Package for electronic component, electronic component, and oscillator

Abstract

The present application provides an electronic component package, an electronic component, and an oscillator, which have high airtightness. The electronic component package has a lid, a first layer, a second layer disposed between the first layer and the lid to form a first frame, a third layer disposed between the second layer and the lid to form a second frame, a joining member joining the third layer and the lid, and a via wiring electrically connected to the lid and penetrating the second frame. When the inner diameter of a first corner portion of the first frame is R1, the inner diameter of a second corner portion of the second frame overlapping the first corner portion in plan view is R2, and R1 < R2, the inner side surface of the second corner portion extends from the inner side surface of the first corner portion in cross-sectional view.

Description

Technical Field

[0001] This invention relates to packages for electronic components, electronic components, and oscillators. Background Technology

[0002] For example, Patent Document 1 discloses a package for electronic components, which is configured such that a frame-shaped second insulating layer is stacked on top of a flat first insulating layer, and a frame-shaped third insulating layer is stacked on top of the second insulating layer. This package for electronic components consists of a base with recesses that are rectangular in plan view and a cover with a sealing material that is also rectangular in plan view. A portion of each of the four corners of the inner periphery of the second insulating layer of the base extends inward toward the recesses and is exposed in plan view. Therefore, even if molten sealing material flows down the inner wall toward the inner bottom surface of the base, the molten sealing material will remain in the exposed portion due to surface tension, preventing further flow into the lower inner bottom surface of the base, thus enabling a reliable hermetic seal.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2009-60260

[0004] However, the packaging for electronic components described in Patent Document 1 has the following problem: the molten sealing material flows along the electrodes on the inner wall to the part exposed when viewed from above, so the sealing material in the sealing area may be insufficient, resulting in reduced airtightness. Summary of the Invention

[0005] An electronic component package includes: a cover; a first layer; a second layer disposed between the first layer and the cover, forming a first frame; a third layer disposed between the second layer and the cover, forming a second frame; a coupling member that joins the third layer to the cover; and a through-hole wiring electrically connected to the cover and penetrating the second frame. When the inner diameter of the first corner of the first frame is set to R1 and the inner diameter of the second corner of the second frame, which overlaps with the first corner in a top view, is set to R2, R1 < R2, and the inner surface of the second corner protrudes from the inner surface of the first corner in a cross-section.

[0006] The electronic component includes: the package for electronic components described above; and an integrated circuit element housed in the package for electronic components.

[0007] The oscillator includes: a package for electronic components as described above; an oscillator housed in the package for electronic components; and an integrated circuit element comprising an oscillation circuit for oscillating the oscillator. Attached Figure Description

[0008] Figure 1 This is a top view showing the schematic structure of an electronic component packaged according to the first embodiment.

[0009] Figure 2 yes Figure 1 Sectional view along line AA in the diagram.

[0010] Figure 3 yes Figure 1 BB line section view.

[0011] Figure 4 This is a top view showing the schematic structure of an electronic component packaged according to the second embodiment.

[0012] Figure 5 yes Figure 4 The CC line section view.

[0013] Label Explanation

[0014] 1: Layer 1; 2: Layer 2; 3: Layer 3; 4, 4a: Base; 5, 5a, 6, 6a: Electrodes; 7, 7a: External terminals; 8: Through-hole wiring; 9: Cover; 10, 10a: Package for electronic components; 11: First frame; 12: First corner; 13: Inner side; 14: First straight section; 14a: Layer 4; 15: Side wiring; 16: Through-hole wiring; 17: Internal terminal; 18: Opening; 21: Second frame; 22: Second corner; 23: Inner side; 24: Second straight section; 25: Through-hole wiring; 26: Opening; 30: Integrated circuit element; 30a: First integrated circuit Components; 31: Oscillating circuit; 31a: Third frame; 32: Temperature compensation circuit; 33: Temperature sensor; 34: Second integrated circuit component; 35: Temperature control circuit; 36: Heater; 37a: Opening; 40: Vibrator; 41: Vibrating substrate; 42: Excitation electrode; 43: Electrode pad; 50, 51, 52, 53, 54: Connecting components; 100, 100a: Electronic components; 200, 200a: Oscillator; H1, H2: Thickness; R1, R2: Inner diameter; L1, L2: Length; S: Internal space; S1: First internal space; S2: Second internal space; W1, W2: Width. Detailed Implementation

[0015] 1. First Implementation Method

[0016] First, as an example of an electronic component 100 having the electronic component package 10 of the first embodiment, an oscillator 200 that houses an integrated circuit element 30 and an oscillator 40 is cited. Figure 1 , Figure 2 and Figure 3 Please provide an explanation.

[0017] In addition, Figure 1In order to facilitate the explanation of the internal structure of the oscillator 200 and the electronic component package 10, the state after removing the cover 9 and the oscillator 40 is shown. Furthermore, for ease of explanation, the X-axis, Y-axis, and Z-axis are shown as three mutually perpendicular axes in the following figures. The direction along the X-axis is referred to as the "X-direction," the direction along the Y-axis as the "Y-direction," and the direction along the Z-axis as the "Z-direction." The side with the arrow on each axis is also referred to as the "positive side," and the side opposite to the arrow is referred to as the "negative side." The positive side of the Z-direction is also referred to as "up," and the negative side of the Z-direction is referred to as "down."

[0018] like Figure 1 , Figure 2 and Figure 3 As shown, the oscillator 200 has an integrated circuit element 30, an oscillator 40, and an electronic component package 10 for housing the integrated circuit element 30 and the oscillator 40.

[0019] The package 10 for electronic components includes: a base 4; a cover 9 forming an internal space S between the cover 9 and the base 4; and a coupling member 50 that joins the base 4 and the cover 9, wherein an integrated circuit element 30 and an oscillator 40 are housed within the internal space S.

[0020] The base 4 is rectangular when viewed from the Z direction. It has a flat first layer 1, a second layer 2 disposed between the first layer 1 and the cover 9 and forming a first frame 11, and a third layer 3 disposed between the second layer 2 and the cover 9 and forming a second frame 21. It is formed by stacking the second layer 2 on the first layer 1 and stacking the third layer 3 on the second layer 2.

[0021] In the first layer 1, electrodes 5 and 6 are formed on the surface opposite to the integrated circuit element 30, and are electrically connected to and fixed to the integrated circuit element 30 via bonding members 51 such as gold bumps. Additionally, on the surface opposite to where the electrodes 5 and 6 are formed, external terminals 7 are formed for outputting the output signals of the integrated circuit element 30 to the outside, and external terminals 7 that serve as ground electrodes are electrically connected to the cover 9 via the electrodes 5. Furthermore, multiple through-hole wiring 8 are formed in the first layer 1, penetrating the upper and lower surfaces of the first layer 1, electrically connecting the electrodes 5 and 6 to the external terminals 7. Through-hole wiring refers to wiring in which conductive material is filled within the through-holes in the upper and lower surfaces of the layer.

[0022] Furthermore, the electrode 5 is electrically connected to the integrated circuit element 30 and the side wiring 15 described later, and is disposed at the corner of the mounting area of ​​the first layer 1 defined by the first frame 11. More specifically, it is disposed in the area that contacts the first corner 12 of the first frame 11.

[0023] An opening 18 for forming the first frame 11 is provided in the second layer 2. An internal terminal 17 is formed on the surface opposite the oscillator 40, electrically connected to and fixed to the oscillator 40 via a bonding member 52 such as a conductive adhesive. Furthermore, multiple through-hole wiring 16 penetrating the upper and lower surfaces of the second layer 2 are formed in the second layer 2, electrically connecting the internal terminal 17 to the electrode 6 formed in the first layer 1. Four corner portions, including the first corner portion 12, in the opening 18 of the first frame 11 are provided with corner portions with an inner diameter R1. Additionally, as... Figure 2 As shown, a side wiring 15 is formed on the inner side surface 13 of the first corner portion 12, and is electrically connected to the electrode 5 formed in the first layer 1 and the through-hole wiring 25 provided in the second frame 21 described later. In addition, in this embodiment, the side wiring 15 is formed on the inner side surface 13 of the first corner portion 12, but it is not limited to this, and it may also be formed on the outer side surface of the first corner portion 12 opposite to the integrated circuit element 30.

[0024] Furthermore, the Z-direction dimension, i.e., the thickness H1, of the second layer 2 is greater than the Z-direction dimension, i.e., the thickness H2, of the integrated circuit element 30. Therefore, compared to the case where the thickness H1 of the second layer 2 is smaller than the thickness H2 of the integrated circuit element 30, a larger integrated circuit element 30 can be accommodated within the opening 18 of the first frame 11 used to form the second layer 2.

[0025] In the third layer 3, when viewed from above in the Z direction, an opening 26 for forming the second frame 21 is provided at a position overlapping with the opening 18 of the second layer 2. Furthermore, the opening 26 of the third layer 3 is wider on its negative side in the X direction than the opening 18 of the second layer 2. Therefore, the internal terminal 17 on which the oscillator 40 is fixed is exposed, allowing the oscillator 40 to be fixed to the internal terminal 17 before sealing with the cover 9. The four corner portions, including the second corner portion 22, in the opening 26 of the second frame 21 are provided with corner portions with an inner diameter R2.

[0026] Furthermore, in the third layer 3, a through-hole wiring 25 is formed near the second corner 22, at a position where it connects with the first corner 12 of the second layer 2, penetrating the upper and lower surfaces of the third layer 3. The through-hole wiring 25 is electrically connected to the cover 9 via the connecting member 50, and is electrically connected to the side wiring 15 provided on the inner side surface 13 of the first corner 12 of the second layer 2.

[0027] In addition, such as Figure 1 As shown, when viewed from the Z direction, the inner diameter R2 of the second corner 22 of the second frame 21 and the inner diameter R1 of the first corner 12 of the first frame 11 are related as R1 < R2, that is, the inner diameter R2 of the second corner 22 of the second frame 21 is larger than the inner diameter R1 of the first corner 12 of the first frame 11. Therefore, as Figure 2As shown, when viewed in section from the Y direction, the inner surface 23 of the second corner portion 22 extends in the negative X direction compared to the inner surface 13 of the first corner portion 12. Specifically, the length L2 from the outer surface of the second frame 21 to the inner surface 23 of the second corner portion 22 is greater than the length L1 from the outer surface of the first frame 11 to the inner surface 13 of the first corner portion 12.

[0028] Additionally, in the base 4 of the electronic component package 10, such as Figure 3 As shown, the first frame 11 of the second layer 2 has a first straight section 14 extending from the first corner 12 in the negative X direction. The second frame 21 of the third layer 3 has a second straight section 24 extending from the second corner 22 in the negative X direction and overlapping the first straight section 14 when viewed from above. The width W1 of the first straight section 14 is the same as the width W2 of the second straight section 24. Furthermore, the width of the straight section of the first frame 11 extending from the first corner 12 in the positive Y direction is the same as the width of the straight section of the second frame 21 extending from the second corner 22 in the positive Y direction. Moreover, the width of the straight section extending from the corner of the first frame 11 at a position symmetrical to the X-axis of the first corner 12 in the negative X direction is the same as the width of the straight section extending from the corner of the second frame 21 at a position symmetrical to the X-axis of the second corner 22 in the negative X direction. In this way, by making the width of the straight portions of the first frame 11 and the second frame 21 constituting the base 4 the same, the mechanical strength of the base 4 can be improved.

[0029] The materials used to form the first layer 1, the second layer 2, and the third layer 3 of the base 4 are preferably various ceramics such as oxide ceramics, nitride ceramics, and carbide ceramics, or they may be silicon substrates or glass substrates.

[0030] The cover 9, when viewed from the Z-direction, is a rectangular plate and is joined to the upper surface of the base 4 via a joining member 50. This creates an airtight internal space S between the base 4 and the cover 9, within which the integrated circuit element 30 and the oscillator 40 are housed. Furthermore, the internal space S is in a depressurized state, preferably closer to a vacuum. This reduces viscous resistance and improves the oscillation characteristics of the oscillator 40. Additionally, the cover 9 is preferably made of a conductive metal or similar material, which shields the integrated circuit element 30 and the oscillator 40 from external electromagnetic waves and other noise.

[0031] The bonding component 50 is a solder or the like containing an alloy of Au and Sn. By using an alloy containing Au and Sn, the melting point temperature is increased, which can reduce the heat impact when mounting electronic components with the package 10 onto a printed circuit board or the like.

[0032] The integrated circuit element 30 housed in the internal space S includes an oscillation circuit 31 that causes the oscillator 40 to oscillate.

[0033] The oscillation circuit 31 is electrically connected to the oscillator 40, amplifies the output signal of the oscillator 40, and feeds back the amplified signal to the oscillator 40, thereby causing the oscillator 40 to oscillate.

[0034] The oscillator 40 housed in the internal space S has: a vibrating substrate 41; an excitation electrode 42 that causes the vibrating substrate 41 to vibrate; an electrode pad 43 that outputs a vibration signal to the outside and fixes the oscillator 40 to the electronic component package 10; and lead electrodes (not shown) that electrically connect the excitation electrode 42 and the electrode pad 43.

[0035] The oscillator 40 is fixed to the internal terminal 17 formed on the upper surface of the second layer 2 of the electronic component package 10 via a bonding member 52, such as a conductive adhesive. Furthermore, the state in which the oscillator 40 is fixed to the electronic component package 10 means that the internal terminal 17 formed on the upper surface of the second layer 2 of the electronic component package 10 and the electrode pads 43 formed on the vibrating substrate 41 of the oscillator 40 are mechanically and electrically bonded via the bonding member 52. Additionally, the vibrating substrate 41 can be an AT-cut quartz substrate, an SC-cut quartz substrate, a BT-cut quartz substrate, etc.

[0036] Furthermore, by incorporating a temperature compensation circuit and a temperature sensor into the integrated circuit element 30 of the oscillator 200 in this embodiment, it can be used as a temperature-compensated quartz oscillator (TCXO) that suppresses the influence of external temperature changes and outputs a high-precision oscillation frequency.

[0037] As described above, the electronic component package 10 and the oscillator 200 of the electronic component 100 in this embodiment are provided with through-hole wiring 25 that is electrically connected to the cover 9 and passes through the second frame 21. Therefore, the bonding member 50 that joins the third layer 3 to the cover 9 will not flow into the electronic component package 10 along the inner side surface 23 of the second frame 21. Therefore, the bonding member 50, which is the sealing material of the sealing area, will not be insufficient, and the reduction of airtightness can be reduced.

[0038] In addition, the inner surface 13 of the first corner portion 12 of the first frame 11 is recessed than the inner surface 23 of the second corner portion 22 of the second frame 21, the inner diameter R1 of the first corner portion 12 is smaller than the inner diameter R2 of the second corner portion 22, and the thickness H1 of the second layer 2 constituting the first frame 11 is larger than the thickness H2 of the integrated circuit element 30. Therefore, a larger integrated circuit element 30 can be housed in the electronic component package 10.

[0039] 2. Second Implementation Method

[0040] Next, as an example of an electronic component 100a having the electronic component package 10a of the second embodiment, an oscillator 200a that houses the first integrated circuit element 30a, the second integrated circuit element 34, the heater 36, and the oscillator 40 will be described, referring to... Figure 4 and Figure 5 Please provide an explanation.

[0041] In addition, Figure 4 In order to facilitate the explanation of the internal structure of the oscillator 200a and the electronic component package 10a, the state after removing the cover 9 and the oscillator 40 is shown.

[0042] The electronic component package 10a and oscillator 200a of this embodiment differ in structure from the electronic component package 10 of the first embodiment. However, compared to the oscillator 200 of the first embodiment, the electronic component package 10a is identical to the electronic component package 10 and oscillator 200 of the first embodiment, except that the first integrated circuit element 30a, the second integrated circuit element 34, and the heater 36 are housed in the electronic component package 10a instead of the integrated circuit element 30. Furthermore, the description will focus on the differences from the first embodiment described above, and identical items will be labeled with the same reference numerals and their descriptions will be omitted.

[0043] like Figure 4 and Figure 5 As shown, the oscillator 200a includes a first integrated circuit element 30a, a second integrated circuit element 34, a heater 36, an oscillator 40, and an electronic component package 10a that houses the first integrated circuit element 30a, the second integrated circuit element 34, the heater 36, and the oscillator 40. Furthermore, the oscillator 200a of this embodiment is equivalent to a quartz oscillator (OCXO) with a thermostat, having a heater 36 and using the electronic component package 10a as a thermostat.

[0044] The package 10a for electronic components includes: a base 4a having a first internal space S1 and a second internal space S2; a cover 9 that seals the first internal space S1; and a coupling member 50 that joins the base 4a and the cover 9. The first internal space S1 houses a first integrated circuit element 30a, a heater 36, and an oscillator 40, and the second internal space S2 houses a second integrated circuit element 34.

[0045] The base 4a forms a first internal space S1 by stacking a first layer 1, a second layer 2 having an opening 18 as a first frame 11, and a third layer 3 having an opening 26 as a second frame 21. A second internal space S2 is formed by stacking a fourth layer 14a having an opening 37a as a third frame 31a on the surface of the first layer 1 opposite to the surface on which the second layer 2 is stacked. Furthermore, an external terminal 7a for outputting an oscillation frequency is formed on the surface of the fourth layer 14a opposite to the surface on which the first layer 1 is stacked.

[0046] The first integrated circuit element 30a housed in the first internal space S1 has an oscillation circuit 31, a temperature compensation circuit 32, and a temperature sensor 33.

[0047] The oscillation circuit 31 is electrically connected to the oscillator 40, amplifies the output signal of the oscillator 40, and feeds back the amplified signal to the oscillator 40, thereby causing the oscillator 40 to oscillate.

[0048] The temperature compensation circuit 32 compensates for temperature based on the temperature information output from the temperature sensor 33, ensuring that the frequency variation of the oscillation signal of the oscillation circuit 31 is less than the frequency-temperature characteristics of the oscillator 40 itself. This results in excellent temperature characteristics. Furthermore, the temperature compensation circuit 32 can be configured to adjust the oscillation frequency of the oscillation circuit 31, for example, by adjusting the capacitance of a variable capacitor circuit connected to the oscillation circuit 31, or by using a PLL (Phase Locked Loop) circuit or a direct digital synthesizer circuit to adjust the frequency of the output signal of the oscillation circuit 31.

[0049] Temperature sensor 33 is a temperature detection element that can be formed by placing a Si diode or a PNP transistor in the first integrated circuit element 30a.

[0050] The heater 36 housed in the first internal space S1 is used to maintain a constant temperature within the first internal space S1, which houses the oscillator 40. The heater 36 is formed on the upper surface of the first layer 1 and is fixed to the electrode 6, which is electrically connected to the temperature control circuit 35 of the second integrated circuit element 34, via a bonding member 53 such as a metal bump.

[0051] The second integrated circuit element 34 housed in the second internal space S2 has a temperature control circuit 35 that controls the temperature of the heater 36, and is fixed to electrodes 5a, 6a formed on the lower surface of the first layer 1 via a bonding member 54 such as a metal bump.

[0052] Temperature control circuit 35 is used to control the amount of current flowing through heater 36 based on temperature information output from temperature sensor 33, thereby maintaining oscillator 40 at a constant temperature. For example, temperature control circuit 35 controls the flow of current through heater 36 when the current temperature, as determined by the output signal of temperature sensor 33, is lower than a set reference temperature, and prevents current from flowing through heater 36 when the current temperature is higher than the reference temperature.

[0053] Alternatively, for example, the temperature control circuit 35 can also control the flow of current through the heater 36 by increasing or decreasing the current based on the difference between the current temperature and the reference temperature. Here, the temperature sensor 33 serves as both the temperature sensor for the temperature compensation circuit 32 and the temperature sensor for the temperature control circuit 35. Therefore, the number of components can be reduced, and the oscillator 200a can be miniaturized. However, this is not a limitation; the temperature sensor for the temperature compensation circuit 32 and the temperature sensor for the temperature control circuit 35 can be provided separately.

[0054] By configuring the structure in this way, an oscillator 200a that suppresses the influence of external temperature and outputs a high-precision oscillation frequency can be obtained, achieving the same effect as the electronic component package 10 or the oscillator 200 in the first embodiment.

Claims

1. An electronic component package, wherein, The electronic component package has: a lid; a first layer; a second layer disposed between the first layer and the lid, constituting a first frame; a third layer disposed between the second layer and the lid, constituting a second frame; a joining member joining the third layer and the lid; and a via wiring electrically connected to the lid, penetrating the second frame, when an inner diameter of a first corner portion of the first frame is R1 and an inner diameter of a second corner portion of the second frame overlapping the first corner portion in plan view is R2, R1 < R2, an inner side surface of the second corner portion protrudes from an inner side surface of the first corner portion in cross section, the first frame has a first straight portion extending from the first corner portion, the second frame has a second straight portion extending from the second corner portion, overlapping the first straight portion in plan view, a width of the first straight portion is the same as a width of the second straight portion.

2. The electronic component package according to claim 1, wherein the electronic component package further has a side surface wiring electrically connected to the via wiring, provided to a side surface of the first frame.

3. The electronic component package according to claim 2, wherein the side surface wiring is provided to an inner side surface of the first frame.

4. The electronic component package according to any one of claims 1 to 3, wherein the joining member contains an alloy of Au and Sn.

5. An electronic component, wherein, The electronic component has: the electronic component package having the first layer, the second layer constituting the first frame, and the third layer constituting the second frame according to any one of claims 1 to 4; and an integrated circuit element housed in the electronic component package.

6. The electronic component according to claim 5, wherein the electronic component package has an electrode electrically connected to the integrated circuit element, the electrode is provided to a corner portion of a mounting region of the first layer divided by the first frame.

7. The electronic component according to claim 5 or 6, wherein a thickness of the second layer is greater than a thickness of the integrated circuit element.

8. An oscillator wherein, The oscillator has: the electronic component package having the first layer, the second layer constituting the first frame, and the third layer constituting the second frame according to any one of claims 1 to 4; and a vibrator housed in the electronic component package; and an integrated circuit element containing an oscillation circuit oscillating the vibrator.

9. The oscillator according to claim 8, wherein a thickness of the second layer is greater than a thickness of the integrated circuit element.

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