An anti-delamination chip LED packaging bracket

Abstract

The invention relates to the technical field of LED packaging, and specifically to an anti-delamination chip LED packaging bracket, comprising a bracket and an LED; a cylindrical packaging body, wherein a top plate for applying pressure to the LED is arranged inside the packaging body, a plurality of guide rods are installed on the bottom surface of the top plate, springs for lifting the top plate upward are sleeved on the guide rods, and a plurality of ear plates slidably connected to the guide rods are installed on the inner wall of the packaging body; a fluorescent glue for white light conversion is arranged above the top plate, and a lens for guiding light is arranged above the fluorescent glue; through the top plate, springs and guide rods arranged below the LED: that is, under the elastic action of the spring, an upward force is applied to the top plate, under which the top plate can be driven to push the LED upward, so that the LED is tightly connected to the fluorescent glue, and under the action of the top plate, it is difficult for the LED and the fluorescent glue to be delaminated or separated, thereby ensuring the conversion effect of the fluorescent glue on white light.

Description

Technical Field

[0001] The invention relates to the technical field of LED packaging, in particular to an anti-delamination chip LED packaging bracket. Background Art

[0002] LED packaging is used to provide adequate protection for the chip to prevent the chip from failing due to long-term exposure to the air or mechanical damage, so as to improve the stability of the chip; packaging is a key link in the preparation of white light LEDs; the luminescence mechanism of semiconductor materials determines that a single LED chip cannot emit white light of a continuous spectrum, so the process must mix two or more complementary colors of light to form white light. At present, there are three main methods to realize white light LEDs: blue light LED + YAG yellow phosphor, RGB three-color LED, ultraviolet LED + multi-color phosphor, and the realization of white light LEDs is in the packaging link;

[0003] At present, when encapsulating LED chips, fluorescent glue is set on the top of the LED chip, and the light emitted by the LED chip can be converted into white light through the fluorescent glue. However, due to the high temperature generated by the LED chip after long-term operation, the temperature of the fluorescent glue is increased. Under the action of high temperature for a long time, the fluorescent glue and the LED chip will be separated and delaminated, thereby affecting the conversion to white light. Therefore, we propose an anti-delamination chip LED packaging bracket. Summary of the invention

[0004] The purpose of the present invention is to provide an anti-delamination chip LED packaging bracket to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] An anti-delamination chip LED packaging bracket, comprising a bracket and an LED;

[0007] The bracket is used to package the LED, and includes a cylindrical packaging body, a top plate for applying pressure to the LED is provided inside the packaging body, a plurality of guide rods are installed on the bottom surface of the top plate, springs for lifting the top plate upward are sleeved on the guide rods, and a plurality of ear plates slidably connected to the guide rods are installed on the inner wall of the packaging body; a fluorescent glue for white light conversion is provided above the top plate, and a lens for guiding light is provided above the fluorescent glue;

[0008] The LED is arranged between the ear plate and the fluorescent glue, and is used to emit a light source. It includes a substrate installed on the top surface of the ear plate, and an LED chip for emitting a light source is installed at the center of the top surface of the substrate. Copper sheets are provided on both sides of the LED chip, and the LED chip and the copper sheet are bonded by gold wires.

[0009] As a preferred technical solution of the present invention, the size of the top plate is matched with the size of the inner cavity of the packaging body.

[0010] As a preferred technical solution of the present invention, a plurality of heat dissipation slots for dissipating heat from the substrate are provided on the top plate.

[0011] As a preferred technical solution of the present invention, two annular ridges are provided on the circumferential inner wall of the packaging body near the top, and the ridges are used to limit the fluorescent glue.

[0012] As a preferred technical solution of the present invention, a limiting ring is installed on the outside of the bottom end of the guide rod, and the limiting ring is used to prevent the guide rod from detaching from the ear plate.

[0013] As a preferred technical solution of the present invention, the lens is overall curved and is made of transparent glass.

[0014] As a preferred technical solution of the present invention, the outer wall of the lens is equipped with an annular connecting ring, the connecting ring is provided with a plurality of slots, and the top surface of the packaging body is equipped with a plurality of card blocks, the card blocks are engaged with the corresponding card slots.

[0015] As a preferred technical solution of the present invention, the bracket is a product made of alloy aluminum material.

[0016] As a preferred technical solution of the present invention, a base for improving the stability of the packaging body is installed at the outside of the bottom end of the packaging body.

[0017] As a preferred technical solution of the present invention, the bottom end of the guide rod is flush with the bottom end surface of the packaging body.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] By setting a top plate, spring and guide rod under the LED, an upward force is applied to the top plate under the elastic action of the spring. Under this force, the top plate can push the LED upward, so that the LED and the fluorescent glue are tightly connected. Under the action of the top plate, it is difficult for the LED and the fluorescent glue to be delaminated or separated, thereby ensuring the conversion effect of the fluorescent glue to white light. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 It is a cross-sectional view of the overall structure of the present invention;

[0022] Figure 3 It is a schematic diagram of the structure of the bracket in the present invention;

[0023] Figure 4It is a schematic diagram of the structure of the top plate in the present invention;

[0024] Figure 5 It is a schematic diagram of the structure of the package body in the present invention;

[0025] Figure 6 is a schematic diagram of the structure of the lens in the present invention;

[0026] Figure 7 It is a schematic diagram of the structure of the LED in the present invention.

[0027] In the figure:

[0028] 1. Bracket; 11. Raised ridge; 12. Top plate; 121. Guide rod; 122. Limiting ring; 13. Spring; 14. Ear plate; 15. Fluorescent glue; 16. Lens; 161. Connecting ring; 162. Card slot; 17. Card block;

[0029] 2. LED; 21. Substrate; 22. LED chip; 23. Copper sheet; 24. Gold wire. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] Example 1

[0032] A delamination-proof SMD LED package bracket comprises a bracket 1 and an LED 2. The bracket 1 is used to package the LED 2 and comprises a cylindrical package body. A top plate 12 for applying pressure to the LED 2 is provided inside the package body. A plurality of guide rods 121 are installed on the bottom surface of the top plate 12. The top plate 12 is tightly bonded to the guide rods 121. The guide rods 121 are sleeved with springs 13 for lifting the top plate 12 upward. A plurality of ear plates 14 slidably connected to the guide rods 121 are installed on the inner wall of the package body. The ear plates 14 are slidably connected to the guide rods 121. The inner wall of the package body is tightly bonded; a fluorescent glue 15 for white light conversion is provided above the top plate 12, and a lens 16 for light guidance is provided above the fluorescent glue 15; LED2 is arranged between the ear plate 14 and the fluorescent glue 15, and is used to emit a light source, including a substrate 21 installed on the top surface of the ear plate 14, and an LED chip 22 for emitting a light source is installed at the center of the top surface of the substrate 21, and copper sheets 23 are provided on both sides of the LED chip 22, and the LED chip 22 and the copper sheet 23 are bonded by gold wires 24.

[0033] Example 2

[0034] A delamination-proof SMD LED package bracket comprises a bracket 1 and an LED 2. The bracket 1 is used to package the LED 2 and comprises a cylindrical package body. A top plate 12 for applying pressure to the LED 2 is provided inside the package body. A plurality of guide rods 121 are installed on the bottom surface of the top plate 12. The top plate 12 is tightly bonded to the guide rods 121. The guide rods 121 are sleeved with springs 13 for lifting the top plate 12 upward. A plurality of ear plates 14 slidably connected to the guide rods 121 are installed on the inner wall of the package body. The ear plates 14 are tightly bonded to the inner wall of the package body. A fluorescent glue 15 for white light conversion is provided above the top plate 12. The fluorescent glue 1 5 is provided with a lens 16 for guiding light above; LED2 is arranged between the ear plate 14 and the fluorescent glue 15, and is used to emit a light source, including a substrate 21 installed on the top surface of the ear plate 14, and an LED chip 22 for emitting a light source is installed at the center of the top surface of the substrate 21. Copper sheets 23 are provided on both sides of the LED chip 22, and the LED chip 22 and the copper sheet 23 are bonded by gold wires 24. The size of the top plate 12 is adapted to the size of the inner cavity of the package body. This design facilitates the top plate 12 to move upward stably in the inner cavity of the package body, thereby lifting the LED2, so that the LED2 is tightly combined with the fluorescent glue 15.

[0035] Example 3

[0036] A delamination-proof SMD LED package bracket, comprising a bracket 1 and an LED 2, wherein the bracket 1 is used to package the LED 2, and comprises a cylindrical package body, wherein a top plate 12 for applying pressure to the LED 2 is provided inside the package body, wherein a plurality of guide rods 121 are installed on the bottom surface of the top plate 12, and the top plate 12 is tightly bonded to the guide rods 121, and a spring 13 for lifting the top plate 12 upward is sleeved on the guide rods 121, and a plurality of ear plates 14 slidably connected to the guide rods 121 are installed on the inner wall of the package body, and the ear plates 14 are tightly bonded to the inner wall of the package body; a white light source is provided above the top plate 12 The converted fluorescent glue 15 has a lens 16 for guiding light provided above the fluorescent glue 15; LED2 is arranged between the ear plate 14 and the fluorescent glue 15, and is used to emit a light source, including a substrate 21 installed on the top end surface of the ear plate 14, and an LED chip 22 for emitting a light source is installed at the center of the top end surface of the substrate 21, and copper sheets 23 are provided on both sides of the LED chip 22, and the LED chip 22 and the copper sheet 23 are bonded by gold wires 24, and a plurality of heat dissipation grooves for heat dissipation of the substrate 21 are opened on the top plate 12, and the plurality of heat dissipation grooves are beneficial to heat dissipation of the substrate 21 and the LED chip 22.

[0037] Example 4

[0038] A delamination-proof SMD LED package bracket comprises a bracket 1 and an LED 2. The bracket 1 is used to package the LED 2 and comprises a cylindrical package body. A top plate 12 for applying pressure to the LED 2 is provided inside the package body. A plurality of guide rods 121 are installed on the bottom surface of the top plate 12. The top plate 12 is tightly bonded to the guide rods 121. The guide rods 121 are sleeved with springs 13 for lifting the top plate 12 upward. A plurality of ear plates 14 slidably connected to the guide rods 121 are installed on the inner wall of the package body. The ear plates 14 are tightly bonded to the inner wall of the package body. A fluorescent glue 15 for white light conversion is provided above the top plate 12. A Lens 16; LED2, arranged between the ear plate 14 and the fluorescent glue 15, for emitting light, including a substrate 21 installed on the top surface of the ear plate 14, an LED chip 22 for emitting light is installed at the center of the top surface of the substrate 21, copper sheets 23 are provided on both sides of the LED chip 22, the LED chip 22 and the copper sheet 23 are bonded by gold wires 24, two annular ridges 11 are provided on the circumferential inner wall of the package body near the top, the ridges 11 are used to limit the fluorescent glue 15, after the fluorescent glue 15 solidifies in the package body, under the action of the ridges, the connection between the fluorescent glue 15 and the package body is more stable, and the connection with LED2 is tighter.

[0039] Example 5

[0040] A delamination-proof SMD LED package bracket comprises a bracket 1 and an LED 2. The bracket 1 is used to package the LED 2 and comprises a cylindrical package body. A top plate 12 for applying pressure to the LED 2 is provided inside the package body. A plurality of guide rods 121 are installed on the bottom surface of the top plate 12. The top plate 12 is tightly bonded to the guide rods 121. The guide rods 121 are sleeved with springs 13 for lifting the top plate 12 upward. A plurality of ear plates 14 slidably connected to the guide rods 121 are installed on the inner wall of the package body. The ear plates 14 are tightly bonded to the inner wall of the package body. A fluorescent glue 15 for white light conversion is provided above the top plate 12. The upper surface of the fluorescent glue 15 is provided with a plurality of guide rods 121 ... A lens 16 for guiding light is provided on the side; LED2 is arranged between the ear plate 14 and the fluorescent glue 15, and is used to emit a light source, including a substrate 21 installed on the top end surface of the ear plate 14, and an LED chip 22 for emitting a light source is installed at the center of the top end surface of the substrate 21, and copper sheets 23 are provided on both sides of the LED chip 22, and the LED chip 22 and the copper sheet 23 are bonded by gold wires 24. A limiting ring 122 is installed on the outside of the bottom end of the guide rod 121, and the limiting ring 122 is used to prevent the guide rod 121 from detaching from the ear plate 14. This design can prevent the top plate 12 from detaching from the package body from the top opening of the package body, and play a limiting role on the top plate 12.

[0041] Example 6

[0042] A delamination-proof SMD LED package bracket comprises a bracket 1 and an LED 2. The bracket 1 is used to package the LED 2 and comprises a cylindrical package body. A top plate 12 for applying pressure to the LED 2 is provided inside the package body. A plurality of guide rods 121 are installed on the bottom surface of the top plate 12. The top plate 12 is tightly bonded to the guide rods 121. The guide rods 121 are sleeved with springs 13 for lifting the top plate 12 upward. A plurality of ear plates 14 slidably connected to the guide rods 121 are installed on the inner wall of the package body. The ear plates 14 are tightly bonded to the inner wall of the package body. A fluorescent glue for white light conversion is provided above the top plate 12. 15, a lens 16 for guiding light is provided above the fluorescent glue 15; LED2 is arranged between the ear plate 14 and the fluorescent glue 15, and is used to emit a light source, including a substrate 21 installed on the top end surface of the ear plate 14, and an LED chip 22 for emitting a light source is installed at the center of the top end surface of the substrate 21, copper sheets 23 are provided on both sides of the LED chip 22, and the LED chip 22 and the copper sheet 23 are bonded by gold wires 24. The lens 16 is curved as a whole, and the lens 16 is a transparent glass product. The curved design is convenient for the light-emitting angle of the LED chip 22 due to the divergence of light, and plays a light-guiding role.

[0043] Example 7

[0044] A delamination-proof SMD LED package bracket comprises a bracket 1 and an LED 2. The bracket 1 is used to package the LED 2 and comprises a cylindrical package body. A top plate 12 for applying pressure to the LED 2 is provided inside the package body. A plurality of guide rods 121 are installed on the bottom surface of the top plate 12. The top plate 12 is tightly bonded to the guide rods 121. The guide rods 121 are sleeved with springs 13 for lifting the top plate 12 upward. A plurality of ear plates 14 slidably connected to the guide rods 121 are installed on the inner wall of the package body. The ear plates 14 are tightly bonded to the inner wall of the package body. A fluorescent glue 15 for white light conversion is provided above the top plate 12. A lens 16 for guiding light is provided above the fluorescent glue 15. The LED 2 is provided with a plurality of guide rods 121. It is placed between the ear plate 14 and the fluorescent glue 15, and is used to emit a light source. It includes a substrate 21 installed on the top surface of the ear plate 14, and an LED chip 22 for emitting a light source is installed at the center of the top surface of the substrate 21. Copper sheets 23 are provided on both sides of the LED chip 22. The LED chip 22 and the copper sheet 23 are bonded by gold wires 24. An annular connecting ring 161 is installed on the outer wall of the lens 16, and the connecting ring 161 is tightly bonded to the lens 16. A plurality of card slots 162 are opened on the connecting ring 161. A plurality of card blocks 17 are installed on the top surface of the package body, and the card blocks 17 are snap-fitted with the corresponding card slots 162. This design facilitates the connection and fixation of the lens 16 to the package body, and is convenient for installation.

[0045] Example 8

[0046] A delamination-proof SMD LED package bracket, comprising a bracket 1 and an LED 2, wherein the bracket 1 is used to package the LED 2, and comprises a cylindrical package body, wherein a top plate 12 for applying pressure to the LED 2 is provided inside the package body, wherein a plurality of guide rods 121 are installed on the bottom surface of the top plate 12, and the top plate 12 is tightly bonded to the guide rods 121, and a spring 13 for lifting the top plate 12 upward is sleeved on the guide rods 121, and a plurality of ear plates 14 slidably connected to the guide rods 121 are installed on the inner wall of the package body, and the ear plates 14 are tightly bonded to the inner wall of the package body; a white light source is provided above the top plate 12 The converted fluorescent glue 15 has a lens 16 for guiding light provided above the fluorescent glue 15; the LED 2 is arranged between the ear plate 14 and the fluorescent glue 15, and is used to emit a light source, including a substrate 21 installed on the top end surface of the ear plate 14, and an LED chip 22 for emitting a light source is installed at the center of the top end surface of the substrate 21, and copper sheets 23 are provided on both sides of the LED chip 22, and the LED chip 22 and the copper sheet 23 are bonded by gold wires 24. The bracket 1 is a product made of alloy aluminum material, and the alloy aluminum material has the advantages of light weight and low price, and has good conductivity, which is convenient for connecting the LED chip 22.

[0047] Example 9

[0048] A delamination-proof SMD LED package bracket comprises a bracket 1 and an LED 2. The bracket 1 is used to package the LED 2 and comprises a cylindrical package body. A top plate 12 for applying pressure to the LED 2 is provided inside the package body. A plurality of guide rods 121 are installed on the bottom surface of the top plate 12. The top plate 12 is tightly bonded to the guide rods 121. The guide rods 121 are sleeved with springs 13 for lifting the top plate 12 upward. A plurality of ear plates 14 slidably connected to the guide rods 121 are installed on the inner wall of the package body. The ear plates 14 are tightly bonded to the inner wall of the package body. A spring 13 for lifting the top plate 12 upward is provided on the top surface of the top plate 12. A fluorescent glue 15 for converting white light has a lens 16 for guiding light disposed above the fluorescent glue 15; an LED 2 is disposed between the ear plate 14 and the fluorescent glue 15 and is used for emitting a light source, comprising a substrate 21 mounted on the top end surface of the ear plate 14, an LED chip 22 for emitting a light source is mounted at the center of the top end surface of the substrate 21, copper sheets 23 are disposed on both sides of the LED chip 22, the LED chip 22 and the copper sheet 23 are bonded by gold wires 24, a base for improving the stability of the package is mounted on the outside of the bottom end of the package, and the arrangement of the base is beneficial to improving the stability of the package.

[0049] Example 10

[0050] A delamination-proof SMD LED package bracket comprises a bracket 1 and an LED 2. The bracket 1 is used to package the LED 2 and comprises a cylindrical package body. A top plate 12 for applying pressure to the LED 2 is provided inside the package body. A plurality of guide rods 121 are installed on the bottom surface of the top plate 12. The top plate 12 is tightly bonded to the guide rods 121. The guide rods 121 are sleeved with springs 13 for lifting the top plate 12 upward. A plurality of ear plates 14 slidably connected to the guide rods 121 are installed on the inner wall of the package body. The ear plates 14 are tightly bonded to the inner wall of the package body. A fluorescent glue 1 for white light conversion is provided above the top plate 12. 5. A lens 16 for guiding light is provided above the fluorescent glue 15; LED 2 is arranged between the ear plate 14 and the fluorescent glue 15, and is used to emit a light source, including a substrate 21 installed on the top surface of the ear plate 14, and an LED chip 22 for emitting a light source is installed at the center of the top surface of the substrate 21, and copper sheets 23 are provided on both sides of the LED chip 22, and the LED chip 22 and the copper sheet 23 are bonded by gold wires 24, and the bottom end of the guide rod 121 is flush with the bottom end surface of the package body. This design makes the top plate 12 only move upward and cannot move downward, thereby ensuring the tightness of the connection between LED 2 and the fluorescent glue 15.

[0051] During specific use, under the elastic force of the spring 13, an upward force is applied to the top plate 12, and the top plate 12 is pushed up, and the substrate 21 is installed on the top plate 12, and the top plate 12 applies an upward force to the substrate 21, and the LED chip 22 is tightly fitted with the fluorescent glue 15.

[0052] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. An anti-delamination SMD LED package bracket, comprising a bracket (1) and an LED (2), characterized in that: A bracket (1) for encapsulating an LED (2), comprising a cylindrical encapsulating body, a top plate (12) for applying pressure to the LED (2) being provided inside the encapsulating body, a plurality of guide rods (121) being installed on the bottom surface of the top plate (12), springs (13) for lifting the top plate (12) upward being sleeved on the guide rods (121), and a plurality of ear plates (14) slidably connected to the guide rods (121) being installed on the inner wall of the encapsulating body; a fluorescent glue (15) for white light conversion being provided above the top plate (12), and a lens (16) for guiding light being provided above the fluorescent glue (15); The LED (2) is arranged between the ear plate (14) and the fluorescent glue (15) and is used to emit light. It includes a substrate (21) mounted on the top surface of the ear plate (14). A chip (22) for emitting light is mounted at the center of the top surface of the substrate (21). Copper sheets (23) are provided on both sides of the chip (22). The chip (22) and the copper sheet (23) are bonded by gold wires (24).

2. The anti-delamination SMD LED package bracket according to claim 1, characterized in that: The size of the top plate (12) is adapted to the size of the inner cavity of the packaging body.

3. The anti-delamination SMD LED package bracket according to claim 1, characterized in that: The top plate (12) is provided with a plurality of heat dissipation grooves for dissipating heat from the base plate (21).

4. The anti-delamination SMD LED package bracket according to claim 1, characterized in that: Two annular ridges (11) are provided on the circumferential inner wall of the packaging body near the top, and the ridges (11) are used to limit the position of the fluorescent glue (15).

5. The anti-delamination SMD LED package bracket according to claim 1, characterized in that: A limiting ring (122) is installed on the outside of the bottom end of the guide rod (121), and the limiting ring (122) is used to prevent the guide rod (121) from detaching from the ear plate (14).

6. The anti-delamination SMD LED package bracket according to claim 1, characterized in that: The lens (16) is in an overall curved shape, and is made of transparent glass.

7. The anti-delamination SMD LED package bracket according to claim 1, characterized in that: An annular connecting ring (161) is installed on the outer wall of the lens (16), a plurality of slots (162) are provided on the connecting ring (161), a plurality of card blocks (17) are installed on the top surface of the packaging body, and the card blocks (17) are engaged with the corresponding card slots (162).

8. The anti-delamination SMD LED package bracket according to claim 1, characterized in that: The bracket (1) is a product made of alloy aluminum material.

9. The anti-delamination SMD LED package bracket according to claim 1, characterized in that: A base for improving the stability of the packaging body is installed outside the bottom end of the packaging body.

10. The anti-delamination SMD LED package bracket according to claim 1, characterized in that: The bottom end of the guide rod (121) is flush with the bottom end surface of the packaging body.

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