Display panel and method for manufacturing display panel

Abstract

The present application discloses a display panel and a method for preparing the display panel, wherein the display panel includes: a substrate, an organic insulating layer, and an inorganic insulating layer; wherein the organic insulating layer is located on one side of the substrate, and the organic insulating layer includes an edge portion and a non-edge portion surrounded by the edge portion; wherein the roughness of the surface of at least a portion of the edge portion facing away from the substrate is less than the roughness of the surface of the non-edge portion facing away from the substrate, and the molecular weight of the substance on the surface of at least a portion of the edge portion facing away from the substrate is greater than the molecular weight of the substance on the surface of the non-edge portion facing away from the substrate; the inorganic insulating layer is located on the side of the organic insulating layer facing away from the substrate, and the orthographic projection of the inorganic insulating layer on the substrate covers the orthographic projection of the organic insulating layer on the substrate. In this way, the present application can reduce the risk of separation between the inorganic insulating layer and the organic insulating layer.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and specifically relates to a display panel and a method for manufacturing the display panel. Background Art

[0002] Currently, display panels generally include multiple stacked layers, such as inorganic and organic insulating layers. During processes such as cutting, peeling, and cleaning of the display panel, there is a risk of peeling between the inorganic and organic insulating layers. Summary of the Invention

[0003] The present application provides a display panel and a method for manufacturing the display panel to reduce the risk of separation between an inorganic insulating layer and an organic insulating layer.

[0004] In order to solve the above technical problems, a technical solution adopted in the present application is: providing a display panel, comprising: a substrate; an organic insulating layer, located on one side of the substrate, the organic insulating layer comprising an edge portion and a non-edge portion surrounded by the edge portion; wherein the roughness of the surface of at least part of the edge portion facing away from the substrate is less than the roughness of the surface of the non-edge portion facing away from the substrate, and the molecular weight of the substance on the surface of at least part of the edge portion facing away from the substrate is greater than the molecular weight of the substance on the surface of the non-edge portion facing away from the substrate; an inorganic insulating layer, located on the side of the organic insulating layer facing away from the substrate, and the orthographic projection of the inorganic insulating layer on the substrate covers the orthographic projection of the organic insulating layer on the substrate.

[0005] The invention further includes a protective layer located between the organic insulating layer and the inorganic insulating layer and covering at least a portion of the edge portion. Preferably, the adhesion between the protective layer and the edge portion is greater than the adhesion between the edge portion and the inorganic insulating layer, and the adhesion between the protective layer and the inorganic insulating layer is greater than the adhesion between the edge portion and the inorganic insulating layer. This design reduces the probability of separation between the protective layer and the inorganic insulating layer above it, as well as the probability of separation between the protective layer and the edge portion below it.

[0006] The material of the protective layer includes metal. Preferably, the display panel further includes an electrode layer located between the organic insulating layer and the inorganic insulating layer. The orthographic projection of the electrode layer on the organic insulating layer is located within the non-edge portion. The electrode layer and the protective layer are spaced apart from each other and are made of the same material. Preferably, the electrode layer is a cathode layer. The cathode layer is generally thin. Since the cathode layer and the protective layer are spaced apart from each other and the protective layer covers the edge portion, the internal stress of the protective layer is relatively low, and the probability of separation between the protective layer and the surrounding film layers is low.

[0007] The protective layer is provided with at least one first groove on a side facing the inorganic insulating layer, and the inorganic insulating layer fills the first groove. The introduction of the first groove can increase the contact area between the inorganic insulating layer and the protective layer.

[0008] The protective layer includes a first portion and a second portion connected to each other; the orthographic projection of the first portion on the organic insulating layer is located within the organic insulating layer, and the orthographic projection of the second portion on the organic insulating layer is located outside the organic insulating layer; the second portion is provided with the first groove; preferably, in the direction from the first portion to the second portion, the first groove includes a sidewall closest to the organic insulating layer, and the distance between the sidewall and the adjacent edge portion is greater than 10 microns. This design ensures that the protective layer effectively wraps around the edge portion of the organic insulating layer, thereby reducing the probability of separation between the edge portion and the surrounding film layer.

[0009] The orthographic projection of the organic insulating layer on the substrate is located within the substrate, and the second portion contacts the substrate. The substrate includes a first inorganic layer closest to the organic insulating layer. In the direction from the substrate toward the second portion, the first groove extends through the second portion, and the inorganic insulating layer fills the first groove and contacts the first inorganic layer. This design can enhance adhesion between the inorganic insulating layer and the underlying film layer.

[0010] The display panel further includes an organic adhesive layer covering a side of the inorganic insulating layer facing away from the substrate; the substrate includes a first organic layer located on a side of the first inorganic layer facing away from the inorganic insulating layer; the first organic layer includes a first extension extending beyond the first inorganic layer; the organic adhesive layer covers the first inorganic layer and at least a portion of the first extension adjacent to the first inorganic layer. This design enhances adhesion between the organic adhesive layer and the underlying film layer.

[0011] The substrate comprises a first inorganic layer and a first organic layer stacked together, with the first inorganic layer located between the first organic layer and the organic insulating layer. Alternatively, the substrate comprises a first inorganic layer closest to the organic insulating layer, and the display panel further comprises an array layer located between the organic insulating layer and the substrate. Furthermore, the array layer comprises an interlayer insulating layer, which comprises a third interlayer insulating layer located in a direction from the array layer to the organic insulating layer, and the inorganic insulating layer fills the third groove and contacts the first inorganic layer. This design reduces the probability of separation between the edge portion and surrounding film layers.

[0012] In order to solve the above technical problems, another technical solution adopted in the present application is: providing a method for preparing a display panel, comprising: forming an organic insulating layer on one side of a substrate, wherein the organic insulating layer includes an edge portion and a non-edge portion surrounded by the edge portion; performing plasma treatment on the side of the non-edge portion facing away from the substrate, so that the roughness of the surface of at least part of the edge portion facing away from the substrate is less than the roughness of the surface of the non-edge portion facing away from the substrate, and the molecular weight of the substance on the surface of the edge portion facing away from the substrate is greater than the molecular weight of the substance on the surface of the non-edge portion facing away from the substrate; forming an inorganic insulating layer on the side of the organic insulating layer facing away from the substrate, and the orthographic projection of the inorganic insulating layer on the substrate covers the orthographic projection of the organic insulating layer on the substrate.

[0013] Wherein, before the step of performing plasma treatment on the side of the non-edge portion facing away from the substrate, the step includes: forming a protective layer on the side of at least part of the edge portion facing away from the substrate; preferably, the step of forming a protective layer on the side of at least part of the edge portion facing away from the substrate includes: forming a metal layer on the side of the organic insulating layer facing away from the substrate; patterning the metal layer to form an electrode layer and the protective layer, and the electrode layer and the protective layer are spaced apart.

[0014] Generally speaking, before forming the inorganic insulating layer, the surface of the organic insulating layer is subjected to plasma treatment. Although plasma treatment can improve the roughness of the surface of the organic insulating layer, it will also cause the surface film quality of the organic insulating layer to deteriorate, especially the presence of stress abnormalities on the edge surface of the organic insulating layer, which will lead to easy separation between the edge and the inorganic insulating layer. Different from the prior art, the display panel provided by the present application includes an organic insulating layer and an inorganic insulating layer arranged in a stacked manner; wherein the organic insulating layer includes an edge portion and a non-edge portion surrounded by the edge portion; the roughness of the surface of at least part of the edge portion facing away from the substrate is less than the roughness of the surface of the non-edge portion facing away from the substrate, and at the same time, the molecular weight of the substance on the surface of at least part of the edge portion facing away from the substrate is greater than the molecular weight of the substance on the surface of the non-edge portion facing away from the substrate. That is, in the above-mentioned design method, the degree of plasma treatment undergone by the edge portion is less than the degree of plasma treatment undergone by the non-edge portion. For example, the edge portion may not be subjected to plasma treatment. On the one hand, this design method can reduce the probability of abnormal stress points at the edge and the probability of separation between the edge and the inorganic insulating layer; on the other hand, this design method can ensure the adhesion between the non-edge part and the inorganic insulating layer, thereby improving the reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive work, among which:

[0016] Figure 1 This is a schematic structural diagram of an embodiment of a display panel of the present application;

[0017] Figure 2 This is a schematic structural diagram of another embodiment of the display panel of the present application;

[0018] Figure 3 for Figure 2 A schematic top view of an embodiment of a display panel;

[0019] Figure 4 This is a schematic structural diagram of another embodiment of the display panel of the present application;

[0020] Figure 5 This is a schematic structural diagram of another embodiment of the display panel of the present application;

[0021] Figure 6 This is a schematic structural diagram of another embodiment of the display panel of the present application;

[0022] Figure 7FIG. 1 is a flow chart of an embodiment of a method for manufacturing a display panel of the present application. DETAILED DESCRIPTION

[0023] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0024] After extensive research, the inventors discovered that, to improve encapsulation and reliability, plasma treatment is typically performed on the surface of the film layer that will come into contact with the inorganic insulating layer before forming the inorganic insulating layer. This increases the surface roughness of the film layer and thereby enhances adhesion. For example, prior to forming the inorganic insulating layer within the encapsulation layer, plasma treatment with N2O (laughing gas) was performed on the surface of the organic insulating layer that would come into contact with the inorganic insulating layer. After the inorganic insulating layer within the encapsulation layer is formed, the film layer within the cut lanes of the display panel may separate, affecting yield and reliability. The reason for this is that during plasma treatment, the surface quality of the organic insulating layer deteriorates, resulting in stress anomalies between the inorganic insulating layer and the organic insulating layer. Furthermore, due to the etching process at the cutting path of the display panel, the organic insulating layer with surface anomalies at the cutting path will be etched away, but the organic insulating layer with stress anomalies covered by the inorganic insulating layer is not etched away. There is a step difference between the etched area and the unetched area, and this step difference makes the edge of the organic insulating layer generally a weak point. During subsequent separation, cleaning, and other processes, the weak point continues to deteriorate, ultimately leading to film separation. Of course, in other embodiments, similar separation phenomena may also occur in the film layer located in the non-cutting path of the display panel. The specific reasons are similar to those in the cutting path and will not be elaborated on here.

[0025] To solve the above technical problems, please refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of one embodiment of a display panel. The display panel can include cutting lines before shipment or remove them after shipment. The display panel can be an OLED display panel, a Micro-LED display panel, a liquid crystal display panel, or the like. The display panel specifically includes a substrate 10, an organic insulating layer 12, and an inorganic insulating layer 14.

[0026] The substrate 10 may include at least one organic layer and at least one inorganic layer stacked together. The organic layer may be made of a flexible material such as polyimide, and the inorganic layer may be made of a material with good water vapor barrier properties such as silicon nitride. Figure 1As shown, the substrate 10 includes a first inorganic layer 100 and a first organic layer 102 stacked together, and the orthographic projection of the first inorganic layer 100 on the first organic layer 102 is located within the first organic layer 102, that is, the outer edge of the first inorganic layer 100 can be retracted relative to the first organic layer 102. Of course, in other embodiments, such as Figure 1 As shown in , the substrate 10 may further include a second inorganic layer 104 and a second organic layer 106, the second inorganic layer 104 being stacked between the first organic layer 102 and the second organic layer 106, and the orthographic projection of the second inorganic layer 104 on the first organic layer 102 may coincide with the first organic layer 102, and the orthographic projection of the second organic layer 106 on the first organic layer 102 may coincide with the first organic layer 102.

[0027] The organic insulating layer 12 is located on one side of the substrate 10, for example, Figure 1 The first inorganic layer 100 is located on a side facing away from the first organic layer 102; the organic insulating layer 12 includes an edge portion 120 and a non-edge portion 122 surrounded by the edge portion 120. Optionally, the edge portion 120 may be annular (e.g., a circular ring, a rectangular ring, a rounded rectangular ring, etc.) and is disposed around the periphery of the non-edge portion 122. The roughness of the surface of at least a portion of the edge portion 120 facing away from the substrate 10 is less than the roughness of the surface of the non-edge portion 122 facing away from the substrate 10, and the molecular weight of the substance on the surface of at least a portion of the edge portion 120 facing away from the substrate 10 is greater than the molecular weight of the substance on the surface of the non-edge portion 122 facing away from the substrate 10.

[0028] Optionally, the roughness of the surface of all edge portions 120 facing away from the substrate 10 is less than the roughness of the surface of the non-edge portion 122 facing away from the substrate 10, and the molecular weight of the substance on the surface of all edge portions 120 facing away from the substrate 10 is greater than the molecular weight of the substance on the surface of the non-edge portion 122 facing away from the substrate 10. The specific division method of the above-mentioned edge portion 120 and non-edge portion 122 can be to use the portion within a preset distance range from the outer edge of the organic insulating layer 12 as the edge portion 120, and the preset distance range can be set according to actual conditions. Generally speaking, the display panel can be provided with a stacked array layer 11, a light-emitting layer, an encapsulation layer and a touch layer on the side facing away from the substrate 10. Optionally, the organic insulating layer 12 can be a planarization layer between the array layer 11 and the light-emitting layer in the display panel or an organic encapsulation layer within the encapsulation layer.

[0029] The inorganic insulating layer 14 is located on the side of the organic insulating layer 12 away from the substrate 10, and the orthographic projection of the inorganic insulating layer 14 on the substrate 10 covers the orthographic projection of the organic insulating layer 12 on the substrate 10; optionally, the material of the inorganic insulating layer 14 can be silicon oxide, etc., and it can be an inorganic encapsulation layer in the encapsulation layer of the display panel or an inorganic insulating layer in the touch layer, etc., as long as the inorganic insulating layer 14 is a film layer structure arranged adjacent to the organic insulating layer 12.

[0030] Generally speaking, plasma treatment of the organic insulating layer 12 causes the surface of the organic insulating layer 12 to become rough, and the molecular chains in the organic insulating layer 12 may break. In the above design, the edge portion 120 of the organic insulating layer 12 undergoes a lesser degree of plasma treatment than the non-edge portion 122. For example, the edge portion 120 may not undergo plasma treatment. On the one hand, this design reduces the probability of stress anomalies in the edge portion 120, and reduces the probability of separation between the edge portion 120 and the inorganic insulating layer 14. On the other hand, this design ensures adhesion between the non-edge portion 122 and the inorganic insulating layer 14. For example, the non-edge portion 122 is in direct contact with the inorganic insulating layer 14, thereby improving the reliability of the display panel.

[0031] In one embodiment, a mask may be used to prevent the edge portion 120 of the organic insulating layer 12 from being subjected to the plasma treatment.

[0032] In another embodiment, Figure 2 and Figure 3 As shown, Figure 2 This is a schematic structural diagram of another embodiment of the display panel of the present application. Figure 3 for Figure 2 A schematic top view of an embodiment of a display panel. In this embodiment, the protective layer 16 can also be used to prevent the edge portion 120 of the organic insulating layer 12 from being subjected to plasma treatment. Specifically, the protective layer 16 is located between the organic insulating layer 12 and the inorganic insulating layer 14, and covers at least a portion of the edge portion 120; wherein the roughness of the surface of the edge portion 120 covered by the protective layer 16 facing away from the substrate 10 is less than the roughness of the surface of the non-edge portion 122 facing away from the substrate 10, and the molecular weight of the substance on the surface of the edge portion 120 covered by the protective layer 16 facing away from the substrate 10 is greater than the molecular weight of the substance on the surface of the non-edge portion 122 facing away from the substrate 10. That is, the edge portion 120 of the organic insulating layer 12 is not subjected to plasma treatment by the introduction of the protective layer 16. Furthermore, when the material of the protective layer 16 is certain removable substances (for example, photoresist), the protective layer 16 may not be included in the display panel finally formed. When the material of the protective layer 16 is a substance that is difficult to remove (for example, metal), the finally formed display panel may include the protective layer 16 .

[0033] Optionally, the adhesion between the protective layer 16 and the edge portion 120 is greater than the adhesion between the edge portion 120 and the inorganic insulating layer 14, and the adhesion between the protective layer 16 and the inorganic insulating layer 14 is greater than the adhesion between the edge portion 120 and the inorganic insulating layer 14. This design approach can reduce the probability of separation between the introduced protective layer 16 and the inorganic insulating layer 14 above it, and the probability of separation between the protective layer 16 and the edge portion 120 below it, thereby improving the reliability of the display panel.

[0034] In one application scenario, the protective layer 16 is made of metal. Generally speaking, when the organic insulating layer 12 is treated with plasma, the plasma intensity does not affect the metal protective layer 16; or even if it does, it only roughens the surface of the protective layer 16 without forming stress abnormalities. In other words, the probability of subsequent separation between the protective layer 16 and the inorganic insulating layer 14 is low.

[0035] Optionally, the display panel further includes an electrode layer (not shown) positioned between the organic insulating layer 12 and the inorganic insulating layer 14. The orthographic projection of the electrode layer on the organic insulating layer 12 is positioned within the non-edge portion 122. The electrode layer and the protective layer 16 are spaced apart from each other and made of the same material and thickness. This design allows the electrode layer and the protective layer 16 to be fabricated simultaneously, reducing the complexity of the fabrication process.

[0036] Preferably, the organic insulating layer 12 can be a planarization layer, and the electrode layer can be a cathode layer. On the one hand, the cathode layer is the metal layer closest to the inorganic insulating layer. Therefore, after the cathode layer is prepared, the waiting time for preparing the inorganic insulating layer is short, and the adhesion between the metal layer and the inorganic insulating layer is strong. On the other hand, the cathode layer is generally thin. Since the cathode layer and the protective layer 16 are spaced apart from each other and the protective layer 16 covers the edge portion 120, the internal stress of the protective layer 16 is relatively low, and the probability of separation between the protective layer 16 and the surrounding film layers is low.

[0037] Please refer again Figure 2 At least one first groove 160 is provided on the side of the protective layer 16 facing the inorganic insulating layer 14, and the inorganic insulating layer 14 fills the first groove 160. The introduction of the first groove 160 can increase the contact area between the inorganic insulating layer 14 and the protective layer 16, thereby increasing the adhesion between the two and reducing the probability of separation between the two.

[0038] Alternatively, as Figure 2As shown, the protective layer 16 includes a first portion 162 and a second portion 164 connected to each other. The orthographic projection of the first portion 162 on the organic insulating layer 12 is located inside the organic insulating layer 12, and the orthographic projection of the second portion 164 on the organic insulating layer 12 is located outside the organic insulating layer 12. The second portion 164 is provided with a first groove 160. That is, the first groove 160 is provided on the second portion 164 located outside the organic insulating layer 12 to reduce the impact of the formation process of the first groove 160 on the organic insulating layer 12.

[0039] Further, in the direction from the first portion 162 to the second portion 164 (ie Figure 2 The first groove 160 includes a sidewall 1600 closest to the organic insulating layer 12, and a distance D between the sidewall 1600 and the adjacent edge portion 120 is greater than 10 microns. This design ensures that the protective layer 16 effectively wraps around the edge portion 120 of the organic insulating layer 12, thereby reducing the possibility of separation between the edge portion 120 and the surrounding film layers.

[0040] Please continue reading Figure 2 , the orthographic projection of the organic insulating layer 12 on the substrate 10 is located within the substrate 10, and the second portion 164 is in contact with the substrate 10; wherein the substrate 10 includes the first inorganic layer 100 closest to the organic insulating layer 12, in the direction from the substrate 10 to the second portion 164 (i.e. Figure 2 In the direction indicated by Y in the figure, first groove 160 extends through second portion 164. Inorganic insulating layer 14 fills first groove 160 and contacts first inorganic layer 100, creating direct contact between inorganic materials at this location. Generally, similar substances have strong adhesion to each other, so this design approach can increase the adhesion between inorganic insulating layer 14 and the underlying film layer, reducing the likelihood of separation between the film layers encapsulated by inorganic insulating layer 14.

[0041] Please continue reading Figure 2 The display panel provided in this application may further include an organic adhesive layer 18 (e.g., optical adhesive (OCA)) covering the side of the inorganic insulating layer 14 facing away from the substrate 10. The substrate 10 includes a first organic layer 102 located on the side of the first inorganic layer 100 facing away from the inorganic insulating layer 14. The first organic layer 102 includes a first extension 1020 extending beyond the first inorganic layer 100 (i.e., the orthographic projection of the first extension 1020 on the first inorganic layer 100 is located outside the first inorganic layer 100). The organic adhesive layer 18 covers the inorganic insulating layer 14, the first inorganic layer 100, and at least a portion of the first extension 1020 adjacent to the first inorganic layer 100. This design allows the organic adhesive layer 18 to contact the first extension 1020, which is also an organic material, thereby enhancing the adhesion between the organic adhesive layer 18 and the underlying film layers, thereby reducing the probability of separation between the film layers wrapped by the organic adhesive layer 18.

[0042] See also Figure 4 and Figure 5 , Figure 4 This is a schematic structural diagram of another embodiment of the display panel of the present application. Figure 5 This is a schematic diagram of the structure of another embodiment of the display panel of the present application. Figure 4 It can be understood as Figure 1 Further improvements based on Figure 5 It can be understood that Figure 2 The substrate 10 comprises a stacked first inorganic layer 100 and a first organic layer 102, with the first inorganic layer 100 positioned between the first organic layer 102 and the organic insulating layer 12. The first inorganic layer 100 includes a through-hole 1000 extending from the first inorganic layer 100 toward the first organic layer 102, and the edge portion 120 fills the second groove 1000 and contacts the first organic layer 102. Since both the edge portion 120 and the first organic layer 102 are made of organic materials, the adhesion between them is strong, thus reducing the probability of separation between the edge portion 120 and surrounding layers.

[0043] Optionally, in this embodiment, if Figure 4 and Figure 5 As shown, other film layers, for example, an array layer 11 and a planarization layer 13, may be stacked between the organic insulating layer 12 and the first inorganic layer 100. The first inorganic layer 100 includes a second extension portion 1002 whose orthographic projection is located outside the other film layers, and the second groove 1000 is located on the second extension portion 1002.

[0044] See also Figure 6 , Figure 6 This is a schematic diagram of the structure of another embodiment of the display panel of the present application. Figure 6 It can be understood as Figure 1 The substrate 10 includes a first inorganic layer 100 closest to the organic insulating layer 12; the display panel also includes an array layer 11, located between the organic insulating layer 12 and the substrate 10; wherein the array layer 11 includes an interlayer insulating layer, in the direction of the array layer 11 pointing to the organic insulating layer 12 (i.e. Figure 6 In the direction indicated by Y in the figure, the interlayer insulating layer is provided with a through third groove 110. The inorganic insulating layer 14 fills the third groove 110 and contacts the first inorganic layer 100. In other words, the outer edge of the interlayer insulating layer now extends beyond the outer edge of the organic insulating layer 12, and the portion of the interlayer insulating layer that extends beyond the organic insulating layer 12 is provided with the third groove 110. Since both the inorganic insulating layer 14 and the first inorganic layer 100 are inorganic materials, the adhesion between them is strong, thereby reducing the probability of separation between the inorganic insulating layer 14 and surrounding film layers.

[0045] In an application scenario, such as Figure 2 As shown, the organic insulating layer 12 is a planarization layer between the array layer 11 and the light-emitting layer in the display panel, and the inorganic insulating layer 14 is an inorganic insulating layer in the touch layer. Figure 3 As shown, Figure 3 The dotted box in the middle is regarded as the cutting line, and the outer portion of the cutting line away from the display area AA can be regarded as the portion located on the cutting path, that is, the portion to be cut and removed. At this time, the above display panel can be regarded as the display panel before cutting. Alternatively, the cutting line can also be located at Figure 3 The outside of the overall structure, that is, the above-mentioned display panel can be regarded as a display panel shipped after cutting.

[0046] See also Figure 7 , Figure 7 This is a flow chart of an embodiment of a method for manufacturing a display panel of the present application. The method comprises:

[0047] S101 : forming an organic insulating layer on one side of a substrate, wherein the organic insulating layer includes an edge portion and a non-edge portion surrounded by the edge portion.

[0048] Specifically, the organic insulating layer may be formed by inkjet printing, coating, or the like.

[0049] S102: Plasma treatment is performed on the side of the non-edge portion facing away from the substrate, so that the roughness of the surface of at least part of the edge portion facing away from the substrate is smaller than the roughness of the surface of the non-edge portion facing away from the substrate, and the molecular weight of the substance on the surface of the edge portion facing away from the substrate is greater than the molecular weight of the substance on the surface of the non-edge portion facing away from the substrate.

[0050] Specifically, the edge portion that does not need to be subjected to plasma treatment can be shielded by means of a mask.

[0051] Alternatively, before step S102, the method further includes forming a protective layer on at least a portion of the edge portion facing away from the substrate. Alternatively, the method further includes forming a metal layer on the side of the organic insulating layer facing away from the substrate, and patterning the metal layer to form an electrode layer and a protective layer, wherein the electrode layer and the protective layer are spaced apart.

[0052] S103: forming an inorganic insulating layer on the side of the organic insulating layer facing away from the substrate, and the orthographic projection of the inorganic insulating layer on the substrate covers the orthographic projection of the organic insulating layer on the substrate.

[0053] The above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display panel, characterized in that: include: substrate; an organic insulating layer located on one side of the substrate, the organic insulating layer comprising an edge portion and a non-edge portion surrounded by the edge portion; wherein, after plasma treatment, a surface roughness of at least a portion of the edge portion on a side facing away from the substrate is less than a surface roughness of the non-edge portion on a side facing away from the substrate, and a molecular weight of a substance on the surface of at least a portion of the edge portion on a side facing away from the substrate is greater than a molecular weight of a substance on the surface of the non-edge portion on a side facing away from the substrate; an inorganic insulating layer, located on a side of the organic insulating layer facing away from the substrate, and an orthographic projection of the inorganic insulating layer on the substrate covers an orthographic projection of the organic insulating layer on the substrate; a protective layer located between the organic insulating layer and the inorganic insulating layer and covering at least a portion of the edge portion; wherein the adhesion between the protective layer and the edge portion is greater than the adhesion between the edge portion and the inorganic insulating layer, and the adhesion between the protective layer and the inorganic insulating layer is greater than the adhesion between the edge portion and the inorganic insulating layer; The protective layer includes a first portion and a second portion connected to each other; wherein the orthographic projection of the first portion on the organic insulating layer is located inside the organic insulating layer, and the orthographic projection of the second portion on the organic insulating layer is located outside the organic insulating layer; the protective layer is provided with at least one first groove on a side facing the inorganic insulating layer, and the inorganic insulating layer fills the first groove; the second portion is provided with the first groove; The orthographic projection of the organic insulating layer on the substrate is located within the substrate, and the second portion is in contact with the substrate; wherein the substrate includes a first inorganic layer closest to the organic insulating layer, and in the direction from the substrate to the second portion, the first groove passes through the second portion, and the inorganic insulating layer fills the first groove and is in contact with the first inorganic layer.

2. The display panel according to claim 1, wherein: The material of the protective layer includes metal.

3. The display panel according to claim 2, wherein: The display panel also includes: an electrode layer, located between the organic insulating layer and the inorganic insulating layer; wherein, the orthographic projection of the electrode layer on the organic insulating layer is located within the non-edge portion, the electrode layer and the protective layer are spaced apart from each other, and the electrode layer and the protective layer are made of the same material.

4. The display panel according to claim 3, wherein: The electrode layer is a cathode layer.

5. The display panel according to claim 1, wherein: In a direction from the first portion to the second portion, the first groove includes a sidewall closest to the organic insulating layer, and a distance between the sidewall and the adjacent edge portion is greater than 10 micrometers.

6. The display panel according to claim 1, wherein: The display panel further includes: an organic adhesive layer covering a side of the inorganic insulating layer facing away from the substrate; In which, the substrate includes a first organic layer, which is located on the side of the first inorganic layer away from the inorganic insulating layer; and the first organic layer includes a first extension portion extending beyond the first inorganic layer, and the organic glue layer covers the first inorganic layer and at least a portion of the first extension portion adjacent to the first inorganic layer.

7. The display panel according to claim 1, wherein: The substrate includes a first inorganic layer and a first organic layer stacked together, and the first inorganic layer is located between the first organic layer and the organic insulating layer; wherein, in a direction from the first inorganic layer to the first organic layer, the first inorganic layer includes a penetrating second groove, and the edge portion fills the second groove and contacts the first organic layer; or, The substrate includes a first inorganic layer closest to the organic insulating layer; the display panel also includes an array layer located between the organic insulating layer and the substrate; wherein the array layer includes an interlayer insulating layer, and the interlayer insulating layer is provided with a through third groove in the direction from the array layer to the organic insulating layer, and the inorganic insulating layer fills the third groove and contacts the first inorganic layer.

8. A method for preparing a display panel, characterized in that: include: forming an organic insulating layer on one side of the substrate, wherein the organic insulating layer includes an edge portion and a non-edge portion surrounded by the edge portion; performing plasma treatment on the side of the non-edge portion facing away from the substrate, so that the roughness of at least a portion of the surface of the edge portion facing away from the substrate is less than the roughness of the surface of the non-edge portion facing away from the substrate, and the molecular weight of a substance on the surface of the edge portion facing away from the substrate is greater than the molecular weight of a substance on the surface of the non-edge portion facing away from the substrate; An inorganic insulating layer is formed on a side of the organic insulating layer facing away from the substrate, and an orthographic projection of the inorganic insulating layer on the substrate covers an orthographic projection of the organic insulating layer on the substrate.

9. The preparation method according to claim 8, characterized in that Before the step of performing plasma treatment on the side of the non-edge portion facing away from the substrate, the method includes: forming a protective layer on at least a portion of the side of the edge portion facing away from the substrate.

10. The preparation method according to claim 9, characterized in that The step of forming a protective layer on at least part of the edge portion facing away from the substrate includes: forming a metal layer on the side of the organic insulating layer facing away from the substrate; patterning the metal layer to form an electrode layer and the protective layer, and the electrode layer and the protective layer are spaced apart.

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