an image recognition device connected to the driving mechanism via a signal. The image recognition device includes a first camera. The limiting plate is horizontally positioned, and the horizontally upward surface of the limiting plate is defined as the upper surface. One end of the carrier protrudes from the upper surface. The first camera is horizontally positioned and its imaging direction is towards the limiting plate.

5. The die-bonding assembly as described in claim 4, characterized in that: The image recognition device further includes a second camera, which is vertically positioned and movable to the limiting plate, with the shooting direction of the second camera facing the upper surface of the limiting plate.

6. The die-bonding assembly as described in claim 5, characterized in that: The second camera is positioned on one side of the main body and moves synchronously with the main body.

7. A die bonder, characterized in that: The die bonder includes the die bonder assembly as described in any one of claims 1-6.

8. A die bonding method, implemented using a die bonding assembly as described in any one of claims 1-6, characterized in that: Includes the following steps: The chip is transferred to the corresponding carrier component of the transfer carrier device according to the preset position; Rotate and / or raise / lower the corresponding carrier components to correct the orientation of the chip; Replace with a nozzle that has at least two suction ports to pick up multiple chips from the transfer carrier at once and transfer them to the soldering position for soldering.

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