Electronic device and heat dissipation method for electronic device

Abstract

The present invention provides an electronic device and a heat dissipation method for the electronic device. The electronic device includes a controller and a working unit. The working unit includes an air guiding module, a fan module, a driving module, a chip module, and a detection module. The chip module includes a first processor chip and a second processor chip. The air guiding module has a first air path and a second air path. The first processor chip is located in the first air path, and the first air path and the second air path are located between the second processor chip and the fan module. Both the driving module and the detection module are electrically connected to the controller. The electronic device provided by the present invention can achieve heat dissipation of the chip module without increasing the rotation speed of the fan module, and has relatively low energy consumption.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic products, and in particular to an electronic device and a heat dissipation method for an electronic device. Background Art

[0002] Electronic devices such as servers usually generate a large amount of heat during operation, and this heat needs to be dissipated in a timely manner.

[0003] A server includes a fan, a controller, a detector, and multiple processor chips. Both the fan and the detector are electrically connected to the controller. The detector is used to detect the temperature of each processor chip, and the controller adjusts the rotation speed of the fan according to the temperature detected by the detector. The operating temperatures of each processor chip are different, and the controller increases the rotation speed of the fan according to the highest temperature detected by the detector, resulting in the fan running at a high rotation speed for a long time.

[0004] The fan running at a high rotation speed for a long time will result in a large energy consumption of the server. Summary of the Invention

[0005] The present invention provides an electronic device and a heat dissipation method for an electronic device, which can achieve heat dissipation of a chip module without increasing the rotation speed of a fan module, and has a small energy consumption.

[0006] The present invention provides an electronic device, including a controller and a working unit. The working unit includes a wind guiding module, a fan module, a driving module, a chip module, and a detection module. The chip module includes at least one first processor chip and at least one second processor chip;

[0007] The wind guiding module has a first air path and a second air path arranged side by side. The first processor chip is located in the first air path, and the first air path and the second air path are located between the second processor chip and the fan module;

[0008] The detection module is used to detect the temperature of the first processor chip and the temperature of the second processor chip respectively. Both the driving module and the detection module are electrically connected to the controller;

[0009] When the temperature of the first processor chip is greater than or equal to the preset temperature of the first processor chip, the controller controls the driving module to increase the air intake of the first air path and decrease the air intake of the second air path to reduce the temperature of the first processor chip;

[0010] When the temperature of the second processor chip is greater than or equal to the preset temperature of the second processor chip, the controller controls the driving module to increase the air intake of the second air path and decrease the air intake of the first air path to reduce the temperature of the second processor chip.

[0011] In a possible implementation, the electronic device provided by the present invention further includes a housing having an accommodation cavity. The number of working units is at least two, and the working units are sequentially arranged at intervals in the accommodation cavity.

[0012] In a possible implementation, for the electronic device provided by the present invention, the detection module includes a first detection component and a second detection component, and both the first detection component and the second detection component are electrically connected to the controller;

[0013] The first detection component is used to detect the temperature of the first processor chip, and the second detection component is used to detect the temperature of the second processor chip.

[0014] In a possible implementation, for the electronic device provided by the present invention, the air guiding module includes a fixed baffle and a movable baffle. The fixed baffle and the movable baffle are arranged side by side on the air outlet side of the fan module. A first air path is formed between the fixed baffle and the movable baffle, and a second air path is formed between the movable baffle and the side wall of the housing or between the movable baffle and the fixed baffle in another adjacent working unit.

[0015] In a possible implementation, for the electronic device provided by the present invention, the fan module is electrically connected to the controller;

[0016] When the temperature of the first processor chip is greater than or equal to the preset temperature of the first processor chip and the temperature of the second processor chip is less than the preset temperature of the second processor chip, the controller controls the driving module to repel the movable baffle, so that the movable baffle moves away from the fixed baffle to increase the air intake of the first air path and reduce the air intake of the second air path;

[0017] When the temperature of the first processor chip is less than the preset temperature of the first processor chip and the temperature of the second processor chip is less than the preset temperature of the second processor chip, the controller controls the rotational speed of the fan module to decrease.

[0018] In a possible implementation, for the electronic device provided by the present invention, the fan module is electrically connected to the controller;

[0019] When the temperature of the first processor chip is less than the preset temperature of the first processor chip and the temperature of the second processor chip is greater than or equal to the preset temperature of the second processor chip, the controller controls the driving module to attract the movable baffle, so that the movable baffle moves towards the fixed baffle to increase the air intake of the second air path and reduce the air intake of the first air path;

[0020] When the temperature of the first processor chip is less than the preset temperature of the first processor chip and the temperature of the second processor chip is less than the preset temperature of the second processor chip, the controller controls the rotational speed of the fan module to decrease.

[0021] In a possible implementation, for the electronic device provided by the present invention, the movable baffle includes a first fixed section, a movable section and a rotating shaft. The movable section is rotatably connected to the first fixed section through the rotating shaft. The movable section is located between the fan module and the first fixed section. The driving module attracts or repels the movable section to make the movable section rotate relative to the first fixed section.

[0022] In a possible implementation, for the electronic device provided by the present invention, the movable section is a magnetic movable section;

[0023] The driving module is an electromagnetic element arranged between the movable section and the fixed baffle.

[0024] In a possible implementation, for the electronic device provided by the present invention, the movable baffle further includes a stop pin. The stop pin is connected to the magnetic movable section. The inner wall of the housing has a chute. The stop pin is inserted into the chute and moves along the extension direction of the chute.

[0025] The present invention also provides a heat dissipation method for an electronic device, which is used for the above-mentioned electronic device to dissipate heat. The heat dissipation method of the electronic device includes:

[0026] Detect the temperatures of the first processor chip and the second processor chip;

[0027] When the temperature of the first processor chip is greater than or equal to the preset temperature of the first processor chip, control the driving module to increase the air intake volume of the first air passage and decrease the air intake volume of the second air passage to lower the temperature of the first processor chip;

[0028] When the temperature of the second processor chip is greater than or equal to the preset temperature of the second processor chip, control the driving module to increase the air intake volume of the second air passage and decrease the air intake volume of the first air passage to lower the temperature of the second processor chip.

[0029] The electronic device and the heat dissipation method thereof provided by the present invention. The electronic device is provided with a controller and a working unit. The working unit includes a wind guiding module, a fan module, a driving module and a chip module. The wind guiding module includes a first air path and a second air path. The chip module includes a first processor chip and a second processor chip. The first processor chip is located in the first air path, and the second processor chip is located behind the first air path and the second air path along the air flow direction. When the temperature of the first processor chip is relatively high, the controller controls the driving module to increase the air intake volume of the first air path and decrease the air intake volume of the second air path to lower the temperature of the first processor chip. When the temperature of the second processor chip is relatively high, the controller controls the driving module to increase the air intake volume of the second air path and decrease the air intake volume of the first air path to lower the temperature of the second processor chip. Thus, the electronic device provided by the present application can achieve the heat dissipation of the chip module by changing the air intake volume in the first air path and the second air path without increasing the rotation speed of the fan module. Compared with the existing electronic devices that need to make the fan run at a high speed for a long time to dissipate heat from the electronic device, the electronic device has lower energy consumption. Description of the Drawings

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0031] Figure 1 Structural schematic diagram of the electronic device provided by the embodiment of the present invention;

[0032] Figure 2 Connection schematic diagram of the controller, the detection module, the driving module and the fan module in the electronic device provided by the embodiment of the present invention;

[0033] Figure 3 Another structural schematic diagram of the electronic device provided by the embodiment of the present invention;

[0034] Figure 4 Structural schematic diagram of the driving module in the electronic device provided by the embodiment of the present invention;

[0035] Figure 5 Flow chart of the heat dissipation method of the electronic device provided by the embodiment of the present invention.

[0036] Description of the reference numerals:

[0037] 100 - Controller;

[0038] 200 - Housing;

[0039] 210 - Accommodating cavity;

[0040] 220 - Bottom wall; 221 - Sliding groove;

[0041] 230 - Side wall; 231 - First side wall; 232 - Second side wall; 233 - Third side wall; 234 - Fourth side wall;

[0042] 300 - Working unit; 300a - First working unit; 300b - Second working unit;

[0043] 310 - Air guiding module; 311 - First air path; 312 - Second air path; 313 - Fixed baffle; 3131 - Second fixed section; 3132 - Third fixed section; 314 - Movable baffle; 3141 - First fixed section; 3142 - Movable section; 3143 - Rotating shaft; 3144 - Positioning pin;

[0044] 320 - Fan module; 321 - Fan bracket; 322 - Fan;

[0045] 330 - Driving module; 331 - Coil; 332 - Iron core; 333 - Power supply circuit; 3331 - First circuit; 3332 - Second circuit; 3333 - Power supply; 3334 - Switch;

[0046] 340 - Chip module; 341 - First processor chip; 342 - Second processor chip;

[0047] 350 - Detection module; 351 - First detection component; 352 - Second detection component;

[0048] A - Length direction;

[0049] B - Width direction;

[0050] C - First direction;

[0051] D - Second direction. Detailed implementation manners

[0052] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0053] In the description of the present application, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, or indirectly connected through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0054] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0055] The terms "first", "second", "third" (if any) in the description, claims, and drawings of the present application are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0056] In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or maintenance tool that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or maintenance tools.

[0057] Electronic devices such as servers usually generate a large amount of heat during operation, and this heat needs to be dissipated in a timely manner.

[0058] The server includes a fan, a controller, a detector, and multiple processor chips. Both the fan and the detector are electrically connected to the controller. The detector is used to detect the temperature of each processor chip, and the controller adjusts the rotation speed of the fan according to the temperature detected by the detector.

[0059] The processor chip may include a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit). The CPU is used to read computer instructions and process data in computer software. The GPU is used to convert and drive the display information required by the computer and control the correct display of the monitor. The CPU and GPU are usually in a high-power state during different time periods. Therefore, the time periods when the CPU and GPU are at high temperatures are different. The controller increases the fan speed according to the highest temperature detected by the detection component. That is to say, no matter which one of the CPU or GPU is in a high-temperature state, the controller dissipates heat from the processor chip by increasing the fan speed, resulting in the fan running at a high speed for a long time.

[0060] The fan running at a high speed for a long time results in high energy consumption of the server.

[0061] Based on this, the present invention provides an electronic device and a heat dissipation method for the electronic device, which can achieve heat dissipation of the chip module without increasing the speed of the fan module and has low energy consumption.

[0062] Figure 1 It is a schematic structural diagram of the electronic device provided by the embodiment of the present invention; Figure 2 It is a schematic connection diagram of the controller, the detection module, the drive module and the fan module in the electronic device provided by the embodiment of the present invention. Among them, in order to clearly show the electrical connection relationship between the controller 100 and the detection module 350, only the Figure 2 shows the controller 100 and the detection module 350. Refer to Figure 1 and Figure 2 As shown, the electronic device provided by the present invention includes a controller 100 and a working unit 300. The working unit 300 includes a wind guiding module 310, a fan module 320, a drive module 330, a chip module 340 and a detection module 350. The chip module 340 includes at least one first processor chip 341 and at least one second processor chip 342; the wind guiding module 310 has a first air path 311 and a second air path 312 arranged side by side. The first processor chip 341 is located in the first air path 311, and the first air path 311 and the second air path 312 are located between the second processor chip 342 and the fan module 320.

[0063] The detection module 350 is used to detect the temperatures of the first processor chip 341 and the second processor chip 342 respectively. Both the drive module 330 and the detection module 350 are electrically connected to the controller 100.

[0064] When the temperature of the first processor chip 341 is greater than or equal to the preset temperature of the first processor chip 341, the controller 100 controls the driving module 330 to increase the air intake volume of the first air duct 311 and decrease the air intake volume of the second air duct 312 to lower the temperature of the first processor chip 341; when the temperature of the second processor chip 342 is greater than or equal to the preset temperature of the second processor chip 342, the controller 100 controls the driving module 330 to increase the air intake volume of the second air duct 312 and decrease the air intake volume of the first air duct 311 to lower the temperature of the second processor chip 342.

[0065] Please continue to refer to Figure 1 As shown, the electronic device further includes a housing 200. The housing 200 has a receiving cavity 210. The number of working units 300 is at least two, and the working units 300 are sequentially arranged at intervals in the receiving cavity 210.

[0066] The electronic device can be a server. The housing 200 of the electronic device is used to support and accommodate the working units 300 in the electronic device. Specifically, please continue to refer to Figure 1 As shown, the housing 200 can be in the shape of a flat cuboid. The housing 200 includes a bottom wall 220, a top wall (not labeled in the figure), and four side walls 230. The bottom wall 220, the top wall, and the four side walls 230 enclose the receiving cavity 210. The four side walls 230 of the housing 200 are respectively called a first side wall 231, a second side wall 232, a third side wall 233, and a fourth side wall 234. The first side wall 231 and the third side wall 233 are opposite to each other, and the second side wall 232 and the fourth side wall 234 are opposite to each other. The extending direction of the first side wall 231 (or the third side wall 233) is called the length direction A, and the extending direction of the second side wall 232 (or the fourth side wall 234) is called the width direction B.

[0067] According to the working requirements of the server, the electronic device may include two working units 300, or more than two working units 300. The working units 300 may be sequentially arranged at intervals along the length direction A, or may be sequentially arranged at intervals along the width direction B. For the sake of convenience, it is described by taking the example that the electronic device includes two working units 300 and the two working units 300 are sequentially arranged at intervals along the length direction A. Among them, the working unit 300 close to the second side wall 232 is called the first working unit 300a, and the working unit 300 arranged at intervals with the first working unit 300a is called the second working unit 300b.

[0068] Please continue to refer to Figure 1As shown in the figure, the fan module 320 is disposed close to the first side wall 231. The fan module 320 includes a fan bracket 321 and at least one fan 322. The fan bracket 321 is mounted on the bottom wall 220 of the housing 200. The fan bracket 321 is used to fix the fan 322. The wind blown by the fan 322 blows from the first side wall 231 to the third side wall 233 opposite to the first side wall 231.

[0069] The air guiding module 310 is used to guide the wind blown by the fan 322. Specifically, a first air path 311 and a second air path 312 are formed side by side between the fan module 320 and the third side wall 233. The first processor chip 341 is located in the first air path 311. Part of the wind blown by the fan 322 enters the first air path 311 to cool the first processor chip 341. The first processor chip 341 can be one of a CPU or a GPU.

[0070] Since two or more working units 300 are usually disposed along the length direction A in the accommodating cavity 210, due to the limitation of the space in the accommodating cavity 210 and to ensure that the second processor chip 342 needs to be disposed as directly opposite to the fan module 320 as possible, it is difficult to dispose the second processor chip 342 in the second air path 312. Therefore, part of the second processor chip 342 is located on the air outlet side of the first air path 311, and part is located on the air outlet side of the second air path 312. Part of the wind blown by the fan 322 reaches the second processor chip 342 through the second air path 312 to cool the second processor chip 342. When the temperature of the first processor chip 341 is relatively low, the wind blown out from the first air path 311 can also be used to cool the second processor chip 342. The second processor chip 342 can be the other one of a GPU and a GPU.

[0071] It can be understood that the first processor chip 341 and the second processor chip 342 are used to process different information in the electronic device. The first processor chip 341 and the second processor chip 342 are usually in a high power consumption state in different time periods. Therefore, the electronic device usually has the following two working states. In the first working state, the temperature of the first processor chip 341 is greater than or equal to the preset temperature of the first processor chip 341, that is to say, the first processor chip 341 needs to be cooled. In the second working state, the temperature of the second processor chip 342 is greater than or equal to the preset temperature of the second processor chip 342, that is to say, the second processor chip 342 needs to be cooled.

[0072] The cooling processes of the first processor chip 341 and the second processor chip 342 will be described below.

[0073] The detection module 350 is used to detect the temperatures of the first processor chip 341 and the second processor chip 342, and feedback the detected temperatures to the controller 100. The preset temperatures of the first processor chip 341 and the second processor chip 342 are preset in the controller 100. Among them, the preset temperature of the first processor chip 341 is about 10° less than the maximum allowable operating temperature of the first processor chip 341. Taking the preset temperature of the first processor chip 341 as the temperature standard for judging whether the first processor chip 341 needs heat dissipation can prevent the first processor chip 341 from operating at the maximum allowable temperature, so as to ensure the performance of the first processor chip 341. The determination method of the preset temperature of the second processor chip 342 is the same as that of the preset temperature of the first processor chip 341, and will not be elaborated here one by one.

[0074] The controller 100 compares the temperature of the first processor chip 341 with the preset temperature of the first processor chip 341. When the temperature of the first processor chip 341 is greater than or equal to the preset temperature of the first processor chip 341, the controller 100 issues a first instruction to the driving module 330. The driving module 330 applies a force to the air guiding module 310 according to the first instruction to change the structure of the air guiding module 310, so that under the condition that the rotation speed of the fan 322 remains basically unchanged, the air volume blown into the first air path 311 is increased, and the air volume blown into the second air path 312 is reduced, so that more of the air blown out by the fan 322 is used to dissipate heat from the first processor chip 341.

[0075] The controller 100 compares the temperature of the second processor chip 342 with the preset temperature of the second processor chip 342. When the temperature of the second processor chip 342 is greater than or equal to the preset temperature of the second processor chip 342, the controller 100 issues a second instruction to the driving module 330. The driving module 330 applies a force to the air guiding module 310 according to the second instruction to change the structure of the air guiding module 310, so that under the condition that the rotation speed of the fan 322 remains basically unchanged, the air volume blown into the second air path 312 is increased, and the air volume blown into the first air path 311 is reduced, so that more of the air blown out by the fan 322 is used to dissipate heat from the second processor chip 342.

[0076] The electronic device provided by the present invention is provided with a controller 100 and a working unit 300. The working unit 300 includes an air guiding module 310, a fan module 320, a driving module 330, and a chip module 340. The air guiding module 310 includes a first air path 311 and a second air path 312. The chip module 340 includes a first processor chip 341 and a second processor chip 342. The first processor chip 341 is located in the first air path 311, and the second processor chip is located behind the first air path 311 and the second air path 312 along the air flow direction. When the temperature of the first processor chip 341 is relatively high, the controller 100 controls the driving module 330 to increase the air intake volume of the first air path 311 and decrease the air intake volume of the second air path 312 to lower the temperature of the first processor chip 341. When the temperature of the second processor chip 342 is relatively high, the controller 100 controls the driving module 330 to increase the air intake volume of the second air path 312 and decrease the air intake volume of the first air path 311 to lower the temperature of the second processor chip 342. Thus, the electronic device provided by the present application can achieve heat dissipation of the chip module 340 by changing the air intake volume in the first air path 311 and the second air path 312 without increasing the rotation speed of the fan module 320. Compared with the existing electronic devices that need to make the fan run at a high speed for a long time to dissipate heat from the electronic device, the electronic device has lower energy consumption.

[0077] Please continue to refer to Figure 2 As shown, the detection module 350 includes a first detection component 351 and a second detection component 352. Both the first detection component 351 and the second detection component 352 are electrically connected to the controller 100. The first detection component 351 is used to detect the temperature of the first processor chip 341, and the second detection component 352 is used to detect the temperature of the second processor chip 342.

[0078] The first detection component 351 and the second detection component 352 can be temperature sensors. The first detection component 351 is arranged close to the first processor chip 341 to detect the temperature of the first processor chip 341, and the second detection component 352 is arranged close to the second processor chip 342 to detect the temperature of the second processor chip 342.

[0079] Please continue to refer to Figure 1 As shown, in this embodiment, the air guiding module 310 includes a fixed baffle 313 and a movable baffle 314. The fixed baffle 313 and the movable baffle 314 are arranged side by side on the air outlet side of the fan module 320. A first air path 311 is formed between the fixed baffle 313 and the movable baffle 314, and a second air path 312 is formed between the movable baffle 314 and the side wall 230 of the housing 200 or between the movable baffle 314 and the fixed baffle 313 in another adjacent working unit 300.

[0080] Both the fixed baffle 313 and the movable baffle 314 are connected to the bottom wall 220 of the housing 200, and both the fixed baffle 313 and the movable baffle 314 extend from the fan module 320 toward the third side wall 233.

[0081] Please continue to refer to Figure 1 As shown, a portion of the air volume blown out by the fan 322 can flow through the space between the fixed baffle 313 and the movable baffle 314. The space between the fixed baffle 313 and the movable baffle 314 is referred to as the first air passage 311.

[0082] According to the different positions of the working unit 300, there are two ways to form the second air passage 312. Please continue to refer to Figure 1 As shown, in the first working unit 300a, the movable baffle 314 is located between the fixed baffle 313 and the second side wall 232, and the movable baffle 314 and the second side wall 232 form the second air passage 312. In the second working unit 300b, the movable baffle 314 in the second working unit 300b and the fixed baffle 313 in the first working unit 300a form the second air passage 312, and the movable baffle 314 can move relative to the fixed baffle 313.

[0083] Next, in combination with the movement mode of the movable baffle 314 relative to the fixed baffle 313, the cooling process in two working states of the electronic device will be described in detail.

[0084] Please continue to refer to Figure 1 and Figure 2 As shown, in the first working state, the fan module 320 is electrically connected to the controller 100; when the temperature of the first processor chip 341 is greater than or equal to the preset temperature of the first processor chip 341, and the temperature of the second processor chip 342 is less than the preset temperature of the second processor chip 342, the controller 100 controls the driving module 330 to repel the movable baffle 314, so that the movable baffle 314 moves away from the fixed baffle 313 to increase the air intake of the first air passage 311 and reduce the air intake of the second air passage 312. When the temperature of the first processor chip 341 is less than the preset temperature of the first processor chip 341, and the temperature of the second processor chip 342 is less than the preset temperature of the second processor chip 342, the controller 100 controls the rotation speed of the fan module 320 to decrease.

[0085] Specifically, the controller 100 controls the driving module 330 to repel the movable baffle 314, so that the movable baffle 314 moves away from the fixed baffle 313, increasing the width of the air inlet side of the first air passage 311 and decreasing the width of the air inlet side of the second air passage 312. Thus, by increasing the width of the air inlet side of the first air passage 311 and decreasing the width of the air inlet side of the second air passage 312, the air intake of the first air passage 311 is increased and the air intake of the second air passage 312 is decreased, allowing more air to enter the first air passage 311 to cool the first processor chip 341.

[0086] The first detection component 351 and the second detection component 352 continuously detect the temperatures of the first processor chip 341 and the second processor chip 342 respectively. Since the air intake of the first air passage 311 is increased, the temperature of the first processor chip 341 is reduced. When the controller 100 determines that the temperature of the first processor chip 341 is less than the preset temperature of the first processor chip 341 and the temperature of the second processor chip 342 is less than the preset temperature of the second processor chip 342, the controller 100 can reduce the rotational speed of the fan 322 based on this judgment result, thereby further reducing the power consumption of the electronic device.

[0087] Figure 3 Another structural schematic diagram of the electronic device provided by the embodiment of the present invention. Refer to Figure 2 and Figure 3 As shown, in the second working state, the fan module 320 is electrically connected to the controller 100; when the temperature of the first processor chip 341 is less than the preset temperature of the first processor chip 341 and the temperature of the second processor chip 342 is greater than or equal to the preset temperature of the second processor chip 342, the controller 100 controls the driving module 330 to attract the movable baffle 314, so that the movable baffle 314 moves towards the fixed baffle 313 to increase the air intake of the second air passage 312 and reduce the air intake of the first air passage 311. When the temperature of the first processor chip 341 is less than the preset temperature of the first processor chip 341 and the temperature of the second processor chip 342 is less than the preset temperature of the second processor chip 342, the controller 100 controls the rotational speed of the fan module 320 to decrease.

[0088] Specifically, the controller 100 controls the driving module 330 to attract the movable baffle 314, so that the movable baffle 314 moves towards the fixed baffle 313, decreasing the width of the air inlet side of the first air passage 311 and increasing the width of the air inlet side of the second air passage 312. Thus, by decreasing the width of the air inlet side of the first air passage 311 and increasing the width of the air inlet side of the second air passage 312, the air intake of the first air passage 311 is decreased and the air intake of the second air passage 312 is increased, allowing more air to enter the second air passage 312 to cool the second processor chip 342.

[0089] The first detection component 351 and the second detection component 352 continuously detect the temperatures of the first processor chip 341 and the second processor chip 342 respectively. Since the air intake volume of the second air duct 312 is increased, the temperature of the second processor chip 342 is reduced. When the controller 100 determines that the temperature of the second processor chip 342 is less than the preset temperature of the second processor chip 342 and the temperature of the first processor chip 341 is less than the preset temperature of the first processor chip 341, the controller 100 can reduce the rotational speed of the fan 322 according to this judgment result, thereby further reducing the energy consumption of the electronic device.

[0090] The movable baffle 314 can move as a whole relative to the fixed baffle 313 or partially relative to the fixed baffle 313, and can be specifically selected according to the structure of different housings 200. Please continue to refer to Figure 1 and Figure 3 As shown, in this embodiment, the movable baffle 314 includes a first fixed section 3141, a movable section 3142 and a rotating shaft 3143. The movable section 3142 is rotatably connected to the first fixed section 3141 through the rotating shaft 3143. The movable section 3142 is located between the fan module 320 and the first fixed section 3141. The driving module 330 attracts or repels the movable section 3142 to make the movable section 3142 rotate relative to the first fixed section 3141.

[0091] The movable section 3142 can rotate relative to the first fixed section 3141 around the rotating shaft 3143. The movable section 3142 is located on the air inlet side of the air guiding module 310, and the first fixed section 3141 is located on the air outlet side of the air guiding module 310. The movable section 3142 rotates relative to the first fixed section 3141 with the rotating shaft 3143 as the center, so that the movable section 3142 rotates towards or away from the fixed baffle 313.

[0092] The driving module 330 can apply a force to the movable section 3142 by attracting or repelling the movable section 3142, so that the movable section 3142 rotates relative to the first fixed section 3141 to increase the air intake volume in the first air duct 311 or the second air duct 312.

[0093] The driving module 330 can attract or repel the movable section 3142 through a transmission mechanism, and the driving module 330 can also attract or repel the movable section 3142 by means of magnetism. In this embodiment, the movable section 3142 is a magnetic movable section; the driving module 330 is an electromagnetic element arranged between the movable section 3142 and the fixed baffle 313.

[0094] The electromagnetic element can be arranged between the movable section 3142 and the fixed baffle 313. The electromagnetic element can be installed on the fan bracket 321, and can also be installed on the housing 200 through a separate fixing bracket. The movable section 3142 is also magnetic. The electromagnetic element attracts the magnetic movable section to make the magnetic movable section rotate towards the fixed baffle 313 to increase the air intake in the second air passage 312, and the electromagnetic element repels the magnetic movable section to make the movable section rotate away from the fixed baffle 313 to increase the air intake in the first air passage 311.

[0095] Figure 4 The structural schematic diagram of the drive module in the electronic device provided by the embodiment of the present invention. Refer to Figure 4 As shown, the drive module 330 is an electromagnetic element, and the electromagnetic element includes a coil 331, an iron core 332, and a power supply circuit 333. The coil 331 is wound around the iron core 332, and the power supply circuit 333 supplies power to the coil 331. The power supply circuit 333 includes a first circuit 3331, a second circuit 3332, a power supply 3333, and a changeover switch 3334. Both the first circuit 3331 and the second circuit 3332 are electrically connected to the coil. Among them, the changeover switch 3334 is a double - pole three - way switch, and the changeover switch 3334 is electrically connected to the controller 100. The changeover switch 3334 connects the first circuit 3331 to the power supply 3333 according to the first instruction issued by the controller 100; the changeover switch 3334 connects the second circuit 3332 to the power supply 3333 according to the second instruction issued by the controller 100.

[0096] Specifically, when the changeover switch 3334 connects the first circuit 3331 and the power supply 3333, the current in the coil 331 flows along the first direction C. When the changeover switch 3334 connects the second circuit 3332 and the power supply 3333, the current in the coil 331 flows along the second direction D. In this way, the N - pole and S - pole of the iron core 332 can be converted. By interchanging the N - pole and S - pole of the electromagnetic element, the attraction and repulsion of the magnetic movable section can be realized. Thus, the magnetic movable section can rotate towards the fixed baffle 313 or away from the fixed baffle 313.

[0097] Please continue to refer to Figure 1 and Figure 3 As shown, the movable baffle 314 further includes a stop pin 3144. The stop pin 3144 is connected to the magnetic movable section. The inner wall of the housing 200 has a sliding groove 221. The stop pin 3144 is inserted into the sliding groove 221 and moves along the extension direction of the sliding groove 221.

[0098] The stop pin 3144 can be connected to the magnetic movable section by welding or a connecting piece. The stop pin 3144 is used to limit the stroke of the magnetic movable section.

[0099] Specifically, one of the bottom wall 220 or the top wall of the housing 200 has a sliding groove 221. The sliding groove 221 is arc-shaped, and the curvature and length of the arc are consistent with the moving track of the positioning pin 3144. The positioning pin 3144 is inserted into the sliding groove 221 and moves along the extending direction of the sliding groove 221 as the movable section 3142 moves.

[0100] Sliding grooves 221 can be provided on both the bottom wall 220 and the top wall of the housing 200. The sliding groove 221 on the bottom wall 220 and the sliding groove 221 on the top wall are opposite to each other. One end of the positioning pin 3144 is inserted into the sliding groove 221 on the bottom wall 220, and the other end of the positioning pin 3144 is inserted into the sliding groove 221 on the top wall. Thereby, the movement of the positioning pin 3144 and the movable section 3142 is made more stable.

[0101] Please continue to refer to Figure 1 and Figure 3 As shown, the fixed baffle 313 includes a second fixed section 3131 and a third fixed section 3132 connected to the second fixed section 3131. The second fixed section 3131 inclines towards the side away from the movable section 3142 so that the second fixed section 3131 and the movable section 3142 together form a flared opening; the third fixed section 3132 is opposite to the first fixed section 3141, and the first processor chip 341 is located between the third fixed section 3132 and the first fixed section 3141.

[0102] The second fixed section 3131 is located on the air inlet side of the air guiding module 310. The second fixed section 3131 is opposite to the movable section 3142, and the second fixed section 3131 inclines along the length direction A away from the movable section 3142. Thus, in the first working state, the second fixed section 3131 and the movable section 3142 form a flared opening, and the flared opening is convenient for guiding the air blown out by the fan 322 into the first air path 311.

[0103] The third fixed section 3132 is located on the air outlet side of the air guiding module 310. The third fixed section 3132 is opposite to the first fixed section 3141. In this embodiment, the third fixed section 3132 and the first fixed section 3141 are parallel and parallel to the second side wall 232, so as to facilitate the smooth flow of air in the first air path 311 and the second air path 312.

[0104] The present invention also provides a heat dissipation method for an electronic device, which is used to dissipate heat from the electronic device provided in the above embodiment. The structure of the electronic device has been described in detail in the above embodiment and will not be elaborated here one by one.

[0105] Figure 5 This is a flowchart of the heat dissipation method for the electronic device provided by the embodiment of the present invention. Refer to Figure 5 As shown, the heat dissipation method of the electronic device includes:

[0106] S101. Detect the temperatures of the first processor chip 341 and the second processor chip 342.

[0107] Use the first detector 351 to detect the temperature of the first processor chip 341 and feedback the temperature of the first processor chip 341 to the controller 100.

[0108] Use the second detector 352 to detect the temperature of the second processor chip 342 and feedback the temperature of the second processor chip 342 to the controller 100.

[0109] S102. When the temperature of the first processor chip 341 is greater than or equal to the preset temperature of the first processor chip 341, control the drive module 330 to increase the air intake of the first air duct 311 and decrease the air intake of the second air duct 312 to lower the temperature of the first processor chip 341.

[0110] Use the controller 100 to compare the temperature of the first processor chip 341 with the preset temperature of the first processor chip 341.

[0111] When the temperature of the first processor chip 341 is greater than or equal to the preset temperature of the first processor chip 341, the controller 100 issues a first instruction to the drive module 330. The drive module 330 exerts a force on the air guide module 310 according to the first instruction to change the structure of the air guide module 310. Thus, with the rotational speed of the fan 322 remaining basically unchanged, the air volume blown into the first air duct 311 is increased, and the air volume blown into the second air duct 312 is decreased, so that more of the air blown by the fan 322 is used to cool the first processor chip 341.

[0112] S103. When the temperature of the second processor chip is greater than or equal to the preset temperature of the second processor chip, control the drive module to increase the air intake of the second air duct and decrease the air intake of the first air duct to lower the temperature of the second processor chip.

[0113] Use the controller 100 to compare the temperature of the second processor chip 342 with the preset temperature of the second processor chip 342.

[0114] When the temperature of the second processor chip 342 is greater than or equal to the preset temperature of the second processor chip 342, the controller 100 issues a second instruction to the drive module 330. The drive module 330 exerts a force on the air guide module 310 according to the second instruction to change the structure of the air guide module 310. Thus, with the rotational speed of the fan 322 remaining basically unchanged, the air volume blown into the second air duct 312 is increased, and the air volume blown into the first air duct 311 is decreased, so that more of the air blown by the fan 322 is used to cool the second processor chip 342.

[0115] Next, the process of reducing the temperature of the first processor chip 341 will be described in detail.

[0116] Reducing the temperature of the first processor chip 341 includes:

[0117] When the temperature of the first processor chip 341 is greater than or equal to the preset temperature of the first processor chip 341, and the temperature of the second processor chip 342 is less than the preset temperature of the second processor chip 342, the control drive module 330 repels the movable baffle 314, so that the movable baffle 314 moves away from the fixed baffle 313, to increase the air intake of the first air duct 311 and reduce the air intake of the second air duct 312.

[0118] When the temperature of the first processor chip 341 is less than the preset temperature of the first processor chip 341, and the temperature of the second processor chip 342 is less than the preset temperature of the second processor chip 342, the rotation speed of the fan module 320 is reduced.

[0119] When the controller 100 controls the change-over switch 3334 to connect the first circuit 3331 in the electromagnetic element and the power supply 3333, the iron core 332 repels the movable section 3142, so that the movable section 3142 moves away from the second fixed section 3131 around the rotating shaft 3143, causing the bell mouth in the first air duct 311 to open, to increase the air intake of the first air duct 311 and reduce the air intake of the second air duct 312, so that more air enters the first air duct 311 for cooling the first processor chip 341.

[0120] The temperature of the first processor chip 341 and the temperature of the second processor chip 342 are continuously detected by the first detection component 351 and the second detection component 352 respectively. Since the air intake of the first air duct 311 is increased, the temperature of the first processor chip 341 is reduced. When the controller 100 determines that the temperature of the first processor chip 341 is less than the preset temperature of the first processor chip 341, and the temperature of the second processor chip 342 is less than the preset temperature of the second processor chip 342, the controller 100 can reduce the rotation speed of the fan 322 according to this judgment result. The first processor chip 341 continuously operates at a temperature less than the preset temperature of the first processor chip 341, and the second processor chip 342 continuously operates at a temperature less than the preset temperature of the second processor chip 342, so that the fan 322 can always be maintained at a low rotation speed. Thus, the energy consumption of the electronic device is further reduced.

[0121] Reducing the temperature of the second processor chip includes:

[0122] When the temperature of the first processor chip 341 is lower than the preset temperature of the first processor chip 341, and the temperature of the second processor chip 342 is greater than or equal to the preset temperature of the second processor chip 342, the control driving module 330 is controlled to attract the movable baffle 314, so that the movable baffle 314 moves towards the fixed baffle 313, so as to increase the air intake of the second air duct 312 and reduce the air intake of the first air duct 311.

[0123] When the temperature of the first processor chip 341 is lower than the preset temperature of the first processor chip 341, and the temperature of the second processor chip 342 is lower than the preset temperature of the second processor chip 342, the rotation speed of the fan module 320 is reduced.

[0124] When the controller 100 controls the change-over switch 3334 to connect the second circuit 3332 in the electromagnetic element and the power supply 3333, the iron core 332 attracts the movable section 3142, so that the movable section 3142 moves around the rotating shaft 3143 towards the second fixed section 3131, so that the bell mouth of the first air duct 311 is not fully opened, so as to increase the air intake of the second air duct 312 and reduce the air intake of the first air duct 311, so that more air enters the second air duct 312 to be used for cooling the second processor chip 342.

[0125] The temperature of the first processor chip 341 and the second processor chip 342 are continuously detected by the first detecting member 351 and the second detecting member 352 respectively. Since the air intake of the second air duct 312 is increased, the temperature of the second processor chip 342 is reduced. When the controller 100 determines that the temperature of the first processor chip 341 is lower than the preset temperature of the first processor chip 341, and the temperature of the second processor chip 342 is lower than the preset temperature of the second processor chip 342, the controller 100 can reduce the rotation speed of the fan 322 according to the determination result. The first processor chip 341 continuously operates at a temperature lower than the preset temperature of the first processor chip 341, and the second processor chip 342 continuously operates at a temperature lower than the temperature of the second processor chip 342, so that the fan 322 can always maintain a low rotation speed. Thus, the energy consumption of the electronic device is further reduced.

[0126] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electronic device, characterized in that, It includes a controller, a housing, and a working unit. The working unit includes an air guiding module, a fan module, a driving module, a chip module, and a detection module. The chip module includes at least one first processor chip and at least one second processor chip; The air guiding module has a first air path and a second air path arranged side by side. The first processor chip is located in the first air path. The first air path and the second air path are located between the second processor chip and the fan module; Part of the second processor chip is located on the air outlet side of the first air path, and part is located on the air outlet side of the second air path; The housing has a receiving cavity. The number of the working units is at least two, and each of the working units is arranged at intervals in the receiving cavity in sequence; The air guiding module includes a fixed baffle and a movable baffle. The fixed baffle and the movable baffle are arranged side by side on the air outlet side of the fan module. A first air path is formed between the fixed baffle and the movable baffle, and a second air path is formed between the movable baffle and the side wall of the housing or between the movable baffle and the fixed baffle in another adjacent working unit; The detection module is used to detect the temperature of the first processor chip and the temperature of the second processor chip respectively. Both the driving module and the detection module are electrically connected to the controller; When the temperature of the first processor chip is greater than or equal to the preset temperature of the first processor chip and the temperature of the second processor chip is less than the preset temperature of the second processor chip, the controller controls the driving module to repel the movable baffle, so that the movable baffle moves away from the fixed baffle, to increase the air intake of the first air path and reduce the air intake of the second air path, so as to reduce the temperature of the first processor chip; When the temperature of the first processor chip is less than the preset temperature of the first processor chip and the temperature of the second processor chip is greater than or equal to the preset temperature of the second processor chip, the controller controls the driving module to attract the movable baffle, so that the movable baffle moves towards the fixed baffle, to increase the air intake of the second air path and reduce the air intake of the first air path, so as to reduce the temperature of the second processor chip.

2. The electronic device according to claim 1, wherein The detection module includes a first detection component and a second detection component. Both the first detection component and the second detection component are electrically connected to the controller; The first detection component is used to detect the temperature of the first processor chip, and the second detection component is used to detect the temperature of the second processor chip.

3. The electronic device according to claim 1, characterized in that The fan module is electrically connected to the controller; When the temperature of the first processor chip is less than the preset temperature of the first processor chip and the temperature of the second processor chip is less than the preset temperature of the second processor chip, the controller controls the rotational speed of the fan module to decrease.

4. The electronic device according to claim 1, wherein The fan module is electrically connected to the controller; When the temperature of the first processor chip is lower than the preset temperature of the first processor chip and the temperature of the second processor chip is lower than the preset temperature of the second processor chip, the controller controls the rotation speed of the fan module to decrease.

5. The electronic device according to any one of claims 1, 3 or 4, characterized in that The movable baffle includes a first fixed section, a movable section and a rotating shaft. The movable section is rotatably connected to the first fixed section through the rotating shaft. The movable section is located between the fan module and the first fixed section. The driving module attracts or repels the movable section to make the movable section rotate relative to the first fixed section.

6. The electronic device according to claim 5, wherein The movable section is a magnetic movable section; The driving module is an electromagnetic element arranged between the movable section and the fixed baffle.

7. The electronic device according to claim 6, wherein The movable baffle further includes a stop pin. The stop pin is connected to the magnetic movable section. The inner wall of the housing has a sliding groove. The stop pin is inserted into the sliding groove and moves along the extension direction of the sliding groove.

8. A heat dissipation method for an electronic device, characterized in that, For dissipating heat from the electronic device according to any one of claims 1 to 7, the heat dissipation method of the electronic device includes: Detecting the temperatures of the first processor chip and the second processor chip; When the temperature of the first processor chip is greater than or equal to the preset temperature of the first processor chip, controlling the driving module to increase the air intake of the first air path and decrease the air intake of the second air path to reduce the temperature of the first processor chip; When the temperature of the second processor chip is greater than or equal to the preset temperature of the second processor chip, controlling the driving module to increase the air intake of the second air path and decrease the air intake of the first air path to reduce the temperature of the second processor chip.

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