A method for polishing the sputtering surface of titanium-aluminum alloy target

Abstract

The invention provides a method for polishing a sputtering surface of a titanium-aluminum alloy target material. The sputtering surface of the titanium-aluminum alloy target material to be polished is sequentially pretreated, laser polished and cleaned to obtain a smooth titanium-aluminum alloy target material. The axial rotation of the target material and the horizontal movement of the laser are used to complete the polishing of the sputtering surface of the target material. The rotation speed of a machine tool spindle of 6-10 r / s is combined with the movement speed of a laser of 0.2-0.4 mm / s, so that the polishing path fully covers the sputtering surface of the target material, reduces the roughness of the sputtering surface of the target material, and improves production efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of target material preparation, and in particular relates to a method for polishing a sputtering surface of a titanium-aluminum alloy target material. Background Art

[0002] With the rapid development of the semiconductor industry, the demand for coating materials, as an important material for the manufacture of semiconductor electronic devices, is also increasing. Target materials, as an important coating material, are widely used in integrated circuits, flat panel displays, solar energy, optical devices and other fields. The most common method for preparing thin films from target materials includes sputtering coating. In order to ensure the excellent performance of thin film products, there are requirements for the structure and other characteristics of the target materials. Therefore, it is necessary to control the preparation process of the target materials to obtain target materials that meet the sputtering requirements.

[0003] Polishing is one of the important steps in the target material preparation process. It has an important influence on the surface properties of the target material, such as roughness, flatness and other parameters. However, the current polishing process often causes unstable surface roughness and uneven color, and the polishing efficiency is low during manual or semi-automatic operation. According to the different target materials, the polishing parameters also need to be adjusted. However, it is difficult to accurately adjust the parameters during manual operation, resulting in poor process stability and reduced product qualification rate. Therefore, it is necessary to select appropriate automatic polishing processes for different target materials to improve production efficiency and product quality.

[0004] CN111975465A discloses a polishing process for the sputtering surface of an aluminum target, the polishing process includes a first mechanical polishing, a second mechanical polishing, a third mechanical polishing and a fourth mechanical polishing performed in sequence; the feed speed in the first mechanical polishing is 2 to 3 m / min: the feed speed in the second mechanical polishing is 4 to 5 m / min; the feed speed in the third mechanical polishing is 6 to 8 m / min: the feed speed in the fourth mechanical polishing is 7 to 9 m / min. The polishing process mainly polishes the sputtering surface of the aluminum target, and the main control parameter is the feed speed of each level of polishing. The selection of the processing height is not disclosed, and the polishing equipment used is not disclosed.

[0005] However, titanium aluminum alloy is a typical difficult-to-process material due to its high hardness and brittleness and poor processing performance. After machining and turning, titanium aluminum alloy often has pits on its surface, which will affect the sputtering use of the target material, so it is necessary to choose a suitable polishing method to improve the surface quality of titanium aluminum alloy.

[0006] Traditional polishing methods have low polishing efficiency and high cost. Polishing in contact with the product can easily damage the product, and the polishing accuracy is difficult to control. Laser polishing focuses the laser beam into a spot of a certain size. The workpiece surface absorbs the radiation energy of the laser beam spot and melts to form a local molten pool. The molten metal flows due to surface tension and the filling of microcavities or grooves, thereby reducing the surface roughness of the metal material and improving the surface finish of the metal material.

[0007] In summary, for titanium-aluminum alloys with high hardness and brittleness, new polishing processes need to be selected to achieve better polishing effects. Summary of the invention

[0008] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a method for polishing the sputtering surface of a titanium-aluminum alloy target, which utilizes the axial rotation of the target and the horizontal movement of the laser to complete the polishing of the sputtering surface of the target, and the rotation speed of the machine tool spindle at 6-10r / s combined with the movement speed of the laser at 0.2-0.4mm / s, so that the polishing path fully covers the sputtering surface of the target, reduces the roughness of the sputtering surface of the target, and improves production efficiency.

[0009] To achieve this object, the present invention adopts the following technical solutions:

[0010] The object of the present invention is to provide a method for polishing the sputtering surface of a titanium-aluminum alloy target, the polishing method comprising the following steps:

[0011] The sputtering surface of the titanium-aluminum alloy target to be polished is sequentially subjected to pretreatment, laser polishing and cleaning to obtain a smooth titanium-aluminum alloy target;

[0012] The laser polishing is performed in a laser processing device, which includes a machine tool spindle and a laser arranged above the machine tool spindle;

[0013] The laser polishing includes: fixing the titanium-aluminum alloy target to be polished on the machine tool spindle, and setting the laser just above the edge of the titanium-aluminum alloy target to be polished; turning on the laser processing device, the machine tool spindle rotates at a speed of 6-10r / s, and the laser moves horizontally from the edge of the target to the center of the target along the radius of the target at a speed of 0.2-0.4mm / s.

[0014] The polishing method for the sputtering surface of the titanium-aluminum alloy target material of the present invention utilizes the axial rotation of the target material and the horizontal movement of the laser to complete the polishing of the sputtering surface of the target material, and the rotation speed of the machine tool spindle at 6-10 r / s is combined with the movement speed of the laser at 0.2-0.4 mm / s, so that the polishing path fully covers the sputtering surface of the target material, reduces the roughness of the sputtering surface of the target material, and improves production efficiency.

[0015] It is worth noting that the speed of the machine tool spindle is 6-10r / s, for example, it can be 6r / s, 6.5r / s, 7r / s, 7.5r / s, 8r / s, 8.5r / s, 9r / s, 9.5r / s or 10r / s, and the moving speed of the laser is 0.2-0.4mm / s, for example, it can be 0.2mm / s, 0.22mm / s, 0.24mm / s, 0.26mm / s, 0.28mm / s, 0.3mm / s, 0.32mm / s, 0.34mm / s, 0.36mm / s, 0.38mm / s or 0.4mm / s, but it is not limited to the listed values, and other values ​​not listed within the above numerical range are also applicable.

[0016] As a preferred technical solution of the present invention, the pretreatment method is polishing with sandpaper.

[0017] Preferably, the mesh number of the sandpaper is 200-300 mesh, for example, it can be 200 mesh, 210 mesh, 220 mesh, 230 mesh, 240 mesh, 250 mesh, 260 mesh, 270 mesh, 280 mesh or 290 mesh, but is not limited to the listed values, and other unlisted values ​​within the above numerical range are also applicable.

[0018] As a preferred technical solution of the present invention, the polishing method further comprises: cleaning with ethanol and / or water after the pretreatment and before the laser polishing.

[0019] As a preferred technical solution of the present invention, a surface of the titanium-aluminum alloy target material to be polished that is away from the sputtering surface is fixed on the main shaft of the machine tool.

[0020] As a preferred technical solution of the present invention, the laser beam emitted by the laser is a flat-top beam.

[0021] As a preferred technical solution of the present invention, the pulse width of the laser beam is 150-250ns, for example, it can be 150ns, 160ns, 170ns, 180ns, 190ns, 200ns, 210ns, 220ns, 230ns, 240ns or 250ns, but is not limited to the listed values, and other unlisted values ​​within the above numerical range are also applicable.

[0022] As a preferred technical solution of the present invention, the spot diameter of the laser beam is 300-500μm, for example, it can be 300μm, 320μm, 340μm, 360μm, 380μm, 400μm, 420μm, 440μm, 460μm, 480μm or 500μm, but is not limited to the listed values, and other unlisted values ​​within the above numerical range are also applicable.

[0023] As a preferred technical solution of the present invention, the energy density of the laser beam is 2.2-3.8 J / cm 3 , for example, it can be 2.2 J / cm 3 , 2.3J / cm 3 , 2.4J / cm 3 , 2.5J / cm 3 , 2.6J / cm 3 , 2.7J / cm 3 , 2.8J / cm 3 , 2.9J / cm 3 , 3J / cm 3 , 3.1J / cm 3 、3.2J / cm 3 , 3.3J / cm 3 、3.4J / cm 3 、3.5J / cm 3 、3.6J / cm 3 、3.7J / cm 3 or 3.8 J / cm 3 , but are not limited to the listed values, and other unlisted values ​​within the above numerical range are also applicable.

[0024] As a preferred technical solution of the present invention, the cleaning method is to rinse with water.

[0025] Preferably, the flushing pressure is 6-8MPa, for example, it can be 6MPa, 6.1MPa, 6.2MPa, 6.3MPa, 6.4MPa, 6.5MPa, 6.6MPa, 6.7MPa, 6.8MPa, 6.9MPa, 7MPa, 7.1MPa, 7.2MPa, 7.3MPa, 7.4MPa, 7.5MPa, 7.6MPa, 7.7MPa, 7.8MPa, 7.9MPa or 8MPa, but is not limited to the listed values, and other values ​​not listed within the above numerical range are also applicable.

[0026] As a preferred technical solution of the present invention, the polishing method comprises the following steps:

[0027] (1) polishing the sputtering surface of the titanium aluminum alloy target to be polished with 200-300 mesh sandpaper, and then cleaning it with ethanol and / or water;

[0028] (2) The titanium-aluminum alloy target to be polished is fixed on the spindle of a machine tool in a laser processing device, and the laser in the laser processing device is set just above the edge of the titanium-aluminum alloy target to be polished; the laser processing device is turned on, the spindle of the machine tool rotates at a speed of 6-10 r / s, and the laser moves horizontally from the edge of the target to the center of the target at a speed of 0.2-0.4 mm / s along the radius of the target until the sputtering surface of the titanium-aluminum alloy target is covered; the laser beam emitted by the laser is a flat-top beam; the pulse width of the laser beam is 150-250 ns, the spot diameter is 300-500 μm, and the energy density is 2.2-3.8 J / cm 3 ;

[0029] (3) flushing the sputtering surface of the titanium-aluminum alloy target with water at a pressure of 6-8 MPa to obtain a smooth titanium-aluminum alloy target.

[0030] The numerical range described in the present invention not only includes the point values ​​listed above, but also includes any point values ​​between the above numerical ranges that are not listed. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0031] Compared with the prior art, the present invention has the following beneficial effects:

[0032] The polishing method for the sputtering surface of the titanium-aluminum alloy target material of the present invention utilizes the axial rotation of the target material and the horizontal movement of the laser to complete the polishing of the sputtering surface of the target material, and the rotation speed of the machine tool spindle at 6-10 r / s combined with the movement speed of the laser at 0.2-0.4 mm / s enables the polishing path to fully cover the sputtering surface of the target material, thereby reducing the roughness of the sputtering surface of the target material and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a schematic diagram of the laser processing device of the present invention;

[0034] Among them, 1-machine tool spindle; 2-laser; 3-titanium-aluminum alloy target to be polished. DETAILED DESCRIPTION

[0035] The technical solution of the present invention is further described below by specific implementation methods. It should be understood by those skilled in the art that the embodiments are only to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0036] It is worth noting that, in a specific implementation manner, laser polishing Figure 1 The process is carried out in the laser processing device shown, which includes a machine tool spindle 1 and a laser 2 arranged above the machine tool spindle; a side of the titanium aluminum alloy target material 3 to be polished away from the sputtering surface is fixed on the machine tool spindle 1, and the laser 2 can move horizontally along the radial direction of the target material.

[0037] Example 1

[0038] This embodiment provides a method for polishing a sputtering surface of a titanium-aluminum alloy target, the polishing method comprising the following steps:

[0039] (1) The sputtering surface of the titanium aluminum alloy target to be polished is polished with 300-mesh sandpaper and then cleaned with ethanol;

[0040] (2) The titanium-aluminum alloy target to be polished is fixed on the spindle of a machine tool in a laser processing device, and the laser in the laser processing device is set just above the edge of the titanium-aluminum alloy target to be polished; the laser processing device is turned on, the spindle of the machine tool rotates at a speed of 8 r / s, and the laser moves horizontally from the edge of the target to the center of the target at a speed of 0.3 mm / s along the radius of the target until the sputtering surface of the titanium-aluminum alloy target is covered; the laser beam emitted by the laser is a flat-top beam; the pulse width of the laser beam is 200 ns, the spot diameter is 500 μm, and the energy density is 3.0 J / cm 3 ;

[0041] (3) The sputtering surface of the titanium-aluminum alloy target is rinsed with water at a pressure of 6 MPa to obtain a smooth titanium-aluminum alloy target.

[0042] Example 2

[0043] This embodiment provides a method for polishing a sputtering surface of a titanium-aluminum alloy target, the polishing method comprising the following steps:

[0044] (1) The sputtering surface of the titanium aluminum alloy target to be polished is polished with 200-mesh sandpaper and then cleaned with 1:1 ethanol and water;

[0045] (2) The titanium-aluminum alloy target to be polished is fixed on the spindle of a machine tool in a laser processing device, and the laser in the laser processing device is set just above the edge of the titanium-aluminum alloy target to be polished; the laser processing device is turned on, the spindle of the machine tool rotates at a speed of 10 r / s, and the laser moves horizontally from the edge of the target to the center of the target at a speed of 0.4 mm / s along the radius of the target until the sputtering surface of the titanium-aluminum alloy target is covered; the laser beam emitted by the laser is a flat-top beam; the pulse width of the laser beam is 250 ns, the spot diameter is 300 μm, and the energy density is 2.2 J / cm 3 ;

[0046] (3) The sputtering surface of the titanium-aluminum alloy target is rinsed with water at a pressure of 7 MPa to obtain a smooth titanium-aluminum alloy target.

[0047] Example 3

[0048] This embodiment provides a method for polishing a sputtering surface of a titanium-aluminum alloy target, the polishing method comprising the following steps:

[0049] (1) The sputtering surface of the titanium aluminum alloy target to be polished is polished with 260-mesh sandpaper and then cleaned with ethanol;

[0050] (2) The titanium-aluminum alloy target to be polished is fixed on the spindle of a machine tool in a laser processing device, and the laser in the laser processing device is set just above the edge of the titanium-aluminum alloy target to be polished; the laser processing device is turned on, the spindle of the machine tool rotates at a speed of 6 r / s, and the laser moves horizontally from the edge of the target to the center of the target at a speed of 0.2 mm / s along the radius of the target until the sputtering surface of the titanium-aluminum alloy target is covered; the laser beam emitted by the laser is a flat-top beam; the pulse width of the laser beam is 150 ns, the spot diameter is 400 μm, and the energy density is 3.8 J / cm 3 ;

[0051] (3) flushing the sputtering surface of the titanium-aluminum alloy target with water at a pressure of 8 MPa to obtain a smooth titanium-aluminum alloy target.

[0052] Comparative Example 1

[0053] This comparative example provides a method for polishing the sputtering surface of a titanium-aluminum alloy target, referring to the polishing method described in Example 1, with the only difference being that the rotation speed of the machine tool spindle in step (2) is 4 r / s.

[0054] Comparative Example 2

[0055] This comparative example provides a method for polishing the sputtering surface of a titanium-aluminum alloy target, referring to the polishing method described in Example 1, with the only difference being that the rotation speed of the machine tool spindle in step (2) is 12 r / s.

[0056] Comparative Example 3

[0057] This comparative example provides a method for polishing the sputtering surface of a titanium-aluminum alloy target, referring to the polishing method described in Example 1, with the only difference being that the moving speed of the laser in step (2) is 0.1 mm / s.

[0058] Comparative Example 4

[0059] This comparative example provides a method for polishing the sputtering surface of a titanium-aluminum alloy target, referring to the polishing method described in Example 1, with the only difference being that the moving speed of the laser in step (2) is 0.5 mm / s.

[0060] Comparative Example 5

[0061] This comparative example provides a method for polishing the sputtering surface of a titanium aluminum alloy target, which is polished by turning, and includes the following steps:

[0062] (1) The sputtering surface of the titanium aluminum alloy target to be polished is polished with 300-mesh sandpaper and then cleaned with ethanol;

[0063] (2) fixing the titanium-aluminum alloy target to be polished on a machine tool spindle in a turning device, with the turning tool close to the edge of the titanium-aluminum alloy target to be polished; turning the turning device, rotating the machine tool spindle at a speed of 8 r / s, and at the same time, horizontally moving the turning tool from the edge of the target to the center of the target at a speed of 0.3 mm / s along the radial direction of the target until the sputtering surface of the titanium-aluminum alloy target is covered;

[0064] (3) The sputtering surface of the titanium-aluminum alloy target is rinsed with water at a pressure of 6 MPa to obtain a smooth titanium-aluminum alloy target.

[0065] The titanium aluminum alloy targets obtained in the above examples and comparative examples were tested, and the contents and methods are as follows:

[0066] Roughness of sputtered surface: tested using a non-contact roughness measuring instrument;

[0067] The above test results are listed in Table 1.

[0068] Table 1

[0069]

[0070]

[0071] From Table 1, we can conclude that:

[0072] (1) It can be seen from Examples 1-3 that the polishing method for the sputtering surface of the titanium-aluminum alloy target of the present invention reduces the roughness of the sputtering surface of the target to less than 0.5 μm, and the polishing effect is excellent;

[0073] (2) By comparing Example 1 with Comparative Examples 1-4, it can be seen that if the spindle speed of the machine tool is too low, the surface of the target material melts unevenly, which will increase the roughness and reduce the polishing effect; if the spindle speed of the machine tool is too high, the target material will vibrate, and the degree of melting of the target material surface will be too large, resulting in increased roughness and affecting the polishing effect; if the laser moving speed is too low, the target material surface will melt excessively, which will easily lead to uneven target surface; if the laser moving speed is too high, the melting effect of the target material surface is poor and the roughness increases;

[0074] (3) Comparing Example 1 with Comparative Example 5, it can be seen that turning will cause pits on the target surface and high roughness.

[0075] The specific embodiments described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for polishing the sputtering surface of a titanium aluminum alloy target, characterized in that: The polishing method comprises the following steps: The sputtering surface of the titanium-aluminum alloy target to be polished is sequentially subjected to pretreatment, laser polishing and cleaning to obtain a smooth titanium-aluminum alloy target; The laser polishing is performed in a laser processing device, which includes a machine tool spindle and a laser arranged above the machine tool spindle; the laser beam emitted by the laser is a flat-top beam; the pulse width of the laser beam is 150-250ns; The laser polishing includes: fixing the titanium-aluminum alloy target to be polished on the machine tool spindle, and setting the laser just above the edge of the titanium-aluminum alloy target to be polished; turning on the laser processing device, the machine tool spindle rotates at a speed of 6-10r / s, and the laser moves horizontally from the edge of the target to the center of the target along the radius of the target at a speed of 0.2-0.4mm / s.

2. The method for polishing the sputtering surface of a titanium aluminum alloy target according to claim 1, characterized in that: The pretreatment method is polishing with sandpaper.

3. The method for polishing the sputtering surface of a titanium-aluminum alloy target according to claim 2, characterized in that: The mesh number of the sandpaper is 200-300 meshes.

4. The method for polishing the sputtering surface of a titanium-aluminum alloy target according to claim 1, characterized in that: The polishing method further comprises: cleaning with ethanol and / or water after the pretreatment and before the laser polishing.

5. The method for polishing the sputtering surface of a titanium-aluminum alloy target according to claim 1, characterized in that: A surface of the titanium-aluminum alloy target material to be polished, which is away from the sputtering surface, is fixed on the main shaft of the machine tool.

6. The method for polishing the sputtering surface of a titanium-aluminum alloy target according to claim 1, characterized in that: The spot diameter of the laser beam is 300-500 μm.

7. The method for polishing the sputtering surface of a titanium-aluminum alloy target according to claim 1, characterized in that: The energy density of the laser beam is 2.2-3.8 J / cm 3 .

8. The method for polishing the sputtering surface of a titanium aluminum alloy target according to claim 1, characterized in that: The cleaning method is to rinse with water.

9. The method for polishing the sputtering surface of a titanium aluminum alloy target according to claim 8, characterized in that: The flushing pressure is 6-8 MPa.

10. The method for polishing the sputtering surface of a titanium aluminum alloy target according to claim 1, characterized in that: The polishing method comprises the following steps: (1) polishing the sputtering surface of the titanium aluminum alloy target to be polished with 200-300 mesh sandpaper, and then cleaning it with ethanol and / or water; (2) The titanium-aluminum alloy target to be polished is fixed on the spindle of a machine tool in a laser processing device, and the laser in the laser processing device is set just above the edge of the titanium-aluminum alloy target to be polished; the laser processing device is turned on, the spindle of the machine tool rotates at a speed of 6-10 r / s, and the laser moves horizontally from the edge of the target to the center of the target at a speed of 0.2-0.4 mm / s along the radius of the target until the sputtering surface of the titanium-aluminum alloy target is covered; the laser beam emitted by the laser is a flat-top beam; the pulse width of the laser beam is 150-250 ns, the spot diameter is 300-500 μm, and the energy density is 2.2-3.8 J / cm 3 ; (3) flushing the sputtering surface of the titanium-aluminum alloy target with water at a pressure of 6-8 MPa to obtain a smooth titanium-aluminum alloy target.

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