A server memory testing method and system

By controlling the air intake/exhaust volume and space pressure in the server memory test area, and deploying racks, cooling modules, and ventilated floors to create different air pressure zones, the problem of heat accumulation and reduced heat dissipation capacity in traditional testing is solved, achieving rapid heat dissipation and cooling effects.

CN115421991BActive Publication Date: 2026-05-08CHANGXIN MEMORY TECH INC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
CHANGXIN MEMORY TECH INC
Filing Date
2022-09-20
Publication Date
2026-05-08

AI Technical Summary

Technical Problem

In traditional server memory testing, the additional temperature and voltage cause heat to accumulate, reducing heat dissipation capacity, increasing fan noise, and the temperature control of the sealed chamber is unbalanced, making it unable to dissipate heat effectively.

Method used

By developing a layout plan, deploying server racks, cooling modules, and ventilated floors, controlling the air intake/exhaust volume and space pressure, different air pressure zones are formed to prevent hot air recirculation and achieve rapid heat dissipation.

Benefits of technology

It achieved rapid heat dissipation in the server memory test area, eliminated overheating, met cooling requirements, and solved the problem of temperature control imbalance.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application provides a server memory test method and system. The method comprises the following steps: formulating a layout scheme of server memory test based on a first condition and a second condition; and deploying a test area according to the layout scheme, wherein the first condition comprises an air intake / exhaust amount of the test area, and the second condition comprises a space pressure value of the test area. The server memory test method and system can layout the space of memory test through the air intake / exhaust amount and the space pressure value of the test area, avoid heat backflow, quickly dissipate the heat energy of the server test area, meet the cooling demand during the server memory test, eliminate the overheated points, and solve the temperature problem of the server memory test area.
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Description

Technical Field

[0001] This invention belongs to the field of computer server technology, and specifically relates to a server memory testing method and system. Background Technology

[0002] Server memory testing is mainly divided into ATE testing and system-level testing. System-level testing mostly uses commercially available mass-produced servers. To reduce testing time and increase test coverage, additional temperature and voltage adjustments are often used during system-level testing. Some manufacturers choose to use sealed temperature chambers for high-temperature testing. However, when using a sealed temperature chamber, the entire server must be placed inside the chamber, and due to the overall temperature limitations of the server, the temperature cannot be set too high (approximately 55-65 degrees Celsius).

[0003] Traditional server memory testing, which involves increasing temperature and voltage for testing conditions, generates more heat. This causes hot air to accumulate around the server due to poor airflow and cannot dissipate. Traditional temperature control devices become unbalanced due to changes in external temperature. Server fans draw in heated air, resulting in reduced heat dissipation capacity and continuous high-speed operation that generates loud noise. Summary of the Invention

[0004] To address the above problems, this invention proposes a server memory testing method, the method comprising:

[0005] A layout plan for server memory testing was developed based on the first and second conditions.

[0006] The test area is deployed according to the described layout scheme, wherein,

[0007] The first condition includes the air intake / exhaust volume of the test area, and the second condition includes the spatial pressure value of the test area.

[0008] Furthermore, the test area is equipped with server racks, cooling modules, and ventilated floors. The layout scheme includes the placement location and / or quantity of the server racks, cooling modules, and ventilated floors.

[0009] Furthermore, deploying the server rack includes:

[0010] Each pair of server racks is set as a group, with the two server racks arranged back-to-back with a gap between them, wherein multiple groups of server racks on the same side are arranged side by side and close together.

[0011] The top and sides of the multiple sets of server racks are respectively equipped with shields and side panels, and the back of the multiple sets of server racks, shields and side panels form a closed space;

[0012] An exhaust module is deployed on the shield to expel hot air from the enclosed space.

[0013] Furthermore, the air intake volume includes the air intake volume (CFM) of the cooling module. i2 CFM of air intake from ventilated floor i1 Server rack air intake (CFM) i3 and side panel air intake CFM i4 The air output includes the air output of the enclosed space (CFM). out ;

[0014] The first condition satisfies CFM i1 +CFM i2 CFM out CFM i3 +CFM i4 .

[0015] Furthermore, the space pressure value includes the air pressure in the space below the ventilated floor (Pa). 1 1. Air pressure above the ventilated floor (Pa) 2 Air pressure in a confined space (Pa) 3 ;

[0016] The first condition satisfies Pa 1 ≥Pa 2 Pa 3 .

[0017] Furthermore, deploying the cooling module and the ventilated floor includes:

[0018] The ventilated floor includes a first ventilated floor and a second ventilated floor;

[0019] Both the cooling module and the first ventilation floor are deployed in front of the server rack, and the cooling module and the first ventilation floor are arranged opposite to each other.

[0020] The second ventilated floor is deployed on the side of the side panel away from the enclosed space.

[0021] Furthermore, if the number of server racks is odd, a partition will be installed opposite to a single deployed server rack to form the enclosed space.

[0022] This disclosure also provides a server memory testing system, the system comprising a layout unit and a deployment unit.

[0023] A layout unit is used to formulate a layout scheme for server memory testing based on the first and second conditions.

[0024] A deployment unit, connected to the layout unit, is used to deploy the test area according to the layout scheme, wherein...

[0025] The first condition includes the air intake / exhaust volume of the test area, and the second condition includes the spatial pressure value of the test area.

[0026] Furthermore, the deployment unit is used to deploy a test area according to the layout scheme, including server racks, cooling modules, and ventilated floors.

[0027] Furthermore, the test area also includes a shield, side panels, and an exhaust module connected to the shield.

[0028] Each pair of server racks is set as a group, with the two server racks arranged back to back with a gap between them. Multiple groups of server racks on the same side are arranged side by side and close together.

[0029] The top and sides of the multiple sets of server racks are respectively equipped with shields and side panels, and the back of the multiple sets of server racks, shields and side panels form a sealed space.

[0030] Furthermore, the air intake volume includes the air intake volume (CFM) of the cooling module. i2 CFM of air intake from ventilated floor i1 Server rack air intake (CFM) i3 and side panel air intake CFM i4 The air output includes the air output of the enclosed space (CFM). out ;

[0031] The first condition satisfies CFM i1 +CFM i2 CFM out CFM i3 +CFM i4 .

[0032] Furthermore, the space pressure value includes the air pressure in the space below the ventilated floor (Pa). 1 1. Air pressure above the ventilated floor (Pa) 2 Air pressure in a confined space (Pa) 3 ;

[0033] The first condition satisfies Pa 1 ≥Pa 2 Pa 3 .

[0034] Furthermore, the ventilated floor includes a first ventilated floor and a second ventilated floor;

[0035] Both the cooling module and the first ventilation floor are deployed in front of the server rack, and the cooling module and the first ventilation floor are arranged opposite to each other.

[0036] The second ventilated floor is deployed on the side of the side panel away from the enclosed space.

[0037] This disclosure also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the server memory testing method described in any of the preceding claims.

[0038] This disclosure also provides an electronic device, including a processor and a memory.

[0039] The memory is used to store executable instructions of the processor; the processor is configured to execute the server memory testing method described above by executing the executable instructions.

[0040] The server memory testing method and system of the present invention arrange the space for memory testing by controlling the air intake / exhaust volume and spatial pressure value of the test area, avoiding hot air backflow, and quickly dissipating heat from the server test area to meet the cooling requirements during server memory testing, eliminating hot spots and solving the temperature problem of the server memory test area.

[0041] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures pointed out in the description, claims and drawings. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 A schematic diagram of the server memory testing method in an embodiment of the present invention is shown;

[0044] Figure 2 A top view schematic diagram of the layout of the ventilated floor and server rack in an embodiment of the present invention is shown;

[0045] Figure 3 A cross-sectional schematic diagram of the server memory testing system layout embodiment one of the present invention is shown;

[0046] Figure 4 A cross-sectional schematic diagram of the server memory testing system layout embodiment two of the present invention is shown;

[0047] Figure 5 A schematic diagram of the side panel air intake in an embodiment of the present invention is shown;

[0048] Figure 6 A schematic diagram of the server memory testing system structure in an embodiment of the present invention is shown.

[0049] In the diagram: 1-Server rack, 2-Second ventilation floor, 3-Side panel, 4-First ventilation floor, 5-Ceiling; 6-Raised floor, 7-Cooling module, 8-Shield, 9-Exhaust module, 10-Partition. Detailed Implementation

[0050] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0051] Server racks are used to assemble and install panels, modules, enclosures, electronic components, devices, and mechanical parts and components into a complete mounting enclosure. Server racks consist of a frame and a cover (door), generally with a rectangular shape and are placed on the floor. They provide a suitable environment and security for the normal operation of electronic equipment. This is the second-highest level of assembly after the system level. A rack without a closed structure is called a server rack. Server racks have good technical performance. The structure of the rack should have good rigidity and strength, as well as good electromagnetic isolation, grounding, noise isolation, ventilation, and heat dissipation performance. In addition, server racks should have vibration resistance, impact resistance, corrosion resistance, dustproof, waterproof, and radiation protection properties to ensure stable and reliable operation of the equipment. Traditional server memory testing, by increasing the temperature and voltage for testing conditions, generates more heat, causing hot air to accumulate around the server due to poor airflow. Traditional temperature control equipment experiences temperature imbalance due to changes in external temperature; server fans, by drawing in heated air, have reduced heat dissipation capacity and generate loud noise due to continuous high-speed operation.

[0052] To address the technical problems in existing server memory testing technologies, such as increased temperature and voltage leading to more heat generation; poor airflow causing hot air to accumulate around the server; temperature control imbalances caused by external temperature changes in traditional temperature control devices; and reduced cooling capacity and excessive noise from server fans due to the intake of heated air, this disclosure provides a server memory testing method. Figure 1 A schematic diagram of the server memory testing method in an embodiment of the present invention is shown. Figure 1The method includes: formulating a layout scheme for server memory testing based on a first condition and a second condition; deploying a test area according to the layout scheme, wherein the first condition includes the air intake / exhaust volume of the test area, and the second condition includes the spatial pressure value of the test area. It should be noted that in this embodiment of the disclosure, the terms "first condition," "second condition," and other similar terms are not intended to imply any order, quantity, or importance, but are merely used to distinguish different conditions during server memory testing.

[0053] In this embodiment, the test area is deployed with server racks 1, cooling modules 7, and ventilated flooring. The layout scheme includes the placement positions and / or quantities of the server racks 1, cooling modules 7, and ventilated flooring. In this embodiment, the number of server racks 1 can be specifically set according to actual needs. The cooling modules 7 can be air conditioners. The memory test of the server is performed by satisfying the first condition of this disclosure through the air volume of the air conditioner, the air volume of the ventilated flooring, the air volume of the server racks, the air volume of the side panels, and the air volume of the enclosed space. In actual application, changes to the number of server racks 1 and the type of cooling modules 7 without departing from the substantive content of this disclosure are all within the protection scope of this disclosure.

[0054] In this embodiment, the cooling module 7 can also be a cooling fan, which also has the function of heat dissipation. During operation, the air outlet of the cooling fan is designed at the front of the server rack 1. The memory test of the server is performed by satisfying the first condition of this disclosure through the air volume of the cooling fan, the air intake of the ventilation floor, the air intake of the server rack, the air intake of the side panel, and the air volume of the enclosed space.

[0055] In this embodiment of the disclosure, deploying the server rack 1 includes: setting up every two server racks 1 as a group, with the two server racks 1 arranged back-to-back with intervals, wherein multiple groups of server racks 1 on the same side are arranged side by side and close together; the top and side of the multiple groups of server racks 1 are respectively provided with a shield 8 and a side panel 3, and the back of the multiple groups of server racks 1, the shield 8 and the side panel 3 form a sealed space; an exhaust module 9 is deployed on the shield 8 to exhaust the hot air in the sealed space.

[0056] The air intake volume in this embodiment includes the air output volume (CFM) of the cooling module. i2 1. Floor ventilation air intake (CFM) i1 Server rack air intake (CFM) i3 and side panel air intake CFM i4 The air output includes the air output of the enclosed space (CFM). out The first condition satisfies CFM i1 +CFM i2 CFM out CFM i3+CFM i4 The space pressure value includes the air pressure in the space below the ventilated floor (Pa). 1 1. Air pressure above the ventilated floor (Pa) 2 Air pressure in a confined space (Pa) 3 The first condition satisfies Pa 1 ≥Pa 2 Pa 3 .

[0057] In this embodiment of the disclosure, the deployment of the cooling module 7 and the ventilation floor includes: the ventilation floor includes a first ventilation floor 4 and a second ventilation floor 2; the cooling module 7 and the first ventilation floor 4 are both deployed in front of the server rack 1, and the cooling module 7 and the first ventilation floor are arranged opposite to each other; the second ventilation floor 2 is deployed on the side panel 3 away from the enclosed space.

[0058] In this embodiment of the disclosure, if the number of server racks 1 is odd, a partition 10 will be provided opposite to a single deployed server rack 1 to form the enclosed space.

[0059] The layout of the server memory testing method in the embodiments of this disclosure will be described in detail below. Figure 2 A top view schematic diagram of the layout of the ventilated floor and server rack in an embodiment of the present invention is shown. Figure 2 In this embodiment, 12 server racks 1 are arranged in two rows, adjacent to each other and back-to-back. There is a gap between the rear doors of the two rows of server racks 1, and side panels 3 are respectively installed on the side walls of the opposite rear doors. The side panels 3 and the two rows of server racks 1 form a U-shaped space, creating a central accommodating space. A first ventilation floor 4 is installed on the floor of the front door of all server racks 1, and a second ventilation floor 2 is installed on the side of the side panel 3 away from the accommodating space. In this embodiment, there are no specific limitations on the number and position of the first ventilation floor 4 and the second ventilation floor 2, as long as the first and second conditions of this application are met. The number of server racks 1 in this embodiment is merely illustrative, and this disclosure does not impose specific limitations on the number of server racks 1.

[0060] This disclosure provides a detailed description of the server memory testing system layout through two embodiments:

[0061] Example 1

[0062] Figure 3The diagram shows a cross-sectional view of a server memory testing system layout according to Embodiment 1 of the present invention. Embodiment 1 mainly describes the server memory testing layout of this disclosure from the perspective of the second condition, namely the condition for satisfying the stress value. Figure 3 In this embodiment, server racks 1 are arranged in even numbers. A shield 8 covers the back-to-back server racks 1, and an exhaust module 9 is installed to expel hot air from above. In this embodiment, the two rows of server racks 1, two side panels 3, and the shield 8 form a sealed space. The server racks 1 and the shield 8 are located in the space between the ceiling 5 and the raised floor. A first ventilation floor 4 is installed at the front door of the server racks 1, and a cooling module 7 is installed at the ceiling 5. In this embodiment, the cooling module 7 is positioned opposite the first ventilation floor 4. In this embodiment, the floor is a raised floor. The airflow in the sealed space is hot air, while the space outside the sealed space (the space above the ceiling 5 and the raised floor) and the space below the raised floor is cold air. In this embodiment, the air pressure in the space below the raised floor is a positive pressure zone, and its pressure value is expressed in Pa. 1 This indicates that the space outside the enclosed space, namely the space above the ceiling 5 and the raised floor, is a slightly positive pressure zone, and its pressure value is expressed in Pa. 2 This indicates that the air pressure inside a confined space is in a negative pressure zone, and its pressure value is expressed in Pa. 3 This indicates that, at this time, the pressure value within the space during server memory testing meets the Pa standard. 1 ≥Pa 2 Pa 3 In this embodiment of the disclosure, when the pressure value in the space meets the second condition and the air intake / exhaust volume of the test area meets the first condition during server memory testing, the temperature problem of the server memory test area is solved by the layout of the test area and the application of the server rack. That is, the layout forms different air pressure zones to avoid hot air backflow and accelerate the removal of hot air.

[0063] For example, in this embodiment of the present disclosure, pressure sensors are installed in the spaces outside the enclosed space, namely the space above the ceiling 5 and the raised floor, the enclosed space, and the space below the raised floor, to detect the air pressure in the space to be measured. Preferably, the pressure sensor can be an air pressure sensor, a piezoresistive pressure sensor, a ceramic pressure sensor, a diffused silicon pressure sensor, a sapphire pressure sensor, or a piezoelectric pressure sensor. Specifically, in this embodiment of the present disclosure, the air pressure sensor is a control sensor that uses air pressure as the conductive object to achieve inductive control. Inside the air pressure sensor, there is an air inlet pipe that allows air to enter. After being energized, air is diverted into the sensor. When air enters, it generates pressure that compresses the sensor. By capturing the magnitude of the current inside the circuit, the magnitude of the pressure is used to transmit electronic signals, thereby sending a working signal to the device controlled by the air pressure sensor. This embodiment of the present disclosure does not specifically limit the air pressure measurement method or measuring tool. In actual applications, changes to the air pressure measurement method and simple pressure sensor without departing from the technical concept of this disclosure are also within the protection scope of this disclosure.

[0064] Example 2

[0065] Figure 4 The diagram shows a cross-sectional view of a server memory testing system layout embodiment two of the present invention. Embodiment two mainly describes the server memory testing layout of the present disclosure based on the first condition, namely the satisfaction of the air intake / exhaust volume. In this embodiment, the airflow direction in the server rack 1 is from the front door to the rear door. The cold airflow flows in from the openings at the bottom of the first ventilation floor 4, the cooling module 7, and the side panel 3, enters the server rack 1 through the front door for heat exchange, and flows out from the rear door of the server rack 1. The hot airflow flows out through the shield 8 in the sealed space and is discharged from the test space under the action of the exhaust module 9. Figure 4 In the middle, the air intake of the second ventilation floor 4 in front of server rack 1 is measured using CFM. i1 It is indicated that the intake air volume of cooling module 7 is measured using CFM. i2 This indicates that the air intake of the front door of server rack 1 is measured using CFM. i3 This indicates that the air intake volume of side panel 3 is measured using CFM. i4 The air volume of a confined space is expressed in CFM. out This indicates that the gas flow rate within the space meets CFM requirements during server memory testing. i1 +CFM i2 CFM out CFM i3 +CFM i4 .

[0066] In this embodiment of the disclosure, a specific description is given of the situation when the number of server racks 1 is odd or when the number of server racks 1 does not meet the existing requirements for memory testing. In this embodiment of the disclosure, the memory testing layout also includes partitions. When the number of server racks 1 is odd or the existing space does not require multiple server racks 1, the space in the test area where no server is installed needs to be blocked by partitions to prevent hot air from flowing out of the sealed space.

[0067] For example, the front door of the server rack 1 disclosed herein is designed as a mesh door, allowing cold air to enter the server rack 1 through the mesh door. The sides, back, bottom, and internal openings of the server rack 1 are sealed. Cold air enters the server rack 1 through the front door, exchanges heat with the heat-generating electronic equipment inside the server rack 1, and then is discharged to the rear of the server rack 1, carrying away heat. This design achieves the sealing of hot air inside the server rack 1, creating a heat exchange channel from the front door to the rear door.

[0068] The air intake method of the side panel 3 is also described in this embodiment. Figure 5 A schematic diagram of the side panel air intake in an embodiment of the present invention is shown. Figure 5 In the middle, a second ventilation floor 2 is installed on the side of the side panel 3 away from the enclosed space, and a ventilation opening is provided at the bottom of the side panel 3. The air intake volume at the side panel 3 is CFM. i4 Air flows into the enclosed space through the vents. In this embodiment, the shape of the vents at the bottom of the side panel 3 is not specifically limited, as long as the air intake volume (CFM) at the side panel 3 is within acceptable limits during server rack testing. i4 With cooling module air output CFM i2 Server rack air intake (CFM) i3 and side panel air intake CFM i4 and the volume of air delivered to a confined space (CFM) out The first condition must be met.

[0069] This disclosure also provides a server memory testing system. Figure 6 A schematic diagram of the server memory testing system structure in an embodiment of the present invention is shown. Figure 6 The server memory testing system includes a layout unit and a deployment unit. The layout unit is used to formulate a layout scheme for server memory testing based on a first condition and a second condition. The deployment unit is communicatively connected to the layout unit and is used to deploy a test area according to the layout scheme. The first condition includes the air intake / exhaust volume of the test area, and the second condition includes the spatial pressure value of the test area.

[0070] The test area in this embodiment further includes a shield 8, a side panel 3, and an exhaust module 7 connected to the shield 8. Every two server racks 1 are set as a group, and the two server racks 1 are arranged back to back with intervals. Multiple groups of server racks 1 on the same side are arranged side by side and attached together. The top and side of the multiple groups of server racks 1 are respectively provided with shields 8 and side panels 3, and the back of the multiple groups of server racks 1, shields 8, and side panels 3 form a sealed space.

[0071] The air intake volume includes the air intake volume (CFM) of the cooling module. i2 CFM of air intake from ventilated floor i1 Server rack air intake (CFM) i3 and side panel air intake CFM i4 The air output includes the air output of the enclosed space (CFM). out The first condition satisfies CFM i1 +CFM i2 CFM out CFM i3 +CFM i4 The space pressure value includes the air pressure in the space below the ventilated floor (Pa). 1 1. Air pressure above the ventilated floor (Pa) 2 Air pressure in a confined space (Pa) 3 The first condition satisfies Pa 1 ≥Pa 2 Pa 3 .

[0072] In this embodiment of the disclosure, the ventilated floor includes a first ventilated floor 4 and a second ventilated floor 2; the cooling module 7 and the first ventilated floor 4 are both deployed in front of the server rack 1, and the cooling module 7 and the first ventilated floor 4 are arranged opposite to each other; the second ventilated floor 2 is deployed on the side panel 3 away from the enclosed space.

[0073] The cooling module 7 can be an air conditioner and a cooling fan. The server's memory testing is performed by satisfying the first condition of this disclosure through the airflow of the air conditioner / cooling fan, the air intake of the ventilated floor, the air intake of the server rack, the air intake of the side panel, and the airflow from the enclosed space. In practical applications, changes to the number of server racks 1 and the type of cooling module 7, without departing from the substantial content of this disclosure, are all within the protection scope of this disclosure. In exemplary embodiments of this disclosure, a computer-readable storage medium is also provided, storing a program product capable of implementing the methods described above. In some possible embodiments, various aspects of this disclosure can also be implemented as a program product including program code. When the program product is run on a terminal device, the program code causes the terminal device to perform the steps described in the "Exemplary Methods" section of this specification according to various exemplary embodiments of this disclosure.

[0074] The program product may employ any combination of one or more readable media. A readable medium may be a readable signal medium or a readable storage medium. A readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of readable storage media (a non-exhaustive list) include: an electrical connection having one or more wires, a portable disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, compact disc read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0075] Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, carrying readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. The readable signal medium may also be any readable medium other than a readable storage medium, capable of transmitting, propagating, or transmitting a program for use by or in connection with an instruction execution system, apparatus, or device. The program code contained on the readable medium may be transmitted using any suitable medium, including but not limited to wireless, wired, optical fiber, RF, etc., or any suitable combination thereof.

[0076] Program code for performing the operations of this application can be written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Java and C++, and conventional procedural programming languages ​​such as C or similar languages. The program code can execute entirely on the user's electronic device, partially on the user's device, as a standalone software package, partially on the user's electronic device and partially on a remote electronic device, or entirely on a remote electronic device or server. In cases involving remote electronic devices, the remote electronic device can be connected to the user's electronic device via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external electronic device (e.g., via the Internet using an Internet service provider).

[0077] In an exemplary embodiment of this disclosure, an electronic device is also provided, comprising at least one processor and at least one memory for storing executable instructions of the processor; wherein the processor is configured to perform the method steps in the exemplary embodiments described above by executing the executable instructions. In embodiments of this disclosure, the memory may be a readable medium in the form of volatile memory cells, having a set of program modules, including but not limited to: an operating system, one or more application programs, other program modules, and program data, each or some combination of these examples may include an implementation of a network environment.

[0078] In this embodiment of the disclosure, the electronic device can also communicate with one or more external devices (e.g., keyboard, pointing device, Bluetooth device, etc.), one or more devices that allow a user to interact with the electronic device, and / or any device that enables the electronic device to communicate with one or more other computing devices (e.g., router, modem, etc.). This communication can be performed via an input / output (I / O) interface. Furthermore, the electronic device can also communicate with one or more networks (e.g., local area network (LAN), wide area network (WAN), and / or public networks, such as the Internet) via a network adapter – the network adapter communicates with other modules of the electronic device via a bus. It should be understood that other hardware and / or software modules can be used in conjunction with the electronic device, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.

[0079] The server memory testing method and system of the present invention arrange the space for memory testing by controlling the air intake / exhaust volume and spatial pressure value of the test area, avoiding hot air backflow, and quickly dissipating heat from the server test area to meet the cooling requirements during server memory testing, eliminating hot spots and solving the temperature problem of the server memory test area.

[0080] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A server memory testing method, characterized in that, The method includes: A layout plan for server memory testing was developed based on the first and second conditions. The test area is deployed according to the described layout scheme, wherein, The first condition includes the air intake / exhaust volume of the test area, and the second condition includes the spatial pressure value of the test area; The test area is equipped with server racks, cooling modules, and ventilated floors. The layout scheme includes the placement location and / or quantity of the server racks, cooling modules, and ventilated floors. Deploying the server racks includes: Each pair of server racks is set as a group, with the two server racks arranged back-to-back with a gap between them, wherein multiple groups of server racks on the same side are arranged side by side and close together. The top and sides of the multiple sets of server racks are respectively equipped with shields and side panels, and the back of the multiple sets of server racks, shields and side panels form a closed space; An exhaust module is deployed on the shield to expel hot air from the enclosed space. The air intake volume includes the air intake volume (CFM) of the cooling module. i2 CFM of air intake from ventilated floor i1 Server rack air intake (CFM) i3 and side panel air intake CFM i4 The air output includes the air output of the enclosed space (CFM). out ; The first condition satisfies CFM i1 +CFM i2 CFM out CFM i3 +CFM i4 .

2. The server memory testing method according to claim 1, characterized in that, The space pressure value includes the air pressure in the space below the ventilated floor (Pa). 1 1. Air pressure above the ventilated floor (Pa) 2 Air pressure in a confined space (Pa) 3 ; The first condition satisfies Pa 1 ≥Pa 2 Pa 3 .

3. The server memory testing method according to claim 1, characterized in that, Deploying the cooling module and the ventilated floor includes: The ventilated floor includes a first ventilated floor and a second ventilated floor; Both the cooling module and the first ventilation floor are deployed in front of the server rack, and the cooling module and the first ventilation floor are arranged opposite to each other. The second ventilated floor is deployed on the side of the side panel away from the enclosed space.

4. The server memory testing method according to claim 1, characterized in that, If the number of server racks is odd, a partition will be placed opposite the single deployed server rack to form the enclosed space.

5. A server memory testing system, characterized in that, The system includes a layout unit and a deployment unit. A layout unit is used to formulate a layout scheme for server memory testing based on the first and second conditions. A deployment unit, connected to the layout unit, is used to deploy the test area according to the layout scheme, wherein... The first condition includes the air intake / exhaust volume of the test area, and the second condition includes the spatial pressure value of the test area; the deployment unit is used to deploy the test area according to the layout scheme, which includes server racks, cooling modules, and ventilated floors; the test area also includes a shield, side panels, and an exhaust module connected to the shield. Each pair of server racks is set as a group, with the two server racks arranged back to back with a gap between them. Multiple groups of server racks on the same side are arranged side by side and close together. The top and sides of the multiple sets of server racks are respectively equipped with shields and side panels, and the back of the multiple sets of server racks, shields and side panels form a closed space; The air intake volume includes the air intake volume (CFM) of the cooling module. i2 CFM of air intake from ventilated floor i1 Server rack air intake (CFM) i3 and side panel air intake CFM i4 The air output includes the air output of the enclosed space (CFM). out ; The first condition satisfies CFM i1 +CFM i2 CFM out CFM i3 +CFM i4 .

6. The server memory testing system according to claim 5, characterized in that, The space pressure value includes the air pressure in the space below the ventilated floor (Pa). 1 1. Air pressure above the ventilated floor (Pa) 2 Air pressure in a confined space (Pa) 3 ; The first condition satisfies Pa 1 ≥Pa 2 Pa 3 .

7. The server memory testing system according to claim 5, characterized in that, The ventilated floor includes a first ventilated floor and a second ventilated floor; Both the cooling module and the first ventilation floor are deployed in front of the server rack, and the cooling module and the first ventilation floor are arranged opposite to each other. The second ventilated floor is deployed on the side of the side panel away from the enclosed space.

8. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the server memory testing method according to any one of claims 1 to 4.

9. An electronic device, characterized in that, Including processor and memory, The memory is used to store executable instructions of the processor; the processor is configured to execute the server memory testing method according to any one of claims 1 to 4 by executing the executable instructions.

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