A high-power blade server with parallel-flow enhanced gas atomization cooling

Abstract

The present invention relates to a high-power blade server with parallel-flow enhanced gas atomization cooling, which includes a spray chamber. An atomization concave plate is provided on the side of the spray chamber. The atomization concave plate is provided with an array of structure holes communicating with the spray chamber. A liquid spraying convex plate is provided outside the atomization concave plate. The liquid spraying convex plate is provided with an array of liquid spraying holes for inputting a liquid working medium. The array of liquid spraying holes is arranged corresponding to the array of structure holes. The longitudinal cross-sections of both the array of structure holes and the array of liquid spraying holes gradually narrow towards the spray chamber. The array of liquid spraying holes protrude towards the array of structure holes and extend into the array of structure holes. A jetting slit for inputting high-pressure gas is provided between the array of liquid spraying holes and the array of structure holes. A gas-liquid mixing chamber is formed at the intersection of the jetting slit, the array of liquid spraying holes and the array of structure holes. Gas atomization is adopted to achieve the spray effect. The generated spray particle size is extremely small, the latent heat of phase change of the liquid working medium can be fully utilized, the spray flow rate is extremely fast, the atomization controllability is good, the impact force is stronger, and the atomization and cooling effects are better.

Description

Technical Field

[0001] The present invention belongs to the technical field of server heat dissipation, and particularly relates to a high-power blade server with enhanced parallel-flow gas atomization cooling. Background Art

[0002] With the vigorous development of information technology, the scale and energy consumption of data centers continue to increase, and the power density of servers keeps rising. Blade servers are specifically designed for high-density computers, and compared with rack servers and tower servers, the heat generation per unit area is more serious, and the heat dissipation problem caused by high power is more prominent. Therefore, it is very necessary to efficiently dissipate the heat of blade servers so that electronic components can be maintained at the optimal working temperature.

[0003] However, the heat dissipation methods of traditional blade servers are air cooling or indirect-contact liquid cooling. Air cooling has a large noise and cannot meet the heat dissipation requirements under high power. Indirect-contact liquid cooling occupies a large amount of internal space of the chassis, requires a large amount of coolant, and has a risk of liquid leakage, and cannot meet the requirements of high integration and safety of blade servers.

[0004] Spray cooling technology is a phase change cooling technology, which has the advantages of less working fluid demand and good heat dissipation performance. The cooling forms of traditional spray cooling devices include pressure atomization cooling using liquid working fluid and spray cooling using external mixing gas siphon atomization. The inner cavity of the blade server is a spray cavity, and various electronic components such as CPUs, memory modules, and hard disks are installed in the spray cavity. By spraying fine liquid droplet sprays through the atomization module, the heat-generating surfaces of the electronic components in the spray cavity are impacted, which can effectively meet the requirements of large-area and high-efficiency heat dissipation, reduce the working temperature of the heat-generating components, and extend the service life.

[0005] However, the high-power blade server equipped with the above spray cooling device has the following technical problems:

[0006] For pressure atomization cooling using liquid working fluid, the diameter of the ejected liquid droplets is relatively large, and the latent heat of phase change of the liquid working fluid cannot be fully utilized, making it difficult to obtain satisfactory atomization and cooling effects. For spray cooling using external mixing gas siphon atomization, according to the siphon principle, the liquid generally flows at a low speed, so its atomization controllability is poor, the impact force is insufficient, and the atomization and cooling effects are not good, making it difficult to meet the heat dissipation requirements of high-power blade servers. Moreover, a relatively thick liquid film is formed on the surface of the electronic components cooled by spraying, which changes the heat transfer process from liquid / gas phase change to pool boiling state, reducing the spray cooling performance.

[0007] Therefore, it is necessary to develop a high-power blade server with better atomization and cooling effects. Summary of the Invention

[0008] Aiming at the technical problems existing in the prior art, the object of the present invention is to provide a high-power blade server with parallel-flow enhanced gas atomization cooling, which can eject uniform and fine sprays, make full use of the latent heat of phase change of the liquid working medium, has good atomization controllability, sufficient impact force, and good atomization and cooling effects.

[0009] The object of the present invention is achieved through the following technical solutions:

[0010] A high-power blade server with parallel-flow enhanced gas atomization cooling includes a spray chamber. An atomization concave plate is provided on the side of the spray chamber. Array structure holes communicating with the spray chamber are provided on the atomization concave plate. A liquid spraying convex plate is provided outside the atomization concave plate. Array liquid spraying holes for inputting a liquid working medium are provided on the liquid spraying convex plate. The array liquid spraying holes are arranged corresponding to the array structure holes. The longitudinal sections of both the array structure holes and the array liquid spraying holes gradually narrow towards the spray chamber. The array liquid spraying holes protrude towards the array structure holes and extend into the array structure holes. A jetting slit for inputting high-pressure gas is provided between the array liquid spraying holes and the array structure holes. A gas-liquid mixing chamber is formed at the intersection of the jetting slit, the array liquid spraying holes, and the array structure holes.

[0011] Further, an array of spray holes is provided on the side of the atomization concave plate close to the spray chamber. The array of spray holes is arranged corresponding to and communicated with the array structure holes. The aperture of the array of spray holes is smaller than the apertures of the corresponding array structure holes and array liquid spraying holes.

[0012] Further, the array of spray holes has various shapes and spraying angles.

[0013] Further, a gas storage chamber is provided between the atomization concave plate and the liquid spraying convex plate. The gas storage chamber is communicated with the jetting slit. The height of the array liquid spraying holes is greater than the thickness of the gas storage chamber and less than the sum of the thickness of the gas storage chamber and the height of the array structure holes.

[0014] Further, the thickness of the jetting slit is smaller than the thickness of the gas storage chamber.

[0015] Further, a liquid storage plate is provided on one side of the liquid spraying convex plate. The liquid storage plate is provided with a liquid storage chamber for supplying the liquid working medium and a liquid inlet flow channel. The liquid storage chamber is respectively connected to the array liquid spraying holes and the liquid inlet flow channel. A buffer ramp is provided in the liquid storage chamber, and the height of the buffer ramp gradually increases along the liquid inlet direction.

[0016] Further, a blowing component for blowing downward is provided at the top of the spray chamber, and an outlet pipe is provided at the bottom of the spray chamber.

[0017] Further, the blowing component includes a diversion device and a gas chamber for inputting high-pressure gas. The diversion device is provided below the gas chamber and is used to divert the high-pressure gas in the gas chamber to the spray chamber.

[0018] Further, the diversion device is a honeycomb plate with an array of honeycomb straight through holes structure.

[0019] Furthermore, the gas chamber is communicated with the jet slit.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The liquid working medium is input from the array liquid jet holes on the liquid jet convex plate, and the high-pressure gas is input from the jet slit between the atomizing concave plate and the liquid jet convex plate. Since the longitudinal cross-sections of both the array structure holes and the array liquid jet holes gradually narrow towards the spray chamber, both the array structure holes and the array liquid jet holes have the function of accelerating the fluid. When the liquid working medium flows along the array liquid jet holes and when the high-pressure gas enters the array structure holes from the jet slit and flows along the array structure holes, the speed gradually increases, which is beneficial to the full mixing of the liquid working medium and the high-pressure gas. When the liquid working medium and the high-pressure gas meet in the gas-liquid mixing chamber, due to the jet diffusion tearing action of the high-pressure gas and the strong gas-liquid friction action of the jet impact, a very uniform and fine spray is generated. The high-pressure gas drives the spray to strongly spray from the array structure holes towards various electronic components in the spray chamber, greatly improving the cooling speed and enhancing the cooling effect. And the honeycomb plate with an array of honeycomb straight through holes is used to change the disordered high-pressure gas source provided by the spray device into a stable and uniform parallel flow, blowing air towards the spray chamber and the surface of the electronic components, effectively thinning the liquid film on the surface of the electronic components, and promoting the discharge of the gaseous working medium after heat exchange outside the server, accelerating the cooling cycle. The present invention uses gas atomization to achieve the spray effect, and the generated spray particle size is extremely small. During spray cooling, it can make full use of the latent heat of phase change of the liquid working medium, and the spray flow rate is extremely fast, the atomization controllability is good, the impact force is stronger, the atomization and cooling effects are better, which can meet the heat dissipation requirements of high-power blade servers, and the flow guiding device with an array of honeycomb straight through holes can extremely effectively convert the turbulent flow into a stable parallel flow, improving the spray cooling effect. Description of the Drawings

[0022] Figure 1 is a schematic structural diagram of an embodiment of the present invention;

[0023] Figure 2 is a schematic longitudinal sectional structural diagram of an embodiment of the present invention;

[0024] Figure 3 is a schematic structural diagram of the liquid storage plate of an embodiment of the present invention;

[0025] Figure 4 is a schematic structural diagram of the liquid jet convex plate of an embodiment of the present invention;

[0026] Figure 5 is a schematic front structural diagram of the atomizing concave plate of an embodiment of the present invention;

[0027] Figure 6 is a schematic back structural diagram of the atomizing concave plate of an embodiment of the present invention;

[0028] Figure 7 It is a schematic structural diagram of a blade server module according to an embodiment of the present invention;

[0029] Figure 8 It is a schematic structural diagram of a blowing component according to an embodiment of the present invention.

[0030] In the figure:

[0031] 1 - Array atomization module;

[0032] 11 - Liquid storage plate, 111 - Liquid storage cavity, 112 - Buffer ramp, 113 - Liquid inlet channel;

[0033] 12 - Liquid spraying convex plate, 121 - Array liquid spraying holes;

[0034] 13 - Atomization concave plate;

[0035] 131 - Air storage cavity, 132 - Array structure holes, 1321 - Jet slit, 1322 - Gas - liquid mixing cavity;

[0036] 133 - Array spray holes;

[0037] 134 - Air outlet;

[0038] 135 - Air inlet channel;

[0039] 2 - Blade server module;

[0040] 21 - Spray cavity;

[0041] 22 - Blowing component, 221 - Honeycomb plate, 222 - Gas cavity, 223 - Wiring groove;

[0042] 23 - Outlet pipe. Detailed implementation manners

[0043] The present invention will be further described in detail below.

[0044] As Figure 1 shown, a high - power blade server with parallel - flow enhanced gas atomization cooling includes an array atomization module 1 and a blade server module 2.

[0045] As Figure 2 shown, the array atomization module 1 includes a liquid storage plate 11, a liquid spraying convex plate 12 and an atomization concave plate 13; the blade server module 2 includes a spray cavity 21, a blowing component 22 and an outlet pipe 23; various electronic components such as CPUs, memory modules, hard disks, etc. are placed in the spray cavity 21; the blowing component 22 is placed on the upper part of the blade server module 2; the outlet pipe 23 is placed at the bottom of the blade server module 2 for discharging gaseous and liquid cooling working fluids.

[0046] As shown Figure 3 in Figure 3 , the liquid storage plate 11 is provided with a liquid storage cavity 111, a buffer ramp 112 and a liquid inlet channel 113. The liquid storage cavity 111 is a hollow cavity for accommodating a liquid working medium. The buffer ramp 112 has a gradually increasing height along the liquid inlet direction to eliminate the pressure fluctuation phenomenon during the initial liquid inlet. The liquid inlet channel 113 is communicated with the liquid storage cavity 111.

[0047] As shown Figure 4 in Figure 4 , the liquid spraying convex plate 12 is provided with an array of liquid spraying holes 121. The cross-sectional area of the array of liquid spraying holes 121 gradually decreases along the liquid flow direction. Preferably, the cross-sectional shape is conical, and it is a channel for the liquid working medium to enter the gas-liquid mixing cavity 1322.

[0048] As shown Figure 5 and Figure 6 in Figure 5 and Figure 6 , the atomizing concave plate 13 is provided with a gas storage cavity 131, an array of structural holes 132, an array of spray holes 133, an air outlet 134 and an air inlet channel 135.

[0049] The gas storage cavity 131 is a hollow cavity for accommodating high-pressure gas. The cross-sectional area of the array of structural holes 132 gradually decreases along the liquid flow direction. Preferably, the cross-sectional shape is conical. The cross-section of a single hole of the array of spray holes 133 can be of any shape, such as circular, spiral, rectangular, etc. Different hole cross-sectional shapes can generate spray angles within different angular ranges to meet the actual spray cooling requirements. The air outlet 134 is respectively communicated with the gas storage cavity 131 and the gas cavity 222 of the air blowing assembly 22. The air inlet channel 135 is communicated with the gas storage cavity 131.

[0050] As shown Figure 2 , Figure 4 , Figure 5 and Figure 6 in Figure 2 , Figure 4 , Figure 5 and Figure 6 , the number of holes of the array of liquid spraying holes 121, the array of structural holes 132 and the array of spray holes 133 is equal, and the positions correspond one by one. The aperture of the array of spray holes 133 is smaller than the aperture of the corresponding array of structural holes 132 and the aperture of the array of liquid spraying holes 121 to meet the spraying conditions.

[0051] As shown Figure 2 in Figure 2 , the conical hole height of the array of liquid spraying holes 121 is greater than the thickness dimension of the gas storage cavity 131 and less than the sum of the thickness of the gas storage cavity 131 and the conical hole height of the array of structural holes 132 to achieve the fitting of the liquid spraying convex plate 12 and the atomizing concave plate 13.

[0052] The aperture of the array liquid spray holes 121 is smaller than that of the corresponding array structure holes 132. After the spray convex plate 12 and the atomization concave plate 13 are sleeved, a jet slit 1321 and a gas-liquid mixing chamber 1322 are formed at the position of the array structure holes 132. The thickness of the jet slit 1321 remains unchanged along the gas flow direction, and the thickness value is equal to the maximum aperture value of the array structure holes 132 minus the minimum aperture value of the corresponding array liquid spray holes 121, and this thickness value is smaller than the thickness value of the gas storage chamber 131 to further increase the gas flow velocity. The jet slit 1321 is the channel for high-pressure gas to enter the gas-liquid mixing chamber 1322. The gas-liquid mixing chamber 1322 provides a chamber space for the full mixing of high-pressure gas and liquid working medium.

[0053] The spray cooling technology is a phase change cooling technology, which has the advantages of less working medium demand and good heat dissipation performance. The use of array spraying can effectively meet the requirements of large-area and high-efficiency heat dissipation, reduce the working temperature of heating elements and extend the service life. However, traditional spray cooling will form a relatively thick liquid film above the cooling surface, causing the liquid / gas phase change to turn into a pool boiling state and reducing the spray cooling performance.

[0054] As Figure 7 and Figure 8 shown, in this embodiment, the air blowing assembly 22 is provided with a honeycomb plate 221, a gas chamber 222 and a wire groove 223. The honeycomb plate 221 has an array of honeycomb straight through hole structures for straightening the gas in the gas chamber 222 to generate a stable parallel flow with the same movement direction. The gas chamber 222 is used to accommodate high-pressure gas. The wire groove 223 is used to lead out the wiring of electronic components.

[0055] The specific implementation process of the high-power blade server with parallel flow enhanced gas atomization cooling is as follows:

[0056] The liquid injection concave plate 12 and the atomizing convex plate 13 achieve the effect of atomizing injection. The liquid working medium enters the liquid storage cavity 111 through the liquid inlet flow channel 113, quickly fills the entire liquid storage cavity 111 along the buffer slope 112 and enters the array of liquid injection holes 121. As the cross-sectional area of the array of liquid injection holes 121 gradually decreases, the liquid flow velocity gradually increases, and reaches the maximum value at the end of the array of liquid injection holes 121 and enters the gas-liquid mixing cavity 1322. At the same time, the high-pressure gas enters the gas storage cavity 131 through the gas inlet flow channel 135, and then enters the gas-liquid mixing cavity 1322 through the gas injection slit 1321. Since the thickness of the gas injection slit 1321 is less than the thickness of the gas storage cavity 131, the high-pressure gas is further accelerated in the gas injection slit 1321. At this time, in the gas-liquid mixing cavity 1322, the high-pressure liquid working medium and the high-pressure gas are strongly mixed. Under the tearing action of the jet diffusion of the high-pressure gas and the strong frictional action of the jet impact, the cooling working medium is atomized in the narrow gas-liquid mixing cavity 1322, producing a very uniform and fine atomization effect. Subsequently, the gas-liquid two-phase working medium enters the array of spray holes 133, and sprays a high-speed and fine spray into the spray cavity 21 of the blade server module 2, impacting the heat-generating surface of the electronic components in the spray cavity 21 to achieve the heat dissipation effect.

[0057] At the same time, the air blowing assembly 22 achieves the effects of reducing the thickness of the liquid film and accelerating the cooling cycle. While the high-pressure gas enters the gas storage cavity 131 through the gas inlet flow channel 135, the high-pressure gas also enters the gas cavity 222 of the air blowing assembly 22 through the air outlet 134 of the spray convex plate 13, that is, the array atomizing module 1 provides a high-pressure gas source for the air blowing assembly 22. Then the high-pressure gas flows through the honeycomb plate 221 and is straightened by the array of honeycomb structures of the honeycomb plate 221. Subsequently, the straightened high-pressure gas blows air on the spray cavity 21 and the surface of the electronic components in the spray cavity 21, not only reducing the thickness of the liquid film formed on the surface of the electronic components and improving the spray cooling performance, but also blowing out the gas-phase working medium participating in heat exchange diffused in the spray cavity 21 through the outlet pipe 23, accelerating the cooling cycle.

[0058] The beneficial effects of the present invention:

[0059] (1) The present invention uses gas atomization to achieve the spray effect, and utilizes the jet diffusion tearing action of the compressed gas and the strong gas-liquid frictional action of the jet impact to produce a very uniform and fine spray. During spray cooling, the latent heat of phase change of the liquid working medium can be fully utilized. Compared with only using pressure atomization cooling of the liquid working medium or spray cooling using external mixing gas siphon atomization, the atomization and cooling effects are better.

[0060] (2) The present invention adopts an array - type integrated spray module. The nozzle head structures are all processed on a single plate, and the atomization device and the liquid - supply and gas - supply pipelines are integrated as a whole. The cooling system has a small volume, which not only meets the requirements of high integration of blade servers but also can dissipate heat from a large - area high - temperature heat source.

[0061] (3) The present invention sets a blowing component 22 at the upper part of the server. The array - type atomization module 1 provides the gas source, and the gas source is straightened and a uniform parallel flow is generated through the array - type honeycomb structure. The straightened high - pressure gas is blown towards the inner cavity of the server and the surfaces of electronic components. Compared with the spray cooling without blowing to thin the liquid film or the spray cooling using a free flow for blowing, it can effectively enhance the spray cooling effect and accelerate the cooling cycle process. And because there is no need to install a fan inside the server, the overall structure is compact and occupies little space.

[0062] The above - mentioned embodiments are the preferred embodiments of the present invention. However, the embodiments of the present invention are not limited to the above - mentioned embodiments. Any other changes, modifications, substitutions, combinations, and simplifications made without departing from the spirit and principle of the present invention shall be equivalent replacement methods and are all included in the protection scope of the present invention.

Claims

1. A high-power blade server with parallel flow enhanced gas atomization cooling, characterized in that: It includes a spray chamber. An atomization concave plate is provided on the side of the spray chamber. Array structure holes communicating with the spray chamber are provided on the atomization concave plate. A liquid spraying convex plate is provided outside the atomization concave plate. Array liquid spraying holes for inputting a liquid working medium are provided on the liquid spraying convex plate. The array liquid spraying holes and the array structure holes are arranged correspondingly. The longitudinal cross-sections of both the array structure holes and the array liquid spraying holes gradually narrow towards the spray chamber. The array liquid spraying holes protrude towards the array structure holes and extend into the array structure holes. A jetting slit for inputting high-pressure gas is provided between the array liquid spraying holes and the array structure holes. A gas-liquid mixing chamber is formed at the intersection of the jetting slit, the array liquid spraying holes and the array structure holes; A blowing component for blowing downward is provided at the top of the spray chamber, and an outlet pipe is provided at the bottom of the spray chamber; The blowing component includes a flow guiding device and a gas chamber for inputting high-pressure gas. The flow guiding device is provided below the gas chamber and is used for guiding the high-pressure gas in the gas chamber to the spray chamber; The flow guiding device is a honeycomb plate with an array of honeycomb straight through holes structure.

2. A high-power blade server with parallel-flow enhanced gas atomization cooling according to claim 1, characterized in that: An array of spray holes is provided on the side of the atomization concave plate close to the spray chamber. The array of spray holes is arranged correspondingly to and communicated with the array structure holes. The aperture of the array of spray holes is smaller than the apertures of the corresponding array structure holes and array liquid spraying holes.

3. The high-power blade server with parallel-flow enhanced gas atomization cooling according to claim 2, characterized in that: The array of spray holes has various shapes and spraying angles.

4. A high-power blade server with parallel-flow enhanced gas atomization cooling according to claim 1, characterized in that: A gas storage chamber is provided between the atomization concave plate and the liquid spraying convex plate. The gas storage chamber communicates with the jetting slit; the height of the array liquid spraying holes is greater than the thickness of the gas storage chamber and less than the sum of the thickness of the gas storage chamber and the height of the array structure holes.

5. A high-power blade server with parallel-flow enhanced gas atomization cooling according to claim 4, characterized in that: The thickness of the jetting slit is smaller than the thickness of the gas storage chamber.

6. A high-power blade server with parallel-flow enhanced gas atomization cooling according to claim 1, characterized in that: A liquid storage plate is provided on one side of the liquid spraying convex plate. The liquid storage plate is provided with a liquid storage chamber for supplying the liquid working medium and a liquid inlet flow channel. The liquid storage chamber is respectively connected to the array liquid spraying holes and the liquid inlet flow channel. A buffer slope is provided in the liquid storage chamber, and the height of the buffer slope gradually increases along the liquid inlet direction.

7. A high-power blade server with parallel flow enhanced gas atomization cooling according to claim 1, characterized in that: The gas chamber communicates with the jetting slit.

Images