A process for transferring die-cut products from strip to wafer

Abstract

This invention discloses a process for transferring die-cut products from a strip to a wafer. The process includes the following steps: 1) fixing a wafer base film to a fixture; 2) mounting a strip carrying multiple products onto the fixture; 3) moving the strip multiple times to sequentially transfer each product onto the wafer base film; 4) attaching a wafer ring to the wafer base film. The fixture has multiple first positioning posts, second positioning posts, and third positioning posts. The wafer base film is fixed by the first positioning posts, the strip is mounted by the second positioning posts, and the wafer ring is attached by the third positioning posts. This process for transferring die-cut products from a strip to a wafer, by using positioning holes on the strip, positioning holes on the base film, and positioning posts on the transfer fixture, precisely transfers products from the strip to the wafer, thereby achieving accurate and efficient wafer-based delivery of die-cut products.

Description

Technical Field

[0001] This invention relates to the field of die-cutting, and in particular to a process for transferring die-cut products from a strip to a wafer. Background Technology

[0002] In the semiconductor industry, wafers are frequently used for shipping, serving as the carrier for products such as chips. A wafer is a circular standard component, typically large in size, consisting of two parts: the wafer disk and the base film. The wafer disk is usually made of metal steel, while the base film is mounted on the wafer disk and serves as the carrier for the product.

[0003] When shipping using wafers, the position of each product on the wafer is fixed. However, die-cutting cannot directly use the wafer as a product carrier for production. Therefore, it is necessary to first use the tape as the product carrier for production, and then transfer the product onto the wafer. As a result, the accuracy of the transfer often becomes a crucial factor affecting production efficiency. Summary of the Invention

[0004] To address the aforementioned problems, this invention provides a process for transferring die-cut products from a strip to a wafer.

[0005] According to one aspect of the present invention, a process for transferring die-cut products from a strip to a wafer is provided, comprising the following steps:

[0006] 1) Fix the Wafer base film onto the fixture;

[0007] 2) Install the conveyor belt carrying multiple products onto the fixture;

[0008] 3) Move the material strip multiple times to sequentially transfer each of the products on it onto the wafer base film;

[0009] 4) Attach the wafer ring to the wafer base film;

[0010] The fixture has multiple first positioning posts, second positioning posts and third positioning posts. The wafer base film is fixed by each of the first positioning posts, the material strip is installed by each of the second positioning posts, and the wafer ring is attached by each of the third positioning posts.

[0011] The process of transferring die-cut products from the material strip to the wafer in this invention uses structures such as positioning holes on the material strip, positioning holes on the backing film, and positioning posts on the transfer fixture to accurately transfer the product from the material strip to the wafer, thereby achieving precise and efficient wafer-based delivery of die-cut products.

[0012] In some embodiments, in step 1), the wafer base film is disposed on a support film, which is fixed to the fixture. The advantage is that the wafer base film cannot have holes, thus necessitating the use of a perforated support film.

[0013] In some embodiments, the base film has fixing holes at each corner, and is fixed by means of the first positioning posts. Its advantage lies in describing the specific method of fixing the wafer base film and the base film.

[0014] In some embodiments, in step 2), the fixture has two rows of second positioning posts on its left and right sides, and the strip has two rows of positioning holes on its upper and lower sides, with each row having two positioning holes that respectively mate with two of the second positioning posts in each row. The advantage is that it describes the specific method of installing the strip.

[0015] In some embodiments, in step 3), after each movement of the conveyor belt, the positioning holes that mate with each of the second positioning posts are replaced with the next two positioning holes in each row. The advantage of this is that it describes a method for conveyor belt movement processing.

[0016] In some embodiments, in step 3), each of the products is arranged in multiple rows and columns on the transfer area of ​​the wafer backing film. This is advantageous because it describes the arrangement and conditions of the products onto the wafer backing film.

[0017] In some embodiments, in step 4), each of the third positioning posts engages at a location on the outer edge of the wafer ring. The advantage is that it describes the manner in which the wafer ring is mounted on the fixture.

[0018] In some embodiments, the base film is provided with a plurality of engaging holes that mate with each of the third positioning posts. Its advantage lies in that it further describes the specific installation method of the wafer ring. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the top surface structure during the transfer process of a die-cut product from a strip to a wafer, according to one embodiment of the present invention.

[0020] Figure 2 for Figure 1 A schematic diagram of the top surface structure of the fixture shown;

[0021] Figure 3 for Figure 1 A schematic diagram of the top surface structure of the Wafer base film and the support film is shown.

[0022] Figure 4 for Figure 1 The diagram shows the top surface structure of the wafer after it has been reposted.

[0023] In the diagram: Wafer base film 1, fixture 2, product 3, material belt 4, Wafer ring 5, base film 6, first positioning post 21, second positioning post 22, third positioning post 23, positioning hole 41, fixing hole 61, locking hole 62. Detailed Implementation

[0024] The present invention will now be described in further detail with reference to the accompanying drawings.

[0025] Figure 1 The diagram schematically illustrates the top surface structure during the transfer of a die-cut product from a strip to a wafer according to an embodiment of the present invention. Figure 2 Showing Figure 1 The top surface structure of the fixture in the middle, Figure 3 Showing Figure 1 The top surface structure of the wafer base film and the support film, Figure 4 Showing Figure 1 The top surface structure of the wafer after it has been copied from elsewhere. For example... Figure 1-4 As shown, before operating this process, it is necessary to first make a specially designed jig 2 and a wafer base film 1, and then transfer them together with a wafer ring 5 and a material strip 4 carrying the product 3.

[0026] When manufacturing fixture 2, fixture 2 is made roughly rectangular, with multiple positioning posts for three different purposes, designated as first positioning posts 21, second positioning posts 22, and third positioning posts 23. There are four first positioning posts, arranged in a roughly square pattern on fixture 2, used to position the wafer base film 1; two rows of second positioning posts 22 are located on opposite sides of fixture 2 (left and right sides), used to position the material strip 4; and approximately four to ten third positioning posts 23 are distributed on the other two sides of fixture 2 (top and bottom sides), used to position the wafer ring 5.

[0027] When manufacturing the wafer base film 1, since the wafer base film 1 cannot have holes, it can be placed on a support film 6, which is then fixed to the fixture 2. The support film 6 is approximately square, with fixing holes 61 at each corner, and each fixing hole 61 can be used to fix it to each of the first positioning posts 21 on the fixture 2.

[0028] The strip 4 is elongated and has two rows of positioning holes 41 on each of its lower sides. When the strip 4 is positioned on the fixture 2, each row of the strip 4 has two positioning holes 41, that is, the four positioning holes 41 are respectively matched with the two positioning posts in each column of the fixture 2, that is, the four positioning posts.

[0029] The wafer ring 5 is annular with irregular outer edges. When it is installed on the fixture 2, its upper and lower outer edges are engaged and fixed by the third positioning posts 23. Multiple engaging holes 62 are provided on the base film 6, and each engaging hole 62 mates with a third positioning post 23, meaning that each third positioning post 23 passes through the engaging hole 62 to engage and fix the wafer ring 5.

[0030] When operating this process, the Wafer base film 1 and the support film 6 are first installed on the fixture 2 and fixed by the cooperation of each fixing hole 61 with each first positioning post 21. Then, the material strip 4 carrying multiple products 3 is installed on the fixture 2 and positioned by the cooperation of the four positioning holes 41 and the four positioning posts. The products 3 at the corresponding positions can then be transferred onto the Wafer base film 1.

[0031] Then, the material strip 4 is moved multiple times, and after each movement, the product 3 at the corresponding position is transferred onto the wafer base film 1. Each time the material strip 4 is moved, the positioning holes 41 that mate with each of the second positioning posts 22—that is, the four positioning holes 41 directly used for positioning—are replaced with the next two positioning holes 41 in each row. Specifically, the four positioning holes 41 used previously are replaced with the next four positioning holes 41 along the direction of the material strip 4's movement. Then, the product 3 can be transferred again until each product 3 is arranged in multiple rows and columns on the corresponding transfer area (generally a circular area) of the wafer base film 1.

[0032] Finally, the Wafer ring 5 is attached to the Wafer base film 1 and secured by the third positioning posts 23. At this point, the transfer of product 3 onto the Wafer is complete.

[0033] The above descriptions are merely some embodiments of the present invention. Those skilled in the art can make various modifications and improvements without departing from the inventive concept of the present invention, and these all fall within the scope of protection of the present invention.

Claims

1. A process for transferring die-cut products from a strip to a wafer, characterized in that: Includes the following steps 1) Fix the wafer base film (1) onto the fixture (2), wherein the wafer base film (1) is disposed on a support film (6), the support film (6) is fixed on the fixture (2), the fixture (2) has a plurality of first positioning posts (21), second positioning posts (22) and third positioning posts (23), and the wafer base film (1) is fixed by each of the first positioning posts (21); 2) The strip (4) carrying multiple products (3) is installed onto the fixture (2), wherein the strip (4) is installed through each of the second positioning posts (22), the fixture (2) has two rows of second positioning posts (22) on the left and right sides respectively, and the strip (4) has two rows of positioning holes (41) on the upper and lower sides respectively, wherein each row has two positioning holes (41) that are respectively fitted with two of the second positioning posts (22) in each row for installation; 3) Move the material strip (4) multiple times and transfer each of the products (3) on it to the wafer base film (1) in sequence. After each movement of the material strip (4), the positioning holes (41) that cooperate with each of the second positioning posts (22) are replaced with the next two positioning holes (41) in each row. 4) The Wafer ring (5) is attached to the Wafer base film (1), wherein the Wafer ring (5) is attached by each of the third positioning posts (23), and each of the third positioning posts (23) is respectively engaged at each of the outer edges of the Wafer ring (5).

2. The process for transferring die-cut products from strip to wafer according to claim 1, characterized in that: Each corner of the base film (6) has a fixing hole (61), and each fixing hole (61) is used to fix it in conjunction with each of the first positioning posts (21).

3. The process for transferring die-cut products from strip to wafer according to claim 1, characterized in that: In step 3), each of the products (3) is arranged in multiple rows and columns on the transfer area of ​​the Wafer base film (1).

4. The process for transferring die-cut products from the strip to the wafer according to claim 1, characterized in that: The base film (6) is provided with a plurality of engaging holes (62) that cooperate with each of the third positioning posts (23).

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